A tank type alkali polishing cleaning apparatus

Abstract

The application discloses a groove type alkali polishing cleaning equipment and relates to the technical field of solar cell production equipment. The cleaning groove of the equipment is internally provided with a clamping mechanism for clamping and fixing a wafer. The clamping mechanism comprises a suction cup for adsorbing and fixing the wafer. The suction cup is movably connected in the cleaning groove through a fixing base. A movable block is slidably connected to the inner side wall of the cleaning groove. The movable block and the fixing base are fixed to each other through a linkage rod. The movable block is symmetrically arranged on opposite two side surfaces in the cleaning groove. Two movable blocks are symmetrically arranged on each side surface. The position of the fixing base of the fixed wafer can be adjusted. When the size of the wafer is small, the overall spacing of the fixing base can be reduced. When the size of the wafer is large, the overall spacing of the fixing base can also be increased. Therefore, the mutual adaptation between the fixing base and the wafer is realized. The fixing base is always fixed at the corresponding position of the wafer. The problem that the wafer cannot be fixed or the edge of the wafer is damaged is avoided. In addition, the wafer can be prevented from being damaged by the relatively hard connecting point.

Description

Technical Field

[0001] This invention relates to the field of solar cell production equipment technology, and in particular to a tank-type alkaline polishing and cleaning equipment. Background Technology

[0002] Solar cell modules consist of high-efficiency monocrystalline / polycrystalline solar cells, low-iron ultra-white tempered glass, encapsulation materials (EVA, POE, etc.), functional backsheets, interconnect strips, busbars, junction boxes, and aluminum alloy frames. Their lifespan can reach 15-25 years.

[0003] Individual solar cells cannot be used directly as power sources. To function as power sources, several individual cells must be connected in series and parallel and tightly packaged into a module. Solar cell modules are the core and most important component of a solar power generation system.

[0004] Polishing and cleaning equipment is required in the production of solar cell modules. To improve production efficiency and competitiveness, solar cell manufacturers are making greater efforts to reduce silicon wafer ratio and lower production costs, while also placing higher demands on the quality and production cost of the silicon wafers.

[0005] Currently, Chinese patent CN215508099U discloses a tank-type cleaning device, including a cleaning box, a storage mechanism, a buffer assembly, a spray mechanism, and a drying mechanism. The storage mechanism for placing wafers is installed inside the cleaning box. Four sets of identical buffer assemblies are installed at the four corners of the bottom of the cleaning box. The spray mechanism for cleaning the crystals is installed inside the cleaning box. The drying mechanism for drying the cleaned crystals is installed inside the cleaning box.

[0006] This cleaning equipment has the advantages of cleaning the wafers more thoroughly and facilitating rapid drying after cleaning. However, when cleaning wafers, the entire wafer needs to be fixed in the cleaning tank. The existing fixing structure has the problem that the connection points are too rigid and can easily damage the wafers under the rinsing action. At the same time, the fixing point position is constant. If the wafer size is large, the fixing point is close to the middle of the wafer, which can easily cause damage to the wafer at the edge. When the wafer is small, the fixing point is too far away and cannot be fixed. Summary of the Invention

[0007] To address the aforementioned technical problems and overcome the shortcomings of existing technologies, this invention provides a tank-type alkaline polishing and cleaning device.

[0008] To address the above technical problems, this invention provides a tank-type alkaline polishing and cleaning device.

[0009] Technical benefits: This cleaning equipment can adjust the position of the fixture for fixing the wafer. When the wafer size is small, the overall spacing of the fixture can be reduced, and when the wafer size is large, the overall spacing of the fixture can be increased. This achieves mutual adaptation between the fixture and the wafer, ensuring that the fixture is always fixed in the corresponding position of the wafer, avoiding problems such as failure to fix or damage to the wafer edge. At the same time, the fixture uses a suction cup to adsorb and fix the wafer, preventing damage to the wafer from hard connection points.

[0010] The technical solution further defined by the present invention is: a tank-type alkaline polishing and cleaning device, comprising a body, a cleaning tank disposed within the body, and a cleaning mechanism. The cleaning tank is provided with a clamping mechanism for clamping and fixing wafers. The clamping mechanism includes a suction cup for adsorbing and fixing wafers. The suction cup is movably connected to the cleaning tank through a fixed base. Movable blocks are slidably connected to the inner side wall of the cleaning tank. The movable blocks are fixed to the fixed base through a linkage rod. The movable blocks are symmetrically arranged on opposite sides of the cleaning tank. Two movable blocks are symmetrically arranged on each side. The clamping mechanism also includes a transverse driving member attached to the inner side wall of the cleaning tank for driving the corresponding movable blocks to slide relative to each other in the transverse direction, and a longitudinal driving member for driving the corresponding movable blocks to slide relative to each other in the longitudinal direction.

