A size-adjustable semiconductor laser sintering fixture

Abstract

The invention discloses a size-adjustable semiconductor laser sintering fixture, which mainly includes a base, a pressing plate, a COS limit card holder for adjusting the position of COS, a heat sink limit card holder for adjusting the position of a heat sink, a probe module and a heat sink. When in use, first install the COS limit card holder and the heat sink limit card holder into the corresponding grooves on the base, and lock their positions by the pressing plate; then place the heat sink on the heat sink limit card holder, and fix the position of the heat sink by the second horizontal adjustment module and the third horizontal adjustment module; then place the COS on the heat sink, and adjust the height and horizontal position of the first adjustment block by the lifting module and the first horizontal adjustment module, so as to fix the horizontal position of the COS on the heat sink; finally, install the probe module on the COS limit card holder, adjust the position of the support rod, so that the spring probe below presses the COS on the heat sink, so as to ensure that its position is fixed during welding, so as to obtain a better welding effect.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor lasers, and in particular to a sintering fixture capable of packaging semiconductor lasers of various sizes. Background Art

[0002] Due to the advantages of small size, light weight and high conversion efficiency, semiconductor lasers are widely used in industry, medical treatment, communication and military fields.

[0003] However, semiconductor lasers generate a lot of heat when working. If this heat cannot be effectively dissipated, it will affect the power, efficiency, life and other characteristics of the laser. Semiconductor laser packaging can be divided into single tube packaging and array packaging. Single tube packaging is conducive to the heat dissipation of the laser, and higher power output can be achieved through combination. Single tubes need to be electrically isolated, which requires the single chip to be packaged on an insulating sub-heat sink, and then the packaged unit device COS (COS refers to chip on submount, which is a laser packaged on a sub-heat sink) is sintered twice and packaged on a large heat sink. In order to avoid chip displacement during the secondary sintering process, the solder used in the secondary sintering should be a low melting point solder, and the secondary sintering should be completed as much as possible in one time. This puts higher requirements on the consistency of the secondary sintering. In order to avoid the displacement of the unit device and the generation of voids during the secondary sintering process, a certain amount of pressure needs to be applied to the unit device. COS and heat sinks of different sizes have different heat dissipation capabilities. Therefore, the selection of appropriate COS and heat sink sizes, as well as the sintering quality between them, determines the heat dissipation capacity of the laser.

[0004] Since there are many types of existing welding fixtures, but none of them can be adjusted and fixed according to the size of the heat sink and the COS, the existing technology needs to be further improved and perfected. Summary of the invention

[0005] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a semiconductor laser sintering fixture with adjustable size.

[0006] The purpose of the present invention is achieved through the following technical solutions:

[0007] A size-adjustable semiconductor laser sintering fixture mainly includes a base, a pressing plate, a COS limit card holder for adjusting the COS position, a heat sink limit card holder for adjusting the heat sink position, a probe module, and a heat sink. Specifically, the base is provided with a plurality of grooves for installation and limiting. The COS limit card holder and the heat sink limit card holder are installed in the groove, and the heat sink limit card holder is located in the COS limit card holder. The pressing plate is installed above the groove, presses the COS limit card holder and the second limit card holder downward and is fixedly connected to the base. The probe module is installed on the COS limit card holder and is located above the heat sink limit card holder. The heat sink is placed on the heat sink limit card holder, and the COS is placed on the heat sink. During installation, first install the COS limit card holder and the heat sink limit card holder in the groove, then cover the pressing plate on the groove, and fix the pressing plate to the base with screws.

[0008] As a preferred solution of the present invention, the COS limit card seat mainly includes a bracket, a first horizontal adjustment module, and a lifting module. The bracket adopts a gantry structure design, and its two ends are respectively installed on the grooves of the base, and the middle part is connected to the probe module. The first horizontal adjustment module and the lifting module are respectively arranged on the two ends of the bracket. The lifting module is connected to the first horizontal adjustment module and drives the first horizontal adjustment module to move up and down.

