Automatic testing device for laser chips

Abstract

The present invention discloses an automated testing device for laser chips, wherein the testing probe assembly comprises: a body connected to a driving bracket, a support plate, a probe for contacting a chip to be tested and a moving point contact probe, a cantilever is installed at one end of the support plate, and the moving point contact probe is installed at the other end, a static point contact probe located at the upper part of the moving point contact probe and corresponding to the moving point contact probe is arranged on one side of the lower end surface of the body, a probe seat is fixed at one end of the cantilever away from the support plate, and the probe seat comprises a base and a clip, the probe is located between the base and the clip, and the angle between the probe and the support plate is 30°. The present invention improves the stability, repeatability, comparability and consistency of the detection data.

Description

Technical Field

[0001] The invention relates to an automatic testing device for a laser chip, belonging to the technical field of chip testing. Background Art

[0002] In the production and testing of lasers in the optical communication industry, the optoelectronic performance test of a single laser chip (Laser Diode, LD) is required before the COC aging process. In the testing process of a single laser chip (LD) in optical communication, the stability of the probe plays a very important role. Since the size of a single chip is very small (generally in the range of 300μm), the test probe will more or less push the position or angle of the chip to shift during contact with the chip. Once the position and angle of the chip change, it will directly affect the stability of subsequent test indicators and the test efficiency. In addition, the pressure stability of the test probe will also directly feed back to the stability of the test value. For mass production testing, a probe needs to detect a large number of chips, and the same chip needs to be tested multiple times. The stability and durability of the powered probe assembly will directly affect the consistency and reproducibility of the test data. Therefore, the long-term stability of the test probe assembly is very demanding during the test process. Summary of the invention

[0003] The inventors found that the change in pressure exerted by the probe on the chip will cause a change in contact resistance, thereby affecting the consistency of the test data. During a long test process, if the pressure change is too large, it will be impossible to distinguish whether the change in the test result is caused by the chip itself or the machine, resulting in the loss of comparability of the test results. Based on the above findings, the purpose of the present invention is to provide an automated testing device for laser chips, which solves the problem of unstable and inconsistent test data during long-term use caused by fatigue of the test probe assembly on the machine in the prior art.

[0004] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is: an automated testing device for laser chips, comprising: a substrate, a test bench installed on the upper surface of the substrate, a driving bracket installed on the outer side of the substrate, and a test probe assembly installed on the driving bracket and located above the test bench, the test probe assembly comprising: a body connected to the driving bracket, a support plate, a probe for contacting the chip to be tested, and a moving point contact probe, a cantilever is installed at one end of the support plate, and the moving point contact probe is installed at the other end, a static point contact probe located at the upper part of the moving point contact probe and corresponding to the moving point contact probe is arranged on one side of the lower end surface of the body, a probe seat with the probe installed is fixed at one end of the cantilever away from the support plate, the probe seat comprises a base and a clamp, the probe is located between the base and the clamp, and the angle between the probe and the support plate is 30°;

[0005] An adapter is installed on the upper surface of the middle part of the support plate, and the front and rear sides of the adapter are respectively provided with a front baffle and a rear baffle, wherein the front baffle and the rear baffle are both provided with a first through hole and two guide grooves located on both sides of the first through hole, and two ends of a first pin shaft are respectively located in the first through holes of the front baffle and the rear baffle;

[0006] A second pin shaft and a third pin shaft are arranged in parallel on the lower protrusion located on the other side of the lower end surface of the body, the second pin shaft and the third pin shaft are located above the first pin shaft and on both sides thereof, and both ends of the second pin shaft and the third pin shaft extend from the front and rear sides of the lower protrusion respectively, the first bearing and the second bearing are respectively sleeved on both ends of the second pin shaft and are located on the front and rear sides of the lower protrusion, and the third bearing and the fourth bearing are respectively sleeved on both ends of the third pin shaft and are located on the front and rear sides of the lower protrusion;

[0007] The first bearing, the third bearing, the second bearing and the fourth bearing are respectively located between the lower protrusion and the front baffle and the rear baffle, one end of the first elastic member located in the vertical through hole of the lower protrusion is connected to the middle area of ​​the first pin located between the front baffle and the rear baffle, and the other end is connected to the fourth pin located in the body and above the second pin and the third pin, and the first elastic member is in a stretched state, so that the movable rings of the first bearing, the second bearing, the third bearing and the fourth bearing are pressed and contacted with the side surface of the first pin;

[0008] The centroid moment of the support plate portion, cantilever, probe seat and probe located on the right side of the first pin is greater than the centroid moment of the remaining support plate portion and the moving point contact probe located on the left side of the first pin.

