Semiconductor cleaning equipment and its carrier

Abstract

The embodiment of the present application provides a semiconductor cleaning device and its supporting device. The supporting device includes: a chuck structure, a sealing adapter structure, a tightening structure and a driving structure; the top surface of the chuck structure is used to support the wafer; the sealing cover of the sealing adapter structure is used to form a sealed installation space at the bottom of the chuck structure, and the chuck structure can rotate relative to the sealing cover, and the driving structure is fixedly connected to the bottom of the sealing cover; the adapter assembly is located in the installation space and is respectively connected to the chuck structure and the driving structure, and the driving structure is used to drive the chuck structure to rotate through the adapter assembly; by operating the tightening structure at the bottom of the sealing cover, the tightening structure located in the installation space is actuated to connect the adapter assembly to the chuck structure. The embodiment of the present application realizes that the top surface of the chuck structure is an integrated structure, which prevents tiny particles on the chuck structure from contaminating the front of the wafer, thereby greatly improving the cleaning efficiency and yield.

Description

Technical Field

[0001] The present application relates to the field of semiconductor processing technology, and more specifically, to a semiconductor cleaning device and a carrier device thereof. Background Art

[0002] At present, the single-wafer backside cleaning machine of semiconductor cleaning equipment has higher requirements for the carrier device than the single-wafer frontside cleaning machine. Since the carrier device is set opposite to the front side of the wafer in actual application, the top surface of the carrier device used to carry the wafer is required to be as clean as possible to avoid the residue of tiny particles (particles) so as not to affect the wafer yield.

[0003] The existing carrier device generally includes a motor, a sealing end cap, and a chuck structure. During installation, the motor must first be mounted on the frame, then the sealing end cap is mounted on the motor, the bottom cover of the chuck structure is fixedly connected to the base, and both are then screwed to the motor. The top cover of the chuck structure is placed on the base and connected to the base via screws, and finally, a plug is used to cover the screws on the top cover. Since there are gaps at the connection between the top cover and the base, and also at the connection between the plug and the top cover, not only does it require high processing accuracy, but it is also easy for tiny particles to remain at the connection, which seriously affects the wafer cleaning yield. Summary of the Invention

[0004] In view of the shortcomings of the existing methods, this application proposes a semiconductor cleaning device and a carrier device thereof to solve the technical problem of the existing technology that tiny particles remaining on the carrier device contaminate wafers.

[0005] In the first aspect, an embodiment of the present application provides a supporting device for semiconductor cleaning equipment, comprising: a chuck structure, a sealing transition structure, a tightening structure and a driving structure; the top surface of the chuck structure is used to support a wafer; the sealing transition structure comprises a sealing cover and an adapter assembly, the sealing cover is covered on the bottom surface of the chuck structure, and is used to form a sealed installation space at the bottom of the chuck structure, and the chuck structure can rotate relative to the sealing cover, and the driving structure is fixedly connected to the bottom of the sealing cover; the adapter assembly is located in the installation space, and is respectively connected to the chuck structure and the driving structure, and the driving structure is used to drive the chuck structure to rotate through the adapter assembly; the tightening structure is penetrated by the sealing cover and can extend into the installation space, and by operating the tightening structure at the bottom of the sealing cover, the tightening structure located in the installation space is actuated to connect the adapter assembly with the chuck structure.

[0006] In one embodiment of the present application, the adapter assembly includes a first adapter and a first connecting member, the first adapter is coaxially arranged with the chuck structure and the drive structure, and the middle position of the first adapter is connected to the drive structure, and multiple first connecting members pass through the first adapter to be connected to the chuck structure.

[0007] In one embodiment of the present application, the tightening structure includes a tightening assembly and an operating rod, the bottom end of the tightening assembly protrudes from the bottom of the sealing cover, and the top end selectively engages with the bottom end of the first connecting member; the operating rod can be detachably connected to the bottom end of the tightening assembly, and is used to drive the tightening assembly to rise and rotate, so that the tightening assembly can be engaged and connected with the bottom end of the first connecting member and tighten the first connecting member.

[0008] In one embodiment of the present application, the tightening assembly includes a bearing component and a sliding rod. The bearing component is passed through the bottom plate of the sealing cover and is fixedly connected to the sealing cover. A sliding hole is opened in the bearing component. The sliding rod is arranged in the sliding hole and can be lifted and rotated relative to the bearing component.

[0009] In one embodiment of the present application, both ends of the sliding rod have a clamping portion, the outer diameter of the clamping portion is larger than the inner diameter of the sliding hole, and the clamping portion is used to limit the lifting and lowering position of the sliding rod relative to the supporting component, and is used to be clamped and connected with the first connecting member and the operating rod.

[0010] In one embodiment of the present application, a linear bearing is disposed in the carrying component, and the sliding rod is disposed in the linear bearing.

