A servo drive heat dissipation structure

Abstract

The present invention provides a servo drive heat dissipation structure. The present invention comprises a drive body and a heat dissipation base, wherein the drive body is mounted on the heat dissipation base, and heat dissipation fins and a heat dissipation fan are arranged on the heat dissipation base. The drive body comprises a PCB circuit board, and a gathering area is arranged on the PCB circuit board, and electronic components are gathered and distributed in the gathering area, and a first plug pin is arranged on the PCB circuit board; a heat dissipation area corresponding to the gathering area and a plug-in area corresponding to the first plug pin are arranged on the heat dissipation base, heat dissipation fins are distributed in the heat dissipation area, and a heat dissipation fan is mounted in the heat dissipation area, and a second plug-in pin is arranged in the plug-in area, and the first plug-in pin and the second plug-in pin are plugged into each other, and the volume of the heat dissipation base is fully controlled, the structure is compact, and the overall heat dissipation effect is good.

Description

Technical Field

[0001] The invention relates to a heat dissipation device, and in particular to a servo drive heat dissipation structure. Background Art

[0002] The traditional driver heat dissipation structure mainly includes a heat dissipation base and a driver body. The driver body is installed on the heat dissipation base, and heat dissipation fins and a heat dissipation fan are provided on the heat dissipation base. The heat emitted by the driver body is transferred to the heat dissipation base and the heat dissipation fins. The heat dissipation fan produces a direct air cooling effect on the heat dissipation base and the heat dissipation fins to achieve a heat dissipation effect.

[0003] Since the electronic components on the PCB circuit board in the traditional driver body are irregularly distributed, the heat dissipated by the entire circuit board has a larger range, requiring a larger heat dissipation base and more widely distributed heat dissipation fins. In addition, it is necessary to add a docking socket to dock with the driver, so the volume of the entire driver heat dissipation structure is larger. Summary of the invention

[0004] In view of this, an object of the present invention is to provide a servo drive heat dissipation structure, which has a more compact structure and a relatively concentrated heat dissipation effect.

[0005] In order to solve the above technical problems, the technical solution of the present invention is:

[0006] A servo driver heat dissipation structure comprises a driver body and a heat dissipation base, wherein the driver body is mounted on the heat dissipation base, and the heat dissipation base is provided with heat dissipation fins and a heat dissipation fan.

[0007] The driver body comprises a PCB circuit board, a gathering area is provided on the PCB circuit board, electronic components are gathered and distributed in the gathering area, and a first plug pin is provided on the PCB circuit board;

[0008] The heat dissipation base is provided with a heat dissipation area corresponding to the gathering area and a plug-in area corresponding to the first plug-in pin, the heat dissipation fins are distributed in the heat dissipation area, the heat dissipation fan is installed in the heat dissipation area, a second plug-in pin is provided in the plug-in area, and the first plug-in pin and the second plug-in pin are plugged into each other.

[0009] Through the above technical scheme, on the one hand, the electronic components are concentrated and distributed in the gathering area, the heat near the gathering area is relatively concentrated, the cooling fan can directly produce a direct cooling effect on the cooling fins, and the cooling fins are distributed in the cooling area, which can dissipate heat in the gathering area in a targeted manner, and the cooling effect is better; on the other hand, the electronic components on the PCB circuit board are distributed regularly, the volume of the heat dissipation base is fully controlled, and the structure is compact.

[0010] Preferably, the heat dissipation area of ​​the heat dissipation base is bent toward the gathering area so that a first groove is formed on the side wall of the heat dissipation base away from the driver body, and the heat dissipation fin is installed in the first groove.

[0011] Through the above technical solution, the heat dissipation base is bent once to form a first groove, and the heat dissipation fins are installed in the first groove, which fully utilizes the limited space of the heat dissipation base and makes the structure more compact.

[0012] Preferably, the plug-in area of ​​the heat dissipation base is bent away from the driver body so that a second groove is formed on the side wall of the heat dissipation base close to the driver body, and the second plug-in pin is installed in the second groove.

[0013] Through the above technical solution, the heat dissipation base is bent once to form the second groove, and the second plug pin is installed in the second groove. Combined with the setting form of the first groove, the compactness of the structure is further improved.

