A turntable device for multiple wafers

Abstract

The present invention relates to the field of turntable technology, specifically a turntable device that can accommodate multiple types of wafers. It includes a turntable base; a turntable, which is mounted on the upper surface of the turntable base and is rotatably connected to the turntable base; a plurality of wafer storage positions for placing wafers are formed on the upper surface of the turntable; a drive motor, which is fixedly mounted on the turntable base and is transmission-connected to the turntable for driving the turntable to rotate; multiple groups of positioning and clamping mechanisms, which are arranged on the turntable, and a group of positioning and clamping mechanisms is provided at each wafer storage position for positioning and clamping the wafer. Compared with the prior art, the turntable device that can accommodate multiple types of wafers in the present invention realizes the rotational switching of multiple wafer storage positions, which is beneficial to the rotational shifting of wafers and facilitates chip retrieval. At the same time, storing multiple groups of wafers on the turntable can meet the loading requirements of different chips and reduce the frequency of manual replacement, thereby improving the utilization rate of the equipment.

Description

Technical Field

[0001] The present invention relates to the technical field of turntables, in particular to a turntable device capable of supplying multiple wafers. Background Art

[0002] Wafers are silicon wafers used to make silicon semiconductor circuits. The starting material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon seed crystals, and then slowly pulled out to form cylindrical single crystals. Silicon ingots are then ground, polished, and sliced ​​to form silicon wafers, also known as wafers.

[0003] The chip is a semi-finished product after wafer cutting. The wafer is the carrier of the chip. After making full use of the wafer to carve out a certain number of chips, it is cut into pieces of chips.

[0004] Existing wafer loading devices typically only hold one wafer, which is insufficient for the three-chip requirements of direct-display MiniLED screens. Furthermore, storing only one wafer requires frequent manual replacement, which reduces equipment utilization.

[0005] Based on this, the present invention proposes a novel turntable device that can accommodate multiple wafers to solve the above problems. Summary of the Invention

[0006] The purpose of the present invention is to provide a turntable device that can accommodate multiple wafers. The turntable device realizes the rotation switching of multiple wafer storage positions, which is beneficial for material retrieval; at the same time, it reduces the frequency of manual replacement, thereby improving the utilization rate of the equipment.

[0007] The present invention adopts the following technical solution: a turntable device for providing a variety of wafers, comprising:

[0008] Turntable base;

[0009] A turntable, the turntable being mounted on the upper surface of the turntable base and being rotatably connected to the turntable base; and a plurality of wafer storage positions for placing wafers are formed on the upper surface of the turntable;

[0010] A drive motor, which is fixedly mounted on the turntable base and is in transmission connection with the turntable to drive the turntable to rotate;

[0011] Multiple groups of positioning and pressing mechanisms are arranged on the turntable, and each wafer storage position is provided with a group of positioning and pressing mechanisms for positioning and pressing the wafer.

[0012] Furthermore, the driving motor is connected to the turntable via a belt transmission mechanism;

[0013] The belt transmission mechanism comprises:

[0014] A synchronous wheel, the synchronous wheel being mounted on the output end of the driving motor;

[0015] A synchronous belt, one end of which is meshed and connected to the synchronous wheel, and the other end of which is meshed and connected to the outer ring of the turntable, driving the turntable to rotate;

[0016] A belt tensioning assembly is installed on the turntable base and is arranged on the outside of the synchronous belt between the synchronous wheel and the turntable, and is used to adjust the tension of the synchronous belt.

[0017] Furthermore, the outer edge of the lower surface of the turntable extends downward to form an annular flange, and a V-shaped guide rail is provided on the inner wall side of the annular flange;

[0018] A guide roller is provided at each of the four corners of the turntable base; a groove matching the V-shaped guide rail is provided on the outer circumference of the guide roller, and the guide roller is in rolling contact with the V-shaped guide rail of the turntable to support the turntable.

[0019] Furthermore, a support column is vertically arranged at each of the four corners of the turntable base, and the guide roller is connected to the top of the support column through a rolling bearing.