[0009] The further improved scheme in the above technical scheme is as follows:

[0010] 1. In the above solution, the clip is connected to the base through an adjusting nut.

[0011] 2. In the above solution, at least one of the surfaces of the base and the clamping piece that contact the probe has a V-shaped groove for the probe to be embedded in.

[0012] 3. In the above scheme, the driving bracket further includes two parallel vertical poles, a mounting plate connected between the upper ends of the two vertical poles, and a connecting plate connected between the lower ends of the two vertical poles, and the two test probe assemblies are respectively installed on the upper surfaces of both ends of the mounting plate.

[0013] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art:

[0014] The automatic testing device for laser chips of the present invention realizes performance testing of a large number of chips. On the basis of realizing performance testing of a large number of chips, a first pin shaft perpendicular to the length direction of the supporting plate is installed on a rotatable supporting plate on which a probe is installed, and a second and a third pin shaft fixed on the main body are arranged on both sides above the first pin shaft, and four bearings fitted with the first pin shaft are installed on both ends of the second and third pin shafts. Finally, the first pin shaft on the supporting plate and the fourth pin shaft in the main body are tightened by a first elastic member, so that the outer rings of the four bearings maintain a pressing contact with the outer circumferential surface of the first pin shaft and can rotate relatively, thereby eliminating the fatigue problem existing in the prior art, facilitating accurate setting of position parameters in the horizontal and vertical directions, and maintaining the stability of the initial pressure setting value after long-term and high-frequency use, thereby improving the stability, repeatability, comparability and consistency of the detection data, and also overcoming the defect that the probe has a slight vertical jitter when the probe is separated from the chip, thereby facilitating shortening the time between adjacent detections, improving the detection efficiency and avoiding unnecessary damage to the chip; and also eliminating the slight rotation offset of the probe in the horizontal direction, ensuring the accuracy of the detection data, and further improving the stability, repeatability, comparability and consistency of the detection data. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Attached Figure 1 This is a schematic diagram of the structure of the automated testing device for the laser chip of the present invention;

[0016] Attached Figure 2 It is a structural schematic diagram of a test probe assembly in an automated test device of the present invention;

[0017] Attached Figure 3 It is a partial structural cross-sectional view of a test probe assembly in the automated test device of the present invention;

[0018] Attached Figure 4 It is a partial structural schematic diagram of a test probe assembly in the automated test device of the present invention;

[0019] Attached Figure 5 for Figure 4 Schematic diagram of the structure in the figure;

[0020] Attached Figure 6 A bottom view of a local structure of a test probe assembly in the automated test device of the present invention;

[0021] Attached Figure 7 The figure is a schematic diagram of the structure of the probe seat in the automatic testing device of the laser chip of the present invention.

[0022] In the above figures: 1, body; 2, support plate; 31, moving point contact probe; 32, static point contact probe; 4, cantilever; 5, probe seat; 51, probe; 52, base; 53, clip; 54, adjustment nut; 55, V-shaped groove; 6, adapter; 61, front baffle; 62, rear baffle; 7, first through hole; 8, guide groove; 9, first pin shaft; 10, lower protrusion; 11, second pin shaft; 12, third pin shaft; 13 , first bearing; 14, second bearing; 15, third bearing; 16, fourth bearing; 17, vertical through hole; 18, first elastic member; 19, fourth pin; 21, base plate; 22, test bench; 23, drive bracket; 231, vertical pole; 232, mounting plate; 233, connecting plate; 24, test probe assembly; 25, fixing plate; 26, motor; 27, lead screw; 28, lead screw nut; 29, slide rail; 30, slider. DETAILED DESCRIPTION

[0023] In the description of this patent, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention; the terms "first", "second", and "third" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance; in addition, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be a connection between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in this patent can be understood according to specific circumstances.

