A display panel and a method for manufacturing the same

Abstract

The present application provides a display panel and a manufacturing method thereof. The display panel includes a driving backplane, and the driving backplane includes: a substrate; a driving circuit layer disposed on the substrate and including a plurality of terminal portions; a reflective layer disposed on the driving circuit layer and including a plurality of openings, and each of the openings corresponds to one of the terminal portions; wherein, the reflective layer further includes a plurality of apertures, and the apertures are spaced apart from the openings. By providing the apertures on the reflective layer, the present application can release the internal stress generated in the reflective layer during the baking process, effectively reduce the risk of the reflective layer cracking, and improve the yield of the display panel.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a method for preparing the same. Background Art

[0002] With the continuous improvement of display panel manufacturing technology, people have put forward higher requirements for the performance and quality of display panels. Mini-LED can achieve a high brightness effect of more than 1000nits. It can be directly used as a pixel unit of the display panel to achieve micro display. It can also be used in the backlight module and combined with regional dimming technology to achieve a high contrast display effect comparable to OLED.

[0003] In existing display panels, the Mini-LED driving backplane generally includes a driving circuit layer and an LED chip arrayed on the driving circuit layer. The driving circuit layer is provided with a plurality of thin film transistors (TFTs). In order to ensure the working stability of the TFT device and improve the light utilization rate and optical quality of the display panel, the driving circuit layer is also covered with a reflective layer, which is generally white oil. However, the white oil in the prior art needs to be processed by a high-temperature process, and internal stress will be generated inside the white oil after high-temperature treatment. In the process of thermal expansion and contraction, the internal stress in the white oil cannot be released in time, resulting in local cracking, which leads to product scrapping and reduced yield. This problem needs to be solved urgently. Summary of the invention

[0004] The present application provides a display panel and a method for manufacturing the same, which can effectively reduce the risk of cracking of a reflective layer and improve the yield of the display panel.

[0005] In order to achieve the above-mentioned purpose, the display panel and the manufacturing method thereof of the present application adopt the following technical solutions.

[0006] The present application provides a display panel, the display panel comprising a driving backplane, the driving backplane comprising:

[0007] substrate substrate;

[0008] A driving circuit layer is disposed on the base substrate and includes a plurality of terminal portions;

[0009] A reflective layer, disposed on the driving circuit layer, and comprising a plurality of windows, each of the windows being disposed in one-to-one correspondence with each of the terminal portions;

[0010] Wherein, the reflective layer further includes a plurality of openings, and the openings are spaced apart from the windows.

[0011] Optionally, the display panel further includes a packaging adhesive layer, wherein the packaging adhesive layer is disposed on the reflective layer, wherein the opening is not filled with the packaging adhesive layer.

[0012] Optionally, the reflective layer includes a plurality of repeating units arranged in an array, and each repeating unit includes a fixed number of the openings and a fixed number of the window openings.

[0013] Optionally, the plurality of window openings include a plurality of first window openings, the plurality of terminal portions include a plurality of first terminal portions, and each of the first window openings is correspondingly arranged with each of the first terminal portions. Wherein, the driving backplane further includes a plurality of LED chips arranged in an array on the driving circuit layer, and each of the LED chips is correspondingly arranged in each of the first window openings and is electrically connected to each of the first terminal portions. Wherein, each repeating unit includes four of the first window openings.

[0014] Optionally, the plurality of window openings further include a plurality of second window openings, the plurality of terminal portions further include a plurality of second terminal portions, and each of the second window openings is correspondingly arranged with each of the second terminal portions. Each second terminal portion includes at least one MOS transistor. Wherein, each repeating unit further includes one of the second window openings.

[0015] Optionally, the area of the second window opening is larger than the area of the opening, and the encapsulation glue layer is filled in the second window opening.

[0016] Optionally, each repeating unit includes m of the openings, where 3 ≤ m ≤ 5.

