Substrate cleaning apparatus and substrate cleaning method

Abstract

The present application relates to a substrate cleaning apparatus and a substrate cleaning method. The substrate cleaning apparatus includes a substrate holding portion that holds a substrate in a horizontal posture, and a one-side cleaning apparatus that cleans one side of the substrate held by the substrate holding portion. The one-side cleaning apparatus includes a cleaning tool that is disposed so as to be contactable with the one side of the substrate, a fluid cylinder that applies an upward force to the cleaning tool, and a cylinder driving portion that drives the fluid cylinder. The cylinder driving portion drives the fluid cylinder so as to apply a first upward force to the cleaning tool when in standby. In addition, the cylinder driving portion drives the fluid cylinder so that the cleaning tool pushes the one side with a predetermined force, by applying a second upward force that is different from the first force to the cleaning tool while the cleaning tool is in contact with the one side of the substrate, when cleaning the one side of the substrate.

Description

Technical Field

[0001] This invention relates to a substrate cleaning apparatus and a substrate cleaning method that cleans a substrate by bringing a cleaning tool into contact with the substrate. Background Technology

[0002] Substrate processing equipment has been used to perform various processing on various substrates used in liquid crystal display devices or organic EL (Electroluminescence) display devices, such as substrates for FPD (Flat Panel Display), semiconductor substrates, optical disc substrates, magnetic disk substrates, magneto-optical disc substrates, photomask substrates, ceramic substrates, or solar cell substrates. Substrate cleaning equipment is used to clean the substrates.

[0003] The substrate cleaning apparatus described in Japanese Patent Application Publication No. 2004-306033 includes a rotary suction cup, a rotary support column, a support arm, and a cleaning brush. The rotary suction cup holds the center of the lower surface of the substrate by adsorption, thus rotatably holding the substrate in a horizontal position. The rotary support column extends vertically and is rotatably positioned to the side of the rotary suction cup about an axis extending vertically. The support arm extends horizontally from the upper end of the rotary support column and is movably positioned above the rotary suction cup in the vertical direction. The cleaning brush is located at the front end of the support arm and is configured to clean the upper surface of the substrate by contacting it.

[0004] In the substrate cleaning apparatus, when cleaning the upper surface of the substrate, the support arm moves up and down and rotates while the substrate is rotated and held in place by a rotating suction cup. As a result, the cleaning brush presses against the upper surface of the substrate and moves against the substrate.

[0005] Here, if the pushing force of the cleaning brush on the substrate is too small during cleaning, the substrate may not be thoroughly cleaned. Therefore, in the substrate cleaning apparatus disclosed in Japanese Patent Application Publication No. 2004-306033, a cylinder is provided at the front end of the support arm to energize the cleaning brush toward the substrate. The pushing force of the cleaning brush is controlled by an electro-pneumatic regulator that adjusts the airflow supplied to the cylinder.

[0006] Additionally, a spring is provided at the front end of the support arm to counteract the weight of the cleaning brush and its surrounding components acting on the cylinder. By counteracting the weight of the cleaning brush and its surrounding components, the weight of the cleaning brush and its surrounding components can be disregarded when controlling the pushing force of the cleaning brush on the substrate. Summary of the Invention

[0007] In the substrate cleaning apparatus, by increasing the contact area between the cleaning brush and the substrate, the path the cleaning brush should travel on the substrate during cleaning can be shortened. Alternatively, the cleaning brush can be made to move on the substrate without needing to do so. This reduces the substrate cleaning time and increases the cleaning capacity.

[0008] However, increasing the contact area between the cleaning brush and the substrate results in a larger cleaning brush and its surrounding components, significantly increasing the weight of the cleaning brush and its components. In this case, if the weight of the cleaning brush and its components is counteracted by a spring, the brush may wobble violently up and down due to the spring's extension and contraction. If the cleaning brush moves violently up and down while moving near the substrate, it may unintentionally come into contact with the substrate. Furthermore, the spring force also acts on the cylinder. Therefore, if the spring force increases with the weight of the cleaning brush, it may become difficult to adjust the pushing force of the cleaning brush against the substrate.

[0009] Therefore, it is possible to omit the aforementioned spring configuration. However, in this case, the force that needs to be controlled by the cylinder will increase, thus lengthening the control time. Consequently, the cleaning process capacity cannot be increased.

[0010] The purpose of this invention is to provide a substrate cleaning apparatus and a substrate cleaning method that can improve the cleaning capacity of the cleaning process.

[0011] (1) A substrate cleaning apparatus according to one aspect of the present invention includes: a substrate holding part for holding the substrate in a horizontal position; a first cleaning fixture for contacting one of the upper and lower surfaces of the substrate held by the substrate holding part; a first fluid cylinder for applying an upward force to the first cleaning fixture; and a first cylinder driving part for driving the first fluid cylinder; and when in standby mode, the first cylinder driving part drives the first fluid cylinder by applying an upward first force to the first cleaning fixture, and when cleaning one side of the substrate, applies an upward second force different from the first force to the first cleaning fixture while the first cleaning fixture is in contact with one side of the substrate, thereby driving the first fluid cylinder by the first cleaning fixture pushing one side with a predetermined force.

[0012] The greater the change in force generated by the first fluid cylinder, the longer the time required to control the first fluid cylinder. In the substrate cleaning apparatus, during standby, the first fluid cylinder applies a first upward force to the first cleaning fixture. On the other hand, during cleaning, the first fluid cylinder applies a second upward force to the first cleaning fixture. Therefore, by reducing the difference between the first and second forces, the time required to control the first fluid cylinder can be shortened when switching from the standby state to the cleaning state. As a result, the substrate processing capacity of cleaning one side of the substrate is increased.

[0013] (2) The first force may also be set such that when the first fluid cylinder applies an upward first force to the first washing device, at least a portion of the weight of the first washing device is offset.

[0014] In this case, the likelihood that the time required to control the first fluid cylinder will increase due to the weight of the first washing device when switching from standby mode to washing mode is reduced.

[0015] (3) The substrate cleaning apparatus may also include a first cleaning fixture holding part for holding the first cleaning fixture, and the first fluid cylinder applies a first or second upward force to the first cleaning fixture via the first cleaning fixture holding part.

[0016] In this case, it is not necessary to directly install the first washing device onto the first fluid cylinder. Therefore, the layout freedom of the first washing device and the first fluid cylinder is increased.

[0017] (4) The substrate cleaning apparatus may also include: a support member for supporting the first fluid cylinder; and a support member moving part configured to allow the support member to move at least in the vertical direction, so that the support member can move between a contact position and a standby position, wherein the contact position is a position where the first cleaning instrument contacts one side of the substrate held by the substrate holding part, and the standby position is a position where the first cleaning instrument is far away from one side of the substrate held by the substrate holding part.

[0018] In this configuration, control of the first fluid cylinder and control of the movement of the support component can be performed simultaneously. Therefore, the substrate processing capacity can be further improved.

[0019] (5) The support member may also include a housing member, which is formed to accommodate the first fluid cylinder and the first washing instrument holding part; and at least a portion of the first washing instrument is held by the first washing instrument holding part in a manner that is located outside the housing member.

[0020] In this case, since the first fluid cylinder and the first cleaning device holding part are housed in the outer casing, the scattering of particles generated from the first fluid cylinder and the first cleaning device holding part is prevented.

[0021] (6) The substrate cleaning apparatus may also include a load sensor that detects the force applied upward from the first fluid cylinder to the first cleaning fixture; and the first cylinder drive unit adjusts the force applied by the first fluid cylinder to the first cleaning fixture based on the output of the load sensor.

[0022] In this case, the force applied by the first fluid cylinder to the first cleaning device can be adjusted more accurately based on the output of the load sensor. Therefore, when cleaning one side of the substrate, the first cleaning device can be pressed against one side of the substrate with a preset force.

[0023] (7) The first cleaning device may also include a brush having a contact surface facing one side of the substrate held by the substrate holder and capable of contacting one side of the substrate; and in top view, the length between the two furthest points on the contact surface of the brush is greater than 1 / 3 of the diameter of the substrate.

[0024] In this case, it is possible to clean at least a portion of one side of the substrate with good efficiency over a relatively large area.

[0025] (8) The substrate cleaning apparatus may also include an anomaly detection unit that detects the phenomenon that the first cleaning tool does not contact one side of the substrate when cleaning one side of the substrate.

[0026] In this case, users can easily and quickly identify the abnormalities in the substrate cleaning device based on the detection results.

[0027] (9) The substrate cleaning apparatus may further include: a second cleaning fixture, which is disposed in such a way that it can contact the other side of the upper surface and the lower surface of the substrate held by the substrate holding part; a second fluid cylinder, which applies an upward force to the second cleaning fixture; and a second cylinder driving part, which drives the second fluid cylinder; and when the second cylinder driving part is in standby mode, it drives the second fluid cylinder in such a way that it applies an upward third force to the second cleaning fixture, and when cleaning the other side of the substrate, it applies an upward fourth force to the second cleaning fixture in such a way that the second cleaning fixture is in contact with the other side of the substrate, thereby driving the first fluid cylinder by pushing the other side with a preset force.

[0028] The greater the change in force generated by the second fluid cylinder, the longer the time required to control the second fluid cylinder. According to this configuration, by reducing the difference between the third and fourth forces, the time required to control the second fluid cylinder can be shortened when switching from the standby state to the cleaning state. This increases the substrate processing capacity for cleaning one side and the other side of the substrate.

[0029] (10) Another embodiment of the substrate cleaning apparatus of the present invention includes: a substrate holding portion for holding a substrate in a horizontal position; a cleaning device configured to clean one side by contacting one side of the upper surface and lower surface of the substrate held by the substrate holding portion; a cleaning device holding portion having a first end and a second end, and holding the cleaning device at the first end; a fluid cylinder supporting the cleaning device holding portion and applying an upward force to the cleaning device holding portion by the cleaning device held by the cleaning device holding portion pressing against one side of the substrate held by the substrate holding portion; and a cylinder driving portion for driving the fluid cylinder; and the fluid cylinder supporting the portion between the first end and the second end of the cleaning device holding portion.

[0030] In this substrate cleaning apparatus, a fluid cylinder supports the portion of the cleaning fixture holding part other than the first and second ends. In this case, the support provided by the fluid cylinder to the cleaning fixture holding part is more stable compared to the case where the fluid cylinder supports only the first and second ends of the cleaning fixture holding part. Therefore, when cleaning the substrate, the cleaning fixture can be stably pressed against one side of the substrate with a predetermined force. Furthermore, since it is unnecessary to place the fluid cylinder near the first and second ends of the cleaning fixture holding part, the enlargement of the cleaning fixture periphery is prevented. Thus, both the enlargement of the cleaning fixture periphery and the efficient cleaning of one side of the substrate are achieved.

[0031] (11) Another embodiment of the substrate cleaning method of the present invention includes the following steps: holding the substrate in a horizontal position by means of the substrate holding part; using a first cleaning tool to clean one of the upper and lower surfaces of the substrate held by the substrate holding part to stand by; and cleaning one side by contacting the first cleaning tool with one side of the substrate held by the substrate holding part; and the step of setting the first cleaning tool to stand by includes the following operation: driving the first fluid cylinder by applying a first force upward to the first cleaning tool; the step of cleaning one side of the substrate includes the following operation: applying a second force upward to the first cleaning tool and different from the first force while the first cleaning tool is in contact with one side of the substrate, thereby driving the first fluid cylinder by pushing one side with a predetermined force.

