Device used to transfer heat from a heat source to the air

Abstract

A device for transferring heat from a heat source to air when it is connected to a heat source is disclosed. The device has a heat sink, which includes a heat sink base and a plurality of main fins connected to the heat sink base. In addition, the device includes a heat sink front. The heat sink base is configured to be thermally coupled to the heat source. Each of the plurality of main fins has one or more channels. The heat sink base includes a first chamber. The first chamber and the channel together form a common space that is isolated from the ambient air around the device. The first chamber and the channel together enclose a heat-carrying fluid in the common space formed by the first chamber and the channel. With the help of the common space, effective movement of the fluid is achieved, which allows the heated and / or evaporated fluid to move to substantially any part of the common space, which produces improvements in heat diffusion and heat transfer. A network access node for a wireless communication system is also provided, wherein the network access node includes a device of the above type.

Description

Technical Field

[0001] The invention relates to a device for transferring heat from a heat source to air when the device is connected to the heat source, wherein the device comprises a heat sink comprising a heat sink base and a plurality of main fins connected to the heat sink base. Furthermore, the invention relates to a network access node for a wireless communication system, wherein the network access node comprises a device of the above type. The network access node may comprise a base station. Background Art

[0002] Heat sinks are used in various technical fields, for example in the field of telecommunications, where heat sinks can be installed in network access nodes, such as base station units or radio units, to provide cooling. Due to heat sources in network access nodes, such as transmitters, printed circuit boards, optical transducers, power amplifiers, etc., cooling is often required in network access nodes. Typically, heat sinks have a plurality of main fins. Some cooling techniques are not well suited for cooling network access nodes. In particular, some techniques are not effective enough. Summary of the invention

[0003] It is an object of embodiments of the present invention to provide solutions that mitigate or resolve the disadvantages and problems of conventional solutions.

[0004] The above-mentioned objects and further objects are solved by the subject-matter of the independent claims. Further advantageous embodiments of the invention can be found in the dependent claims.

[0005] According to a first aspect of the present invention, the above-mentioned and other objects are achieved by a device for transferring heat from a heat source to air when the device is connected to the heat source. The device includes a radiator, which includes a radiator base and a plurality of main fins connected to the radiator base. The device includes a radiator front. The radiator base is configured to be thermally coupled to the heat source. Each of the plurality of main fins includes one or more channels. The radiator base includes a first chamber, wherein the first chamber and the channel together form a common space isolated from the ambient air surrounding the device. The first chamber and the channel together enclose a heat-carrying fluid in the common space formed by the first chamber and the channel.

[0006] In the common space of the device according to the first aspect, the heat-carrying fluid can move freely under the drive of the temperature difference of different parts of the radiator. The advantage of the device according to the first aspect is that the heat-carrying fluid can basically travel or move in "three-dimensional space". In the first chamber of the radiator base, the fluid can basically travel in two-dimensional space, basically in a "plane" defined by the x-axis and the y-axis or the x-vector and the y-vector, and in each channel, the fluid can travel in the direction of the z-axis or the z-vector, wherein the x-axis, the y-axis and the z-axis form an angle of approximately 90 degrees to each other. Therefore, the fluid can travel in the radiator in an effective manner and take away heat from the heat source and from the radiator base in an improved manner. The heat source can be, for example, an electrical or electronic component located on a printed circuit board PCB. Other examples of heat sources are given in the specific description below. With the help of the "three-dimensional" common space, the "three-dimensional space" movement of the fluid is achieved, which allows the heated and / or evaporated fluid to move to basically any part of the common space, which produces improved heat diffusion or heat transfer. By means of this "three-dimensional space" movement of the fluid, the heat in the radiator can be transferred in a more efficient manner, thereby effectively improving the heat transfer efficiency or thermal conductivity of the radiator. Therefore, the heat source, such as electrical or electronic components and / or the area around the heat source is effectively cooled. The result of improving the heat transfer efficiency or thermal conductivity of the radiator is that the volume and weight of the radiator can be reduced, which is an advantage for network access nodes such as base stations for wireless communication systems. Therefore, the base station can be produced in a more efficient manner and take up less space when installed. The temperature of typical electrical or electronic components of a typical base station can be significantly reduced, for example, by about 5°C to 30°C. It should be understood that the fluid can be a liquid or a vapor or a mixture thereof.

[0007] Each of the plurality of main fins may be connected to the heat sink base by being attached to the heat sink base or by being integrally formed with the heat sink base.

[0008] In an implementation form of the device according to the first aspect, the first chamber and the channel form a common space, so that heat is carried by the fluid from the first chamber to the channel. The advantage of this implementation form is that heat can be transferred in an effective manner, thereby improving the heat transfer efficiency or thermal conductivity and cooling efficiency of the radiator.

[0009] In an implementation form of the device according to the first aspect, the first chamber and the channel form a common space, so that heat is carried by the fluid from the first chamber to the front of the radiator via the channel. The advantage of this implementation form is that heat can be transferred in an effective manner, thereby improving the heat transfer efficiency and cooling efficiency of the radiator.