[0017] Optionally, each repeating unit includes five of the openings. Wherein, within one repeating unit, four of the five openings are respectively arranged on four gap regions between adjacent first window openings, and the other opening is located within a defined region surrounded by the four openings.

[0018] Optionally, the shape of the opening is circular, the shape of the window opening is rectangular, and the diameter of the opening is smaller than the side length of the window opening.

[0019] On the other hand, the present application further provides a method for manufacturing a display panel, including the following steps:

[0020] Provide a substrate;

[0021] Form a driving circuit layer on the substrate, and the driving circuit layer includes a plurality of terminal portions;

[0022] Form a patterned reflective layer on the driving circuit layer by an inkjet printing process. The reflective layer includes a plurality of window openings and a plurality of openings, and each of the window openings is correspondingly arranged with each of the terminal portions one by one, and the openings are arranged at intervals with the window openings;

[0023] Bake the reflective layer.

[0024] The present application provides a display panel and a method for manufacturing the same. By providing the opening on the reflective layer, the internal stress generated by the reflective layer during the baking process can be well released, the risk of the reflective layer cracking can be effectively reduced, and the yield of the display panel can be improved. Description of the Drawings

[0025] Figure 1 It is a top view schematic diagram of a driving backplane without an encapsulation glue layer provided in the first embodiment of the present application;

[0026] Figure 2 is Figure 1 a cross-sectional schematic diagram of the driving backplane in unfolded along line AA;

[0027] Figure 3 It is a cross-sectional schematic diagram of a driving backplane with an encapsulation glue layer provided in the first embodiment of the present application;

[0028] Figure 4 It is a flowchart for manufacturing a display panel provided in the first embodiment of the present application;

[0029] Figure 5 It is a top view schematic diagram of a driving backplane without an encapsulation glue layer provided in the second embodiment of the present application;

[0030] Figure 6 is Figure 5 a cross-sectional schematic diagram of the driving backplane in unfolded along line BB;

[0031] Figure 7 It is a cross-sectional schematic diagram of a driving backplane with an encapsulation glue layer provided in the second embodiment of the present application;

[0032] Figure 8 It is a top view schematic diagram of a driving backplane without an encapsulation glue layer provided in the third embodiment of the present application. Detailed Embodiments

[0033] Next, the technical solutions in the embodiments of the present application will be clearly and completely described with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present application. In addition, it should be understood that the specific embodiments described herein are only for explaining and understanding the present application, and are not used to limit the present application. In the present application, unless otherwise stated, the orientation terms such as "upper" and "lower" generally refer to the upper and lower in the actual use or working state of the device, specifically the drawing direction in the drawings; and "inner" and "outer" refer to the outline of the device.

[0034] The following disclosure provides many different embodiments or examples for implementing different structures of the present application. To simplify the disclosure of the present application, the components and settings of specific examples are described below. Of course, they are only examples and are not intended to limit the present application. In addition, the present application may repeat reference numerals and / or reference letters in different examples. This repetition is for the purpose of simplification and clarity and does not itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present application provides examples of various specific processes and materials, but those of ordinary skill in the art can be aware of the application of other processes and / or the use of other materials. The following will be described in detail separately. It should be noted that the description order of the following embodiments does not limit the preferred order of the embodiments.

[0035] Embodiment 1

[0036] The present application provides a display panel, and the display panel includes a driving backplane, on which an LED chip is disposed.

[0037] In this embodiment, the display panel is, for example, an LCD display panel. The display panel includes the driving backplane and a liquid crystal cell. The driving backplane includes an LED chip, and the LED chip can be used as a light source in the display panel. Of course, the present application does not limit the type of the display panel. The display panel can also be a micro-LED display panel, and the LED chip in the driving backplane can also directly serve as a pixel unit of the display panel. In addition, the present application does not limit the size of the LED chip. The LED chip can be any one of a conventional LED chip, a Mini-LED chip, or a Micro-LED chip. Generally, the size of a conventional LED chip is above 200 μm; the size of a Mini-LED chip is between 50 μm and 200 μm; the size of a Micro-LED chip is below 50 μm.

