Connector and connector kit

Abstract

The present invention provides a connector and a connector kit, which are difficult to be inserted reversely. The connector includes a plurality of socket connectors (1) mounted on a first substrate (51) and a plurality of plug connectors (2) mounted on a second substrate (52). The socket connector (1) includes a first housing (10) having a slot (19) and a plurality of contacts (8) arranged in the slot (19). The plug connector (2) includes a second housing (20) having a head portion (29) that fits into the slot (19) and a plurality of contacts (8) arranged in the head portion (29). Thus, the first housing (10) of the socket connector (1) and the second housing (20) of the plug connector (2) have a rotationally asymmetric shape when viewed from the fitting direction.

Description

Technical Field

[0001] The present invention relates to a high-speed transmission connector mounted on a circuit board. More specifically, it relates to a mezzanine connector that electrically connects different circuit boards to each other. Background Art

[0002] Among connectors that relay high-speed signal transmission between a circuit board and an expansion board, there is a type where the connector mounted on the circuit board side is a socket-type connector, and the connector mounted on the expansion board side is a plug-type connector. By fitting the plug-type connector within the lateral range of the socket-type connector, the terminals of the two connectors are connected. As an example, such a connector is called a "mezzanine connector".

[0003] As an example of a document that discloses technology related to such a connector, there is Patent Document 1. The connector described in this document has a box-shaped housing and contacts arranged side by side on the wall surface. On the bottom surface of the housing of this connector, there are protrusions that are inserted into positioning holes on the circuit board, and contacts are provided in the lateral range on the side of the housing opposite to the side where the protrusions are present. When this connector is surface-mounted onto the circuit board by reflow soldering, the contacts of the connector and the pads of the circuit board are electrically connected via solder.

[0004] [Patent Document 1] Japanese Unexamined Patent Application Publication No. 2018-113146

[0005] Then, the housing of such a connector has a rotationally symmetric shape. Therefore, the socket-type connector has a problem that it is prone to cause so-called reverse insertion, that is, inserting the plug-type connector in the opposite orientation to the original orientation. Summary of the Invention

[0006] The present invention has been completed in view of such problems, and its object is to provide a connector that is difficult to cause reverse insertion.

[0007] To solve the above problems, a connector as a preferred embodiment of the present invention includes a plurality of socket-type connectors mounted on a first substrate and a plurality of plug-type connectors mounted on a second substrate, which electrically connect the first substrate and the second substrate. The socket-type connector includes: a housing having a slot; and a plurality of contacts arranged in the slot. The plug-type connector includes: a housing having a head portion that fits into the slot; and a plurality of contacts arranged in the head portion. The housing of the socket-type connector and the housing of the plug-type connector have a rotationally asymmetric shape when viewed from the fitting direction.

[0008] In this manner, it is also possible that the housing of the socket-type connector has: a bottom; two first wall portions that face each other in a first direction orthogonal to the fitting direction so as to surround the slot; and two second wall portions that face each other in a second direction orthogonal to the fitting direction and the first direction. The slot is divided into a plurality of slots by a partition wall extending along the first direction. One end portion of the partition wall is connected to one of the two first wall portions on both sides in the first direction, and the other end of the partition wall is not connected to the other first wall portion, and a gap is formed between the other end of the partition wall and the other first wall portion.

[0009] Alternatively, the housing of the plug-type connector may have a plurality of the first portions, and the plurality of first portions extend along the first direction, and a fitting plate portion that fits into the gap is provided between one end portions in the first direction of adjacent plurality of first portions.

[0010] Alternatively, a part of the plurality of socket-type connectors and the remaining socket-type connectors other than the part are mounted on the first substrate in such a manner that the orientations of the gaps are opposite to each other, and the plug-type connectors that are fitted to the part of the socket-type connectors among the plurality of plug-type connectors and the remaining plug-type connectors other than the part are mounted on the second substrate in such a manner that the orientations of the fitting plate portions are opposite to each other.

[0011] Alternatively, in one of the socket-type connectors, the number of the slots is two, and in one of the plug-type connectors, the number of the first portions is two.

[0012] Alternatively, the contact positions on one side and the contact positions on the other side of the contacts respectively arranged on both sides of the slot and the first portion are offset by half a contact.

