Electrical connector, electrical connector module and sheet including electrical connector module

Abstract

The present application discloses an electrical connector, an electrical connector module, and a sheet including an electrical connector module. An electrical connector module has an opening in an insulating support that is selectively positioned to limit dielectric losses in a signal. The connector may include a first conductor and a second conductor, the first conductor and the second conductor including a first side and a second side between a first edge and a second edge. The insulating support holds the first conductor adjacent to the second conductor and may have at least five base portions, wherein a first base portion contacts a first side of the first conductor, a second base portion contacts a second side of the first conductor, a third base portion contacts a first side of the second conductor, a fourth base portion contacts a second side of the second conductor, and at least a portion of a fifth base portion is disposed between two edges of the first conductor and the second conductor. The width of the base portion may be less than the width of the first side and the second side of the first conductor and the second conductor.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application is a divisional application of Chinese patent application No. 201980028014.5, filed on October 23, 2020, entitled “Insulating Support for Very High-Speed ​​Electrical Interconnects.” The international filing date of the parent application is March 19, 2019, with international application number PCT / US2019 / 022934. This application claims priority to and the benefit of U.S. Provisional Patent Application Serial No. 62 / 647,517, filed on March 23, 2018, entitled “INSULATIVE SUPPORT FOR VERY HIGH SPEED ELECTRICAL INTERCONNECTION,” and this application also claims priority to and the benefit of U.S. Provisional Patent Application Serial No. 62 / 776,349, filed on December 6, 2018, entitled “INSULATIVE SUPPORT FOR VERY HIGH SPEED ELECTRICAL INTERCONNECTION,” which are hereby incorporated by reference in their entirety. Technical Field

[0003] The present patent application relates generally to interconnection systems for interconnecting electronic components, such as interconnection systems including electrical connectors, and more particularly to insulating supports for very high-speed electrical interconnection. Background Art

[0004] Electrical connectors are used in many electronic systems. It is often easier and more cost-effective to manufacture the system as separate electronic components, such as printed circuit boards (PCBs), that can be joined together using electrical connectors. Known arrangements for joining several PCBs have one PCB serving as a backplane. Other PCBs, known as "daughterboards" or "daughter cards," can be connected via the backplane.

[0005] A known backplane is a printed circuit board (PCB) on which a number of connectors may be mounted. Conductive traces in the backplane may be electrically connected to signal conductors in the connectors, allowing signals to be routed between the connectors. Daughter cards may also have connectors mounted thereon. The connectors mounted on the daughter cards may be plugged into connectors mounted on the backplane. In this way, signals may be routed between the daughter cards through the backplane. The daughter cards may be plugged into the backplane at right angles. Consequently, connectors used for these applications include right-angle bends and are commonly referred to as "right-angle connectors."

[0006] In other configurations, connectors can also be used to interconnect printed circuit boards and to interconnect other types of devices, such as cables, to printed circuit boards. Sometimes, one or more smaller printed circuit boards can be connected to another larger printed circuit board. In such a configuration, the larger printed circuit board can be called a "motherboard" and the printed circuit boards connected to the motherboard can be called daughterboards. In addition, printed circuit boards of the same or similar sizes can sometimes be aligned in parallel. Connectors used in these applications are often called "stacking connectors" or "mezzanine connectors."

[0007] Regardless of the specific application, electrical connector designs have adapted to reflect trends in the electronics industry. Electronic systems have generally become smaller, faster, and more complex. As a result of these changes, the number of circuits in a given area of ​​an electronic system, as well as the frequency at which these circuits operate, has increased significantly in recent years. Current systems transfer more data between printed circuit boards, requiring electrical connectors that can handle more data at higher speeds than connectors available just a few years ago.

[0008] In high-density, high-speed connectors, electrical conductors can be located close together, potentially causing electrical interference between adjacent signal conductors. To reduce this interference and otherwise provide desired electrical characteristics, shielding members are often placed between or around adjacent signal conductors. Shields can prevent signals carried on one conductor from generating "crosstalk" on another conductor. Shields can also affect the impedance of each conductor, thereby contributing to desired electrical characteristics.

[0009] Examples of shielding can be seen in U.S. Patent No. 4,632,476 and U.S. Patent No. 4,806,107, which show connector designs that use shields between multiple columns of signal contacts. These patents describe connectors in which the shield extends parallel to the signal contacts through both the daughterboard connector and the backplane connector. Cantilever beams are used to establish electrical contact between the shield and the backplane connector. U.S. Patent Nos. 5,433,617, 5,429,521, 5,429,520, and 5,433,618 show similar arrangements, however, the electrical connection between the backplane and the shield is made through spring-loaded contacts. A shield with torsion beam contacts is used in the connector described in U.S. Patent No. 6,299,438. Other shields are shown in U.S. Pre-Grant Publication 2013-0109232.

[0010] Other connectors have a shield located only within the daughterboard connector. Examples of such connector designs can be found in U.S. Patents No. 4,846,727, 4,975,084, 5,496,183, and 5,066,236. Another connector with a shield located only within the daughterboard connector is shown in U.S. Patent No. 5,484,310, and U.S. Patent No. 7,985,097 is yet another example of a shielded connector.

[0011] Other techniques can be used to control the performance of the connector. For example, transmitting signals differentially can also reduce crosstalk. Differential signals are carried on a pair of conductive paths called a "differential pair." The voltage difference between the conductive paths represents the signal. Typically, differential pairs are designed to have preferential coupling between the conductive paths. For example, the two conductive paths of a differential pair can be arranged to extend closer to each other than adjacent signal paths in the connector. Shielding is not desired between the pair of conductive paths, but shielding can be used between the differential pairs. Electrical connectors can be designed for differential signals as well as single-ended signals. Examples of differential electrical connectors are shown in U.S. Patents No. 6,293,827, No. 6,503,103, No. 6,776,659, No. 7,163,421, and No. 7,794,278. Summary of the Invention

[0012] Aspects of the present disclosure relate to an electrical connector configured to reduce dielectric losses.

[0013] According to one aspect of the present application, an electrical connector module is provided, comprising: at least two conductors, each of the at least two conductors comprising: a first end and a second end; and an intermediate portion connecting the first end and the second end, the intermediate portion comprising a first edge and a second edge and a first side and a second side between the first edge and the second edge, the first side and the second side being wider than the first edge and the second edge, wherein the at least two conductors comprise a first conductor and a second conductor; and an insulating support member, the insulating support member maintaining the first conductor adjacent to the second conductor, the insulating support member having a first base portion, a second base portion, a third base portion and a fourth base portion, wherein: the first base portion contacts the first side of the first conductor, the second base portion contacts the second side of the first conductor, the third base portion contacts the first side of the second conductor, and the fourth base portion contacts the second side of the second conductor, and the width of at least one of the first base portion and the second base portion is smaller than the width of the first side and the second side of the first conductor, and the width of at least one of the third base portion and the fourth base portion is smaller than the width of the first side and the second side of the second conductor.

[0014] According to one aspect of the present application, a thin sheet is provided, comprising: a plurality of electrical connector modules as described above, the electrical connector modules further comprising a shielding member around the insulating support member, wherein the shielding member comprises a first shielding member and a second shielding member that jointly surround the insulating support member; and at least one loss member, the at least one loss member being coupled to the first shielding member and / or the second shielding member of each electrical connector module in the plurality of electrical connector modules.

[0015] According to one aspect of the present application, there is provided an electrical connector comprising a plurality of thin sheets as described above, wherein the plurality of thin sheets are aligned in parallel to form the electrical connector.

[0016] According to one aspect of the present application, an electrical connector module is provided. The electrical connector module includes: at least two conductors, each of the at least two conductors including: a first end and a second end; and an intermediate portion connecting the first end and the second end, the intermediate portion including a first edge and a second edge and a first side and a second side between the first edge and the second edge, the first side and the second side being wider than the first edge and the second edge, wherein the at least two conductors include a first conductor and a second conductor; and an insulating support member that holds the first conductor adjacent to the second conductor, the insulating support member having a first pedestal portion, a second pedestal portion, a third pedestal portion, and a fourth pedestal portion, wherein the first pedestal portion contacts the first side of the first conductor, the second pedestal portion contacts the second side of the first conductor, the third pedestal portion contacts the first side of the second conductor, and the fourth pedestal portion contacts the second side of the second conductor, and wherein the widths of the first pedestal portion and the fourth pedestal portion are smaller than the widths of the first and second sides of the first and second conductors.

[0017] According to one aspect of the present application, an electrical connector is provided. The electrical connector includes: a plurality of signal conductors, wherein the signal conductors are configured to generate an electric field pattern when carrying a low-voltage differential signal at a frequency of 40 GHz, the electric field pattern defining regions of higher electric field strength and lower electric field strength; and an insulating material that retains the plurality of signal conductors, wherein the insulating material includes a plurality of openings along at least a portion of the length of the plurality of signal conductors, wherein the openings are selectively positioned based on the regions of higher electric field strength such that a 14 GHz 50 millivolt differential signal exhibits a dielectric loss that is at least 10% less than that of an insulating housing without the openings.

[0018] According to one aspect of the present application, a method for manufacturing a module for an electrical connector is provided. The method includes: positioning a central member of an insulating support between at least two conductors, each of the at least two conductors including: a first end and a second end; and a middle portion connecting the first end and the second end, the middle portion including a first edge and a second edge and a first side and a second side between the first edge and the second edge, the first side and the second side being wider than the first edge and the second edge, wherein the at least two conductors include a first conductor and a second conductor, and the central member includes a first base portion and a second base portion, wherein the first base portion contacts the first side of the first conductor and the second base portion contacts the first side of the second conductor; positioning first and second covers of the insulating support adjacent to the first and second conductors, respectively, each of the first and second covers including a corresponding base portion, wherein the base portion of the first cover contacts the second side of the first conductor and the base portion of the second cover contacts the second side of the second conductor, and wherein a portion of at least one surface of each conductor is exposed within an opening between the central member and one of the first and second covers; and surrounding at least a portion of the covers and the central member with one or more reference conductors.

[0019] The foregoing is a non-limiting summary of the invention, which is defined by the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The drawings are not intended to be drawn to scale. In the drawings, each identical or nearly identical component illustrated in various figures may be represented by a like reference numeral. For clarity, not every component will be labeled in every figure. In the drawings:

[0021] Figure 1 is an isometric view of an illustrative electrical interconnect system according to some embodiments;

[0022] Figure 2 yes Figure 1 a partially cutaway isometric view of a backplane connector;

[0023] Figure 3 yes Figure 2 an isometric view of a pin assembly of a backplane connector;

[0024] Figure 4 yes Figure 3 an exploded perspective view of a pin assembly;

[0025] Figure 5 yes Figure 3 an isometric view of a signal conductor of a pin assembly;

[0026] Figure 6 yes Figure 1 a partially exploded isometric view of a daughter card connector;

[0027] Figure 7 yes Figure 6 an isometric view of a wafer assembly of a daughter card connector;

[0028] Figure 8 yes Figure 7 an isometric view of a sheet module of a sheet assembly;

[0029] Figure 9 yes Figure 7 an isometric view of a portion of a housing of a wafer assembly;

[0030] Figure 10 yes Figure 7 a partially exploded isometric view of a wafer module of a wafer assembly;

[0031] Figure 11 yes Figure 7 a partially exploded isometric view of a portion of a wafer module of a wafer assembly;

[0032] Figure 12 yes Figure 7 a partially exploded isometric view of a portion of a wafer module of a wafer assembly;

[0033] Figure 13 yes Figure 7 an isometric view of a pair of conductive elements of a wafer module of a wafer assembly;

[0034] Figure 14A yes Figure 13 a side view of a pair of conductive elements;

[0035] Figure 14B It is along Figure 14A The line BB intercepts Figure 13 an end view of a pair of conductive elements;

[0036] Figure 15 is a cross-sectional view of a pair of conducting elements with equipotential lines;

[0037] Figure 16A is configured to reduce dielectric loss along line 16-16 according to an illustrative embodiment Figure 8 A cross-sectional view of an alternative embodiment of a thin-film module;

[0038] Figure 16B yes Figure 16A The thin film module is in Figure 16A Cross-sectional views at different positions shown in FIG;

[0039] Figure 16C yes Figure 16A The thin film module is in Figure 16A and Figure 16BCross-sectional views at different locations shown;

[0040] Figure 17 is a cross-sectional view of a wafer module configured to reduce dielectric losses according to an illustrative embodiment; and

[0041] Figure 18 is a cross-sectional view of a wafer module configured to reduce dielectric losses according to another illustrative embodiment.

[0042] Figure 19 is an isometric view of a wafer with portions cut away to show a portion of a wafer module having edge-coupled signal conductors configured to reduce dielectric losses in accordance with an illustrative embodiment.

[0043] Figure 20A is a cross-sectional view of a wafer module having edge-coupled signal conductors configured to reduce dielectric losses according to another illustrative embodiment.

[0044] Figure 20B yes Figure 20A Cross-sectional views of the sheet module taken at different positions.

[0045] Figure 21A is a partially exploded view of a connector module having edge-coupled signal conductors in accordance with an illustrative embodiment.

[0046] Figure 21B is a partially exploded view of a connector module according to an illustrative embodiment.

[0047] Figure 22 is a partially exploded view of a wafer according to an illustrative embodiment.

[0048] Figure 23 is a partially exploded view of a vertical connector according to an illustrative embodiment. DETAILED DESCRIPTION

[0049] The inventors have recognized and understood techniques for increasing the performance of high-density interconnect systems, particularly those that carry the extremely high frequency signals necessary to support high data rates by selectively positioning dielectric material adjacent to signal conductors to limit dielectric losses. Due to the geometry of the signal conductors, high-frequency signals carried on the signal conductors may generate electric fields of spatially variable strength. Where the electric field interacts with the dielectric material supporting the signal conductors, there may be large dielectric losses experienced by high frequencies such as 14 GHz, 24 GHz, or 40 GHz signals. Such dielectric losses can be mitigated by removing dielectric material at selected locations near the signal conductors. According to some embodiments, dielectric material adjacent to the edges of the signal conductors can be omitted. The inventors have recognized and understood that in some embodiments, these areas contain higher electric field strengths.

[0050] The inventors have also recognized and appreciated techniques for stably maintaining signal conductors despite areas where dielectric material is omitted. According to some embodiments, a signal conductor can be suspended within one or more openings in a dielectric material. The openings can be defined by and / or abut one or more pedestals in the dielectric material coupled to the signal conductors. The dielectric material can include multiple members to form an insulating support for the signal conductors in a signal conductor pair.

[0051] In some embodiments, one or more other members can surround multiple insulating members to push them together so that the signal conductors are clamped between the base portions. In some embodiments, the members surrounding the insulating supports can be metal, and in some embodiments, can be grounded and can serve as a shield for the signal conductor pairs. Multiple surrounding members can collectively surround each insulating support, and these multiple surrounding members can be held together with a latch or insulating structure. In some embodiments, the corners of the insulating members can be relieved to reduce variations in the pressure applied on the insulating members by the surrounding members.

[0052] In some embodiments, when the connector carries a low voltage differential signal, such as a 25 mV, 50 mV, 100 mV, 250 mV, or 500 mV low voltage differential signal, the open area on the dielectric support adjacent to the edge of the broadside-coupled signal conductor is believed to reduce the insertion loss of the connector by 10% to 15% at frequencies such as 14 GHz relative to a connector without the open area. The attenuation difference may be 15% to 20% at 24 GHz and even greater at higher frequencies.

[0053] In some embodiments, an electrical connector module can be manufactured to include at least two conductors and an insulating support member that holds the conductors between base portions. Each of the first and second conductors can include a first end and a second end connected by a middle portion, the middle portion having two sides and two edges that are narrower than the sides. The insulating support member can have at least four base portions, wherein a pair of base portions contacts a corresponding side of each of the at least two conductors. At least two of the base portions can have a width that is smaller than the width of the side of the conductor.