[0009] As a preferred solution of the present invention, the lifting module mainly includes a lifting knob, a first connecting rod, a first gear, a first rack, and a first locking screw. One end of the first connecting rod is fixedly connected to the lifting knob, and the other end is connected to the first gear. The first rack is vertically arranged in the bracket and is perpendicular to the first connecting rod. The upper end of the first rack is connected to the first horizontal adjustment module. The first gear is meshed with the first rack, and the first rack and the first horizontal adjustment module are driven to rise and fall on the bracket by the rotation of the lifting knob. The first locking screw is installed on the bracket, located on one side of the first connecting rod, and is screwed into the bracket inward and pressed against the first connecting rod to achieve self-locking of the lifting module. When in use, by turning the lifting knob, the first connecting rod drives the first gear to rotate, thereby driving the first rack to move up and down with the slider of the first horizontal adjustment module, thereby achieving the change of the height of the first adjustment block. When adjusted to a suitable position, the first connecting rod is locked by the first locking screw to prevent the first rack from falling due to its own weight.

[0010] As a preferred embodiment of the present invention, the first horizontal adjustment module mainly includes a slider, a first knob, a first telescopic rod that cannot rotate radially, a second connecting rod, and a first adjustment block. One end of the first telescopic rod is installed on one side of the slider, and the other end is connected to the first adjustment block. The first knob is installed on the other side of the slider. The second connecting rod is arranged in the first telescopic rod, one end of the second connecting rod passes through the slider and is fixedly connected to the first knob, and the other end is threadedly connected to the other end of the first telescopic rod. The first knob is turned and the first telescopic rod and the first adjustment block are driven to extend or retract through the second connecting rod. When in use, the second connecting rod is driven to rotate by turning the first knob. Since the second connecting rod is threadedly connected to the end of the first telescopic rod, the rotation of the second connecting rod can drive the first telescopic rod to extend or shorten, thereby changing the horizontal position of the first adjustment block.

[0011] As a preferred embodiment of the present invention, the heat sink limit card seat mainly includes a first shell, a boss for placing the heat sink, a second adjustment block, a second locking screw, a second horizontal adjustment module, and a third horizontal adjustment module. The two ends of the first shell are respectively installed in the grooves of the base. The boss is fixedly set on the top of the first shell. The second horizontal adjustment module and the third horizontal adjustment module are both installed in the first shell, and their driving ends extend to the boss, and are connected to the second adjustment block and drive all the second adjustment blocks to move closer to or away from the boss. The second locking screw is arranged on the driving ends of the second horizontal adjustment module and the third horizontal adjustment module, and the position of the second adjustment block is locked by a threaded connection. When in use, the height position of the second adjustment block can be fixed by the second locking screw.

[0012] As a preferred solution of the present invention, the second horizontal adjustment module mainly includes a second knob, a third connecting rod, a first helical gear, a second helical gear, a transmission shaft, a second gear, a second rack, a first driving rod, and a second telescopic rod that cannot rotate radially. One end of the third connecting rod is fixedly connected to the second knob, and the other end is connected to the first helical gear. The transmission shaft is vertically arranged with the third connecting rod. The second helical gear and the second gear are both mounted on the transmission shaft, and the second helical gear is meshed with the first helical gear for transmission. The first driving rod is provided with two, respectively located on both sides of the second gear. The second rack is provided with two, respectively mounted on the two first driving rods, and meshed with the second gear for transmission, so that the second gear drives the two first driving rods at the same time. The second telescopic rod is mounted on a boss. The other end of the first driving rod extends to the boss and is connected to the end of the second telescopic rod to drive the second telescopic rod to extend or shorten. The second telescopic rod is parallel to the second rack, and the end of the second telescopic rod is connected to the second adjustment block. When in use, the first helical gear is driven to rotate by rotating the second knob, thereby driving the second helical gear and the second gear to rotate. Due to the meshing transmission of the second gear and the second rack, the second knob can simultaneously drive the two first driving rods to move toward or away from each other. Since the first driving rod is connected to the second telescopic rod and the second adjusting block, the second knob can simultaneously drive the two relative second adjusting blocks to move closer to or away from the boss.

