A high heat dissipation efficiency air-cooled radiator with phase change and manufacturing method

Abstract

The present invention discloses a high-heat-dissipation-efficiency air-cooled radiator with phase change and a manufacturing method thereof, aiming to provide a high-heat-dissipation-efficiency air-cooled radiator with phase change and a manufacturing method thereof, which can effectively absorb heat emitted by a heat source and distribute the heat on the radiator substrate to various positions of the radiator for dissipation, thereby effectively improving the heat dissipation efficiency. The high-heat-dissipation-efficiency air-cooled radiator with phase change and a manufacturing method thereof include a heat dissipation substrate and a fin heat dissipation assembly, the fin heat dissipation assembly including a plurality of parallelly distributed fins, a heat dissipation channel provided in the heat dissipation substrate, a liquid refrigerant provided in the heat dissipation channel, the heat dissipation channel including an evaporation end channel provided at the lower portion of the heat dissipation substrate, a condensation end channel provided at the upper portion of the heat dissipation substrate, and a plurality of connecting channels distributed between the evaporation end channel and the condensation end channel, the lower end of the connecting channel being connected to the evaporation end channel, and the upper end of the connecting channel being connected to the condensation end channel.

Description

Technical Field

[0001] The present invention relates to the field of radiators, and in particular to a high-heat-dissipation-efficiency air-cooled radiator with phase change and a manufacturing method thereof. Background Art

[0002] Current fin heat sinks typically include a base plate and heat dissipating fins mounted on the base plate. Conventional base plates are typically solid, and solid base plate fin heat sinks have poor heat dissipation efficiency. To improve the heat dissipation efficiency of fin heat sinks, some inventors have designed base plates with water channels. Water within these channels absorbs heat from the heat source and distributes the heat to various locations within the heat sink, thereby improving the heat dissipation efficiency. However, due to the poor efficiency of water in absorbing heat from the heat source, these improvements have been ineffective.

[0003] On the other hand, current fin heat sink production is generally divided into two types: integral and split production. The split production method involves manufacturing the base plate and fins separately. Specifically, the base plate and fins are processed separately, and fin slots are cut into the base plate, with the fin slots corresponding to the fins one by one. The fins are then inserted into the corresponding fin slots, and the fins are welded to the base plate as a whole. The current split production method of fin heat sinks is inconvenient and inefficient because it requires machining a large number of fin slots on the base plate surface. Summary of the Invention

[0004] One purpose of the present invention is to provide a high-heat dissipation efficiency air-cooled radiator with phase change and a manufacturing method thereof, which can effectively absorb the heat emitted by the heat source and distribute the heat on the substrate of the radiator to various positions of the radiator for dissipation, thereby effectively improving the heat dissipation efficiency.

[0005] Another object of the present invention is to provide a high-heat dissipation efficiency air-cooled radiator with phase change and a manufacturing method thereof, which is easy to process and manufacture and can improve production efficiency.

[0006] The technical solution of the present invention is:

[0007] A high-heat-dissipation-efficiency air-cooled radiator with phase change, comprising a heat dissipation substrate and a fin heat dissipation assembly, the fin heat dissipation assembly comprising a plurality of parallelly distributed fins, a heat dissipation channel provided in the heat dissipation channel, a liquid refrigerant provided in the heat dissipation channel, the heat dissipation channel comprising an evaporation-end channel arranged at the lower part of the heat dissipation substrate, a condensation-end channel arranged at the upper part of the heat dissipation substrate, and a plurality of connecting channels distributed between the evaporation-end channel and the condensation-end channel, the lower end of the connecting channel being connected to the evaporation-end channel, the upper end of the connecting channel being connected to the condensation-end channel, the liquid refrigerant being located in the evaporation-end channel, or a portion of the liquid refrigerant being located in the evaporation-end channel, and the other portion being located in the lower part of each connecting channel. The heat dissipation substrate in the high-efficiency air-cooled radiator with phase change of this solution has a phase change system. Specifically, during the operation of the radiator, the liquid refrigerant in the heat dissipation substrate absorbs the heat emitted by the heat source. After the liquid refrigerant is saturated with heat, it further absorbs heat, and the refrigerant undergoes a phase change, causing the liquid refrigerant to evaporate into a gaseous refrigerant. The gaseous refrigerant rises along the connecting channel to the condensation end channel, and the gaseous refrigerant releases heat in the condensation end channel and condenses into a liquid refrigerant again; then, the liquid refrigerant flows down through the connecting channel back to the evaporation end channel, and the cycle continues like this. The liquid refrigerant continuously and effectively absorbs the heat emitted by the heat source, and distributes the heat on the radiator substrate to various positions of the radiator for dissipation, thereby effectively improving the heat dissipation efficiency.

