Wafer box, wafer transfer apparatus and control method, electrical apparatus, and storage medium

Abstract

Embodiments of the present application disclose a wafer box, wafer conveying equipment and control method, electrical equipment and storage medium. The wafer box comprises a bearing part and a light source, the bearing part comprises two oppositely arranged side plate parts and a plurality of bearing plates, the two side plate parts have a containing space and a taking and placing opening located on one side of the containing space, the containing space is used for accommodating a plurality of wafers, the plurality of bearing plates are connected to one side of the two side plate parts close to the containing space, and two adjacently arranged bearing plates and the side plate part jointly form an accommodation groove; and the light source is arranged on one side of the containing space away from the taking and placing opening and one side of at least one side plate part close to the accommodation groove, and is used for emitting light towards the accommodation groove, when the accommodation groove accommodates the edge of the wafer, part of light of the light source is blocked by the wafer, and another part of light of the light source is emitted towards the taking and placing opening.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor technology, in particular to a wafer box, wafer conveying equipment and control method, electrical equipment and storage medium. BACKGROUND

[0002] In the packaging and testing process of semiconductors, wafers need to be conveyed between different devices for operations such as dicing, probe testing or die bonding. Automated wafer conveying and testing are important links in the semiconductor manufacturing process. Different wafer processing equipment has different requirements for the size, surface quality and die yield of incoming wafers. Wafers are affected by the environment and operation during storage, transportation and conveying operations, and there is a certain damage and defect rate. Therefore, the traditional wafer picking and placing process cannot perform clear force sensing and counting, which brings challenges to the precise alignment, conveying and automated operation of wafers. SUMMARY

[0003] The embodiments of the present application disclose a wafer box, wafer conveying equipment and control method, electrical equipment and storage medium, which can achieve the purpose of precise alignment, conveying and automated operation of wafers.

[0004] In one aspect, the embodiments of the present application disclose a wafer box, which comprises a bearing member and a light source. The bearing member comprises two side plate portions arranged oppositely and a plurality of bearing plates. The two side plate portions have a containing space and a picking and placing opening located on one side of the containing space. The containing space is used to accommodate a plurality of wafers. The plurality of bearing plates are connected to one side of the two side plate portions close to the containing space, and two adjacent bearing plates and the side plate portion together form an accommodation groove for accommodating the edges of the wafers. The light source is arranged on one side of the containing space away from the picking and placing opening and one side of at least one side plate portion close to the accommodation groove, and is used to emit light towards the accommodation groove. When the accommodation groove accommodates the edges of the wafers, part of the light of the light source is blocked by the wafers, and the other part of the light of the light source is emitted towards the picking and placing opening.

[0005] Compared with the prior art, the wafer box disclosed by the present application can block part of the light of the light source by the wafers when the accommodation groove accommodates the wafers, and the other part of the light of the light source is emitted towards the picking and placing opening, so that the light and dark contrast in the wafer box is more intense, and the storage condition of the wafers in the wafer box can be observed more clearly.

[0006] According to an embodiment of the present application, the light source comprises a first light source arranged on a side of the accommodating space away from the access opening, a second light source arranged on one of the side plate portions close to the receiving groove, and a third light source arranged on the other side plate portion close to the receiving groove. By arranging the first light source, the second light source and the third light source, the light irradiation in the wafer box can be more uniform, and the shadow is less likely to affect the observation of the wafer storage.

[0007] According to an embodiment of the present application, the first light source comprises a light-emitting plate connected between the two side plate portions for emitting light toward the side of the accommodating space away from the access opening; the second light source, the third light source and the receiving groove are each in a plurality, and each of the second light source and the third light source is used for emitting light toward the corresponding receiving groove. By arranging the first light source comprising a light-emitting plate, and each of the second light source and the third light source being used for emitting light toward the corresponding receiving groove, the light source forms a C-shaped light emission to the accommodating space, which is more matched to the shape of the wafer and is less likely to produce shadows, thereby facilitating clearer observation of the wafer storage in the wafer box.

[0008] According to an embodiment of the present application, the carrier further comprises a back plate portion connected to the two side plate portions away from the access opening, the number of the light sources is a plurality, and the number of the receiving grooves is a plurality, each of the light sources corresponding to one of the receiving grooves and comprising the first light source arranged on the back plate portion close to the accommodating space, the second light source arranged on one of the side plate portions close to the receiving groove, and the third light source arranged on the other side plate portion close to the receiving groove. By arranging the first light source arranged on the back plate portion close to the accommodating space, the second light source arranged on one of the side plate portions close to the receiving groove, and the third light source arranged on the other side plate portion close to the receiving groove for emitting light toward the corresponding receiving groove, the light source forms a C-shaped light emission to the accommodating space, which is more matched to the shape of the wafer and is less likely to produce shadows, thereby facilitating clearer observation of the wafer storage in the wafer box.

[0009] According to an embodiment of the present application, the first light source, the second light source and the third light source independently emit light and / or at least two of the first light source, the second light source and the third light source are connected in one body and emit light at the same time.

[0010] According to an embodiment of the present application, the first light source, the second light source and the third light source each comprise a light-emitting surface corresponding to a side surface of the wafer, and a top of the light-emitting surface is higher than a top of the corresponding wafer; the back plate portion is an arc-shaped plate protruding outward from the containing space, or a surface of the back plate portion close to the containing space is an arc-shaped surface protruding outward from the containing space. By arranging the first light source, the second light source and the third light source each to comprise a light-emitting surface corresponding to a side surface of the wafer, and a top of the light-emitting surface is higher than a top of the corresponding wafer, when the light source irradiates the wafer, part of the light of the light source is blocked by the wafer, and another part of the light can also be emitted to the taking and placing opening, so that a user or other operating equipment can clearly observe the storage state of the wafer in the wafer box from the taking and placing opening. Meanwhile, by arranging the back plate portion to be an arc-shaped plate protruding outward from the containing space, or a surface of the back plate portion close to the containing space to be an arc-shaped surface protruding outward from the containing space, the wafer can be more matched with the shape of the wafer and be more convenient to store.

[0011] In the second aspect, the embodiments of the present application further disclose a wafer carrying device, which comprises the wafer box, a carrying module, a visual sensing module and a control module according to any one of the above embodiments. The carrying module is used to obtain or place the wafer from the taking and placing opening. The visual sensing module is used to shoot the containing space on one side of the taking and placing opening and output a first shooting image. The control module is electrically connected to the carrying module and the visual sensing module, and is used to receive and control the carrying module to carry out alignment according to the first shooting image, and control the carrying module to obtain or place the wafer after the alignment is completed.

[0012] Compared with the prior art, the wafer carrying device provided by the present application shoots the containing space on one side of the taking and placing opening and outputs a first shooting image, so that the control module controls the carrying module to carry out alignment according to the first shooting image, and controls the carrying module to obtain or place the wafer, thereby realizing accurate alignment and grabbing of the wafer in the wafer box, and realizing accurate carrying and automatic operation of the wafer.

[0013] In the third aspect, the embodiments of the present application further disclose a wafer carrying control method, which comprises the following steps:

[0014] providing a wafer box, wherein the wafer box is the wafer box according to any one of the above embodiments;

[0015] obtaining a first shooting image of the containing space shot on one side of the taking and placing opening when the light source emits light;

[0016] control the carrying module to perform the alignment according to the first photographing image; and

[0017] control the carrying module to perform the wafer pickup or placement after the alignment is completed.

[0018] Compared with the prior art, the wafer carrying control method provided in the application realizes accurate alignment and grabbing of the wafers in the wafer box, and thus realizes accurate wafer carrying and automatic operation, by taking a first photographing image of the containing space on the side of the pickup and placement opening when the light source emits light towards the containing space, and controlling the carrying module to perform alignment according to the first photographing image, and completing the wafer pickup or placement.

