Wafer buffer mechanism

Abstract

The present invention provides a wafer cache mechanism, which relates to the field of semiconductor equipment. The wafer cache mechanism includes a first holding part, a second holding part and a connecting part, the first holding part includes a first position, the second holding part includes a second position, the first end of the connecting part is connected to the first position, the second end of the connecting part opposite to the first end is connected to the second position, the first point in one of the first position and the second position is set to be able to withstand a force with a direction jointly determined by the first point and the second point in the other of the first position and the second position, when the first point is subjected to the force, the first holding part and the second holding part are elastically deformed, and the connecting part moves along the direction of the force. The wafer cache mechanism of the present application solves the problem that the particulate matter formed by the oil stains generated by the right-angle bearings used in the existing wafer cache equipment will cause pollution to the wafer, thereby ensuring the cleanliness of the wafer.

Description

Technical Field

[0001] The present application relates to the field of semiconductor equipment, and in particular to a wafer cache mechanism. Background Art

[0002] A wafer cache device refers to a device that can drive wafers to perform linear motion. Existing wafer cache devices generally achieve linear motion through linear guides, linear bearings, and gear rack structures. In this type of motion, linear bearings ensure that the wafer cache device performs linear motion. However, during the linear motion process, the frictional contact of the linear bearings will produce oil stains, which in turn form particulate matter and cause contamination to the wafers. Summary of the Invention

[0003] In view of this, the present application provides a wafer cache mechanism. When a force is applied to one of the first position and the second position in the direction determined by the first point and the second point, the first retaining part and the second retaining part undergo elastic deformation, and the connecting part moves along the direction determined by the first point and the second point. This ensures that the connecting part can move in a straight line, solves the problem that the oil stains generated by the right-angle bearings used in the existing wafer cache equipment will cause particulate matter to contaminate the wafer, and ensures the cleanliness of the wafer.

[0004] According to the present application, a wafer cache mechanism is provided, which includes a first holding part, a second holding part and a connecting part, the first holding part includes a first position, the second holding part includes a second position, the first end of the connecting part is connected to the first position, and the second end of the connecting part opposite to the first end is connected to the second position, and the first point in one of the first position and the second position is set to be able to withstand a force having a direction jointly determined by the first point and the second point in the other of the first position and the second position, when the first point is subjected to the force, the first holding part and the second holding part are elastically deformed, and the connecting part moves along the direction of the force.

[0005] Preferably, both the first position and the second position are planar figures, the first point forms the centroid of the first position, and the second point forms the centroid of the second position.

[0006] Preferably, the first holding portion includes a first plate, the second holding portion includes a second plate, and both the first plate and the second plate are provided with a predetermined number of cutouts.

[0007] Preferably, the defective portion is a groove, and in either the first plate or the second plate: the predetermined number is six, three of the six grooves are set as a first group, and the other three of the six grooves are set as a second group, the first group is arranged on the inner side of the second group, the grooves in the first group are arranged at equal intervals along the circumference of the first plate, the grooves in the second group are arranged at equal intervals along the circumference of the second plate, and the grooves in the first group are staggered with the grooves in the second group.

[0008] Preferably, the thickness of the first plate is equal to the thickness of the second plate, and the thickness of the first plate is one of 0.3 mm, 0.5 mm and 1 mm.

[0009] Preferably, the wafer buffer mechanism further includes an adsorption portion, the adsorption portion is connected to the second holding portion, the adsorption portion is formed with a groove concave toward the interior of the adsorption portion, and the groove is used to adsorb wafers.

[0010] Preferably, the adsorption portion includes a mounting base and an adsorption component, the groove is formed on the adsorption component, the adsorption portion includes a first airflow channel, the groove is provided with a first opening, the first opening is connected to the first airflow channel, the mounting base forms a second airflow channel, and the first airflow channel is connected to the second airflow channel.

[0011] Preferably, the adsorption element is made of electrostatic protection material.

[0012] Preferably, the wafer cache mechanism also includes a first fastening part and a second fastening part, one end of the first fastening part is connected to the surface of the first retaining part facing away from the connecting part, the other end of the first fastening part is connected to the mounting base, and the second fastening part is connected to the surface of the second retaining part facing away from the connecting part.

