A method for manufacturing a display module and a display module

Abstract

The present invention discloses a method for manufacturing a display module and a display module, wherein the manufacturing method comprises: providing a substrate; arranging a light emitting element on the substrate to obtain a light board to be sealed with glue; arranging a first glue layer on the light board to be sealed with glue, wherein the first glue layer covers the light emitting element to obtain an intermediate light board; arranging a second glue layer covering the first glue layer on the intermediate light board to obtain a display module. In the present application, after arranging a first glue layer to encapsulate the light emitting element in the process of manufacturing the display module, the second glue layer is continuously coated on the first glue layer to form two glue layers on the side of the light emitting element, thereby increasing the blocking effect on the light emitted from the side of the light emitting element, thereby reducing the occurrence of side light leakage of the display module.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor display technology, and in particular to a manufacturing method of a display module and a display module. Background Art

[0002] In the semiconductor industry, light emitting diode (LED) chips are increasingly widely used due to their good energy saving and long service life. The display module of the prior art includes a substrate, and a plurality of LED chips, a packaging layer and a diffusion layer sequentially arranged on the substrate. The packaging layer is used to prevent the LED chip from being corroded by air, and the diffusion layer is used to improve the uniformity of light output on the display module to obtain a better display effect.

[0003] However, the packaging layer and diffusion layer of the existing display module only focus on the light emitting effect directly above the LED chip. When the LED chip emits light, light is emitted from the front and sides. Therefore, the display module is prone to side light leakage, which affects the visual effect of the display module.

[0004] Therefore, the prior art still needs to be improved and developed. Summary of the invention

[0005] In view of the above-mentioned deficiencies in the prior art, an object of the present invention is to provide a method for manufacturing a display module and a display module, aiming to solve the problem of side light leakage of the display module.

[0006] The technical solution of the present invention is as follows:

[0007] A method for manufacturing a display module, wherein the manufacturing method comprises:

[0008] providing a substrate;

[0009] Arranging light-emitting elements on the substrate to obtain a light board to be sealed with glue;

[0010] A first glue layer is provided on the lamp board to be sealed with glue, wherein the first glue layer covers the light emitting element to obtain an intermediate lamp board;

[0011] A second adhesive layer covering the first adhesive layer is arranged on the middle light panel to obtain a display module.

[0012] The manufacturing method of the display module, wherein the substrate comprises a mounting portion and an edge portion surrounding the mounting portion; the step of arranging a light emitting element on the substrate to obtain a light board to be sealed with glue comprises:

[0013] A light-emitting element is arranged on the mounting portion to obtain a light board to be sealed with glue.

[0014] In the manufacturing method of the display module, the width of the edge portion is 10-20 mm.

[0015] The manufacturing method of the display module, wherein the light-emitting elements are provided in plurality, and the plurality of light-emitting elements are arranged in a rectangular array on the substrate to form a light-emitting assembly; the step of providing a first glue layer covering the light-emitting elements on one side of the light board to be sealed with glue to obtain the intermediate light board comprises:

[0016] Applying a first colloid on the lamp board to be sealed with glue, so that the first colloid covers the front and side surfaces of each of the light-emitting elements;

[0017] The first colloid on the substrate that is located on the side of the light-emitting component and is greater than 0.5 mm away from the light-emitting component is removed to form a first glue layer to obtain an intermediate light board.

[0018] The manufacturing method of the display module, wherein the step of removing the first colloid on the substrate which is located on the side of the light-emitting component and is greater than 0.5 mm away from the light-emitting component to form a first glue layer to obtain an intermediate light board includes:

[0019] Removing the first colloid on the substrate which is located on the side of the light-emitting component and is greater than 0.5 and less than 2.5 mm away from the light-emitting component to form a separation groove;

[0020] The first colloid on the substrate located on the side of the separation groove away from the light-emitting component is removed to form a first glue layer to obtain an intermediate light board.