[0014] Preferably, the heat dissipation fins include a plurality of single fins, and the plurality of single fins are spaced apart and arranged parallel to each other;

[0015] The heat dissipation fan is slidably connected to the groove wall of the first groove, and the sliding direction of the heat dissipation fan is consistent with the length direction of the single fin;

[0016] Each of the single fins is divided into a plurality of fin pieces, a plurality of mounting slots are provided through the heat dissipation base, the fin pieces are slidably connected to the mounting slots one by one, and a tension spring is connected between the fin piece and the heat dissipation base;

[0017] The heat dissipation fan generates a squeezing force on the fins, and the fins overcome the action of the tension spring and slide into the installation groove.

[0018] Through the above technical scheme, the cooling fan can be moved according to the actual heat dissipation needs. During the movement of the cooling fan, the fins at the location thereof will generate extrusion pressure, and the fins will overcome the elastic force of the tension spring and slide into the installation groove to provide moving space for the cooling fan; while the other fins will be reset into the first groove under the elastic force of the tension spring. On the one hand, the wind blown by the cooling fan can have a direct heat dissipation effect on the heat dissipation base at that location; on the other hand, the wind will also pass between two adjacent single fins and have a heat dissipation effect on the heat dissipation base at other locations.

[0019] Preferably, the heat dissipation fan comprises a fan housing, and a slope is provided on a side of the fan housing, and the slope is used to generate an extrusion force on the wing piece toward one side of the mounting groove.

[0020] Through the above technical solution, when the heat dissipation fan gradually approaches the fin, the inclined surface will gradually exert a squeezing force on the fin, and the fin can overcome the force of the tension spring and move toward one side of the installation slot.

[0021] Preferably, one end of the fin extends to the side of the heat sink base away from the first groove and forms an extended end, the tension spring is located on the side of the heat sink base away from the first groove, and a spring mounting hole is provided on the side of the heat sink base away from the first groove, and the tension spring is installed in the spring mounting hole and connected to the extended end.

[0022] Through the above technical solution, the tension spring is installed on the side of the heat dissipation base away from the first groove. The structural neatness on the wall of the first groove is high, which can help reduce the resistance to the wind force passing between two adjacent single fins and improve the heat dissipation effect.

[0023] Preferably, a ventilation hole is provided at the bottom of the spring mounting hole, and the ventilation hole runs through the heat dissipation base.

[0024] Through the above technical solution, when the small wing at this position overcomes the tension of the tension spring and moves upward, the wind generated by the cooling fan will pass through the ventilation holes and the spring mounting holes, and then blow onto the PCB circuit board inside the driver body, thereby producing a direct heat dissipation effect.

[0025] Preferably, a connecting block is provided on the extending end, the tension spring is connected to the connecting block, a plug is provided on the connecting block, the plug is in the shape of a circular ring, the end of the tension spring connected to the connecting block is arranged in the plug, and the plug cooperates with the spring mounting hole to block each other.

[0026] Through the above technical solution, when the wing piece at this position overcomes the tension of the tension spring and moves upward, the plug can be pulled out of the spring mounting hole, and the wind generated by the cooling fan will pass through the ventilation hole and the spring mounting hole, and then blow to the PCB circuit board in the driver body, thereby producing a direct heat dissipation effect;

[0027] When the fin at this position is not squeezed by the cooling fan, the tension spring pulls the fin downward, and the plug can be inserted into the spring mounting hole, thereby limiting external dust from entering the PCB circuit board of the driver body through the ventilation hole and the spring mounting hole.

[0028] Preferably, a slot is provided on the PCB circuit board, a plurality of interwoven heat conducting sheets are provided on the PCB circuit board, a heat dissipating edge is wrapped on the groove edge of the slot, and the heat conducting sheet is connected to the heat dissipating edge;

[0029] The fin can slide into the slot and contact the heat dissipation edge;

[0030] Through the above technical solution, the heat generated on the PCB circuit board will be conducted to the heat dissipation edge through the heat conductive sheet. When the fins slide into the slots, they will come into contact with the heat dissipation edge. The heat on the heat dissipation edge is transferred to the fins. The cooling fan can directly dissipate the heat on the fins, and the heat dissipation effect of the entire PCB circuit board is better.