[0019] In a fourth aspect, the embodiment of the application further discloses an electrical device, which comprises a memory and a processor, the memory stores computer readable instructions, and the computer readable instructions are executed by the processor to enable the processor to implement the wafer carrying control method in any one of the above aspects.

[0020] In a fifth aspect, the embodiment of the application further discloses a computer readable storage medium, which stores computer readable instructions, and the computer readable instructions are executed by a processor to implement the wafer carrying control method in any one of the above aspects. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the application, the drawings needed in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative effort on the basis of these drawings.

[0022] Figure 1 is a perspective view of a wafer carrying device disclosed by an embodiment of the application;

[0023] Figure 2 is a perspective view of a wafer box disclosed by an embodiment of the application;

[0024] Figure 3 is Figure 2 is a cross-sectional view of the wafer box shown in FIG. 5;

[0025] Figure 4 is Figure 2 is a top view of the wafer box shown in FIG. 5;

[0026] Figure 5 is a top view of a wafer box disclosed by another embodiment of the application;

[0027] Figure 6is a three-dimensional schematic view of a carrying module disclosed by one embodiment of the present application;

[0028] Figure 7 is a flow chart of a wafer carrying control method disclosed by one embodiment of the present application;

[0029] Figure 8 is a working flow chart of a wafer carrying equipment using the wafer carrying control method shown in Figure 5 ;

[0030] Figure 9 is a partial working flow chart of a wafer carrying equipment using the wafer carrying control method shown in Figure 5 ;

[0031] Figure 10 is a structural schematic view of an electrical equipment disclosed by one embodiment of the present application;

[0032] Figure 11 is a structural schematic view of a computer readable storage medium disclosed by one embodiment of the present application. DETAILED DESCRIPTION

[0033] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present application.

[0034] In the present application, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0035] Moreover, in addition to indicating the orientation or positional relationship, the above-mentioned partial terms can also be used to indicate other meanings, for example, the term "upper" can also be used to indicate a certain dependent relationship or connection relationship in some cases. Those of ordinary skill in the art can understand the specific meaning of these terms in the present application according to the specific circumstances.

[0036] In addition, the terms "mount", "set", "provided with", "connected", "linked" should be broadly understood. For example, it can be fixed connection, detachable connection, or integral structure; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate media, or internal communication between two devices, elements or components. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0037] In addition, the terms "first", "second" and the like are mainly used to distinguish different devices, elements or components (the specific type and structure may be the same or different), and are not intended to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise stated, the meaning of "multiple" is two or more.

[0038] In some related technologies, the wafer handling equipment uses a sensor to position and handle. However, some use the sensor as an indirect measurement. When there is an installation error or position deviation between the sensor position and the real wafer position, the reliability and safety of accurate positioning and handling are not easy to guarantee. In addition, some related technologies do not have a contact force sensing module in the wafer handling process, and it is difficult to determine the actual contact between the wafer carrier and the wafer. When the preset wafer picking position deviates, it will cause picking error judgment, that is, there is a possibility that the preset picking position is reached without picking and the next step is continued to execute. In addition, some related technologies do not have wafer pre-detection and classification functions in the wafer handling process. The wafer handling process is essentially to serve the front and rear process procedures. Wafer handling without detection and classification has the possibility of processing defective wafers in the rear process, wasting manpower and resources, and reducing wafer processing efficiency.

[0039] To improve the above problems, the embodiments of the present application disclose a wafer box 10, a wafer handling equipment 1 and a control method, an electrical equipment 2 and a storage medium 3, which can achieve the purpose of accurate wafer handling and automatic operation. The following will be described in detail.

[0040] Please refer to Figures 1-4 , Figure 1 is a perspective view of a wafer handling equipment 1 disclosed by an embodiment of the present application; Figure 2 is a perspective view of a wafer box 10 disclosed by an embodiment of the present application; Figure 3 is Figure 2 is a cross-sectional view of the wafer box 10 shown in Figure 4 is Figure 2 is a top view of the wafer box 10 shown in

[0041] As Figure 1As shown, the embodiment of the present application discloses a wafer carrying device 1, which comprises a wafer box 10, a carrying module 20, a visual sensing module 30 and a control module 40. In the embodiment, the wafer box 10 comprises a carrier 11 and a light source 12, the carrying module 20 is used for taking or placing the wafer from or at the taking and placing opening 112, the visual sensing module 30 is used for shooting the containing space 111 at one side of the taking and placing opening 112 and outputting a first shooting image, and the control module 40 is electrically connected with the carrying module 20 and the visual sensing module 30, and is used for receiving and controlling the carrying module 20 to carry out alignment according to the first shooting image, and controlling the carrying module 20 to take or place the wafer after the alignment is completed.

[0042] It can be understood that the wafer carrying device 1 can take or place the wafer from the wafer box 10, the visual sensing module 30 shoots the containing space 111 at one side of the taking and placing opening 112 and outputs a first shooting image during carrying the wafer, and the control module 40 controls the carrying module 20 to carry out alignment according to the first shooting image and completes taking or placing the wafer. Therefore, the wafer carrying device 1 can realize accurate alignment and grabbing of the wafer in the wafer box 10, and further realize accurate carrying and automatic operation of the wafer.

[0043] The wafer carrying device 1 can realize accurate alignment and grabbing of the wafer in the wafer box 10 by shooting the containing space 111 at one side of the taking and placing opening 112 and outputting a first shooting image, so that the control module 40 controls the carrying module 20 to carry out alignment according to the first shooting image and controls the carrying module 20 to take or place the wafer, thereby realizing accurate carrying and automatic operation of the wafer.

[0044] Specifically, please refer to Figures 2-4In the embodiment, the wafer box 10 comprises a carrier 11 and a light source 12. The carrier 11 comprises two oppositely arranged side plate portions 113b and a plurality of carrier plates 114. The two side plate portions 113b have a receiving space 111 and a taking and placing opening 112 located at one side of the receiving space 111. The receiving space 111 is used to accommodate a plurality of wafers. The plurality of carrier plates 114 are connected to the two side plate portions 113b at the side close to the receiving space 111. Two adjacent carrier plates 114 and the side plate portion 113b together form a receiving groove 115 for accommodating the edge of the wafer. The light source 12 is arranged at the side of the receiving space 111 away from the taking and placing opening 112 and at the side of at least one side plate portion 113b close to the receiving groove 115, and is used to emit light towards the receiving groove 115. When the receiving groove 115 accommodates the edge of the wafer, part of the light of the light source 12 is blocked by the wafer, and the other part of the light of the light source 12 is emitted towards the taking and placing opening 112.

[0045] It can be understood that, by arranging the light source 12 at the side of the receiving space 111 away from the taking and placing opening 112 and at the side of at least one side plate portion 113b close to the receiving groove 115, when the receiving groove 115 accommodates the edge of the wafer, part of the light of the light source 12 is blocked by the wafer, so that the receiving groove 115 accommodating the wafer becomes dark, and the other part of the light of the light source 12 is emitted towards the taking and placing opening 112, so that the receiving groove 115 not accommodating the wafer becomes bright, thereby forming a more obvious light and dark contrast in the wafer box 10, and facilitating more clear observation of the storage condition of the wafers in the wafer box 10.

[0046] Further, the light source 12 comprises a first light source 12a arranged at the side of the receiving space 111 away from the taking and placing opening 112, a second light source 12b arranged at the side of one side plate portion 113b close to the receiving groove 115, and a third light source 12c arranged at the side of the other side plate portion 113b close to the receiving groove 115. By arranging the first light source 12a, the second light source 12b and the third light source 12c, the light irradiation in the wafer box 10 can be more uniform, and it is not easy to produce a shadow to affect the observation of the storage of the wafers.

