Wafer cleaning device and wafer cleaning method

Abstract

The present invention discloses a wafer cleaning device and a method for cleaning wafers. The wafer cleaning device includes a carrier, at least one nozzle, a chassis, an upper shell, and a lower shell. The carrier is used to support wafers, and the top surface of the wafer is coated with photoresist. At least one nozzle is used to spray a cleaning solution toward the wafer. The chassis is used to recover the cleaning solution. The lower shell is arranged on the chassis. The upper shell is arranged on the lower shell, wherein the chassis, the lower shell, and the upper shell surround and accommodate the carrier, and the upper shell and the lower shell together form a liquid flow channel extending toward the carrier and the chassis, and the liquid flow channel is used to guide the cleaning solution to flow toward the chassis. In this way, the wafer cleaning device can effectively spray the cleaning solution onto the wafer and recover the cleaning solution.

Description

Technical Field

[0001] The present invention relates to a cleaning device and a cleaning method, in particular to a cleaning device and a cleaning method for cleaning wafers. Background Art

[0002] Photoresist is widely used in today's integrated circuit manufacturing processes. Photoresist is typically sprayed onto the surface of a silicon wafer by a coating device while the wafer is rotating, forming a film.

[0003] During the spin coating process, a protective shield is placed around the silicon wafer to prevent the sputtered photoresist from contaminating the surrounding environment. However, while the protective shield prevents contamination, it can also easily cause pattern defects on the silicon wafer surface, especially during bevel rinse.

[0004] Therefore, how to propose a wafer cleaning device that can solve the above problems is one of the problems that the industry is eager to invest research and development resources to solve. Summary of the Invention

[0005] In view of this, an object of the present invention is to provide a wafer cleaning device that can solve the above-mentioned problem.

[0006] To achieve the above-mentioned object, according to one embodiment of the present invention, a wafer cleaning device is provided, comprising a carrier, at least one nozzle, a chassis, an upper shell, and a lower shell. The carrier is used to carry a wafer, the top surface of which is coated with a photoresist. At least one nozzle is used to spray a cleaning solution toward the wafer. The chassis is used to recover the cleaning solution. The lower shell is disposed on the chassis. The upper shell is disposed on the lower shell, wherein the chassis, the lower shell, and the upper shell surround and accommodate the carrier, and the upper shell and the lower shell together form a liquid flow channel extending toward the carrier and the chassis, and the liquid flow channel is used to guide the cleaning solution to flow toward the chassis.

[0007] In one or more embodiments of the present invention, the inner end of the upper shell extends above the carrying surface of the carrying platform, and the inner end of the lower shell extends below the carrying platform.

[0008] In one or more embodiments of the present invention, the at least one nozzle includes a first nozzle and a second nozzle. The first nozzle is disposed on the chassis and is configured to spray a cleaning solution toward the bottom surface of the wafer when the carrier platform rotates the wafer. The second nozzle is disposed on the top surface of the lower housing and is configured to spray a cleaning solution toward the edge of the wafer when the carrier platform rotates the wafer.

[0009] In one or more embodiments of the present invention, the wafer cleaning apparatus includes a controller for controlling the first nozzle to spray the cleaning solution toward the bottom surface of the wafer and then controlling the second nozzle to spray the cleaning solution toward the edge of the wafer.

[0010] In one or more embodiments of the present invention, the wafer cleaning apparatus includes a controller for controlling the first nozzle to spray the cleaning solution toward the bottom surface of the wafer after the second nozzle finishes spraying the cleaning solution toward the edge of the wafer.

[0011] Another object of the present invention is to provide a method for cleaning wafers that can solve the above-mentioned problem.

[0012] In order to achieve the above-mentioned purpose, according to one embodiment of the present invention, a method for cleaning wafers is provided, which includes: providing a carrier, at least one nozzle, a chassis, a lower shell and an upper shell, wherein the lower shell is arranged on the chassis, and the upper shell is arranged on the lower shell, the chassis, the lower shell and the upper shell surround and accommodate the carrier, and the upper shell and the lower shell together form a liquid flow channel extending toward the carrier and the chassis, and the liquid flow channel is used to guide the cleaning solution to flow toward the chassis; using the carrier to adsorb the wafer, so that the carrier rotates the wafer and coats photoresist on the top surface of the wafer; using at least one nozzle to spray the cleaning solution toward the bottom surface and crystal edge of the wafer; and using the chassis to recover the cleaning solution.