[0031] Preferably, the plane where the PCB circuit board on the driver body is located is perpendicular to the plane where the single fin is located, and a single fin can be inserted into the slots of multiple PCB circuit boards at the same time.

[0032] Through the above technical solution, when a single fin is inserted into the slots of multiple PCB circuit boards at the same time, it can produce a simultaneous heat dissipation effect on the multiple PCB circuit boards, and the heat dissipation effect is better.

[0033] The technical effects of the present invention are mainly reflected in the following aspects:

[0034] (1) By dividing the area on the PCB and improving the structure of the heat dissipation base, the entire heat dissipation structure becomes more compact and the heat dissipation effect is more concentrated;

[0035] (2) By driving the cooling fan to move and adjusting the position of the cooling base where the cooling fan is located, the targeted cooling effect is obvious;

[0036] (3) The cooling fan can squeeze the fins to move up and down. Under the premise that the volume of the entire cooling structure remains unchanged, the cooling fan moves more smoothly;

[0037] (4) The fins can be in contact with the heat dissipation edge on the PCB circuit board. Through the heat conduction of the heat conductive sheet, the heat dissipation effect of the PCB circuit board is stronger;

[0038] (5) After the plug is inserted into the spring mounting hole, it can play a certain dust-proof effect; after the plug is inserted and pulled out of the spring mounting hole, the wind from the cooling fan can pass through the ventilation holes and the spring mounting holes, and then blow onto the PCB circuit board inside the driver body, thereby producing a direct heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 It is a structural schematic diagram of embodiment 1;

[0040] Figure 2 It is a bottom view structural schematic diagram of the first embodiment;

[0041] Figure 3 This is a schematic diagram of the main structure of the first embodiment;

[0042] Figure 4 It is a side partial cross-sectional view of the second embodiment;

[0043] Figure 5 for Figure 4 A magnified view of part A;

[0044] Figure 6 This is a partial cross-section of the main view of the second embodiment. Figure 1 , used to highlight the connection between the fan housing and the heat sink base;

[0045] Figure 7 The main partial section of the second implementation Figure 2 , used to focus on the structures of slots, heat sinks and heat conducting sheets on the PCB;

[0046] Figure 8 It is a side view of a partial cross-section of the third embodiment;

[0047] Fig. 9 It is a schematic diagram of a partial cross-section of the front view of the third embodiment.

[0048] Figure numerals: 1. driver body; 2. PCB circuit board; 21. gathering area; 3. first plug pin; 4. heat dissipation base; 41. heat dissipation area; 42. plugging area; 5. second plug pin; 6. heat dissipation fin; 61. single fin; 612. fin; 7. extension end; 8. cooling fan; 81. fan housing; 812. inclined surface; 9. first groove; 10. second groove; 11. mounting groove; 12. tension spring; 13. spring mounting hole; 14. ventilation hole; 15. connecting block; 16. plug block; 17. slot; 18. heat conductive sheet; 19. heat dissipation edging; 20. driving motor; 201. driving screw; 22. cooling air duct; 23. cooling push rod; 24. rubber layer. DETAILED DESCRIPTION

[0049] The specific implementation modes of the present invention are further described below in conjunction with the accompanying drawings to make the technical solutions of the present invention easier to understand and grasp. Embodiment 1

[0050] A servo drive heat dissipation structure, see Figure 1 , including a driver body 1 and a heat dissipation base 4.

[0051] The driver body 1 is installed above the heat dissipation base 4 .

[0052] See also Figure 1 as well as Figure 2 The driver body 1 includes a PCB circuit board 2, on which a gathering area 21 is provided, in which electronic components are gathered and distributed, and on which a first plug pin 3 is provided.

[0053] Attach Figure 3For orientation reference, the clustering area 21 is located at the upper left position of the PCB circuit board 2 , and the first plug pin 3 is located at the lower right position of the PCB circuit board 2 .

[0054] See also Figure 3 The heat dissipation base 4 is provided with a heat dissipation area 41 corresponding to the gathering area 21 and a plug-in area 42 corresponding to the first plug-in pin 3 .

[0055] See also Figure 3 , heat dissipation fins 6 and heat dissipation fans 8 are distributed in the heat dissipation area 41 , and the heat dissipation fan 8 can blow wind toward the heat dissipation fins 6 , and the heat dissipation fins 6 produce a direct heat dissipation effect on the heat dissipation base 4 .