[0011] In one embodiment of the present application, a mounting hole corresponding to the first connecting member is formed on the first adapter, and the first connecting member can rotate around its own axis in the mounting hole and can be confined in the mounting hole.

[0012] In one embodiment of the present application, the mounting hole includes a through hole and a locking cavity from top to bottom, and the bottom of the locking cavity has an opening; the first connecting member includes an integrally arranged connecting portion and an operating portion, and a flexible member is further provided on the periphery of the operating portion. The connecting portion enters the through hole after passing through the opening, the operating portion is located in the locking cavity, and the flexible member cooperates with the locking cavity to limit the position.

[0013] In one embodiment of the present application, the chuck structure includes a top cover, a base and a bottom cover that are stacked together, the top surface of the top cover is used to support the wafer, the bottom of the top cover has a receiving groove, the base is arranged in the receiving groove and connected to the bottom surface of the receiving groove, and the bottom cover is arranged at the bottom of the top cover to cover the receiving groove.

[0014] In one embodiment of the present application, the adapter assembly further includes a second adapter and a second connecting member, the second adapter is arranged at the bottom of the bottom cover, and a plurality of second connecting members are passed through the middle position of the second adapter and connected to the base.

[0015] In one embodiment of the present application, the first connecting member is disposed through a position close to the periphery of the first adapter, and sequentially passes through the second adapter and the bottom cover to be connected to the base.

[0016] In one embodiment of the present application, the first adapter and the second adapter both include a circular portion and branch portions, and the plurality of branch portions are located on the outer circumference of the circular portion and are radially distributed along the radial direction of the circular portion.

[0017] In one embodiment of the present application, the drive structure includes a hollow shaft motor, and the adapter assembly also includes an adapter ring, which is connected to the output shaft of the drive structure near the periphery, and the first adapter is connected to the drive structure through the adapter ring.

[0018] In a second aspect, an embodiment of the present application provides a semiconductor cleaning device, comprising a process chamber and a carrier device as provided in the first aspect, wherein the carrier device is located in the process chamber.

[0019] The beneficial technical effects brought about by the technical solutions provided by the embodiments of the present application are:

[0020] The embodiment of the present application sets the adapter assembly in the sealing cover, and after connecting the adapter assembly to the drive structure, it is connected to the chuck structure, so that the drive structure is directly connected to the chuck structure through the adapter assembly, and the adapter assembly is selectively contacted with the adapter assembly by the tightening structure to achieve the connection between the adapter assembly and the chuck structure. With the above design, the top surface of the chuck structure of the embodiment of the present application does not need to be provided with a top cover in the prior art, that is, it can be connected to the drive structure, and the top surface of the chuck structure is an integrated structure, which avoids the top surface of the chuck structure from causing particle contamination to the front of the wafer due to tiny particles remaining in the gap, thereby greatly improving the cleaning efficiency and yield of the embodiment of the present application.

[0021] Additional aspects and advantages of the present application will be given in part in the following description, which will become apparent from the following description, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which:

[0023] Figure 1A three-dimensional schematic diagram of a carrying device provided in an embodiment of the present application;

[0024] Figure 2 An exploded schematic diagram of a carrying device provided in an embodiment of the present application;

[0025] Figure 3 An exploded schematic diagram of a carrying device provided in an embodiment of the present application from another perspective;

[0026] Figure 4 An exploded schematic diagram of the cooperation between a drive structure and a switching assembly provided in an embodiment of the present application;

[0027] Figure 5 A three-dimensional schematic diagram of a tightening assembly provided in an embodiment of the present application;

[0028] Figure 6 A cross-sectional schematic diagram of a mounting hole and a first connecting member provided in an embodiment of the present application;

[0029] Figure 7A An exploded schematic diagram of a chuck structure provided in an embodiment of the present application;

[0030] Figure 7B A schematic diagram of an exploded view from another perspective of a chuck structure provided in an embodiment of the present application. DETAILED DESCRIPTION

[0031] The present application is described in detail below. Examples of embodiments of the present application are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar components or components having the same or similar functions. In addition, if the detailed description of the known technology is not necessary for the features of the present application shown, it will be omitted. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application.

[0032] It will be understood by those skilled in the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs. It should also be understood that terms such as those defined in common dictionaries should be understood to have meanings consistent with their meanings in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless specifically defined as herein.

[0033] The following describes in detail the technical solution of the present application and how the technical solution of the present application solves the above-mentioned technical problems with specific embodiments.

