Wave-soldering apparatus for preventing poor soldering

Abstract

The application discloses a wave-soldering device capable of preventing poor soldering, and particularly relates to the technical field of wave-soldering, which comprises a jig positioning frame, the outer surface of the jig positioning frame is provided with mounting grooves around, and positioning sleeve rings are arranged in the four mounting grooves; the outer surfaces of the four positioning sleeve rings are fixedly connected with the inner walls of the four mounting grooves respectively; the inner walls of the positioning sleeve rings are fixedly connected with the outer surfaces of limiting friction rings; and adjusting rods are clamped in the limiting friction rings. The positioning suction cups, the wave-soldering jig, the workpiece positioning plates, the adjusting rods, the first synchronous wheels and the second synchronous wheels are arranged, so that the adhering effect between the workpiece to be soldered and the wave-soldering jig is ensured; the multiple positioning suction cups and the four workpiece positioning plates are arranged, so that the stress points of the workpiece to be soldered are increased, the workpiece to be soldered is prevented from being dislocated or even unsoldered during the machining of the workpiece to be soldered, and the machining effect of the wave-soldering jig on the workpiece to be soldered is ensured.

Description

Technical Field

[0001] This invention relates to the field of wave soldering technology, and more specifically, to a wave soldering apparatus for preventing poor lead output. Background Technology

[0002] With the development of technology, the welding process for workpieces has evolved from manual welding to dip soldering, and then to wave soldering. In particular, the use of wave soldering fixtures has enabled mass production of wave soldering. Currently, wave soldering fixtures are widely used in wave soldering. A wave soldering fixture is an auxiliary tooling used when wave soldering workpieces. It generally consists of a substrate, solder blocks, and clamps. The substrate primarily supports the workpiece, while the solder blocks around the substrate prevent the flow of molten solder in the wave soldering pot. The clamps primarily press the workpiece against the substrate, preventing it from being affected by the flow of molten solder as it passes through the wave soldering pot. In addition to the clips distributed around the substrate to hold down the workpiece to be soldered, sometimes an arched elastic clip made of steel sheet is added to the substrate of the wave soldering fixture to hold down the components and prevent them from floating or tilting, in order to reduce the impact of liquid solder on lighter components during wave soldering.

[0003] Chinese patent document (CN103237420B) discloses a wave soldering fixture. The specification states that "in PCB board soldering production, the PCB board needs to be placed in the fixture for wave soldering. After the PCB board is placed in the fixture, a knob is used to press the PCB board down to prevent it from deforming or bending due to heat, ensuring the PCB board passes through the reflow oven flat." Please refer to [the relevant documentation]. Figure 1 , Figure 1This is a schematic diagram of a typical wave soldering fixture in the prior art. In the prior art, a typical wave soldering fixture includes a worktable 1' and knob clips 2', with at least two knob clips positioned on the worktable. When wave soldering a component 3' (PCB board), the knob clips 2' need to be turned off when the component 3' is placed on the worktable 1'; after the component 3' is placed on the worktable 1', the knob clips 2' need to be turned back to press the component 3' in place. This makes the component fixing operation quite complex and cumbersome. The proposed solution states that "with the above structural design, when pressing the component, it is only necessary to press the component onto the worktable, and the pressing assembly will then press it onto the worktable. This avoids the need for operators to manually rotate the pressure plate during the traditional pressing structure, greatly simplifying the component pressing operation." "However, although it simplifies the installation process in actual use, the installation effect is still unsatisfactory. Therefore, compared with existing wave soldering fixtures and the fixtures described in the cited comparative cases, the following problems still exist:"

[0004] 1. The existing wave soldering fixture usage steps are as follows: First, place the workpiece to be soldered into the corresponding opening in the substrate, then adjust the clamps in sequence to lock the workpiece to be soldered. After soldering, adjust the clamps in sequence to remove the workpiece to be soldered from the fixture. However, simply installing the workpiece to be soldered by the clamps results in insufficient installation points and poor fixing methods, leading to uneven force on the workpiece to be soldered, which limits the contact effect between the workpiece to be soldered and the fixture, making it easy for poor lead emergence or even desoldering to occur during wave soldering.

