Uniform temperature plate and electronic component

Abstract

A kind of vapor chamber and electronic component, the vapor chamber is suitable for electronic component with heating element, vapor chamber includes evaporation plate and condensation plate, evaporation plate and condensation plate are parallel to heating surface, and evaporation plate is located on the side of condensation plate close to heating surface, evaporation plate is welded to condensation plate;The surface of evaporation plate close to the side of condensation plate has evaporation zone and liquid storage zone, and the evaporation zone of evaporation plate is provided with evaporation microchannel, and the liquid storage zone of evaporation plate is provided with liquid storage microchannel;Evaporation microchannel and liquid storage microchannel are communicated, and the cross-sectional area of evaporation microchannel is less than the cross-sectional area of liquid storage microchannel, and evaporation cavity rib is formed between adjacent microchannels on evaporation plate;The surface of condensation plate close to the side of evaporation plate has condensation zone, and the condensation zone of condensation plate is provided with condensation cavity and condensation cavity support;Condensation cavity is communicated with evaporation microchannel and liquid storage microchannel, and condensation cavity support is welded to evaporation cavity rib.This application has smaller thickness, and is convenient to realize ultra-thin and prevent wrinkling.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic components, in particular to a vapor chamber and an electronic component. BACKGROUND

[0002] Heat pipe is a kind of component that uses liquid phase change process to carry latent heat of vaporization to improve heat transfer capacity of heat dissipation system, which has been widely used in the field of electronic engineering.

[0003] In the related art, a vapor chamber (also known as a heat spreader or a vapor cavity, English Vapor Chamber, abbreviated as VC) is a heat pipe structure that performs liquid phase change heat transfer in a planar cavity. The vapor chamber includes a lower shell, a wire mesh plate, a sintered plate and an upper shell arranged in sequence. The lower shell is provided with a vapor cavity, and the wire mesh plate and the sintered plate are embedded in the vapor cavity. The edge of the lower shell is tightly welded with the edge of the upper shell, so that the vapor cavity forms a closed cavity. In use, the lower shell is arranged adjacent to the heat dissipation surface of the heat generating component as the evaporation end, and the upper shell is in contact with the cold source as the condensation end.

[0004] However, the thickness of the vapor chamber in the above technical solution is large and prone to wrinkling. SUMMARY

[0005] In view of the above problems, the present application provides a vapor chamber and an electronic component, which has a smaller thickness and is convenient for achieving ultra-thin and preventing wrinkling.

[0006] In order to achieve the above purpose, the present application provides the following technical solution:

[0007] The first aspect of the embodiment of the present application provides a vapor chamber suitable for an electronic component with a heat generating component, the vapor chamber includes an evaporation plate and a condensation plate, the evaporation plate and the condensation plate are parallel to the heat generating surface of the heat generating component, and the evaporation plate is located on the side of the condensation plate close to the heat generating surface, and the evaporation plate is welded to the condensation plate;

[0008] The surface of the evaporation plate close to the condensation plate side has an evaporation area and a liquid storage area, the evaporation area and the liquid storage area do not overlap, the evaporation plate is provided with evaporation micro-channels, and the evaporation plate is provided with liquid storage micro-channels;

[0009] The evaporation micro-channels and the liquid storage micro-channels are in communication, and the cross-sectional area of the evaporation micro-channels is smaller than the cross-sectional area of the liquid storage micro-channels;

[0010] The surface of the condensation plate close to the evaporation plate side has a condensation area, the condensation area covers at least the evaporation area and the liquid storage area in the orthogonal projection of the evaporation plate, and the condensation area of the condensation plate is provided with a condensation cavity;

[0011] The condensing cavity is in communication with the evaporation micro-channels and the liquid storage micro-channels;

[0012] The vapor chamber further comprises an evaporation cavity rib located between the adjacent micro-channels on the evaporation plate and a condensing cavity support located in the condensing cavity on the condensing plate, a normal projection of the condensing cavity support on the evaporation plate covers the evaporation cavity rib, and the condensing cavity support is welded to the evaporation cavity rib.

[0013] In an implementable embodiment, the surface of the evaporation plate adjacent to the condensing plate further has an introduction area, the introduction area, the evaporation area and the liquid storage area are all mutually non-overlapping, and the introduction area of the evaporation plate is provided with an introduction micro-channel.

[0014] The introduction micro-channel is in communication between the evaporation micro-channels and the liquid storage micro-channels, and the cross-sectional area of the introduction micro-channel is greater than that of the evaporation micro-channels and smaller than that of the liquid storage micro-channels.

[0015] The normal projection of the condensing area on the evaporation plate further covers the introduction area.

[0016] In an implementable embodiment, the surface of the evaporation plate adjacent to the condensing plate further has a drainage area, the drainage area, the evaporation area, the introduction area and the liquid storage area are all mutually non-overlapping, and the drainage area of the evaporation plate is provided with a drainage micro-channel.

[0017] The drainage micro-channel is in communication with the liquid storage micro-channels, and the cross-sectional area of the drainage micro-channel is greater than that of the liquid storage micro-channels.

[0018] The normal projection of the condensing area on the evaporation plate further covers the drainage area, and the condensing cavity is in communication with the drainage micro-channel.