[0013] As a preferred embodiment of the present invention, the third horizontal adjustment module mainly includes a third knob, a fourth connecting rod, a third gear, a fourth gear, a third rack, a fourth rack, a second driving rod, a third driving rod, and a third telescopic rod that cannot rotate radially. One end of the fourth connecting rod is fixedly connected to the third knob, and the other end is connected to the third gear and the fourth gear. The third telescopic rod is mounted on a boss. The third rack is mounted on one end of the second driving rod and meshes with the third gear for transmission. The fourth rack is mounted on one end of the third driving rod and meshes with the fourth gear for transmission. The other end of the second driving rod and the other end of the third driving rod extend onto the boss and are respectively connected to the ends of the third telescopic rod. The third telescopic rod is parallel to the third rack and the fourth rack, respectively. The end of the third telescopic rod is connected to the second adjustment block. When in use, the third gear and the fourth gear are driven to rotate by the rotation of the third knob and the fourth connecting rod, thereby simultaneously pushing the second driving rod and the third driving rod to move in opposite directions. Since the second driving rod and the third driving rod are both connected to the third telescopic rod and the second adjusting block, the third knob can simultaneously drive the two relative second adjusting blocks to move toward or away from each other.

[0014] As a preferred embodiment of the present invention, the probe module mainly includes a fourth knob, a fifth connecting rod, a support rod, a second housing, a fifth gear, a fifth rack, a sixth rack, a fourth drive rod, a fifth drive rod, and a spring probe. The support rod is vertically mounted on the COS limit card seat, and its bottom is fixedly connected to the second housing. The fifth connecting rod is arranged in the support rod, and its upper end is fixedly connected to the fourth knob, and the lower end is connected to the fifth gear. The fifth gear is arranged in the second housing. The fourth drive rod is provided with two, respectively located on the left and right sides of the fifth gear. The fifth rack is fixed on one end of the fourth drive rod, and meshes with the fifth gear for transmission, and the other end of the fourth drive rod extends outside the second housing. The fifth drive rod is provided with two, respectively located on the front and rear sides of the fifth gear. The sixth rack is fixed on one end of the fifth drive rod, and meshes with the fifth gear for transmission, and the other end of the fifth drive rod extends outside the second housing. The spring probe is vertically mounted on the other ends of the fourth drive rod and the fifth drive rod, respectively. When in use, the fourth driving rod and the fifth driving rod can be driven to move in opposite directions simultaneously through the rotation of the fourth knob, the fifth connecting rod and the fifth gear, so that the spring probes installed on the fourth driving rod and the fifth driving rod can move toward or away from the center at the same time.

[0015] Furthermore, the probe module also includes a third locking screw. The third locking screw is arranged on the COS limit holder, and locks the position of the support rod by thread locking. When the height of the spring probe needs to be adjusted, the third locking screw can be loosened, and the height of the support rod can be adjusted up and down and then locked to change the height of the spring probe.

[0016] Furthermore, in order to increase the downward pressure of the spring probe and the stability of the probe during pressing, the probe module of the present invention further comprises an upper pressing block. The upper pressing block is mounted on the support rod and fixedly connected to the support rod.

[0017] The working process and principle of the present invention are as follows: when in use, first install the COS limit card holder and the heat sink limit card holder into the corresponding grooves on the base, and lock their positions by the pressure plate; then place the heat sink on the heat sink limit card holder, and fix the position of the heat sink by the second horizontal adjustment module and the third horizontal adjustment module; then place the COS on the heat sink, and adjust the height and horizontal position of the first adjustment block by the lifting module and the first horizontal adjustment module, so as to fix the horizontal position of the COS on the heat sink; finally, install the probe module on the COS limit card holder, and adjust the position of the support rod so that the spring probe below presses the COS on the heat sink, thereby ensuring that its position is fixed during welding to obtain a better welding effect. The present invention also has the advantages of simple structure, convenient operation, and easy implementation.

[0018] Compared with the prior art, the present invention also has the following advantages:

[0019] (1) The size-adjustable semiconductor laser sintering fixture provided by the present invention utilizes the gravity of the pressing block itself and the spring probe at the bottom to ensure that the pressure on the COS is consistent by the height to which the pressing block descends. The pressure is controlled by fixing it with a countersunk screw according to the height to which the pressing block descends.

[0020] (2) The size-adjustable semiconductor laser sintering fixture provided by the present invention can adjust the corresponding limiting points according to the sizes of the COS and the heat sink, thereby fixing and sintering the heat sink and the COS.

[0021] (3) The size-adjustable semiconductor laser sintering fixture provided by the present invention has a simple structure, saving the cost of different fixtures required for COS and heat sinks of different sizes.