[0013] Preferably, the wafer buffer mechanism further includes a limiting portion, part of the connecting portion is arranged inside the limiting portion, and the limiting portion is used to limit the first holding portion.

[0014] Preferably, the limiting portion includes a first part and a second part connected to each other, the first part is connected to the first retaining portion, and the end of the second part facing away from the first part is formed with a limiting wall extending toward the connecting portion, and the wafer cache mechanism also includes a limiting elastic member, the connecting portion is formed with a protrusion protruding toward the outside of the connecting portion, and the limiting elastic member is connected to both the protrusion and the limiting wall.

[0015] Preferably, the wafer cache mechanism also includes a supporting portion, part of which is arranged inside the connecting portion, and one end of the supporting portion away from the first retaining portion protrudes through both the second retaining portion and the second fastening portion, and the supporting portion is connected to the mounting base.

[0016] Preferably, the wafer buffer mechanism further includes an adjusting portion, and the adjusting portion is used to adjust the distance between the supporting portion and the connecting portion.

[0017] Preferably, the wafer cache mechanism further includes a driving component, wherein the driving component is connected to the first fastening portion, and the driving component drives the first fastening portion to move so as to apply the force to the first retaining portion.

[0018] Preferably, the wafer cache mechanism includes an outer shell, the driving assembly is arranged inside the outer shell, the outer shell is provided with a rotating shaft, the driving assembly includes a lever part, a flexible part and a driving part, one end of the lever part is connected to the flexible part, the other end of the lever part is connected to the rotating shaft, the part of the lever part close to the rotating shaft is connected to the first fastening part, and the driving part can drive the movement of the flexible part to make the lever part move around the rotating shaft.

[0019] Preferably, the driving assembly further comprises a roller, wherein the roller is connected to the lever portion, a portion of the roller protrudes from the lever portion toward the outside of the lever portion, and the roller is connected to the first fastening portion.

[0020] Preferably, the wafer buffer mechanism further includes an auxiliary portion, one side of the auxiliary portion is connected to the roller, and the other side of the auxiliary portion is connected to the first fastening portion.

[0021] Preferably, the driving portion includes a driving motor and a gear, the driving motor drives the gear to rotate, and a portion of the flexible portion is configured to be able to be wound around the gear.

[0022] Preferably, the connecting portion has an axis, the axis passes through the centroid of the first position and the centroid of the second position, and the axis is arranged to extend along the direction of gravity. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0024] Figure 1A schematic diagram showing a planar structure of a wafer buffer mechanism according to an embodiment of the present invention;

[0025] Figure 2 A schematic diagram showing a portion of the structure of a wafer buffer mechanism according to an embodiment of the present invention is shown;

[0026] Figure 3 A schematic structural diagram of an adsorption portion according to an embodiment of the present invention is shown;

[0027] Figure 4 A schematic cross-sectional structure diagram of an adsorption portion according to an embodiment of the present invention is shown;

[0028] Figure 5 A partial structural schematic diagram of a drive assembly according to an embodiment of the present invention is shown;

[0029] Figure 6 A schematic diagram illustrating the installation of a drive assembly according to an embodiment of the present invention is shown.

[0030] Icons: 100-first retaining portion; 200-second retaining portion; 210-groove; 300-connecting portion; 310-protrusion; 410-first fastening portion; 420-second fastening portion; 431-first part; 432-second part; 440-reset spring; 450-support portion; 451-air guide channel; 460-stabilizing portion; 510-mounting base; 520-adsorption member; 521-groove; 522-first opening; 523-second opening; 530-first air flow channel; 540-second air flow channel; 600-inner shell; 700-outer shell; 710-adsorption interface; 720-rotating shaft; 810-auxiliary portion; 821-drive motor; 822-gear; 823-flexible portion; 824-lever portion; 825-roller. DETAILED DESCRIPTION

[0031] The following detailed description is provided to help the reader gain a comprehensive understanding of the methods, devices, and / or systems described herein. However, various changes, modifications, and equivalents of the methods, devices, and / or systems described herein will be apparent upon understanding the disclosure of this application. For example, the order of operations described herein is merely illustrative and is not limited to the order set forth herein. Rather, except for operations that must occur in a particular order, changes may be made that will be apparent upon understanding the disclosure of this application. Furthermore, descriptions of features known in the art may be omitted for clarity and brevity.

