Vibration generating device, operating method thereof, and device including the vibration generating device

Abstract

Disclosed are a vibration generating device, an operating method thereof, a device including the vibration generating device, and a vibration device driver. The vibration generating device includes: a vibration device; and a vibration driving circuit including a driving signal generator configured to provide a driving signal to the vibration device, wherein the driving signal generator is configured to set a frequency-based gain compensation value based on at least one of a circuit internal temperature value of the vibration driving circuit and a temperature prediction value of the vibration device corresponding to a current value of an nth driving signal; compensate the frequency-based gain value based on the set frequency-based gain compensation value; compensate an (n+1)th driving signal based on the compensated frequency-based gain value; and provide the compensated (n+1)th driving signal to the vibration device.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to Korean Patent Application No. 10-2020-0190063, filed on December 31, 2020, which is hereby incorporated by reference in its entirety. Technical Field

[0003] The present disclosure relates to a vibration generating device, an operating method thereof, and a device including the vibration generating device. Background Art

[0004] The device for generating vibration includes a piezoelectric element. The structure of the piezoelectric element generates capacitance in the piezoelectric element, and the capacitance in the piezoelectric element changes with temperature.

[0005] Because the capacitance in the piezoelectric element affects the drive signal output from the vibration drive circuit and provided to the piezoelectric element, changes in the capacitance in the piezoelectric element change the drive signal. When an undesirable drive signal is provided to the piezoelectric element, the piezoelectric element malfunctions. Summary of the Invention

[0006] Therefore, the inventors of the present disclosure have recognized the above-mentioned problems and have conducted various experiments on a vibration generating device for providing a driving signal whose characteristics do not change due to temperature environment. Based on the various experiments, the inventors of the present disclosure have invented a vibration generating device for providing a driving signal whose characteristics do not change due to temperature environment.

[0007] Accordingly, embodiments of the present disclosure are directed to providing a vibration generating device, an operating method thereof, and a device including the same that substantially obviate one or more problems due to the above limitations and disadvantages.

[0008] One aspect of the present disclosure is to provide a vibration generating device configured to provide a driving signal whose characteristics do not change due to a temperature environment, a method of operating the vibration generating device, and a device including the vibration generating device.

[0009] Another aspect of the present disclosure is to provide a vibration generating device, an operating method thereof, and a device including the vibration generating device, which predicts an internal temperature value of the vibration device based on a current value of a driving signal, compensates the driving signal based on the predicted internal temperature value of the vibration device, and provides the compensated driving signal to the vibration device.

[0010] Another aspect of the present disclosure is directed to providing a vibration generating device, an operating method thereof, and a device including the same, which compensates a driving signal based on an internal temperature value of a vibration driving circuit and provides the compensated driving signal to a vibration device.

[0011] Another aspect of the present disclosure is to provide a vibration generating device, an operating method thereof, and a device including the vibration generating device, which compensates a driving signal based on an internal temperature value of a vibration driving circuit and an internal temperature value of the vibration device predicted based on a current value of the driving signal, and provides the compensated driving signal to the vibration device.

[0012] Additional features and aspects will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the inventive concepts presented herein. Other features and aspects of the inventive concepts may be realized and attained by the structure particularly pointed out or derivable from the written description, the claims thereof, and the accompanying drawings.

[0013] To achieve these and other aspects of the present disclosure as implemented and broadly described herein, a vibration generating device includes a vibration device and a vibration driving circuit, the vibration driving circuit including a driving signal generator configured to provide a driving signal to the vibration device, the driving signal generator configured to set or adjust a frequency-based gain compensation value based on at least one of a circuit internal temperature value of the vibration driving circuit and a temperature prediction value of the vibration device corresponding to a current value of an nth driving signal, compensate the frequency-based gain value based on the set or adjusted frequency-based gain compensation value, compensate the (n+1)th driving signal based on the compensated frequency-based gain value, and provide the compensated (n+1)th driving signal to the vibration device.

[0014] In another aspect, a device includes a vibration member and a vibration generating device that causes the vibration member to vibrate and includes a vibration device and a vibration driving circuit, the vibration driving circuit including a driving signal generator that provides a driving signal to the vibration device, and the driving signal generator is configured to set or adjust a frequency-based gain compensation value based on at least one of a circuit internal temperature value of the vibration driving circuit and a temperature prediction value of the vibration device corresponding to a current value of an nth driving signal, compensate the frequency-based gain value based on the set or adjusted frequency-based gain compensation value, compensate an (n+1)th driving signal based on the compensated frequency-based gain value, and provide the compensated (n+1)th driving signal to the vibration device.

[0015] On the other hand, an operating method of a vibration generating device includes: providing an nth driving signal to the vibration device; measuring a circuit internal temperature value of a vibration driving circuit; measuring a driving signal current value of the nth driving signal; setting or adjusting a temperature prediction value of the vibration device corresponding to the driving signal current value; and generating an (n+1)th driving signal and compensating the (n+1)th driving signal based on a compensation value.

[0016] On the other hand, a vibration device driver for providing a drive signal to a vibration device includes: a temperature measurer configured to measure a temperature value inside a circuit of the vibration device driver; a temperature predictor configured to predict a predicted temperature value of the vibration device based on a current value of the drive signal; and a drive signal generator configured to set a compensation value for the drive signal based on at least one of the temperature value inside the circuit of the vibration device driver and the predicted temperature value of the vibration device, and to compensate the drive signal based on the compensation value to output a compensated drive signal.

[0017] The vibration generating device and operating method thereof according to an embodiment of the present disclosure can predict an internal temperature value of the vibration device based on the current value of a driving signal, compensate the driving signal based on the predicted internal temperature of the vibration device, and provide the compensated driving signal to the vibration device, thereby offsetting the adverse effects caused by the internal temperature of the vibration device when the driving signal flows in the vibration device.

[0018] The vibration generating device and operating method thereof according to an embodiment of the present disclosure can compensate the driving signal based on the internal temperature value of the vibration driving circuit, and provide the compensated driving signal to the vibration device, thereby offsetting the adverse effects caused by the internal temperature of the vibration driving circuit when the driving signal flows in the vibration driving circuit.

[0019] The vibration generating device and operating method thereof according to an embodiment of the present disclosure can compensate the driving signal based on the internal temperature value of the vibration driving circuit and the internal temperature value of the vibration device predicted based on the current value of the driving signal, and can provide the compensated driving signal to the vibration device, thereby offsetting the adverse effects caused by the internal temperature of the vibration driving circuit when the driving signal flows in the vibration driving circuit, and offsetting the adverse effects caused by the internal temperature of the vibration device when the driving signal flows in the vibration device.

[0020] The vibration generating device and operating method thereof according to an embodiment of the present disclosure can provide a drive signal to the vibration device that is compensated based on the internal temperature environment of the vibration device and the internal temperature environment of the vibration drive circuit, thereby causing the vibration device to vibrate based on the compensated drive signal to adapt to the temperature environment. Therefore, it is possible to minimize the degradation of the sound characteristics generated by the vibration of the vibration member based on the vibration of the vibration device.

[0021] Other systems, methods, features, and advantages will be or become apparent to one skilled in the art upon examination of the following figures and detailed description. It is intended that all such additional systems, methods, features, and advantages be included herein, be within the scope of the present disclosure, and be protected by the following claims. Nothing in this section should be construed as limiting the claims. Additional aspects and advantages are discussed below in conjunction with the embodiments of the present disclosure.

[0022] It is to be understood that both the foregoing general description and the following detailed description of the present disclosure are exemplary and explanatory and are intended to provide further explanation of the disclosure as claimed. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings, which are included to provide a further understanding of the disclosure and are incorporated in and constitute a part of this application, illustrate embodiments of the disclosure and together with the description serve to explain the principles of the disclosure.

[0024] Figure 1 A vibration generating device according to an embodiment of the present disclosure is shown.

[0025] Figure 2 A vibration device according to an embodiment of the present disclosure is shown.

[0026] Figure 3 A vibration device according to another embodiment of the present disclosure is shown.

[0027] Figure 4 It is along Figure 3 A cross-sectional view taken along line II' shown in FIG.

[0028] Figures 5A to 5F Shown Figure 4 The vibrating portion of the vibrating device shown.

[0029] Figure 6 An apparatus according to an embodiment of the present disclosure is shown.

[0030] Figure 7 It is along Figure 6 sectional view taken along line II-II' shown in FIG.

[0031] Figure 8 is a flowchart illustrating the operation of the vibration generating device according to an embodiment of the present disclosure.

[0032] Throughout the drawings and detailed description, unless otherwise described, the same drawing reference numerals should be understood to refer to the same elements, features, and structures. The relative size and depiction of these elements may be exaggerated for clarity, illustration, and convenience. DETAILED DESCRIPTION

[0033] Reference will now be made in detail to embodiments of the present disclosure, examples of which may be shown in the accompanying drawings. In the following description, detailed descriptions of known functions or configurations associated with this document will be omitted when it is determined that such detailed descriptions would unnecessarily obscure the main points of the inventive concept. The described progression of processing steps and / or operations are examples; however, the order of the steps and / or operations is not limited to the order set forth herein and may be changed as is known in the art, except that the steps and / or operations must occur in a particular order. The same reference numerals represent the same elements throughout. The names of the various elements used in the following description have been selected solely for ease of writing this specification and may therefore be different from those used in actual products.

[0034] The advantages and features of the present disclosure and their implementation methods will be illustrated by the following embodiments described with reference to the accompanying drawings. However, the present disclosure may be implemented in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided to make the present disclosure thorough and complete and to fully convey the scope of the present disclosure to those skilled in the art. Furthermore, the present disclosure is limited only by the scope of the claims.

[0035] The shapes, sizes, proportions, angles and quantities disclosed in the drawings for describing the embodiments of the present disclosure are merely examples, and therefore, the embodiments of the present disclosure are not limited to the details shown. The same reference numerals always represent the same elements. In the following description, when it is determined that a detailed description of a related known function or configuration unnecessarily obscures the main points of the present disclosure, the detailed description will be omitted. When "including", "having" and "comprising" described in this specification are used, other components may be added unless "only" is used. Terms in the singular may include plural forms unless mentioned to the contrary.

[0036] When explaining an element, the element is interpreted as including an error or tolerance range although there is no explicit description of such error or tolerance range.

[0037] When describing a positional relationship, for example, when the positional relationship between two components is described as, for example, "on," "over," "under," and "beside," one or more other components may be disposed between the two components, unless more restrictive terms such as "only" or "directly" are used.

[0038] In the description of the embodiments, when one structure is described as being “on or over” or “under” or “lower” another structure, the description should be interpreted as including the case where the structures are in contact with each other and the case where a third structure is provided therebetween.

[0039] When describing temporal relationships, for example, when a time sequence is described as, for example, "after," "subsequently," "next," and "before," discontinuities may be included unless more restrictive terms such as "directly," "directly," or "directly" are used.

[0040] It should be understood that although the terms "first," "second," etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from other elements. For example, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element, without departing from the scope of the present disclosure.

[0041] When describing elements of the present disclosure, the terms "first," "second," "A," "B," "(a)," "(b)," etc. may be used. These terms are intended to distinguish corresponding elements from other elements, and the basis, order, or number of corresponding elements should not be limited by these terms. The statement that an element is "connected," "coupled," or "adhered" to other elements or layers means that the element or layer can be not only directly connected or adhered to the other elements or layers, but also indirectly connected or adhered to the other elements or layers, with one or more intermediate elements or layers "disposed" or "interposed" between the elements or layers, unless otherwise specified.

[0042] In the description of the embodiments, when a structure is described as being "on or above or above" or "below" or "below" another structure, the description should be interpreted as including the case where these structures are in contact with each other and the case where a third structure is provided therebetween. The sizes and thicknesses of the elements shown in the drawings are for convenience of description only, and the embodiments of the present disclosure are not limited thereto unless otherwise specified. The term "at least one" should be understood to include any and all combinations of one or more of the relevant listed items. For example, the meaning of "at least one of the first, second, and third items" means all combinations of items proposed from two or more of the first, second, and third items, as well as the first, second, or third item.

[0043] In the present disclosure, a device may include a display device having a display panel and a driver for driving the display panel, such as an organic light emitting display (OLED) module, a liquid crystal module (LCM), etc. In addition, the device may include a kit device (or kit device) or a kit electronic device as a complete product (or final product) including an LCM, an OLED module, etc., such as a notebook computer, a television (TV), a computer monitor, an equipment device including an automotive device or other type of device for a vehicle, or a mobile electronic device such as a smart phone or an electronic tablet.

[0044] Therefore, in the present disclosure, examples of a device may include a display device itself, such as an LCM or OLED module, and a kit device (kit device) that is a final consumer device or application product including the LCM or OLED module.

[0045] In some embodiments, an LCM or OLED module including a display panel and a driver may be referred to as a display device, and an electronic device as a final product including the LCM or OLED module may be referred to as a kit device. For example, the display device may include a display panel such as an LCD or OLED, and a source printed circuit board (PCB) serving as a controller for driving the display panel. The kit device may also include a kit PCB serving as a kit controller electrically connected to the source PCB for overall control of the kit device.

[0046] The display panel applied to the embodiments of the present disclosure may use all types of display panels, such as a liquid crystal display panel, an organic light emitting diode (OLED) display panel, and an electroluminescent display panel, but the embodiments of the present disclosure are not limited thereto. For example, the display panel may be a display panel capable of generating sound by being vibrated by a vibration device according to an embodiment of the present disclosure. The display panel applied to the display device according to an embodiment of the present disclosure is not limited to the shape or size of the display panel.

[0047] For example, when the display panel is a liquid crystal display panel, the display panel may include a plurality of gate lines, a plurality of data lines, and a plurality of pixels respectively arranged at a plurality of pixel regions defined by the intersection of the gate lines and the data lines. In addition, the display panel may include: an array substrate including a thin film transistor (TFT), which is a switching element for adjusting the transmittance of each of the plurality of pixels; an upper substrate including a color filter and / or a black matrix; and a liquid crystal layer located between the array substrate and the upper substrate.

[0048] When the display panel is an organic light-emitting display panel (OLED), the display panel may include a plurality of gate lines, a plurality of data lines, and a plurality of pixels respectively arranged at a plurality of pixel areas defined by the intersection of the gate lines and the data lines. In addition, the display panel may include: an array substrate including a TFT as an element for selectively applying a voltage to each pixel; an organic light-emitting device layer on the array substrate; and an encapsulation substrate arranged on the array substrate to cover the organic light-emitting device layer. The encapsulation substrate may protect the TFT and the organic light-emitting device layer from external impacts and may prevent water or oxygen from penetrating into the organic light-emitting device layer. In addition, the layer arranged on the array substrate may include an inorganic light-emitting layer, such as a nano-sized material layer, quantum dots, a light-emitting layer, etc. As another embodiment of the present disclosure, the layer arranged on the array substrate may include a micro light-emitting diode.

[0049] The display panel may further include a backing attached to the display panel, such as a metal plate. However, embodiments of the present disclosure are not limited to metal plates, and the display panel may also include other structures.

[0050] The features of the various embodiments of the present disclosure may be coupled or combined with each other in part or in whole, and may interoperate and be driven technically differently from each other, as will be fully understood by those skilled in the art. The embodiments of the present disclosure may be implemented independently of each other, or may be implemented together in a mutually dependent relationship.

[0051] The accompanying drawings are included to provide a further understanding of the present disclosure and are included in and constitute a part of this application. The drawings illustrate embodiments of the present disclosure and, together with the description, serve to explain the principles of the present disclosure. However, the technical features of the present disclosure are not limited to the specific drawings, and the features disclosed in the drawings may be combined with each other to form new embodiments.

[0052] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. For ease of description, the proportions of each element shown in the drawings are different from the actual proportions, and therefore the embodiments of the present disclosure are not limited to the proportions shown in the drawings.

