Wafer detection method and detection system

Abstract

The present invention proposes a wafer detection method and detection system, which belongs to the field of semiconductor technology. The wafer detection method includes: numbering all wafers; selecting the first wafer to be tested required for the normal detection site from the wafers, and obtaining the number of the first wafer to be tested; selecting the second wafer to be tested required for the temporary detection site from the wafers, and obtaining the number of the second wafer to be tested; and judging whether the number of the first wafer to be tested is consistent with the number of the second wafer to be tested; if consistent, removing the wafer with the consistent number from the first wafer to be tested; if inconsistent, the first wafer to be tested is tested at the normal detection site. The wafer detection method and detection system proposed by the present invention improve the efficiency of wafer sampling.

Description

Technical Field

[0001] The present invention belongs to the field of semiconductor technology, and in particular relates to a wafer detection method and a detection system. Background Art

[0002] In the semiconductor manufacturing process, wafers are processed and manufactured in multiple processing stations, and there are inspection stations between the processing stations to inspect some of the wafers that have been processed before the inspection station to determine the stability of the process. The inspection station pre-sets the wafers to be tested through the dispatching system, and then inspects the wafers to be tested. However, in the actual production process, it is sometimes necessary to add additional temporary demand test stations during the inspection process. During the inspection process, if the wafer passes through the temporary inspection station and then undergoes inspection at the normal inspection station, meaningless inspection data will be generated, resulting in a waste of inspection resources. If the subsequent normal inspection stations are forcibly skipped after inspection at the temporary test station, it will affect the normal sampling risk online.

[0003] Therefore, how to coordinate the needs of temporary additional inspections and normal inspections has become an urgent problem that needs to be solved. Summary of the Invention

[0004] In view of the above-mentioned deficiencies in the existing technology, the present application proposes a wafer inspection method and inspection system, which can coordinate the inspection requirements between temporary inspection sites and normal inspection sites to improve the efficiency of wafer sampling and avoid waste of inspection resources.

[0005] To achieve the above and other objectives, the present application proposes a wafer inspection method, comprising:

[0006] Number all wafers;

[0007] Selecting a first wafer to be tested required by a normal inspection site from the wafers, and obtaining a number of the first wafer to be tested;

[0008] Selecting a second wafer to be tested required by the temporary inspection site from the wafers, and obtaining a serial number of the second wafer to be tested; and

[0009] Determining whether the number of the first wafer to be tested is consistent with the number of the second wafer to be tested;

[0010] If they are consistent, removing the wafer with the consistent number from the first wafer to be tested;

[0011] If they are inconsistent, the first wafer to be tested is tested at the normal testing site.

[0012] In one embodiment of the present invention, the numbers of the first wafers to be tested are selected in sections according to the wafer numbering sequence.

[0013] In an embodiment of the present invention, the wafers are numbered from 1 to n, and when n is an odd number, the numbers of the first wafers to be tested include 1, (n+1) / 2, and n.

[0014] In one embodiment of the present invention, the wafers are numbered from 1 to n, and when n is an even number, the first wafer to be tested is numbered from 1 to n, and (n+2) / 2 or n / 2.

[0015] In one embodiment of the present invention, if the serial number of the first wafer to be tested and the serial number of the second wafer to be tested are consistent, the first wafer to be tested skips the normal inspection station.

[0016] In one embodiment of the present invention, if the serial number of the first wafer to be tested and the serial number of the second wafer to be tested are partially consistent, the wafers with consistent serial numbers are removed from the first wafer to be tested.

[0017] In one embodiment of the present invention, if the number of the first wafer to be tested and the number of the second wafer to be tested are inconsistent, the number of the first wafer to be tested remains consistent.

[0018] The present invention also provides a wafer detection system, comprising:

[0019] Wafer marking unit, used to obtain wafer numbers;

[0020] A first dispatching unit is configured to determine a first wafer to be tested required by a normal testing site and obtain a serial number of the first wafer to be tested;

[0021] A second dispatching unit is configured to determine a second wafer to be tested required by the temporary testing site and obtain a serial number of the second wafer to be tested; and

[0022] The judging unit is used to judge whether the serial number of the first wafer to be tested is consistent with the serial number of the second wafer to be tested.

[0023] In one embodiment of the present invention, the wafer marking unit obtains the number of the wafer using a fixed sequence numbering method.

[0024] In one embodiment of the present invention, the first work dispatching unit is arranged in front of the second work dispatching unit, and the second work dispatching unit is arranged in front of the temporary inspection site.