[0022] (4) The size-adjustable semiconductor laser sintering fixture provided by the present invention can be used to sinter heat sinks and COS of different sizes, making it easy to compare the quality and heat dissipation capacity after sintering and quickly determine the optimal parameters.

[0023] (5) The size-adjustable semiconductor laser sintering fixture provided by the present invention can save the cost of different fixtures required for COS and heat sinks of different sizes, speed up the production time, and also save time costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a structural schematic diagram of the size-adjustable semiconductor laser sintering fixture provided by the present invention.

[0025] Figure 2 It is a structural schematic diagram of the base provided by the present invention.

[0026] Figure 3 It is a three-dimensional diagram of the COS limit card holder provided by the present invention.

[0027] Figure 4 It is a front view (perspective view of the interior) of the COS limit card holder provided by the present invention.

[0028] Figure 5 It is a partial structural schematic diagram of the COS limit card holder provided by the present invention.

[0029] Figure 6 It is a right side view (perspective view of the interior) of the COS limit card holder provided by the present invention.

[0030] Figure 7 It is a structural schematic diagram of the first horizontal adjustment module provided by the present invention.

[0031] Figure 8 It is a three-dimensional diagram of the heat sink limiting holder provided by the present invention.

[0032] Fig. 9 It is a schematic diagram of the internal structure of the heat sink limiting holder provided by the present invention.

[0033] Fig.10 It is a partially enlarged schematic diagram of the interior of the heat sink limiting holder provided by the present invention.

[0034] Fig.11 It is a stereoscopic diagram of the probe module provided by the present invention.

[0035] Fig.12 It is a schematic diagram of the internal structure of the probe module provided by the present invention.

[0036] Fig.13 It is a three-dimensional diagram of the connection structure between the fifth gear, the fourth driving rod and the fifth driving rod provided by the present invention.

[0037] Fig.14 This is a schematic diagram of the connection structure between the fifth gear and the fourth drive rod and the fifth drive rod provided by the present invention.

[0038] Description of the reference numerals in the above drawings:

[0039] 1-base, 2-pressing plate, 3-COS limit card holder, 4-heat sink limit card holder, 5-probe module, 6-upper pressing block, 7-heat sink, 8-COS;

[0040] 31-lifting knob, 32-first locking screw, 33-first knob, 34-first telescopic rod, 35-sliding block, 36-third locking screw, 37-bracket, 38-first adjustment block, 39-second connecting rod; 70-first connecting rod, 71-first gear, 72-first rack;

[0041] 41-third knob, 42-second knob, 43-third telescopic rod, 44-second telescopic rod, 45-second locking screw, 46-second adjustment block, 47-third connecting rod, 48-first helical gear, 49-second helical gear; 60-transmission shaft, 61-second gear, 62-first drive rod, 63-boss, 64-fourth connecting rod, 65-third gear, 66-fourth gear, 67-second drive rod, 68-third drive rod;

[0042] 51 - fourth knob, 52 - fourth driving rod, 53 - fifth driving rod, 54 - supporting rod, 55 - second housing, 56 - fifth gear, 57 - spring probe. DETAILED DESCRIPTION

[0043] In order to make the purpose, technical solutions and advantages of the present invention more clear and explicit, the present invention is further described below with reference to the accompanying drawings and embodiments.

[0044] Embodiment 1:

[0045] like Figures 1 to 14 As shown, this embodiment discloses a size-adjustable semiconductor laser sintering fixture, which mainly includes a base 1, a pressing plate 2, a COS limit card seat 3 for adjusting the position of COS8, a heat sink limit card seat 4 for adjusting the position of heat sink 7, a probe module 5, and a heat sink 7. Specifically, the base 1 is provided with a plurality of grooves for installation and limiting. The COS limit card seat 3 and the heat sink limit card seat 4 are installed in the groove, and the heat sink limit card seat 4 is located in the COS limit card seat 3. The pressing plate 2 is installed above the groove, pressing the COS limit card seat 3 and the second limit card seat downward and fixedly connected to the base 1. The probe module 5 is installed on the COS limit card seat 3 and is located above the heat sink limit card seat 4. The heat sink 7 is placed on the heat sink limit card seat 4, and the COS is placed on the heat sink 7. During installation, the COS limit card seat 3 and the heat sink limit card seat 4 are first installed in the groove, and then the pressing plate 2 is covered on the groove, and the pressing plate 2 is fixed to the base 1 by screws.