[0053] Figure 1 A vibration generating device according to an embodiment of the present disclosure is shown.

[0054] Reference Figure 1 The vibration generating device according to an embodiment of the present disclosure may include a vibration driving circuit (or a vibration driving integrated circuit (IC) or a sound processing circuit) 100 and a vibration device 200, but the configuration of the vibration generating device is not limited thereto. For example, the vibration generating device may include one or more vibration devices 200.

[0055] The vibration driving circuit 100 according to an embodiment of the present disclosure may be provided with a sound source signal from the sound source providing system 300 to generate a driving signal corresponding to the sound source signal, and may provide the driving signal to the vibration device 200. For example, the vibration driving circuit 100 may provide the driving signal to the vibration device 200 to vibrate the vibration device 200, thereby vibrating a vibration member (or a vibrating object) in which the vibration device 200 is disposed.

[0056] According to an embodiment of the present disclosure, the vibration drive circuit 100 can be configured to predict the internal temperature value of the vibration device 200 based on the current value of the drive signal (or vibration drive signal or sound signal) provided to the vibration device 200, and can be configured to compensate the drive signal based on the predicted internal temperature value (or the temperature prediction value of the vibration device). For example, the temperature prediction value of the vibration device can be a temperature change value based on the change in the capacitance of the vibration device 200. The change in the capacitance of the vibration device 200 may affect the drive signal, and therefore, the current value of the drive signal may change. According to an embodiment of the present disclosure, the vibration drive circuit 100 can set or adjust the temperature prediction value of the vibration device based on the current value of the drive signal that changes according to the change in capacitance. According to an embodiment of the present disclosure, since the drive signal is compensated based on the temperature prediction value of the vibration device, the effect of the change in the capacitance of the vibration device 200 on the drive signal flowing in the vibration device 200 can be offset.

[0057] According to an embodiment of the present disclosure, the vibration drive circuit 100 may be configured to provide an nth drive signal to the vibration device 200, and then, may be configured to predict the internal temperature value of the vibration device 200 based on the current value of the nth drive signal. For example, the vibration drive circuit 100 may be configured to compensate the drive signal based on the internal temperature value (or circuit internal temperature value) of the vibration drive circuit 100. For example, the vibration drive circuit 100 may be configured to compensate the drive signal based on the temperature prediction value of the vibration device and the circuit internal temperature value.

[0058] The vibration driving circuit 100 according to an embodiment of the present disclosure may include a temperature measurer 110 , a current measurer 120 , a temperature predictor 130 , a driving signal generator 140 , and an amplifier 150 , but the configuration of the vibration driving circuit 100 is not limited thereto.

[0059] The temperature measurer (or temperature measurement circuit) 110 may be provided in the vibration driving circuit 100 and may be configured to measure an internal temperature value of the vibration driving circuit 100. For example, the temperature measurer 110 may be configured to provide the measured temperature value to the driving signal generator 140.

[0060] According to an embodiment of the present disclosure, the temperature measurer 100 may be configured to measure the temperature value of at least one region of the vibration drive circuit 100. For example, the temperature measurer 110 may be configured to measure the temperature value of at least one region that has a greater impact on the drive signal among the regions in the vibration drive circuit 100. For example, the temperature measurer 100 may be configured to measure the temperature values ​​of multiple regions in the vibration drive circuit 100.

[0061] According to an embodiment of the present disclosure, the temperature measurer 110 may be disposed adjacent to the amplifier 150 that ultimately outputs the drive signal, and may be configured to measure the temperature value of an area adjacent to the amplifier 150, but the embodiments of the present disclosure are not limited thereto. For example, the temperature measurer 110 may include at least one temperature sensor 111. For example, the at least one temperature sensor 111 may be disposed adjacent to the amplifier 150, but the embodiments of the present disclosure are not limited thereto.

[0062] The current measurer (or current measurement circuit) 120 may be configured to measure a current value of a driving signal provided from the vibration driving circuit 100 to the vibration device 200. For example, the current measurer 120 may be configured to provide the measured current value to the temperature predictor 130.

[0063] According to an embodiment of the present disclosure, the current measurer 120 may be connected to the line W between the vibration drive circuit 100 and the vibration device 200 and may be configured to measure the current value of the drive signal. For example, the current measurer 120 may be connected to a portion n of the line W adjacent to the vibration device 200. For example, when the current value of the drive signal is measured at the portion n of the line W adjacent to the vibration device 200, a current value similar to the current value of the drive signal flowing in the vibration device 200 may be measured.

[0064] According to an embodiment of the present disclosure, the current value measured by the current measurer 120 can be used to predict the internal temperature of the vibration device 200, and therefore, when a current value similar to the current value flowing in the vibration device 200 is measured, the internal temperature of the vibration device 200 can be accurately predicted. For example, the current measurer 120 may include at least one current sensor 121. For example, the at least one current sensor 121 may be connected to a portion n of a portion of the line W between the vibration drive circuit 100 and the vibration device 200 that is adjacent to the vibration device 200.

[0065] The temperature predictor (or temperature predictor of the vibration device or current-temperature converter) 130 may be provided with the current value from the current measurer 120 and may output a temperature prediction value of the vibration device 200 (or temperature prediction value of the vibration device) to the driving signal generator 140 .

[0066] According to an embodiment of the present disclosure, the temperature predictor 130 may use a current-temperature table to output a temperature prediction value of the vibration device corresponding to the current value from the current measurer 120. For example, the current-temperature table may include the current value of the drive signal provided from the vibration drive circuit 100 to the vibration device 200 and the temperature prediction value of the vibration device that matches the current value. For example, the current-temperature table may be a table that includes the temperature prediction value of the vibration device corresponding to each drive signal current value. For example, when the temperature predictor 130 is provided with the current value from the current measurer 120, the temperature predictor 130 may be configured to output a temperature value that matches the provided current value with reference to the current-temperature table.

[0067] Furthermore, the temperature predictor 130 may predict the internal temperature of the vibration device 200 based on a plurality of current values, for example, including the current value of the nth drive signal and the current values ​​of one or more drive signals prior to the nth drive signal. In this case, for example, the current-temperature table may include a correspondence between the plurality of current values ​​and the temperature prediction values.

[0068] The driving signal generator 140 may be provided with a sound source signal from the sound source providing system 300. For example, the driving signal generator 140 may be provided with an internal temperature value (or a circuit internal temperature value or a first temperature value) of the vibration driving circuit 100 measured by the temperature measurer 110. For example, the driving signal generator 140 may be provided with a temperature prediction value (or a temperature prediction value or a second temperature value) of the vibration device from the temperature predictor 130.

[0069] The drive signal generator 140 may be configured to generate a drive signal corresponding to the sound source signal from the sound source providing system 300. For example, the drive signal generator 140 may be configured to output the generated drive signal to the amplifier 150. For example, the drive signal generator 140 may be configured to compensate the drive signal and may be configured to output the compensated drive signal to the amplifier 150. For example, the drive signal generator 140 may be configured to compensate the frequency-based gain value according to the frequency-based gain compensation value, and may be configured to compensate the drive signal based on the compensated frequency-based gain value.

[0070] According to an embodiment of the present disclosure, the drive signal generator 140 may be configured to compensate the drive signal based on the internal circuit temperature value from the temperature measurer 110, and then may be configured to output the compensated drive signal. For example, the drive signal generator 140 may be configured to compensate the drive signal based on the temperature prediction value of the vibration device from the temperature predictor 130, and then may be configured to output the compensated drive signal. For example, the drive signal generator 140 may be configured to compensate the drive signal based on the internal circuit temperature value from the temperature measurer 110 and the temperature prediction value of the vibration device from the temperature predictor 130, and then may be configured to output the compensated drive signal.

[0071] The driving signal generator 140 may apply a temperature compensation table to compensate the driving signal.

[0072] According to an embodiment of the present disclosure, the driving signal generator 140 may apply a first temperature compensation table to compensate the driving signal based on the circuit internal temperature value from the temperature measurer 110 .

[0073] According to an embodiment of the present disclosure, the first temperature compensation table may include the internal circuit temperature value provided by the temperature measurer 110 and the compensation value matched to the internal circuit temperature value. For example, the first temperature compensation table may be a table including compensation values ​​corresponding to each internal circuit temperature value. For example, the compensation value may be a frequency-dependent gain compensation value. However, the embodiments of the present disclosure are not limited thereto; for example, the compensation value may simply be a non-frequency-dependent gain compensation value.

[0074] According to an embodiment of the present disclosure, when the circuit internal temperature value is provided from the temperature measurer 110, the drive signal generator 140 can set or adjust (determine, check or extract) a compensation value in the first temperature compensation table that matches the circuit internal temperature value, apply the set or adjusted compensation value to the drive signal to compensate the drive signal, and output the compensated drive signal.

[0075] According to an embodiment of the present disclosure, the drive signal generator 140 may be configured to set or adjust a frequency-based gain compensation value that matches a circuit internal temperature value, compensate for the frequency-based gain of the drive signal by the set or adjusted frequency-based gain compensation value, and apply the compensated frequency-based gain to the drive signal to compensate the drive signal.

[0076] According to an embodiment of the present disclosure, the drive signal generator 140 may apply a second temperature compensation table to compensate the drive signal based on the temperature prediction value of the vibration device from the temperature predictor 130. According to an embodiment of the present disclosure, the second temperature compensation table may include the temperature prediction value of the vibration device provided by the temperature predictor 130 and a compensation value that matches the temperature prediction value of the vibration device. For example, the second temperature compensation table may be a table including compensation values ​​corresponding to each temperature prediction value of the vibration device. For example, the compensation value may be a frequency-based gain compensation value.

[0077] According to an embodiment of the present disclosure, when the temperature prediction value of the vibration device is provided from the temperature predictor 130, the driving signal generator 140 may set or adjust a compensation value in the second temperature compensation table that matches the temperature prediction value of the vibration device, apply the set or adjusted compensation value to the driving signal to compensate the driving signal, and output the compensated driving signal.

[0078] According to an embodiment of the present disclosure, the driving signal generator 140 may be configured to set or adjust a frequency-based gain compensation value that matches a temperature prediction value of the vibration device, compensate for the frequency-based gain of the driving signal by the set or adjusted frequency-based gain compensation value, and apply the compensated frequency-based gain to the driving signal to compensate the driving signal.

[0079] According to an embodiment of the present disclosure, the drive signal generator 140 may apply a third temperature compensation table to compensate the drive signal based on the internal circuit temperature value from the temperature measurer 110 and the temperature prediction value of the vibration device from the temperature predictor 130. According to an embodiment of the present disclosure, the third temperature compensation table may include compensation values ​​that match the internal circuit temperature value from the temperature measurer 110 and the temperature prediction value of the vibration device from the temperature predictor 130. For example, the third temperature compensation table may be a table that includes compensation values ​​corresponding to each internal circuit temperature value and each temperature prediction value of the vibration device. Here, the compensation value may be a frequency-based gain compensation value.

[0080] According to an embodiment of the present disclosure, when the circuit internal temperature value is provided from the temperature measurer 110 and the temperature prediction value of the vibration device is provided from the temperature predictor 130, the drive signal generator 140 may be configured to set or adjust a compensation value in the third temperature compensation table that matches the circuit internal temperature value and the temperature prediction value of the vibration device, apply the set or adjusted compensation value to the drive signal to compensate the drive signal, and output the compensated drive signal.

[0081] According to an embodiment of the present disclosure, the driving signal generator 140 may be configured to set or adjust a frequency-based gain compensation value that matches a circuit internal temperature value and a temperature prediction value of the vibration device, compensate for the frequency-based gain of the driving signal by the set or adjusted frequency-based gain compensation value, and apply the compensated frequency-based gain to the driving signal to compensate the driving signal.

[0082] The vibration driving circuit 100 according to an embodiment of the present disclosure may be configured to predict an internal temperature value of the vibration device 200 based on a current value of a driving signal, compensate the driving signal based on the predicted internal temperature value of the vibration device 200, and provide the compensated driving signal to the vibration device 200, thereby offsetting an adverse effect caused by the internal temperature of the vibration device 200 when the driving signal flows in the vibration device 200.

[0083] The vibration driving circuit 100 according to an embodiment of the present disclosure may be configured to compensate a driving signal based on an internal temperature value of the vibration driving circuit 100 and provide the compensated driving signal to the vibration device 200, thereby offsetting an adverse effect caused by the internal temperature of the vibration driving circuit 100 when the driving signal flows in the vibration driving circuit 100.

[0084] The vibration drive circuit 100 according to an embodiment of the present disclosure may be configured to compensate the drive signal based on the internal temperature value of the vibration drive circuit 100 and the internal temperature value of the vibration device 200 predicted based on the current value of the drive signal, and may be configured to provide the compensated drive signal to the vibration device 200, thereby offsetting the adverse effects of the drive signal caused by the internal temperature of the vibration drive circuit 100 when the drive signal flows in the vibration drive circuit 100, and offsetting the adverse effects of the drive signal caused by the internal temperature of the vibration device 200 when the drive signal flows in the vibration device 200.

[0085] Therefore, the vibration drive circuit 100 according to the embodiment of the present disclosure can be configured to provide a drive signal compensated based on the internal temperature environment of the vibration device 200 and the internal temperature environment of the vibration drive circuit 100 to the vibration device 200, thereby enabling the vibration device 200 to vibrate based on the compensated drive signal to adapt to the temperature environment. Therefore, the reduction in sound characteristics generated by the vibration of the vibration member based on the vibration of the vibration device 200 can be minimized.

[0086] The amplifier 150 may be supplied with the driving signal from the driving signal generator 140 , amplify the supplied driving signal based on a predetermined gain, and supply the amplified driving signal to the vibration device 200 .

[0087] Alternatively, compensation of the drive signal may also be performed by the amplifier 150. For example, the drive signal generator 140 may set a compensation value for the drive signal based on at least one of an internal temperature value of the vibration drive circuit 100 and an internal temperature value of the vibration device 200 predicted based on the current value of the drive signal, and provide the compensation value to the amplifier 150. The amplifier 150 sets its gain based on the compensation value, amplifies the drive signal from the drive signal generator 140 based on the set gain, and provides the amplified drive signal to the vibration device 200. For example, the compensation value may be a frequency-based gain compensation value or a non-frequency-based gain compensation value.

[0088] The vibration device 200 according to an embodiment of the present disclosure can be provided at a vibration member. For example, the vibration device 200 can be provided with a drive signal from the vibration drive circuit 100 and can vibrate based on the provided drive signal to vibrate the vibration member, thereby enabling the vibration member to provide sound and / or tactile feedback. For example, the vibration device 200 can be provided as one or more. For example, when the vibration device 200 is provided as multiple, the multiple vibration devices 200 can be provided with the same drive signal, or can be provided with different drive signals. For example, the vibration device 200 can be a piezoelectric element or a membrane-type vibration device. For example, when the vibration device 200 is provided as multiple, the multiple vibration devices 200 can be the same type of vibration device, or can be different types of vibration devices. For example, the vibration device 200 can be configured with one or more of a piezoelectric element and a membrane-type vibration device. For example, a piezoelectric element can be referred to as a piezoelectric device, a piezoelectric device, etc., but the embodiments of the present disclosure are not limited thereto.

[0089] According to an embodiment of the present disclosure, the vibration component may include a display panel including a plurality of pixels configured to display an image, or may include a non-display panel. For example, the vibration component may include a display panel including a plurality of pixels configured to display an image, or may be one or more of wood, plastic, glass, cloth, paper, interior materials of a vehicle, glass windows of a vehicle, interior ceilings of a building, glass windows of a building, interior materials of an aircraft, and glass windows of an aircraft, but the embodiments of the present disclosure are not limited thereto. For example, the non-display panel may be a light-emitting diode lighting panel (or device), an organic light-emitting lighting panel (or device), or an inorganic light-emitting lighting panel (or device), but the embodiments of the present disclosure are not limited thereto. For example, the vibration component may include a display panel including a plurality of pixels configured to display an image, or may include one or more non-display panels of a light-emitting diode lighting panel (or device), an organic light-emitting lighting panel (or device), and an inorganic light-emitting lighting panel (or device), but the embodiments of the present disclosure are not limited thereto.