[0005] 2. PCB boards may deform due to high temperatures when passing through a wave soldering machine, resulting in skewed components and affecting the soldering effect. This can lead to burn-out of electronic components on the surface of the workpiece during the wave soldering process. In addition, existing wave soldering fixtures have limited functionality and cannot meet the safety and processing efficiency requirements of actual use. Summary of the Invention

[0006] To overcome the aforementioned deficiencies of the prior art, this invention provides a wave soldering device to prevent poor lead emergence. The technical problem to be solved by this invention is as follows: the existing wave soldering fixtures are used in the following steps: first, the workpiece to be soldered is placed into the corresponding opening on the substrate, then the clamps are adjusted sequentially to lock the workpiece to be soldered, and after soldering, the clamps are adjusted sequentially to remove the workpiece from the fixture. However, simply using the clamps to install the workpiece to be soldered results in insufficient installation points and poor fixing methods, leading to uneven force on the workpiece to be soldered, limiting the contact effect between the workpiece to be soldered and the fixture, which easily leads to poor lead emergence or even desoldering during wave soldering. The PCB board may deform due to high temperature when passing through the wave soldering machine, resulting in skewed components after soldering and affecting the soldering effect. This also leads to the possibility of burnt electronic components on the surface of the workpiece during soldering. At the same time, the existing wave soldering fixtures have limited functionality and cannot meet the requirements of safety and processing efficiency in actual use.

[0007] To achieve the above objectives, the present invention provides the following technical solution: a wave soldering device for preventing poor lead output, comprising a fixture positioning frame, wherein mounting grooves are formed around the outer surface of the fixture positioning frame, and positioning rings are provided in each of the four mounting grooves; the outer surfaces of the four positioning rings are respectively fixedly connected to the inner walls of the four mounting grooves; the inner walls of the positioning rings are fixedly connected to the outer surfaces of a limiting friction ring; an adjusting rod is engaged within the limiting friction ring; the outer surface of the adjusting rod is fixedly connected to the inner wall of a first synchronous pulley; the outer surfaces of the four first synchronous pulleys are wound with the same synchronous belt, and the four... The first synchronous pulley is connected by a synchronous belt drive. The inner wall of the synchronous belt overlaps with the outer surface of the four second synchronous pulleys, and the four second synchronous pulleys are connected by a synchronous belt drive. The inner walls of the four second synchronous pulleys are fixedly connected to the outer surface of the four connecting shafts. The top end of the connecting shaft is sleeved in the positioning bearing. The upper surface of the positioning bearing is engaged with the lower surface of the fixing sleeve. The four fixing sleeves are located at the four corners of the outer surface of the fixture positioning frame. The bottom end of the connecting shaft passes through the second synchronous pulley and is fixedly connected to the upper surface of the positioning base. The four positioning bases are on the same horizontal plane.

[0008] As a further aspect of the present invention: a limiting groove is formed in the limiting friction ring, a limiting rod is fixedly connected to the outer surface of the adjusting rod, and the adjusting rod is slidably connected to the limiting groove formed in the limiting friction ring through the limiting rod.

[0009] As a further aspect of the present invention: the top end of the adjusting rod is fixedly connected to the lower surface of the first fixing block, and two adjusting handles are fixedly connected to the upper surface of the first fixing block, and the outer surfaces of the two adjusting handles are provided with anti-slip textures.

[0010] As a further embodiment of the present invention: the bottom end of the adjusting rod passes through the limiting friction ring and is fixedly connected to the upper surface of the second fixing block, and a workpiece positioning plate is fixedly connected to the outer surface of the second fixing block, wherein the workpiece positioning plate is configured as a fan-shaped workpiece positioning plate.

[0011] As a further aspect of the present invention: the left and right sides of the workpiece positioning plate are both set as inclined surfaces, and the lower surfaces of the four workpiece positioning plates and the lower surfaces of the four positioning bases are all located on the same horizontal line, and the lower surfaces of the four workpiece positioning plates and the lower surfaces of the four positioning bases are all provided with anti-slip insulating pads.

[0012] As a further aspect of the present invention: a wave soldering fixture is provided inside the fixture positioning frame, the outer surface of the wave soldering fixture is fixedly connected to the inner wall of the fixture positioning frame, a plurality of wave soldering grooves are provided on the upper surface of the wave soldering fixture, and two positioning grooves are provided on the lower surface of the wave soldering fixture.