[0046] As a preferred solution of the present invention, the COS limit card seat 3 mainly includes a bracket 37, a first horizontal adjustment module, and a lifting module. The bracket 37 adopts a gantry structure design, and its two ends are respectively installed on the grooves of the base 1, and the middle part is connected to the probe module 5. The first horizontal adjustment module and the lifting module are respectively arranged on the two ends of the bracket 37. The lifting module is connected to the first horizontal adjustment module and drives the first horizontal adjustment module to move up and down.

[0047] As a preferred solution of the present invention, the lifting module mainly includes a lifting knob 31, a first connecting rod 70, a first gear 71, a first rack 72, and a first locking screw 32. One end of the first connecting rod 70 is fixedly connected to the lifting knob 31, and the other end is connected to the first gear 71. The first rack 72 is vertically arranged in the bracket 37 and is perpendicular to the first connecting rod 70. The upper end of the first rack 72 is connected to the first horizontal adjustment module. The first gear 71 is meshed with the first rack 72, and the first rack 72 and the first horizontal adjustment module are driven to rise and fall on the bracket 37 by the rotation of the lifting knob 31. The first locking screw 32 is installed on the bracket 37, located on one side of the first connecting rod 70, and is screwed into the bracket 37 inwardly and pressed against the first connecting rod 70 to achieve self-locking of the lifting module. When in use, by rotating the lifting knob 31, the first connecting rod 70 drives the first gear 71 to rotate, thereby driving the first rack 72 to move the slider 35 of the first horizontal adjustment module up and down, thereby achieving the change of the height of the first adjustment block 38. After being adjusted to a suitable position, the first connecting rod 70 is locked by the first locking screw 32 to prevent the first rack 72 from falling due to its own weight.

[0048] As a preferred solution of the present invention, the first horizontal adjustment module mainly includes a slider 35, a first knob 33, a first telescopic rod 34 that cannot rotate radially, a second connecting rod 39, and a first adjustment block 38. One end of the first telescopic rod 34 is mounted on one side of the slider 35, and the other end is connected to the first adjustment block 38. The first knob 33 is mounted on the other side of the slider 35. The second connecting rod 39 is arranged in the first telescopic rod 34, one end of the second connecting rod 39 passes through the slider 35 and is fixedly connected to the first knob 33, and the other end is threadedly connected to the other end of the first telescopic rod 34. The first knob 33 is rotated and the first telescopic rod 34 and the first adjustment block 38 are driven to extend or retract through the second connecting rod 39. When in use, the second connecting rod 39 is driven to rotate by rotating the first knob 33. Since the second connecting rod 39 is threadedly connected to the end of the first telescopic rod 34, the rotation of the second connecting rod 39 can drive the first telescopic rod 34 to extend or shorten, thereby changing the horizontal position of the first adjustment block 38.

[0049] As a preferred embodiment of the present invention, the heat sink limit holder 4 mainly includes a first shell, a boss 63 for placing the heat sink 7, a second adjustment block 46, a second locking screw 45, a second horizontal adjustment module, and a third horizontal adjustment module. The two ends of the first shell are respectively installed in the grooves of the base 1. The boss 63 is fixedly set on the top of the first shell. The second horizontal adjustment module and the third horizontal adjustment module are both installed in the first shell, and their driving ends extend to the boss 63, and are connected to the second adjustment block 46 and drive all the second adjustment blocks 46 to move closer to or away from the boss 63. The second locking screw 45 is set on the driving ends of the second horizontal adjustment module and the third horizontal adjustment module, and the position of the second adjustment block 46 is locked by a threaded connection. When in use, the height position of the second adjustment block 46 can be fixed by the second locking screw 45.

