Accommodating device, exposure apparatus, and article manufacturing method

Abstract

The present application provides a storage device, an exposure device, and an article manufacturing method. The storage device stores a master including a pattern surface on which a pattern is formed, and has: a first supply portion that blows and supplies a gas in a manner to form at least one of a first gas flow along a first surface on an opposite side of the pattern surface of the master and a second gas flow along a second surface on an opposite side of the pattern surface of a protection member, the protection member being disposed separately from the pattern surface and protecting the pattern surface; a second supply portion that blows and supplies a gas in a manner to form a third gas flow that interferes with the at least one gas flow formed by the first supply portion; and a member including an acceptance surface that intersects a blowing direction of the gas blown from the second supply portion and that is used to accept the third gas flow formed by the second supply portion, the first supply portion being disposed on a depth side of a storage space in which the master is stored with reference to a conveyance port used to convey the master, and the second supply portion being disposed on a front side of the storage space with reference to the conveyance port.

Description

Technical Field

[0001] The present invention relates to a storage device, an exposure device, and an article manufacturing method. Background Art

[0002] In the photolithography process (lithography) of semiconductor and liquid crystal display device manufacturing, an exposure system is used to project a pattern on an original plate (mask or photomask) onto a substrate (wafer) coated with a resist material, thereby transferring (forming) the pattern onto the substrate. In this exposure system, if foreign matter or other particles are present on the original plate during the projection of the original plate pattern onto the substrate, i.e., during the exposure of the substrate, these particles can be transferred to the substrate along with the pattern, causing defects (faults).

[0003] Therefore, generally speaking, in order to prevent foreign matter from adhering to the pattern surface (the surface on which the pattern is formed) of the original, a protective component called a plench is provided on the original. The plench is, for example, a film-like product made of a synthetic resin. The plench is supported by a plench support frame at a predetermined distance from the pattern surface of the original. Therefore, since foreign matter adheres to the plench film that is offset from the pattern surface of the original by a predetermined distance, it cannot form a focus on the substrate during exposure and only appears as a light spot. In this way, by providing a plench on the original, the influence of foreign matter during exposure can be reduced.

[0004] In addition, in exposure devices, in order to cope with the miniaturization of semiconductor elements and achieve high resolution, the exposure wavelength is being shortened. Currently, the mainstream exposure wavelengths are 248nm of KrF excimer lasers and 193nm of ArF excimer lasers belonging to the vacuum ultraviolet region. In exposure devices that use short wavelengths (high energy) such as ArF excimer lasers as light sources, blurring of the original plate becomes a problem. Specifically, first, due to the reaction of oxygen and alkali present on the surface of the original plate or in the atmospheric gas, or the photochemical reaction of organic impurities, substances that cause blurring are formed on the original plate. In addition, the presence of moisture and the irradiation of ultraviolet rays (exposure energy) cause the blurring to condense and grow into blurring of a size that causes defects.

[0005] For the blurring of the original, the volatile impurities (mainly SO x Effective measures to suppress the overall blurring of the original plate include removing moisture (such as NH3, organic matter) or reducing humidity, which is a source of blurring. Japanese Patent Application Laid-Open No. 11-249286 and Japanese Patent No. 4585514 propose techniques for supplying a gas such as clean dry air (CDA) into the surrounding environment of the original plate to perform a gas purge, replacing the surrounding environment with the purge gas.

[0006] Furthermore, the blurring of the original is also caused by moisture within the mask film. However, even if the interior of the mask film is exposed to a low-humidity environment, it takes time for the humidity inside the mask film to be replaced by a low-humidity environment. Therefore, gas purging of the storage environment, such as the original storage room, is effective in reducing the humidity inside the mask film and suppressing the blurring of the original. Summary of the Invention

[0007] Problems to be solved by the invention

[0008] However, conventional techniques have a problem in that a large amount (large flow rate) of purge gas is required in order to reduce the humidity of the surrounding environment such as the storage environment of the original.

[0009] The present invention provides a storage device which is advantageous for reducing the humidity of a storage space for an original plate.

[0010] Solutions to Problems

[0011] In order to achieve the above-mentioned purpose, a storage device as an aspect of the present invention stores an original plate including a pattern surface on which a pattern is formed, and is characterized in that the above-mentioned storage device has: a first supply part, the first supply part blows and supplies gas in a manner of forming at least one of a first airflow and a second airflow, the above-mentioned first airflow is along the first surface of the above-mentioned original plate opposite to the pattern surface, the above-mentioned second airflow is along the second surface of the protective member opposite to the pattern surface, the above-mentioned protective member is separated from the above-mentioned pattern surface and protects the above-mentioned pattern surface; A supply section, the second supply section blows out and supplies gas in a manner of forming a third airflow, the above-mentioned third airflow interferes with at least one of the above-mentioned airflows formed by the above-mentioned first supply section; and a component, the component includes a receiving surface that intersects with the blowing direction of the gas blown from the above-mentioned second supply section and is used to receive the above-mentioned third airflow formed by the above-mentioned second supply section, the above-mentioned first supply section is arranged on the depth side of the storage space for accommodating the above-mentioned original plate with respect to the conveying port for conveying the above-mentioned original plate as a reference, and the above-mentioned second supply section is arranged on the near front side of the above-mentioned storage space with respect to the above-mentioned conveying port as a reference.

