Display panel and display panel manufacturing method

Abstract

The present application provides a display panel and a method for manufacturing the display panel. The display panel includes a light-emitting layer located on one side of a driving circuit layer and an encapsulation layer covering the light-emitting layer. The light-emitting layer includes a plurality of light-emitting elements. The encapsulation layer includes a first encapsulation material layer proximal to the driving circuit layer and a second encapsulation material layer located on a side of the first encapsulation material layer distal to the driving circuit layer. The first encapsulation material layer includes a first encapsulation material, and the second encapsulation material layer includes a second encapsulation material. The first encapsulation material has a lower moisture permeability than the second encapsulation material. By providing an encapsulation layer having a double-layer stacked structure, and by making the second encapsulation material layer and the first encapsulation material layer each include encapsulation materials with successively lower moisture permeabilities, the present application improves the encapsulation layer's ability to isolate moisture, thereby enhancing the quality and reliability of the display panel.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a method for manufacturing the display panel. Background Art

[0002] Mini LED (Mini Light Emitting Diode) displays have the characteristics of high brightness, strong grayscale performance, high color saturation, and high-definition dynamic image quality. In addition, they have the unique advantage of being easy to store and install, and have the potential to replace traditional monitors and projectors. Mini LED display devices generally adopt an active matrix drive method. At the same time, in order to ensure the stability of the device, the active layer of the driving transistor usually adopts indium gallium zinc oxide semiconductor material. Mini LED display devices need to use packaging technology to protect transistors and LED devices. The currently used packaging material is silicone. Since silicone has the advantages of high temperature resistance, stable properties, and good light transmittance, Mini LED devices encapsulated with silicone exhibit better light emitting effects. However, the ability of silicone materials to isolate water vapor is poor. External water vapor can easily penetrate the silicone packaging layer to reach the LED device, causing damage to the device and resulting in poor display.

[0003] Therefore, the current packaging structure of Mini LED display devices has the technical problem of poor ability to isolate water vapor. Summary of the Invention

[0004] The present application provides a display panel and a method for manufacturing the display panel, which are used to alleviate the technical problem of poor water vapor isolation capability of the current packaging structure of display devices.

[0005] The present application provides a display panel, comprising:

[0006] substrate;

[0007] A driving circuit layer is provided on one side of the substrate;

[0008] a light-emitting layer, disposed on a side of the driving circuit layer away from the substrate, the light-emitting layer comprising a plurality of light-emitting elements;

[0009] An encapsulation layer is arranged on a side of the driving circuit layer away from the substrate and covers the light-emitting layer, the encapsulation layer comprising: a first encapsulation material layer close to the driving circuit layer, and a second encapsulation material layer located on a side of the first encapsulation material layer away from the driving circuit layer, the first encapsulation material layer comprising a first encapsulation material, the second encapsulation material layer comprising a second encapsulation material, and the moisture permeability of the first encapsulation material is less than the moisture permeability of the second encapsulation material.

[0010] In the display panel of the present application, the adhesion between the first encapsulation material and the surface of the driving circuit layer facing the encapsulation layer is greater than the adhesion between the second encapsulation material and the surface of the driving circuit layer facing the encapsulation layer;

[0011] The adhesion between the first packaging material and the surface of the light-emitting element is greater than the adhesion between the second packaging material and the surface of the light-emitting element.

[0012] In the display panel of the present application, the light-emitting element includes a light-emitting surface; the surface of the first encapsulation material layer facing the second encapsulation material layer is located between the plane where the light-emitting surface is located and the plane where the surface of the driving circuit layer facing the encapsulation layer is located.

[0013] In the display panel of the present application, the light-emitting element includes a light-emitting surface; and the surface of the first encapsulation material layer facing the second encapsulation material layer is flush with the light-emitting surface.

[0014] In the display panel of the present application, the light-emitting element includes a light-emitting surface; and the light-emitting surface is in contact with the second encapsulation material layer.

[0015] In the display panel of the present application, the first packaging material includes an epoxy material, and the second packaging material includes a silicone material.

[0016] In the display panel of the present application, the moisture permeability of the first packaging material is less than 20 g / m2×24 hours, and the transparency of the first packaging material is greater than 90%.