[0010] In an implementation of the device according to the first aspect, the heat sink base defines a thermal interface, wherein the device is configured at the thermal interface to convert the liquid in the fluid in the common space into vapor by allowing the liquid to absorb heat from the thermal interface. This implementation has the advantage that heat can be transferred in an efficient manner, thereby improving the heat transfer efficiency and cooling efficiency of the heat sink.

[0011] In an implementation of the device according to the first aspect, the first chamber has a housing, wherein the device is configured at the thermal interface to convert the liquid into vapor by allowing the liquid in the fluid in the common space to absorb heat from the housing of the first chamber. This implementation has the advantage that heat can be transferred in an efficient manner, thereby improving the heat transfer efficiency of the heat sink.

[0012] In an implementation of the device according to the first aspect, the first chamber and the channel form a common space, so that the vapor in the fluid travels from the first chamber of the radiator base along the channel and toward the front of the radiator. The advantage of this implementation is that heat can be transferred in an efficient manner and the thermal conductivity of the radiator is improved.

[0013] In an implementation form of the device according to the first aspect, each of the plurality of main fins has a surface for condensing the vapor in the fluid in the common space into liquid. The advantage of this implementation form is that the fluid circulates in the common space in an efficient manner, thereby further improving the thermal conductivity of the radiator.

[0014] In an implementation form of the device according to the first aspect, the first chamber and the channel form a common space, so that the liquid in the fluid returns to the first chamber by any one of capillary action, gravity and pressure difference. The advantage of this implementation form is that the fluid circulates in the common space in an efficient manner, thereby further improving the thermal conductivity of the heat sink.

[0015] In an implementation form of the device according to the first aspect, the front part of the radiator includes a second chamber. The first chamber, the channel and the second chamber together form a common space isolated from the ambient air around the device. The first chamber, the channel and the second chamber together enclose the heat transfer fluid in the common space formed by the first chamber, the channel and the second chamber. The advantage of this implementation form is that heat can be transferred in an effective manner and transferred to the air in an effective manner, thereby improving the heat transfer efficiency of the radiator.

[0016] In an implementation form of the device according to the first aspect, the first chamber, the channel and the second chamber form a common space, so that the vapor in the fluid travels from the first chamber to the second chamber via the channel. The advantage of this implementation form is that the fluid circulates in the common space in an efficient manner, thereby further improving the thermal conductivity of the radiator.

[0017] In an implementation form of the device according to the first aspect, the radiator front has a surface for condensing the vapor in the fluid in the common space into liquid. The advantage of this implementation form is that the heat can be transferred in an efficient manner and transferred to the air in an efficient manner, thereby improving the heat transfer efficiency of the radiator.

[0018] In the implementation form of the device according to the first aspect, the radiator base includes a third chamber. The first chamber, the channel and the third chamber together form a common space isolated from the ambient air around the device. The first chamber, the channel and the third chamber together enclose the heat transfer fluid in the common space formed by the first chamber, the channel and the third chamber, wherein at the radiator base, the channel of each main fin in the first group of multiple main fins is fluidly connected to the first chamber but isolated from the third chamber, and wherein, at the radiator base, the channel of each main fin in the second group of multiple main fins is fluidly connected to the third chamber but isolated from the first chamber. The advantage of this implementation form is that the radiator base and the channels on the radiator base side are divided into modules or parts, thereby the heat transfer from the radiator base can be customized according to the number of heat sources and the position of the heat sources relative to the radiator base. Therefore, heat can be transferred in an effective manner, thereby improving the heat transfer efficiency of the radiator.

[0019] In an implementation form of the device according to the first aspect, the front part of the radiator includes a second chamber and a fourth chamber, wherein the radiator base includes a third chamber. The first chamber, the channel of each main fin in the first group of multiple main fins, and the second chamber together form a common space isolated from the ambient air around the device, wherein the first chamber, the channel of each main fin in the first group of multiple main fins, and the second chamber together confine the heat transfer fluid in the common space formed by the first chamber, the channel of each main fin in the first group of multiple main fins, and the second chamber. The third chamber, the channel of each main fin in the second group of multiple main fins, and the fourth chamber together form a common space isolated from the ambient air around the device, wherein the third chamber, the channel of each main fin in the second group of multiple main fins, and the fourth chamber together confine the heat transfer fluid in the common space formed by the third chamber, the channel of each main fin in the second group of multiple main fins, and the fourth chamber. At the base of the radiator, the channel of each main fin in the first group of multiple main fins is fluidly connected to the first chamber but isolated from the third chamber, wherein, at the base of the radiator, the channel of each main fin in the second group of multiple main fins is fluidly connected to the third chamber but isolated from the first chamber. At the front of the radiator, the channel of each main fin in the first group of multiple main fins is fluidly connected to the second chamber but isolated from the fourth chamber, wherein, at the front of the radiator, the channel of each main fin in the second group of multiple main fins is fluidly connected to the fourth chamber but isolated from the second chamber. The advantage of this implementation form is that the channels on the radiator base, the front of the radiator, and both the radiator base side and the radiator front side are divided into modules or parts, thereby customizing the heat transfer from the radiator base according to the intensity of each heat source and the position of the heat source relative to the radiator base. Therefore, heat can be transferred in an effective manner, thereby improving the heat transfer efficiency of the radiator.