[0038] Figure 1 It is a top view schematic diagram of a driving backplane without a packaging glue layer provided in Embodiment 1 of the present application;

[0039] Figure 2 is Figure 1 The cross-sectional schematic diagram of the driving backplane in [reference] unfolded along line AA. Referring to Figure 1 and Figure 2 In this embodiment, the driving backplane includes: a substrate 10, a driving circuit layer 20, a reflective layer 30, and an LED chip 40.

[0040] In this embodiment, the material of the substrate 10 can be glass, plastic, polyimide, etc., and the substrate 10 can be a rigid substrate or a flexible substrate.

[0041] In this embodiment, the driving circuit layer 20 is disposed on the substrate 10 and includes a plurality of terminal portions 21, and the terminal portions 21 may specifically be connection terminals (pads) or electrical components.

[0042] In this embodiment, the reflective layer 30 is disposed on the driving circuit layer 20, and the material of the reflective layer 30 is, for example, white oil with a high reflectivity. Specifically, the reflectivity of the reflective layer 30 is greater than 80%, and the film thickness of the reflective layer 30 is less than or equal to 30 μm. In other embodiments of the present application, the reflective layer 30 may include an adhesive layer and the white oil coated on the adhesive layer, and the adhesive layer can enable the white oil to better adhere to the driving circuit layer 20.

[0043] In this embodiment, the reflective layer 30 includes a plurality of openings 31, and the openings 31 are hole-like structures penetrating through the reflective layer 30 for exposing each terminal portion 21 in the driving circuit layer 20, so that the terminal portion 21 can be electrically connected to the LED chip 40 or other external devices by means of via connection, or realize a photosensitive or monitoring function. Correspondingly, each of the openings 31 is arranged in one-to-one correspondence with each of the terminal portions 21.

[0044] In this embodiment, the reflective layer 30 further includes a plurality of apertures 32, and the apertures 32 are arranged at intervals from the openings 31. That is, the orthographic projection of the apertures 32 on the driving circuit layer 20 is arranged at intervals from the terminal portions 21, and the apertures 32 are also hole-like structures penetrating through the reflective layer 30, but their functions are different from those of the openings 31. Specifically, in the preparation process of the existing driving backplane, except for the openings 31 provided at the positions corresponding to the terminal portions 21, the reflective layer 30 covers the driving circuit layer 20 at the remaining positions, and the driving backplane needs to be subjected to at least one high-temperature baking treatment. The reflective layer 30 generates internal stress during the high-temperature treatment process, and the reflective layer 30 contains a large number of inorganic particles and has a relatively thick film thickness. After subsequent cooling, the reflective layer 30 will expand and contract due to heat, and the internal stress cannot be effectively released, thereby causing the problem of cracking of the reflective layer 30. In the present application, by providing the apertures 32 on the reflective layer 30, the internal stress generated by the reflective layer 30 during the high-temperature baking treatment process is released, thereby effectively avoiding the problem of cracking of the reflective layer 30, improving the yield of the driving backplane and the display panel, and reducing the production and manufacturing cost.

[0045] In this embodiment, the shape of the opening 32 is different from that of the window 31. Specifically, the shape of the window 31 is rectangular; the shape of the opening 32 is circular, and the circular opening 32 is more conducive to improving the internal stress release ability of the reflective layer. Further, the diameter of the opening 32 is smaller than the side length of the window 31, and the diameter of the opening 32 is, for example, 0.1 mm to 1 mm. By controlling the size of the opening 32, while ensuring the internal stress release effect of the reflective layer 30, the area of the opening 32 can be minimized as much as possible, thereby ensuring the reflection effect of the reflective layer 30 and the display quality of the display panel. Of course, the application does not limit the shape of the opening 32. In other embodiments of the application, the shape of the opening 32 can also be a ring. By making the opening 32 in the shape of a ring and controlling the width of the ring, while achieving a good effect of releasing internal stress, the area of each opening 32 can be further reduced, thereby further improving the light reflectance of the reflective layer 30 and the display effect of the display panel.