[0017] The present application also provides a method for manufacturing a display panel, which includes:

[0018] forming a driving circuit layer on a substrate;

[0019] A light-emitting layer is formed on a side of the driving circuit layer away from the substrate, wherein the light-emitting layer includes a plurality of light-emitting elements;

[0020] forming a first packaging material layer on a side of the driving circuit layer away from the substrate, so that a surface of the first packaging material layer away from the driving circuit layer is located between a plane where the light emitting surface of the light emitting element is located and a plane where a surface of the driving circuit layer facing the first packaging material layer is located;

[0021] A second packaging material layer is formed on a side of the first packaging material layer away from the driving circuit layer, so that the second packaging material layer covers the light emitting element.

[0022] In the display panel manufacturing method of the present application, the step of forming a first packaging material layer on a side of the driving circuit layer away from the substrate includes:

[0023] coating a first packaging material on a side of the driving circuit layer away from the substrate so that the first packaging material covers the light emitting element;

[0024] extruding the first packaging material through a molding process;

[0025] The first packaging material is thinned by a laser ablation process to form the first packaging material layer, so that the surface of the first packaging material layer away from the driving circuit layer is located between the plane where the light-emitting surface of the light-emitting element is located and the plane where the surface of the driving circuit layer facing the first packaging material layer is located.

[0026] In the display panel manufacturing method of the present application, the material used to manufacture the first packaging material layer includes epoxy material, and the material used to manufacture the second packaging material layer includes silicone material.

[0027] The beneficial effects of the present application are as follows: the present application provides a display panel and a method for manufacturing a display panel, wherein the display panel includes a light-emitting layer located on one side of a driving circuit layer and an encapsulation layer covering the light-emitting layer, wherein the light-emitting layer includes a plurality of light-emitting elements, and the encapsulation layer includes a first encapsulation material layer adjacent to the driving circuit layer and a second encapsulation material layer located on a side of the first encapsulation material layer away from the driving circuit layer, wherein the first encapsulation material layer includes a first encapsulation material, and the second encapsulation material layer includes a second encapsulation material, wherein the moisture permeability of the first encapsulation material is lower than that of the second encapsulation material. The present application provides an encapsulation layer having a double-layer stacked structure, and wherein the second encapsulation material layer and the first encapsulation material layer respectively include encapsulation materials with successively decreasing moisture permeabilities. This design is beneficial for improving the ability of the encapsulation layer to isolate moisture vapor, thereby improving the quality and reliability of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The following detailed description of the specific embodiments of the present application in conjunction with the accompanying drawings will make the technical solutions and other beneficial effects of the present application apparent.

[0029] Figure 1 Schematic diagram of a partial film layer structure of a display panel provided in an embodiment of the present application;

[0030] Figure 2 yes Figure 1 The diagram shows a schematic diagram of a local film structure corresponding to a light-emitting element in a display panel.

[0031] Figure 3 This is a flow chart of a display panel manufacturing method provided in an embodiment of the present application.

[0032] Figure 4It is a structural diagram after the driving circuit layer is manufactured in the display panel manufacturing method provided in an embodiment of the present application.

[0033] Figure 5 This is a partial enlarged view after the driving circuit layer is manufactured in the display panel manufacturing method provided in an embodiment of the present application.

[0034] Figure 6 It is a structural diagram after the light-emitting layer is manufactured in the display panel manufacturing method provided in an embodiment of the present application.

[0035] Figure 7 This is a partial enlarged view of the display panel manufacturing method provided in an embodiment of the present application after the light-emitting layer is manufactured.

[0036] Figure 8 It is a structural schematic diagram after coating the first packaging material layer in the display panel manufacturing method provided in an embodiment of the present application.

[0037] Figure 9 This is a structural schematic diagram of the display panel manufacturing method provided in an embodiment of the present application after the first packaging material layer is thinned.

[0038] Figure 10 It is a structural schematic diagram after the second packaging material layer is manufactured in the display panel manufacturing method provided in an embodiment of the present application. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative efforts are within the scope of protection of this application.