[0008] Preferably, a bending piece and a buckling structure are provided on one side of the fin. The buckling structure includes a snap-in groove and a snap-in piece provided on the bending piece. The snap-in piece of one of any two adjacent fins is snap-into the snap-in groove of the other fin, so that the fins of the fin heat dissipation assembly are connected as one body. The fins of the fin heat dissipation assembly are welded to one side of the heat dissipation substrate via the bending piece. The fins are sequentially connected as one body via the buckling structure to form a fin heat dissipation assembly. When the fin heat dissipation assembly is welded to the substrate, the fin heat dissipation assembly can be directly supported on the substrate surface by the bending piece for welding. No additional tooling is required to support the heat dissipation fins of the fin heat dissipation assembly, which greatly simplifies the pre-welding work, facilitates processing and improves production efficiency. At the same time, welding the fins to the heat dissipation substrate via the bending piece not only improves the stability of the welding structure, but also increases the contact area between the fins and the heat dissipation substrate, which is beneficial to improving the heat conduction efficiency between the heat dissipation substrate and the fins.

[0009] Preferably, the other side of the fin is also provided with a bending piece and a buckle structure, and the bending pieces on both sides of the fin are distributed on opposite sides of the fin. In this way, after the fins are sequentially connected into one body through the buckle structure to form a fin heat dissipation assembly, it is beneficial to improve the structural stability of the fin heat dissipation assembly.

[0010] Preferably, the snap-in plate is provided with an insertion hole, and the snap-in groove is provided with a latch, so that the latch of one of the two adjacent fins is inserted into the insertion hole. In this way, after the fins are sequentially connected to form a fin heat dissipation assembly through the snap-in structure, the latch can be inserted into the insertion hole, further improving the structural stability of the fin heat dissipation assembly and the accuracy of the fin distribution position positioning.

[0011] Preferably, the fins are stamped from a profile plate, and the bent pieces, snap-fit ​​structure, and fins are stamped integrally. Stamping the fins from a profile plate not only facilitates processing and manufacturing, but also allows the thickness and material of the fins to be varied by stamping using profile plates of varying thickness and material as needed. Fins within the same fin heat dissipation assembly can be made of the same material or a combination of fins of different materials.

[0012] A method for manufacturing a high-heat-dissipation-efficiency air-cooled radiator with phase change, comprising the following steps:

[0013] (1) Substrate production, substrate production includes the following steps:

[0014] A. A heat dissipation substrate with heat dissipation channels is manufactured using a mold. The outer surface of the heat dissipation substrate is provided with a connection hole connected to the evaporation end channel or the condensation end channel;

[0015] B. Weld a section of metal pipe to the outer port of the connecting hole to form a filling pipe;

[0016] The fin heat dissipation assembly is manufactured by stamping the fins with the profile plate, and the bending piece, buckle structure and fin are stamped and formed as a whole; then, each fin is sequentially connected into one body through the buckle structure to form a fin heat dissipation assembly, and the snap-fit ​​piece of one fin of any two adjacent fins in the fin heat dissipation assembly is clamped in the snap-fit ​​groove of the other fin to connect the fins into one body;

[0017] (2) The base plate and the fin heat dissipation component are welded and formed. The base plate and the fin heat dissipation component are welded and formed including the following steps:

[0018] A1: Place the side of the heat sink substrate for soldering the fin heat sink assembly upwards, then place the solder sheet on the side of the heat sink substrate for soldering the fin heat sink assembly; then place the fin heat sink assembly on the solder sheet using the bent sheet.