[0019] In an implementable embodiment, the evaporation area, the introduction area, the liquid storage area and the drainage area are sequentially and adjacently arranged, the introduction area surrounds at least part of the evaporation area, the liquid storage area surrounds at least part of the introduction area, and the drainage area surrounds at least part of the liquid storage area.

[0020] In an implementable embodiment, the evaporation micro-channels, the introduction micro-channels, the liquid storage micro-channels and the drainage micro-channels are all provided with a plurality of,

[0021] The plurality of micro-channels in the same area are all arranged in parallel, or the plurality of micro-channels in the same area are arranged in a mesh shape and are in communication with each other.

[0022] In an implementation, the evaporation cavity rib comprises a plurality of sub-evaporation cavity ribs arranged at intervals, and / or the condensation cavity support comprises a plurality of sub-condensation cavity supports arranged at intervals.

[0023] In an implementation, a partition plate is further included, the partition plate is arranged between the evaporation plate and the condensation plate, and a projection of the partition plate on the condensation plate covers at least the condensation region;

[0024] The partition plate is provided with a through hole corresponding to a position of the evaporation region, and the through hole communicates the evaporation micro-channel and the condensation cavity.

[0025] The partition plate is provided with a first drainage hole corresponding to a middle position of the drainage region, and the first drainage hole communicates the drainage micro-channel and the condensation cavity.

[0026] In an implementation, the partition plate is provided with a second drainage hole corresponding to an outer edge position of the drainage region, the second drainage hole is arranged at intervals with the first drainage hole, a cross-sectional area of the second drainage hole is greater than that of the first drainage hole, and the second drainage hole communicates the drainage micro-channel and the condensation cavity.

[0027] In an implementation, a front projection of the partition plate on the condensation plate coincides with the condensation plate, an edge of the partition plate close to the evaporation plate is welded with an edge of the evaporation plate, and an edge of the partition plate close to the condensation plate is welded with an edge of the condensation plate.

[0028] Or, a front projection of the partition plate on the condensation plate coincides with the condensation region, a surface of the evaporation cavity rib close to the condensation plate is recessed from an edge of the evaporation plate and forms a recessed cavity, the partition plate is embedded in the recessed cavity, and edges of the evaporation plate and the condensation plate are welded with each other.

[0029] An edge of the partition plate close to the evaporation plate is welded with the evaporation cavity rib, and an edge of the partition plate close to the condensation plate is welded with the condensation cavity support.

[0030] A second aspect of the embodiments of the present application provides an electronic component, comprising a heat generating component and the above-mentioned vapor chamber, the heat generating component has a heat generating surface, and the vapor chamber is arranged on a side of the heat generating component close to the heat generating surface.

[0031] The embodiment of the present application provides a vapor chamber and an electronic component. The vapor chamber is suitable for the electronic component with a heating element, and the electronic component includes small and micro electronic devices, especially handheld mobile electronic devices, such as a battery with a battery core or a circuit board with a chip. The vapor chamber is provided with an evaporation area and a liquid storage area on an evaporation plate, and a condensation area on a condensation plate, so that the evaporation plate forms an evaporation end, and the condensation plate forms a condensation end; the evaporation plate and the condensation plate are both parallel to the heating surface, so that the evaporation plate can be arranged adjacent to the heating surface, and the contact area of the vapor chamber and the heating surface is increased; the condensation cavity, the evaporation micro channel and the liquid storage micro channel are arranged, so that the micro channel forms a stable capillary structure, and the condensation liquid can be uniformly distributed on the evaporation plate along the micro channel; the condensation cavity, the evaporation micro channel and the liquid storage micro channel are in communication with each other, and the cross-sectional area of the three is in a size relationship, so that a capillary structure with a limited flow direction is formed between the evaporation plate and the condensation plate; the condensation liquid flows from the micro channel with a large cross-sectional area to the micro channel with a small cross-sectional area, so that the condensation liquid can form a circulating flow in the micro channel, and the phase change of the condensation liquid occurs in the circulating process to dissipate heat from the heating element; the evaporation plate and the condensation plate are arranged to form the vapor chamber, without other intermediate structures such as a silk screen plate and a sintered plate, so that a large contact thermal resistance is avoided, and the ultra-thin vapor chamber is realized; the condensation cavity is supported by the evaporation cavity rib, and wrinkles are prevented. The electronic component includes the above-mentioned vapor chamber of the heating element, and has the same beneficial effects.

[0032] The structure of the present application and its other purposes and beneficial effects will be more apparent and understandable through the description of the preferred embodiment in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0033] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0034] Figure 1 The partition diagram of the side of the evaporation plate close to the condensation plate is provided for the embodiment of the present application.

[0035] Figure 2 The structure diagram of the side of the evaporation plate close to the condensation plate is provided for the embodiment of the present application.