[0011] Furthermore, the lateral drive component includes a lateral drive seat, on which a horizontally oriented drive groove is formed. The movable block is slidably connected within the drive groove. An movable cavity is formed on the inner side wall of the cleaning groove, and the lateral movable seat is slidably connected within the movable cavity.

[0012] The aforementioned tank-type alkaline polishing and cleaning equipment includes a transverse drive component comprising a drive screw rotatably connected in a drive tank. The drive screw has two threaded sections with opposite thread directions. The two ends of the drive screw pass through two movable blocks on the same side and are threadedly connected to them. The two movable blocks are located in the two threaded sections respectively. The drive screw is driven to rotate by a drive motor fixed on a transverse drive seat.

[0013] The aforementioned trough-type alkaline polishing and cleaning equipment includes a longitudinal drive component comprising a longitudinal motor fixed in the movable cavity, a longitudinal lead screw fixed on the output shaft of the longitudinal motor, a connecting rod fixed on the transverse drive seat, two connecting rods symmetrically arranged, a push block provided between the two connecting rods, and the longitudinal lead screw penetrating the push block and being threadedly connected to it.

[0014] The aforementioned tank-type alkaline polishing and cleaning equipment includes a cleaning mechanism comprising several cleaning heads fixed on the inner wall of the cleaning tank. The cleaning heads are positioned facing the center of the wafer, and there are two sets of cleaning heads, which are respectively fixed at two corresponding heights on the inner wall of the cleaning tank.

[0015] The aforementioned tank-type alkaline polishing and cleaning equipment has a cover plate on the machine body for closing and opening the cleaning tank. The cover plate is rotatably connected to the machine body via a rotating shaft. The size of the cover plate is adapted to the cleaning tank. The machine body is provided with a rotating component for driving the rotating shaft and the cover plate to rotate.

[0016] The aforementioned tank-type alkaline polishing and cleaning equipment includes a rotating component comprising a rotating motor fixed on the machine body, a rotating worm gear on the output shaft of the rotating motor, and a rotating worm wheel coaxially mounted on the rotating shaft, with the rotating worm gear and the rotating worm wheel meshing with each other.

[0017] The beneficial effects of this invention are:

[0018] (1) In this invention, when it is necessary to clean the wafer, the operator places the wafer in the cleaning tank and fixes the entire wafer by the suction cup on the clamping mechanism. Then the cleaning mechanism is used for cleaning. When the wafer size is small, the operator can adjust the position of the four fixing seats by the horizontal drive and the vertical drive to reduce the distance between the four fixing seats. At this time, the suction cup can be adsorbed on the four corners of the wafer to ensure adsorption stability. Similarly, when the wafer size is large, the distance between the four fixing seats can be increased by the drive to ensure that the suction cup can also be adsorbed on the four corners of the wafer, thereby improving the firmness of fixing wafers of various sizes and avoiding impact on the wafer periphery during rinsing, which may cause breakage.

[0019] (2) In this invention, when it is necessary to adjust the distance between two fixed seats on the same side, the drive motor can be started to drive the drive screw to rotate. Under the thread drive of the two threaded sections in opposite directions, the two movable blocks on the same side can slide in opposite or opposite directions, thereby adjusting the distance between the movable blocks and the fixed seats.

[0020] (3) In this invention, when it is necessary to adjust the distance between the two sets of fixed seats on opposite sides, the operator can start the longitudinal motor and, through the threaded engagement between the longitudinal screw and the push block, the entire transverse drive seat can be pushed out or pulled back, thereby changing the distance between the two transverse drive seats.

[0021] (4) In this invention, when it is necessary to open or close the cover, the rotating motor can be started, and the worm gear can be rotated electrically to rotate the worm wheel, thereby driving the rotating shaft to rotate. Since the cover is fixed on the rotating shaft, the cover can be closed or opened. Closing the cover during cleaning can reduce water waste and avoid environmental pollution during the cleaning process.

[0022] (5) In this invention, the position of the fixing seat for fixing the wafer can be adjusted. When the wafer size is small, the overall spacing of the fixing seat can be reduced. When the wafer size is large, the overall spacing of the fixing seat can be increased, thereby achieving mutual adaptation between the fixing seat and the wafer, so that the fixing seat is always fixed in the corresponding position of the wafer, avoiding the problem of not being able to fix or the wafer edge being damaged. At the same time, the fixing seat uses a suction cup to adsorb and fix the wafer, preventing the hard connection point from damaging the wafer. Attached Figure Description

[0023] Figure 1 This is a structural diagram of Example 1;

[0024] Figure 2 This is a structural diagram of the longitudinal drive component in Example 1;

[0025] Figure 3 This is a structural diagram of the transverse drive component in Example 1.