[0032] The features described herein may be implemented in different forms and should not be construed as being limited to the examples described herein. Rather, the examples described herein have been provided merely to illustrate some of the many possible ways to implement the methods, devices, and / or systems described herein that will be apparent upon understanding the disclosure of this application.

[0033] Throughout the specification, when an element (such as a layer, region, or substrate) is described as being “on,” “connected to,” “coupled to,” “over,” or “overlaying” another element, it may be directly “on,” “connected to,” “coupled to,” “over,” or “overlaying” another element, or one or more other elements may be present between them. In contrast, when an element is described as being “directly on,” “directly connected to,” “directly coupled to,” “directly over,” or “directly covering” another element, there may be no other elements intervening therebetween.

[0034] As used herein, the term "and / or" includes any one of the associated listed items and any combination of any two or more items.

[0035] Although terms such as "first," "second," and "third" may be used herein to describe various members, components, regions, layers, or portions, these members, components, regions, layers, or portions are not limited by these terms. Rather, these terms are used only to distinguish one member, component, region, layer, or portion from another member, component, region, layer, or portion. Thus, a first member, component, region, layer, or portion in the examples described herein may also be referred to as a second member, component, region, layer, or portion without departing from the teachings of the examples.

[0036] For ease of description, spatial relational terms such as "above," "upper," "below," and "lower" may be used herein to describe the relationship of one element to another element as shown in the accompanying drawings. Such spatial relational terms are intended to encompass different orientations of the device in use or operation in addition to the orientations depicted in the accompanying drawings. For example, if the device in the accompanying drawings is turned over, an element described as being "above" or "upper" relative to another element would subsequently be "below" or "lower" relative to the other element. Thus, the term "above" includes both the orientations "above" and "below," depending on the spatial orientation of the device. The device may also be positioned in other ways (e.g., rotated 90 degrees or in other orientations), and the spatial relational terms used herein will be interpreted accordingly.

[0037] The terms used herein are intended only to describe various examples and are not intended to limit the present disclosure. Unless the context clearly indicates otherwise, the singular is intended to include the plural. The terms "comprise," "include," and "have" list the presence of stated features, quantities, operations, components, elements, and / or combinations thereof, but do not preclude the presence or addition of one or more other features, quantities, operations, components, elements, and / or combinations thereof.

[0038] Due to manufacturing techniques and / or tolerances, variations in the shapes shown in the drawings may occur. Therefore, the examples described herein are not limited to the specific shapes shown in the drawings but include changes in shapes that occur during manufacturing.

[0039] The features of the examples described herein can be combined in various ways that will be apparent after understanding the disclosure of the present application. In addition, although the examples described herein have various configurations, other configurations are possible as will be apparent after understanding the disclosure of the present application.

[0040] According to the present application, a wafer buffer mechanism is provided, comprising a first holding portion, a second holding portion, and a connecting portion, wherein the first holding portion comprises a first position, the second holding portion comprises a second position, a first end of the connecting portion is connected to the first position, and a second end of the connecting portion, opposite to the first end, is connected to the second position, a first point in one of the first position and the second position is configured to withstand a force having a direction determined by the first point and a second point in the other of the first position and the second position, and when the first point withstands the force, the first holding portion and the second holding portion undergo elastic deformation, and the connecting portion moves in the direction of the force. In this wafer buffer mechanism, when a force in a direction determined by the first point and the second point is applied to one of the first position and the second position, the first holding portion and the second holding portion undergo elastic deformation, and the connecting portion moves in the direction determined by the first point and the second point, thereby ensuring that the connecting portion can move in a straight line, thereby resolving the problem of particulate matter formed by oil stains generated by right-angle bearings in existing wafer buffer devices causing contamination of wafers, and ensuring the cleanliness of the wafers.

[0041] It should be noted that the direction of the force jointly determined by the above-mentioned first point and the second point in the other of the first position and the second position, the direction of the force is the extension direction of the straight line where the first point and the second point are located, that is, the direction of the force can be from the first point to the second point or from the second point to the first point.

