Guide plate unit capable of dissipating heat and probe seat using the same

Abstract

The present invention relates to a guide plate unit capable of dissipating heat, comprising an outer guide plate, a metal heat dissipation layer and an inner guide plate stacked in sequence, the inner guide plate comprising a probe mounting block and a peripheral portion surrounding the probe mounting block, the peripheral portion comprising an inner connection surface for connecting with a guide plate and an outer connection surface located on the opposite side of the inner connection surface, the probe mounting block comprising a recessed portion recessed from the inner connection surface and a protruding portion protruding from the outer connection surface, so that the probe mounting block forms a step difference portion at the junction between the probe mounting block and the peripheral portion, the outer guide plate comprising a mounting groove and a supporting portion surrounding the mounting groove, the mounting groove being recessed from an inner surface of the supporting portion and accommodating the protruding portion of the inner guide plate, the metal heat dissipation layer being arranged between the peripheral portion of the inner guide plate and the supporting portion of the outer guide plate to achieve the heat dissipation function.

Description

Technical Field

[0001] The present invention relates to a guide plate unit of a probe seat of a probe card, in particular to a guide plate unit capable of dissipating heat, and a probe seat using the guide plate unit. Background Art

[0002] See also Figure 1 The conventional probe card mainly includes a probe head 10, a main circuit board 16, and a space converter 19 disposed between the main circuit board 16 and the probe head 10. The probe head 10 mainly includes a probe base 11 and a plurality of probes 12 (actually there are hundreds or even thousands of probes, only three probes are drawn as a representation). The probe base 11 usually includes a guide plate (such as a middle guide plate 13), and upper and lower guide plate units 14 and 15 respectively disposed on the upper and lower surfaces of the middle guide plate 13. The upper and lower guide plate units 14 and 15 usually respectively include an inner layer guide plate 142 and 152 connected to the middle guide plate 13, and an outer layer guide plate 144 and 154 connected to the inner layer guide plate 142 and 152, so as to avoid a single guide plate being too thick and difficult to drill. The inner and outer layer guide plates of each guide plate unit are usually glued to each other and then fixed to each other and to the middle guide plate 13 with bolts 17. In addition, the inner and outer guide plates 142, 152, 144, and 154 of the upper and lower guide plate units 14 and 15 are respectively provided with a plurality of probe holes 18 of quite small size for the probes 12 to pass through. The bottom end of each probe 12 protrudes below the lower guide plate unit 15 to touch the conductive contact of the object to be tested (not shown in the figure), and the top end of each probe 12 protrudes above the upper guide plate unit 14 and abuts against the conductive contact on the bottom surface of the space transformer 19 (not shown in the figure). Alternatively, there may be no space transformer 19, and the top end of each probe 12 is a conductive contact that directly abuts against the bottom surface of the main circuit board 16.

[0003] However, when the conventional probe head 10 is used for testing under high temperature conditions, the object to be tested will be heated to a specific temperature (e.g., above 100 degrees Celsius), and the heat energy will be transferred to the probe head 10 through conduction or radiation, especially the area closer to the object to be tested (e.g., the lower guide plate unit 15) will be heated more significantly. Moreover, the transmission of electrical signals between the probe 12 and the object to be tested will also generate some heat energy, which will also heat the guide plate. Taking the lower guide plate unit 15 as an example, the outer guide plate 154 is closer to the object to be tested, so the degree of heat it receives will be higher than that of the inner guide plate 152. In other words, there will be a temperature difference between the inner and outer guide plates 152, 154 when they are heated, so that the inner and outer guide plates 152, 154 will have different deformation amounts. Since the inner and outer guide plates 152, 154 are in surface contact with each other, the aforementioned difference in deformation amount will cause the inner and outer guide plates 152, 154 to warp, causing the probe 12 to be slightly skewed, thereby causing the needle tip position of the probe 12 to be misaligned. Summary of the invention

[0004] In view of the above problems, the main purpose of the present invention is to provide a guide plate unit for a probe seat, which has the function of heat dissipation, especially has the function of reducing the deformation effect of heat dissipation on the guide plate to ensure the needle tip position of the probe.

[0005] To achieve the above-mentioned purpose, the present invention provides a heat-dissipating guide plate unit, which is used to be arranged on a surface of a guide plate; the characteristic is that the guide plate unit includes: an outer guide plate, a metal heat dissipation layer and an inner guide plate, the inner guide plate, the metal heat dissipation layer and the outer guide plate are stacked in sequence from the surface of the guide plate; wherein: the inner guide plate includes a probe mounting block for allowing multiple probes to pass through, and a peripheral portion surrounding the probe mounting block, the peripheral portion has an inner connection surface for connecting with the guide plate, and an outer connection surface located on the opposite side of the inner connection surface, The probe mounting block has a recessed portion recessed from the inner connection surface, and a protruding portion protruding from the outer connection surface, so that the probe mounting block forms a step portion at the junction with the surrounding portion; the outer guide plate includes a mounting groove for each probe to pass through, and a supporting portion surrounding the mounting groove, the supporting portion has an inner surface, the mounting groove is recessed from the inner surface, the mounting groove is larger than the protruding portion of the inner guide plate, and the protruding portion is accommodated in the mounting groove; the metal heat dissipation layer is arranged between the surrounding portion of the inner guide plate and the supporting portion of the outer guide plate.

[0006] In the technical solution of the present invention, the metal heat dissipation layer includes a metal heat sink, which is configured in an integrated and ring-shaped manner around the protrusion, and the protrusion of the probe mounting area of ​​the inner guide plate is located in the space surrounded by the metal heat sink.

[0007] The metal heat dissipation layer includes a plurality of metal heat dissipation fins that can be separated from each other. Adjacent metal heat dissipation fins abut against each other without gaps, or there is a gap between adjacent metal heat dissipation fins.

[0008] The inner guide plate has a plurality of protrusions, the metal heat dissipation layer includes a peripheral unit surrounding each of the protrusions, and at least one reinforcing rib extending from the peripheral unit toward the space surrounded by the peripheral unit, the at least one reinforcing rib divides the space surrounded by the peripheral unit into a plurality of areas, and at least one protrusion is arranged in each of the areas.

[0009] The metal heat dissipation layer has an outer periphery and a notch located at the outer periphery. The notch penetrates an upper surface and a lower surface of the metal heat dissipation layer, or the notch is recessed from the upper surface or the lower surface of the metal heat dissipation layer.

[0010] The probe installation block of the inner guide plate includes a penetration portion for each of the probes to pass through, the step portion is located between the penetration portion and the surrounding portion, and the thickness of the penetration portion is smaller than the thickness of the surrounding portion.

[0011] The height of the step portion of the inner layer guide plate is greater than the height of the protruding portion of the inner layer guide plate.

[0012] The thickness of the peripheral portion of the inner layer guide plate is smaller than the thickness of the supporting portion of the outer layer guide plate.

[0013] The thickness of the metal heat dissipation layer is smaller than the height of the step portion.

[0014] The sum of the thickness of the metal heat dissipation layer and the thickness of the peripheral portion of the inner layer guide plate is smaller than the height of the step portion or the height of the protruding portion.

[0015] The metal heat dissipation layer includes two metal heat sinks, each of which includes two blocks perpendicular to each other, and each block is respectively located on the four sides of the protruding portion of the inner guide plate, or the metal heat dissipation layer includes four metal heat sinks, and each of which is respectively located on the four sides of the protruding portion of the inner guide plate.

[0016] The metal heat dissipation layer is made into an integral body and is in a ring shape. The metal heat dissipation layer has a plurality of pre-tear lines, each of which divides the metal heat dissipation layer into a plurality of metal heat dissipation fins and enables the metal heat dissipation fins to be separated from each other; a plurality of metal heat dissipation layers are arranged between the inner guide plate and the outer guide plate, each of the metal heat dissipation layers has an outer peripheral edge and a notch located at the outer peripheral edge and adjacent to a pre-tear line, and the notches of adjacent metal heat dissipation layers are located at non-corresponding positions.

[0017] At least a portion of the metal heat dissipation layer is spaced apart from the protruding portion of the inner layer guide plate by a gap.