[0012] As another aspect of the present invention, an exposure device is provided for exposing a substrate, and is characterized in that the exposure device comprises: a storage portion for storing an original plate including a pattern surface on which a pattern is formed; an original plate holding portion for holding the original plate transported from the storage portion; and a projection optical system for projecting the pattern of the original plate held by the original plate holding portion onto the substrate, the storage portion comprising: a first supply portion for blowing and supplying gas in a manner of forming at least one of a first airflow and a second airflow, the first airflow being along a first surface of the original plate opposite to the pattern surface, and the second airflow being along a protective member The protective member is separated from the pattern surface and protects the pattern surface; a second supply portion, which blows out and supplies gas in a manner of forming a third airflow, and the third airflow interferes with at least one of the airflows formed by the first supply portion; and a member, which includes a receiving surface that intersects with the blowing direction of the gas blown from the second supply portion and is used to receive the third airflow formed by the second supply portion, the first supply portion is arranged on the depth side of the storage space for accommodating the original plate with respect to the conveying port for conveying the original plate, and the second supply portion is arranged on the near front side of the storage space with respect to the conveying port.

[0013] As another aspect of the present invention, the method for manufacturing an article is characterized in that the method for manufacturing an article comprises: a process of exposing a substrate using the above-mentioned exposure device; a process of developing the exposed substrate; and a process of manufacturing an article from the developed substrate.

[0014] Additional objects and other aspects of the present invention will become apparent from the following embodiments described with reference to the accompanying drawings.

[0015] Effects of the Invention

[0016] According to the present invention, for example, a storage device that is advantageous in reducing the humidity of a storage space for original plates can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram showing the configuration of a storage device in the first embodiment of the present invention.

[0018] Figure 2 It is a diagram for explaining the relationship among the flow rate of the first airflow, the flow rate of the second airflow, and the flow rate of the third airflow.

[0019] Figure 3 This is a schematic diagram showing the configuration of a storage device in the first embodiment of the present invention.

[0020] Figure 4This is a schematic diagram showing the configuration of a storage device in the first embodiment of the present invention.

[0021] Figure 5 This is a schematic diagram showing the configuration of a storage device in the first embodiment of the present invention.

[0022] Figure 6 This is a schematic diagram showing the configuration of a storage device in the first embodiment of the present invention.

[0023] Figure 7A as well as Figure 7B It is a schematic diagram showing the configuration of a storage device in a second embodiment of the present invention.

[0024] Figure 8 This is a schematic diagram showing the configuration of a storage device in a third embodiment of the present invention.

[0025] Figure 9 This is a schematic diagram showing the configuration of a storage device in a fourth embodiment of the present invention.

[0026] Figure 10 This is a schematic diagram showing the configuration of an exposure apparatus as one aspect of the present invention.

[0027] Figure 11 This is a schematic diagram showing the structure of a storage device in the related art.

[0028] Figure 12 This is a schematic diagram showing the structure of a storage device in the related art. DETAILED DESCRIPTION

[0029] The following embodiments are described in detail with reference to the accompanying drawings. The following embodiments do not limit the inventions described in the claims. While the embodiments describe various features, not all of these features are essential technical features of the invention, and multiple features may be combined in any desired manner. Furthermore, in the accompanying drawings, identical or similar components are denoted by the same reference numerals, and repeated descriptions are omitted.

[0030] First, before describing the present embodiment, a conventional technology regarding a storage device (storage room) for storing (keeping) originals will be described.

[0031] Figure 11This is a schematic diagram showing the structure of the storage device 1000 disclosed in Patent Document 1. The storage device 1000 performs gas purge from one direction on the storage space (surrounding environment of the original plate 91) that stores the original plate 91 including the pattern surface on which the pattern is formed. Specifically, the supply unit 94 causes the gas 95 (low-humidity gas) to flow to the back surface 92 of the original plate 91 opposite to the pattern surface or to the protective surface 93 of the protective member (mask) that protects the pattern surface of the original plate 91 via the nozzle, thereby performing gas purge of the storage space. In this way, if the storage space of the original plate 91 is gas-purged from one direction, as shown in FIG. Figure 11 As shown, an eddy flow 96 is generated on the downstream side relative to the original plate 91 , and the high-humidity atmosphere around the original plate 91 is drawn in, so there is a problem that the humidity of the storage space cannot be reduced.