[0021] The manufacturing method of the display module, wherein the step of providing a second adhesive layer covering the first adhesive layer on the middle light board to obtain the display module comprises:

[0022] Applying a second colloid on the middle light board to cover the front and side surfaces of the first colloid layer;

[0023] Removing the second colloid on the substrate which is located on the side of the first adhesive layer and is greater than 1 mm away from the light-emitting component to form a second adhesive layer;

[0024] The substrate protruding from the second adhesive layer is cut off to obtain a display module.

[0025] In the manufacturing method of the display module, the substrate is a printed circuit board.

[0026] The manufacturing method of the display module, wherein the first adhesive layer is a light-transmitting adhesive layer; and / or,

[0027] The second adhesive layer is a black adhesive layer.

[0028] The present application also discloses a display module, wherein the display module is manufactured using any of the above-mentioned manufacturing methods for the display module.

[0029] The display module comprises a substrate, a light-emitting component, a first adhesive layer and a second adhesive layer, wherein the light-emitting component is arranged on the substrate; the first adhesive layer is arranged on the substrate to cover the light-emitting component; the second adhesive layer is arranged on the substrate to cover the first adhesive layer.

[0030] The display module, wherein the light-emitting component includes a plurality of light-emitting elements; and / or the thickness of the first adhesive layer on the side of the light-emitting component is 0.3-0.5 mm.

[0031] The display module, wherein the thickness of the second adhesive layer on the side of the first adhesive layer is 0.3-0.5 mm.

[0032] Compared with the prior art, the embodiments of the present invention have the following advantages:

[0033] During use of the display module disclosed in the present application, light will be emitted from both the front and side surfaces of the light-emitting element, but the light emitted from the side surfaces is weaker than that emitted from the front surface, and the light transmission capability of the front surface of the light-emitting element is stronger than that of the side surfaces; during the manufacturing process of the display module, after a first adhesive layer for encapsulating the light-emitting element is provided on the substrate, a second adhesive layer is further provided on the first adhesive layer, and the thickness of the encapsulating adhesive layer on the display module is directly increased by adding the second adhesive layer, so that the light emitted by the light-emitting element needs to overcome more resistance to be transmitted to the air, while the light emitted from the front surface of the light-emitting element has a strong transmission capability, so the light can still penetrate the first adhesive layer and the second adhesive layer to be emitted, while the light transmission capability of the side surfaces of the light-emitting element is weak and cannot penetrate the two adhesive layers, that is, when the display module is working, only the light emitted in the forward direction can be observed, while the light emitted in the side direction cannot be seen, thereby solving the problem of light leakage when viewed from the side of the display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0035] Figure 1 is a flow chart of a method for manufacturing a display module in the present invention;

[0036] Figure 2 It is a schematic diagram of an intermediate process of the manufacturing process of the display module in the present invention.

[0037] Among them, 1. substrate; 2. light-emitting element; 3. light-emitting component; 4. first colloid; 5. first adhesive layer; 6. second colloid; 7. second adhesive layer. DETAILED DESCRIPTION

[0038] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0039] In the prior art, LED chips are widely used in semiconductor fields such as display panels, display screens, and display modules. Before using LED chips in practical applications, they must be packaged and assembled on display modules. In order to improve the display brightness, many LED chips are usually arranged on the display module. At the same time, in order to make the light emission effect of the entire light-emitting surface good, there is also a design of setting a diffusion layer or a fluorescent layer on the packaging glue layer of the display module to reduce the concentrated emission of light on the display module and improve the light emission uniformity of the display module.

[0040] However, the light-emitting element is an electronic device that can emit light from the front and the side at the same time. Therefore, when the display module is working, the side light of the light-emitting element can easily make the side visual effect of the display module poor, resulting in the problem of side light leakage.

[0041] It should be noted that the substrate involved in the embodiments disclosed in the present invention is a printed circuit board (PCB board for short). The PCB board can well support and fix the LED chip.

[0042] It should be noted that the light-emitting elements involved in the embodiments disclosed in the present invention include but are not limited to LED chips suitable for display screens such as OLED, mini LED, and Micro LED.