[0047] Further, the first light source 12a comprises a light-emitting plate 113c connected between the two side plate portions 113b for emitting light toward the side of the access opening 112 via the accommodation space 111; the second light source 12b, the third light source 12c and the receiving grooves 115 are each in plurality, and each of the second light source 12b and the third light source 12c is for emitting light toward the corresponding receiving groove 115. It can be understood that the first light source 12a is the light-emitting plate 113c, which can emit light from the side of the accommodation space 111 away from the access opening 112 toward the side of the access opening 112, and the second light source 12b and the third light source 12c emit light toward the corresponding receiving groove 115, forming a C-shaped light-emitting with the first light source 12a, which can better match the shape of the wafer and is not easy to produce shadow, facilitating more clearly observing the storage condition of the wafer in the wafer box 10.

[0048] Specifically, the first light source 12a, the second light source 12b and the third light source 12c independently emit light and / or at least two of the first light source 12a, the second light source 12b and the third light source 12c are connected together and emit light at the same time.

[0049] Please refer to Figure 5 , Figure 5 is a top view of a wafer box 10 disclosed in another embodiment of the present application. In other embodiments, the carrier 11 further comprises a back plate portion 113a connected to the two side plate portions 113b away from the access opening 112, and the number of light sources 12 is in plurality, and the number of receiving grooves 115 is in plurality, and each of the light sources 12 corresponds to one of the receiving grooves 115 and comprises the first light source 12a arranged on the side of the back plate portion 113a close to the accommodation space 111, the second light source 12b arranged on the side of one of the side plate portions 113b close to the receiving groove 115, and the third light source 12c arranged on the side of the other side plate portion 113b close to the receiving groove 115. It can be understood that the first light source 12a arranged on the side of the back plate portion 113a close to the accommodation space 111, the second light source 12b arranged on the side of one of the side plate portions 113b close to the receiving groove 115, and the third light source 12c arranged on the side of the other side plate portion 113b close to the receiving groove 115 are for emitting light toward the corresponding receiving groove 115, so that the light sources 12 form a C-shaped light-emitting toward the accommodation space 111, which can better match the shape of the wafer and is not easy to produce shadow, facilitating more clearly observing the storage condition of the wafer in the wafer box 10.

[0050] Further, the first light source 12a, the second light source 12b and the third light source 12c each include a light-emitting surface 121 corresponding to the side surface of the wafer, and the height of the top of the light-emitting surface 121 is higher than the height of the top of the corresponding wafer; the back plate portion 113a is an arc-shaped plate protruding outward from the containing space 111, or the surface of the back plate portion 113a close to the containing space 111 is an arc-shaped surface protruding outward from the containing space 111. By arranging the first light source 12a, the second light source 12b and the third light source 12c each to include a light-emitting surface 121 corresponding to the side surface of the wafer, and the height of the top of the light-emitting surface 121 is higher than the height of the top of the corresponding wafer, when the light source 12 irradiates the wafer, part of the light of the light source 12 is blocked by the wafer, and another part of the light can also be directed to the taking and placing opening 112, so that the user or other operating equipment can clearly observe the storage condition of the wafer in the wafer box 10 from the taking and placing opening 112. At the same time, by arranging the back plate portion 113a to be an arc-shaped plate protruding outward from the containing space 111, or the surface of the back plate portion 113a close to the containing space 111 to be an arc-shaped surface protruding outward from the containing space 111, the wafer can be more matched with the shape of the wafer, and the storage of the wafer is more convenient.

[0051] Further, the wafer box 10 further includes a pressure sensor 13, a counting module 14 and a communication module 15, the pressure sensor 13 is arranged on the side of the bearing plate 114 bearing the wafer, and is electrically connected to the counting module 14 and the communication module 15, the communication module 15 is electrically connected to the control module 40, the pressure sensor 13 is used for sensing whether the wafer is placed in the containing groove 115 and sending a first sensing signal to the counting module 14, so that the counting module 14 counts the wafers in the wafer box 10 according to the first sensing signal, and the communication module 15 sends the counting result recorded by the counting module 14 to the control module 40; the counting module 14 is also used for displaying the counting result; the two bearing plates 114 are each provided with the pressure sensor 13, the number of the pressure sensors 13 is twice the number of the wafers that can be accommodated in the wafer box 10; the pressure sensor 13 is located in the middle area of the side of the bearing plate 114 bearing the wafer. By arranging the two bearing plates 114 each to be provided with the pressure sensor 13, the placement condition of the wafers in the wafer box 10 can be accurately obtained through pressure sensing, and then counted and displayed through the counting module 14, and the counting result is sent to the control module 40 through the communication module 15, so that the control module 40 can be controlled to operate, thereby realizing accurate wafer handling and automatic operation.

[0052] Further, referring to Figure 6 , the carrying module 20 includes a moving assembly 21 electrically connected to the control module 40 and a wafer carrier 22 connected to the moving assembly 21, the moving assembly 21 is used to drive the wafer carrier 22 to move under the control of the control module 40, and the visual sensing module 30 is arranged on the wafer carrier 22, so that the visual sensing module 30 can move together with the wafer carrier 22. By arranging the visual sensing module 30 on the wafer carrier 22 of the carrying module 20, the visual sensing module 30 can move together with the wafer carrier 22, so that the visual sensing module 30 does not need to be driven to move by other devices alone, and the visual angle of the visual sensing module 30 for shooting the first shooting image is the same as the operation visual angle of the wafer carrier 22, so that the control algorithm is simpler and less prone to errors, and higher operation efficiency is achieved while realizing accurate wafer carrying and automatic operation.

[0053] Specifically, the moving assembly 21 includes a base 211, a first moving joint 212 arranged on the base 211 and capable of stretching and retracting along a second preset direction, a first rotating arm 213 having one end rotatably connected to the first moving joint 212, a second rotating arm 214 having one end rotatably connected to the other end of the first rotating arm 213, and the wafer carrier 22 rotatably connected to the other end of the second rotating arm 214. In this embodiment, the first preset direction and the second preset direction can be the same direction. It can be understood that the moving assembly 21 is a multi-degree-of-freedom robot, and the second rotating arm 214 and the wafer carrier 22 can be integrally connected or rotatably connected. The moving assembly 21 can realize accurate wafer carrying and automatic operation.

[0054] Further, the wafer carrier 22 includes a connecting base 221 arranged on the moving assembly 21 along the second preset direction and a carrying part 222 connected to one side of the connecting base 221, and the visual sensing module 30 is arranged on the side of the connecting base 221 away from the moving assembly 21 along the second preset direction, and the visual sensing module 30 is used to shoot the side where the carrying part 222 is located. It can be understood that the first moving joint 212, the connecting base 221, and the visual sensing module 30 are all arranged along the second preset direction, so that position conversion is not needed during picking and placing, improving the accuracy and efficiency of positioning during wafer picking and placing. By connecting and arranging the moving assembly 21, the visual sensing module 30, and the carrying part 222, control can be more efficient, and carrying can be more accurate.

[0055] Further, the visual sensing module 30 comprises a camera mounting plate 31 arranged on the connecting base 221, a first industrial camera 32 arranged on the camera mounting plate 31, and a first lens 33 mounted on the first industrial camera 32. In the embodiment, the first lens 33 can be a telecentric lens.

[0056] Further, the wafer conveying device 1 further comprises a wafer sensor 50 arranged on the surface of the conveying part 222 close to the wafer and at the end of the conveying part 222 away from the connecting base 221, and electrically connected to the control module 40. The wafer sensor 50 is configured to sense the wafer and output a second sensing signal to the control module 40, so that the control module 40 counts and / or monitors the wafer conveying by the conveying module 20. By arranging the wafer sensor 50 on the surface of the conveying part 222 close to the wafer and at the end of the conveying part 222 away from the connecting base 221, the control module 40 can perceive the contact state between the wafer and the conveying part 222 in real time through the second sensing signal, accurately perceive and synchronously count the wafer conveying, thereby ensuring the reliability of the wafer conveying and conveying process.

