Precursor capsules, containers and methods

Abstract

The present disclosure relates to precursor capsules holding a precursor for a vapor deposition process. The precursor capsules comprise a vapor permeable enclosure configured to define a precursor space and to allow the precursor in vapor form to exit the precursor capsule under evaporation conditions. The present disclosure also relates to precursor containers, vapor deposition apparatuses and methods comprising capsules according to the present disclosure.

Description

TECHNICAL FIELD

[0001] The present disclosure relates generally to systems and methods including semiconductor processing equipment, and in particular to evaporation systems for chemical vapor delivery. BACKGROUND

[0002] Typical precursor or source reactant delivery systems for vapor deposition processes include solid or liquid source containers. The containers can include a chemical reactant to be evaporated. A carrier gas sweeps the reactant vapor along with it across the container outlet and eventually to a substrate in a reaction chamber, or the precursor is evaporated at low pressure. The efficiency of evaporation depends in part on the surface area of the precursor exposed to the carrier gas. Accordingly, there are solutions in the prior art that aim to more efficiently distribute the precursor composition in the precursor container or otherwise increase the evaporation area. Furthermore, process control can be challenging, especially for solid precursors. In many cases, achieving a sufficiently high evaporation of the precursor requires heating the precursor above ambient temperature. Keeping a solid precursor composition at high temperature for a prolonged period of time can cause the precursor composition to aggregate, resulting in a reduced surface area of the precursor available for evaporation. This can result in a change of the dose behavior of the precursor composition and thus a change in the properties of the deposited material.

[0003] After the precursor is depleted, the precursor container is refilled. In addition to strict cleaning requirements, disposal of the precursor composition must also be compatible with the moisture sensitivity, toxicity, or other potentially challenging characteristics of the precursor composition. They can need to work in a strictly controlled environment. Accordingly, filling of the precursor container can be a slow and expensive task.

[0004] Accordingly, there is a need in the art for a simplified method of loading a precursor into a precursor container for vapor deposition. SUMMARY

[0005] In a first aspect, a precursor capsule holding a precursor for a vapor deposition process is disclosed. The precursor capsule according to the present disclosure comprises a housing configured to define a precursor space. The housing is vapor permeable to allow the precursor in vapor form to exit the precursor capsule under evaporation conditions.

[0006] In a second aspect, a precursor container is disclosed. The precursor container comprises at least two precursor capsules holding a precursor for a vapor deposition process, wherein the precursor capsule comprises a housing configured to define a precursor space, and wherein the housing is vapor permeable to allow the precursor in vapor form to exit the precursor capsule under evaporation conditions.

[0007] In a third aspect, a vapor deposition assembly is disclosed. The vapor deposition assembly according to the present disclosure comprises a precursor container containing at least two precursors held for a vapor deposition process, wherein the precursor container comprises a housing configured to define a precursor space, and wherein the housing is vapor permeable to allow the precursors in vapor form to exit the precursor container under evaporation conditions.

[0008] In a fourth aspect, a method of loading precursors into a precursor container is disclosed. The method comprises providing a precursor capsule holding precursors for a vapor deposition process comprising a precursor composition, and inserting at least two precursor capsules into a precursor container, wherein the precursor capsule comprises a housing configured to define a precursor space, and wherein the housing is vapor permeable to allow the precursors in vapor form to exit the precursor capsule under evaporation conditions.

[0009] The precursor capsules, the precursor containers, the vapor deposition assemblies and the methods according to the present disclosure can have the advantage of increasing the surface area of the precursors available for evaporation without additional structures in the precursor container. Furthermore, the impact of precursors accumulating during the use of the container tooling can be reduced. The precursor capsules can also provide a cost-effective alternative for filling the precursor containers. It is possible to increase the throughput of refilling the precursor containers, as the precursor capsules can be pre-filled with a precursor composition and the capsules can be more efficiently loaded into the precursor containers than the composition itself. For example, according to the present disclosure, a chemical supplier can sell precursors pre-packaged into precursor capsules and a customer can fill the containers on site without the need to send a complete precursor container for filling. Furthermore, for solid precursors consisting of a powder or small particles, the landing of the precursor composition in the sealing surface of the container can be reduced or avoided. Still further, the housing of the capsule can act as a particle filter for the solid precursors. Thus, an increased advantage of the capsules according to the present disclosure is that the amount of particle contamination from the powdered precursors can be reduced. This can reduce or in some embodiments eliminate the need for additional particle filters downstream of the precursor container. Another advantage can be that the lifetime of particle filters downstream of the precursor containers comprising the precursor capsules according to the present disclosure can be prolonged. BRIEF DESCRIPTION OF DRAWINGS

[0010] The accompanying drawings, which are included to provide a further understanding of the disclosure and constitute a part of this specification, illustrate exemplary embodiments and together with the description help to explain the principles of the disclosure. In the drawings:

[0011] Figure 1A 、 1B Figures 1A, 1 B and 1 C show embodiments of a chemical precursor container according to the present disclosure.

[0012] Figure 2 Figures 2A, 2B and 2C show embodiments of a vapor deposition assembly according to the present disclosure.

[0013] Figure 3FIGS. A-K in the drawings depict exemplary embodiments of precursor capsules according to the present disclosure. DETAILED DESCRIPTION

[0014] The following description of embodiments of precursor capsules, containers, and methods provided below is merely exemplary in nature and is intended to illustrate the disclosure only. The following description is not intended to limit the scope of the disclosure or claims in any way. Furthermore, the description of multiple embodiments having described features is not intended to exclude other embodiments having additional features or other embodiments comprising different combinations of the described features. For example, various embodiments are set forth as exemplary embodiments, and can be stated in dependent claims. Unless otherwise indicated, exemplary embodiments or components thereof can be combined or applied separately or in combination with each other.

[0015] In the present disclosure, any two numbers of a variable can constitute a workable range of the variable, and any range indicated can include or exclude endpoints. Furthermore, any value of a variable indicated, whether or not they are indicated with "about," can refer to an exact value or an approximate value, and include equivalents, and can refer to an average, median, representative, majority, etc. Furthermore, in the present disclosure, the terms "comprising," "consisting of," and "having" independently refer to "generally or broadly including" or "including." In the present disclosure, in some embodiments, any defined meaning does not necessarily exclude ordinary and customary meanings.

[0016] The headings provided herein are for convenience only and do not necessarily affect the scope or meaning of the claimed invention. Described herein are systems and related methods for delivering evaporated or sublimated reactants in a high-capacity deposition module.

[0017] A chemical reactant delivery system for vapor deposition can include a solid or liquid source container for providing a reactant into a reaction chamber. The source container (i.e., precursor container) can include a housing for defining a container space inside the precursor container. The housing can include a lid and / or a fill port for precursor loading. The housing can include a fluid inlet and a fluid outlet for delivering fluid into and out of the precursor container, respectively. In some embodiments, the fluid inlet and / or fluid outlet are located in the lid.