[0046] In this embodiment, the reflective layer 30 includes a plurality of repeating units 300 arranged in an array. The number of the windows 31 in each repeating unit 300 is fixed, and the number of the openings 32 in each repeating unit 300 is also fixed. That is, each repeating unit 300 includes a fixed number of the openings 32 and a fixed number of the windows 31.

[0047] In this embodiment, the plurality of windows 31 include a plurality of first windows 311, and the plurality of terminal portions 21 include a plurality of first terminal portions 211. Each of the first windows 311 is correspondingly arranged with each of the first terminal portions 211. The first windows 311 are used to accommodate the LED chips 40, and each repeating unit 300 includes four first windows 311.

[0048] In this embodiment, the driving backplane further includes a plurality of LED chips 40 arranged in an array on the driving circuit layer 20. Each of the LED chips 40 is disposed in each of the first windows 311 and electrically connected to each of the first terminal portions 211.

[0049] In this embodiment, each repeating unit 300 includes m openings 32, where 3 ≤ m ≤ 5. By controlling the number of the openings 32 in each repeating unit 300, the application can control the stress release ability of the reflective layer 30 and the total area of the openings 32 in the reflective layer 30. While ensuring that the reflectance of the reflective layer 30 is maintained within a relatively high level range, the stress release ability of the reflective layer 30 can be improved as much as possible, and the cracking risk of the reflective layer 30 is greatly reduced.

[0050] In this embodiment, each of the repeating units 300 includes five of the openings 32. Among them, within one repeating unit 300, four of the five openings 32 are respectively disposed on four gap regions between adjacent first window openings 311, and the other opening 32 is located within the defined region surrounded by the four openings 32. Further, within one repeating unit 300, the four openings 32 respectively disposed on the four gap regions between adjacent first window openings 311 are equidistant from the two adjacent first window openings 311 respectively; and the other opening 32 is located at the center of the repeating unit 300.

[0051] In this embodiment, n openings 32 are provided between two adjacent repeating units 300, where 2 ≤ n ≤ 3.

[0052] In this embodiment, three openings 32 are provided between two adjacent repeating units 300. Among them, within the region defined by two adjacent repeating units 300, two of the three openings 32 are respectively disposed on two gap regions between adjacent first window openings 311, and the other opening 32 is located between the two openings 32. As Figure 1 shown, in the reflective layer 30 provided in this application, one first opening 32 is provided between any two adjacent first window openings 311, and one first opening 32 is provided in the middle region of the smallest rectangular unit formed by every four first window openings 311, that is, five openings 32 are included within the region of the smallest rectangular unit formed by every four first window openings 311, so that the area of the openings 32 is relatively fixed per unit area of the reflective layer 30, improving the light reflection uniformity of the reflective layer 30, and improving the optical effect of the driving backplane and the display quality of the display panel.

[0053] Figure 3 is a schematic cross-sectional view of a driving backplane including a packaging adhesive layer provided in Embodiment 1 of this application. As Figure 3As shown, in this embodiment, the driving backplane further includes a packaging glue layer 50, which is disposed on the reflective layer 30 and covers the reflective layer 30. Among them, the packaging glue layer 50 is not filled in the opening 32. Specifically, the area of the opening 32 provided in this application is small, and the viscosity of the packaging glue layer 50 is large. When the packaging glue layer 50 is formed by covering on the reflective layer 30, the packaging glue layer 50 cannot fill the opening 32, so that the reflective layer 30 forms a hollowed-out area at the position of the opening 32. After the packaging glue layer 50 is manufactured, the driving backplane will be subjected to a high-temperature baking treatment. Since the packaging glue layer 50 is not filled in the opening 32, the internal stress in the reflective layer 30 can be effectively released through the opening 32, thereby greatly reducing the risk of the reflective layer 30 cracking.