[0057] Specifically, the conveying part 222 comprises two arm parts 222a, both of which are connected to the connecting base 221 and form a U-shaped opening, the opening is directed away from the connecting base 221, and the wafer sensor 50 is arranged at the end of the arm part 222a away from the connecting base 221. One wafer sensor 50 is arranged on the side of each arm part 222a carrying the wafer. The wafer sensor 50 is a pressure film sensor. In the embodiment, the optical axis direction of the first industrial camera 32 and the first lens 33 is consistent with the axial direction of the U-shaped opening formed by the two arm parts 222a. By arranging the wafer sensor 50 on the side of each arm part 222a carrying the wafer, the pressure sensing of the wafer is not affected by the position deviation of the wafer, and the sensing is more accurate. Meanwhile, the wafer sensor 50 is a pressure film sensor, which can accurately sense the pressure of the wafer without affecting the wafer conveying.

[0058] Further, the control module 40 monitors whether the carrying module 20 acquires the wafer from the wafer box 10 according to the second sensing signal. When the control module 40 determines that the carrying module 20 is in an empty state according to the second sensing signal, the control module 40 controls the visual sensing module 30 to update the first captured image by capturing the accommodation space 111 from the taking and placing opening 112 again, and performs the alignment again according to the updated first captured image. After the alignment is completed, the control module 40 controls the carrying module 20 to acquire the wafer. It can be understood that after each acquisition operation of the wafer, the control module 40 detects the acquisition operation. When it is detected that the carrying module 20 is in an empty state, it proves that the wafer acquisition operation fails at this time. At this time, the control module 40 can control the visual sensing module 30 to update the first captured image by capturing the accommodation space 111 from the taking and placing opening 112 again, and perform the alignment again according to the updated first captured image. Then, the wafer acquisition operation is performed again, which avoids the subsequent acquisition operation caused by the error operation, and even causes the entire wafer carrying equipment 1 to stop. Through the determination of whether the carrying module 20 is in an empty state according to the second sensing signal by the control module 40, the alignment can be performed again when the carrying module 20 is in an empty state, and the wafer acquisition operation is performed again, which avoids the stop, and improves the operation efficiency.

[0059] Further, it can be understood that the wafer carrying equipment 1 with the wafer box 10, the carrying module 20 and the visual sensing module 30 can be applied to carry the wafer in the wafer box 10 to other boxes (such as the first box 60 or the second box 70), and can also be applied to carry the wafer in other boxes to the wafer box 10 for storage. Hereinafter, the wafer carrying equipment 1 will be mainly described by taking the wafer carrying equipment 1 carrying the wafer in the wafer box 10 to other boxes as an example.

[0060] Specifically, in an embodiment, the wafer conveying device 1 further comprises a first magazine 60, the conveying module 20 is used to take the wafer from the wafer box 10 and transport and place the wafer to the first magazine 60, when the control module 40 judges that the conveying module 20 is still in the carrying state after executing the placing action of placing the wafer to the first magazine 60 according to the second sensing signal, the control module 40 controls the conveying module 20 to execute the placing action of placing the wafer to the first magazine 60 again. It can be understood that after the placing action of placing the wafer to the first magazine 60, the control module 40 will detect the placing operation, when it is detected that the conveying module 20 is still in the carrying state, it proves that the placing operation of the wafer at this time fails, at this time, the control module 40 can control the conveying module 20 to execute the placing action of placing the wafer to the first magazine 60 again, avoiding the damage caused by the misplacement operation of the wafer, even causing the shutdown of the whole wafer conveying device 1. By judging whether the conveying module 20 is in the carrying state after executing the placing action of placing the wafer to the first magazine 60 according to the second sensing signal, the placing action of placing the wafer to the first magazine 60 can be executed again when the conveying module 20 is in the carrying state, avoiding the damage of the wafer and the shutdown, at the same time, the operation efficiency is improved.

[0061] Further, the wafer conveying device 1 can further comprise a second tray 70 and a defect detection module 80, the defect detection module 80 is located on the conveying path of the conveying module 20 from the wafer box 10 to the first tray 60, the defect detection module 80 is electrically connected to the control module 40, the defect detection module 80 is used for detecting defects of the wafer transported by the conveying module 20 and outputting defect detection information to the control module 40, and the control module 40 is further used for controlling the conveying module 20 to place the wafer that passes the detection in the first tray 60 and place the wafer that fails the detection in the second tray 70. It can be understood that the conveying path of the conveying module 20 from the wafer box 10 to the first tray 60 passes through the defect detection module 80 first, and the wafer is detected at the defect detection module 80, and the control module 40 controls the conveying module 20 to place the wafer that passes the detection in the first tray 60 and place the wafer that fails the detection in the second tray 70 according to the defect detection information after detection by the defect detection module 80. By arranging the defect detection module 80 on the conveying path from the wafer box 10 to the first tray 60, the wafer is detected for defects, which can reduce the conveying error of the wafer during conveying, save conveying time, improve detection efficiency, and at the same time, the wafer that fails the detection is placed in the second tray 70, which can be pre-detected and classified during conveying, provide a pre-detected sample for subsequent processing of the wafer, avoid waste entering the subsequent processing process, and thus improve production efficiency and reduce equipment space occupation.

[0062] It can be understood that the first tray 60 and the second tray 70 can have the same structure as the wafer box 10, and the specific structure of the first tray 60 and the second tray 70 will not be described here.

[0063] Further, the visual sensing module 30 is further configured to capture a second image of the receiving space 111 of the first cassette 60 from the access opening 112 of the first cassette 60 before the wafer is placed into the first cassette 60 by the handling module 20, and the control module 40 is further configured to control the handling module 20 to perform a placement alignment of the wafer before the wafer is placed into the first cassette 60 or the wafer is detected after the placement alignment is completed; and / or the visual sensing module 30 is further configured to capture a third image of the receiving space 111 of the second cassette 70 from the access opening 112 of the second cassette 70 before the wafer is placed into the second cassette 70 by the handling module 20, and the control module 40 is further configured to control the handling module 20 to perform a placement alignment of the wafer before the wafer is placed into the second cassette 70 or the wafer is detected after the placement alignment is completed. By capturing the second image of the receiving space 111 of the first cassette 60 from the access opening 112 of the first cassette 60 before the wafer is placed into the first cassette 60 by the handling module 20 and / or capturing the third image of the receiving space 111 of the second cassette 70 from the access opening 112 of the second cassette 70 before the wafer is placed into the second cassette 70 by the handling module 20, the handling module 20 can operate more accurately during each time the wafer is picked up and / or placed, ensuring the reliability of the wafer pick-up and placement operation and the operation efficiency.

[0064] Further, the defect detection information includes a detection image, the defect detection module 80 includes a camera module 81 and a support 82 supporting the camera module 81, the camera module 81 is configured to capture the wafer transported by the handling module 20 to obtain the detection image, and the control module 40 is further configured to analyze a defect proportion of the wafer according to the detection image, and compare the defect proportion with a preset proportion to determine whether the wafer is qualified.