[0090] According to another embodiment of the present disclosure, the vibration member may include a plate, and the plate may include a metal material or may include one or more single non-metallic or composite non-metallic materials of wood, plastic, glass, cloth, paper and leather, but the embodiments of the present disclosure are not limited thereto.

[0091] Figure 2 A vibration device according to an embodiment of the present disclosure is shown.

[0092] Reference Figure 2 The vibration device 200 according to an embodiment of the present disclosure may include a vibration part PE, a first electrode layer E1, and a second electrode layer E2. For example, the structure including the vibration part PE, the first electrode layer E1, and the second electrode layer E2 may be referred to as a vibration structure (or vibration module) PCM. For example, the vibration device 200 may include at least one vibration structure (or vibration module) PCM.

[0093] The vibration portion PE may include a piezoelectric material (or electroactive material) having a piezoelectric effect. For example, a piezoelectric material may have a characteristic in which, when pressure is applied to a crystal structure or twisted (or bent) by an external force, a potential difference occurs due to dielectric polarization caused by a change in the relative positions of positive (+) ions and negative (-) ions, and vibration is generated by an electric field based on a reverse voltage applied thereto. The vibration portion PE may be referred to as a vibration layer, a piezoelectric layer, a piezoelectric material layer, an electroactive layer, a piezoelectric vibration portion, a piezoelectric material portion, an electroactive portion, a piezoelectric structure, an inorganic material layer, an inorganic material portion, etc., but the embodiments of the present disclosure are not limited thereto.

[0094] The vibration portion PE can be formed of a transparent, translucent or opaque piezoelectric material (or electroactive material), and can be transparent, translucent (or translucent) or opaque. The vibration portion PE may include a ceramic-based material for generating relatively high vibrations, or may include a piezoelectric ceramic having a perovskite-based crystal structure. The perovskite crystal structure may have a piezoelectric effect and an inverse piezoelectric effect, and may be a plate-like structure with an orientation or arrangement. The perovskite crystal structure may be represented by the chemical formula "ABO3". In the chemical formula, "A" may include a divalent metal element, and "B" may include a tetravalent metal element. For example, in the chemical formula "ABO3", "A" and "B" may be cations, and "O" may be an anion. For example, the vibration portion PE may include one of lead (II) titanate (PbTiO3), lead zirconate (PbZrO3), lead zirconate titanate (PbZrTiO3), barium titanate (BaTiO3) and strontium titanate (SrTiO3), but the embodiments of the present disclosure are not limited thereto.

[0095] The vibration portion PE according to an embodiment of the present disclosure may include a lead zirconate titanate (PZT)-based material including lead (Pb), zirconium (Zr), and titanium (Ti); or may include a lead zirconate nickel niobate (PZNN)-based material including lead (Pb), zirconium (Zr), nickel (Ni), and niobium (Nb), but the embodiments of the present disclosure are not limited thereto. In addition, the vibration portion PE may include at least one of calcium titanate (CaTiO3), barium titanate (BaTiO3), and strontium titanate (SrTiO3), all of which do not contain Pb, but the embodiments of the present disclosure are not limited thereto.

[0096] The vibration part PE according to an embodiment of the present disclosure may include a circular shape, an elliptical shape, or a polygonal shape, but the embodiment of the present disclosure is not limited thereto.

[0097] The first electrode layer E1 may be disposed at the first surface (or upper surface) of the vibration part PE and may be electrically connected to the first surface of the vibration part PE. For example, the first electrode layer E1 may have a single electrode (or a common electrode type) disposed at the entire first surface of the vibration part PE. For example, the first electrode layer E1 may have the same shape as the vibration part PE, but the embodiments of the present disclosure are not limited thereto. The first electrode layer E1 according to the embodiments of the present disclosure may include a transparent conductive material, a semi-transparent conductive material, or an opaque conductive material. For example, the transparent conductive material or the semi-transparent conductive material may include indium tin oxide (ITO) or indium zinc oxide (IZO), but is not limited thereto. The opaque conductive material may include aluminum (Al), copper (Cu), gold (Au), silver (Ag), molybdenum (Mo), magnesium (Mg), or any alloy thereof, etc., but the embodiments of the present disclosure are not limited thereto.

[0098] The second electrode layer E2 may be disposed at a second surface (or rear surface) of the vibration part PE opposite to the first surface, and may be electrically connected to the second surface of the vibration part PE. For example, the second electrode layer E2 may have a single electrode (or common electrode type) disposed at the entire second surface of the vibration part PE. For example, the second electrode layer E2 may have a larger size than the vibration part PE and have the same shape as the vibration part PE, but the embodiments of the present disclosure are not limited thereto. The second electrode layer E2 according to an embodiment of the present disclosure may include a transparent conductive material, a translucent conductive material, or an opaque conductive material. For example, the second electrode layer E2 may include the same material as the first electrode layer E1, but the embodiments of the present disclosure are not limited thereto. As another embodiment of the present disclosure, the second electrode layer E2 may include a material different from the first electrode layer E1.

[0099] The vibration portion PE can be polarized by a certain voltage applied to the first electrode layer E1 and the second electrode layer E2 in a certain temperature environment or in a temperature environment that can be changed from high temperature to room temperature, but the embodiments of the present disclosure are not limited thereto. For example, the vibration portion PE can be alternately and repeatedly contracted and expanded to vibrate based on the inverse piezoelectric effect according to a driving signal (or voice signal) applied from the outside to the first electrode layer E1 and the second electrode layer E2.

[0100] The vibration device 200 according to an embodiment of the present disclosure may further include a first protective member and a second protective member.

[0101] The first protective member may be disposed above the first electrode layer E1 and may protect the first electrode layer E1. For example, the first protective member may include a plastic material, a fiber material, or a wood material, but embodiments of the present disclosure are not limited thereto.

[0102] The second protective member may be disposed above the second electrode layer E2 and may protect the second electrode layer E2. For example, the second protective member may include a plastic material, a fiber material, or a wood material, but embodiments of the present disclosure are not limited thereto. For example, the first protective member may include the same or different materials as the second protective member. One or more of the first and second protective members may be attached or coupled to the display panel (or vibration member) via an adhesive member.

[0103] Figure 3 A vibration device according to another embodiment of the present disclosure is shown. Figure 4 It is along Figure 3 A cross-sectional view taken along line II' shown in FIG.

[0104] Reference Figure 3 and Figure 4 , the vibration device 200 according to an embodiment of the present disclosure may contract and expand alternately and / or repeatedly to vibrate based on the inverse piezoelectric effect (or inverse piezoelectric characteristics) or the piezoelectric effect (or piezoelectric characteristics).

[0105] The vibration device 200 according to another embodiment of the present disclosure may alternately and / or repeatedly contract and expand based on the inverse piezoelectric effect to vibrate in the thickness direction Z, thereby directly vibrating the vibrating object. The vibration device 200 according to another embodiment of the present disclosure may have a quadrilateral shape or a square shape, but embodiments of the present disclosure are not limited thereto.

[0106] A vibration device 200 according to another embodiment of the present disclosure may include a vibration portion PCL, a first electrode layer E1, and a second electrode layer E2. For example, the structure including the vibration portion PCL, the first electrode layer E1, and the second electrode layer E2 may be referred to as a vibration structure (or vibration module) PCM. For example, the vibration device 200 may include at least one vibration structure (or vibration module) PCM.

[0107] The vibration portion PCL may include a piezoelectric material, a composite piezoelectric material, or an electroactive material, and the piezoelectric material, composite piezoelectric material, and electroactive material may have a piezoelectric effect. The vibration portion PCL may be referred to as a vibration layer, a piezoelectric material layer, a piezoelectric composite layer, an electroactive layer, a piezoelectric material portion, a piezoelectric composite portion, an electroactive portion, a piezoelectric structure, a piezoelectric composite structure, or a piezoelectric ceramic composite structure, but embodiments of the present disclosure are not limited thereto.

[0108] The vibration portion PCL according to another embodiment of the present disclosure may include a ceramic-based material capable of achieving relatively high vibration. For example, the vibration portion PCL may include a 1-3 composite structure or a 2-2 composite structure. For example, the piezoelectric deformation coefficient "d" of the vibration portion PCL in the thickness direction Z is 33 ” may have 1,000 pC / N or greater, but embodiments of the present disclosure are not limited thereto.

[0109] The first electrode layer E1 may be disposed above the first surface (or upper surface) of the vibration part PCL and may be electrically connected to the first surface of the vibration part PCL. For example, the first electrode layer E1 may have a single electrode type (or common electrode type) disposed at the entire first surface of the vibration part PCL. The first electrode layer E1 according to another embodiment of the present disclosure may include a transparent conductive material, a semi-transparent (or translucent) conductive material, or an opaque conductive material. For example, examples of transparent conductive materials or semi-transparent conductive materials may include indium tin oxide (ITO) or indium zinc oxide (IZO), but the embodiments of the present disclosure are not limited thereto. The opaque conductive material may include aluminum (Al), copper (Cu), gold (Au), silver (Ag), molybdenum (Mo), magnesium (Mg), etc., and any alloys thereof, but the embodiments of the present disclosure are not limited thereto.

[0110] The second electrode layer E2 may be above the second surface (or rear surface) of the vibration part PCL opposite to the first surface, and may be electrically connected to the second surface of the vibration part PCL. For example, the second electrode layer E2 may have a single electrode type (or common electrode type) provided at the entire second surface of the vibration part PCL. The second electrode layer E2 according to another embodiment of the present disclosure may include a transparent conductive material, a semi-transparent conductive material, or an opaque conductive material. For example, the second electrode layer E2 may include the same material as the first electrode layer E1, but the embodiments of the present disclosure are not limited thereto. As another embodiment of the present disclosure, the second electrode layer E2 may include a material different from that of the first electrode layer E1.

[0111] The vibration portion PCL may be polarized in a certain temperature environment by a certain voltage applied to the first and second electrode layers E1 and E2, or in a temperature environment that may be changed from high temperature to room temperature, but embodiments of the present disclosure are not limited thereto.

[0112] The vibration device 200 according to another embodiment of the present disclosure may further include a first protective member 211 and a second protective member 213 .

[0113] The first protective member 211 may be disposed above the first surface of the vibration structure PCM. For example, the first protective member 211 may cover the first electrode layer E1 disposed above the first surface of the vibration part PCL. Thus, the first protective member 211 may support the first surface of the vibration structure PCM and protect the first surface of the vibration part PCL or the first electrode layer E1.

[0114] The first protective member 211 according to another embodiment of the present disclosure may be disposed at the first surface of the vibration structure PCM through the first adhesive layer 212. For example, the first protective member 211 may be directly disposed at the first surface of the vibration structure PCM through a film lamination process using the first adhesive layer 212.

[0115] The second protective member 213 may be disposed above the second surface of the vibration structure PCM. For example, the second protective member 213 may cover the second electrode layer E2 disposed on the second surface of the vibration part PCL. Thus, the second protective member 213 may support the second surface of the vibration structure PCM and protect the second surface of the vibration part PCL or the second electrode layer E2.

[0116] The second protective member 213 according to another embodiment of the present disclosure may be disposed at the second surface of the vibration structure PCM through the second adhesive layer 214. For example, the second protective member 213 may be directly disposed at the second surface of the vibration structure PCM through a film lamination process using the second adhesive layer 214.

[0117] According to another embodiment of the present disclosure, each of the first protective member 211 and the second protective member 213 may include a plastic film. For example, each of the first protective member 211 and the second protective member 213 may be a polyimide (PI) film or a polyethylene terephthalate (PET) film, but the embodiment of the present disclosure is not limited thereto.

[0118] The first adhesive layer 212 may be provided at the first surface of the vibration structure PCM. For example, the first adhesive layer 212 may be formed on the rear surface (or inner surface) of the first protective member 211 facing the first surface of the vibration structure PCM and provided at the first surface of the vibration structure PCM.

[0119] The second adhesive layer 214 may be provided at the second surface of the vibration structure PCM. For example, the second adhesive layer 214 may be formed on the front surface (or inner surface) of the second protective member 213 facing the second surface of the vibration structure PCM and provided at the second surface of the vibration structure PCM.

[0120] The vibration structure PCM may be surrounded by the first adhesive layer 212 and the second adhesive layer 214. For example, the first adhesive layer 212 and the second adhesive layer 214 may completely surround the entire vibration structure PCM. For example, the first adhesive layer 212 and the second adhesive layer 214 may be referred to as covering members, but embodiments of the present disclosure are not limited thereto. When each of the first adhesive layer 212 and the second adhesive layer 214 is a covering member, the first protective member 211 may be provided at the first surface of the covering member, and the second protective member 213 may be provided at the second surface of the covering member. For example, for convenience of description, the first adhesive layer 212 and the second adhesive layer 214 are illustrated as the first adhesive layer 212 and the second adhesive layer 214, but embodiments of the present disclosure are not limited thereto and may be provided as one adhesive layer.

[0121] Each of the first adhesive layer 212 and the second adhesive layer 214 according to another embodiment of the present disclosure may include an electrically insulating material having adhesiveness and may include a material capable of compression and decompression. For example, each of the first adhesive layer 212 and the second adhesive layer 214 may include epoxy resin, acrylic resin, silicone resin, or urethane resin, but embodiments of the present disclosure are not limited thereto.

[0122] The vibration device 200 according to another embodiment of the present disclosure may further include a first power line PL1 , a second power line PL2 , and a pad portion 201 .

[0123] The first power line PL1 may be provided at the first protective member 211. For example, the first power line PL1 may be provided at the rear surface of the first protective member 211 facing the first surface of the vibration portion PCL. The first power line PL1 may be electrically connected to the first electrode layer E1 of the vibration structure PCM. For example, the first power line PL1 may be directly electrically connected to the first electrode layer E1 of the vibration structure PCM. For example, the first power line PL1 may be electrically connected to the first electrode layer E1 of the vibration structure PCM via an anisotropic conductive film. As another embodiment of the present disclosure, the first power line PL1 may be electrically connected to the first electrode layer E1 of the vibration structure PCM via a conductive material (or particles) included in the first adhesive layer 212.

[0124] The second power line PL2 may be provided at the second protective member 213. For example, the second power line PL2 may be provided at the front surface of the second protective member 213 facing the second surface of the vibration portion PCL. The second power line PL2 may be electrically connected to the second electrode layer E2 of the vibration structure PCM. For example, the second power line PL2 may be directly electrically connected to the second electrode layer E2 of the vibration structure PCM. For example, the second power line PL2 may be electrically connected to the second electrode layer E2 of the vibration structure PCM through an anisotropic conductive film. As another embodiment of the present disclosure, the second power line PL2 may be electrically connected to the second electrode layer E2 of the vibration structure PCM through a conductive material (or particles) included in the second adhesive layer 214.

[0125] The pad portion 201 may be electrically connected to the first power line PL1 and the second power line PL2. For example, the pad portion 201 may be electrically connected to a portion (or one end) of each of the first power line PL1 and the second power line PL2. The pad portion 201 according to another embodiment of the present disclosure may include a first pad electrode and a second pad electrode. The first pad electrode may be electrically connected to a portion of the first power line PL1. The second pad electrode may be electrically connected to a portion of the second power line PL2.

[0126] The vibration device 200 according to an embodiment of the present disclosure may further include a flexible cable 205 .