[0013] As a further aspect of the present invention: the front of the fixture positioning frame is fixedly connected to two air pump connection ports, and each of the two positioning slots is fixedly connected to a connecting conduit. The outer surfaces of the two connecting conduits are fixedly connected to several positioning suction cups. One of the air pump connection ports is connected to the two connecting conduits through the fixture positioning frame. The lower surface of the positioning suction cup is at the same horizontal level as the lower surface of the wave soldering fixture.

[0014] As a further aspect of the present invention: the lower surface of the wave soldering fixture is provided with a plurality of solder drag sheets, the inner wall of the fixture positioning frame is provided with an adsorption groove, the adsorption groove is configured as a U-shaped adsorption groove, and another air pump connection port is connected to the adsorption groove through the fixture positioning frame.

[0015] The beneficial effects of this invention are as follows:

[0016] 1. This invention, by setting up a positioning suction cup, a wave soldering fixture, a workpiece positioning plate, an adjusting rod, a first synchronous wheel, and a second synchronous wheel, allows the workpiece to be initially fixed by the positioning suction cup. The adjusting handle can then be rotated, causing the three first synchronous wheels to rotate simultaneously. This rotation of the first synchronous wheels causes the workpiece positioning plate to rotate along the adjusting rod. When the workpiece positioning plate contacts the workpiece, the inclined surfaces on both sides of the workpiece positioning plate press the workpiece upwards. When the workpiece is in contact with the wave soldering fixture, the top of the workpiece positioning plate contacts the workpiece. After rotating 180 degrees, the workpiece positioning plate stops rotating, allowing... This wave soldering fixture can quickly fix the workpiece to be welded during use, avoiding the problems of detachment or poor lead protrusion that can occur when fixing the workpiece solely with positioning suction cups. Furthermore, the beveled design on both sides of the workpiece positioning plate allows it to press upwards on the workpiece when in contact with it, ensuring a good adhesion between the workpiece and the wave soldering fixture. The multiple positioning suction cups and four workpiece positioning plates increase the stress points on the workpiece, preventing misalignment or even detachment during processing and ensuring the optimal processing effect of the wave soldering fixture.

[0017] 2. This invention, by setting up an air pump connection port, a fixture positioning frame, a positioning suction cup, and a wave soldering fixture, selects an air pump connection port that connects to the connecting conduit. After connection, the external air pump is started. As the external air pump operates, the connecting conduit draws gas from inside the positioning suction cup, pushing the workpiece to be welded upwards. This causes the workpiece to move upwards along the space inside the fixture positioning frame. When the workpiece contacts the positioning suction cup, the suction cup adheres to the workpiece using suction force. This allows the wave soldering fixture to pre-fix the workpiece by drawing gas from the external air pump during use, avoiding the need for subsequent fixation using a workpiece positioning plate. If misalignment occurs when fixing the workpiece to be welded, and after fixing is completed, an external air pump can be connected to another air pump port. During the welding process, the external air pump can draw air from inside the fixture positioning frame through the adsorption tank, thereby accelerating the airflow inside the fixture positioning frame. This makes the wave soldering fixture less prone to overheating during the processing of the workpiece to be welded, reducing damage to electronic components caused by temperature and welding failures. In addition, the two air pump ports can be used for initial fixing and rapid heat dissipation of the workpiece to be welded, thus ensuring the protection of the workpiece to be welded and the processing effect of the wave soldering fixture in actual use.

[0018] 3. By setting up solder drag sheets and insulating rubber pads, and because the lower surfaces of the four workpiece positioning plates and the four positioning bases are all equipped with anti-slip insulating pads, the wave soldering fixture can effectively shield the electrostatic discharge between the wave soldering fixture and the workpiece to be soldered, thereby protecting the workpiece and preventing it from burning. At the same time, the setting of solder drag sheets can prevent the solder joints of the soldered parts from bridging, greatly reducing the probability of poor soldering and achieving the best soldering effect. Attached Figure Description

[0019] Figure 1 This is a three-dimensional structural schematic diagram of the present invention;

[0020] Figure 2 This is a three-dimensional structural diagram of the positioning frame of the fixture of the present invention;

[0021] Figure 3 This is a three-dimensional structural diagram of the synchronous belt of the present invention;

[0022] Figure 4 This is an enlarged structural schematic diagram of point A in the present invention;