[0019] B1, placing the heat sink substrate, solder sheet, and fin heat sink assembly into a soldering furnace, heating the solder sheet to melt the solder sheet; then, removing the substrate, solder sheet, and fin heat sink assembly from the soldering furnace and cooling them to room temperature to complete the soldering of the fin heat sink assembly and the heat sink substrate;

[0020] (3) Liquid refrigerant filling: inject liquid refrigerant into the heat dissipation channel through the filling pipe. After the liquid refrigerant filling is completed, the filling pipe is sealed.

[0021] In the manufacturing method of the high heat dissipation efficiency air-cooled radiator with phase change of this scheme, the heat dissipation substrate is formed by open mold, and the processing efficiency is high; the fins are stamped from the profile plate, and each fin is connected in sequence into one body through a buckle structure to form a fin heat dissipation assembly, and then the fins are welded to the substrate through a bending piece to obtain a fin heat sink, which does not require machining fin grooves on the substrate, is easy to process and manufacture, and has high production efficiency.

[0022] Preferably, in step (iii), after the liquid refrigerant is added, the charging tube is first clamped flat with a clamp, and then the charging tube is sealed by welding. In this way, by clamping the charging tube flat, the sealing welding area can be initially isolated from the refrigerant in the heat dissipation substrate, thereby preventing the refrigerant in the substrate from being ignited by open flames generated during welding.

[0023] Preferably, the upper surface of the solder sheet is provided with a plurality of solder bosses extending upward, the solder bosses being used to support the fin heat dissipation assembly, the solder sheet and the solder bosses being made of the same material, and the solder bosses being close to the edge of the upper surface of the solder sheet.

[0024] In the above-mentioned step A1, the fin heat dissipation assembly is supported on each solder boss by the bent sheet, so that a thermally conductive gap layer is formed between the bent sheet of the fin heat dissipation assembly and the upper surface of the solder sheet.

[0025] In step B1, during the process of the soldering furnace heating the substrate, solder sheet, and fin heat dissipation assembly, the heat in the soldering furnace can directly heat the solder sheet through the thermal conductive gap layer, so that the solder sheet is melted uniformly as a whole. Since the fin heat dissipation assembly is placed on the solder sheet through the bent sheet, and the number and density of the heat dissipation fins of the fin heat dissipation assembly are large, in step B1, during the process of the soldering furnace heating the substrate, solder sheet, and fin heat dissipation assembly, the solder sheet melts unevenly. Especially for large-area radiators, the problem of uneven melting of the solder sheet becomes more obvious. The edges of the solder sheet melt quickly, while the middle of the solder sheet melts slowly, resulting in bubbles and bulges between the bent sheet and the substrate, which not only affects the welding quality between the heat dissipation fins and the substrate, but also affects the heat conduction efficiency between the substrate and the heat dissipation fins. In order to solve this problem, the present solution sets a solder boss made of the same material as the solder sheet on the upper surface of the solder sheet, and the solder boss is close to the edge of the upper surface of the solder sheet, and then forms a thermal conductive gap layer between the bent sheet and the upper surface of the solder sheet by supporting the fin heat dissipation component. In this way, in step B1, during the process of heating the substrate, solder sheet and fin heat dissipation component in the soldering furnace, the heat in the soldering furnace can directly heat the solder sheet through the thermal conductive gap layer, so that the entire solder sheet is melted evenly. This can not only effectively avoid the uneven melting of the solder sheet (the middle surface of the edge block), which leads to the problem of bubbles and bulging between the bent sheet and the substrate; but also after the entire solder sheet is evenly melted, the solder boss will automatically melt, so that the bent sheet of the heat dissipation fin is welded to the substrate, without the need for additional control or adding other processes, which is extremely convenient for actual production and processing.

[0026] Preferably, in step B1, during the process of heating the substrate, solder sheet and fin heat dissipation assembly in the soldering furnace, when the middle portion of the solder sheet begins to melt, the fin heat dissipation assembly remains supported on each solder boss by the bent sheet.

[0027] Preferably, the connection holes are formed by machining, or the connection holes and the heat dissipation channels are formed together by mold manufacturing.