[0034] The embodiment of the present application provides a carrier device for semiconductor cleaning equipment. The structural diagram of the carrier device is as follows: Figure 1 and Figure 2 As shown, it includes: a chuck structure 1, a sealing adapter structure 2, a tightening structure 3 and a driving structure 4; the top surface of the chuck structure 1 is used to carry the wafer; the sealing adapter structure 2 includes a sealing cover 21 and an adapter assembly 22, the sealing cover 21 covers the bottom surface of the chuck structure 1, and is used to form a sealed installation space 211 at the bottom of the chuck structure 1, and the chuck structure 1 can rotate relative to the sealing cover 21, and the driving structure 4 is fixedly connected to the bottom of the sealing cover 21; the adapter assembly 22 is located in the installation space 211, and is respectively connected to the chuck structure 1 and the driving structure 4, and the driving structure 4 is used to drive the chuck structure 1 to rotate through the adapter assembly 22; the tightening structure 3 is penetrated by the sealing cover 21, and can extend into the installation space 211, and by operating the tightening structure 3 at the bottom of the sealing cover 21, the tightening structure 3 located in the installation space 211 is actuated to connect the adapter assembly 22 with the chuck structure 1.

[0035] like Figure 1 and Figure 2 As shown, the semiconductor cleaning equipment can be, for example, a single-wafer cleaning equipment, but the embodiment of the present application does not limit the specific type of semiconductor cleaning equipment, and those skilled in the art can set it according to actual conditions. The chuck structure 1 can specifically be a disc-shaped structure, and the top surface of the chuck structure 1 is used to support the wafer, and can drive the wafer to rotate so that the wafer completes the cleaning process in the process chamber. Furthermore, the top surface of the chuck structure 1 is also used to support the front of the wafer so that the back of the wafer faces upward, thereby completing the cleaning process on the back of the wafer. The sealing adapter structure 2 includes a sealing cover 21 and an adapter assembly 22. The bottom surface of the sealing cover 21 is fixedly connected to the top surface of the drive structure 4, for example, connected to the drive structure 4 through a plurality of fasteners, but the embodiment of the present application is not limited to this. The top of the sealing cover 21 is covered on the bottom surface of the chuck structure 1 and is sealed to the bottom surface of the chuck structure 1. For example, a plurality of annular grooves are provided on the bottom surface of the chuck structure 1, and a groove is provided at a corresponding position on the top surface of the sealing cover 21. The grooves of the two are nested and matched with each other to achieve a sealed sliding connection, which is used to form an installation space 211 at the bottom of the chuck structure 1 and enable the chuck structure 1 to rotate relative to the sealing cover 21. However, the embodiment of the present application does not limit the cooperation method between the sealing cover 21 and the chuck structure 1. The adapter assembly 22 is arranged in the installation space 211 and is respectively connected to the chuck structure 1 and the drive structure 4. The drive structure 4 drives the chuck structure 1 to rotate through the adapter assembly 22. The tightening structure 3 as a whole can be a rod-shaped structure. The tightening structure 3 is passed through the bottom of the sealing cover 21 and can extend into the installation space 211. In actual application, the adapter assembly 22 can be connected to the driving structure 4 first, and then the chuck structure 1 can be covered on the sealing cover 21. The tightening structure 3 can selectively contact the adapter assembly 22, and the adapter assembly 22 can be connected to the chuck structure 1 by operating the tightening structure 3 at the bottom of the sealing cover 21.

[0036] The embodiment of the present application sets the adapter assembly in the sealing cover, and after connecting the adapter assembly to the drive structure, it is connected to the chuck structure, so that the drive structure is directly connected to the chuck structure through the adapter assembly, and the adapter assembly is selectively contacted with the adapter assembly by the tightening structure to achieve the connection between the adapter assembly and the chuck structure. With the above design, the top surface of the chuck structure of the embodiment of the present application does not need to be provided with a top cover in the prior art, that is, it can be connected to the drive structure, and the top surface of the chuck structure is an integrated structure, which avoids the top surface of the chuck structure from causing particle contamination to the front of the wafer due to tiny particles remaining in the gap, thereby greatly improving the cleaning efficiency and yield of the embodiment of the present application.

[0037] In one embodiment of the present application, Figure 2 and Figure 3 As shown, the adapter assembly 22 includes a first adapter 221 and a first connecting member 222. The first adapter 221 is coaxially arranged with the chuck structure 1 and the drive structure 4, and the middle position of the first adapter 221 is connected to the drive structure 4. Multiple first connecting members 222 pass through the first adapter 221 and are connected to the chuck structure 1.

[0038] like Figure 2 and Figure 3 As shown, the first adapter 221 can be a plate-like structure made of metal material. The first adapter 221 is coaxially arranged with the drive structure 4 and the chuck structure 1. The first adapter 221 is, for example, coaxially arranged with the output shaft 41 of the drive structure 4 to drive the chuck structure 1 to rotate. The middle position of the first adapter 221 is connected to the output shaft 41 of the drive structure 4, for example, by a plurality of fasteners 26, but the embodiment of the present application does not limit the specific connection method between the two. The first connecting member 222 is, for example, a bolt. The plurality of first connecting members 222 are connected to the chuck structure 1 after passing through the first adapter 221, and the plurality of first connecting members 222 can be arranged at a position close to the periphery of the first adapter 221. The above design allows the drive structure 4 to be connected from the bottom of the chuck structure 1, making the structural design of the embodiment of the present application reasonable, not only realizing the integrated structure of the top surface of the chuck structure 1, but also facilitating the disassembly and maintenance of the chuck structure 1, thereby greatly improving the disassembly and maintenance efficiency of the embodiment of the present application.