[0013] In one or more embodiments of the present invention, at least one nozzle includes a first nozzle and a second nozzle, and at least one nozzle sprays the cleaning solution toward the bottom surface and the edge of the wafer, including: using the first nozzle to spray the cleaning solution toward the bottom surface of the wafer; and using the second nozzle to spray the cleaning solution toward the edge of the wafer.

[0014] In one or more embodiments of the present invention, after the cleaning solution is sprayed toward the bottom surface of the wafer using the first nozzle, the cleaning solution is then sprayed toward the edge of the wafer using the second nozzle.

[0015] In one or more embodiments of the present invention, after the cleaning solution is sprayed toward the edge of the wafer using the second nozzle, the cleaning solution is then sprayed toward the bottom surface of the wafer using the first nozzle.

[0016] In one or more embodiments of the present invention, a first nozzle and a second nozzle are used to spray the cleaning solution toward the bottom surface and the edge of the wafer respectively at the same time.

[0017] In summary, the wafer cleaning device of the present invention can not only effectively recover the cleaning solution, but also prevent the cleaning solution from splashing back onto the surface of the wafer due to the wafer rotating too fast when cleaning the wafer, thereby avoiding defects when cleaning the wafer edge and bottom surface.

[0018] The above description is only used to illustrate the problems to be solved by the present invention, the technical means to solve the problems, and the effects produced, etc. The specific details of the present invention will be introduced in detail in the following embodiments and related drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] To achieve the aforementioned advantages and features, the principles briefly described above will be explained in more detail with reference to specific embodiments, which are illustrated in the accompanying drawings. These drawings are merely illustrative of the present invention and therefore do not limit the scope of the invention. The principles of the invention will be clearly explained through the accompanying drawings, and additional features and details will be fully described, including:

[0020] Figure 1 A three-dimensional schematic diagram of some components of a wafer cleaning device is shown according to one or more embodiments of the present invention;

[0021] Figure 2 A schematic cross-sectional view of a wafer cleaning apparatus according to one or more embodiments of the present invention is shown; and

[0022] Figure 3 A diagram illustrating steps of a method for cleaning a wafer according to one or more embodiments of the present invention is shown.

[0023] Description of main reference numerals:

[0024] 100-wafer cleaning device; 110-carrying platform; 110a-carrying surface; 120-nozzle; 120a-first nozzle; 120b-second nozzle; 130-chassis; 140-lower shell; 140a-inner end; 150-upper shell; 150a-inner end; 160-upper cover; 161-annular inner wall; 170-controller; 200-method; 210, 230, 250, 270-steps; P-liquid flow channel; S1, S2-spraying direction; W-wafer; W1-top surface; W2-bottom surface; W3-crystal edge. DETAILED DESCRIPTION

[0025] The following drawings illustrate various embodiments of the present invention. For clarity, many practical details will be included in the following description. However, it should be understood that these practical details are not intended to limit the present invention. In other words, in some embodiments of the present invention, these practical details are not essential. Furthermore, to simplify the drawings, some commonly used structures and components are depicted in simplified schematic form.

[0026] Please refer to Figure 1 and Figure 2 . Figure 1 A three-dimensional schematic diagram of some components of a wafer cleaning apparatus 100 is shown according to one or more embodiments of the present invention. Figure 2A schematic cross-sectional view of a wafer cleaning apparatus 100 is shown. In some embodiments of the present invention, the wafer cleaning apparatus 100 includes a rotatable carrier 110, at least one nozzle 120, a chassis 130, an annular lower shell 140, and an annular upper shell 150. The carrier 110 is used to support a wafer W, the top surface W1 of which is coated with photoresist. The nozzle 120 is used to spray a cleaning solution toward the wafer W on the carrier 110. The chassis 130 is used to recover the cleaning solution, the lower shell 140 is disposed on the chassis 130, and the upper shell 150 is disposed on the lower shell 140, wherein the chassis 130, the lower shell 140, and the upper shell 150 surround and accommodate the carrier 110. The lower housing 140 and the upper housing 150 together form a liquid flow channel P extending toward the carrier 110 and the base 130. The liquid flow channel P gradually tapers away from the carrier 110. The liquid flow channel P is used to guide the cleaning solution toward the base 130. Furthermore, a pipe or device for recovering the cleaning solution may be provided on the base 130, but the present invention is not limited thereto.