[0018] The metal heat dissipation layer is made into an integral and ring-shaped body to enclose a hollow portion. The protrusion of the probe mounting block of the inner guide plate is located in the hollow portion of the metal heat dissipation layer. The metal heat dissipation layer has an inner periphery defining the hollow portion, an outer periphery, and a pre-tear line extending from the inner periphery to the outer periphery.

[0019] There is a gap between the protruding portion of the inner layer guide plate and the mounting groove of the outer layer guide plate, and the height of the gap is greater than the thickness of the metal heat dissipation layer.

[0020] The guide plate unit capable of dissipating heat is arranged on the surface of the guide plate facing an object to be tested.

[0021] The present invention also provides a probe seat, characterized in that it includes: a guide plate, having an upper surface and a lower surface facing opposite directions, and a accommodating hole penetrating the upper surface and the lower surface, and the lower surface faces an object to be tested; an upper guide plate unit and a lower guide plate unit, which are respectively arranged on the upper surface and the lower surface of the guide plate; wherein at least one of the upper guide plate unit and the lower guide plate unit is a guide plate unit that can dissipate heat as described above, and the recessed portion of the inner guide plate and the accommodating hole of the guide plate together form a probe accommodating space.

[0022] Wherein, the lower guide plate unit is the guide plate unit capable of dissipating heat.

[0023] Therefore, when the probe head equipped with the guide plate unit performs detection operations under high temperature conditions, the heat energy near the center of the probe head (that is, the inside of the probe head) can be transferred to the periphery of the probe head and contact the external environment through the metal heat dissipation layer, thereby achieving the function of improving heat dissipation.

[0024] However, in order to improve the heat dissipation function of the probe head, after a metal heat dissipation layer is set between the inner guide plate and the outer guide plate, the thickness of the guide plate unit (such as the guide plate unit on the side of the middle guide plate close to the object to be tested) will increase. At this time, in order to ensure the amount of protrusion of the probe downward from the lower guide plate unit, the length of the probe needs to be lengthened. However, once the probe becomes longer, it will affect its electrical characteristics (such as high-frequency characteristics) and mechanical geometry performance. In other words, a probe that is too long will destroy the original electrical and mechanical specification design. In addition, the so-called overall depth of the probe seat refers to the longitudinal dimension protruding beyond the lower surface of the substrate (the main circuit board of the probe card), which is limited by the hardware specifications of the test machine and has an upper limit. Therefore, the overall depth of the probe seat, together with the length of the probe, should be avoided from increasing due to the setting of the metal heat dissipation layer.

[0025] Therefore, the inventor of this case further reviewed and found that in order to ensure the amount of the probe protruding downward from the bottom of the probe seat, the probe length must match the depth of the probe seat (the distance from the bottom surface of the main circuit board of the probe card to the bottom surface of the probe seat), and the probe length will affect its high-frequency characteristics. The depth of the probe seat is limited by the test machine, so the depth of the probe seat should not be increased by setting a metal heat dissipation layer. Thus, a method that can solve the above-mentioned problems was discovered, and the following invention was considered.

[0026] The guide plate unit of the present invention can be applied to a probe seat, which is used to insert a probe to form a probe head. When the probe head performs a detection operation under high temperature conditions, heat energy is generated due to the transmission of electrical signals by the probe, or when the object to be tested is heated and the probe head is heated, the metal heat dissipation layer can transfer the heat energy inside the probe head to the periphery of the probe head, thereby achieving the function of heat dissipation.

[0027] Moreover, the present invention can ensure the thickness of the inner and outer guide plates after being combined through the structural design that the outer guide plate has a mounting groove and the inner guide plate has a step portion. This can avoid the required length of the probe being increased, which would affect its high-frequency characteristics, and avoid the probe seat being too deep due to the installation of a metal heat dissipation layer and not meeting the model specification requirements of various manufacturers.

[0028] In addition, after the metal heat dissipation layer is set, when installing the metal heat sink, the problem of the probe being damaged may occur due to improper installation of the metal heat sink (for example, too deep into the probe installation block). Therefore, the probe installation block of the inner guide plate has a protrusion, so that the metal heat dissipation layer can only be located at the periphery of the probe installation block or against the side of the protrusion and cannot enter the probe installation block, thereby preventing the metal heat dissipation layer (metal heat sink) from touching the probe when being removed or installed by the user.

[0029] Thus, the heat dissipating guide plate unit provided by the present invention can not only reduce the influence of heat energy on the guide plate deformation, but also allow the probe seat to maintain the required depth to meet the requirements of the test machine and avoid the required length of the probe to be increased to ensure its high frequency characteristics.

[0030] The metal heat dissipation layer in the present invention may include a plurality of metal heat dissipation sheets that can be separated from each other, and each of the metal heat dissipation sheets can be arranged in a manner of surrounding the protrusion together, so that the protrusion of the probe mounting block of the inner guide plate is located in the space surrounded by the metal heat dissipation sheets. Such a metal heat dissipation layer not only has a good heat dissipation effect, but also the metal heat dissipation layer is arranged around the outer periphery of the protrusion of the inner guide plate, which can generate good support between the inner and outer guide plates and avoid uneven thickness of the probe seat.

[0031] The metal heat dissipation layer in the present invention can be composed of a plurality of metal heat dissipation fins that can be directly separated from each other, so that the user can directly remove the metal heat dissipation fins of the metal heat dissipation layer after disassembling the fixing parts of the probe seat, and can install a metal heat dissipation layer with different heat dissipation performance. However, the metal heat dissipation layer in the present invention can also be made into an integral and annular shape, and have a plurality of pre-tear lines to divide the metal heat dissipation layer into a plurality of metal heat dissipation fins, that is, each of the metal heat dissipation fins is originally connected into one body, and the user can tear the metal heat dissipation layer along each of the pre-tear lines to separate each of the metal heat dissipation fins from each other. Alternatively, the metal heat dissipation layer in the present invention may not be composed of a plurality of metal heat dissipation fins, but is made into an integral and annular shape to enclose a hollow portion, so that the protruding portion of the probe mounting block of the inner layer guide plate is located in the hollow portion, and the metal heat dissipation layer has an inner periphery defining the hollow portion, an outer periphery, and a pre-tear line extending from the inner periphery to the outer periphery, so that the user can tear the metal heat dissipation layer along the pre-tear line and then remove the metal heat dissipation layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1is a cross-sectional schematic diagram of a conventional probe card;

[0033] Figure 2 and Figure 3 They are respectively a three-dimensional assembly diagram and a three-dimensional exploded diagram of a probe seat provided by a first preferred embodiment of the present invention;

[0034] Figure 4 and Figure 5 They are Figure 2 Sectional views along section lines 4-4 and 5-5;

[0035] Figure 6 is a top view of a metal heat dissipation layer of a probe seat of the present invention;

[0036] Figures 7 to 13 It is the top view of other different forms of metal heat dissipation layers;

[0037] Fig.14 It is generally a middle guide plate, an inner guide plate and similar Figure 6 The bottom view of the metal heat dissipation layer is shown, and the disassembly positioning holes are lightly displayed at different positions;

[0038] Fig.15 It is a bottom view of a middle guide plate, an inner guide plate and a metal heat dissipation layer of a probe seat provided by a second preferred embodiment of the present invention;

[0039] Figures 16 to 20 Similar to Fig.15 , but showing other different forms of metal heat dissipation layers;

[0040] Fig.21 and Fig. 22 Respectively similar to Fig.14 and Fig.16 , but the disassembly positioning holes are shown to be located at different positions;

[0041] Fig.23A and Fig. 23B Similar to Figure 6 , but showing different morphologies of the metal heat sink layer;

[0042] Fig.24 is a chart of a simulation result of the present invention;

[0043] Fig.25 This is a top view of another form of the metal heat sink layer. DETAILED DESCRIPTION

[0044] The following embodiments are given in conjunction with the accompanying drawings to illustrate the detailed structure, characteristics, assembly or use of the present invention in detail.