[0127] The flexible cable 220 can be electrically connected to the pad portion 201 provided at the vibration device 200, and can provide the drive signal (or voice signal or sound signal) provided by the vibration drive circuit 100 to the vibration device 200. The flexible cable 220 according to another embodiment of the present disclosure may include a first terminal and a second terminal. The first terminal can be electrically connected to the first pad electrode of the pad portion 201. The second terminal can be electrically connected to the second pad electrode of the pad portion 201. For example, the flexible cable 220 can be configured with a flexible printed circuit cable or a flexible flat cable, but the embodiments of the present disclosure are not limited thereto.

[0128] The vibration device 200 according to another embodiment of the present disclosure may further include a plate 215 .

[0129] The plate 215 may be provided at the first protective member 211 or the second protective member 213. For example, the plate 215 may have the same shape as the first protective member 211 (or the second protective member 213). The plate 215 may have a size greater than or equal to that of the first protective member 211 (or the second protective member 213).

[0130] The plate 215 according to another embodiment of the present disclosure may be provided at the front surface (or first surface) of the first protective member 211. The plate 215 may be provided at the front surface of the first protective member 211 of the vibration device 200 through a connecting member. The plate 215 according to another embodiment of the present disclosure may be provided between the vibration member (or vibration object) and the first protective member 211.

[0131] According to another embodiment of the present disclosure, the plate 215 may be provided at the rear surface (or second surface) of the second protective member 213. The plate 215 may be provided at the rear surface of the second protective member 213 of the vibration device 200 via a connecting member. According to another embodiment of the present disclosure, the plate 215 may be provided between the vibration member (or vibration object) and the second protective member 213.

[0132] The plate 215 according to an embodiment of the present disclosure may include a metal material, for example, one or more materials including stainless steel, aluminum (Al), magnesium (Mg), a magnesium (Mg) alloy, a magnesium-lithium (Mg-Li) alloy, and an Al alloy, but the embodiments of the present disclosure are not limited thereto. The plate 215 may be disposed at the first protective member 211 (or the second protective member 213), and may increase the mass of the vibration device 200 to reduce the resonant frequency of the vibration device 200 based on the increase in mass, thereby improving the sound characteristics and sound pressure level characteristics of the bass tone band generated by the vibration of the vibration device 200, and enhancing the flatness of the sound characteristics. For example, the flatness of the sound characteristics may be the size of the deviation between the highest sound pressure level and the lowest sound pressure level.

[0133] Figures 5A to 5F Shown Figure 4 The vibrating portion of the vibrating device shown.

[0134] Reference Figure 3 、 Figure 4 and Figure 5A The vibration part PCL of the vibration device 200 according to another embodiment of the present disclosure may include a first part 200a and a second part 200b. For example, the first part 200a may include an inorganic material, and the second part 200b may include an organic material. For example, the first part 200a may have piezoelectric properties, and the second part 200b may have ductility or flexibility. For example, the inorganic material of the first part 200a may have piezoelectric properties, and the organic material of the second part 200b may have ductility or flexibility.

[0135] The vibration part PCL may include a plurality of first parts 200a and a plurality of second parts 200b. For example, the plurality of first parts 200a and the plurality of second parts 200b may be arranged alternately and repeatedly along the second direction Y. Each of the plurality of first parts 200a may be positioned between two adjacent second parts 200b of the plurality of second parts 200b. For example, each of the plurality of first parts 200a may have a first width W1 parallel to the second direction Y and a length parallel to the first direction X. Each of the plurality of second parts 200b may be positioned parallel to the second direction Y. For example, each of the plurality of second parts 200b may have a second width W2 and a length parallel to the first direction X. Each of the plurality of second parts 200b may have the same dimensions, such as the same width, area, or volume. For example, each of the plurality of second parts 200b may have the same dimensions (e.g., the same width, area, or volume) within a process error range (or tolerance) that occurs during the manufacturing process. The first width W1 may be the same as or different from the second width W2. For example, the first width W1 may be greater than the second width W2. For example, the first portion 200a and the second portion 200b may include lines or bars having the same size or different sizes. Figure 5A The vibration part PCL shown in the figure may include a 2-2 composite structure and thus may have a resonance frequency of 20 kHz or less, but the embodiments of the present disclosure are not limited thereto, and the resonance frequency of the vibration part PCL may vary based on at least one of the shape, length, and thickness of the vibration part.

[0136] Reference Figure 3 、 Figure 4 and Figure 5B , the vibration part PCL of the vibration device 200 according to another embodiment of the present disclosure may include a plurality of first parts 200a and a plurality of second parts 200b arranged alternately and repeatedly in the first direction X. Each of the plurality of first parts 200a may be disposed between two adjacent second parts 200b of the plurality of second parts 200b. For example, each of the plurality of first parts 200a may have a third width W3 parallel to the first direction X and a length parallel to the second direction Y. Each of the plurality of second parts 200b may have a fourth width W4 parallel to the first direction X, and may have a length parallel to the second direction Y. The third width W3 may be the same as or different from the fourth width W4. For example, the third width W3 may be greater than the fourth width W4. For example, the first part 200a and the second part 200b may include lines or bars having the same size or different sizes. Therefore, Figure 5BThe vibration part PCL shown in the figure may include a 2-2 composite structure and thus may have a resonance frequency of 20 kHz or less, but the embodiments of the present disclosure are not limited thereto, and the resonance frequency of the vibration part PCL may vary based on at least one of the shape, length, and thickness of the vibration part.

[0137] exist Figure 5A and Figure 5B In each of the vibration parts PCL shown in FIG, each of the plurality of first parts 200a and each of the plurality of second parts 200b can be provided (or arranged) in parallel on the same plane (or the same layer). Each of the plurality of second parts 200b can be configured to fill the gap between two adjacent first parts 200a. Each of the plurality of second parts 200b can be connected to or attached to the adjacent first part 200a. Therefore, based on the lateral coupling (or lateral connection) between the first part 200a and the second part 200b, the vibration part PCL can be expanded to have a desired size or length.

[0138] exist Figure 5A and Figure 5B In each of the vibration parts (or vibration layers) PCL shown in FIG, the width (or size) W2 and W4 of each of the multiple second parts 200b can gradually decrease in the direction from the central part of the vibration part PCL or the vibration device 200 to the two edges (or both sides or both ends).

[0139] According to another embodiment of the present disclosure, the second portion 200b with the largest widths W2 and W4 among the plurality of second portions 200b can be located at a portion where the highest stress may be concentrated when the vibration portion PCL or the vibration device 200 vibrates in the vertical (or up-down) direction Z (or thickness direction). The second portion 200b with the smallest widths W2 and W4 among the plurality of second portions 200b can be located at a portion where relatively low stress may occur when the vibration portion PCL or the vibration device 200 vibrates in the vertical direction Z. For example, the second portion 200b with the largest widths W2 and W4 among the plurality of second portions 200b can be located at the center portion of the vibration portion PCL, and the second portion 200b with the smallest widths W2 and W4 among the plurality of second portions 200b can be located at each of the two edges of the vibration portion PCL. Therefore, when the vibration portion PCL or the vibration device 200 vibrates in the vertical direction Z, interference of sound waves or overlap of resonant frequencies occurring in the portion with the highest stress concentration can be reduced or minimized. Therefore, the drop in sound pressure level in the bass band can be reduced, thereby improving the flatness of the sound characteristics in the bass band. For example, the flatness of the sound characteristics can be the deviation level between the highest sound pressure and the lowest sound pressure.

[0140] exist Figure 5A and Figure 5B In each of the vibration parts PCL shown in FIG, each of the plurality of first parts 200a may have a different size (or width). For example, the size (or width) of each of the plurality of first parts 200a may gradually decrease or increase in a direction from the center of the vibration part PCL or the vibration device 200 to both edges (or both sides or ends). In this case, in the vibration part PCL, based on the various natural vibration frequencies of each of the plurality of first parts 200a having different sizes, the sound pressure level characteristics of the sound can be enhanced and the sound reproduction frequency band can be increased.

[0141] Reference Figure 3 、 Figure 4 and Figure 5C , the vibration part PCL of the vibration device 200 according to another embodiment of the present disclosure may include a plurality of first parts 200a spaced apart from each other in the first direction X and the second direction Y, and a second part 200b arranged between the plurality of first parts 200a. The plurality of first parts 200a can be arranged to be spaced apart from each other in the first direction X and the second direction Y. For example, each of the plurality of first parts 200a can have a hexahedral shape (or a six-sided member shape) of the same size and can be arranged in a lattice shape. The second part 200b can be arranged between the plurality of first parts 200a in each of the first direction X and the second direction Y. The second part 200b can be configured to fill the gap or space between two adjacent first parts 200a, or to surround each of the plurality of first parts 200a. Therefore, the second part 200b can be connected to or attached to the adjacent first part 200a. For example, the width of the second portion 200b disposed between two first portions 200a adjacent to each other along the first direction X may be the same as or different from the width of the first portion 200a, and the width of the second portion 200b disposed between two first portions 200a adjacent to each other along the second direction Y may be the same as or different from the width of the first portion 200a. Figure 5C The vibration portion PCL shown may have a resonance frequency of 30 MHz or less according to the 1-3 composite structure, but the embodiments of the present disclosure are not limited thereto, and the resonance frequency of the vibration portion PCL may vary based on at least one of its shape, length, and thickness.

[0142] Reference Figure 3 、 Figure 4 and Figure 5D, the vibration part PCL of the vibration device 200 according to another embodiment of the present disclosure may include a plurality of first parts 200a spaced apart from each other in the first direction X and the second direction Y, and a second part 200b surrounding each of the plurality of first parts 200a. Each of the plurality of first parts 200a may have a flat structure with a circular shape. For example, each of the plurality of first parts 200a may have a circular shape, but the embodiments of the present disclosure are not limited thereto, and may have a point shape including an elliptical shape, a polygonal shape, or a torus shape. The second part 200b may be configured to surround each of the plurality of first parts 200a. Therefore, the second part 200b may be connected to or attached to the side surface of each of the plurality of first parts 200a. The plurality of first parts 200a and the second part 200b may be set (or arranged) in parallel on the same plane (or the same layer). Therefore, Figure 5D The vibration part PCL shown may include a 1-3 composite structure and may be implemented as a circular vibration source (or vibrator), thereby enhancing vibration characteristics or sound output characteristics and having a resonance frequency of 30 MHz or less, but the embodiments of the present disclosure are not limited thereto, and the resonance frequency of the vibration part PCL may vary based on at least one of the shape, length, and thickness of the vibration part.

[0143] Reference Figure 3 、 Figure 4 and Figure 5E The vibration part PCL of the vibration device 200 according to another embodiment of the present disclosure may include a plurality of first parts 200a spaced apart from each other in the first direction X and the second direction Y, and a second part 200b surrounding each of the plurality of first parts 200a. Each of the plurality of first parts 200a may have a flat structure in a triangular shape. For example, each of the plurality of first parts 200a may have a triangular plate shape.

[0144] According to an embodiment of the present disclosure, four adjacent first parts 200a in the plurality of first parts 200a may be adjacent to each other to form a quadrangular or quadrilateral shape (or a square shape). The vertices of the four adjacent first parts 200a forming the quadrangular shape may be adjacent to each other in the central part (or part of the center) of the quadrangular shape. The second part 200b may be configured to surround each of the plurality of first parts 200a. Therefore, the second part 200b may be connected to or attached to the side surface (or lateral surface) of each of the plurality of first parts 200a. The plurality of first parts 200a and the second part 200b may be set (or arranged) in parallel on the same plane (or the same layer). Therefore, Figure 5EThe vibration portion PCL shown may have a resonance frequency of 30 MHz or less according to the 1-3 composite structure, but the embodiments of the present disclosure are not limited thereto, and the resonance frequency of the vibration portion PCL may vary based on at least one of its shape, length, and thickness.

[0145] As another embodiment of the present disclosure, Figure 5F As shown, six adjacent first parts 200a in the plurality of first parts 200a can be adjacent to each other to form a hexagonal shape (or a regular hexagonal shape). The vertices of the six adjacent first parts 200a forming the hexagonal shape can be adjacent to each other in the central part (or central part) of the hexagonal shape. The second part 200b can be configured to surround each of the plurality of first parts 200a. Therefore, the second part 200b can be connected to or attached to the side surface (or lateral surface) of each of the plurality of first parts 200a. The plurality of first parts 200a and the second part 200b can be set (or arranged) in parallel on the same plane (or the same layer). Therefore, Figure 5F The vibration part PCL shown may include a 1-3 composite structure and may be implemented as a circular vibration source (or vibrator), thereby enhancing vibration characteristics or sound output characteristics and having a resonance frequency of 30 MHz or less, but the embodiments of the present disclosure are not limited thereto, and the resonance frequency of the vibration part PCL may vary based on at least one of the shape, length, and thickness of the vibration part.

[0146] Reference Figure 5E and Figure 5F , 2N (where N is a natural number greater than or equal to 2) adjacent first portions 200a among the plurality of first portions 200a having a triangular shape may be disposed adjacent to each other to form a 2N triangular shape.

[0147] exist Figures 5A to 5F In another embodiment of the present disclosure, the plurality of first portions 200a may be configured as inorganic material portions. The inorganic material portion may include a piezoelectric material or an electroactive material. The piezoelectric material or the electroactive material may have the following characteristics: when pressure is applied to the crystal structure or distortion (or bending) is applied by an external force, a potential difference is generated due to dielectric polarization caused by a change in the relative positions of positive (+) ions and negative (-) ions, and vibration is generated by the electric field based on the reverse voltage applied thereto. As described above with reference to Figure 4 As described above, the first surface of each of the plurality of first portions 200 a may be electrically connected to the first electrode layer E1 , and the second surface of each of the plurality of first portions 200 a may be electrically connected to the second electrode layer E2 .

[0148] exist Figures 5A to 5FIn the embodiment of the present invention, the inorganic material portion included in each of the plurality of first portions 200a may include a ceramic-based material for generating relatively high vibrations, or may include a piezoelectric ceramic having a perovskite-based crystal structure. The perovskite crystal structure may have a piezoelectric effect and an inverse piezoelectric effect, and may be a plate-like structure with orientation. The perovskite crystal structure may be represented by the chemical formula "ABO3". In the chemical formula, "A" may include a divalent metal element, and "B" may include a tetravalent metal element. For example, in the chemical formula "ABO3", "A" and "B" may be cations, and "O" may be an anion. For example, the first portion 200a may include one of lead (II) titanate (PbTiO3), lead zirconate (PbZrO3), lead zirconate titanate (PbZrTiO3), barium titanate (BaTiO3), and strontium titanate (SrTiO3), but the embodiments of the present disclosure are not limited thereto.

[0149] When a perovskite crystal structure includes a central ion (e.g., lead (II) titanate (PbTiO3)), the position of the titanium (Ti) ion may be changed by external stress or magnetic field, and thus, the polarization may be changed, thereby generating a piezoelectric effect. For example, in the perovskite crystal structure, the cubic shape corresponding to the symmetrical structure may be changed to a tetragonal (or quadrilateral), orthorhombic, or rhombohedral structure corresponding to the asymmetric structure, thereby generating a piezoelectric effect. In the tetragonal (or quadrilateral), orthorhombic, or rhombohedral structure corresponding to the asymmetric structure, the polarization in the morphotropic phase boundary may be high, and the rearrangement of the polarization may be easy, thereby enabling the perovskite crystal structure to have high piezoelectric properties.

[0150] According to an embodiment of the present disclosure, the inorganic material portion included in each of the plurality of first portions 200a may include one or more materials of lead (Pb), zirconium (Zr), titanium (Ti), zinc (Zn), nickel (Ni), and niobium (Nb), but the embodiments of the present disclosure are not limited thereto.

