Electronic device, immersion cooling system, and liquid volume regulation module

Abstract

An electronic device, an immersion cooling system, and a liquid level adjustment module are disclosed. The electronic device includes at least one heat generating component and an immersion cooling system. The immersion cooling system includes a main tank and a liquid level adjustment module. The main tank is adapted to contain a heat dissipation medium, and the heat generating component is disposed in the main tank and immersed in the heat dissipation medium. The liquid level adjustment module includes an auxiliary tank and a pump. The auxiliary tank is adjacent to the main tank, and the heat dissipation medium in the main tank is adapted to overflow to the auxiliary tank. The pump is disposed in the auxiliary tank and is adapted to drive the heat dissipation medium in the auxiliary tank to flow into the main tank.

Description

TECHNICAL FIELD

[0001] The present invention relates to a cooling system, a regulating module and an electronic device having the same, and particularly relates to an immersion cooling system, a liquid level regulating module and an electronic device having the same. BACKGROUND

[0002] As the performance of servers develops rapidly, high-performance servers generate a large amount of waste heat. To avoid the accumulation of waste heat causing poor operation of the host, some servers are designed to immerse the motherboard in the heat dissipation liquid, the heat dissipation liquid absorbs the heat generated by the heat generating elements of the motherboard and vaporizes and condenses on the condensing pipeline, the drops of heat dissipation liquid condensed on the condensing pipeline fall back into the heat dissipation liquid through gravity, and the cycle achieves the effect of heat dissipation, which is called two-phase immersion cooling technology in the industry. The thermal expansion and contraction of the heat dissipation liquid, the evaporation of the heat dissipation liquid and / or the taking and placing of the motherboard, etc. will all cause the liquid level of the heat dissipation liquid to be too low or too high. The liquid level that is too low will cause the motherboard to be unable to be completely immersed in the heat dissipation liquid, resulting in a decrease in the heat dissipation effect, and the liquid level that is too high will reduce the recognizability of the status light of the motherboard. SUMMARY

[0003] The present invention provides an electronic device, an immersion cooling system and a liquid level regulating module, which can stably control the liquid level height of the heat dissipation medium.

[0004] The electronic device of the present invention comprises at least one heat generating component and an immersion cooling system. The immersion cooling system comprises a main tank body and a liquid level regulating module. The main tank body is adapted to contain a heat dissipation medium, and the heat generating component is arranged in the main tank body and immersed in the heat dissipation medium. The liquid level regulating module comprises an auxiliary tank body and a pump. The auxiliary tank body is adjacent to the main tank body, and the heat dissipation medium in the main tank body is adapted to overflow into the auxiliary tank body. The pump is arranged in the auxiliary tank body and is adapted to drive the heat dissipation medium in the auxiliary tank body to flow into the main tank body.

[0005] The immersion cooling system of the present invention comprises a main tank body and a liquid level regulating module. The main tank body is adapted to contain a heat dissipation medium, and at least one heat generating component is arranged in the main tank body and immersed in the heat dissipation medium. The liquid level regulating module comprises an auxiliary tank body and a pump. The auxiliary tank body is adjacent to the main tank body, and the heat dissipation medium in the main tank body is adapted to overflow into the auxiliary tank body. The pump is arranged in the auxiliary tank body and is adapted to drive the heat dissipation medium in the auxiliary tank body to flow into the main tank body.

[0006] The liquid level height regulating module of the present invention is applicable to an immersion cooling system. The immersion cooling system comprises a main tank body, and the main tank body is adapted to contain a heat dissipation medium. The liquid level height regulating module comprises an auxiliary tank body and a pump. The auxiliary tank body is adjacent to the main tank body. The pump is arranged in the auxiliary tank body. The pump drives the heat dissipation medium in the auxiliary tank body to backfill into the main tank body, so as to regulate the liquid level height of the heat dissipation medium in the main tank body.

[0007] In an embodiment of the present application, the volume of the auxiliary tank is less than the volume of the main tank.

[0008] In an embodiment of the present application, the volume of the auxiliary tank is not less than the volume of the at least one heat-generating component.

[0009] In an embodiment of the present application, the pump is disposed at the bottom of the auxiliary tank.

[0010] In an embodiment of the present application, the liquid level adjusting module includes a guide rail disposed in the auxiliary tank, and the pump is connected to the guide rail and adapted to move along the guide rail to the top of the auxiliary tank.