[0045] The applicant first explains that in the embodiments and drawings to be introduced below, the same reference numbers represent the same or similar elements or their structural features. It should be noted that the elements and structures in the drawings are for illustration purposes only and are not drawn according to the actual proportions and quantities, and if it is possible in practice, the features of different embodiments can be applied interchangeably. Secondly, when it is mentioned that an element is disposed on another element, it means that the aforementioned element is directly disposed on the other element, or the aforementioned element is indirectly disposed on the other element, that is, one or more other elements are disposed between the two elements. When it is mentioned that an element is "directly" disposed on another element, it means that no other elements are disposed between the two elements.

[0046] Please read first Figures 2 to 5 As shown, the probe seat 20 provided in a first preferred embodiment of the present invention mainly includes a guide plate (such as the middle guide plate 30 ) and two guide plate units (ie, an upper guide plate unit 40A and a lower guide plate unit 40B).

[0047] In this embodiment, the middle guide plate 30 is rectangular and has two surfaces facing opposite directions (i.e., an upper surface 31 and a lower surface 32), a rectangular receiving hole 33 located in the center of the middle guide plate 30 and penetrating the upper and lower surfaces 31 and 32, and a plurality of screw holes 34, 35 and through holes 36, 37 arranged around the periphery of the receiving hole 33. The middle guide plate 30 is used to carry the upper guide plate unit 40A and the lower guide plate unit 40B, and provides good supporting rigidity for the upper guide plate unit 40A and the lower guide plate unit 40B.

[0048] The upper and lower guide plate units 40A, 40B of this embodiment respectively include an inner guide plate 41, an outer guide plate 42, and four fixing members 60. Each inner and outer guide plate 41, 42 is rectangular and smaller in size than the middle guide plate 30. Each fixing member 60 is a bolt. Each inner guide plate 41 includes a probe mounting block 413 and a peripheral portion 417 surrounding the probe mounting block 413. The peripheral portion 417 has an outer connecting surface 411 and an inner connecting surface 412 facing opposite directions. The probe mounting block 413 has a rectangular protrusion 414 protruding from the outer connecting surface 411, and a rectangular recessed portion 415 recessed from the inner connecting surface 412. The position of the recessed portion 415 corresponds to the protrusion 414 and the size is smaller than the protrusion 414, so that the probe mounting block 413 forms a step portion 413a at the junction between it and the peripheral portion 417. Each inner guide plate 41 also has a plurality of fixing holes 416 and through holes 418, 419 arranged around the periphery of the probe mounting block 413. Each outer guide plate 42 includes an inner surface 421, an outer surface 422, a mounting groove 423, and a support portion 425 surrounding the mounting groove 423. The inner surface 421 and the outer surface 422 face opposite directions. Specifically, the inner surface 421 is the outer connecting surface 411 facing the inner guide plate 41. The mounting groove 423 is recessed from the inner surface 421 and is rectangular. The mounting groove 423 is larger than the protrusion 414 of the inner guide plate 41 and is used to accommodate the protrusion 414. Each outer guide plate 42 also has a plurality of fixing holes (countersunk holes) 424 and through holes 426 and 427 arranged around the periphery of the mounting groove 423.

[0049] The upper guide plate unit 40A is arranged in such a way that the inner connecting surface 412 of the inner guide plate 41 is connected to the upper surface 31 of the middle guide plate 30, and the inner surface 421 of the outer guide plate 42 is connected to the outer connecting surface 411 of the inner guide plate 41, and the protrusion 414 of the inner guide plate 41 is located in the installation groove 423 of the outer guide plate 42, and each fixing part 60 passes through the fixing hole 424 of the outer guide plate 42 and the fixing hole 416 of the inner guide plate 41 and is screwed to the screw hole 34 of the middle guide plate 30, thereby, the inner and outer guide plates 41, 42 of the upper guide plate unit 40A can be detachably fixed to each other and can be detachably fixed to the upper surface 31 of the middle guide plate 30.

[0050] The lower guide plate unit 40B is disposed on the lower surface 32 of the middle guide plate 30 in a similar manner to the upper guide plate unit 40A. The lower surface 32 refers to the surface close to the side of the object to be measured, that is, the lower surface 32 faces the object to be measured (not shown in the figure), but a metal heat dissipation layer 70 is also disposed between the inner and outer guide plates 41, 42 of the lower guide plate unit 40B. The metal heat dissipation layer 70 is disposed between the peripheral portion 417 of the inner guide plate 41 and the supporting portion 425 of the outer guide plate 42. In other words, the lower guide plate unit 40B is connected to the lower surface 32 of the middle guide plate 30 by the inner connecting surface 412 of the inner guide plate 41 and the outer connecting surface 411 is connected to the metal heat dissipation layer 70, and is connected to the metal heat dissipation layer 70 by the inner surface 421 of the outer guide plate 42, and the protrusion 414 of the inner guide plate 41 is located in the mounting groove 423 of the outer guide plate 42. Figure 4 and Figure 5As shown, there is a gap between the protrusion 414 of the inner guide plate 41 and the mounting groove 423 of the outer guide plate 42, and the height H1 of the gap is greater than the thickness T1 of the metal heat dissipation layer 70, but it is not limited thereto. For example, the height H1 of the gap may also be less than the thickness T1 of the metal heat dissipation layer 70. The probe mounting block 413 of the inner guide plate 41 includes a through-set portion 413b for the probe to pass through, and the step portion 413a is located between the through-set portion 413b and the surrounding portion 417. The thickness T2 of the through-set portion 413b is preferably less than the thickness T3 of the surrounding portion 417. In this way, since the thickness T3 of the surrounding portion 417 can be ensured to maintain its support strength, it is also possible to avoid the through-set portion 413b of the probe mounting block 413 being too thick to be difficult to drill. Thus, the depth of the probe seat can be kept unchanged, and the installation space (thickness) of the metal heat sink can be increased, and the support strength and the ease of drilling can be ensured at the same time. The height H2 of the step portion 413a of the inner guide plate 41 is preferably greater than the height H3 of the protrusion 414 of the inner guide plate 41 (i.e., the height of the side 414a of the protrusion), thereby ensuring that a larger probe accommodating space 22 is obtained, and at the same time, the installation space (thickness) of the metal heat sink can be increased without changing the depth of the probe seat, and at the same time, the thickness T3 of the thicker surrounding portion 417 and the thickness T2 of the thinner penetration portion 413b of the probe mounting block 413 can be matched to ensure that the support strength of the surrounding portion 417 and the ease of drilling of the penetration portion 413b of the probe mounting block 413 are satisfied at the same time. The thickness T2 of the penetration portion 413b of the probe mounting block 413 of the inner guide plate 41 is preferably less than the height H2 of the step portion 413a, and the height H2 of the step portion 413a is preferably greater than the thickness T3 of the surrounding portion 417. The thickness T3 of the peripheral portion 417 of the inner guide plate 41 is preferably smaller than the thickness T4 of the support portion 425 of the outer guide plate 42, thereby ensuring that the depth of the probe seat remains unchanged and the installation space (thickness) of the metal heat sink is increased. The thickness T1 of the metal heat dissipation layer 70 is preferably smaller than the height H2 of the step portion 413a, thereby ensuring that the depth of the probe seat remains unchanged and the installation space (thickness) of the metal heat dissipation layer 70 is increased. The thickness T1 of the metal heat dissipation layer 70 is preferably smaller than the thickness of the inner guide plate 41 (equivalent to the thickness T2 of the probe mounting block 413) and is preferably smaller than the thickness of the outer guide plate 42 (equivalent to the thickness T4 of the support portion 425), thereby ensuring the depth of the probe seat. The sum of the thickness T1 of the metal heat dissipation layer 70 and the thickness T3 of the peripheral portion 417 of the inner guide plate 41 is smaller than the height H2 of the step portion or the height H3 of the protrusion 414. Specifically, the sum of the thickness T1 of the metal heat dissipation layer 70 and the thickness T3 of the peripheral portion 417 of the inner layer guide plate 41 is less than the height H3 of the protrusion 414 of the inner layer guide plate 41 (i.e., the height of the side 414a of the protrusion 414). This ensures that the installation space (thickness) of the metal heat sink is increased while the depth of the probe seat remains unchanged.