[0043] See also Figure 1 In one embodiment of the present invention, a method for manufacturing a light emitting element 2 board is disclosed, wherein the manufacturing method comprises:

[0044] S100, providing a substrate 1;

[0045] S200, arranging the light emitting element 2 on the substrate 1 to obtain a light board to be sealed with glue;

[0046] S300, setting a first glue layer 5 on the lamp board to be sealed with glue, wherein the first glue layer 5 covers the light emitting element 2 to obtain an intermediate lamp board;

[0047] S400, disposing a second adhesive layer 7 covering the first adhesive layer 5 on the middle light board to obtain a light emitting element 2 board.

[0048] During the use of the light-emitting element 2 board disclosed in the present application, both the front and side surfaces of the light-emitting element 2 will emit light, but the light emitted from the side surfaces is weaker than the light emitted from the front surface, and the transmission ability of the front surface of the light-emitting element 2 is stronger than the transmission ability of the side surfaces; during the manufacturing process of the light-emitting element 2 board, after the first adhesive layer 5 for encapsulating the light-emitting element 2 is set on the substrate 1, the second adhesive layer 7 is further set on the first adhesive layer 5, and the thickness of the encapsulating adhesive layer on the light-emitting element 2 board is directly increased by adding the second adhesive layer 7, so that the light emitted by the light-emitting element 2 needs to overcome more resistance to be transmitted to the air, while the light emitted from the front surface of the light-emitting element 2 has a strong transmission ability, so the light can still penetrate the first adhesive layer 5 and the second adhesive layer 7, the side light of the light emitting element 2 has a weak transmission ability and cannot penetrate the two adhesive layers, that is, when the light emitting element 2 is working, only the light emitted in the forward direction can be observed, but the light emitted from the side cannot be seen; and when the light emitted from the side of the light emitting element 2 is obliquely emitted toward the first adhesive layer 5 and the second adhesive layer 7, the incident angle of the light on the surface of the first adhesive layer 5 and the second adhesive layer 7 is relatively large, and total reflection may occur, so that the side light cannot penetrate the first adhesive layer 5 and the second adhesive layer 7 on the side; therefore, the method of arranging the second adhesive layer 7 on the first adhesive layer 5 can solve the problem of light leakage when the light emitting element 2 is viewed from the side, and improve the visual effect of the light emitting element 2 during use.

[0049] Specifically, as an implementation method of the embodiment of the present invention, it is disclosed that the substrate 1 includes a mounting portion and an edge portion surrounding the periphery of the mounting portion; the step S200 specifically includes: arranging the light-emitting element 2 on the mounting portion to obtain a light board to be sealed with glue. The light-emitting element 2 is arranged in the middle of the substrate 1 as much as possible, and the edge portion is reserved for one purpose to protect the light-emitting element 2. The edge portion of the light-emitting element 2 is more easily contacted during use, and is prone to collision or friction. The light-emitting element 2 is arranged on the mounting portion to reduce the risk of collision or wear; secondly, it is convenient to arrange the first glue layer 5 and the second glue layer 7 on the substrate 1 later. During the glue coating process, the edge portion of the substrate 1 can provide glue support. For example, in this embodiment, an edge portion with a width of 10-20 mm is arranged. If the width of the edge portion is too small, it is easy to cause the colloid to be unable to support a sufficient volume, and the first glue layer 5 and the second glue layer 7 that meet the thickness requirements cannot be achieved. When the width of the edge portion is 10-20 mm, there is enough space to prevent the colloid from detaching from the side wall of the light-emitting element 2 due to flow until the colloid is solidified to form a glue layer.

[0050] Specifically, as another implementation of the embodiment of the present invention, it is disclosed that the light-emitting element 2 is provided with a plurality of light-emitting elements 2, and the plurality of light-emitting elements 2 are arranged in a rectangular array on the substrate 1 to form a light-emitting assembly 3; the step S300 specifically includes:

[0051] S301, applying a first colloid 4 on the lamp board to be sealed, so that the first colloid 4 covers the front and side surfaces of each of the light-emitting elements 2;

[0052] S302, removing the first colloid 4 on the substrate 1 which is located on the side of the light emitting component 3 and is greater than 0.5 mm away from the light emitting component 3, to form a first adhesive layer 5, so as to obtain an intermediate light board.

