MCC heat sink indium evaporation device and method

Abstract

The present application relates to a kind of MCC heat sink indium evaporation device and indium evaporation method.The heat sink indium evaporation device, including fixed plate and with fixed plate matching cover plate, fixed plate middle is equipped with square recess, recess inside two ends are equipped with evenly arranged evaporation area I, recess central portion is equipped with evaporation area III, evaporation area I and evaporation area III between evaporation area II are equipped, evaporation area I, evaporation area II and evaporation area III constitute an evaporation unit;The four corners of the fixed plate are respectively provided with fixed hole I, the side of the fixed plate is uniformly provided with screw hole, screw hole is provided with top wire;The cover plate is located above fixed plate, cover plate middle is equipped with protrusion, protrusion and recess shape size match;The four corners of the cover plate are respectively provided with screw hole, screw hole and fixed hole I match.The MCC heat sink indium evaporation device provided by the present application is simple in structure, low in cost, easy and reliable to operate and check, so that the MCC heat sink assembly efficiency is effectively improved, and the MCC heat sink evaporation quality consistency is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to a kind of MCC heat sink evaporation of indium device and evaporation of indium method, belong to semiconductor laser package technical field. BACKGROUND

[0002] Due to the advantages of small volume, light weight, high electro-optical conversion efficiency, long life and high reliability, semiconductor lasers have gradually replaced the use of gas and solid lasers in communication, medical, display, industrial production and security fields, and their application range is also expanding. The waste heat generated by the chip during the operation of the semiconductor laser needs to be effectively discharged in time, otherwise it will cause the temperature of the laser chip to be too high, reduce the light-emitting efficiency of the device and induce the failure of the laser. The widely used technical solution of micro-channel MCC laser package is to sinter the semiconductor laser bar, the insulating sheet and the negative sheet together on the MCC heat sink with strong heat dissipation capacity, and the heat generated by the bar is effectively dissipated through the MCC heat sink. In order to weld the bar, the insulating sheet and the negative sheet together, a layer of indium must be evaporated on the surface of the MCC heat sink block. Indium has the characteristics of excellent ductility (plasticity), low vapor pressure, low resistance, high thermal conductivity, firmness, reliability and fatigue resistance, and can adhere to various materials, so it is widely used in the field of semiconductor laser packaging technology.

[0003] The position of the MCC heat sink surface that needs to be evaporated with indium becomes the evaporation of indium area, and the position of the evaporation of indium area needs to be accurate. A layer of indium with uniform thickness is evaporated on the surface of the MCC heat sink in the evaporation of indium area, and there should be no indium leakage outside the evaporation of indium area, otherwise it will affect the performance of the laser. The method currently used to control the position of the evaporation of indium area is to paste and shield the non-evaporation of indium area of the MCC heat sink to be evaporated with indium by high-temperature tape, then fix the MCC heat sink in a hollow evaporation of indium jig, place it in an evaporation of indium furnace for evaporation of indium, and then tear off the high-temperature tape on the surface of the MCC heat sink after the evaporation of indium is completed. This method is relatively simple, but it is difficult to master, the position of the tape is not easy to control, the quality consistency of the evaporation of indium of the MCC heat sink is poor, and the production efficiency is low. Therefore, a MCC heat sink evaporation of indium device and method with simple structure, high production efficiency and good evaporation of indium quality consistency are needed to solve the current problems of MCC heat sink evaporation of indium. SUMMARY

[0004] In view of the shortcomings of the prior art, the present application provides a MCC heat sink evaporation of indium device and method. The MCC heat sink evaporation of indium device has the advantages of simple structure, convenient operation and high production efficiency, and ensures high evaporation of indium quality consistency.

[0005] The present application also provides a method for evaporation of indium of MCC heat sink using the device.

[0006] Term explanation:

[0007] MCC (micro channel cooler): a copper heat sink with micro channels inside, which has strong heat dissipation capacity; in order to make the expression simple and clear, the professional term MCC is used in the present application.