[0036] Figure 3 The A partial enlarged view of Figure 2 The B partial enlarged view of

[0037] Figure 4 The B partial enlarged view of Figure 2 The B partial enlarged view of

[0038] Figure 5 C-C view of Figure 2

[0039] Figure 6 Structure diagram of the side of the baffle plate close to the condensing plate provided by the embodiment of the present application;

[0040] Figure 7 D view of Figure 6

[0041] Figure 8 Structure diagram of the side of the condensing plate close to the evaporating plate provided by the embodiment of the present application;

[0042] Figure 9 E view of Figure 8

[0043] BRIEF DESCRIPTION OF DRAWINGS

[0044] 100 - evaporating plate

[0045] 110 - evaporating area; 111 - evaporating micro-channel

[0046] 120 - introduction area; 121 - introduction micro-channel

[0047] 130 - liquid storage area; 131 - liquid storage micro-channel

[0048] 140 - flow guiding area; 141 - flow guiding micro-channel

[0049] 150 - evaporating cavity rib

[0050] 200 - baffle plate

[0051] 210 - first flow guiding hole

[0052] 220 - second flow guiding hole

[0053] 230 - through hole

[0054] 300 - condensing plate

[0055] 310 - condensing area; 311 - condensing cavity

[0056] 320 - condensing cavity support DETAILED DESCRIPTION

[0057] ​​​In the related art, the vapor chamber includes a lower shell, a wire mesh plate, a sintered plate and an upper shell arranged in sequence. The lower shell is provided with a vapor cavity and a plurality of support columns arranged in an array in the vapor cavity, and the plurality of support columns are recessed from the edge of the lower shell. The wire mesh plate is arranged on and welded to the support columns, and the sintered plate is arranged on the wire mesh plate. The wire mesh plate and the sintered plate are embedded in the vapor cavity. The edge of the lower shell is buckled and welded to the edge of the upper shell, so that the vapor cavity forms a closed cavity.

[0058] In use, the lower shell is arranged adjacent to the heat dissipation surface of the heat generating element as an evaporation end, and the upper shell is in contact with the cold source as a condensation end. The condensate is injected into the evaporation cavity of the lower shell, so that the condensate is distributed at the bottom of the vapor cavity and filled in the pores of the wire mesh plate. The condensate in the pores of the wire mesh plate absorbs heat from the heat dissipation surface and rapidly vaporizes into steam. The steam flows to the condensation cavity under the diffusion force and contacts the cold source in the condensation cavity to release heat and change into condensate. The condensate in the condensation cavity flows through the cavity wall of the condensation cavity, the pores of the sintered plate and the pores of the wire mesh plate, and then flows back into the evaporation cavity. This process is repeated until the temperature of the evaporation end and the condensation end is equal.

[0059] However, in the above technical solution, on the one hand, due to the arrangement of the wire mesh plate and the sintered plate between the upper shell and the lower shell, the multi-layer component structure increases the contact thermal resistance between each other, which limits the ultra-thinning of the vapor chamber; on the other hand, since the wire mesh plate is formed by intersecting and welding of warp threads and weft threads, the height of the warp threads and the weft threads is different, which reduces the connection strength of the wire mesh plate and the support columns, and further the condensate in the vapor cavity cannot be uniformly distributed in the capillary gap of the wire mesh plate.

[0060] To solve the above technical problems, the embodiment of the present application provides a vapor chamber and an electronic component. The vapor chamber is suitable for an electronic component with a heating element, and the electronic component includes small and micro electronic devices, especially handheld mobile electronic devices, such as a battery with a battery core or a circuit board with a chip. The vapor chamber is provided with an evaporation area and a liquid storage area on an evaporation plate, and a condensation area on a condensation plate, so that the evaporation plate forms an evaporation end and the condensation plate forms a condensation end. The evaporation plate and the condensation plate are both parallel to the heating surface, so that the evaporation plate can be arranged adjacent to the heating surface, thereby increasing the contact area between the vapor chamber and the heating surface. The condensation cavity, the evaporation micro channel and the liquid storage micro channel are arranged to form a capillary structure with stable structure, and the condensate can be uniformly distributed along the micro channel on the evaporation plate. The condensation cavity, the evaporation micro channel and the liquid storage micro channel are connected and have a size relationship in cross section, so that a capillary structure with a limited flow direction is formed between the evaporation plate and the condensation plate. The condensate flows from the micro channel with a large cross-sectional area to the micro channel with a small cross-sectional area, so that the condensate can form a circulating flow in the micro channel and phase change during the circulation to dissipate heat from the heating element. The evaporation plate and the condensation plate are arranged to form the vapor chamber without other intermediate structures such as a wire mesh plate and a sintered plate, thereby avoiding a large contact thermal resistance and realizing the ultra-thin vapor chamber. The condensation cavity is supported by the evaporation cavity rib to prevent wrinkling. The electronic component includes the above vapor chamber of the heating element, and has the same beneficial effects.

[0061] To make the objectives, technical solutions and advantages of the present application clearer, the technical solutions in the embodiments of the present application will be described in more detail below with reference to the drawings in the preferred embodiments of the present application. In the drawings, the same or similar reference numerals represent the same or similar components or components with the same or similar functions throughout. The described embodiments are part of the embodiments of the present application, not all of the embodiments. The embodiments described below by reference to the drawings are exemplary and are intended to explain the present application, and cannot be understood as a limitation of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0062] The electronic component provided by the embodiment of the present application will be described below.

[0063] The embodiment of the present application provides an electronic component, which includes a heating element and a vapor chamber. The heating element has a heating surface, and the vapor chamber is arranged on a side of the heating element close to the heating surface.

[0064] The electronic component can include a battery or a circuit board. For example, the battery or the circuit board can be a component in a mobile terminal or other electronic device. When the electronic component includes a battery, the heat generating component can be a cell in the battery. When the electronic component includes a circuit board, the heat generating component can be a chip on the printed circuit board.