[0020] In an implementation form of the device according to the first aspect, at the front of the radiator, the channel of the first main fin of the plurality of main fins is isolated from the channel of the second main fin of the plurality of main fins. The advantage of this implementation form is that the heat transfer from the radiator base can be customized according to the strength of each heat source and according to the position of the heat source relative to each main fin, thereby providing efficient heat transfer. In addition, the advantage of such an implementation form is that a more compact structure is provided, because since any chamber is excluded in the front of the radiator, the front can be made thinner. In addition, the compact structure provided requires a smaller volume of heat transfer fluid compared to a structure with a chamber in the front of the radiator. Therefore, since the heat transfer fluid is associated with cost, the compact structure makes the device cheaper.

[0021] In an implementation form of the device according to the first aspect, each of the plurality of main fins extends from the heat sink base to the heat sink front. This implementation form has the advantage of providing efficient heat transfer.

[0022] In an implementation form of the device according to the first aspect, the heat sink front is opposite to the heat sink base. This implementation form has the advantage of providing efficient heat transfer.

[0023] In an implementation of the device according to the first aspect, each of the plurality of main fins is connected to the front of the radiator. Each of the plurality of main fins can be connected to the front of the radiator by being attached to the front of the radiator or by being integrally formed with the front of the radiator. This implementation has the advantage of providing efficient heat transfer.

[0024] In an implementation form of the device according to the first aspect, the device comprises a plurality of auxiliary fins, wherein each of the plurality of auxiliary fins is connected to a main fin of the plurality of main fins. This implementation form has the advantage of further improving the heat transfer efficiency of the heat sink.

[0025] According to a second aspect of the present invention, the above-mentioned and other objects are achieved by a network access node for a wireless communication system, wherein the network access node comprises an apparatus according to any embodiment or implementation form of the apparatus described above or below. The advantages of the network access node correspond to the advantages of the apparatus and its implementation form or embodiment mentioned above or below. The network access node may include a base station.

[0026] Further applications and advantages of implementations or embodiments of the present invention will become apparent from the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The accompanying drawings are intended to illustrate and explain different embodiments of the present invention, in which:

[0028] Figure 1 is a schematic perspective view of a first embodiment of the device according to the first aspect of the present invention;

[0029] Figure 2 Observed from different angles Figure 1 A schematic perspective view of a first embodiment of the device is shown;

[0030] Figure 3 yes Figure 1 and Figure 2 A schematic exploded view of a first embodiment of the device is shown;

[0031] Figure 4 yes Figures 1 to 3 A schematic perspective view of a main fin of a first embodiment of the device and an enlarged view of a detail of the main fin;

[0032] Figure 5 yes Figure 1 and Figure 2A schematic cross-sectional side view of a first embodiment of a device and an enlarged view of a detail of the device;

[0033] Figure 6 is with Figure 5 a schematic cross-sectional side view of the first embodiment of the same device, but with different enlargements of details of the device;

[0034] Figure 7 is a diagram showing the movement of fluid in a common space Figure 1 and Figure 2 A schematic partial cross-sectional side view of a device;

[0035] Figure 8 is a diagram showing the movement of fluid on the base side of the heat sink Figure 1 and Figure 2 A schematic exploded view of a device;

[0036] Fig. 9 is a diagram showing the movement of fluid on the front side of the radiator Figure 1 and Figure 2 A schematic exploded view of a device;

[0037] Fig.10 is a schematic partial cross-sectional side view of a second embodiment of the device according to the first aspect of the present invention, which also shows the movement of the fluid;

[0038] Fig.11 is a diagram showing the movement of fluid on the base side of the heat sink Fig.10 A schematic exploded view of a second embodiment of the device;

[0039] Fig.12 is a diagram showing the movement of fluid on the front side of the radiator Fig.10 A schematic exploded view of a device;

[0040] Fig.13 is a schematic perspective view of a third embodiment of the device according to the first aspect of the invention, with the radiator front plate removed for illustration purposes;

[0041] Fig.14 is a partial schematic exploded view of a fourth embodiment of the device according to the first aspect of the present invention;

[0042] Fig.15 yes Fig.14 An enlarged view of a detail of the device;

[0043] Fig.16 yes Fig.14 A top view of the device and an enlarged view of the details of the device;

[0044] Fig.17It shows the movement of the fluid Fig.14 A partial schematic exploded view of a fourth embodiment of the device;

[0045] Fig.18 is a partial schematic perspective view of a fifth embodiment of the device according to the first aspect of the present invention;

[0046] Fig.19 yes Fig.18 A schematic exploded view of a fifth embodiment of the device;

[0047] Fig. 20 yes Fig.18 and Fig.19 an enlarged view of a detail of the device; and

[0048] Fig.21 yes Fig.18 Schematic top view of a fifth embodiment of a device. DETAILED DESCRIPTION

[0049] Reference Figures 1 to 9 , schematically shows a first embodiment of a device 102 according to the first aspect, the device 102 being used to transfer heat from a heat source 104 to air when the device 102 is connected to a heat source 104. Figure 1 and Figure 2 In the illustrated embodiment, each heat source 104 is an electrical or electronic component attached or mounted to a printed circuit board PCB 105. The electrical or electronic component may be a transmitter, an optical transducer, a power amplifier, or any other heat generating component, or any other heat generating electrical or electronic component. However, it should be understood that the heat source 104 in an alternative embodiment may be a component that is not mounted to the PCB 105. In the illustrated embodiment, there are four heat sources 104. For example, one heat source 104 or a plurality of heat sources 104 and also, for example, the PCB 105 may be part of a network access node of a wireless communication system. The network access node may include a base station.