[0054] On the other hand, this application also provides a method for manufacturing a display panel. Figure 4 This is the flowchart for manufacturing the display panel provided in the first embodiment of this application. Refer to Figures 1 - 4 and the method for manufacturing the display panel includes the following steps:

[0055] S01: Provide a substrate 10;

[0056] S02: Form a driving circuit layer 20 on the substrate 10, and the driving circuit layer 20 includes a plurality of terminal portions 21;

[0057] S03: Use an inkjet printing process to form a patterned reflective layer 30 on the driving circuit layer 20. The reflective layer 30 includes a plurality of openings 31 and a plurality of openings 32. Each of the openings 31 is arranged in one-to-one correspondence with each of the terminal portions 21, and the openings 32 are arranged at intervals with the openings 31;

[0058] S04: Bake the reflective layer 30.

[0059] In the step S02, the terminal portions 21 are all, for example, first terminal portions 211, and the first terminal portions 211 are used for electrically connecting with the LED chips 40 and transmitting electrical signals.

[0060] In the step S03, a pattern corresponding to the plurality of openings 31 and the plurality of openings 32 is formed on a stencil, and the stencil is used as a mask plate to form the patterned reflective layer 30 on the driving circuit layer 20. Among them, the openings 31 are all, for example, first openings 311 for arranging the LED chips 40, and each of the first openings 311 is arranged corresponding to each of the first terminal portions 211.

[0061] In the step S04, the baking treatment is carried out at 150 °C for 60 minutes.

[0062] After the step S04, the following steps are further included:

[0063] S05: Fabricate and form an LED chip 40 on the driving circuit layer 20, and the LED chip 40 is disposed within the opening 31;

[0064] S06: Form an encapsulation glue layer 50 on the reflective layer 30 and perform a baking treatment.

[0065] S07: Perform a bonding process.

[0066] In the step S05, the LED chip 40 is disposed within the opening 31 by means of reflow soldering SMT chip mounting process, so that the LED chip 40 is electrically connected to the first terminal portion 211.

[0067] In the step S06, the encapsulation glue layer 50 covers the reflective layer 30, and the opening 32 is not filled with the encapsulation glue layer 50; the baking treatment includes a first stage and a second stage. The baking treatment temperature in the first stage is 100 °C for 60 minutes; the baking treatment temperature in the second stage is 150 °C for 120 minutes.

[0068] In the step S07, a driving circuit board for providing a driving signal is bonded and electrically connected to the driving backplane.

[0069] Embodiment Two

[0070] Figure 5 FIG. is a top view schematic diagram of a driving backplane without an encapsulation glue layer provided in Embodiment Two of the present application;

[0071] Figure 6 is Figure 5 in the cross-sectional schematic diagram of the driving backplane unfolded along the line BB. Refer to Figures 5 - 6 , Embodiment Two of the present application provides a display panel. The display panel includes a driving backplane. The driving backplane includes: a substrate 10; a driving circuit layer 20 disposed on the substrate 10 and including a plurality of terminal portions 21; a reflective layer 30 disposed on the driving circuit layer 20 and including a plurality of openings 31, and each of the openings 31 is disposed in one-to-one correspondence with each of the terminal portions 21; wherein, the reflective layer 30 further includes a plurality of openings 32, and the openings 32 are spaced apart from the openings 31.

[0072] The display panel provided in the second embodiment of the present application is similar in structure to the display panel in the first embodiment. For the same parts, no further description will be given in this embodiment. The difference is that in the reflection layer 30 of the driving backplane, in addition to a plurality of first openings 311, the plurality of openings 31 further include a plurality of second openings 312. Correspondingly, in the driving circuit layer 20 of the driving backplane, in addition to a plurality of first terminal portions 211, the plurality of terminal portions 21 further include a plurality of second terminal portions 212. Each second terminal portion 212 includes at least one MOS transistor, that is, the driving circuit layer 20 is provided with a MOS transistor at a position corresponding to the second terminal portion 212.