[0042] Furthermore, both the first position and the second position are plane figures, the first point forms the centroid of the first position, the second point forms the centroid of the second position, and the connecting portion may be formed as a clamping sleeve.

[0043] Preferably, the first position and the second position are both formed into a circle, with the first point forming the center of the circle of the first position, and the second point forming the center of the circle of the second position. When a force is applied to the first position from the first point toward the second point, that is, when a vertical upward force is applied to the first holding portion 100, the first holding portion 100 deforms upward, thereby pushing the connecting portion 300 upward, causing the second holding portion 200 connected to the connecting portion 300 to elastically deform upward. In this way, it is possible to ensure that the wafer-holding portion disposed above the second holding portion 200 maintains a straight upward motion. The structure of the holding portion will be described later.

[0044] like Figure 2 As shown, the first retaining portion 100 includes a first plate, and the second retaining portion 200 includes a second plate. A predetermined number of notches are provided on the first plate and the second plate, so that the first plate and the second plate can be elastically deformed in the vertical direction.

[0045] Alternatively, both the first holding portion 100 and the second holding portion 200 may be formed as flexible leaf springs.

[0046] Preferably, both the first and second plates are circular, with a predetermined number of six grooves. The notches are formed as grooves 210, with three of the six grooves 210 grouped into a first group and the remaining three grooves 210 grouped into a second group. The first group is disposed inward of the second group. The three grooves 210 in the first group are equidistantly spaced along the circumference of the first plate, and the three grooves 210 in the second group are also equidistantly spaced along the circumference of the first plate. The grooves 210 in the first group are offset from the grooves 210 in the second group, i.e., the central angle of the connecting portion 300 of two grooves 210 in the first group along the circumference of the first plate corresponds to the central angle of a groove 210 in the second group. The axis of symmetry of the connecting portion 300 of the first group may coincide with the axis of symmetry of a groove 210 in the second group. The grooves 210 on the second plate are disposed in the same manner as the grooves 210 on the first plate.

[0047] Preferably, the first plate and the second plate have the same thickness, and the thickness of the first plate may be one of 0.3 mm, 0.5 mm and 1 mm.

[0048] like Figure 1As shown, the connecting portion 300 is formed into a cylindrical shape and has an axis extending in the direction of gravity. The axis of the connecting portion passes through the centroid of the first position and the centroid of the second position. The lower end of the connecting portion 300 is connected to the first holding portion 100, and the lower end of the connecting portion 300 is connected to the second holding portion 200. The wafer buffer mechanism also includes a first fastening portion 410 and a second fastening portion 420. The first fastening portion 410 can be formed as a clamping nut, and the second fastening portion 420 can be formed as an adjustment sleeve. The first fastening portion 410 is disposed below the first holding portion 100, and the second fastening portion 420 is disposed above the second holding portion 200. By providing the first fastening portion 410 and the second fastening portion 420, the first holding portion 100 and the second holding portion 200 are clamped to the connecting portion 300.

[0049] Furthermore, the wafer cache mechanism also includes a limiting portion, which includes a first part 431 and a second part 432. The first part 431 is connected to the lower end of the second part 432, and the first part 431 and the second part 432 are both mounted on the outside of the connecting part 300. The lower part of the connecting part 300 protrudes upward from the first part 431. The diameter of the first part 431 is larger than the diameter of the second part 432. The first part 431 is connected to the outer side of the first position on the first retaining part 100, and the upper end of the second part 432 is provided with a limiting wall extending inward (not marked in the figure). By setting the limiting portion, the position of the connecting part 300 can be limited, and the limiting portion can be formed as a limiting flange.

[0050] In addition, the wafer cache mechanism also includes a stabilizing portion 460, which includes a large diameter portion and a small diameter portion. The lower end of the large diameter portion is connected to the small diameter portion. Both the large diameter portion and the small diameter portion are mounted on the outside of the connecting portion 300, and the large diameter portion is connected to the outside of the second position of the second retaining member.