[0013] As a connector kit according to another preferred embodiment of the present invention, it includes the above-mentioned socket-type connector and a first cover that is assembled to the plurality of socket-type connectors when the plurality of socket-type connectors are mounted on a substrate. It is characterized in that a round hole is provided at one end portion of the socket-type connector, a positioning pin that fits into the round hole is provided at one end portion of the first cover, a long hole is provided at the other end of the socket-type connector, and a positioning long pin that fits into the long hole is provided at the other end of the first cover.

[0014] In this manner, it is also possible that a snap ring is provided on the first cover. When the positioning pin is inserted into the round hole, the positioning long pin is inserted into the long hole, and the snap ring is inserted into the inner side of the wall portion of the socket-type connector to assemble the first cover to the socket-type connector, the socket-type connector is supported from the inside by the snap ring of the first cover.

[0015] Alternatively, on the inner surface of one side of the slot in the wall portion of the socket-type connector, a engaging piece protruding toward one side of the slot is provided, the lower end portion of the hook spring protrudes outward, and the lower end portion of the hook spring is configured to engage with the engaging piece.

[0016] The present invention includes a plurality of socket-type connectors mounted on a first substrate and a plurality of plug-type connectors mounted on a second substrate, electrically connecting the first substrate and the second substrate. The socket-type connector includes a housing having a slot and a plurality of contacts arranged in the slot. The plug-type connector includes a housing having a head portion that fits into the slot and a plurality of contacts arranged in the head portion. The housing of the socket-type connector and the housing of the plug-type connector have a rotationally asymmetric shape when viewed from the fitting direction. Therefore, a connector that is difficult to be inserted reversely can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a perspective view of a socket-type connector 1 and a plug-type connector 2 according to an embodiment of the present invention.

[0018] Figure 2 is Figure 1 a perspective view of the socket-type connector 1 and a first cover 100 assembled to the socket-type connector 1.

[0019] Figure 3 is Figure 1 a perspective view of the plug-type connector 2 and a second cover 200 assembled to the plug-type connector 2.

[0020] Figure 4 is Figure 2 an exploded view of the socket-type connector 1.

[0021] Figure 5 is Figure 3 an exploded view of the plug-type connector 2.

[0022] Figure 6 is Figure 4 a perspective view of the first housing 10 of the socket-type connector 1.

[0023] Figure 7 is Figure 5 a perspective view of the second housing 20 of the plug-type connector 2.

[0024] Figure 8 is Figure 4 of the socket-type connector 1 and Figure 5 a perspective view of the solder joint terminal 7 of the plug-type connector 2.

[0025] Figure 9 isFigure 4 Schematic diagram of the contact 8 of the socket-type connector 1 and Figure 5 the plug-type connector 2.

[0026] Figure 10 is a perspective view of the first cover 100 observed from the opposite side Figure 2 thereof.

[0027] Figure 11 is a perspective view of the second cover 200 observed from the opposite side Figure 3 thereof.

[0028] In Figure 12 , (A) is a line cross-sectional view of a cross-section parallel to the XZ plane of Figure 1 , and (B) is an enlarged view of the F frame in (A).

[0029] In Figure 13 , (A) is a view of Figure 1 observed from the -Z side, (B) is a D-D line cross-sectional view of (A), and (C) is an enlarged view of the E frame in (B).

[0030] Figure 14 is a cross-sectional view of the component after assembling the socket-type connector 1 to the first cover 100, which is parallel to the XZ plane.

[0031] In Figure 15 , (A) is a view showing the expansion of the socket-type connector 1 during reflow, (B-1) is a view showing the expansion of the plug-type connector 2 during reflow when the thermal expansion rate of the socket-type connector 1 and the thermal expansion rate of the material of the plug-type connector 2 are almost the same, and (B-2) is a view showing the expansion of the plug-type connector 2 during reflow when the thermal expansion rate of the material of the plug-type connector 2 is smaller than the thermal expansion rate of the socket-type connector 1.