[0053] After the first colloid 4 is coated on the lamp board to be sealed, the first colloid 4 is filled around and on the top surface of each light-emitting element 2, and the first colloid 4 is also filled between two adjacent light-emitting elements 2. The air around the light-emitting element 2 is discharged through the first colloid 4, firstly, to prevent the air from corroding the light-emitting element 2, and secondly, to prevent the air from affecting the light-emitting effect of the light-emitting element 2, so as to achieve the encapsulation of the light-emitting element 2; then, the excess first colloid 4 on the side of the light-emitting component 3 is removed, in order to control the size of the light-emitting element 2 board, to avoid the situation that the side of the light-emitting element 2 board is too thick, which affects the appearance of the light-emitting element 2 board, in view of the current market's preference for borderless or narrow-border LED display screens, manufacturing narrower borders is conducive to improving market competitiveness; moreover, the first glue layer 5 only serves to encapsulate the LED, so it does not need to be set too thick, and the thickness of the first glue layer 5 on the side of the light-emitting component 3 is set to be less than or equal to 0.5 mm, which can also save materials and costs.

[0054] like Figure 2 As shown in FIG. (b) and FIG. (c) of FIG. 1 , as another implementation of the embodiment of the present invention, step S302 specifically includes:

[0055] The first colloid 4 on the substrate 1 which is located on the side of the light-emitting component 3 and is greater than 0.5 and less than 2.5 mm away from the light-emitting component 3 is removed to form a separation groove;

[0056] The first colloid 4 on the substrate 1 located on the side of the separation groove away from the light-emitting component 3 is removed to form a first adhesive layer 5 to obtain an intermediate light board.

[0057] During the manufacturing process of the present application, because the first adhesive layer 5 set on the side of the light-emitting component 3 as required is very thin and easy to be damaged, part of the first colloid 4 is first removed to form a separation groove with a width of about 2 mm, and the excess first colloid 4 is first separated from the first adhesive layer 5 to be retained, and then the excess first colloid 4 is cleaned. During the cleaning process, the first adhesive layer 5 will not be frequently touched, reducing the contact with the first adhesive layer 5 on the side of the light-emitting component 3 during the cleaning process, and preventing the integrity of the first adhesive layer 5 from being damaged.

[0058] like Figure 2 As shown in FIG. (e), FIG. (f) and FIG. (g), as another implementation of the embodiment of the present invention, step S400 specifically includes:

[0059] Applying a second colloid 6 on the middle light board to cover the front and side surfaces of the first colloid layer 5;

[0060] The second colloid 6 on the substrate 1 which is located on the side of the first adhesive layer 5 and is greater than 1 mm away from the light-emitting component 3 is removed to form a second adhesive layer 7;

[0061] The substrate 1 protruding from the second adhesive layer 7 is cut off to obtain a light emitting element 2 plate.

[0062] After the first adhesive layer 5 is formed, the second colloid 6 is continuously applied. Without changing the equipment, the light-emitting element 2 board can be processed. The second colloid 6 is applied in the same manner as the first colloid 4, so that the second colloid 6 covers the first adhesive layer 5, and then the excess second colloid 6 on the side of the first adhesive layer 5 is removed, so that the total thickness of the first adhesive layer 5 and the second adhesive layer 7 on the side of the light-emitting component 3 is about 1 mm. If it is too thin, there will not be enough blocking ability, and the light emitted from the side of the light-emitting element 2 may penetrate the first adhesive layer 5 and the second adhesive layer 7 and be emitted into the air; if it is too thick, it will affect the frame size of the light-emitting element 2 board. Furthermore, after the second adhesive layer 7 is made, the substrate 1 protruding from the second adhesive layer 7 is also cut off, so that the side of the substrate 1 is flush with the side of the second adhesive layer 7, further reducing the size of the substrate 1, saving space and materials.