[0011] In an embodiment of the present application, the liquid level adjusting module includes a filter connected to the pump, and the pump is adapted to drive the heat-dissipating medium in the auxiliary tank to flow into the main tank through the filter.

[0012] In an embodiment of the present application, the liquid level adjusting module includes a pressure gauge connected to the pump.

[0013] In an embodiment of the present application, the liquid level adjusting module includes a liquid level sensor disposed in the auxiliary tank.

[0014] In an embodiment of the present application, the liquid level adjusting module includes a pipe connected to the pump and extending to the main tank, and the pump drives the heat-dissipating medium in the auxiliary tank to refill into the main tank through the pipe.

[0015] In an embodiment of the present application, the immersion cooling system includes a condensing structure disposed above the main tank, and the liquid heat-dissipating medium is adapted to be vaporized into gaseous heat-dissipating medium by the heat energy of the heat-generating component, when the gaseous heat-dissipating medium flows to the condensing structure, the gaseous heat-dissipating medium condenses into liquid heat-dissipating medium on the condensing structure, and the liquid heat-dissipating medium condensed on the condensing structure falls back into the liquid heat-dissipating medium in the main tank by gravity.

[0016] Based on the above, the present application adds a liquid level adjusting module (liquid level height adjusting module) beside the main tank of the immersion cooling system, the auxiliary tank of the liquid level adjusting module can receive the heat-dissipating medium overflowing from the main tank, and the pump of the liquid level adjusting module can drive the heat-dissipating medium in the auxiliary tank to refill into the main tank. Thus, when the liquid level of the heat-dissipating medium in the main tank rises or falls due to thermal expansion and contraction of the heat-dissipating medium, escape of the heat-dissipating medium, taking or placing of the heat-generating component in the main tank, or other factors, the liquid level adjusting module can immediately adjust the amount of the heat-dissipating medium in the main tank to a normal value, so that the liquid level does not become too low or too high. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 is a partial component perspective view of an electronic device according to an embodiment of the present invention;

[0018] Figure 2 is a schematic view of an immersion cooling system according to an embodiment of the present invention; Figure 1

[0019] Figure 3 is a partial component perspective view of an immersion cooling system according to an embodiment of the present invention; Figure 1

[0020] Figure 4 is a perspective view of a liquid level adjustment module according to an embodiment of the present invention; Figure 3

[0021] Figure 5 is a partial component side view of a liquid level adjustment module according to an embodiment of the present invention; Figure 4

[0022] Figures 6A to 6D illustrates a liquid level adjustment module adjusting a liquid level of a heat dissipation medium within a main tank according to an embodiment of the present invention; Figure 2

[0023] Figure 7 is a partial component exploded view of a liquid level adjustment module according to an embodiment of the present invention; Figure 4

[0024] Figure 8 is a partial component exploded view of a liquid level adjustment module according to an embodiment of the present invention. Figure 7 LEGEND

[0025]

[0026] 10: electronic device

[0027] 12: heat generating component

[0028] 100: immersion cooling system

[0029] 110: main tank

[0030] 120: condensing structure

[0031] 130: liquid level adjustment module

[0032] 130a: liquid level sensor

[0033] 131: pressure gauge

[0034] 131a: tee

[0035] 132: auxiliary tank

[0036] 133: cable

[0037] 134: pump​​​​​​​

[0038] 135: seat

[0039] 135a: fixing portion

[0040] 136: guide rail

[0041] 136a: sliding block

[0042] 137: frame body

[0043] 138: pipeline

[0044] 139: filter

[0045] M: heat dissipation medium DETAILED DESCRIPTION

[0046] Figure 1 is a partial component perspective view of an electronic device according to an embodiment of the present application. Figure 2 is a schematic view of an immersion cooling system according to the embodiment of the present application. Please refer to Figure 1 , the electronic device 10 according to the embodiment of the present application comprises a plurality of heat generating components 12 (shown in Figure 1 ) and an immersion cooling system 100. The immersion cooling system 100, as shown in Figure 2 , comprises two main tank bodies 110 and a condensing structure 120. The main tank bodies 110 are adapted to contain a heat dissipation medium M (indicated in Figure 2 ), and the heat generating components 12 are arranged in the main tank bodies 110 and immersed in the heat dissipation medium M. The liquid level of the heat dissipation medium M is controlled to be, for example, about 2-3 mm higher than the heat generating components 12. The condensing structure 120 is arranged above the main tank bodies 110. In other embodiments, the number of main tank bodies 110 can be one or other appropriate number, which is not limited by the present application. For the sake of clarity of the drawings, Figure 1 only one main tank body 110 is shown. Figure 2 Figure 2 In the embodiment, a cover can be used to cover the immersion cooling system 100 and seal the containing space of the immersion cooling system 100, so that the heat dissipation medium M performs the above-mentioned circulation in the sealed containing space. Moreover, the cover can be opened to facilitate the maintenance of the electronic device 10 or the disassembly and replacement of components.