[0024] Embodiment 1: An automated testing device for a laser chip, comprising: a substrate 21, a test bench 22 mounted on the upper surface of the substrate 21, a drive bracket 23 mounted on the outer side of the substrate 21, and a test probe assembly 24 mounted on the drive bracket 23 and located above the test bench 22, wherein the test probe assembly 24 comprises: a body 1 connected to the drive bracket 23, a support plate 2, a probe 51 for contacting a chip to be tested, and a moving point contact probe 31, wherein a cantilever 4 is mounted on one end of the support plate 2, and the moving point contact probe 31 is mounted on the other end, wherein the body 1 A static point contact probe 32 is arranged on one side of the lower end surface, which is located on the upper part of the dynamic point contact probe 31 and corresponds to the dynamic point contact probe. When the probe contacts the chip to be tested, the dynamic point contact probe rotates with the support plate away from the static point contact probe, and the dynamic and static point contact probes change from an initial state of contact with each other to a state of separation from each other. After receiving the signal that the dynamic and static point contact probes are separated from each other, the control system of the chip test performs a power-on operation to make the probe and the chip electrically conductive, and then tests various parameters of the chip. A probe seat 5 with the probe 51 installed is fixed to one end of the cantilever 4 away from the support plate 2;

[0025] An adapter seat 6 is installed on the upper surface of the middle part of the support plate 2, and the front and rear sides of the adapter seat 6 are respectively provided with a front baffle plate 61 and a rear baffle plate 62, wherein the front baffle plate 61 and the rear baffle plate 62 are both provided with a first through hole 7 and two guide grooves 8 located on both sides of the first through hole 7, and two ends of a first pin shaft 9 are respectively located in the first through hole 7 of the front baffle plate 61 and the rear baffle plate 62;

[0026] A second pin shaft 11 and a third pin shaft 12 are arranged in parallel on the lower protrusion 10 located on the other side of the lower end surface of the body 1. The second pin shaft 11 and the third pin shaft 12 are located above the first pin shaft 9 and on both sides thereof, and both ends of the second pin shaft 11 and the third pin shaft 12 extend from the front and rear sides of the lower protrusion 10. The first bearing 13 and the second bearing 14 are respectively sleeved on both ends of the second pin shaft 11 and are located on the front and rear sides of the lower protrusion 10. The third bearing 15 and the fourth bearing 16 are respectively sleeved on both ends of the third pin shaft 12 and are located on the front and rear sides of the lower protrusion 10.

[0027] The first bearing 13, the third bearing 15, the second bearing 14, and the fourth bearing 16 are respectively located between the lower protrusion 10 and the front baffle 61 and the rear baffle 62. One end of the first elastic member 18 located in the vertical through hole 17 of the lower protrusion 10 is connected to the middle area of ​​the first pin shaft 9 located between the front baffle 61 and the rear baffle 62, and the other end is connected to the fourth pin shaft 19 located in the body 1 and above the second pin shaft 11 and the third pin shaft 12. The first elastic member 18 is in a stretched state, so that the respective moving circles of the first bearing 13, the second bearing 14, the third bearing 15, and the fourth bearing 16 are pressed and contacted with the side surface of the first pin shaft 9.

[0028] The centroid moment of the support plate 2 , cantilever 4 , probe seat 5 and probe 51 on the right side of the first pin 9 is greater than the centroid moment of the remaining support plate 2 and the moving point contact probe 31 on the left side of the first pin 9 .

[0029] The probe seat 5 comprises a base 52 and a clip 53, the probe 51 is located between the base 52 and the clip 53, and the clip 53 is connected to the base 52 via an adjusting nut 54;

[0030] At least one of the surfaces of the base 52 and the clip 53 that contact the probe 51 is provided with a V-shaped groove 55 for the probe 51 to be embedded; the angle between the probe 51 and the support plate 2 is 30°.

[0031] Embodiment 2: An automated testing device for a laser chip, comprising: a substrate 21, a test bench 22 mounted on the upper surface of the substrate 21, a drive bracket 23 mounted on the outer side of the substrate 21, and a test probe assembly 24 mounted on the drive bracket 23 and located above the test bench 22, wherein the test probe assembly 24 comprises: a body 1 connected to the drive bracket 23, a support plate 2, a probe 51 for contacting a chip to be tested, and a moving point contact probe 31, wherein a cantilever 4 is mounted on one end of the support plate 2, and the moving point contact probe 31 is mounted on the other end, a static point contact probe 32 located on the upper part of the moving point contact probe 31 and corresponding to the static point contact probe 32 is arranged on one side of the lower end surface of the body 1, and a probe holder 5 mounted with the probe 51 is fixed on one end of the cantilever 4 away from the support plate 2;

[0032] An adapter seat 6 is installed on the upper surface of the middle part of the support plate 2, and the front and rear sides of the adapter seat 6 are respectively provided with a front baffle plate 61 and a rear baffle plate 62, wherein the front baffle plate 61 and the rear baffle plate 62 are both provided with a first through hole 7 and two guide grooves 8 located on both sides of the first through hole 7, and two ends of a first pin shaft 9 are respectively located in the first through hole 7 of the front baffle plate 61 and the rear baffle plate 62;

