Test piece arrangement structure and test substrate

Abstract

The present application discloses a test piece arrangement structure and a test substrate. The test piece arrangement structure includes: a plurality of test groups, each of the test groups includes at least one test piece, the number of the test pieces in each of the test groups is the same, the plurality of test groups are arranged around a virtual marking point, the test pieces have a patterned structure, each of the test groups has at least one test piece with the same patterned structure, and the distance from the same patterned structure in each of the test groups to the virtual marking point is the same. The film thickness of each of the above-mentioned patterned structures obtained by evaporation using an evaporation device is relatively consistent, which improves the uniformity of the thickness of the evaporated film layer of the same patterned structure of each test group, and improves the phenomenon of uneven thickness of the evaporated film layer of the test pieces in each test group to a certain extent. The test piece has sufficient film layer accuracy, so it can ensure that more accurate test results can be obtained when using the test piece for testing.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a test piece arrangement structure and a test substrate. Background Art

[0002] With the rapid development of electronic technology, display technologies such as organic light emitting diodes (OLED) have become a research hotspot in the display field. Technicians can use test pieces to experiment and verify display technologies.

[0003] For example, test pieces can be made in advance before mass production, and the design, process and function of the display panel can be experimentally verified through the test pieces. This method has the advantages of low cost, simple operation and flexible process. The applicant believes that the test piece itself should have sufficient accuracy so that the test piece can accurately reflect the test results. If the thickness of the evaporated film layer of the test piece is uneven during the evaporation process, the test results may be inaccurate. Summary of the invention

[0004] The embodiments of the present application provide a test piece arrangement structure and a test substrate, which can improve the uneven film thickness of the film layer structure of the test piece to a certain extent.

[0005] In a first aspect, an embodiment of the present application provides a test piece arrangement structure, comprising: a plurality of test groups, each of the test groups comprising at least one test piece, the number of the test pieces in each of the test groups being the same, the plurality of test groups being arranged around a virtual marking point, the test pieces having a patterned structure, each of the test groups having at least one test piece having the same patterned structure, and the distances from the same patterned structures in each of the test groups to the virtual marking point being the same.

[0006] In a second aspect, an embodiment of the present application provides a test substrate, comprising the test piece arrangement structure of the first aspect.

[0007] According to the test piece arrangement structure provided in this embodiment, the number of test pieces in each test group is the same, and each test group has at least one test piece with the same pattern. Multiple test groups are arranged around virtual marking points, so the above-mentioned same patterned structure in each test group is also arranged around the virtual marking point. Therefore, the film thickness of each of the above-mentioned patterned structures obtained by evaporation using the evaporation equipment is relatively consistent, which improves the uniformity of the thickness of the evaporated film layer of the same patterned structure of each test group, and improves the phenomenon of uneven thickness of the evaporated film layer of the test pieces in each test group to a certain extent. The test piece has sufficient film layer accuracy, so it can ensure that more accurate test results can be obtained when using the test piece for testing. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0009] Figure 1 A schematic diagram showing a test piece arrangement structure provided in an embodiment of the present application;

[0010] Figure 2 A schematic diagram showing a test piece arrangement structure provided in an embodiment of the present application;

[0011] Figure 3 A schematic diagram showing a test piece arrangement structure provided in an embodiment of the present application;

[0012] Figure 4 A schematic diagram showing a test piece arrangement structure provided in an embodiment of the present application;

[0013] Figure 5 A schematic diagram showing a test piece arrangement structure provided in an embodiment of the present application;

[0014] Figure 6 A schematic diagram showing a test piece arrangement structure provided in an embodiment of the present application;

[0015] Figure 7 A schematic diagram showing a test piece arrangement structure provided in an embodiment of the present application;

[0016] Figure 8 A schematic diagram showing a test piece arrangement structure provided in an embodiment of the present application;

[0017] Fig. 9 A schematic diagram showing a test piece arrangement structure provided in an embodiment of the present application;

[0018] Fig.10 A schematic diagram showing a test piece arrangement structure provided in an embodiment of the present application;

[0019] Fig.11 A schematic diagram showing the structure of a test piece provided in an embodiment of the present application is shown;

[0020] Fig.12 Show Fig.11 A possible cross-sectional structure diagram of the test piece along the AA direction;

[0021] Fig.13 Show Fig.11 A schematic diagram of another possible cross-sectional structure of the test piece along the AA direction;

[0022] Fig.14 A schematic diagram showing a test piece arrangement structure provided in an embodiment of the present application;

[0023] Fig.15 A schematic diagram showing a test piece arrangement structure provided in an embodiment of the present application;

[0024] Fig.16 Show Fig.15 A schematic diagram of the structure of the first test piece and the second test piece;

[0025] Fig.17 Show Fig.14 A possible cross-sectional structure diagram of the middle test group along the BB direction;

[0026] Fig.18 A partial schematic diagram showing a test piece arrangement structure provided in an embodiment of the present application;

[0027] Fig.19 Show Fig.18 A possible cross-sectional structure diagram of the test piece along the CC direction;

[0028] Fig. 20 A schematic diagram showing a test substrate according to an embodiment of the present application.