[0050] The device 102 includes a heat sink 106. The heat sink 106 includes a heat sink base 108 and a plurality of main fins 110 connected to the heat sink base 108. Each of the plurality of main fins 110 may be connected to the heat sink base 108 by being attached to the heat sink base 108 or by being integrally formed with the heat sink base 108. The main fins 110 are arranged in a plurality of main fin modules 111 or sections. Each main fin module 111 includes a plurality of main fins 110. When the device 102 and the heat sink 106 are installed, i.e., have been installed and are in an installed state, the plurality of main fins 110 of the same module 111 are arranged side by side, but with an air space between two adjacent main fins 110. In the illustrated embodiment, four main fin modules 111 are provided. However, fewer fin modules 111 may be provided, for example even only one fin module 111, or more modules 111 may be provided. As Figure 1 and Figure 2 As shown in FIG. 1 , when the device 102 and the heat sink 106 are installed, the main fin modules 111 are arranged or positioned one above the other.

[0051] Reference Figure 1 and Figure 2 , in the lateral direction, each main fin 110 forms an angle of approximately 90 degrees with the radiator base 108. However, in the vertical direction 113, each main fin 110 forms a non-perpendicular angle with the radiator base 108. However, in an alternative embodiment, in the lateral direction, each main fin 110 may form a non-perpendicular angle with the radiator base 108. In addition, the radiator 102 includes a radiator front 112. In the illustrated embodiment, the radiator front 112 is formed as a portion or structure separate from the main fins 110. However, the radiator front is not necessarily a portion or structure separate from the main fins 110, but may simply be an area where the main fins 110 terminate toward the front and may therefore be formed by a portion of the main fins 110. Each of the plurality of main fins 110 may be connected to the radiator front 112. Each of the plurality of main fins 110 may be connected to the radiator front portion 112 by being attached thereto or by being integrally formed therewith.

[0052] The heat sink base 108 is configured to be thermally coupled to one or more heat sources 104. Figure 4, each of the plurality of main fins 110 includes or defines one or more channels 114, such as a longitudinal hollow portion. In the illustrated embodiment, in the lateral direction, each channel 114 forms an angle of approximately 90 degrees with the radiator base 108. However, in the vertical direction 113, each channel 114 forms a non-vertical angle with the radiator base 108. The main fins 110 and the associated channels 114 can be formed by extrusion or by adjoining two plates. However, other ways of producing the main fins 110 are also feasible. When the device 102 and the radiator 106 are installed, the channels 114 of the same main fin 110 can be arranged or positioned so that one channel is above another channel.

[0053] Reference Figure 5 , the heat sink base 108 includes or defines a first chamber 116. The first chamber 116 and the channel 114 together form or define or constitute a joint or common space that is isolated from the ambient air around the device 102 and the heat sink 106. Therefore, the first chamber 116 and the channel 114 are part of the common space. In other words, the plurality of main fins 110 and the heat sink base 112 form or define a common space. The common space can be referred to as an internal space or a physical space, such as a room that forms an internal volume or a common internal volume.

[0054] In addition, the first chamber 116 and the channel 114 together enclose or contain or maintain the heat-carrying fluid in a common space formed by the first chamber 116 and the channel 114. It should be understood that the fluid can be a liquid or a vapor (gas) or a mixture thereof. As described above, each channel 114 is, for example, a hollow portion integrated in the corresponding main fin 110, such as an elongated hollow portion. Each channel 114 can hold a fluid and can transport or transmit the fluid along its length or longitudinal extension. With the help of the fluid, heat is transferred from the first chamber 116 via the channel 114. The radiator 106 can be referred to as a radiator 106 based on liquid and steam.

[0055] The heat sink base 108 and / or the first chamber 116 may include one or more capillary structures configured to be adjacent to the heat source 104. The capillary structures themselves are known to those skilled in the art and are therefore not discussed in more detail. Each channel 114 leads to the first chamber 116. The channel 114 is fluidically connected to the first chamber 116. "Fluid connection" in the context of the present disclosure and with respect to two entities, such as a channel 114 and a first chamber 116, means that the two entities are in fluid communication with each other, i.e., a fluid can travel from one of the entities to the other, for example, a fluid can travel between a channel 114 and the first chamber 116.