[0050] As a preferred solution of the present invention, the second horizontal adjustment module mainly includes a second knob 42, a third connecting rod 47, a first helical gear 48, a second helical gear 49, a transmission shaft 60, a second gear 61, a second rack, a first driving rod 62, and a second telescopic rod 44 that cannot rotate radially. One end of the third connecting rod 47 is fixedly connected to the second knob 42, and the other end is connected to the first helical gear 48. The transmission shaft 60 is arranged vertically with the third connecting rod 47. The second helical gear 49 and the second gear 61 are both mounted on the transmission shaft 60, and the second helical gear 49 is meshed with the first helical gear 48 for transmission. The first driving rod 62 is provided with two, respectively located on both sides of the second gear 61. The second rack is provided with two, respectively mounted on the two first driving rods 62, and meshed with the second gear 61 for transmission, so that the second gear 61 drives the two first driving rods 62 at the same time. The second telescopic rod 44 is mounted on the boss 63. The other end of the first driving rod 62 extends to the boss 63 and is connected to the end of the second telescopic rod 44 to drive the second telescopic rod 44 to extend or shorten. The second telescopic rod 44 is parallel to the second rack, and the end of the second telescopic rod 44 is connected to the second adjustment block 46. When in use, the first helical gear 48 is driven to rotate by rotating the second knob 42, thereby driving the second helical gear 49 and the second gear 61 to rotate. Due to the meshing transmission between the second gear 61 and the second rack, the second knob 42 can simultaneously drive the two first driving rods 62 to move toward or away from each other. Since the first driving rod 62 is connected to the second telescopic rod 44 and the second adjustment block 46, the second knob 42 can simultaneously drive the two opposite second adjustment blocks 46 to move toward or away from the boss 63.

[0051] As a preferred solution of the present invention, the third horizontal adjustment module mainly includes a third knob 41, a fourth connecting rod 64, a third gear 65, a fourth gear 66, a third rack, a fourth rack, a second driving rod 67, a third driving rod 68, and a third telescopic rod 43 that cannot rotate radially. One end of the fourth connecting rod 64 is fixedly connected to the third knob 41, and the other end is connected to the third gear 65 and the fourth gear 66. The third telescopic rod 43 is mounted on the boss 63. The third rack is mounted on one end of the second driving rod 67 and meshes with the third gear 65 for transmission. The fourth rack is mounted on one end of the third driving rod 68 and meshes with the fourth gear 66 for transmission. The other end of the second driving rod 67 and the other end of the third driving rod 68 both extend to the boss 63 and are respectively connected to the end of the third telescopic rod 43. The third telescopic rod 43 is parallel to the third rack and the fourth rack, respectively. The end of the third telescopic rod 43 is connected to the second adjustment block 46. When in use, the third gear 65 and the fourth gear 66 are driven to rotate by the rotation of the third knob 41 and the fourth connecting rod 64, thereby simultaneously pushing the second driving rod 67 and the third driving rod 68 to move in opposite directions. Since the second driving rod 67 and the third driving rod 68 are both connected to the third telescopic rod 43 and the second adjustment block 46, the third knob 41 can simultaneously drive the two relative second adjustment blocks 46 to move toward or away from each other.

[0052] As a preferred embodiment of the present invention, the probe module 5 mainly includes a fourth knob 51, a fifth connecting rod, a support rod 54, a second shell 55, a fifth gear 56, a fifth rack, a sixth rack, a fourth drive rod 52, a fifth drive rod 53, and a spring probe 57. The support rod 54 is vertically mounted on the COS limit card seat 3, and its bottom is fixedly connected to the second shell 55. The fifth connecting rod is arranged in the support rod 54, and its upper end is fixedly connected to the fourth knob 51, and its lower end is connected to the fifth gear 56. The fifth gear 56 is arranged in the second shell 55. The fourth drive rod 52 is provided with two, which are respectively located on the left and right sides of the fifth gear 56. The fifth rack is fixed on one end of the fourth drive rod 52, and meshes with the fifth gear 56 for transmission, and the other end of the fourth drive rod 52 extends outside the second shell 55. The fifth drive rod 53 is provided with two, which are respectively located on the front and rear sides of the fifth gear 56. The sixth rack is fixed on one end of the fifth driving rod 53 and meshes with the fifth gear 56 for transmission. The other end of the fifth driving rod 53 extends outside the second housing 55. The spring probe 57 is vertically mounted on the other ends of the fourth driving rod 52 and the fifth driving rod 53. When in use, the fourth driving rod 52 and the fifth driving rod 53 can be driven to move in opposite directions at the same time by rotating the fourth knob 51, the fifth connecting rod and the fifth gear 56, so that the spring probes 57 mounted on the fourth driving rod 52 and the fifth driving rod 53 can move toward or away from the center at the same time.