[0032] The greater the change in force generated in the first fluid cylinder, the longer the time required to control the first fluid cylinder. In the substrate cleaning method, during standby, the first fluid cylinder applies a first upward force to the first cleaning fixture. On the other hand, during cleaning, the first fluid cylinder applies a second upward force to the first cleaning fixture. Therefore, by reducing the difference between the first and second forces, the time required to control the first fluid cylinder can be shortened when switching from the standby state to the cleaning state. As a result, the substrate processing capacity of cleaning one side of the substrate is increased.

[0033] (12) The first force may also be set such that when the first fluid cylinder applies an upward first force to the first washing device, at least a portion of the weight of the first washing device is offset.

[0034] In this case, the likelihood that the time required to control the first fluid cylinder will increase due to the weight of the first washing device when switching from standby mode to washing mode is reduced.

[0035] (13) The substrate cleaning method may also include the following steps: detecting the force applied upward from the first fluid cylinder to the first cleaning fixture by means of a load sensor; and adjusting the force applied by the first fluid cylinder to the first cleaning fixture based on the output of the load sensor.

[0036] In this case, the force applied by the first fluid cylinder to the first cleaning device can be adjusted more accurately based on the output of the load sensor. Therefore, when cleaning one side of the substrate, the first cleaning device can be pressed against one side of the substrate with a preset force.

[0037] (14) The step of cleaning one side of the substrate may also include an operation to detect the phenomenon that the first cleaning tool does not contact one side.

[0038] In this case, users can easily and quickly identify the abnormalities in the substrate cleaning device based on the detection results.

[0039] (15) The substrate cleaning method may also include the following steps: using a second cleaning fixture to clean the other side of the upper and lower surfaces of the substrate held by the substrate holding part; and cleaning the other side by bringing the second cleaning fixture into contact with the other side of the substrate held by the substrate holding part; and the step of bringing the second cleaning fixture into standby includes the following operation: driving the second fluid cylinder by applying an upward third force to the second cleaning fixture; the step of cleaning the other side of the substrate includes the following operation: applying an upward fourth force different from the third force to the second cleaning fixture while the second cleaning fixture is in contact with one side of the substrate, thereby driving the second fluid cylinder by pushing the other side with a predetermined force.

[0040] The greater the change in force generated by the second fluid cylinder, the longer the time required to control the second fluid cylinder. According to this configuration, by reducing the difference between the third and fourth forces, the time required to control the second fluid cylinder can be shortened when switching from the standby state to the cleaning state. This increases the substrate processing capacity for cleaning one side and the other side of the substrate. Attached Figure Description

[0041] Figure 1 This is a schematic top view of a substrate cleaning apparatus according to one embodiment of the present invention.

[0042] Figure 2 It means Figure 1 A three-dimensional view of the internal structure of the substrate cleaning device.

[0043] Figure 3 This is a block diagram illustrating the configuration of the control system of a substrate cleaning apparatus according to one embodiment of the present invention.

[0044] Figure 4 It is used to explain Figure 1 A schematic diagram of the structure of the brushing action part on the lower surface.

[0045] Figure 5 This is a schematic side view illustrating the basic operation of the lower surface brushing unit when the lower surface of the substrate is cleaned by the lower surface cleaning device.

[0046] Figure 6 This is a schematic side view illustrating the basic operation of the lower surface brushing unit when the lower surface of the substrate is cleaned by the lower surface cleaning device.

[0047] Figure 7 It is used to explain the process. Figure 5 and Figure 6 The diagram shows the timing of the change in the force applied from the cylinder to the brush on the lower surface of the substrate as it is being cleaned.

[0048] Figure 8 It is used to explain Figure 1 A schematic diagram of the structure of the brushing action part on the upper surface.

[0049] Figure 9 This is a schematic side view illustrating the basic operation of the upper surface brushing unit when the upper surface of the substrate is cleaned by the upper surface cleaning device.

[0050] Figure 10 This is a schematic side view illustrating the basic operation of the upper surface brushing unit when the upper surface of the substrate is cleaned by the upper surface cleaning device.

[0051] Figure 11 It is used to explain the process. Figure 9 and Figure 10 The diagram shows the timing of the change in the force applied upwards from the cylinder to the brush on the upper surface of the substrate during the cleaning process.

[0052] Figure 12 It is used to explain Figure 1 A schematic diagram illustrating an example of the overall operation of a substrate cleaning device.

[0053] Figure 13 It is used to explain Figure 1 A schematic diagram illustrating an example of the overall operation of a substrate cleaning device.

[0054] Figure 14 It is used to explain Figure 1 A schematic diagram illustrating an example of the overall operation of a substrate cleaning device.

[0055] Figure 15 It is used to explain Figure 1 A schematic diagram illustrating an example of the overall operation of a substrate cleaning device.

[0056] Figure 16 It is used to explain Figure 1 A schematic diagram illustrating an example of the overall operation of a substrate cleaning device.

[0057] Figure 17 It is used to explain Figure 1 A schematic diagram illustrating an example of the overall operation of a substrate cleaning device.

[0058] Figure 18 It is used to explain Figure 1 A schematic diagram illustrating an example of the overall operation of a substrate cleaning device.

[0059] Figure 19 It is used to explain Figure 1 A schematic diagram illustrating an example of the overall operation of a substrate cleaning device.

[0060] Figure 20 It is used to explain Figure 1 A schematic diagram illustrating an example of the overall operation of a substrate cleaning device.

[0061] Figure 21 It is used to explain Figure 1 A schematic diagram illustrating an example of the overall operation of a substrate cleaning device.

[0062] Figure 22 It is used to explain Figure 1 A schematic diagram illustrating an example of the overall operation of a substrate cleaning device.

[0063] Figure 23 It is used to explain Figure 1 A schematic diagram illustrating an example of the overall operation of a substrate cleaning device. Detailed Implementation

[0064] Hereinafter, with the aid of accompanying drawings, the substrate cleaning apparatus and substrate cleaning method according to embodiments of the present invention will be described. In the following description, "substrate" refers to a semiconductor substrate (wafer), a substrate for an FPD (Flat Panel Display) such as a liquid crystal display device or an organic EL (Electroluminescence) display device, a substrate for an optical disc, a substrate for a magnetic disk, a substrate for a magneto-optical disc, a substrate for a photomask, a ceramic substrate, or a substrate for a solar cell, etc. Furthermore, in this embodiment, the upper surface of the substrate is the circuit formation surface (front side), and the lower surface of the substrate is the side opposite to the circuit formation surface (back side). Also, in this embodiment, the substrate has a circular shape, ignoring notches.

[0065] [1] Composition of substrate cleaning device

[0066] Figure 1 This is a schematic top view of a substrate cleaning apparatus according to an embodiment of the present invention. Figure 2 It means Figure 1 A perspective view of the internal structure of the substrate cleaning apparatus 1. In the substrate cleaning apparatus 1 of this embodiment, the X, Y, and Z directions, which are orthogonal to each other, are defined to clarify the positional relationships. Figure 1 and Figure 2In subsequent drawings, the X, Y, and Z directions will be indicated by arrows as appropriate. The X and Y directions are orthogonal to each other in the horizontal plane, and the Z direction corresponds to the vertical direction.

[0067] like Figure 1 As shown, the substrate cleaning apparatus 1 includes upper holding devices 10A and 10B, a lower holding device 20, a base device 30, a transfer device 40, a lower surface cleaning device 50, a cup-holding device 60, an upper surface cleaning device 70, an upper surface cleaning device 80, and an opening and closing device 90. These components are housed within the unit housing 2. Figure 2 In the diagram, the unit housing 2 is represented by a dashed line.

[0068] The unit housing 2 has a rectangular bottom portion 2a and four sidewall portions 2b, 2c, 2d, and 2e extending upwards from the four sides of the bottom portion 2a. Sidewall portions 2b and 2c face each other, and sidewall portions 2d and 2e face each other. A rectangular opening is formed in the center of the sidewall portion 2b. This opening serves as a loading / unloading outlet 2x for the substrate W, used when the substrate W is loaded into and unloaded from the unit housing 2. Figure 2 In the diagram, the loading / unloading outlet 2x is represented by a thick dashed line. In the following description, the direction in the Y direction from the inside of the unit housing 2 through the loading / unloading outlet 2x toward the outside of the unit housing 2 (from side wall 2c toward side wall 2b) is called the front, and the opposite direction (from side wall 2b toward side wall 2c) is called the rear.

[0069] like Figure 1 As shown, an opening and closing device 90 is provided in the portion of the side wall 2b where the inlet / outlet 2x is formed and in the surrounding area. The opening and closing device 90 includes a gate 91 configured to open or close the inlet / outlet 2x, and a gate drive 92 that drives the gate 91. Figure 2 In the diagram, the barrier 91 is represented by a thick two-dot chain line. The barrier drive unit 92 drives the barrier 91 to open the inlet / outlet 2x when the substrate W is being moved into and out of the substrate cleaning apparatus 1. Furthermore, the barrier drive unit 92 drives the barrier 91 to close the inlet / outlet 2x when the substrate W is being cleaned in the substrate cleaning apparatus 1.

[0070] A base device 30 is provided at the center of the bottom surface 2a. The base device 30 includes a linear guide 31, a movable base 32, and a base drive unit 33. The linear guide 31 includes two tracks that extend from near the side wall 2b along the Y direction to near the side wall 2c when viewed from above. The movable base 32 is provided so that it can move along the Y direction on the two tracks of the linear guide 31. The base drive unit 33 includes, for example, a pulse motor, to move the movable base 32 along the Y direction on the linear guide 31.

[0071] A lower holding device 20 and a lower surface cleaning device 50 are arranged along the Y direction on a movable base 32. The lower holding device 20 includes an adsorption holding part 21 and an adsorption holding drive part 22. The adsorption holding part 21 is a so-called rotating suction cup, having a circular adsorption surface capable of adsorbing and holding the lower surface of the substrate W, and is configured to rotate about an axis extending along the vertical direction (the Z direction axis). Figure 1 In the diagram, the shape of the substrate W held by the lower holding device 20 is represented by a two-point chain line. In the following description, the area on the lower surface of the substrate W that should be adsorbed by the adsorption surface of the adsorption holding part 21 when the substrate W is held by the adsorption holding part 21 is referred to as the central portion of the lower surface. On the other hand, the area on the lower surface of the substrate W that surrounds the central portion of the lower surface is referred to as the outer region of the lower surface.

[0072] The adsorption-holding drive unit 22 includes a motor. The motor of the adsorption-holding drive unit 22 is mounted on a movable base 32 with its rotation axis protruding upwards. The adsorption-holding part 21 is mounted on the upper end of the rotation axis of the adsorption-holding drive unit 22. Furthermore, a suction path for adsorbing and holding the substrate W by the adsorption-holding part 21 is formed on the rotation axis of the adsorption-holding drive unit 22. This suction path is connected to a suction device (not shown). The adsorption-holding drive unit 22 rotates the adsorption-holding part 21 about the rotation axis.

[0073] On the movable base 32, near the lower holding device 20, a connecting device 40 is also provided. The connecting device 40 includes multiple (in this example, three) support pins 41, pin connecting members 42, and a pin lifting drive 43. The pin connecting members 42 are formed to surround the adsorption holding part 21 from a top view, connecting the multiple support pins 41. The multiple support pins 41 are interconnected by the pin connecting members 42 and extend upward from the pin connecting members 42 by a certain length. The pin lifting drive 43 causes the pin connecting members 42 to rise and fall on the movable base 32. As a result, the multiple support pins 41 rise and fall relative to the adsorption holding part 21.