[0039] It should be noted that the embodiment of the present application does not limit the specific implementation of the first connecting member 222. For example, the first connecting member 222 can be engaged with the chuck structure 1. Therefore, the embodiment of the present application is not limited to this, and those skilled in the art can adjust the settings according to actual conditions.

[0040] In one embodiment of the present application, Figures 2 to 4As shown, the tightening structure 3 includes a tightening assembly 31 and an operating rod 32. The bottom end of the tightening assembly 31 protrudes from the bottom of the sealing cover 21, and the top end selectively engages with the bottom end of the first connecting member 222; the operating rod 32 can be detachably connected to the bottom end of the tightening assembly 31, and is used to drive the tightening assembly 31 to rise and rotate, so that the tightening assembly 31 can be engaged with the bottom end of the first connecting member 222 and tighten the first connecting member 222.

[0041] like Figures 2 to 4 As shown, the tightening assembly 31 is arranged in the installation space 211 of the sealing cover 21, and the bottom end of the tightening assembly 31 protrudes from the bottom of the sealing cover 21, for connecting the operating rod 32, and the top of the tightening assembly 31 can be engaged with the bottom ends of multiple first connecting members 222, for tightening the first connecting member 222 with the chuck structure 1. The top end of the operating rod 32 is engaged with the bottom end of the tightening assembly 31, and the bottom end of the operating rod 32 can be provided with an operating block 321, so that the operator can hold it. In actual application, the operator can engage the top end of the operating rod 32 with the bottom end of the tightening assembly 31, and raise the tightening assembly 31 by the operating rod 32 to engage with the bottom end of the first connecting member 222, and then rotate the operating rod 32 to drive the tightening assembly 31 to rotate, so that the first connecting member 222 is tightened with the chuck structure 1, thereby achieving the first connecting member 222 being fixedly connected to the chuck structure 1. Furthermore, after one of the first connecting members 222 is tightened with the chuck structure 1, the chuck structure 1 is rotated so that the multiple first connecting members 222 are aligned with the tightening assembly 31 in sequence, so that the multiple first connecting members 222 are tightened with the chuck structure 1. Optionally, the multiple first connecting members 222 are evenly arranged along the circumference of the first adapter 221, and the chuck structure 1 is driven by the driving structure 4 to rotate a preset angle, so that the multiple first connecting members 222 are aligned with the tightening assembly 31, so that the multiple first connecting members 222 are tightened with the chuck structure 1. The above design allows the embodiment of the present application to adopt a relatively simple structure, which facilitates the operation of the first connecting member 222 from the bottom of the sealing cover 21, thereby achieving a fixed connection between the first adapter 221 and the chuck structure 1.

[0042] In one embodiment of the present application, Figure 4 and Figure 5As shown, the tightening assembly 31 includes a bearing component 311 and a sliding rod 312. The bearing component 311 is provided on the bottom plate of the sealing cover 21 and is fixedly connected to the sealing cover 21. A sliding hole is provided in the bearing component 311. The sliding rod 312 is provided in the sliding hole and can be raised and lowered and rotated relative to the bearing component 311. Specifically, the bearing component 311 is a cylindrical structure. The bearing component 311 is provided on the bottom plate of the sealing cover 21 and the top end is fixedly connected to the bottom plate of the sealing cover 21. The bearing component 311 is provided with a sliding hole extending in the axial direction. The sliding rod 312 is slidably provided in the sliding hole and can be raised and lowered and rotated relative to the bearing component 311. The top end of the sliding rod 312 is used to engage with the bottom ends of the multiple first connecting members 222 after rising, and the bottom end of the sliding rod 312 is used to be detachably connected to the operating rod 32. The above design makes the embodiment of the present application simple and easy to implement, thereby significantly reducing the application and maintenance costs.