[0028] The beneficial effects of the present invention are:

[0029] First, it can effectively absorb the heat emitted by the heat source and distribute the heat on the substrate of the radiator to various positions of the radiator for dissipation, thereby effectively improving the heat dissipation efficiency.

[0030] Second, it is easy to process and manufacture, which can improve production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a structural schematic diagram of a high heat dissipation efficiency air-cooled radiator with phase change according to the present invention.

[0032] Figure 2 It is a structural schematic diagram of the heat dissipation substrate of the present invention.

[0033] Figure 3 It is a structural schematic diagram of the fin of the present invention.

[0034] Figure 4 It is a structural schematic diagram of the fin heat dissipation component of the present invention.

[0035] Figure 5 yes Figure 4 A partial enlarged view of point C in the middle.

[0036] In the picture:

[0037] heat dissipation substrate 1;

[0038] Fin heat dissipation assembly 2, fin 2.1, bent piece 2.2, buckle structure 2.3, snap-fit ​​groove 2.31, snap-fit ​​piece 2.32, plug hole 2.33, latch 2.34;

[0039] Filling pipe 3;

[0040] Evaporation end channel 4.1, condensation end channel 4.2, connecting channel 4.3. DETAILED DESCRIPTION

[0041] Specific embodiment 1: Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 As shown, a high-heat-dissipation-efficiency air-cooled radiator with phase change comprises a heat dissipation substrate 1 and a fin heat dissipation assembly 2. The fin heat dissipation assembly comprises a plurality of parallel fins 2.1. The fin heat dissipation assembly is arranged on one side of the heat dissipation substrate. A heat dissipation channel is provided in the heat dissipation substrate, and liquid refrigerant is provided in the heat dissipation channel. The heat dissipation channel comprises an evaporation-end channel 4.1 provided at the lower portion of the heat dissipation substrate, a condensation-end channel 4.2 provided at the upper portion of the heat dissipation substrate, and a plurality of connecting channels 4.3 distributed between the evaporation-end channel and the condensation-end channel. The connecting channels extend upward and downward. The lower end of the connecting channel is connected to the evaporation-end channel, and the upper end of the connecting channel is connected to the condensation-end channel. The liquid refrigerant is located in the evaporation-end channel, or a portion of the liquid refrigerant is located in the evaporation-end channel, and the other portion is located at the lower portion of each connecting channel. In actual application of the high-heat-dissipation-efficiency air-cooled radiator with phase change, the heat dissipation substrate is arranged vertically.

[0042] The heat dissipation substrate in the high heat dissipation efficiency air-cooled radiator with phase change in this embodiment has a phase change system. Specifically, during the operation of the radiator, the liquid refrigerant in the heat dissipation substrate absorbs heat emitted by the heat source. After the liquid refrigerant is saturated with heat, it further absorbs heat, and the refrigerant undergoes a phase change, causing the liquid refrigerant to evaporate into a gaseous refrigerant. The gaseous refrigerant rises along the connecting channel to the condensation end channel, and the gaseous refrigerant releases heat in the condensation end channel and condenses into liquid refrigerant again; then, the liquid refrigerant flows back to the evaporation end channel through the connecting channel, and the cycle continues. The liquid refrigerant continuously and effectively absorbs the heat emitted by the heat source, and distributes the heat on the radiator substrate to various positions of the radiator for dissipation, thereby effectively improving the heat dissipation efficiency.

[0043] Further, such as Figure 1 、 Figure 3 、 Figure 4 、 Figure 5 As shown, a bending piece 2.2 and a buckling structure 2.3 are provided on one side of the fin 2.1. In this embodiment, the fin is stamped and formed by a profile plate, and the bending piece, the buckling structure and the fin are stamped and formed as a whole. The bending piece is perpendicular to the fin. The buckling structure includes a snap-in groove 2.31 and a snap-in piece 2.32 provided on the bending piece. The snap-in piece of one of any two adjacent fins is clamped in the snap-in groove of the other fin, so that the fins of the fin heat dissipation assembly are connected as a whole. The fin heat dissipation assembly is welded to one side of the heat dissipation substrate through the bending piece on one side of each fin. The fins are connected in sequence as a whole through the buckling structure to form a fin heat dissipation assembly, so that when the fin heat dissipation assembly is welded to the substrate, the fin heat dissipation assembly can be directly supported on the surface of the substrate by the bending piece for welding, without the need for additional tooling to support the heat dissipation fins of the fin heat dissipation assembly, which greatly simplifies the pre-welding work, makes processing and manufacturing convenient, and improves production efficiency. At the same time, the fins are welded to the heat dissipation substrate through the bending pieces, which not only improves the stability of the welding structure, but also increases the contact area between the fins and the heat dissipation substrate, which is beneficial to improving the heat conduction efficiency between the heat dissipation substrate and the fins.