[0056] See also Figure 3 The heat dissipation area 41 of the heat dissipation base 4 is bent toward the side close to the gathering area 21 so that the side wall of the heat dissipation base 4 facing away from the driver body 1 forms a first groove 9 , and the heat dissipation fin 6 is installed in the first groove 9 .

[0057] See also Figure 3 The plug-in area 42 of the heat dissipation base 4 is bent toward the side away from the driver body 1 so that a second groove 10 is formed on the side wall of the heat dissipation base 4 close to the driver body 1. The second plug-in pin 5 is installed in the second groove 10, and the first plug-in pin 3 and the second plug-in pin 5 are plugged into each other.

[0058] Embodiment 2: The difference from Embodiment 1 is that:

[0059] See also Figure 4 The heat dissipation fin 6 includes a plurality of single fins 61 , and the plurality of single fins 61 are spaced apart and arranged parallel to each other.

[0060] See also Figure 4 as well as Figure 5 Each of the single fins 61 is divided into a plurality of fin pieces 612. A plurality of mounting grooves 11 are penetrated through the heat dissipation base 4. The fin pieces 612 are slidably connected to the mounting grooves 11 one by one. A tension spring 12 is connected between the fin piece 612 and the heat dissipation base 4. The tension spring 12 can pull the corresponding fin piece 612 to move into the first groove 9.

[0061] See also Figure 4 as well as Figure 6 The heat dissipation fan 8 is slidably connected to the groove wall of the first groove 9 , and the sliding direction of the heat dissipation fan 8 is consistent with the length direction of the single fin 61 .

[0062] The heat dissipation fan 8 includes a fan housing 81, and a slope 812 is provided on the side of the fan housing 81. The slope 812 is used to generate a squeezing force on the fin 612 toward the side of the mounting groove 11. When the heat dissipation fan 8 generates a squeezing force on the fin 612, the fin 612 overcomes the action of the tension spring 12 and slides into the mounting groove 11, that is, slides toward the driver body 1.

[0063] See also Figure 4 as well as Figure 5 One end of each fin 612 extends to the side of the heat sink 4 away from the first groove 9 and forms an extension end 7. The tension spring 12 is located on the side of the heat sink 4 away from the first groove 9. The side of the heat sink 4 away from the first groove 9 is provided with a spring mounting hole 13. The tension spring 12 is installed in the spring mounting hole 13 and connected to the extension end 7. Of course, it is best to set two symmetrical tension springs 12 on each fin 612.

[0064] See also Figure 5 A ventilation hole 14 is provided at the bottom of the spring mounting hole 13 , and the ventilation hole 14 runs through the heat dissipation base 4 .

[0065] See also Figure 5 A connecting block 15 is provided on the extension end 7, and the tension spring 12 is connected to the connecting block 15. A plug 16 is provided on the connecting block 15, and the material of the plug 16 is preferably rubber. The plug 16 is in the shape of a circular ring, and the hole shape of the spring mounting hole 13 is also a circular hole. The end of the tension spring 12 connected to the connecting block 15 is arranged in the plug 16, and the plug 16 and the spring mounting hole 13 cooperate with each other to plug.

[0066] See also Figure 7 A slot 17 is provided on the PCB circuit board 2, and a plurality of interwoven heat conducting sheets 18 are provided on the PCB circuit board 2. The material of the heat conducting sheets 18 is preferably aluminum.

[0067] See also Figure 7 The slot 17 is wrapped with a heat dissipation edge 19, and the material of the heat dissipation edge 19 is preferably aluminum. The heat conducting sheet 18 is connected to the heat dissipation edge 19;

[0068] See also Figure 7 The plane where the PCB circuit board 2 on the driver body 1 is located is perpendicular to the plane where the single fin 61 is located, and a single fin 612 can be simultaneously inserted into the slots 17 of multiple PCB circuit boards 2. The fin 612 can slide into the slot 17 and contact the heat dissipation edge 19.