[0054] In some embodiments, the insulating support includes an opening, and the edges of the conductors are disposed within the opening. In some embodiments, the sides of the conductors have a first width, and the edges of the conductors each extend into the opening a distance equal to at least 10% of the first width. In some embodiments, the first and second surfaces of the first and second conductors are exposed within the opening.

[0055] In some embodiments, the conductors are held within the insulating support with the sides of the conductors parallel. In some embodiments, the insulating support comprises: a first cover comprising a first base portion; a central member comprising a second base portion and a third base portion; and a second cover comprising a fourth base portion. In some embodiments, one or both covers comprises a compliant portion between a first end and a second end, the first and second ends of the cover contacting the central member, and the base portion extending from the compliant portion.

[0056] In some embodiments, the electrical connector module includes at least one shield surrounding an insulating support, the at least one shield pressing a compliant portion of the cover toward a central member such that the first conductor is clamped between a first base portion and a second base portion. In some embodiments, the at least one shield includes at least one metal member. In some embodiments, the at least one metal member includes two connected metal members that collectively surround the insulating support. In some embodiments, the two shield members collectively surround the insulating support. In some embodiments, the conductors are a pair of broadside-coupled signal conductors, and the shield is positioned to surround the broadside-coupled pair. In some embodiments, the first end of the signal conductor includes a mating contact portion, the second ends of the first and second signal conductors include contact tails, and the mating contact portion and contact tails extend from the insulating support. In some embodiments, at least one of the covers includes a first side and an opposite side, the first base portion extending from a central portion of the first side, a portion of the opposite side contacting the shield, and the central portion of the opposite side includes a recess to create a space between the central portion and the shield.

[0057] In some embodiments, a corner between a first end and a second end of at least one cover is softened to provide space between the corner and at least one shield. In some embodiments, a subassembly includes at least two conductors, an insulating support, a first shield member, and a second shield member, and the electrical connector module includes a sheet. The sheet may include a plurality of lossy members coupled to the first shield member and / or the second shield member of at least one of the plurality of subassemblies disposed within the sheet. In some embodiments, the plurality of sheets are aligned in parallel to form the electrical connector.

[0058] In some embodiments, an electrical connector is provided. The electrical connector includes: a plurality of signal conductors, wherein the signal conductors are configured to generate an electric field pattern when carrying a low voltage differential signal having a frequency of 40 GHz, the electric field pattern defining regions of higher electric field strength and lower electric field strength; and an insulating material that holds the plurality of signal conductors, wherein the insulating material includes a plurality of openings along at least a portion of the length of the signal conductors of the plurality of signal conductors, wherein the openings are selectively positioned according to regions of higher electric field strength. In some embodiments, a 14 GHz 50 mV differential signal exhibits at least 10% less dielectric loss than an insulating housing without openings. In some embodiments, a 14 GHz differential signal exhibits at least 15% less loss than an insulating housing without openings. In some embodiments, a 14 GHz low voltage differential signal exhibits at least 0.5 dB less loss than an insulating housing without openings.

[0059] In some embodiments, at least one surface of each of the plurality of signal conductors is exposed within the plurality of openings. In some embodiments, the signal conductors are supported by a base portion of the insulating housing, and a corresponding width of one or more base portions is narrower than a width of a corresponding surface of the signal conductor.

[0060] In some embodiments, the signal conductors are arranged in a plurality of rows, wherein the first ends are positioned to form a first interface, the second ends are positioned to form a second interface, and the first interface is angled relative to the second interface such that each row in the plurality of rows is a different length. The size of the opening within the group of signal conductors in a row can be determined based on the length of the group of signal conductors in the row.

[0061] In some embodiments, a method for manufacturing a module for an electrical connector is provided. The method may include positioning a central member of an insulating support between at least two conductors. Each of the at least two conductors includes a middle portion connecting a first end and a second end, the middle portion including two edges and two sides between the edges, the sides being wider than the edges. The central member may include first and second base portions that contact respective portions of the first and second conductors. The method may include positioning first and second covers of the insulating support adjacent to the first and second conductors, each of the first and second covers including a respective base portion that contacts respective sides of the conductors that do not contact the central member, wherein a portion of at least one surface of each conductor is exposed within an opening between the central member and one of the covers. The method may also include surrounding at least a portion of the covers and the central member with one or more reference conductors. In some embodiments, the base portion of the insulating support defines one or more openings in a dielectric material, and the method may also include positioning one or more edges of the conductors within the one or more openings. In some embodiments, the method also includes forming a sheet by at least partially positioning a plurality of lossy members so that each lossy member is electrically coupled to a plurality of reference conductors, and aligning the plurality of sheets. In some embodiments, the flakes are aligned in parallel.

[0062] The techniques for reducing dielectric loss as described herein can be applied to connectors having broadside-coupled pairs along all or part of their length. Such techniques can be applied to right-angle connectors or other connectors that include broadside-coupled differential pairs. Such techniques can also be applied to vertical connectors or other connectors that have edge-coupled differential pairs.

[0063] Figure 1 The figures show an electrical interconnect system in a form that can be used in an electronic system. In this example, the electrical interconnect system includes a right-angle connector and can be used, for example, to electrically connect a daughter card to a backplane. The figures show two mating connectors. In this example, connector 200 is designed to be attached to a backplane and connector 600 is designed to be attached to a daughter card. Figure 1 As can be seen in the diagram, the daughter card connector 600 includes contact tails 610 designed to be attached to a daughter card (not shown). The backplane connector 200 includes contact tails 210 designed to be attached to a backplane (not shown). These contact tails form one end of a conductive element that passes through the interconnect system. When the connector is mounted to a printed circuit board, these contact tails will be electrically connected to signal-carrying conductive structures within the printed circuit board or to a reference potential. In the example shown, the contact tails are press-fit "eye-of-the-needle" contacts, which are designed to be pressed into vias in the printed circuit board. However, other forms of contact tails may be used.

[0064] Each connector in the connector also has a mating interface where the connector can mate or unmate with another connector. The daughter card connector 600 includes a mating interface 620. The backplane connector 200 includes a mating interface 220. Although Figure 1 Not fully visible in the view shown in FIG, the mating contact portion of the conductive element is still exposed at the mating interface.

[0065] Each of these conductive elements includes an intermediate portion that connects the contact tail to the mating contact portion. The intermediate portion can be retained within the connector housing, and at least a portion of the connector housing can be dielectric to provide electrical isolation between the conductive elements. In addition, the connector housing can include conductive or lossy portions, which in some embodiments can provide conductive or partially conductive paths between some of the conductive elements. In some embodiments, the conductive portion can provide shielding. The lossy portion can also provide shielding in some cases and / or can provide desired electrical characteristics within the connector.

[0066] In various embodiments, the dielectric member can be molded or overmolded from a dielectric material such as plastic or nylon. Examples of suitable materials include, but are not limited to, liquid crystal polymer (LCP), polyphenylene sulfide (PPS), high-temperature nylon or polyphenylene oxide (PPO), or polypropylene (PP). Other suitable materials may be used, as aspects of the present disclosure are not limited in this regard.

[0067] All of the aforementioned materials are suitable for use as binder materials in connector manufacturing. According to some embodiments, one or more fillers may be included in some or all of the binder materials. As a non-limiting example, a thermoplastic PPS filled with 30% glass fiber by volume may be used to form the entire connector housing or the dielectric portion of the housing.

[0068] Alternatively or additionally, a portion of the housing can be formed from a conductive material such as processed metal or extruded metal powder. In some embodiments, a portion of the housing can be formed from metal or other conductive material and a dielectric member that separates the signal conductor from the conductive portion. In the illustrated embodiment, for example, the housing of backplane connector 200 can have a region formed from a conductive material and an insulating member that separates the intermediate portion of the signal conductor from the conductive portion of the housing.

[0069] The housing of the daughter card connector 600 may also be formed in any suitable manner. In the illustrated embodiment, the daughter card connector 600 may be formed from a plurality of subassemblies referred to herein as "sheets." Each sheet (700, Figure 7) can include a housing portion that can similarly include dielectric / lossy and / or conductive portions. One or more members can hold the sheets in a desired position. For example, support members 612 and 614 can respectively hold the top and back of multiple sheets in a side-by-side configuration. Support members 612 and 614 can be formed from any suitable material, such as sheet metal, stamped with tabs, openings, or other features that engage corresponding features on different sheets.

[0070] Other components that may form part of the connector housing may provide mechanical integrity to the daughter card connector 600 and / or hold the tabs in a desired position. For example, the front housing portion 640 ( Figure 6 ) can receive the portion of the sheet that forms the mating interface. Any or all of these portions of the connector housing can be dielectric, lossy and / or conductive to achieve the desired electrical characteristics of the interconnect system.

[0071] In some embodiments, each sheet may hold a column of conductive elements forming signal conductors. These signal conductors may be shaped and spaced to form single-ended signal conductors. However, in Figure 1 In the embodiment shown in , the signal conductors are shaped and spaced apart in pairs to provide differential signal conductors. Each of the columns may include or be bounded by a conductive element that functions as a ground conductor. It should be understood that the ground conductors need not be connected to ground, but are shaped to carry a reference potential, which may include ground voltage, a DC voltage, or other suitable reference potential. The "ground" or "reference" conductors may have a different shape than the signal conductors, which are configured to provide suitable signal transmission performance for high-frequency signals.

[0072] The conductive elements can be made of metal or any other material that is electrically conductive and provides suitable mechanical properties for conductive elements in electrical connectors. Phosphor bronze, beryllium copper, and other copper alloys are non-limiting examples of materials that can be used. The conductive elements can be formed from such materials in any suitable manner, including by stamping and / or forming.

[0073] The spacing between conductors of adjacent columns can be within a range that provides the desired density and desired signal integrity. As a non-limiting example, the conductors can be stamped from a 0.4 mm thick copper alloy, and the conductors within each column can be spaced 2.25 mm apart and the conductors within each column can be spaced 2.4 mm apart. However, higher density can be achieved by placing the conductors closer together. In other embodiments, for example, smaller sizes can be used to provide higher density, such as a thickness between 0.2 mm and 0.4 mm, or a spacing between conductors between columns or within a column of 0.7 mm to 1.85 mm. In addition, each column can include four pairs of signal conductors, so that Figure 1The interconnect system shown in achieves a density of 60 or more pairs per linear inch. However, it should be understood that higher density connectors can be achieved using more pairs per column, tighter spacing between pairs within a column, and / or smaller distances between columns.

[0074] The sheet can be formed in any suitable manner. In some embodiments, the sheet can be formed by stamping multiple columns of conductor elements from a metal sheet and overmolding a dielectric portion over the intermediate portions of the conductor elements. In other embodiments, the sheet can be assembled from modules, each module including a single single-ended signal conductor, a single pair of differential signal conductors, or any suitable number of single-ended or differential pairs.

[0075] Assembling the sheets from modules can help reduce "skew" of signal pairs at high frequencies, such as between about 25 GHz and 40 GHz or higher. In this context, skew refers to the difference in electrical propagation time between signal pairs operating as differential signals. Module structures designed to reduce skew are described, for example, in application Ser. No. 61 / 930,411, which is incorporated herein by reference.

[0076] According to the technology described in the application, in some embodiments, the connector can be formed from modules, each module carrying a signal pair. The modules can be individually shielded, such as by attaching a shielding member to the module and / or inserting the module into an organizer or other structure that can provide electrical shielding between multiple pairs and / or around the signal-carrying conductive elements.

[0077] In some embodiments, pairs of signal conductors within each module can be broadside coupled for a major portion of their length. Broadside coupling enables paired signal conductors to have the same physical length. To facilitate routing of signal traces within the connector footprint of a printed circuit board to which the connector is attached and / or construction of the mating interface of the connector, the signal conductors can be aligned in an edge-to-edge coupled manner in one or both of these regions. Thus, the signal conductors can include transition regions in which the coupling changes from edge-to-edge to broadside or vice versa. As described below, these transition regions can be designed to prevent mode conversion or suppress undesirable propagation modes that may interfere with the signal integrity of the interconnect system.

[0078] Modules can be assembled into sheets or other connector structures. In some embodiments, different modules can be formed for each row position of a pair of right-angle connectors. These modules can be manufactured to be used together to build connectors with as many rows as desired. For example, a module of one shape can be formed for a pair of conductive elements to be positioned at the shortest row of the connector (sometimes referred to as the ab row). A separate module can be formed for the conductive elements in the second longest row (sometimes referred to as the cd row). The interior of the module in the cd row can be designed to conform to the exterior of the module in the ab row.

[0079] This pattern can be repeated for any number of pairs. Each module can be shaped to be used with modules that carry multiple pairs of conductor elements in shorter and / or longer rows. To manufacture connectors of any suitable size, connector manufacturers can assemble multiple modules into a sheet to provide the desired number of pairs in the sheet. In this way, connector manufacturers can promote widely used connector sizes such as 2 pairs for connector series. When customer demand changes, connector manufacturers can obtain tools for each additional pair or obtain tools for modules that contain multiple pairs or multiple pairs of groups to produce larger-sized connectors. The tools used to produce modules for smaller connectors can be used to produce modules for shorter rows or even shorter rows of larger connectors. Figure 8 Such a modular connector is shown in .

[0080] Figure 2 Provided in Figure 1 Additional details of the construction of the interconnect system are shown with the backplane connector 200 partially cut away. Figure 2 In the embodiment shown in FIG, the front wall of the housing 222 is cut away to reveal the interior of the mating interface 220 .

[0081] In the illustrated embodiment, the backplane connector 200 also has a modular construction. A plurality of pin modules 300 are organized to form an array of conductive elements. Each of the pin modules 300 can be designed to mate with a module of the daughter card connector 600.

[0082] In the illustrated embodiment, four rows and eight columns of pin modules 300 are shown. With each pin module having two signal conductors, the four rows 230A, 230B, 230C, and 230D of pin modules create a total of four pairs or eight columns of signal conductors. However, it should be understood that the number of signal conductors per row or column is not a limitation of the present invention. A greater or smaller number of rows of pin modules can be included within the housing 222. Similarly, a greater or smaller number of columns can be included within the housing 222. Alternatively or additionally, the housing 222 can be viewed as a module of a backplane connector, and multiple such modules can be aligned edge to edge to extend the length of the backplane connector.

[0083] exist Figure 2 In the embodiment shown in FIG, each of the pin modules 300 includes conductive elements that serve as signal conductors. These signal conductors are held within an insulating member that may serve as part of the housing of the backplane connector 200. The insulating portion of the pin modules 300 may be positioned to separate the signal conductors from the rest of the housing 222. In this configuration, the rest of the housing 222 may be conductive or partially conductive, such as may result from the use of lossy materials.

[0084] In some embodiments, the housing 222 can include both conductive and lossy portions. For example, the shield, including the walls 226 and the base plate 228, can be extruded from powdered metal or formed from conductive material in any other suitable manner. The pin module 300 can be inserted into an opening in the base plate 228.

[0085] Lossy or conductive members may be positioned adjacent to adjacent rows 230A, 230B, 230C, and 230D of pin modules 300. Figure 2 In an embodiment, separators 224A, 224B, and 224C are shown between adjacent rows of pin modules. The separators 224A, 224B, and 224C can be conductive or lossy and can be formed as part of the same work or from the same components that form the walls 226 and the bottom plate 228. Alternatively, the separators 224A, 224B, and 224C can be inserted into the housing 222 separately after the walls 226 and the bottom plate 228 are formed. In embodiments where the separators 224A, 224B, and 224C are formed separately from the walls 226 and the bottom plate 228 and subsequently inserted into the housing 222, the separators 224A, 224B, and 224C can be formed of a different material than the walls 226 and / or the bottom plate 228. For example, in some embodiments, the walls 226 and the bottom plate 228 can be conductive while the separators 224A, 224B, and 224C can be lossy or partially lossy and partially conductive.