[0073] In this embodiment, the second opening 312 exposes the second terminal portion 212, so as to dissipate heat from the MOS transistor in the second terminal portion 212 and improve the heat dissipation performance of the driving backplane.

[0074] In this embodiment, each second opening 312 is correspondingly arranged with each second terminal portion 212 and is used to expose the MOS transistor of the second terminal portion 212. Wherein, each repeating unit 300 includes one second opening 312, and the second opening 312 is located in a defined area surrounded by four first openings 311 in the repeating unit 300.

[0075] In this embodiment, each repeating unit 300 includes five openings 32. Among them, within one repeating unit 300, four of the five openings 32 are respectively arranged on four gap areas between adjacent first openings 311, and the other opening 32 is located in a defined area surrounded by the four openings 32. Further, within one repeating unit 300, at least one of the four openings 32 respectively arranged on the four gap areas between adjacent first openings 311 has unequal distances from the two adjacent first openings 311; the other opening 32 outside the four openings 32 is located in the middle position of the repeating unit 300, but not in the central area.

[0076] Compared with the first embodiment, since one second opening 312 is added in each repeating unit 300, in order to avoid the increase in process difficulty caused by the too-close distance between the second opening 312 and the opening 32, the present application adjusts the positions of at least two openings 32 in the repeating unit 300. Figure 5 The two openings 32 shown in the adjusted positions are respectively the opening 32 in the middle area and the opening 32 in the lower area within each repeating unit 300.

[0077] Figure 7Schematic cross - sectional view of the driving backplane including the encapsulation glue layer provided in the second embodiment of the present application. In this embodiment, the driving backplane further includes an encapsulation glue layer 50. The encapsulation glue layer 50 is disposed on the reflection layer 30 and covers the reflection layer 30. Among them, the encapsulation glue layer 50 is not filled in the opening 32; the encapsulation glue layer 50 is filled in the second window 312.

[0078] In this embodiment, the area of the second window 312 is larger than the area of the opening 32. Since the area of the opening 32 is smaller than the area of the second window 312, the area of the opening 32 is small, and the viscosity of the encapsulation glue layer 50 is large. When the encapsulation glue layer 50 is formed by covering on the reflection layer 30, the encapsulation glue layer 50 cannot fill the opening 32, so that the reflection layer 30 forms a hollowed - out area at the position of the opening 32. After the encapsulation glue layer 50 is manufactured, the driving backplane will be subjected to a high - temperature baking treatment. Since the encapsulation glue layer 50 is not filled in the opening 32, the internal stress in the reflection layer 30 can be effectively released through the opening 32, thus greatly reducing the risk of the reflection layer 30 cracking.

[0079] On the other hand, the second embodiment of the present application also provides a method for manufacturing a display panel. The manufacturing method includes the following steps:

[0080] S01: Provide a substrate 10;

[0081] S02: Form a driving circuit layer 20 on the substrate 10. The driving circuit layer 20 includes a plurality of terminal portions 21;

[0082] S03: Use an ink - jet printing process to form a patterned reflection layer 30 on the driving circuit layer 20. The reflection layer 30 includes a plurality of windows 31 and a plurality of openings 32. Each of the windows 31 is arranged in one - to - one correspondence with each of the terminal portions 21, and the openings 32 are arranged at intervals with the windows 31;

[0083] S04: Bake the reflection layer 30;

[0084] S05: Fabricate an LED chip 40 on the driving circuit layer 20. The LED chip 40 is disposed in the window 31;

[0085] S06: Form an encapsulation glue layer 50 on the reflection layer 30 and perform a baking treatment.

[0086] S07: Perform a bonding process.