[0020] Furthermore, a plurality of first through holes uniformly distributed along the circumference of the turntable are provided on the turntable, and the first through holes are the wafer storage positions;

[0021] A second through hole is opened on the turntable base, and the diameter of the second through hole is larger than the diameter of the first through hole; when any first through hole on the turntable rotates to above the second through hole, the first through hole and the second through hole completely overlap.

[0022] Furthermore, the positioning and pressing mechanism includes:

[0023] at least two limiting posts, the limiting posts being spaced apart and arranged at an outer edge of one side of the first through hole of the turntable;

[0024] A push rod support seat, the push rod support seat is fixedly mounted on the outer edge of the other side of the first through hole of the turntable, opposite to the two limit posts;

[0025] A push rod is slidably mounted on the push rod support seat, and the push rod can slide from a position away from the first through hole to a position close to the center of the first through hole to achieve positioning and pressing of the wafer.

[0026] Furthermore, the top of the limiting column is in the shape of an inverted frustum;

[0027] The ejector rod is provided with an oblique surface on one side close to the wafer.

[0028] Furthermore, the turntable device further includes:

[0029] A cross sliding module, the cross sliding module includes an X-axis sliding module and a Y-axis sliding module installed on the X-axis sliding module, and the sliding direction of the X-axis sliding module is perpendicular to the sliding direction of the Y-axis sliding module; the turntable base is fixedly installed on the Y-axis sliding module, driving the turntable base to slide along the XY direction.

[0030] Furthermore, the X-axis sliding module and the Y-axis sliding module are both linear motor sliding modules.

[0031] Compared with the prior art, the beneficial effects of the turntable device for multiple wafers in the present invention are:

[0032] 1) During operation, wafers are placed in the wafer storage positions on the turntable. The positioning and clamping mechanisms are adjusted to achieve wafer positioning and clamping. A drive motor drives the turntable to rotate, switching between multiple wafer storage positions. This facilitates wafer rotation and shifting, facilitating chip retrieval. Storing multiple groups of wafers on the turntable can meet the loading needs of different chips, reduce the frequency of manual replacement, and thus improve equipment utilization.

[0033] 2) The turntable base is fixedly mounted on the Y-axis sliding module, and the turntable base is driven to slide along the XY direction, so as to facilitate moving multiple wafers to the required material removal positions, thereby facilitating the removal of chips at different positions on the wafer.

[0034] 3) Because the guide roller has a bearing inside, the friction resistance when the turntable rotates can be greatly reduced.

[0035] 4) During use, the wafer is placed in the wafer storage position and the ejector pin is pushed to slide toward the center of the first through-hole to position and tighten the wafer, enabling rapid wafer clamping and positioning. However, wafers of the same specification may vary in size due to manufacturing errors. The sliding position of the ejector pin facilitates fine-tuning of the wafer storage position to overcome problems such as difficulty in placement due to manufacturing errors. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0037] Figure 1 This is a structural schematic diagram of an embodiment of a turntable device capable of processing multiple wafers according to the present invention;

[0038] Figure 2 for Figure 1 Schematic diagram of the structure after removing the cross slide module;

[0039] Figure 3 for Figure 2 Schematic diagram of the structure after removing the wafer;

[0040] Figure 4 for Figure 3 A cross-sectional view of the overall structure;

[0041] Figure 5 for Figure 3 Cross-sectional view of local structure;

[0042] In the figure: turntable base 1, clapper board portion 10, handle portion 11, guide roller 12, support column 13, second through hole 14;

[0043] Turntable 2, wafer storage position 20, annular flange 21, V-shaped guide rail 22, first through hole 23;

[0044] Drive motor 3;

[0045] Positioning and pressing mechanism 4, limiting column 40, ejector rod support seat 41, ejector rod 42;

[0046] Cross sliding module 5, X-axis sliding module 50, Y-axis sliding module 51;

[0047] Belt transmission mechanism 6, synchronous pulley 60, synchronous belt 61, belt tensioning assembly 62, tensioning pulley support seat 621, tensioning pulley 622;

[0048] Wafer 7. DETAILED DESCRIPTION

[0049] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of the present invention.