[0086] In some embodiments, other lossy or conductive members may extend perpendicular to the backplane 228 to the mating interface 220. Members 240 are shown adjacent to the endmost rows 230A and 230D. In contrast to the spacers 224A, 224B, and 224C extending across the mating interface 220, spacer members 240, having a width approximately equal to the width of a column, are positioned in a row adjacent to rows 230A and 230D. The daughter card connector 600 may include slots in its mating interface 620 for receiving the spacers 224A, 224B, and 224C. The daughter card connector 600 may include openings similarly adapted to receive the members 240. Members 240 may have similar electrical effects as the spacers 224A, 224B, and 224C, all of which may suppress resonance, crosstalk, or other undesirable electrical effects. Because member 240 fits into a smaller opening in daughter card connector 600 than dividers 224A, 224B, and 224C, member 240 can achieve greater mechanical integrity of the housing portion of daughter card connector 600 on the side where member 240 is received.

[0087] Figure 3 The pin modules 300 are shown in greater detail. In this embodiment, each pin module includes a pair of conductive elements serving as signal conductors 314A and 314B. Each of the signal conductors has a mating interface portion shaped as a pin. Opposite ends of the signal conductors have contact tails 316A and 316B. In this embodiment, the contact tails are shaped as press-fit, compliant sections. The middle portion of the signal conductors, connecting the contact tails to the mating contact portion, passes through the pin modules 300.

[0088] Conductive elements serving as reference conductors 320A and 320B are attached to opposing outer surfaces of the pin module 300. Each of the reference conductors has a contact tail 328 shaped for electrical connection to a via in a printed circuit board. The reference conductors also have a mating contact portion. In the illustrated embodiment, two types of mating contacts are shown. The compliant member 322 can serve as a mating contact portion that presses against the reference conductors in the daughter card connector 600. In some embodiments, surfaces 324 and 326 can alternatively or additionally serve as mating contacts, wherein a reference conductor of the mating conductor can press against the reference conductor 320A or 320B. However, in the illustrated embodiment, the reference conductors can be shaped so that electrical contact is made only at the compliant member 322.

[0089] Figure 4 An exploded view of the pin module 300 is shown. The intermediate portions of the signal conductors 314A and 314B are held within an insulating member 410, which may form part of the housing of the backplane connector 200. The insulating member 410 may be insert molded around the signal conductors 314A and 314B. The surface 412 against which the reference conductor 320B is pressed is Figure 4 is visible in the exploded view of . Similarly, Figure 4 Surface 428 of reference conductor 320A is seen, which is pressed against the member 410 at Figure 4 Invisible surfaces.

[0090] As can be seen, surface 428 is substantially complete. Surface 428 may have attachment features such as tabs 432 formed therein. Such tabs may engage openings ( Figure 4 4 (not visible in the view shown in FIG) to hold reference conductor 320A to insulating member 410. Similar connectors (not numbered) can be formed in reference conductor 320B. As shown, these connectors, which serve as an attachment mechanism, are centered between signal conductors 314A and 314B, where radiation from or affecting this pair of signal conductors is relatively low. Additionally, connectors such as 436 can be formed in reference conductors 320A and 320B. Connectors 436 can engage insulating member 410 to hold pin module 300 in the opening in base plate 228.

[0091] In the illustrated embodiment, compliant member 322 is not cut from the planar portion of reference conductor 320B that presses against surface 412 of insulating member 410. Instead, compliant member 322 is formed from a different portion of sheet metal and folded parallel to the planar portion of reference conductor 320B. In this manner, no opening is left in the planar portion of reference conductor 320B for forming compliant member 322. Furthermore, as shown, compliant member 322 has two compliant portions 424A and 424B that are joined together at their distal ends but separated by opening 426. This configuration provides the proper mating force to the mating contacts in the desired position without leaving an opening in the shield surrounding pin module 300. However, in some embodiments, a similar effect can be achieved by attaching separate compliant members to reference conductors 320A and 320B.

[0092] Reference conductors 320A and 320B can be secured to pin module 300 in any suitable manner. As noted above, connector 432 can engage opening 434 in the housing portion. Additionally or alternatively, straps or other features can be used to secure other portions of the reference conductors. As shown, each reference conductor includes straps 430A and 430B. Strap 430A includes connectors, while strap 430B includes openings adapted to receive these connectors. Here, reference conductors 320A and 320B have the same shape and can be manufactured using the same tooling, but are mounted on opposing surfaces of pin module 300. Thus, connector 430A of one reference conductor aligns with connector 430B of the opposing reference conductor, interlocking connectors 430A and 430B and securing the reference conductors in place. These connectors can engage openings 448 in the insulating member, which can further assist in securing the reference conductors in a desired orientation relative to signal conductors 314A and 314B in pin module 300.

[0093] Figure 4 Also shown is a tapered surface 450 of the insulating member 410. In this embodiment, the surface 450 tapers relative to the axis of the signal conductor pair formed by the signal conductors 314A and 314B. The surface 450 is tapered in that it approaches the axis of the signal conductor pair closer to the distal end of the mating contact portion and further away from the axis further away from the distal end. In the illustrated embodiment, the pin module 300 is symmetrical relative to the axis of the signal conductor pair, and the tapered surface 450 is formed adjacent to each of the signal conductors 314A and 314B.

[0094] According to some embodiments, some or all of the adjacent surfaces in the mating connector may be tapered. Figure 4 Not shown, the surface of the insulating portion of the daughter card connector 600 adjacent the tapered surface 450 may be tapered in a complementary manner so that the surface of the mating connector conforms to the surface of the connector when the connectors are in the designed mated position.

[0095] Tapered surfaces in the mating interface can avoid sudden changes in impedance depending on the connector separation. Therefore, other surfaces designed to be adjacent to the mating connector can be similarly tapered. Figure 4 Such a tapered surface 452 is shown. As shown, the tapered surface 452 is between the signal conductors 314A and 314B. The surfaces 450 and 452 cooperate to provide a taper on the insulation on both sides of the signal conductors.

[0096] Figure 5 There is shown further detail of the pin module 300. Here, the signal conductors are shown separated from the pin module. Figure 5The signal conductors are shown before being overmolded by the insulation or otherwise incorporated into the pin module 300. However, in some embodiments, the signal conductors may be overmolded by the insulation before being assembled into the module. Figure 5 The components are held together by carrier straps or other suitable support mechanisms not shown.

[0097] In the illustrated embodiment, signal conductors 314A and 314B are symmetrical about the axis 500 of the signal conductor pair. Each signal conductor has a mating contact portion 510A or 510B shaped as a pin. Each signal conductor also has an intermediate portion 512A or 512B and 514A and 514B. Here, different widths are provided to provide impedance matching with the mating connector and printed circuit board, despite each having different materials or construction techniques. A transition region as shown in the figure can be included to provide a gradual transition between regions of different widths. Contact tails 516A or 516B can also be included.

[0098] In the illustrated embodiment, the middle portions 512A, 512B, 514A, and 514B can be flat, with broadsides and narrower edges. In the illustrated embodiment, the signal conductor pairs are aligned edge to edge and are thus configured for edge coupling. In other embodiments, some or all of the signal conductor pairs can alternatively be broadside coupled.

[0099] The mating contact portion can be of any suitable shape, but in the illustrated embodiment it is cylindrical. The cylindrical portion can be formed by rolling a portion of a metal sheet into a tube or in any other suitable manner. Such a shape can be formed, for example, by stamping a shape from a metal sheet including a middle portion. A portion of the material can be rolled into a tube to provide the mating contact portion. Alternatively or additionally, a wire or other cylindrical element can be flattened to form the middle portion, leaving a cylindrical mating contact portion. One or more openings (not numbered) can be formed in the signal conductor. Such openings can ensure that the signal conductor is fixedly engaged with the insulating member 410.

[0100] Go to Figure 6 , which shows further details of daughter card connector 600 in a partially exploded view. As shown, connector 600 includes multiple tabs 700A held together in a side-by-side configuration. Here, eight tabs are shown, corresponding to the eight columns of pin modules in backplane connector 200. However, as with backplane connector 200, the size of the connector assembly can be configured by incorporating more rows per tab, more tabs per connector, or more connectors per interconnect system.

[0101] The conductive elements within the sheet 700A may include mating contact portions and contact tails. The contact tails 610 are shown extending from a surface of the connector 600 that is adapted to be mounted against a printed circuit board. In some embodiments, the contact tails 610 may pass through a member 630. The member 630 may include an insulating portion, a lossy portion, and / or a conductive portion. In some embodiments, the contact tails associated with the signal conductors may pass through the insulating portion of the member 630. The contact tails associated with the reference conductors may pass through the lossy portion or the conductive portion of the member 630. In some embodiments, the lossy portion or the conductive portion may be compliant so that these portions can conform to and press against the ground conductors within the connector and the ground pads on the printed circuit board to which the connector is mounted, thereby improving the shielding capabilities of the member 630 at the mounting interface of the connector.

[0102] The mating contact portions of the sheet 700A are retained in the front housing portion 640. The front housing portion can be made of any suitable material, which can be insulating, lossy, or conductive, or can include any suitable combination of such materials. For example, the front housing portion can be molded from a filled lossy material using similar materials and techniques as described above for the housing wall 226, or can be formed from a conductive material. As shown, the sheet is composed of modules 810A, 810B, 810C, and 810D ( Figure 8 ) are assembled into modules, each module having a pair of signal conductors surrounded by a reference conductor. In the illustrated embodiment, the front housing portion 640 has a plurality of passages, each passage being positioned to receive a pair of signal conductors and an associated reference conductor. However, it should be understood that each module may contain a single signal conductor or more than two signal conductors.

[0103] Figure 7 Thin slice 700 is shown. A plurality of such thin slices can be aligned side by side and held together by one or more support members or in any other suitable manner to form a daughter card connector. In the illustrated embodiment, thin slice 700 is formed by a plurality of modules 810A, 810B, 810C and 810D. The modules are aligned to form a row of mating contacts along one edge of thin slice 700 and a row of contacts along the other edge of thin slice 700. In the embodiment in which the thin slice is designed for use in a right-angle connector, these edges are vertical, as shown.

[0104] In the illustrated embodiment, each module includes a reference conductor that at least partially encloses the signal conductor. The reference conductor may similarly have a mating contact portion and a contact tail.

[0105] The modules can be held together in any suitable manner. For example, the modules can be held within a housing, which in the illustrated embodiment is formed by components 900A and 900B. Components 900A and 900B can be formed separately and then fastened together, retaining modules 810A…810D therein. Components 900A and 900B can be held together in any suitable manner, such as by attachment components that form an interference fit or a snap fit. Alternatively or additionally, adhesives, welding, or other attachment techniques can be used.

[0106] Components 900A and 900B can be formed from any suitable material. The material can be an insulating material. Alternatively or additionally, the material can be a lossy or conductive portion or can include a lossy or conductive portion. Components 900A and 900B can be formed, for example, by molding the material into a desired shape. Alternatively, components 900A and 900B can be formed in place around modules 810A...810D, such as by insert molding. In such an embodiment, components 900A and 900B do not need to be formed separately. Instead, the housing portion that holds modules 810A...810D can be formed in one operation.

[0107] Figure 8 Modules 810A...810D are shown without components 900A and 900B. In this view, the reference conductors are visible. Signal conductors ( Figure 8 The signal conductors (not visible in the figure) are enclosed within the reference conductor to form a waveguide structure. Each waveguide structure includes a contact tail region 820, a middle region 830, and a mating contact region 840. Within the mating contact region 840 and the contact tail region 820, the signal conductors are positioned edge-to-edge. Within the middle region 830, the signal conductors are positioned for broadside coupling. Transition regions 822 and 842 are configured to transition between edge-coupled and broadside-coupled orientations.

[0108] As described below, transition regions 822 and 842 in the reference conductor can correspond to transition regions in the signal conductor. In the illustrated embodiment, the reference conductor forms an enclosure around the signal conductor. In some embodiments, the transition region in the reference conductor can maintain a substantially uniform spacing between the signal conductor and the reference conductor throughout the length of the signal conductor. Thus, the enclosure formed by the reference conductor can have different widths in different regions.

[0109] The reference conductor provides shielding coverage along the length of the signal conductor. As shown, coverage is provided along substantially the entire length of the signal conductor, with coverage provided in the mating contact portion and the intermediate portion of the signal conductor. The contact tails are shown exposed so that they can contact the printed circuit board. However, in use, these mating contact portions will be adjacent to ground structures within the printed circuit board, thereby Figure 8 , does not compromise shield coverage along substantially the entire length of the signal conductor. In some embodiments, the mating contact portion may also be exposed for mating to another connector. Thus, in some embodiments, shield coverage may be provided in greater than 80%, 85%, 90%, or 95% of the middle portion of the signal conductor. Similarly, shield coverage may also be provided in the transition region such that shield coverage may be provided in greater than 80%, 85%, 90%, or 95% of the combined length of the middle portion and the transition region of the signal conductor. In some embodiments, the mating contact region and some or all of the mating contacts may also be shielded such that shield coverage may be provided in various embodiments for greater than 80%, 85%, 90%, or 95% of the length of the signal conductor.

[0110] In the illustrated embodiment, the waveguide-like structure formed by the reference conductor has a wide dimension in the column direction of the connector in the contact tail region 820 and the mating contact region 840 to accommodate the wide dimension of the signal conductors arranged side by side in the column direction in these regions. In the illustrated embodiment, the contact tail region 820 and the mating contact region 840 of the signal conductor are separated by a distance that aligns them with contact structures on a printed circuit board to which the connector is to be attached or with mating contacts of a mating connector.

[0111] These spacing requirements mean that the waveguides are wider in the column dimension than in the lateral direction, thereby providing that the waveguides in these regions may have an aspect ratio of at least 2: 1 and in some embodiments may be about at least 3: 1. In contrast, in the intermediate region 830, the signal conductors are oriented with the wide dimension of the signal conductors overlapping along the column direction, resulting in a waveguide aspect ratio that may be less than 2: 1 and in some embodiments may be less than 1.5: 1 or about 1: 1.

[0112] Due to this smaller aspect ratio, the maximum dimension of the waveguide in the middle region 830 will be smaller than the maximum dimension of the waveguide in regions 830 and 840. Since the lowest frequency of waveguide propagation is inversely proportional to the length of its shortest dimension, the lowest frequency mode of propagation that can be excited in the middle region 830 is higher than the frequency modes that can be excited in the contact tail region 820 and the mating contact region 840. The lowest frequency mode that can be excited in the transition region will be somewhere in between. Since the transition from edge coupling to broadside coupling has the potential to excite undesirable waveguide modes, signal integrity can be improved when these modes are at frequencies higher than, or at least as high as possible, than the expected operating range of the connector.

[0113] These regions can be configured to avoid mode conversion at the transition between the coupling regions, which could excite undesirable signals propagating through the waveguide. For example, as shown below, the signal conductor can be shaped so that the transition occurs in the intermediate region 830 or in the transition regions 822 and 842, or partially in both. Additionally or alternatively, the module can be configured to suppress the excitation of undesirable modes in the waveguide formed by the reference conductor, as described in more detail below.

[0114] Although the reference conductors can substantially enclose each pair of signal conductors, the enclosure is not required to be open. Thus, in an embodiment shaped to provide a rectangular shield, the reference conductors in the middle region can be aligned with at least a portion of all four sides of the signal conductors. The reference conductors can be combined to provide, for example, 360-degree coverage around a pair of signal conductors. Such coverage can be provided, for example, by overlapping or physically contacting the reference conductors. In the illustrated embodiment, the reference conductors are U-shaped shells and together form the enclosure.

[0115] Regardless of the shape of the reference conductor, three hundred and sixty degrees of coverage can be provided. For example, such coverage can be provided with a circular or elliptical reference conductor, or any other suitable shape. However, it is not required that the coverage be complete. The coverage can, for example, have an angular range between approximately 270 and 365 degrees. In some embodiments, the coverage can be between approximately 340 and 360 degrees. Such coverage can be achieved, for example, by slots or other openings in the reference conductor.

[0116] In some embodiments, the shield coverage can be different in different regions. In the transition region, the shield coverage can be greater than in the intermediate region. In some embodiments, due to direct contact or even overlap in the reference conductors in the transition region, the shield coverage can have an angular range greater than 355 degrees, or even in some embodiments, 360 degrees, even though less shield coverage is provided in the transition region.

