Micro-LED display panel packaging method, packaging structure and display device

Abstract

The present application provides a packaging method, packaging structure and display device for a Micro-LED display panel. The packaging method includes arranging a plurality of Micro-LED chips on a substrate, forming a first cavity between two adjacent Micro-LED chips; arranging a plurality of transparent banks on the side of the cover plate facing the substrate, the plurality of transparent banks corresponding to the Micro-LED chips one by one, and forming a second cavity between two adjacent transparent banks; arranging a sealing block along the outer edge of the substrate to form a packaging cavity; pouring black ink into the packaging cavity to cover the Micro-LED chip; aligning the transparent bank with the Micro-LED chip and pressing the cover plate onto the substrate, the transparent bank squeezes the Micro-LED chip, the first cavity and the second cavity are connected to form a closed receiving cavity, and the black ink is squeezed into the receiving cavity in liquid form and fills the receiving cavity. The packaging method provided by the present application can well solve the problem of severe color deviation of Micro-LED display panels.

Description

Technical Field

[0001] The present application belongs to the field of display technology, and in particular, relates to a packaging method, packaging structure and display device of a Micro-LED display panel. Background Art

[0002] There are still many problems with Micro-LED display panels. The common methods used for Micro-LED display panel packaging are: 1. Whole-surface silicone packaging, disadvantages: poor water and oxygen barrier ability, limited protection ability; 2. Plain glass cover packaging, disadvantages: serious metal reflection and serious color cross-talk; 3. Barrier film packaging, disadvantages: poor water and oxygen barrier ability, limited protection ability; 4. BM cover glass packaging, disadvantages: because the BM cover and the driver backplane need to be bonded together, the existence of OCA gap leads to serious color deviation problems. Summary of the invention

[0003] The embodiments of the present application provide a packaging method, packaging structure and display device of a Micro-LED display panel to solve the problem that the existing Micro-LED display panel has poor water and oxygen barrier ability after packaging and is prone to color deviation.

[0004] In a first aspect, an embodiment of the present application provides a packaging method for a Micro-LED display panel, comprising:

[0005] A plurality of Micro-LED chips are arranged on the substrate, and a first cavity is formed between two adjacent Micro-LED chips;

[0006] A plurality of transparent banks are arranged on a side of the cover plate facing the substrate, the plurality of transparent banks correspond to the Micro-LED chips one by one, and a second cavity is formed between two adjacent transparent banks;

[0007] A sealing block is arranged along the outer edge of the substrate to form a packaging cavity;

[0008] Pouring black ink into the packaging cavity to cover the Micro-LED chip;

[0009] After aligning the transparent Bank with the Micro-LED chip, the cover plate is pressed onto the substrate. The transparent Bank squeezes the Micro-LED chip, the first chamber and the second chamber are connected to form a closed receiving chamber, and the black ink is squeezed into the receiving chamber in liquid form and fills the receiving chamber, thereby packaging the Micro-LED display panel.

[0010] Optionally, the substrate includes a back panel and a driving circuit board, the driving circuit board is arranged on the back panel, and the Micro-LED chips are all arranged on the driving circuit board and electrically connected to the driving circuit board.

[0011] Optionally, the volume of the black ink poured into the packaging cavity is not less than the sum of the volumes of the containing chambers.

[0012] Optionally, the transparent Bank is prepared by a yellow light process.

[0013] Optionally, the transparent Bank has a thickness of 2-10 um.

[0014] Optionally, the thickness of the transparent Bank is 6 um.

[0015] Optionally, the plurality of Micro-LED chips and the plurality of transparent Banks are arranged linearly.

[0016] Optionally, the plurality of Micro-LED chips and the plurality of transparent Banks are arranged in an array.

[0017] In a second aspect, an embodiment of the present application further provides a packaging structure, which is prepared by the packaging method of the Micro-LED display panel as described above.

[0018] In a third aspect, an embodiment of the present application further provides a display device, comprising at least one packaging structure as described above.