[0056] Reference Figure 3 and Figure 5, the heat sink base 108 includes a heat sink base plate 117 in contact with and / or adjacent to the heat source 104 and / or the PCB 105. The heat sink base 108 also includes a heat sink base cover 118. The heat sink base cover 118 is provided with a plurality of openings or slots, through which the channels 114 of the main fins 110 are fluidly connected to the first chamber 116. The heat sink base plate 117 is located between the heat source 104 and the heat sink base cover 118. The heat sink base plate 117 is also located between the PCB 105 and the heat sink base cover 118.

[0057] The first chamber 116 and the channel 114 form a common space, so that heat is carried by the fluid from the first chamber 116 to the channel 114. The first chamber 116 and the channel 114 form a common space, so that heat is carried by the fluid from the first chamber 116 to the radiator front portion 112 via the channel 114. This is caused by Figure 7 108 is shown by arrows pointing upward and rightward in FIG. The heat sink base 108 defines a thermal interface, wherein the device 102 is configured at the thermal interface to convert liquid into vapor by allowing liquid in the fluid in the common space to absorb heat from the thermal interface. In other words, the heat sink base 108 has a surface for converting liquid into vapor by allowing liquid in the fluid in the common space, more specifically in the first chamber 116, to absorb heat from the surface of the heat sink base 108 or from the heat sink base 108. The first chamber 116 has a housing 117, 118 formed, for example, by a heat sink base plate 117 and a heat sink base cover 118. The device 102 is configured at the thermal interface or at the surface to convert liquid into vapor by allowing liquid in the fluid in the common space, more specifically in the first chamber 116, to absorb heat from the housing 117, 118 of the first chamber 116. The first chamber 116 and the channel 114 form a common space so that the vapor in the fluid travels from the first chamber 116 of the heat sink base 108 along the channel 114 and toward the heat sink front 112. Figure 7 The upward and right pointing arrows are shown in FIG.

[0058] Each of the plurality of main fins 110 may have a surface for condensing the vapor in the fluid in the common space into liquid. The first chamber 116 and the channel 114 form a common space so that the liquid in the fluid returns to the first chamber 116 by any one of capillary action, gravity of the fluid, and pressure difference. Figure 7108. The radiator 108 is shown as a plurality of channels 114, each of which ...

[0059] Reference Figure 3 and Figure 6 , the radiator front portion 112 may include a radiator front cover 119 and a radiator front plate 121. In the illustrated embodiment, the radiator cover 119 is located between the radiator front plate 121 and the main fins 110. The radiator front portion 112 includes or defines a second chamber 120. The first chamber 116, the channel 114, and the second chamber 120 together form a common space isolated from the ambient air around the device 102, wherein the first chamber 116, the channel 114, and the second chamber 120 together enclose a heat transfer fluid in the common space formed by the first chamber 116, the channel 114, and the second chamber 120. The channel 114 is fluidly connected to the second chamber 120. Each channel 114 may extend from the first chamber 116 to the second chamber 120. The second chamber 120 may have, for example, a housing 119, 121 formed by the radiator front cover 119 and the radiator front plate 121 of the radiator front portion 112. The radiator front cover 119 is provided with a plurality of openings or slots via which the channels 114 of the main fins 110 are fluidly connected to the second chamber 120. The second chamber 120 is fluidly connected to the first chamber 116 via the channels 114. The radiator front 112 may be referred to as a condenser.

[0060] Through the fluid, heat is transferred from the first chamber 116 to the second chamber 112 via the channel 114, for example, by evaporating liquid in the fluid into vapor in the first chamber 116. The vapor can then travel through the channel 114. When the fluid has released heat, for example, in the channel 114 of the main fin 110 and / or the second chamber 120, for example, by condensing vapor in the fluid into liquid, the fluid in liquid form is transported back to the first chamber 116 via the channel 114. The first chamber 116, the channel 114, and the second chamber 120 can form a common space, so that the evaporated vapor in the fluid travels from the first chamber 116 to the second chamber 120 via the channel 114. The radiator front 112 has a surface for condensing vapor in the fluid in the common space, more specifically in the second chamber 120, into liquid. The first chamber 116, the channel 114, and the second chamber 120 can form a common space, so that the condensed liquid in the fluid travels from the second chamber 120 to the first chamber 116 via the channel 114. The condensation of the vapor into liquid, the movement of the liquid in the second chamber 120, and the movement of the liquid from the second chamber 120 to the first chamber 116 via the passage 114 are determined by Figure 7 The downward and left pointing arrows are shown in FIG.

[0061] exist Figure 8 and Fig. 9 , the movement of fluid in the form of vapor or liquid on the heat sink base side and the heat sink front side respectively. Figures 1 to 9 When the device 102 and the heat sink 106 are mounted, the heat sink base 108 and the heat sink front 112 can extend substantially in the vertical direction 113. When the device 102 and the heat sink 106 are mounted, one or more of the first chamber 116 and the second chamber 120 can extend substantially in the vertical direction 113.