[0044] In this embodiment, the snap-in tab of one of any two adjacent fins fits within the snap-in slot of the other fin. Multiple snap-in slots are provided, distributed sequentially along the length of the connecting edge between the bent tab and the fin. Each snap-in tab corresponds to each snap-in slot. The snap-in slot is provided on one side of the bent tab connected to the fin, and the snap-in tab and snap-in slot are located on opposite sides of the bent tab.

[0045] Further, such as Figure 3 、 Figure 4 、 Figure 5As shown, the other side of the fin is also provided with a bent piece 2.2 and a snap-fit ​​structure 2.3. The bent pieces on both sides of the fin are distributed on opposite sides of the fin. In this way, when the fins are sequentially connected to form a fin heat sink assembly through the snap-fit ​​structure, the structural stability of the fin heat sink assembly is improved. Of the bent pieces on both sides of the fin, only the bent piece on one side of the fin is welded to one side of the heat sink substrate.

[0046] In this embodiment, in the fin heat dissipation assembly, the bent pieces on the same side of each fin are located in the same plane. The width of the bent piece is the same as the spacing between two adjacent heat dissipation fins. Of course, the width of the bent piece can also be smaller than the spacing between two adjacent heat dissipation fins.

[0047] Further, such as Figure 3 、 Figure 4 、 Figure 5 As shown, the snap-in plate is provided with a plug hole 2.33, and the snap-in groove is provided with a latch 2.34. The latch of one of the two adjacent fins is inserted into the plug hole. In this way, after the fins are sequentially connected to form a fin heat dissipation assembly through the snap-in structure, the latch can be inserted into the plug hole, further improving the structural stability of the fin heat dissipation assembly and the accuracy of the fin distribution position positioning.

[0048] Specific embodiment 2: A method for manufacturing a high heat dissipation efficiency air-cooled radiator with phase change. The specific structure of the high heat dissipation efficiency air-cooled radiator with phase change is referred to the specific embodiment 1. The method for manufacturing a high heat dissipation efficiency air-cooled radiator with phase change includes the following steps in sequence:

[0049] (1) Substrate production, substrate production includes the following steps:

[0050] A. A heat dissipation substrate with heat dissipation channels is manufactured using a mold. The outer surface of the heat dissipation substrate is provided with a connection hole that communicates with the evaporation end channel or the condensation end channel. In this embodiment, the connection hole is formed by machining, or the connection hole and the heat dissipation channel are manufactured together using a mold.

[0051] B, such as Figure 1 、 Figure 2 As shown, a section of metal pipe is welded to the outer end of the connecting hole to form a filling pipe 3.

[0052] The fin heat dissipation assembly is manufactured, and the fins are stamped and formed by profile plates, and the bending pieces, buckle structures and fins are stamped and formed as one body; then, each fin is connected in sequence through the buckle structure to form a fin heat dissipation assembly, and the snap-fit ​​piece of one fin of any two adjacent fins in the fin heat dissipation assembly is clamped in the snap-fit ​​groove of the other fin to connect the fins as one body.

[0053] (2) The base plate and the fin heat dissipation component are welded and formed. The base plate and the fin heat dissipation component are welded and formed including the following steps:

[0054] A1: Place the side of the heat sink substrate for soldering the fin heat sink assembly upwards, then place the solder sheet on the side of the heat sink substrate for soldering the fin heat sink assembly; then place the fin heat sink assembly on the solder sheet using the bent sheet.