[0018] A precursor capsule according to the present disclosure is designed to hold a precursor for a vapor deposition process. The precursor can be a liquid precursor or a solid precursor. The size, material, and other characteristics of the precursor capsule are selected in a manner that the capsule is compatible with the vapor deposition process. A capsule refers herein to a housing or small box into which a precursor can be loaded. The precursor can be in the form of a precursor composition. If the composition is solid at standard temperature and pressure or at deposition conditions, it can be considered a solid composition. If the composition is liquid at standard temperature and pressure or at deposition conditions, it can be considered a liquid composition.

[0019] A precursor composition refers here to a chemical formulation that can be used for vapor deposition applications. Generally, the composition needs to be stable enough to allow for long-term storage and use, e.g. for several weeks or even months. Furthermore, the evaporation rate of the precursor compounds under predetermined conditions is preferably kept constant. The composition also needs to allow for the evaporation of the precursor molecules in order to transport them to the deposition chamber for vapor deposition. Thus, the temperature and pressure range in which the precursors comprised in the composition must be suitable for vapor deposition.

[0020] The terms "precursor" and "reactant" are used interchangeably in the present disclosure and can refer to a molecule (compound or molecule comprising a single element) that participates in a chemical reaction that produces another compound. The precursor or reactant typically comprises at least a portion that forms part of the compound or element resulting from the chemical reaction in question. The thus obtained compound or element can be deposited on a substrate. However, the precursor or reactant can be an element or compound that does not substantially incorporate into the resulting compound or element.

[0021] Examples of solid precursors that can be loaded into a precursor container according to the present invention are, for example, metal halides such as HfCl4, InI3, FeCl3, metal-organic precursors, organometallic precursors and organic precursors such as pyromellitic dianhydride. Precursor capsules according to the present disclosure are particularly useful for solid precursors, wherein the actual high vapor pressure obtained with conventional precursor containers requires high evaporation temperatures, e.g. above 150°C or 200°C. Examples of liquid precursors that can be loaded into a precursor container according to the present disclosure are, for example, metal-organic precursors or organometallic precursors with a relatively low vapor pressure. Generally, the advantages of the present disclosure can be most pronounced for precursors having a low vapor pressure at room temperature. In some embodiments, the enclosure is configured and arranged to hold a solid precursor. In some embodiments, the enclosure is configured and arranged to hold a liquid precursor.

[0022] The vapor deposition process according to the present disclosure can be a chemical vapor deposition (CVD) process. The vapor deposition process according to the present disclosure can be an atomic layer deposition (ALD) process. The vapor deposition process according to the present disclosure can be a cyclic vapor deposition process. As used herein, the term "cyclic deposition" can refer to the sequential introduction of precursors (reactants) into a reaction chamber to deposit a layer on a substrate and includes processing techniques such as atomic layer deposition and cyclic chemical vapor deposition. Vapor deposition can be used, for example, in the manufacture of semiconductor devices in the electronics industry. Thin films can be deposited on a substrate by vapor deposition. As used herein, the term "substrate" can refer to any one or more underlying materials that can be used to form or on which a structure, device, circuit, or layer is formed.

[0023] CVD-type processes generally involve a gas phase reaction between two or more precursors or reactants. The precursors or reactants can be provided to the reaction chamber or substrate simultaneously or in partially or fully separated pulses. The substrate and / or reaction space can be heated to promote reaction between the gaseous reactants. In some embodiments, the reactants are provided until a thin film having a desired thickness is deposited. Thus, CVD-type processes can be either a cyclic or non-cyclic process. In some embodiments, a cyclic CVD-type process can be used with multiple cycles to deposit a thin film having a desired thickness. In a cyclic CVD-type process, the reactants can be provided to the reaction chamber in non-overlapping or partially or fully overlapping pulses.

[0024] ALD-type processes are based on controlled, typically self-limiting surface reactions of precursors and / or reactant chemicals. By alternating and sequentially delivering precursors into the reaction chamber, gas phase reactions are avoided. The gaseous reactants are separated from each other in the reaction chamber, for example, by removing excess reactants and / or reactant byproducts from the reaction chamber between reactant pulses. This can be achieved by evacuation steps and / or inert gas pulses or purges. In some embodiments, the substrate is in contact with a purge gas, such as an inert gas. For example, the substrate can be in contact with a purge gas between reactant pulses to remove excess reactants and reaction byproducts. In some embodiments, each reaction is self-limiting and a monolayer-on-monolayer growth is achieved. These can be referred to as “true ALD” reactions. In some such embodiments, a first precursor can adsorb on the substrate surface in a self-limiting manner. A second precursor or reactant, and optionally additional reactants or precursors, will then react with the first adsorbed precursor to form a metal or metal compound monolayer on the substrate.

[0025] In some embodiments, the precursor capsules according to the present disclosure are configured to be loadable in a precursor container to perform a vapor deposition process. Thus, the materials, dimensions, structural details, and other features of the precursor capsules can be selected so that the precursor capsules can be loaded into a precursor container. Furthermore, the precursor capsules according to the present disclosure are suitable for use in vapor deposition processes. Because vapor deposition processes are sensitive to contamination and other changes in processing conditions, the properties of the precursor capsules can be selected to provide results that are as reproducible as possible, and are sufficiently inert so as not to introduce undesirable changes in the vapor composition of the process gases.

[0026] A plurality (i.e., two or more) precursor capsules according to the present disclosure can be filled with precursor and loaded into a precursor container. The size and shape of the capsules are chosen so that a sufficient number of precursor capsules can be loaded into the precursor container. Generally, it can be advantageous to load many small precursor capsules into a precursor container to more greatly obtain the advantages of the present disclosure. In some embodiments, the precursor capsules according to the present disclosure are individual units. In some embodiments, at least two precursor capsules according to the present disclosure are attached to one another. In some embodiments, at least five precursor capsules according to the present disclosure are attached to one another. In some embodiments, at least ten precursor capsules according to the present disclosure are attached to one another. In some embodiments, the precursor capsules are attached to one another by a flexible attachment.

[0027] The precursor capsules divide the precursor into smaller units. One advantage of the present invention is that the surface area available for evaporation can be increased relative to simply loading the precursor directly into the reaction vessel. At the same time, the reaction vessel structure can remain simple because the precursor capsules according to the present disclosure can be used without the need to design any internal structure in the precursor container. Thus, the present precursor capsules can increase the evaporation efficiency of a basic precursor container and can broaden their availability to more difficult to evaporate precursors. Thus, the basic container can be used for processes requiring higher.

[0028] An advantage of the present disclosure can further relate to the behavior of the precursor or precursor composition during the tooling time of the precursor container. The precursor is generally heated to cause the precursor to evaporate sufficiently. Without limiting the present invention to any particular theory, a solid precursor can clump or "cake" at high temperatures for long periods of time. The precursor can be packed more tightly and lose its original powdery or granular structure, resulting in a decrease in surface area and a decrease in evaporation rate. The same phenomenon can occur in the precursor capsules, but the decrease in precursor surface area can be reduced compared to a solid precursor that exists as a continuous mass.