[0023] Figure 5 This is a three-dimensional structural diagram of the workpiece positioning plate of the present invention;

[0024] Figure 6 This is a three-dimensional structural schematic diagram of the second synchronous pulley of the present invention;

[0025] In the diagram: 1. Fixture positioning frame, 2. Mounting groove, 3. Positioning collar, 4. Limiting friction ring, 5. Adjusting rod, 6. First synchronous pulley, 7. Synchronous belt, 8. Second synchronous pulley, 9. Connecting shaft, 10. Positioning bearing, 11. Fixing sleeve, 12. Positioning base, 13. First fixing block, 14. Adjusting handle, 15. Second fixing block, 16. Workpiece positioning plate, 17. Inclined surface, 18. Air pump connection port, 19. Wave soldering fixture, 20. Wave soldering groove, 21. Positioning groove, 22. Connecting conduit, 23. Positioning suction cup, 24. Adsorption groove, 25. Solder drag sheet. Detailed Implementation

[0026] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0027] like Figure 1-6As shown, this invention provides a wave soldering device to prevent poor lead output, including a fixture positioning frame 1. The outer surface of the fixture positioning frame 1 has mounting grooves 2 around its perimeter, and each of the four mounting grooves 2 contains a positioning sleeve 3. The outer surfaces of the four positioning sleeves 3 are fixedly connected to the inner walls of the four mounting grooves 2. The inner walls of the positioning sleeves 3 are fixedly connected to the outer surfaces of a limiting friction ring 4. An adjusting rod 5 is engaged within the limiting friction ring 4. The outer surface of the adjusting rod 5 is fixedly connected to the inner wall of a first synchronous pulley 6. The outer surfaces of the four first synchronous pulleys 6 are wound with the same synchronous belt 7, and the four first synchronous pulleys 6 are connected by the synchronous belt 7. The inner walls of the synchronous belt 7 overlap with the outer surfaces of four second synchronous pulleys 8, and the four second synchronous pulleys 8 are connected by the synchronous belt 7. The inner walls of the four second synchronous pulleys 8 are fixedly connected to the outer surfaces of four connecting shafts 9. The top end of the connecting shaft 9 is sleeved within a positioning bearing 10. The upper surface of the positioning bearing 10 is engaged with the lower surface of a fixing sleeve 11, and the four fixing sleeves 11 are respectively located in the fixture positioning frame. At the four corners of the outer surface of the frame 1, the bottom end of the connecting shaft 9 passes through the second synchronous wheel 8 and is fixedly connected to the upper surface of the positioning base 12. The four positioning bases 12 are on the same horizontal plane. By setting the positioning suction cup 23, adjusting rod 5, first synchronous wheel 6 and second synchronous wheel 8, the wave soldering fixture can quickly fix the workpiece to be welded during use. This avoids the situation of detachment or poor lead protrusion during the processing of the workpiece due to fixing the workpiece solely by the positioning suction cup 23. Due to the design of the inclined surfaces 17 on both sides of the workpiece positioning plate 16, the workpiece positioning plate 16 can press the workpiece upward when in contact with it, thereby ensuring the adhesion effect between the workpiece and the wave soldering fixture 19. The multiple positioning suction cups 23 and the four workpiece positioning plates 16 increase the force points of the workpiece to be welded, preventing the workpiece from being misaligned or even detached during the processing of the workpiece, thus ensuring the processing effect of the wave soldering fixture on the workpiece.

[0028] like Figure 1 , Figure 3 , Figure 4 and Figure 6As shown, a limiting groove is opened in the limiting friction ring 4, and a limiting rod is fixedly connected to the outer surface of the adjusting rod 5. The adjusting rod 5 is slidably connected in the limiting groove opened in the limiting friction ring 4 through the limiting rod. Because a positioning suction cup 23 is provided, the wave soldering fixture can be pre-fixed by the external air pump during use, so as to avoid misalignment when fixing the workpiece to be welded by the workpiece positioning plate 16 later. The top end of the adjusting rod 5 is fixedly connected to the lower surface of the first fixing block 13. Two adjusting handles 14 are fixedly connected to the upper surface of the first fixing block 13, and the outer surface of the two adjusting handles 14 is provided with anti-slip texture. The bottom end of the adjusting rod 5 passes through the limiting friction ring 4 and is fixedly connected to the upper surface of the second fixing block 15. The outer surface of the second fixing block 15 is fixedly connected to the workpiece positioning plate 16, which is set as a fan-shaped workpiece positioning plate.