[0055] B1, place the heat dissipation substrate, solder sheet and fin heat dissipation assembly into a soldering furnace, and heat the solder sheet by heating the soldering furnace to melt the solder sheet; then, remove the substrate, solder sheet and fin heat dissipation assembly from the soldering furnace and cool to room temperature to achieve welding the fin heat dissipation assembly and the heat dissipation substrate into one.

[0056] (3) Liquid refrigerant filling: inject liquid refrigerant into the heat dissipation channel through the filling pipe. After the liquid refrigerant filling is completed, the filling pipe is sealed.

[0057] In the manufacturing method of the high heat dissipation efficiency air-cooled radiator with phase change in this embodiment, the heat dissipation substrate is formed by open mold, and the processing efficiency is high; the fins are stamped from the profile plate, and each fin is connected in sequence into one body through a snap-fit ​​structure to form a fin heat dissipation assembly, and then the fins are welded to the substrate through a bending piece to obtain a fin heat sink, which does not require machining fin grooves on the substrate, is easy to process and manufacture, and has high production efficiency.

[0058] Further, such as Figure 1 、 Figure 2 As shown, in step (3), after the liquid refrigerant is filled, the charging tube is first clamped flat with a clamp, and then the charging tube is sealed by welding. In this embodiment, the area where the clamps clamp the charging tube is close to the heat sink substrate. In this way, by clamping the charging tube flat, the sealing welding area is initially isolated from the refrigerant in the heat sink substrate, preventing the open flame generated by the welding process from igniting the refrigerant in the substrate.

[0059] Furthermore, the upper surface of the solder sheet is provided with a plurality of solder bosses extending upward, and the solder bosses are used to support the fin heat dissipation assembly. The solder sheet and the solder bosses are made of the same material, and the solder bosses are close to the edge of the upper surface of the solder sheet. In step A1, the fin heat dissipation assembly is supported on each solder boss by a bent sheet, so that a thermally conductive gap layer is formed between the bent sheet of the fin heat dissipation assembly and the upper surface of the solder sheet. In step B1, during the process of the soldering furnace heating the substrate, the solder sheet and the fin heat dissipation assembly, the heat in the soldering furnace can directly heat the solder sheet through the thermally conductive gap layer, so that the entire solder sheet is evenly melted. Since the fin heat dissipation assembly is placed on the solder sheet through the bent sheet, and the number and density of the heat dissipation fins of the fin heat dissipation assembly are large, the solder sheet melts unevenly in the process of heating the substrate, solder sheet and fin heat dissipation assembly in the soldering furnace in step B1. Especially for large-area radiators, the problem of uneven melting of the solder sheet is more obvious. The edge of the solder sheet melts quickly, and the middle of the solder sheet melts slowly, resulting in bubbles and bulges between the bent sheet and the substrate, which not only affects the welding quality of the heat dissipation fins and the substrate, but also affects the heat conduction efficiency between the substrate and the heat dissipation fins. In order to solve this problem, the present solution sets a solder boss made of the same material as the solder sheet on the upper surface of the solder sheet, and the solder boss is close to the edge of the upper surface of the solder sheet, and then forms a thermal conductive gap layer between the bent sheet and the upper surface of the solder sheet by supporting the fin heat dissipation component. In this way, in step B1, during the process of heating the substrate, solder sheet and fin heat dissipation component in the soldering furnace, the heat in the soldering furnace can directly heat the solder sheet through the thermal conductive gap layer, so that the entire solder sheet is melted evenly. This can not only effectively avoid the uneven melting of the solder sheet (the middle surface of the edge block), which leads to the problem of bubbles and bulging between the bent sheet and the substrate; but also after the entire solder sheet is evenly melted, the solder boss will automatically melt, so that the bent sheet of the heat dissipation fin is welded to the substrate, without the need for additional control or adding other processes, which is extremely convenient for actual production and processing.

[0060] In this embodiment, the thickness of the solder sheet is 0.1-1.5 mm, the height of the solder boss is 0.5-3 mm, and the outer diameter of the solder boss is 2-10 mm.