[0065] Further, the support 82 comprises a support body 821, a camera support part 822 connected to one side of the support body 821, and a light source support part 823 connected to one side of the support body 821, the camera module 81 comprises a second industrial camera 811, a second lens 812 and a fill light 813, the second lens 812 is installed on the second industrial camera 811, the second industrial camera 811 is arranged at one end of the camera support part 822 away from the support body 821; the fill light 813 is arranged at one end of the light source support part 823 away from the support body 821; the wafer carried by the carrying module 20 is placed parallel to the first reference surface, the second industrial camera 811 faces the wafer and the optical axis of the second industrial camera 811 is perpendicular to the first reference surface; the fill light 813 comprises a ring-shaped light emitting part, the ring-shaped light emitting part is located between the second industrial camera 811 and the carrying module 20 and is used for emitting light towards the wafer, and the second industrial camera 811 is used for capturing the wafer via the hollow area of the ring-shaped light emitting part to obtain the detection image. In the embodiment, the second lens 812 can be a telecentric lens. By arranging the wafer carried by the carrying module 20 to be placed parallel to the first reference surface, the second industrial camera 811 faces the wafer and the optical axis of the second industrial camera 811 is perpendicular to the first reference surface, the second industrial camera 811 can be vertically captured to the wafer, and at the same time, under the irradiation of the fill light 813, the defect detection of the defect detection module 80 can be more accurate and have higher precision.

[0066] Please refer to Figure 7 , Figure 7 is a flow chart of a wafer carrying control method disclosed in an embodiment of the application, in an embodiment of the application, when the wafer carrying device 1 performs the taking and placing operation of the wafer, the taking and placing of the wafer can be completed by executing the wafer carrying control method, and the wafer carrying control method comprises the following steps:

[0067] Step S101: providing a wafer box 10.

[0068] The wafer box 10 comprises a carrier 11 and a light source 12. The carrier 11 comprises two oppositely arranged side plate portions 113b, a receiving space 111 between the two side plate portions 113b, and a taking and placing opening 112 on one side of the receiving space 111, the receiving space 111 being used for receiving a plurality of wafers, and a plurality of carrier plates 114 connected to the two side plate portions 113b on the side close to the receiving space 111, two adjacent carrier plates 114 and the side plate portion 113b together forming a receiving groove 115 for receiving the edge of the wafer. The light source 12 is arranged on the side of the receiving space 111 away from the taking and placing opening 112 and on the side of at least one side plate portion 113b close to the receiving groove 115, and is used for emitting light towards the receiving groove 115. When the receiving groove 115 receives the edge of the wafer, part of the light of the light source 12 is blocked by the wafer, and the other part of the light of the light source 12 is emitted towards the taking and placing opening 112. Specifically, after the wafer handling equipment 1 is started, the light source 12 emits light. From the side of the taking and placing opening 112, the place without the wafer is brighter than the place where the wafer is placed, and a strong light-dark contrast is formed between the two places due to the blocking of the light by the wafer, so that the position of the wafer can be easily known.

[0069] Step S102: When the light source 12 emits light, a first shooting image of the receiving space 111 on the side of the taking and placing opening 112 is acquired.

[0070] It can be understood that, when the wafer is placed in the wafer box 10 and carried on the carrier plate, the brightness of the area carrying the wafer is lower than that of the area without the wafer under the irradiation of the light source 12 due to the irradiation of the light and the blocking of the wafer. The first shooting image is an image in which part of the area in the receiving space 111 is bright and part of the area is dark. When the brightness of part of the area in the first shooting image is lower than the preset brightness threshold, it is considered that the wafer is placed there. When the brightness of part of the area in the first shooting image is higher than or equal to the preset brightness threshold, it is considered that the wafer is not placed there. That is, when a plurality of wafers are placed in the wafer box 10, the first shooting image in step S102 is an image with light-dark contrast formed under the irradiation of the light source 12.

[0071] It can be understood that the wafer handling control method can further comprise the following steps:

[0072] Step S301: Before acquiring the first shooting image, the carrying module 20 is controlled to move to a current detection position according to a current detection position parameter.

[0073] The current detection position can be a position for detecting the position of taking and placing the wafer. In this embodiment, the current detection position can be a position for shooting the first shooting image.

[0074] Step S302: It is judged whether the current wafer taking position or the current wafer placing position corresponding to the current detection position has the wafer according to the first shooting image. If the current wafer taking position has the wafer or the current wafer placing position does not place the wafer, step S103 is performed.

[0075] It can be understood that the wafer carrying control method described above can be applied to wafer taking or wafer placing when the wafer in the wafer cassette 10 is carried to other cassettes (such as the first cassette 60 or the second cassette 70). It can also be applied to wafer placing in the wafer cassette 10 from other cassettes. Hereinafter, wafer taking or wafer placing when the wafer carrying device 1 carries the wafer in the wafer cassette 10 to other cassettes is taken as an example for description.

[0076] In step S302, when wafer taking is performed, if the current wafer taking position has the wafer, wafer taking is performed after alignment. When wafer placing is performed, if the current wafer placing position does not place the wafer, wafer placing is performed after alignment. By judging whether the current wafer taking position or the current wafer placing position corresponding to the current detection position has the wafer, the carrying module 20 is controlled to perform alignment, which can avoid misalignment when the current wafer taking position does not have the wafer or the current wafer placing position has placed the wafer, thereby avoiding damage to the wafer, avoiding downtime caused by operation errors, and improving operation reliability and operation efficiency.

[0077] In this embodiment, in step S302, if the current wafer taking position does not have the wafer or the current wafer placing position places the wafer, it is judged whether the current detection position is a maximum detection position. If the current detection position is the maximum detection position, the carrying module 20 is controlled to return to an initial position. If the current detection position is not the maximum detection position, the current detection position parameter, the current wafer taking position parameter, or the current wafer placing position parameter is adjusted by a preset value, respectively, and the step of controlling the carrying module 20 to move to the current detection position according to the current detection position parameter is performed again.

[0078] It should be noted that the wafer box 10 has limited wafer storage positions, each of which is spaced apart by a preset interval distance. In this embodiment, the preset interval distance can be Δz. The maximum detection position is the detection position corresponding to the last wafer storage position of the wafer box 10. When the current detection position is the maximum detection position, the handling module 20 is controlled to return to the initial position, which can be a default position. When the current detection position is not the maximum detection position, the current detection position parameter, the current pick position parameter, or the current unloading position parameter is adjusted by a preset value to obtain an updated current detection position parameter, current pick position parameter, or current unloading position parameter. In this embodiment, the preset value can be the preset interval distance of the wafer box 10, i.e., Δz. By determining whether the current detection position is the maximum detection position, the handling module 20 can quickly return to the initial position after reaching the maximum detection position for subsequent operations, thereby improving the operation efficiency.

[0079] Step S103: controlling the handling module 20 to perform alignment according to the first captured image.

[0080] The first captured image obtained in step S102 is subjected to image analysis. In the first captured image, the position of the dark stripe is the position of the wafer, and thus the storage information of the wafer in the wafer box 10 can be obtained. In this way, the handling module 20 can be controlled to perform alignment.

[0081] It can be understood that the current pick position parameter or the current unloading position parameter can be stored in the control module 40 of the wafer handling device 1. Specifically, step S102 can include the following steps:

[0082] Step S201: correcting the current pick position parameter or the current unloading position parameter to obtain a corrected pick position parameter or a corrected unloading position parameter according to the first captured image, and updating the current pick position parameter or the current unloading position parameter according to the corrected pick position parameter or the corrected unloading position parameter;

[0083] It can be understood that the current taking position parameter is a position parameter of the wafer in the wafer box 10 that needs to be taken currently, and the current discharging position parameter is a position parameter of the wafer that needs to be discharged currently and should be placed in the wafer box 10. The current taking position parameter or the current discharging position parameter can be obtained by calculation. In the embodiment, the wafers in the wafer box 10 are stored at intervals, and the interval distance can be a preset interval Δz. After the current taking position or the current discharging position completes taking or discharging, the current taking position parameter is updated to the last taking position parameter + Δz, and the current discharging position parameter is updated to the last discharging position parameter + Δz. To ensure the accuracy of the operation, the first captured image can be analyzed before the taking or discharging operation, so as to obtain a corrected taking position parameter or a corrected discharging position parameter. Finally, the current taking position parameter or the current discharging position parameter is updated according to the corrected taking position parameter or the corrected discharging position parameter, and after the taking or discharging operation is completed, the updated current taking position parameter or the current discharging position parameter is + Δz, that is, the current taking position parameter or the current discharging position parameter of the next taking or discharging can be obtained.