[0032] Description of reference numerals

[0033] 1 Socket-type connector; 2 Plug-type connector; 7 Solder lap terminal; 8 Contact; 10 First housing; 11 Wall portion; 12 Wall portion; 13 Bottom; 17 Partition; 18 Gap; 19 Slot; 20 Second housing; 23 Bottom; 29 Head; 31 Round hole; 33 Long hole; 34 Bonding piece; 35 Angular groove; 36 Groove; 41 Round hole; 45 Angular hole; 46 Groove; 48 Fitting plate portion; 51 First substrate; 52 Second substrate; 71 Substrate portion; 72 Tab portion; 81 Straight portion; 82 Terminal portion; 83 Fork portion; 100 First cover; 111 Wall portion; 112 Wall portion; 113 Top cover portion; 130 First opening; 134 Lower end portion; 135 Spring; 136 Spring receiving portion; 200 Second cover; 211 Wall portion; 212 Wall portion; 213 Top cover portion; 227 Retaining piece portion; 229 Retaining piece portion; 230 Second opening. Detailed implementation mode

[0034] Hereinafter, while referring to the drawings, the socket connector 1, the plug connector 2, the first cover 100, and the second cover 200 of the connector kit as one embodiment of the present invention will be described. The socket connector 1 and the plug connector 2 are arranged side by side in multiples (in the Figure 1 example, 4), and are respectively mounted on the first substrate 51 and the second substrate 52 formed of a material having a smaller coefficient of thermal expansion than the first substrate 51. For example, the material of the first substrate 51 is FR4 (Flame Retardant Type 4), and the material of the second substrate 52 is ceramic.

[0035] When the head 29 of the plug connector 2 on the second substrate 52 is fitted into the slot 19 of the socket connector 1 on the first substrate 51, the contact 8 of the socket connector 1 and the contact 8 of the plug connector 2 are electrically connected, and high-speed differential transmission based on PAM (Pulse Amplitude Modulation) can be performed.

[0036] When the socket connector 1 is reflow-mounted on the first substrate 51, the first cover 100 is assembled to the socket connector 1. When the plug connector 2 is reflow-mounted on the second substrate 52, the second cover 200 is assembled to the plug connector 2.

[0037] In the following description, the fitting direction of the socket connector 1 to the plug connector 2 is appropriately referred to as the Z direction, one direction orthogonal to the Z direction is appropriately referred to as the X direction, and the direction orthogonal to both the Z direction and the X direction is appropriately referred to as the Y direction. In addition, the +Z side is sometimes referred to as the upper side, the -Z side is referred to as the lower side, the +X side is referred to as the front side, the -X side is referred to as the rear side, the +Y side is referred to as the left side, and the -Y side is referred to as the right side.

[0038] As Figure 4 shown, the socket connector 1 has a first housing 10, a solder joint terminal 7, and a contact 8. As Figure 5 shown, the plug connector 2 has a second housing 20, a solder joint terminal 7, and a contact 8. The first housing 10 of the socket connector 1 and the second housing 20 of the plug connector 2 are formed by injecting resin along the X direction as the long side direction. The first housing 10 of the socket connector 1 and the second housing 20 of the plug connector 2 have a rotationally asymmetric shape.

[0039] If described in more detail, two slots 19 are provided in the first housing 10 of the socket-type connector 1. The two slots 19 extend along the X direction. The first housing 10 has: a bottom 13 that forms the bottom of the housing 10; a wall portion 11 and a wall portion 12 that face each other in the X direction and the Y direction so as to surround the slots 19; and a partition wall 17 that separates the two slots 19 in the lateral range surrounded by the wall portion 11 and the wall portion 12. The wall portion 11 extends along the -Y direction, and the wall portion 12 extends along the X direction.

[0040] The -X side end of the partition wall 17 is connected to the -X side wall portion 11. The +X side end of the partition wall 17 is not connected to the +X side wall portion 11, and a gap 18 is formed between the +X side end of the partition wall 17 and the +X side wall portion 11.

[0041] In the middle of the Y direction in the -X side wall portion 11, a round hole 31 is provided. In the middle of the Y direction in the +X side wall portion 11, a long hole 33 is provided. The +X side of the long hole 33 is open. On the +Y side and -Y side of the holes in the -X side wall portion 11 and the +X side wall portion 11, angled grooves 35 are provided. The angled grooves 35 are recessed from the upper surface of the wall portion 11 toward the bottom 13. A hole is drilled through the bottom of the angled groove 35, and a solder lapping terminal 7 is inserted and fixed in the hole. As Figure 8 shown, the solder lapping terminal 7 has an elongated substrate portion 71 and two tab portions 72 that stand up from both ends of one long side of the substrate portion 71. The two tab portions 72 are inserted into the bottom holes of the angled grooves 35 of the first housing 10.