[0061] Furthermore, in step B1, as the soldering furnace heats the substrate, solder sheet, and fin heat sink assembly, when the center of the solder sheet begins to melt, the fin heat sink assembly remains supported on the solder bosses via the bent tabs. This prevents the solder bosses from melting before the center of the solder sheet begins to melt, causing the fin heat sink assembly to drop onto the solder sheet and affect the uniform melting of the solder sheet.

[0062] Furthermore, each solder boss is arranged in two rows, and each row of solder bosses includes at least two solder bosses. For example, each row of solder bosses includes two or three solder bosses, and the two rows of solder bosses are distributed on opposite sides of the upper surface of the solder sheet. In step B1, during the process of heating the heat dissipation substrate, the solder sheet, and the fin heat dissipation assembly in the soldering furnace, the solder bosses in one row of solder bosses are completely melted first, and the solder bosses in the other row of solder bosses are completely melted later. Specifically, the outer diameters of the solder bosses in the same row of solder bosses are the same. The outer diameter of the solder bosses in one row of the two rows of solder bosses is smaller than the outer diameter of the solder bosses in the other row of solder bosses, so that in step B1, during the process of heating the heat dissipation substrate, the solder sheet, and the fin heat dissipation assembly in the soldering furnace, the solder bosses in one row of solder bosses are completely melted first, and the solder bosses in the other row of solder bosses are completely melted later. Since the bent pieces of each heat dissipation fin of the fin heat dissipation assembly are located in the same plane and the gaps between each bent piece are very small, if each bent piece of the fin heat dissipation assembly is horizontally lowered, it is easy for some air under the bent piece in the middle of the fin heat dissipation assembly to not be emptied in time, resulting in the problem of bubbles and bulging between some bent pieces in the middle of the fin heat dissipation assembly and the substrate. In order to solve this problem, in the process of heating the heat dissipation substrate, solder sheet and fin heat dissipation assembly in the soldering furnace, the solder bosses in one row of solder bosses are completely melted first, and the solder bosses in the other row of solder bosses are completely melted later. In this way, one side of the fin heat dissipation assembly will tilt at a small angle during the descent process, and one side of the fin heat dissipation assembly will first contact the melted solder sheet, and then the other side of the fin heat dissipation assembly will gradually descend and contact the melted solder sheet. In this way, the air under each bent piece of the fin heat dissipation assembly can be effectively discharged, avoiding the problem of bubbles and bulging between some bent pieces in the middle of the fin heat dissipation assembly and the substrate.

[0063] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any way. Any simple modification, change and equivalent transformation made to the above embodiment based on the technical essence of the present invention still fall within the scope of protection of the technical solution of the present invention.

Claims

1. A method for manufacturing a high heat dissipation efficiency air-cooled radiator with phase change, characterized in that: The following steps are included: (1) Substrate production, substrate production includes the following steps: A. A heat dissipation substrate with heat dissipation channels is manufactured using a mold. The outer surface of the heat dissipation substrate is provided with a connection hole connected to the evaporation end channel or the condensation end channel; B. Weld a section of metal pipe to the outer port of the connecting hole to form a filling pipe; The fin heat dissipation assembly is manufactured by stamping the fins with the profile plate, and the bending piece, buckle structure and fin are stamped and formed as a whole; then, each fin is sequentially connected into one body through the buckle structure to form a fin heat dissipation assembly, and the snap-fit ​​piece of one fin of any two adjacent fins in the fin heat dissipation assembly is clamped in the snap-fit ​​groove of the other fin to connect the fins into one body; (2) The base plate and the fin heat dissipation component are welded and formed. The base plate and the fin heat dissipation component are welded and formed including the following steps: A1. Place the side of the heat sink substrate where the fin heat sink assembly will be soldered facing upward. Then, place a solder sheet on the side of the heat sink substrate where the fin heat sink assembly will be soldered. The upper surface of the solder sheet is provided with several solder bosses extending upward. Next, place the fin heat sink assembly on the solder sheet via the bent sheet. The fin heat sink assembly is supported on the solder bosses by the bent sheet, so that a thermally conductive gap layer is formed between the bent sheet of the fin heat sink assembly and the upper surface of the solder sheet. B1, placing the heat sink substrate, solder sheet, and fin heat sink assembly into a soldering furnace, heating the solder sheet to melt the solder sheet; then, removing the substrate, solder sheet, and fin heat sink assembly from the soldering furnace and cooling them to room temperature to complete the soldering of the fin heat sink assembly and the heat sink substrate; (3) Refrigerant filling: inject liquid refrigerant into the heat dissipation channel through the filling pipe. After the liquid refrigerant filling is completed, the filling pipe is sealed.