[0117] Completely enclosing a signal pair within a reference conductor in a central region can have undesirable effects on signal integrity, particularly when used in conjunction with the transition between edge coupling and broadside coupling within a module. The reference conductors surrounding the signal pair can form a waveguide. Signals on the pair of signal conductors, and particularly within the transition region between edge coupling and broadside coupling, can cause energy in a differential propagation mode between the edges to excite signals that can propagate within the waveguide. In accordance with some embodiments, one or more techniques can be used to avoid excitation of these undesirable modes or to suppress them if they are excited.

[0118] Some techniques that can be used to increase frequency can excite undesirable modes. In the illustrated embodiment, the reference conductor can be shaped to leave an opening 832. These openings can be in the narrow wall of the enclosure. However, in the embodiment where there is a wide wall, the opening can be in the wide wall. In the illustrated embodiment, the opening 832 extends parallel to the middle portion of the signal conductor and is located between the signal conductors forming a pair. These slots reduce the angular range of the shielding so that near the middle portion of the signal conductor coupled through the broadside, the angular range of the shielding can be less than 360 degrees. The angular range can be, for example, within the range of 355 degrees or less. In the embodiment where components 900A and 900B are formed by overmolding lossy material on the module, the lossy material can be allowed to fill the opening 832 when extending into the interior of the waveguide or when not entering the interior of the waveguide, which can suppress the propagation of undesirable signal propagation modes that can reduce signal integrity.

[0119] exist Figure 8 In the embodiment shown in FIG, the opening 832 is slot-shaped, effectively dividing the shield in the middle region 830 into two parts. The lowest frequency that can be excited in the structure used as a waveguide - as shown in FIG Figure 8 The effect of the reference conductor substantially surrounding the signal conductor is shown in FIG—inversely proportional to the size of the side surface. In some embodiments, the lowest frequency waveguide mode that can be excited is a TEM mode. By effectively shortening the side surface by incorporating the slit-like opening 832, the frequency of the TEM mode that can be excited is increased. A higher resonant frequency can mean that less energy within the operating frequency range of the connector is coupled into undesired propagation within the waveguide formed by the reference conductor, which improves signal integrity.

[0120] In region 830, a pair of signal conductors are broadside coupled, and openings 832 with or without lossy material therein can suppress the TEM common propagation mode. While not being bound by any particular theory of operation, the inventors theorize that openings 832, incorporating the edge-coupled to broadside-coupled transition, help provide a balanced connector suitable for high-frequency operation.

[0121] Figure 9Component 900 is shown, which may be representative of components 900A or 900B. As can be seen, component 900 is formed with channels 910A...910D shaped to receive Figure 8 Modules 810A...810D are shown in FIG. With the modules positioned in the channel, component 900A can be secured to component 900B. In the illustrated embodiment, components 900A and 900B can be attached by having a post, such as post 920, in one component pass through a hole, such as hole 930, in the other component. The post can be welded or otherwise secured in the hole. However, any suitable attachment mechanism can be used.

[0122] Components 900A and 900B can be molded from or include lossy materials. These and other "lossy" structures can use any suitable lossy material. Materials that are electrically conductive but have some loss, or that attract electromagnetic energy through another physical mechanism within the frequency range of interest, are generally referred to herein as "lossy" materials. Electrically lossy materials can be formed from lossy dielectric materials and / or weakly conductive materials and / or lossy magnetic materials. Magnetic lossy materials can, for example, be formed from materials traditionally considered ferromagnetic, such as those having a magnetic loss factor greater than approximately 0.05 within the frequency range of interest. The "magnetic loss factor" is the ratio of the imaginary part to the real part of a material's complex electromagnetic constant. Actual magnetic lossy materials or mixtures containing magnetic lossy materials can also exhibit useful amounts of dielectric loss or conductive loss effects within a portion of the frequency range of interest. Electrically lossy materials can be formed from materials traditionally considered dielectric materials, such as those having an electrical loss factor greater than approximately 0.05 within the frequency range of interest. The "electrical loss factor" is the ratio of the imaginary part to the real part of a material's complex dielectric constant. Electrically lossy materials may also be formed from materials that are generally considered conductors but are relatively poor conductors in the frequency range of interest, containing substantially dispersed conductive particles or regions that do not provide high electrical conductivity or are otherwise prepared with properties that result in relatively poor bulk electrical conductivity in the frequency range of interest compared to good conductors such as copper.

[0123] Electrically lossy materials typically have a bulk conductivity of about 1 Siemens / meter to about 10,000 Siemens / meter, and preferably about 1 Siemens / meter to about 5,000 Siemens / meter. In some embodiments, materials with a bulk conductivity between about 10 Siemens / meter and about 200 Siemens / meter may be used. As a specific example, a material with a conductivity of about 50 Siemens / meter may be used. However, it should be understood that the conductivity of the material can be selected empirically or through electrical simulation using known simulation tools to determine an appropriate conductivity that provides suitably low crosstalk and suitably low signal path attenuation or insertion loss.

[0124] The electrically lossy material can be a partially conductive material such as a material having a surface resistivity between 1 Ω / square and 100,000 Ω / square. In some embodiments, the electrically lossy material has a surface resistivity between 10 Ω / square and 1000 Ω / square. As a specific example, the material can have a surface resistivity between approximately 20 Ω / square and 80 Ω / square.

[0125] In some embodiments, the lossy material is formed by adding a filler containing conductive particles to an adhesive. In such embodiments, the lossy member can be formed by molding or otherwise shaping the filler-containing adhesive into the desired shape. Examples of conductive particles that can be used as fillers to form the lossy material include carbon or graphite formed into fibers, flakes, nanoparticles, or other types of particles. Metals or other particles in powder, flake, or fiber form can also be used to provide appropriate lossy properties. Alternatively, a combination of fillers can be used. For example, a metal coated with carbon particles can be used. Silver and nickel are suitable metals for fiber coating. Coated particles can be used alone or in combination with other fillers, such as carbon flakes. The adhesive or matrix can be any material that will be placed, cured, or can be used to position the filler material. In some embodiments, the adhesive can be a thermoplastic material, which is traditionally used as part of the manufacturing of electrical connectors to facilitate molding the lossy material into the desired shape and position. Examples of such materials include liquid crystal polymer (LCP) and nylon. However, many alternative adhesive materials can be used. Curable materials such as epoxy resin can be used as the adhesive. Alternatively, materials such as thermosetting resins or adhesives may be used.

[0126] Furthermore, while the aforementioned binder material can be used to create an electrically lossy material by forming a binder around a conductive particulate filler, the present invention is not limited thereto. For example, the conductive particles can be impregnated into the formed matrix material or coated onto the formed matrix material, such as by applying a conductive coating to a plastic or metal part. As used herein, the term "binder" encompasses materials that encapsulate, are impregnated with, or otherwise serve to retain a filler.

[0127] Preferably, the filler will be present in a sufficient volume percentage to allow for the creation of a conductive path from particle to particle. For example, when metal fibers are used, the fibers may be present in a volume percentage of about 3% to 40%. The amount of filler will affect the conductive properties of the material.

[0128] Filling materials are commercially available, for example from Celanese under the trade name Materials sold as such, which may be filled with carbon fibers or stainless steel filaments. Adhesive preforms filled with lossy conductive carbon, such as the lossy materials sold by Techfilm of Billerica, Massachusetts, USA, may also be used. Such preforms may include an epoxy adhesive filled with carbon fibers and / or other carbon particles. The adhesive surrounds the carbon particles, which may serve as reinforcement for the preform. Such preforms may be inserted into connector sheets to form all or part of a housing. In some embodiments, the preforms may be adhered by an adhesive in the preform, which may be cured during a heat treatment process. In some embodiments, the adhesive may take the form of a separate conductive or non-conductive adhesive layer. In some embodiments, the adhesive in the preform may be used alternatively or additionally to secure one or more conductive elements, such as a foil, to the lossy material.

[0129] Various forms of reinforcing fibers can be used, either woven or non-woven, coated or uncoated. Non-woven carbon fiber is one suitable material. Other suitable materials such as custom blends sold by RTP Company may be used, as the invention is not limited in this respect.

[0130] In some embodiments, the lossy member can be manufactured by stamping a preform or a thin sheet of lossy material. For example, the insert can be formed by stamping an appropriate opening pattern from a preform as described above. However, other materials can be used instead of or in addition to such a preform. For example, a sheet of ferromagnetic material can be used.

[0131] However, lossy materials can also be formed in other ways. In some embodiments, the lossy member can be formed by interweaving layers of lossy and conductive materials, such as metal foil. The layers can be rigidly attached to each other, such as by using epoxy or other adhesives, or can be held together in any other suitable manner. The layers can be in the desired shape before being fastened together or can be stamped or otherwise formed after they are held together.

[0132] Figure 10 1000. Module 1000 may be representative of any module in a connector, such as Figure 7 and Figure 8 810D shown in FIG. Each module in modules 810A...810D can have the same overall structure, and some parts can be the same for all modules. For example, the contact tail area 820 and the mating contact area 840 can be the same for all modules. Each module can include a middle area 830, but the length and shape of the middle area 830 can vary depending on the location of the module in the sheet.

[0133] In the illustrated embodiment, the module 1000 includes a pair of signal conductors 1310A and 1310B ( Figure 13 ). Insulating housing portion 1100 is at least partially enclosed by reference conductors 1010A and 1010B. This subassembly can be held together in any suitable manner. For example, reference conductors 1010A and 1010B can have features that engage one another. Alternatively or additionally, reference conductors 1010A and 1010B can have features that engage insulating housing portion 1100. As another example, when components 900A and 900B are as shown, Figure 7 The reference conductor can be held in place when fastened together as shown in FIG.

[0134] Figure 10 The exploded view of FIG1 shows that the mating contact area 840 includes sub-areas 1040 and 1042. Sub-area 1040 includes the mating contact portion of module 1000. When mated with pin module 300, the mating contact portion of the pin module will enter sub-area 1040 and engage the mating contact portion of module 1000. These components can be sized to support a "functional mating range" such that if modules 300 and 1000 are fully pressed together, the mating contact portion of module 1000 will slide along the pin from pin module 300 a distance of the "functional mating range" during mating.

[0135] The impedance of the signal conductors in sub-region 1040 will be primarily determined by the structure of module 1000. The separation of the signal conductors and the separation of the signal conductors from reference conductors 1010A and 1010B will set the impedance. The dielectric constant of the material surrounding the signal conductors (in this embodiment, air) will also affect the impedance. According to some embodiments, the design parameters of module 1000 can be selected to provide a nominal impedance within region 1040. The impedance can be designed to match the impedance of the rest of module 1000, and in turn can be selected to match the impedance of the printed circuit board or other parts of the interconnect system so that the connector does not create an impedance discontinuity.

[0136] If modules 300 and 1000 are in their standard mated position, which in this embodiment are fully pressed together, the pins will be located within the mating contacts of the signal conductors of module 1000. The impedance of the signal conductors in sub-region 1040 will still be driven primarily by the configuration of sub-region 1040, thereby providing an impedance matching the rest of module 1000.

[0137] There may be a sub-area 340 ( Figure 3In sub-region 340, the impedance of the signal conductors will be determined by the configuration of pin module 300. The impedance will be determined by the separation of signal conductors 314A and 314B, and the separation of signal conductors 314A and 314B from reference conductors 320A and 320B. The dielectric constant of insulating portion 410 will also affect the impedance. Therefore, these parameters can be selected to provide an impedance within sub-region 340 that can be designed to match the nominal impedance in sub-region 1040.

[0138] The impedance in sub-regions 340 and 1040, determined by the module's construction, is largely independent of any separation between the modules during mating. However, modules 300 and 1000 have sub-regions 342 and 1042, respectively, that interact with components of the mating module and can affect impedance. Because the positioning of these components affects impedance, impedance can vary depending on the separation of the mating modules. In some embodiments, these components are positioned to minimize changes in impedance regardless of separation distance, or to minimize the impact of impedance changes by distributing the impedance changes across the mating area.

[0139] When pin module 300 is fully pressed against module 1000, the components in sub-areas 342 and 1042 can combine to provide the rated mating impedance. Because the modules are designed to provide a functional mating range, the signal conductors within pin module 300 and module 1000 can still mate even when the modules are separated by an amount equal to the functional mating range. However, the separation between the modules may cause the impedance at one or more locations along the signal conductors in the mating area to change relative to the rated value. Appropriate shaping and positioning of these components can reduce this change or reduce the effect of the change by distributing the change over portions of the mating area.

[0140] exist Figure 3 and Figure 10 In the embodiment shown in FIG, sub-region 1042 is designed to overlap pin module 300 when module 1000 is fully pressed against pin module 300. Protruding insulating members 1042A and 1042B are sized to fit within spaces 342A and 342B, respectively. With the modules pressed together, distal ends of insulating members 1042A and 1042B abut against surfaces 450 ( Figure 4). These distal ends can have a shape that is complementary to the tapered portion of surface 450 so that insulating members 1042A and 1042B fill spaces 342A and 342B, respectively. The overlap creates a relative position for the signal conductor, the dielectric, and the reference conductor, which can be proximate to structures within sub-region 340. These components can be sized to provide the same impedance as the impedance in sub-region 340 when modules 300 and 1000 are fully pressed together. When the modules are fully pressed together (in this example, the modules are in the standard mating position), the signal conductors will have the same impedance throughout the mating area consisting of sub-regions 340, 1040, and where sub-regions 342 and 1042 overlap.

[0141] These components may also be sized and may have material properties that provide impedance control based on the separation of modules 300 and 1000. Impedance control may be achieved by providing substantially the same impedance in sub-regions 342 and 1042, even if the sub-regions do not completely overlap, or by providing a gradual impedance transition regardless of how the modules are separated.

[0142] In the illustrated embodiment, impedance control is provided in part by protruding insulating members 1042A and 1042B, which completely or partially overlap module 300, depending on the separation between modules 300 and 1000. These protruding insulating members can reduce the magnitude of changes in the relative dielectric constant of the material surrounding the pins from pin module 300. Impedance control is also provided by protrusions 1020A and 1022A, and 1020B and 1022B, in reference conductors 1010A and 1010B. These protrusions affect the separation between portions of the signal conductor pair and reference conductors 1010A and 1010B in a direction perpendicular to the axis of the signal conductor pair. This separation, combined with other features such as the width of the signal conductors in these portions, can control the impedance of these portions so that it is close to the rated impedance of the connector or does not change abruptly in a manner that could cause signal reflections. Other parameters of either or both mating modules can be configured for such impedance control.

[0143] Go to Figure 11 , further details of exemplary components of module 1000 are shown. Figure 11FIG1 is an exploded view of module 1000, excluding reference conductors 1010A and 1010B. In the illustrated embodiment, insulating housing portion 1100 is made of multiple components that cooperate to secure the position of signal conductors. Central member 1110 can be molded from an insulating material. In the illustrated embodiment, central member 1110 includes two recesses 1212A and 1212B into which conductive elements 1310A and 1310B, which form a pair of signal conductors in the illustrated embodiment, can be inserted.

[0144] Covers 1112 and 1114 can be attached to opposite sides of the central member 1110. Covers 1112 and 1114 can help retain the conductive elements 1310A and 1310B within the recesses 1212A and 1212B and with controlled separation from the reference conductors 1010A and 1010B. In the illustrated embodiment, covers 1112 and 1114 can be formed from the same material as the central member 1110. However, the materials are not required to be the same, and in some embodiments, different materials can be used to provide different relative permittivities in different regions to provide a desired impedance for the signal conductors.

[0145] In the illustrated embodiment, grooves 1212A and 1212B are configured to maintain a pair of signal conductors edge-coupled at the contact tail and mating contact portion. Within the main portion of the middle portion of the signal conductor, the pair of signal conductors remains broadside coupled. To transition between edge coupling at both ends of the signal conductor and broadside coupling in the middle portion, a transition region can be included in the signal conductor. The grooves in the central member 1110 can be shaped to provide transition regions in the signal conductor. Protrusions 1122, 1124, 1126, and 1128 on the covers 1112 and 1114 can press the conductive elements against the central portion 1110 in these transition regions.

