A semiconductor test socket having a latch and a floating plate for holding a semiconductor device

Abstract

A test socket assembly for a semiconductor device for burn-in testing, comprising a base assembly, a floating plate coupled to the base assembly, and a latch assembly mounted on the floating plate for holding and moving the semiconductor device. The base assembly further includes a pin assembly for electrically coupling to the semiconductor device for burn-in testing and at least two upright flexure arms. Additionally, the floating plate and the latch assembly move to a test position to accommodate different heights of the semiconductor device when mating with a test fixture, while the latch still effectively holds the semiconductor device. Finally, when the semiconductor device is inserted into the test socket, the floating plate is held in a fixed loading position due to the support provided by the upright flexure arms.

Description

[0001] Cross - reference to Related Applications

[0002] This application claims the benefit of U.S. Patent Application No. 16 / 694,011, filed on November 25, 2019, entitled "Semiconductor Test Socket with a Floating Plate and Latch for Holding the Semiconductor Device", the entire content of which is incorporated herein by reference. Technical Field

[0003] The present disclosure relates to a socket for a semiconductor device for burn - in testing, and more particularly to a socket having a latch and a floating plate for holding the semiconductor device. Background Art

[0004] Semiconductor devices, such as integrated circuits (ICs), are subjected to tests, typically at elevated temperatures. Burn - in testing can eliminate the occurrence of defects in semiconductor devices over a predetermined period and prevent the shipment of faulty devices. Typically, during burn - in testing, a thermal unit, such as a heat sink or a hot plate, contacts the body of the semiconductor device. The success of burn - in testing depends largely on the flatness of the contact between the thermal unit and the body of the semiconductor device (i.e., no gap between the thermal unit and the body of the semiconductor device). U.S. Patent Nos. 8,388,365 B2 and 8,602,805 B2 disclose sockets for testing, each of which is incorporated herein by reference.

[0005] To accommodate increased test density, multiple semiconductor devices are simultaneously subjected to thermal burn - in testing. The semiconductor devices are held in test sockets, and the test sockets are arranged in a large pattern. Then, a single thermal unit contacts multiple semiconductor devices simultaneously. However, high - density testing reduces the efficiency of thermal testing because the variable thicknesses of different semiconductor devices prevent the thermal unit from effectively contacting the semiconductor devices for heating or cooling. There may also be variability in the height of the test sockets, heating elements, and / or cooling elements, which further hinders proper mating between the semiconductor devices under test and the thermal unit. Summary of the Invention

[0006] In view of the above, there is a need for a test socket for burn - in testing of semiconductor devices (such as IC chips) that can provide proper contact between a thermal unit and a semiconductor device during testing even when there are height variations in the semiconductor device or other components. The subject technology relates to a semiconductor burn - in test socket having a floating plate and opposing latches for holding the semiconductor device, which move to accommodate different heights.

[0007] One embodiment of the present disclosure relates to a test socket assembly for pre-burn testing of semiconductor devices. The test socket assembly includes: a base assembly including a pin assembly for electrically coupling to a semiconductor device for pre-burning; a floating plate coupled to the base assembly; and opposing latches mounted on the floating plate for moving and holding the semiconductor device. The floating plate and the opposing latches move to a test position to accommodate different heights of the semiconductor device when mating with a test fixture, while the latches still effectively hold the semiconductor device.

[0008] Another embodiment of the present disclosure relates to a test socket assembly for pre-burn testing of semiconductor devices. The test socket assembly includes a base assembly including a pin assembly for electrically coupling to a semiconductor device for pre-burning, at least one upright flexure arm, and a floating plate coupled to the base assembly. When inserting a semiconductor device into the test socket, the upright flexure arm supports the floating plate at a fixed loading position.