[0040] Embodiments of the present application provide a display panel and a method for manufacturing the display panel. The display panel includes a light-emitting layer located on one side of a drive circuit layer and an encapsulation layer covering the light-emitting layer. The light-emitting layer includes multiple light-emitting elements. The encapsulation layer includes a first encapsulation material layer adjacent to the drive circuit layer and a second encapsulation material layer located on a side of the first encapsulation material layer away from the drive circuit layer. The first encapsulation material layer includes a first encapsulation material, and the second encapsulation material layer includes a second encapsulation material. The first encapsulation material has a lower moisture permeability than the second encapsulation material. Embodiments of the present application provide an encapsulation layer having a double-layer stacked structure, and the second and first encapsulation material layers each include encapsulation materials with successively lower moisture permeabilities. This design improves the encapsulation layer's ability to isolate moisture, thereby enhancing the quality and reliability of the display panel.

[0041] The following describes the relevant technical features of the display panel and the display panel manufacturing method provided in the application embodiments with reference to the accompanying drawings.

[0042] See also Figure 1 and Figure 2 , Figure 1 is a schematic diagram of a partial film layer structure of a display panel provided in an embodiment of the present application, Figure 2 yes Figure 1 The diagram shows a schematic diagram of a local film structure corresponding to a light-emitting element in a display panel.

[0043] An embodiment of the present application provides a display panel, which includes: a substrate 10, a driving circuit layer 20 arranged on one side of the substrate 10, a light-emitting layer 30 arranged on a side of the driving circuit layer 20 away from the substrate 10, and an encapsulation layer 40 arranged on a side of the driving circuit layer 20 away from the substrate 10 and covering the light-emitting layer 30.

[0044] The substrate 10 can be a flexible substrate, such as a substrate made of a flexible material such as polyimide, or a rigid substrate, such as a substrate made of a rigid material such as glass. A buffer layer can be provided between the substrate 10 and the driving circuit layer 20 to mitigate any mismatch in stress, strain, and other properties between the substrate 10 and the driving circuit layer 20. The buffer layer can be made of an inorganic material such as silicon oxide or silicon nitride, or an organic material such as polyimide.

[0045] The driving circuit layer 20 includes a plurality of driving lines and a plurality of thin film transistor devices; the driving lines may include data lines and scan lines for signal transmission, etc.; the thin film transistor devices are directly or indirectly connected to the driving lines and provide control and driving signals for the light-emitting elements in the light-emitting layer 30.

[0046] Specifically, the driving circuit layer 20 includes: a gate 201 disposed on the substrate 10, a gate insulating layer 202 disposed on the substrate 10 and covering the gate 201, an active layer 203 disposed on the gate insulating layer 202, a source-drain electrode layer 204 at least partially disposed on the active layer 203, and an interlayer insulating layer 205 covering the gate insulating layer 202, the active layer 203, and the source-drain electrode layer 204. At least a portion of the active layer 203 overlaps with the gate 201, and the active layer 203 can be made of a semiconductor material such as indium gallium zinc oxide. The source-drain electrode layer 204 is coupled to opposite ends of the active layer 203. The gate 201, the gate insulating layer 202, the active layer 203, and the source-drain electrode layer 204 constitute the thin film transistor device.

[0047] The light-emitting layer 30 includes a plurality of light-emitting elements L, which are disposed on the driving circuit layer 20 and electrically connected to the source-drain layer 204 through vias in the interlayer insulating layer 205 to receive control signals and drive signals transmitted by the driving circuit layer 20 and achieve their light-emitting function. Optionally, the light-emitting element L includes an anode, a light-emitting functional layer disposed on the anode, and a cathode disposed on the light-emitting functional layer; wherein the anode is electrically connected to the source-drain layer 204, and the cathode is electrically connected to another signal line. When driven by a voltage, hole carriers on the anode and electron carriers on the cathode move to the light-emitting functional layer, where they combine to emit light.

[0048] Alternatively, the light-emitting element L may be a miniature organic light-emitting diode (Mini LED) device. The light-emitting layer 30 may be manufactured by mass transfer technology, where a large number of miniature organic light-emitting diodes are transferred and welded onto the driving circuit layer 20 and electrically connected to the driving circuit layer 20.

[0049] Optionally, the light emitting element L may include a red light emitting element, a green light emitting element and a blue light emitting element, wherein the red light emitting element is configured to emit red light, the green light emitting element is configured to emit green light, and the blue light emitting element is configured to emit blue light.

[0050] The light emitting element L has a light emitting surface L1 , which refers to a surface from which light generated by the light emitting element L is emitted. The light generated by the light emitting element L is emitted in a direction away from the driving circuit layer 20 .