[0062] Reference Fig.10 In a second embodiment of the device 202 according to the first aspect, the radiator front portion 212 of the radiator 206 includes or defines both the second chamber 220 and the fourth chamber 226. The radiator base 208 includes or defines both the first chamber 216 and the third chamber 222. The first chamber 216, the channel 114 of each main fin 110 in the first plurality of main fins 110, and the second chamber 220 together form a common space isolated from the ambient air around the device 202. The first chamber 216, the channel 114 of each main fin 110 in the first plurality of main fins 110, and the second chamber 220 together confine the heat transfer fluid in the common space formed by the first chamber 216, the channel 114 of each main fin 110 in the first plurality of main fins 110, and the second chamber 220.

[0063] Reference Fig.10The third chamber 222, the channel 114 of each main fin 110 in the second plurality of main fins 110, and the fourth chamber 226 together form a common space isolated from the ambient air around the device 202. The third chamber 222, the channel 114 of each main fin 110 in the second plurality of main fins 110, and the fourth chamber 226 together confine the heat transfer fluid in the common space formed by the third chamber 222, the channel 114 of each main fin 110 in the second plurality of main fins 110, and the fourth chamber 226.

[0064] Reference Fig.10 , at the heat sink base 208, the channel 114 of each main fin 110 of the first plurality of main fins 110 is fluidly connected to the first chamber 216 but isolated (fluidically disconnected / separated) from the third chamber 222, wherein at the heat sink base 208, the channel 114 of each main fin 110 of the second plurality of main fins 110 is fluidly connected to the third chamber 222 but isolated (fluidically disconnected / separated) from the first chamber 116. At the heat sink front 212, the channel 114 of each main fin 110 of the first plurality of main fins 110 is fluidly connected to the second chamber 220 but isolated (fluidically disconnected / separated) from the fourth chamber 226, wherein at the heat sink front 212, the channel 114 of each main fin 110 of the second plurality of main fins 110 is fluidly connected to the fourth chamber 226 but isolated (fluidically disconnected / separated) from the second chamber 220.

[0065] Reference Fig.10 At the heat sink base 208, the first chamber 216 and the third chamber 222 can be isolated from each other (fluidically disconnected) by means of one or more first barriers 228. At the heat sink front 212, the third chamber 222 and the fourth chamber 226 can be isolated from each other (fluidically disconnected) by means of one or more second barriers 230. Fig.10 The movement of the fluid in the second embodiment is shown by arrows. Fig.10 , the main fin 110 shown can be described as belonging to two different modules or parts. In this way, at the radiator base 208, the channel 114 is provided and leads to different evaporation chambers 216, 222 formed by the radiator base 208 and the first chamber 216 and the third chamber 222; and at the radiator front 212, the channel 114 is provided and leads to different condensers or condenser chambers formed by the radiator front 212 and the second chamber 220 and the fourth chamber 226. Fig.11 and Fig.12 , the movement of fluid in the form of vapor or liquid on the heat sink base side and the heat sink front side of the second embodiment of the device 202 is shown. Fig.10, when the device 202 and the heat sink 206 are installed, one or more of the first chamber 216 , the second chamber 220 , the third chamber 222 , and the fourth chamber 226 may extend substantially in the vertical direction 113 .

[0066] In relation to Figures 1 to 9 The first embodiment of the device 102 is shown and is relative to Figures 10 to 12 In an alternative embodiment of the second embodiment modification of the device 202 shown, the heat sink base 208 includes a third chamber 222, wherein the first chamber 216, the channel 114, and the third chamber 222 together form a common space that is isolated from the ambient air surrounding the device. The first chamber 216, the channel 114, and the third chamber 222 together enclose the heat transfer fluid in the common space formed by the first chamber 216, the channel 114, and the third chamber 222. At the heat sink base 208, the channel 114 of each main fin 110 in the first plurality of main fins 110 is fluidly connected to the first chamber 216 but isolated from the third chamber 222, and wherein, at the heat sink base 208, the channel 114 of each main fin 110 in the second plurality of main fins 110 is fluidly connected to the third chamber 222 but isolated from the first chamber 216. Thus, at the heat sink base 208, the first chamber 216 and the third chamber 222 are isolated from each other, and at the heat sink base 208, the channel 114 leads to different evaporation chambers 216, 222, which corresponds to Figures 10 to 12 The radiator base 208 of the second embodiment of the device 202 is shown. However, at the radiator front 112, the channel 114 opens into the same second chamber 120, which corresponds to the radiator front 112. Figures 1 to 9 The radiator front 112 of the first embodiment of the device 102 shown in FIG. Therefore, at the radiator front 112 , the channels 114 share a common condenser or condenser chamber formed by the radiator front 112 and the second chamber 120 .

[0067] exist Fig.13 , a portion of a third embodiment of a device 302 according to the first aspect of the present invention is schematically shown. The device 302 has four main fin modules 211. Each main fin module 211 includes a plurality of main fins 210. In the transverse direction, each main fin 210 forms an angle of approximately 90 degrees with the heat sink base 108 of the heat sink 306, and also in the vertical direction 113, each main fin 210 forms an angle of approximately 90 degrees with the heat sink base 108. Therefore, in the third embodiment of the device 302, in the transverse direction, each channel 214 (see Fig.16 and Fig.21 ) can form an angle of approximately 90 degrees with the heat sink base 108, and also in the vertical direction 113, each channel 214 can form an angle of approximately 90 degrees with the heat sink base 108.