[0051] The metal heat dissipation layer 70 of the present embodiment includes two metal heat dissipation fins 71 that can be separated from each other. The two metal heat dissipation fins 71 have the same shape and surround a space 75 (hereinafter also referred to as a hollow portion 75). Figure 6 As shown, each metal heat sink 71 includes a first block 711 with a larger width and a rectangular shape, a second block 712 with a smaller width and vertically connected to the first block 711, and an exposed portion 713 protruding from both ends of the second block 712 in the same direction, so as to roughly form an L shape. Each of the first and second blocks 711, 712 is provided with a fixing hole 72 and a through hole 73, and each of the exposed portions 713 is provided with a through hole 74. When the metal heat dissipation layer 70 is disposed between the inner and outer guide plates 41, 42, the protruding portion 414 of the probe mounting block 413 of the inner guide plate 41 is located in the hollow portion 75 of the metal heat dissipation layer 70, so that each of the first and second blocks 711, 712 is respectively located at the four sides 414a to 414d of the protruding portion 414 of the inner guide plate 41, as shown in FIG. Figure 4 and Figure 5 The fixing member 60 of the lower guide plate unit 40B passes through the fixing hole 424 of the outer guide plate 42, the fixing hole 72 of the metal heat dissipation layer 70 and the fixing hole 416 of the inner guide plate 41 and is screwed to the screw hole 35 of the middle guide plate 30, thereby, the inner and outer guide plates 41, 42 and the metal heat dissipation layer 70 of the lower guide plate unit 40B are detachably fixed to each other and detachably fixed to the lower surface 32 of the middle guide plate 30.

[0052] It is worth mentioning that the "multiple metal heat sinks that can be separated from each other" mentioned in the present invention include: Figures 6 to 8 and Figures 14 to 23B The metal heat sinks 71, 71A-I shown in the figure are directly separated from each other (i.e., there is a gap G between adjacent metal heat sinks 71, 71A-I), and also include a form in which the metal heat sinks 71, 71A-I are not spaced apart but are in contact with each other but can still be directly separated (not shown in the figure), and also include the form in which the metal heat sinks 71, 71A-I are spaced apart from each other (i.e., there is a gap G between adjacent metal heat sinks 71, 71A-I). Figures 9 to 11 The metal heat dissipation layer 70 shown is provided with a pre-tear line 76 so that the user can tear it into a plurality of metal heat dissipation sheets 77A, 77B, 77C (described in detail below). However, the metal heat dissipation layer of the present invention is not limited to comprising a plurality of metal heat dissipation sheets, for example Fig.25 The metal heat dissipation layer 70 shown only includes a metal heat sink, which is configured in an integrated and ring-shaped manner around the protrusion 414, so that the protrusion 414 of the probe mounting block 413 of the inner guide plate 41 is located in the space 75 surrounded by the metal heat sink. Such a metal heat dissipation layer 70 can be disassembled and assembled without setting the fixing part 60 and the outer guide plate 42.

[0053] After the probe seat 20 is assembled in the above manner, the through holes 426 of the outer guide plate 42 of the upper and lower guide plate units 40A and 40B, the through holes 418 of the inner guide plate 41, the through holes 36 of the middle guide plate 30, and the through holes 73 of the metal heat dissipation layer 70 together form four disassembly positioning holes 21 (such as Figure 2 In addition, the through hole 427 of the outer layer guide plate 42 of the upper guide plate unit 40A, the through hole 419 of the inner layer guide plate 41 of the upper and lower guide plate units 40A and 40B, the through hole 37 of the middle guide plate 30, and the through hole 74 of the metal heat dissipation layer 70 together constitute four installation positioning holes 23 (as shown in FIG. Figure 2 As shown), the four corners of the outer guide plate 42 of the lower guide plate unit 40B are provided with chamfers 428 corresponding to the mounting positioning holes 23, so the exposed portions 713 of the metal heat dissipation layer 70 where the mounting positioning holes 23 are provided are not connected to the outer guide plate 42 and are exposed to the outside.

[0054] like Figure 4 and Figure 5 As shown, the recessed portion 415 of the inner guide plate 41 of the upper and lower guide plate units 40A and 40B and the accommodating hole 33 of the middle guide plate 30 jointly form a probe accommodating space 22. In addition, the inner guide plate 41 of the upper and lower guide plate units 40A and 40B also has a plurality of inner probe holes (not shown in the figure) located in the recessed portion 415 and penetrating the protruding portion 414, and the mounting groove 423 of the outer guide plate 42 has a plurality of outer probe holes (not shown in the figure) respectively connected to the inner probe holes, for allowing a plurality of probes (not shown in the figure) to be installed on the probe seat 20 in a manner of passing through the inner and outer probe holes of the upper and lower guide plate units 40A and 40B and being partially accommodated in the probe accommodating space 22. This part is less related to the technical features of the present invention. In order to simplify the drawings and facilitate explanation, the inner and outer probe holes and probes of the upper and lower guide plate units 40A and 40B are not shown in the drawings.

[0055] As can be seen from the above content, the structures of the upper and lower guide plate units 40A and 40B are similar to each other, but the lower guide plate unit 40B in this embodiment has a metal heat dissipation layer 70 compared to the upper guide plate unit 40A. Such structural features make the lower guide plate unit 40B a guide plate unit that can dissipate heat. Since each guide plate is usually made of ceramic material, its thermal conductivity is poor, while the metal heat dissipation layer 70 can achieve the effect of heat dissipation due to the good thermal conductivity of metal material. When the probe head generates heat energy due to the transmission of electrical signals by the probe, or when the object to be measured is heated and the probe head is heated, the metal heat dissipation layer 70 can transfer the heat energy inside the probe head to the periphery of the probe head, thereby achieving the function of heat dissipation. However, the probe seat 20 of the present invention can also be designed so that the upper guide plate unit 40A is a guide plate unit that can dissipate heat as described above, or the upper and lower guide plate units 40A and 40B can both be guide plate units that can dissipate heat as described above. However, the lower guide plate unit 40B is closer to the object to be tested and will be heated more obviously, so the lower guide plate unit 40B is a guide plate unit capable of dissipating heat as described above, which can achieve better heat dissipation effect. In addition, the probe seat 20 of the present invention is not limited to including the middle guide plate 30, and the non-heat dissipating guide plate units in the upper and lower guide plate units 40A and 40B only need to include at least one guide plate. It can be seen that the guide plates of the probe seat 20 of the present invention can only include the inner and outer guide plates 41 and 42 sandwiching the metal heat dissipation layer 70 therebetween, and another guide plate (in this embodiment, the middle guide plate 30) connected to the inner guide plate 41, that is, the probe seat 20 of the present invention only needs to include at least three guide plates.

[0056] Taking the lower guide plate unit 40B of this embodiment as an example of a guide plate unit capable of dissipating heat, when there is an application requirement to replace the metal heat dissipation layer 70, the user can first set the probe seat 20 on a fixture (not shown in the figure), and insert four positioning pins (not shown in the figure) into the four disassembly positioning holes 21 respectively, so that the guide plates 41, 42, and 30 will not move relative to each other due to the following disassembly and assembly operations. Then, the user can remove the fixing member 60 of the lower guide plate unit 40B to release the mutual fixing relationship between the inner and outer guide plates 41, 42 and the metal heat dissipation layer 70 of the lower guide plate unit 40B. Then, the user can insert a tool (not shown in the figure) from the chamfered corner 428 of the outer guide plate 42 of the lower guide plate unit 40B into the through hole 74 of the exposed portion 713 of the metal heat dissipation sheet 71, and then pull the metal heat dissipation sheet 71 out from between the inner and outer guide plates 41, 42. It should be noted that, since the metal heat dissipation layer 70 of the present embodiment includes two metal heat dissipation sheets 71, and the two metal heat dissipation sheets 71 can be positioned by positioning pins respectively, before the user takes out one of the metal heat dissipation sheets 71, the positioning pin inserted in the metal heat dissipation sheet 71 can be removed first, so that the metal heat dissipation sheet 71 can be separated from the inner and outer layer guide plates 41 and 42 and taken out, and at this time, the positioning pin inserted in the other metal heat dissipation sheet 71 can still prevent the guide plate from being displaced. Alternatively, the metal heat dissipation layer 70 can also be designed so that each metal heat dissipation sheet 71 leaves room for the positioning pin to pass through, so there may be gaps between each metal heat dissipation sheet 71, and they will not fit completely, that is, the position of the disassembly positioning hole 21 does not correspond to the metal heat dissipation sheet 71, for example Fig.14 In the embodiment shown, each metal heat sink 71 is not provided with the aforementioned through hole 73, and the position of the through holes 36, 418, 426 for the positioning pins to pass through each guide plate 30, 41, 42 (i.e., the position of the disassembly positioning hole 21) corresponds to the gap G between the two metal heat sinks 71, i.e. Fig.14 The positions of the two through holes 418 shown in the figure (the number is not limited, as long as they can be set in the gaps G between the metal heat sinks 71), so that there is no need to remove part of the positioning pins during the process of removing each metal heat sink 71.