[0029] like Figure 2 , Figure 4 , Figure 5 and Figure 6 As shown, the left and right sides of the workpiece positioning plate 16 are both set as inclined surfaces 17, and the lower surfaces of the four workpiece positioning plates 16 and the four positioning bases 12 are all located on the same horizontal line. The lower surfaces of the four workpiece positioning plates 16 and the four positioning bases 12 are all provided with anti-slip insulating pads. A wave soldering fixture 19 is set inside the fixture positioning frame 1. Because of the adsorption groove 24, the wave soldering fixture is not prone to overheating during the processing of the workpiece to be soldered, reducing the damage to electronic components caused by temperature and soldering failures. The two air pump connection ports 18 can respectively perform preliminary fixation and rapid heat dissipation of the workpiece to be soldered, thereby ensuring the protection of the workpiece to be soldered and the processing effect of the wave soldering fixture in actual use. The outer surface of the wave soldering fixture 19 is fixedly connected to the inner wall of the fixture positioning frame 1. Several wave soldering grooves 20 are opened on the upper surface of the wave soldering fixture 19, and two positioning grooves 21 are opened on the lower surface of the wave soldering fixture 19.

[0030] like Figure 1 , Figure 5 and Figure 6As shown, two air pump connection ports 18 are fixedly connected to the front of the fixture positioning frame 1, and connecting conduits 22 are fixedly connected to both positioning slots 21. Several positioning suction cups 23 are fixedly connected to the outer surface of both connecting conduits 22. One air pump connection port 18 is connected to the two connecting conduits 22 through the fixture positioning frame 1. The lower surface of the positioning suction cup 23 is at the same level as the lower surface of the wave soldering fixture 19. Because of the rubber insulating pad, the wave soldering fixture can effectively shield the electrostatic charge on the wave soldering fixture 19 and the workpiece to be soldered, thereby protecting the workpiece to be soldered and preventing it from burning. Several solder drag sheets 25 are provided on the lower surface of the wave soldering fixture 19. An adsorption groove 24 is opened on the inner wall of the fixture positioning frame 1. The adsorption groove 24 is set as a U-shaped adsorption groove. The other air pump connection port 18 is connected to the adsorption groove 24 through the fixture positioning frame 1.

[0031] Working principle of this invention: When using this wave soldering fixture, simply select a suitable wave soldering tank 20, remove the specified wave soldering fixture and fixture positioning frame 1, place the workpiece to be soldered under the wave soldering fixture 19, and then connect it to the external air pump via the air pump connection port 18. The air pump connection port 18 connected to the connecting conduit 22 can be selected first. After connection, start the external air pump. As the external air pump operates, the connecting conduit 22 will draw gas from the positioning suction cup 23, pushing the workpiece upwards. This causes the workpiece to move upwards along the space inside the fixture positioning frame 1. When the workpiece contacts the positioning suction cup 23, the positioning suction cup 23 will adhere to the workpiece using suction. After fixing, another air pump can be connected via the external air pump. The interface 18 is connected so that during the welding process, the external air pump can draw air from the inside of the fixture positioning frame 1 through the suction tank 24, thereby accelerating the air flow rate inside the fixture positioning frame 1. After the workpiece to be welded is initially fixed by the positioning suction cup 23, the adjustment handle 14 can be rotated so that the adjustment handle 14 drives the other three first synchronous wheels 6 to rotate simultaneously. The first synchronous wheels 6 drive the workpiece positioning plate 16 to rotate along the adjustment rod 5 during the rotation. When the workpiece positioning plate 16 contacts the workpiece to be welded, the inclined surfaces 17 on both sides of the workpiece positioning plate 16 will squeeze the workpiece to be welded upward. When the workpiece to be welded is in a close fit with the wave soldering fixture 19, the top of the workpiece positioning plate 16 will contact the workpiece to be welded. After the workpiece positioning plate 16 rotates 180 degrees, the workpiece positioning plate 16 stops rotating.

[0032] Finally, the following points should be noted: First, in the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installation", "connection", and "linkage" should be interpreted broadly, and can be mechanical or electrical connections, or internal connections between two components, or direct connections. "Up", "down", "left", "right", etc. are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may change.

