Through hole method of glass substrate for mini-led backlight panel

Abstract

The application discloses a through hole method for a glass substrate of a Mini-LED backlight plate, and the through hole method comprises the following steps: S1, forming a plurality of groups of blind holes coaxial and corresponding in position by using laser to open holes on the upper and lower surfaces of a glass substrate covered with acid-resistant films; and S2, spraying an acid etching solution into the blind holes to form through holes through acid etching. The through hole method disclosed by the application can not only obtain straight holes with small edge collapse and small roughness of hole walls, and meet the requirements of the Mini-LED backlight plate, but also can realize rapid through holes of the glass substrate, and meet the requirements of industrial production.

Description

Technical Field

[0001] This invention belongs to the field of display technology, and particularly relates to a through-hole method for a glass substrate used in Mini-LED backlight panels. Background Technology

[0002] With the mature application of Mini-LED display technology, the demand for backlight panels is increasing. For a long time, PCBs (Printed Circuit Boards) have been the preferred choice for Mini-LED backlight panels. However, as Mini-LED chips become smaller and PCBs become more expensive, glass is gradually replacing PCBs for Mini-LED backlight panels. Currently, most PCBs required for Mini-LED backlighting are 2-layer or 4-layer through-hole boards. Due to their inherent heat dissipation limitations, PCB substrates are prone to warping and deformation in large-size applications, making it more difficult to transfer Mini-LED chips onto the PCB substrate. If glass substrates are used, their high thermal conductivity, strong heat dissipation, and low coefficient of thermal expansion make them effective for high-density Mini-LED soldering, meeting complex wiring requirements. Furthermore, glass substrates have high flatness, making chip transfer easier than with PCBs. Additionally, glass has better rigidity, allowing for high-precision splicing of multiple backlight units and reducing seam problems. From a material cost perspective, PCB substrates are several times more expensive than glass substrates. Therefore, compared with traditional PCB substrates, using glass substrates as backplanes is more energy-efficient, lower in cost, and can achieve the same display effect.

[0003] When glass is used in Mini-LED backlight panels, design requirements necessitate drilling small holes with a diameter of approximately 100 micrometers and a spacing of less than 1000 micrometers. Traditional mechanical drilling is unsuitable for these glass through-holes, necessitating the use of laser drilling. However, directly drilling through-holes with a laser results in defects such as chipping around the hole surface, rough and uneven hole walls, and a large taper. Therefore, there is an urgent need to develop a non-destructive, rapid method for creating through-holes in glass. Summary of the Invention

[0004] To address the aforementioned technical issues, this invention provides a method for creating through-holes in a glass substrate for Mini-LED backlight panels. This method combines laser drilling and acid etching, making it suitable for processing through-holes with a diameter of micrometers on the glass substrate for Mini-LED backlight panels. Furthermore, it improves the through-hole processing speed while ensuring the quality of the through-holes.

[0005] The specific technical solution of this invention is as follows:

[0006] This invention provides a method for creating through-holes in a glass substrate for a Mini-LED backlight panel. The through-hole method includes: S1, using a laser to create holes on the upper and lower surfaces of a glass substrate coated with an acid-resistant film, forming multiple sets of coaxial and corresponding blind holes; S2, spraying an acid etching solution into the blind holes to form through-holes through etching.

[0007] Preferably, the thickness of the glass substrate is 0.2-1 mm.

[0008] Preferably, in S1, the depth of the blind hole is 1 / 20 to 1 / 25 of the glass thickness.

[0009] Preferably, in S1, the multiple sets of blind holes have the same depth.

[0010] Preferably, in S2, the acid etching solution includes hydrofluoric acid, sulfuric acid, and ammonium hydrogen fluoride.

[0011] Preferably, in S2, the temperature of the acid etching solution is 30-50℃.

[0012] Preferably, in S2, the spray pressure of the acid etching solution is 0.02-0.1 kg / cm². 2 The flow rate of the acid etching solution is 0.5-2 L / min, and the acid etching time is 1-5 min.