[0065] It can be understood that as the position and posture of the electronic component change during use, the position and posture of the heat generating surface also change, i.e., the heat generating surface can have a horizontal, inclined, or vertical state.

[0066] The following will be described with reference to Figures 1-9 A vapor chamber provided by an embodiment of the present application will be described.

[0067] An embodiment of the present application provides a vapor chamber suitable for an electronic component having a heat generating component.

[0068] The vapor chamber includes an evaporating plate 100 and a condensing plate 300, both of which are parallel to the heat generating surface of the heat generating component, and the evaporating plate 100 is located on the side of the condensing plate 300 close to the heat generating surface, and the evaporating plate 100 is welded to the condensing plate 300.

[0069] Referring to Figures 1-5 As shown in the figure, the surface of the evaporating plate 100 close to the condensing plate 300 has an evaporation area 110 and a liquid storage area 130, and the evaporation area 110 and the liquid storage area 130 do not overlap each other. The evaporation area 110 of the evaporating plate 100 is provided with evaporation micro-channels 111, and the liquid storage area 130 of the evaporating plate 100 is provided with liquid storage micro-channels 131.

[0070] The evaporation micro-channels 111 and the liquid storage micro-channels 131 are in communication, and the cross-sectional area of the evaporation micro-channels 111 is smaller than that of the liquid storage micro-channels 131.

[0071] Referring to Figure 8 and Figure 9 As shown in the figures, the surface of the condensing plate 300 close to the evaporating plate 100 has a condensing area 310, and the condensing area 310 covers at least the evaporation area 110 and the liquid storage area 130 in the orthogonal projection of the evaporating plate. The condensing area 310 of the condensing plate 300 is provided with condensing cavities 311.

[0072] The condensing cavities 311 are in communication with the evaporation micro-channels 111 and the liquid storage micro-channels 131. The cross-sectional area of the condensing cavities 311 is greater than that of the liquid storage micro-channels 131.

[0073] The evaporation plate 100 and the condensation plate 300 can each include a ceramic piece, a metal material piece, or a composite material piece. For example, the evaporation plate 100 and the condensation plate 300 can each be a copper alloy sheet or a stainless steel sheet. The evaporation plate 100 and the condensation plate 300 can have the same shape and size, such that the evaporation plate 100 has a front projection on the condensation plate 300 that coincides with the condensation plate 300. The evaporation plate 100 and the condensation plate 300 can be directly welded together, or other components (such as the partition plate 200 described below) can be added between the evaporation plate 100 and the condensation plate 300 and then welded together.

[0074] The thickness of the evaporation plate 100 can range from 0.08 mm to 0.10 mm. For example, the thickness of the evaporation plate 100 can be 0.08 mm, 0.09 mm, or 0.10 mm. The thickness of the condensation plate 300 can range from 0.13 mm to 0.15 mm. For example, the thickness of the condensation plate 300 can be 0.13 mm, 0.14 mm, or 0.15 mm. In this way, the thickness of the heat spreader can be less than 0.3 mm, forming an ultra-thin heat spreader.

[0075] The evaporation plate 100 can be provided with an evaporation area 110 and a liquid storage area 130, such that the evaporation plate 100 forms an evaporation end. The condensation plate 300 can be provided with a condensation area 310, such that the condensation plate 300 forms a condensation end. The evaporation plate 100 and the condensation plate 300 can be parallel to the heat-generating surface, and the evaporation plate 100 can be arranged in abutment with the heat-generating surface, increasing the contact area between the heat spreader and the heat-generating surface and improving the heat dissipation effect of the heat spreader on the heat-generating surface.

[0076] The evaporation plate 100 can be provided with an evaporation micro-channel 111 and a liquid storage micro-channel 131, and the condensation plate 300 can be provided with a condensation cavity 311, such that the micro-channels form a capillary structure. Compared to a structure in which a wire mesh plate is welded to a support column, the micro-channels have a defined structure, and the condensate can be uniformly distributed in the micro-channels. The micro-channels can be formed by a material removal process, such as a half-etching technique, in which a portion of the thickness of the solid material at the corresponding position of the sheet is removed by an etching liquid, and a portion of the thickness of the solid material is retained, and the space where the material is removed forms the micro-channels. The shape of the cross-section of the micro-channels can include a triangle, a rectangle, a trapezoid, or a polygon.

[0077] The evaporation zone 110 and the liquid storage zone 130 do not overlap with each other, and the condensation zone 310 at least corresponds to the positions of the evaporation zone 110 and the liquid storage zone 130. The evaporation zone 110 can be arranged to correspond to the relatively high temperature point of the heating surface, and the liquid storage zone 130 is relatively far away from the relatively high temperature point of the heating surface. In this way, the condensate at the evaporation end absorbs heat, and the condensate in the evaporation zone 110 undergoes phase change and vaporizes into steam. The steam diffuses to the condensation zone 310 and contacts the cold source at the condensation end to undergo phase change and transform into condensate. The condensate on the condensation end flows back to the liquid storage zone 130 and the evaporation zone 110, and the condensate in the liquid storage zone 130 is pushed by the dislocation potential energy of the condensate in the evaporation zone 110 to flow to the evaporation zone 110 to replenish the condensate. The above process is repeated until the temperature of the evaporation end is equal to that of the condensation end.