[0009] Yet another embodiment of the present disclosure relates to a test socket assembly for pre-burn testing of semiconductor devices. The test socket assembly includes: a base assembly including a pin assembly for electrically coupling to a semiconductor device for pre-burning; at least one upright flexure arm; a floating plate coupled to the base assembly; and a latch assembly mounted on the floating plate for moving and holding the semiconductor device. The floating plate and the latch assembly move to a test position to accommodate different heights of the semiconductor device when mating with a test fixture, while the latches still effectively hold the semiconductor device. When inserting a semiconductor device into the test socket, the upright flexure arm supports the floating plate at a fixed loading position.

[0010] It should be understood that the subject technology can be implemented and utilized in various ways, including but not limited to processes, apparatuses, systems, devices, methods for applications now known and later developed. These and other unique features of the systems disclosed herein will become more apparent through the following description and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Aspects of the present disclosure are discussed herein with reference to the drawings. It should be understood that for the sake of brevity and clarity of illustration, the elements shown in the drawings are not necessarily drawn precisely or to scale. For example, for clarity, the dimensions of some elements may be exaggerated relative to other elements, or several physical components may be included in one functional block or element. Additionally, where appropriate, reference numerals may be repeated among the drawings to indicate corresponding or similar elements. However, for the sake of clarity, not every component may be labeled in every drawing. The drawings are provided for purposes of illustration and explanation and are not intended as a definition of the limitations of the present disclosure.

[0012] Figure 1AA perspective view of a socket for pre-burn testing of semiconductor devices loaded with semiconductor devices in accordance with the present subject matter technology is shown.

[0013] Figure 1B A perspective view of a socket for pre-burn testing of semiconductor devices without semiconductor devices in accordance with the present subject matter technology is shown. Figure 1A The perspective view of the socket shown.

[0014] Figure 2A Shown is Figure 1A and 1B The perspective exploded view of the test socket.

[0015] Figure 2B Shown is Figure 1A and 1B The front exploded view of the test socket.

[0016] Figure 2C Shown is Figure 1A and 1B The bottom perspective exploded view of the test socket.

[0017] Figure 3 Shown is Figure 1A and 1B The front planar view of the empty test socket.

[0018] Figure 4A Shown is the Figure 1A and 1B Perspective cross-sectional view of the test socket having a semiconductor device and a load head thereon.

[0019] Figure 4B Shown is Figure 1A and 1B The cross-sectional view of the test socket, where the load head has been partially inserted.

[0020] Figure 4C Shown is Figure 1A and 1B The cross-sectional view of the test socket in the fixed load position, where the load head has been fully inserted thereon.

[0021] Figure 4D Shown is Figure 1A and 1B The front cross-sectional view of the test socket in the fixed load position, where the load head has been fully inserted thereon.

[0022] Figure 4E Shown is Figure 1A and 1B The front cross-sectional view of the socket, where semiconductor devices are loaded after the load head is removed.

[0023] Figure 5 Shown in accordance with the present subject matter technologyFigure 1A and 1B front cross-sectional view of a socket, in which the loaded socket is in contact with the thermal unit.

[0024] Figure 6 is a cross-sectional view of another test socket according to the subject technology. DETAILED DESCRIPTION

[0025] The subject technology overcomes many well-known problems associated with ensuring good contact between a semiconductor device mounted in a test socket and a thermal unit during thermal testing of the semiconductor device. From the following detailed description of certain exemplary embodiments in conjunction with the accompanying drawings, the advantages and other features of the technology disclosed herein will become apparent to those of ordinary skill in the art, where like reference numerals represent similar structural elements. It should be noted that directional indications, such as top, bottom, vertical, horizontal, inward, outward, upward, downward, right, left, etc., are used with respect to the drawings and are not meant in a limiting manner.

[0026] Reference Figure 1A and Figure 1B shows a perspective assembled view of a test socket 100 for pre-burn testing of a semiconductor device. Figure 1A Depicts the test socket 100 with a semiconductor device 102 loaded thereon (e.g., at a test position). Figure 1B Depicts the test socket 100 before the semiconductor device 102 is loaded, with several lower-level components omitted for clarity. The semiconductor device 102 can be an integrated circuit (IC) or the like.