[0057] After removing the metal heat sink 71, the user can directly reinstall the fixing parts 60 of the upper and lower guide plate units 40B to fix the inner and outer guide plates 41, 42 to each other again, which will reduce the thickness of the original metal heat sink layer 70 of the probe seat 20; or, the user can install another metal heat sink layer 70 with a structure similar to the original metal heat sink layer 70 between the inner and outer guide plates 41, 42, and then use another four positioning pins (not shown in the figure) to be inserted into the four installation positioning holes 23 respectively to accurately position the metal heat sink 71 of the replaced metal heat sink layer 70, and then install the fixing parts 60 of the upper and lower guide plate units 40B to fix the inner and outer guide plates 41, 42 and the replaced metal heat sink layer 70 to each other, and by replacing different metal heat sink layers 70, the heat dissipation performance of the probe seat 20 can be changed as needed. It is worth mentioning that when the metal heat sink 71 is provided with the aforementioned through hole 73, that is, when the disassembly positioning hole 21 passes through the metal heat sink 71, the disassembly positioning hole 21 can also be used as the aforementioned installation positioning hole without providing an additional installation positioning hole. However, in the form with the aforementioned installation positioning hole 23, the through hole 74 of the metal heat sink 71 is not blocked by the outer guide plate 42 and can be directly seen by the user, which makes it easier for the user to install and position the metal heat sink 71, and as mentioned above, it is convenient to use the through hole 74 to remove the metal heat sink 71.

[0058] Since the probe mounting block 413 of the inner guide plate 41 has a protrusion 414, the metal heat dissipation layer 70 can be designed so that at least a portion of each metal heat sink 71 abuts against the protrusion 414 of the inner guide plate 41. Therefore, the user only needs to make the first block 711 of the metal heat sink 71 abut against the protrusion 414 to know that the metal heat sink 71 is roughly installed in the correct position, but the present invention is not limited to the above design. In order to avoid the interference between the metal heat sink 71 and the protrusion 414 of the inner guide plate 41 due to processing tolerance, at least a portion of each metal heat sink 71 does not abut against the protrusion 414 of the inner guide plate 41, for example Figure 4 As shown, the second block 712 of the two metal heat sinks 71 of this embodiment is respectively separated from the side edges 414a and 414b of the protruding portion 414 of the inner layer guide plate 41 by a gap d. Figure 5 As shown, a small gap is also left between the first block 711 of the two metal heat sinks 71 of this embodiment and the side edges 414c, 414d of the protrusion 414 of the inner layer guide plate 41. The first block 711 of each metal heat sink 71 can also be designed as follows: Figure 7The protrusion 414 of the inner guide plate 41 not only has the function of positioning the metal heat sink 71 as mentioned above, but also has the side edges 414a-414d of the protrusion 414 as a protective wall around the periphery of the probe, so that the metal heat sink 71 can only be located outside the probe installation block 413 or against the side edges 414a-414d of the protrusion 414 and cannot enter the probe installation block 413, so as to prevent the metal heat sink 71 from touching the probe when being removed or installed by the user.

[0059] In addition, in order to ensure the amount of the probe protruding downward from the bottom of the probe seat, the length of the probe needs to match the depth of the probe seat (the distance from the bottom surface of the main circuit board of the probe card to the bottom surface of the probe seat), and the length of the probe will affect its high-frequency characteristics. The depth of the probe seat is limited by the test machine, so the depth of the probe seat should not be increased due to the installation of the metal heat dissipation layer. The present invention has a structural design of an outer guide plate 42 with a mounting groove 423 and an inner guide plate 41 with a step portion 413a, so that the thickness of the inner and outer guide plates 41, 42 can be smaller than the conventional ones, so as to avoid the installation of the metal heat dissipation layer 70 causing the depth of the probe seat 20 to be too large and not meet the requirements. In other words, the heat-dissipating guide plate unit of the present invention can not only reduce the influence of heat energy on the deformation of the guide plate, but also allow the probe seat to maintain the required depth to meet the requirements of the test machine and avoid changing the length of the probe.

[0060] The above-mentioned method of removing or replacing the metal heat dissipation layer 70 allows the user to quickly and easily adjust the heat dissipation function of the probe seat 20. The above-mentioned adjustment process does not require the removal of the guide plate or the probe, which not only has high operating efficiency, but also does not change the motion range of the probe, and can ensure consistent needle test performance. Each metal heat sink 71 can be made using a high-precision processing method to finely maintain the depth of the probe seat 20, and the metal heat sink 71 can have good structural strength to enhance the overall structural strength of the probe seat 20.

[0061] From the foregoing, it can be seen that the present invention achieves the function of heat dissipation by providing a metal heat dissipation layer 70 sandwiched between the inner and outer guide plates 41, 42 in at least one of the upper and lower guide plate units 40A, 40B. The metal heat dissipation layer 70 of the present invention is arranged around the periphery of the protrusion 414 of the inner guide plate 41, rather than being U-shaped or other structures that are open on one side or multiple sides. Therefore, the metal heat dissipation layer 70 of the present invention can generate good support between the inner and outer guide plates 41, 42 and avoid uneven thickness of the probe seat 20. Figure 6 and Figure 7 The metal heat sink 70 is formed of two metal heat sinks 71 and is roughly a square ring. The metal heat sink 71 can be removed or replaced by the user without removing the guide plate of the probe seat 20. The number and position distribution of the metal heat sink 71 of the metal heat sink layer 70 are not limited and can be adjusted according to needs, for example Figure 8 The metal heat dissipation layer 70 shown in the figure includes four metal heat dissipation fins 71A and 71B, and its shape design is like Figure 6 The first and second blocks 711 and 712 of the metal heat sink 71 are disassembled into different metal heat sinks 71A and 71B. Figure 8 When the metal heat dissipation layer 70 is disposed between the inner and outer guide plates 41 , 42 , the four metal heat dissipation fins 71A, 71B are respectively located on the four side edges 414 a - 414 d of the protruding portion 414 of the inner guide plate 41 .

[0062] like Figures 6 to 8 and Figures 14 to 23B The metal heat dissipation layer 70 shown is composed of a plurality of metal heat dissipation sheets that can be directly separated from each other, so that the user can directly remove the metal heat dissipation sheets after removing the fixing member 60, and can install a different metal heat dissipation layer 70. However, in the case where there is only a need to remove the metal heat dissipation layer 70 and no need to install the metal heat dissipation layer 70 again, the metal heat dissipation layer 70 in the present invention can also be made into an integral and ring-shaped body, for example Figures 9 to 11 The metal heat dissipation layer 70 shown is in an integral square ring shape and has a plurality of pre-tear lines 76 formed by pre-punching. Each pre-tear line 76 divides the metal heat dissipation layer 70 into a plurality of metal heat dissipation sheets. The number and position distribution of the pre-tear lines 76 and the metal heat dissipation sheets are not limited and can be adjusted according to needs, for example Fig. 9 and Fig.10 The metal heat dissipation layer 70 includes four pre-tear lines 76 and four metal heat dissipation sheets 77A and 77B separated by the pre-tear lines 76. Fig. 9 and Fig.10 The positions of the pre-tear lines 76 and the metal heat sinks 77A and 77B of the metal heat sink layer 70 are distributed differently. Fig.11 The metal heat dissipation layer 70 only includes two pre-tear lines 76 and two metal heat dissipation sheets 77C separated by the two pre-tear lines 76. When there is an application need to remove the metal heat dissipation layer 70, the user can tear the metal heat dissipation layer 70 along the pre-tear lines 76 after removing the fixing member 60, so that the metal heat dissipation sheets originally connected as one are separated from each other, and then take out each metal heat dissipation sheet.