[0146] exist Figure 11 In the embodiment shown in FIG, the transition between broadside coupling and edge coupling can be seen in region 1150. At one end of this region, the signal conductors are aligned edge-to-edge in the column direction in a plane parallel to the column direction. Turning region 1150 sideways toward the middle, the signal conductors bend in opposite directions perpendicular to the plane and toward each other in a direction parallel to the plane. Thus, at the ends of region 1150, the signal conductors are in different planes parallel to the column direction. The middle portions of the signal conductors are aligned in a direction perpendicular to these planes.

[0147] Region 1150 includes a transition region such as 822 or 842 where the waveguide is formed by the reference conductor transitioning from the widest dimension of the middle portion to the narrower dimension plus a portion of the narrower middle region 830. Thus, at least a portion of the waveguide formed by the reference conductor in region 1150 has the same widest dimension W as in the middle region 830. Having at least a portion of the waveguide having a physical transition in the narrower portion reduces energy coupling into undesired waveguide propagation modes.

[0148] Having full 360 degree shielding for the signal conductors in region 1150 can also reduce energy coupling into undesired waveguide propagation modes. Thus, in the illustrated embodiment, the opening 832 does not extend into region 1150.

[0149] Figure 12 Further details of module 1000 are shown. In this view, conductive elements 1310A and 1310B are shown separated from central member 1110. For clarity, covers 1112 and 1114 are not shown. In this view, transition region 1312A between contact tail 1330A and middle portion 1314A is visible. Similarly, transition region 1316A between middle portion 1314A and mating contact portion 1318A is also visible. Similar transition regions 1312B and 1316B are visible for conductive element 1310B, allowing for edge coupling at contact tail 1330B and mating contact portion 1318B, as well as broadside coupling at middle portion 1314B.

[0150] The mating contacts 1318A and 1318B can be formed from the same metal sheet as the conductive elements. However, it should be understood that in some embodiments, the conductive elements can be formed by attaching separate mating contacts to other conductors to form an intermediate portion. For example, in some embodiments, the intermediate portion can be a cable, and the conductive elements are formed by terminating the cable with the mating contacts.

[0151] In the illustrated embodiment, the mating contact portion is tubular. This shape can be formed by stamping the conductive element from sheet metal and then rolling the mating contact portion into the tubular shape. The outer circumference of the tube can be large enough to accommodate the pins of the mating pin module, but can fit snugly around the pins. The tube can be divided into two or more sections to form a compliant beam. Figure 12 Two such beams are shown in FIG. A ridge or other protrusion may be formed in the distal portion of the beam to create a contact surface. These contact surfaces may be coated with gold or other conductive, ductile material to improve the reliability of the electrical contact.

[0152] When conductive elements 1310A and 1310B are installed in central member 1110, mating contact portions 1318A and 1318B fit within openings 1220A and 1220B. The mating contact portions are separated by wall 1230. Distal ends 1320A and 1320B of mating contact portions 1318A and 1318B can be aligned with openings in platform 1232, such as opening 1222B. These openings can be positioned to receive pins from mating pin module 300. Wall 1230, platform 1232, and insulating protruding members 1042A and 1042B can be formed as part of portion 1110, such as in a single molding operation. However, any suitable technique can be used to form these components.

[0153] Figure 12 Other techniques are shown as an alternative or in addition to the above techniques for reducing the energy propagating in undesired modes within the waveguide formed by the reference conductor in the transition region 1150. Conductive or lossy materials can be incorporated into each module to reduce the excitation of undesired modes or suppress undesired modes. Figure 12 For example, loss region 1215 is shown. Loss region 1215 can be configured to drop along the centerline between signal conductors 1310A and 1310B in some or all regions 1150. Because signal conductors 1310A and 1310B bend in different directions through this region to perform the edge-to-broadside transition, loss region 1215 may not be defined by a surface that is parallel or perpendicular to the wall of the waveguide formed by the reference conductor. Instead, it can be contoured to provide a surface that is equidistant from the edges of signal conductors 1310A and 1310B as the signal conductors twist through region 1150. In some embodiments, loss region 1215 can be electrically connected to the reference conductor. However, in other embodiments, loss region 1215 can be floating.

[0154] Although shown as lossy region 1215, similarly positioned conductive regions can also reduce energy coupling into undesirable waveguide modes that reduce signal integrity. In some embodiments, such a conductive region having a twist through region 1150 can be connected to a reference conductor. While not being limited to any particular theory of operation, a conductor that acts as a separation between signal conductors and thereby twists to follow the twist of the signal conductor in the transition region can couple ground currents into the waveguide, thereby reducing undesirable modes. For example, current can be coupled to flow in a different mode through the walls of the reference conductor parallel to the broadside-coupled signal conductor, rather than exciting a common mode.

[0155] Figure 13The positioning of conductive members 1310A and 1310B forming signal conductor pair 1300 is shown in greater detail. In the illustrated embodiment, conductive members 1310A and 1310B each have an edge and a broadside located between these edges. Contact tails 1330A and 1330B are aligned in column 1340. With this alignment, the edges of conductive elements 1310A and 1310B face each other at contact tails 1330A and 1330B. Other modules in the same wafer will similarly have contact tails aligned along column 1340. Contact tails of adjacent wafers will be aligned in parallel columns. The spaces between the parallel columns create routing channels on the printed circuit board to which the connector is attached. Mating contact portions 1318A and 1318B are aligned along column 1344. Although the mating contact portions are tubular, the portions of conductive elements 1310A and 1310B to which they are attached are edge-coupled. Thus, the mating contact portions 1318A and 1318B can similarly be referred to as being edge coupled.

[0156] In contrast, the middle portions 1314A and 1314B are aligned with their broad sides facing each other. The middle portions are aligned in the direction of row 1342. Figure 13 In the example of FIG. 1 , the conductive elements for a right angle connector are shown as being bent at a right angle between column 1340, which represents the point of attachment to the daughter card, and column 1344, which represents the location of the mating pins for attachment to the backplane connector.

[0157] In conventional right-angle connectors where edge-coupled pairs are used in wafers, the conductive elements in the outer row at the daughter card are longer within each pair. Figure 13 In the example, conductive element 1310B is attached to the outer rows of the daughter card. However, because the middle sections are coupled broadside, middle sections 1314A and 1314B are parallel throughout the right-angled portion of the connector, leaving no conductive elements in the outer rows. Consequently, no skew is introduced due to different electrical path lengths.

[0158] In addition, Figure 13, other techniques for reducing skew are described. Although contact tails 1330B of conductive element 1310B are located in an outer row along column 1340, the mating contact portions of conductive element 1310B (mating contact portions 1318B) are located in a shorter inner row along column 1344. Conversely, contact tails 1330A of conductive element 1310A are located in an inner row along column 1340, but mating contact portions 1318A of conductive element 1310A are located in an outer row along column 1344. Thus, the longer path length of the signal moving closer to contact tails 1330B relative to 1330A is offset by the shorter path length of the signal moving closer to mating contact portions 1318A relative to mating contact portions 1318B. Thus, the illustrated techniques can further reduce skew.

[0159] Figure 14A and Figure 14B Edge coupling and broadside coupling within the same pair of signal conductors are shown. Figure 14A This is a side view shown along the direction of row 1342. Figure 14B is an end view shown along the direction of column 1344. Figure 14A and Figure 14B The transition between the edge-coupled mating contact portions and contact tails and the broadside-coupled intermediate portions is shown.

[0160] Other details of the mating contact portions 1318A and 1318B are also visible. The tubular portion of the mating contact portion 1318A is Figure 14A The tubular portion of the mating contact portion 1318B is visible in the view shown and is Figure 14B The beams, of which beams 1420 and 1422 in the mating contact portion 1318B are numbered, are also visible.

[0161] The inventors have recognized and understood that high-frequency signals carried on signal conductors (e.g., 1314A and 1314B) can cause unevenly distributed electric fields. In addition, when the electric field interacts with the dielectric material supporting the signal conductors, high-frequency signals such as 14 GHz, 24 GHz, or 40 GHz can experience considerable dielectric losses. This dielectric loss can be alleviated by removing dielectric material near the signal conductors. In particular, a portion of the signal conductor may be close to an area of ​​higher electric field strength, which will result in higher dielectric losses. These portions of the signal conductor can be suspended in one or more openings in the dielectric material. The opening can be defined by one or more pedestals in the dielectric material coupled to the signal conductor and / or adjacent to one or more pedestals in the dielectric material coupled to the signal conductor.

[0162] Figure 15 is a cross-sectional view of the pair 1550 of signal conductors 1314A and 1314B. Figure 15The equipotential lines (e.g., 1552A and 1552B) are shown when the pair of signal conductors is excited by a low voltage differential signal, such as a 50 mV signal. Each equipotential line shows a point having the same potential as the other points identified by the same line. For clarity, not all equipotential lines are labeled.

[0163] The electric field strength surrounding any one of the signal conductors 1314A and 1314B is proportional to the slope of the equipotential lines, for example, the closer the equipotential lines are, the stronger the electric field is. The inventors have recognized and understood that the electric field associated with the propagation of the differential signal through the signal conductor pair may result in dielectric losses greater than the dielectric losses recognized so far. Dielectric losses are caused by the interaction of the electric field with the molecules of the dielectric that are close to the signal conductors 1314A and 1314B. Although not bound by any particular theory of operation, it is believed that the electric field can polarize the molecules of the dielectric, thereby aligning these molecules with the electric field. As the signal carried on the signal conductors 1314A and 1314B oscillates, the electric field changes accordingly, requiring the molecules of the dielectric to rotate to remain aligned with the electric field. The molecular motion required for the molecules of the dielectric to remain aligned with the electric field generated by the signal can result in energy loss. Since this energy is provided by the signal intended to propagate through the signal conductors 1314A and 1314B, this dielectric loss is converted into signal loss (or attenuation).

[0164] The inventors have devised a design that reduces this signal loss by removing dielectric material from the areas around the signal conductors 1314A and 1314B where the electric field is strongest and therefore will have the greatest dielectric loss. Figure 15 In the illustrative embodiment, regions 1556A and 1556B have a stronger electric field than regions 1554A and 1554B. Without being bound by any particular theory of operation, this is believed to be due to the geometry of signal conductor 1314A, as the magnitude of the electric field at a point is determined in part by the charge distribution around signal conductor 1314A and the distance between that point and the charge distribution. Configuring the dielectric material to include openings adjacent to regions 1556A and 1556B can significantly reduce dielectric losses.

[0165] It should be understood that the electric field around signal conductor 1314B mirrors the electric field around signal conductor 1314A, and for clarity, the labeling of the higher electric field region around signal conductor 1314B has been omitted. In addition, signal conductors 1314A and 1314B are shown in a broadside arrangement, but any suitable arrangement of signal conductors (e.g., edge coupling) may be used. In other arrangements, the high electric field region may have a substantially uniform distribution relative to the signal conductors. Figure 15 Therefore, the location of the area where the opening is provided in the insulating housing may be different from 16A to 16C as well as Figures 17 and 18. In some embodiments, the electric field strength may be significantly affected by the interaction between the fields of two or more signal conductors. It should also be understood that signal conductors having rectangular cross-sections are shown, but other suitable conductor geometries may be utilized and associated with regions of electric field strength variation other than those shown and described.

[0166] Figure 16A is a cross-sectional view through a connector module 1660 configured to reduce dielectric losses, according to an illustrative embodiment of the present invention. Figure 8 The cross section is taken at the position indicated by line 16-16 in FIG. Figure 16A As shown, the cross section may be through the middle of the signal conductor where the signal conductors are coupled broadside. However, the cross section of the signal module may be uniform along substantially the entire length of the signal conductor within the module. Thus, the connector module may have a cross section such as Figure 16A In some embodiments, the cross-section is greater than 90% or greater than 95% of the length of the signal conductor within the module.

[0167] In the illustrated embodiment, module 1660 can differ from module 810A in that module 1660 is arranged to reduce dielectric losses in signal conductors 1314A and 1314B by providing openings 1665A to 1665D around areas of relatively strong electric fields. This configuration can be provided by replacing the central member 1110 and covers 1112 and 1114 in each wafer module in the connector with insulating members as described below. Module 1660 can also be configured similarly to, and used in, connectors having any or all of the features described herein.

[0168] The signal conductors 1314A and 1314B may be any suitable signal conductors, such as those described in other aspects of this disclosure. Figure 8 and Figures 10 to 15 However, in some embodiments, the dielectric openings around the signal conductors enable the use of larger signal conductors 1314A and 1314B without changing the overall impedance of the signal conductors in the module, which reduces signal losses in the conductors. In the illustrative embodiment, the signal conductors 1314A and 1314B are broadside coupled, but any suitable coupling or arrangement may be used. The signal conductors 1314A and 1314B may carry any suitable differential and / or high frequency signals, thereby producing, for example, a signal as described with reference to FIG. Figure 15 The electric potential and electric field in question.

[0169] Openings 1665A to 1665D represent spaces formed by insulating support members (e.g., 1661 and 1667A and 1667B), which can be filled with air or other materials having a lower dielectric loss than the insulating material forming the insulating members. It has been found that having air gaps around the ends of the signal conductors 1314A and 1314B where the electric field caused by the signal is strongest effectively limits dielectric losses while providing sufficient support to stably hold the signal conductors 1314A and 1314B. For example, the selective positioning of openings 1665A to 1665D based on areas of higher electric field strength caused by a 40 GHz low voltage (e.g., 50 mV) differential signal can prevent dielectric losses of 0.5 dB, 1 dB, 3 dB, 5 dB, or more that would occur if the openings 1665A to 1665D were filled with the material of the central member 1661 and / or the covers 1667A and 1667B. In other embodiments or at other frequencies, such as 14 GHz, the losses with openings can be 10% to 15% less than the losses without openings. The openings 1665A to 1665D can be sized proportionally to the conductor and have a square, rectangular, circular, or any other suitable geometric shape. For example, the openings 1665A to 1665D can be substantially square with a side that is twice, three times, four times, five times, or more times the thickness of the conductor. The openings can be sized relative to the size of the electric field, for example to remove material from areas where the electric field strength is above a threshold. In some embodiments, the openings 1665A to 1665D can be porous areas in the dielectric material. In some embodiments, each of the openings 1665A to 1665D can include several smaller openings, such as a collection of smaller squares, slits, hollow cells, or any other suitable arrangement.

[0170] Module 1660 includes a central member 1661 and covers 1667A and 1667B configured to position signal conductors 1314A and 1314B within openings 1665A to 1665D. Central member 1661 and covers 1667A and 1667B may be collectively referred to as one or more insulating support members and may be formed to hold, for example, the insulating housing portion 1100 and Figure 11 The dielectric support members may be formed of any suitable dielectric material that allows the dielectric support members to structurally cooperate to align the signal conductors 1314A and 1314B.

[0171] Central member 1661 includes bases 1663A and 1663B configured to support signal conductors 1314A and 1314B within openings 1665A through 1665D. In the illustrated embodiment, bases 1663A and 1663B abut against the remainder of central member 1661 and define openings 1665A through 1665D. Bases 1663A through 1663D can have any suitable width for supporting signal conductors 1314A and 1314B. For example, the width of bases 1663A through 1663D can be 90%, 80%, 50%, 25%, or less of the width of signal conductors 1314A and 1314B. In some embodiments, the signal conductors 1314A and 1314B and the bases 1663A to 1663D can be configured such that at least 10% of the width of each signal conductor extends into one of the openings 1665A to 1665D. In some embodiments, the bases 1663A and 1663B are arranged to align the signal conductors 1314A and 1314B. In some embodiments, the central member 1661 includes support elements within one or more portions of the openings 1665A to 1665D for aligning the signal conductors 1314A and 1314B within the remaining portions of the openings 1665A to 1665D. In the illustrated configuration, when the covers 1667A and 1667B are configured to press the signal conductors 1314A and 1314B against the bases 1663A and 1663B, respectively, the bases 1663A and 1663B establish spacing between the signal conductors 1314A and 1314B.