[0032] Figure 12 This is a schematic diagram showing the structure of the storage device 2000 disclosed in Patent Document 2. The storage device 2000 performs gas purge on the storage space 110 that stores the original plate 101 including the pattern surface on which the pattern is formed. Specifically, in the storage device 2000, the gas 104 (low-humidity gas) is caused to flow inward from the opening side of the storage space 110 of the original plate 101, and the gas 104 flows toward the opening side after purging the storage space 110 (the inner side). At this time, the gas 104 flows around the back surface 102 of the original plate 101 on the opposite side to the pattern surface and around the protective surface 103 of the protective member (mask) that protects the pattern surface of the original plate 101. In addition, in Figure 12 , the flow of gas 104 from the inside of the storage space 110 for the original plate 101 to the open side is shown. Furthermore, in the storage device 2000, a supply unit 105 is provided above the open side (downstream relative to the original plate 101) of the storage space 110 for the original plate 101, which blows gas 106 (low-humidity gas) downward through a nozzle to form an air curtain. Furthermore, the storage device 2000 is provided with an opening and closing mechanism 109 that closes the opening of a cavity 108 defining the storage space 110 for the original plate 101, thereby forming the storage space 110 into a sealed space.

[0033] In such a storage device 2000, when the storage space 110 is formed into a sealed space by the opening and closing mechanism 109 without performing gas purging, a vortex 107 is generated on the downstream side relative to the original plate 101, which draws in the high-humidity ambient gas around the original plate 101, making it impossible to reduce the humidity of the storage space 110. In order to reduce the humidity of the storage space 110 for the original plate 101, the area where the vortex 107 is generated must be narrowed to reduce the entrainment of the surrounding high-humidity ambient gas. Therefore, it is considered to use the supply unit 105 to form an air curtain that blocks the flow of gas 104 flowing around the back surface 102 of the original plate 101 and around the protective surface 103 of the protective member. However, there is a problem that a large amount (high flow rate) of gas 106 is required to form such an air curtain.

[0034] Hereinafter, in each embodiment, a storage device that is advantageous for reducing the humidity of a storage space for an original plate will be described.

[0035] <First embodiment>

[0036] Figure 1 The schematic diagram shows the configuration of a storage device 1A according to the first embodiment of the present invention. The storage device 1A stores (stores) a master plate 11 including a pattern surface 14 on which a pattern is formed in a storage space AS defined by a storage cavity (not shown).

[0037] The original plate 11 is held in the storage space AS, for example, via a holding groove or holding member provided in the storage chamber. A protective member 12, also known as a mask, is provided on the original plate 11 to prevent foreign matter from adhering to the pattern surface 14 of the original plate 11. The protective member 12 is supported by a support frame 12a at a predetermined distance from (offset from) the pattern surface 14 of the original plate 11.

[0038] The storage device 1A is provided with a first supply unit 13 (nozzle) to purge the storage space AS (the surrounding environment of the original plate 11) with gas from one direction. The first supply unit 13 supplies gas around the back surface 15 (first surface) of the original plate 11, which is opposite the pattern surface 14, and around the protective surface 16 (second surface) of the protective member 12, which is opposite the pattern surface 14, thereby replacing the storage space AS with this gas. Specifically, the first supply unit 13 has the function of generating at least one of a first airflow 17 along the back surface 15 of the original plate 11 (i.e., flowing around the back surface 15) and a second airflow 18 along the protective surface 16 of the protective member 12 (i.e., flowing around the protective surface 16). In this embodiment, the first supply unit 13 blows and supplies gas to the storage space AS in a manner that generates both the first airflow 17 and the second airflow 18. In this way, the first supply unit 13 forms an airflow (the first airflow 17 and the second airflow 18) in one direction, flowing from the rear side of the storage space AS toward the front side of the storage space AS. Furthermore, the first supply unit 13 can form the first airflow 17 and the second airflow 18 using a single nozzle, or it can form the first airflow 17 and the second airflow 18 using separate nozzles (two nozzles). By forming the first airflow 17 and the second airflow 18 using separate nozzles, the flow rates of the first airflow 17 and the second airflow 18 can be independently controlled (set).

[0039] In addition, in the storage device 1A, a second supply unit 21 is provided on the opening side of the storage chamber, specifically above the side of the conveying port CP for conveying the original plate 11 between the storage device 1A and the outside. The second supply unit 21 forms an air curtain for blocking the conveying port CP from the outside. Specifically, the second supply unit 21 blows out and supplies gas in a manner that forms a third airflow 19 that interferes with at least one of the first airflow 17 and the second airflow 18 formed by the first supply unit 13. In the present embodiment, the second supply unit 21 blows out and supplies gas downward in a manner that forms a third airflow 19 that collides with (intersects) both the first airflow 17 and the second airflow 18 formed by the first supply unit 13.