[0084] Step S202: moving the carrying module 20 to the current taking position or the current discharging position according to the corrected taking position parameter or the corrected discharging position parameter.

[0085] It can be understood that moving the carrying module 20 to the current taking position or the current discharging position according to the corrected taking position parameter or the corrected discharging position parameter obtained according to the first captured image can make the operation more accurate, thereby avoiding damage to the wafer and avoiding downtime caused by operation errors, and improving the reliability and efficiency of the operation.

[0086] Step S104: controlling the carrying module 20 to take or place the wafer after the alignment is completed.

[0087] According to the corrected taking position parameter or the corrected discharging position parameter, the carrying module 20 is moved to the current taking position or the current discharging position, that is, the carrying module 20 is inserted into the wafer box 10 to reach the current taking position or the current discharging position, and the carrying module 20 can then perform the taking or discharging operation.

[0088] Specifically, the step of controlling the wafer carrier 22 to place the wafer after the alignment can include a step of controlling the wafer carrier 22 to place the wafer on the carrier 11 according to a preset lowering parameter after the wafer carrier 22 moves to the current unloading position. It can be understood that after the wafer carrier 22 moves to the current unloading position, the wafer carrier 22 lowers according to the preset lowering parameter, and the wafer is placed on the carrier 11. The preset lowering parameter can be a preset lowering distance. Then, the wafer carrier 22 returns according to a return parameter. The return parameter can be a default return position or an operation position of the next operation. By controlling the wafer carrier 22 to place the wafer according to the preset lowering and return parameters after the wafer carrier 22 moves to the current unloading position, the operation efficiency of the wafer picking and placing operation can be improved.

[0089] The step of controlling the wafer carrier 22 to pick the wafer after the alignment can include a step of controlling the wafer carrier 22 to lift and pick the wafer according to a preset lifting and picking parameter after the wafer carrier 22 moves to the current picking position. It can be understood that after the wafer carrier 22 moves to the current picking position, the wafer carrier 22 lifts according to a preset lifting parameter, and the wafer is placed on the wafer carrier 22. The preset lifting parameter can be a preset lifting distance. Then, the wafer carrier 22 picks the wafer according to a picking parameter. By controlling the wafer carrier 22 to lift and pick the wafer according to the preset lifting and picking parameters, the wafer can be effectively protected, and the reliability of the picking operation can be ensured.

[0090] The wafer carrying control method provided in the present application can achieve accurate alignment and grasping of the wafers in the wafer box 10, and thus accurate wafer carrying and automatic operation, by acquiring a first shooting image of the containing space 111 shot from the side of the taking and placing opening 112 when the light source 12 emits light toward the containing space 111, and controlling the wafer carrier 22 to align after the alignment is completed.

[0091] Further, in some embodiments, the wafer carrier 22 includes a wafer carrier 22 for carrying the wafer and a moving assembly 21 for driving the wafer carrier 22 to move. The wafer carrier 22 is provided with a wafer sensor 50 for sensing the contact state of the wafer carrier 22 and the wafer. The wafer carrying control method further includes the following steps:

[0092] Step S401: judging whether the carrier module 20 is in the empty state or the loaded state according to the sensing signal output by the wafer sensor 50, if judging that the carrier module 20 is in the empty state, returning to execute step S301, if judging that the carrier module 20 is in the loaded state, executing step S402.

[0093] Step S402: adjusting the current detection position parameter, the current pick position parameter or the current unloading position parameter by a preset value respectively, and placing the wafer carried by the wafer carrier 22.

[0094] By sensing the pressure of the wafer placed on the wafer carrier 22 by the wafer sensor 50, it can be judged whether the wafer carrier 22 has the wafer, when the wafer carrier 22 has no wafer, i.e. the carrier module 20 is in the empty state, at this time the wafer has been placed, the carrier module 20 moves to the current detection position according to the current detection position parameter for the next time, when the wafer carrier 22 has the wafer, i.e. the carrier module 20 is in the loaded state, then executing step S402 to place the wafer, and updating the current detection position parameter, the current pick position parameter or the current unloading position parameter according to the preset value.

[0095] In the above embodiment, by judging whether the carrier module 20 is in the empty state or the loaded state, the movement of the carrier module 20 can be more accurate and efficient, avoiding damage to the wafer, downtime, and improving the operation efficiency.

[0096] Specifically, the step of placing the wafer carried by the wafer carrier 22 includes the following steps:

[0097] Step S501: executing the placing action of the carrier module 20 placing the wafer in the first magazine 60 according to a preset placing parameter.

[0098] Step S502: judging whether the carrier module 20 is in the empty state according to the sensing signal of the wafer sensor 50 after executing the placing action, if the carrier module 20 is in the empty state, returning to execute step S301, if the carrier module 20 is in the loaded state, returning to execute step S501.

[0099] It can be understood that the first box 60 can be a box for storing the wafer after the wafer is taken out from the wafer box 10. After the wafer is taken out from the wafer box 10, the wafer is placed in the first box 60 according to the placement parameter. If the placement is successful and the handling module 20 is in the empty state, the handling module 20 can return to perform the next taking operation. If the placement is not successful, the placement operation is continued. By judging whether the handling module 20 is in the empty state or in the carrying state, the movement of the handling module 20 can be more accurate and efficient, and damage to the wafer and downtime can be avoided. At the same time, the operation efficiency is improved.

[0100] Further, the step of placing the wafer carried by the wafer carrier 22 can further include a step of detecting the wafer, and the step of detecting the wafer includes the following steps:

[0101] Step S601: moving the wafer to a preset detection position.

[0102] It should be noted that the preset detection position can be a fixed detection position. After the wafer is obtained each time, the handling module 20 can move the wafer to the preset detection position.

[0103] Step S602: detecting defects of the wafer at the preset detection position; if the wafer detection is qualified, step S501 is performed; if the wafer detection is unqualified, step S603 is performed.

[0104] Specifically, the step of detecting defects of the wafer can include the following steps:

[0105] Step S701: obtaining a detection image of the wafer carried on the handling module 20 by photographing the wafer at the preset detection position.

[0106] Step S702: analyzing a defect proportion of the wafer according to the detection image, and comparing the defect proportion with a preset proportion to determine whether the wafer is qualified.

[0107] In the embodiment, the wafer is subjected to defect detection, and the proportion of defects of the wafer is analyzed according to the detection image. The proportion of defects of the wafer can be the proportion of wear defects of the wafer. The preset proportion can be a preset proportion of wear defects η. When the proportion of wear defects of the wafer is less than the preset proportion of wear defects η, it is considered that the wafer passes the detection, and the wafer that passes the detection is placed into the first magazine 60. When the proportion of wear defects of the wafer is greater than or equal to the preset proportion of wear defects η, it is considered that the wafer fails the detection. The detection image is obtained by photographing the wafer that is carried on the carrying module 20 at the preset detection position, so as to determine whether the wafer is qualified. The wafer can be pre-detected and classified during the carrying process, so as to provide a pre-detection sample for a subsequent processing process of the wafer, avoid waste materials from entering a subsequent processing process, and thus improve production efficiency and reduce equipment occupation space.