[0029] The number of precursor capsules loaded into a precursor container varies depending on the application at hand. For example, capsules according to the present disclosure can be used in experimental settings or for testing new precursors or precursor compositions. In such cases, a smaller number of capsules or a smaller precursor container can be used. However, precursor capsules according to the present disclosure can also be used in higher volume applications. For example, if vaporization efficiency limits the use of such precursors, an increase in vaporization efficiency can allow the use of cheaper precursors or precursor compositions. Alternatively, cost savings can be achieved by using the current precursor capsules in combination with less complex precursor containers, thereby avoiding the use of more expensive dedicated containers. In some embodiments, at least five precursor capsules can be packaged in a precursor container. In some embodiments, at least eight precursor capsules can be packaged in a precursor container. In some embodiments, at least ten precursor capsules can be packaged in a precursor container. In some embodiments, at least 15 precursor capsules can be packaged in a precursor container. In some embodiments, at least 20 precursor capsules can be packaged in a precursor container. In some embodiments, at least 25 precursor capsules can be packaged in a precursor container. In some embodiments, at least 30 precursor capsules can be packaged in a precursor container. In some embodiments, at least 50 precursor capsules can be packaged in a precursor container. In some embodiments, at least 70 precursor capsules can be packaged in a precursor container. In some embodiments, at least 100 precursor capsules can be packaged in a precursor container. In some embodiments, at least 500 precursor capsules can be packaged in a precursor container. There is no fixed upper limit to the number of precursor capsules that can be packaged in a precursor container, as the number depends on the size of the capsules and the container and the amount of precursor that is loaded into the container. For example, in some embodiments, up to several kilograms of a precursor composition can be loaded into a precursor container. Even in such large scale applications, each capsule can contain several grams or tens of grams of precursor. Thus, in some embodiments, at least 1000 precursor capsules can be packaged in a precursor container. In some embodiments, at least 2000 precursor capsules can be packaged in a precursor container.

[0030] A precursor capsule according to the present disclosure comprises a shell defining a precursor space. The shell of a precursor capsule according to the present disclosure is substantially rigid. Rigid in this context means self-supporting. In other words, the capsule can maintain its shape under the conditions present in a precursor container. Since a precursor capsule according to the present disclosure is designed to be loadable into a precursor container, the shell needs to be rigid enough to withstand the weight of other filled precursor capsules that can be placed on top of it. A precursor capsule can be flexible. Especially in embodiments where the precursor capsule is oblong or tubular, it can be beneficial to design a precursor capsule that is bendable to improve the packing efficiency of the capsules into a precursor container.

[0031] The shell defines the shape of the precursor capsule. It can be advantageous to maximize the surface area of the precursor capsule relative to the volume of the precursor. In some embodiments, the shell can be substantially spherical. It can also be advantageous for the precursor capsule to have a shape that allows for loose packing of the precursor capsules to allow for gas flow between the capsules. Thus, it can be advantageous for the shell to be at least partially curved. In some embodiments, the shell comprises a curved surface. In some embodiments, the shell has an elliptical shape.

[0032] In some embodiments, the shell (i.e., the precursor capsule) has a width and a length. The width of the capsule can be considered to be the smallest measurement of the shell, and the length is the largest measurement of the shell perpendicular to the width. The shell of a precursor capsule according to the present disclosure can have a tubular shape. A shell can be considered to be tubular if its length exceeds three times its width. In some embodiments, the shell has a substantially spherocylindrical shape. A spherocylinder is a cylinder with substantially hemispherical end portions. For the purposes of the present disclosure, the end portions of a spherocylindrical shell need not be complete hemispheres, but it is sufficient that they comprise some spherical surface. In some embodiments, the shell has a substantially cylindrical shape. The end portions of the cylinder are substantially flat.

[0033] In some embodiments, the shell has a width and a length, and the ratio of the width to the length of the shell is about 1 : 1 to about 1 :20. For example, the ratio of the width to the length of the capsule is about 1 :2 to about 1 :20, or about 1 :3 to about 1 :20, or about 1 :5 to about 1 :20, or about 1 :7 to about 1 :20, or about 1 : 10 to about 1 :20, or about 1 :2 to about 1 : 10, or about 1 :5 to 1 : 10. In some embodiments, the ratio of the width to the length of the capsule is about 1 : 1 to about 1 : 10, or about 1 : 1 to about 1 :6, or about 1 : 1 to about 1 :5, or about 1 : 1 to about 1 :4, or about 1 : 1 to about 1 :3, or about 1 : 1 to about 1 :2.

[0034] The shell of the precursor capsule defines a precursor space. Thus, the capsules according to the present disclosure are hollow, and the precursor or precursor composition can be filled into the hollow interior of the precursor capsule. To maximize airflow between the interior and exterior of the shell, the shell can be as thin as possible without compromising its rigidity. In some embodiments, the thickness of the shell is from about 0.1 mm to about 1 mm, such as about 0.25 mm, about 0.4 mm, about 0.5 mm, or about 0.7 mm. In some embodiments, the precursor capsules according to the present disclosure have a substantially smooth surface. In some embodiments, the precursor capsules according to the present disclosure have a substantially regular shape, without protrusions or indentations, unless they are necessary for the function of, for example, a filling device. The simple shape of the precursor capsule can keep the cost of manufacturing the capsule low. However, in some embodiments, the precursor capsule can include protrusions that extend toward the interior of the precursor space. Such protrusions, which can have a variety of different shapes, can help to further increase the surface of the precursor or precursor composition available for vaporization.

[0035] The dimensions of the precursor capsules according to the present disclosure depend on the application, the precursor, and the precursor container. Thus, the volume of the precursor space, and the dimensions of the shell, can vary. In some embodiments, the diameter of the shell can vary from about 0.2 cm to about 20 cm. The diameter of the shell can be, for example, 0.5 cm to 8 cm, 1 cm to 8 cm, 2 cm to 8 cm, 4 cm to 8 cm, or 5 cm to 8 cm. The diameter of the shell can be, for example, 5 cm to 20 cm, 7 cm to 20 cm, 10 cm to 20 cm, 12 cm to 30 cm, or 15 cm to 20 cm. Thus, the diameter of the shell can be, for example, 1 cm, 2 cm, 3 cm, 5 cm, 8 cm, 10 cm, 14 cm, 15 cm, 17 cm, or 20 cm.

[0036] In some embodiments, the shell has a length and a width, and the length is from about 1 cm to about 20 cm.

[0037] In smaller scale applications, smaller precursor capsules can be used, and the length of the shell of the precursor capsule can be, for example, from about 1 cm to about 8 cm, or from about 3 cm to about 8 cm, or from about 5 cm to about 8 cm, or from about 6 cm to about 8 cm, such as 2 cm, 4 cm, or 7 cm. In larger scale applications, the length of the precursor capsules according to the present disclosure can be, for example, from about 8 cm to about 20 cm, or from about 10 cm to about 20 cm, or from about 12 cm to about 20 cm, or from about 15 cm to about 20 cm, such as 9 cm, 13 cm, or 14 cm.