[0068] refer to Figures 14 to 17 , schematically shows a fourth embodiment of the device 402 according to the first aspect. Only one portion or module 211 of the main fins 210 is shown, but it should be understood that the same features can apply to other modules of the main fins 210. At the heat sink base 108, all the main fins 210 of the module can lead to the same first chamber 116. However, at the heat sink front 412, the channel 214 of the first main fin 210 of the plurality of main fins 210 (see Fig.16 ) is isolated from the channel 214 of the second main fin 210 among the plurality of main fins 210. Therefore, referring to Fig.15 and Fig.16 At the radiator front 412, the channels 214 of each main fin 210 are provided with and lead to their own individual condenser chamber 420, which is isolated from the individual condenser chambers 420 of the channels 214 of the other main fins 210 of the module 211. When the radiator 406 and the device 402 are installed, the individual condenser chambers 420 extend substantially in the vertical direction 113. At the radiator front 412, louvers 432 or tongues or wings may be provided between the individual condenser chambers 420 to facilitate heat transfer from the radiator front 412 to the air. Fig.17 , the movement of fluid in the form of vapor or liquid on the heat sink base side and the heat sink front side of a fourth embodiment of the device is shown.

[0069] Reference Fig.16 , the device 402 may include a plurality of auxiliary fins 434. Each auxiliary fin 434 of the plurality of auxiliary fins 434 is connected to a main fin 210 of the plurality of main fins 210. The plurality of auxiliary fins 434 may be connected to the same main fin 210. Fig.16 , only three auxiliary fins 434 connected to one main fin 210 are shown. However, it should be understood that more auxiliary fins 434 may be provided, and these auxiliary fins 434 may be connected to one or more of the plurality of main fins 210. For example, the auxiliary fin 434 may be located between two main fins 210. Each auxiliary fin 434 of the plurality of auxiliary fins 434 may be connected to the main fin 210 by, for example, being attached to the main fin 210 by welding or by being integrally formed with the main fin 210. However, it should be understood that the auxiliary fin 434 may not be included in alternative embodiments.

[0070] Reference Figures 18 to 21, schematically shows a fifth embodiment of a device 502 according to the first aspect of the invention. Only one portion or module 211 of the main fins 210 is shown, but it should be understood that the same features may apply to other modules 211 of the main fins 210. At the heat sink base 108, all the main fins 210 of the module may open into the same first chamber 116. However, referring to Fig. 20 and Fig.21 , at the front portion 512 of the heat sink, the channel 214 of the first main fin 210 of the plurality of main fins 210 is isolated from the channel 214 of the second main fin 210 of the plurality of main fins 210. Figure 20 to Figure 21 , at the radiator front 512, the channels 214 of each main fin 210 are provided with and lead to their own separate condenser chambers 520, which are isolated from the separate condenser chambers 520 of the channels 214 of the other main fins 210 of the module 211. Each separate condenser chamber 520 can be formed by a U-shaped member 534. The U-shaped member 534 can be connected to a common frame 536. However, in an alternative embodiment, the common frame 536 may not be included. When the radiator 506 and the device 502 are installed, the separate condenser chambers 520 extend substantially in the vertical direction 113. At the radiator front 512, air exists between the separate condenser chambers 520. The movement of the fluid in the form of vapor or liquid on the radiator base side and the radiator front side of the fifth embodiment of the device 502, respectively, corresponds to Fig.17 The movement shown in .

[0071] With reference to the embodiments disclosed above, each of the plurality of main fins 110, 210 may extend from the heat sink base 108, 208 to the heat sink front 112, 212, 412, 512. The heat sink front 112, 212, 412, 512 may advantageously be located opposite the heat sink base 108, 208. With reference to the embodiments disclosed above, each of the plurality of main fins 110, 210 may be connected to the heat sink front 112, 212, 412, 512. Each of the plurality of main fins 110 , 210 may be connected to the radiator front portion 112 , 212 , 412 , 512 by being attached to the radiator front portion 112 , 212 , 412 , 512 , for example by welding or by other mechanical connection means or by being integrally formed with the radiator front portion 112 , 412 , 512 .

[0072] The parts or units of the radiator 106 can be made of any suitable material, for example, a thermally conductive material (such as any suitable metal or metal alloy, such as aluminum, copper, etc.). The amount or volume of the fluid relative to the volume of the common space can depend on the location of the heat source to be cooled by the radiator 106, 206, 306, 406, 506, for example, so that the liquid surface in the fluid in the first chamber 116 is above the heat source 104, which is vertically positioned highest relative to other heat sources 104 when the radiator 106, 206, 306, 406, 506 and the device 102, 202, 302, 402, 502 are installed (i.e., installed). The fluid can be water or a fluid called R135A or R1233ZD or any other suitable fluid. The first chamber 116 may include additional channels, channels and / or baffles extending in different directions. The main fins 110 do not have to be parallel to each other. When the device 102, 202, 302, 402, 502 and the radiator 106, 206, 306, 406, 506 are installed, the radiator base 108, 208 and the radiator front 112, 212, 412, 512 can extend substantially in the vertical direction 113. When the device 102, 202, 302, 402, 502 and the radiator 106, 206, 306, 406, 506 are installed, the channel 114, 214 can extend substantially in the horizontal direction, or can form a certain angle with the horizontal plane. The radiator 106, 206, 306, 406, 506 of the embodiments disclosed above can also be used in combination with one or more fans. The meaning of "multiple" in the present disclosure or claims should be understood as two or more.

