Heat dissipation device

Abstract

A heat dissipation device is used to fill with a working fluid. The heat dissipation device includes a base, at least one heat dissipation fin, and at least one fluid replenisher. The base has at least one internal flow channel and is used to fill with the working fluid. At least one heat dissipation fin has an extended flow channel and an inlet and an outlet communicating with the extended flow channel. At least one heat dissipation fin is inserted into one side of the base, and the extended flow channel is communicated with at least one internal flow channel through the connected inlet and outlet. At least one fluid replenisher is connected to at least one internal flow channel.

Description

Technical Field

[0001] The present invention relates to a heat dissipation device, particularly a liquid-cooled heat dissipation device. Background Art

[0002] With the continuous improvement of the operating frequency and speed of electronic components, the heat generated per unit volume of electronic components increases accordingly. However, due to limitations in machining, the heat dissipation areas of traditional simple aluminum extrusion and die-casting heat dissipation fins are extremely limited, and the area for exchanging heat with the surrounding air is not large. Even with the use of a fan, heat cannot be dissipated in a timely and sufficient manner. Such heat dissipation fins no longer meet the current heat dissipation requirements of electronic manufacturers. Summary of the Invention

[0003] The present invention aims to provide a heat dissipation device to improve the heat dissipation efficiency of the heat dissipation device.

[0004] The heat dissipation device disclosed in an embodiment of the present invention is used for filling with a working fluid. The heat dissipation device includes a base, at least one heat dissipation fin, and at least one fluid replenisher. The base has at least one internal flow channel and is used for filling with the working fluid. At least one heat dissipation fin has an extended flow channel and an inlet and an outlet communicating with the extended flow channel. At least one heat dissipation fin is inserted on one side of the base, and the extended flow channel is communicated with at least one internal flow channel through the connected inlet and outlet. At least one fluid replenisher is connected to at least one internal flow channel.

[0005] The heat dissipation device disclosed in another embodiment of the present invention is used for filling with a working fluid. The heat dissipation device includes a base, at least one heat dissipation fin, and at least one fluid driver. The base has at least one internal flow channel and is used for filling with the working fluid. At least one heat dissipation fin has an extended flow channel and an inlet and an outlet communicating with the extended flow channel. At least one heat dissipation fin is inserted on one side of the base, and the extended flow channel is communicated with at least one internal flow channel through the connected inlet and outlet. At least one fluid driver is connected to at least one internal flow channel.

[0006] The heat dissipation device disclosed in another embodiment of the present invention is used for filling with a working fluid. The heat dissipation device includes a base and at least one heat dissipation fin. The base has at least one internal flow channel and is used for filling with the working fluid. The at least one heat dissipation fin has an extended flow channel and an inlet and an outlet communicating with the extended flow channel. The at least one heat dissipation fin is inserted on one side of the base, and the extended flow channel is communicated with the at least one internal flow channel through the connected inlet and outlet. Wherein, the internal flow channel has an inlet section, an outlet section, a first flow section, a second flow section, a third flow section, a fourth flow section, a fifth flow section, a sixth flow section and a plurality of connection sections. The inlet section and the outlet section are respectively communicated with the outlet and the inlet of the extended flow channel. The first flow section is communicated with the inlet section. The second flow section is communicated with the first flow section. The third flow section is communicated with the second flow section. The fourth flow section is communicated with the third flow section through these connection sections. The fifth flow section is communicated with the fourth flow section. The sixth flow section connects the fifth flow section and the outlet section.

[0007] According to the heat dissipation device of the above embodiment, through the connection between the internal flow channel and the extended flow channel, after the working fluid absorbs the heat energy transferred by the heat source, heat convection is generated in the internal flow channel and the extended flow channel, thereby forming a cooling cycle. In this way, in addition to the two-dimensional conduction formed by the base, the heat dissipation device further forms a third-dimensional conduction through the heat dissipation fins, so that the heat dissipation device achieves a three-dimensional uniform temperature effect, thereby improving the heat dissipation efficiency of the heat dissipation device.