[0069] Actual use process:

[0070] (1) Under normal use, the tension spring 12 pulls the fin 612 to move downward, and the plug 16 on the fin 612 is blocked in the spring mounting hole 13. The wind blown by the cooling fan 8 passes between the two single fins 61, and then dissipates the heat dissipation base 4, the cooling fins 6, the PCB circuit board 2, and the driver body 1; the plug 16 cooperates with the spring mounting hole 13 to also play a dust-proof role;

[0071] (2) When the heat dissipation position of the heat dissipation fan 8 needs to be adjusted, the heat dissipation fan 8 is pushed, and the heat dissipation fan 8 moves along the length direction of the single fin 61. The inclined surface 812 on the heat dissipation fan 8 squeezes the fin 612. The fin 612 overcomes the tension of the tension spring 12, and the plug 16 is pulled out of the spring mounting hole 13. The wind of the heat dissipation fan 8 blows directly to the heat dissipation base 4 to dissipate heat directly. The wind of the heat dissipation fan 8 will flow between two adjacent single fins 61 for heat dissipation, and will also enter the driver body 1 from the ventilation hole 14 and the spring mounting hole 13 for heat dissipation.

[0072] Of course, when the fin 612 moves toward the side of the driver body 1, the fin 612 will enter the slot 17 and contact the heat dissipation package 19. The heat on the PCB circuit board 2 will be conducted to the heat dissipation package 19 through the heat conductive sheet 18, and then conducted to the fin 612 by the heat dissipation package 19, thereby enhancing the heat dissipation effect.

[0073] Embodiment 3: Based on Embodiment 2, the following technical solutions are added.

[0074] See also Figure 8 A driving motor 20 and a driving screw 201 are installed on the heat dissipation base 4. The driving screw 201 penetrates and is threadedly connected to the fan housing 81 of the heat dissipation fan 8. The driving motor 20 drives the driving screw 201 to rotate forward and reverse, and the driving screw 201 drives the heat dissipation fan 8 to slide back and forth.

[0075] Therefore, the driving motor 20 drives the driving screw 201 to rotate forward and reverse, and the driving screw 201 can drive the cooling fan 8 to slide back and forth, and the cooling fan 8 can evenly blow air to dissipate heat at various positions of the cooling base 4; of course, the cooling fan 8 can also be made to stay at a specified position by controlling the rotation angle of the driving motor 20, thereby achieving the effect of controllable cooling position.

[0076] See also Figure 8 as well as Fig. 9 A cooling air duct 22 is provided on the groove wall of the slot 17, and a cooling push rod 23 is connected to the fin 612. A rubber layer 24 is provided at the end of the cooling push rod 23. The rubber layer 24 is used to abut against the side wall of the cooling air duct 22. The cooling push rod 23 can slide back and forth along the cooling air duct 22, and air flow is generated in the cooling air duct 22.

[0077] Therefore, when the cooling fan 8 moves, it will squeeze the fin 612, and the fin 612 will move toward the side of the PCB circuit board 2. At the same time, the fin 612 drives the cooling push rod 23 to slide back and forth in the cooling air duct 22. The rubber layer 24 at the end of the cooling push rod 23 and the side wall of the cooling air duct 22 continue to seal and slide, so that the air in the cooling air duct 22 can flow back and forth, thereby producing a heat dissipation effect on the inside of the PCB board.

[0078] See also Fig. 9 The cooling air duct 22 extends and is distributed inside the PCB circuit board 2 .

[0079] Therefore, the cooling air duct 22 can produce a more uniform heat dissipation effect on the PCB circuit board 2 .

[0080] During actual use, the driving motor 20 drives the driving screw 201 to rotate, and the driving screw 201 drives the cooling fan 8 to move. The cooling fan 8 generates an extrusion force on the wing 612. During the movement of the wing 612 toward the side of the PCB circuit board 2, the wing 612 enters the slot 17. Conversely, when the cooling fan 8 is disengaged from the wing 612, the tension spring 12 pulls the wing 612 to reset, and the cooling push rod 23 of the wing 612 drives the rubber layer 24 to reciprocate along the cooling air duct 22, and the cooling air in the cooling air duct 22 flows continuously.

[0081] Of course, the above are only typical examples of the present invention. In addition, the present invention may also have many other specific implementations. All technical solutions formed by equivalent replacement or equivalent transformation fall within the scope of protection required by the present invention.