[0008] The technical scheme of the present application is as follows:

[0009] The MCC heat sink indium evaporation device comprises a fixed plate and a cover plate matched with the fixed plate, a square groove is arranged in the middle of the fixed plate, evenly arranged indium evaporation areas I are arranged at both ends in the groove, an indium evaporation area III is arranged in the center of the groove, an indium evaporation area II is arranged between the indium evaporation area I and the indium evaporation area III, and the indium evaporation area I, the indium evaporation area II and the indium evaporation area III constitute an indium evaporation unit; a fixed hole I is arranged at each corner of the fixed plate, screw holes are uniformly arranged on the side surface of the fixed plate, and a jackscrew is arranged on the screw hole.

[0010] The cover plate is arranged above the fixed plate, a protrusion is arranged in the middle of the cover plate, and the protrusion is matched with the groove in shape and size; screw holes are arranged at four corners of the cover plate, and the screw holes are matched with the fixed holes I.

[0011] According to the present application, the groove is provided with notches at four corners. The notches are used to suspend the corners of the MCC heat sink, so that the edges of the MCC heat sink placed in the groove are tightly attached together around the groove.

[0012] According to the present application, 2-10 indium evaporation units are arranged in the groove, and the indium evaporation units are arranged in the groove in axial symmetry with the indium evaporation area III as the axis. One indium evaporation unit corresponds to one MCC heat sink, the indium evaporation area I is used for evaporating indium on the rear end of the MCC heat sink, the indium evaporation area II is used for evaporating indium on the areas on both sides of the positioning hole II of the MCC heat sink, and the indium evaporation area III is used for evaporating indium on the front end of the MCC heat sink. During the evaporation of indium, the indium vapor can pass through the indium evaporation area and be adsorbed to the surface of the MCC heat sink to form an indium layer.

[0013] According to the present application, the indium evaporation area I is rectangular, and the number of the indium evaporation area I corresponds to the number of the MCC heat sink placed in the groove.

[0014] According to the present application, the indium evaporation area II is a symmetrical structure, and the number of the indium evaporation area II corresponds to the number of the MCC heat sink placed in the groove. The indium evaporation area II is a hollow structure in the shape of a Chinese character "K", and the size of the indium evaporation area II is matched with the areas on both sides of the positioning hole II of the MCC heat sink.

[0015] According to the present application, the indium evaporation area III is rectangular, and the number of the indium evaporation area III corresponds to the number of the MCC heat sink placed in the groove. A plurality of indium evaporation areas III jointly form a larger rectangular indium evaporation area.

[0016] According to the present application, the indium evaporation area I, the indium evaporation area II and the indium evaporation area III are all hollow structures.

[0017] According to the application, preferably, the number of the top pins is 4-6. By adjusting the top pins, the MCC heat sink is fixed in the front, back, left and right positions in the indium evaporation device, so that the adjacent MCC heat sinks are tightly fitted together in the front, back, left and right directions.

[0018] According to the application, preferably, the surface of the fixing plate is further provided with fixing holes II, and the surface of the cover plate is provided with fixing holes III corresponding to the fixing holes II. The fixing holes are used for fixing in the indium evaporation furnace.

[0019] According to the application, preferably, the screw holes are provided with fixing screws. The fixing screws are used for fixing the cover plate and the fixing plate together.

[0020] According to the application, a method for evaporating indium by using the MCC heat sink evaporation device is provided, and the method comprises the following steps:

[0021] (1) The MCC heat sink to be evaporated with indium is arranged in the indium evaporation unit of the fixing plate in a uniform manner with the side to be evaporated with indium facing downward, so that the front ends of the MCC heat sinks are aligned;

[0022] (2) After the MCC heat sinks are arranged in a full manner, the top pins are adjusted, so that the adjacent MCC heat sinks are tightly fitted together in the front, back, left and right directions;

[0023] (3) The cover plate is placed on the upper end of the fixing plate with the protrusions of the cover plate facing downward, and the fixing screws are used for fixing the cover plate, the fixing plate and the MCC heat sinks together;

[0024] (4) The MCC heat sink evaporation device after being assembled with the MCC heat sinks is placed in the indium evaporation furnace through the fixing holes III for evaporating indium;

[0025] (5) After the evaporation of indium is completed, the MCC heat sinks are taken out from the MCC heat sink evaporation device, and the evaporation of indium of the MCC heat sinks is completed.