2. The method for manufacturing a high heat dissipation efficiency air-cooled radiator with phase change according to claim 1, characterized in that: In the step (iii), after the liquid refrigerant is filled, the filling pipe is first clamped flat with a clamp, and then the filling pipe is sealed and welded to achieve sealing of the filling pipe.

3. The method for manufacturing a high heat dissipation efficiency air-cooled radiator with phase change according to claim 1 or 2, characterized in that: The solder sheet and the solder boss are made of the same material, and the solder boss is close to the edge of the upper surface of the solder sheet; In step B1, when the soldering furnace heats the substrate, the solder sheet and the fin heat dissipation assembly, the heat in the soldering furnace can directly heat the solder sheet through the thermally conductive gap layer, so that the entire solder sheet is uniformly melted.

4. The method for manufacturing a high heat dissipation efficiency air-cooled radiator with phase change according to claim 3, characterized in that: In the step B1, during the process of heating the substrate, the solder sheet and the fin heat sink assembly in the soldering furnace, when the middle portion of the solder sheet begins to melt, the fin heat sink assembly remains supported on each solder boss via the bent sheet.

5. The method for manufacturing a high heat dissipation efficiency air-cooled radiator with phase change according to claim 1 or 2, characterized in that: The connection holes are formed by machining, or the connection holes and the heat dissipation holes are formed together by using a mold.

6. The method for manufacturing a high heat dissipation efficiency air-cooled radiator with phase change according to claim 1 or 2, characterized in that: The high heat dissipation efficiency air-cooled radiator with phase change includes a heat dissipation substrate and a fin heat dissipation assembly, the fin heat dissipation assembly includes a plurality of parallel distributed fins, a heat dissipation channel is provided in the heat dissipation substrate, and a liquid refrigerant is provided in the heat dissipation channel, the heat dissipation channel includes an evaporation end channel arranged at the lower part of the heat dissipation substrate, a condensation end channel arranged at the upper part of the heat dissipation substrate, and a plurality of connecting channels distributed between the evaporation end channel and the condensation end channel, the lower end of the connecting channel is connected to the evaporation end channel, and the upper end of the connecting channel is connected to the condensation end channel, the liquid refrigerant is located in the evaporation end channel or a part of the liquid refrigerant is located in the evaporation end channel, and the other part is located in the lower part of each connecting channel.

7. The method for manufacturing a high heat dissipation efficiency air-cooled radiator with phase change according to claim 6, characterized in that: A bending piece and a buckling structure are provided on one side of the fin, and the buckling structure includes a snap-in groove and a snap-in piece arranged on the bending piece. The snap-in piece of one fin of any two adjacent fins is clamped in the snap-in groove of the other fin, so that the fins of the fin heat dissipation assembly are connected as one. The fins of the fin heat dissipation assembly are welded to one side of the heat dissipation substrate through the bending piece.

8. The method for manufacturing a high heat dissipation efficiency air-cooled radiator with phase change according to claim 7, characterized in that: The other side of the fin is also provided with a bending piece and a buckling structure, and the bending pieces on both sides of the fin are distributed on opposite sides of the fin.

9. The method for manufacturing a high heat dissipation efficiency air-cooled radiator with phase change according to claim 7, characterized in that: The clamping piece is provided with a plug-in hole, the clamping groove is provided with a plug-in pin, and the plug-in pin of one of any two adjacently distributed fins is inserted into the plug-in hole.

10. The method for manufacturing a high heat dissipation efficiency air-cooled radiator with phase change according to claim 7, characterized in that: The fins are formed by stamping a profile plate, and the bending pieces, the buckling structure and the fins are stamped integrally.

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