[0025] In summary, this application proposes a wafer inspection method and inspection system that can reduce the repetition rate of wafer inspection and improve the efficiency of wafer sampling. It avoids the risk of normal online sampling caused by forcibly skipping the normal inspection site after the temporary inspection site, ensures the normal progress of production, improves production efficiency, increases enterprise production capacity, and reduces production costs.

[0026] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0028] Figure 1 FIG. 4 is a flow chart of a wafer inspection method according to an embodiment of the present invention.

[0029] Figure 2 FIG. 1 is a schematic diagram of a wafer inspection system according to an embodiment of the present invention.

[0030] Figure 3 FIG. 1 is a schematic diagram of selecting a first wafer to be tested and a second wafer to be tested in one embodiment of the present invention.

[0031] Figure 4 FIG. 1 is a schematic diagram of selecting a first wafer to be tested and a second wafer to be tested in one embodiment of the present invention.

[0032] Figure 5 FIG. 1 is a schematic diagram of selecting a first wafer to be tested and a second wafer to be tested in one embodiment of the present invention.

[0033] Figure 6 It is the number of wafers repeatedly inspected by a single testing machine within one week in one embodiment of the present invention.

[0034] Description of reference numerals:

[0035] 10 wafer marking unit; 20 temporary inspection station; 30 judgment unit; 40 normal inspection station; 50 first dispatching unit; 60 second dispatching unit; 1 first wafer; 2 second wafer; 3 third wafer; 4 fourth wafer; 5 fifth wafer; steps S1-S3. DETAILED DESCRIPTION

[0036] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0037] It should be noted that the illustrations provided in this embodiment are only used to schematically illustrate the basic concept of the present invention. Therefore, the illustrations only show components related to the present invention and are not drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component can be changed at will, and the component layout type may also be more complicated.

[0038] In the present invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer" and the like indicate positions or locations based on those shown in the accompanying drawings. These terms are intended solely to facilitate the description of the present application and simplify the description, and are not intended to indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limiting the present application. Furthermore, the terms "first" and "second" are used solely for descriptive and distinguishing purposes and should not be construed as indicating or implying relative importance.

[0039] During the semiconductor manufacturing process, multiple inspection stations are located between each processing station in the wafer fabrication process to inspect portions of wafers processed prior to the inspection station. For example, thin film thickness testing is performed to determine whether the film thickness in the previous process meets manufacturing requirements, as well as to measure reflectivity or density, identifying and monitoring different film layers. For example, critical dimension (CD) testing is performed to determine whether semiconductor manufacturing dimensions meet manufacturing requirements, monitor line width and aperture, and achieve precise error measurement. For example, reticle / mask inspection is performed to capture reticle defects and pattern position errors, reducing the risk of defects and improving the yield of semiconductor devices. For example, overlay alignment measurement can correct for position errors in the lithography machine, mask, and silicon wafer, improving overlay accuracy. Another example is unpatterned wafer inspection, patterned wafer inspection, and defect review to determine the stability and reliability of the manufacturing process prior to the inspection station. Inspection stations do not inspect all wafers; rather, they select wafers to be tested from the same batch of wafers. The detection site can sample the test wafers by marking the wafers with a marking unit, pre-set the number of the wafer to be tested through the work order, and then test the wafer to be tested. In the actual production process, sometimes temporary inspections are performed on wafers as needed. For example, when the yield rate fluctuates and the inspection of the wafers in each normal inspection site is normal, a temporary inspection is added to find the cause of the fluctuation, or a temporary inspection is added based on reasons such as changes in device types, improvements in device functions, and customer needs. In order to avoid repeated inspections of wafers inspected at temporary test sites and samples to be tested in normal test sites, resulting in meaningless inspection data and waste of inspection resources, or after inspection at temporary test sites, forcibly skipping subsequent normal inspection sites, affecting the risk of normal online sampling, etc., the wafer inspection method and inspection system provided by the present invention can reduce the phenomenon of repeated testing and ensure normal online sampling, and can be widely used in various inspection processes in the wafer production and manufacturing process.

[0040] See also Figure 1 As shown, the present invention provides a wafer inspection method, which can improve inspection efficiency and ensure normal online sampling during the process of setting up a temporary inspection site. The wafer inspection method can include steps S1-S3.

[0041] S1. Number all wafers, select the first wafer to be tested required by a normal inspection site from the wafers, and obtain the number of the first wafer to be tested.