[0038] In some embodiments, the shell has a length and a width, and the width is from about 0.4 cm to about 10 cm. In smaller scale applications, smaller precursor capsules can be used, and the width of the shell can be, for example, from about 0.4 cm to about 6 cm, or from about 0.5 cm to about 6 cm, or from about 1 cm to about 6 cm, or from about 2 cm to about 6 cm, or from about 3 cm to about 6 cm, e.g., 4 cm or 5 cm. In larger scale applications, the width of the precursor capsules according to the present disclosure can be, for example, from about 5 cm to about 10 cm, or from about 7 cm to about 10 cm, e.g., 6 cm, 8 cm, or 9 cm.

[0039] In some embodiments, the precursor space has a volume of from about 1 cm 3 to about 20 cm 3 . For example, the volume of the precursor space can be from about 1 cm 3 to about 2 cm 3 , or from about 1 cm 3 to about 5 cm 3 , or from about 1 cm 3 to about 7 cm 3 , from about 1 cm 3 to about 10 cm 3 , or from about 1 cm 3 to about 12 cm 3 , or from about 1 cm 3 to about 15 cm 3 . In some embodiments, the volume of the precursor space can be, for example, from about 15 cm 3 to about 20 cm 3 , or from about 12 cm 3 to about 20 cm 3 , or from about 10 cm 3 to about 20 cm 3 , or from about 8 cm 3 to about 20 cm 3 , or from about 5 cm 3 to about 20 cm 3 .

[0040] The shell of the precursor capsule is vapor permeable to allow the precursor in vapor form to exit the precursor capsule under vaporization conditions. To allow the vaporized precursor to exit the precursor capsule, the shell of the precursor capsule is permeable to the vaporized precursor species. In some embodiments, the precursor in vapor form can diffuse through the shell. In some embodiments, the precursor in vapor form can move through the shell by mass flow. The precursor capsule according to the present disclosure does not need to be completely occlusive to the exit of the liquid or solid precursor or precursor composition. The advantages of the present disclosure can be realized even if some amount of the liquid or solid precursor or precursor composition leaks out of the precursor container. In some embodiments, the shell is configured to substantially retain the liquid or solid precursor in the precursor space. In some embodiments, the shell is configured to retain the liquid or solid precursor in the precursor space. Unvaporized precursor refers to the precursor or precursor composition in liquid or solid phase. In some embodiments, the precursor capsule according to the present disclosure includes a rigid support structure and a vapor permeable portion. The rigid support can be a frame.

[0041] In some embodiments, the shell of the precursor capsule includes an opening for the vaporized precursor to exit the precursor capsule. The opening can be considered as a region that is free or lacking of the shell material that can be distinguished from the surrounding region. The hole can be created by punching a hole in the shell material at or after the production of the shell material. The size, amount, and location of the opening can vary depending on the particular embodiment. The opening can have different shapes. In some embodiments, the opening can be circular or substantially circular. In some embodiments, the opening can be elliptical. In some embodiments, the opening can be oblong. In some embodiments, the opening can be substantially square. In some embodiments, the opening can be rectangular or substantially rectangular. In some embodiments, the maximum cross section of the opening is about 50 pm to about 5 mm, or about 100 pm to about 5 mm, or about 200 pm to about 5 mm, or about 500 pm to about 5 mm, or about 1 mm to about 5 mm, or about 2 mm to about 5 mm, or about 3 mm to about 5 mm, or about 4 mm to about 5 mm.

[0042] In some embodiments, the maximum cross section of the opening is about 50 pm to about 3 mm, or about 50 pm to about 1 mm, or about 50 pm to about 500 pm, or about 50 pm to about 300 pm, or about 50 pm to about 200 pm, or about 50 pm to about 100 pm.

[0043] To optimize the gas permeability of the enclosure, the openings can comprise as large a proportion of the surface area of the enclosure as possible. In some embodiments, the vapor permeable region can comprise as large a proportion of the surface area of the enclosure as possible. In some embodiments, at least 50% of the surface area of the enclosure is vapor permeable. In some embodiments, at least 60% of the surface area of the enclosure is vapor permeable. In some embodiments, at least 70% of the surface area of the enclosure is vapor permeable. In some embodiments, at least 80% of the surface area of the enclosure is vapor permeable. In some embodiments, at least 90% of the surface area of the enclosure is vapor permeable. In some embodiments, at least 95% of the surface area of the enclosure is vapor permeable. In some embodiments, about 50% to about 99% of the surface area of the enclosure is vapor permeable. In some embodiments, about 50% to about 95% of the surface area of the enclosure is vapor permeable. In some embodiments, about 50% to about 90% of the surface area of the enclosure is vapor permeable. In some embodiments, about 50% to about 85% of the surface area of the enclosure is vapor permeable. In some embodiments, about 50% to about 80% of the surface area of the enclosure is vapor permeable. In some embodiments, about 50% to about 75% of the surface area of the enclosure is vapor permeable. In some embodiments, about 50% to about 70% of the surface area of the enclosure is vapor permeable. In some embodiments, about 50% to about 60% of the surface area of the enclosure is vapor permeable.

[0044] However, in some embodiments, in accordance with the present disclosure, a high volatility precursor can be packaged in a precursor capsule. In some embodiments, the volatility of the high volatility precursor is at least 2 Torr under standard conditions. In some embodiments, the volatility of the high volatility precursor is at least 5 Torr under standard conditions. In some embodiments, the volatility of the high volatility precursor is at least 10 Torr under standard conditions. In such embodiments, less than about 50% of the surface area of the enclosure can be vapor permeable. In some embodiments, less than about 30% of the surface area of the enclosure is vapor permeable. In some embodiments, less than about 20% of the surface area of the enclosure is vapor permeable. In some embodiments, less than about 10% of the surface area of the enclosure is vapor permeable. In some embodiments, about 5% to about 50% of the surface area of the enclosure is vapor permeable. In some embodiments, about 5% to about 25% of the surface area of the enclosure is vapor permeable. In embodiments in which the vapor permeable area is less than about 50% of the surface area of the enclosure, the precursor capsule in accordance with the present disclosure can improve or simplify the regulation of the precursor vapor. Needle valves are often used in the art to regulate the flow of volatile precursor into a reaction chamber, but the precursor capsule in accordance with the present disclosure can add additional or alternative precursor vapor regulation means.

[0045] In some embodiments, the shell of the precursor capsule comprises a mesh material. In some embodiments, the shell consists essentially of a mesh material. In some embodiments, the largest diameter of the opening is smaller than the diameter of the particles in the precursor composition.

[0046] In some embodiments, the shell comprises a vapor movement path. The shell material can comprise a vapor movement path. The vapor movement path can be considered a route within the shell material for the vapor phase precursor to travel between the interior and the exterior of the shell. The vapor movement path can be dispersed throughout the shell material. In other words, the vapor movement path can be dispersed throughout the shell material without forming a discernible opening in the shell material. In some embodiments, the shell comprises a fibrous material. The fibrous material can comprise a vapor movement path. In some embodiments, the shell consists essentially of a fibrous material. In some embodiments, the shell can comprise a gas permeable membrane.