[0051] The encapsulation layer 40 is disposed on the driving circuit layer 20 and covers at least the light-emitting layer 30. The encapsulation layer 40 is used to seal and protect the light-emitting element L, the wiring in the driving circuit layer 20, and other electronic components, reducing or preventing erosion by external moisture and preventing damage by external forces.

[0052] The encapsulation layer 40 includes: a first encapsulation material layer 401 close to the driving circuit layer 20, and a second encapsulation material layer 402 located on the side of the first encapsulation material layer 401 away from the driving circuit layer 20, the first encapsulation material layer 401 includes a first encapsulation material, the second encapsulation material layer 402 includes a second encapsulation material, and the moisture permeability of the first encapsulation material is less than the moisture permeability of the second encapsulation material. The moisture permeability refers to the ability of a material to allow water vapor to pass through. The greater the moisture permeability of a material, the easier it is for water vapor to penetrate the material, and the smaller the moisture permeability of a material, the stronger the ability of the material to block water vapor penetration. The moisture permeability of a material can be characterized by the mass of water vapor that passes through a unit surface area of the material within 24 hours. For example, the moisture permeability of a certain material is 5g / m 2 *24h means that the mass of water vapor passing through 1 square meter of the surface of the material within 24 hours is 5 grams.

[0053] In this embodiment, the encapsulation layer 40 is configured as a double-layer stacked structure, and the moisture permeability of the first encapsulation material is made lower than that of the second encapsulation material, thereby forming an encapsulation structure whose ability to block external water vapor is gradually enhanced. This is beneficial to improving the ability of the encapsulation layer 40 to isolate water vapor, thereby improving the quality and reliability of the display panel.

[0054] Optionally, the moisture permeability of the first packaging material is less than 20 g / m2×24 hours (or 20 g / m 2 *24h), and the transparency of the first packaging material is greater than 90%, so as to ensure that the first packaging material layer 401 has a strong ability to isolate water vapor and has a high transparency to meet display requirements.

[0055] Furthermore, the adhesion between the first encapsulation material and the surface of the driving circuit layer 20 facing the encapsulation layer 40 is greater than the adhesion between the second encapsulation material and the surface of the driving circuit layer 20 facing the encapsulation layer 40; and the adhesion between the first encapsulation material and the surface of the light-emitting layer 30 facing the encapsulation layer 40 is greater than the adhesion between the second encapsulation material and the surface of the light-emitting layer 30 facing the encapsulation layer 40. The surface of the light-emitting layer 30 facing the encapsulation layer 40 may include all surfaces of each component unit of the light-emitting layer 40 except for the surface in contact with the driving circuit layer 20. The adhesion refers to the bonding force generated by the natural connection between a material and a surface through processes such as melting and solidification. The greater the adhesion between a material and a surface, the less likely the material is to peel from the surface.

[0056] Specifically, the adhesion between the first packaging material and the surface of the light-emitting element L is greater than the adhesion between the second packaging material and the surface of the light-emitting element L.

[0057] In this embodiment, the packaging layer directly connected to the driving circuit layer 20 and / or the light-emitting layer 30 is set to a first packaging material with high adhesion, thereby reducing the risk of the packaging layer 40 peeling off from the surface of the driving circuit layer 20 and / or the light-emitting layer 30, and further improving the quality reliability of the display panel.

[0058] Furthermore, the first encapsulation material includes an epoxy material, and the second encapsulation material includes a silicone material. The epoxy material may include an epoxy resin, such as a bisphenol A epoxy resin, an alicyclic epoxy resin, or an oxidized epoxy resin. It is understood that the epoxy material has a lower moisture permeability than the silicone material and has a higher adhesion to the drive circuit layer 20 or the light-emitting layer 30. The silicone material also has better performance stability than the epoxy material. For example, under high temperature or low-wavelength light conditions, the silicone material is less likely to experience color change and reduced light transmittance.

[0059] Furthermore, the surface of the first encapsulation material layer 401 facing the second encapsulation material layer 402 is located between the plane where the light-emitting surface L1 is located and the plane where the surface of the driving circuit layer 20 facing the encapsulation layer 40 is located, thereby ensuring that the light emitted by the light-emitting element L does not pass through the first encapsulation material layer 401, preventing the first encapsulation material layer 401 from yellowing due to exposure to light from the light-emitting element L. The second encapsulation material layer 402 is made of silicone material, which does not yellow under light and maintains a high light transmittance.