[0026] In the application, the method for evaporating indium of the MCC heat sink is performed according to the prior art.

[0027] The application has the following beneficial effects:

[0028] 1. The MCC heat sink evaporation device provided by the application has the advantages of simple structure, low cost, convenient and reliable operation and inspection. The device can be used for evaporating indium of 2-10 MCC heat sinks according to the needs. Compared with the previous MCC evaporation device, the number of the MCC heat sinks loaded is increased by more than 2 times, and the working efficiency is greatly improved.

[0029] 2. The device is accurately designed for the evaporation area of the MCC heat sink. The MCC heat sink can be automatically positioned in the corresponding evaporation area by adjusting the top pins, and the adjacent MCC heat sinks are kept in close contact, so that the indium vapor cannot be evaporated to other positions of the heat sink through the gaps between the adjacent MCC heat sinks.

[0030] 3、The method for evaporating indium provided by the application is simpler in operation than the previous method of fixing the indium evaporation area by manually sticking adhesive tape, so that the assembly efficiency of the MCC heat sink is effectively improved, the consistency of the quality of the MCC heat sink evaporated with indium is improved, the qualified rate of the MCC heat sink evaporated with indium reaches more than 98%, and great economic benefits are achieved. BRIEF DESCRIPTION OF DRAWINGS

[0031] Figure 1 is a schematic diagram of the three-dimensional structure of the device of the application Figure I .

[0032] Figure 2 is a schematic diagram of the three-dimensional structure of the device of the application Figure II .

[0033] Figure 3 is a schematic diagram of the three-dimensional structure of the fixing plate in the device of the application.

[0034] Figure 4 is a schematic diagram of the front structure of the fixing plate in the device of the application.

[0035] Figure 5 is a schematic diagram of the three-dimensional structure of the heat sink in the device of the application.

[0036] Figure 6 is a schematic diagram of the three-dimensional structure of the fixing plate and the heat sink in the device of the application.

[0037] Figure 7 is a schematic diagram of the three-dimensional structure of the cover plate in the device of the application.

[0038] In the figure: 1, fixing plate, 2, fixing screw, 3, cover plate, 4, front top screw, 5, heat sink, 6, side top screw, 7, front screw hole, 8, fixing hole I, 9, fixing hole II, 10, side screw hole, 11, indium evaporation area I, 12, notch, 13, indium evaporation area II, 14, indium evaporation area III, 15, protrusion, 16, fixing hole III, 17, screw hole, 18, groove, 19, positioning hole I, 20, positioning hole II, 21, sealing groove. DETAILED DESCRIPTION

[0039] The application will be further described below in conjunction with the embodiments and the drawings. However, it is not limited thereto.

[0040] Example 1

[0041] As Figures 1-7As shown, the MCC heat sink indium evaporation device includes a fixed plate 1, a cover plate 3 matched with the fixed plate 2, a square groove 18 arranged in the middle of the fixed plate 1, and a plurality of indium evaporation areas Ⅰ 11 arranged uniformly on both sides of the groove 18, an indium evaporation area Ⅲ 14 arranged in the center of the groove, and an indium evaporation area Ⅱ 13 arranged between the indium evaporation area Ⅰ 11 and the indium evaporation area Ⅲ 14; the indium evaporation area Ⅰ 11, the indium evaporation area Ⅱ 13, and the indium evaporation area Ⅲ 14 form an indium evaporation unit; the fixed plate 4 is provided with a fixed hole Ⅰ 8 at each corner, and the side surface of the fixed plate 2 is uniformly provided with a screw hole; the screw hole for fixing the front and rear positions of the MCC heat sink 5 is a front screw hole 7, and the front screw hole 7 is provided with a front top screw 4; the screw hole for fixing the left and right positions of the MCC heat sink 5 is a side screw hole 10, and the side screw hole 10 is provided with a side top screw 6.