[0074] The lower surface cleaning device 50 includes a lower surface brush 51, two liquid nozzles 52, a gas ejection section 53, a lower surface brush lifting section 54, a lower surface brush moving section 55, a lower surface brush actuation section 55a, a lower surface brush lifting drive section 55b, a lower surface brush moving drive section 55c, and a lower surface brush support section 59. The lower surface brush moving section 55 is arranged to move relative to the lower holding device 20 in the Y direction within a certain area on the movable base 32. Figure 2As shown, a lower surface brush lifting part 54 is provided on the lower surface brush moving part 55, and a lower surface brush support part 59 is provided on the lower surface brush lifting part 54. The lower surface brush lifting part 54 supports the lower surface brush support part 59 in a height-adjustable manner. The lower surface brush support part 59 has an upper surface 59u that is inclined downwards in the direction away from the adsorption holding part 21 (in this example, rearwards).

[0075] like Figure 1 As shown, the lower surface brush 51 is formed, for example, from PVA (polyvinyl alcohol) sponge or PVA sponge with dispersed abrasive particles, and has a circular contact surface that can contact the lower surface of the substrate W. Furthermore, the lower surface brush 51 is mounted on the upper surface 59u of the lower surface brush support 59 with the contact surface facing upwards and the contact surface rotatable about an axis extending vertically through the center of the contact surface. In plan view, the area of ​​the contact surface of the lower surface brush 51 is larger than the area of ​​the adsorption surface of the adsorption holding portion 21. In plan view, the length between the two furthest points on the contact surface of the lower surface brush 51 is greater than 1 / 3 and less than 1 / 2 of the diameter of the substrate W. With this configuration, the lower surface brush 51 can be prevented from being too large, thus allowing for efficient cleaning of at least a portion of the lower surface of the substrate W over a larger area.

[0076] Two liquid nozzles 52 are each mounted on the upper surface 59u of the lower surface brush support 59, positioned near the lower surface brush 51 with their liquid outlets facing upwards. A lower surface cleaning liquid supply unit 56 is connected to each liquid nozzle 52. Figure 3 The lower surface cleaning solution supply unit 56 supplies cleaning solution to the liquid nozzle 52. When cleaning the substrate W using the lower surface brush 51, the liquid nozzle 52 supplies the cleaning solution supplied from the lower surface cleaning solution supply unit 56 to the lower surface of the substrate W. In this embodiment, pure water (deionized water) is used as the cleaning solution supplied to the liquid nozzle 52. In addition to pure water, carbonated water, ozone water, hydrogen water, electrolyzed water, SCl (a mixture of ammonia and hydrogen peroxide) or TMAH (tetramethylammonium hydroxide) may also be used as the cleaning solution supplied to the liquid nozzle 52.

[0077] The gas ejection section 53 is a slit-shaped gas nozzle with a unidirectionally extending gas outlet. The gas ejection section 53 is mounted on the upper surface 59u of the lower surface brush support 59, positioned between the lower surface brush 51 and the adsorption holding section 21 from a top view, with the gas outlet facing upwards. A gas supply section 57 is connected to the gas ejection section 53. Figure 3The ejector gas supply unit 57 supplies gas to the gas ejector unit 53. In this embodiment, nitrogen is used as the gas supplied to the gas ejector unit 53. When cleaning the substrate W with the lower surface brush 51 and drying the lower surface of the substrate W, the gas ejector unit 53 ejects the gas supplied from the ejector gas supply unit 57 onto the lower surface of the substrate W. In this case, a strip-shaped air curtain extending in the X direction is formed between the lower surface brush 51 and the adsorption holding unit 21. In addition to nitrogen, inert gases such as argon or helium can also be used as the gas supplied to the gas ejector unit 53.

[0078] The lower surface brush actuation unit 55a includes a cylinder. When cleaning the substrate W with the lower surface brush 51, the cylinder is driven to press the lower surface brush 51 against the lower surface of the substrate W with a specified force. The lower surface brush actuation unit 55a also includes a motor. When cleaning the substrate W with the lower surface brush 51, the motor is driven while the lower surface brush 51 is in contact with the lower surface of the substrate W. This causes the lower surface brush 51 to rotate. Details regarding the lower surface brush actuation unit 55a will be described below.

[0079] The lower surface brush lifting drive unit 55b includes a stepper motor or cylinder, which raises and lowers the lower surface brush support unit 59, supported by the lower surface brush lifting unit 54, relative to the lower surface brush moving unit 55. The lower surface brush moving drive unit 55c includes a motor, which moves the lower surface brush moving unit 55 along the Y direction on the movable base 32. Here, the lower side holding device 20 is fixed in position on the movable base 32. Therefore, when the lower surface brush moving unit 55 is moved along the Y direction by the lower surface brush moving drive unit 55c, the lower surface brush moving unit 55 moves relative to the lower side holding device 20. In the following description, the position of the lower surface cleaning device 50 on the movable base 32 when it is closest to the lower side holding device 20 is referred to as the approach position, and the position of the lower surface cleaning device 50 on the movable base 32 when it is farthest from the lower side holding device 20 is referred to as the distance position.

[0080] A cup-receiving device 60 is also provided in the center of the bottom part 2a. The cup-receiving device 60 includes a cup 61 and a cup-receiving drive part 62. The cup 61 is arranged in a way that surrounds the lower holding device 20 and the base device 30 when viewed from above, and is liftable. Figure 2 In the diagram, the support cup 61 is indicated by a dashed line. The support cup driving unit 62 moves the support cup 61 between a lower support cup position and an upper support cup position depending on which part of the lower surface of the substrate W needs to be cleaned by the lower surface brush 51. The lower support cup position is the height position where the upper end of the support cup 61 is below the substrate W held by the adsorption and holding unit 21. The upper support cup position is the height position where the upper end of the support cup 61 is above the adsorption and holding unit 21.

[0081] At a height slightly above the support cup 61, viewed from above, a pair of upper retaining devices 10A and 10B are disposed opposite each other across the base device 30. Upper retaining device 10A includes a lower suction cup 11A, an upper suction cup 12A, a lower suction cup drive unit 13A, and an upper suction cup drive unit 14A. Upper retaining device 10B includes a lower suction cup 11B, an upper suction cup 12B, a lower suction cup drive unit 13B, and an upper suction cup drive unit 14B.

[0082] The lower suction cups 11A and 11B, viewed from above, are arranged vertically symmetrically about the center of the adsorption holding part 21 along the Y direction (front-to-back direction), and are configured to move along the X direction within a common horizontal plane. Each of the lower suction cups 11A and 11B has two support plates, which support the lower periphery of the substrate W from below. The lower suction cup drive parts 13A and 13B move the lower suction cups 11A and 11B by bringing them closer together or separating them from each other.

[0083] Like the lower suction cups 11A and 11B, the upper suction cups 12A and 12B are arranged symmetrically in a vertical plane extending along the Y direction (front-back direction) from the center of the adsorption holding portion 21 when viewed from above, and are configured to move along the X direction within a common horizontal plane. Each of the upper suction cups 12A and 12B has two holding tabs, which are configured to abut against two portions of the outer peripheral end of the substrate W to hold the outer peripheral end of the substrate W. The upper suction cup driving portions 14A and 14B move the upper suction cups 12A and 12B by bringing them closer together or separating them from each other.

[0084] like Figure 1 As shown, a top surface cleaning device 70 is provided on one side of the cup 61, near the upper holding device 10B in a top view. The top surface cleaning device 70 includes a rotating support shaft 71, an arm 72, a spray nozzle 73, and a rotating shaft drive unit 74.

[0085] The rotating support shaft 71 extends vertically along the bottom surface 2a and is supported by the rotating shaft drive unit 74 in a height-lifting and rotatable manner. Figure 2 As shown, the arm 72 is positioned above the upper holding device 10B and extends horizontally from the upper end of the rotating support shaft 71. A spray nozzle 73 is mounted on the front end of the arm 72.

[0086] The spray nozzle 73 is connected to the upper surface cleaning fluid supply section 75. Figure 3The upper surface cleaning fluid supply unit 75 supplies cleaning liquid and gas to the spray nozzle 73. In this embodiment, pure water is used as the cleaning liquid supplied to the spray nozzle 73, and nitrogen is used as the gas supplied to the spray nozzle 73. When cleaning the upper surface of the substrate W, the spray nozzle 73 mixes the cleaning liquid supplied from the upper surface cleaning fluid supply unit 75 with the gas to generate a mixed fluid, and sprays the generated mixed fluid downward.

[0087] In addition to pure water, the cleaning solution supplied to the spray nozzle 73 can also include carbonated water, ozone water, hydrogen water, electrolyzed ionized water, SC1 (a mixed solution of ammonia and hydrogen peroxide), or TMAH (tetramethylammonium hydroxide). Furthermore, in addition to nitrogen, inert gases such as argon or helium can also be used as the gas supplied to the spray nozzle 73.

[0088] The rotating shaft drive unit 74 includes one or more pulse motors and cylinders, etc., to raise and lower the rotating support shaft 71 and to rotate the rotating support shaft 71. According to the above configuration, the spray nozzle 73 can move in an arc shape on the upper surface of the substrate W, which is adsorbed, held and rotated by the adsorption and holding unit 21, thereby cleaning the entire upper surface of the substrate W.

[0089] like Figure 1 As shown, on the other side of the cup 61, near the upper holding device 10A in a top view, an upper surface cleaning device 80 is provided. The upper surface cleaning device 80 includes a rotating support shaft 81, an upper surface brush support 82, an upper surface brush 83, a rotating shaft drive 84, a liquid dispensing nozzle 85, and an upper surface brush actuation unit 86.

[0090] The rotating support shaft 81 extends vertically along the bottom surface 2a and is supported by the rotating shaft drive unit 84 in a height-lifting and rotatable manner. Figure 2 As shown, the upper surface brush support portion 82 is provided above the upper holding device 10A, extending horizontally from the upper end of the rotating support shaft 81. An upper surface brush 83 is provided at the front end of the upper surface brush support portion 82, protruding downwards.

[0091] In this embodiment, the upper surface brush 83 has a configuration substantially the same as that of the lower surface brush 51. That is, the upper surface brush 83 is formed, for example, from PVA sponge or PVA sponge with dispersed abrasive particles, and has a circular contact surface that can contact the upper surface of the substrate W. In addition, the upper surface brush 83 is mounted on the upper surface brush support 82 with the contact surface facing downward and the contact surface being rotatable about an axis extending vertically through the center of the contact surface.

[0092] Viewed from above, the length between the two furthest points on the contact surface of the upper surface brush 83 is greater than 1 / 3 and less than 1 / 2 of the diameter of the substrate W. This configuration avoids making the upper surface brush 83 too large, thus allowing for efficient cleaning of at least a portion of the upper surface of the substrate W over a larger area.

[0093] The rotary shaft drive unit 84 includes one or more pulse motors and cylinders, etc., to raise and lower the rotary support shaft 81 and to rotate the rotary support shaft 81. The liquid discharge nozzle 85 is fixed above the holder 61 with the liquid discharge outlet facing the center of the substrate W held by the lower holding device 20. An upper surface cleaning fluid supply unit 75 is connected to the liquid discharge nozzle 85. Figure 3 The upper surface cleaning fluid supply unit 75 supplies cleaning fluid to the liquid discharge nozzle 85. When cleaning the substrate W using the upper surface brush 83, the liquid discharge nozzle 85 discharges the cleaning fluid supplied by the upper surface cleaning fluid supply unit 75 onto the substrate W. Pure water (deionized water) is used as the cleaning fluid supplied to the liquid discharge nozzle 85. In addition to pure water, carbonated water, ozone water, hydrogen water, electrolyzed water, SCl, or TMAH can also be used as the cleaning fluid supplied to the liquid discharge nozzle 85.

[0094] The upper surface brush actuation unit 86 includes a cylinder. When cleaning the substrate W with the upper surface brush 83, the cylinder is driven to press the upper surface brush 83 against the upper surface of the substrate W with a specified force. Additionally, the upper surface brush actuation unit 86 also includes a motor. When cleaning the substrate W with the upper surface brush 83, the motor is driven while the upper surface brush 83 is in contact with the upper surface of the substrate W. This causes the upper surface brush 83 to rotate.