[0060] Furthermore, the surface of the first packaging material layer 401 facing the second packaging material layer 402 is flush with the light-emitting surface L1, thereby ensuring that the light emitted by the light-emitting element L does not pass through the first packaging material layer 401 while making the first packaging material layer 401 reach a maximum thickness. By utilizing the first packaging material's strong ability to block water vapor, the first packaging material layer 401's ability to block water vapor reaches its strongest, thereby enhancing the overall water vapor blocking ability of the packaging layer 40 and improving the quality and reliability of the display panel.

[0061] Furthermore, the light emitting surface L1 contacts the second packaging material layer 402, forming a structure in which the second packaging material layer 402 directly covers the light emitting surface L1, thereby sealing and protecting the light emitting surface L1 of the light emitting element L and preventing the first packaging material layer 401 from yellowing due to covering the light emitting surface L1.

[0062] To sum up, the display panel provided by the embodiment of the present application, by setting the encapsulation layer 40 to a double-layer stacked structure and making the moisture permeability of the first encapsulation material lower than the moisture permeability of the second encapsulation material, forms a encapsulation structure with gradually enhanced ability to block external water vapor, which is beneficial to improving the ability of the encapsulation layer 40 to isolate water vapor; and further making the height of the first encapsulation material layer 401 lower than the plane where the light-emitting surface L1 is located, eliminating the risk of the first encapsulation material layer 401 being discolored by the light emitted by the light-emitting element L, thereby improving the quality reliability of the display panel.

[0063] The present application also provides a method for manufacturing a display panel. Figure 3 , Figure 3 This is a flow chart of a display panel manufacturing method provided by an embodiment of the present application. The display panel manufacturing method comprises the following steps:

[0064] Step S101, please refer to Figure 4 , a driving circuit layer 20 is manufactured on a substrate 10 .

[0065] The substrate 10 may be a flexible substrate, such as one made of a flexible material such as polyimide, or a rigid substrate, such as one made of a rigid material such as glass. The driving circuit layer 20 includes a plurality of driving traces and a plurality of thin film transistor devices.

[0066] For details, please refer to Figure 5 The driving circuit layer 20 includes: a gate 201 disposed on the substrate 10; a gate insulating layer 202 disposed on the substrate 10 and covering the gate 201; an active layer 203 disposed on the gate insulating layer 202; a source-drain electrode layer 204 at least partially disposed on the active layer 203; and an interlayer insulating layer 205 covering the gate insulating layer 202, the active layer 203, and the source-drain electrode layer 204. At least a portion of the active layer 203 overlaps with the gate 201. The active layer 203 can be made of a semiconductor material such as indium gallium zinc oxide. The source-drain electrode layer 204 is coupled to opposite ends of the active layer 203. The gate 201, the gate insulating layer 202, the active layer 203, and the source-drain electrode layer 204 constitute the thin film transistor device.

[0067] Step S102, please refer to Figure 6 and Figure 7 A light emitting layer 30 is formed on a side of the driving circuit layer 20 away from the substrate 10 .

[0068] The light-emitting layer 30 includes a plurality of light-emitting elements L, which are disposed on the drive circuit layer 20 and receive control signals and drive signals transmitted by the drive circuit layer 20 to achieve their light-emitting function. Optionally, the light-emitting element L includes an anode, a light-emitting functional layer disposed on the anode, and a cathode disposed on the light-emitting functional layer; wherein the anode is electrically connected to the source-drain electrode layer 204, and the cathode is electrically connected to another signal line. Hole carriers on the anode and electron carriers on the cathode move to the light-emitting functional layer under voltage drive, and combine in the light-emitting functional layer to emit light.

[0069] Alternatively, the light-emitting element L may be a miniature organic light-emitting diode (Mini LED) device. The light-emitting layer 30 may be manufactured by mass transfer technology, where a large number of miniature organic light-emitting diodes are transferred and welded onto the driving circuit layer 20 and electrically connected to the driving circuit layer 20.