[0042] The cover plate 3 is located above the fixed plate 1, the cover plate 3 is provided with a protrusion 15 in the middle, the protrusion 15 corresponds in shape and size to the groove 18; the cover plate 3 is provided with a screw hole 17 at each corner, and the screw hole 17 corresponds to the fixed hole Ⅰ 8; the surface of the fixed plate is further provided with a fixed hole Ⅱ, and the surface of the cover plate is provided with a fixed hole Ⅲ. The fixed hole Ⅲ 16 and the fixed hole Ⅱ 9 are used to fix the combined indium evaporation device in the indium evaporation equipment.

[0043] The groove is provided with six indium evaporation units, and six MCC heat sinks 5 can be uniformly placed in the groove. The MCC heat sink 5 is provided with a positioning hole Ⅱ 20 in the middle, sealing grooves 21 are arranged on both sides of the positioning hole Ⅱ 20, and a positioning hole Ⅰ 19 is arranged at one end of the MCC heat sink 5.

[0044] The indium evaporation area Ⅰ is rectangular, and the number of the indium evaporation area Ⅰ is six; the indium evaporation area Ⅱ is a symmetrical structure, and the number of the indium evaporation area Ⅱ is six; the indium evaporation area Ⅲ is rectangular, and the number of the indium evaporation area Ⅲ is six; the indium evaporation area Ⅰ, the indium evaporation area Ⅱ, and the indium evaporation area Ⅲ are all hollow structures. The number of the front top screw 4 is three, and the number of the side top screw 6 is two. The front top screw 4 and the side top screw 6 are adjusted to fix the MCC heat sink 5 in the front and rear positions and the left and right positions in the indium evaporation device, so that the adjacent MCC heat sinks 5 are tightly attached together, the indium vapor cannot pass through the gap between the adjacent MCC heat sinks 5, and is evaporated to other positions of the MCC heat sink 5.

[0045] The screw hole 17 is provided with a fixing screw 2. The fixing screw 2 is used to fix the cover plate 3 and the fixed plate 1 together.

[0046] Example 2

[0047] The MCC heat sink indium evaporation device is used to perform the method of MCC heat sink indium evaporation, and the method includes the following steps:

[0048] (1) Place the MCC heat sink to be evaporated with indium downwards in the indium evaporation unit of the groove of the fixed plate, so that the front ends of the MCC heat sinks are aligned;

[0049] (2) After the MCC heat sink is full, adjust the front and side top wires clockwise to make the adjacent MCC heat sinks tightly fit together;

[0050] (3) Place the cover plate with the convex direction downward on the upper end of the fixed plate, and cooperate the cover plate, the fixed plate and the MCC heat sink together through the fixing screws;

[0051] (4) Place the MCC heat sink after the installation of the MCC heat sink in the indium evaporation furnace through the fixing hole III to evaporate the indium;

[0052] (5) After the evaporation of the indium is completed, remove the fixing screws of the MCC heat sink, take down the cover plate, rotate the front and side top wires counterclockwise with the internal hexagonal screws, and take out the MCC heat sink from the indium evaporation device to complete the evaporation of the MCC heat sink.

[0053] The qualified rate of the MCC heat sink in the embodiment is 98%.

[0054] Example 3

[0055] A MCC heat sink indium evaporation device, the structure is as described in Example 1, the difference is that the recess 18 is provided with a notch 12 at each corner. The notch is used to suspend the corner of the MCC heat sink, so that the edge of the MCC heat sink placed in the recess is tightly fit together with the four corners of the recess.

[0056] Comparative Example 1

[0057] A method for evaporating indium of a MCC heat sink, the steps are as follows: the MCC heat sink to be evaporated is pasted and shielded in the non-indium evaporation area by high-temperature tape, then the MCC heat sink is fixed in the hollow indium evaporation clamp and placed in the indium evaporation furnace for evaporation, and the high-temperature tape on the surface of the MCC heat sink is torn off after the evaporation of the indium is completed.