[0027] The test socket 100 includes a base assembly 110, which includes a main body 160 having four upright flexure arms 162. A floating plate 200 is slidably coupled to the base assembly 110. Two opposing latches 240 are mounted on the floating plate 200 for moving therewith and for holding the semiconductor device 102 thereon. The floating plate 200 is biased upward. In another embodiment, the main body 160 has fewer upright flexure arms, such as two or three. When viewed from above, the floating plate 200 is slightly H-shaped such that four corners 220 form opposing spaces 222.

[0028] When the semiconductor device 102 is loaded as Figure 1A shown, the floating plate 200 and the latches 240 are free to move downward to accommodate different heights of the semiconductor device 102 when mating with a test fixture (e.g., Figure 5 partially shown therein), while the latches 240 still effectively hold the semiconductor device 102. When the semiconductor device 102 is inserted into the test socket 100, the floating plate 200 is supported at a fixed loading position, as described below with reference to Figure 4A -D.

[0029] Also refer to Figure 2A -C, which respectively shows the top perspective, front, and bottom perspective exploded views of the test socket 100. In the base assembly 110, the main body 160 is coupled to the pin assembly 120. The base assembly 110 further includes a rectangular backplane 112, where the insulator sheet 114 is below the pin assembly 120.

[0030] The pin assembly 120 includes a pre-burn-in board 130 seated on the insulator sheet 114. The pre-burn-in board 130 forms an array 132 of pads or pads to receive a plurality of contact pins 122 by compression mounting. The contact pins 122 are preferably pogo pins. The stopper 140 is connected to the main body 160 to accommodate the contact pins 122. The stopper 140 also has two overhanging cylinders 142, which are respectively fitted into the round slots 134 of the pre-burn-in board 130 and the backplane 112. The contact pins 122 also pass through an array 144 of holes formed in the stopper 140. The stopper 140 has four upright deflectable fingers 146, and each finger 146 has a distal latch 148 located on the top side 150 of the stopper 140. Each finger 146 is snap-fitted into a hole 164 formed in the main body 160, such that the top surface 168 of the main body 160 serves as a ledge to hold the corresponding latch 148 in place. The contact pins 122 are also aligned with and pass through an array 166 of holes in the main body 160 to connect to the semiconductor device 102 during loading.

[0031] The main body 160, the pre-burn-in board 130, the insulator 114, and the backplane 112 each have four corner through-holes 170, 136, 118, 116. The insert nut 172 is fixed in the corner hole 170 of the main body 160. The insert nut 172 has internal threads to capture the screw 111 passing through the corner through-holes 170, 136, 118, 116, thereby holding the pin assembly 120 and the main body 160 together to form the base assembly 110.

[0032] Still referring to Figure 2A -C, the floating plate 200 is slidably coupled to the main body 160 by inserting four overhanging tongues 202 into the slots 174 formed in the main body 160. Each tongue 202 has a snap feature 204 that latches onto the recessed bottom portion 176 of the main body 160. Thus, the tongue 202 can freely move further into the slot 174 but cannot retract because the snap feature 204 latches onto the bottom portion 176. The wide and flat dimensions and shapes of the tongue 202 and the slot 174 prevent the floating plate 200 from rotating relative to the main body 160, effectively guiding the sliding movement of the floating plate 200.

[0033] The floating plate 200 is biased upward from the main body 160 by four floating plate springs 206, which are assembled into their respective floating spring circular grooves 178 on the main body 160. As Figure 2B Best shown, the floating plate 200 has spring guides 208 assembled into each floating plate spring 206 to ensure proper positioning of the floating plate springs 206. The main body 160 forms an end cavity 180 for receiving the floating plate 200 and the latch 240.