[0042] S2. Select a second wafer to be tested required by the temporary testing site from the wafers, and obtain the number of the second wafer to be tested.

[0043] S3, determining whether the number of the first wafer to be tested is consistent with the number of the second wafer to be tested,

[0044] If they are consistent, the wafer with the same number is removed from the first wafer to be tested.

[0045] If not, the first wafer to be tested is tested at a normal testing station.

[0046] See also Figure 1 Figure 2 As shown, in one embodiment of the present invention, according to the wafer detection method provided by the present invention, before the wafers are detected, all wafers are numbered, and at the same time, the first wafer to be tested detected in the normal detection site is determined by the dispatch order in the first dispatch unit 50, and the number of the first wafer to be tested is obtained. When the temporary detection site 20 is added, the second wafer to be tested detected in the temporary detection site 20 is determined by the second dispatch unit 60, and the number of the second wafer to be tested is obtained. Before the normal detection site 40, a judgment unit 30 is provided. The numbers of the first wafer to be tested and the second wafer to be tested are judged by the automatic identification system in the judgment unit 30, and the second wafer to be tested that has passed the temporary detection site 20 is eliminated, and the first wafer to be tested that has not passed the temporary detection site 20 is entered into the normal detection site 40 for detection. Through the wafer detection method provided by the present invention, the phenomenon of repeated wafer testing can be reduced, the phenomenon of repeated wafer testing can be reduced, the efficiency of wafer detection can be improved, and the production capacity of the enterprise can be improved.

[0047] See also Figures 1 to 2 As shown, in one embodiment of the present invention, during the preparation process, although each wafer has its own wafer number before leaving the factory, the wafer numbers of each batch and each manufacturer are different. Therefore, during the inspection process, the wafer needs to be re-marked. That is, after the wafer completes the previous process and before entering the inspection site, the wafer is marked in the wafer marking unit 10. In this embodiment, the wafer numbering is marked, for example, by selecting a fixed sequence numbering method, and multiple wafers in the same batch are numbered, and the numbers are, for example, 1 to n. When the wafer is inspected, in order to ensure the randomness of the inspection, the test samples are selected in segments, for example, one wafer is drawn from the front, middle and back positions of the number in the same batch of wafers to confirm the defect level of the entire batch of wafers. For example, the same batch contains an odd number of wafers, that is, n is an odd number. At this time, the first dispatching unit 50 selects wafers numbered 1, (n+1) / 2 and n as the first wafer to be tested in the normal inspection site 20. When the same batch contains an even number of wafers, that is, n is an even number, the first dispatching unit 50 selects wafers numbered 1, n / 2, and n as the first wafers to be tested at the normal inspection site 20, or selects wafers numbered 1, (n+2) / 2, and n as the first wafers to be tested at the normal inspection site 20. Evenly spaced selection improves the randomness of the inspection and ensures the reliability of the inspection.

[0048] See also Figures 1 to 3As shown, in one embodiment of the present invention, in order to explain in detail the detection method provided by the present invention, the effect of reducing repeated testing during the wafer detection process is described, for example, taking any batch of wafers to be tested as an example, wherein the batch to be tested includes, for example, 5 wafers. Of course, in other embodiments, the number of wafers in the same batch is not limited, for example, 5 to 30 wafers. In this embodiment, the wafers are marked by the wafer marking unit 10, and the wafer numbers are obtained as the first wafer 1, the second wafer 2, the third wafer 3, the fourth wafer 4 and the fifth wafer 5, and the first dispatching unit 50 judges and determines that the first wafer to be tested in the batch of wafers at the normal detection site 40 is numbered as the first wafer 1, the third wafer 3 and the fifth wafer 5.