[0033] Secondly: The accompanying drawings of the embodiments disclosed in this invention only involve the structures involved in the embodiments disclosed in this invention. Other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of this invention can be combined with each other.

[0034] In conclusion, the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A wave soldering device for preventing poor foot, comprising a jig positioning frame (1), characterized in that: The outer surface of the jig positioning frame (1) is provided with mounting grooves (2) around, and the four mounting grooves (2) are provided with positioning sleeve rings (3) inside, the outer surfaces of the four positioning sleeve rings (3) are fixedly connected with the inner walls of the four mounting grooves (2) respectively, the inner wall of the positioning sleeve ring (3) is fixedly connected with the outer surface of the limiting friction ring (4), the adjusting rod (5) is clamped in the limiting friction ring (4), the outer surface of the adjusting rod (5) is fixedly connected with the inner wall of the first synchronous wheel (6), the outer surfaces of the four first synchronous wheels (6) are wound with the same synchronous belt (7), and the four first synchronous wheels (6) are drivingly connected through the synchronous belt (7), the inner wall of the synchronous belt (7) is respectively overlapped with the outer surfaces of the four second synchronous wheels (8), and the four second synchronous wheels (8) are drivingly connected through the synchronous belt (7), the inner walls of the four second synchronous wheels (8) are fixedly connected with the outer surfaces of the four connecting shafts (9) respectively, the top ends of the connecting shafts (9) are sleeved in the positioning bearings (10), the upper surfaces of the positioning bearings (10) are clamped in the lower surfaces of the fixed sleeves (11), and the four fixed sleeves (11) are respectively located at the four corners of the outer surface of the jig positioning frame (1), the bottom ends of the connecting shafts (9) are fixedly connected with the upper surfaces of the positioning bases (12) through the second synchronous wheels (8), and the four positioning bases (12) are in the same horizontal plane, the bottom end of the adjusting rod (5) is fixedly connected with the upper surface of the second fixed block (15) through the limiting friction ring (4), the outer surface of the second fixed block (15) is fixedly connected with the workpiece positioning plate (16), the workpiece positioning plate (16) is provided as a fan-shaped workpiece positioning plate, the left and right sides of the workpiece positioning plate (16) are provided as inclined surfaces (17), and the lower surfaces of the four workpiece positioning plates (16) and the lower surfaces of the four positioning bases (12) are located on the same horizontal line, the lower surfaces of the four workpiece positioning plates (16) and the lower surfaces of the four positioning bases (12) are provided with anti-skid insulating pads, the jig positioning frame (1) is provided with a wave solder jig (19) inside, the outer surface of the wave solder jig (19) is fixedly connected with the inner wall of the jig positioning frame (1), a plurality of wave solder grooves (20) are formed in the upper surface of the wave solder jig (19), two positioning grooves (21) are formed in the lower surface of the wave solder jig (19), the front surface of the jig positioning frame (1) is fixedly connected with two air pump connecting ports (18), and the two positioning grooves (21) are fixedly connected with connecting pipes (22) inside, the outer surfaces of the two connecting pipes (22) are fixedly connected with a plurality of positioning suction cups (23), one of the air pump connecting ports (18) is connected with the two connecting pipes (22) through the jig positioning frame (1), the lower surfaces of the positioning suction cups (23) are located on the same horizontal line with the lower surface of the wave solder jig (19), a plurality of tin dragging pieces (25) are arranged on the lower surface of the wave solder jig (19), and the inner wall of the jig positioning frame (1) is provided with an adsorption groove (24), the adsorption groove (24) is provided as a meandering adsorption groove.Another air pump connection port (18) is connected with the adsorption groove (24) through the jig positioning frame (1).

2. The apparatus according to claim 1, wherein: The limiting friction ring (4) is internally provided with a limiting groove, and the outer surface of the adjusting rod (5) is fixedly connected with a limiting rod.

3. The apparatus according to claim 1, wherein: The top end of the adjusting rod (5) is fixedly connected with the lower surface of the first fixed block (13), the upper surface of the first fixed block (13) is fixedly connected with two adjusting knobs (14), and the outer surfaces of the two adjusting knobs (14) are both provided with anti-skid lines.

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