[0034] Opposing pairs of flexible arms 162 stand upright in the cavity 180 for supporting the floating plate 200 during loading of the semiconductor device 102. The flexible arms 162 each have a distal end 182 to interact with a complementary contact surface 210 of the floating plate 200. The flexible arms 162 also each have an inward protrusion 184 to interact with the outer sidewall 304 of the inner shoulder 302 of the loading head 300 when loading the semiconductor device 102.

[0035] Despite the upward biasing, the floating plate 200 can be moved downward in a controlled manner by inserting it deeper into the slot 174 through the tongue 204. In one embodiment, the maximum downward travel or float of the floating plate 200 is equal to the clearance height "h" between the floating plate 200 and the main body 160. The floating plate 200 also includes a plurality of contact pin holes 212 through which the contact pins 122 contact the semiconductor device 102 during testing.

[0036] During the pre-burn test (e.g., test position), opposing latches 240 hold the semiconductor device 102 stably on the floating plate 200. The opposing latches 240 are mounted on the floating plate 200 such that when the floating plate 200 moves, the latches 240 move therewith.

[0037] Each latch 240 forms a pivot 242. The pivot 242 is assembled into a pivot channel 216 on the floating plate 200 through a side slot 214, respectively. Thus, the latch 240 rotates about an axis "a" that passes centrally through each pivot 242. Each latch 240 has an upright clamping portion 244 that terminates in a chip contact surface 246 having an upper lip 248. Each latch 240 also has a horizontal lever portion 250. Each latch 240 may have an upper inclined ramp 252 that interacts with the loading head 300. Although this embodiment describes the upper inclined ramp 252 on the latch 240, various other shapes and configurations may also serve the same purpose.

[0038] The latch 240 is biased to the closed position by a latch spring 254 that extends between the main body 160 and the lever portion 250. The latch spring 254 is formed by a collar 188 in the side cavity 180 of the main body 160 (see Figure 4B and 4C) and a retaining ridge 256 (see Figure 2B 、 Figure 4B and Figure 4C ) that extends downward from the lever portion 250 of the latch 240 hold it in place. The floating plate 200 has sufficient clearance space 218 to allow the latch 240 to rotate freely when mounted thereon.

[0039] Still referring to Figure 2A -C, the loading head 300 is part of a pre-burn test assembly (not shown) for mounting the semiconductor device 102 onto the test socket 100. When the loading head 300 is lowered onto the test socket 100, the latch 240 moves outward so that the semiconductor device 102 can be loaded as described in more detail below. Once the semiconductor device 102 is inserted, the loading head 300 is removed so that the latch 240 engages and fixes the semiconductor device 102 in place for the pre-burn test.

[0040] As Figure 2C best seen in, the loading head 300 has inner shoulders 302 on each side 306. The inner shoulders 302 have a bottom surface 308 for selectively contacting the inclined ramp 252 of the latch 240 and an outer sidewall 304 for selectively contacting the flexible arm 162, as described in more detail below. The loading head 300 also forms a loading port 310 for providing access to the floating plate 200 during loading of the semiconductor device 102. The loading head 300 also has an upper flange 312 that seats on the floating plate 200 when the loading head 300 is fully inserted onto the test socket 100.

[0041] Loading a Semiconductor Device onto a Test Socket

[0042] Once assembled, the test socket 100 is placed in a large array of similar test sockets. The array can be more or less than 256 such that a large number of semiconductor devices 102 can be quickly and simultaneously loaded onto the corresponding test sockets 100 and pre-burn tested. Thus, the manufacturing bottleneck caused by the pre-burn test can be alleviated.

[0043] For simplicity, Figure 4A -E details the process of loading a single semiconductor device 102 onto a single test socket 100. However, it should be understood that any number of test sockets 100 can be arranged with a tooling fixture (not shown) for mounting multiple semiconductor devices 102, the tooling fixture having a plurality of IC loading heads 300 that are arranged to interact with the plurality of test sockets 100.