[0049] See also Figures 1 to 3 As shown, in one embodiment of the present invention, after determining the number of the first wafer to be tested at the normal inspection site 40, the number of the second wafer to be tested at the temporary inspection site 20 is obtained through the second dispatching unit 60 according to the additional inspection requirements. In this embodiment, the numbers of the second wafers to be tested are, for example, the first wafer 1, the third wafer 3, and the fifth wafer 5. After obtaining the number of the second wafer to be tested at the temporary inspection site 20, the second wafer to be tested is inspected, and when the temporary inspection project is completed, the temporary inspection site 20 will also inspect the inspection projects of the normal inspection site 40. That is, the wafer to be tested after passing through the temporary inspection site 20 has completed the items that need to be tested, and then passes through the normal inspection site 40, resulting in repeated tests. At this time, the judgment unit 30 is used to judge whether the number of the first wafer to be tested determined by the first dispatching unit 50 and the second dispatching unit 60 is consistent with the number of the second wafer to be tested, and the automatic identification program is started to compare the number of the existing data at the station in the database management system (Database Management System, DMS) or the database (Data Base, DB) with the number of the first wafer to be tested on the dispatching order determined by the first dispatching unit 50. After judgment, the number of the second test wafer is consistent with the number of the first wafer to be tested. Through the automatic identification system, the first wafer 1, the third wafer 3 and the fifth wafer 5 that have been inspected and completed at the temporary inspection site 20 are eliminated. According to the dispatching order, at this time, all the first wafers to be tested that have passed the normal inspection site 40 have completed the inspection at the temporary inspection site 20. Then, this batch of wafers can skip the normal inspection site 40 and enter the next process. Under the condition of meeting the temporary additional inspection and normal inspection, the repeated inspection of the wafers is reduced and the inspection efficiency is improved.

[0050] See also Figure 2 and Figure 4As shown, in another embodiment of the present invention, a batch to be tested includes, for example, 5 wafers. Of course, in other embodiments, the number of wafers in the same batch is not limited, for example, 5 to 30 wafers. After the wafers in this batch pass through the wafer marking unit 10, the wafer numbers are obtained as the first wafer 1, the second wafer 2, the third wafer 3, the fourth wafer 4, and the fifth wafer 5. The first dispatching unit 50 judges and determines that the first wafer to be tested in the batch of wafers at the normal inspection site 40 is numbered as the first wafer 1, the third wafer 3, and the fifth wafer 5.

[0051] See also Figure 2 and Figure 4 As shown, in one embodiment of the present invention, after determining the number of the first wafer to be tested at the normal testing site 40, the second dispatching unit 60 obtains the number of the second wafer to be tested at the temporary testing site 20 according to the additional inspection requirements. In this embodiment, the numbers of the second wafers to be tested are, for example, the third wafer 3, the fourth wafer 4, and the fifth wafer 5. After obtaining the number of the second wafer to be tested at the temporary testing site 20, the second wafer to be tested is tested, and when the temporary testing site 20 completes the temporary testing items, it also tests the inspection items of the normal testing site 40. After the second wafer to be tested is inspected, the judgment unit 30 determines whether the numbers of the first wafer to be tested determined by the first dispatch unit 50 and the second dispatch unit 60 are consistent. An automatic identification program is initiated, comparing the numbers of the existing data at the database management system or database at the current station with the numbers of the first wafer to be tested on the dispatch order determined by the first dispatch unit 50. Upon determination, it is determined that the second wafer to be tested and the first wafer to be tested have duplicate numbers, namely, the third wafer 3 and the fifth wafer 5, which have already been inspected at the temporary inspection site 20. Through the automatic identification system, the dispatch system removes the third wafer 3 and the fifth wafer 5 that have already been inspected at the temporary inspection site 20 and, based on the dispatch order, determines that the wafer that needs to pass through the normal inspection site 40 is the first wafer 1. Based on the dispatch order, the normal inspection site 40 inspects the first wafer 1 in the batch of wafers. By providing the judgment unit 30, re-inspection of wafers that have already been tested at the temporary inspection site 20 can be avoided, reducing the waste of inspection resources, improving enterprise production efficiency, and lowering production costs.

[0052] See also Figure 2 and Figure 5As shown, in another embodiment of the present invention, a batch to be tested includes, for example, 5 wafers. Of course, in other embodiments, the number of wafers in the same batch is not limited, for example, 5 to 30 wafers. After the wafers in this batch pass through the wafer marking unit 10, the wafer numbers are obtained as the first wafer 1, the second wafer 2, the third wafer 3, the fourth wafer 4, and the fifth wafer 5. The first dispatching unit 50 judges and determines that the first wafer to be tested in the normal inspection site 40 of this batch of wafers is numbered as the first wafer 1, the third wafer 3, and the fifth wafer 5.