[0063] The probe seat 20 of the present invention may also be provided with a plurality of metal heat dissipation layers 70 between the inner and outer guide plates 41 and 42, so that the user can replace the metal heat dissipation layers 70 in batches. Fig.11 The figure shows two metal heat dissipation layers 70 which are simultaneously arranged between the inner and outer guide plates 41 and 42, wherein each metal heat dissipation layer 70 has a notch 782 located at its outer periphery 78 and adjacent to a pre-tear line 76, and the notches 782 of adjacent metal heat dissipation layers 70 are located at non-corresponding positions. This design makes it easy for the user to tear open and remove a single metal heat dissipation layer 70.

[0064] See also Fig.12 and Fig.13 , wherein the metal heat dissipation layer 70 shown is similar to Figures 9 to 11 The metal heat dissipation layer 70 shown is made into an integral and annular shape and surrounds a hollow portion 75, but Fig.12 and Fig.13 The metal heat dissipation layer 70 shown in the figure only includes a single pre-tear line 76, and the pre-tear line 76 extends from an inner periphery 79 of the metal heat dissipation layer 70 defining the hollow portion 75 to an outer periphery 78, wherein Fig.12 The pre-tear line 76 of the metal heat dissipation layer 70 is provided at a location where no fixing hole 72 or through hole 73 is provided. Fig.13 The pre-tear line 76 of the metal heat dissipation layer 70 passes through the fixing hole 72 for the fixing member 60 to pass through and the through hole 73 for the positioning pin to pass through (i.e., through the disassembly positioning hole 21 as described above). Thus, the user can tear the metal heat dissipation layer 70 along the pre-tear line 76 and then take the metal heat dissipation layer 70 out from between the inner and outer layer guide plates 41, 42.

[0065] The various forms of the metal heat dissipation layer 70 provided by the present invention can also be applied to the probe head of a probe card for simultaneously detecting multiple DUTs (multi-DUT) through the following changes, for example Fig.15 In a second preferred embodiment of the present invention, the metal heat dissipation layer 70 is similar to Figure 8 The main difference of the metal heat dissipation layer 70 is Fig.15 Each of the metal heat sinks 71A and 71B includes a Figure 8 The main block 714 is similar to the metal heat sink in the embodiment of the present invention, and further includes a reinforcing rib 715 integrally connected to the main block 714. Each main block 714 forms a peripheral unit 80 (i.e. Figures 6 to 14 The metal heat sinks of the same metal heat sink layer 70 shown in the figure all constitute a peripheral unit), and each reinforcing rib 715 extends from the peripheral unit 80 toward the hollow portion 75 to divide the hollow portion 75 into four areas 752. Such a metal heat sink layer 70 is suitable for a probe card that simultaneously detects four objects to be tested. In this case, the inner layer guide plate 41 will be provided with four protrusions 414, that is, the probe head will have four probe mounting blocks for setting probes for respectively point-testing the four objects to be tested, such as Fig.15 The metal heat dissipation layer 70 shown has four protrusions 414 located in four regions 752, respectively, to achieve a good support effect, and still allow the user to remove or replace the metal heat dissipation layer 70. It is worth mentioning that in actual application, the size ratios of the reinforcing ribs 715, the regions 752, the protrusions 414 and other features may not be the same. Fig.15As shown, the probes provided on adjacent protrusions 414 may be used to test adjacent DUTs, or the DUTs tested by the probes provided on adjacent protrusions 414 may be separated by one or more other DUTs, which is commonly known as DUT jumping test method.

[0066] Fig.15 The metal heat dissipation layer 70 shown is composed of T-shaped metal heat dissipation fins 71A and 71B. However, the metal heat dissipation layer 70 including the reinforcing ribs 715 can also be composed of metal heat dissipation fins of other shapes (such as L-shaped, I-shaped, etc.). Figures 16 to 20 The form shown. Fig.16 The metal heat dissipation layer 70 shown includes two metal heat dissipation sheets 71C and two metal heat dissipation sheets 71D. Each metal heat dissipation sheet 71C includes a first block 716 and a second block 717 which are connected to each other in an L-shape. Each metal heat dissipation sheet 71D includes a third block 718 and a reinforcing rib 715 which are connected to each other in an L-shape. The first blocks 716 of the two metal heat dissipation sheets 71C are respectively adjacent to the third blocks 718 of the two metal heat dissipation sheets 71D. The second blocks 717 of the two metal heat dissipation sheets 71C are respectively adjacent to the reinforcing ribs 715 of the two metal heat dissipation sheets 71D, so that the first, second, and third blocks 716, 717, and 718 constitute a peripheral unit 80 surrounding the hollow portion 75. The reinforcing ribs 715 of the two metal heat dissipation sheets 71D extend from the peripheral unit 80 toward the hollow portion 75 to divide the hollow portion 75 into two regions 752. A single or multiple protrusions 414 may be provided in each region 752, for example Fig.16 Three protrusions 414 are provided in each area 752, that is, the inner guide plate 41 is provided with six protrusions 414 ( Figures 17 to 20 This form is suitable for a probe card that simultaneously detects six objects to be tested.

[0067] Fig.17 The metal heat dissipation layer 70 is similar to Fig.16 The metal heat sink layer 70 shown, but Fig.17 The metal heat sink layer 70 shown is replaced by metal heat sinks 71E, 71F, 71G in a T-shape, an L-shape, and an I-shape, respectively. Fig.16 The metal heat sink 71C in the Fig.17 The metal heat dissipation layer 70 shown includes eight metal heat dissipation fins 71D, 71E, 71F, and 71G, wherein the metal heat dissipation fin 71D includes a reinforcing rib 715, and the metal heat dissipation fins 71E and 71F also include reinforcing ribs 715. Therefore, the metal heat dissipation layer 70 includes six reinforcing ribs 715 extending from the peripheral unit 80 toward the hollow portion 75, thereby dividing the hollow portion 75 into six areas 752. The six protrusions 414 of the inner guide plate 41 are respectively located in the six areas 752.

[0068] Fig.18The metal heat dissipation layer 70 is similar to Figure 8 The main difference of the metal heat dissipation layer 70 is Fig.18 Each metal heat sink 71A includes a Figure 8 The main block 714 is similar to the metal heat sink 71A in the figure, and further includes a reinforcing rib 715 integrally connected to the main block 714, that is, each metal heat sink 71A is generally T-shaped, but the reinforcing rib 715 is not located in the center of the main block 714 but is biased to one side, and each metal heat sink 71B does not include the reinforcing rib 715 but is I-shaped. Therefore, the metal heat sink layer 70 only includes two reinforcing ribs 715 extending from the peripheral unit 80 toward the hollow portion 75 to divide the hollow portion 75 into three areas 752, and two protrusions 414 are set in each area 752.

[0069] Fig.19 The metal heat dissipation layer 70 is similar to Fig.18 The metal heat sink layer 70 shown, however Fig.19 The main area 714 of the metal heat sink 71A is relatively small, while the metal heat sink 71B extends an additional area toward the metal heat sink 71A, so that the metal heat sink 71B is L-shaped.

[0070] Fig. 20 The metal heat dissipation layer 70 shown is also similar to Fig.18 The metal heat dissipation layer 70 shown is only Fig. 20 The metal heat dissipation layer 70 is replaced by L-shaped and I-shaped metal heat dissipation sheets 71H and 71I respectively. Fig.18 The T-shaped metal heat sink 71A, that is, Fig. 20 The metal heat dissipation layer 70 shown includes two L-shaped metal heat dissipation fins 71H and four I-shaped metal heat dissipation fins 71B and 71I.