[0026] The components are as follows: 1. Body; 11. Cleaning tank; 12. Cleaning mechanism; 121. Cleaning head; 13. Cover plate; 2. Clamping mechanism; 21. Suction cup; 22. Movable block; 23. Drive slot; 24. Movable cavity; 25. Linking rod; 26. Fixed seat; 3. Lateral drive component; 31. Lateral drive seat; 32. Drive screw; 33. Threaded section; 34. Drive motor; 4. Longitudinal drive component; 41. Longitudinal motor; 42. Longitudinal screw; 43. Push block; 44. Connecting rod; 5. Rotating component; 51. Rotating shaft; 52. Rotating motor; 53. Rotating worm gear; 54. Rotating worm. Detailed Implementation

[0027] This embodiment provides a tank-type alkaline polishing and cleaning device, the structure of which is as follows: Figure 1-3 As shown, the device includes a body 1, a cleaning tank 11 disposed inside the body 1, and a cleaning mechanism 12. The cleaning mechanism 12 includes a plurality of cleaning heads 121 fixed on the inner sidewall of the cleaning tank 11. The cleaning heads 121 are positioned toward the center of the wafer. There are two sets of cleaning heads 121, which are fixed at two corresponding heights above and below the inner sidewall of the cleaning tank 11.

[0028] like Figure 1-3 As shown, the machine body 1 is provided with a cover plate 13 for closing and opening the cleaning tank 11. The cover plate 13 is rotatably connected to the machine body 1 via a rotating shaft 51. The size of the cover plate 13 is adapted to the cleaning tank 11. The machine body 1 is provided with a rotating component 5 for driving the rotating shaft 51 and the cover plate 13 to rotate. The rotating component 5 includes a rotating motor 52 fixed on the machine body 1. A rotating worm 54 is provided on the output shaft of the rotating motor 52. A rotating worm wheel 53 is coaxially provided on the rotating shaft 51. The rotating worm 54 and the rotating worm wheel 53 are meshed with each other.

[0029] like Figure 1-3As shown, the cleaning tank 11 is provided with a clamping mechanism 2 for clamping and fixing the wafer. The clamping mechanism 2 includes a suction cup 21 for adsorbing and fixing the wafer. The suction cup 21 is movably connected to the cleaning tank 11 through a fixed base 26. A movable block 22 is slidably connected to the inner side wall of the cleaning tank 11. The movable block 22 and the fixed base 26 are fixed to each other through a linkage rod 25. The movable blocks 22 are symmetrically arranged on opposite sides of the cleaning tank 11. Two movable blocks 22 are symmetrically arranged on each side.

[0030] like Figure 1-3 As shown, the clamping mechanism 2 also includes a transverse drive member 3 mounted on the inner wall of the cleaning tank 11 for driving the corresponding movable block 22 to slide relative to each other in the transverse direction, and a longitudinal drive member 4 for driving the corresponding movable block 22 to slide relative to each other in the longitudinal direction. The transverse drive member 3 includes a transverse drive seat 31, on which a horizontally arranged drive groove 23 is formed. The movable block 22 is slidably connected in the drive groove 23. An active cavity 24 is formed on the inner wall of the cleaning tank 11, and the transverse active seat is slidably connected in the active cavity 24.

[0031] like Figure 1-3 As shown, the transverse drive component 3 includes a drive screw 32 rotatably connected in the drive groove 23. The drive screw 32 is provided with two threaded sections 33 with opposite thread directions. The two ends of the drive screw 32 pass through two movable blocks 22 on the same side and are threadedly connected to them. The two movable blocks 22 are located in the two threaded sections 33 respectively. The drive screw 32 is driven to rotate by a drive motor 34 fixed on the transverse drive seat 31.

[0032] like Figure 1-3 As shown, the longitudinal drive component 4 includes a longitudinal motor 41 fixed in the movable cavity 24, a longitudinal lead screw 42 fixed on the output shaft of the longitudinal motor 41, a connecting rod 44 fixed on the transverse drive seat 31, two connecting rods 44 are symmetrically arranged, a push block 43 is provided between the two connecting rods 44, and the longitudinal lead screw 42 penetrates the push block 43 and is threadedly connected to it.