[0033] A second pin shaft 11 and a third pin shaft 12 are arranged in parallel on the lower protrusion 10 located on the other side of the lower end surface of the body 1. The second pin shaft 11 and the third pin shaft 12 are located above the first pin shaft 9 and on both sides thereof, and both ends of the second pin shaft 11 and the third pin shaft 12 extend from the front and rear sides of the lower protrusion 10. The first bearing 13 and the second bearing 14 are respectively sleeved on both ends of the second pin shaft 11 and are located on the front and rear sides of the lower protrusion 10. The third bearing 15 and the fourth bearing 16 are respectively sleeved on both ends of the third pin shaft 12 and are located on the front and rear sides of the lower protrusion 10.

[0034] The first bearing 13, the third bearing 15, the second bearing 14, and the fourth bearing 16 are respectively located between the lower protrusion 10 and the front baffle 61 and the rear baffle 62. One end of the first elastic member 18 located in the vertical through hole 17 of the lower protrusion 10 is connected to the middle area of ​​the first pin shaft 9 located between the front baffle 61 and the rear baffle 62, and the other end is connected to the fourth pin shaft 19 located in the body 1 and above the second pin shaft 11 and the third pin shaft 12. The first elastic member 18 is in a stretched state, so that the respective moving circles of the first bearing 13, the second bearing 14, the third bearing 15, and the fourth bearing 16 are pressed and contacted with the side surface of the first pin shaft 9.

[0035] The centroid moment of the support plate 2 , cantilever 4 , probe seat 5 and probe 51 on the right side of the first pin 9 is greater than the centroid moment of the remaining support plate 2 and the moving point contact probe 31 on the left side of the first pin 9 .

[0036] The driving bracket 23 further comprises two parallel vertical rods 231, a mounting plate 232 connected between the upper ends of the two vertical rods 231, and a connecting plate 233 connected between the lower ends of the two vertical rods 231, and the two test probe assemblies 24 are respectively mounted on the upper surfaces of both ends of the mounting plate 232;

[0037] A fixing plate 25 mounted on the base plate 21 is vertically arranged between the vertical rod 231 of the driving bracket 23 and the base plate 21, a motor 26 is installed at the lower part of the fixing plate 25, a screw rod 27 arranged in the vertical direction is installed on the output shaft of the motor 26, and a screw rod nut 28 mounted on the screw rod 27 is connected to the connecting plate 233 of the driving bracket 23;

[0038] A slide rail 29 is disposed on both sides of the screw rod 27 and between the vertical rod 231 and the fixed plate 25. The vertical rod 231 is movably connected to the slide rail 29 via at least two sliders 30. The included angle between the probe 51 and the support plate 2 is 60°.

[0039] When the above-mentioned automated testing device for the laser chip is used, the driving bracket is driven by a motor to drive the test probe assembly to move, so that the probe on the test probe assembly contacts the chip to be tested on the test bench. While the probe applies downward pressure to the chip, it is subjected to an upward reaction force from the chip, driving the support plate to rotate. The moving point contact probe installed on the support plate moves downward, and changes from an initial state of contact with the static point contact probe to a state of separation from the static point contact probe, indicating that the probe has applied appropriate pressure to the chip. At this time, the control system of the chip test performs a power-on operation to make the probe electrically conductive with the chip and test various parameters of the chip. After the test is completed, the support plate rotates in the opposite direction under the action of the second elastic member and returns to its initial horizontal position. At the same time, the moving point contact probe contacts the static point contact probe.

[0040] In the process of long-term testing of a large number of chips and reciprocating rotation of the support plate, the first pin shaft installed on the support plate is fitted with four bearings installed on both sides and ends of the first elastic member and on the main body, while ensuring that the support plate can smoothly rotate with the first pin shaft as a fulcrum, the first pin shaft is accurately limited, so that the support plate can only rotate without deviation in other directions; thereby, on the basis of realizing performance testing of a large number of chips, the fatigue problem existing in the prior art of using a spring sheet support structure to support the front-end probe structure can be eliminated, which is conducive to accurately setting the position parameters in the horizontal and vertical directions, and can still maintain the stability of the initial pressure setting value after long-term and high-frequency use, thereby improving the stability, repeatability, comparability and consistency of the detection data, and also overcoming the defect that the probe has a slight vertical jitter when the probe is separated from the chip, which is conducive to shortening the time between adjacent detections, thereby improving the detection efficiency and avoiding unnecessary damage to the chip;

[0041] Furthermore, the slight rotational deviation of the probe in the horizontal direction is also eliminated, which ensures the accuracy of the test data and further improves the stability, repeatability, comparability and consistency of the test data.