[0029] In the attached figure:

[0030] 00. Test substrate;

[0031] 01, test group; 011, first test group; 012, second test group; 013, third test group; 014, fourth test group; 015, fifth test group; 016, sixth test group; 017, seventh test group; 018, eighth test group; 019, ninth test group; 01A, tenth test group; 01B, eleventh test group; 01C, twelfth test group; 01D, thirteenth test group;

[0032] 1. Test piece; 101. First part; 102. Second part;

[0033] 11. patterned structure; 100. substrate; 110. film layer; 111. pixel unit; 111a. first pixel unit; 111b. second pixel unit; 112. first electrode layer; 113. pixel definition layer; 114. light-emitting functional layer; 115. second electrode layer; 116. encapsulation layer; 117. touch function layer;

[0034] 12. first test piece; 121. first test end; 122. second test end;

[0035] 13. second test piece; 131. third test end; 132. fourth test end;

[0036] V1, first virtual track; V2, second virtual track; V3, third virtual track; V4, fourth virtual track; V5, fifth virtual track;

[0037] P, virtual marking point; L1, first axis; L2, second axis. DETAILED DESCRIPTION

[0038] The features and exemplary embodiments of various aspects of the application will be described in detail below. In the detailed description below, many specific details are proposed to provide a comprehensive understanding of the application. However, it is obvious to those skilled in the art that the application can be implemented when some details in these specific details are not needed. The following description of the embodiments is only to provide a better understanding of the application by illustrating the example of the application.

[0039] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The embodiments will be described in detail below in conjunction with the accompanying drawings.

[0040] Relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device that includes a series of elements includes not only those elements, but also other elements that are not explicitly listed, or also includes elements that are inherent to such process, method, article, or device. In the absence of further restrictions, the elements defined by the statement "comprising ..." do not exclude the presence of additional identical elements in the process, method, article, or device that includes the elements.

[0041] It should be understood that when describing the structure of a component, when a layer or a region is referred to as being "on" or "over" another layer or another region, it may mean that it is directly on the other layer or another region, or that other layers or regions are included between it and the other layer or another region. Moreover, if the component is turned over, the layer or a region will be "below" or "beneath" another layer or another region.

[0042] In addition, the term "and / or" in this article is only a description of the association relationship between the associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0043] With the rapid development of display technology, display devices have undergone a transition from liquid crystal display (LCD), organic light emitting diode (OLED) to ， With the iteration of display technologies such as OLED, Quantum-dot Light Emitting Diode (QLED), and Micro Light Emitting Diode (Micro LED), technicians can use test pieces to experiment and verify display technologies.

[0044] For example, before mass production of display panels, technicians can make test pieces in advance and use them to experimentally verify the design, process and function of the display panels; for another example, if a display panel has a display defect, technicians can make a variety of test pieces corresponding to each production stage of the display panel, and conduct experiments and verification on different test pieces to explore the root cause of the display defect. This method of testing with test pieces has the advantages of low cost, simple operation and flexible process.

[0045] The applicant believes that the test piece itself should have sufficient precision for testing purposes to ensure that the test piece can accurately reflect the real data. Similar to the actual product, the test piece also needs to deposit many film layers through the deposition process. If the test piece has undesirable phenomena such as uneven thickness of the deposited film layer during the manufacturing process, it may cause the technician to use the test piece for testing to obtain inaccurate test results.

[0046] Furthermore, the applicant has recognized that in some deposition processes, the deposited film layer often shows a phenomenon that the film layer is thick in the center area and thin in the edge area. For example, in the evaporation process, the film layer thickness after evaporation is relatively thick at the position close to the evaporation source on the substrate to be evaporated; the film layer thickness after evaporation is relatively thin at the position far away from the evaporation source on the substrate to be evaporated. Another example is the sputtering process, the closer the substrate is to the center of the target material, the thicker the deposited film layer; the farther the substrate is from the center of the target material, the thinner the deposited film layer. Therefore, even the same film layer prepared by the same process may have uneven film thickness.

[0047] Based on the above considerations, in order to at least alleviate or solve the above technical problems to a certain extent, the applicant filed this application.

[0048] In order to better understand this application, Figures 1 to 20 The test piece arrangement structure and the test substrate provided in the embodiments of the present application are described in detail.

[0049] The embodiment of the first aspect of the present application provides a test piece arrangement structure, Figure 1 A schematic diagram of a test piece arrangement structure provided in an embodiment of the present application is shown.