[0042] As Figure 14 shown, on the lower side of the inner surface of one side of the slot 19 in the +X side and -X side wall portions 11, there are engaging pieces 34 that protrude toward one side of the slot 19.

[0043] On the inner surface of the wall portion 12 and the side surface of the partition wall 17, grooves 36 are provided. In the grooves 36, contacts 8 are received. As Figure 10 shown, the contact 8 has a straight portion 81 that extends in one direction, a terminal portion 82 at one end of the straight portion 81, and a fork portion 83 at the other end of the straight portion 81. The terminal portion 82 is bent into a "く" shape. The fork portion 83 is divided into two branches. In the fork portion 83, solder 9 is riveted and fixed. The contact 8 is held in the grooves 36 of the wall portion 12 and the partition wall 17, and the fork portion 83 of the contact 8 and the solder 9 are exposed through the hole in the bottom 13 to the side opposite to one side of the grooves 36.

[0044] As Figure 2 And Figure 10As shown, the first cover 100 has a box shape with a width slightly larger than that of a component formed by arranging four socket-type connectors 1 side by side in the X direction and the Y direction. On the -Z side of the first cover 100, a first opening 130 is provided. The first cover 100 has a top cover portion 113 that serves as the ceiling of the first cover 100, and wall portions 111 and 112 that face each other in the X direction and the Y direction with the first opening 130 therebetween.

[0045] At positions corresponding to the respective slots 19 of the four first housings 10 inside the -X side wall portion 112 and the +X side wall portion 112, a retaining ring spring 135 and a spring receiving portion 136 are provided. As Figure 14 shown, the lower end portion 134 of the retaining ring spring 135 protrudes outward in a triangular shape.

[0046] At positions corresponding to the round holes 31 between the spring receiving portions 136 adjacent to each other inside the -X side wall portion 112, a positioning pin is provided. The positioning pin has a shape that fits into the round hole 31. At positions corresponding to the long holes 33 between the spring receiving portions 136 adjacent to each other inside the +X side wall portion 112, a positioning long pin is provided. The positioning long pin has a shape that fits into the long hole 33.

[0047] The assembly of the first cover 100 to the socket-type connector 1 and its reflow mounting are carried out as follows. First, the four socket-type connectors 1 are arranged such that the orientation of the gap 18 of a part of the socket-type connectors 1 is opposite to the orientation of the gap 18 of the remaining socket-type connectors 1 (for example, the gaps 18 of the two middle socket-type connectors 1 are on the -X side, and the gaps 18 of the two end socket-type connectors 1 are on the +X side).

[0048] Next, the first cover 100 is assembled to the four socket-type connectors 1 by inserting the positioning pin into the round hole 31 on the -X side, inserting the positioning long pin into the long hole 33 on the +X side, and fitting the retaining ring spring 135 into the inside of the -X side and +X side wall portions 11. As Figure 14 shown in (A) of Figure 14 and (B) of

[0049] Next, the four socket - type connectors 1 gathered by the first cover 100 are placed at the specified positions on the first substrate 51, and are housed in a reflow device, causing the temperature inside the device to change in the pattern of 20°C → 260°C → 20°C. When the temperature exceeds 217°C, the solder 9 at the front end of the contact 8 melts, and when it returns to room temperature, the solder 9 solidifies. By the solidification of the solder 9, the contact 8 of the socket - type connector 1 and the pad of the first substrate 51 are connected. After the socket - type connector 1 is assembled to the first substrate 51, the first cover 100 is removed from the socket - type connector 1.

[0050] As Figure 5 and Figure 7 shown, in the second housing 20 of the plug - type connector 2, there are provided two head portions 29. The two head portions 29 extend along the X - direction. The - X side, + X side, - Y side, and + Y ends of the bottom 23 that forms the bottom of the two head portions 29 of the second housing 20 protrude outward to the part that supports the head portions 29. Between the - X - side ends of the two adjacent head portions 29 in the second housing 20, there is provided a fitting plate portion 48.

[0051] At the exact middle in the Y - direction of the - X - side end of the bottom 23, there is provided a round hole 41. At the exact middle in the Y - direction of the + X - side end of the bottom 23, there is provided a second long hole. The + X side of the second long hole is open. At the + Y side and - Y side of the holes in the - X side and + X side ends of the bottom 23, there are provided corner holes 45. The solder - lapping terminals 7 are embedded and fixed in the corner holes 45.