[0050] The following is combined with Figure 1 To the attached Figure 5 And specific embodiments discuss the present invention in detail:

[0051] like Figure 1-5 As shown, the present invention provides a turntable device for a variety of wafers, comprising:

[0052] Turntable base 1;

[0053] A turntable 2 is mounted on the upper surface of the turntable base 1 and is rotatably connected to the turntable base 1. A plurality of wafer storage positions 20 for placing wafers are formed on the upper surface of the turntable 2. In this embodiment, three wafer storage positions 20 are provided, which can be used to store three wafers to meet the requirement of three types of chips for the direct display MiniLED screen.

[0054] A drive motor 3, which is fixedly mounted on the turntable base 1 and is in transmission connection with the turntable 2, and is used to drive the turntable 2 to rotate 360 ​​degrees;

[0055] Multiple groups of positioning and pressing mechanisms 4 are provided on the turntable 2 , and a group of positioning and pressing mechanisms 4 is provided at each wafer storage position 20 for positioning and pressing the wafer.

[0056] During operation, wafers are placed in wafer storage positions 20 on turntable 2. Positioning and clamping mechanisms 4 are adjusted to achieve wafer positioning and clamping. Drive motor 3 drives turntable 2 to rotate, switching between multiple wafer storage positions 20. This facilitates wafer rotation and shifting, facilitating chip retrieval. Storing multiple wafer groups on turntable 2 can meet the loading needs of different chips, reduce the frequency of manual replacement, and thus improve equipment utilization.

[0057] Of course, in some specific embodiments, the turntable device may further include:

[0058] The cross slide module 5 includes an X-axis slide module 50 and a Y-axis slide module 51 mounted on the X-axis slide module 50, with the sliding direction of the X-axis slide module 50 being perpendicular to the sliding direction of the Y-axis slide module 51. The turntable base 1 is fixedly mounted on the Y-axis slide module 51, driving the turntable base 1 to slide along the XY directions, facilitating the movement of multiple wafers to the desired retrieval positions, thereby facilitating the retrieval of chips at different locations on the wafers. At the same time, the 360-degree rotation of the X-axis slide module 50, the Y-axis slide module 51, and the turntable 2 can accurately transport the wafers to the desired transfer position, facilitating precise retrieval.

[0059] Of course, the present invention does not limit the specific structure of the X-axis slide module 50 and the Y-axis slide module 51. A belt-type moving mechanism or a screw-type moving mechanism may be used. Any mechanism that can achieve movement of the X-axis slide module 50 and the Y-axis slide module 51 along the X-axis and Y-axis directions, respectively, falls within the scope of protection of the present invention. However, preferably, both the X-axis slide module 50 and the Y-axis slide module 51 are linear motor slide modules, which provide high transmission speed and precision.

[0060] Furthermore, in some specific embodiments, the driving motor 3 is connected to the turntable 2 via a belt transmission mechanism 6 to drive the turntable 2 to rotate.

[0061] The belt transmission mechanism 6 comprises:

[0062] A synchronous wheel 60 , which is mounted on the output end of the drive motor 3 ;

[0063] A synchronous belt 61, one end of which is meshed and connected to the outer ring of the synchronous wheel 60, and the other end of which is meshed and connected to the outer ring of the turntable 2, driving the turntable 2 to rotate;

[0064] The belt tensioning assembly 62 is mounted on the turntable base 1 and disposed outside the synchronous belt 61 between the synchronous pulley 60 and the turntable 2, for adjusting the tension of the synchronous belt 61. In the present invention, the belt tensioning assembly 62 can be designed as follows: it includes an idler pulley support 621 and an idler pulley 622. The idler pulley support 621 has an elongated hole through which a bolt is installed to secure the idler pulley 622 to the turntable base 1. A idler pulley 622 is mounted on the side of the idler pulley support 621 near the synchronous belt 61. The idler pulley 622 contacts the outer surface of the synchronous belt 61, thereby tightening the synchronous belt 61. Furthermore, an elongated hole is provided in the idler pulley support 621 to facilitate adjustment of the tension of the synchronous belt 61 by the idler pulley 622.