[0050] See also Figure 1 The test piece arrangement structure provided in the embodiment of the present application includes a plurality of test groups 01, each test group 01 includes at least one test piece 1, the number of test pieces 1 in each test group 01 is the same, and the plurality of test groups 01 are arranged around a virtual marking point P. The test pieces 1 have a patterned structure 11, each test group 01 has at least one test piece 1 with the same patterned structure 11, and the distance from the same patterned structure 11 in each test group 01 to the virtual marking point P is the same.

[0051] The test piece arrangement structure of the embodiment of the present application can be used to make the above-mentioned test piece 1, which can be used to verify the display technology and can also be used to test the display device. The display device mentioned here can include but is not limited to a display, a mobile phone, a tablet computer, a laptop computer and related devices with display requirements.

[0052] The test piece 1 has a patterned structure 11, and this patterned structure 11 can be, for example, a film layer 110 structure formed by evaporating a substrate to be evaporated by an evaporation device; or it can be a film layer 110 structure formed by depositing materials on a substrate to be deposited by a sputtering device. The test piece arrangement structure includes a plurality of test groups 01, and the plurality of test groups 01 are arranged around a virtual marking point P. In the evaporation process, the virtual marking point P can be a position located on the substrate to be evaporated and closest to the evaporation source or the evaporation center of the evaporation device; in the sputtering process, the virtual marking point P can be a position located on the substrate to be deposited and closest to the center of the target material. The following description only takes the evaporation process as an example, but is not limited to this.

[0053] In this embodiment, the number of test pieces 1 in each test group 01 is the same, and each test group 01 has at least one test piece 1 with the same pattern. Multiple test groups 01 are arranged around the virtual marking point P, so the above-mentioned same patterned structure in each test group 01 is also arranged around the virtual marking point P. The distance from the same patterned structure 11 in each test group 01 to the virtual marking point P is the same, that is, the distance from the same patterned structure 11 in each test group 01 to the evaporation source or to the evaporation center is the same, therefore, the film thickness of each patterned structure 11 obtained by evaporation using the evaporation equipment is relatively consistent, which improves the uniformity of the thickness of the evaporated film layer of the same patterned structure 11 in each test group 01, and improves the phenomenon of uneven thickness of the evaporated film layer of the test piece 1 in each test group 01 to a certain extent. The test piece 1 has sufficient film layer accuracy, so it can ensure that more accurate test results can be obtained when using the test piece 1 for testing.

[0054] See also Figures 2 to 4 ,in, Figures 2 to 4 Schematic diagrams of several test piece arrangements provided in the embodiments of the present application are respectively shown.

[0055] In some optional embodiments, such as Figure 2 As shown, multiple test groups 01 are arranged in an array. This embodiment does not limit the specific form of the array arrangement. It is understandable that this array arrangement can be an array arrangement form presented by multiple test groups 01 relative to virtual test points. For example, Figure 2 As shown, multiple test groups 01 can be distributed in a rectangular array. In this example, each test group 01 includes four test pieces 1. In order to better illustrate the optional array arrangement of the test group 01 of this embodiment, in the other two examples provided below, the test group 01 only includes one test piece 1, but it is not limited to one. In one example, Figure 3 As shown, multiple test groups 01 can be arranged in a circular array; in another example, as Figure 4 As shown, multiple test groups 01 may be arranged in a fan-ring array.

[0056] The array arrangement of multiple test groups 01 in this embodiment can not only ensure that the film thickness of the test pieces 1 of the multiple test groups 01 is more uniform, but also make the test piece arrangement structure more compact, so that more test pieces 1 can be prepared when the multiple test groups 01 occupy a certain space. Moreover, the array arrangement form can also make it easier for technicians to divide and mark the test groups 01 or test pieces 1. For example, when there are a large number of test groups 01, arranging the test groups 01 in an array can facilitate technicians to quickly locate the specified test group 01. In addition, the array arrangement form also makes it easier to select the position of the virtual marking point P of the test piece arrangement structure.

[0057] See also Figure 5 , Figure 5 A schematic diagram of an array arrangement provided in an embodiment of the present application is shown.

[0058] In some embodiments, Figure 5As shown, at least two test groups 01 are arranged rotationally symmetrically around the virtual marking point P. The two test groups 01 are rotationally symmetrical around the virtual marking point P, which can be understood as one test group 01 coincides with the other test group 01 after rotating around the virtual marking point P by a certain angle. The present embodiment does not limit the rotation angle, for example, it can be 30 degrees, 45 degrees, 90 degrees, 180 degrees, etc. Regardless of the rotation angle, a plurality of rotationally symmetrical test groups 01 can be located on a circular trajectory with the virtual marking point P as the center, so the two test groups 01 are at an equal distance from the virtual marking point P, and thus the same patterned structure 11 of the two test groups 01 is also at an equal distance from the virtual marking point P, and the thickness of the deposited film layer of the test piece 1 in the two test groups 01 is more uniform, thereby improving the uniformity of the film layer thickness of the test piece 1.