[0047] Evaporation of the precursor refers herein to the ability of the liquid or solid precursor to evaporate, for example by evaporation or sublimation, and to be carried outside the precursor capsule to be delivered to the reaction chamber of the vapor deposition assembly. Evaporation conditions herein refer to the conditions under which evaporation is to occur. For example, the evaporation conditions can comprise a predetermined temperature and / or pressure range. Outside the evaporation conditions, for example during storage or transport of the precursor capsule or of a precursor container comprising the precursor capsule, evaporation can or can not occur. Under other conditions than the evaporation conditions, the precursor can evaporate more slowly than under the evaporation conditions.

[0048] The shell of the precursor capsule according to the present disclosure can be made of any material or materials suitable for use in a vapor deposition process. The shell material should be sufficiently inert not to release unwanted substances into the vapor deposition process. The shell material should also be able to withstand the target evaporation conditions, for example temperature and pressure. The precursor capsule according to the present disclosure can be reused. Therefore, the shell material should withstand industrial cleaning processes. For example, metals such as stainless steel or aluminum can be used as shell material. In some embodiments, metal alloys, for example brass, can be used as shell material. Furthermore, vapor deposition compatible plastic types are known in the art, which can be suitable as shell material. Other materials, for example ceramics or composites, can be envisaged. In some embodiments, the shell material comprises a metal. In some embodiments, the shell material consists essentially of a metal. In some embodiments, the shell material consists essentially of at least two metals. In some embodiments, the shell comprises a coating. Thus, the shell material, for example a metal, can be coated with another material. The coating can improve the performance of the precursor capsule, as the surface properties of the shell can be optimized by the coating, while the shell material can be selected based on its structural properties.

[0049] In some embodiments, the housing is configured and arranged to be openable to allow filling of the precursor capsule with precursor. The housing can include a fill opening that can be closed by a plug or cap. In some embodiments, the housing is comprised of two portions that can be moved relative to each other to open the precursor capsule. For example, the housing can include two detachable portions. The detachable portions can be configured to be held together when in contact with each other. Examples of such attachment can be various snap engagements, closely matching attachment surfaces, etc. The two portions of the housing can be connected with a hinge.

[0050] The precursor capsules according to the present disclosure can be filled with variable amounts of precursor composition. The amount of precursor composition in the precursor capsule depends on the volume of the precursor space, the density of the composition, and the desired degree of filling of the precursor capsule. For example, in some embodiments, the precursor capsules according to the present disclosure can be filled with about 0.5 g to about 50 g of precursor or precursor composition. In some embodiments, for example, about 1 g, 5 g, 10 g, 12 g, 15 g, 20 g, 25 g, 30 g, or 40 g of precursor composition can be loaded into the precursor capsule. However, in higher volume applications, larger amounts of precursor composition can be packaged in the precursor capsule.

[0051] In some embodiments, it can not be necessary or desirable to fill the precursor capsule completely. For example, the precursor capsule can be filled to about 50%, 60%, 70%, 80%, or 90% of the volume of the precursor space.

[0052] In an aspect, a precursor container comprising at least two precursor capsules according to the present disclosure is disclosed. A chemical reactant delivery system for vapor deposition can include a liquid or solid precursor container for providing reactants into a reaction chamber. The reactant delivery system can include a heating device comprising a heater, such as a radiant heat lamp, an electrical resistance heater, etc. In some embodiments, the heating device can be adapted to heat the precursor container to a temperature of about 20 °C to about 500 °C, such as to about 50 °C, 70 °C, 100 °C, 200 °C, 250 °C, 300 °C, 350 °C, or 400 °C.

[0053] A precursor container according to the present disclosure includes at least two precursor capsules holding precursors for a vapor deposition process. A heater can heat the container to evaporate the precursors in the container. The precursor container can have an inlet and an outlet for a carrier gas (e.g., N2) to flow through the precursor container. The carrier gas can be an inert gas. The carrier gas can sweep the precursor vapor, such as sublimated or evaporated precursors, as it passes through the container outlet and ultimately to a substrate in a reaction chamber. The precursor container typically includes isolation valves for isolating the contents of the container from the outside of the container. One isolation valve can be disposed upstream of the container inlet and another isolation valve can be disposed downstream of the container outlet. The precursor container of some embodiments includes, consists essentially of, or consists of a sublimator.

[0054] Depending on the application, the composition can be heated and / or maintained at very low pressure to produce sufficient amounts of precursor vapor for a vapor deposition process. The precursor container can be supplied with gas lines extending from the inlet and outlet, isolation valves on the lines, and fittings on the valves configured to connect to gas flow lines of the remaining vapor deposition assembly. It is generally desirable to provide additional heaters to heat the various valves and gas flow lines between the precursor container and the reaction chamber to prevent the precursor vapor from condensing and depositing on these components. Thus, the gas delivery components between the precursor container and the reaction chamber are sometimes referred to as a “hot zone,” in which the temperature is maintained above the vaporization / condensation / sublimation temperature of the precursor.

[0055] In some embodiments, the precursor container according to the present disclosure is configured and arranged for use in a vapor deposition assembly. In some embodiments, the precursor container according to the present disclosure is constructed and arranged to operate at an evaporation temperature of about 30 °C to about 500 °C, and the material of the precursor capsule enclosure is selected to withstand the evaporation temperature. In some embodiments, the precursor container according to the present disclosure is constructed and arranged to operate at an evaporation temperature of about 200 °C to about 500 °C, and the material of the precursor capsule enclosure is selected to withstand the evaporation temperature. In some embodiments, the precursor container according to the present disclosure is constructed and arranged to operate at an evaporation temperature of about 300 °C to about 500 °C, and the material of the precursor capsule enclosure is selected to withstand the evaporation temperature. In some embodiments, the precursor container according to the present disclosure is constructed and arranged to operate at an evaporation temperature of about 400 °C to about 500 °C, and the material of the precursor capsule enclosure is selected to withstand the evaporation temperature. In some embodiments, the precursor container according to the present disclosure is constructed and arranged to operate at an evaporation temperature of about 30 °C to about 200 °C, and the material of the precursor capsule enclosure is selected to withstand the evaporation temperature. In some embodiments, the precursor container according to the present disclosure is constructed and arranged to operate at an evaporation temperature of about 50 °C to about 150 °C, and the material of the precursor capsule enclosure is selected to withstand the evaporation temperature. In some embodiments, the precursor container according to the present disclosure is constructed and arranged to operate at an evaporation temperature of about 70 °C to about 150 °C, and the material of the precursor capsule enclosure is selected to withstand the evaporation temperature.

[0056] In yet another aspect, a vapor deposition assembly is disclosed, comprising a precursor container comprising at least two precursor capsules according to the present disclosure. The vapor deposition assembly comprises a reaction chamber for performing a vapor deposition process and a precursor delivery system comprising a precursor container comprising precursor capsules according to the present disclosure, the precursor container being connected to the reaction chamber to supply precursor into the reaction chamber.