[0053] See also Figure 2 and Figure 5 As shown, in one embodiment of the present invention, after determining the number of the first wafer to be tested at the normal inspection site 40, the second dispatch unit 60 obtains the number of the second wafer to be tested at the temporary inspection site 20 according to the additional inspection requirements. In this embodiment, the numbers of the second wafers to be tested obtained by the second dispatch unit 60 are, for example, the second wafer 2 and the fourth wafer 4. After obtaining the second wafer to be tested number at the temporary inspection site 20, the second wafer to be tested is inspected, and when the temporary inspection items are completed at the temporary inspection site 20, the inspection items at the normal inspection site 40 are also inspected. After the inspection at the temporary inspection site 20 is completed, the judgment unit 30 determines whether the number of the first wafer to be tested is consistent with the number of the second wafer to be tested. An automatic identification program is initiated to compare the number of the existing data at the database management system or database at the current station with the number of the first wafer to be tested on the dispatch order determined by the first dispatch unit 50. After determination, it is determined that there is no duplicate inspection of the number of the second wafer to be tested at the temporary inspection site 20 and the number of the first wafer to be tested at the normal inspection site 40. Through the automatic identification system, based on the work order, it is determined that the normal inspection site 40 needs to inspect the first wafer 1, the third wafer 3, and the fifth wafer 5 in the batch of wafers. By providing a judgment unit 30, it is possible to avoid re-inspecting wafers that have been tested at the temporary inspection site 20, which would waste inspection resources. It also avoids the risk of normal online sampling caused by forcibly skipping the normal inspection site after the temporary inspection site. While ensuring temporary additional inspections, it avoids duplication of inspections and ensures normal production.

[0054] See also Figure 6 As shown, in one embodiment of the present invention, before the wafer detection method is used, the repetition rate of wafer detection is counted. Figure 6 As mentioned above, the number of wafer batches and wafers repeatedly tested by a single QGK (KLA-2835) and QPK (PUMA-9150 / 9550) tester within a week is counted. Figure 6It can be seen that in each process of the wafer manufacturing process, the QGK test repeatedly tested 18 batches of wafers in a week, and repeatedly tested 54 wafers, which is equivalent to wasting about 0.33 days of production capacity of a machine. In each process of the wafer manufacturing process, the QPK test repeatedly tested 31 batches of wafers in a week, and repeatedly tested 124 wafers, which is equivalent to wasting about 0.43 days of production capacity of a machine. The waste of production capacity is large, which causes a large waste of resources for the company's production. It can be calculated from the above data that by adopting the wafer detection method provided by the present invention, for the QGK test machine, it is estimated that 17.1 days of production capacity can be saved per machine per year, and for the QPK test machine, it is estimated that 22.3 days of production capacity can be saved per machine per year. For enterprises, the production capacity that can be saved by multiple machines is considerable, which further illustrates that the wafer detection method provided by this application can improve the production efficiency of the enterprise and has the value of wide application. It can be seen from the statistical data that the use of the wafer inspection method provided by the present invention can reduce the repeated inspection rate and improve the wafer inspection efficiency, thereby increasing the company's production capacity and reducing the company's production costs.

[0055] See also Figure 2 As shown, the present invention also provides a wafer inspection system for executing a wafer inspection method. The wafer inspection system includes a wafer marking unit 10, a temporary inspection site 20, a judgment unit 30, a normal inspection site 40, a first dispatching unit 50, and a second dispatching unit 60. In this embodiment, the wafer marking unit 10 marks the wafers in the same batch, obtains the wafer number, and the first dispatching unit 50 determines the number of the first wafer to be tested detected by the marked wafer in the normal inspection site 40. Before the temporary inspection site 20 is inspected, the second dispatching unit 60 determines the number of the second wafer to be tested detected by the temporary inspection site 20, and then the second wafer to be tested is inspected. After completing the inspection of the temporary inspection site 20, the automatic identification program in the judgment unit 30 compares the number of the existing data at the current site in the database management system or the database with the number of the first wafer to be tested, and skips or changes the dispatch order of the normal inspection site 40 for the wafer that has passed the temporary inspection site 20. After passing through the judgment unit 30 , the wafers to be tested having the same number as the temporary testing site 20 have been removed from the work order, and the wafers to be tested on the work order that have not passed through the temporary testing site 20 are tested.

[0056] In summary, this application proposes a wafer inspection method and inspection system. When temporary inspection is required, a judgment unit is set between the temporary inspection site and the normal inspection site. By comparing the wafer numbers of the temporary inspection site and the normal inspection site, the wafers to be tested that have passed through the temporary inspection site are skipped, thereby reducing the repetition rate of wafer inspection and improving the efficiency of wafer sampling. This avoids the risk of normal online sampling caused by forcibly skipping the normal inspection site after the temporary inspection site, ensures the normal progress of production, improves production efficiency, increases enterprise production capacity, and reduces production costs.