[0044] In Figure 3In [the figure], a front - view planar view of the empty test socket 100 is shown, where the latch 240 is open for illustration purposes. It should be understood that the latch 240 is normally biased closed. The latch 240 remains closed until the loading head 300 forces it open.

[0045] Now refer to Figure 4A and 4B , a perspective cross - sectional view and a cross - sectional view of the test socket 100 are shown, where the loading head 300 has been partially inserted. When the loading head 300 is placed down onto the test socket 100, the inner shoulder 302 contacts the flexible arm 162. As Figure 4C shown, when the outer sidewall 304 of the shoulder 302 slides down against the inward protrusion 184, the flexible arm 162 spreads outwards. Thus, the end 182 of the flexible arm 162 contacts the complementary contact surface 210 of the floating plate 200, such that the floating plate 200 no longer moves freely downwards. In one embodiment, the floating plate 200 becomes stably positioned to load the semiconductor device 102 merely by resting on the end 182. For further stability of the floating plate 200, the end 182 can be wedged between the contact surface 210 of the floating plate 200 and the ledge 168 of the main body 160. Almost simultaneously, the flange 312 of the loading head 300 contacts the main body 160 to limit further downward travel of the loading head 300.

[0046] Now refer to Figure 4D , a cross - sectional front - view of the test socket 100 in the loading position by fully inserting the loading head 300 is shown. As can be seen from Figure 4D , the bottom surface 308 of the inner shoulder 302 of the loading head 300 contacts the inclined ramp 252 of the latch 240, thereby applying a downward force. This downward force causes the latch 240 to rotate about the axis "a" of the pivot 242. Thus, the clamping portion 244 rotates outwards from the floating plate 200, and the latch spring 254 is compressed in the loading position (i.e., the latch 240 is open). Additionally, in the loading position, not only is the floating plate 200 stabilized, but also the latch 240 rotates out of the way so that the semiconductor device 102 can be easily loaded through the loading port 310 of the loading head 300. It is conceivable but not necessary to place a large array of semiconductor devices 102 simultaneously on a large array of test sockets 100.

[0047] Now refer to Figure 4E, a cross-sectional front view of the test socket 100 of FIG. 1 loaded with the semiconductor device 102 is shown. Once the semiconductor device 102 is positioned on the floating plate 200, the loading head 300 (not shown in this figure) is removed. As the loading head 300 is removed from the test socket 100, the downward force acting on the inclined ramp 252 of the latch 240 is removed. The latch spring 254 pushes the corresponding lever portion 250 upward, causing the clamping portion 244 to rotate inward to contact the semiconductor device 102 on the floating plate 200. The opposing vertical chip contact surfaces 246 can apply sufficient compressive force to fully hold the semiconductor device 102. However, each clamping portion 244 includes an upper lip 248, which enhances the holding of the semiconductor device 102 by the clamping portion 244. Thus, the semiconductor device 102 is firmly loaded on the floating plate 200 and positioned for the burn-in test.

[0048] Testing a Semiconductor Device on a Test Socket

[0049] Figure 5 A cross-sectional front view of the test socket 100 in the test mode according to the present subject technology is shown, where the loaded semiconductor device 102 is in contact with the thermal unit 400 (not fully shown). The thermal unit 400 includes a heating or cooling element 402, which is part of a larger array that contacts a plurality of semiconductor devices 102 during testing. For the burn-in test, the element 402 is typically a heating element. Although the height position of the semiconductor device 102 is changed due to the movement of the floating plate 200 and the latch 240 having the floating plate 200, the element 402 effectively contacts the semiconductor device 102 during the burn-in test.

[0050] The element 402 is substantially flat but includes an overhang region 404 that is sized and configured to fit within the latch 240 but covers most of the corresponding semiconductor device 102. The element 402 is typically a good thermal conductor such that the thermal energy applied to it is easily conducted to or from the semiconductor device 102.