[0063] Specifically, as another implementation of the embodiment of the present invention, it is disclosed that the first adhesive layer 5 is a light-transmitting adhesive layer; and / or the second adhesive layer 7 is a black adhesive layer. The first adhesive layer 5 mainly serves to encapsulate the light-emitting element 2. It is convenient to check whether there are bubbles, impurities and other defects in the adhesive layer after manufacturing. The second adhesive layer 7 is mainly to increase the restriction on the side light emission of the LED chip. The black adhesive layer is set. The black adhesive has better light blocking properties, and the black color absorbs light, which makes it easier to absorb and block the light emitted laterally from the light-emitting element 2 board, and can better solve the problem of side light leakage.

[0064] Preferably, as another embodiment of the present invention, a method for preparing a light emitting element 2 board is specifically disclosed, comprising:

[0065] 1. If Figure 2 As shown in Figure (a), multiple light-emitting elements 2 are arranged in a rectangular array to form a light-emitting component 3 which is attached to a PCB board to obtain a light board to be sealed with glue; wherein, the distance from the light-emitting component 3 to the edge of the light board is d, taking 10 mm as an example.

[0066] 2. If Figure 2 As shown in FIG. (b), the surface of the light board to be sealed with glue and on which the light emitting element 2 is arranged is completely covered with the first colloid 4, and the first colloid 4 is a transparent colloid;

[0067] 3. Such as Figure 2 As shown in FIG. (c), a 2 mm wide separation groove is cut at a distance of 0.5 mm from the side wall of the light emitting component 3, so that the first colloid 4 is divided into two parts, and a first glue layer 5 is formed on the light emitting component 3, and then, as shown in FIG. Figure 2 As shown in FIG. (d), the first colloid 4 at the edge is removed, and the first glue layer 5 is retained to obtain the middle light board;

[0068] 4. If Figure 2 As shown in FIG. (e), the surface of the middle light board provided with the first adhesive layer 5 is completely covered with the second adhesive 6, and the second adhesive 6 is a black adhesive;

[0069] 5. If Figure 2 As shown in FIG. (f), the second colloid 6 beyond 1 mm from the side wall of the light emitting component 3 is cut off to form a second glue layer 7;

[0070] 6. If Figure 2 As shown in FIG. 7 (g), align the second adhesive layer 7, cut off the protruding part of the PCB board, and obtain the light-emitting element 2 board.

[0071] See also Figure 2 FIG. (g) in the figure, as another embodiment of the present invention application, further discloses a light-emitting element 2 plate, wherein the light-emitting element 2 plate is manufactured by any of the above-described methods for manufacturing the light-emitting element 2 plate.

[0072] Specifically, as an implementation method of an embodiment of the present invention, the light-emitting element 2 board includes a substrate 1, a light-emitting component 3, a first adhesive layer 5 and a second adhesive layer 7. The light-emitting component 3 is arranged on the substrate 1; the first adhesive layer 5 is arranged on the substrate 1, covering the light-emitting component 3; the second adhesive layer 7 is arranged on the substrate 1, covering the first adhesive layer 5. The light-emitting element 2 board with the second adhesive layer 7 manufactured by the above method can avoid the problem of light leakage from the side view of the light-emitting element 2 board, and improve the display effect. Among them, the first adhesive layer 5 is a transparent adhesive layer, and the second adhesive layer 7 is a black adhesive layer.

[0073] Specifically, as another implementation of the embodiment of the present invention, it is disclosed that the light-emitting assembly 3 includes a plurality of light-emitting elements 2. The first adhesive layer 5 and the second adhesive layer 7 are provided on the light-emitting element 2 board, which inevitably affects the light output brightness of the light-emitting element 2 board. The light-emitting assembly 3 composed of a plurality of light-emitting elements 2 is provided, and a plurality of light sources are provided, so that the intensity of the light output from the front of the light-emitting element 2 board is higher, thereby improving the brightness of the light-emitting element 2 board.