[0019] The packaging method of the Micro-LED display panel provided in the embodiment of the present application uses a cover plate with a transparent bank and black ink to package the Micro-LED display panel. The transparent bank corresponds to the Micro-LED chip one by one. After bonding, the transparent bank and the Micro-LED chip are completely pressed together, and the black ink is squeezed into the receiving chamber and fills the chamber. The cover plate and the substrate are fixed together by a sealing block. The black ink in the receiving chamber can absorb the light emitted from the side of the Micro-LED chip, solve the color deviation problem, and reduce the reflection of the metal. The cover plate and the sealing block can well isolate the water vapor and oxygen in the air to improve reliability. The present application can not only solve the problem of serious color deviation of the Micro-LED display panel, but also solve the problems of poor water and oxygen barrier ability, easy scratches on the circuit, easy corrosion in high temperature and high humidity environment and even circuit damage, high reflectivity, etc., greatly improving the display quality and reliability of the Micro-LED display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application, and those skilled in the art can obtain other drawings based on these drawings without creative work.

[0021] In order to more completely understand the present application and its beneficial effects, the following description will be given in conjunction with the accompanying drawings. In the following description, the same reference numerals represent the same parts.

[0022] Figure 1 A schematic diagram of the structure before packaging of the packaging structure provided in an embodiment of the present application.

[0023] Figure 2 A schematic diagram of the structure of the packaged structure provided in an embodiment of the present application after packaging;

[0024] Figure 3 This is a light projection diagram of the Micro-LED chip provided in an embodiment of the present application. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0026] The present application provides a packaging method, packaging structure, display device and terminal of a Micro-LED display panel to solve the problem that the existing Micro-LED display panel has poor water and oxygen barrier ability after packaging and is prone to color deviation. The following will be described in conjunction with the accompanying drawings.

[0027] The packaging structure of the Micro-LED display panel provided in the embodiments of the present application can be applied to a display device. For example, the display device can be a projection device, a television, a tablet computer, a laptop computer, a PDA, a smart phone, a television, a monitor, a digital photo frame, an e-book reader and other terminals, a portable computer and other mobile terminal devices with display functions, or any other device that can include a Micro-LED packaging structure.

[0028] In order to more clearly illustrate the packaging structure of the Micro-LED display panel, the packaging method and packaging structure of the Micro-LED display panel will be introduced below with reference to the accompanying drawings.

[0029] For example, see Figure 1and Figure 2 , Figure 1 A schematic diagram of the structure of the packaging structure provided in an embodiment of the present application before packaging. Figure 2 A schematic diagram of the structure after packaging of the packaging structure provided in an embodiment of the present application.

[0030] The packaging method of the Micro-LED display panel includes: arranging a plurality of Micro-LED chips 30 on a substrate 10, and forming a first cavity 80 between two adjacent Micro-LED chips 30;

[0031] A plurality of transparent Banks 50 are disposed on a side of the cover plate facing the substrate 10 , and the plurality of transparent Banks 50 correspond to the Micro-LED chips 30 one by one, and a second chamber 90 is formed between two adjacent transparent Banks 50 ;

[0032] A sealing block 60 is arranged along the outer edge of the substrate 10 to form a packaging cavity;

[0033] Pour black ink 70 into the packaging cavity to cover the Micro-LED chip 30;

[0034] After aligning the transparent Bank 50 with the Micro-LED chip 30, the cover plate is pressed onto the substrate 10, the transparent Bank 50 squeezes the Micro-LED chip 30, the first chamber 80 and the second chamber 90 are connected to form a closed receiving chamber 100, and the black ink 70 is squeezed into the receiving chamber 100 in liquid form and fills the receiving chamber 100, thereby packaging the Micro-LED display panel.

[0035] In this embodiment, the Micro-LED display panel is packaged by using a cover plate with a transparent Bank and black ink 70. The transparent Bank corresponds to the Micro-LED chip 30 one by one. The pattern of the transparent Bank 50 is prepared by a yellow light process. After bonding, the transparent Bank and the Micro-LED chip 30 are completely pressed together, and the black ink 70 is squeezed into the accommodating chamber 100 and fills the chamber. The cover plate and the substrate 10 are fixed together by a sealing block 60. The black ink 70 in the accommodating chamber 100 can well absorb the light emitted from the side of the Micro-LED chip 30, solve the color deviation problem, and reduce the reflection of the metal. The cover plate and the sealing block 60 can well isolate the water vapor and oxygen in the air to improve reliability. This application can not only solve the problem of serious color deviation of the Micro-LED display panel, but also solve the problems of poor water and oxygen barrier ability, easy scratching of the circuit, easy corrosion and even circuit explosion in high temperature and high humidity environment, high reflectivity, etc., greatly improving the display quality and reliability of the Micro-LED display panel.