[0057] The vapor deposition assembly includes one or more reaction chambers configured and arranged to hold a substrate and a precursor injector system configured and arranged to provide precursors in a gas phase into the reaction chambers. The vapor deposition assembly further includes a precursor container comprising at least two precursor capsules according to the present disclosure, and the assembly is configured and arranged to provide a composition according to the present disclosure to the reaction chambers by the precursor injector system to deposit a Group 13 metal-containing material on the substrate.

[0058] In some embodiments, the vapor deposition assembly can additionally include a control processor and software configured to operate the reaction chambers to perform an ALD process. In some embodiments, the vapor deposition assembly can additionally include a control processor and software configured to operate the reaction chambers to perform a CVD process.

[0059] In an aspect, a method of loading a precursor into a precursor container is disclosed. The method includes providing a precursor capsule holding a precursor for a vapor deposition process comprising a precursor composition, and inserting at least two precursor capsules into a precursor container; wherein the precursor capsule comprises a housing configured to define a precursor space, and wherein the housing is vapor permeable to allow the precursor in vapor form to exit the precursor capsule under vaporization conditions.

[0060] The precursor can be loaded into the openable precursor capsule by any of the ways described above. For example, if the precursor capsule comprises a fill opening, the precursor or precursor composition can be loaded therethrough. The opening can be closed with a lid or plug. In some embodiments, a portion of the housing can be removed, or two portions of the precursor capsule can be moved relative to each other to fill the precursor capsule. In embodiments comprising a vapor permeable membrane, the precursor capsule can be sealed after the precursor or precursor composition has been inserted into the precursor capsule.

[0061] The precursor capsule can be stored after the precursor or precursor composition is loaded into the precursor capsule. The storage conditions and acceptable storage duration depend on the precursor chemistry. When the precursor or precursor composition is inserted into the precursor container, the container is opened and the desired amount of precursor capsules is inserted into the precursor container. Then, the precursor container is closed. The filled precursor container can be further stored, transported, or connected to a vapor deposition assembly.

[0062] Detailed description of the drawings

[0063] The present disclosure is further explained by the following exemplary embodiments depicted in the drawings. The illustrations presented herein are not meant to be actual views of any particular precursor capsule or container, but are merely illustrative of the presently disclosed embodiments. It should be understood that the elements of the drawings are shown schematically and are not necessarily drawn to scale. For example, the dimensions of some of the elements in the figures can be exaggerated relative to others for the purpose of increasing the understanding of the illustrated embodiments of the present disclosure. The embodiments depicted in the drawings can contain additional elements and details, which can be omitted for the sake of clarity.

[0064] Figure 1A A schematic cross-section of a precursor container 10 according to the present disclosure is shown along its longitudinal axis. The container 10 is made of a suitable container material, such as stainless steel, aluminum, copper, nickel, silver, alloys thereof, graphite, boron nitride, ceramic materials, or combinations or mixtures of said materials. The material of the precursor container 10 can be a thermally conductive material. The material of the precursor container 10 can be coated or clad with a material.

[0065] The precursor container comprises a shell 11 defining an inner volume 12 of the precursor container 10. The shell 11 comprises a bottom 111 and a sidewall 112. In some embodiments, the shell 11 has a substantially cylindrical shape. Accordingly, the shell 11 has a circular bottom 111. However, the precursor container 10 can have any shape compatible with the proper carrier gas flow through its inner volume 12. In some embodiments, the precursor container 10 has substantially the shape of a rectangular prism. The shape of the precursor container 10 can deviate from the ideal geometries described above due to availability, ease of manufacturing and disposal. For example, any edges and / or corners can be more rounded, or some sides are at least partially inclined. In some embodiments, the bottom and the sidewall can be indistinguishable. The bottom 111 can be curved. The shell 11 can be composed of one part by, for example, machining. However, the shell 11 can be formed of two or more parts attached to each other in a gas-tight manner. For example, the bottom 111 and the sidewall 112 can be separable components.

[0066] In Figure 1A In embodiments, the precursor container 10 comprises a lid 13 for isolating the inner volume 12 from the surrounding atmosphere together with the shell 11. The lid 13 can comprise an inlet 14 for feeding a carrier gas into the precursor container 10. The inlet 14 can comprise an inlet valve 141, and the inlet 14 can be arranged to introduce the carrier gas into the inner volume 12 of the precursor container 10 when the inlet valve 141 is open.

[0067] The lid 13 can comprise an outlet 15 for feeding carrier gas and evaporated precursor into a reaction chamber of a vapour deposition assembly (not shown). The outlet 15 can comprise an outlet valve 151 and be arranged to release carrier gas containing evaporated precursor into the reaction chamber when the outlet valve 151 is open. When connected to a vapour deposition assembly, gas lines can extend from the inlet 14 and outlet 15, an isolation valve on the line and a fitting on the valve configured to connect to gas flow lines of the remaining vapour deposition assembly.

[0068] The size and proportions of the precursor container 10 can vary depending on the design choices and applications discussed and the scale of the vapour deposition process. In some embodiments, the height of the precursor container 10 is greater than its width. In some embodiments, the height of the precursor container 10 is equal to its width. In some embodiments, the height of the precursor container 10 is less than its width. In some embodiments, the precursor container 10 can have a height to width ratio of about 0.5 to 4, for example 1 to 2 or 1 to 3. The height of the precursor container 10 is an external measurement of the portion of the precursor container 10 furthest from the lid 13 from the lid 13 to the shell 11. The width of the precursor container 10 is the longest measurement through the precursor container 10 perpendicular to the height.

[0069] According to the present disclosure, the internal volume 12 of the precursor container 10 is adapted to hold precursor capsules 16. The internal volume 12 comprises a capsule support 121. The capsule support 121 is a gas permeable structure on which precursor capsules according to the present disclosure are located. According to the present disclosure, the capsule support 121 can define a lower gas space 122 below the portion of the internal volume 12 containing the precursor capsules 16. The capsule support 121 can for example distribute carrier gas entering the internal volume 12 along the surface area of the bottom 111 of the precursor container 10 in the lower gas space 122. This can improve the uniformity of the gas flow through the precursor container 10. The capsule support 121 can be made of the same material as the precursor container. The capsule support 121 can comprise a metal mesh or net. The capsule support 121 can be a plate with holes. The capsule support 121 can be a freestanding structure or removably attached to the wall 112 or bottom 111 of the precursor container 10. In some embodiments, the capsule support 121 can be permanently attached to the precursor container shell 11. In some embodiments, the capsule support 121 can be removable from the precursor container 10. Figure 1A In embodiments, the inlet tube 142 extends from the outlet 14 in the lid 13 to the lower gas space 122 to deliver carrier gas into the lower gas space 122.