[0040] like Figure 1 As shown, in the storage apparatus 1A, the first supply unit 13 is positioned toward the rear of the storage space AS, with the conveyor port CP as a reference. The second supply unit 21 is positioned toward the front of the storage space AS, with the conveyor port CP as a reference. Furthermore, with the plate 11 stored in the storage space AS as a reference, the first supply unit 13 is positioned to one side (in the -Y direction) of the plate 11, while the second supply unit 21 is positioned to the other side (in the +Y direction) of the plate 11. This arrangement allows the storage space AS to be purged from a single direction.

[0041] Examples of the gas (purge gas) supplied from the first supply unit 13 and the second supply unit 21 include clean dry air (CDA). Compared to ordinary air, CDA contains an extremely low proportion of moisture (water vapor), which is a blur-generating substance for the original plate 11. In this embodiment, the gas has a humidity of 1% or less. Alternatively, the gas supplied from the first supply unit 13 and the second supply unit 21 may be an inert gas containing a low proportion of moisture, such as nitrogen (N2). By purging the storage space AS with CDA having a humidity of 1% or less, the humidity of the environment surrounding the original plate 11 can be reduced to, for example, 1.5% or less, thereby suppressing blurring of the original plate 11.

[0042] Furthermore, if the humidity of the environment surrounding the original plate 11 can be set below the target humidity, the gas supplied from the first supply unit 13 and the gas supplied from the second supply unit 21 may be different. In other words, the gas forming the third airflow 19 may be a gas other than the gases forming the first airflow 17 and the second airflow 18. However, from the perspective of increasing the complexity of the device configuration, it is preferable that the gas supplied from the first supply unit 13 and the gas supplied from the second supply unit 21 be the same gas.

[0043] Furthermore, in the storage device 1A, a wall member 20 is provided facing the second supply unit 21. The wall member 20 is a member including a receiving surface 20a that intersects with the blowing direction BD of the gas blown out from the second supply unit 21 and is used to receive the third airflow 19 formed by the second supply unit 21. Specifically, the wall member 20 is configured so that the receiving surface 20a extends from the protective surface 16 of the protective member 12 in the Y direction (along the direction of the protective surface 16) to the outside within a range of 0 mm to 300 mm. The wall member 20 may be configured as part of the storage cavity that defines the storage space AS, or may be configured separately from the storage cavity.

[0044] In the storage device 1A, as described above, due to the first airflow 17 and the second airflow 18, a vortex 22 is generated on the downstream side relative to the original plate 11. However, in this embodiment, by sandwiching the first airflow 17 and the second airflow 18 with the third airflow 19 formed by the second supply unit 21 and the wall member 20, the area (generation area) where the vortex 22 is generated can be narrowed. Therefore, the involvement of the high-humidity ambient gas around the original plate 11 can be reduced, and the storage space AS can be made low-humidity. In addition, from the viewpoint of narrowing the generation area of ​​the vortex 22, it is preferred that the distance in the Z direction (the direction orthogonal to the pattern surface 14 of the original plate 11) between the second supply unit 21 and the wall member 20 is short. Specifically, the wall member 20 can be configured so that the distance between the receiving surface 20a and the gas blowing outlet of the second supply unit 21 in the Z direction is greater than 10 mm and less than 500 mm.

[0045] Here, refer to Figure 2 , the relationship between the flow rate Q1 of the first airflow 17, the flow rate Q2 of the second airflow 18, and the flow rate Q3 of the third airflow 19 will be described. Figure 2 , the flow of gas around the original plate 11 is shown when the flow rate Q3 of the third airflow 19 is greater than the sum of the flow rate Q1 of the first airflow 17 and the flow rate Q2 of the second airflow 18 (the total flow rate of the first airflow 17 and the second airflow 18), that is, when Q3 ≥ Q1 + Q2. In this case, as Figure 2 As shown, the third airflow 19 strikes the receiving surface 20a of the wall member 20, generating a portion of the airflow 19a flowing toward the plate original 11 (countercurrent). This draws in the high-humidity ambient air surrounding the plate original 11, generating an airflow 81 of high-humidity gas flowing toward the plate original 11. This adversely affects the lowering of humidity in the storage space AS, i.e., the surrounding environment of the plate original 11. Therefore, it is preferable that the flow rate Q3 of the third airflow 19 be less than the sum of the flow rates Q1 of the first airflow 17 and Q2 of the second airflow 18 (the total flow rate of the first and second airflows 17, 18), i.e., Q3 < Q1 + Q2.

[0046] In addition, the storage device 1A can also be Figure 3 As shown in FIG, a plurality of original plates 11 can be stored by providing a multi-layer storage space AS, that is, a storage rack for stacking multiple layers of original plates 11. Figure 3 In the embodiment, two layers of storage racks are stacked, but the number of layers of the storage racks is not limited, and more than three layers of storage racks can also be stacked. Figure 3 1A is a diagram showing the structure of a storage device 1A that can store a plurality of original plates 11. In this case, a second supply unit 21 and a wall member 20 are provided for each of the plurality of storage spaces AS (a plurality of original plates 11). Figure 3 As shown in the storage device 1A, a second supply unit 21 for forming a third airflow 19 in the lower storage space AS is provided on the wall member 20 of the upper storage space AS. On the other hand, the first supply unit 13 does not need to be provided for each of the plurality of storage spaces AS. Figure 3 As shown, the first airflow 17 and the second airflow 18 in each of the plurality of storage spaces AS are formed by one first supply unit 13. This is more advantageous in terms of device configuration than providing each first supply unit 13 for each of the plurality of storage spaces AS.