[0027] Specifically, the inner end 150a of the upper housing 150 extends above the supporting surface 110a of the platform 110, while the inner end 140a of the lower housing 140 extends below (e.g., directly below) the platform 110. Therefore, the platform 110 is located between the inner end 140a of the lower housing 140 and the inner end 150a of the upper housing 150. The lower housing 140 and the upper housing 150 can simultaneously block and guide the photoresist or cleaning solution that is splashed when the platform 110 rotates.

[0028] In one or more embodiments of the present invention, the wafer cleaning apparatus 100 further includes an annular upper cover 160, wherein the upper cover 160 is disposed on the upper housing 150 and surrounds the carrier 110. Specifically, the upper cover 160 includes an annular inner wall 161, wherein the annular inner wall 161 surrounds and faces the carrier 110. Thus, the upper cover 160 can effectively prevent contaminants from splashing out, but the present invention is not limited thereto.

[0029] In one or more embodiments of the present invention, at least one nozzle 120 includes a first nozzle 120a and a second nozzle 120b. The first nozzle 120a is disposed on the base 130. When the carrier 110 rotates the wafer W, the first nozzle 120a selectively sprays the cleaning solution toward the bottom surface W2 of the wafer W. For example, referring to the spraying direction S1, the first nozzle 120a sprays the cleaning solution toward the bottom surface W2 of the wafer W through the hollow channel formed by the cylindrical structure 131 of the base 130 and the inner end 140a of the lower shell 140. The second nozzle 120b is disposed on the top surface of the lower shell 140 and is located in the liquid flow channel P to align with the edge W3 of the wafer W. Referring to the spraying direction S2, when the carrier 110 rotates the wafer W, the second nozzle 120b selectively sprays the cleaning solution toward the edge W3 of the wafer W. In this way, contaminants and / or impurities on the bottom surface W2 and edge W3 of the wafer W can be effectively removed. Specifically, the rotational speed of the wafer W driven by the carrier 110 is between 600 RPM and 1500 RPM. More preferably, the rotational speed of the wafer W is between 600 RPM and 1200 RPM, but the present invention is not limited thereto.

[0030] In some embodiments of the present invention, the wafer cleaning apparatus 100 includes a controller 170 connected to the first nozzle 120a and the second nozzle 120b. The controller 170 controls the first nozzle 120a to spray the cleaning solution toward the bottom surface W2 of the wafer W, and then controls the second nozzle 120b to spray the cleaning solution toward the edge W3 of the wafer W. Specifically, the first nozzle 120a sprays the cleaning solution toward the bottom surface W2 of the rotating wafer W for 5 to 20 seconds and then stops. Subsequently, the second nozzle 120b sprays the cleaning solution toward the edge W3 of the rotating wafer W for 5 to 20 seconds to completely clean the bottom surface W2 and edge W3 of the wafer W, but the present invention is not limited to this. The controller 170 is a computing device with computing capabilities, and may be a central processing unit or microprocessor equipped with appropriate software or firmware to control the first nozzle 120a, the second nozzle 120b, or other hardware.

[0031] In other embodiments of the present invention, after the controller 170 controls the second nozzle 120b to spray the cleaning solution toward the edge W3 of the wafer W, it then controls the first nozzle 120a to spray the cleaning solution toward the bottom surface W2 of the wafer W. Specifically, the second nozzle 120b sprays the cleaning solution toward the edge W3 of the rotating wafer W for 5 to 20 seconds and then stops. Then, the first nozzle 120a sprays the cleaning solution toward the bottom surface W2 of the rotating wafer W for 5 to 20 seconds to completely clean the bottom surface W2 and edge W3 of the wafer W. Because the first nozzle 120a and the second nozzle 120b do not spray the cleaning solution toward the wafer W on the carrier 110 simultaneously, defects on the surface of the wafer W caused by splashback of the cleaning solution can be avoided, but the present invention is not limited to this.

[0032] In other embodiments of the present invention, the controller 170 controls the first nozzle 120 a and the second nozzle 120 b to simultaneously spray the cleaning solution toward the bottom surface W2 and the edge W3 of the wafer W, respectively. Specifically, the first nozzle 120 a and the second nozzle 120 b simultaneously spray the cleaning solution toward the bottom surface W2 and the edge W3 of the wafer W for 5 to 20 seconds, thereby effectively cleaning the bottom surface W2 and the edge W3 of the wafer W, but the present invention is not limited to this.