[0047] In the embodiment, a cover can be used to cover the immersion cooling system 100 and seal the containing space of the immersion cooling system 100, so that the heat dissipation medium M performs the above-mentioned circulation in the sealed containing space. Moreover, the cover can be opened to facilitate the maintenance of the electronic device 10 or the disassembly and replacement of components.

[0048] ​The heat dissipation medium M is, for example, a dielectric liquid at room temperature, such as a fluorinated liquid having a boiling point of 40-60°C or other suitable heat dissipation medium, without being limited thereto. The liquid heat dissipation medium M absorbs heat generated by a central processing unit or other types of chips on the heat generating component 12, such as a motherboard in a server, to reduce the temperature of the heat generating component 12, and is rapidly vaporized into a gaseous state by the heat generated by the heat generating component 12. The gaseous heat dissipation medium M with high heat energy flows to the condensing structure 120 in the closed accommodating space, and is cooled and condensed into a liquid state on the condensing structure 120 by the low-temperature condensing liquid flowing in the condensing structure 120. The condensing liquid in the condensing structure 120 absorbs heat energy from the heat dissipation medium M, flows to the outside of the electronic device 10 for heat exchange and cooling, and then flows back to the condensing structure 120 for continuous circulation. On the other hand, the liquid drops of the heat dissipation medium M condensed on the condensing structure 120 fall back into the liquid heat dissipation medium M in the main tank body 110 by gravity, thereby achieving the effect of heat dissipation through circulation.

[0049] The electronic device 10 of the present embodiment further comprises a liquid level adjusting module 130. The liquid level adjusting module 130 is used to adjust the liquid level of the heat dissipation medium M in the main tank body 110, so that the liquid level is not too high or too low. Therefore, the liquid level adjusting module can also be referred to as a liquid level height adjusting module. The liquid level adjusting module 130 of the present embodiment is described in detail below with reference to the accompanying drawings.

[0050] Figure 3 is a partial component perspective view of the immersion cooling system of Figure 1 . Figure 4 is a perspective view of the liquid level adjusting module of Figure 3 . Figure 5 is a partial component side view of the liquid level adjusting module of Figure 4 . Please refer to Figures 3 to 5 , the liquid level adjusting module 130 comprises an auxiliary tank body 132, a pump 134 and a pipeline 138. The auxiliary tank body 132 is arranged between the two main tank bodies 110 and abuts the two main tank bodies 110, so that the heat dissipation medium M (indicated by Figure 2 ) in each main tank body 110 can overflow into the auxiliary tank body 132. The auxiliary tank body 132 is fixed between the two main tank bodies 110 by, for example, welding, locking or other suitable means. The pump 134 is arranged in the auxiliary tank body 132, and the pipeline 138 is connected to the pump 134 and extends to the main tank body 110. The pump 134 is adapted to drive the heat dissipation medium in the auxiliary tank body 132 to refill into the main tank body 110 through the pipeline 138, so as to adjust the liquid level height of the heat dissipation medium in the main tank body 110. In this way, when the heat dissipation medium in the main tank body 110 expands or contracts due to heat, the heat dissipation medium in the main tank body 110 escapes, or the heat generating component 12 (indicated by Figure 2When the liquid level of the heat dissipation medium in the main tank 110 is lowered due to the removal or other factors of the heat generating components 12, the liquid level adjusting module 130 can immediately adjust the amount of the heat dissipation medium in the main tank 110 to the normal value, so that the liquid level of the heat dissipation medium in the main tank 110 will not be too low or too high.