[0043] In one embodiment of the present application, Figure 5 、 Figure 2 As shown, both ends of the sliding rod 312 have a clamping portion 3121, the outer diameter of the clamping portion 3121 is larger than the inner diameter of the sliding hole, and the clamping portion 3121 is used to limit the lifting position of the sliding rod 312 relative to the bearing member 311, and is used to engage with the first connecting member 222 and the operating rod 32. Specifically, both ends of the sliding rod 312 are provided with a clamping portion 3121, and the cross-sectional shape of the clamping portion 3121 can be hexagonal to cooperate with the first connecting member 222, that is, the first connecting member 222 can adopt a hexagonal socket bolt, and the top of the operating rod 32 is a hexagonal socket structure. Furthermore, the outer diameter of the clamping portion 3121 can be larger than the inner diameter of the sliding hole, so as to limit the sliding rod 312 on the bearing member 311, thereby preventing the sliding rod 312 from falling off the bearing member 311. Since the clamping parts 3121 all adopt a hexagonal structure, the outer diameter of the inscribed circle of the clamping parts 3121 can be larger than the inner diameter of the sliding hole, thereby achieving the position limiting of the sliding rod 312 and the bearing component 311. It should be noted that the embodiment of the present application does not limit the specific structure of the clamping parts 3121. For example, the first connecting member 222 can be a cross bolt or a flat bolt, and the shape of the clamping parts 3121 that match the sliding rod 312 and the first connecting member 222 can be set to correspond; and the shape of the clamping parts 3121 that match the sliding rod 312 and the operating rod 32 does not have to be a hexagonal structure, as long as it can be detachably connected to the operating rod 32. Therefore, the embodiment of the present application is not limited to this, and those skilled in the art can adjust the settings according to actual conditions.

[0044] In one embodiment of the present application, Figure 5As shown, a linear bearing (not shown in the figure) is provided in the bearing component 311, and the sliding rod 312 is provided in the linear bearing. Specifically, the bearing component 311 includes a sleeve 3111 and a mounting plate 3112 which are separately provided. The mounting plate 3112 can be connected to the sleeve 3111 by screwing or clamping. The bottom end of the sleeve 3111 and the mounting plate 3112 are provided with through holes to form sliding holes. The linear bearing is provided in the sleeve 3111, and the sliding rod 312 is provided in the linear bearing to achieve sliding and rotation relative to the bearing component 311. The above design not only makes the bearing component 311 simple in structure, but also avoids dust pollution, thereby improving the cleaning rate.

[0045] In one embodiment of the present application, Figures 2 to 4 As shown, the first adapter 221 is provided with mounting holes 223 corresponding to the first connectors 222. The first connectors 222 can rotate around their own axes within the mounting holes 223 and can be confined within the mounting holes 223. Specifically, the first adapter 221 is provided with multiple mounting holes 223 near the periphery. The multiple first connectors 222 are provided in a one-to-one correspondence within the mounting holes 223 and can rotate around their own axes within the mounting holes 223, so that the tightening assembly 31 can operate and tighten the first connectors 222. The first connectors 222 can be confined within the mounting holes 223. Specifically, when the first connectors 222 are inserted into the mounting holes 223, they can engage with the first adapter 221 to prevent the first connectors 222 from falling off, so that the tightening assembly 31 can operate the first connectors 222 from the bottom, thereby greatly improving the operational convenience of the embodiment of the present application. However, the embodiment of the present application does not limit the engagement method between the first connecting member 222 and the mounting hole 223 , and those skilled in the art may adjust the setting according to actual conditions.

[0046] In one embodiment of the present application, Figure 6 As shown, the mounting hole 223 includes a through hole 2231 and a locking cavity 2232 from top to bottom, and the bottom of the locking cavity 2232 has an opening; the first connecting member 222 includes an integrally arranged connecting portion 2221 and an operating portion 2222, and a flexible member 2223 is further provided on the periphery of the operating portion 2222. The connecting portion 2221 enters the through hole 2231 after passing through the opening, and the operating portion 2222 is located in the locking cavity 2232, and the flexible member 2223 cooperates with the locking cavity 2232 to limit the position.

[0047] like Figure 6As shown, the first connecting member 222 is, for example, a bolt, wherein the connecting portion 2221 is specifically the screw portion of the bolt, and the operating portion 2222 is specifically the nut portion of the bolt. The flexible member 2223 is a flexible steel sheet structure, and specifically adopts an annular structure. The flexible member 2223 is arranged around the outer periphery of the operating portion 2222. The mounting hole 223 includes a straight-through hole 2231 and a snap-fit ​​cavity 2232. The diameter of the straight-through hole 2231 corresponds to the connecting portion 2221 of the first connecting member 222, and the diameter of the snap-fit ​​cavity 2232 is set to correspond to the diameter of the flexible member 2223. The bottom of the snap-fit ​​cavity 2232 is provided with an opening for the first connecting member 222 to pass through. In actual use, the connecting portion 2221 of the first connecting member 222 enters through the bottom opening of the engaging cavity 2232 and extends into the through hole 2231. Then, the operating portion 2222 and the flexible member 2223 enter through the opening at the same time. At this time, the flexible member 2223 deforms to enter the engaging cavity 2232. The flexible member 2223 restores its shape to restrict the first connecting member 222 in the mounting hole 223. The above design makes the embodiment of the present application simple in structure, not only reducing application and maintenance costs, but also improving disassembly and maintenance efficiency.