[0078] The evaporation micro-channel 111 and the liquid storage micro-channel 131 are in communication with each other, the condensation cavity 311 is in communication with the evaporation micro-channel 111 and the liquid storage micro-channel 131, and the cross-sectional areas of the condensation cavity 311, the liquid storage micro-channel 131 and the evaporation micro-channel 111 decrease in sequence, so that the equivalent effective diameters of the three decrease in sequence, and the capillary forces of the three on the condensate increase in sequence. When the condensate in the evaporation zone 110 absorbs heat and vaporizes into steam, the condensate in the liquid storage zone 130 can flow to the evaporation zone 110 under the double pushing of the capillary force and the dislocation potential energy of the heated evaporation to replenish the condensate. Similarly, the condensate in the condensation zone 310 can replenish the condensate in the liquid storage zone 130 and the evaporation zone 110.

[0079] It can be understood that the cross-sectional areas of the micro-channels in the same zone can be equal everywhere, or can gradually change and reach an extreme value near the micro-channel connected thereto. For example, the cross-sectional area of the liquid storage micro-channel 131 can gradually decrease from one end away from the evaporation micro-channel 111 to one end close to the evaporation micro-channel 111, so that the capillary force of the liquid storage micro-channel 131 on the condensate gradually increases, thereby guiding the condensate to flow from the liquid storage micro-channel 131 to the evaporation micro-channel 111 under the action of the more certain capillary force. Similarly, the cross-sectional area of the condensation cavity 311 can gradually decrease from one end close to the evaporation micro-channel 111 to one end close to the liquid storage micro-channel 131, thereby guiding the condensate to flow in the condensation cavity 311 from one end close to the evaporation micro-channel 111 to one end close to the liquid storage micro-channel 131.

[0080] In an implementable embodiment, referring to FIG. 1, Figures 1-5 As shown in FIG. 1, the surface of the evaporation plate 100 adjacent to the condensation plate 300 also has a guide-in zone 120, and the guide-in zone 120, the evaporation zone 110 and the liquid storage zone 130 do not overlap with each other. The guide-in zone 120 of the evaporation plate 100 is provided with a guide-in micro-channel 121.

[0081] The import micro-channel 121 is connected between the evaporation micro-channel 111 and the storage micro-channel 131, and the cross-sectional area of the import micro-channel 121 is greater than the cross-sectional area of the evaporation micro-channel 111 and less than the cross-sectional area of the storage micro-channel 131.

[0082] The condensation area 310 also covers the import area 120 in the orthographic projection of the evaporation plate 100.

[0083] In this way, the distribution area of the condensate can be increased and the total flow of the condensate can be increased by adding the import area 120 and the import micro-channel 121. The cross-sectional area of the import micro-channel 121 is set to be between the cross-sectional area of the evaporation micro-channel 111 and the cross-sectional area of the storage micro-channel 131, so that the condensate in the storage micro-channel 131 has a more determined tendency to flow to the evaporation micro-channel 111 under the guidance of the import micro-channel 121.

[0084] In an implementable embodiment, referring to Figures 1-3 The evaporation plate 100 has a drainage area 140 adjacent to the surface of the condensation plate 300. The drainage area 140, the evaporation area 110, the import area 120 and the storage area 130 do not overlap with each other. The evaporation plate 100 is provided with a drainage micro-channel 141 in the drainage area 140.

[0085] The drainage micro-channel 141 is connected to the storage micro-channel 131, and the cross-sectional area of the drainage micro-channel 141 is greater than the cross-sectional area of the storage micro-channel 131.

[0086] The condensation area 310 also covers the drainage area 140 in the orthographic projection of the evaporation plate 100. The condensation cavity 311 is connected to the drainage micro-channel 141.

[0087] In this way, the distribution area of the condensate can be increased and the total flow of the condensate can be increased by adding the drainage area 140 and the drainage micro-channel 141. The cross-sectional area of the drainage micro-channel 141 is set to be greater than the cross-sectional area of the storage micro-channel 131, so as to promote the condensate in the drainage micro-channel 141 to flow to the storage micro-channel 131 autonomously.

[0088] In an implementable embodiment, the evaporation plate 100 is provided with a liquid injection port (not shown) with a sealing cover. The liquid injection port can be located at the edge of the evaporation plate 100, and the liquid injection port is connected to the drainage micro-channel 141.

[0089] In this way, the evaporation end can be injected with supplemental condensate through the liquid injection port.

[0090] In an implementable embodiment, referring to Figure 1 and Figure 2As shown, the evaporation zone 110, the introduction zone 120, the liquid storage zone 130 and the drainage zone 140 are sequentially and adjacently arranged, the introduction zone 120 surrounds at least part of the evaporation zone 110, the liquid storage zone 130 surrounds at least part of the introduction zone 120, and the drainage zone 140 surrounds at least part of the liquid storage zone 130.

[0091] As shown, the evaporation zone 110, the introduction zone 120, the liquid storage zone 130 and the drainage zone 140 can be distributed from the center to the outside in turns, and each zone can be distributed in a whole circle or in a ring segment. Figure 1 As shown, the evaporation zone 110 and the introduction zone 120 are adjacently arranged at the center, the liquid storage zone 130 is arranged around the outer periphery of the common area of the two zones and is distributed in a whole circle, and the drainage zone 140 is arranged around the outer periphery of the liquid storage zone 130 and is distributed in a whole circle.