[0033] In some embodiments of the present invention, the controller 170 controls the first nozzle 120a to first spray the cleaning solution toward the bottom surface W2 of the wafer W. When the first nozzle 120a continues spraying the cleaning solution for a predetermined time, the controller 170 controls the second nozzle 120b to spray the cleaning solution toward the edge W3 of the wafer W. Assuming that the controller 170 controls the first nozzle 120a to spray the cleaning solution toward the bottom surface W2 of the wafer W for a total of 20 seconds, it can be predetermined that when the first nozzle 120a continues spraying the cleaning solution toward the wafer W for 15 seconds, the controller 170 controls the second nozzle 120b to spray the cleaning solution toward the edge W3 of the wafer W for another 20 seconds. In this way, the controller 170 controls the first nozzle 120a and the second nozzle 120b to effectively clean the bottom surface W2 and the edge W3 of the wafer W, but the present invention is not limited to this.

[0034] In other embodiments of the present invention, the controller 170 controls the second nozzle 120b to first spray the cleaning solution toward the edge W3 of the wafer W. When the second nozzle 120b continues to spray the cleaning solution for a predetermined time, the controller 170 controls the first nozzle 120a to spray the cleaning solution toward the bottom surface W2 of the wafer W. For example, if the controller 170 controls the second nozzle 120b to spray the cleaning solution toward the edge W3 of the wafer W for 20 seconds, it can be predetermined that when the second nozzle 120b continues to spray the cleaning solution toward the wafer W for 15 seconds, the controller 170 controls the first nozzle 120a to also spray the cleaning solution toward the bottom surface W2 of the wafer W. In this way, the controller 170 controls the first nozzle 120a and the second nozzle 120b to effectively clean the bottom surface W2 and the edge W3 of the wafer W.

[0035] Please refer to Figures 1 to 3 , Figure 3 A step diagram illustrates a method 200 for cleaning a wafer W using a wafer cleaning apparatus 100 according to one or more embodiments of the present invention. In some embodiments of the present invention, method 200 begins with step 210, which includes providing a carrier 110, at least one nozzle 120, a base 130, a lower housing 140, and an upper housing 150. The lower housing 140 is disposed on the base 130, and the upper housing 150 is disposed on the lower housing 140. The base 130, the lower housing 140, and the upper housing 150 surround and accommodate the carrier 110, and the upper housing 150 and the lower housing 140 collectively form a liquid flow channel P extending toward the carrier 110 and the base 130. Method 200 then proceeds to step 230, which includes placing a wafer W on the carrier 110, rotating the wafer W on the carrier 110, and coating a photoresist on the top surface W1 of the wafer W. The method 200 then proceeds to step 250 , where at least one nozzle 120 sprays a cleaning solution toward the bottom surface W2 and the edge W3 of the wafer W. The method 200 then proceeds to step 270 , where the base 130 recovers the cleaning solution.

[0036] In step 210 , details regarding the carrier 110 , the at least one nozzle 120 , the base 130 , the lower housing 140 , and the upper housing 150 have been introduced in the previous paragraphs and will not be repeated here.

[0037] In step 230 , the carrier 110 drives the photoresist-coated wafer W to rotate, thereby utilizing centrifugal force to evenly coat the photoresist on the top surface W1 of the wafer W, thereby obtaining a photoresist film with uniform thickness, thereby completing the process of spin-coating photoresist.

[0038] In step 250, at least one nozzle 120 includes a first nozzle 120a and a second nozzle 120b. Step 250 further includes: the controller 170 controlling the first nozzle 120a to spray the cleaning solution toward the bottom surface W2 of the wafer W; and the controller 170 controlling the second nozzle 120b to spray the cleaning solution toward the edge W3 of the wafer W. In some embodiments, after the controller 170 controls the first nozzle 120a to spray the cleaning solution toward the bottom surface W2 of the wafer W, the controller 170 controls the second nozzle 120b to spray the cleaning solution toward the edge W3 of the wafer W. In other embodiments, after the controller 170 controls the second nozzle 120b to spray the cleaning solution toward the edge W3 of the wafer W, the controller 170 controls the first nozzle 120a to spray the cleaning solution toward the bottom surface W2 of the wafer W. In some embodiments of the present invention, the controller 170 controls the first nozzle 120a and the second nozzle 120b to spray the cleaning solution toward both the bottom surface W2 and the edge W3 of the wafer W simultaneously. The present invention is not limited thereto.

[0039] In summary, the wafer cleaning device of the present invention can not only effectively recover the cleaning solution, but also prevent the cleaning solution from splashing back onto the surface of the wafer due to the wafer rotating too fast when cleaning the wafer, thereby avoiding defects when cleaning the wafer edge and bottom surface.