[0042] The automated testing device for laser chips of the present invention can be extended to other industries for semiconductor chip testing, and its use is not limited to the optical communication industry. All industries that require automated testing devices for laser chips can be simultaneously expanded and used, and have a wide range of applications.

[0043] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with the technology to understand the content of the present invention and implement it accordingly, and they cannot be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the protection scope of the present invention.

Claims

1. An automated testing device for a laser chip, characterized in that: include: A substrate (21), a test bench (22) mounted on the upper surface of the substrate (21), a drive bracket (23) mounted on the outside of the substrate (21), and a test probe assembly (24) mounted on the drive bracket (23) and located above the test bench (22), wherein the test probe assembly (24) comprises: a body (1) connected to the drive bracket (23), a support plate (2), a probe (51) for contacting a chip to be tested, and a moving point contact probe (31), wherein a cantilever (4) is mounted on one end of the support plate (2) and a moving point contact probe (31) is mounted on the other end of the support plate (2). The moving point contact probe (31) is installed at the end thereof, a static point contact probe (32) located above the moving point contact probe (31) and corresponding to the moving point contact probe (31) is arranged on one side of the lower end surface of the body (1), a probe seat (5) on which the probe (51) is installed is fixed at one end of the cantilever (4) away from the support plate (2), the probe seat (5) comprising a base (52) and a clamping piece (53), the probe (51) is located between the base (52) and the clamping piece (53), and the angle between the probe (51) and the support plate (2) is 30°; An adapter seat (6) is mounted on the upper surface of the middle portion of the support plate (2), and the adapter seat (6) has a front baffle plate (61) and a rear baffle plate (62) on the front and rear sides respectively, wherein the front baffle plate (61) and the rear baffle plate (62) are each provided with a first through hole (7) and two guide grooves (8) located on both sides of the first through hole (7), and two ends of a first pin shaft (9) are respectively located in the first through hole (7) of the front baffle plate (61) and the rear baffle plate (62); A second pin shaft (11) and a third pin shaft (12) are arranged in parallel on the lower protrusion (10) located on the other side of the lower end surface of the body (1); the second pin shaft (11) and the third pin shaft (12) are located above the first pin shaft (9) and on both sides thereof, and both ends of the second pin shaft (11) and the third pin shaft (12) extend from the front and rear sides of the lower protrusion (10); the first bearing (13) and the second bearing (14) are respectively sleeved on both ends of the second pin shaft (11) and are located on the front and rear sides of the lower protrusion (10); the third bearing (15) and the fourth bearing (16) are respectively sleeved on both ends of the third pin shaft (12) and are located on the front and rear sides of the lower protrusion (10); The first bearing (13), the third bearing (15), the second bearing (14), and the fourth bearing (16) are respectively located between the lower protrusion (10) and the front baffle (61) and the rear baffle (62); one end of a first elastic member (18) located in a vertical through hole (17) of the lower protrusion (10) is connected to a middle area of ​​the first pin shaft (9) located between the front baffle (61) and the rear baffle (62); the other end is connected to a fourth pin shaft (19) located in the body (1) and above the second pin shaft (11) and the third pin shaft (12); the first elastic member (18) is in a stretched state, so that the respective moving circles of the first bearing (13), the second bearing (14), the third bearing (15), and the fourth bearing (16) are pressed and contacted with the side surface of the first pin shaft (9); The centroid moment of the support plate (2) portion, the cantilever (4), the probe seat (5) and the probe (51) located on the right side of the first pin shaft (9) is greater than the centroid moment of the remaining portion of the support plate (2) and the moving point contact probe (31) located on the left side of the first pin shaft (9).

2. The automated testing device for laser chips according to claim 1, characterized in that: The clip (53) is connected to the base (52) via an adjusting nut (54).

3. The automated testing device for laser chips according to claim 1 or 2, characterized in that: At least one of the surfaces of the base (52) and the clamping piece (53) that are in contact with the probe (51) is provided with a V-shaped groove (55) for the probe (51) to be embedded.

4. The automated testing device for laser chips according to claim 1, characterized in that: The driving bracket (23) further comprises two parallel vertical rods (231), a mounting plate (232) connected between the upper ends of the two vertical rods (231), and a connecting plate (233) connected between the lower ends of the two vertical rods (231), and the two test probe assemblies (24) are respectively mounted on the upper surfaces at both ends of the mounting plate (232).

Images