[0070] Optionally, the light emitting element L may include a red light emitting element, a green light emitting element and a blue light emitting element, wherein the red light emitting element is configured to emit red light, the green light emitting element is configured to emit green light, and the blue light emitting element is configured to emit blue light.

[0071] The light emitting element L has a light emitting surface L1 , which refers to a surface from which light generated by the light emitting element L is emitted. The light generated by the light emitting element L is emitted in a direction away from the driving circuit layer 20 .

[0072] Step S103, please refer to Figure 8 and Figure 9 A first packaging material layer 401 is formed on a side of the driving circuit layer 20 away from the substrate 10 .

[0073] Specifically, the step S103 includes the following steps: coating a first packaging material on the side of the driving circuit layer 20 away from the substrate 10 so that the first packaging material covers the light emitting element L, such as Figure 8 As shown; the first packaging material is extruded by a molding process; the first packaging material is thinned by a laser ablation process to form the first packaging material layer 401, as shown Figure 9As shown, the surface of the first encapsulation material layer 401 away from the driving circuit layer 20 is located between the plane where the light emitting surface L1 of the light emitting element L is located and the plane where the surface of the driving circuit layer 20 facing the first encapsulation material layer 401 is located. The first encapsulation material includes an epoxy material, and the epoxy material may include an epoxy resin, and the epoxy resin may be a bisphenol A epoxy resin, an alicyclic epoxy resin, an oxidized epoxy resin, or the like.

[0074] The first encapsulating material applied to one side of the driving circuit layer 20 can be in a liquid or semi-liquid state to maintain a certain degree of fluidity and be formed by the molding process. The molding process involves extruding the first encapsulating material through a mold of a specific shape to achieve connection between the first encapsulating material and the driving circuit layer 20 or the light-emitting layer 30, and to extrude the first encapsulating material into a specific shape. The laser ablation process involves heating one side of the first encapsulating material with a laser, causing partial deterioration and removal, thereby reducing the thickness of the first encapsulating material.

[0075] Optionally, the first packaging material layer 401 finally formed may also meet the following conditions: the surface of the first packaging material layer 401 facing away from the driving circuit layer 20 is flush with the light-emitting surface L1, so as to ensure that the light emitted by the light-emitting element L does not pass through the first packaging material layer 401 while making the first packaging material layer 401 reach a maximum thickness.

[0076] Optionally, the moisture permeability of the first packaging material is less than 20 g / m2×24 hours (or 20 g / m 2 *24h), and the transparency of the first packaging material is greater than 90%, so as to ensure that the first packaging material layer 401 has a strong ability to isolate water vapor and has a high transparency to meet display requirements.

[0077] Step S104, please refer to Figure 10 A second packaging material layer 402 is formed on a side of the first packaging material layer 401 away from the driving circuit layer 20 , so that the second packaging material layer 402 covers the light emitting element L.

[0078] Specifically, the second encapsulation material layer 402 includes a second encapsulation material including a silicone material. The light emitting surface L1 of the light emitting element L contacts the second encapsulation material layer 402, forming a structure in which the second encapsulation material layer 402 directly covers the light emitting surface L1, thereby sealing and protecting the light emitting surface L1 of the light emitting element L.

[0079] Furthermore, the moisture permeability of the first encapsulation material is lower than that of the second encapsulation material. Furthermore, the adhesion between the first encapsulation material and the surface of the driving circuit layer 20 facing the encapsulation layer 40 is greater than the adhesion between the second encapsulation material and the surface of the driving circuit layer 20 facing the encapsulation layer 40. Furthermore, the adhesion between the first encapsulation material and the surface of the light-emitting layer 30 facing the encapsulation layer 40 is greater than the adhesion between the second encapsulation material and the surface of the light-emitting layer 30 facing the encapsulation layer 40.

[0080] To sum up, the display panel manufacturing method provided in the embodiment of the present application, by producing a packaging layer with a double-layer stacked structure, makes the height of the first packaging material layer 401 lower than the plane where the light-emitting surface L1 is located, thereby eliminating the risk of the light emitted by the light-emitting element L causing the first packaging material layer 401 to discolor, and improving the quality reliability of the display panel; and makes the moisture permeability of the first packaging material lower than the moisture permeability of the second packaging material, forming a packaging structure with a layer-by-layer enhanced ability to block external water vapor, which is beneficial to improving the ability of the overall packaging layer to isolate water vapor.

