A guide device for semiconductor packaging frame and a method for removing metal chips

Abstract

The present invention discloses a guide device and a metal chip removal method for a semiconductor packaging frame. A left flow channel and a right flow channel are laid on the left and right sides of the frame in the running direction. The upper parts of the left flow channel and the right flow channel are respectively provided with a U-shaped groove, and the openings of the U-shaped groove on the upper part of the left flow channel and the U-shaped groove on the upper part of the right flow channel are opposite; the lower parts of the left flow channel and the right flow channel are respectively provided with a collection groove with an upward opening; the upper part of the inner side edge of the collection groove is connected with the lower part of the opening of the U-shaped groove of the left flow channel or the right flow channel, and the collection groove is located at one end of the left flow channel or the right flow channel and is provided with a notch for splicing with a collection box. The inner bottom surface of the collection groove is inclined downward toward one end of the collection box and the lowest point is higher than the inner bottom surface of the collection box. The present invention automatically collects metal chips dropped from the frame and can prevent the frame from sliding off the track when stepping, so that the equipment runs stably, greatly improving production efficiency, product quality and equipment utilization efficiency; it has a simple structure, is stable and efficient, and has a low manufacturing cost.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor packaging, and in particular relates to a guiding device for a semiconductor packaging frame and a method for removing metal chips. Background Art

[0002] During the semiconductor packaging process, the frame has to pass through the track in each process. There are burrs on the frame. The high-frequency vibration during machine operation produces friction, causing metal chips and burrs to fall everywhere. If they fall on the product, it is easy to cause product quality problems. If they fall into the machine, it will cause a short circuit, affecting production efficiency, product quality and equipment utilization efficiency.

[0003] In addition, the guide structure surface of the current frame stepping is smooth and has no obstructions, so the frame is easy to slide out of the track when stepping, resulting in material jamming and scrapping. Summary of the Invention

[0004] The purpose of the present invention is to address the above problems and provide a guiding device for a semiconductor packaging frame and a metal chip removal method, which has a simple structure, can prevent the frame from sliding off the track when stepping, and can collect metal chips dropped from the frame.

[0005] The technical solution of the present invention is achieved in this way.

[0006] A guiding device for a semiconductor packaging frame, characterized in that: it includes a left flow channel and a right flow channel laid on the left and right sides of the frame running direction, the upper parts of the left flow channel and the right flow channel are respectively provided with a U-shaped groove along the running direction of the frame, and the U-shaped groove on the upper part of the left flow channel and the U-shaped groove on the upper part of the right flow channel are opened oppositely; the lower parts of the left flow channel and the right flow channel are respectively provided with a collecting groove opening upward along the running direction of the frame; the upper part of the inner side edge of the collecting groove is connected with the lower part of the opening of the U-shaped groove of the left flow channel or the right flow channel, and the collecting groove is located at one end of the left flow channel or the right flow channel and is provided with a notch for splicing with a collecting box, the collection box is opened upward and the upper end is clamped with the collection groove hollowed out at the bottom through a clamping groove; the collection box is closed at one end along the running direction of the frame, and the other end is docked with the notch of the collection groove; the inner bottom surface of the collection groove is inclined downward toward one end of the collection box and the lowest point is higher than the inner bottom surface of the collection box.

[0007] Furthermore, the U-shaped grooves and the collecting grooves at one end of the left flow channel and the right flow channel are provided with oblique introduction ports for the frames to be introduced into the U-shaped grooves.

[0008] Furthermore, the engaging groove on the upper portion of the collecting box is a dovetail groove.

[0009] Furthermore, the inner width of the collection box is equal to the inner width of the collection tank.

[0010] A method for removing metal chips based on the guide device of the above-mentioned semiconductor packaging frame is specifically as follows: the frame is pushed out by the pushing assembly device and enters the U-shaped grooves of the left flow channel and the right flow channel, the frame slides in the U-shaped groove, and the machines loaded with the left flow channel and the right flow channel generate high-frequency vibrations. The frame is subjected to friction so that the metal chips fall into the collection trough, and at the same time, by utilizing the high-frequency vibrations generated during the operation of the machine, the metal chips slide along the inclined structure on the bottom surface of the collection trough to the collection box for collecting metal chips, and the collection box is regularly disassembled to clean the metal chips.

[0011] Its working principle is as follows: the guide device of the semiconductor packaging frame of the present invention adds a U-shaped groove on both sides of the Y direction of the traditional track, so that the frame can be confined in the U-shaped groove when stepping, preventing the frame from sliding out of the traditional track when stepping; metal chips are generated when the semiconductor packaging frame steps, and the horizontal groove in the Z direction of the guide device with the U-shaped groove is changed into an oblique groove with the bottom surface inclined toward one end. The high-frequency vibration generated during the operation of the machine is used to make the metal chips and burrs slide along the downward slope of the oblique groove toward the metal chip collection box.