[0095] According to the configuration described above, by raising and lowering and rotating the rotating support shaft 81, the upper surface brush 83 contacts the upper surface of the substrate W, which is held and rotated by the adsorption and holding part 21. In this state, the cleaning liquid is supplied to the substrate W from the liquid discharge nozzle 85, and the upper surface brush 83 presses against the upper surface of the substrate W and rotates. Furthermore, the upper surface brush 83 moves in an arc shape on the substrate W. As a result, the entire upper surface of the substrate W can be physically cleaned. Details regarding the upper surface brush actuation part 86 will be described below.

[0096] Figure 3 This is a block diagram illustrating the configuration of the control system of a substrate cleaning apparatus 1 according to an embodiment of the present invention. Figure 3 The control unit 9 includes a CPU (Central Processing Unit), RAM (Random Access Memory), ROM (Read-Only Memory), and a storage device. RAM serves as the CPU's operating area. ROM stores the system program. The storage device stores the control program. The CPU executes the substrate cleaning program stored in the storage device on RAM to control the operation of each part of the substrate cleaning apparatus 1.

[0097] like Figure 3 As shown, the control unit 9 mainly receives the substrate W to be moved into the substrate cleaning apparatus 1 and holds it above the adsorption holding unit 21, and controls the lower suction cup drive units 13A and 13B and the upper suction cup drive units 14A and 14B. In addition, the control unit 9 mainly controls the adsorption holding drive unit 22 to adsorb and hold the substrate W through the adsorption holding unit 21 and to rotate the adsorbed and held substrate W.

[0098] In addition, the control unit 9 mainly controls the base drive unit 33 to move the movable base 32 relative to the substrate W held by the upper holding devices 10A and 10B. In addition, the control unit 9 controls the pin lifting drive unit 43 to move the substrate W between the height position of the substrate W held by the upper holding devices 10A and 10B and the height position of the substrate W held by the adsorption holding unit 21.

[0099] In addition, the control unit 9 controls the lower surface brush actuation unit 55a, the lower surface brush lifting drive unit 55b, the lower surface brush moving drive unit 55c, the lower surface cleaning liquid supply unit 56, and the ejected gas supply unit 57 in order to clean the lower surface of the substrate W. Furthermore, the control unit 9 controls the cup drive unit 62 to receive the cleaning liquid that spills from the substrate W when it is held by the adsorption and holding unit 21 during cleaning.

[0100] In addition, the control unit 9 controls the rotary shaft drive unit 74, the upper surface cleaning fluid supply unit 75, the rotary shaft drive unit 84, and the upper surface brush action unit 86 in order to clean the upper surface of the substrate W. Furthermore, the control unit 9 controls the gate drive unit 92 to open or close the loading / unloading outlet 2x of the unit housing 2 when the substrate W is loaded into and unloaded in the substrate cleaning apparatus 1.

[0101] [2] Details of the brushing action part 55a on the lower surface

[0102] (1) Structure of the brushing unit 55a on the lower surface

[0103] Figure 4 It is used to explain Figure 1 A schematic diagram of the structure of the brushing action part 55a on the lower surface. Figure 4 In the middle, a schematic side view is shown. Figure 1 The lower surface brushing action part 55a and its surrounding components constitute the structure. For example... Figure 4 As shown, the lower surface brush actuation unit 55a includes a rotating shaft 511, a lower surface brush holding member 512, a rotational force transmission mechanism 513, a motor 514, a motor drive unit 515, a shaft member 516, a cylinder 520, an electro-pneumatic regulator 521, a linear guide 531, a load sensor 550, a sensor support member 551, and a descent detection unit 560.

[0104] In the lower surface cleaning apparatus 50 of this embodiment, the lower surface brush support 59 includes a housing component that houses all components of the lower surface brush actuation unit 55a except for the motor drive unit 515 and the electro-pneumatic regulator 521. This prevents particles generated by the operation of the lower surface brush holding member 512, the rotational force transmission mechanism 513, the motor 514, the shaft member 516, and the cylinder 520 from scattering within the unit housing 2.

[0105] exist Figure 4 In order to illustrate the structure of the lower surface brush actuating part 55a, the shape of the lower surface brush support part 59 is conceptually shown. Therefore, in Figure 4 In the middle, the upper surface 59u of the lower surface brush support 59 is not inclined. Additionally, in... Figure 4 The liquid nozzle 52 and the gas ejection section 53 are also omitted from the illustration.

[0106] The lower surface brush support part 59 is composed of Figure 2 The lower surface brush lifting part 54 and the lower surface brush moving part 55 are supported. Inside the lower surface brush support part 59, a cylinder 520 is provided on the bottom of the lower surface brush support part 59. The lower surface brush holding member 512 has one end and another end in the horizontal direction. The cylinder 520 supports the approximately central portion between one end and the other end of the lower surface brush holding member 512. An electro-pneumatic regulator 521 is connected to the cylinder 520. Air is supplied to the cylinder 520 through the electro-pneumatic regulator 521, thereby applying an upward force to the lower surface brush holding member 512. By adjusting the force applied to the lower surface brush holding member 512 by the cylinder 520, the lower surface brush holding member 512 moves vertically within a specified range (hereinafter referred to as the movable height range). In addition, the electro-pneumatic regulator 521 may also be housed inside the lower surface brush support part 59.

[0107] The rotating shaft 511 is rotatably disposed at one end of the lower surface brush holding member 512, extending upward. The lower surface brush 51 is mounted on the upper end of the rotating shaft 511. The lower surface brush 51 is located outside (above) the lower surface brush support 59, mounted on the rotating shaft 511.

[0108] A motor 514 is mounted near the other end of the lower surface brush holding member 512. A motor drive unit 515 is connected to the motor 514. The rotation shaft of the motor 514 extends in the vertical direction. A rotational force transmission mechanism 513 is provided between the rotation shaft 511 and the rotation shaft of the motor 514. The rotational force transmission mechanism 513 includes two pulleys respectively mounted on the rotation shaft 511 and the rotation shaft of the motor 514, and a belt connecting the two pulleys, transmitting the rotational force generated in the motor 514 to the rotation shaft 511. As a result, the lower surface brush 51 rotates. In addition, the motor drive unit 515 may also be housed inside the lower surface brush support member 59.

[0109] A linear guide 531 is provided near the cylinder 520 at the bottom of the lower surface brush support 59. The linear guide 531 has a through hole extending a certain length in the vertical direction. A shaft member 516 is provided on a part of the lower surface brush holding member 512, extending downward. The shaft member 516 is movably inserted into the through hole of the linear guide 531 in the vertical direction. Thus, when the lower surface brush holding member 512 moves due to changes in the force applied to it by the cylinder 520, the linear guide 531 regulates its movement direction to the direction of the through hole (vertical direction).

[0110] The sensor support member 551 extends upward from the bottom of the lower surface brush support 59 through the vicinity of the other end of the lower surface brush holding member 512, and bends horizontally to extend to a position above the other end of the lower surface brush holding member 512.

[0111] In the following description, the total weight of the various components supported by cylinder 520 is referred to as the total weight of the lower surface brush. Furthermore, the pushing force applied to the substrate W by the lower surface brush 51 when cleaning the lower surface of the substrate W is referred to as the lower surface cleaning pushing force. In this embodiment, the lower surface cleaning pushing force is less than the total weight of the lower surface brush.

[0112] A load sensor 550 is mounted on the portion of the sensor support member 551 located above the other end of the lower surface brush holding member 512. When the cylinder 520 applies a force exceeding the total weight of the lower surface brush to the lower surface brush holding member 512, the other end of the lower surface brush holding member 512 abuts against the load sensor 550. At this time, the load sensor 550 outputs a signal representing the force obtained by subtracting the total weight of the lower surface brush from the force applied by the cylinder 520 to the lower surface brush holding member 512. The signal output from the load sensor 550 is sent to... Figure 3 The control department supplies 9.

[0113] For example, when the total weight of the lower surface brush is 10 (N) and an upward force of 13 (N) is applied to the lower surface brush holding member 512 from the cylinder 520, the load sensor 550 outputs a signal indicating 3 (N). The signal output from the load sensor 550 is then directed to... Figure 3 The control department supplies 9.

[0114] A descent detection unit 560 is mounted on a portion of the sensor support member 551 extending vertically. The descent detection unit 560, for example, is a reflective photoelectric sensor that outputs a signal indicating whether the lower surface brush holding member 512 is located at the lower end of its movable height range, i.e., whether the lower surface brush holding member 512 is at its maximum descent position. The signal output from the descent detection unit 560 is sent to… Figure 3 The control department supplies 9.

[0115] (2) Basic operation of the lower surface brushing unit 55a

[0116] Figure 5 and Figure 6 This is a schematic side view illustrating the basic operation of the lower surface brushing unit 55a when the lower surface of the substrate W is cleaned by the lower surface cleaning device 50. Figure 7 It is used to explain the process. Figure 5 and Figure 6 The diagram shows the timing of the change in the force applied upwards from the cylinder 520 to the lower surface brush 51 during the cleaning of the lower surface of the substrate W. Figure 7 In the timing diagram, the vertical axis represents the force applied upwards from the cylinder 520 to the lower surface brush 51, and the horizontal axis represents time.

[0117] At the time point t0 when the power supply to the substrate cleaning device 1 is disconnected, such as Figure 5 As shown in the upper section, with the lower surface brush holding member 512 supported by the cylinder 520, the lower surface brush holding member 512 is located at the lower end of its movable height range. Furthermore, at this time, as... Figure 7 As shown, no force is applied to the lower surface brush 51 from the cylinder 520.

[0118] Next, at the power-on time t1 of the substrate cleaning apparatus 1, control of the electro-pneumatic regulator 521 begins to apply a first force f1 upward from the cylinder 520 onto the lower surface brush 51. The electro-pneumatic regulator 521 is... Figure 3 Control unit 9 controls.

[0119] The first force f1 is preset to at least offset a portion of the weight of the lower surface brush 51. More specifically, the first force f1 is set to offset at least a portion of the total weight of the lower surface brush. In this example, the components supported by the cylinder 520 are the lower surface brush 51, the lower surface brush holding member 512, the rotational force transmission mechanism 513, the motor 514, and the shaft member 516. For example, if the total weight of the lower surface brush is 10 (N), the first force f1 can be set to 10 (N) or 9 (N). The first force f1 is set to a value less than the total weight of the lower surface brush plus the lower surface cleaning pushing force. If at time point t2, the force applied from the cylinder 520 to the lower surface brush 51 reaches the first force f1, the lower surface brush operating unit 55a enters a standby state.

[0120] Next, at time t3 when the lower surface cleaning device 50 begins cleaning the substrate W, the electro-pneumatic regulator 521 is activated to apply a second force f2 from the cylinder 520 to the lower surface brush 51. The second force f2 is the sum of the total weight of the lower surface brush and the lower surface cleaning pushing force.

[0121] After time point t3, if the force applied by cylinder 520 to the lower surface brush holding member 512 exceeds the total weight of the lower surface brush, then the lower surface brush holding member 512 rises from the lower end of its movable height range. Afterwards, if... Figure 5 As shown in the middle section, the lower surface brush holding member 512 abuts against the load sensor 550 at its other end, and the lower surface brush holding member 512 stops. Thus, the upper end of the movable height range of the lower surface brush holding member 512 is the height position of the load sensor 550.

[0122] Based on the output of the load sensor 550, the electro-pneumatic regulator 521 is controlled so that, with the lower surface brush holding member 512 abutting against the load sensor 550, the lower surface cleaning push pressure is correctly applied from the lower surface brush holding member 512 by the load sensor 550.