[0036] Please refer to Figure 3 When the Micro-LED chip 30 emits light, the light emitted from the side of the Micro-LED chip 30 can be absorbed by the black ink 70, so that the light emitted by the Micro-LED chip 30 is limited to the width direction of the transparent block, thereby solving the color deviation problem.

[0037] The substrate 10 includes a backplane 40 and a driver circuit board 20, the driver circuit board 20 is arranged on the backplane 40, and the Micro-LED chips 30 are all arranged on the driver circuit board 20 and electrically connected to the driver circuit board 20. Therefore, during packaging, the black ink 70 is poured into the packaging cavity, directly covering the metal traces on the driver circuit board 20, and also avoiding the reflection of the metal traces affecting the appearance and display effect of the panel. Among them, the thickness of the transparent Bank 50 is 2-10um. In an optional embodiment, the thickness of the transparent Bank 50 is 5um.

[0038] In order to ensure that the receiving chamber 100 formed by the first chamber 80 and the second chamber 90 can be filled with black ink 70 when the cover plate and the back plate 40 are squeezed and packaged, so as to prevent incomplete absorption of the light emitted from the side of the Micro-LED chip 30. Therefore, when pouring the black ink 70 into the packaging cavity, the amount of black ink 70 poured is not less than the sum of the volumes of each receiving chamber 100, so that when the transparent Bank 50 squeezes the Micro-LED chip 30 from top to bottom, it can ensure that the receiving chamber 100 can be filled with black ink 70 to prevent light leakage.

[0039] It should be noted that, in some embodiments, the plurality of Micro-LED chips 30 and the plurality of transparent Banks 50 are arranged linearly to adapt to a display panel of a single chip.

[0040] In other embodiments, the plurality of Micro-LED chips 30 and the plurality of transparent Banks 50 are arranged in an array to accommodate a display panel with multiple rows and columns of chips.

[0041] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0042] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more features. The packaging method of the Micro-LED display panel provided in the embodiment of the present application is introduced in detail above. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea; at the same time, for technical personnel in this field, according to the ideas of the present application, there will be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A packaging method for a Micro-LED display panel, used for preparing a Micro-LED display panel, characterized in that: include: A plurality of Micro-LED chips are arranged on the substrate, and a first cavity is formed between two adjacent Micro-LED chips; A plurality of transparent banks are arranged on a side of the cover plate facing the substrate, the plurality of transparent banks correspond to the Micro-LED chips one by one, and a second cavity is formed between two adjacent transparent banks; A sealing block is arranged along the outer edge of the substrate to form a packaging cavity; Pouring black ink into the packaging cavity to cover the Micro-LED chip; After aligning the transparent Bank with the Micro-LED chip, the cover plate is pressed onto the substrate, the transparent Bank squeezes the Micro-LED chip, the first chamber and the second chamber are connected to form a closed receiving chamber, and the black ink is squeezed into the receiving chamber in liquid form and fills the receiving chamber, thereby packaging the Micro-LED display panel; The thickness of the transparent Bank is 2-10 um.

2. The packaging method of the Micro-LED display panel according to claim 1, characterized in that: The substrate includes a back plate and a driving circuit board. The driving circuit board is arranged on the back plate. The Micro-LED chips are arranged on the driving circuit board and are electrically connected to the driving circuit board.

3. The packaging method of the Micro-LED display panel according to claim 1, characterized in that: The volume of the black ink poured into the packaging cavity is not less than the sum of the volumes of the containing chambers.

4. The packaging method of the Micro-LED display panel according to claim 1, characterized in that: The transparent Bank is prepared by a yellow light process.

5. The packaging method of the Micro-LED display panel according to claim 1, characterized in that: The thickness of the transparent Bank is 6 um.

6. The packaging method of the Micro-LED display panel according to claim 1, characterized in that: The plurality of Micro-LED chips and the plurality of transparent Banks are arranged linearly.

7. The packaging method of the Micro-LED display panel according to claim 1, characterized in that: The plurality of Micro-LED chips and the plurality of transparent Banks are arranged in an array.

8. A packaging structure, characterized in that: The packaging structure is prepared by the packaging method of the Micro-LED display panel according to any one of claims 1 to 7.

9. A display device, characterized in that: The display device comprises at least one packaging structure according to claim 8.

Images