[0172] Covers 1667A and 1667B can be located on opposite sides of central member 1661. In the illustrated embodiment, covers 1667A and 1667B can be formed from the same material as central member 1661. However, this material is not required to be the same, and in some embodiments, different materials can be used, for example, to provide different relative dielectric constants in different regions, thereby providing a desired impedance for the signal conductors. Bases 1663C and 1663D can be configured similarly to bases 1663A and 1663B, but this is not required. In some embodiments, bases 1663C and 1663D can have the same or different width and / or height as any of bases 1663A to 1663D.

[0173] The covers 1667A and 1667B can be configured to help retain the signal conductors 1314A and 1314B between the bases 1663A and 1663B of the central member 1661 and the bases 1663C and 1663D of the covers 1667A and 1667B. The bases 1663C and 1663D can be connected to the compliant portions of the covers 1667A and 1667B. The compliance in the covers 1667A and 1667B can enable the covers 1667A and 1667B to clamp the signal conductors 1314A and 1314B while also compensating for warpage or misalignment in the module 1660 assembly.

[0174] The insulating support member may be fully or partially enclosed by reference conductors 1671A and 1671B (e.g., Figure 16A ). The assembly can be held together in any suitable manner. For example, reference conductors 1671A and 1671B can have features that engage one another. Alternatively or additionally, reference conductors 1671A and 1671B can be held in place by external shielding and / or lossy material used in the wafer assembly.

[0175] As an example of how reference conductors 1671A and 1671B generate forces on covers 1667A and 1667B, Figure 16B Shown in Figure 16A A cross section through module 1660 is shown in various positions. Figure 16B At the location of the cross-section shown, one or both of covers 1667A and 1667B may include latching features that hold reference conductors 1671A and 1671B together. Latching features 1672A and 1672B are schematically shown. The latching features can be configured to place the subassembly including central member 1661 and covers 1667A and 1667B in a compressed state. A sufficient number of latching features can be included along the length of the module to provide the required compression force and hold the module together. Thus, there can be multiple such latching features along the length of the module.

[0176] exist Figure 16B In an illustrative embodiment, covers 1667A and 1667B are connected to reference conductors 1617A and 1617B via standoffs 1669A to 1669D. These standoffs 1669A to 1669D can be configured to limit the surface area of ​​covers 1667A and 1667B that is in contact with reference conductors 1671A and 1671B. This can prevent overconstraint of the assembly and aid in alignment. In some embodiments, standoffs 1669A and 1669B can be configured to kinematically couple to the reference conductors, thereby precisely constraining covers 1667A and 1667B relative to reference conductors 1671A and 1671B.

[0177] In some embodiments, portions of covers 1667A and 1667B (e.g., corners) are recessed from reference conductors 1671A and 1671B, which creates openings 1673A to 1673F. Openings 1673A to 1673F can limit dielectric losses because the electric field within reference conductors 1671A and 1671B is non-zero and non-negligible. Additionally, openings 1673A to 1673F can be advantageous for consistent and durable assembly of module 1660. Openings 1673A to 1673F can allow for variability in the stamping and / or forming of reference conductors 1671A and 1671B because, without such openings, the inner radius of reference conductors 1671A and 1671B can interfere with the insulating support member and prevent reference conductors 1671A and 1671B and / or additional shielding from being pressed into position on and around the insulating support member.

[0178] The compressive force generated by the reference conductors 1671A and 1671B around the insulating member causes the signal conductors to Figure 16B In the orientation shown, the insulating members are positioned relative to each other in a vertical direction. Since this direction is perpendicular to the width of the signal conductor, it is perpendicular to the direction in which the signal conductor is most flexible. Therefore, the cross section of the insulating member is Figure 16A and Figure 16B The cross-section may be substantially the same throughout the cross-section of the signal conductor. The cross-section may be maintained the same over all or substantially all of the length of the middle portion of the signal conductor, for example, greater than 90% of the middle portion or in some embodiments greater than 95% of the middle portion.

[0179] exist Figure 16A and Figure 16B Not shown are lateral supports that position the signal conductors relative to each other in a direction parallel to the wide dimension of the signal conductors. However, lateral supports for the intermediate portions of the signal conductors may be included at certain locations along the length of the signal conductors. In some embodiments, lateral supports may be provided only at locations that collectively account for a portion of the length of the openings 1665A...1665D. Figure 16C A cross section of module 1660 is shown in this position. In the embodiment shown, lateral support is provided by projections 1662A...1662D of the walls of the channels forming openings 1665A...1665D in central portion 1661. The projections providing lateral support may alternatively extend from covers 1667A and 1667B, or any other suitable structure may be used to provide lateral support.

[0180] In the embodiment shown, lateral support is not included along the entire length of the middle portion of the signal conductors 1314A and 1314B. In some embodiments, the span of the protrusions 1662A...1662D can be less than 25% of the length, and in some embodiments, less than 15% or less than 10%.

[0181] Figure 17 is a cross-sectional view of a module 1760 having an alternative configuration of insulating members configured to reduce dielectric losses. Figure 16A , Figure 17 is a section through a portion of the module without lateral support or latching features, but incorporating Figure 16B and Figure 16C The features described or any other suitable structure performing the same function may be used with Figure 17 Used together with the configuration of

[0182] exist Figure 17 In the illustrative embodiment of the present invention, the central member 1761 is configured to include bases 1763A to 1763D forming openings 1765A to 1765F. The openings 1765A and 1765B and 1765E and 1765F remove the high electric field regions 1556A and 1556B ( Figure 15 ) in the dielectric material, and due to the combination with the above Figure 16A The dielectric loss is reduced for the same reason as described above. Figure 16A More dielectric is removed around the edges of the signal conductors because Figure 16A Sufficient material is removed to expose the first and second surfaces at the edges of the signal conductors, while Figure 17 Only one such surface is exposed on each signal conductor.

[0183] In some embodiments, the bases 1763A and 1763B contact the ends of one side of the signal conductors 1314A and 1314B to aid assembly and alignment. In other embodiments, the bases 1763A to 1763D are recessed into the central member 1761. For example, the bases 1763A to 1763D can be recessed by the thickness of the signal conductors 1314A and 1314B, such that the opposing surfaces of the signal conductors 1314A and 1314B are substantially coplanar with the portion of the central member 1761 that contacts the caps 1767A and 1767B. Nevertheless, an opening exists in the insulating support between the edges of the signal conductors and the wall of the central member 1761, thereby reducing dielectric losses.

[0184] exist Figure 17In the example shown, bases 1763A to 1763D are further configured to create openings 1765C and 1765D near the center of signal conductors 1314A and 1314B. In addition to eliminating some dielectric losses, openings 1765C and 1765D can mechanically aid in the assembly of module 1760. For example, openings 1765C and 1765D can compensate for warping of insulating support members or reference shields 1771A and 1771B. Additionally, openings 1765C and 1765D can provide compliance to mitigate excessive pressure from bases 1763E and 1763F on signal conductors 1314A and 1314B. In some embodiments, openings 1765A to 1765F can be sized to prevent dimensional changes or variations (e.g., due to assembly or temperature) from significantly altering the impedance of module 1760.

[0185] A method for manufacturing a module for limiting dielectric loss (e.g., 1660 and 1760) may include the following steps: positioning a central member of an insulating support between at least two conductors. Each of the at least two conductors includes a first end and a second end and a middle portion connecting the first end and the second end, the middle portion including a first edge and a second edge and a first side and a second side between the first edge and the second edge, the first side and the second side being wider than the first edge and the second edge. The at least two conductors may include a first conductor and a second conductor (e.g., 1314A and 1314B). The central member may include a first base portion and a second base portion, such that the first base portion contacts a first side of the first conductor and the second base portion contacts a first side of the second conductor. First and second covers of the insulating support may be positioned adjacent to the first and second conductors, respectively, wherein each of the first and second covers includes a corresponding base portion. The base portion of the first cover may contact a second side of the first conductor, and the base portion of the second cover may contact a second side of the second conductor. At least a portion of the covers and the central member may be surrounded by one or more reference conductors.

[0186] Figure 18 Another alternative embodiment is shown in which a material with low dielectric loss (air in the embodiment shown) is selectively positioned in high electric field regions adjacent to the signal conductors. Figure 16A and Figure 17 In the embodiment shown in , such a configuration can be formed by molding a plastic support member with channels or other structures that form openings adjacent to the edges of the signal conductors. Figure 18 In FIG. 1 , signal conductors 1314A and 1314B are configured as a broadside coupled differential pair, and support members 1861 and 1867A and 1867B are formed with openings 1865A, 1865B, 1865C, and 1865D positioned adjacent to the edges of the signal conductors.

[0187] Figure 18 1867A and 1867B, with the signal conductors held between the support members. The support members can be molded so that the cross-section shown exists along substantially all of the length of the signal conductors within the module. However, as described above in conjunction with Figure 16B and Figure 16C As shown, other cross-sections may be created at intermittent locations along the length of the signal conductor, such as at locations that provide lateral support for the signal conductor or latching of the shield member. Figure 16A or Figure 17 The cross section is the same, Figure 18 The cross section can be produced at 90% or more of the length of the signal conductor within the module.

[0188] Figure 18 Openings 1865A, 1865B, 1865C, and 1865D in the plastic support are smaller than openings 1665A, 1665B, 1665C, ​​and 1665D and openings 1765A, 1765B, 1765E, and 1765F. Openings 1865A, 1865B, 1865C, and 1865D expose the upper surfaces of 1314A and 1314B adjacent the edge, even though the lower surfaces of those conductive elements (even adjacent the edge) rest against the plastic support. Figure 18 It is shown that even those smaller openings can provide benefits. In some embodiments, such as Figure 18 The structure in can provide sufficient performance and can provide the advantage of easy molding.

[0189] Figure 18 The implementation method is not as Figure 16A Openings 1673A through 1673F are shown. These openings are useful for providing a spring force in the insulating support members 1667A and 1667B, which helps to hold the signal conductors 1314A and 1314B securely in place with uniform and controlled spacing determined by the spacing between the surfaces of the bases 1663A and 1663B.

[0190] Figure 18 The embodiment has no connection between the broadsides of the signal conductors. Figure 17 The openings 1765C and 1765D correspond to the openings in FIG. Figure 18 It is shown that no such opening is required to deliver low insertion loss. However, any of the above features may be used with Figure 18 Used together with the structure shown in .

[0191] Figure 19is an isometric view of a wafer according to an illustrative embodiment, the wafer being partially cut away to show a portion of a wafer module having edge-coupled signal conductors configured to reduce dielectric losses. The wafer module includes a connector module 1960 having an alternative configuration of insulating members configured to reduce dielectric losses. 16A to 16C 、 Figure 17 and Figure 18 The features are achieved Figure 19 ; or any other suitable structure performing the same function may be used with Figure 19 Use with the configuration of Figure 19 In the illustrative embodiment of FIG. 1 , module 1960 is disposed between members 1981A and 1981B, which may be lossy in some embodiments or insulating in other embodiments. Module 1960 includes reference shields 1971A and 1971B that partially surround covers 1967A and 1967B, which hold signal conductors 1314A and 1314B.

[0192] exist Figure 19 In the illustrative embodiment, signal conductors 1314A and 1314B are edge coupled, for example, as described earlier with reference to at least Figure 5 As described. The signal conductors are arranged with adjacent edges and aligned sides. In the illustrated embodiment, the sides of the signal conductors 1314A and 1314B are substantially collinear. In the case where the cross-section of the signal conductor is rectangular, its edges can be considered as the outer narrower portions.

[0193] exist Figure 19 In the illustrative embodiment, the insulating support member includes two covers 1967A and 1967B, which are configured to include a base for creating an opening, and no obvious central insulating support member is required between the two covers 1967A and 1967B. The covers 1967A and 1967B are configured to create an opening that removes dielectric material in the high electric field area and due to the combination with the above Figure 16A Although the signal conductors 1314A and 1314B are edge coupled, the inventors have recognized and understood that there may be a difference between the signal conductors 1314A and 1314B as shown in FIG. Figure 15 In particular, Figure 19 The dielectric around the edges of the signal conductors is shown removed to expose the first and second surfaces at the edges of the signal conductors 1314A and 1314B. In some embodiments, one edge of each signal conductor 1314A and 1314B is adjacent to less dielectric material than the other corresponding edge of the same signal conductor. In some embodiments, the dielectric around the edges of the signal conductors 1314A and 1314B may be removed to expose the first and second surfaces at the edges of the signal conductors 1314A and 1314B. 16A to 16C 、 Figure 17 and Figure 18 The areas of removed dielectric may be configured as discussed or according to any suitable arrangement for reducing dielectric losses.

[0194] Figure 20A is a cross-sectional view of a portion of a wafer having edge-coupled signal conductors configured to reduce dielectric losses. Figure 20A In the example of FIG. 2 , the sheet includes a connector module 2060 having an insulating member configured to reduce dielectric loss. Figure 19 Described features to achieve Figure 20A , or any other suitable structure performing the same function may be combined with Figure 20A Use with the configuration of Figure 20A In the illustrative embodiment, module 2060 is disposed between lossy components. Module 2060 includes reference shields 2071A and 2071B surrounding covers 2067A and 2067B, which hold signal conductors 1314A and 1314B. Cover 2067A includes supports 2069A through 2069C and bases 2063A, 2063B, and 2063E. Cover 2067B includes bases 2063C and 2063D and supports 2069D through 2069F.

[0195] exist Figure 20A In the illustrative embodiment, signal conductors 1314A and 1314B are edge coupled, for example, as described earlier with reference to at least Figure 19 As described above. Bases 2063A and 2063B contact a portion of one side of signal conductors 1314A and 1314B, and bases 2063C and 2063D contact a portion of the opposite side of signal conductors 1314A and 1314B. Protrusion 2063E extends between cover 2067A and cover 2067B. In some embodiments, protrusion 2063E contacts cover 2067B and spaced apart from the insulating support member. In some embodiments, protrusion 2063E does not contact cover 2067B.

[0196] In some embodiments, protrusion 2063E can be configured to contact the edges of signal conductors 1314A and 1314B, which can provide lateral support for all or a portion of signal conductors 1314A and 1314B. In some embodiments, protrusions 2062A and 2062B can provide lateral support and / or alignment for all or a portion of signal conductors 1314A and 1314B. Protrusions 2062A and 2062B can function as described with reference to protrusions 1662A through 1662D.

[0197] exist Figure 20AIn the example of FIG, the insulating support members (2067A and 2067B) are configured to create openings 2073A to 2073H and openings 2065A to 2065D. As has been described with reference to earlier figures (eg, Figure 17 ), these openings, in addition to eliminating some dielectric losses, can also mechanically assist in the assembly of the waveguide 2060.

[0198] Figure 20B is a cross-sectional view of a portion of a wafer having edge-coupled signal conductors configured to reduce dielectric losses, according to some embodiments. Figure 20B Shown is a different Figure 20A In the illustrated embodiment, the connector module 2060 has a configuration of insulating members that are further configured to reduce dielectric losses.

[0199] and Figure 20A Compared to the cross section shown, Figure 20B The portion of covers 2067A and 2067B shown does not include a base between signal conductors 1314A and 1314B. Tabs 2062A and 2062B also do not appear in this cross section. Figure 20A can represent the first part of the slice, Figure 20B The second portion of the same sheet may be displaced from the first portion along the length of the same signal conductors 1314A and 1314B. Protrusions, such as protrusion 2063E, may be present at discrete locations along the length of the same signal conductors 1314A and 1314B. Such protrusions may provide lateral alignment of the signal conductors 1314A and 1314B. However, to limit dielectric losses, protrusion 2063E may be configured to be adjacent to only one or more portions of the length of the signal conductors 1314A and 1314B. For example, protrusion 2063E may be configured to span less than 25% of the length, and in some embodiments, less than 15% or less than 10%. Similarly, protrusions 2062A and 2062B may be adjacent to only one or more portions of the length of the signal conductors 1314A and 1314B, which may be the same as or different from the portion adjacent to protrusion 2063E.