[0033] When a wafer needs cleaning, the operator places the wafer in the cleaning tank 11 and fixes it in place using the suction cup 21 on the clamping mechanism 2. Then, the cleaning mechanism 12 performs the cleaning. When the wafer is small, the operator can adjust the position of the four fixing seats 26 using the horizontal drive 3 and the vertical drive 4 to reduce the distance between the four fixing seats 26. At this time, the suction cup 21 can adhere to the four corners of the wafer, ensuring the stability of the adhesion. Similarly, when the wafer is large, the distance between the four fixing seats 26 can be increased using the drive mechanism to ensure that the suction cup 21 can also adhere to the four corners of the wafer, improving the firmness of fixing wafers of various sizes.

[0034] The present invention can adjust the position of the fixing base 26 for fixing the wafer. When the wafer size is small, the overall spacing of the fixing base 26 can be reduced, and when the wafer size is large, the overall spacing of the fixing base 26 can be increased, thereby achieving mutual adaptation between the fixing base 26 and the wafer, so that the fixing base 26 is always fixed in the corresponding position of the wafer, avoiding problems such as failure to fix or damage to the edge of the wafer. At the same time, the fixing base 26 uses the suction cup 21 to adsorb and fix the wafer, preventing the wafer from being damaged by the hard connection point.

[0035] In addition to the embodiments described above, the present invention may have other implementations. All technical solutions formed by equivalent substitution or equivalent transformation fall within the protection scope claimed by the present invention.

Claims

1. A tank-type alkaline polishing and cleaning device, comprising a body (1), a cleaning tank (11) disposed within the body (1), and a cleaning mechanism (12), characterized in that: The cleaning tank (11) is provided with a clamping mechanism (2) for clamping and fixing the wafer. The clamping mechanism (2) includes a suction cup (21) for adsorbing and fixing the wafer. The suction cup (21) is movably connected to the cleaning tank (11) through a fixed seat (26). A movable block (22) is slidably connected to the inner wall of the cleaning tank (11). The movable block (22) and the fixed seat (26) are fixed to each other through a linkage rod (25). The movable blocks (22) are symmetrically arranged on opposite sides of the cleaning tank (11). Two movable blocks (22) are symmetrically arranged on each side. The clamping mechanism (2) also includes a transverse drive member (3) attached to the inner wall of the cleaning tank (11) for driving the corresponding movable block (22) to slide relative to each other in the transverse direction, and a longitudinal drive member (4) for driving the corresponding movable block (22) to slide relative to each other in the longitudinal direction. The lateral drive component (3) includes a lateral drive seat (31), a drive groove (23) arranged in a horizontal direction is provided on the lateral drive seat (31), a movable block (22) is slidably connected in the drive groove (23), a movable cavity (24) is provided on the inner side wall of the cleaning groove (11), and the lateral movable seat is slidably connected in the movable cavity (24). The transverse drive component (3) includes a drive screw (32) rotatably connected in the drive groove (23). The drive screw (32) has two threaded sections (33) with opposite thread directions. The two ends of the drive screw (32) pass through two movable blocks (22) on the same side and are threadedly connected to them. The two movable blocks (22) are located in the two threaded sections (33) respectively. The drive screw (32) is driven to rotate by a drive motor (34) fixed on the transverse drive seat (31). The longitudinal drive component (4) includes a longitudinal motor (41) fixed in the movable cavity (24), a longitudinal lead screw (42) fixed on the output shaft of the longitudinal motor (41), a connecting rod (44) fixed on the transverse drive seat (31), two connecting rods (44) are symmetrically arranged, a push block (43) is provided between the two connecting rods (44), and the longitudinal lead screw (42) penetrates the push block (43) and is threadedly connected to it.

2. The tank-type alkaline polishing and cleaning equipment according to claim 1, characterized in that: The cleaning mechanism (12) includes several cleaning heads (121) fixed on the inner wall of the cleaning tank (11). The cleaning heads (121) are positioned facing the center of the wafer. There are two sets of cleaning heads (121), which are fixed at two corresponding heights on the inner wall of the cleaning tank (11).

3. The tank-type alkaline polishing and cleaning equipment according to claim 1, characterized in that: The machine body (1) is provided with a cover plate (13) for closing and opening the cleaning tank (11). The cover plate (13) is rotatably connected to the machine body (1) via a rotating shaft (51). The size of the cover plate (13) is adapted to the cleaning tank (11). The machine body (1) is provided with a rotating component (5) for driving the rotating shaft (51) and the cover plate (13) to rotate.

4. The tank-type alkaline polishing and cleaning equipment according to claim 3, characterized in that: The rotating component (5) includes a rotating motor (52) fixed on the machine body (1). A rotating worm (54) is provided on the output shaft of the rotating motor (52). A rotating worm wheel (53) is coaxially provided on the rotating shaft (51). The rotating worm (54) and the rotating worm wheel (53) are meshed with each other.

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