Patch capacitor holder

Abstract

The application discloses a patch type capacitor support, which comprises a metal pad and a support body, the support body is fixedly connected with the outer wall of the metal pad, a recess is arranged in the middle of the support body, and a pin extending downward is arranged at one end of the metal pad; the hardware terminal is fixed by high-temperature-resistant resin (plastic), the hardware terminal is designed as a semicircle with the same outer diameter as the capacitor, the product is more closely attached to the capacitor during use, space is saved, the length and thickness of the whole product are reduced, material is greatly saved, and cost is saved; metal pads are arranged at both ends of the product, the metal pads are attached to a PCB substrate, and the metal pads are connected with the PCB substrate after welding; in order to make the product and the PCB more closely combined and more accurate during SMT patch operation, 90-degree DIP pins are arranged at the bottom of the metal pads, and adverse conditions such as false welding, false soldering and empty welding are effectively prevented; the product is packaged by a carrier tape, automatic batch production can be realized, labor is saved, and defects are reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of capacitor support, in particular to a patch type capacitor support. BACKGROUND

[0002] The traditional capacitor support has only two metal sheets, and the customer needs to connect a material belt for positioning when using it. After welding, the material belt also needs to be cut off, which is very inconvenient. In the production process, it is easy to deform, and in addition, due to the lack of plastic protection, the strength is very low and cannot withstand high-strength tension. The traditional capacitor support is spot-welded and cannot be automatically patch-welded, so it cannot realize SMT automatic patching operation and has low efficiency. Therefore, a patch capacitor support more suitable for SMT automatic patching operation is needed. SUMMARY

[0003] The purpose of the present application is to provide a patch type capacitor support to overcome the deficiencies in the prior art.

[0004] In order to achieve the above purpose, the present application provides the following technical scheme:

[0005] The patch type capacitor support comprises a metal pad and a support body, the support body is wrapped on the outer wall of the metal pad and is fixedly connected with the metal pad, a recess is arranged in the middle of the support body, and one end of the metal pad is provided with a pin extending downward.

[0006] Preferably, the two ends of the metal pad are bent towards the bottom of the support body and extend to the left side wall and the right side wall of the support body respectively to form a patch site.

[0007] Preferably, the pin and the patch site are arranged perpendicular to each other.

[0008] Preferably, the recess is an arc-shaped structure.

[0009] Preferably, the recess is used for placing a patch capacitor

[0010] Preferably, the support body is a semi-cylindrical structure, an adsorption site is arranged in the middle of the arc-shaped side wall of the support body, and the plane where the adsorption site is located is a horizontal plane.

[0011] Preferably, the support body is integrally injection molded and solidified on the outer side wall of the metal pad, the metal pad is at least two, and the metal pads are distributed in the support body in a ring array around the central axis of the support body.

[0012] Preferably, the end of the support body is provided with a positioning column integrally injection molded.

[0013] Compared with the prior art, the present application has the following advantages:

[0014] The application is fixed by high-temperature resistant resin (plastic) to hardware terminal, the hardware terminal is designed as semicircle and same as the outer diameter of the capacitor, the product is more close to the capacitor in use, saves space, reduces the length and thickness of the whole product, greatly saves material and cost; the metal pad is arranged at both ends of the product, the metal pad is attached to the PCB substrate, and the metal pad is connected with the PCB substrate after welding; in order to make the product and the PCB more closely combined, the 90-degree DIP pin is arranged at the bottom of the metal pad of the product, which effectively prevents the adverse conditions such as false welding, false welding and empty welding; the product is packaged by carrier tape, can realize automatic batch production, saves labor and reduces defects.

[0015] The application is integrally injection molded, the product structure is stable, can bear strong tension and torsion, has protection capacitor, and effectively connects the end PCB and other electronic components; the carrier tape packaging can realize rapid SMT patching operation, is low-carbon and environmentally friendly, and greatly improves production efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is a perspective view of the application;

[0017] Figure 2 It is a sectional view of the application;

[0018] Figure 3 It is a schematic view of the upper structure of the application;

[0019] Figure 4 It is a schematic view of the structure of the metal pad.

[0020] BRIEF DESCRIPTION OF DRAWINGS:

[0021] 1-bracket body, 2-metal pad, 3-pin, 4-positioning column, 5-suction site, 6-patch site. DETAILED DESCRIPTION

[0022] In order to make the above-mentioned purpose, features and advantages of the application more obvious and easy to understand, the specific embodiments of the application will be described in detail below. In the following description, a lot of specific details are set forth in order to fully understand the application. However, the application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the application, therefore the application is not limited by the specific embodiments disclosed below.