[0051] As the thermal unit 400 moves toward the semiconductor devices 102, the overhang region 404 contacts each semiconductor device 102 and applies a downward force thereto. The overhang region 404 and the semiconductor devices 102 can be at different heights. However, since the floating plate 200 is slidably mounted and biased upward by the floating plate spring 206, the first contacted semiconductor device 102 and the overhang region 404 will not prevent effective contact between the subsequently contacted semiconductor devices 102 and the overhang region 404. In other words, the tall semiconductor devices 102 push the corresponding floating plates 200 downward, and the thermal unit 400 continues to move downward until it contacts all the semiconductor devices 102 without any gaps. Thus, the non-uniform thermal unit 402 or the variable thickness of the plurality of semiconductor devices 102 does not prevent an effective and efficient burn-in test.

[0052] In another embodiment, the subject technology relates to a test socket assembly that does not have upright flex arms on a base assembly. For example, springs can be selected to provide sufficient support for the floating plates so that the loading of the test socket can still be achieved reliably. In yet another embodiment, the test socket assembly does not employ latches. Instead, the device being tested is held firmly enough by the pins being inserted so that latches are not needed.

[0053] Now referring Figure 6 , a test socket 600 according to yet another embodiment of the subject technology is shown in cross-section. Elements similar to those described in connection with the above embodiments are designated with like reference numerals in the 600 series. Many of the elements are similar or identical to the elements of the foregoing embodiments and thus are not described further here. The main difference between the above embodiments and the test socket 600 is the pin assembly 620. It should be noted that the burn-in board and the backplane are not shown in Figure 6 and

[0054] The pin assembly 620 employs etched contact pins 622 that are received within a base assembly 610 that includes a main body 660 of the test socket 600. Each contact pin 622 is fixed to a retainer insert 621. The retainer inserts 621 fixed by the pins 622 are stacked and held together by shafts 648 to form a pin assembly 620 having a gap "b" between each contact pin 622. Once assembled, the pin assembly 620 is inserted into the main body 660. It is envisioned that the pin assembly 620 includes a plurality of inserts 621 made of thin plastic.

[0055] The lead guide 641 is connected to the main body 660. The lead guide 641 has at least one guiding tongue 646 which is mounted in a corresponding slot (not shown) of the main body 660. The stopper 640 has an alignment screw or post 672 passing through the main body 660 and the lead guide 641 for aligning the base assembly 610 and the pin assembly 620 together. The lead guide 641 has an array of holes 644 for receiving the contact pins 622.

[0056] The contact pin 622 includes a distal male end 623, a distal straight region 624, a distal arc 625, an intermediate straight region 626, a proximal arc 627, and a proximal female end 628. The distal male end 623 of the contact pin 622 is stabilized in the main body 660 by a lower locking feature 690, an upper locking feature 692, and an annular ridge 629 near the proximal female end 628 which interacts with the retainer insert 621. The main body 660 has an array of guide holes 656 for receiving the proximal female ends 628 of the contact pins 622.

[0057] The lower locking feature 690 secures the distal male end 623. In one embodiment, the insert 621 forms a necked channel 695 which establishes the lower locking feature 690 to prevent significant upward or downward movement of the corresponding pin 622. However, the upper locking feature 692 and the annular ridge 629 only restrict the upward travel of the proximal female end 628. As shown, the upper locking feature 692 includes a pin protrusion 693 which cannot enter the corresponding guide hole 656 in the insert 694. Thus, the proximal female end 628 is free to move downward by elastic flexure or deformation of the distal straight region 624, the distal arc 625, the intermediate straight region 626, and the proximal arc 627, but is elastically biased upward by the material of the contact pin 622. In one embodiment, the contact pin 622 is etched from a metal sheet to have a generally rectangular or square cross-section, and the insert 694 forms an open interior 696 which allows the pin 622 to deform while maintaining a gap "b" therebetween.