[0048] It should be noted that the embodiment of the present application does not limit the engagement method between the first connecting member 222 and the mounting hole 223. For example, the end of the connecting portion 2221 near the operating portion 2222 is a polished rod structure, and the mounting hole 223 is a threaded hole. After the connecting portion 2221 is installed in the mounting hole 223, the polished rod of the connecting portion 2221 and the mounting hole 223 slide together, which can also achieve the above-mentioned function. Therefore, the embodiment of the present application is not limited to this, and those skilled in the art can adjust the configuration according to actual conditions.

[0049] In one embodiment of the present application, Figure 7A and Figure 7B As shown, the chuck structure 1 includes a stacked top cover 11, a base 12 and a bottom cover 13. The top surface of the top cover 11 is used to support the wafer. The bottom of the top cover 11 has a receiving groove 111. The base 12 is arranged in the receiving groove 111 and is connected to the bottom surface of the receiving groove 111. The bottom cover 13 is arranged at the bottom of the top cover 11 to cover the receiving groove 111.

[0050] like Figure 7A and Figure 7BAs shown, the top cover 11, the base 12 and the bottom cover 13 are all made of resin material, which can prevent corrosion caused by acidic cleaning solutions. However, the embodiment of the present application does not limit the specific material of the chuck structure 1, as long as it is made of corrosion-resistant material. The top cover 11 is made in an integrated molding manner. The top surface of the top cover 11 is used to support the wafer, and the bottom surface is provided with a circular receiving groove 111 for accommodating the base 12. Since the top cover 11 is made in an integrated molding manner, it can prevent the tiny particles remaining in the gap of the top cover 11 in the prior art from contaminating the wafer. The base 12 is a circular plate-like structure, which is arranged in the receiving groove 111 and forms an air flow channel with the bottom surface of the top cover 11 for passing gas so that the top cover 11 can adsorb the wafer. A plurality of fasteners 26 are evenly arranged near the periphery of the base 12. The plurality of fasteners 26 pass through the base 12 and are connected to the top cover 11, but the embodiment of the present application is not limited thereto. The bottom cover 13 is a circular, disc-shaped structure that fits over the bottom of the top cover 11 to seal the receiving slot 111. The bottom cover 13 can be used to support a support pin structure for selectively raising and lowering the wafer relative to the top surface of the top cover 11, but the present embodiment is not limited to this. The above design allows the present embodiment to modify existing structures, thereby not only reducing application and maintenance costs but also significantly improving applicability and scope of application.

[0051] It should be noted that the embodiments of the present application do not limit the specific structure of the chuck structure 1. For example, the chuck structure 1 is made of an integrally formed structure. Therefore, the embodiments of the present application are not limited to this, and those skilled in the art can adjust the configuration according to actual conditions.

[0052] In one embodiment of the present application, Figure 3 、 Figure 7A and Figure 7BAs shown, the adapter assembly 22 further includes a second adapter 231 and a second connecting member 232. The second adapter 231 is disposed at the bottom of the bottom cover 13. A plurality of second connecting members 232 are disposed through the middle of the second adapter 231 and are connected to the base 12. Specifically, the second adapter 231 and the second connecting member 232 are both made of metal. The second adapter 231 can have the same structure as the first adapter 221. The second connecting member 232 is coaxially disposed with the chuck structure 1. The plurality of second connecting members 232 are all disposed through the middle of the second adapter 231 and extend into the circular hole in the middle of the bottom cover 13 and are connected to the middle of the base 12 to press the bottom cover 13 against the bottom of the top cover 11. The second connecting member 232 is, for example, a bolt, but the embodiment of the present application is not limited thereto. The above design utilizes the second adapter 231 to press the bottom cover 13 against the top cover 11, simplifying the structure of the present application, facilitating assembly and disassembly for maintenance, and also improving the overall strength of the chuck structure 1. However, the present embodiment is not limited to the specific shape and material of the second adapter 231 and the second connecting member 232; as long as the above functions can be achieved, those skilled in the art may adjust the configuration based on actual circumstances.

[0053] In one embodiment of the present application, Figure 3 、 Figure 4 、 Figure 7A and Figure 7B As shown, the first connecting member 222 is provided at a position near the periphery of the first adapter 221, and sequentially passes through the second adapter 231 and the bottom cover 13 to be connected to the base 12. Specifically, multiple first connecting members 222 are provided at a position near the periphery of the first adapter 221, and sequentially pass through the second adapter 231 and the bottom cover 13 to be connected to the base 12, that is, first, the first connecting member 222 is provided in the mounting hole 223, and then the second adapter 231 is connected to the base 12 of the chuck structure 1 through the second connecting member 232. The chuck structure 1 is covered on the sealing cover 21. At this time, the first connecting member 222 can be sequentially passed through the second adapter 231 and the bottom cover 13 to enter the receiving groove 111 and then connected to the base 12. With the above design, since both the first adapter 221 and the first connecting member 222 are made of metal, connecting the first connecting member 222 to the base 12 can further improve the overall strength of the chuck structure 1, thereby enhancing structural stability and extending service life. Furthermore, the multiple first connecting members 222 are positioned near the periphery of the first adapter 221. This is primarily because the middle portion of the first adapter 221 is connected to the drive structure 4, while the middle portion of the second adapter 231 is connected to the base 12. This makes the structural design of the embodiment of the present application more reasonable, thereby improving the efficiency of disassembly, assembly, and maintenance.