[0059] In this embodiment, if Figure 5 As shown, the five test groups 01 closer to the virtual marking point P are rotationally symmetrical to each other and are located on the first virtual track V1; the eleven test groups 01 farther from the virtual marking point P are rotationally symmetrical to each other and are located on the second virtual track V2. The first virtual track V1 and the second virtual track V2 are concentric circles with the virtual marking point P as the center. Therefore, the five test groups 01 located on the first virtual track V1 have the same distance to the virtual marking point P, so the film thickness of the test piece 1 in these five test groups 01 has good uniformity; the eleven test groups 01 located on the second virtual track V2 have the same distance to the virtual marking point P, so the film thickness of the test piece 1 in these eleven test groups 01 has good uniformity.

[0060] See also Figure 6 , Figure 6 A schematic diagram showing a test piece arrangement structure provided in an embodiment of the present application is shown.

[0061] In some embodiments, Figure 6 As shown, at least two test groups 01 are arranged symmetrically around the virtual marking point P. Central symmetry can be understood as a specific form of rotational symmetry. The two test groups 01 are centrally symmetrical around the virtual marking point P, which means that one test group 01 overlaps with another test group 01 after being rotationally symmetrical 180 degrees around the virtual marking point P. Multiple test groups 01 are centrally symmetrical around the virtual marking point P, which can be understood as the central symmetry of the test groups 01 in pairs. The deposition rates of the film layer 110 of the patterned structure 11 of the test piece 1 in the two centrally symmetrical test groups 01 are relatively small. The deposition in a centrally symmetrical setting ensures that the test piece 1 has good uniformity of the film layer 110, which can improve the detection performance of the test piece 1.

[0062] In this embodiment, Figure 6As shown, the two first test groups 011 are symmetrical around the virtual mark point P, wherein each first test group 011 includes a test piece 1, and the patterned structures 11 of the test pieces 1 in the two first test groups 011 are the same, so the film thickness of the patterned structures 11 of the two test pieces 1 is relatively uniform, and the prepared test pieces 1 have good film layer accuracy, and more accurate test results can be obtained when using the test pieces 1 for testing. Figure 6 The two second test groups 012 are symmetrical about the virtual marking point P, and the two third test groups 013 are symmetrical about the virtual marking point P. The specific technical effects can be compared with those of the two first test groups 011, and will not be repeated here.

[0063] See also Figures 7 to 9 , Figures 7 to 9 Schematic diagrams of several test piece arrangement structures provided in the embodiments of the present application are respectively shown.

[0064] In some embodiments, the plurality of test groups 01 are arranged rotationally symmetrically around the virtual marking point P, and the rotation angle of the rotational symmetry is 90 degrees. Figure 7 The dashed lines are used to distinguish the test groups 01. Figure 7 As shown, the fourth test group 014 rotates 90 degrees clockwise around the virtual mark point P and coincides with the fifth test group 015. The clockwise direction refers to Figure 7 The fifth test group 015 is rotated 90 degrees clockwise and overlaps with the sixth test group 016.

[0065] In this embodiment, on the one hand, the film thickness of the patterned structure 11 of the test piece 1 in each test group 01 is relatively uniform, and the prepared test piece 1 has better accuracy and good test performance. On the other hand, the rotation angle of rotational symmetry is 90 degrees, which helps multiple test groups 01 to achieve a more compact arrangement structure, and also makes the division of the test group 01 simpler, and it is also easy to prepare and divide each test group 01 in actual production.

[0066] Optionally, the technician can divide the test group 01 into different groups according to the accuracy requirements of the film layer 110 of the test piece 1. Figure 8 Based on the combination Fig. 9 In one example, if Figure 8 As shown, the four seventh test groups 017 are rotationally symmetric around the virtual marking point P, the four eighth test groups 018 are rotationally symmetric around the virtual marking point P, and the four ninth test groups 019 are rotationally symmetric around the virtual marking point P, and the rotation angles of the above rotational symmetries are all 90 degrees. Fig. 9As shown, the third virtual track V3, the fourth virtual track V4, and the fifth virtual track V5 are concentric circles with the virtual marking point P as the center. The distances from each test group 01 on the same virtual track to the virtual marking point P are the same, so the film thickness of the test piece 1 in the test group 01 is more uniform.