[0070] Figure 1AThe arrows in the figure indicate the movement of the carrier gas through the precursor container 10. The carrier gas enters the inner volume 12 through the inlet tube 142. The carrier gas is distributed at least to some extent in the lower gas space 122. The carrier gas moves out of the lower gas space 122 through the openings in the capsule support 121. The precursor present in the precursor capsule 16 is evaporated and carried by the carrier gas towards the outlet 15. According to Figure 1A The presently disclosed precursor capsule 16 shown has a spherical shape. The carrier gas can travel partly inside and partly outside the precursor capsule 16. In some embodiments, it can be advantageous to minimize the volume outside the precursor capsule. In such embodiments, the precursor capsule 16 can be tightly packed and comprise straight surfaces to allow the precursor capsule 16 to be tightly packed in the inner volume 12 of the precursor container. The carrier gas and evaporated precursor leave the precursor container 19 through the outlet 15.

[0071] The precursor container 10 can be coupled to a heating device, such as a heater, for example a radiant heat lamp or an electric resistance heater. The heating device heats the precursor container 10 to enhance the evaporation of the precursor in the precursor container 10. The heating device can be inside or outside the precursor container 10.

[0072] The precursor container 10 can comprise additional features, which are omitted from the figures for clarity. For example, the precursor container 10 can comprise precursor distribution means for enabling efficient precursor evaporation. For this purpose, various precursor holding structures or carrier gas guiding means can be present in the inner volume 12 of the precursor container 10. The precursor container 10 can comprise features for avoiding that solid precursor particles are trapped in the carrier gas stream. Various filters or other trapping structures can be used. In addition, the inlet 14 and outlet 15 and the gas lines extending therefrom can comprise heaters for heating the various valves and gas lines between the precursor container 10 and the reaction chamber to prevent the precursor vapor from condensing and depositing on any components.

[0073] Figure 1B Another embodiment of a precursor container 10 according to the present disclosure is shown. Figure 1B The embodiment of Fig. 1 comprises features similar to those described in connection with Figure 1A However, in the embodiment of Fig. 1 the housing 11 comprises a bottom 111, a wall 112 and a lid 113 covering the upper surface of the precursor container 10. Figure 1B In the embodiment of Fig. 1 the bottom 111 and the wall 112 are one piece. Figure 1A In the embodiment of Fig. 1 the bottom 111 and the wall 112 are one piece. Figure 1B In the embodiment of Fig. 1 the precursor container 10 comprises a cap or plug 13 for inserting and removing the precursor from the precursor container 10, respectively. The cap 13 can comprise various structures, closing and safety features available in the art for closing a container at a pressure different from the ambient pressure. In addition, Figure 1B In the embodiment of Fig. 1 the bottom 111 is a separate piece from the wall, while in the embodiment of Fig. 2 the bottom 111 and the wall 112 are one piece. Figure 1A In the embodiment of Fig. 1 the bottom 111 is a separate piece from the wall, while in the embodiment of Fig. 2 the bottom 111 and the wall 112 are one piece.

[0074] Figure 1B The inlet tube 142 further extends into the lower gas space 122. It extends substantially parallel to the bottom 111 of the precursor container 10 and contains a gas outlet hole through which carrier gas can be released into the lower gas space 122. In the figure, the inlet tube 142 comprises a single tube. However, in some embodiments, the portion of the inlet tube 142 that extends substantially parallel to the bottom 111 can comprise multiple branches. This portion can also be annular. In some embodiments comprising a portion of the inlet tube 142 that extends substantially parallel to the bottom 111, the separate capsule support 121 can be omitted.

[0075] Although Figure 1A Embodiments of the precursor container 10 comprise a capsule support 121 that stands upright on the bottom 111 of the precursor container 10, in Figure 1B Embodiments of the precursor container 10, the capsule support 121 rests on one or more ledges mounted on the wall 112 of the precursor container 10.

[0076] Figure 1B The precursor capsules 16 of the precursor container 10 are substantially spherocylindrical. Thus, the outer shell of the precursor capsules 16 comprises a cylindrical middle portion and a spherical end portion located on each side of the middle portion. Similar to Figure 1A The arrows inside the precursor container 10 indicate possible flow directions of carrier gas and evaporated precursor.

[0077] Figure 1C A further embodiment of a precursor container 10 according to the present disclosure is shown. This embodiment is similar to the embodiment of Figure 1A The precursor container 10 comprises a housing 11, a bottom 111 and a side wall 112. It comprises a lid 13 with an inlet 14 and an outlet 15, and corresponding inlet and outlet valves 141, 151. An inlet tube 142 extends from the outlet 14 in the lid 13 to the vicinity of the bottom 111 of the precursor container. In Figure 1C The capsule support 121 is formed as a plurality of surfaces that define a tortuous flow path through the interior volume 12. The flow path starts at the end of the inlet tube 142 and extends the length that carrier gas travels inside the precursor container, as indicated by the arrows in Figure 1C Such a structure can improve the evaporation of low-vapor-pressure precursors.

[0078] Figure 2A vapor deposition assembly 20 including a precursor container 231 according to the present disclosure is shown in schematic form. The deposition assembly 20 can be used to perform a vapor deposition process. The vapor deposition process can be, for example, a CVD-type process or an ALD-type process or a hybrid thereof. In the illustrated example, the deposition assembly 20 includes one or more reaction chambers 22, a precursor injector system 23, and a precursor container 231 containing at least two precursor capsules 2311 holding precursors for use in a vapor deposition process. The vapor deposition assembly 20 also includes a second precursor container 232, a purge gas source 233, an exhaust source 24, and a controller 25.

[0079] The reaction chamber 22 can include any suitable reaction chamber, such as an ALD or CVD reaction chamber.

[0080] The precursor container 231 can include a container and precursor capsules 2311 as described herein. The second precursor container 232 can include a container and one or more additional precursors— alone or mixed with one or more carrier gases. The purge gas source 233 can include one or more inert gases, such as N2or He or Ar. Although three sources / precursor containers 231-233 are illustrated, the deposition assembly 20 can include any suitable number of sources / precursor containers. The sources / precursor containers 231-233 can be coupled to the reaction chamber 22 by lines 234-236, which can each include flow controllers, valves, heaters, etc. In some embodiments, the composition according to the present disclosure and / or the second precursor and / or the purge gas in the precursor container 231 can be heated. In some embodiments, the precursor container 231 is heated so that the composition according to the present disclosure reaches a temperature of between about 50 °C to about 140 °C, such as about 70 °C to about 130 °C, for example 60 °C, 80 °C, 90 °C, 100 °C, 110 °C, or 120 °C. The exhaust source 24 can include one or more vacuum pumps.

[0081] The controller 25 includes electronic circuitry and software to selectively operate the valves, manifolds, heaters, pumps, and other components included in the deposition assembly 20. Such circuitry and components operate to introduce precursors, reactants, and purge gases from the respective sources 231-233. The controller 25 can control the timing of the gas pulse sequences, the temperature of the substrate and / or the reaction chamber 22, the pressure within the reaction chamber 22, and various other operations to provide proper operation of the deposition assembly 20. The controller 25 can include control software to electrically or pneumatically control the valves to control the flow of precursors, reactants, and purge gases into and out of the reaction chamber 22. The controller 25 can include modules, such as software or hardware components, that perform specific tasks.