[0108] Step S603: performing a placing action of the carrying module 20 to place the wafer into the second magazine 70, and returning to performing the step of moving to the current detection position according to the current detection position parameter.

[0109] The second magazine 70 can be a recycling box of unqualified products. The wafer that fails the detection can be recycled through the second magazine 70. When the proportion of wear defects of the wafer is greater than or equal to the preset proportion of wear defects η, the wafer fails the detection, and the wafer that fails the detection is placed into the second magazine 70. Through the step of detecting the wafer before the step of placing the wafer carried by the wafer carrier 22, the wafer can be pre-detected during the carrying process, defects of products can be found in time, a pre-detection sample is provided for a subsequent processing process of the wafer, and thus production efficiency is improved.

[0110] To ensure the operation accuracy and reliability of the carrying module 20 in placing the wafer into the first magazine 60 and the second magazine 70, the wafer carrying control method can further include the following steps:

[0111] Step S801: before the carrying module 20 places the wafer into the first magazine 60, a second photographing image of a containing space 111 of the first magazine 60 is obtained by photographing the first magazine 60 from a taking and placing opening 112 of the first magazine 60. The carrying module 20 is controlled to perform placing alignment of the wafer, and after the placing alignment is completed, the carrying module 20 is controlled to perform a placing action of placing the wafer into the first magazine 60.

[0112] Step S802: Before the carrying module 20 places the wafer into the second cassette 70, a third shooting image of the containing space 111 of the second cassette 70 is obtained by shooting the second cassette 70 from the taking and placing opening 112, the carrying module 20 is controlled to perform the placing alignment according to the third shooting image, and after the placing alignment is completed, the carrying module 20 is controlled to perform the placing action of placing the wafer into the second cassette 70.

[0113] The processes of obtaining the second shooting image and the third shooting image in steps S801 and S802, controlling the carrying module 20 to perform the placing alignment according to the second shooting image and the third shooting image, and controlling the carrying module 20 to perform the placing action of placing the wafer into the first cassette 60 and the second cassette 70 after the placing alignment is completed are similar to the step of obtaining the first shooting image, controlling the carrying module 20 to perform the placing alignment according to the first shooting image, and controlling the carrying module 20 to perform the placing action of placing the wafer into the wafer box 10 after the placing alignment is completed, which will not be described here. By obtaining the second shooting image before the carrying module 20 places the wafer into the first cassette 60 and / or obtaining the third shooting image before the carrying module 20 places the wafer into the second cassette 70, the operation of the carrying module 20 can be more accurate during the process of obtaining and / or placing the wafer each time, which guarantees the reliability of the wafer taking and placing operation and also guarantees the operation efficiency.

[0114] Please refer to Figure 8 , Figure 8 is an embodiment of the present application discloses the use Figure 7The working flow chart of the wafer carrying equipment 1 of one wafer carrying control method is shown. The wafer carrying equipment 1 starts to work, the light source is turned on, the control module 40 realizes the initialization of each preset parameter (including the current taking position parameter, the current discharging position parameter, the maximum detection position parameter, the preset value, the wear defect ratio η, etc.), then the control module 40 controls the carrying module 20 and the visual sensing module 30 to move to the current detection position for visual detection according to the current detection position parameter, that is, the visual sensing module 30 shoots to obtain the first shooting image, further, the control module 40 judges whether there is a wafer in the current detection position according to the first shooting image, if there is a wafer in the current detection position, corrects the current taking position parameter according to the first shooting image, and controls the carrying module to align the current detection position and carry out the action of wafer acquisition according to the current taking position parameter, if there is no wafer in the current detection position, it is judged whether the current detection position is the maximum detection position, if yes, the cycle is ended, the work is stopped, and it is waited for starting work again, if not, the current detection position parameter is adjusted by a preset value, and the control module 40 returns to execute the step of visual detection according to the adjusted current detection position parameter, that is, controls the carrying module 20 and the visual sensing module 30 to move to the next current detection position for visual detection.

[0115] Further, after the carrying module 20 carries out the action of wafer acquisition, the control module 40 judges whether the carrying module 20 is in the carrying state or the empty state according to the second sensing signal output by the wafer sensor 50 on the carrying module 20, if it is the empty state, it returns to execute the step of visual detection, if it is the carrying state, the carrying module 20 carries the wafer to the preset detection position for defect detection, specifically, the defect detection module obtains a detection image, and the control module 40 judges whether the defect ratio of the wafer is less than a preset value according to the detection image, if it is less than the preset value, the carrying module 20 can carry out the action of placing the wafer in the first magazine 60. In addition, the detection image can also be saved by the control module 40 for subsequent review.

[0116] Specifically, before the wafer is unloaded to the first box 60, the current detection position parameter of the first box 60 stored in advance can be used to control the moving of the carrying module 20 to the current detection position of the first box 60, and then the visual sensing module 30 can be used to capture the containing space of the first box 60 to obtain a second captured image, and then it can be determined whether the current unloading position of the first box 60 has a wafer according to the second captured image, and the current unloading position parameter of the first box 60 can be corrected according to the second captured image, so that the carrying module 20 can be accurately positioned according to the corrected current unloading position parameter of the first box 60 and perform the action of placing the wafer into the first box 60; similarly, before the wafer is unloaded to the second box 70, the current detection position parameter of the second box 70 stored in advance can be used to control the moving of the carrying module 20 to the current detection position of the second box 70, and then the visual sensing module 30 can be used to capture the containing space of the second box 70 to obtain a third captured image, and then it can be determined whether the current unloading position of the second box 70 has a wafer according to the third captured image, and the current unloading position parameter of the second box 70 can be corrected according to the third captured image, so that the carrying module can be accurately positioned according to the corrected current unloading position parameter of the second box 70 and perform the action of placing the wafer into the second box 70.

[0117] Further, after the carrying module 20 performs the placing action, the control module 40 can further determine whether the carrying module 20 is in a loaded state or an unloaded state according to the second sensing signal output by the wafer sensor 50, if it is the unloaded state, the current detection position parameter of the first box 60 stored in advance can be updated, such as adjusting the preset value, so as to correspond to the next detection position of the first box 60, and the current detection position parameter of the second box 70 stored in advance can be updated, such as adjusting the preset value, so as to correspond to the next detection position, and return to perform the next wafer acquisition action of the wafer box 10; if it is the loaded state, the control module can control the carrying module 20 to return to perform the defect detection according to the detection image again, so that the steps of capturing the second captured image or the third captured image by the defect detection module 80 can be further repeatedly performed, and the wafer unloading and placing actions can be performed again. Figure 9 As shown in some other embodiments, if it is the loaded state, the control module 40 can also control the carrying module 20 to return to perform the steps of capturing the second captured image or the third captured image by the defect detection module 80, and the wafer unloading and placing actions can be performed again.

[0118] In summary, the wafer carrying equipment 1 and the wafer carrying control method provided by the embodiments of the present application have the advantages that

[0119] 1. The light source 12 and the first industrial camera 32 directly detect the wafer and the wafer box 10, are not affected by the assembly error between the wafer real accommodation groove, can realize the automatic alignment and accurate pick-and-place of the wafer carrying process, can also accurately judge whether the wafer exists or not in real time, and count and other composite functions, has certain self-adaptive adjustment ability to the positioning error introduced by environmental disturbance, and has good flexibility, compliance and reliability.

[0120] 2. The wafer carrying equipment 1 and the wafer carrying method can realize real-time sensing of the contact state of the wafer and the wafer box 10 bearing plate 114, the wafer and the wafer carrier 22 through the symmetrical arrangement of the pressure sensor 13 on each layer of the wafer box 10 bearing plate 114 and the symmetrical arrangement of the wafer sensor 50 at the end of the wafer carrier 22, accurately sense the wafer pick-and-place and synchronize counting, thereby ensuring the reliability of the wafer pick-and-place and carrying process.