[0040] While various embodiments of the present invention have been described above, it should be understood that these embodiments are presented by way of example only and are not intended to be limiting. Numerous modifications may be made to the embodiments of the present invention based on the disclosure herein without departing from the spirit and scope of the present invention. Therefore, the breadth and scope of the present invention should not be limited by the embodiments described above.

Claims

1. A wafer cleaning device, characterized in that: include: A carrier platform, used for carrying a wafer, wherein the top surface of the wafer is coated with a photoresist; at least one nozzle for spraying a cleaning solution toward the wafer; a chassis for recovering a cleaning solution, wherein the chassis comprises a cylindrical structure, and wherein the at least one nozzle comprises a first nozzle, the first nozzle being disposed on the chassis; a lower housing disposed on the chassis, wherein an inner end of the lower housing extends below the carrier platform, the cylindrical structure contacts and engages the inner end of the lower housing to form a hollow channel, wherein the hollow channel faces the bottom surface of the wafer, and wherein the first nozzle sprays a cleaning solution toward the bottom surface of the wafer through the hollow channel; as well as The upper shell is arranged on the lower shell, wherein the chassis, the lower shell and the upper shell surround and accommodate the supporting platform, and the upper shell and the lower shell together form a liquid flow channel extending toward the supporting platform and the chassis, and the liquid flow channel is used to guide the cleaning solution to flow toward the chassis.

2. The wafer cleaning device according to claim 1, wherein: The inner end of the upper shell extends above the bearing surface of the bearing platform, and the inner end of the lower shell extends below the bearing platform.

3. The wafer cleaning device according to claim 1, wherein: The at least one nozzle comprises: a first nozzle disposed on the chassis, the first nozzle being used to selectively spray a cleaning solution toward the bottom surface of the wafer when the wafer is rotated by the carrier; and The second nozzle is disposed on the top surface of the lower shell, and is used for selectively spraying a cleaning solution toward the edge of the wafer when the wafer is rotated by the carrier platform.

4. The wafer cleaning device according to claim 3, wherein: The invention also includes a controller for controlling the second nozzle to spray the cleaning solution toward the edge of the wafer after the first nozzle finishes spraying the cleaning solution toward the bottom surface of the wafer.

5. The wafer cleaning device according to claim 3, wherein: The invention also includes a controller for controlling the first nozzle to spray the cleaning solution toward the bottom surface of the wafer after the second nozzle finishes spraying the cleaning solution toward the wafer edge.

6. A method for cleaning a wafer, characterized in that: include: A carrier platform, at least one nozzle, a base, a lower shell, and an upper shell are provided, wherein the lower shell is disposed on the base, and the upper shell is disposed on the lower shell. The base, the lower shell, and the upper shell surround and accommodate the carrier platform, and the upper shell and the lower shell jointly form a liquid flow channel extending toward the carrier platform and the base, the liquid flow channel being used to guide a cleaning solution to flow toward the base, the base comprising a cylindrical structure, wherein the inner end of the lower shell extends below the carrier platform, the cylindrical structure contacts and engages with the inner end of the lower shell and jointly forms a hollow channel, wherein the hollow channel faces the bottom surface of the wafer; Using the carrier to absorb the wafer, causing the carrier to rotate the wafer and coating the photoresist on the top surface of the wafer; Using the at least one nozzle to spray a cleaning solution toward the bottom surface and edge of the wafer, wherein the at least one nozzle includes a first nozzle, and the first nozzle sprays the cleaning solution toward the bottom surface of the wafer through the hollow channel; as well as The cleaning solution is recovered using the bottom tray.

7. The method according to claim 6, wherein The at least one nozzle includes a first nozzle and a second nozzle, and the at least one nozzle sprays a cleaning solution toward the bottom surface and the wafer edge of the wafer, including: spraying a cleaning solution toward the bottom surface of the wafer using the first nozzle; and The cleaning solution is sprayed toward the edge of the wafer using the second nozzle.

8. The method according to claim 7, wherein After the cleaning solution is sprayed toward the bottom surface of the wafer using the first nozzle, the cleaning solution is sprayed toward the edge of the wafer using the second nozzle.

9. The method according to claim 7, wherein After the cleaning solution is sprayed toward the edge of the wafer using the second nozzle, the cleaning solution is sprayed toward the bottom surface of the wafer using the first nozzle.

10. The method according to claim 7, wherein The first nozzle and the second nozzle are used to spray a cleaning solution toward the bottom surface and the edge of the wafer respectively at the same time.

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