[0008] The above description of the content of the present invention and the following description of the embodiments are used to demonstrate and explain the principle of the present invention and provide a further explanation of the scope of the patent application of the present invention. Brief Description of the Drawings

[0009] Figure 1 It is a three-dimensional view of the heat dissipation device according to the first embodiment of the present invention.

[0010] Figure 2 is Figure 1 exploded view of.

[0011] Figure 3 is Figure 1 partial sectional view of.

[0012] Figure 4 is Figure 1 another sectional view of.

[0013] Figure 5 It is a three-dimensional view of the heat dissipation device according to the second embodiment of the present invention.

[0014] Figure 6 is Figure 5 exploded view of.

[0015] Figure 7 is Figure 5Partial sectional view.

[0016] Figure 8 is Figure 5 Another sectional view.

[0017] Figure 9 It is a sectional view of the heat dissipation device according to the third embodiment of the present invention.

[0018] Wherein, reference numerals:

[0019] 10, 10a, 10b Heat dissipation device

[0020] 100, 100a, 100b Base

[0021] 110 First side

[0022] 111 Accommodating groove

[0023] 112 First groove bottom surface

[0024] 113 Second groove bottom surface

[0025] 114 Third groove bottom surface

[0026] 120 Second side

[0027] 121 First bearing section

[0028] 122 Second bearing section

[0029] 123 Third bearing section

[0030] 130 Assembly slot

[0031] 150 Connecting slot

[0032] 200, 200a Heat dissipation fins

[0033] 210 Cold side

[0034] 220 Hot side

[0035] 221 First section

[0036] 222 Second section

[0037] 223 Third section

[0038] 201, 201a Extended flow channel

[0039] 202, 202a Outlet

[0040] 203, 203a Inlet

[0041] 300 Fluid replenisher

[0042] 300a Fluid driver

[0043] Width of D1 - D8

[0044] Directions of F1 - F7

[0045] Internal flow path of S

[0046] Si inlet section

[0047] So outlet section

[0048] S1 First flow - through section

[0049] S2 Second flow - through section

[0050] S3 Third flow - through section

[0051] S4 First connection section

[0052] S5 Second connection section

[0053] S11 First flow - through section

[0054] S12 Second flow - through section

[0055] S13 Third flow - through section

[0056] S14 Fourth flow - through section

[0057] S31 Fifth flow - through section

[0058] S32 Sixth flow - through section

[0059] S33 Seventh flow - through section

[0060] S2 connection section

[0061] S31 Fourth flow - through section

[0062] S32 Fifth flow - through section

[0063] S33 Sixth flow - through section

[0064] A1 First direction

[0065] A2 Second direction Specific implementation manner

[0066] Please refer to Figures 1 to 4 . Figure 1 It is a three - dimensional view of the heat dissipation device according to the first embodiment of the present invention. Figure 2 It is Figure 1 exploded view of Figure 3 It is Figure 1 partial sectional view of Figure 4 It is Figure 1 another sectional view of

[0067] The heat dissipation device 10 of this embodiment is used for filling with a working fluid (not shown in the figure). The working fluid is, for example, a cooling fluid such as water or refrigerant. The heat dissipation device 10 includes a base 100, a plurality of heat dissipation fins 200, and two fluid replenishers 300.

[0068] The base 100 has at least one internal flow channel S. The internal flow channel S is used for filling with a working fluid (not shown in the figure). Specifically, the base 100 has a first side surface 110, a second side surface 120, a receiving groove 111, and a plurality of assembly slots 130. The receiving groove 111 is located on the first side surface 110 and is used for receiving a heat source (not shown in the figure). The second side surface 120 faces away from the first side surface 110. These assembly slots 130 are located on the second side surface 120. In addition, the base 100 may also have two sets of connection grooves 150. The two sets of connection grooves 150 are both communicated with the internal flow channel S.

[0069] The heat dissipation fin 200 has an extended flow channel 201 and an outlet 202 and an inlet 203 that communicate with the extended flow channel 201. The extended flow channel 201 is, for example, in a grid shape. The heat dissipation fin 200 is inserted on one side of the base 100, and the extended flow channel 201 is communicated with at least one internal flow channel S through the connected inlet 203 and outlet 202.