[0087] The manufacturing method of the display panel provided in the second embodiment of the present application is similar to that of the display panel in the first embodiment. For the same parts, no further description will be given in this embodiment. The difference is that in the above step S02, in addition to a plurality of the first terminal portions 211, the plurality of terminal portions 21 further include a plurality of second terminal portions 212, and each second terminal portion 212 includes at least one MOS transistor; in the above step S03, in addition to a plurality of first openings 311, the plurality of openings 31 further include a plurality of second openings 312, and each of the second openings 312 is correspondingly arranged with the second terminal portion 212 and exposes the MOS transistor. Moreover, due to the arrangement of the second terminal portion 212, the position of at least a part of the opening 32 in the reflective layer 30 is also adjusted accordingly; in the above step S06, the encapsulation glue layer 50 is disposed on the reflective layer 30 and covers the reflective layer 30, wherein the encapsulation glue layer 50 is not filled in the opening 32; the encapsulation glue layer 50 is filled in the second opening 312.

[0088] Embodiment Three

[0089] Figure 8 FIG. is a top view schematic diagram of a driving backplane without an encapsulation glue layer provided in Embodiment Three of the present application. Referring to Figures 6 - 8 FIG., Embodiment Three of the present application provides a display panel, and the display panel includes a driving backplane. The driving backplane includes: a substrate 10; a driving circuit layer 20 disposed on the substrate 10 and including a plurality of terminal portions 21; a reflective layer 30 disposed on the driving circuit layer 20 and including a plurality of openings 31, and each of the openings 31 is correspondingly arranged with each of the terminal portions 21 one by one; wherein, the reflective layer 30 further includes a plurality of openings 32, and the openings 32 are spaced apart from the openings 31.

[0090] The display panel provided in Embodiment Three of the present application is similar in structure to the display panel in Embodiment Two. For the same parts, no further description will be given in this embodiment. The difference is that in the reflective layer 30 of the driving backplane, each repeating unit 300 includes four of the openings 32. Among them, within one repeating unit 300, the four openings 32 are respectively disposed on four gap regions between adjacent first openings 311. Further, within one repeating unit 300, at least one of the four openings 32 respectively disposed on the four gap regions between adjacent first openings 311 has unequal distances from the two adjacent first openings 311.

[0091] In this embodiment, two of the openings 32 are disposed between two adjacent repeating units 300.

[0092] Among them, the two openings 32 are respectively arranged on two gap areas between adjacent first window openings 311. As Figure 8 shown, in the reflective layer 30 provided in this application, one of the first openings 32 is arranged between any two adjacent first window openings 311. That is, each minimum rectangular unit area composed of four first window openings 311 contains four openings 32, so that the area of the openings 32 per unit area of the reflective layer 30 is relatively fixed, improving the light reflection uniformity of the reflective layer 30 and the optical effect of the driving backplane and the display quality of the display panel.

[0093] Compared with the second embodiment, the number of the openings 32 in the reflective layer 30 in this embodiment is smaller, so that the reflective layer 30 has a higher reflectivity and the display effect of the display panel is better.

[0094] On the other hand, the third embodiment of this application also provides a method for manufacturing a display panel. The manufacturing method includes the following steps:

[0095] S01: Provide a substrate 10;

[0096] S02: Form a driving circuit layer 20 on the substrate 10. The driving circuit layer 20 includes a plurality of terminal portions 21;

[0097] S03: Use an inkjet printing process to form a patterned reflective layer 30 on the driving circuit layer 20. The reflective layer 30 includes a plurality of window openings 31 and a plurality of openings 32. Each of the window openings 31 is arranged corresponding to each of the terminal portions 21, and the openings 32 are arranged at intervals with the window openings 31;

[0098] S04: Bake the reflective layer 30;

[0099] S05: Fabricate and form an LED chip 40 on the driving circuit layer 20. The LED chip 40 is arranged in the window opening 31;

[0100] S06: Form a packaging glue layer 50 on the reflective layer 30 and perform a baking process.

[0101] S07: Perform a bonding process.

[0102] The method for manufacturing the display panel provided in the third embodiment of this application is similar to the method for manufacturing the display panel in the second embodiment. The same parts in this embodiment will not be described in detail. The difference is that in the step S03, the layout of the openings 32 in the reflective layer 30 is different, so that the number of the openings 32 is reduced, so that the reflective layer 30 has a higher reflectivity and the display effect of the display panel is better.