[0013] The acid etching and perforation process described in S2 of this invention can be implemented in a sealed device equipped with spray pipes. The structure of the sealed device is not specifically limited, as long as it enables the acid etching solution to be sprayed into the blind holes on the upper and lower surfaces of the glass substrate. The acid etching solution can then etch the glass along the coaxial, corresponding blind holes until a through hole is formed. For example, the sealed device can be a closed tank with spray pipes arranged within it, each equipped with a nozzle. During operation, the nozzles align with the blind holes on the glass, spraying the acid etching solution into them.

[0014] Compared with existing technologies, the beneficial effects are:

[0015] This invention uses a combination of laser drilling and acid etching to create through-holes in glass substrates. In particular, the acid etching method involves spraying acid solution into blind holes. By limiting the spraying parameters, straight holes with minimal edge chipping and low wall roughness can be obtained, meeting the requirements of Mini-LED backlight panels. Compared with other acid etching methods, this invention also significantly improves the etching speed and effectively shortens the through-hole time, enabling rapid through-hole creation in glass substrates, which meets the requirements of industrial production. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the glass substrate through-hole method of the present invention; wherein: 1-glass substrate, 2-spray pipe;

[0017] Figure 2This is a schematic diagram of the glass substrate with through holes obtained according to the present invention;

[0018] Figure 3 This is a schematic diagram of the spray pipe; Detailed Implementation

[0019] The technical solution of the present invention will be described in detail below through specific embodiments. However, it should be clearly stated that these embodiments are for illustrative purposes only and are not intended to limit the scope of the present invention.

[0020] Example 1

[0021] A method for creating through-holes in a glass substrate for a Mini-LED backlight panel includes the following steps:

[0022] S1. Laser drilling: Using a laser, holes are drilled on the upper and lower surfaces of a glass substrate coated with an acid-resistant film, forming multiple sets of coaxial and corresponding blind holes; the specific operation is as follows:

[0023] Before laser drilling, TFT-LCD glass with a thickness of 0.5mm is cut into 400×500mm pieces. After the glass is edged by an edge grinding machine and polished by a polishing machine, it is cleaned, covered with an acid-resistant film, placed on the platform of the laser drilling machine, and fixed in position.

[0024] During laser drilling, the laser focus is adjusted to 23 μm from the upper surface of the glass, resulting in blind holes with a depth of 20 μm and a diameter of 80 μm. The glass is then flipped so that the opposite side faces upwards and fixed in the same position. Laser drilling is performed on the same side to obtain coaxial, corresponding blind holes with the same depth and diameter. Multiple sets of blind holes with the same depth and diameter are formed on the glass substrate according to the set spacing and the above method.

[0025] S2. Acid Etching Through Hole: Acid solution is sprayed into the blind hole, and through etching, a through hole is formed. The specific operation is as follows:

[0026] Before acid etching, place the glass substrate vertically in a sealed acid etching tank and fix its position. Place a support consisting of spray pipes at corresponding positions on both sides of the glass substrate, with the spray pipes 2cm away from the glass. At the same time, ensure that the nozzles of the spray pipes correspond one-to-one with the positions of multiple blind holes on the glass substrate.

[0027] For acid etching, turn on the acid pump in the spray pipe and maintain the spray pressure of the acid etching solution at 0.02 kg / cm². 2 The outlet flow rate of each nozzle is 1L / min, the temperature of the acid etching solution is 40℃, and after 2 minutes of acid etching treatment, a through hole is formed; the acid etching solution is a mixture of hydrofluoric acid, sulfuric acid and ammonium bifluoride.

[0028] After acid etching, the glass with through holes is cleaned and dried to obtain the glass substrate required for the Mini-LED backlight panel.

[0029] Example 2

[0030] A method for creating through-holes in a glass substrate for a Mini-LED backlight panel includes the following steps:

[0031] S1. Laser drilling: Using a laser, holes are drilled on the upper and lower surfaces of a glass substrate coated with an acid-resistant film, forming multiple sets of coaxial and corresponding blind holes; the specific operation is as follows:

[0032] Before laser drilling, the 0.7mm thick TFT-LCD glass is cut into 500×600mm pieces. After the glass is edged by an edge grinder and polished by a polishing machine, it is cleaned, covered with an acid-resistant film, placed on the platform of the laser drilling machine, and fixed in position.