[0151] According to another embodiment of the present disclosure, the inorganic material portion included in each of the plurality of first portions 200a may include a lead zirconate titanate (PZT)-based material including lead (Pb), zirconium (Zr), and titanium (Ti); or may include a lead zirconate nickel niobate (PZNN)-based material including lead (Pb), zirconium (Zr), nickel (Ni), and niobium (Nb), but embodiments of the present disclosure are not limited thereto. Furthermore, the inorganic material portion may include at least one of calcium titanate (CaTiO3), barium titanate (BaTiO3), and strontium titanate (SrTiO3), all of which do not contain Pb, but embodiments of the present disclosure are not limited thereto.

[0152] According to another embodiment of the present disclosure, the inorganic material portion included in each of the plurality of first portions 200a may have a piezoelectric deformation coefficient "d" of 1,000 pC / N or more in the thickness direction Z. 33 The vibration device may be applied to a target object having a large size and may need to have a high voltage electric deformation coefficient "d 33 ", in order to have sufficient vibration characteristics or piezoelectric characteristics. For example, in order to have a high voltage deformation coefficient "d 33 ", the inorganic material portion may include a PZT-based material (PbZrTiO3) as a main component, and may include a softener dopant material doped to the A site (Pb) and a relaxor ferroelectric material doped to the B site (ZrTi).

[0153] The softener dopant material can enhance the piezoelectric and dielectric properties of the inorganic material portion, for example, it can increase the piezoelectric deformation coefficient "d 33 ". The softener dopant material according to an embodiment of the present disclosure may include a divalent element "+2" to a trivalent element "+3". A morphotropic phase boundary (MPB) may be achieved by adding a softener dopant material to a PZT-based material (PbZrTiO3), and thus, piezoelectric and dielectric properties may be enhanced. For example, the softener dopant material may include strontium (Sr), barium (Ba), lanthanum (La), neodymium (Nd), calcium (Ca), yttrium (Y), erbium (Er), or ytterbium (Yb). For example, the ions of the softener dopant material (Sr) doped into the PZT-based material (PbZrTiO3) 2+ 、Ba 2+ 、La 2+ 、Nd 3+ , Ca 2+ 、Y 3+ 、Er 3+ 、Yb 3+ ) can replace a portion of lead (Pb) in the PZT-based material (PbZrTiO3), and the substitution rate thereof can be about 2 mol% to about 20 mol%. For example, when the substitution rate is less than 2 mol% or greater than 20 mol%, the perovskite crystal structure may be destroyed, and thus the electromechanical coupling coefficient "kP" and the piezoelectric deformation coefficient "d 33 " may be reduced. When the softener doping material is replaced, an MPB can be formed, and the piezoelectric and dielectric properties in the MPB can be high, thereby realizing a vibration device with high piezoelectric and high dielectric properties.

[0154] According to an embodiment of the present disclosure, a relaxor ferroelectric material doped into a PZT-based material (PbZrTiO3) can enhance the electrodeformation characteristics of the inorganic material portion. The relaxor ferroelectric material according to an embodiment of the present disclosure may include a material based on lead magnesium niobate (PMN) or a material based on lead nickel niobate (PNN), but the embodiments of the present disclosure are not limited thereto. The PMN-based material may include Pb, Mg, and Nb, and may, for example, include Pb(Mg,Nb)O3. The PNN-based material may include Pb, Ni, and Nb, and may, for example, include Pb(Ni,Nb)O3. For example, the relaxor ferroelectric material doped into a PZT-based material (PbZrTiO3) may replace a portion of each of zirconium (Zr) and titanium (Ti) in the PZT-based material (PbZrTiO3), and the replacement rate may be from about 5 mol% to about 25 mol%. For example, when the substitution rate is less than 5 mol% or greater than 25 mol%, the perovskite crystal structure may be destroyed, and thus the electromechanical coupling coefficient "kP" and the piezoelectric deformation coefficient "d 33 "May be reduced.

[0155] According to an embodiment of the present disclosure, the inorganic material portion provided in each of the plurality of first portions 211 may further include a donor material doped into the B site (ZrTi) of the PZT-based material (PbZrTiO3) to further improve the piezoelectric coefficient. For example, the donor material doped into the B site (ZrTi) may include a tetravalent element "+4" or a hexavalent element "+6". For example, the donor material doped into the B site (ZrTi) may include tellurium (Te), germanium (Ge), uranium (U), bismuth (Bi), niobium (Nb), tantalum (Ta), antimony (Sb), or tungsten (W).

[0156] The inorganic material portion configured in each of the plurality of first portions 200a according to an embodiment of the present disclosure may have a piezoelectric deformation coefficient "d" of 1,000 pC / N or more in the thickness direction Z. 33 ”, thereby realizing a vibration device with enhanced vibration characteristics. For example, the vibration device 200 with enhanced vibration characteristics can be realized in a vibration member (or vibration object) with a large area.

[0157] exist Figures 5A to 5FIn the embodiment, the second portion 200b can be arranged between the multiple first portions 200a, or can be arranged to surround each of the multiple first portions 200a. Therefore, in the vibration portion PCL or the vibration device 200, the vibration energy based on the link in the unit grid of each first portion 200a can be increased by the corresponding second portion 200b. Therefore, vibration can be increased, and piezoelectric properties and flexibility can be ensured. For example, the second portion 200b can include one of an epoxy-based polymer, an acrylic-based polymer, and a silicone-based polymer, but embodiments of the present disclosure are not limited thereto.

[0158] The second portion 200b according to an embodiment of the present disclosure may be configured with an organic material portion. For example, the organic material portion may be provided between the inorganic material portions and may absorb impact applied to the inorganic material portion (or the first portion), release stress concentrated on the inorganic material portion to improve the overall durability of the vibration portion PCL or the vibration device 200, and provide flexibility to the vibration portion PCL or the vibration device 200.

[0159] The second portion 200b according to an embodiment of the present disclosure may have a modulus and viscoelasticity lower than those of each first portion 200a. Therefore, the second portion 200b can improve the reliability of each first portion 200a, which is susceptible to impact due to its fragile nature. For example, the second portion 200b may include a material having a loss factor of approximately 0.01 to approximately 1.0 and a modulus of approximately 0.1 [GPa] to approximately 10 [GPa].

[0160] The organic material portion configured in the second portion 200b may include one or more of an organic material, an organic polymer, an organic piezoelectric material, and an organic non-piezoelectric material having flexibility or ductility compared to the inorganic material portion of the first portion 200a. For example, the second portion 200b may be referred to as an adhesive portion, a stretching portion, a bending portion, a damping portion, or a flexible portion, but embodiments of the present disclosure are not limited thereto.

[0161] Therefore, multiple first parts 200a and second parts 200b can be arranged (or connected) on the same plane, and thus, the vibration part PCL of the vibration device 200 according to various embodiments of the present disclosure can have a single thin film type. For example, the vibration part PCL can vibrate in the vertical (or vertical) direction by the first part 200a having vibration characteristics, and can be bent into a curved shape by the second part 200b having flexibility or ductility. In addition, in the vibration part PCL of the vibration device 200 according to various embodiments of the present disclosure, the size of the first part 200a and the size of the second part 200b can be adjusted based on the piezoelectric characteristics and flexibility required for the vibration part PCL. For example, if the vibration part PCL requires piezoelectric characteristics but not flexibility, the size of the first part 200a can be configured to be larger than the second part 200b. As another embodiment of the present disclosure, if the vibration part PCL requires flexibility but not piezoelectric characteristics, the size of the second part 200b can be configured to be larger than the first part 200a. Therefore, the size of the vibration part PCL can be adjusted based on its required characteristics, thereby simplifying the design of the vibration part PCL.

[0162] Figures 5A to 5F One or more of the vibration parts PCL shown in FIG may be Figure 3 The vibration portion PCL of the vibration device 200 shown in FIG. For example, the vibration portion PCL can be configured as described above with reference to FIG. Figures 5A to 5F One or more of the vibration parts PCL described are implemented.

[0163] According to an embodiment of the present disclosure, the vibration device 200 may include the above reference Figures 5A to 5F One or more of the vibration parts PCL are described.

[0164] According to an embodiment of the present disclosure, the vibration device 200 may be configured with a piezoelectric element. The piezoelectric element may be configured with a piezoelectric ceramic. For example, the piezoelectric element may alternately and / or repeatedly contract and expand to vibrate based on the piezoelectric effect or the inverse piezoelectric effect. For example, the piezoelectric element may be configured with a material based on lead zirconate titanate (PZT) or barium titanate (BaTiO3), but the embodiments of the present disclosure are not limited thereto.

[0165] Figure 6 An apparatus according to an embodiment of the present disclosure is shown. Figure 7 It is along Figure 6 The cross-sectional view is taken along line II-II'.

[0166] Reference Figure 6 and Figure 7, the device according to an embodiment of the present disclosure may include a display panel 400 displaying an image, and a vibration device 200 provided at a rear surface (or backside) of the display panel 400 .

[0167] The vibration device 200 of the device according to the embodiment of the present disclosure may be a reference Figure 1 The vibration device 200 is described, and therefore, repeated description of the vibration device 200 and its related elements will be omitted or briefly given. For example, the vibration device 200 can be provided in a device and can be implemented at a flexible printed circuit board.

[0168] The vibration device 200 of the device according to the embodiment of the present disclosure may be a reference Figures 1 to 5F The vibration device 200 is described in detail, and therefore, repeated description of the vibration device 200 and its related elements is omitted.

[0169] The display panel 400 may be configured to display an electronic image or a digital image. For example, the display panel 400 may output light to display an image. The display panel 400 may be a curved display panel, or any type of display panel such as a liquid crystal display panel, an organic light-emitting display panel, a quantum dot light-emitting display panel, a micro-light-emitting diode display panel, and an electrophoretic display panel. The display panel 400 may be a flexible display panel. For example, the display panel 400 may be a flexible light-emitting display panel, a flexible electrophoretic display panel, a flexible electrowetting display panel, a flexible micro-light-emitting diode display panel, or a flexible quantum dot light-emitting display panel, but the embodiments of the present disclosure are not limited thereto.

[0170] The display panel 400 according to an embodiment of the present disclosure may include a display area AA configured to display an image according to driving of a plurality of pixels. The display panel 400 may include a non-display area IA surrounding the display area AA, but the embodiment of the present disclosure is not limited thereto.

[0171] The display panel 400 according to an embodiment of the present disclosure may be configured to display images in a top emission type, a bottom emission type, a dual emission type, or the like, depending on the structure of a pixel array layer including an anode electrode, a cathode electrode, and a light-emitting device. In the top emission type, an image may be displayed by outputting visible light generated from the pixel array layer to a front region of a base substrate. In the bottom emission type, an image may be displayed by outputting visible light generated from the pixel array layer to a rear region of the base substrate.

[0172] The display panel 400 according to an embodiment of the present disclosure may include a pixel array portion provided in a pixel region composed of a plurality of gate lines and / or a plurality of data lines. The pixel array portion may include a plurality of pixels that display an image based on signals provided via signal lines. The signal lines may include gate lines, data lines, pixel driving power lines, etc., but the embodiments of the present disclosure are not limited thereto.

[0173] Each of the multiple pixels may include a pixel circuit layer, which includes a driving thin film transistor (TFT) arranged at the pixel area, an anode electrode electrically connected to the driving TFT, a light emitting device formed above the anode electrode, and a cathode electrode electrically connected to the light emitting device.

[0174] The driving TFT may be configured at a transistor region of each pixel region provided on the substrate. The driving TFT may include a gate electrode, a gate insulating layer, a semiconductor layer, a source electrode, and a drain electrode. The semiconductor layer of the driving TFT may include silicon such as amorphous silicon (a-Si), polycrystalline silicon (poly-Si), or low-temperature polycrystalline silicon, or may include an oxide such as indium gallium zinc oxide (IGZO), but embodiments of the present disclosure are not limited thereto.

[0175] The anode electrode may be provided at an opening region provided at each pixel region and may be electrically connected to the driving TFT.

[0176] The light-emitting device according to the embodiment may include an organic light-emitting device layer formed above the anode electrode. The organic light-emitting device layer can be implemented to emit light with the same color (e.g., white light) for each pixel, or can be implemented to emit light with different colors (e.g., red light, green light, or blue light) for each pixel. The cathode electrode (or common electrode) can be connected to the organic light-emitting device layer arranged in each pixel area. For example, the organic light-emitting device layer can have a stacked structure, which includes a single structure or two or more structures including the same color for each pixel. As another embodiment of the present disclosure, the organic light-emitting device layer can have a stacked structure, which includes two or more structures including one or more different colors for each pixel. The two or more structures including one or more different colors can be configured with one or more of blue, red, yellow-green, and green, or a combination thereof, but the embodiments of the present disclosure are not limited thereto. The embodiments of the combination can include blue and red, red and yellow-green, red and green, red / yellow-green / green, etc., but the embodiments of the present disclosure are not limited thereto. In addition, the present disclosure can be applied regardless of its stacking order. The stacked structure including two or more structures having the same color or one or more different colors may further include a charge generation layer between the two or more structures. The charge generation layer may have a PN junction structure and may include an N-type charge generation layer and a P-type charge generation layer.

[0177] A light-emitting device according to another embodiment of the present disclosure may include a micro-light-emitting diode device electrically connected to each of an anode electrode and a cathode electrode. The micro-light-emitting diode device may be a light-emitting diode implemented as an integrated circuit (IC) or a chip type. The micro-light-emitting diode device may include a first terminal electrically connected to the anode electrode and a second terminal electrically connected to the cathode electrode. The cathode electrode may be commonly connected to the second terminal of the micro-light-emitting diode device provided in each pixel region.

[0178] The encapsulation portion may be formed above the substrate to surround the pixel array portion, thereby preventing oxygen or water from penetrating into the light-emitting device of the pixel array portion. The encapsulation portion according to an embodiment of the present disclosure may be formed as a multilayer structure in which organic material layers and inorganic material layers are alternately stacked, but the embodiments of the present disclosure are not limited thereto. The inorganic material layer may prevent oxygen or water from penetrating into the light-emitting device of the pixel array portion. The organic material layer may be formed to have a thickness relatively thicker than the inorganic material layer to cover particles generated in the manufacturing process. For example, the encapsulation portion may include a first inorganic layer, an organic layer above the first inorganic layer, and a second inorganic layer above the organic layer. The organic layer may be a particle covering layer, but the embodiments of the present disclosure are not limited thereto. The touch panel may be disposed above the encapsulation portion, or may be disposed at the rear surface of the pixel array portion.

[0179] The display panel 400 according to an embodiment of the present disclosure may include a first substrate, a second substrate and a liquid crystal layer. The first substrate may be an upper substrate or a thin film transistor (TFT) array substrate. For example, the first substrate may include a pixel array (or a display portion or a display area), the pixel array including a plurality of pixels, which are respectively arranged in a plurality of pixel areas defined by the intersection between a plurality of gate lines and / or a plurality of data lines. Each of the plurality of pixels may include a TFT connected to the gate line and / or the data line, a pixel electrode connected to the TFT, and a common electrode arranged adjacent to the pixel electrode and provided with a common voltage.

[0180] The first substrate may further include a pad portion disposed at the first edge (or the first non-display portion) and a gate driving circuit disposed at the second edge (or the second non-display portion).

[0181] The pad portion can provide externally provided signals to the pixel array and / or the gate driver circuit. For example, the pad portion can include a plurality of data pads connected to a plurality of data lines via a plurality of data link lines and / or a plurality of gate input pads connected to the gate driver circuit via a gate control signal line. For example, the first substrate can be larger than the second substrate, but embodiments of the present disclosure are not limited thereto.