[0052] On the + Y side and - Y side sides of the two head portions 29, there are provided grooves 46. In the grooves 46, the contacts 8 are housed. The contacts 8 are held in the grooves 46 of the head portions 29, and the fork portions 83 of the contacts 8 and the solder 9 are exposed to the side opposite to one side of the groove 46 through the holes in the bottom 23.

[0053] As Figure 3 and Figure 11 shown, the second cover 200 is in the shape of a box having a width slightly larger in the X - direction and Y - direction than the part formed by arranging four plug - type connectors 2 in parallel. On the - Z side of the second cover 200, there is provided a second opening 230. The second cover 200 has a top cover portion 213 that forms the ceiling of the second cover 200, and wall portions 211 and wall portions 212 that face each other in the X - direction and Y - direction with the second opening 230 in between.

[0054] At the position corresponding to the gap between the head portion 29 of the second housing 20 on the - X side and the inside of the wall portion 211, there is a holding piece portion 227 protruding inward. At the position corresponding to the gap between the head portion 29 of the second housing 20 on the + X side and the inside of the wall portion 211, there is a holding piece portion 229 protruding inward.

[0055] A positioning pin is provided at a position corresponding to the circular hole 41 of the second housing 20 between adjacent retaining piece portions 227 of the wall portion 211 on the -X side. The positioning pin has a shape that can be received in the circular hole 41. The positioning pin is provided with a positioning long pin at a position corresponding to the second long hole of the second housing 20 between adjacent retaining piece portions 229 of the wall portion 211 on the +X side. The positioning long pin has a shape that can be received in the second long hole.

[0056] The assembly of the second cover 200 to the plug-type connector 2 and its reflow mounting are carried out in the following manner. First, the mating plate portion 48 is positioned such that the combination of the connectors on one side and the combination of the connectors on the other side are arranged in the same manner as the combination of the four socket-type connectors 1, and the four plug-type connectors 2 are arranged.

[0057] Next, the positioning pin is inserted into the circular hole 41 on the +X side and the positioning long pin is inserted into the second long hole on the -X side to assemble the second cover 200 onto the four plug-type connectors 2. When the second cover 200 is assembled to the four plug-type connectors 2, the retaining piece portions 227 and 229 of the second cover 200 abut against the head portion 29 of the plug-type connector 2, and the four socket-type connectors 1 are supported from the outside in the X direction by the retaining piece portions 227 and 229 of the second cover 200.

[0058] Next, the four plug-type connectors 2 gathered by the second cover 200 are placed at the specified positions on the second substrate 52 and received in the reflow device, and the temperature inside the device is changed in the manner of 20°C → 260°C → 20°C. When the temperature exceeds 217°C, the solder 9 at the front end of the contact 8 melts, and when it returns to room temperature, the solder 9 solidifies. By the solidification of the solder 9, the contact 8 of the plug-type connector 2 and the solder pad of the second substrate 52 are connected. After the plug-type connector 2 is assembled on the second substrate 52, the second cover 200 is removed from the plug-type connector 2.

[0059] The mating plate portion 48 of the plug-type connector 2 is inserted into the gap 18 of the socket-type connector 1 when the plug-type connector 2 and the socket-type connector 1 are connected in the correct orientation, and interferes with the head portion 29 of the socket-type connector 1 when the plug-type connector 2 and the socket-type connector 1 are connected in the wrong orientation. If the plug-type connector 2 and the socket-type connector 1 are in the opposite orientation, the mating plate portion 48 and the head portion 29 interfere with each other, thus preventing the reverse insertion of the plug-type connector 2 and the socket-type connector 1.

[0060] As Figure 13 shown in (B) and Figure 13 shown in (C), when the plug-type connector 2 and the socket-type connector 1 are connected in the correct orientation, the contact 8 of the plug-type connector 2 and the contact 8 of the socket-type connector 1 are in contact. In addition, as Figure 12 shown in (A) and Figure 12As shown in (B) thereof, among the contacts 8 disposed opposite to each other on both sides of the head portion 29 and the slot 19, the positions of the contacts 8 on the -Y side and the positions of the contacts 8 on the +Y side are offset by 1 / 2 a contact in the X direction. The positions of the contacts 8 on the -Y side and the positions of the contacts 8 on the +Y side are offset by 1 / 2 a contact in the X direction in order to effectively prevent crosstalk.