[0051] In the present embodiment, the auxiliary tank 132 is used to adjust the amount of the heat dissipation medium M in the main tank 110, instead of being used to accommodate the heat generating components 12, so the volume of the auxiliary tank 132 can be designed to be smaller than that of the main tank 110. Also, the volume of the auxiliary tank 132 is designed to be, for example, not less than the volume of the heat generating components 12, so that the maximum amount of the heat dissipation medium M that the auxiliary tank 132 can accommodate is sufficient to compensate for the amount of the liquid level drop caused by the removal of the heat generating components 12 from the main tank 110. In addition, the proportion of thermal expansion and contraction of the heat dissipation medium M can also be considered as a factor in determining the volume of the auxiliary tank 132, so as to ensure that the liquid level adjusting module 130 can effectively adjust the amount of the heat dissipation medium in the main tank 110 through the heat dissipation medium in the auxiliary tank 132.

[0052] Figures 6A to 6D The liquid level adjusting module adjusts the liquid level of the heat dissipation medium in the main tank. Specifically, when a heat generating component 12 is removed from the main tank 110 as shown in Figure 2 , the pump 134 drives the heat dissipation medium M in the auxiliary tank 132 to flow into the main tank 110, so that the liquid level of the heat dissipation medium M in the main tank 110 will not be lowered due to the removal of the heat generating component 12. In this process, part of the heat dissipation medium M in the auxiliary tank 132 flows into the main tank 110, so that the liquid level of the heat dissipation medium M in the auxiliary tank 132 is lowered. Figure 6A On the contrary, when a heat generating component 12 is placed into the main tank 110 as shown in

[0053] , since the height of the side wall of the main tank 110 is only slightly higher than the top end of the heat generating component 12 in it by about 2-3 mm, the heat dissipation medium M in the main tank 110 will overflow into the auxiliary tank 132, so that the liquid level of the heat dissipation medium M in the main tank 110 will not be raised due to the placement of the heat generating component 12. In this process, the heat dissipation medium M in the auxiliary tank 132 increases, so that the liquid level of the heat dissipation medium M in the auxiliary tank 132 is raised. Figure 6B On the other hand, when the heat dissipation medium M in the main tank 110 evaporates as shown in

[0054] , the pump 134 drives the heat dissipation medium M in the auxiliary tank 132 to flow into the main tank 110, so that the liquid level of the heat dissipation medium M in the main tank 110 will not be lowered due to its evaporation. In this process, part of the heat dissipation medium in the auxiliary tank 132 flows into the main tank 110, so that the liquid level of the heat dissipation medium in the auxiliary tank 132 is lowered. Figure 6C

[0055] ​In addition, when the heat dissipation medium M in the main tank 110 is as follows Figure 6D During the thermal expansion shown, since the height of the sidewall of the main tank 110 is only slightly higher than the top of the heating element 12 inside it by about 2 to 3 millimeters, the heat dissipation medium M in the main tank 110 will overflow into the auxiliary tank 132, preventing the liquid level of the heat dissipation medium M in the main tank 110 from rising due to thermal expansion. During this process, the amount of heat dissipation medium M in the auxiliary tank 132 increases, causing the liquid level of the heat dissipation medium M in the auxiliary tank 132 to rise.

[0056] like Figure 5 and Figures 6A to 6D As shown, in this embodiment, the pump 134 is disposed at the bottom of the auxiliary tank 132. Since the temperature of the heat dissipation medium M at the bottom of the auxiliary tank 132 is low, the pump 134 disposed there can avoid a reduction in service life due to high temperature. The configuration of the pump 134 in this embodiment will be specifically described below with reference to the accompanying drawings.

[0057] Figure 7 yes Figure 4 An exploded view of some components of the liquid volume regulation module. Figure 8 yes Figure 7 An exploded view of some components of the liquid volume regulation module. Please refer to... Figure 7 and Figure 8 In this embodiment, the liquid volume adjustment module 130 includes a guide rail 136. The guide rail 136 is disposed within a frame 137 in an auxiliary tank 132. A pump 134 is connected to the guide rail 136 and is adapted to move along the guide rail 136 towards the top of the auxiliary tank 132 to facilitate maintenance or replacement of the pump 134. Specifically, the pump 134 is mounted on a fixing part 135a of a support 135. The support 135 is assembled onto a slider 136a on the guide rail 136, allowing the support 135 and the pump 134 thereon to slide up and down along the guide rail 136 with the slider 136a. Furthermore, a cable 133 can be connected to the support 135, allowing the user to easily pull the support 135 and the pump 134 thereon to the top of the auxiliary tank 132 using the cable 133. In other embodiments, the pump 134 can be installed in other suitable ways, and the present invention is not limited thereto.