[0182] The gate drive circuit according to an embodiment of the present disclosure may be embedded (or integrated) into the second edge of the first substrate to connect to a plurality of gate lines. For example, the gate drive circuit may be implemented with a shift register including transistors formed by the same process as the TFTs provided in the pixel area. The gate drive circuit according to another embodiment of the present disclosure may be implemented as an integrated circuit (IC) and may be provided at the panel drive circuit without being embedded in the first substrate.

[0183] The second substrate may be a lower substrate or a color filter array substrate. For example, the second substrate may include a pixel defining layer configured to include an opening area overlapping with a pixel area formed at the first substrate, and a color filter layer formed at the opening area. The size of the second substrate may be smaller than that of the first substrate, but the embodiments of the present disclosure are not limited thereto. For example, the second substrate may overlap with the remainder of the first substrate (i.e., the upper substrate) except for the first edge. A sealant may be used to bond the second substrate to the remainder of the first substrate except for the first edge, with a liquid crystal layer therebetween.

[0184] The liquid crystal layer may be disposed between the first and second substrates. The liquid crystal layer may include liquid crystals containing liquid crystal molecules whose arrangement directions change based on an electric field generated by a common voltage and a data voltage applied to a pixel electrode of each pixel.

[0185] The first polarization member may be attached to the upper surface of the first substrate and may polarize light passing through the first substrate and output to the outside. The second polarization member may be attached to the lower surface of the second substrate and may polarize light incident from the backlight and propagating to the liquid crystal layer.

[0186] The display panel 400 according to an embodiment of the present disclosure may drive a liquid crystal layer based on an electric field generated in each pixel by a data voltage and a common voltage applied thereto, and thus may display an image based on light passing through the liquid crystal layer.

[0187] In the display panel 400 according to another embodiment of the present disclosure, the first substrate may be implemented as a color filter array substrate, and the second substrate may be implemented as a TFT array substrate. For example, the display panel 400 according to another embodiment of the present disclosure may have a type in which the upper and lower parts of the display panel 400 according to an embodiment of the present disclosure are reversed. For example, the pad portion of the display panel 400 according to another embodiment of the present disclosure may be covered by a separate mechanism or structure.

[0188] The display panel 400 according to another embodiment of the present disclosure may include a curved portion, which may be bent or curved to have a curved shape or a specific curvature radius.

[0189] The curved portion of the display panel 400 may be located at least one of one edge and another edge of the display panel 400 that are parallel to each other. The one edge and / or the other edge of the display panel 400 where the curved portion is implemented may include only the non-display area IA, or may include the edge of the display area AA and the non-display area IA. The display panel 400 including the curved portion implemented by bending the non-display area IA may have a one-sided frame curved structure or a two-sided frame curved structure. In addition, the display panel 400 including the curved portion implemented by bending the edge of the display area AA and the non-display area IA may have a one-sided active bending structure or a two-sided active bending structure.

[0190] The vibration device 200 can vibrate the display panel 400. For example, the vibration device 200 can vibrate the display panel 400 based on a driving signal (or voice signal or sound signal) provided from the vibration driving circuit. Figure 1 The vibration driving circuit 100 shown in FIG. 1 is used to vibrate the display panel 400 using a driving signal provided by the vibration driving circuit 100. For example, the vibration device 200 can be implemented at the rear surface of the display panel 400 to directly vibrate the display panel 400. For example, the vibration device 200 can vibrate the display panel 400 at the rear surface of the display panel 400, thereby providing sound and / or tactile feedback to the user (or viewer) based on the vibration of the display panel 400.

[0191] According to an embodiment of the present disclosure, the vibration device 200 may vibrate according to a driving signal synchronized with an image displayed on the display panel 400 to vibrate the display panel 400. As another embodiment of the present disclosure, the vibration device 200 may vibrate according to a tactile feedback signal (or tactile feedback signal) synchronized with a user's touch applied to a touch panel (or touch sensor layer) disposed above or embedded in the display panel 400, and may vibrate the display panel 400. Therefore, the display panel 400 may vibrate based on the vibration of the vibration device 200 to provide at least one of sound and tactile feedback to the user (or viewer).

[0192] The vibration device 200 according to the embodiment of the present disclosure can be implemented to have a size corresponding to the display area AA of the display panel 400. The size of the vibration device 200 can be 0.9 times to 1.1 times the size of the display area AA, but the embodiment of the present disclosure is not limited thereto. For example, the size of the vibration device 200 can be equal to or less than the size of the display area AA. For example, the size of the vibration device 200 can be the same or approximately the same as the display area AA of the display panel 400, so that the vibration device 200 can cover most areas of the display panel 400, and the vibration generated by the vibration device 200 can vibrate the entire part of the display panel 400, so that the positioning of the sound can be high and the user's satisfaction can be improved. In addition, the contact area (or panel coverage) between the display panel 400 and the vibration device 200 can be increased, so that the vibration area of ​​the display panel 400 can be increased, thereby improving the sound of the mid-bass frequency band generated based on the vibration of the display panel 400. In addition, the vibration device 200 applied to a large-sized display device can vibrate the entire display panel 400 having a large size (or large area), and thus, the localization of the sound based on the vibration of the display panel 400 can be further enhanced, thereby achieving an improved sound effect. Therefore, the vibration device 200 according to an embodiment of the present disclosure can fully vibrate the display panel 400 in the vertical (or front-to-back) direction on the rear surface of the display panel 400, thereby outputting the desired sound to the front area in front of the device or the display device.

[0193] The vibration device 200 may be provided at the rear surface of the display panel 400 to overlap with the display area of ​​the display panel 400. For example, the vibration device 200 may overlap with half or more of the display area of ​​the display panel 400. As another embodiment of the present disclosure, the vibration device 200 may overlap with the entire display area of ​​the display panel 400.

[0194] The vibration device 200 according to an embodiment of the present disclosure can vibrate by alternately repeating contraction and expansion based on the inverse piezoelectric effect when an alternating current (AC) voltage is applied, thereby vibrating the display panel 400 through its vibration. For example, the vibration device 200 can vibrate according to a voice signal synchronized with the image displayed on the display panel 400 to vibrate the display panel 400. As another embodiment of the present disclosure, the vibration device 200 can vibrate according to a tactile feedback signal (or tactile feedback signal) synchronized with a user's touch applied to a touch panel (or touch sensor layer) provided above the display panel 400 or embedded in the display panel 400, and can vibrate the display panel 400. Therefore, the display panel 400 can vibrate based on the vibration of the vibration device 200 to provide at least one of sound and tactile feedback to the user (or viewer).

[0195] Therefore, the device according to an embodiment of the present disclosure can output the sound generated by the vibration of the display panel 400 in the front area in front of the display panel based on the vibration of the vibration device 200. In addition, in the device according to an embodiment of the present disclosure, most areas of the display panel 400 can be vibrated by the vibration device 200 having a membrane type, thereby further enhancing the sound localization and sound pressure level characteristics of the sound based on the vibration of the display panel 400.

[0196] The device according to an embodiment of the present disclosure may further include a connection member (or a first connection member) 450 .

[0197] According to an embodiment of the present disclosure, a connection member 450 may be provided between the rear surface of the display panel 400 and the vibration device 200, and may connect or couple the vibration device 200 to the rear surface of the display panel 400. For example, the vibration device 200 may be connected or coupled to the rear surface of the display panel 400 through the connection member 450, and thus may be supported by or provided at the rear surface of the display panel 400. For example, the vibration device 200 may be provided at the rear surface of the display panel 400 through the connection member 450.

[0198] The connecting member 450 according to an embodiment of the present disclosure may include a material including an adhesive layer having good adhesion or adhesion to each of the rear surface of the display panel 400 and the vibration device 200. For example, the connecting member 450 may include a foam pad, double-sided tape, an adhesive, etc., but the embodiments of the present disclosure are not limited thereto. For example, the adhesive layer of the connecting member 450 may include epoxy resin, acrylic resin, silicone resin, or urethane, but the embodiments of the present disclosure are not limited thereto. For example, the adhesive layer of the connecting member 450 may include an acrylic-based material, which is relatively better than acrylic resin and urethane in terms of adhesion and hardness. Therefore, the vibration of the vibration device 200 can be well transmitted to the display panel 400.

[0199] The adhesive layer of the connecting member 450 may further include additives such as a tackifier or adhesion enhancer, a wax component, an antioxidant, and the like. The additives may prevent or reduce the connection member 450 from being detached (peeled off) from the display panel 400 due to the vibration of the vibration device 200. For example, the tackifier may be a rosin derivative, and the wax component may be paraffin, and the like. For example, the antioxidant may be a phenol-based antioxidant such as a thioester, but embodiments of the present disclosure are not limited thereto.

[0200] The connection member 450 according to another embodiment of the present disclosure may further include a hollow portion between the display panel 400 and the vibration device 200. The hollow portion of the connection member 450 may provide an air gap between the display panel 400 and the vibration device 200. Due to the air gap, the sound waves (or sound pressure) based on the vibration of the vibration device 200 may not be dispersed by the connection member 450 and may be concentrated on the display panel 400. Therefore, the vibration loss caused by the connection member 450 may be minimized, thereby increasing the sound characteristics and / or sound pressure level characteristics of the sound generated by the vibration of the display panel 400.

[0201] The device according to an embodiment of the present disclosure may further include a plate disposed between the display panel 400 and the vibration device 200. The plate may be similar to the plate 215 and may include a metal material, for example, one or more of stainless steel, aluminum (Al), magnesium (Mg), a magnesium (Mg) alloy, a magnesium-lithium (Mg-Li) alloy, and an Al alloy, but the embodiment of the present disclosure is not limited thereto.

[0202] The device according to an embodiment of the present disclosure may further include a support member 500 provided at the rear surface of the display panel 400 .

[0203] The supporting member 500 may be disposed at the rear surface of the display panel 400. For example, the supporting member 500 may cover the rear surface of the display panel 400. For example, the supporting member 500 may cover the entire rear surface of the display panel 400 with a gap space GS therebetween. For example, the supporting member 500 may include at least one or more of a glass material, a metal material, and a plastic material. For example, the supporting member 500 may be a rear surface structure or a collective structure. For example, the supporting member 500 may be referred to as other terms such as a cover bottom, a plate bottom, a back cover, a base frame, a metal frame, a metal chassis, a chassis base, an m-chassis, etc. For example, the supporting member 500 may be implemented as any type of frame or plate-like structure disposed at the rear surface of the display panel 400.

[0204] The edges or sharp corners of the support member 500 may be chamfered or rounded to have an inclined or curved shape. For example, the support member 500 made of glass may be sapphire glass. As another embodiment of the present disclosure, the support member 500 made of metal may include one or more of aluminum (Al), Al alloy, magnesium (Mg), magnesium (Mg) alloy, and iron (Fe)-nickel (Ni) alloy.

[0205] The support member 500 according to an embodiment of the present disclosure may include a first support member 510 and a second support member 530 .

[0206] The first supporting member 510 may be disposed between the rear surface of the display panel 400 and the second supporting member 530. For example, the first supporting member 510 may be disposed between the rear edge portion of the display panel 400 and the front edge portion of the second supporting member 530. The first supporting member 510 may support one or more of the rear edge portion of the display panel 400 and the front edge portion of the second supporting member 530. As another embodiment of the present disclosure, the first supporting member 510 may cover the rear surface of the display panel 400. For example, the first supporting member 510 may cover the entire rear surface of the display panel 400. For example, the first supporting member 510 may be a member that covers the entire rear surface of the display panel 400. For example, the first supporting member 510 may include at least one of a glass material, a metal material, and a plastic material. For example, the first supporting member 510 may be an inner plate, but embodiments of the present disclosure are not limited thereto. For example, the first supporting member 510 may be omitted.

[0207] The first supporting member 510 may be spaced apart from the rear surface of the display panel 400 or the vibration device 200 with a gap space GS therebetween. For example, the gap space GS may be referred to as an air gap, a vibration space, a sound resonance box, etc., but the embodiments of the present disclosure are not limited thereto.

[0208] The second support member 530 may be provided at the rear surface of the first support member 510. The second support member 530 may be a member that covers the entire rear surface of the display panel 400. For example, the second support member 530 may include at least one of a glass material, a metal material, and a plastic material. For example, the second support member 530 may be an outer plate, a rear plate, a back plate, or a back cover, but embodiments of the present disclosure are not limited thereto.

[0209] The support member 500 according to an embodiment of the present disclosure may further include a connection member (or a second connection member, or a coupling member) 550 .

[0210] The connecting member 550 may be disposed between the first supporting member 510 and the second supporting member 530. For example, the first supporting member 510 and the second supporting member 530 may be coupled or connected to each other via the connecting member 550. For example, the connecting member 550 may be an adhesive resin, a double-sided tape, or a double-sided adhesive foam pad, but embodiments of the present disclosure are not limited thereto. For example, the connecting member 550 may have elasticity for absorbing shock, but embodiments of the present disclosure are not limited thereto. For example, the connecting member 550 may be disposed throughout the entire area between the first supporting member 510 and the second supporting member 530. As another embodiment of the present disclosure, the connecting member 550 may be disposed between the first supporting member 510 and the second supporting member 530 in a grid structure including air gaps.

[0211] The device according to an embodiment of the present disclosure may further include a middle frame 600. The middle frame 600 may be disposed between the rear edge portion of the display panel 400 and the front edge portion of the support member 500. The middle frame 600 may support one or more of the rear edge portion of the display panel 400 and the front edge portion of the support member 500. The middle frame 600 may surround one or more of the side surfaces of each of the display panel 400 and the support member 500. The middle frame 600 may provide a gap space GS between the display panel 400 and the support member 500. The middle frame 600 may be referred to as a middle cabinet, a middle cover, a middle chassis, etc., but embodiments of the present disclosure are not limited thereto.

[0212] The middle frame 600 according to an embodiment of the present disclosure may include a first supporting portion 610 and a second supporting portion 630. For example, the first supporting portion 610 may be a supporting portion, but the embodiment of the present disclosure is not limited thereto. For example, the second supporting portion 630 may be a sidewall portion, but the embodiment of the present disclosure is not limited thereto.

[0213] The first supporting portion 610 may be disposed between the rear edge of the display panel 400 and the front edge of the supporting member 500, and thus, a gap space GS may be provided between the display panel 400 and the supporting member 500. The front surface of the first supporting portion 610 may be coupled or connected to the rear edge portion of the display panel 400 through a first connecting member (or a first coupling member) 601. The rear surface of the first supporting portion 610 may be coupled or connected to the front edge portion of the supporting member 500 through a second connecting member (or a second coupling member) 603. For example, the first supporting portion 610 may have a single picture frame structure in a square shape or a frame structure in a shape of a plurality of partition bars, but embodiments of the present disclosure are not limited thereto.

[0214] The second supporting portion 630 may be disposed parallel to the thickness direction Z of the device. For example, the second supporting portion 630 may be perpendicularly coupled to the outer surface of the first supporting portion 610 parallel to the thickness direction Z of the device. The second supporting portion 630 may surround one or more of the outer surface of the display panel 400 and the outer surface of the support member 500, thereby protecting the outer surface of each of the display panel 400 and the support member 500. The first supporting portion 610 may protrude from the inner surface of the second supporting portion 630 toward the gap space GS between the display panel 400 and the support member 500.

[0215] The device according to the embodiment of the present disclosure may include a panel connection member instead of the middle frame 600 .

[0216] The panel connection member may be disposed between the rear edge portion of the display panel 400 and the front edge portion of the support member 500, and may provide a gap space GS between the display panel 400 and the support member 500. The panel connection member may be disposed between the rear edge portion of the display panel 400 and the front edge portion of the support member 500 to adhere the display panel 400 and the support member 500. For example, the panel connection member may be a double-sided tape, a single-sided tape, or a double-sided adhesive foam pad, but embodiments of the present disclosure are not limited thereto. For example, the panel connection member may include epoxy resin, acrylic resin, silicone resin, or urethane, but embodiments of the present disclosure are not limited thereto. For example, in order to minimize the vibration of the display panel 400 transmitted to the support member 500, the adhesive layer of the panel connection member may include a urethane-based material, which has relatively ductile properties compared to acrylic resins among acrylic resins and urethanes. Therefore, the vibration of the display panel 400 transmitted to the support member 500 can be minimized.

