Control Method and System for Exposure Batches

Abstract

The present application discloses a method and a system for controlling exposure batches. The method includes: obtaining the exposure energy of the product batch currently running in the exposure device; obtaining the exposure energy and alignment accuracy of subsequent product batches; when the exposure energy of the product batch currently running is greater than the reference energy and the exposure energy of the subsequent product batches is less than the reference energy, among the subsequent product batches, those with the eigenvalue of the alignment accuracy greater than or equal to the reference value are arranged in the first queue, and those with the eigenvalue of the alignment accuracy less than the reference value are arranged in the second queue, where the higher the eigenvalue of the alignment accuracy, the lower the requirement for the alignment accuracy; arranging the operation sequence of the subsequent product batches to operate the first queue first and then the second queue. By giving priority to running the subsequent product batches with low requirements for alignment accuracy when it is determined that the exposure energy of the product batch currently running is high, the present application avoids the aberration problem and improves the yield of the production line.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and particularly to a method and system for controlling exposure batches. Background Art

[0002] In semiconductor manufacturing, during the exposure process of an exposure device, the lens of the exposure device will be gradually heated, and its aberration value will also change accordingly, and finally reach a thermal stable state; when the exposure stops, the lens will gradually cool down, and the aberration value will gradually decrease to the state when the lens is cooled.

[0003] During the production process of semiconductor products, after a product batch with high requirements for exposure energy is run, the aberration value of the lens increases. If the overlay (OVL) window of the next product batch is small at this time, it is easy to cause the overlay accuracy to shift, which will cause the OVL inspection result of this batch of products to be out of specification (OOS), resulting in rework of this batch.

[0004] In view of this, in the related art, after a product batch with high requirements for exposure energy is run, a dummy wafer is run to reduce the influence of the lens heating on the next product batch (especially the product with a small OVL window). However, running a dummy wafer will prolong the operation time, thereby increasing the manufacturing cost. Summary of the Invention

[0005] The present application provides a method and system for controlling exposure batches, which can solve the problem of long operation time caused by running a dummy wafer to reduce the influence of lens heating on the next product batch in the related art.

[0006] On the one hand, an embodiment of the present application provides a method for controlling exposure batches, including:

[0007] Obtaining the exposure energy of the currently running product batch in the exposure device;

[0008] Obtaining the exposure energy and alignment accuracy of the subsequent product batch;

[0009] When the exposure energy of the currently running product batch is greater than the reference energy, and the exposure energy of the subsequent product batch is less than the reference energy, among the subsequent product batches, those with the characteristic value of the alignment accuracy greater than or equal to the reference value are arranged in the first queue, and those with the characteristic value of the alignment accuracy less than the reference value are arranged in the second queue. The higher the characteristic value of the alignment accuracy, the lower the requirement for the alignment accuracy;

[0010] Arranging the operation order of the subsequent product batches to operate in the order of running the first queue first and then the second queue.

[0011] In some embodiments, in the first queue, sorting is performed in the order of decreasing eigenvalues of alignment accuracy.

[0012] In some embodiments, in the second queue, those with the same alignment accuracy are placed in the same group.

[0013] In some embodiments, in each group, sorting is performed in the order of decreasing exposure energy.

[0014] In some embodiments, if there are product batches with the same exposure energy and alignment accuracy, the product batches at the same level are sorted ahead.

[0015] In some embodiments, if there are no product batches with eigenvalues of alignment accuracy greater than or equal to the reference value in subsequent product batches, then after an idle predetermined time, the subsequent product batches are run.

[0016] In some embodiments, the exposure energy is set based on the energy when the heat generated by the exposure device during the operation of the product batch is equal to the heat dissipated.

[0017] In some embodiments, the eigenvalue of the alignment accuracy is set based on the capabilities of the exposure device.

[0018] In some embodiments, the exposure device is a linear step exposure device.

[0019] On the other hand, an embodiment of the present application provides a control system for exposure batches, including:

[0020] A manufacturing execution system module for feeding back the exposure energy of the product batch currently being run by the exposure device to the real-time data module;

[0021] A process control module for feeding back the exposure energy and alignment accuracy of subsequent product batches to the real-time data module;

[0022] The real-time data module, when the exposure energy of the currently running product batch is greater than the reference energy and the exposure energy of the subsequent product batches is less than the reference energy, sorts the product batches in the subsequent product batches with eigenvalues of alignment accuracy greater than or equal to the reference value into the first queue, and those with eigenvalues of alignment accuracy less than the reference value into the second queue. The higher the eigenvalue of the alignment accuracy, the lower the requirement for alignment accuracy; the operation order of the subsequent product batches is to run the first queue first and then the second queue.