[0092] In this way, the distribution positions of the zones can be reasonably set according to the positions of the relatively high temperature points of the heat-emitting surface.

[0093] In an implementable embodiment, referring to Figures 2-4 and Figure 8 and Figure 9 As shown, the evaporation micro-channels 111, the introduction micro-channels 121, the liquid storage micro-channels 131 and the drainage micro-channels 141 are each provided with a plurality of micro-channels.

[0094] The plurality of micro-channels in the same zone are arranged in parallel, or the plurality of micro-channels in the same zone are arranged in a mesh shape and are interconnected.

[0095] As an example, the evaporation plate 100 and the condensation plate 300 are rectangular, and the micro-channels in each zone can be parallel to the edges of the evaporation plate 100 and the condensation plate 300, or can form an angle with the edges of the evaporation plate 100 and the condensation plate 300 to guide the flow direction of the condensed liquid.

[0096] In this way, the plurality of micro-channels in each zone can form a micro-channel group, so that the condensed liquid can be uniformly distributed in the micro-channel group, and the heat dissipation area between the condensed liquid and the heat-emitting component can be expanded.

[0097] For the convenience, when the micro-channels in two zones are interconnected, one of the zones is referred to as a to-be-connected zone of the other zone. As an example, the introduction zone 120 is referred to as a to-be-connected zone of the liquid storage zone 130 and the evaporation zone 110.

[0098] When the plurality of micro-channels in the same zone are arranged in parallel, each micro-channel in the same zone can be interconnected with at least one micro-channel in the to-be-connected zone, or the same ends of the plurality of condensation cavities in the same zone can be interconnected, and then interconnected with at least one micro-channel in the to-be-connected zone.

[0099] When the multiple micro-channels in the same region are arranged in a net shape and are interconnected, at least one micro-channel in the same region is interconnected with at least one micro-channel in the region to be connected.

[0100] It can be understood that the evaporation micro-channel 111 can be a straight micro-channel, a vertical net micro-channel or a net micro-channel with an inclination angle.

[0101] In an implementable embodiment, referring to Figure 3 , Figure 4 and Figure 9 and combining with Figure 2 and Figure 8 , the vapor chamber further comprises evaporation cavity ribs 150 and condensation cavity supports 320. The evaporation cavity ribs 150 are formed between the adjacent micro-channels on the evaporation plate 100, and the condensation cavity supports 320 are located in the condensation cavities 311 on the condensation plate 300. The orthographic projection of the condensation cavity supports 320 on the evaporation plate 100 covers the evaporation cavity ribs 150.

[0102] The solid part between the adjacent micro-channels on the evaporation plate 100 constitutes the evaporation cavity ribs 150, and the condensation cavity supports 320 are arranged in the condensation cavities 311 on the condensation plate 300. Since the cross-sectional area of the micro-channel on the evaporation plate 100 is smaller than the cross-sectional area of the condensation cavity 311 on the condensation plate 300, the number of the evaporation cavity ribs 150 is greater than the number of the condensation cavity supports 320. It can be understood that the closer to the evaporation micro-channel 111, the greater the density of the unit size micro-channel. However, the surface area of the corresponding condensation cavity support 320 is unchanged. The welding between the condensation cavity support 320 and the evaporation cavity rib 150 is a group of large-area welding corresponding to a plurality of small-area welding. The corresponding projection area in the evaporation area corresponding to the condensation area includes a combination of a plurality of small-area rib surfaces and a plurality of micro-channels. Moreover, the closer to the evaporation channel 111, the higher the combination density of the evaporation cavity rib 150 and the micro-channel. Moreover, the corresponding welding between the condensation cavity support 320 and the evaporation cavity rib 150 will not affect the flow of the liquid in the evaporation area to the evaporation channel. The purpose is to ensure the most effective welding contact surface.

[0103] When the micro-channels are interconnected in a net shape, the evaporation cavity ribs 150 include a plurality of spaced sub-evaporation cavity ribs, and the condensation cavity supports 320 include a plurality of spaced sub-condensation cavity supports.

[0104] The evaporation plate 100 and the condensation plate 300 are arranged in layers, and the edges of the two are welded to each other. In order to improve the welding strength of the two, the evaporation cavity ribs 150 and the condensation cavity supports 320 can be correspondingly welded. At this time, part of the evaporation cavity ribs 150 correspond to the condensation cavity supports 320. Exemplarily, the starting position of the condensation cavity support 320 can correspond to the starting position of the evaporation cavity rib 150, and the spacing between the condensation cavity supports 320 can be an integer multiple of the spacing between the adjacent evaporation cavity ribs 150.

[0105] In an implementation, as shown in Figure 6 and Figure 7 The heat spreader further comprises a partition plate 200, which is arranged between the evaporating plate 100 and the condensing plate 300, and the projection of the partition plate 200 on the condensing plate 300 covers at least the condensing area 310.

[0106] The partition plate 200 is provided with a through hole 230 corresponding to the position of the evaporating area 110, and the through hole 230 connects the evaporating micro channel 111 and the condensing cavity 311.

[0107] The partition plate 200 is provided with a first drainage hole 210 corresponding to the middle position of the drainage area 140, and the first drainage hole 210 connects the drainage micro channel 141 and the condensing cavity 311.