[0058] Figure 6 The illustrated embodiment further includes a floating plate 681 which is slidably coupled to the top surface of the main body 660 and is biased upward, as described above. Again, during the process of loading the semiconductor device 602 onto the floating plate 681, the flexure arm 662 spreads apart to support the floating plate 681.

[0059] Although Figure 6Although not shown, the test socket 600 may have two or more floating plates such that multiple semiconductor devices are ready to be tested on a single test socket 600. For simplicity, the second floating plate on the left side is not shown. For the second plate, the contact pins are similarly fabricated and assembled but pass upward from right to left without contacting other pins. In another embodiment, the contact pins are coated, spaced apart by spacers / inserts, or otherwise separated to prevent electrical contact during assembly and bending.

[0060] The foregoing subject technology has several advantages over known solutions, including but not limited to ensuring flush contact between the semiconductor device and the thermal unit, regardless of the thickness of the semiconductor device. With the latter in place, it becomes feasible to simultaneously test a substantial number of semiconductor devices, even for variable sizes. The ability to simultaneously test a substantial number of semiconductor devices reduces the need for multiple size-appropriate test furnaces, overall cost, and complexity. As can be seen, the investment cost, cost of ownership, and efficacy of pre-burn testing of semiconductor devices are all improved by the subject technology.

[0061] Those skilled in the art should understand that the functions of several elements in the related art may be performed by fewer elements or a single element in alternative embodiments. Similarly, in some embodiments, any functional element may perform fewer or different operations compared to those described with respect to the illustrated embodiments. Additionally, functional elements shown as distinct for purposes of illustration may be incorporated within other functional elements in a particular implementation.

[0062] Although the subject technology has been described with respect to various embodiments, those skilled in the art will readily understand that various changes and / or modifications can be made to the subject technology without departing from the scope of the disclosure.

Claims

1. A test socket assembly for a semiconductor device, comprising: A base assembly, the base assembly comprising: a pin assembly for electrically coupling to the semiconductor device for pre-burning; and at least one upright flexure arm; A floating plate, the floating plate being slidably coupled to the base assembly, wherein when the semiconductor device is inserted into the test socket assembly, the at least one upright flexure arm supports the floating plate at a fixed loading position; Opposing latches, the opposing latches being mounted on the floating plate for moving with the floating plate and holding the semiconductor device on the floating plate, wherein each latch includes an upright clamping portion and a horizontal lever portion in contact with a latch spring; and A floating plate spring, which extends between the floating plate and the base assembly and is fitted into corresponding floating spring circular grooves on the main body of the base assembly, wherein the floating plate is biased upward from the main body by the floating plate spring.

2. The test socket assembly according to claim 1, wherein: The floating plate has four corners forming opposing spaces; and The at least one upright flexure arm is four upright flexure arms, each flexure arm configured to selectively interact with a corresponding corner of the floating plate at the fixed loading position.

3. The test socket assembly according to claim 2, further comprising a loading head, the loading head comprising opposing inner shoulders having outer sidewalls, wherein: The loading head is mounted on the test socket assembly such that the outer sidewalls flare out the four upright flexure arms to support the four corners of the floating plate at the fixed loading position; and Each flexure arm includes an inward protrusion for contacting a corresponding outer sidewall of the inner shoulder of the loading head.

4. A test socket assembly for a semiconductor device, comprising: A base assembly, the base assembly comprising a pin assembly for electrically coupling to the semiconductor device for pre-burning; A floating plate, the floating plate being slidably coupled to the base assembly; And Opposing latches, the latches being mounted on the floating plate for moving with the floating plate and holding the semiconductor device thereon, wherein the floating plate and the opposing latches move to a test position to accommodate different heights of the semiconductor device when mating with a test fixture, while the latches still effectively hold the semiconductor device, wherein each latch includes an upright clamping portion and a horizontal lever portion in contact with a latch spring, wherein the floating plate is biased away from the base assembly by four floating plate springs extending between the floating plate and the base assembly.