[0057] The above description of the illustrated embodiments of the present invention (including that described in the Abstract) is not intended to be exhaustive or to limit the invention to the precise forms disclosed herein. Although specific embodiments of the present invention and examples of the present invention are described herein for illustrative purposes only, as those skilled in the art will recognize and appreciate, various equivalent modifications are possible within the spirit and scope of the present invention. As noted, modifications may be made to the present invention in light of the above description of the illustrated embodiments of the present invention, and such modifications will be within the spirit and scope of the present invention.

[0058] Thus, although the invention has been described herein with reference to specific embodiments thereof, freedom of modification, various changes and substitutions are intended within the foregoing disclosure, and it should be understood that in some cases, some features of the invention will be employed without the corresponding use of other features without departing from the scope and spirit of the claimed invention. Thus, many modifications may be made to adapt a particular environment or material to the true scope and spirit of the invention. The invention is not intended to be limited to the specific terminology used in the claims below and / or to the specific embodiments disclosed as the best mode contemplated for carrying out the invention, but the invention is intended to include any and all embodiments and equivalents falling within the scope of the appended claims. Thus, the scope of the invention will be determined solely by the appended claims.

[0059] The above description is only a preferred embodiment of the present application and an explanation of the technical principles used. Those skilled in the art should understand that the scope of the invention involved in this application is not limited to the technical solutions formed by the specific combination of the above technical features, but should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the inventive concept, such as the technical solutions formed by replacing the above features with (but not limited to) technical features with similar functions disclosed in this application. In addition to the technical features described in the specification, the remaining technical features are known technologies to those skilled in the art. In order to highlight the innovative features of the present invention, the remaining technical features will not be repeated here.

Claims

1. A wafer detection method, characterized in that: include: Number all wafers; Selecting a first wafer to be tested required by a normal inspection site from the wafers, and obtaining a number of the first wafer to be tested; Selecting a second wafer to be tested required by a temporary testing site from the wafers, obtaining a number of the second wafer to be tested, and testing the second wafer to be tested at the temporary testing site; as well as Before the first wafer to be tested is tested at a normal testing station, determining whether the serial number of the first wafer to be tested is consistent with the serial number of the second wafer to be tested; If they are consistent, the wafer with the same number has been tested at the temporary testing site, and the wafer with the same number is removed from the first wafer to be tested; If they are inconsistent, the first wafer to be tested is tested at the normal testing site.

2. The wafer detection method according to claim 1, wherein: The numbers of the first wafers to be tested are selected in sections according to the wafer numbering sequence.

3. The wafer detection method according to claim 2, wherein: The wafers are numbered from 1 to n, and when n is an odd number, the first wafers to be tested are numbered 1, (n+1) / 2, and n.

4. The wafer detection method according to claim 2, wherein: The wafers are numbered from 1 to n, and when n is an even number, the first wafer to be tested is numbered from 1 to n, and (n+2) / 2 or n / 2.

5. The wafer detection method according to claim 1, wherein: If the number of the first wafer to be tested is consistent with the number of the second wafer to be tested, the first wafer to be tested skips the normal inspection station.

6. The wafer detection method according to claim 1, wherein: If the serial number of the first wafer to be tested and the serial number of the second wafer to be tested are partially consistent, the wafers with consistent serial numbers are removed from the first wafer to be tested.

7. The wafer detection method according to claim 1, wherein: If the number of the first wafer to be tested and the number of the second wafer to be tested are inconsistent, the number of the first wafer to be tested remains consistent.

8. A wafer inspection system, characterized in that: include: Wafer marking unit, used to obtain wafer numbers; A first dispatching unit is configured to determine a first wafer to be tested required by a normal testing site and obtain a serial number of the first wafer to be tested; A second dispatching unit is configured to determine a second wafer to be tested required by the temporary testing site and obtain a serial number of the second wafer to be tested; A temporary testing site, used for testing the second wafer to be tested; A judgment unit, comprising an automatic identification program, for judging whether the number of the first wafer to be tested is consistent with the number of the second wafer to be tested; The normal inspection site is used to test the first wafer to be tested which has a number inconsistent with that of the second wafer to be tested after being judged by the judgment unit.

9. The wafer inspection system according to claim 8, characterized in that: The wafer marking unit obtains the number of the wafer using a fixed sequence numbering method.

10. The wafer inspection system according to claim 8, wherein: The first work dispatching unit is arranged in front of the second work dispatching unit, and the second work dispatching unit is arranged in front of the temporary detection site.

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