[0071] The various forms of the metal heat dissipation layer 70 mentioned above can achieve a good supporting effect through the reinforcement ribs 715 extending from the peripheral unit 80 toward the hollow portion 75, and the metal heat dissipation layer 70 can still be removed or replaced by the user. In addition, the reinforcement ribs 715 located in the hollow portion 75 can directly conduct the heat energy inside the probe head to the outside, which can further enhance the heat dissipation effect. Furthermore, the reinforcement ribs 715 also have the effect of enhancing the structural strength, especially in the aforementioned test method commonly known as DUT jumping, where the adjacent protrusions 414 are spaced farther apart, and there will be a problem of insufficient strength. The reinforcement ribs 715 of the metal heat dissipation layer 70 can extend between the adjacent protrusions 414 as support reinforcement. In addition, with the trend of large-scale guide plates, the center of the large-area guide plate is prone to warping and deformation. In this case, the reinforcement ribs 715 of the metal heat dissipation layer 70 can be provided with fixing holes for screws to pass through, such as Fig. 20The fixing holes 715a in the reinforcing ribs 715 are used to lock the inner and outer guide plates 41 and 42 with screws, thereby preventing the guide plates from warping and deforming in the center.

[0072] As mentioned above, the disassembly positioning hole 21 is set at a position not corresponding to the metal heat sink 71, that is, there is no need to remove part of the positioning pins during the process of removing the metal heat sink 71, so that the removal of the metal heat sink 71 can be facilitated. The position not corresponding to the metal heat sink 71 is not limited to Fig.14 The positions shown correspond to the gaps G between the metal heat sinks 71 as long as interference with the removal path of the metal heat sinks can be avoided.

[0073] Similar to Fig.14 Take the metal heat dissipation layer as an example. Fig.21 As shown, the position of the disassembly positioning hole 21 may correspond to the space between the metal heat sink 71 and the protrusion 414, that is, to the space 75, which may be provided at Fig.21 The positions of the two through holes 418 are not limited in number, as long as they are arranged between the metal heat sink 71 and the protrusion 414. Or, as Fig.21 As shown, the metal heat sink 71 may have a notch 719 that is open toward the other metal heat sink 71, and the position of the disassembly positioning hole 21 may correspond to the notch 719, that is, Fig.21 The position of the notch 719 and the position of the through hole 418' (i.e., the position of the disassembly positioning hole 21) are not limited to being located at the center of the end of the metal heat sink 71, for example, they may also be located at the end of the metal heat sink 71 and the outside of the metal heat sink 71, or they may also be located at the end of the metal heat sink 71 and the inside of the metal heat sink 71. Alternatively, the notch 719 and the through hole 418' may not be located at the end of the metal heat sink 71, but may be located at the inside of the metal heat sink 71, that is, the notch 719 of the metal heat sink 71 is open to the other metal heat sink 71 across the space 75.

[0074] Similarly to Fig.16 Take the metal heat dissipation layer as an example. Fig. 22 As shown, the metal heat sink 71C may have a notch 719 located at its end and open outside the metal heat sink layer 70, and the position of the disassembly positioning hole 21 may correspond to the notch 719, that is, Fig. 22 The positions of the two through holes 418 are shown in FIG.

[0075] Likewise, if Figures 9 to 13 The integral metal heat dissipation layer 70 shown may not be provided with the through hole 73 for the positioning pin to pass through, and may selectively be provided with an open recess toward the hollow portion 75 or toward the outside of the metal heat dissipation layer 70, and the disassembly positioning hole 21 may be provided at a position corresponding to the hollow portion 75 or the aforementioned recess.

[0076] As mentioned above, the metal heat dissipation layer 70 of the present invention has various forms, such as Figures 9 to 13 The metal heat dissipation layer 70 with the pre-tear line 76 shown in the figure can be easily torn and removed by the user without disassembling the fixing member 60. Figures 6 to 8 and Figures 14 to 23B The metal heat sinks shown are directly separated from each other, so that the user can replace the metal heat sink layer 70 with a different one after removing the metal heat sink layer 70. The metal heat sinks directly separated from each other can be designed to be in contact with each other without leaving any gaps (not shown) for easy assembly. Alternatively, the metal heat sinks directly separated from each other can be designed as follows: Figures 6 to 8 and Figures 14 to 23B In the form shown, a gap G is left between adjacent metal heat sinks. In this way, the gap G can serve as a heat dissipation channel, so that the heat energy inside the probe head is discharged to the outside through the gap G to improve the heat dissipation effect.

[0077] Fig.24 The results of simulations of the present invention under the conditions of the metal heat dissipation layer 70 with and without gaps G and without a metal heat dissipation layer are shown. The simulation condition is to set the temperature of the central area where the probe is set to 125°C to simulate the temperature distribution of the outer layer guide plate 42, the metal heat dissipation layer 70 and the inner layer guide plate 41 of the guide plate unit 40B when the temperature reaches 125°C. The results of the above three conditions are that the temperature of the outer layer guide plate 42 is obviously high in the central area and the temperature is lower as it goes to the periphery. The metal heat dissipation layer 70 and the inner layer guide plate 41 also roughly present a distribution of higher temperature inside and lower temperature outside. The highest and lowest temperatures of the outer layer guide plate 42, the metal heat dissipation layer 70 and the inner layer guide plate 41 are shown in FIG. Fig.24 Although the simulation results of the three conditions mentioned above are not much different in terms of the highest and lowest temperatures, the distribution areas of the high and low temperatures are significantly different, especially the low temperature area (about 114°C) of the inner guide plate 41 is significantly larger when the metal heat dissipation layer 70 has gaps G than when the metal heat dissipation layer has no gaps. Fig.24 As shown, the area ratio of the inner layer guide plate 41 greater than 116°C has significant differences in the above three conditions. The area ratio greater than 116°C in the case of the metal heat dissipation layer 70 is much higher than that in the case of no metal heat dissipation layer, and the area ratio greater than 116°C in the case of the metal heat dissipation layer 70 having gaps G is also much higher than that in the case of no gaps in the metal heat dissipation layer 70. It can be seen that the gaps G in the metal heat dissipation layer 70 can improve the heat dissipation effect.

[0078] like Fig.23A and Fig. 23BAs shown, the metal heat dissipation layer 70 may also be provided with one or more notches 82 (the number is not limited) on its outer periphery, and the notches 82 penetrate the upper surface 84 and the lower surface of the metal heat dissipation layer 70, thereby increasing the surface area of ​​the outer periphery of the metal heat dissipation layer 70 to increase the heat dissipation area, so that the metal heat dissipation layer 70 has a structure similar to a heat dissipation fin and can further improve the heat dissipation effect. The notches 82 can penetrate the metal heat dissipation layer 70 and be in the shape of a through groove, such as Fig.23A Alternatively, the notch 82 may not penetrate the upper and lower surfaces of the metal heat dissipation layer 70 but may be in the shape of a groove, such as Fig. 23B As shown, the notch 82 is recessed from one surface (eg, the upper surface 84 ) of the metal heat dissipation layer 70 and does not penetrate through another surface (eg, the lower surface).

[0079] Likewise, Fig. 22 In the illustrated embodiment, there is a gap G between adjacent metal heat sinks 71C and 71D, which can achieve a good heat dissipation effect. Fig. 22 The metal heat dissipation layer 70 in Fig.23A and Fig. 23B As shown, a notch 82 is provided on the outer periphery of the metal heat dissipation layer 70, and the notch 82 penetrates the upper and lower surfaces of the metal heat dissipation layer 70 and is in a groove shape, thereby increasing the surface area of ​​the outer periphery of the metal heat dissipation layer 70 to improve the heat dissipation effect. Specifically, the notch 82 penetrates the upper and lower surfaces of the metal heat sink 71C. The notch of another embodiment of the present invention is recessed from the surface of the metal heat dissipation layer 70. Specifically, the notch is recessed from the surface of the metal heat dissipation layer 70, and a groove is formed on the surface of the metal heat dissipation layer 70. The aforementioned notch in the shape of a groove can also extend from the inner periphery of the metal heat dissipation layer 70 to the outer periphery to increase the surface area of ​​the metal heat dissipation layer 70 in contact with the environment. At the same time, the space 75 where the probe mounting block 413 is located can be connected to the external environment through the notch-shaped notch, so that the heat of the probe mounting block 413 can be discharged to the external environment through the notch-shaped notch.