[0067] In this example, the four seventh test groups 017 are located on the third virtual track V3, so the film thickness of the test pieces 1 in the four seventh test groups 017 is relatively uniform. Similarly, the film thickness of the test pieces 1 in the eight eighth test groups 018 is relatively uniform. The film thickness of the test pieces 1 in the four ninth test groups 019 is relatively uniform. Figure 7 The test piece arrangement structure shown in the example further divides the test group 01, so the film thickness uniformity of the prepared test pieces 1 is better. On the basis of preparing the same number of test pieces 1, the film thickness uniformity of each group of test pieces 1 is further improved.

[0068] See also Fig.10 , Fig.10 A test piece arrangement structure provided in an embodiment of the present application is shown.

[0069] In some embodiments, at least two adjacent test groups 01 are symmetrically distributed about an axis passing through the virtual marking point P. Fig.10 As shown, the tenth test group 01A is adjacent to the eleventh test group 01B, and the two are symmetrically distributed about the axis passing through the virtual marking point P. The axis passing through the virtual marking point P is as follows: Fig.10 The adjacent and symmetrical test groups 01 and the test pieces 1 in these test groups 01 not only have the characteristics of uniform film thickness, but can also be used as a comparative example of the test experiment, and more intuitively reflect the test results. In addition, the symmetrical distribution form also facilitates the division of the substrate where the test pieces 1 are located, and is easy to manufacture.

[0070] Please continue reading Fig.10 . In some optional embodiments, two lines located in the plane where the test piece arrangement structure is located, passing through the virtual marking point P and perpendicular to each other are defined as the first axis L1 and the second axis L2. Adjacent test groups 01 along the extension direction of the first axis L1 are symmetrical about the second axis L2, and adjacent test groups 01 along the extension direction of the second axis L2 are symmetrical about the first axis L1. The distances from adjacent test groups 01 to the virtual marking point P are relatively close, and the distances from the symmetrical test groups 01 to the virtual marking point P are also close, that is, the distances from these test groups 01 to the evaporation source are the same or similar, so the film thickness differences of the test pieces 1 in these test groups 01 are relatively small. In addition, the symmetrical arrangement makes it easier to design and manufacture the test piece arrangement structure.

[0071] As an example, Fig.10 As shown, the first axis L1 is Fig.10 As shown in L1, the second axis L2 is Fig.10 As shown in L2, the tenth test group 01A and the eleventh test group 01B are adjacent to each other along the extension direction of the first axis L1, and the two are symmetrical about the second axis L2. The tenth test group 01A and the twelfth test group 01C are adjacent to each other along the extension direction of the second axis L2, and the two are symmetrical about the first axis L1. According to the mathematical relationship, the distances from the tenth test group 01A, the eleventh test group 01B, and the twelfth test group 01C to the virtual marking point P are the same. Similarly, the positional relationship between the thirteenth test group 01D and the eleventh test group 01B and the twelfth test group 01C can be inferred by analogy, and no further details are given. Therefore, the distances from the tenth test group 01A to the thirteenth test group 01D to the virtual marking point P are the same, and the distances from the test pieces 1 in each test group 01 to the virtual marking point P are similar. Therefore, within a certain error range, the film layer 110 of the test pieces 1 in the tenth test group 01A to the thirteenth test group 01D can be regarded as a film layer 110 of uniform thickness. This symmetrical arrangement of adjacent test groups 01 not only makes it easier to design the arrangement of the test pieces 1, but also makes it easy to divide the substrate where the test pieces 1 are located, which helps to batch manufacture test pieces 1 with better film thickness uniformity.

[0072] See also Fig.11 , Fig.11 A schematic structural diagram of a test piece 1 provided in an embodiment of the present application is shown.

[0073] In some embodiments, Fig.11 As shown, the test piece 1 includes a plurality of pixel units 111, and at least two pixel units 111 are arranged rotationally symmetrically. The two pixel units 111 are rotationally symmetrical, which can be understood as one pixel unit 111 coincides with the other pixel unit 111 after rotating a certain angle around a reference point. The reference point can be located inside the test piece 1, or can be arranged with a test avoidance position. The reference point can be located on the substrate 100 where the test piece 1 is located, or can coincide with the virtual marking point PP. The present embodiment does not limit the position of the reference point, as long as at least two pixel units 111 can be rotationally symmetrical as a whole.

[0074] like Fig.11 As shown, the two first pixel units 111a are rotationally symmetrically arranged, and the two second pixel units 111b are rotationally symmetrically arranged. The rotationally symmetrical arrangement helps to set multiple groups of pixel units 111 on a test piece 1, and multiple types of pixel units 111 can be tested by a test piece 1, saving manufacturing costs and test efficiency. In addition, it also helps the test piece 1 to be compatible with the test fixture.