[0047] In addition, Figure 1 In the embodiment, the wall member 20 exists only in the portion facing the second supply portion 21. However, the wall member 20 may also be Figure 4As shown in FIG. 1 , the back surface 15 of the original plate 11 or the protective surface 16 of the protective member 12 extends toward the first supply unit 13. In this case, the second airflow 18 formed by the second supply unit 21 is rectified by the wall member 20. Similarly, from the perspective of rectifying the first airflow 17, it is also possible to Figure 4 As shown, the second supply portion 21 is extended toward the first supply portion 13 side relative to the back surface 15 of the original plate 11 or the protective surface 16 of the protective member 12 .

[0048] Figure 5 yes Figure 1 The XY plane view of the storage device 1A shown in FIG. Figure 5 As shown in the figure, the second air flow 18 preferably flows in the X direction over a range wider than the back surface 15 of the original plate 11. Similarly, it is preferred that the second air flow 18 flows in the X direction over a range wider than the protective surface 16 of the protective member 12. Therefore, the first supply unit 13 can blow and supply gas in a manner such that the first air flow 17 and the second air flow 18 are formed in the X direction over a range wider than the back surface 15 of the original plate 11 or the protective surface 16 of the protective member 12. In addition, it is preferred that the third air flow 19 flows in the X direction over a range wider than the first air flow 17 and the second air flow 18. Therefore, the second supply unit 21 can blow and supply gas in a manner such that the third air flow 19 is formed in the X direction over a range wider than the first air flow 17 and the second air flow 18.

[0049] The second supply unit 21 (the gas outlet) is preferably arranged near the original plate 11 in the Y direction. This is because if the second supply unit 21 is arranged away from the original plate 11, the position where the third airflow 19 interferes (intersects) with the first airflow 17 and the second airflow 18 is farther away from the original plate 11, and the region where the vortex 22 is generated expands in the +Y direction, which takes time to reduce the humidity of the storage space AS.

[0050] In addition, as described above, the third airflow 19 only needs to sandwich the first airflow 17 and the second airflow 18 on the downstream side relative to the original plate 11 in cooperation with the wall member 20. Figure 6 As shown, the second supply unit 21 and the wall member 20 do not need to be opposed to each other in the Z direction. They can be arranged so that the blowing direction BD of the gas blown from the second supply unit 21 intersects the receiving surface 20a. Even if the second supply unit 21 and the wall member 20 are offset in the Y direction, it is sufficient that the blowing direction BD of the gas blown from the second supply unit 21 intersects the receiving surface 20a of the wall member 20.

[0051] <Second embodiment>

[0052] Reference Figure 7A as well as Figure 7BA storage device 1B according to a second embodiment of the present invention will be described. Figure 7A 1B is a schematic diagram showing the configuration of a storage device 1B in a second embodiment of the present invention. Figure 7B yes Figure 7A The XY plane view of the storage device 1B is shown. The storage device 1B stores (or stores) a master plate 11 having a patterned surface 14 formed thereon in a storage space AS defined by a storage cavity (not shown). The storage device 1B has the same structure as the storage device 1A, but differs from the storage device 1A in the structure of the wall member 20.

[0053] In the present embodiment, the wall member 20 includes a convex portion 41 on the receiving surface 20a that protrudes toward the second supply portion 21. The convex portion 41 is opposed to the second supply portion 21 and is provided so as to intersect with the blowing direction BD of the gas blown out from the second supply portion 21. By providing the convex portion 41 on the receiving surface 20a of the wall member 20, the distance in the Z direction between the second supply portion 21 and the wall member 20 can be shortened. In addition, the surface of the convex portion 41 on the second supply portion 21 side can be formed so that the surface on the second supply portion 21 side is located at a higher position (+Z direction) in the Z direction than the protective surface 16 of the protective member 12.

[0054] As described in the first embodiment, the region where the vortex 42 is generated can be narrowed by the third airflow 19 formed by the second supply unit 21 and the wall member 20. However, by providing the protrusion 41 as in this embodiment, the region where the vortex 42 is generated can be further narrowed. This reduces the ingress of high-humidity ambient gas surrounding the original plate 11, allowing the storage space AS to be kept at a low humidity. Thus, the protrusion 41 is effective in reducing the humidity of the environment surrounding the original plate 11.