[0065] In some more preferred embodiments, the turntable base 1 is designed to be in the shape of a table tennis racket, including a paddle portion 10 and a handle portion 11. Correspondingly, the drive motor 3 is arranged at the handle portion 11, and the turntable 2 is installed parallel to the upper surface of the paddle portion 10, and the wafer storage positions 20 are triangular in shape and evenly distributed on the upper surface of the turntable 2, so that the overall structure is compact and space-saving.

[0066] Furthermore, in some specific embodiments, the outer edge of the lower surface of the turntable 2 extends downward to form an annular flange 21 , and a V-shaped guide rail 22 is formed on the inner wall side of the annular flange 21 .

[0067] A guide roller 12 is provided at each of the four corners of the turntable base 1; a groove matching the V-shaped guide rail 22 is provided on the outer circumference of the guide roller 12, and rolling contact is made with the V-shaped guide rail 22 of the turntable 2. Through the cooperation between the V-shaped guide rail 22 and the guide roller 12, support for the turntable 2 is achieved, and the support stability is good.

[0068] In some more preferred embodiments, the turntable base 1 and the turntable 2 are both arranged horizontally. Vertical support columns 13 are provided at the four corners of the turntable base 1, and the guide rollers 12 are connected to the tops of the support columns 13 via rolling bearings. The bearings within the guide rollers 12 significantly reduce frictional resistance during the rotation of the turntable 2.

[0069] Furthermore, in some specific embodiments, a plurality of first through holes 23 evenly distributed along the circumference of the turntable 2 may be opened on the turntable 2 , and the first through holes 23 are the wafer storage locations 20 .

[0070] At the same time, a second through-hole 14 is formed on the turntable base 1. The diameter of the second through-hole 14 is larger than the diameter of the first through-hole 23. When any first through-hole 23 on the turntable 2 rotates to above the second through-hole 14, the first through-hole 23 and the second through-hole 14 completely overlap. That is, when looking down at the turntable base 1 and turntable 2 from above, the first through-hole 23 completely falls within the circle of the second through-hole 14, facilitating wafer processing and loading and unloading.

[0071] On this basis, the positioning and pressing mechanism 4 can be further refined and designed as follows: the positioning and pressing mechanism 4 includes:

[0072] At least two limiting posts 40 , the limiting posts 40 being spaced apart and arranged at an outer edge of one side of the first through hole 23 of the turntable 2 ;

[0073] A push rod support seat 41 is fixedly mounted on the outer edge of the other side of the first through hole 23 of the turntable 2 and is directly opposite to the two limiting posts 40;

[0074] The ejector rod 42 is slidably mounted on the ejector rod support seat 41. The ejector rod 42 can slide from the first through hole 23 to the center of the first through hole 23 to achieve positioning and pressing of the wafer. When in use, the wafer is placed in the wafer storage position 20, and the ejector rod 42 is pushed to slide toward the center of the first through hole 23 to achieve positioning and pressing of the wafer, which can achieve rapid clamping and positioning of the wafer. However, the size of wafers of the same specification may have certain deviations due to errors in production and manufacturing. The sliding setting of the ejector rod 42 facilitates fine-tuning of the size of the wafer storage position 20 to overcome the problem of being unable to be placed due to errors in production and manufacturing. The ejector rod 42 can be driven to slide by a cylinder or can be driven manually. Preferably, the ejector rod 42 is driven manually, and a spring is provided at the positioning and clamping mechanism 4. One end of the spring is fixedly connected to the ejector rod support seat 41, and the other end is connected to the ejector rod 42, so as to realize manual adjustment of the ejector rod; by manually pulling the ejector rod 42, the wafer can be quickly replaced.

[0075] In some more preferred embodiments, the top of the limiting column 40 is designed to be in the shape of an inverted cone, and when the wafer is placed in the wafer storage position 20, the position is limited by the inclined surface of the inverted cone.