[0023] The technical solution of the present application has at least the following advantages:

[0024] During the exposure operation of semiconductor products, when it is determined that the exposure energy of the currently running product batch is high while the exposure energy of the subsequent product batch is low, the subsequent product batches with low alignment accuracy requirements are preferentially run, thus avoiding the large aberration generated by the exposure equipment due to running product batches with high exposure energy, which affects the subsequent product batches with high alignment accuracy requirements, and improving the yield of the production line. Brief Description of the Drawings

[0025] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the following will briefly introduce the drawings required for the description of the specific embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0026] Figure 1 It is a topology diagram of a control system for exposure batches provided by an exemplary embodiment of the present application;

[0027] Figure 2 It is a flowchart of a control method for exposure batches provided by an exemplary embodiment of the present application. Detailed Embodiments

[0028] The following will clearly and completely describe the technical solutions in the present application in conjunction with the drawings. Obviously, the described embodiments are some, rather than all, embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present application.

[0029] In the description of the present application, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present application. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0030] In the description of the present application, it should be noted that unless otherwise clearly specified and defined, the terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be a direct connection or an indirect connection through an intermediate medium, and may also be the communication inside two components. It may be a wireless connection or a wired connection. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0031] In addition, the technical features involved in different embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.

[0032] Reference Figure 1 , which shows a topology diagram of a control system for an exposure batch provided by an exemplary embodiment of the present application, as Figure 1 shown, the system includes:

[0033] A manufacturing execution system (MES) module 110, configured to obtain information about the product batch currently being run by the exposure device 200 (the exposure device 200 may be a linear step (i-line stepper) exposure device), and feedback the exposure energy of the product batch currently being run by the exposure device 200 to a real-time data control (RTD) module 130.

[0034] Among them, the exposure energy of the product batch currently being run can be reported by the MES module 110 to the RTD module 130, or the RTD module 130 can obtain the exposure energy of the product batch currently being run from the MES module 110.

[0035] An advanced process control (APC) module 120, configured to obtain information about the subsequent product batch of the exposure device 200, and feedback the exposure energy and alignment accuracy of the subsequent product batch to the RTD module 130.

[0036] Among them, the exposure energy and alignment accuracy of the subsequent product batch can be reported by the APC module 120 to the RTD module 130, or the RTD module 130 can obtain the exposure energy and alignment accuracy of the subsequent product batch from the APC module 120.

[0037] The RTD module 130 is used to execute the control method for the exposure batches provided by any of the following method embodiments. For example, when the exposure energy of the currently running product batch is greater than the reference energy, and the exposure energy of the subsequent product batch is less than the reference energy, among the subsequent product batches, those with the eigenvalue of the alignment accuracy greater than or equal to the reference value are arranged in the first queue, and those with the eigenvalue of the alignment accuracy less than the reference value are arranged in the second queue (where the higher the eigenvalue of the alignment accuracy, the lower the requirement for the alignment accuracy); the operation order of the subsequent product batches is to operate the first queue first and then the second queue.

[0038] In the embodiments of the present application, the MES module 110, the APC module 120, and the RTD module 130 can be loaded into at least one computer device in the form of an application (APP); the control system for the exposure batches can control the product batches of at least one exposure device. Figure 1 Here, one exposure device 200 is used as an example for illustration.

[0039] Reference Figure 2 , which shows the flowchart of the control method for the exposure batches provided by an exemplary embodiment of the present application. This method can be applied to Figure 1 the system provided by the embodiment, as Figure 2 shown, this method includes:

[0040] Step S1, obtain the exposure energy of the currently running product batch in the exposure device.

[0041] The currently running product batch includes at least one wafer of the same product. As described above, the MES module obtains the information of the currently running product batch in the exposure device and feeds back the exposure energy of the currently running product batch in the exposure device to the RTD module 130.

[0042] Step S2, obtain the exposure energy and alignment accuracy of the subsequent product batch.

[0043] As described above, the APC module obtains the information of the subsequent product batch in the exposure device and feeds back the exposure energy and alignment accuracy of the subsequent product batch to the RTD module.

[0044] In the embodiments of the present application, the exposure energy is set based on the energy when the heat generated by the exposure device during the operation of the product batch is equal to the heat dissipated, and the eigenvalue of the alignment accuracy is set based on the capabilities of the exposure device.

[0045] Step S3, when the exposure energy of the currently running product batch is greater than the reference energy, and the exposure energy of the subsequent product batch is less than the reference energy, among the subsequent product batches, those with the eigenvalue of the alignment accuracy greater than or equal to the reference value are arranged in the first queue, and those with the eigenvalue of the alignment accuracy less than the reference value are arranged in the second queue.