[0055] In addition, in this embodiment, Figure 7B As shown in FIG, a side wall 43 is provided in the X direction relative to the original plate 11. Figure 7B The first airflow 17 formed by the first supply unit 13 generally diffuses in the X direction. However, in this embodiment, the side wall 43 is provided, so that the diffusion of the first airflow 17 in the X direction can be suppressed. Therefore, in this embodiment, the first airflow 17 can be caused to flow in the X direction within a range narrower than the back surface 15 of the original plate 11. Similarly, the second airflow 18 can be caused to flow in the X direction within a range narrower than the protective surface 16 of the protective member 12. On the other hand, it is preferable that the third airflow 19 flows in the X direction within a range wider than the first airflow 17 and the second airflow 18.

[0056] <Third embodiment>

[0057] Reference Figure 8 A storage device 1C according to a third embodiment of the present invention will be described. Figure 8This is a schematic diagram illustrating the configuration of a storage device 1C according to a third embodiment of the present invention. Storage device 1C stores (or stores) a master plate 11 including a patterned surface 14 formed with a pattern in a storage space AS defined by a storage cavity (not shown). Storage device 1C has the same configuration as storage device 1A, but, compared to storage device 1A, further includes a third supply unit 51. Furthermore, in this embodiment, first supply unit 13 blows and supplies gas to form only first airflow 17.

[0058] The third supply unit 51 is provided facing the protection surface 16 of the protection member 12, and blows and supplies gas toward the protection surface 16. Figure 8 As shown, an air flow 52 is formed in the storage space AS of the original plate 11 .

[0059] The gas (purge gas) supplied from the third supply unit 51 contains a much lower proportion of moisture (water vapor), a substance that causes blurring of the original plate 11, than ordinary air. In this embodiment, the gas has a humidity of 1% or less. The gas supplied from the third supply unit 51 may be different from or the same as the gas supplied from the first supply unit 13 or the gas supplied from the second supply unit 21.

[0060] As described in the first embodiment, the third airflow 19 and the wall member 20 generated by the second supply unit 21 can narrow the region where the vortex 53 is generated. However, by forming the airflow 52 as in this embodiment, the region where the vortex 53 is generated can be further narrowed. This reduces the ingress of high-humidity ambient gas surrounding the original plate 11, allowing the storage space AS to be kept at a low humidity. Thus, the formation of the airflow 52 by blowing gas from the third supply unit 51 toward the protective surface 16 of the protective member 12 is effective in reducing the humidity of the environment surrounding the original plate 11.

[0061] In this embodiment, the third supply unit 51 is provided on the wall member 20, but this is not limiting. For example, the third supply unit 51 can be configured to blow gas toward the entire area of ​​the protective surface 16 of the protective member 12. The third supply unit 51 may also be provided separately from the wall member 20. The gas outlet of the third supply unit 51 may be shaped in any desired manner, such as a slit or a circular shape.

[0062] <Fourth embodiment>

[0063] Reference Figure 9 A storage device 1D according to a fourth embodiment of the present invention will be described. Figure 9This is a schematic diagram illustrating the configuration of a storage device 1D according to a fourth embodiment of the present invention. Storage device 1D stores (or stores) original plates 11, each including a patterned surface 14, in a storage space AS defined by a storage cavity (not shown). Storage device 1D has the same configuration as storage device 1A, but, compared to storage device 1A, further includes a fourth supply unit 61.

[0064] The fourth supply unit 61 is provided on the wall member 20 so as to face the second supply unit 21. The fourth supply unit 61 blows and supplies gas to form a fourth airflow 62. This fourth airflow 62 interferes with the first airflow 17 and the second airflow 18 formed by the first supply unit 13 and faces the third airflow 19 formed by the second supply unit 21. It is preferable that the fourth airflow 62 flows in the X direction within a range comparable to that of the third airflow 19.

[0065] The gas (purge gas) supplied from the fourth supply unit 61 contains a much lower proportion of moisture (water vapor), a substance that causes blurring of the original plate 11, than ordinary air. In this embodiment, the gas has a humidity of 1% or less. The gas supplied from the fourth supply unit 61 may be different from or the same as the gas supplied from the first supply unit 13 or the gas supplied from the second supply unit 21.

[0066] In this embodiment, since the fourth airflow 62 is formed in a manner that interferes with (collides with) the first airflow 17 and the second airflow 18, the same effect as in the third embodiment can be obtained. Specifically, the third airflow 19 formed by the second supply unit 21 and the wall member 20 can be used to narrow the area where the vortex 63 is generated. However, by forming the fourth airflow 62 as in this embodiment, the area where the vortex 63 is generated can be further narrowed. Therefore, the involvement of the high-humidity ambient gas around the original plate 11 can be reduced, and the storage space AS can be made low-humidity. In this way, the method of forming the fourth airflow 62 that blows out gas from the fourth supply unit 61 and faces the third airflow 19 is effective for lowering the humidity of the environment around the original plate 11.