[0033] During laser drilling, the laser focus is adjusted to 33μm from the upper surface of the glass, resulting in blind holes with a depth of 30μm and a diameter of 80μm. The glass is then flipped so that the opposite side faces upwards and fixed in the same position. Laser drilling is performed on the same side to obtain coaxial, corresponding blind holes with the same depth and diameter. Multiple sets of blind holes with the same depth and diameter are formed on the glass substrate according to the set spacing and the above method.

[0034] S2. Acid Etching Through Hole: Acid solution is sprayed into the blind hole, and through etching, a through hole is formed. The specific operation is as follows:

[0035] Before acid etching, place the glass substrate vertically in a sealed acid etching tank and fix its position. Place a support consisting of spray pipes at corresponding positions on both sides of the glass substrate, with the spray pipes 2cm away from the glass. At the same time, ensure that the nozzles of the spray pipes correspond one-to-one with the positions of multiple blind holes on the glass substrate.

[0036] For acid etching, turn on the acid pump in the spray pipe and maintain the spray pressure of the acid etching solution at 0.03 kg / cm². 2 The outlet flow rate of each nozzle is 2L / min, the temperature of the acid etching solution is 35℃, and after 3 minutes of acid etching treatment, a through hole is formed; the acid etching solution is a mixture of hydrofluoric acid, sulfuric acid and ammonium bifluoride.

[0037] After acid etching, the glass with through holes is cleaned and dried to obtain the glass substrate required for the Mini-LED backlight panel.

[0038] Examples 3-6 and Comparative Examples 1-2

[0039] The only difference between Examples 3-6 and Comparative Examples 1-2 and Example 1 is the difference in the relevant parameters during the S2 acid etching process. The specific parameters are shown in Table 1 below.

[0040] Table 1. Parameters related to acid etching and perforation treatment in Examples 3-6 and Comparative Examples 1-2

[0041]

[0042] Performance testing

[0043] The quality of the through holes obtained in Examples 1-6 and Comparative Examples 1-2 was tested, mainly focusing on the roughness of the inner wall and the diameter error of the through holes. The test results are shown in Table 2 below:

[0044] Test method for the inner wall roughness of through holes: The distance between the most prominent part and the hole wall after the through hole is formed is called the inner wall roughness of the through hole. Measurement method: After the glass through hole is completed, the through hole on the glass substrate is removed, its morphology is observed under a microscope, and then the distance between the most prominent part and the inner wall is measured using measurement software.

[0045] Aperture error test method: Measure the diameter of the through hole with a micrometer, and obtain the difference between the measured aperture and the target aperture, which is the aperture error.

[0046] Table 2. Through-hole quality of Examples 1-6 and Comparative Examples 1-2

[0047] Roughness (μm) Actual pore size (μm) Aperture error (μm) Example 1 8 82 2 Example 2 9 81 1 Example 3 6 81 1 Example 4 10 82 2 Example 5 8 78 -2 Example 6 6 79 -1 Comparative Example 1 20 84 4 Comparative Example 2 24 88 8

[0048] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A method for creating through-holes in a glass substrate for a Mini-LED backlight panel, characterized in that, The through-hole method includes: S1, using a laser to create holes on the upper and lower surfaces of a glass substrate coated with an acid-resistant film, forming multiple sets of coaxial and corresponding blind holes; S2, spraying acid etching solution into the blind holes, forming through holes through acid etching. In S2, the etching solution consists of hydrofluoric acid, sulfuric acid, and ammonium bifluoride; the temperature of the etching solution is 30-50℃; and the spray pressure of the etching solution is 0.02-0.1 kg / cm². 2 The flow rate of the acid etching solution is 0.5-2 L / min, and the acid etching time is 1-5 min.

2. The through-hole method for a glass substrate for a Mini-LED backlight panel according to claim 1, characterized in that, The thickness of the glass substrate is 0.2-1 mm.

3. The through-hole method for a glass substrate for a Mini-LED backlight panel according to claim 1 or 2, characterized in that, In S1, the depth of the blind hole is 1 / 20 to 1 / 25 of the glass thickness.

4. The through-hole method for a glass substrate for a Mini-LED backlight panel according to claim 3, characterized in that, In S1, the multiple sets of blind holes have the same depth.

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