[0051] like Figure 1 As shown, the wafer cache mechanism also includes a limiting elastic member, which can be formed as a reset spring 440. The reset spring 440 is sleeved on the outside of the limiting portion, and the limiting portion is formed with a protrusion 310. The lower end of the reset spring 440 is connected to the protrusion 310, and the upper end is connected to the limiting wall. When the connecting portion 300 moves upward, the protrusion 310 applies force to the reset spring 440, so that the reset spring 440 is compressed. When the elastic force of the reset spring 440 itself is greater than the force applied by the protrusion 310 to the reset spring 440, the connecting portion 300 moves downward, so that it can perform reciprocating motion in the vertical direction.

[0052] like Figure 1 As shown, the wafer buffer mechanism includes an adsorption portion, the adsorption portion includes a mounting base 510 and an adsorption member 520, and the adsorption member 520 is fastened to the mounting base 510 by screws or bonded to the mounting base 510 by glue, as shown in FIG. Figure 3 and Figure 4 As shown, the adsorbent 520 includes a groove 521 that is recessed into the adsorbent 520. The bottom surface of the groove 521 is 1 mm away from the upper surface of the adsorbent 520, that is, the depth of the groove 521 is 1 mm. A first opening 522 is formed on the bottom surface of the groove 521, and the first opening 522 is connected to the first air flow channel 530 in the groove 521. A second air flow channel 540 is formed in the mounting base 510, and the first air flow channel 530 and the second air flow channel 540 are connected. Figure 5 As shown, the first air flow channel 530 extends in the vertical direction, and the second air flow channel 540 is divided into two sections, wherein one section extends in the vertical direction and the other section extends in the horizontal direction. The second section of the second air flow channel 540 has a second opening 523, and the second opening 523 is the port of the process hole when processing the second air flow channel 540. After the processing is completed, the second opening 523 needs to be sealed so that the gas passes through the first opening 522, the first air flow channel 530 and the second air flow channel 540, thereby adsorbing the wafer into the groove 521 of the adsorption component 520.

[0053] Preferably, the adsorbent 520 is made of an electrostatic protection material. For example, the adsorbent 520 can be made of PEEK (Polyetheretherketone) and Semitron ESD 410 (polyimide). By setting the adsorbent 520 as an electrostatic protection material, static electricity can be prevented from damaging the wafer.

[0054] Furthermore, if Figure 1 As shown, the wafer buffer mechanism also includes a support portion 450, which is formed into a hollow structure and is arranged inside the connecting portion 300. The upper end of the support portion 450 protrudes upward through the second fastening portion 420, and the side of the second fastening portion 420 is provided with an adjustment portion (not shown in the figure). The adjustment portion is used to adjust the distance between the support portion 450 and the adjustment portion. The adjustment portion can be formed as a screw, and the end of the screw contacts the outer wall of the support portion 450. By adjusting the depth of the screw, the position of the support portion 450 can be adjusted, and the support portion 450 can be ensured to move in the vertical direction. The upper end of the support portion 450 is connected to the mounting base 510, so that the linear movement of the wafer can be guaranteed.

[0055] Furthermore, the wafer buffer mechanism further includes an inner shell 600, in which the connecting portion 300, the limiting portion, the limiting spring, the first holding portion 100, and the second holding portion 200 are all disposed. Parts of the first fastening portion 410, the second fastening portion 420, and the supporting portion 450 protrude from the inner shell 600. Figure 1 The inner housing 600 is not shown.

[0056] Furthermore, the wafer cache mechanism also includes an outer shell 700, the lower part of the inner shell 600 is arranged inside the outer shell 700, and an adsorption interface 710 is opened on the outer shell 700. An air guide channel 451 is formed inside the support part 450, and the upper end of the air guide channel 451 is connected to the second flow channel in the mounting base 510, and the lower end of the air guide channel 451 is connected to the adsorption interface 710. In this way, the adsorption component 520 can be sucked to achieve the adsorption of the wafer into the groove 521 in the adsorption component 520.

[0057] In this application Figure 1 In the illustrated embodiment, the axes of the connecting portion 300 , the first fastening portion 410 , the second fastening portion 420 , the limiting portion, and the stabilizing portion 460 coincide with each other.