[0081] It should be noted that although the present application is disclosed above with specific embodiments, the above embodiments are not intended to limit the present application. Ordinary technicians in this field can make various changes and modifications without departing from the spirit and scope of the present application. Therefore, the scope of protection of the present application shall be based on the scope defined by the claims.

Claims

1. A display panel, characterized in that: include: substrate; A driving circuit layer is provided on one side of the substrate; a light-emitting layer, disposed on a side of the driving circuit layer away from the substrate, the light-emitting layer comprising a plurality of light-emitting elements; An encapsulation layer is arranged on a side of the driving circuit layer away from the substrate and covers the light-emitting layer, the encapsulation layer comprising: a first encapsulation material layer close to the driving circuit layer, and a second encapsulation material layer located on a side of the first encapsulation material layer away from the driving circuit layer, the first encapsulation material layer comprising a first encapsulation material, the second encapsulation material layer comprising a second encapsulation material, the moisture permeability of the first encapsulation material being less than the moisture permeability of the second encapsulation material; the transparency of the first encapsulation material being greater than 90%; the adhesion between the first encapsulation material and the surface of the driving circuit layer facing the encapsulation layer is greater than the adhesion between the second encapsulation material and the surface of the driving circuit layer facing the encapsulation layer; the adhesion between the first encapsulation material and the surface of the light-emitting element is greater than the adhesion between the second encapsulation material and the surface of the light-emitting element; the light-emitting element comprises a light-emitting surface, and the light-emitting surface is in contact with the second encapsulation material layer.

2. The display panel according to claim 1, wherein: The light-emitting element includes a light-emitting surface; a surface of the first packaging material layer facing the second packaging material layer is located between a plane where the light-emitting surface is located and a plane where a surface of the driving circuit layer facing the packaging layer is located.

3. The display panel according to claim 2, wherein: The light-emitting element includes a light-emitting surface; and a surface of the first packaging material layer facing the second packaging material layer is flush with the light-emitting surface.

4. The display panel according to any one of claims 1 to 3, wherein: The first packaging material includes epoxy material, and the second packaging material includes silicone material.

5. The display panel according to claim 1, wherein: The moisture permeability of the first packaging material is less than 20 g / m2×24 hours.

6. A method for manufacturing a display panel, characterized in that: include: forming a driving circuit layer on a substrate; A light-emitting layer is formed on a side of the driving circuit layer away from the substrate, wherein the light-emitting layer includes a plurality of light-emitting elements; The light emitting element comprises a light emitting surface facing away from the driving circuit layer; A first encapsulation material layer is formed on a side of the driving circuit layer away from the substrate, such that a surface of the first encapsulation material layer away from the driving circuit layer is located between a plane where the light emitting surface of the light emitting element is located and a plane where a surface of the driving circuit layer facing the first encapsulation material layer is located; the first encapsulation material layer includes a first encapsulation material, and the transparency of the first encapsulation material is greater than 90%; forming a second packaging material layer on a side of the first packaging material layer away from the driving circuit layer, so that the second packaging material layer covers the light emitting surface of the light emitting element; The second packaging material layer includes a second packaging material, the first packaging material has a lower moisture permeability than the second packaging material; the first packaging material has a stronger adhesive force to the surface of the driving circuit layer facing the first packaging material layer than the second packaging material has to the surface of the driving circuit layer facing the second packaging material layer; The adhesion between the first packaging material and the surface of the light-emitting element is greater than the adhesion between the second packaging material and the surface of the light-emitting element.

7. The method for manufacturing a display panel according to claim 6, wherein: The step of forming a first packaging material layer on a side of the driving circuit layer away from the substrate includes: coating a first packaging material on a side of the driving circuit layer away from the substrate so that the first packaging material covers the light emitting element; extruding the first packaging material through a molding process; The first packaging material is thinned by a laser ablation process to form the first packaging material layer, so that the surface of the first packaging material layer away from the driving circuit layer is located between the plane where the light-emitting surface of the light-emitting element is located and the plane where the surface of the driving circuit layer facing the first packaging material layer is located.

8. The method for manufacturing a display panel according to claim 7, wherein: The material used to make the first packaging material layer includes epoxy material, and the material used to make the second packaging material layer includes silicone material.

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