[0061] Here, the first cover 100 and the second cover 200 are formed of different types of resin, and the thermal expansion rate of the material of the second cover 200 is smaller than that of the material of the first cover 100. More specifically, the thermal expansion rate of the second cover 200 in the Y direction, which is the juxtaposition direction of the four socket-type connectors 1, is set as α11, the thermal expansion rate of the first substrate 51 in the Y direction is set as α11, the thermal expansion rate of the second cover 200 in the Y direction is taken as α20, that is, the thermal expansion rate of the second substrate 52 in the Y direction is taken as α20, then α11 / α10≈α21 / α20. This is to control the error between the mounting positions of the contacts 8 of the socket-type connector 1 on the first substrate 51 and the mounting positions of the contacts 8 of the plug-type connector 2 on the second substrate 52 to be less than 0.15 mm.

[0062] By making the thermal expansion rate of the second cover 200 smaller than that of the first cover 100, the mounting position error between the socket-type connector 1 and the plug-type connector 2 can be reduced, and the reason is as described below.

[0063] Figure 15 of (A) and Figure 15 As shown in (B-1) thereof, in the reflow mounting, when the temperature in the reflow device becomes high, the first cover 100, the first housing 10, the first substrate 51, the second cover 200, the second housing 20, and the second substrate 52 expand in the Y direction, and when the temperature returns to normal temperature, they contract.

[0064] Along with the expansion of the first cover 100, the distance between adjacent contacts 8 in the first housing 10 of the socket-type connector 1 becomes wider, and the position of the contacts 8 of the socket-type connector 1 at the moment when the melting temperature of the solder 9 is exceeded and reaches 260 °C is the mounting position of the contacts 8 on the first substrate 51. Similarly, the position of the contacts 8 of the plug-type connector 2 at the moment when it reaches 260 °C is the mounting position of the contacts 8 on the second substrate 52.

[0065] As described above, compared with FR4, which is the material of the first substrate 51, the ceramic, which is the material of the second substrate 52, has a small coefficient of thermal expansion. Therefore, if the first cover 100 and the second cover 200 are made of materials with almost the same coefficient of thermal expansion as the first substrate 51, during the period of returning from 260 °C to 20 °C, the first substrate 51 shrinks, and the interval between the contacts 8 of the socket-type connector 1 returns to the original state. In contrast, the second substrate 52 hardly shrinks, and the interval between the contacts 8 of the socket-type connector 1 remains in the state where it has become larger due to expansion. As a result, the error in the mounting positions of the socket-type connector 1 and the plug-type connector 2 becomes larger.

[0066] In contrast, as Figure 15 (B-2) shown, if the coefficient of thermal expansion of the second cover 200 is reduced compared to the coefficient of thermal expansion of the first cover 100, the interval between the contacts 8 of the plug-type connector 2 at the moment of reaching 260 °C is smaller than in the case where the coefficients of thermal expansion are the same. Therefore, when returning from 260 °C to 20 °C, the error in the mounting positions of the socket-type connector 1 and the plug-type connector 2 becomes smaller.

[0067] The above are the details of this embodiment. The connector kit of this embodiment includes: a socket-type connector 1 as the first connector; a first cover 100 that is assembled to the socket-type connector 1 when the socket-type connector 1 is reflow-mounted on the first substrate 51; a plug-type connector 2 as the second connector; and a second cover 200 that is assembled to the plug-type connector 2 when the plug-type connector 2 is reflow-mounted on a second substrate 52 made of a material with a smaller coefficient of thermal expansion than the first substrate 51. The second cover 200 is formed of a material with a smaller coefficient of thermal expansion than the first cover 100. Thereby, the difference in the coefficients of thermal expansion of the material of the circuit board on which the socket-type connector 1 is mounted and the material of the circuit board on which the plug-type connector 2 is mounted can be absorbed, and the error in the mounting position can be reduced.

[0068] In addition, the connector of this embodiment includes a plurality of socket-type connectors 1 mounted on the first substrate 51 and a plurality of plug-type connectors 2 mounted on the second substrate 52. The socket-type connector 1 includes a first housing 10 having a slot 19 and a plurality of contacts 8 arranged in the slot 19. The plug-type connector 2 includes a second housing 20 having a head 29 that fits into the slot 19 and a plurality of contacts 8 arranged in the head 29. Thus, the first housing 10 of the socket-type connector 1 and the second housing 20 of the plug-type connector 2 have a rotationally asymmetric shape when viewed from the fitting direction. Thereby, a connector that is difficult to be inserted reversely can be provided.