[0070] In this embodiment, the second side surface 120 has a first abutting section 121, a second abutting section 122, and a third abutting section 123. The two opposite sides of the second abutting section 122 are respectively connected to the first abutting section 121 and the third abutting section 123, and the second abutting section 122 is closer to the first side surface 110 than the first abutting section 121, and the first abutting section 121 is closer to the first side surface 110 than the third abutting section 123. The assembly slots 130 are distributed on the first abutting section 121, the second abutting section 122, and the third abutting section 123. The heat dissipation fin 200 has a relatively cold side 210 and a relatively hot side 220. The hot side 220 has a first section 221, a second section 222, and a third section 223. The first section 221, the second section 222, and the third section 223 respectively abut against the first abutting section 121, the second abutting section 122, and the third abutting section 123.

[0071] The two fluid replenishers 300 are respectively located in the two sets of connection grooves 150 on the opposite sides of the base 100. The two fluid replenishers 300 are connected to the internal flow channel S. After the working fluid (not shown in the figure) absorbs the heat energy transferred by the heat source, heat convection is generated in at least one internal flow channel S and the extended flow channel 201, thereby forming a cooling cycle. Since the heat dissipation device 10 circulates through the heat convection of the working fluid, for example, no capillary structure is provided in at least one internal flow channel S and the extended flow channel 201 of this embodiment.

[0072] In this embodiment, the number of the assembly slots 130 and the heat dissipation fins 200 is multiple, but it is not limited thereto. In other embodiments, the number of the assembly slots 130 and the heat dissipation fins 200 may also be single. In addition, in this embodiment, the number of the two sets of connection slots 150 and the fluid replenisher 300 is two, but it is not limited thereto. In other embodiments, the number of the two sets of connection slots 150 and the fluid replenisher 300 may also be only single.

[0073] As Figure 4 shown, the internal flow channel S of this embodiment has an inlet section Si, an outlet section So, a first flow section S1, a second flow section S2, a third flow section S3, a first connection section S4 and a second connection section S5. The first flow section S1 and the third flow section S3 are respectively communicated with the inlet section Si and the outlet section So, and the opposite ends of the second flow section S2 are respectively communicated with the first flow section S1 and the third flow section S3 through the first connection section S4 and the second connection section S, and the second flow section S2 is closer to the first side surface 110 than the first flow section S1, and the first flow section S1 is closer to the first side surface 110 than the third flow section S3. The fluid replenisher 300 is communicated with the first flow section S1 to maintain the working fluid volume inside the internal flow channel S and the extended flow channel 201.

[0074] When the heat dissipation device 10 of this embodiment is actually used, for example, it is placed vertically, that is, the horizontal height of the second flow section S2 is higher than the horizontal height of the first flow section S1, and the horizontal height of the third flow section S3 is higher than the horizontal height of the second flow section S2. In addition, since the flow resistance of the first flow section S1 is smaller than the flow resistance of the inlet section Si and the outlet section So, and the fluid pressure in the extended flow channel 201 of the heat dissipation fins 200 is greater than the fluid pressure in the internal flow channel S of the base 100, after the working fluid absorbs the heat energy transferred by the heat source, it flows along the direction F1 to the direction F7 due to the influence of heat convection and gravity, thereby forming a cooling cycle. The so-called flow resistance of the first flow section S1 is smaller than the flow resistance of the inlet section Si and the outlet section So, for example, the overall dimension of the first flow section S1 in the horizontal cross-section is larger than the overall dimension of the inlet section Si and the outlet section So in the vertical cross-section.

[0075] This embodiment takes the fluid replenisher 300 being communicated with the first flow section S1 as an example, that is, the fluid replenisher 300 is close to the bottom of the internal flow channel S, but it is not limited thereto. In other embodiments, the fluid replenisher may also be changed to be communicated with the third flow section S3, that is, the fluid replenisher is changed to be close to the top of the internal flow channel.