[0053] Furthermore, the probe module 5 also includes a third locking screw 36. The third locking screw 36 is arranged on the COS limiter holder 3, and locks the position of the support rod 54 by thread locking. When the height of the spring probe 57 needs to be adjusted, the third locking screw 36 can be loosened, the height of the support rod 54 can be adjusted up and down, and then locked, so that the height of the spring probe 57 can be changed.

[0054] Furthermore, in order to increase the downward pressure of the spring probe 57 and the stability when pressed, the probe module 5 of the present invention further includes an upper pressing block 6. The upper pressing block 6 is mounted on the support rod 54 and fixedly connected to the support rod 54.

[0055] The working process and principle of the present invention are as follows: when in use, first install the COS limit card seat 3 and the heat sink limit card seat 4 into the corresponding grooves on the base 1, and lock their positions by the pressure plate 2; then place the heat sink 7 on the heat sink limit card seat 4, and fix the position of the heat sink 7 by the second horizontal adjustment module and the third horizontal adjustment module; then place the COS8 on the heat sink 7, and adjust the height and horizontal position of the first adjustment block 38 by the lifting module and the first horizontal adjustment module, so as to fix the horizontal position of the COS8 on the heat sink 7; finally, install the probe module 5 on the COS limit card seat 3, and adjust the position of the support rod 54, so that the spring probe 57 below presses the COS8 on the heat sink 7, so as to ensure that its position is fixed during welding, so as to obtain a better welding effect. The present invention also has the advantages of simple structure, convenient operation and easy implementation.

[0056] The above embodiments are preferred implementation modes of the present invention, but the implementation modes of the present invention are not limited to the above embodiments. Any other changes, modifications, substitutions, combinations, and simplifications that do not deviate from the spirit and principles of the present invention should be equivalent replacement methods and are included in the protection scope of the present invention.

Claims

1. A size-adjustable semiconductor laser sintering fixture, characterized in that: It includes a base, a pressing plate, a COS limit card holder for adjusting the COS position, a heat sink limit card holder for adjusting the heat sink position, a probe module, and a heat sink; The base is provided with a plurality of grooves for installation and limiting; the COS limiting card holder and the heat sink limiting card holder are installed in the grooves, and the heat sink limiting card holder is located in the COS limiting card holder; the pressing plate is installed above the groove, pressing the COS limiting card holder and the heat sink limiting card holder downward and fixedly connected to the base; the probe module is installed on the COS limiting card holder, located above the heat sink limiting card holder; the heat sink is placed on the heat sink limiting card holder, and the COS is placed on the heat sink; The heat sink limit clamp includes a first shell, a boss for placing the heat sink, a second adjustment block, a second locking screw, a second horizontal adjustment module, and a third horizontal adjustment module; the two ends of the first shell are respectively installed in the grooves of the base; the boss is fixedly set on the top of the first shell; the second horizontal adjustment module and the third horizontal adjustment module are both installed in the first shell, and their driving ends extend to the boss, and are connected to the second adjustment block and drive all the second adjustment blocks to move closer to or away from the boss; the second locking screw is set on the driving ends of the second horizontal adjustment module and the third horizontal adjustment module, and locks the position of the second adjustment block by threaded connection.

2. The size-adjustable semiconductor laser sintering fixture according to claim 1, characterized in that: The COS limit card seat includes a bracket, a first horizontal adjustment module, and a lifting module; the bracket adopts a gantry structure design, and its two ends are respectively installed on the grooves of the base, and the middle part is connected to the probe module; the first horizontal adjustment module and the lifting module are respectively arranged on the two ends of the bracket; the lifting module is connected to the first horizontal adjustment module and drives the first horizontal adjustment module to move up and down.

3. The size-adjustable semiconductor laser sintering fixture according to claim 2, characterized in that: The lifting module includes a lifting knob, a first connecting rod, a first gear, a first rack, and a first locking screw; one end of the first connecting rod is fixedly connected to the lifting knob, and the other end is connected to the first gear; the first rack is vertically arranged in the bracket and perpendicular to the first connecting rod, and the upper end of the first rack is connected to the first horizontal adjustment module; the first gear is meshed with the first rack, and the first rack and the first horizontal adjustment module are driven to rise and fall on the bracket by the rotation of the lifting knob; the first locking screw is installed on the bracket, located on one side of the first connecting rod, and is screwed into the bracket inward and presses the first connecting rod to achieve self-locking of the lifting module.