[0058] like Figure 1 As shown, the wafer cache mechanism also includes a driving assembly and an auxiliary part 810. The upper end of the auxiliary part 810 contacts the first fastening part 410, and the lower end of the auxiliary part 810 contacts the driving assembly. The driving assembly can move, thereby causing the auxiliary part 810 and the first fastening part 410 to move, thereby applying a vertical upward force to the first retaining part 100.

[0059] like Figure 1 、 Figure 5 and Figure 6 As shown, the driving assembly includes a driving motor 821, a gear 822, a flexible portion 823, a lever portion 824 and a roller 825. The driving motor 821 can drive the gear 822 to rotate. One end of the flexible portion 823 is connected to the lever portion 824, and the other end of the flexible portion 823 is connected to the gear 822. Part of the flexible portion 823 can be wound around the gear 822 as the gear 822 rotates. The lever portion 824 is connected to the rotating shaft 720 on the outer shell 700. The roller 825 is arranged at a portion of the lever portion 824 near the second end. The roller 825 is connected to the auxiliary portion 810 ( Figure 5 and Figure 6 The auxiliary portion may be formed as a linear motion driving member to achieve transmission between the roller 825 and the second fastening portion 420. The flexible portion 823 may be formed as a steel belt.

[0060] In the wafer cache mechanism, when the driving motor 821 drives the gear 822 to rotate, part of the flexible part 823 is wound onto the gear 822, and the end of the lever part 824 connected to the flexible part 823 is lifted. The lever part 824 rotates around the rotation axis 720, so that the roller 825 arranged on the lever part 824 moves upward, pushing the auxiliary part and the first fastening part 410 to move upward, and then applying a vertical force to the first holding part 100, the first holding part 100 is deformed upward, pushing the connecting part 300 to move upward, and then causing the second holding part 200 to deform upward, the second fastening part 420 and the supporting part 450 connected to the second fastening part 420 to move upward, thereby pushing the adsorption part and the wafer on the adsorption part to move upward. During the movement of the connecting portion 300, the return spring 440 is compressed. When the force applied by the return spring 440 to the connecting portion 300 is greater than the force applied by the first holding portion 100 to the connecting portion 300, the connecting portion 300 moves downward, and the first holding portion 100 and the second holding portion 200 restore the original shape of the adsorption portion and the downward movement of the wafer on the adsorption portion. In this way, a linear reciprocating motion of 3 mm in the vertical direction of the wafer can be achieved. The drive assembly is provided with a lever portion 824 so that the movement speed of the end of the lever portion 824 near the roller 825 is less than the movement speed of the end near the flexible portion 823, thereby achieving deceleration of the roller 825. In addition, by providing the lever portion 824, the force of the end of the lever portion 824 near the roller 825 is less than the force of the end near the flexible portion 823, thereby achieving amplification of the driving force.

[0061] In addition, while driving the wafer to move, the wafer cache mechanism can hand it over to other equipment for further processing the wafer. By providing a first holding part and a second holding part that can undergo elastic deformation, the wafer cache mechanism can avoid the rigid handover of traditional wafer cache equipment during the handover process, achieve flexible handover, and reduce the risk of wafer breakage during the handover process.

[0062] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A wafer buffer mechanism, characterized in that: The wafer buffer mechanism includes a first holding portion, a second holding portion and a connecting portion, wherein the first holding portion includes a first position, the second holding portion includes a second position, a first end of the connecting portion is connected to the first position, and a second end of the connecting portion opposite to the first end is connected to the second position. A first point in one of the first position and the second position is arranged to be able to withstand a force having a direction determined by both the first point and a second point in the other of the first position and the second position, When the first point is subjected to the force, the first holding portion and the second holding portion are elastically deformed, and the connecting portion moves in the direction of the force; The connecting portion is formed in a cylindrical shape, the connecting portion having an axis, the axis passing through the centroid of the first position and the centroid of the second position along the axis, and the axis is arranged to extend along the direction of gravity; The wafer buffer mechanism further includes a limiting portion, wherein a portion of the connecting portion is disposed inside the limiting portion, and the limiting portion is used to limit the first holding portion; The limiting portion includes a first portion and a second portion connected to each other, the first portion is connected to the first retaining portion, and the end of the second portion facing away from the first portion is formed with a limiting wall extending toward the connecting portion, and the diameter of the first portion is larger than the diameter of the second portion; The wafer buffer mechanism further includes a limiting elastic member, the connecting portion is formed with a protrusion protruding toward the outside of the connecting portion, and the limiting elastic member is connected to both the protrusion and the limiting wall.