[0200] Figure 21A and Figure 21B A partially exploded view of a connector module (e.g., 2060) with edge-coupled signal conductors is shown. The signal conductors 1314A and 1314B can be disposed between insulating support member covers 2167A and 2167B, which can be as described with reference to at least Figure 19 as well as Figure 20A and Figure 20BThe insulating support member may be surrounded by reference conductors 2171A and 2171B, which may function as described with reference to any reference conductor herein.

[0201] exist Figure 21A In the configuration of FIG. 1 , it can be seen that lateral support and positioning of the signal conductors 1314A and 1314B is provided by the following protrusions 2162, which pass through the holes in the signal conductors rather than abutting the sides of the signal conductors. Any one or both of these mechanisms, as well as other suitable structures, can be used to position the signal conductors within the module.

[0202] Figure 22 A partially exploded view of a sheet 2290 is shown in accordance with an illustrative embodiment. The sheet module 2290 shown may be used with Figure 19 The plurality of connector modules (for clarity, only labeled 2260A and 2260B) may be covered in lossy material 2281A and 2281B to form a sheet module 2290. The connector modules 2260A and 2260B may be as described with reference to at least Figure 19 as well as Figure 20A and Figure 20B Works as described.

[0203] Figure 23 A partially exploded view of a vertical connector 2300 is shown in accordance with an illustrative embodiment. The vertical connector 2300 may include a plurality of sheets, including 2390A and 2390B. The sheets may be as described with reference to FIG. Figure 22 The sheets can be assembled and configured to be connected to the housing 2340, the member 2330, and the organizers 2392A and 2392B. The organizers 2392A and 2392B can be made of any suitable material and are configured to separate the sheets (e.g., 2390A and 2390B) at suitable intervals.

[0204] Member 2330 can include an insulating portion, a lossy portion, and / or a conductive portion. In some embodiments, contact tails associated with signal conductors in the sheets (e.g., 2390A and 2390B) can pass through the insulating portion of member 2330. Contact tails associated with reference conductors can pass through the lossy or conductive portion of member 2330. In some embodiments, the lossy or conductive portions can be compliant, allowing those portions to conform to and press against ground conductors within connector 2300 and ground pads on the printed circuit board on which connector 2300 is mounted, thereby improving the shielding capabilities of member 2330 at the connector's mounting interface.

[0205] The mating contacts of the tabs (e.g., 2390A and 2390B) are held in the front housing portion 2340. The front housing portion 2340 can be made of any suitable material, which can be insulating, lossy, or conductive, or can include any suitable combination or combinations of such materials. For example, the front housing portion 2340 can be molded from a filled lossy material, or can be formed from a conductive material using similar materials and techniques as described above for the housing wall 226. In the illustrated embodiment, the front housing portion 2340 has a plurality of channels, each channel being positioned to accommodate a pair of signal conductors and an associated reference conductor.

[0206] In some embodiments, the base portion of the insulating support is shaped to provide one or more openings in the dielectric material, and a method of manufacturing the module may include positioning an edge of the conductor in the one or more openings. The manufacturing method may also include: forming a sheet by at least partially positioning a plurality of lossy members such that each lossy member is electrically coupled to a plurality of reference conductors; and aligning the plurality of sheets in parallel.

[0207] The frequency range of interest may depend on the operating parameters of the system in which such a connector is used, but may generally have an upper limit of approximately 10 GHz to 50 GHz, such as 25 GHz, 30 GHz, or 40 GHz, although higher or lower frequencies may be of interest in certain applications. Some connector designs may have a frequency range of interest that spans only a portion of this range, such as 1 GHz to 10 GHz, 3 GHz to 15 GHz, or 5 GHz to 35 GHz. In some embodiments, the connector may be designed to carry signals having frequencies of 14 GHz or 24 GHz. At these higher frequencies, the effects of unbalanced signal pairs and any discontinuities in shielding at the mounting interface may be more significant.

[0208] The operating frequency range of an interconnect system can be determined based on the frequency range within which the interconnect can pass with acceptable signal integrity. Signal integrity can be measured according to a number of criteria, depending on the application for which the interconnect system is designed. Some of these criteria may relate to signal propagation along a single-ended signal path, a differential signal path, a hollow waveguide, or any other type of signal path. Two examples of such criteria are attenuation of the signal along the signal path or reflection of the signal from the signal path.

[0209] Other standards may involve the interaction of multiple different signal paths. Such standards may include, for example, near-end crosstalk, which is defined as the portion of a signal injected on one signal path at one end of an interconnect system that can be measured on any other signal path on the same end of the interconnect system. Another such standard may be far-end crosstalk, which is defined as the portion of a signal injected on one signal path at one end of an interconnect system that can be measured on any other signal path on the other end of the interconnect system.

[0210] As a specific example, it may be required that the signal path attenuation is no greater than 3dB power loss, the reflected power ratio is no greater than -20dB, and the crosstalk contribution of each signal path to the signal path is no greater than -50dB. Because these characteristics are frequency dependent, the operating range of the interconnect system is defined as the frequency range that meets the specified standards.

[0211] Described herein are designs for electrical connectors that improve signal integrity for high-frequency signals—e.g., frequencies in the GHz range, including up to about 25 GHz, up to about 40 GHz, up to about 50 GHz, up to about 60 GHz, or up to about 75 GHz or higher—while maintaining high density, such as spacing between adjacent mating contacts of about 3 mm or less, including center-to-center spacing between adjacent contacts in a column of, for example, between 1 mm and 2.5 mm, or between 2 mm and 2.5 mm. The spacing between mating contacts in multiple columns can be similar, although the spacing between all mating contacts in the connector is not required to be the same.

[0212] Although a broadside-coupled configuration may be desirable for the middle portion of the conductive element, a fully or primarily edge-coupled configuration may be employed at the mating interface with another connector or the attachment interface with a printed circuit board. Such a configuration may, for example, facilitate routing of signal traces within a printed circuit board that connect to vias that house the contact tails of the connector.

[0213] Thus, the conductive elements inside the connector can have a transition region at one or both ends. In the transition region, the conductive elements can bend out of a plane parallel to the wide dimension of the conductive elements. In some embodiments, each transition region can bend toward the transition region of another conductive element. In some embodiments, the conductive elements will each bend toward the plane of the other conductive element so that the ends of the transition region are aligned in the same plane parallel to the plane of the separated conductive elements but between the planes of the separated conductive elements. To avoid contact in the transition region, the conductive elements can also be bent away from each other in the transition region. Thus, the conductive elements in the transition region can be aligned edge to edge in a plane parallel to the plane of the separated conductive elements but offset from the plane of the separated conductive elements. Such a configuration can provide a balanced pair over the frequency range of interest while providing routing channels within a printed circuit board supporting a high-density connector, or while providing mating contacts in a gap that facilitates the manufacture of mating contact portions.

[0214] In embodiments where an edge coupled configuration is employed at the mid-portion of the signal conductors, the openings in the insulating support member may be positioned differently than for a broadside coupled configuration to ensure that the openings coincide with areas of high electric fields surrounding the signal conductors. For example, in some configurations, the openings in the insulating support member may preferably be configured between the pair of signal conductors and encompass the opposing edges of the pair of signal conductors and a portion of the first surface and / or second surface of the wide dimension of the signal conductors that are adjacent to these edges. In some embodiments, the exposed portions of the first and second surfaces may comprise a percentage of the aforementioned surfaces, for example, greater than 25% or in some embodiments greater than 50%. In such embodiments, lateral support may also be provided at some locations along the length of the signal conductors. However, the lateral support may be between the edges of the edge coupled signal conductors.

[0215] Although details of specific configurations of conductive elements, housings, and shielding members are described above, it should be understood that such details are provided for illustrative purposes only, as the concepts disclosed herein can be implemented in other ways. In this regard, the various connector designs described herein can be used in any suitable combination, as aspects of the present disclosure are not limited to the specific combinations shown in the accompanying drawings.

[0216] Having described several embodiments, it will be appreciated that various changes, modifications, and improvements may readily occur to those skilled in the art, and that such changes, modifications, and improvements are intended to fall within the spirit and scope of the present invention.

[0217] As an example, a 50 millivolt signal is given as an example of a low voltage differential signal. A low voltage signal may have a differential voltage of 2 volts or less.

[0218] Accordingly, the foregoing description and drawings are by way of example only.

[0219] Manufacturing techniques may also vary. For example, an embodiment in which the daughter card connector 600 is formed by assembling multiple sheets onto a stiffener is described. It is possible that an equivalent structure can be formed by inserting multiple shields and signal receptacles into a molded housing.

[0220] As another example, a connector formed by modules is described, and each module includes a pair of signal conductors. It is not necessary for each module to just include a pair of signal conductors or that the number of signal pairs is the same in all modules in the connector. For example, 2 pairs or 3 pairs of modules can be formed. In addition, in some embodiments, a core module with two rows, three rows, four rows, five rows, six rows or some larger number of rows can be formed in a single-ended or differential pair configuration. Each connector, or each thin slice in the embodiment of the connector lamination can include such a core module. For manufacturing a connector with more rows than the row included in the basic module, the core module can be coupled with an additional module (for example, each additional module has a smaller number of pairs, such as each module single pair).

[0221] Furthermore, while many aspects of the invention are shown and described with reference to a daughterboard connector having a right-angle configuration, it should be understood that the aspects of the present disclosure are not limited in this regard, as any inventive concept, whether alone or in combination with one or more other inventive concepts, may be used with other types of electrical connectors, such as backplane connectors, cable connectors, stacking connectors, mezzanine connectors, I / O connectors, chip sockets, etc.

[0222] In some embodiments, the contact tails are shown as press-fit "eye-of-the-needle" compliant sections designed to fit within vias in a printed circuit board. However, other configurations may be used, such as surface mount components, spring-loaded contacts, solderable pins, etc., as aspects of the present disclosure are not limited to the use of any particular mechanism for attaching the connector to a printed circuit board.

[0223] Therefore, the present disclosure is not limited to the details of construction or arrangement of parts described above and / or set forth in the accompanying drawings. Various embodiments are provided for illustrative purposes only, and the concepts described herein can be practiced or implemented in other ways. In addition, the terms and terminology used herein are for descriptive purposes and should not be considered restrictive. The use of "including," "comprising," "having," "containing," or "involving" and variations thereof in this document is intended to encompass the items listed thereafter (or their equivalents) and / or as supplementary items.

[0224] Regarding the implementation methods including the above embodiments, the following technical solutions are also disclosed:

[0225] Solution 1. An electrical connector module, comprising:

[0226] At least two conductors, each of the at least two conductors comprising:

[0227] a first end and a second end; and

[0228] a middle portion connecting the first end and the second end, the middle portion including a first edge and a second edge and a first side and a second side between the first edge and the second edge, the first side and the second side being wider than the first edge and the second edge, wherein the at least two conductors include a first conductor and a second conductor; and

[0229] an insulating support that holds the first conductor adjacent to the second conductor, the insulating support comprising a first base portion, a second base portion, a third base portion, and a fourth base portion,

[0230] in:

[0231] The first base portion contacts a first side of the first conductor, the second base portion contacts a second side of the first conductor, the third base portion contacts a first side of the second conductor, and the fourth base portion contacts a second side of the second conductor, and

[0232] a width of at least one of the first base portion and the second base portion being smaller than a width of the first side and the second side of the first conductor, and

[0233] A width of at least one of the third base portion and the fourth base portion is smaller than widths of the first side and the second side of the second conductor.

[0234] Option 2. The electrical connector module according to Option 1, wherein the second side of the first conductor faces the first side of the second conductor.

[0235] Solution 3. The electrical connector module according to Solution 1, wherein the second edge of the first conductor faces the first edge of the second conductor.

[0236] Solution 4. The electrical connector module according to Solution 1, wherein the widths of the first base portion and the fourth base portion are smaller than the widths of the first side and the second side of the first conductor and the second conductor.

[0237] Solution 5. The electrical connector module according to Solution 1, wherein the insulating support further comprises a fifth base portion, wherein at least a portion of the fifth base portion is disposed between two edges of the first conductor and the second conductor.

[0238] Option 6. An electrical connector module according to Option 1, wherein the first conductor and the second conductor are held within the insulating support, wherein the first side and the second side of the first conductor are aligned with the first side and the second side of the second conductor.

[0239] Option 7. The electrical connector module according to Option 6, wherein the first signal conductor and the second signal conductor are an edge-coupled signal conductor pair.

[0240] Option 8. The electrical connector module according to Option 1, wherein the insulating support member includes: a first component, the first component including the first base portion and the third base portion; and a second component, the second component including the second base portion and the fourth base portion.

[0241] Solution 9. The electrical connector module according to Solution 1 further includes a shielding member surrounding the insulating support member, wherein the shielding member includes a first shielding member and a second shielding member that together surround the insulating support member.

[0242] Solution 10. A sheet comprising:

[0243] A plurality of electrical connector modules according to solution 9;

[0244] At least one lossy member is coupled to the first shield member and / or the second shield member of each electrical connector module of the plurality of electrical connector modules.

[0245] Embodiment 11. An electrical connector comprising a plurality of thin sheets according to embodiment 10, wherein the plurality of thin sheets are aligned in parallel to form an electrical connector.

[0246] Solution 12. An electrical connector module, comprising:

[0247] At least two conductors, each of the at least two conductors comprising:

[0248] a first end and a second end; and

[0249] a middle portion connecting the first end and the second end, the middle portion including a first edge and a second edge and a first side and a second side between the first edge and the second edge, the first side and the second side being wider than the first edge and the second edge, wherein the at least two conductors include a first conductor and a second conductor; and

[0250] an insulating support that holds the first conductor adjacent to the second conductor, the insulating support having a first base portion, a second base portion, a third base portion, and a fourth base portion,

[0251] in:

[0252] The first base portion contacts the first side of the first conductor, the second base portion contacts the second side of the first conductor, the third base portion contacts the first side of the second conductor, and the fourth base portion contacts the second side of the second conductor, and wherein:

[0253] The widths of the first and fourth base portions are smaller than the widths of the first and second sides of the first and second conductors.

[0254] Solution 13. The electrical connector module according to Solution 12, wherein:

[0255] The insulating support comprises an opening; and

[0256] The first edge and the second edge of the first conductor and the second conductor are disposed within the opening.

[0257] Solution 14. The electrical connector module according to Solution 13, wherein:

[0258] The first side and the second side of the first conductor and the second conductor have a first width; and

[0259] The first edge and the second edge of the first conductor and the second conductor each extend into the opening a distance equal to at least 10% of the first width.

[0260] Solution 15. The electrical connector module according to Solution 13, wherein:

[0261] The first side and the second side of the first conductor and the second conductor are exposed within the opening.

[0262] Option 16. An electrical connector module according to Option 12, wherein the first conductor and the second conductor are held within the insulating support, wherein the first side and the second side of the first conductor are parallel to the first side and the second side of the second conductor.

[0263] Solution 17. The electrical connector module according to Solution 12, wherein the insulating support member comprises:

[0264] a first member comprising said first base portion;

[0265] a second member including the second base portion and the third base portion; and

[0266] The third member includes the fourth base portion.

[0267] Solution 18. The electrical connector module according to Solution 17, wherein:

[0268] The first member includes a first end and a second end and a compliant portion between the first end and the second end;

[0269] The first end and the second end of the first member contact the second member; and

[0270] The first base portion extends from the compliant portion.

[0271] Solution 19. The electrical connector module according to Solution 18, further comprising:

[0272] At least one fourth member around the insulating support presses the compliant portion of the first member toward the second member such that the first conductor is clamped between the first and second base portions.

[0273] Solution 20. The electrical connector module according to Solution 19, wherein:

[0274] The at least one fourth member includes at least one metal member.

[0275] Solution 21. The electrical connector module according to Solution 20, wherein:

[0276] The at least one metal member includes two connected metal members that collectively surround the first member, the second member, and the third member of the insulating support.