[0123] Next, from time point t4 to time point t5, through Figure 1 The movement of the lower surface brush lifting part 54 and the lower surface brush moving part 55, such as Figure 5 As indicated by the hollow arrow in the lower section, the lower surface brush support 59 moves. Additionally, as... Figure 6As shown in the upper section, the contact surface of the lower surface brush 51 presses against the lower surface of the substrate W. At this time, within the lower surface brush support 59, the lower surface brush holding member 512 is pushed downward together with the lower surface brush 51, and the lower surface brush holding member 512 moves away from the load sensor 550. As a result, the lower surface brush 51 pushes the lower surface of the substrate W with the lower surface cleaning pressure. In this state, the lower surface brush 51 rotates about an axis extending in the vertical direction by the operation of the motor 514, thereby cleaning the lower surface of the substrate W.

[0124] Then, at time point t5, the cleaning of a designated area on the lower surface of substrate W is completed, such as... Figure 7 As shown, the control of the electro-pneumatic regulator 521 is initiated to apply a first force f1 from the cylinder 520 to the lower surface brush 51. Additionally, from time point t5 to time point t6, via... Figure 1 With the operation of the lower surface brush lifting unit 54 and the lower surface brush moving unit 55, the lower surface brush 51 moves to a position away from the substrate W. Therefore, the lower surface brush operating unit 55a returns to the standby state.

[0125] The greater the change in force generated by cylinder 520, the longer the time required to control cylinder 520. According to the basic operation, in the lower surface brush actuation unit 55a, a first force f1 is applied to the lower surface brush 51 before the cleaning process is in standby mode. Therefore, by reducing the difference between the first force f1 and the second force f2, the time required to apply the second force f2 to the lower surface brush 51 by controlling the electro-pneumatic regulator 521 can be shortened when cleaning the lower surface of the substrate W from the standby state. This increases the substrate processing capacity for cleaning the lower surface of the substrate W.

[0126] In addition, such as Figure 6 As shown in the middle section, if the substrate W is damaged during the cleaning of its lower surface, the lower surface brush holding member 512 may come into contact with the load sensor 550 due to the force applied to the lower surface brush 51 by the cylinder 520. In this case, Figure 3 The control unit 9 detects instances where the lower surface brush 51 fails to contact the substrate W during the cleaning process of the lower surface of the substrate W, based on the output signal of the load sensor 550. By displaying the detection results to the user using a display device or an audio device, the user can easily and quickly grasp the occurrence of abnormalities in the lower surface cleaning device 50.

[0127] In addition, such as Figure 6 As shown in the lower section, if cylinder 520 malfunctions while cleaning the lower surface of substrate W, the lower surface brush holding member 512 may descend to the lower end of its movable height range. In this case, Figure 3The control unit 9 detects instances where the lower surface brush 51 fails to contact the substrate W during the cleaning process of the lower surface of the substrate W, based on the output signal from the descent detection unit 560. By displaying the detection results to the user using a display device or an audio device, the user can easily and quickly grasp the occurrence of abnormalities in the lower surface cleaning device 50.

[0128] In the basic operating example, the movement of the lower surface brush support 59 begins after the second force f2 is applied to the lower surface brush holding member 512 at time point t4. However, the movement of the lower surface brush support 59 can also begin at time point t3. In this case, the control of the electro-pneumatic regulator 521 and the control used to move the lower surface brush support 59 can be performed simultaneously. Therefore, the substrate processing throughput can be further improved.

[0129] [3] Details of the brushing action part 86 on the upper surface

[0130] (1) Structure of the brushing action part 86 on the upper surface

[0131] Figure 8 It is used to explain Figure 1 A schematic diagram of the structure of the brushing action part 86 on the upper surface. Figure 8 In, with Figure 4 Similarly, the example of the lower surface brush action part 55a is shown in a schematic side view. Figure 1 The upper surface brushing action part 86 and its surrounding components constitute the structure. For example... Figure 8 As shown, the upper surface brush actuation unit 86 includes a rotating shaft 811, an upper surface brush holding member 812, a rotational force transmission mechanism 813, a motor 814, a motor drive unit 815, a shaft member 816, a cylinder 820, an electro-pneumatic regulator 821, a linear guide 831, a load sensor 850, and a sensor support member 851.

[0132] In the upper surface cleaning apparatus 80 of this embodiment, the upper surface brush support 82 includes a housing component that houses all components of the upper surface brush actuating unit 86 except for the motor drive unit 815 and the electro-pneumatic regulator 821. This prevents particles generated by the operation of the upper surface brush holding member 812, the rotational force transmission mechanism 813, the motor 814, the shaft member 816, and the cylinder 820 from scattering within the unit housing 2. Figure 8 In order to illustrate the structure of the upper surface brush actuation part 86, the shape of the upper surface brush support part 82 is shown conceptually.

[0133] The upper surface brush support part 82 is made of Figure 2The brush holder 81 is supported by a rotating support shaft 81. A cylinder 820 is provided at the bottom of the upper brush support 82, inside the upper brush support portion 82. The upper brush holding member 812 has one end and another end in the horizontal direction. The cylinder 820 supports approximately the central portion between one end and the other end of the upper brush holding member 812. An electro-pneumatic regulator 821 is connected to the cylinder 820. Air is supplied to the cylinder 820 through the electro-pneumatic regulator 821, thereby applying an upward force to the upper brush holding member 812. By adjusting the force applied to the upper brush holding member 812 by the cylinder 820, the upper brush holding member 812 moves vertically. Alternatively, the electro-pneumatic regulator 821 may also be housed inside the upper brush support portion 82.

[0134] A rotating shaft 811 is rotatably disposed at one end of an upper surface brush holding member 812, extending upward and downward. An upper surface brush 83 is mounted at the lower end of the rotating shaft 811. The upper surface brush 83 is mounted on the rotating shaft 811 and is located outside (below) the upper surface brush support 82.

[0135] A motor 814 is mounted near the other end of the upper surface brush holding member 812. A motor drive unit 815 is connected to the motor 814. The rotation axis of the motor 814 extends in the vertical direction. A rotational force transmission mechanism 813 is provided between the rotational shaft 811 and the rotational shaft of the motor 814. The rotational force transmission mechanism 813 transmits the rotational force generated in the motor 814 to the rotational shaft 811. As a result, the upper surface brush 83 rotates. Alternatively, the motor 814 may be housed inside the upper surface brush support member 82.

[0136] A linear guide 831 is provided near the cylinder 820 at the bottom of the upper brush support 82. The linear guide 831 has a through hole extending a certain length in the vertical direction. A shaft member 816 is provided in a downwardly extending manner on a part of the upper brush holding member 812. The shaft member 816 is movably inserted into the through hole of the linear guide 831 in the vertical direction. Thus, when the upper brush holding member 812 moves due to the change in force applied to it by the cylinder 820, the linear guide 831 regulates its movement direction to the direction of the through hole (vertical direction).

[0137] The sensor support member 851 extends upward a specified distance from the bottom of the lower surface brush support 59 and bends horizontally to extend to a position below the other end of the upper surface brush retainer 812.

[0138] In the following description, the total weight of the various components supported by cylinder 820 is referred to as the total weight of the upper surface brush. Furthermore, the pushing force applied to the substrate W by the upper surface brush 83 when cleaning the upper surface of the substrate W is referred to as the upper surface cleaning pushing force. In this embodiment, the upper surface cleaning pushing force is less than the total weight of the upper surface brush.

[0139] A load sensor 850 is mounted on the portion of the sensor support member 851 located below the other end of the upper surface brush holding member 812. When the cylinder 820 does not apply force to the upper surface brush holding member 812, the other end of the upper surface brush holding member 812 abuts against the load sensor 850. Furthermore, when the cylinder 820 applies a force to the upper surface brush holding member 812 that is less than or equal to the total weight of the upper surface brush, the other end of the upper surface brush holding member 812 still abuts against the load sensor 850. In this case, the load sensor 850 outputs a signal indicating the weight of the total weight of the upper surface brush that was not offset by the cylinder 820.

[0140] For example, when the total weight of the upper surface brush is 10 (N) and an upward force of 7 (N) is applied to the upper surface brush holding member 812 from the cylinder 820, the load sensor 850 outputs a signal indicating 3 (N). Conversely, when the total weight of the upper surface brush is 10 (N) and no upward force is applied to the upper surface brush holding member 812 from the cylinder 820, the load sensor 850 outputs a signal indicating 10 (N). The signal output from the load sensor 850 is used to... Figure 3 The control department supplies 9.

[0141] (2) Basic operation of the brushing unit 86 on the upper surface

[0142] Figure 9 and Figure 10 This is a schematic side view showing the basic operation of the upper surface brushing unit 86 when the upper surface of the substrate W is cleaned by the upper surface cleaning device 80. Figure 11 It is used to explain the process. Figure 9 and Figure 10 The diagram shows the timing of the change in the upward force applied by the cylinder 820 to the upper surface brush 83 during the cleaning of the upper surface of the substrate W. Figure 11 In the timing diagram, the vertical axis represents the force applied upward from cylinder 820 to the upper surface brush 83, and the horizontal axis represents time.

[0143] At the time point t10 when the power supply to the substrate cleaning device 1 is disconnected, such as Figure 9 As shown in the upper section, with the upper surface brush holding member 812 supported by the cylinder 820, the upper surface brush holding member 812 abuts against the load sensor 850. At this time, as... Figure 11 As shown, no force is applied to the upper surface brush 83 from the cylinder 820.

[0144] Next, at the power-on time t11 of the substrate cleaning apparatus 1, control of the electro-pneumatic regulator 821 begins to apply a third force f3 upwards from the cylinder 520 to the upper surface brush 83. The electro-pneumatic regulator 821 is controlled by... Figure 3 Control unit 9 controls.

[0145] The third force f3 is preset to at least offset a portion of the weight of the upper surface brush 83. More specifically, the third force f3 is set to offset at least a portion of the total weight of the upper surface brush. In this example, the components supported by the cylinder 820 are the upper surface brush 83, the upper surface brush holding member 812, the rotational force transmission mechanism 813, the motor 814, and the shaft member 816. For example, if the total weight of the upper surface brush is 10 (N), the third force f3 can be set to 10 (N) or 9 (N). Here, the force obtained by subtracting the upper surface cleaning pushing force from the total weight of the upper surface brush is set as the fourth force f4. In this case, the third force f3 is set to be less than twice the force of the fourth force f4. If at time point t12, the force applied to the upper surface brush 83 by the cylinder 820 reaches the third force f3, the upper surface brush actuation unit 86 enters a standby state.

[0146] Next, at time t13, when the upper surface cleaning device 80 begins cleaning the substrate W, as shown... Figure 9 As shown in the middle section, the control of the electro-pneumatic regulator 821 is initiated to apply a fourth force f4 from the cylinder 820 to the upper surface brush 83.

[0147] Next, at time t14, a fourth upward force f4 is applied to the upper surface brush 83 from the cylinder 820. In this state, an upper surface cleaning push force is applied to the load sensor 850 from the other end of the upper surface brush holding member 812. Here, based on the output of the load sensor 850, the electro-pneumatic regulator 821 is controlled to correctly apply the upper surface cleaning push force from the upper surface brush holding member 812 through the load sensor 850 while the upper surface brush holding member 812 is in contact with the load sensor 850.

[0148] Next, from time point t14 to time point t15, through Figure 1 The operation of the rotating shaft drive unit 84, such as Figure 9 As shown by the hollow arrow in the lower section, the upper surface brush support 82 can be raised, lowered, and rotated. Additionally, as... Figure 10As shown in the upper section, the contact surface of the upper surface brush 83 presses against the upper surface of the substrate W. At this time, within the upper surface brush support 82, the upper surface brush holding member 812 and the upper surface brush 83 are pushed upward together, and the upper surface brush holding member 812 moves away from the load sensor 850. As a result, the upper surface brush 83 pushes the upper surface of the substrate W with the upper surface cleaning pressure. In this state, the upper surface brush 83 rotates about an axis extending in the vertical direction by the operation of the motor 814, thereby cleaning the upper surface of the substrate W.