[0103] In summary, the present application provides a display panel and a method for manufacturing the same. The display panel includes a driving backplane, and the driving backplane includes: a substrate; a driving circuit layer disposed on the substrate and including a plurality of terminal portions; a reflective layer disposed on the driving circuit layer and including a plurality of openings, each of the openings corresponding to one of the terminal portions; wherein the reflective layer further includes a plurality of apertures, the apertures being spaced apart from the openings. By providing the apertures on the reflective layer, the present application can release the internal stress generated in the reflective layer during the baking process, effectively reduce the risk of the reflective layer cracking, and improve the yield of the display panel.

[0104] The above has introduced in detail a display panel and a method for manufacturing the same provided by the embodiments of the present application. Specific examples are used herein to elaborate on the principle and implementation manner of the present application. The description of the above embodiments is only used to help understand the method and its core idea of the present application; at the same time, for those skilled in the art, according to the idea of the present application, there will be changes in the specific implementation manner and application scope. In summary, the content of this specification should not be construed as a limitation to the present application.

Claims

1. A display panel, characterized in that, The display panel includes a driving backplane, and the driving backplane includes: a substrate; a driving circuit layer disposed on the substrate and including a plurality of terminal portions; a reflective layer disposed on the driving circuit layer and including a plurality of openings, each of the openings corresponding to one of the terminal portions; wherein, the reflective layer further includes a plurality of apertures, the apertures being spaced apart from the openings; wherein, there is the aperture between any two adjacent ones of the openings, and the aperture is for releasing internal stress.

2. The display panel according to claim 1, characterized in that, The display panel further includes a packaging adhesive layer disposed on the reflective layer, and the packaging adhesive layer is not filled in the aperture.

3. The display panel according to claim 2, characterized in that, The reflective layer includes a plurality of repeating units arranged in an array, and each repeating unit includes a fixed number of the apertures and a fixed number of the openings.

4. The display panel according to claim 3, characterized in that, The plurality of openings include a plurality of first openings, the plurality of terminal portions include a plurality of first terminal portions, each of the first openings corresponding to one of the first terminal portions, wherein, the driving backplane further includes a plurality of LED chips arranged in an array on the driving circuit layer, each of the LED chips being disposed in one of the first openings and electrically connected to one of the first terminal portions, and each repeating unit includes four of the first openings.

5. The display panel according to claim 4, characterized in that, The plurality of openings further include a plurality of second openings, the plurality of terminal portions further include a plurality of second terminal portions, each of the second openings corresponding to one of the second terminal portions, and each second terminal portion includes at least one MOS transistor, wherein, each repeating unit further includes one of the second openings.

6. The display panel according to claim 5, characterized in that, The area of the second opening is larger than the area of the aperture, and the packaging adhesive layer is filled in the second opening.

7. The display panel according to claim 4, characterized in that, Each repeating unit includes m of the apertures, wherein, 3 ≤ m ≤ 5.

8. The display panel according to claim 7, characterized in that, Each repeating unit includes five of the apertures, and in one repeating unit, four of the five apertures are respectively disposed on four gap regions between adjacent ones of the first openings, and the other aperture is located in a defined region surrounded by the four apertures.

9. The display panel according to claim 1, characterized in that, The shape of the aperture is circular, the shape of the opening is rectangular, and the diameter of the aperture is smaller than the side length of the opening.

10. A method for manufacturing a display panel, characterized in that, including the following steps: providing a substrate; forming a driving circuit layer on the substrate, the driving circuit layer including a plurality of terminal portions; forming a patterned reflective layer on the driving circuit layer by an inkjet printing process, the reflective layer including a plurality of openings and a plurality of apertures, each of the openings corresponding to one of the terminal portions, the apertures being spaced apart from the openings; baking the reflective layer; wherein, there is the aperture between any two adjacent ones of the openings, and the aperture is for releasing internal stress.

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