[0075] Optionally, in some embodiments, at least two pixel units 111 are centrally symmetrically arranged. Fig.11 As shown, the two first pixel units 111a are centrally symmetrical and the two second pixel units 111b are centrally symmetrical, which can facilitate technicians to test the first pixel units 111a and the second pixel units 111b, further improve the compatibility with test fixtures, and reduce differences caused by test methods.

[0076] Optionally, in some embodiments, at least two rotationally symmetric pixel units 111 have the same opening size, which can improve the test accuracy of the pixel unit 111 and facilitate the division of multiple pixel units 111. Exemplarily, when a test piece 1 includes multiple pixel units 111, the rotationally symmetric pixel units 111 have the same opening size, and multiple types of pixel units 111 can be prepared in one test piece 1. The same opening size of the pixel units 111 ensures that when the pixel units 111 are tested, the test results are less affected by the opening shape, which is beneficial to improving the accuracy of the test piece 1 and the test efficiency.

[0077] Please Fig.11 See on the basis of Fig.12 and Fig.13 , Fig.12 Show Fig.11 A possible cross-sectional structure diagram of the test piece 1 along the AA direction, Fig.13 Show Fig.11 Schematic diagram of another possible cross-sectional structure of the test piece 1 along the AA direction.

[0078] In some embodiments, the patterned structure 11 includes at least one of a first electrode layer 112, a pixel definition layer 113, a light emitting function layer 114, a touch function layer 117, and an encapsulation layer 116. Fig.12 As shown, the test piece 1 includes a substrate 100, and a first electrode layer 112, a second electrode layer 115, a pixel definition layer 113, and an encapsulation layer 116 on the substrate 100. One of the first electrode layer 112 and the second electrode layer 115 is an anode, and the other is a cathode. The anode includes an anode pattern corresponding to the pixel unit 111. The pixel definition layer 113 can be located on the side of the anode away from the substrate 100, and the pixel definition layer 113 can be formed of an organic material such as polyimide, polyamide, benzocyclobutene, acrylic resin or phenolic resin, or formed of an inorganic material such as silicon nitride. The pixel definition layer 113 includes a plurality of pixel definition openings, and the pixel definition openings expose the anode. The pixel definition layer 113 covers the edge of the anode pattern. The light-emitting function layer 114 is at least partially filled in the pixel definition opening and contacts the anode. The light-emitting function layer 114 in the pixel definition opening forms a minimum light-emitting device, and each light-emitting device can emit light of different colors according to different organic light-emitting materials.

[0079] Optionally, the light-emitting functional layer 114 can be formed in the pixel definition opening of the pixel definition layer 113 by inkjet printing, nozzle printing, or evaporation. The cathode can be formed on the light-emitting functional layer 114 by evaporation. Optionally, the cathode covers the light-emitting functional layer 114 and the pixel definition layer 113 on the front side.

[0080] Optionally, the patterned structure 11 may further include a passivation layer, and the constituent material of the passivation layer may be silicon oxide and / or silicon nitride.

[0081] Optionally, the patterned structure 11 may further include an encapsulation layer 116, which may be used to prevent external water, oxygen, and dirt from entering the interior of the test piece 1, thereby improving the test accuracy of the test piece 1. Exemplarily, the encapsulation layer 116 may be a thin film encapsulation layer 116, which is located on the side of the light-emitting functional layer 114 away from the substrate 100, and the thin film encapsulation layer 116 may seal the light-emitting material.

[0082] Optional, such as Fig.13 As shown, the patterned structure 11 may further include a touch function layer 117. The touch function layer 117 is located on a side of the light emitting function layer 114 away from the substrate 100, and is used to realize a touch function.

[0083] The patterned structure 11 of this embodiment may include various types, and a corresponding patterned structure 11 may be manufactured according to actual test requirements, making the test more flexible.

[0084] See also Fig.14 , Fig.14 A schematic diagram showing a test piece arrangement structure provided in an embodiment of the present application is shown.

[0085] In some embodiments, Fig.14 As shown, the test group 01 includes a first test piece 12 and a second test piece 13, and the first test piece 12 and the second test piece 13 are successively distributed in a direction away from the virtual marking point P. The patterned structures 11 of the first test piece 12 and the second test piece 13 can be the same or different. Exemplarily, the first test piece 12 and the second test piece 13 have different patterned structures 11, and multiple test pieces 1 can be prepared in one test group 01, thereby improving the preparation efficiency of the test pieces 1.

[0086] Optionally, the first test piece 12 is centrally symmetrical, and / or the second test piece 13 is centrally symmetrical. The test piece 1 is centrally symmetrical, that is, the patterned structure 11 of the test piece 1 is a centrally symmetrical structure. Similar to the centrally symmetrical setting effect of the pixel unit 111, the central symmetry can facilitate the technicians to test the patterned structure 11 of the test piece 1, further improve the compatibility with the test fixture, and reduce the differences caused by the test means.