[0149] Then, at time point t15, the cleaning of a designated area on the upper surface of substrate W is completed, as shown... Figure 11 As shown, the control of the electro-pneumatic regulator 821 is initiated to apply a third force f3 from the cylinder 820 to the upper surface brush 83. Additionally, from time point t15 to time point t16, via... Figure 1 With the operation of the rotation shaft drive unit 84, the upper surface brush 83 moves to a position away from the substrate W. Therefore, the upper surface brush actuation unit 86 returns to the standby state.

[0150] The greater the change in force generated by cylinder 820, the longer the time required to control cylinder 820. According to the basic operation, in the upper surface brush actuation unit 86, a third force f3 is applied to the upper surface brush 83 before the cleaning process is in standby mode. Therefore, by reducing the difference between the third force f3 and the fourth force f4, the time required for the control electro-pneumatic regulator 821 to apply the fourth force f4 to the upper surface brush 83 can be shortened when cleaning the upper surface of the substrate W begins from the standby state. This increases the substrate processing capacity for cleaning the upper surface of the substrate W.

[0151] In addition, such as Figure 10 As shown in the lower section, if the substrate W is damaged during the cleaning of its lower surface, the upper surface brush holding member 812 may descend, causing it to come into contact with the load sensor 850. In this case, Figure 3 The control unit 9 detects instances where the upper surface brush 83 fails to contact the substrate W during the upper surface cleaning process based on the output signal of the load sensor 850. By displaying the detection results to the user using a display device or an audio device, the user can easily and quickly grasp the occurrence of abnormalities in the lower surface cleaning device 50.

[0152] In the basic operating example, the movement of the upper surface brush support 82 begins after the fourth force f4 is applied to the upper surface brush holding member 812 at time point t14. However, the movement of the upper surface brush support 82 can also begin at time point t13. In this case, the control of the electro-pneumatic regulator 821 and the control used to move the upper surface brush support 82 can be performed simultaneously. Therefore, the substrate processing throughput can be further improved.

[0153] [4] Overall operation of substrate cleaning device 1

[0154] Figures 12-23 It is used to explain Figure 1 A schematic diagram illustrating an example of the overall operation of the substrate cleaning apparatus 1. Figures 12-23 The upper section of each shows a top view of the substrate cleaning apparatus 1. The middle section shows a side view of the lower holding device 20 and its periphery as viewed along the Y direction, and the lower section shows a side view of the lower holding device 20 and its periphery as viewed along the X direction. The side views of the middle sections correspond to... Figure 1 The side view of line AA, the side view of the lower segment corresponds to Figure 1 The BB line side view. Furthermore, to facilitate understanding of the shape and operating state of each component in the substrate cleaning apparatus 1, the magnification / reduction rate of some components differs between the top view of the upper section and the side views of the middle and lower sections. Additionally, in Figures 12-23 In the diagram, the cup 61 is represented by a two-point chain line, and the shape of the substrate W is represented by a thick one-point chain line.

[0155] In the initial state before the substrate W is transferred into the substrate cleaning apparatus 1, the gate 91 of the opening and closing device 90 closes the transfer outlet 2x. Additionally, as... Figure 1 As shown, the lower suction cups 11A and 11B are maintained such that the distance between them is sufficiently greater than the diameter of the substrate W. Similarly, the upper suction cups 12A and 12B are also maintained such that the distance between them is sufficiently greater than the diameter of the substrate W. Furthermore, the movable base 32 of the base device 30 is configured such that the center of the suction holding portion 21 is located at the center of the cup 61 when viewed from above. Additionally, the lower surface cleaning device 50 is positioned close to the movable base 32. Furthermore, the lower surface brush lifting portion 54 of the lower surface cleaning device 50 supports the lower surface brush support portion 59 such that the contact surface of the lower surface brush 51 is located below the suction holding portion 21. Furthermore, the transfer device 40 is positioned such that the plurality of support pins 41 are located below the suction holding portion 21. In the cup device 60, the cup 61 is located at the lower cup position. In the following description, the center position of the cup 61 when viewed from above will be referred to as the planar reference position rp. Furthermore, the position of the movable base 32 on the bottom surface 2a when the center of the adsorption and holding part 21 is located at the plane reference position rp when viewed from above is referred to as the first horizontal position.

[0156] Furthermore, in the initial state, a first upward force f1 is applied to the lower surface brush 51 of the lower surface cleaning device 50. In addition, a third upward force f3 is applied to the upper surface brush 83 of the upper surface cleaning device 80.

[0157] First, substrate W is moved into the unit housing 2 of the substrate cleaning apparatus 1. Specifically, just before substrate W is moved in, gate 91 opens the inlet / outlet 2x. Then, as... Figure 12 As indicated by the thick solid arrow a1, the hand (substrate holding part) RH of the substrate transfer robot (not shown) moves the substrate W into the approximate center position inside the unit housing 2 through the inlet / outlet 2x. At this time, the substrate W held by the hand RH is located between the lower suction cup 11A and the upper suction cup 12A and the lower suction cup 11B and the upper suction cup 12B.

[0158] Next, as Figure 13 As indicated by the thick solid arrow a2, the lower suction cups 11A and 11B are brought close together, so that the multiple support plates of the lower suction cups 11A and 11B are located below the lower peripheral edge of the substrate W. In this state, the handpiece RH descends and exits from the loading / unloading outlet 2x. Thus, multiple portions of the lower peripheral edge of the substrate W held at the handpiece RH are supported by the multiple support plates of the lower suction cups 11A and 11B. After the handpiece RH exits, the stop gate 91 closes the loading / unloading outlet 2x.

[0159] Next, as Figure 14 As indicated by the thick solid arrow a3, the upper suction cups 12A and 12B are brought close together, causing multiple holding tabs of the upper suction cups 12A and 12B to abut against the outer peripheral end of the substrate W. By causing multiple holding tabs of the upper suction cups 12A and 12B to abut against multiple portions of the outer peripheral end of the substrate W, the substrate W, supported by the lower suction cups 11A and 11B, is then held by the upper suction cups 12A and 12B. Thus, the center of the substrate W held by the upper holding devices 10A and 10B, when viewed from above, will coincide with or approximately coincide with the planar reference position rp. Furthermore, as... Figure 14 As indicated by the thick solid arrow a4, the movable base 32 moves forward from the first horizontal position, causing the adsorption and holding part 21 to shift a specified distance from the planar reference position rp, and bringing the center of the lower surface brush 51 to the planar reference position rp. At this time, the position of the movable base 32 located on the bottom part 2a is referred to as the second horizontal position.

[0160] Next, as Figure 15 As indicated by the thick solid arrow a5, the lower surface brush support 59, supported by the lower surface brush lifting part 54, rises, causing the contact surface of the lower surface brush 51 to contact the center of the lower surface of the substrate W. Just before the lower surface brush support 59 rises, the upward force applied to the lower surface brush 51 of the lower surface cleaning device 50 changes from a first force f1 to a second force f2. As a result, the lower surface brush 51 presses against the lower surface of the substrate W with the lower surface cleaning pressure. Furthermore, as... Figure 15 As indicated by the thick solid arrow a6, the lower surface brush 51 rotates (spins) around an axis in the vertical direction. As a result, contaminants adhering to the center of the lower surface of the substrate W are physically removed by the lower surface brush 51.

[0161] Figure 15 The enlarged detail box in the lower section shows an enlarged side view of the portion where the lower surface brush 51 contacts the lower surface of the substrate W. As shown in the enlarged detail box, with the lower surface brush 51 in contact with the substrate W, the liquid nozzle 52 and the gas ejection portion 53 are held in close proximity to the lower surface of the substrate W. At this time, the liquid nozzle 52, as indicated by the hollow arrow a51, ejects cleaning liquid toward the lower surface of the substrate W near the lower surface brush 51. Thus, by guiding the cleaning liquid supplied from the liquid nozzle 52 to the lower surface of the substrate W to the contact portion between the lower surface brush 51 and the substrate W, contaminants removed from the back side of the substrate W by the lower surface brush 51 are washed away by the cleaning liquid. For this purpose, in the lower surface cleaning apparatus 50, the liquid nozzle 52 and the lower surface brush 51 are provided together on the lower surface brush support portion 59. As a result, cleaning liquid can be supplied to the portion of the lower surface of the substrate W to be cleaned by the lower surface brush 51 with good efficiency. Therefore, the consumption of cleaning liquid is reduced, and excessive dispersion of cleaning liquid is suppressed.

[0162] Furthermore, when cleaning the lower surface of the substrate W, the rotation speed of the lower surface brush 51 is maintained at a speed such that the cleaning liquid supplied from the liquid nozzle 52 to the lower surface of the substrate W does not scatter to the side of the lower surface brush 51.

[0163] Here, the upper surface 59u of the lower surface brush support 59 is inclined downward in the direction away from the adsorption and holding part 21. In this case, if the cleaning liquid containing contaminants falls from the lower surface of the substrate W onto the lower surface brush support 59, the cleaning liquid caught by the upper surface 59u will be guided in the direction away from the adsorption and holding part 21.

[0164] Additionally, when cleaning the lower surface of the substrate W using the lower surface brush 51, the gas ejection section 53, as shown... Figure 15 As shown by the hollow arrow a52 in the enlarged detail frame, gas is sprayed toward the lower surface of the substrate W at a position between the lower surface brush 51 and the adsorption holding portion 21. In this embodiment, the gas ejection portion 53 is mounted on the lower surface brush support portion 59 such that the gas ejection port extends along the X direction. In this case, when gas is sprayed toward the lower surface of the substrate W from the gas ejection portion 53, a strip-shaped air curtain extending along the X direction is formed between the lower surface brush 51 and the adsorption holding portion 21. As a result, when the lower surface of the substrate W is cleaned with the lower surface brush 51, the phenomenon of cleaning liquid containing contaminants scattering toward the adsorption holding portion 21 is prevented. Therefore, when the lower surface of the substrate W is cleaned with the lower surface brush 51, the phenomenon of cleaning liquid containing contaminants adhering to the adsorption holding portion 21 is prevented, thereby keeping the adsorption surface of the adsorption holding portion 21 clean.

[0165] In addition, Figure 15In the example, as shown by the hollow arrow a52, gas is ejected from the gas ejection section 53 towards the lower surface brush 51 at an angle upwards, but the present invention is not limited to this. Gas can also be ejected from the gas ejection section 53 towards the lower surface of the substrate W along the Z direction.

[0166] Next, in Figure 15 In this state, after the cleaning of the central portion of the lower surface of the substrate W is completed, the lower surface brush 51 stops rotating, and the lower surface brush support 59 descends, causing the contact surface of the lower surface brush 51 to move away from the substrate W by a specified distance (greater than 0 mm and less than 10 mm, for example, about 5 mm). At this time, the force applied upward to the lower surface brush 51 changes from the second force f2 to the first force f1. Furthermore, the discharge of cleaning liquid from the liquid nozzle 52 to the substrate W stops. At this time, gas continues to be sprayed onto the substrate W from the gas ejection section 53.

[0167] After that, as Figure 16 As indicated by the thick solid arrow a7, the movable base 32 moves rearward, causing the adsorption and holding part 21 to be positioned at the planar reference position rp. That is, the movable base 32 moves from the second horizontal position to the first horizontal position. At this time, by continuing to spray gas from the gas ejection part 53 onto the substrate W, the central part of the lower surface of the substrate W is dried sequentially using the gas curtain.