[0080] It is worth mentioning that the present invention is only based on Fig.23A , Fig. 23B and Fig. 22 As an example, the metal heat dissipation layer 70 may be provided with a notch 82 to enhance the heat dissipation effect. Fig.23A and Fig. 23BThe outer periphery of each metal heat sink 71 of the metal heat sink layer 70 is provided with a notch 82, but this structural feature is not limited to each metal heat sink being provided with a notch 82. The number and position of the notch 82 can be set according to requirements, and this structural feature can also be applied to other embodiments. In addition to the heat dissipation function, the aforementioned notch 82 can also be used to identify the metal heat sink layer 70 or the metal heat sink. More specifically, the metal heat sink layer 70 or the metal heat sink of different shapes or heat dissipation performance can be provided with notches 82 of different shapes (slots or grooves), widths or numbers. After the probe head is assembled, the user can still see the notch 82 from the side of the probe head, and can identify the state of the metal heat sink layer 70 or the metal heat sink through the notch 82. The metal heat sink layer 70 with gaps G between the metal heat sinks can also achieve a similar effect. The user can see the notch formed by the gap G on the outer periphery of the metal heat sink layer 70 from the side of the probe head to identify the shape of the metal heat sink layer 70 or the metal heat sink.

[0081] Finally, it must be stated again that the constituent elements disclosed in the aforementioned embodiments of the present invention are for illustrative purposes only and are not intended to limit the scope of patent protection of this case. Replacements or changes of other equivalent elements should also be covered by the scope of patent protection of this case.

[0082] For example, in this embodiment, the metal heat dissipation layer is described as one layer and two layers, but it is not limited thereto and may also be in the form of three layers or multiple layers.

Claims

1. A guide plate unit capable of dissipating heat, used to be arranged on a surface of a guide plate; Features The guide plate unit comprises: An outer guide plate, a metal heat dissipation layer and an inner guide plate, wherein the inner guide plate, the metal heat dissipation layer and the outer guide plate are stacked in sequence from the surface of the guide plate; wherein: The inner guide plate includes a probe mounting block for a plurality of probes to pass through, and a peripheral portion surrounding the probe mounting block, the peripheral portion having an inner connection surface for connecting with the guide plate, and an outer connection surface located on the opposite side of the inner connection surface, the probe mounting block having a recessed portion recessed from the inner connection surface, and a protruding portion protruding from the outer connection surface, so that the probe mounting block forms a step difference portion at the junction between the probe mounting block and the peripheral portion; The outer guide plate includes a mounting groove for each of the probes to pass through, and a support portion surrounding the mounting groove, the support portion having an inner surface, the mounting groove being recessed from the inner surface, the mounting groove being larger than the protrusion of the inner guide plate, and the protrusion being accommodated in the mounting groove; The metal heat dissipation layer is arranged between the peripheral portion of the inner layer guide plate and the supporting portion of the outer layer guide plate.

2. The guide plate unit capable of dissipating heat according to claim 1, Features: The metal heat dissipation layer includes a metal heat sink, which is arranged in an integral and ring-shaped manner around the protrusion. The protrusion of the probe installation block of the inner guide plate is located in the space surrounded by the metal heat sink.

3. The guide plate unit capable of dissipating heat according to claim 1, Features: The metal heat dissipation layer includes a plurality of metal heat dissipation fins that can be separated from each other. Adjacent metal heat dissipation fins abut against each other without gaps, or there is a gap between adjacent metal heat dissipation fins.

4. The guide plate unit capable of dissipating heat according to claim 1, Features: The inner guide plate has a plurality of protrusions, the metal heat dissipation layer includes a peripheral unit surrounding each of the protrusions, and at least one reinforcing rib extending from the peripheral unit toward the space surrounded by the peripheral unit, the at least one reinforcing rib divides the space surrounded by the peripheral unit into a plurality of areas, and at least one protrusion is arranged in each of the areas.

5. The guide plate unit capable of dissipating heat according to claim 1, Features: The metal heat dissipation layer has an outer periphery and a notch located at the outer periphery. The notch penetrates an upper surface and a lower surface of the metal heat dissipation layer, or the notch is recessed from the upper surface or the lower surface of the metal heat dissipation layer.

6. The guide plate unit capable of dissipating heat according to claim 1, Features: The probe installation block of the inner guide plate includes a penetration portion for each of the probes to pass through, the step portion is located between the penetration portion and the surrounding portion, and the thickness of the penetration portion is smaller than the thickness of the surrounding portion.

7. The guide plate unit capable of dissipating heat according to claim 1, Features: The height of the step portion of the inner layer guide plate is greater than the height of the protruding portion of the inner layer guide plate.

8. The guide plate unit capable of dissipating heat according to claim 1, Features: The thickness of the peripheral portion of the inner layer guide plate is smaller than the thickness of the supporting portion of the outer layer guide plate.

9. The guide plate unit capable of dissipating heat according to claim 1, Features: The thickness of the metal heat dissipation layer is smaller than the height of the step portion.

10. The guide plate unit capable of dissipating heat according to claim 1, Features: The sum of the thickness of the metal heat dissipation layer and the thickness of the peripheral portion of the inner layer guide plate is smaller than the height of the step portion or the height of the protruding portion.

11. The guide plate unit capable of dissipating heat according to claim 1, Features: The metal heat dissipation layer includes two metal heat sinks, each of which includes two blocks perpendicular to each other, and each block is respectively located on the four sides of the protruding portion of the inner guide plate, or the metal heat dissipation layer includes four metal heat sinks, and each of which is respectively located on the four sides of the protruding portion of the inner guide plate.

12. The guide plate unit capable of dissipating heat according to claim 1, Features: The metal heat dissipation layer is made into an integral body and is in a ring shape. The metal heat dissipation layer has a plurality of pre-tear lines, each of which divides the metal heat dissipation layer into a plurality of metal heat dissipation fins and enables the metal heat dissipation fins to be separated from each other; a plurality of metal heat dissipation layers are arranged between the inner guide plate and the outer guide plate, each of the metal heat dissipation layers has an outer peripheral edge and a notch located at the outer peripheral edge and adjacent to a pre-tear line, and the notches of adjacent metal heat dissipation layers are located at non-corresponding positions.

13. The guide plate unit capable of dissipating heat according to claim 1, Features: At least a portion of the metal heat dissipation layer is spaced apart from the protruding portion of the inner layer guide plate by a gap.

14. The guide plate unit capable of dissipating heat according to claim 1, Features: The metal heat dissipation layer is made into an integral and ring-shaped body to enclose a hollow portion. The protrusion of the probe mounting block of the inner guide plate is located in the hollow portion of the metal heat dissipation layer. The metal heat dissipation layer has an inner periphery defining the hollow portion, an outer periphery, and a pre-tear line extending from the inner periphery to the outer periphery.

15. The guide plate unit capable of dissipating heat according to claim 1, Features: There is a gap between the protruding portion of the inner layer guide plate and the mounting groove of the outer layer guide plate, and the height of the gap is greater than the thickness of the metal heat dissipation layer.

16. The guide plate unit capable of dissipating heat according to claim 1, Features: The guide plate unit capable of dissipating heat is arranged on the surface of the guide plate facing an object to be tested.

17. A probe holder, Features Contains: A guide plate having an upper surface and a lower surface facing opposite directions, and a receiving hole penetrating the upper surface and the lower surface, wherein the lower surface faces an object to be measured; An upper guide plate unit and a lower guide plate unit, respectively disposed on the upper surface and the lower surface of the guide plate; Wherein, at least one of the upper guide plate unit and the lower guide plate unit is a guide plate unit capable of dissipating heat as claimed in any one of claims 1 to 16, and the recessed portion of the inner guide plate and the accommodating hole of the guide plate together form a probe accommodating space.

18. The probe holder according to claim 17, Features: The lower guide plate unit is the guide plate unit capable of dissipating heat.

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