[0058] The qualified rate of the MCC heat sink in the comparative example is 80%.

[0059] In summary, the MCC heat sink indium evaporation device provided by the application has the advantages of simple structure, low cost, convenient and reliable operation and inspection, and the adjacent MCC heat sinks are kept in close contact. Compared with the previous manual tape fixing method for fixing the evaporation area, the operation is simpler, the MCC heat sink assembly efficiency is effectively improved, the MCC heat sink evaporation quality consistency is improved, the qualified rate of the MCC heat sink in Example 2 reaches more than 98%, and the qualified rate of the MCC heat sink in the comparative example is only 80%, which is improved by more than 18%, and has great economic benefits.

Claims

1. A MCC heat sink indium evaporation device, comprising a fixed plate and a cover plate matched with the fixed plate, a square groove is arranged in the middle of the fixed plate, a plurality of indium evaporation areas I are arranged uniformly at both ends of the groove, an indium evaporation area III is arranged in the center of the groove, an indium evaporation area II is arranged between the indium evaporation area I and the indium evaporation area III, and the indium evaporation area I, the indium evaporation area II and the indium evaporation area III constitute an indium evaporation unit; a plurality of fixed holes I are arranged at four corners of the fixed plate respectively, and a plurality of screw holes are arranged uniformly on the side surface of the fixed plate, and a plurality of jacks are arranged on the screw holes; the cover plate is arranged above the fixed plate, a protrusion is arranged in the middle of the cover plate, the protrusion is matched with the groove in shape and size; a plurality of screw holes are arranged at four corners of the cover plate respectively, and the screw holes are matched with the fixed holes I; a plurality of notches are arranged at four corners of the groove respectively; 2-10 indium evaporation units are arranged in the groove, and the indium evaporation units are arranged symmetrically with the indium evaporation area III as the axis in the groove.

2. The indium evaporation apparatus according to claim 1, wherein The indium evaporation area I is rectangular, and the number of the indium evaporation area I corresponds to the number of MCC heat sinks arranged in the groove.

3. The indium evaporation apparatus as recited in claim 1, wherein The indium evaporation area II is a symmetrical structure, and the number of the indium evaporation area II corresponds to the number of MCC heat sinks arranged in the groove.

4. The indium evaporation apparatus as recited in claim 1, wherein The indium evaporation area III is rectangular, and the number of the indium evaporation area III corresponds to the number of MCC heat sinks arranged in the groove.

5. The indium evaporation apparatus as claimed in claim 1, wherein The indium evaporation area I, the indium evaporation area II and the indium evaporation area III are all hollow structures.

6. The indium evaporation apparatus as recited in claim 1, wherein The number of the jacks is 4-6.

7. The indium evaporation apparatus as claimed in claim 1, wherein A plurality of fixed holes II are further arranged on the surface of the fixed plate, a plurality of fixed holes III are arranged on the surface of the cover plate, the fixed holes III correspond to the fixed holes II, and a plurality of fixed screws are arranged on the screw holes.

8. A method for MCC heat sink evaporation of indium using the MCC heat sink evaporation apparatus of claim 1, characterized in that, The MCC heat sink indium evaporation device comprises the following steps: (1) arranging MCC heat sinks to be evaporated in the indium evaporation units in the groove of the fixed plate with one side of the MCC heat sinks downward, and arranging the MCC heat sinks in the indium evaporation units with the front ends of the MCC heat sinks opposite to each other; (2) adjusting the jacks after the MCC heat sinks are arranged, so that the adjacent MCC heat sinks are tightly fitted together in front and back and left and right directions; (3) placing the protrusion of the cover plate downward on the upper end of the fixed plate, and cooperating the cover plate, the fixed plate and the MCC heat sinks through the fixed screws; (4) placing the MCC heat sink indium evaporation device after the MCC heat sinks are arranged in the indium evaporation furnace for evaporation; (5) taking out the MCC heat sinks from the MCC heat sink indium evaporation device after the evaporation is completed, and completing the evaporation of the MCC heat sinks.

Images