[0046] Step S4, perform operations on the operation sequence of subsequent product batches in the order of first running the first queue and then running the second queue.

[0047] Exemplarily, the reference values of reference energy and alignment accuracy are preset parameters. When the exposure energy of the currently running product batch is greater than the reference energy, it can be considered that after the exposure equipment runs the current product batch, the subsequent product batches will be affected due to the heat of the lens. Therefore, it is necessary to divide the subsequent product batches, and preferentially expose the products with larger characteristic values of alignment accuracy (that is, lower requirements for alignment accuracy and less influence of lens heat on them). Among them, the reference energy can be [200, 600] millijoules (for example, it can be 400 millijoules); the reference value of alignment accuracy can be [25, 75] nanometers (for example, it can be 50 nanometers).

[0048] Further, in the first queue, the sorting can be performed in the order of decreasing characteristic values of alignment accuracy.

[0049] Further, in the second queue, the products with the same alignment accuracy can be placed in the same group, and in each group, the sorting is performed in the order of decreasing exposure energy.

[0050] In the embodiment of the present application, if there are product batches with the same exposure energy and alignment accuracy, the product batches at the same level can be sorted first; if there are no product batches with characteristic values of alignment accuracy greater than or equal to the reference value in the subsequent product batches, then after a predetermined idle time, the subsequent product batches are run, so as to avoid the influence of lens heat on the subsequent product batches.

[0051] In summary, in the embodiment of the present application, during the exposure operation of semiconductor products, when it is determined that the exposure energy of the currently running product batch is high while the exposure energy of the subsequent product batches is low, the subsequent product batches with low requirements for alignment accuracy are preferentially run, thereby avoiding the large aberration generated by the exposure equipment due to running product batches with high exposure energy and affecting the subsequent products with high requirements for alignment accuracy, and improving the yield of the production line.

[0052] Obviously, the above embodiments are only examples clearly described and not limitations on the implementation manners. For those of ordinary skill in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation manners here. And the obvious changes or modifications derived therefrom are still within the protection scope of the present invention.

Claims

1. A method for controlling exposure batches, characterized in that, Including: Obtain the exposure energy of the product batch currently running in the exposure device; Obtain the exposure energy and alignment accuracy of subsequent product batches; When the exposure energy of the currently running product batch is greater than the reference energy and the exposure energy of the subsequent product batch is less than the reference energy, among the subsequent product batches, those with the eigenvalue of the alignment accuracy greater than or equal to the reference value are put into the first queue, and those with the eigenvalue of the alignment accuracy less than the reference value are put into the second queue. The higher the eigenvalue of the alignment accuracy, the lower the requirement for the alignment accuracy; Arrange the operation order of the subsequent product batches to operate in the order of running the first queue first and then the second queue; Among them, in the first queue, sort in descending order of the eigenvalue of the alignment accuracy. In the second queue, group those with the same alignment accuracy together, and in each group, sort in descending order of the exposure energy.

2. The method according to claim 1, wherein If there are product batches with the same exposure energy and alignment accuracy, sort the product batches at the same level first.

3. The method according to claim 1 or 2, characterized in that, If there are no product batches with the eigenvalue of the alignment accuracy greater than or equal to the reference value in the subsequent product batches, then after an idle predetermined time, run the subsequent product batches.

4. The method according to claim 3, wherein The exposure energy is set based on the energy when the heat generated by the exposure device during the operation of the product batch is equal to the heat dissipated.

5. The method according to claim 4, characterized in that The eigenvalue of the alignment accuracy is set based on the capability of the exposure device.

6. The method according to claim 5, characterized in that The exposure device is a linear step exposure device.

7. A control system for an exposure batch, characterized in that, Including: A manufacturing execution system module for feeding back the exposure energy of the product batch currently running in the exposure device to the real-time data control module; A process control module for feeding back the exposure energy and alignment accuracy of subsequent product batches to the real-time data control module; The real-time data control module is configured to, when the exposure energy of the currently running product batch is greater than the reference energy and the exposure energy of the subsequent product batch is less than the reference energy, put those with the eigenvalue of the alignment accuracy greater than or equal to the reference value among the subsequent product batches into the first queue, and those with the eigenvalue of the alignment accuracy less than the reference value into the second queue. The higher the eigenvalue of the alignment accuracy, the lower the requirement for the alignment accuracy; arrange the operation order of the subsequent product batches to operate in the order of running the first queue first and then the second queue; Among them, in the first queue, sort in descending order of the eigenvalue of the alignment accuracy. In the second queue, group those with the same alignment accuracy together, and in each group, sort in descending order of the exposure energy.

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