[0087] See also Fig.15 , Fig.15 A schematic diagram showing a test piece arrangement structure provided in an embodiment of the present application is shown.

[0088] Optionally, the first test piece 1 and the second test piece 13 are mirror-symmetrical structures. In this embodiment, the first test piece 12 and the second test piece 13 are mirror-symmetrical structures, which can include the situation that the structures of the two are mirror-symmetrical to each other, or the situation that the two are only in the process of preparing the test piece 1, that is, in the test piece arrangement structure, in the mirror-symmetrical form. In other words, this embodiment is not limited to the situation that the first test piece 12 and the second test piece 13 are mirror-symmetrical in the test piece arrangement structure. In other words, even if the first test piece 12 and the second test piece 13 are not mirror-symmetrical in the test piece arrangement structure, the patterned structures 11 of the two prepared can be mirror-symmetrical after the positions of the two are adjusted, and this situation should also be included in the scope covered by this embodiment. This embodiment aims to prepare the first test piece 12 and the second test piece 13 that are mirror-symmetrical to each other, and whether they are mirror-symmetrical during the preparation process of the two is not limited. The two test pieces 1 with mirror-symmetrical structures can share a set of test fixtures, which can improve the test efficiency of the test piece 1.

[0089] See also Fig.16 , Fig.16 Show Fig.15 Schematic diagram of the structure of the first test piece 12 and the second test piece 13.

[0090] For example, Fig.16 As shown, the first test piece 12 and the second test piece 13 are mirror-symmetrical to each other. The first test piece 12 and the second test piece 13 both include a first electrode and a second electrode. The first electrode of the first test piece 12 has a first test end 121, and the second electrode has a second test end 122; the first electrode of the second test piece 13 has a third test end 131, and the second electrode has a fourth test end 132. To test the first test piece 12 and the second test piece 13, the first electrodes and the second electrodes of the two test pieces 1 need to be connected to the test fixture respectively, such as Fig.16As shown, the first test piece 12 and the second test piece 13, which are mirror-symmetrical to each other, can share a set of fixtures for their first test end 121 and the third test end 131, and the second test end 122 and the fourth test end 132, thereby saving the number of test fixtures and optimizing test efficiency.

[0091] See also Fig.17 , Fig.17 Show Fig.14 A schematic diagram of a possible cross-sectional structure of test group 01 along direction BB.

[0092] In some embodiments, the first test piece 1 is located between the second test piece 13 and the virtual marking point P, and the patterned structure 11 includes a plurality of film layers 110 stacked, such as Fig.17 As shown, the number of film layers 110 of the first test piece 12 is greater than the number of film layers 110 of the second test piece 13 .

[0093] The process of preparing the test piece 1 on the substrate 100 can be understood as a process of depositing multiple film layers 110 on the substrate 100. In the area of ​​the substrate 100 close to the evaporation source, the thickness and distribution of the deposited material are often more controllable. In other words, the closer to the evaporation source, the easier it is to control the process parameters such as the deposition speed and deposition thickness of the evaporation material. Therefore, when evaporation is performed in the area close to the evaporation source, the error of the film layer 110 is relatively small. Far away from the evaporation source, the movement of the evaporation material is more uncontrollable, and the control of these process parameters becomes more difficult, so the error of the deposited film layer 110 in these areas is relatively large. Therefore, when evaporation is performed away from the evaporation source area, the error of the film layer 110 is relatively large. When multiple film layers 110 are prepared, multiple film layers 110 will cause error accumulation. The more film layers 110 there are, the more and more obvious this accumulated error will be. Based on the above considerations, from the perspective of reducing errors, the first test piece 12 with a larger number of film layers 110 is placed close to the virtual marking point P. The error of the single-layer film layer 110 close to the virtual marking point P is smaller, and the cumulative error after the accumulation of errors of the multiple film layers 110 is also relatively small; the second test piece 13 with a smaller number of film layers 110 is placed away from the virtual marking point P. Even if the error of the single-layer film layer 110 at the virtual marking point P is larger, due to the small number of film layers 110, the final cumulative error is also relatively small, which can improve the error accumulation phenomenon to a certain extent and improve the film layer accuracy of the test piece 1.

[0094] In some embodiments, the number of film layers 110 in each region of the test piece 1 may not be equal everywhere, that is, a test piece 1 may have a different number of film layers 110 in one part than in another part. Similar to the principle of the above embodiment, technicians can optimize the arrangement position according to the number of film layers 110 in each part of the test piece 1.

[0095] See also Fig.18 and Fig.19 , Fig.18 A partial schematic diagram of a test piece arrangement structure provided in an embodiment of the present application is shown. Fig.19 Show Fig.18 Schematic diagram of a possible cross-sectional structure of the test piece along the CC direction.