[0067] Here, the relationship between the flow rate Ql of the first gas flow 17, the flow rate Q2 of the second gas flow 18, the flow rate Q3 of the third gas flow 19, and the flow rate Q4 of the fourth gas flow 62 is explained. For example, consider a case where the sum (total flow rate) of the flow rate Q3 of the third gas flow 19 and the flow rate Q4 of the fourth gas flow 62 is greater than or equal to the sum (total flow rate) of the flow rate Ql of the first gas flow 17 and the flow rate Q2 of the second gas flow 18, that is, Q3 + Q4 ≥ Ql + Q2. In this case, by the collision of the third gas flow 19 and the fourth gas flow 62, a gas flow in which a part thereof flows toward the original 11 (counterflow) is generated. Thus, the high-humidity atmosphere gas around the original 11 is drawn in, and a gas flow in which a high-humidity gas flows toward the original 11 is generated, and thus the low-humidification of the storage space AS, which is the surrounding environment of the original 11, is not favorable. Therefore, it is preferable that the sum of the flow rate Q3 of the third gas flow 19 and the flow rate Q4 of the fourth gas flow 62 be less than the sum of the flow rate Ql of the first gas flow 17 and the flow rate Q2 of the second gas flow 18, that is, Q3 + Q4 < Ql + Q2.

[0068] Thus, according to the first embodiment, the second embodiment, the third embodiment, and the fourth embodiment, the storage device that is favorable for the low-humidification of the storage space AS, which is the surrounding environment of the original 11, can be provided without a large amount (large flow rate) of gas (purge gas). In addition, the first embodiment, the second embodiment, the third embodiment, and the fourth embodiment can be appropriately combined.

[0069] Hereinafter, the exposure apparatus to which the storage device 1A is applied as a storage portion that stores an original will be described with reference to Figure 10 to which the storage device 1A is applied as a storage portion that stores an original will be described with reference to Figure 10 is a schematic view showing the configuration of an exposure apparatus 505 as one aspect of the present application.

[0070] The exposure apparatus 505 is a lithography apparatus that is employed in a photolithography process as a manufacturing process of a device such as a semiconductor element or a liquid crystal display element, and forms a pattern on a substrate. The exposure apparatus 505 exposes the substrate via an original, and transfers the pattern of the original onto the substrate. The exposure apparatus 505 can employ a step-and-scan method, a distributed-repetition method, or another exposure method.

[0071] As shown in Figure 10 , the exposure apparatus 505 has an illumination optical system 501, an original stage 502 (original holding portion) that holds and moves an original, a projection optical system 503, a substrate stage 504 that holds and moves a substrate, and the storage device 1A.

[0072] The illumination optical system 501 illuminates the original 11 held by the original stage 502 with light from a light source. The illumination optical system 501 includes a lens, a mirror, an optical integrator, an aperture, and the like. In addition, as the light source, for example, a laser such as an ArF excimer laser having a wavelength of about 193 nm, a KrF excimer laser having a wavelength of about 248 nm, an F2 laser having a wavelength of about 157 nm, a YAG laser, or the like can be used. The number of lasers used by the light source is not limited. In the case where the light source uses a laser, the illumination optical system 501 can include a shaping optical system that shapes the laser light (parallel light) into a desired shape or a de-coherence optical system that de-coherences coherent laser light. In addition, the light source is not limited to a laser, and one or a plurality of lamps such as a mercury lamp or a xenon lamp can be used.

[0073] The projection optical system 503 projects the pattern of the original 11 onto a substrate held by the substrate stage 504. The projection optical system 503 can use an optical system composed of only a plurality of lens elements, an optical system including a plurality of lens elements and at least one concave mirror (catadioptric optical system), or the like. In addition, the projection optical system 503 can use an optical system including a plurality of lens elements and a diffractive optical element such as a diffractive imaging element, a total reflection mirror type optical system, or the like.

[0074] The storage device 1A stores (stores) the original 11 that is carried into the exposure apparatus 505 from the outside of the exposure apparatus 505 and carried to the original stage 502. The storage device 1A can lower the humidity of the storage space AS, which is the surrounding environment of the original 11, without using a large amount (large flow) of gas (purge gas) as described above. Therefore, the original 11 that is carried to the original stage 502 from the storage device 1A and held by the original stage 502 can suppress the occurrence of blur at the time of exposure. Thus, the exposure apparatus 505 can manufacture a high-quality device at a lower cost than in the related art in the photolithography process of the manufacturing process of a device such as a semiconductor element or a liquid crystal display element.

[0075] The article manufacturing method in the embodiment of the present application is suitable for manufacturing an article such as a device (semiconductor element, magnetic storage medium, liquid crystal display element, or the like). The manufacturing method includes a process of exposing (forming a pattern on a substrate) a substrate on which a photosensitive agent is applied using the exposure apparatus 505 and a process of developing (processing a substrate) the exposed substrate. In addition, the manufacturing method can include other known processes (oxidation, film formation, evaporation, doping, planarization, etching, resist peeling, cutting, bonding, packaging, or the like). The article manufacturing method of the present embodiment is advantageous in at least one of the performance, quality, production efficiency, and production cost of the article compared to the related art. In addition, the above-described article manufacturing method can be performed using a photolithography apparatus such as an imprint apparatus or a drawing apparatus.