[0058] The liquid volume regulating module 130 of this embodiment also includes a filter 139. The filter 139 is connected to the pump 134 via a pipe 138. The pump 134 is adapted to drive the heat dissipation medium M in the auxiliary tank 132 through the filter 139 and flow into the main tank 110. This effectively reduces impurities in the heat dissipation medium M, thus maintaining its heat dissipation capacity. Furthermore, the liquid volume regulating module 130 of this embodiment... Figure 5 and Figure 7The pressure gauge 131 is connected to the pipe 138 between the pump 134 and the filter 139 by a three-way pipe 131a (indicated by the arrow in FIG. 1) in this embodiment. Figure 5 ) in this embodiment.

[0059] Please refer to Figure 4 The liquid level sensor 130a is arranged in the auxiliary tank 132 to sense the liquid level of the heat dissipation medium M in the auxiliary tank 132, so as to determine whether the amount of the heat dissipation medium M is sufficient. Thus, the liquid level sensor does not need to be arranged in the main tank 110, and the liquid level sensing is not affected by the boiling fluctuation of the heat dissipation medium M in the main tank 110 due to the high temperature of the heat generating component 12.

[0060] In summary, the liquid amount adjusting module is added to the main tank of the immersion cooling system according to the present application. The auxiliary tank of the liquid amount adjusting module can receive the overflow of the heat dissipation medium from the main tank, and the pump of the liquid amount adjusting module can drive the heat dissipation medium in the auxiliary tank to flow into the main tank. Thus, when the liquid level of the heat dissipation medium in the main tank fluctuates due to thermal expansion and contraction, evaporation, or the placement of the heat generating component in the main tank, the liquid amount adjusting module can immediately adjust the amount of the heat dissipation medium in the main tank to a normal value, so that the liquid level does not become too low or too high. In addition, the filter and the liquid level sensor can be arranged in the liquid amount adjusting module according to the present application, so that the filter and the liquid level sensor can be used to filter impurities and sense the liquid level of the heat dissipation medium without occupying the internal space of the main tank.

Claims

1. An electronic device, comprising: comprising: at least one heat generating component; and a submersion cooling system comprising: a main tank adapted to contain a heat dissipation medium, wherein the at least one heat generating component is configured to be submerged in the heat dissipation medium within the main tank; and a liquid level regulating module comprising an auxiliary tank, a liquid level sensor, a pipe and a pump, wherein the auxiliary tank is adjacent to the main tank, at least a portion of the heat dissipation medium within the main tank overflows from a top surface of the main tank to the auxiliary tank, the pump is configured to be within the auxiliary tank, wherein the heat dissipation medium flowing from the main tank flows unidirectionally along a path from a top surface of a sidewall of the main tank towards the auxiliary tank, wherein the pipe is connected to the pump and extends to a top portion of the main tank, the pump drives the heat dissipation medium within the auxiliary tank to refill from the top portion of the main tank to the main tank via the pipe, the liquid level sensor is configured to be within the auxiliary tank, wherein a liquid level of the heat dissipation medium within the main tank is higher than a liquid level of the heat dissipation medium within the auxiliary tank.

2. The electronic device of claim 1, wherein a volume of the auxiliary tank is less than a volume of the main tank.

3. The electronic device of claim 1, wherein a volume of the auxiliary tank is not less than a volume of the at least one heat generating component.

4. The electronic device of claim 1, wherein the pump is configured to be at a bottom portion of the auxiliary tank.

5. The electronic device of claim 1, wherein the liquid level regulating module comprises a guide rail configured to be within the auxiliary tank, the pump is connected to the guide rail and is adapted to move along the guide rail towards a top portion of the auxiliary tank.

6. The electronic device of claim 1, wherein the liquid level regulating module comprises a filter connected to the pump, the pump is adapted to drive the heat dissipation medium within the auxiliary tank to flow to the main tank after passing through the filter.

7. The electronic device of claim 1, wherein the liquid level regulating module comprises a pressure gauge connected to the pump.

8. The electronic device of claim 1, wherein the submersion cooling system comprises a condensing structure configured to be above the main tank, the heat dissipation medium in a liquid state is adapted to be vaporized into the heat dissipation medium in a gaseous state by heat energy of the at least one heat generating component, when the heat dissipation medium in the gaseous state flows to the condensing structure, the heat dissipation medium in the gaseous state condenses into the heat dissipation medium in the liquid state on the condensing structure, the heat dissipation medium in the liquid state condensed on the condensing structure falls back into the heat dissipation medium in the liquid state within the main tank by gravity.