[0217] In a device according to an embodiment of the present disclosure, when the device includes a panel connection member instead of the middle frame 600, the support member 500 may include a curved sidewall that curves from the end (or ends) of the second support member 530 and surrounds one or more of the outer surfaces (or outer sidewalls) of each of the first support member 510, the panel connection member, and the display panel 400. The curved sidewall according to an embodiment of the present disclosure may have a single sidewall structure or a curling structure. A curling structure may be a structure in which the ends of any member are bent into a curved shape and overlap each other or are spaced apart in parallel. For example, to enhance the aesthetics of the design, the curved sidewall may include a first curved sidewall that curves from one side of the second support member 530 and a second curved sidewall that curves from the first curved sidewall to the area between the first curved sidewall and the outer surface of the display panel 400. The second curved sidewall may be spaced apart from the inner surface of the first curved sidewall to minimize contact with the inner surface of the first curved sidewall or external impact transmitted to the outer surface of the display panel 400 in a lateral direction. Therefore, the second curved sidewall may prevent the outer surface of the display panel 400 from contacting the inner surface of the first curved sidewall, or may prevent an external impact in a lateral direction from being transferred to the outer surface of the display panel 400 .

[0218] According to another embodiment of the present disclosure, in the device according to another embodiment of the present disclosure, the middle frame 600 may be omitted. Instead of the middle frame 600, it may be configured with a panel connecting member or adhesive. According to another embodiment of the present disclosure, it may be configured with a partition instead of the middle frame 600.

[0219] Figure 8 is a flowchart illustrating the operation of the vibration generating device according to an embodiment of the present disclosure.

[0220] Reference Figure 1 and Figure 8 In operation S800, the vibration drive circuit 100 may provide the vibration device 200 with an nth drive signal corresponding to the nth sound source signal. Then, in operation S810, the temperature measurer 110 may measure the internal temperature value (or circuit internal temperature value or first temperature value) of the vibration drive circuit 100, and in operation S820, the current measurer 120 may measure the current value of the nth drive signal. For example, the circuit internal temperature value (or first temperature value) measured in operation S810 may be provided to the drive signal generator 140. For example, the current value measured in operation S820 may be provided to the temperature predictor 130.

[0221] In operation S810, the temperature measurer 110 may measure a circuit internal temperature value in at least one region of the vibration driving circuit 100. For example, the temperature measurer 110 may measure at least one circuit internal temperature value.

[0222] In operation S810 , the temperature measurer 110 may measure a temperature value of an adjacent region of the amplifier 150 provided within the vibration driving circuit 100 .

[0223] In operation S820 , the current measurer 120 may be connected to the line W between the vibration driving circuit 100 and the vibration device 200 , and may measure a current value of the nth driving signal flowing in the line W.

[0224] In operation S820 , the current measurer 120 may be connected to a portion n of the wire W adjacent to the vibration driving circuit 100 and may measure a current value of the nth driving signal at the portion n of the wire W.

[0225] After operation S820, in operation S830, the temperature predictor 130 may set or adjust a temperature prediction value (or a second temperature value) of the vibration device corresponding to the current value from the current measurer 120. The temperature prediction value of the vibration device set or adjusted in operation S830 may be provided to the driving signal generator 140.

[0226] In operation S830 , the temperature predictor 130 may set or adjust a temperature prediction value of the vibration device with reference to a current-temperature table including the temperature prediction value of the vibration device corresponding to each driving signal current value.

[0227] In operation S830 , when the driving signal current value measured in operation S820 is provided from the current measurer 120 , the temperature predictor 130 may set or adjust a temperature prediction value of the vibration device corresponding to the driving signal current value with reference to the current-temperature table.

[0228] After operation S830, in operation S840, the driving signal generator 140 may generate an (n+1)th driving signal corresponding to the (n+1)th sound source signal provided from the sound source providing system 300, and in operation S850 may compensate the generated (n+1)th driving signal based on the compensation value to output a compensated (n+1)th driving signal.

[0229] In operation S850 , the driving signal generator 140 may compensate the (n+1)th driving signal based on at least one of the circuit internal temperature value from the temperature measurer 110 and the temperature prediction value of the vibration device from the temperature predictor 130 .

[0230] In operation S850, the driving signal generator 140 may set or adjust a frequency-based gain compensation value based on at least one of a circuit internal temperature value and a temperature prediction value of the vibration device, compensate for the frequency-based gain of the (n+1)th driving signal based on the set or adjusted frequency-based gain compensation value, and apply the compensated frequency-based gain to the driving signal to compensate the driving signal.

[0231] In operation S850, the drive signal generator 140 may set or adjust a frequency-based gain compensation value based on the circuit internal temperature value. For example, the drive signal generator 140 may refer to a first temperature compensation table to set or adjust a frequency-based gain compensation value corresponding to the circuit internal temperature value. For example, the first temperature compensation table may include a compensation value corresponding to each circuit internal temperature value.

[0232] In operation S850, the drive signal generator 140 may set or adjust a frequency-based gain compensation value based on the temperature prediction value of the vibration device. For example, the drive signal generator 140 may refer to a second temperature compensation table to set or adjust a frequency-based gain compensation value corresponding to the temperature prediction value of the vibration device. For example, the second temperature compensation table may include a compensation value corresponding to each temperature prediction value of the vibration device.

[0233] In operation S850, the drive signal generator 140 may set or adjust a frequency-based gain compensation value based on the internal circuit temperature value and the temperature prediction value of the vibration device. For example, the drive signal generator 140 may refer to a third temperature compensation table to set or adjust a frequency-based gain compensation value corresponding to the internal circuit temperature value and the temperature prediction value of the vibration device. For example, the third temperature compensation table may include a compensation value corresponding to each internal circuit temperature value and each temperature prediction value of the vibration device.

[0234] Subsequently, in operation S860 , the amplifier 150 amplifies the driving signal provided from the driving signal generator 140 based on a predetermined gain and may then provide the amplified driving signal to the vibration device 200 .

[0235] The vibration generating device according to the embodiment of the present disclosure can be applied to the vibration generating device provided in the device. The device according to the embodiment of the present disclosure can be applied to mobile devices, video phones, smart watches, watch phones, wearable devices, foldable devices, rollable devices, bendable devices, flexible devices, bending devices, sliding devices, variable devices, electronic organizers, e-books, portable multimedia players (PMP), personal digital assistants (PDA), MP3 players, mobile medical equipment, desktop personal computers (PC), laptop PCs, netbook computers, workstations, navigation devices, car navigation devices, car display devices, car devices, theater devices, theater display devices, televisions, wallpaper display devices, signage devices, game consoles, laptop computers, monitors, cameras, video cameras, household appliances, etc. In addition, the vibration device according to the embodiment of the present disclosure can be applied to organic light emitting lighting devices or inorganic light emitting lighting devices. When the vibration device according to the embodiment of the present disclosure is applied to lighting devices, the vibration device can be used as lighting devices and speakers. Furthermore, when the vibration generating device of an embodiment of the present disclosure is applied to a mobile device, the vibration generating device may function as one or more of a speaker, a receiver, and a haptic device, but the embodiments of the present disclosure are not limited thereto.

[0236] A vibration generating device, an operating method thereof, and a device including the vibration generating device according to an embodiment of the present disclosure will be described below.

[0237] A vibration generating device according to some embodiments of the present disclosure may include a vibration device, and a vibration driving circuit, the vibration driving circuit including a driving signal generator configured to provide a driving signal to the vibration device, the driving signal generator may be configured to set or adjust a frequency-based gain compensation value based on a circuit internal temperature value of the vibration driving circuit and at least one of a temperature prediction value of the vibration device corresponding to a current value of an nth driving signal, compensate the frequency-based gain value based on the set or adjusted frequency-based gain compensation value, compensate the (n+1)th driving signal based on the compensated frequency-based gain value, and provide the compensated (n+1)th driving signal to the vibration device.

[0238] According to some embodiments of the present disclosure, the vibration drive circuit may include a temperature measurer configured to measure a temperature value inside the circuit, and the drive signal generator may receive the circuit internal temperature value from the temperature measurer and may set or adjust a frequency-based gain compensation value corresponding to the circuit internal temperature value.

[0239] According to some embodiments of the present disclosure, the drive signal generator may be configured to set or adjust a frequency-based gain compensation value corresponding to a circuit internal temperature value with reference to a first temperature compensation table, the first temperature compensation table including compensation values ​​corresponding to each circuit internal temperature value.

[0240] According to some embodiments of the present disclosure, the vibration drive circuit may include: a current measurer configured to measure a current value of an nth drive circuit; and a temperature predictor that receives the current value from the current measurer to output a temperature prediction value corresponding to the current value, and the drive signal generator may be configured to receive the temperature prediction value from the temperature predictor and set or adjust a frequency-based gain compensation value corresponding to the temperature prediction value.

[0241] According to some embodiments of the present disclosure, the driving signal generator may be configured to set or adjust a frequency-based gain compensation value corresponding to a temperature prediction value with reference to a second temperature compensation table, the second temperature compensation table including a compensation value corresponding to each temperature prediction value.

[0242] According to some embodiments of the present disclosure, the vibration drive circuit may include a temperature measurer configured to measure a temperature value inside the circuit, a current measurer configured to measure a current value of an nth drive signal, and a temperature predictor configured to receive the current value from the current measurer to output a temperature prediction value corresponding to the current value, and the drive signal generator may be configured to receive the circuit internal temperature value from the temperature measurer and the temperature prediction value from the temperature predictor, and set or adjust a frequency-based gain compensation value corresponding to the circuit internal temperature value and the temperature prediction value.

[0243] According to some embodiments of the present disclosure, the drive signal generator may be configured to set or adjust a frequency-based gain compensation value corresponding to a circuit internal temperature value and a temperature prediction value with reference to a third temperature compensation table, wherein the third temperature compensation table includes compensation values ​​corresponding to each circuit internal temperature value and each temperature prediction value.

[0244] According to some embodiments of the present disclosure, the vibration driving circuit may include an amplifier configured to amplify the driving signal from the driving signal generator and provide the amplified driving signal to the vibration device, and the temperature measurer may include at least one temperature sensor disposed adjacent to the amplifier.

[0245] According to some embodiments of the present disclosure, the temperature predictor may be configured to output a temperature prediction value corresponding to the driving signal current value with reference to a current-temperature table including a temperature prediction value corresponding to each driving signal current value.

[0246] According to some embodiments of the present disclosure, the current measurer may include at least one current sensor connected to a portion of a line between the vibration driving circuit and the vibration device that is adjacent to the vibration device.

[0247] According to some embodiments of the present disclosure, the vibration device may include one or more of a piezoelectric element and a membrane-type vibration device.

[0248] According to some embodiments of the present disclosure, the vibration device may include a vibration portion, and the vibration portion may include a plurality of first portions and a plurality of second portions between the plurality of first portions, the first portions including an inorganic material, and the second portions including an organic material.

[0249] According to some embodiments of the present disclosure, the vibration device may further include a first electrode layer disposed at a first surface of the vibration portion, and a second electrode layer disposed at a second surface of the vibration portion different from the first surface.

[0250] According to some embodiments of the present disclosure, the first portion may have piezoelectric properties, and the second portion may have ductile properties.

[0251] An apparatus according to some embodiments of the present disclosure may include a vibration member, and a vibration generating apparatus that causes the vibration member to vibrate and includes a vibration device and a vibration driving circuit, the vibration driving circuit including a driving signal generator that provides a driving signal to the vibration device, and the driving signal generator may be configured to set or adjust a frequency-based gain compensation value based on at least one of a circuit internal temperature value of the vibration driving circuit and a temperature prediction value of the vibration device corresponding to a current value of an nth driving signal, compensate the frequency-based gain value based on the set or adjusted frequency-based gain compensation value, compensate the (n+1)th driving signal based on the compensated frequency-based gain value, and provide the compensated (n+1)th driving signal to the vibration device.

[0252] According to some embodiments of the present disclosure, the device may further include one or more of a connecting member and a plate disposed between the vibration member and the vibration generating device.

[0253] According to some embodiments of the present disclosure, the vibration member may include a plate, and the plate may include one of a single non-metal or a composite non-metal of metal and one or more of wood, plastic, glass, cloth, paper, and leather.

[0254] According to some embodiments of the present disclosure, the vibration member may include a display panel including a plurality of pixels configured to display an image, or the vibration member may include a non-display panel of a light emitting diode lighting panel, an organic light emitting lighting panel, and an inorganic light emitting lighting panel.

[0255] According to some embodiments of the present disclosure, the vibration component may include a display panel comprising a plurality of pixels configured to display an image, or the vibration component includes one or more of a vehicle interior material, a vehicle glass window, a building ceiling, a building interior material, a building glass window, an aircraft interior material, and an aircraft glass window.

[0256] According to some embodiments of the present disclosure, the operating method of the vibration generating device may include: providing an nth driving signal to the vibration device; measuring the internal circuit temperature value of the vibration driving circuit; measuring the driving signal current value of the nth driving signal; setting or adjusting the temperature prediction value of the vibration device corresponding to the driving signal current value; and generating an (n+1)th driving signal and compensating the (n+1)th driving signal based on the compensation value.

[0257] According to some embodiments of the present disclosure, compensating the (n+1)th drive signal may include setting or adjusting a frequency-based gain compensation value based on at least one of a circuit internal temperature value and a temperature prediction value, compensating the frequency-based gain value based on the set or adjusted frequency-based gain compensation value, and compensating the (n+1)th drive signal based on the compensated frequency-based gain value.

[0258] According to some embodiments of the present disclosure, setting or adjusting the temperature prediction value may include setting or adjusting the temperature prediction value corresponding to the drive signal current value with reference to a current-temperature table, the current-temperature table including a temperature prediction value corresponding to each drive signal current value.

[0259] According to some embodiments of the present disclosure, compensating the (n+1)th drive signal may include setting or adjusting a frequency-based gain compensation value corresponding to a circuit internal temperature value with reference to a first temperature compensation table, wherein the first temperature compensation table includes a compensation value corresponding to each circuit internal temperature value.

[0260] According to some embodiments of the present disclosure, compensating the (n+1)th driving signal may include setting or adjusting a frequency-based gain compensation value corresponding to a temperature prediction value with reference to a second temperature compensation table, the second temperature compensation table including a compensation value corresponding to each temperature prediction value.

[0261] According to some embodiments of the present disclosure, compensating the (n+1)th drive signal may include setting or adjusting a frequency-based gain compensation value corresponding to a circuit internal temperature value and a temperature prediction value with reference to a third temperature compensation table, the third temperature compensation table including compensation values ​​corresponding to each circuit internal temperature value and each temperature prediction value.

[0262] A vibration device driver for providing a drive signal to a vibration device, comprising: a temperature measurer configured to measure a temperature value within a circuit of the vibration device driver; a temperature predictor configured to predict a predicted temperature value of the vibration device based on a current value of the drive signal; and a drive signal generator configured to set or adjust a compensation value for the drive signal based on at least one of the temperature value within the circuit of the vibration device driver and the predicted temperature value of the vibration device, and to compensate the drive signal based on the compensation value to output a compensated drive signal.

[0263] According to some aspects of the present disclosure, the drive signal generator may be configured to set or adjust a compensation value based on a temperature compensation table, and the temperature compensation table may include a correspondence between at least one of a circuit internal temperature value of the vibration device driver and a temperature prediction value of the vibration device and the compensation value.

[0264] According to some aspects of the present disclosure, the compensation value may be a frequency-based gain compensation value.