[0076] The present invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Therefore, the following claims are appended to disclose the scope of the invention.

Claims

1. A storage device for storing an original plate having a pattern surface formed with a pattern, characterized in that: The storage device has: a first supply unit configured to blow and supply gas in a manner to form at least one of a first airflow and a second airflow, wherein the first airflow is directed along a first surface of the original plate opposite to the pattern surface, and the second airflow is directed along a second surface of a protective member opposite to the pattern surface, the protective member being disposed separately from the pattern surface and protecting the pattern surface; a second supply unit configured to blow and supply gas so as to form a third airflow, the third airflow interfering with the at least one airflow formed by the first supply unit; and a member disposed opposite to the second supply portion, comprising a receiving surface intersecting with a blowing direction of the gas blown from the second supply portion and configured to receive the third airflow formed by the second supply portion, The first supply unit is arranged on the back side of the storage space for storing the original plate with respect to the transport port for transporting the original plate as a reference. The second supply unit is disposed on the front side of the storage space with respect to the transfer port.

2. The storage device according to claim 1, wherein: The first supply unit blows and supplies gas so as to form an airflow from the rear side of the storage space toward the front side of the storage space as the at least one airflow.

3. The storage device according to claim 1, wherein: The second supply unit blows out and supplies gas so as to form an airflow as the third airflow that collides with the at least one airflow formed by the first supply unit.

4. The storage device according to claim 1, wherein: The member is arranged so that the receiving surface is located below the second surface in a direction perpendicular to the pattern surface.

5. The storage device according to claim 1, wherein: The member is arranged so that a distance between the receiving surface and the gas blowing port of the second supply unit in a direction perpendicular to the pattern surface is 10 mm to 500 mm.

6. The storage device according to claim 1, wherein: The receiving surface extends in a range of 0 mm to 300 mm outward from the second surface in a direction along the second surface relative to the second surface of the protection member.

7. The storage device according to claim 1, wherein: The first supply unit blows and supplies gas in a manner to form the first airflow and the second airflow. The flow rate of the third airflow is smaller than the sum of the flow rates of the first airflow and the second airflow.

8. The storage device according to claim 1, wherein: The receiving surface includes a convex portion protruding toward the second supply portion.

9. The storage device according to claim 1, wherein: The first supply unit blows and supplies gas in a manner that only the first airflow is formed. The storage device further includes a third supply unit that is provided facing the second surface of the protection member and blows and supplies gas toward the second surface.

10. The storage device according to claim 1, wherein: The above-mentioned storage device also has a fourth supply part, which is arranged on the above-mentioned component and blows out and supplies gas in a manner of forming a fourth airflow. The above-mentioned fourth airflow interferes with at least one of the above-mentioned airflows formed by the above-mentioned first supply part and is opposite to the above-mentioned third airflow formed by the above-mentioned second supply part.

11. The storage device according to claim 1, wherein: The storage device stores a plurality of the above-mentioned original plates. The second supply unit and the member are provided for each of the original plate.

12. The storage device according to claim 1, wherein: The above-mentioned gas includes a gas having a humidity of 1% or less.

13. The storage device according to claim 1, wherein: The first supply unit is arranged on a deeper side of the storage space than a position where the original plate is stored in the storage space.

14. An exposure device for exposing a substrate, characterized in that: The exposure device has: a receiving portion for receiving an original plate including a pattern surface on which a pattern is formed; an original plate holding portion for holding the original plate conveyed from the storage portion; and a projection optical system for projecting the pattern of the original plate held by the original plate holding portion onto the substrate, The storage portion includes: a first supply unit configured to blow and supply gas in a manner to form at least one of a first airflow and a second airflow, wherein the first airflow is directed along a first surface of the original plate opposite to the pattern surface, and the second airflow is directed along a second surface of a protective member opposite to the pattern surface, the protective member being disposed separately from the pattern surface and protecting the pattern surface; a second supply unit configured to blow and supply gas so as to form a third airflow, the third airflow interfering with the at least one airflow formed by the first supply unit; and a member disposed opposite to the second supply portion, comprising a receiving surface intersecting with a blowing direction of the gas blown from the second supply portion and configured to receive the third airflow formed by the second supply portion, The first supply unit is arranged on the back side of the storage space for storing the original plate with respect to the transport port for transporting the original plate as a reference. The second supply unit is disposed on the front side of the storage space with respect to the transfer port.

15. A method for manufacturing an article, characterized in that: The method for manufacturing an article has the following features: A step of exposing a substrate using the exposure apparatus according to claim 14; a step of developing the exposed substrate; and The process of manufacturing an article from the developed substrate.

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