[0054] In one embodiment of the present application, Figures 2 to 4As shown, the first adapter 221 and the second adapter 231 both include a circular portion 241 and branch portions 242. The multiple branch portions 242 are all located on the outer circumference of the circular portion 241 and are radially distributed along the radial direction of the circular portion 241. Specifically, the first adapter 221 and the second adapter 231 adopt the same structure. Both include a circular portion 241 and branch portions 242. The shape of the branch portions 242 can be a trapezoidal structure, with a relatively smaller side connected to the outer circumference of the circular portion 241. The three branch portions 242 are integrally formed with the circular portion 241, and the three branch portions 242 are radially distributed along the radial direction of the circular portion 241. Each branch portion 242 of the first adapter 221 is provided with two mounting holes 223 near the end for mounting the first adapter 221. The above design not only saves space, but also significantly reduces the overall weight of the adapter assembly 22. Furthermore, the annular portions 241 of the first adapter 221 and the second adapter 231 allow for passage of a gas pipeline, which is used to introduce gas into the flow path of the chuck structure 1. It should be noted that the present embodiment does not limit the shape of the first adapter 221 and the second adapter 231. For example, both can be circular plate-shaped with a through hole in the middle. Therefore, the present embodiment is not limited to this, and those skilled in the art may adjust the configuration based on actual circumstances.

[0055] In one embodiment of the present application, Figures 2 to 4 As shown, the drive structure 4 includes a hollow shaft motor, and the adapter assembly 22 also includes an adapter ring 25. The adapter ring 25 is connected to the output shaft 41 of the drive structure 4 near the periphery, and the first adapter 221 is connected to the drive structure 4 through the adapter ring 25. Specifically, the drive structure 4 can adopt a hollow shaft motor so that the gas pipeline can be passed through the hollow part of the drive structure 4. However, the embodiment of the present application does not limit the specific type of the drive structure 4, and those skilled in the art can adjust the setting according to actual conditions. A plurality of fasteners 26 can be passed through the position near the periphery of the adapter ring 25 to achieve connection with the output shaft 41 of the drive structure 4. A plurality of fasteners 26 are passed through the annular portion 241 of the first adapter 221. After passing through the annular portion 241, the plurality of fasteners 26 are connected to the adapter ring 25 and are arranged near the inner edge of the adapter ring 25, so that the structural design of the embodiment of the present application is reasonable and easy to disassemble and maintain. The above design makes it easy to modify existing equipment in the embodiment of the present application, thereby not only reducing the modification cost, but also greatly improving the applicability and scope of application. It should be noted that the embodiment of the present application does not limit the adapter assembly 22 to include the adapter ring 25. For example, the annular portion 241 of the first adapter 221 can be directly connected to the output shaft 41 of the drive structure 4. Therefore, the embodiment of the present application is not limited to this, and those skilled in the art can adjust the settings according to actual conditions.

[0056] Based on the same inventive concept, an embodiment of the present application provides a semiconductor cleaning device, including a process chamber and a carrier device as provided in the aforementioned embodiments, wherein the carrier device is located in the process chamber.

[0057] By applying the embodiments of the present application, at least the following beneficial effects can be achieved:

[0058] The embodiment of the present application sets the adapter assembly in the sealing cover, and after connecting the adapter assembly to the drive structure, it is connected to the chuck structure, so that the drive structure is directly connected to the chuck structure through the adapter assembly, and the adapter assembly is selectively contacted with the adapter assembly by the tightening structure to achieve the connection between the adapter assembly and the chuck structure. With the above design, the top surface of the chuck structure of the embodiment of the present application does not need to be provided with a top cover in the prior art, that is, it can be connected to the drive structure, and the top surface of the chuck structure is an integrated structure, which avoids the top surface of the chuck structure from causing particle contamination to the front of the wafer due to tiny particles remaining in the gap, thereby greatly improving the cleaning efficiency and yield of the embodiment of the present application.

[0059] It will be understood that the above embodiments are merely exemplary embodiments for illustrating the principles of the present invention, and the present invention is not limited thereto. Those skilled in the art will appreciate that various modifications and improvements can be made without departing from the spirit and substance of the present invention, and such modifications and improvements are also considered to be within the scope of protection of the present invention.