[0108] The material of the partition plate 200 can be the same as that of the evaporating plate, and the thickness of the partition plate 200 can be 0.02mm-0.03mm. For example, the thickness of the partition plate 200 can be 0.02mm or 0.03mm. The partition plate 200 can isolate the evaporating end and the condensing end, so that the micro channels on the evaporating plate 100 and the condensing plate 300 form micro channels, which can strengthen the self-flowing direction of the condensing liquid, improve the heat transfer performance of the heat spreader, and also enhance the overall strength of the heat spreader.

[0109] The through hole 230 on the partition plate 200 can realize the connection between the evaporating micro channel 111 and the condensing cavity 311, and the first drainage hole 210 can realize the connection between the condensing cavity 311 and the drainage micro channel 141, so as to ensure that the heat absorbing vapor at the evaporating end smoothly enters the condensing end, and the condensing liquid at the condensing end and the evaporating end flows back to communicate, so as to complete the heat dissipation of the heat spreader to the heat generating element.

[0110] In an implementation, as shown in Figure 6 and Figure 7 The partition plate 200 is provided with a second drainage hole 220 corresponding to the outer edge position of the drainage area 140, and the second drainage hole 220 is arranged in a spaced manner with the first drainage hole 210, and the cross-sectional area of the second drainage hole 220 is greater than that of the first drainage hole 210. The second drainage hole 220 connects the drainage micro channel 141 and the condensing cavity 311.

[0111] When the heat generating element changes its posture with the electronic component, the condensing liquid will flow to the low point of the heat spreader. The second drainage hole 220 is arranged at the position corresponding to the outer edge of the drainage area 140 of the partition plate 200, so that the condensing liquid at the condensing end can quickly flow back to the drainage micro channel 141 through the second drainage hole 220 with a larger cross-sectional area at the low point of the heat spreader, and sufficient condensing liquid can be supplied to the drainage micro channel 141.

[0112] In an implementable embodiment, the partition plate 200 is provided with liquid storage drainage holes corresponding to the liquid storage area 130, and is provided with import drainage holes corresponding to the import area 120. The liquid storage drainage holes and the import drainage holes are arranged at intervals, the liquid storage drainage holes are connected to the liquid storage micro channel 131 and the condensation cavity 311, and the import drainage holes are connected to the import micro channel 121 and the condensation cavity 311.

[0113] The first drainage hole 210, the liquid storage drainage hole and the import drainage hole are each provided with a plurality of holes, and the number of the liquid storage drainage holes and the number of the import drainage holes are each less than the number of the first drainage holes 210.

[0114] In this way, an appropriate amount of drainage holes can be arranged in the liquid storage area 130 or the import area 120 according to actual conditions, so that the condensate can be supplemented to the corresponding area, and the circulation flow speed of the condensate in the micro channel can be increased.

[0115] In the embodiments of the present application, the partition plate 200 can include the following two arrangement modes:

[0116] In the first implementable arrangement mode, the orthographic projection of the partition plate 200 on the condensation plate 300 coincides with the condensation plate 300, the edge of the partition plate 200 close to the evaporation plate 100 is welded with the edge of the evaporation plate 100, and the edge of the partition plate 200 close to the condensation plate 300 is welded with the edge of the condensation plate 300. The surface of the partition plate 200 close to the evaporation plate 100 is welded with the evaporation cavity rib 150, and the surface of the partition plate 200 close to the condensation plate 300 is welded with the condensation cavity support 320.

[0117] In the second implementable arrangement mode, the orthographic projection of the partition plate 200 on the condensation plate 300 coincides with the condensation area 310, the surface of the evaporation cavity rib 150 close to the condensation plate is recessed from the edge of the evaporation plate 100 and forms a recessed cavity, the partition plate 200 is embedded in the recessed cavity, and the edges of the evaporation plate 100 and the condensation plate 300 are welded with each other. The surface of the partition plate 200 close to the evaporation plate 100 is welded with the evaporation cavity rib 150, and the surface of the partition plate 200 close to the condensation plate 300 is welded with the condensation cavity support 320.

[0118] In this way, the partition plate 200 can be connected between the evaporation plate 100 and the condensation plate 300 according to the use requirement, or the partition plate 200 can be embedded in the cavity between the evaporation plate 100 and the condensation plate 300, which can improve the structural strength of the vapor chamber and improve the heat transfer effect of the vapor chamber.

[0119] It should be noted that in the embodiments of the present application, the "micro" in the "micro channel" refers to the structure size of the channel being microns, and for structures not explicitly shown, such as "through holes", the structure size can be millimeters or microns, which is not limited.

[0120] It should be noted that in the description of the embodiments of the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connecting" should be understood in a broad sense, for example, it can be fixedly connected, or indirectly connected through an intermediate medium, or the internal communication of two elements, or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0121] In the description of the embodiments of the present application, the terms "upper", "lower", "front", "back", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the term "a plurality of" means two or more, unless otherwise specified and limited.