[0121] 3. The wafer carrying equipment 1 and the wafer carrying method adopt the second industrial camera 811 to carry out wafer pre-detection on the wafer pick-and-place path, and the pre-detection classification process in the carrying process can provide pre-detection samples for the subsequent wafer processing process, avoid waste materials entering the subsequent processing process, and thereby improve the production efficiency.

[0122] Please refer to Figure 10 , Figure 10 is a structural schematic diagram of an electrical equipment 2 disclosed by an embodiment of the application, and the electrical equipment 2 comprises a memory 91 and a processor 92.

[0123] The memory 91 stores computer readable instructions 93, and the computer readable instructions 93 are executed by the processor 92, so that the processor 92 implements the wafer carrying control method according to any one of the above.

[0124] Please refer to Figure 11 , Figure 11 is a structural schematic diagram of a computer readable storage medium 3 disclosed by an embodiment of the application, and the computer readable storage medium 3 stores computer readable instructions 93, and the computer readable instructions 93 are executed by the processor 92 to implement the wafer carrying control method according to any one of the above.

[0125] It should be understood that every feature, structure, or characteristic described herein is within a preferred embodiment of the present application. It should be noted that the features, structures, or characteristics described in connection with one embodiment can be combined in any manner with features, structures, or characteristics of other embodiments. For the purposes of the present application, the phrase "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described is included in at least one embodiment of the present application. Thus, appearances of the phrases "in one embodiment" or "in an embodiment" not necessarily refer to the same embodiment. Furthermore, the described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. It will be appreciated by persons skilled in the art that the embodiments described herein represent preferred embodiments of the present application. The features, structures, or characteristics described in connection with one embodiment can be combined in any manner with features, structures, or characteristics of other embodiments. The skilled person will also appreciate that the described embodiments are optional and that the described acts and modules are not necessarily required for the present application.

[0126] In various embodiments of the present application, it should be understood that the magnitude of the serial number of the above processes does not mean the inevitable sequence of execution, and the execution sequence of the processes should be determined according to its function and inherent logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0127] The units described above as separate components can or can not be physically separate, and the components shown as units can or can not be physical units, i.e. can be located in one place, or can be distributed to multiple network units. Part or all of the units can be selected according to actual needs to achieve the purpose of the embodiments of the present application.

[0128] In addition, the functional units in each embodiment of the present application can be integrated in one processing unit, or each unit can exist physically, or two or more units can be integrated in one unit. The integrated unit can be realized in the form of hardware or in the form of a software functional unit.

[0129] The integrated unit described above, if realized in the form of a software functional unit and sold or used as an independent product, can be stored in a computer accessible memory. Based on such understanding, the technical solutions of the present application essentially or the part that contributes to the prior art or the whole or part of the technical solutions can be embodied in the form of a software product. The computer software product is stored in a memory and includes a number of steps or all steps for enabling an electrical device (which can be a personal computer, a server or a network device, etc., specifically a processor in the electrical device) to execute the methods of the embodiments of the present application.

[0130] Those skilled in the art can understand that all or part of the steps in the above-mentioned embodiments can be completed by instructing the relevant hardware by a program, and the program can be stored in a computer readable storage medium 3, which includes a Read-Only Memory (ROM), a Random Access Memory (RAM), a Programmable Read-only Memory (PROM), an Erasable Programmable Read Only Memory (EPROM), a One-time Programmable Read-Only Memory (OTPROM), an Electrically-Erasable Programmable Read-Only Memory (EEPROM), a Compact Disc Read-Only Memory (CD-ROM) or other optical disk memories, magnetic disk memories, magnetic tape memories, or any other computer readable medium capable of carrying or storing data.

[0131] The wafer box 10, the wafer conveying device 1 and the control method, the electrical equipment 2 and the storage medium 3 disclosed in the embodiments of the present application are described in detail above, and the principles and implementation manners of the present application are described by applying specific examples in the present text. The above-mentioned embodiment descriptions are only used to help understand the method of the present application and its core idea. Meanwhile, according to the idea of the present application, the specific implementation manners and application ranges will be changed by those skilled in the art, and the above-mentioned descriptions should not be understood as the limitation of the present application.

Claims

1. A wafer cassette, characterized by, The wafer box comprises: a carrier comprising two oppositely arranged side plate portions and a plurality of carrier plates, the two side plate portions having a receiving space for receiving a plurality of wafers and a loading / unloading opening on one side of the receiving space, and the plurality of carrier plates being connected to the two side plate portions on the side close to the receiving space, and two adjacent carrier plates and the side plate portions together forming a receiving groove for receiving the edges of the wafers; a light source arranged on the side of the receiving space away from the loading / unloading opening and on the side of at least one of the side plate portions close to the receiving groove, for emitting light towards the receiving groove, when the receiving groove receives the edges of the wafers, part of the light of the light source is blocked by the wafers, and the other part of the light of the light source is emitted towards the loading / unloading opening; the light source comprises a first light source arranged on the side of the receiving space away from the loading / unloading opening, a second light source arranged on one of the side plate portions close to the receiving groove, and a third light source arranged on the other side plate portion close to the receiving groove, the first light source, the second light source and the third light source each comprise a light emitting surface corresponding to the side surface of the wafers, and the height of the top of the light emitting surface is higher than the height of the top of the corresponding wafers.

2. The wafer cassette of claim 1, wherein, the first light source comprises a light emitting plate connected between the two side plate portions, for emitting light towards the side of the receiving space away from the loading / unloading opening; the number of the second light sources, the third light sources and the receiving grooves is plural, and each of the second light sources and each of the third light sources is used for emitting light towards the corresponding receiving groove.

3. The wafer cassette of claim 1, wherein, the carrier further comprises a back plate portion connected to the two side plate portions on the end away from the loading / unloading opening, the number of the light sources is plural, and the number of the receiving grooves is plural, each of the light sources corresponds to one of the receiving grooves and comprises the first light source arranged on the side of the back plate portion close to the receiving space, the second light source arranged on one of the side plate portions close to the receiving groove, and the third light source arranged on the other side plate portion close to the receiving groove.

4. The wafer cassette of claim 2 or 3, wherein, the first light source, the second light source and the third light source independently emit light and / or at least two of the first light source, the second light source and the third light source are connected together and emit light at the same time.

5. The wafer cassette of claim 3, wherein, the back plate portion is an arc-shaped plate protruding outwardly towards the receiving space, or the surface of the back plate portion close to the receiving space is an arc-shaped surface protruding outwardly towards the receiving space.

6. A wafer handling apparatus, characterized by, The wafer carrying device comprises: the wafer box according to any one of claims 1-5; a carrying module for obtaining or placing the wafers from the loading / unloading opening; a visual sensing module for shooting the receiving space on the side of the loading / unloading opening and outputting a first shooting image; and a control module electrically connected to the carrying module and the visual sensing module, for receiving and controlling the carrying module to perform alignment according to the first shooting image, and controlling the carrying module to obtain or place the wafers after the alignment is completed.

7. A wafer conveyance control method characterized by comprising: comprising the following steps: A wafer box is provided, which adopts the wafer box as claimed in any one of claims 1-5. When the light source emits light, a first shooting image of the containing space is obtained by shooting at the side of the taking and placing opening; According to the first shooting image, the carrying module is controlled to perform alignment; And After the alignment is completed, the carrying module is controlled to perform the taking or placing of the wafer.

8. An electrical device comprising a memory and a processor, the memory having computer readable instructions stored therein, the computer readable instructions, when executed by the processor, cause the processor to implement the method of claim 7.

9. A computer-readable storage medium having stored thereon computer-readable instructions, wherein, The computer readable instructions, when executed by the processor, implement the method of claim 7.

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