[0076] At the same time, the ejector rod 42 is provided with a beveled surface on the side close to the wafer, which can press the outer frame of the wafer; a toggle protrusion can also be formed on the upper surface of the ejector rod 42 to facilitate manual pulling of the ejector rod 42 to achieve manual adjustment.

[0077] The present invention is further described above with the aid of specific embodiments. However, it should be understood that the specific description herein should not be construed as limiting the essence and scope of the present invention. Various modifications made to the above embodiments by ordinary technicians in this field after reading this specification are all within the scope of protection of the present invention.

Claims

1. A turntable device for handling multiple wafers, characterized by: It includes: Turntable base; A turntable, the turntable being mounted on the upper surface of the turntable base and being rotatably connected to the turntable base; A plurality of wafer storage locations for placing wafers are formed on the upper surface of the turntable; A plurality of first through holes are provided on the turntable and are evenly distributed along the circumference of the turntable, wherein the first through holes are the wafer storage positions; A second through hole is provided on the turntable base, wherein the diameter of the second through hole is larger than the diameter of the first through hole; when any first through hole on the turntable rotates to above the second through hole, the first through hole and the second through hole completely overlap; A drive motor, which is fixedly mounted on the turntable base and is in transmission connection with the turntable. The drive motor is connected to the turntable via a belt drive mechanism; and is used to drive the turntable to rotate; Multiple groups of positioning and pressing mechanisms are arranged on the turntable, and each wafer storage position is provided with a group of positioning and pressing mechanisms for positioning and pressing the wafer.

2. The turntable device for handling multiple wafers according to claim 1, wherein: The belt transmission mechanism comprises: A synchronous wheel, the synchronous wheel being mounted on the output end of the driving motor; A synchronous belt, one end of which is meshed and connected to the synchronous wheel, and the other end of which is meshed and connected to the outer ring of the turntable, driving the turntable to rotate; A belt tensioning assembly is installed on the turntable base and is arranged on the outside of the synchronous belt between the synchronous wheel and the turntable, and is used to adjust the tension of the synchronous belt.

3. The turntable device for handling multiple wafers according to claim 1, wherein: The outer edge of the lower surface of the turntable extends downward to form an annular flange, and a V-shaped guide rail is provided on the inner wall side of the annular flange; A guide roller is provided at each of the four corners of the turntable base; a groove matching the V-shaped guide rail is provided on the outer circumference of the guide roller, and the guide roller is in rolling contact with the V-shaped guide rail of the turntable to support the turntable.

4. The turntable device for handling multiple wafers according to claim 3, wherein: A support column is vertically arranged at each of the four corners of the turntable base, and the guide roller is connected to the top of the support column through a rolling bearing.

5. The turntable device for handling multiple wafers according to claim 1, wherein: The positioning and pressing mechanism comprises: at least two limiting posts, the limiting posts being spaced apart and arranged at an outer edge of one side of the first through hole of the turntable; A push rod support seat, the push rod support seat is fixedly mounted on the outer edge of the other side of the first through hole of the turntable, opposite to the two limit posts; A push rod is slidably mounted on the push rod support seat, and the push rod can slide from a position away from the first through hole to a position close to the center of the first through hole to achieve positioning and pressing of the wafer.

6. The turntable device for handling multiple wafers according to claim 5, wherein: The top of the limiting column is in the shape of an inverted frustum; The ejector rod is provided with an oblique surface on one side close to the wafer.

7. The turntable device for handling multiple wafers according to claim 1, wherein: The turntable device also includes: A cross sliding module, the cross sliding module includes an X-axis sliding module and a Y-axis sliding module installed on the X-axis sliding module, and the sliding direction of the X-axis sliding module is perpendicular to the sliding direction of the Y-axis sliding module; the turntable base is fixedly installed on the Y-axis sliding module, driving the turntable base to slide along the XY direction.

8. The turntable device for handling multiple wafers according to claim 7, wherein: The X-axis sliding module and the Y-axis sliding module are both linear motor sliding modules.

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