5. The test socket assembly according to claim 4, wherein: The floating plate includes a tongue for fitting into a slot formed in the main body of the base assembly to guide the movement of the floating plate relative to the base assembly; and The maximum stroke of the floating plate is equal to the clearance height "h" between the floating plate and the main body.

6. The test socket assembly according to claim 5, further comprising a latch spring that extends between the floating plate and the main body for biasing each opposing latch to a closed position to hold the semiconductor device.

7. A test socket assembly for a semiconductor device, comprising: A base assembly including a pin assembly for electrically coupling to the semiconductor device for pre-burning and at least one upright flexure arm; At least one floating plate slidably coupled to the base assembly; and At least one latch assembly mounted on the at least one floating plate for moving with the floating plate and holding the semiconductor device thereon, Wherein the at least one floating plate is biased away from the base assembly by four floating plate springs extending between the floating plate and the base assembly; When mating with a test fixture, the at least one floating plate and the at least one latch assembly move to a test position to accommodate different heights of the semiconductor device, while the latch still effectively holds the semiconductor device, and when the semiconductor device is inserted into the test socket assembly, the at least one upright flexure arm supports the floating plate at a fixed loading position, wherein each latch of the at least one latch assembly includes an upright clamping portion and a horizontal lever portion in contact with the latch spring.

8. The test socket assembly according to claim 7, wherein: The at least one floating plate has four corners forming opposing spaces; and The at least one upright flexure arm is four upright flexure arms, each flexure arm configured to selectively interact with a corresponding corner of the floating plate at the fixed loading position.

9. The test socket assembly according to claim 8, further comprising a loading head including opposing inner shoulders having outer sidewalls, wherein at the fixed loading position, the loading head is mounted on the test socket assembly such that the outer sidewalls flare out the four upright flexure arms to support the four corners of the at least one floating plate.

10. The test socket assembly according to claim 9, wherein, The at least one latch assembly includes opposing latches mounted on the at least one floating plate for moving with the floating plate and holding the semiconductor device thereon, wherein the floating plate and the opposing latches move to a test position to accommodate different heights of the semiconductor device when mating with the test fixture, while the latch still effectively holds the semiconductor device.

11. The test socket assembly according to claim 10, wherein: The opposing latches and the inner shoulders move within the opposing spaces; The at least one floating plate includes a tongue for fitting into a slot formed in the main body of the base assembly to guide the movement of the at least one floating plate relative to the base assembly; The maximum travel of the at least one floating plate is equal to the clearance height "h" between the floating plate and the main body.

12. The test socket assembly according to claim 11, further comprising a latch spring that extends between the floating plate and the main body for biasing each opposing latch to a closed position to hold the semiconductor device.

13. The test socket assembly according to claim 7, wherein, The pin assembly includes contact pins, and the contact pins include: a proximal female end that is close to the floating plate and configured to connect to the semiconductor device, and the proximal female end is positioned orthogonally to the floating plate; an intermediate straight region that is connected to the proximal female end and is positioned parallel to the floating plate; and a distal male end that is distal to the floating plate and is connected between the lead guide and the intermediate straight region, and the distal male end is positioned orthogonally to the floating plate.

14. The test socket assembly according to claim 13, wherein, The contact pin further includes: a proximal arc that connects the proximal female end to the intermediate straight region; and a distal arc that connects the distal straight region of the distal male end and the intermediate straight region, wherein: the contact pin is biased to move away from the base assembly; the distal straight region of the distal male end includes a lower locking feature that immovably couples the distal male end to the test socket assembly; and the proximal female end has an upper locking feature that is distal to the proximal female end and close to the proximal arc, and a corresponding guide hole of the contact pin prevents the upper locking feature from passing therethrough.

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