[0168] Next, as Figure 17 As indicated by the thick solid arrow a8, the lower surface brush support 59 descends, causing the contact surface of the lower surface brush 51 to be positioned below the adsorption surface (upper end) of the adsorption holding part 21. Additionally, as... Figure 17 As indicated by the thick solid arrow a9, the upper suction cups 12A and 12B separate from each other, causing the multiple holding tabs of the upper suction cups 12A and 12B to leave the outer peripheral end of the substrate W. At this time, the substrate W is supported by the lower suction cups 11A and 11B.

[0169] After that, as Figure 17 As indicated by the thick solid arrow a10, the pin connecting component 42 rises, positioning the upper ends of the plurality of support pins 41 slightly above the lower suction cups 11A and 11B. Thus, the substrate W supported by the lower suction cups 11A and 11B is received by the plurality of support pins 41.

[0170] Next, as Figure 18 As indicated by the thick solid arrow a11, the lower suction cups 11A and 11B separate. At this time, the lower suction cups 11A and 11B move to a position that, when viewed from above, does not coincide with the substrate W supported by the multiple support pins 41. As a result, the upper holding devices 10A and 10B return to their initial state.

[0171] Next, as Figure 19As indicated by the thick solid arrow a12, the pin connecting member 42 descends, positioning the upper ends of the plurality of support pins 41 below the adsorption holding portion 21. Consequently, the substrate W, supported on the plurality of support pins 41, is received by the adsorption holding portion 21. In this state, the adsorption holding portion 21 adsorbs and holds the center portion of the lower surface of the substrate W. Thus, the center of the substrate W adsorbed and held by the lower holding device 20, viewed from above, coincides with or approximately coincides with the planar reference position rp. Simultaneously with the descent of the pin connecting member 42, or after the descent of the pin connecting member 42 is completed, as... Figure 19 As indicated by the thick solid arrow a13, the cup 61 rises from the lower cup position to the upper cup position.

[0172] Next, as Figure 20 As indicated by the thick solid arrow a14, the adsorption holding part 21 rotates about an axis in the vertical direction (the axis of rotation of the adsorption holding drive part 22). As a result, the substrate W adsorbed and held in the adsorption holding part 21 rotates in a horizontal position.

[0173] Next, from Figure 1 The liquid discharge nozzle 85 discharges the cleaning solution towards the upper surface of the rotating substrate W. Furthermore, Figure 20 The liquid discharge nozzle 85 is omitted from the illustration. Additionally, the rotating support shaft 81 of the upper surface cleaning device 80 rotates and lowers. Thus, as... Figure 20 As indicated by the thick solid arrow a15, the upper surface brush 83 moves to a position above the center of the substrate W, and presses against the center of the upper surface of the substrate W with the upper surface cleaning pressure. Before the rotating support shaft 81 rotates, the force applied upward to the upper surface brush 83 changes from the third force f3 to the fourth force f4.

[0174] In addition, such as Figure 20 As indicated by the thick solid arrow a16, the upper surface brush 83 moves to the outer periphery of the substrate W and then returns to its initial position. Thus, the upper surface of the substrate W is physically cleaned by the upper surface brush 83. After cleaning the substrate W with the upper surface brush 83, the upward force applied to the upper surface brush 83 changes from the fourth force f4 to the third force f3.

[0175] Next, the rotating support shaft 71 of the upper surface cleaning device 70 rotates and descends. Thus, as... Figure 21 As indicated by the thick solid arrow a17, the spray nozzle 73 moves to a position above the substrate W and descends such that the distance between the spray nozzle 73 and the substrate W becomes a predetermined distance. In this state, the spray nozzle 73 sprays a mixture of cleaning liquid and gas onto the upper surface of the substrate W. Additionally, the rotation support shaft 71 rotates. Thus, as... Figure 21As indicated by the thick solid arrow a18, the spray nozzle 73 moves to a position above the rotating substrate W. By spraying the mixed fluid onto the entire upper surface of the substrate W, the entire upper surface of the substrate W, which was cleaned by the upper surface brush 83, is cleaned again.

[0176] When the upper surface of the substrate W is cleaned using the spray nozzle 73, the lower surface brush support 59 rises, causing the contact surface of the lower surface brush 51 to contact the outer region of the lower surface of the substrate W. Just before the lower surface brush support 59 rises, the upward force applied to the lower surface brush 51 of the lower surface cleaning device 50 changes from a first force f1 to a second force f2. Additionally, as... Figure 21 As indicated by the thick solid arrow a19, the lower surface brush 51 rotates (spins) about an axis in the vertical direction. Furthermore, the liquid nozzle 52 ejects cleaning liquid toward the lower surface of the substrate W, and the gas ejection section 53 sprays gas toward the lower surface of the substrate W. In this state, further... Figure 21 As indicated by the thick solid arrow a20, the lower surface brush moving part 55 moves back and forth between an approaching position and a distant position on the movable base 32. As a result, the entire outer region of the lower surface of the substrate W, which is held and rotated by the adsorption and holding part 21, is cleaned by the lower surface brush 51. After cleaning the outer region of the lower surface of the substrate W, the lower surface brush 51 descends and leaves the substrate W. At this time, the force applied upward to the lower surface brush 51 changes from the second force f2 to the first force f1.

[0177] In addition, the cleaning of the outer region of the lower surface of the substrate W can be performed either when cleaning the upper surface of the substrate W using the spray nozzle 73 or when cleaning the upper surface of the substrate W using the upper surface brush 83.

[0178] As described above, after the outer regions of the upper and lower surfaces of the substrate W are cleaned, the upper surface brush 83, the spray nozzle 73, and the lower surface brush 51 remain in their initial positions. In this state, the cleaning solution adhering to the substrate W is shaken off by the high-speed rotation of the adsorption holding part 21, thereby allowing the entire substrate W to dry.

[0179] Next, as Figure 22 As indicated by the thick solid line arrow a21, the support cup 61 descends from the upper support cup position to the lower support cup position. Additionally, as... Figure 22 As indicated by the thick solid arrow a22, the lower suction cups 11A and 11B move closer together to a position that can support the new substrate W, preparing for the new substrate W to be moved into the unit housing 2.

[0180] Finally, the substrate W is removed from the unit housing 2 of the substrate cleaning apparatus 1. Specifically, just before the substrate W is removed, the gate 91 opens the inlet / outlet 2x. Afterwards, as... Figure 23As indicated by the thick solid arrow a23, the hand (substrate holding part) RH of the substrate transfer robot (not shown) enters the unit housing 2 through the transfer inlet / outlet 2x. Then, the hand RH receives the substrate W on the adsorption holding part 21 and exits through the transfer inlet / outlet 2x. After the hand RH exits, the stop 91 closes the transfer inlet / outlet 2x.

[0181] [5] Effects

[0182] (1) In the lower surface cleaning apparatus 50, during standby, the cylinder 520 applies a first upward force f1 to the lower surface brush 51. During cleaning, the cylinder 520 applies a second upward force f2 to the lower surface brush 51. Therefore, by reducing the difference between the first force f1 and the second force f2, the time required to control the cylinder 520 can be shortened when switching from the standby state to the cleaning state. This increases the processing capacity of cleaning the lower surface of the substrate W.

[0183] (2) In the upper surface cleaning apparatus 80, during standby, the cylinder 820 applies a third upward force f3 to the upper surface brush 83. During cleaning, the cylinder 820 applies a fourth upward force f4 to the upper surface brush 83. Therefore, by reducing the difference between the third force f3 and the fourth force f4, the time required to control the cylinder 820 can be shortened when switching from the standby state to the cleaning state. This increases the processing capacity of cleaning the upper surface of the substrate W.

[0184] (3) In the lower surface cleaning apparatus 50, the cylinder 520 supports the portion of the lower surface brush holding member 512 except for its two ends. In this case, the support state of the lower surface brush holding member 512 by the cylinder 520 is more stable than that of the lower surface brush holding member 512 when the cylinder 520 supports either of its two ends. As a result, when cleaning the substrate W, the lower surface brush 51 can be stably pressed against the lower surface of the substrate W with the lower surface cleaning push force. In addition, it is not necessary to provide the cylinder 520 near the two ends of the lower surface brush holding member 512, thereby suppressing the possibility of large-scale construction around the lower surface brush 51. Therefore, it is possible to suppress the large-scale construction around the lower surface brush 51 while effectively cleaning the lower surface of the substrate W.

[0185] (4) In the upper surface cleaning apparatus 80, the cylinder 820 supports the portion of the upper surface brush holding member 812 except for its two ends. In this case, the support state of the upper surface brush holding member 812 by the cylinder 820 is more stable than that of the case where the cylinder 820 supports either of the two ends of the upper surface brush holding member 812. As a result, when cleaning the substrate W, the upper surface brush 83 and above can be stably pressed against the upper surface of the substrate W with a surface cleaning pushing force. In addition, it is not necessary to provide the cylinder 820 near the two ends of the upper surface brush holding member 812, thereby suppressing the situation of large-scale construction around the upper surface brush 83. Therefore, it is possible to suppress the large-scale construction around the upper surface brush 83 and effectively clean the upper surface of the substrate W.

[0186] [6] Other implementation methods

[0187] (1) In the lower surface cleaning device 50 of the described embodiment, the lower surface brush actuation unit 55a is equipped with a cylinder 520 to apply an upward force to the lower surface brush 51, but the present invention is not limited thereto. A fluid cylinder, such as an oil cylinder, may be used instead of the cylinder 520 in the lower surface brush actuation unit 55a. In this case, a hydraulic supply device is used instead of the electro-pneumatic regulator 521 in the lower surface brush actuation unit 55a. The hydraulic supply device controls the force generated in the oil cylinder by adjusting the hydraulic pressure of the oil supplied to the oil cylinder.

[0188] Furthermore, in the upper surface cleaning device 80 of the described embodiment, the upper surface brush actuation unit 86 is equipped with a cylinder 820 to apply an upward force to the upper surface brush 83, but the present invention is not limited to this. A fluid cylinder, such as an oil cylinder, may be used instead of the cylinder 820 in the upper surface brush actuation unit 86. In this case, a hydraulic supply device may be used instead of the electro-pneumatic regulator 821 in the upper surface brush actuation unit 86.

[0189] (2) In the lower surface cleaning device 50 of the described embodiment, a load sensor 550 and a descent detection unit 560 are provided on the lower surface brush actuation unit 55a, but the present invention is not limited thereto. The load sensor 550 and the descent detection unit 560 may not be provided on the lower surface brush actuation unit 55a. Furthermore, in the upper surface cleaning device 80 of the described embodiment, a load sensor 850 is provided on the upper surface brush actuation unit 86, but the present invention is not limited thereto. The load sensor 850 may not be provided on the upper surface brush actuation unit 86.

[0190] (3) In the lower surface cleaning device 50 of the described embodiment, the lower surface brush actuation unit 55a is provided with a rotational force transmission mechanism 513 and a motor 514 for rotating the lower surface brush 51, but the present invention is not limited thereto. The rotational force transmission mechanism 513 and motor 514 may not be provided in the lower surface brush actuation unit 55a. Furthermore, in the upper surface cleaning device 80 of the described embodiment, the upper surface brush actuation unit 86 is provided with a rotational force transmission mechanism 813 and a motor 814 for rotating the upper surface brush 83, but the present invention is not limited thereto. The rotational force transmission mechanism 813 and motor 814 may not be provided in the upper surface brush actuation unit 86.