[0069] In addition, in this embodiment, the slot 19 of the socket-type connector 1 and the head 29 of the plug-type connector 2 are in two rows. Therefore, compared with the existing one-row connector, it is possible to make it difficult to apply stress to the solder 9 part.

[0070] The above describes the embodiments of the present invention. However, the following variations can also be added to these embodiments.

[0071] (1) In the above embodiment, the number of connectors mounted on the substrate capped and gathered can be 2 to 3, or can be 4 or more.

[0072] (2) In the above embodiment, the number of columns of the slots 19 in one socket-type connector 1 and the number of columns of the heads 29 in one plug-type connector 2 can be 1 column, or can be 3 columns or more.

Claims

1. A connector includes a plurality of socket-type connectors mounted on a first substrate and a plurality of plug-type connectors mounted on a second substrate, for electrically connecting the first substrate and the second substrate, characterized in that: The socket-type connector includes: a housing having a slot; and a plurality of contacts arranged in the slot. The plug-type connector includes: a housing having a head portion that fits into the slot; and a plurality of contacts arranged in the head portion. The housing of the socket-type connector and the housing of the plug-type connector have a rotationally asymmetric shape when viewed from the fitting direction. Among the contacts arranged on both sides of the slot and the head portion, the positions of the contacts on one side and the positions of the contacts on the other side are offset by half a contact in a first direction that is orthogonal to the fitting direction and parallel to the slot. When G represents a contact for ground connection and S represents a contact for signal transmission, the contacts are arranged to respectively include a plurality of contact groups that are adjacently arranged in the order of GSSG in the first direction, and there is a space between the contact groups in the first direction.

2. The connector according to claim 1, characterized in that: The housing of the socket-type connector has: a bottom; two first wall portions that face each other in a first direction orthogonal to the fitting direction so as to surround the slot; and two second wall portions that face each other in a second direction orthogonal to the fitting direction and the first direction. The slot is divided into a plurality of slots by a partition wall extending along the first direction. One end portion of the partition wall is connected to one of the two first wall portions on both sides in the first direction, and the other end of the partition wall is not connected to the other first wall portion, and a gap is formed between the other end of the partition wall and the other first wall portion.

3. The connector according to claim 2, characterized in that: The housing of the plug-type connector has a plurality of the head portions that extend along the first direction, and a fitting plate portion that fits into the gap is provided between one end portions in the first direction of adjacent plurality of head portions.

4. The connector according to claim 3, characterized in that: Among the plurality of socket-type connectors, a part of the socket-type connectors and the remaining socket-type connectors other than them are mounted on the first substrate with the orientations of the gaps being opposite. Among the plurality of plug-type connectors, the plug-type connectors that fit into the part of the socket-type connectors and the remaining plug-type connectors other than them are mounted on the second substrate with the orientations of the fitting plate portions being opposite.

5. The connector according to any one of claims 1 to 4, characterized in that: In one socket-type connector, the number of the slots is two. In one plug-type connector, the number of the head portions is two.

6. A connector kit includes: the socket-type connector according to any one of claims 1 to 5 and a first cover that is assembled to the plurality of socket-type connectors when mounting the plurality of socket-type connectors on a substrate, characterized in that: A round hole is provided at one end of the socket-type connector, a positioning pin that fits into the round hole is provided at one end of the first cover, a long hole is provided at the other end of the socket-type connector, and a positioning long pin that fits into the long hole is provided at the other end of the first cover.

7. The connector kit according to claim 6, wherein a snap spring is provided on the first cover, when the positioning pin is inserted into the round hole, the positioning long pin is inserted into the long hole, and the snap spring is fitted inside the wall portion of the socket-type connector to assemble the first cover to the socket-type connector, the socket-type connector is supported from the inside by the snap spring of the first cover.

8. The connector kit according to claim 7, wherein a engaging piece protruding toward one side of the slot is provided on the inner surface of one side of the slot in the wall portion of the socket-type connector, the lower end portion of the snap spring protrudes outward, the lower end portion of the snap spring is configured to engage with the engaging piece.

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