[0265] It is obvious to those skilled in the art that various modifications and variations can be made to the present disclosure without departing from the technical concept or scope of the present disclosure. Therefore, the embodiments of the present disclosure are intended to cover modifications and variations of the present disclosure as long as they fall within the scope of the appended claims and their equivalents.

[0266] This technology can also be configured as follows:

[0267] (1) A vibration generating device comprising:

[0268] a vibration device; and

[0269] a vibration driving circuit comprising a driving signal generator configured to provide a driving signal to the vibration device,

[0270] The drive signal generator is configured to set a frequency-based gain compensation value based on at least one of a circuit internal temperature value of the vibration drive circuit and a temperature prediction value of the vibration device corresponding to the current value of the nth drive signal, compensate the frequency-based gain value based on the set frequency-based gain compensation value, compensate the n+1th drive signal based on the compensated frequency-based gain value, and provide the compensated n+1th drive signal to the vibration device.

[0271] (2) The vibration generating device according to (1),

[0272] The vibration drive circuit includes a temperature measuring device configured to measure a temperature value inside the circuit, and

[0273] The driving signal generator receives the circuit internal temperature value from the temperature measurer and sets a frequency-based gain compensation value corresponding to the circuit internal temperature value.

[0274] (3) A vibration generating device according to (2), wherein the drive signal generator is configured to set a frequency-based gain compensation value corresponding to the circuit internal temperature value with reference to a first temperature compensation table, the first temperature compensation table including a compensation value corresponding to each circuit internal temperature value.

[0275] (4) The vibration generating device according to (1),

[0276] Wherein, the vibration driving circuit includes:

[0277] a current measurer configured to measure a current value of the nth driving signal; and

[0278] a temperature predictor configured to receive the current value from the current measurer to output the temperature prediction value corresponding to the current value, and

[0279] The driving signal generator is configured to receive the temperature prediction value from the temperature predictor and set a frequency-based gain compensation value corresponding to the temperature prediction value.

[0280] (5) The vibration generating device according to (4), wherein the drive signal generator is configured to set the frequency-based gain compensation value corresponding to the temperature prediction value with reference to a second temperature compensation table, the second temperature compensation table including a compensation value corresponding to each temperature prediction value.

[0281] (6) The vibration generating device according to (1),

[0282] Wherein, the vibration driving circuit includes:

[0283] a temperature measurer configured to measure a temperature value inside the circuit;

[0284] a current measurer configured to measure a current value of the nth driving signal; and a temperature predictor configured to receive the current value from the current measurer to output the temperature prediction value corresponding to the current value, and

[0285] The drive signal generator is configured to receive the circuit internal temperature value from the temperature measurer and the temperature prediction value from the temperature predictor, and set a frequency-based gain compensation value corresponding to the circuit internal temperature value and the temperature prediction value.

[0286] (7) A vibration generating device according to (6), wherein the drive signal generator is configured to set a frequency-based gain compensation value corresponding to the circuit internal temperature value and the temperature prediction value with reference to a third temperature compensation table, wherein the third temperature compensation table includes compensation values ​​corresponding to each circuit internal temperature value and each temperature prediction value.

[0287] (8) The vibration generating device according to (2) or (6),

[0288] wherein the vibration driving circuit includes an amplifier configured to amplify the driving signal from the driving signal generator and provide the amplified driving signal to the vibration device, and

[0289] The temperature measurer includes at least one temperature sensor arranged adjacent to the amplifier.

[0290] (9) A vibration generating device according to (4) or (6), wherein the temperature predictor is configured to output a temperature prediction value corresponding to the drive signal current value with reference to a current-temperature table, wherein the current-temperature table includes a temperature prediction value corresponding to each drive signal current value.

[0291] (10) The vibration generating device according to (4) or (6), wherein the current measuring device includes at least one current sensor connected to a portion of a line between the vibration driving circuit and the vibration device that is adjacent to the vibration device.

[0292] (11) The vibration generating device according to (1), wherein the vibration device includes one or more of a piezoelectric element and a membrane-type vibration device.

[0293] (12) The vibration generating device according to (1),

[0294] Wherein, the vibration device includes a vibration part, and

[0295] The vibration portion includes a plurality of first portions and a plurality of second portions located between the plurality of first portions, the first portions include an inorganic material, and the second portions include an organic material.

[0296] (13) The vibration generating device according to (12), further comprising:

[0297] a first electrode layer provided at a first surface of the vibration portion; and

[0298] The second electrode layer is provided on a second surface of the vibration portion that is different from the first surface.

[0299] (14) The vibration generating device according to (12),

[0300] wherein the first portion has piezoelectric properties, and

[0301] Wherein, the second portion has a ductile property.

[0302] (15) A device comprising:

[0303] a vibrating member; and

[0304] a vibration generating device for vibrating the vibration member,

[0305] Wherein, the vibration generating device includes the vibration generating device according to any one of (1) to (14).

[0306] (16) The device according to (15), further comprising one or more of a connecting member and a plate provided between the vibration member and the vibration generating device.

[0307] (17) The device according to (15),

[0308] Wherein, the vibration component includes a plate, and

[0309] The plate comprises a single non-metal or a composite non-metal of metal and one or more of wood, plastic, glass, cloth, paper and leather.

[0310] (18) The device according to (15), wherein the vibration member includes a display panel including a plurality of pixels configured to display an image, or the vibration member includes a non-display panel selected from the group consisting of a light-emitting diode lighting panel, an organic light-emitting lighting panel, and an inorganic light-emitting lighting panel.

[0311] (19) The device according to (15), wherein the vibration component includes a display panel including a plurality of pixels configured to display an image, or the vibration component includes one or more of a vehicle interior material, a vehicle glass window, a building ceiling, a building interior material, a building glass window, an aircraft interior material, and an aircraft glass window.

[0312] (20) A method for operating a vibration generating device, comprising:

[0313] providing an nth driving signal to the vibration device;

[0314] Measuring the internal temperature of the vibration drive circuit;

[0315] measuring a driving signal current value of the nth driving signal;

[0316] Setting a predicted temperature value of the vibration device corresponding to the current value of the driving signal; and

[0317] An n+1th driving signal is generated and compensated based on the compensation value.

[0318] (21) An operating method according to (20), wherein compensating the n+1th drive signal includes setting a frequency-based gain compensation value based on at least one of the circuit internal temperature value and the temperature prediction value, compensating the frequency-based gain value based on the set frequency-based gain compensation value, and compensating the n+1th drive signal based on the compensated frequency-based gain value.

[0319] (22) The operating method according to (20), wherein setting the temperature prediction value includes setting the temperature prediction value corresponding to the drive signal current value by referring to a current-temperature table, wherein the current-temperature table includes a temperature prediction value corresponding to each drive signal current value.

[0320] (23) An operating method according to (21), wherein compensating the n+1th drive signal includes setting a frequency-based gain compensation value corresponding to the internal temperature value of the circuit with reference to a first temperature compensation table, the first temperature compensation table including compensation values ​​corresponding to each internal temperature value of the circuit.

[0321] (24) An operating method according to (21), wherein compensating the n+1th drive signal includes setting a frequency-based gain compensation value corresponding to the temperature prediction value with reference to a second temperature compensation table, the second temperature compensation table including a compensation value corresponding to each temperature prediction value.

[0322] (25) An operating method according to (21), wherein compensating the n+1th drive signal includes setting a frequency-based gain compensation value corresponding to the circuit internal temperature value and the temperature prediction value with reference to a third temperature compensation table, wherein the third temperature compensation table includes compensation values ​​corresponding to each circuit internal temperature value and each temperature prediction value.

[0323] (26) A vibration device driver for providing a driving signal to a vibration device, comprising:

[0324] a temperature measurer configured to measure a temperature value inside a circuit of the vibration device driver;

[0325] a temperature predictor configured to predict a temperature prediction value of the vibration device based on a current value of the drive signal; and

[0326] A drive signal generator is configured to set a compensation value for the drive signal based on at least one of a circuit internal temperature value of the vibration device driver and a temperature prediction value of the vibration device, and compensate the drive signal based on the compensation value to output a compensated drive signal.

[0327] (27) The vibration device driver according to (26), wherein

[0328] The driving signal generator is configured to set the compensation value based on a temperature compensation table; and

[0329] The temperature compensation table includes a correspondence between at least one of a temperature value inside a circuit of the vibration device driver and a temperature prediction value of the vibration device, and a compensation value.

[0330] (28) The vibration device driver according to (26), wherein the compensation value is a gain compensation value based on frequency.

Claims

1. A vibration generating device comprising: Vibration device; as well as a vibration driving circuit including a driving signal generator configured to provide a driving signal to the vibration device, the vibration driving circuit further including a temperature measurer arranged in the vibration driving circuit, The drive signal generator is configured to set a frequency-based gain compensation value based on at least one of a circuit internal temperature value of the vibration drive circuit and a temperature prediction value of the vibration device corresponding to the current value of the nth drive signal, compensate the frequency-based gain value based on the set frequency-based gain compensation value, compensate the n+1th drive signal based on the compensated frequency-based gain value, and provide the compensated n+1th drive signal to the vibration device.

2. The vibration generating device according to claim 1, in, The temperature measurer is configured to measure a temperature value inside the circuit, and The driving signal generator receives the circuit internal temperature value from the temperature measurer and sets a frequency-based gain compensation value corresponding to the circuit internal temperature value.

3. The vibration generating device according to claim 2, wherein: The driving signal generator is configured to set a frequency-based gain compensation value corresponding to the circuit internal temperature value with reference to a first temperature compensation table including a compensation value corresponding to each circuit internal temperature value.

4. The vibration generating device according to claim 1, in, The vibration drive circuit comprises: a current measurer configured to measure a current value of the nth driving signal; and a temperature predictor configured to receive the current value from the current measurer to output the temperature prediction value corresponding to the current value, and The driving signal generator is configured to receive the temperature prediction value from the temperature predictor and set a frequency-based gain compensation value corresponding to the temperature prediction value.

5. The vibration generating device according to claim 4, wherein: The driving signal generator is configured to set a frequency-based gain compensation value corresponding to the temperature prediction value with reference to a second temperature compensation table including a compensation value corresponding to each temperature prediction value.

6. The vibration generating device according to claim 1, in, The vibration drive circuit further includes: a current measurer configured to measure a current value of the nth driving signal; and a temperature predictor configured to receive the current value from the current measurer to output the temperature prediction value corresponding to the current value, and The drive signal generator is configured to receive the circuit internal temperature value from the temperature measurer and the temperature prediction value from the temperature predictor, and set a frequency-based gain compensation value corresponding to the circuit internal temperature value and the temperature prediction value.

7. The vibration generating device according to claim 6, wherein: The driving signal generator is configured to set a frequency-based gain compensation value corresponding to the circuit internal temperature value and the temperature prediction value with reference to a third temperature compensation table, the third temperature compensation table including compensation values ​​corresponding to each circuit internal temperature value and each temperature prediction value.

8. The vibration generating device according to claim 2 or claim 6, in, the vibration driving circuit includes an amplifier configured to amplify the driving signal from the driving signal generator and provide the amplified driving signal to the vibration device, and The temperature measurer includes at least one temperature sensor arranged adjacent to the amplifier.

9. The vibration generating device according to claim 4 or claim 6, wherein: The temperature predictor is configured to output a temperature prediction value corresponding to a driving signal current value with reference to a current-temperature table including a temperature prediction value corresponding to each driving signal current value.

10. The vibration generating device according to claim 4 or claim 6, wherein: The current measurer includes at least one current sensor connected to a portion of a line between the vibration drive circuit and the vibration device that is adjacent to the vibration device.

11. The vibration generating device according to claim 1, wherein: The vibration device includes one or more of a piezoelectric element and a membrane type vibration device.

12. The vibration generating device according to claim 1, in, The vibration device includes a vibration portion, and The vibration portion includes a plurality of first portions and a plurality of second portions located between the plurality of first portions, the first portions include an inorganic material, and the second portions include an organic material.

13. The vibration generating device according to claim 12, further comprising: a first electrode layer disposed on a first surface of the vibration portion; as well as The second electrode layer is provided on a second surface of the vibration portion that is different from the first surface.

14. The vibration generating device according to claim 12, in, The first portion has piezoelectric properties, and Wherein, the second portion has a ductile property.

15. An apparatus comprising: vibrating components; and a vibration generating device for vibrating the vibration member, Wherein, the vibration generating device includes the vibration generating device according to any one of claims 1 to 14. 16 . The device of claim 15 , further comprising one or more of a connecting member and a plate provided between the vibration member and the vibration generating device.

17. The device according to claim 15, in, The vibration member includes a plate, and The plate comprises a single non-metal or a composite non-metal of metal and one or more of wood, plastic, glass, cloth, paper and leather.

18. The device according to claim 15, wherein The vibration member includes a display panel including a plurality of pixels configured to display an image, or the vibration member includes a non-display panel among a light emitting diode lighting panel, an organic light emitting lighting panel, and an inorganic light emitting lighting panel.

19. The device according to claim 15, wherein The vibration component includes a display panel including a plurality of pixels configured to display an image, or the vibration component includes one or more of a vehicle interior material, a vehicle glass window, a building ceiling, a building interior material, a building glass window, an aircraft interior material, and an aircraft glass window.

20. A method for operating a vibration generating device, comprising: providing an nth driving signal to the vibration device; Measuring the internal temperature of the vibration drive circuit by a temperature measuring device; measuring a driving signal current value of the nth driving signal; Setting a temperature prediction value of the vibration device corresponding to the current value of the driving signal; as well as An n+1th driving signal is generated and compensated based on the compensation value.

21. The operating method according to claim 20, wherein: Compensating the n+1th drive signal includes setting a frequency-based gain compensation value based on at least one of the circuit internal temperature value and the temperature prediction value, compensating the frequency-based gain value based on the set frequency-based gain compensation value, and compensating the n+1th drive signal based on the compensated frequency-based gain value.

22. The operating method according to claim 20, wherein: Setting the temperature prediction value includes setting the temperature prediction value corresponding to the driving signal current value with reference to a current-temperature table, the current-temperature table including a temperature prediction value corresponding to each driving signal current value.

23. The operating method according to claim 21, wherein: Compensating the (n+1)th driving signal includes setting a frequency-based gain compensation value corresponding to the circuit internal temperature value with reference to a first temperature compensation table including compensation values ​​corresponding to each circuit internal temperature value.

24. The operating method according to claim 21, wherein: Compensating the (n+1)th driving signal includes setting a frequency-based gain compensation value corresponding to the temperature prediction value with reference to a second temperature compensation table including a compensation value corresponding to each temperature prediction value.

25. The operating method according to claim 21, wherein: Compensating the n+1th driving signal includes setting a frequency-based gain compensation value corresponding to the circuit internal temperature value and the temperature prediction value with reference to a third temperature compensation table, wherein the third temperature compensation table includes compensation values ​​corresponding to each circuit internal temperature value and each temperature prediction value.

26. A vibration device driver for providing a driving signal to a vibration device, comprising: a temperature measurer configured to measure a temperature value inside a circuit of the vibration device driver; a temperature predictor configured to predict a temperature prediction value of the vibration device based on a current value of the drive signal; as well as A drive signal generator is configured to set a compensation value for the drive signal based on at least one of a circuit internal temperature value of the vibration device driver and a temperature prediction value of the vibration device, and compensate the drive signal based on the compensation value to output a compensated drive signal.

27. The vibration device driver according to claim 26, wherein The driving signal generator is configured to set the compensation value based on a temperature compensation table; and The temperature compensation table includes a correspondence between at least one of a temperature value inside a circuit of the vibration device driver and a temperature prediction value of the vibration device, and a compensation value.

28. The vibration device driver according to claim 26, wherein The compensation value is a frequency-based gain compensation value.

Images