9. An immersion cooling system characterized in that, comprising: a main tank adapted to contain a heat dissipation medium, wherein at least one heat generating component is adapted to be configured within the main tank to be submerged in the heat dissipation medium; and a liquid level regulating module comprising an auxiliary tank, a liquid level sensor, a pipe and a pump, wherein the auxiliary tank is adjacent to the main tank, at least a portion of the heat dissipation medium within the main tank overflows from a top surface of the main tank to the auxiliary tank, the pump is configured to be within the auxiliary tank, wherein the heat dissipation medium flowing from the main tank flows unidirectionally along a path from a top surface of a sidewall of the main tank towards the auxiliary tank, ​ wherein the pipe is connected to the pump and extends to a top of the main tank, the pump drives the heat dissipation medium in the auxiliary tank to backfill from the top of the main tank into the main tank through the pipe, the liquid level sensor is disposed in the auxiliary tank, wherein the liquid level of the heat dissipation medium in the main tank is higher than the liquid level of the heat dissipation medium in the auxiliary tank.

10. The immersion cooling system of claim 9, wherein a volume of the auxiliary tank is less than a volume of the main tank.

11. The immersion cooling system of claim 9, wherein the pump is disposed at a bottom of the auxiliary tank.

12. The immersion cooling system of claim 9, wherein the liquid level adjustment module comprises a guide rail, the guide rail is disposed in the auxiliary tank, the pump is connected to the guide rail and is adapted to move along the guide rail to a top of the auxiliary tank.

13. The immersion cooling system of claim 9, wherein the liquid level adjustment module comprises a filter, the filter is connected to the pump, the pump is adapted to drive the heat dissipation medium in the auxiliary tank to flow into the main tank through the filter.

14. The immersion cooling system of claim 9, wherein the liquid level adjustment module comprises a pressure gauge, the pressure gauge is connected to the pump.

15. The immersion cooling system of claim 9, wherein the liquid level adjustment module comprises a liquid level sensor, the liquid level sensor is disposed in the auxiliary tank.

16. The immersion cooling system of claim 9, comprising a condensing structure, wherein the condensing structure is disposed above the main tank, the heat dissipation medium in liquid state is adapted to be vaporized into the heat dissipation medium in gaseous state by heat energy of the at least one heat generating component, when the heat dissipation medium in gaseous state flows to the condensing structure, the heat dissipation medium in gaseous state condenses into the heat dissipation medium in liquid state on the condensing structure, the heat dissipation medium in liquid state condensed on the condensing structure falls back into the heat dissipation medium in liquid state in the main tank by gravity.

17. A liquid level adjustment module adapted for use in the submersion cooling system of any one of claims 9-16, the submersion cooling system comprising a main tank adapted to hold a heat dissipation medium, characterized in that, the liquid level adjustment module comprises: an auxiliary tank adjacent to the main tank; and a pump disposed in the auxiliary tank, wherein the pump drives the heat dissipation medium in the auxiliary tank to backfill from above the main tank into the main tank to adjust the liquid level of the heat dissipation medium in the main tank, wherein the liquid level of the heat dissipation medium in the main tank is higher than the liquid level of the heat dissipation medium in the auxiliary tank.

18. The liquid level adjustment module of claim 17, wherein the pump is disposed at a bottom of the auxiliary tank.

19. The liquid level adjustment module of claim 17, comprising a guide rail, wherein the guide rail is disposed in the auxiliary tank, the pump is connected to the guide rail and is adapted to move along the guide rail to a top of the auxiliary tank.

20. The liquid level adjustment module of claim 17, comprising a filter, wherein the filter is connected to the pump, the pump is adapted to drive the heat dissipation medium in the auxiliary tank to flow into the main tank through the filter.

21. The liquid level adjustment module of claim 17, comprising a pressure gauge, wherein the pressure gauge is connected to the pump.

22. The liquid level adjustment module of claim 17, comprising a liquid level sensor, wherein the liquid level sensor is disposed in the auxiliary tank.

23. The liquid level adjustment module of claim 17, comprising a pipe connected to the pump and extending toward the main tank, the pump driving the heat transfer medium in the auxiliary tank to backfill into the main tank via the pipe.

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