[0277] Option 22. The electrical connector module of Option 21, wherein the first signal conductor and the second signal conductor are a broadside-coupled pair of signal conductors, and the at least one member forms a shield around the broadside-coupled pair.

[0278] Solution 23. The electrical connector module according to Solution 22, wherein:

[0279] The first ends of the first and second signal conductors include mating contact portions; the second ends of the first and second signal conductors include contact tails; and the mating contact portions and the contact tails extend from the insulating support.

[0280] Solution 24. The electrical connector module according to Solution 22, wherein:

[0281] The first member includes a first side and an opposite side;

[0282] the first base portion extending from a central portion of the first side;

[0283] Portions of the opposite sides contact the fourth member; and

[0284] The central portion of the opposite side includes a groove to create a space between the central portion and the fourth member.

[0285] Aspect 25. The electrical connector module according to Aspect 19, wherein a corner between the first end and the second end of the first member is softened so as to leave a space between the corner and the at least one fourth member.

[0286] Solution 26. The electrical connector module according to Solution 19, wherein:

[0287] The third member includes a first end and a second end and a compliant portion between the first end and the second end;

[0288] The first end and the second end of the third member contact the second member; and

[0289] The fourth base portion extends from the compliant portion of the third member.

[0290] Solution 27. The electrical connector module according to Solution 18, further comprising a shielding member surrounding the insulating support, wherein the shielding member comprises a first shielding member and a second shielding member that together surround the insulating support.

[0291] Solution 28. The electrical connector module according to Solution 27, wherein the subassembly comprises at least two conductors, an insulating support, a first shielding member, and a second shielding member, and further comprises a sheet, wherein the sheet comprises:

[0292] a plurality of lossy members coupled to the first shield member and / or the second shield member; and

[0293] A plurality of subassemblies are disposed within the sheet.

[0294] Option 29. The electrical connector module according to Option 28, wherein a plurality of thin sheets are aligned in parallel to form an electrical connector.

[0295] Solution 30. An electrical connector, comprising:

[0296] a plurality of signal conductors, wherein the signal conductors are configured to generate an electric field pattern when carrying a low voltage differential signal at a frequency of 14 GHz, the electric field pattern comprising regions of higher electric field strength and lower electric field strength; and an insulating material retaining the plurality of signal conductors, wherein the insulating material comprises a plurality of openings along at least a portion of the length of the signal conductors of the plurality of signal conductors, wherein the openings are selectively positioned based on the regions of higher electric field strength such that a 14 GHz 50 millivolt differential signal exhibits at least 10% less dielectric loss than an insulating housing without the openings.

[0297] Item 31. An electrical connector according to Item 30, wherein the 14 GHz differential signal exhibits at least 15% less loss than an insulating housing without an opening.

[0298] Item 32. An electrical connector according to Item 30, wherein the 14 GHz low voltage differential signal exhibits at least 0.5 dB less loss compared to an insulating housing without an opening.

[0299] Embodiment 33. The electrical connector according to embodiment 30, wherein at least one surface of each of the plurality of signal conductors is exposed within the plurality of openings.

[0300] Option 34. An electrical connector according to Option 30, wherein the signal conductors are arranged in a plurality of rows, and wherein the plurality of signal conductors include a first end and a second end, wherein the first end is positioned to form a first interface, and the second end is positioned to form a second interface, and wherein the first interface is at a certain angle relative to the second interface such that each row in the plurality of rows is a different length, and

[0301] Wherein, the size of the opening within the signal conductor set of the row is determined based on the length of the signal conductor set of the row.

[0302] Solution 35. An electrical connector module, comprising:

[0303] At least two conductors, each of the at least two conductors comprising:

[0304] a first end and a second end; and

[0305] a middle portion connecting the first end and the second end, the middle portion including a first edge and a second edge and a first side and a second side between the first edge and the second edge, the first side and the second side being wider than the first edge and the second edge, wherein the at least two conductors include a first conductor and a second conductor; and

[0306] an insulating support that holds the first conductor adjacent to the second conductor, the second side of the first conductor facing the first side of the second conductor, the insulating support comprising a first support member, a second support member, and a third support member,

[0307] in:

[0308] The first support member contacts the first side of the first conductor, the second support member contacts the second side of the first conductor and the first side of the second conductor, and the third support member contacts the second side of the second conductor;

[0309] The insulating support further includes an opening; and

[0310] The first edge and the second edge of the first conductor and the second conductor are disposed within the opening.

Claims

1. An electrical connector, comprising: a plurality of signal conductors, the plurality of signal conductors comprising a first conductor (1310A) and a second conductor (1310B), the first conductor and the second conductor each comprising: a first end and a second end; and a middle portion (1314A, 1314B) connecting the first end and the second end, the middle portion comprising a first edge and a second edge and a first side and a second side between the first edge and the second edge, the first side and the second side being wider than the first edge and the second edge, and wherein the signal conductors of the plurality of signal conductors are configured to generate an electric field pattern when carrying a low voltage differential signal at a frequency of 14 GHz, the electric field pattern comprising regions of higher electric field strength and lower electric field strength; and an insulating material holding the first conductor adjacent to the second conductor, wherein the insulating material includes a plurality of openings along at least a portion of a length of a signal conductor of the plurality of signal conductors, wherein openings of the plurality of openings are selectively positioned based on the area of ​​higher electric field strength such that a 14 GHz 50 millivolt differential signal exhibits at least 10% less dielectric loss than an insulating housing without the openings.

2. The electrical connector according to claim 1, wherein The loss exhibited by the 14 GHz differential signal is at least 15% less than the loss exhibited by an insulating housing without openings.

3. The electrical connector according to claim 1, wherein The loss exhibited by the 14 GHz differential signal is at least 0.5 dB less than the loss exhibited by an insulating housing without openings.

4. The electrical connector according to claim 1, wherein At least one surface of each of the plurality of signal conductors is exposed within the plurality of openings.

5. The electrical connector according to claim 1, wherein The signal conductors are arranged in a plurality of rows, and wherein the first ends are positioned to form a first interface and the second ends are positioned to form a second interface, and wherein the first interface is angled relative to the second interface such that each of the plurality of rows is a different length, and Wherein, the size of the opening within the signal conductor set of the row is determined based on the length of the signal conductor set of the row.

6. An electrical connector module, comprising: A first conductor (1310A) and a second conductor (1310B), each of the first conductor and the second conductor comprising: a first end and a second end; and a middle portion (1314A, 1314B) connecting the first end and the second end, the middle portion including a first edge and a second edge and a first side and a second side between the first edge and the second edge, the first side and the second side being wider than the first edge and the second edge; and an insulating support that holds the first conductor adjacent to the second conductor, the insulating support comprising a first member (1867A), a second member (1867B), and a third member (1861), in: The first member (1867A) contacts the first side of the first conductor (1310A), the second member (1867B) contacts the second side of the second conductor (1310B), and the third member (1861) contacts the second side of the first conductor (1310A) and the first side of the second conductor (1310B), The third member (1861) includes a first groove and a second groove, the first groove being provided in a first surface of the third member, and the second groove being provided in a second surface of the third member opposite to the first surface, The first groove and the second groove have a first width and a second width, The first width and the second width are respectively greater than the widths of the first side and the second side of the first conductor and the second conductor, and The first conductor and the second conductor are respectively arranged in the first groove and the second groove so that there are openings (1865A, 1865B) between the first edge and the second edge of the first conductor and the side of the first groove, and there are openings (1865C, 1865D) between the first edge and the second edge of the second conductor and the side of the second groove.

7. The electrical connector module according to claim 6, wherein: The first and second conductors (1310A, 1310B) comprise a broadside coupled pair of signal conductors.

8. The electrical connector module according to claim 6, wherein: The first ends of the first conductor and the second conductor include mating contact portions (1318A, 1318B); The second ends of the first conductor and the second conductor include contact tails (1330A, 1330B); and The mating contact portion and the contact tail extend from the insulating support. 9 . The electrical connector module according to claim 6 , further comprising a shielding member disposed around the insulating support member.

10. The electrical connector module according to claim 9, wherein: The shield compresses the first, second and third members (1867A, 1867B, 1861).

11. The electrical connector module according to claim 9, wherein: The shield includes a first shield member (1771A) and a second shield member (1771B) that together surround the insulating support.

12. The electrical connector module according to claim 11, wherein: The first shield member (1771A) and the second shield member (1771B) include latching features (1672A, 1672B) configured to retain the first shield member and the second shield member together.

13. The electrical connector module according to claim 11, wherein: The shield includes a slit.

14. The electrical connector module according to claim 11, wherein The subassembly (1000) includes first and second conductors (1310A, 1310B), an insulating support, a first shield member (1771A), and a second shield member (1771B), and also includes a sheet (700), the sheet (700) including: a plurality of lossy members (1215) coupled to the first shield member and / or the second shield member; and A plurality of subassemblies are disposed within the sheet.

15. The electrical connector module according to claim 14, wherein: The sheets of the plurality of sheets are aligned in parallel to form an electrical connector.

16. An electrical connector module, comprising: A first conductor (1310A) and a second conductor (1310B), each of the first conductor and the second conductor comprising: a first end and a second end; and a middle portion (1314A, 1314B) connecting the first end and the second end, the middle portion including a first edge and a second edge and a first side and a second side between the first edge and the second edge, the first side and the second side being wider than the first edge and the second edge; an insulating support that holds the first conductor adjacent to the second conductor, the insulating support comprising a first base portion (1663C), a second base portion (1663A), a third base portion (1663B), and a fourth base portion (1663D), and a shielding member (1671A, 1671B) disposed around the insulating support member, in: The first base portion (1663C) contacts the first side of the first conductor (1310A), the second base portion (1663A) contacts the second side of the first conductor (1310A), the third base portion (1663B) contacts the first side of the second conductor (1310B), and the fourth base portion (1663D) contacts the second side of the second conductor (1310B). The first conductor, the second conductor, the first base portion, the second base portion, the third base portion, and the fourth base portion are arranged in a line, and A first opening (1673B) and a second opening (1673E) are provided between the shield and the insulating support at various locations along the line.

17. The electrical connector module according to claim 16, wherein: The first base portion (1663C) and the second base portion (1663A) each have a width that is smaller than a width of the first side and the second side of the first conductor (1310A).

18. The electrical connector module according to claim 17, wherein: The third base portion (1663B) and the fourth base portion (1663D) each have a width smaller than the width of the first side and the second side of the second conductor (1310B).

19. The electrical connector module according to claim 16, wherein: The insulating support member comprises: a first member (1667A) comprising the first base portion (1663C); a second member (1661) comprising the second base portion and the third base portion (1663A, 1663B); and The third member (1667B) includes the fourth base portion (1663D).

20. The electrical connector module according to claim 19, wherein: The first opening (1673B) is disposed between the first member (1667A) and the shield; and The second opening (1673E) is provided between the third member (1667B) and the shield.

21. The electrical connector module according to claim 19, wherein The shield comprises a first shield member (1671A) and a second shield member (1671B) that together surround the insulating support, and Corner openings (1673A, 1673C, 1673D, 1673F) are provided between the corners of the first member (1667A) and the corners of the first shielding member (1671A) and between the corners of the third member (1667B) and the corners of the second shielding member (1671B).

22. A sheet comprising: A plurality of electrical connector modules according to claim 11; as well as At least one lossy member (1215), wherein the at least one lossy member (1215) is coupled to the first shielding member (1671A) and / or the second shielding member (1671B) of each electrical connector module in the plurality of electrical connector modules.

23. An electrical connector comprising a plurality of sheets according to claim 22, wherein: The plurality of sheets are aligned in parallel to form the electrical connector.

24. An electrical connector module, comprising: A first conductor (1310A) and a second conductor (1310B), each of the first conductor and the second conductor comprising: a first end and a second end; and a middle portion (1314A, 1314B) connecting the first end and the second end, the middle portion including a first edge and a second edge and a first side and a second side between the first edge and the second edge, the first side and the second side being wider than the first edge and the second edge; and an insulating support that holds the first conductor adjacent to the second conductor, the insulating support comprising a first base portion (1763E), a second base portion (1763F), a third base portion (1763C), a fourth base portion (1763D), a fifth base portion (1763A), and a sixth base portion (1763B), in: The first base portion (1763E) contacts the first side of the first conductor (1310A), the second base portion (1763F) contacts the second side of the second conductor, the third base portion and the fourth base portion (1763C, 1763D) contact the first side of the second conductor, and the fifth base portion and the sixth base portion (1763A, 1763B) contact the second side of the first conductor, the first base portion and the second base portion each having a width that is smaller than a width of the first side and the second side of the first conductor, The third base portion (1763C) is separated from the fourth base portion (1763D) by a first opening (1765D), the first opening being adjacent to the first side of the second conductor (1310B), and The fifth base portion (1763A) is separated from the sixth base portion (1763B) by a second opening (1765C), the second opening being adjacent to the second side of the first conductor (1310A).

25. The electrical connector module according to claim 24, wherein The first opening (1765D) is disposed near the center of the second conductor (1310B), and the second opening (1765C) is disposed near the center of the first conductor (1310A).

26. The electrical connector module according to claim 24, wherein The insulating support includes a third opening (1765A, 1765B, 1765E, 1765F); and The first edge and the second edge of the first conductor and the second conductor (1310A, 1310B) are disposed within the third opening (1765A, 1765B, 1765E, 1765F).

27. The electrical connector module according to claim 26, wherein: The first side and the second side of the first conductor and the second conductor (1310A, 1310B) have a first width; as well as The first and second edges of the first and second conductors (1310A, 1310B) each extend into the third opening (1765A, 1765B, 1765E, 1765F) by a distance equal to at least 10% of the first width.

28. The electrical connector module according to claim 26, wherein: The first side and the second side of the first conductor and the second conductor (1310A, 1310B) are exposed within the third opening (1765A, 1765B, 1765E, 1765F).

29. The electrical connector module according to claim 24, wherein The insulating support member comprises: a first member (1767A) comprising the first base portion (1763E); a second member (1767B) comprising the second base portion (1763F); and The third member (1761) includes the third base portion, the fourth base portion, the fifth base portion, and the sixth base portion (1763C, 1763D, 1763A, 1763B), wherein: The third member (1761) is disposed between the first member (1767A) and the second member (1767B).

30. The electrical connector module according to claim 29, further comprising a shield (1771A, 1771B) disposed around the insulating support.

31. The electrical connector module according to claim 30, wherein: The corners of the first and second members (1767A, 1767B) are smoothed to leave openings (1773A, 1773C, 1773D, ​​1773F), which are arranged to be close to the corners of the first and second members (1767A, 1767B) and the corners of the shielding members (1771A, 1771B).

32. The electrical connector module according to claim 30, wherein: The first conductor, the second conductor, the first base portion, the second base portion, the first opening, and the second opening are arranged in a line, and a fourth opening (1773B) provided between the shield (1771A) and the first member (1767A) at a position along the line, and A fifth opening (1773E) is provided between the shield (1771B) and the second member (1767B) at a certain position along the line.

33. The electrical connector module according to claim 24, wherein The first and second conductors (1310A, 1310B) comprise a broadside coupled pair of signal conductors.

34. The electrical connector module according to claim 33, wherein: The first ends of the first conductor and the second conductor include mating contact portions (1318A, 1318B); The second ends of the first conductor and the second conductor include contact tails (1330A, 1330B); and The mating contact portions (1318A, 1318B) and the contact tails (1330A, 1330B) extend from the insulating support.

35. The electrical connector module according to claim 30, wherein The shield includes a first shield member (1771A) and a second shield member (1771B) that together surround the insulating support.

36. The electrical connector module according to claim 35, wherein The subassembly includes a first conductor and a second conductor, an insulating support, a first shield member and a second shield member, and also includes a sheet (700) comprising: a plurality of lossy members (1215) coupled to the first shield member (1771A) and / or the second shield member (1771B); and A plurality of subassemblies are disposed within the sheet (700).

37. The electrical connector module according to claim 36, wherein: The sheets of the plurality of sheets are aligned in parallel to form an electrical connector.

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