[0096] In this embodiment, if Fig.18 As shown, the test piece 1 is divided into a first part 101 and a second part 102 according to the distance from the virtual marking point P, the first part 101 is close to the virtual marking point P, and the second part 102 is far away from the virtual marking point P. The patterned structure 11 includes a plurality of film layers 110 stacked, and the number of film layers 110 in the first part 101 is greater than the number of film layers 110 in the second part 102. Similar to the principle of the above embodiment, in this embodiment, the first part 101 is close to the virtual marking point P, the error of the single film layer 110 is small, and the cumulative error of the multi-layer film layer 110 is also relatively small; the second part 102 is far away from the virtual marking point P, the error of the single film layer 110 is large, but because the number of film layers 110 in the second part 102 is small, the cumulative error of the multi-layer film layer 110 will not be too large, so to a certain extent, the phenomenon of error accumulation of the film layer 110 of the single test piece 1 is improved, and the film layer accuracy of the test piece 1 is improved to improve the test performance of the test piece 1.

[0097] The present application also provides a test substrate 100. Fig. 20 , Fig. 20 FIG. 1 is a schematic diagram of a test substrate 100 according to an embodiment of the present application.

[0098] like Fig. 20 As shown, the test substrate 100 includes the test piece arrangement structure provided by any of the above embodiments. The test substrate 100 provided by the embodiment of the present application can be used to manufacture or test the above test piece 1.

[0099] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in the present application, and these modifications or replacements should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A test piece arrangement structure, characterized in that: include: Multiple test groups, each of the test groups includes at least one test piece, the number of the test pieces in each test group is the same, the multiple test groups are arranged around a virtual marking point, the test pieces have a patterned structure, each of the test groups has at least one test piece with the same patterned structure, and the distance from the same patterned structure to the virtual marking point is the same in each test group.

2. The test piece arrangement structure according to claim 1, characterized in that: The multiple test groups are arranged in an array.

3. The test piece arrangement structure according to claim 1, characterized in that: At least two of the test groups are arranged rotationally symmetrically around the virtual marking point.

4. The test piece arrangement structure according to claim 3, characterized in that: At least two of the test groups are symmetrically arranged around the center of the virtual marking point.

5. The test piece arrangement structure according to claim 3, characterized in that: The multiple test groups are arranged rotationally symmetrically around the virtual marking point, and the rotation angle of the rotational symmetry is 90 degrees.

6. The test piece arrangement structure according to claim 4, characterized in that: At least two adjacent test groups are symmetrically distributed about an axis passing through the virtual marking point.

7. The test piece arrangement structure according to claim 6, characterized in that: Two lines located in the plane where the test piece arrangement structure is located, passing through the virtual marking point and perpendicular to each other are defined as a first axis and a second axis; The adjacent test groups along the extending direction of the first axis are symmetrical with respect to the second axis, and the adjacent test groups along the extending direction of the second axis are symmetrical with respect to the first axis.

8. The test piece arrangement structure according to claim 1, characterized in that: The test piece comprises a plurality of pixel units, and at least two of the pixel units are arranged rotationally symmetrically.

9. The test piece arrangement structure according to claim 8, characterized in that: At least two of the pixel units are centrally symmetrically arranged. 10 . The test piece arrangement structure according to claim 8 , wherein the opening sizes of at least two rotationally symmetrically arranged pixel units are the same.

11. The test piece arrangement structure according to claim 1, characterized in that: The patterned structure includes at least one of a first electrode layer, a pixel definition layer, a light-emitting function layer, a second electrode layer, a touch function layer and an encapsulation layer.

12. The test piece arrangement structure according to claim 1, characterized in that: The test group includes a first test piece and a second test piece, and the first test piece and the second test piece are successively distributed in a direction away from the virtual marking point.

13. The test piece arrangement structure according to claim 12, characterized in that: The first test piece and / or the second test piece are / is centrally symmetrical.

14. The test piece arrangement structure according to claim 12, characterized in that: The first test piece and the second test piece are mirror-symmetrical structures to each other.

15. The test piece arrangement structure according to claim 12, characterized in that: The first test piece is located between the second test piece and the virtual marking point, the patterned structure includes a plurality of film layers stacked together, and the number of film layers of the first test piece is greater than the number of film layers of the second test piece.

16. The test piece arrangement structure according to claim 1, characterized in that: The test piece is divided into a first part and a second part according to the distance from the virtual marking point, the first part is close to the virtual marking point, and the second part is far away from the virtual marking point. The patterned structure includes a plurality of film layers stacked together, and the number of film layers in the first part is greater than the number of film layers in the second part.

17. A test substrate, characterized in that: Comprising the test piece arrangement structure as described in any one of claims 1 to 16.

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