[0074] Specifically, as another implementation of the embodiment of the present invention, it is disclosed that the thickness of the first adhesive layer 5 on the side surface of the light emitting component 3 is 0.3-0.5 mm.

[0075] Specifically, as another implementation of the embodiment of the present invention, it is disclosed that the thickness of the second adhesive layer 7 on the side of the first adhesive layer 5 is 0.3-0.5 mm.

[0076] It should be understood that the present invention is not limited to the exact construction that has been described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present invention is limited only by the appended claims.

[0077] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for manufacturing a display module, characterized in that: The manufacturing method comprises: providing a substrate; Arranging light-emitting elements on the substrate to obtain a light board to be sealed with glue; A first glue layer is provided on the lamp board to be sealed with glue, wherein the first glue layer covers the light emitting element to obtain an intermediate lamp board; Disposing a second adhesive layer covering the first adhesive layer on the middle light panel to obtain a display module; There are a plurality of light-emitting elements, and the plurality of light-emitting elements are arranged on the substrate in a rectangular array to form a light-emitting assembly; The step of providing a first glue layer covering the light emitting element on one side of the light board to be glued to obtain the intermediate light board comprises: Applying a first colloid on the lamp board to be sealed with glue, so that the first colloid covers the front and side surfaces of each of the light-emitting elements; The first colloid on the substrate that is located on the side of the light-emitting component and is greater than 0.5 mm away from the light-emitting component is removed to form a first glue layer to obtain an intermediate light board.

2. The method for manufacturing a display module according to claim 1, characterized in that: The substrate comprises a mounting portion and an edge portion surrounding the periphery of the mounting portion; The step of arranging light-emitting elements on the substrate to obtain a light board to be sealed with glue comprises: A light-emitting element is arranged on the mounting portion to obtain a light board to be sealed with glue.

3. The method for manufacturing a display module according to claim 2, characterized in that: The width of the edge portion is 10-20 mm.

4. The method for manufacturing a display module according to claim 1, wherein: The step of removing the first colloid on the substrate which is located on the side of the light-emitting component and is greater than 0.5 mm away from the light-emitting component to form a first glue layer to obtain an intermediate light board includes: Removing the first colloid on the substrate which is located on the side of the light-emitting component and is greater than 0.5 and less than 2.5 mm away from the light-emitting component to form a separation groove; The first colloid on the substrate located on the side of the separation groove away from the light-emitting component is removed to form a first glue layer to obtain an intermediate light board.

5. The method for manufacturing a display module according to claim 1, characterized in that: The step of providing a second adhesive layer covering the first adhesive layer on the middle light panel to obtain a display module comprises: Applying a second colloid on the middle light board to cover the front and side surfaces of the first colloid layer; Removing the second colloid on the substrate which is located on the side of the first adhesive layer and is greater than 1 mm away from the light-emitting component to form a second adhesive layer; The substrate protruding from the second adhesive layer is cut off to obtain a display module.

6. The method for manufacturing a display module according to any one of claims 1 to 5, characterized in that: The substrate is a printed circuit board.

7. The method for manufacturing a display module according to any one of claims 1 to 5, characterized in that: The first adhesive layer is a light-transmitting adhesive layer; and / or, The second adhesive layer is a black adhesive layer.

8. A display module, characterized in that: The display module is manufactured by the manufacturing method of the display module according to any one of claims 1 to 7.

9. The display module according to claim 8, characterized in that: The display module comprises: substrate; A light-emitting component is disposed on the substrate; A first adhesive layer is disposed on the substrate and covers the light-emitting component; and The second adhesive layer is disposed on the substrate and covers the first adhesive layer.

10. The display module according to claim 9, characterized in that: The light emitting assembly comprises a plurality of light emitting elements and / or, The thickness of the first adhesive layer on the side surface of the light-emitting component is 0.3-0.5 mm.

11. The display module according to claim 10, characterized in that: The thickness of the second adhesive layer on the side of the first adhesive layer is 0.3-0.5 mm.

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