[0023] It should be noted that when an element is referred to as being "on" another element, it can be directly on the other element or intervening elements can also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements can also be present. When an element is referred to as being "comprise a plurality of" it can be two or more of any number. The terms "vertical", "horizontal", "left", "right" and similar expressions as used herein are for illustrative purposes only and are not intended to be limiting.

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0025] The application will be described in detail below with reference to the embodiments shown in the drawings:

[0026] As Figures 1-4 shown, in the embodiment, a patch capacitor support is provided, comprising a metal pad 2 and a support body 1, the support body 1 is wrapped on the outer wall of the metal pad 2 and is fixedly connected with the metal pad 2, the support body 1 here is not completely wrapped on the outer surface of the metal pad 2.

[0027] In order to protect the patch capacitor, the support body 1 of the application is provided with a groove in the middle, the inner diameter of the groove is slightly larger than the outer diameter of the patch capacitor, the groove is an arc structure, and the groove is used for placing the patch capacitor. In the SMT patch operation, the patch capacitor of the application is covered on the PCB substrate and then welded.

[0028] The patch welding is only performed by the patch plane of the metal pad 2, and the contact failure such as virtual welding and empty welding may occur. One end of the metal pad 2 is provided with a downward extending pin 3, and the end of the support body 1 is also provided with a positioning column 4 integrally formed by injection molding. The pin 3 and the positioning column 4 can be used for positioning, the pin 3 can be inserted into the metal line on the PCB substrate and abut against the metal line, and the positioning column 4 can be inserted into the non-metal part on the PCB substrate. The two ends of the metal pad 2 are bent towards the bottom of the support body 1 and respectively extend towards the left side wall and the right side wall of the support body 1 to form patch sites 6. Specifically, the two sides of the metal pad 2 are downwardly pressed and bent to form two faces with different heights. It should be noted that the pin 3 and the patch site 6 are arranged perpendicular to each other, and the pin 3 and the patch site 6 are arranged at 90°.

[0029] The support body 1 is a semi-cylindrical structure, and the middle part of the arc-shaped side wall of the support body 1 is provided with an adsorption site 5, the plane where the adsorption site 5 is located is a horizontal plane, and the adsorption site 5 is convenient for vacuum adsorption during assembly.

[0030] The support body 1 is integrally injection molded and solidified on the outer side wall of the metal pad 2, the metal pad 2 is at least two, and is slightly curved. Since the support body 1 is a semi-cylindrical structure, the cross section of the metal pad 2 is slightly curved arc. In order to make the assembly degree high, the above-mentioned arc is matched with the arc of the support body 1, and the metal pad 2 is distributed in the inner part of the support body 1 in the form of annular array with the center axis of the support body 1.

[0031] The technical features of the above-mentioned embodiments can be combined arbitrarily, and in order to make the description simple, all possible combinations of the technical features in the above-mentioned embodiments are not described, however, as long as the combination of the technical features does not exist contradictory, it should be considered as the scope of the present application.

[0032] The above-mentioned embodiments only express several embodiments of the present application, the description is more specific and detailed, but it cannot be understood as the limitation of the scope of the present application. It should be pointed out that for ordinary skilled in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which belong to the protection scope of the present application. Therefore, the protection scope of the present application patent should be subject to the appended claims.

Claims

1. A patch capacitor mount, characterized by: The metal pad and the support body are included, the support body is covered on the outer wall of the metal pad and is fixedly connected with the metal pad, a recess is arranged in the middle of the support body, one end of the metal pad is provided with a pin extending downward, the end of the support body is provided with a positioning column integrally formed by injection molding, the metal pad forms a patch site, and the recess is used for placing a patch capacitor.

2. The patch-like capacitive mount of claim 1, wherein: The two ends of the metal pad are bent towards the bottom of the support body and extend to the left side wall and the right side wall of the support body respectively to form patch sites.

3. The patch-like capacitive mount of claim 2, wherein: The pin and the patch site are arranged perpendicularly.

4. The patch-like capacitive mount of claim 1, wherein: The recess is an arc structure.

5. The patch-like capacitive mount of claim 1, wherein: The support body is a semi-cylindrical structure, an adsorption site is arranged in the middle of the arc side wall of the support body, and the plane where the adsorption site is located is a horizontal plane.

6. The patch-like capacitive mount of claim 1, wherein: The support body is integrally injection molded and solidified on the outer side wall of the metal pad, the metal pad is at least two, and the metal pads are distributed in the support body in a ring array type around the central axis of the support body.

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