[0073] Embodiments of the present invention also include a network access node for a wireless communication system, wherein the network access node includes an apparatus 102, 202, 302, 402, 502 according to any of the embodiments disclosed above. The network access node herein may also be represented as a radio network access node, an access network access node, an access point or a base station (e.g., a radio base station (RBS)), which in some networks may be referred to as a transmitter, "gNB", "gNodeB", "eNB", "eNodeB", "NodeB" or "B node" according to the technology and terminology used. Based on the transmission power and thus also based on the cell size, the radio network access node may have different categories, such as, for example, a macro eNodeB, a home eNodeB or a pico base station. The radio network access node may be a station (STA), which is any device that includes a media access control (MAC) and a physical layer (PHY) interface compliant with IEEE 802.11 to a wireless medium (WM). The wireless network access node may also be a base station corresponding to a fifth generation (5G) wireless system. The network access node may include an active antenna, a remote radio unit (RRU), or a baseband processor. The network access node may include one or more antennas. The network access node may have a housing for accommodating an antenna. Alternatively, the antenna may be mounted outside the housing of the network access node, for example, at a distance from the housing of the network access node.

[0074] Finally, it should be understood that the present invention is not limited to the embodiments described above, but also relates to and encompasses all embodiments within the scope of the attached independent claims.

Claims

1. A device for transferring heat from a heat source to air when the device is connected to the heat source, the device comprising: a heat sink comprising a heat sink base and a plurality of main fins connected to the heat sink base, and Radiator front, wherein the heat sink base is configured to be thermally coupled to the heat source, Wherein, each of the plurality of main fins comprises one or more channels, Wherein, the radiator base comprises a first chamber, wherein the first chamber and the channel together form a common space isolated from the ambient air surrounding the device, and wherein the first chamber and the channel together enclose the heat transfer fluid in the common space formed by the first chamber and the channel, wherein the heat sink base defines a thermal interface, and wherein the device is configured at the thermal interface to convert liquid in the fluid within the common space into vapor by allowing the liquid to absorb heat from the thermal interface, Wherein, at the front portion of the radiator, a channel of a first main fin among the plurality of main fins is isolated from a channel of a second main fin among the plurality of main fins.

2. The device according to claim 1, wherein: The first chamber and the channel form the common space such that heat is carried by the fluid from the first chamber to the channel.

3. The device according to claim 1, wherein: The first chamber and the channel form the common space, so that heat is carried by the fluid from the first chamber to the front of the heat sink via the channel.

4. The device according to claim 1, wherein: The first chamber has a housing, and wherein the device is configured at the thermal interface to transform liquid in the fluid within the common space into vapor by allowing the liquid to absorb heat from the housing of the first chamber.

5. The device according to claim 1, wherein: The first chamber and the channel form the common space such that vapor in the fluid travels from the first chamber of the heat sink base along the channel and toward the front of the heat sink.

6. The device according to claim 1, wherein: Each of the plurality of main fins has a surface for condensing vapor in the fluid within the common space into liquid.

7. The device according to claim 6, wherein: The first chamber and the channel form the common space so that liquid in the fluid returns to the first chamber by any one of capillary action, gravity, and pressure difference.

8. The device according to claim 1, wherein: The front part of the heat sink includes a second chamber, wherein the first chamber, the channel and the second chamber together form a common space isolated from the ambient air around the device, and wherein the first chamber, the channel and the second chamber together enclose a heat carrier fluid in the common space formed by the first chamber, the channel and the second chamber.

9. The device according to claim 8, wherein: The first chamber, the channel, and the second chamber form the common space such that vapor in the fluid travels from the first chamber to the second chamber via the channel.

10. The device according to claim 7 or 8, wherein: The heat sink front has a surface for condensing vapor in the fluid within the common space into liquid.

11. The device according to any one of claims 1 to 9, wherein: The heat sink base includes a third chamber, wherein the first chamber, the channel and the third chamber together form a common space isolated from the ambient air around the device, wherein the first chamber, the channel and the third chamber together enclose a heat-carrying fluid in the common space formed by the first chamber, the channel and the third chamber, wherein, at the heat sink base, the channel of each main fin in a first group of multiple main fins is fluidly connected to the first chamber but isolated from the third chamber, and wherein, at the heat sink base, the channel of each main fin in a second group of multiple main fins is fluidly connected to the third chamber but isolated from the first chamber.

12. The device according to any one of claims 1 to 9, wherein: Each of the plurality of main fins extends from the heat sink base to the heat sink front.

13. A network access node for a wireless communication system, wherein: The network access node comprises an apparatus according to any one of claims 1 to 12.

Images