[0012] The beneficial effects of the present invention are: 1. Compared with the prior art, the guiding device of the semiconductor packaging frame of the present invention automatically collects metal chips dropped from the frame and can prevent the frame from sliding off the track when stepping, so that the equipment runs stably, greatly improving production efficiency, product quality and equipment utilization efficiency; 2. Its structure is simple, stable and efficient, with low production cost, and is easy to promote and use. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is an overall structural diagram of the guide device of the semiconductor packaging frame of the present invention;

[0014] Figure 2 A disassembled structural diagram of a guide device of a semiconductor package frame according to the present invention;

[0015] Figure 3 This is a schematic structural diagram of the left flow channel of the guide device of the semiconductor packaging frame of the present invention;

[0016] Figure 4 This is a schematic diagram of the disassembled structure of the left flow channel of the guide device of the semiconductor packaging frame of the present invention;

[0017] Figure 5 This is a schematic structural diagram of the right flow channel of the guide device of the semiconductor packaging frame of the present invention;

[0018] Figure 6 This is a schematic diagram of the disassembled structure of the right flow channel of the guide device of the semiconductor packaging frame of the present invention;

[0019] Figure 7 for Figure 1 A longitudinal cross-sectional view of

[0020] Figure 8 A structural cross-sectional view of the left flow channel of the guide device of the semiconductor packaging frame of the present invention;

[0021] Figure 9 A cross-sectional view of the structure of the right flow channel of the guide device of the semiconductor packaging frame of the present invention;

[0022] Figure 10 This is a schematic structural diagram of a guide device collecting box of a semiconductor packaging frame of the present invention;

[0023] Figure 11 Schematic diagram of the guide device for removing metal chips from the semiconductor packaging frame of the present invention.

[0024] In the figure, 1, left flow channel, 2, right flow channel, 3, U-shaped groove, 4, metal chips, 5, collecting groove, 6, collecting box, 7, frame. DETAILED DESCRIPTION

[0025] The technical solution of the present invention is further described in detail below through embodiments and accompanying drawings.

[0026] like Figures 1-11 As shown, a guiding device of a semiconductor packaging frame of the present invention includes a left flow channel 1 and a right flow channel 2 laid on the left and right sides of the running direction of the frame 7, the upper parts of the left flow channel 1 and the right flow channel 2 are respectively provided with a U-shaped groove 3 along the running direction of the frame 7, and the openings of the U-shaped groove 3 on the upper part of the left flow channel 1 and the U-shaped groove 3 on the upper part of the right flow channel 2 are opposite; the lower parts of the left flow channel 1 and the right flow channel 2 are respectively provided with a collecting groove 5 with an opening facing upward and along the running direction of the frame 7; the upper part of the inner side edge of the collecting groove 5 is connected with the lower part of the opening of the U-shaped groove 3 of the left flow channel 1 or the right flow channel 2, and the collecting groove 5 is located at one end of the left flow channel 1 or the right flow channel 2 and is provided with a notch for splicing with the collecting box 6, the collecting box 6 is opened upward and the upper end is clamped with the collecting groove 5 with a hollow bottom through a clamping groove; the collecting box 6 is closed at one end along the running direction of the frame 7, and the other end is docked with the notch of the collecting groove 5; the inner bottom surface of the collecting groove 5 is inclined downward toward one end of the collecting box 6 and the lowest point is higher than the inner bottom surface of the collecting box 6.

[0027] The U-shaped groove 3 and the collecting groove 5 at one end of the left flow channel 1 and the right flow channel 2 are provided with an oblique introduction port for the frame 7 to be introduced into the U-shaped groove 3.

[0028] The clamping groove on the upper part of the collecting box 6 is a dovetail groove.

[0029] The inner width of the collecting box 6 is equal to the inner width of the collecting tank 5 .

[0030] The metal chip removal method of the guide device based on the above-mentioned semiconductor packaging frame is specifically as follows: the frame 7 is pushed out by the pushing assembly device and enters the U-shaped groove 3 of the left flow channel 1 and the right flow channel 2. The frame 7 slides in the U-shaped groove 3, and the machine loaded with the left flow channel 1 and the right flow channel 2 generates high-frequency vibration. The frame 7 is subjected to friction so that the metal chips 4 fall into the collecting trough 5. At the same time, by utilizing the high-frequency vibration generated during the operation of the machine, the metal chips 4 slide along the inclined structure of the bottom surface of the collecting trough 5 to the collecting box 6 for collecting metal chips. The collecting box 6 is regularly disassembled to clean the metal chips 4.

[0031] The guiding device of the semiconductor packaging frame of the present invention is designed with a collection groove 5 and a collection box 6, which uses the high-frequency vibration of the machine to automatically collect metal chips dropped from the frame, and designs the left and right flow channels 2 with relative openings of the U-shaped groove 3 to limit the left and right and up and down positions of the frame 7 when stepping. It can effectively prevent the frame from sliding off the track when stepping. After the metal chips are automatically collected, they can be prevented from falling into the interior of the machine, avoiding machine short circuit, making the machine run stably, and greatly improving production efficiency, product quality and equipment utilization efficiency.

[0032] The above is a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications are also considered to be within the scope of protection of the present invention.

Claims

1. A guiding device for a semiconductor package frame, characterized in that: The trough is located at one end of the frame and has a U-shaped groove, the other end of the U-shaped groove is connected to the bottom of the frame, and the bottom of the frame is connected to the U-shaped groove of the left or right channel. The U-shaped groove at one end of the left flow channel and the right flow channel and the collecting groove are provided with an oblique introduction port for the frame to be introduced into the U-shaped groove; The clamping groove on the upper part of the collecting box is a dovetail groove.

2. The guiding device for a semiconductor package frame according to claim 1, wherein: The inner width of the collecting box is equal to the inner width of the collecting tank.

3. A method for removing metal chips based on the guide device of the semiconductor package frame according to claim 1 or 2, characterized in that: The specific method is as follows: the frame is pushed out by the pushing assembly device and enters the U-shaped groove of the left flow channel and the right flow channel. The frame slides in the U-shaped groove, and the machine loaded with the left flow channel and the right flow channel generates high-frequency vibration. The frame is subjected to friction, causing the metal chips to fall into the collection trough. At the same time, using the high-frequency vibration generated during the operation of the machine, the metal chips slide along the inclined structure of the bottom surface of the collection trough to the collection box for collecting metal chips. The collection box is regularly disassembled to clean the metal chips.

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