Claims

1. A servo drive heat dissipation structure, comprising a drive body (1) and a heat dissipation base (4), wherein the drive body (1) is mounted on the heat dissipation base (4), and the heat dissipation base (4) is provided with heat dissipation fins (6) and a heat dissipation fan (8), wherein: The driver body (1) comprises a PCB circuit board (2), a gathering area (21) is provided on the PCB circuit board (2), electronic components are gathered and distributed in the gathering area (21), and a first plug pin (3) is provided on the PCB circuit board (2); The heat dissipation base (4) is provided with a heat dissipation area (41) corresponding to the gathering area (21) and a plug-in area (42) corresponding to the first plug-in pin (3); the heat dissipation fins (6) are distributed in the heat dissipation area (41); the heat dissipation fan (8) is installed in the heat dissipation area (41); a second plug-in pin (5) is provided in the plug-in area (42); the first plug-in pin (3) and the second plug-in pin (5) are plugged into each other; The heat dissipation area (41) of the heat dissipation base (4) is bent toward a side close to the gathering area (21) so that a first groove (9) is formed on a side wall of the heat dissipation base (4) facing away from the driver body (1), and the heat dissipation fin (6) is installed in the first groove (9); The plug-in area (42) of the heat dissipation base (4) is bent toward a side away from the driver body (1) so that a second groove (10) is formed on a side wall of the heat dissipation base (4) close to the driver body (1), and the second plug-in pin (5) is installed in the second groove (10); The heat dissipation fins (6) include a plurality of single fins (61), and the plurality of single fins (61) are spaced apart and arranged parallel to each other; The heat dissipation fan (8) is slidably connected to the groove wall of the first groove (9), and the sliding direction of the heat dissipation fan (8) is consistent with the length direction of the single fin (61); Each of the single fins (61) is divided into a plurality of fin pieces (612); a plurality of mounting grooves (11) are provided through the heat dissipation base (4); the fin pieces (612) are slidably connected to the mounting grooves (11) in a one-to-one correspondence; and a tension spring (12) is connected between the fin pieces (612) and the heat dissipation base (4); The heat dissipation fan (8) generates a squeezing force on the fin (612), and the fin (612) overcomes the action of the tension spring (12) and slides into the installation groove (11).

2. The servo drive heat dissipation structure according to claim 1, characterized in that: The heat dissipation fan (8) comprises a fan housing (81), and a slope (812) is provided on the side of the fan housing (81), and the slope (812) is used to generate a squeezing force on the wing piece (612) toward one side of the installation groove (11).

3. The servo drive heat dissipation structure according to claim 1, characterized in that: One end of the fin (612) extends to the side of the heat dissipation base (4) away from the first groove (9) and forms an extended end (7); the tension spring (12) is located on the side of the heat dissipation base (4) away from the first groove (9); a spring mounting hole (13) is provided on the side of the heat dissipation base (4) away from the first groove (9); the tension spring (12) is installed in the spring mounting hole (13) and connected to the extended end (7).

4. The servo drive heat dissipation structure according to claim 3 is characterized in that: A ventilation hole (14) is provided at the bottom of the spring mounting hole (13), and the ventilation hole (14) penetrates the heat dissipation base (4).

5. The servo drive heat dissipation structure according to claim 4 is characterized in that: A connecting block (15) is provided on the extending end (7), the tension spring (12) is connected to the connecting block (15), a plug block (16) is provided on the connecting block (15), the plug block (16) is in the shape of a circular ring, the end of the tension spring (12) connected to the connecting block (15) is arranged in the plug block (16), and the plug block (16) and the spring mounting hole (13) cooperate with each other to plug each other.

6. The servo drive heat dissipation structure according to claim 5, characterized in that: The PCB circuit board (2) is provided with a slot (17), the PCB circuit board (2) is provided with a plurality of interwoven heat conducting sheets (18), the slot edge of the slot (17) is wrapped with a heat dissipating edge (19), and the heat conducting sheet (18) is connected to the heat dissipating edge (19); The fin (612) can slide into the slot (17) and contact the heat dissipation edge (19).

7. The servo drive heat dissipation structure according to claim 6, characterized in that: The plane where the PCB circuit board (2) on the driver body (1) is located is perpendicular to the plane where the single fin (61) is located, and a single fin (612) can be inserted into the slots (17) of multiple PCB circuit boards (2) at the same time.

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