[0082] Other configurations of the deposition assembly 20 are possible, including different numbers and kinds of precursor and reactant sources and purge gas sources. In addition, it should be understood that there are many arrangements of valves, conduits, precursor sources, and purge gas sources that can be used to achieve selective and coordinated feeding of gases to targets in the reaction chamber 22. Moreover, as a schematic representation of a deposition assembly, many components have been omitted for simplicity of illustration, and these components can include, for example, various valves, manifolds, purifiers, heaters, vessels, vents, and / or bypasses.

[0083] During operation of the deposition assembly 20, a substrate such as a semiconductor wafer (not shown) is transferred from, for example, a substrate handling system to the reaction chamber 22. Once the substrate is transferred to the reaction chamber 22, one or more gases such as precursors, reactants, carrier gases, and / or purge gases from the gas sources 231-233 are introduced into the reaction chamber 22.

[0084] Figure 3 Embodiments of a precursor capsule 30 according to the present disclosure are depicted. In Figures A to K, the outer shell is denoted by the number 31 and the precursor space is denoted by the number 32. The dashed lines in Figures A to F show possible fill levels of the precursor or precursor composition. The initial fill level after packaging the precursor or precursor composition into a capsule according to the present disclosure can vary depending on, for example, the precursor properties, the application, and the usage amount in a given case and can be determined based on practical and economic considerations.

[0085] Figures A to D show a longitudinal cross-section of a precursor capsule 30. Figure A presents a spherical precursor capsule according to the present disclosure. Thus, the length and the width of the precursor capsule of this embodiment are equal. Figures B to D show progressively elongated embodiments of a precursor capsule 30, wherein the ratio of the width to the length is about 1 : 1.5 (Figure B), 1 :2 (Figure C), or 1 :3.7 (Figure D). In some embodiments, the ratio of the width to the length can be, for example, 1 :5, 1 :6, 1 :8, or 1 : 10. In Figure 3 In the example of Figure E, the cross-section of the precursor capsule can be circular. However, in some embodiments, the precursor capsule 30 can have an elliptical or angular cross-section, for example, a quadrilateral, pentagonal, or hexagonal. Figure E depicts a side view of a cylindrical embodiment of a precursor capsule 30. In Figure F, the cylindrical precursor capsule 30 is depicted as an isometric view.

[0086] Figures G through K depict some possible structural options for precursor capsules 30. In the embodiments of Figures G through K, the precursor capsules 30 are openable. The precursor capsules 30 of Figures G through K comprise two parts that are connectable to one another at a junction 33. In Figure G, one of the parts can be considered a cap 34, while in Figure H, the two parts of the precursor capsule 30 are of the same size. Thus, in the embodiment of Figure H, no cap part is designated. The junction 33 can comprise various attachment means (not shown), such as snap joints, complementary grooves, and the like, to hold the two parts of the precursor capsule 30 together.

[0087] Figure 3 Figures I and J of the drawings illustrate the possibility of the two parts of the capsule being oriented differently. In Figure I, the junction 33 is positioned transversely relative to the length of the capsule 30. In Figure J, the junction 33 is positioned along the length of the capsule 30. In Figure K, an embodiment of a precursor capsule 30 is depicted in which the two parts of the capsule 30 are held together by a hinge 35. In some embodiments, the two parts of the precursor capsule 30 can be separable from one another.

[0088] While Figures G through K depict only embodiments in which the precursor capsule 30 comprises two parts, the precursor capsule 30 can be constructed from more parts. However, in most embodiments, a capsule comprising two parts is the most likely cost-effective and easy-to-use option. Even if a capsule according to the present disclosure can be opened into two parts, each part can be constructed from more than one element that is attached to one another in a non-separable manner.

Claims

1. A precursor capsule for holding precursors for a vapor deposition process, wherein, The precursor capsules include: The shell is configured to limit the pre-body space, and therein, The outer shell is vapor-permeable to allow the precursor in vapor form to leave the precursor capsule under evaporative conditions. The casing described therein comprises metal.

2. The precursor capsule according to claim 1, wherein, The outer casing is configured to substantially retain the unevaporated precursor within the precursor space.

3. The precursor capsule according to claim 1, wherein, The outer shell includes an opening for the evaporating precursor to exit the precursor capsule.

4. The precursor capsule according to claim 1, wherein, The precursor capsule is configured to be loaded into a precursor container to perform a vapor deposition process.

5. The precursor capsule according to claim 3, wherein, The maximum cross-section of the opening is 50 μm to 50 mm.

6. The precursor capsule according to claim 3, wherein, At least 50% of the surface area of ​​the casing is vapor permeable.

7. The precursor capsule according to claim 1, wherein, The outer casing includes a coating.

8. The precursor capsule according to claim 1, wherein, The volume of the precursor space is 1 cm³. 3 Up to 20cm 3 .

9. The precursor capsule according to claim 1, wherein, The outer shell includes protrusions extending toward the interior of the precursor space.

10. The precursor capsule according to claim 1, wherein, The outer shell has a basically spherical shape.

11. The precursor capsule according to claim 1, wherein, The outer shell has a width and a length, and the ratio of the width to the length of the outer shell is from 1:1 to 1:

20.

12. The precursor capsule according to claim 1, wherein, The outer shell has a basic spherical-cylindrical shape.

13. The precursor capsule according to claim 1, wherein, The outer shell has a basically cylindrical shape.

14. The precursor capsule according to claim 1, wherein, The outer shell has a length and a width, with the length ranging from 1 cm to 20 cm.

15. The precursor capsule according to claim 1, wherein, The outer shell is configured and arranged to retain the solid precursor.

16. The precursor capsule according to claim 1, wherein, The outer shell has a length and a width, with the width ranging from 0.4 cm to 10 cm.

17. The precursor capsule according to claim 1, wherein, The outer shell is constructed and arranged to be openable to allow the precursor to be filled into the precursor capsule.

18. The precursor capsule according to claim 16, wherein, The outer shell is composed of components that can move relative to each other to open the precursor capsule.

19. A precursor container comprising at least two precursor capsules according to any one of the preceding claims.

20. The precursor container of claim 19, configured and arranged to operate at an evaporation temperature of 30°C to 500°C, and the material of the precursor capsule shell is selected to withstand the evaporation temperature.

21. A vapor deposition assembly including a precursor container comprising a precursor capsule according to any one of claims 1-18.

22. A method of loading a solid precursor into a precursor container, the method comprising providing a precursor capsule for holding a precursor in a vapor deposition process comprising a precursor composition, and At least two precursor capsules are inserted into the precursor container; wherein... The precursor capsule includes a shell configured to define a precursor space, and wherein, The outer shell is vapor-permeable to allow the precursor in vapor form to leave the precursor capsule under evaporative conditions. The housing includes a coating.

Images