2. The wafer buffer mechanism according to claim 1, characterized in that: Both the first position and the second position are planar figures, the first point forms the centroid of the first position, and the second point forms the centroid of the second position.

3. The wafer buffer mechanism according to claim 1, characterized in that: The first holding portion includes a first plate, the second holding portion includes a second plate, and both the first plate and the second plate are provided with a predetermined number of cutouts.

4. The wafer buffer mechanism according to claim 3, characterized in that: The defective portion is a groove, In either the first plate or the second plate: the predetermined number is six, three of the six grooves are set as a first group, and the other three of the six grooves are set as a second group, the first group is arranged on the inner side of the second group, the grooves in the first group are arranged at equal intervals along the circumference of the first plate, the grooves in the second group are arranged at equal intervals along the circumference of the second plate, and the grooves in the first group are staggered with the grooves in the second group.

5. The wafer buffer mechanism according to claim 3, characterized in that: The thickness of the first plate is equal to the thickness of the second plate, and the thickness of the first plate is one of 0.3 mm, 0.5 mm, and 1 mm.

6. The wafer buffer mechanism according to claim 1, wherein: The wafer buffer mechanism further includes an adsorption portion connected to the second holding portion. The adsorption portion is formed with a groove concave toward the interior of the adsorption portion, and the groove is used to adsorb wafers.

7. The wafer buffer mechanism according to claim 6, characterized in that: The adsorption portion includes a mounting base and an adsorption component, the groove is formed on the adsorption component, the adsorption portion includes a first airflow channel, the groove has a first opening, the first opening is connected to the first airflow channel, the mounting base forms a second airflow channel, and the first airflow channel is connected to the second airflow channel.

8. The wafer buffer mechanism according to claim 7, characterized in that: The adsorption element is made of electrostatic protection material.

9. The wafer buffer mechanism according to claim 7, characterized in that: The wafer cache mechanism also includes a first fastening part and a second fastening part, one end of the first fastening part is connected to the surface of the first retaining part facing away from the connecting part, the other end of the first fastening part is connected to the mounting base, and the second fastening part is connected to the surface of the second retaining part facing away from the connecting part.

10. The wafer buffer mechanism according to claim 9, characterized in that: The wafer buffer mechanism also includes a supporting portion, part of which is arranged inside the connecting portion, and an end of the supporting portion away from the first retaining portion protrudes through both the second retaining portion and the second fastening portion, and the supporting portion is connected to the mounting base.

11. The wafer buffer mechanism according to claim 10, characterized in that: The wafer buffer mechanism further includes an adjusting portion, which is used to adjust the distance between the supporting portion and the connecting portion.

12. The wafer buffer mechanism according to claim 9, wherein: The wafer buffer mechanism further includes a driving component connected to the first fastening portion, and the driving component drives the first fastening portion to move so as to apply the force to the first holding portion.

13. The wafer buffer mechanism according to claim 12, wherein: The wafer cache mechanism includes an outer shell, the drive assembly is arranged inside the outer shell, the outer shell is provided with a rotating shaft, the drive assembly includes a lever part, a flexible part and a drive part, one end of the lever part is connected to the flexible part, the other end of the lever part is connected to the rotating shaft, the part of the lever part close to the rotating shaft is connected to the first fastening part, and the drive part can drive the movement of the flexible part to make the lever part move around the rotating shaft.

14. The wafer buffer mechanism according to claim 13, wherein: The driving assembly further includes a roller connected to the lever portion, a portion of the roller protruding from the lever portion toward the outside of the lever portion, and the roller connected to the first fastening portion.

15. The wafer buffer mechanism according to claim 14, characterized in that: The wafer buffer mechanism further includes an auxiliary portion, one side of the auxiliary portion is connected to the roller, and the other side of the auxiliary portion is connected to the first fastening portion.

16. The wafer buffer mechanism according to claim 13, wherein: The driving portion includes a driving motor and a gear. The driving motor drives the gear to rotate. The flexible portion is configured to be wound around the gear.

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