[0076] In this embodiment, the extending directions of the first flow section S1, the second flow section S2, and the third flow section S3 are different from the extending directions of the first connecting section S4 and the second connecting section S5. For example, the extending directions of the first flow section S1, the second flow section S2, and the third flow section S3 are substantially perpendicular to the extending directions of the first connecting section S4 and the second connecting section S5. The so-called substantially perpendicular means perpendicular or nearly perpendicular. However, the extending directions of the first flow section S1, the second flow section S2, the third flow section S3, the first connecting section S4, and the second connecting section S5 are not used to limit the present invention. In other embodiments, the first connecting section and the second connecting section can also be changed to a ramp and form an acute angle with the first flow section, the second flow section, and the third flow section.

[0077] In this embodiment, the base 100 has a first groove bottom surface 112, a second groove bottom surface 113, and a third groove bottom surface 114 located in the accommodating groove 111. The first groove bottom surface 112, the second groove bottom surface 113, and the third groove bottom surface 114 respectively correspond to the first flow section S1, the second flow section S2, and the third flow section S3. The opposite sides of the second groove bottom surface 113 are respectively connected to the first groove bottom surface 112 and the second groove bottom surface 113, and the second groove bottom surface 113 is closer to the first side surface 110 than the first groove bottom surface 112, and the first groove bottom surface 112 is closer to the first side surface 110 than the third groove bottom surface 114. In addition, the first groove bottom surface 112, the second groove bottom surface 113, and the third groove bottom surface 114 are respectively used for thermally contacting different heat sources.

[0078] In this embodiment, the width D1 of the first flow section S1 is greater than the width D2 of the second flow section S2, and the width D3 of the third flow section S3 is greater than the width D1 of the first flow section S1. Also, the widths D4, D5 of the first connecting section S4 and the second connecting section S5 are greater than the width D3 of the third flow section S3.

[0079] Please refer to Figures 5 to 8 。 Figure 5 is a perspective view of the heat dissipation device according to the second embodiment of the present invention. Figure 6 is Figure 5 exploded view of Figure 7 is Figure 5 partial sectional view of Figure 8 is Figure 5 another sectional view of

[0080] The heat dissipation device 10a is used for filling with a working fluid (not shown in the figure). The working fluid is, for example, a cooling fluid such as water or refrigerant. The heat dissipation device 10a includes a base 100a, a plurality of heat dissipation fins 200a, and a fluid driver 300a.

[0081] The base 100a has an internal flow channel S. The internal flow channel S is used for filling with a working fluid (not shown in the figure). The heat dissipation fin 200a has an extended flow channel 201a, an outlet 202a and an inlet 203a that communicate with the extended flow channel 201a. The heat dissipation fin 200a is inserted on one side of the base 100a, and the extended flow channel 201a is communicated with the internal flow channel S through the connected inlet 203a and outlet 202a. The fluid driver 300a is, for example, a pump and is connected to the internal flow channel S to drive the working fluid to perform a cooling cycle in the internal flow channel S and the extended flow channel 201a.

[0082] Specifically, the internal flow channel S has an inlet section Si, an outlet section So, a first flow section S11, a second flow section S12, a third flow section S13, a fourth flow section S14, a fifth flow section S31, a sixth flow section S32, a seventh flow section S33 and a plurality of connecting sections S2. The inlet section Si and the outlet section So communicate with the outlet 202a and the inlet 203a of the extended flow channel 201a respectively. The first flow section S11 communicates with the inlet section Si. The second flow section S12 communicates with the first flow section S11. The third flow section S13 communicates with the second flow section S12 through the fluid driver 300a. The fourth flow section S14 communicates with the third flow section S13. The fifth flow section S31 communicates with the fourth flow section S14 through these connecting sections S2. The sixth flow section S32 communicates with the fifth flow section S31. The seventh flow section S33 connects the sixth flow section S32 and the outlet section So.