4. The size-adjustable semiconductor laser sintering fixture according to claim 3, characterized in that: The first horizontal adjustment module includes a slider, a first knob, a first telescopic rod that cannot rotate radially, a second connecting rod, and a first adjustment block; one end of the first telescopic rod is installed on one side of the slider, and the other end is connected to the first adjustment block; the first knob is installed on the other side of the slider; the second connecting rod is arranged in the first telescopic rod, one end of the second connecting rod passes through the slider and is fixedly connected to the first knob, and the other end is threadedly connected to the other end of the first telescopic rod; the first knob is rotated to drive the first telescopic rod and the first adjustment block to extend or retract through the second connecting rod.

5. The size-adjustable semiconductor laser sintering fixture according to claim 1, characterized in that: The second horizontal adjustment module includes a second knob, a third connecting rod, a first helical gear, a second helical gear, a transmission shaft, a second gear, a second rack, a first driving rod, and a second telescopic rod that cannot rotate radially; one end of the third connecting rod is fixedly connected to the second knob, and the other end is connected to the first helical gear; the transmission shaft and the third connecting rod are vertically arranged; the second helical gear and the second gear are both installed on the transmission shaft, and the second helical gear is meshed with the first helical gear for transmission; there are two first driving rods, which are respectively located on both sides of the second gear; there are two second racks, which are respectively installed on the two first driving rods, and are meshed with the second gear for transmission, so that the second gear drives the two first driving rods at the same time; the second telescopic rod is installed on the boss; the other end of the first driving rod extends to the boss and is connected to the end of the second telescopic rod to drive the second telescopic rod to extend or shorten; the second telescopic rod and the second rack are parallel to each other, and the end of the second telescopic rod is connected to the second adjustment block.

6. The size-adjustable semiconductor laser sintering fixture according to claim 1, characterized in that: The third horizontal adjustment module includes a third knob, a fourth connecting rod, a third gear, a fourth gear, a third rack, a fourth rack, a second driving rod, a third driving rod, and a third telescopic rod that cannot rotate radially; one end of the fourth connecting rod is fixedly connected to the third knob, and the other end is connected to the third gear and the fourth gear; the third telescopic rod is installed on a boss; the third rack is installed on one end of the second driving rod and meshes with the third gear for transmission; the fourth rack is installed on one end of the third driving rod and meshes with the fourth gear for transmission; the other end of the second driving rod and the other end of the third driving rod both extend to the boss and are respectively connected to the ends of the third telescopic rod; the third telescopic rod is parallel to the third rack and the fourth rack, respectively; the end of the third telescopic rod is connected to the second adjustment block.

7. The size-adjustable semiconductor laser sintering fixture according to claim 1, characterized in that: The probe module includes a fourth knob, a fifth connecting rod, a support rod, a second shell, a fifth gear, a fifth rack, a sixth rack, a fourth driving rod, a fifth driving rod, and a spring probe; the support rod is vertically mounted on the COS limit holder, and its bottom is fixedly connected to the second shell; the fifth connecting rod is arranged in the support rod, its upper end is fixedly connected to the fourth knob, and the lower end is connected to the fifth gear; the fifth gear is arranged in the second shell; the fourth driving rod is provided with two, which are respectively located on the left and right sides of the fifth gear; the fifth rack is fixed on one end of the fourth driving rod and meshes with the fifth gear for transmission, and the other end of the fourth driving rod extends to the outside of the second shell; the fifth driving rod is provided with two, which are respectively located on the front and rear sides of the fifth gear; the sixth rack is fixed on one end of the fifth driving rod and meshes with the fifth gear for transmission, and the other end of the fifth driving rod extends to the outside of the second shell; the spring probe is vertically mounted on the other ends of the fourth driving rod and the fifth driving rod respectively.

8. The size-adjustable semiconductor laser sintering fixture according to claim 7, characterized in that: The probe module also includes a third locking screw; the third locking screw is arranged on the COS limit clamping seat, and locks the position of the support rod by thread locking.

9. The size-adjustable semiconductor laser sintering fixture according to claim 7, characterized in that: The probe module also includes an upper pressing block; the upper pressing block is installed on the support rod and fixedly connected to the support rod.

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