[0060] In the description of this application, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0061] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0062] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they may refer to fixed connections, detachable connections, or integral connections; they may refer to direct connections, indirect connections through an intermediate medium, or internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0063] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0064] The above description is only part of the implementation methods of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications should also be regarded as the scope of protection of the present application.

Claims

1. A carrier device for semiconductor cleaning equipment, characterized in that: include: Chuck structure, sealing transfer structure, tightening structure and driving structure; The top surface of the chuck structure is used to support the wafer; The sealing adapter structure includes a sealing cover and an adapter assembly. The sealing cover covers the bottom surface of the chuck structure and is used to form a sealed installation space at the bottom of the chuck structure. The chuck structure can rotate relative to the sealing cover. The drive structure is fixedly connected to the bottom of the sealing cover. The adapter assembly is located in the installation space and is respectively connected to the chuck structure and the drive structure. The drive structure is used to drive the adapter assembly to drive the chuck structure to rotate. The tightening structure is provided through the sealing cover and can extend into the installation space. By operating the tightening structure at the bottom of the sealing cover, the tightening structure located in the installation space is activated to connect the adapter assembly with the chuck structure.

2. The carrying device according to claim 1, characterized in that: The adapter assembly includes a first adapter and a first connecting member. The first adapter is coaxially arranged with the chuck structure and the drive structure, and the middle position of the first adapter is connected to the drive structure. Multiple first connecting members pass through the first adapter and are connected to the chuck structure.

3. The carrying device according to claim 2, characterized in that: The tightening structure includes a tightening assembly and an operating rod. The bottom end of the tightening assembly protrudes from the bottom of the sealing cover, and the top end selectively engages with the bottom end of the first connecting member. The operating rod can be detachably connected to the bottom end of the tightening assembly, and is used to drive the tightening assembly to rise and rotate, so that the tightening assembly can be engaged with the bottom end of the first connecting member and tighten the first connecting member.

4. The carrying device according to claim 3, characterized in that: The tightening assembly includes a bearing component and a sliding rod. The bearing component is inserted into the bottom plate of the sealing cover and is fixedly connected to the sealing cover. A sliding hole is opened in the bearing component. The sliding rod is arranged in the sliding hole and can be lifted and rotated relative to the bearing component.

5. The carrying device according to claim 4, characterized in that: Both ends of the sliding rod have a clamping part, the outer diameter of the clamping part is larger than the inner diameter of the sliding hole, the clamping part is used to limit the lifting position of the sliding rod relative to the bearing component, and is used to be clamped and connected with the first connecting member and the operating rod.

6. The carrying device according to claim 4, characterized in that: A linear bearing is provided in the bearing component, and the sliding rod is provided in the linear bearing.

7. The carrying device according to claim 2, characterized in that: The first adapter is provided with a mounting hole corresponding to the first connecting member on a one-to-one basis. The first connecting member can rotate around its own axis in the mounting hole and can be limited in the mounting hole.

8. The carrying device according to claim 7, characterized in that: The mounting hole includes a through hole and a locking cavity from top to bottom, and the bottom of the locking cavity has an opening; the first connecting member includes an integral connecting portion and an operating portion, and a flexible member is further provided on the periphery of the operating portion. The connecting portion enters the through hole after passing through the opening, and the operating portion is located in the locking cavity, and the flexible member cooperates with the locking cavity to limit the position.

9. The carrying device according to claim 2, wherein: The chuck structure includes a top cover, a base and a bottom cover that are stacked together. The top surface of the top cover is used to support the wafer. The bottom of the top cover has a receiving groove. The base is arranged in the receiving groove and is connected to the bottom surface of the receiving groove. The bottom cover is arranged at the bottom of the top cover to cover the receiving groove.

10. The carrying device according to claim 9, characterized in that: The adapter assembly further includes a second adapter and a second connecting member. The second adapter is arranged at the bottom of the bottom cover. A plurality of second connecting members are arranged through the middle of the second adapter and connected to the base.

11. The carrying device according to claim 10, wherein: The first connecting member is arranged at a position close to the periphery of the first adapter, and passes through the second adapter and the bottom cover in sequence before being connected to the base.

12. The carrying device according to claim 11, wherein: The first adapter and the second adapter both include a circular portion and branch portions. The plurality of branch portions are located on the outer circumference of the circular portion and are radially distributed along the radial direction of the circular portion.

13. The carrying device according to claim 2, characterized in that: The driving structure includes a hollow shaft motor, and the adapter assembly also includes an adapter ring. The adapter ring is connected to the output shaft of the driving structure near the periphery, and the first adapter is connected to the driving structure through the adapter ring.

14. A semiconductor cleaning device, characterized in that: The process chamber comprises a process chamber and the carrying device according to any one of claims 1 to 13, wherein the carrying device is located in the process chamber.

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