[0122] In the description of the embodiments of the present application, the terms "first", "second", "third", "fourth" and the like (if any) are used to distinguish similar objects, and do not necessarily have to describe a particular order or sequence. It should be understood that the data thus used can be interchanged under appropriate circumstances, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, system, product or device that includes a series of steps or units does not have to be limited to those steps or units clearly listed, but can include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0123] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A heat spreader, characterized in that, Suitable for electronic components with heating elements, the heat spreader includes an evaporator plate and a condenser plate, both of which are parallel to the heating surface of the heating element, and the evaporator plate is located on the side of the condenser plate closer to the heating surface, and the evaporator plate is welded to the condenser plate; The surface of the evaporator plate near the condenser plate has an evaporation zone and a liquid storage zone, the evaporation zone and the liquid storage zone do not overlap, the evaporation zone of the evaporator plate is provided with evaporation microchannels, and the liquid storage zone of the evaporator plate is provided with liquid storage microchannels. The evaporation microchannel is connected to the liquid storage microchannel, and the cross-sectional area of ​​the evaporation microchannel is smaller than the cross-sectional area of ​​the liquid storage microchannel. The surface of the condenser plate near the evaporator plate has a condensation zone, and the projection of the condensation zone onto the evaporator plate covers at least the evaporation zone and the liquid storage zone. The condensation zone of the condenser plate is provided with an evaporation chamber. The evaporation chamber is connected to both the evaporation microchannel and the liquid storage microchannel; The heat spreader also includes an evaporation chamber rib and a condensation chamber support. The evaporation chamber rib is located between adjacent microchannels on the evaporation plate, and the condensation chamber support is located inside the condensation chamber on the condensation plate. The orthographic projection of the condensation chamber support on the evaporation plate covers the evaporation chamber rib, and the condensation chamber support is welded to the evaporation chamber rib.

2. The temperature distribution plate according to claim 1, characterized in that, The surface of the evaporating plate adjacent to the condensing plate also has an inlet area. The inlet area, the evaporating area and the liquid storage area do not overlap with each other. The inlet area of ​​the evaporating plate is provided with inlet microchannels. The inlet microchannel is connected between the evaporation microchannel and the liquid storage microchannel, and the cross-sectional area of ​​the inlet microchannel is larger than the cross-sectional area of ​​the evaporation microchannel and smaller than the cross-sectional area of ​​the liquid storage microchannel. The condensation zone, when projected onto the evaporator plate, also covers the inlet zone.

3. The temperature distribution plate according to claim 2, characterized in that, The surface of the evaporating plate adjacent to the condensing plate also has a drainage area. The drainage area, the evaporating area, the inlet area and the liquid storage area do not overlap with each other. The drainage area of ​​the evaporating plate is provided with drainage microchannels. The drainage microchannel is connected to the liquid storage microchannel, and the cross-sectional area of ​​the drainage microchannel is larger than that of the liquid storage microchannel. The condensation zone, projected onto the evaporation plate, also covers the drainage zone, and the condensation chamber is connected to the drainage microchannel.

4. The temperature distribution plate according to claim 3, characterized in that, The evaporation zone, the inlet zone, the liquid storage zone, and the drainage zone are arranged adjacent to each other in sequence. The inlet zone surrounds at least a portion of the evaporation zone, the liquid storage zone surrounds at least a portion of the inlet zone, and the drainage zone surrounds at least a portion of the liquid storage zone.

5. The temperature distribution plate according to claim 3 or 4, characterized in that, Multiple microchannels are provided for each of the following: evaporation microchannels, inlet microchannels, liquid storage microchannels, and drainage microchannels. Multiple microchannels within the same area are arranged in parallel, or multiple microchannels within the same area are arranged in a network and interconnected.

6. The temperature distribution plate according to claim 5, characterized in that, The evaporation chamber rib includes multiple spaced sub-evaporation chamber ribs, and / or the condensation chamber support includes multiple spaced sub-condensation chamber supports.

7. The temperature distribution plate according to claim 6, characterized in that, It also includes a partition, which is disposed between the evaporator plate and the condenser plate, and the projection of the partition on the condenser plate at least covers the condensation area; The partition plate is provided with through holes at the position corresponding to the evaporation zone, and the through holes connect the evaporation microchannels and the condensation chamber; The partition is provided with a first drainage hole at the middle position of the drainage area, and the first drainage hole connects the drainage microchannel and the condensation chamber.

8. The temperature distribution plate according to claim 7, characterized in that, The partition is provided with a second drainage hole at the outer edge of the drainage area. The second drainage hole is spaced apart from the first drainage hole, and the cross-sectional area of ​​the second drainage hole is larger than that of the first drainage hole. The second drainage hole connects the drainage microchannel and the condensation chamber.

9. The temperature distribution plate according to claim 8, characterized in that, The orthographic projection of the partition plate onto the condensing plate coincides with the condensing plate. The edge of the partition plate near the evaporating plate is welded to the edge of the evaporating plate. The edge of the partition plate near the condensing plate is welded to the edge of the condensing plate. Alternatively, the orthographic projection of the partition plate onto the condensing plate coincides with the condensing zone, the surface of the evaporation chamber rib near the condensing plate is recessed into the edge of the evaporation plate to form a recessed cavity, the partition plate is embedded in the recessed cavity, and the edges of the evaporation plate and the condensing plate are welded to each other. The surface of the partition plate near the evaporator plate is welded to the evaporator cavity rib, and the side of the partition plate near the condenser plate is welded to the condenser cavity support.

10. An electronic component, characterized in that, It includes a heating element and a heat spreader as described in any one of claims 1-9, wherein the heating element has a heating surface and the heat spreader is disposed on the side of the heating element near the heating surface.

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