[0083] In this embodiment, the first flow section S11, the fourth flow section S14, the fifth flow section S31 and the seventh flow section S33 extend along the first direction A1, and the second flow section S12, the third flow section S13, the sixth flow section S32 and the plurality of connecting sections S2 extend along the second direction A2. The second direction A2 is substantially perpendicular to the first direction A1, but is not limited thereto. In other embodiments, the second direction A2 may also form an acute angle or an obtuse angle with the first direction A1.

[0084] In this embodiment, the width D7 of these connecting sections S2 is smaller than the widths D6, D8 of the first flow section S11, the second flow section S12, the third flow section S13, the fourth flow section S14, the fifth flow section S31, the sixth flow section S32 and the seventh flow section S33, but is not limited thereto. In other embodiments, the width of these connecting sections may also be greater than the widths of the first flow section, the second flow section, the third flow section, the fourth flow section, the fifth flow section, the sixth flow section and the seventh flow section.

[0085] The heat dissipation device 10a of this embodiment can be placed vertically or horizontally. When the heat dissipation device 10a is placed vertically (the connecting section S2 is parallel to the vertical line), the working fluid can be forced to perform a cooling cycle by the drive of the fluid driver 300a, or can naturally perform a cooling cycle through the heat exchange process of the working fluid. When the heat dissipation device 10a is placed horizontally (the connecting section S2 is parallel to the horizontal line), the working fluid can be forced to perform a cooling cycle by the drive of the fluid driver 300a.

[0086] In the above embodiment, the heat dissipation device 10a has a fluid driver 300a, but it is not limited thereto. Please refer to Figure 9 . Figure 9 It is a sectional view of the heat dissipation device according to the third embodiment of the present invention. In this embodiment, the heat dissipation device only includes a base 100b and heat dissipation fins. Since the structure of the heat dissipation fins is similar to the structure of the above heat dissipation fins 200a, it will not be described in detail.

[0087] The base 100b has an internal flow channel S. The internal flow channel S is used for filling with a working fluid (not shown in the figure). Specifically, the internal flow channel S has an inlet section Si, an outlet section So, a first flow section S11, a second flow section S12, a third flow section S13, a fourth flow section S31, a fifth flow section S32, a sixth flow section S33, and a plurality of connecting sections S2. The inlet section Si and the outlet section So are respectively connected and extended to the outlet 202a and the inlet 203a of the flow channel 201a. The first flow section S11 is connected to the inlet section Si. The second flow section S12 is connected to the first flow section S11. The third flow section S13 is connected to the second flow section S12. The fourth flow section S31 is connected to the third flow section S13 through these connecting sections S2. The fifth flow section S32 is connected to the fourth flow section S31. The sixth flow section S33 connects the fifth flow section S32 and the outlet section So.

[0088] In this embodiment, the first flow section S11, the third flow section S13, the fourth flow section S31, and the sixth flow section S33 extend along the first direction A1, and the second flow section S12, the fifth flow section S32, and the plurality of connecting sections S2 extend along the second direction A2. The second direction A2 is substantially perpendicular to the first direction A1, but it is not limited thereto. In other embodiments, the second direction A2 can also form an acute angle or an obtuse angle with the first direction A1.

[0089] In this embodiment, the width of these connecting sections S2 is smaller than the widths of the first flow section S11, the second flow section S12, the third flow section S13, the fourth flow section S31, the fifth flow section S32, and the sixth flow section S33, but it is not limited thereto. In other embodiments, the width of these connecting sections can also be greater than the widths of the first flow section, the second flow section, the third flow section, the fourth flow section, the fifth flow section, the sixth flow section, and the seventh flow section.

[0090] The heat dissipation device 10b of this embodiment can be placed vertically. When the heat dissipation device 10b is placed vertically (the connecting section S2 is parallel to the vertical line), the working fluid can naturally perform a cooling cycle through the heat exchange process of the working fluid.

[0091] For the heat dissipation device according to the above embodiment, the internal flow channel is connected to the extended flow channel. After the working fluid absorbs the heat energy transferred by the heat source, heat convection is generated in the internal flow channel and the extended flow channel, thereby forming a cooling cycle. In this way, in addition to forming two-dimensional conduction through the base, the heat dissipation device further forms three-dimensional conduction through the heat dissipation fins, so that the heat dissipation device achieves a three-dimensional uniform temperature effect, thereby improving the heat dissipation efficiency of the heat dissipation device.