[0191] (4) The substrate cleaning apparatus 1 of the above embodiment only needs to include either the lower surface cleaning apparatus 50 or the upper surface cleaning apparatus 80. Alternatively, the upper surface cleaning apparatus 70 may not be provided in the substrate cleaning apparatus 1. In this case, the substrate cleaning apparatus 1 is configured to clean the upper or lower surface of the substrate W by including only either the lower surface cleaning apparatus 50 or the upper surface cleaning apparatus 80, thereby achieving miniaturization of the substrate cleaning apparatus 1 and a reduction in the number of parts.

[0192] (5) The substrate cleaning apparatus 1 of the embodiment may also be configured to clean the outer peripheral end of the substrate W held and rotated by the lower holding device 20. In this case, the substrate cleaning apparatus 1 can clean the upper surface, lower surface and the entire outer peripheral end of the substrate W.

[0193] (6) In the substrate cleaning apparatus 1 of the described embodiment, cleaning liquid is supplied to the lower surface of the substrate W from the liquid nozzle 52 when cleaning the central portion of the lower surface of the substrate W held by the upper holding devices 10A and 10B. However, the present invention is not limited to this. Alternatively, before cleaning the central portion of the lower surface of the substrate W, cleaning liquid can be supplied from the liquid nozzle 52 to the lower surface brush 51, so that a certain amount of cleaning liquid is impregnated, thereby replacing the method of supplying cleaning liquid to the lower surface of the substrate W from the liquid nozzle 52 when cleaning the central portion of the lower surface of the substrate W. In this case, the phenomenon of cleaning liquid scattering when cleaning the central portion of the lower surface of the substrate W can be prevented.

[0194] (7) In the substrate cleaning apparatus 1 of the above embodiment, cleaning liquid is supplied to the upper surface of the substrate W from the liquid discharge nozzle 85 when the upper surface brush 83 is used to clean the upper surface of the substrate W, but the present invention is not limited to this. Alternatively, the liquid discharge nozzle 85 can be arranged opposite to the upper surface brush 83 in the standby state, and before the upper surface of the substrate W is cleaned by the upper surface brush 83, cleaning liquid is supplied to the upper surface brush 83 from the liquid discharge nozzle 85 so that the substrate W is impregnated with a certain amount of cleaning liquid.

[0195] (8) In the substrate cleaning apparatus 1 of the described embodiment, with the substrate W held by the upper holding devices 10A and 10B, the central portion of the lower surface of the substrate W is cleaned using the lower surface brush 51. Additionally, with the substrate W held by the lower holding device 20, the outer region of the lower surface of the substrate W is cleaned using the lower surface brush 51. Furthermore, with the substrate W held by the lower holding device 20, the entire upper surface of the substrate W is cleaned using the upper surface brush 83.

[0196] Here, the portion of the upper surface of the substrate W that corresponds to the center of the lower surface (the portion opposite to the center of the lower surface) is called the central portion of the upper surface, and the portion of the upper surface of the substrate W that corresponds to the outer region of the lower surface (the portion opposite to the outer region of the lower surface) is called the outer region of the upper surface.

[0197] Not limited to the examples described, in the substrate cleaning apparatus 1, the substrate W may be held by the upper holding devices 10A and 10B, and the lower surface brush 51 may be used to clean the central portion of the lower surface of the substrate W, while the upper surface brush 83 may be used to clean the central portion of the upper surface of the substrate W. Alternatively, with the substrate W held by the lower holding device 20, the lower surface brush 51 may be used to clean the outer region of the lower surface of the substrate W, while the upper surface brush 83 may be used to clean the outer region of the upper surface of the substrate W.

[0198] In this case, when cleaning the central portion of the lower surface and the central portion of the upper surface of the substrate W, the central portion of the substrate W is sandwiched between the lower surface brush 51 and the upper surface brush 83. Similarly, when cleaning the outer regions of the lower surface and the outer regions of the upper surface of the substrate W, the peripheral portion of the substrate W is sandwiched between the lower surface brush 51 and the upper surface brush 83. Therefore, the lower surface cleaning pressure applied to each part of the substrate W cancels out the upper surface cleaning pressure, thereby preventing the substrate W from deforming due to the pressure applied from the lower surface brush 51 and the upper surface brush 83.

[0199] (9) The lower surface brush 51 and the upper surface brush 83 of the embodiment have basically the same structure, but in fact, the lower surface brush 51 and the upper surface brush 83 may also have different structures. For example, the contact surfaces of the lower surface brush 51 and the upper surface brush 83 may have different shapes and sizes.

[0200] [7] Correspondence between the constituent elements of the claims and the constituent elements of the embodiments

[0201] Hereinafter, examples of the correspondence between each constituent element of the claims and each element of the embodiments will be described. In the embodiments described, the adsorption holding part 21 and the upper holding devices 10A and 10B are examples of substrate holding parts, the lower surface brush 51 (or upper surface brush 83) is an example of a first cleaning tool and brush, the cylinder 520 (or cylinder 820) is an example of a first fluid cylinder, the electro-pneumatic regulator 521 (or electro-pneumatic regulator 821) is an example of a first cylinder drive part, the first force f1 (or the third force f3) is an example of a first force, the second force f2 (or the fourth force f4) is an example of a second force, and the substrate cleaning device 1 is an example of a substrate cleaning device.

[0202] Additionally, the lower surface brush holding member 512 (or the upper surface brush holding member 812) is an example of a first cleaning appliance holding member, the lower surface brush support member 59 (or the upper surface brush support member 82) is an example of a support member and a housing member, the load sensor 550 (or the load sensor 850) is an example of a load sensor, and the group including the load sensor 550, the descent detection unit 560 and the control unit 9 (or the group including the load sensor 850 and the control unit 9) is an example of an abnormality detection unit.

[0203] Additionally, the upper surface brush 83 (or lower surface brush 51) is an example of a second cleaning device, the cylinder 820 (or cylinder 520) is an example of a second fluid cylinder, the electro-pneumatic regulator 821 (or electro-pneumatic regulator 521) is an example of a second cylinder drive unit, the third force f3 (or the first force f1) is an example of a third force, and the fourth force f4 (or the second force f2) is an example of a fourth force.

[0204] Furthermore, the lower surface brush 51 and the upper surface brush 83 are examples of a cleaning device, the lower surface brush holding member 512 and the upper surface brush holding member 812 are examples of a cleaning device holding part, the cylinders 520 and 820 are examples of a fluid cylinder, and the electro-pneumatic regulators 521 and 821 are examples of a cylinder drive part.

[0205] As constituent elements of the claims, various other elements having the composition or function described in the claims may be used.

Claims

1. A substrate cleaning apparatus, comprising: The substrate holding section holds the substrate in a horizontal position; The first cleaning device is provided in such a way that it can contact one of the upper and lower surfaces of the substrate held by the substrate holding part; The first fluid cylinder applies an upward force to the first washing vessel; and The first cylinder drive unit drives the first fluid cylinder; and The first cylinder drive unit drives the first fluid cylinder by supplying fluid in standby mode, in order to apply a first upward force to the first cleaning appliance. When cleaning one side of the substrate, the first fluid cylinder is driven by supplying fluid in the following manner: when the first cleaning appliance is in contact with the one side of the substrate, a second upward force different from the first force is applied to the first cleaning appliance, thereby the first cleaning appliance pushes the one side with a predetermined force.

2. The substrate cleaning apparatus according to claim 1, wherein... The first force is set in such a way that when the first fluid cylinder applies the first upward force to the first washing instrument, at least a portion of the weight of the first washing instrument is offset.

3. The substrate cleaning apparatus according to claim 1 or 2, wherein... It also includes a first detergent holder for holding the first detergent, and The first fluid cylinder applies the first or second upward force to the first washing instrument via the first washing instrument holding part.

4. The substrate cleaning apparatus according to claim 3, further comprising: Supporting components, supporting the first fluid cylinder; and The support member moving part is configured to allow the support member to move at least in the vertical direction, and to move the support member between a contact position and a standby position. The contact position is the position where the first cleaning device contacts one side of the substrate held by the substrate holding part, and the standby position is the position where the first cleaning device is far away from the one side of the substrate held by the substrate holding part.

5. The substrate cleaning apparatus according to claim 4, wherein... The support member includes a housing component formed to accommodate the first fluid cylinder and the first detergent holder; and At least a portion of the first detergent is held by the first detergent holder in a manner located outside the outer casing component.

6. The substrate cleaning apparatus according to claim 1 or 2, wherein... It also includes a load sensor that detects the upward force applied from the first fluid cylinder to the first washing vessel; and The first cylinder drive unit adjusts the force applied by the first fluid cylinder to the first cleaning appliance based on the output of the load sensor.

7. The substrate cleaning apparatus according to claim 1 or 2, wherein... The first cleaning device includes a brush having a contact surface facing and capable of contacting one side of the substrate held by the substrate holding portion; and Viewed from above, the length between the two furthest points on the contact surface of the brush is greater than 1 / 3 of the diameter of the substrate.

8. The substrate cleaning apparatus according to claim 1 or 2, wherein It also includes an anomaly detection unit that detects the phenomenon that the first cleaning tool does not contact the side of the substrate when cleaning the side of the substrate.

9. The substrate cleaning apparatus according to claim 1 or 2, further comprising: The second cleaning device is provided in such a way that it can contact the other side of the upper and lower surfaces of the substrate held by the substrate holding part; The second fluid cylinder applies an upward force to the second washing vessel; and The second cylinder drive unit drives the second fluid cylinder; and The second cylinder drive unit drives the second fluid cylinder by applying an upward third force to the second cleaning appliance when in standby mode. When cleaning the other side of the substrate, a fourth force different from the third force is applied to the second cleaning appliance while it is in contact with the other side of the substrate. Thus, the second cleaning appliance drives the second fluid cylinder by pushing the other side with a preset force.

10. A substrate cleaning method, comprising the following steps: The substrate is held in a horizontal position by the substrate holding part; A first cleaning device for cleaning one of the upper and lower surfaces of the substrate held by the substrate holding portion is in standby mode; and The first cleaning tool is brought into contact with one side of the substrate held by the substrate holding portion, thereby cleaning that side; and The step of putting the first washing instrument into standby includes the following operation: driving the first fluid cylinder by supplying fluid in such a way as to apply a first force upward to the first washing instrument; The step of cleaning one side of the substrate includes the following operation: driving the first fluid cylinder by supplying fluid in such a way that, while the first cleaning instrument is in contact with the one side of the substrate, a second force, which is upward and different from the first force, is applied to the first cleaning instrument, thereby the first cleaning instrument pushes the one side with a predetermined force.

11. The substrate cleaning method according to claim 10, wherein... The first force is set in such a way that when the first fluid cylinder applies the first upward force to the first washing instrument, at least a portion of the weight of the first washing instrument is offset.

12. The substrate cleaning method according to claim 10 or 11, further comprising the following steps: The force applied upwards from the first fluid cylinder to the first washing vessel is detected by a load sensor; and Based on the output of the load sensor, the force applied by the first fluid cylinder to the first cleaning appliance is adjusted.

13. The substrate cleaning method according to claim 10 or 11, wherein... The step of cleaning one side of the substrate includes detecting a phenomenon where the first cleaning tool is not in contact with the side.

14. The substrate cleaning method according to claim 10 or 11, further comprising the following steps: A second cleaning device for cleaning the other side of the upper and lower surfaces of the substrate held by the substrate holding portion is in standby mode; and The other side of the substrate is cleaned by bringing the second cleaning tool into contact with the other side of the substrate held by the substrate holding portion; and The step of putting the second washing device into standby includes the following operation: driving the second fluid cylinder by applying a third upward force to the second washing device; The step of cleaning the other side of the substrate includes the following operation: while the second cleaning tool is in contact with the other side of the substrate, a fourth force, which is upward and different from the third force, is applied to the second cleaning tool, thereby driving the second fluid cylinder by pushing the other side with a predetermined force.

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