Claims

1. A heat dissipation device for filling with a working fluid, characterized in that, The heat dissipation device includes: a base having at least one internal flow channel for filling the working fluid; the base has a first side surface, a second side surface, a receiving groove, and at least one assembly slot, the receiving groove is located on the first side surface and is used for receiving a heat source, the second side surface faces away from the first side surface, and the at least one assembly slot is located on the second side surface; at least one heat dissipation fin having an extended flow channel and an inlet and an outlet communicating with the extended flow channel, the at least one heat dissipation fin is inserted on one side of the base, and the extended flow channel is communicated with the at least one internal flow channel through the connected inlet and outlet; and at least one fluid replenisher connected to the at least one internal flow channel; wherein, the at least one internal flow channel has an inlet section, an outlet section, a first flow section, a second flow section, a third flow section, a first connection section, and a second connection section, the first flow section and the third flow section respectively communicate with the inlet section and the outlet section, and opposite ends of the second flow section communicate with the first flow section and the third flow section through the first connection section and the second connection section respectively, the second flow section is closer to the first side surface than the first flow section, and the first flow section is closer to the first side surface than the third flow section, the at least one fluid replenisher is communicated with the first flow section, and the at least one fluid replenisher is close to the bottom of the at least one internal flow channel.

2. The heat dissipation device according to claim 1, wherein, The extending directions of the first flow section, the second flow section, and the third flow section are different from the extending directions of the first connection section and the second connection section.

3. The heat dissipation device according to claim 2, wherein The extending directions of the first flow section, the second flow section, and the third flow section are substantially perpendicular to the extending directions of the first connection section and the second connection section.

4. The heat dissipation device according to claim 1, characterized in that, The horizontal height of the second flow section is higher than the horizontal height of the first flow section, and the horizontal height of the third flow section is higher than the horizontal height of the second flow section.

5. The heat dissipation device according to claim 1, wherein, The width of the first flow section is greater than the width of the second flow section, and the width of the third flow section is greater than the width of the first flow section.

6. The heat dissipation device according to claim 5, wherein, The widths of the first connection section and the second connection section are greater than the width of the third flow section.

7. The heat dissipation device according to claim 1, wherein, The base has a first groove bottom surface, a second groove bottom surface, and a third groove bottom surface located in the receiving groove, the first groove bottom surface, the second groove bottom surface, and the third groove bottom surface respectively correspond to the first flow section, the second flow section, and the third flow section, opposite sides of the second groove bottom surface are respectively connected to the first groove bottom surface and the second groove bottom surface, and the second groove bottom surface is closer to the first side surface than the first groove bottom surface, and the first groove bottom surface is closer to the first side surface than the third groove bottom surface.

8. The heat dissipation device according to claim 1, characterized in that The second side surface has a first bearing section, a second bearing section and a third bearing section. The two opposite sides of the second bearing section are respectively connected to the first bearing section and the third bearing section. The second bearing section is closer to the first side surface than the first bearing section, and the first bearing section is closer to the first side surface than the third bearing section. The at least one heat dissipation fin has opposite cold and hot sides. The hot side has a first section, a second section and a third section, and the first section, the second section and the third section respectively abut against the first bearing section, the second bearing section and the third bearing section.

9. The heat dissipation device according to claim 1, characterized in that, The extending flow channel is in a grid shape.

10. The heat dissipation device according to claim 1, wherein No capillary structure is provided in the at least one internal flow channel and the extending flow channel.

11. The heat dissipation device according to claim 1, wherein, The flow resistance of the at least one internal flow channel of the base is less than the flow resistance of the extending flow channel of the at least one heat dissipation fin.

12. The heat dissipation device according to claim 1, wherein, The fluid pressure in the extending flow channel of the at least one heat dissipation fin is greater than the fluid pressure in the at least one internal flow channel of the base.

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