Electronic device with connected component carrier and fluid cooling member

Abstract

An electronic device (100) and a method for manufacturing the electronic device (100) are provided, wherein the electronic device (100) comprises a component carrier (102), the component carrier (102) comprises a stack (106), the stack (106) has at least one electrically conductive layer structure (110) and / or at least one electrically insulating layer structure (112), and the component carrier (102) comprises electronic components (118) on and / or in the stack (106); and a cooling member (120), the cooling member (120) having a fluid cooling unit (124) at least partially located in the cooling member (120); wherein the component carrier (102) and the cooling member (120) are connected via a connecting structure (122).

Description

Technical Field

[0001] The present invention relates to a method of manufacturing an electronic device, and to an electronic device. Background Art

[0002] Against the background of increasing product functionality of component carriers equipped with one or more electronic components and the increasing demand for miniaturization of such components and the increasing number of components to be mounted on or embedded in component carriers such as printed circuit boards, increasingly powerful array-like components or packages with several components having a plurality of contacts or connections, where the spacing between these contacts is becoming increasingly smaller, are being adopted. The removal of the heat generated by these components and the component carrier itself during operation is becoming an increasingly serious problem. At the same time, the component carrier should have mechanical robustness and electrical reliability in order to be able to operate even under harsh conditions.

[0003] Surface mounted components and especially embedded components can generate a lot of heat during operation, which can limit the performance and reliability of electronic devices. Therefore, effectively removing heat from electronic components in electronic devices becomes a problem. Summary of the invention

[0004] There is a need for electronic devices having adequate electrical reliability and efficient heat removal.

[0005] According to an exemplary embodiment of the present invention, there is provided an electronic device comprising a component carrier, the component carrier comprising a stack having at least one electrically conductive layer structure and / or at least one electrically insulating layer structure, and the component carrier comprising electronic components on and / or in the stack; and a cooling member having a fluid cooling unit at least partially located in the cooling member, wherein the component carrier and the cooling member are connected by a connecting structure (e.g., metal) (e.g., to facilitate heat removal from the electronic components to the cooling unit).

[0006] According to another exemplary embodiment of the present invention, a method for manufacturing an electronic device is provided, wherein the method includes mounting electronic components on and / or in a stack of component carriers (106), the stack including at least one electrically conductive layer structure and / or at least one electrically insulating layer structure forming at least a portion of a fluid cooling unit in a cooling member; and connecting the component carrier to the cooling member via a connecting structure (e.g., metal) (e.g., to facilitate heat removal from the electronic components to the cooling unit).

[0007] In the context of the present application, the term "component carrier" may particularly denote any support structure capable of accommodating one or more components on and / or in the component carrier structure for providing mechanical support and / or electrical connection. In other words, the component carrier may be configured as a mechanical carrier and / or an electronic carrier for components. The component carrier may include a laminate stack. In particular, the component carrier may be one of a printed circuit board, an organic interposer and an IC (integrated circuit) substrate. The component carrier may also be a hybrid board combining different types of component carriers of the above-mentioned types.

[0008] In the context of the present application, the term "stack" may particularly denote an arrangement of a plurality of planar layer structures, which are mounted one above the other in a parallel manner.

[0009] In the context of the present application, the term "layer structure" may particularly denote a continuous layer, a patterned layer or a plurality of non-continuous islands in a common plane.

[0010] In the context of the present application, the term "electronic component" may particularly denote a component that implements an electronic task. For example, such an electronic component may be a semiconductor chip comprising a semiconductor material, in particular as a main or basic material. The semiconductor material may, for example, be a type IV semiconductor such as silicon or germanium, or may be a type III-V semiconductor material such as gallium arsenide. In particular, the semiconductor component may be a semiconductor chip such as a bare die or a molded die. The electronic component may also be a passive device, such as an ohmic resistor, a capacitor or an inductor.

[0011] In the context of the present application, the term "cooling member" may particularly denote a second main component of the electronic device besides the component carrier, which may be pre-manufactured at least partially separately from the component carrier before being connected by the metallic connection structure. The cooling member may be configured for cooling one or more surface-mounted electronic components and / or embedded electronic components of the component carrier. The cooling member may functionally cooperate with the component carrier, in particular the cooling member may functionally cooperate with the component carrier by: by a thermal coupling between the cooling member and the component carrier; and / or by the fact that an upper opening of the cooling member may be closed by a component carrier attached to the cooling member.

[0012] In the context of the present application, the term "fluid cooling unit in a cooling member" may particularly denote a component part of a cooling member, which may be configured such that a cooling fluid may be contained or a cooling fluid may flow through the cooling member to cool the electronic components. Such a flow may be from a source fluid coupling member of the electronic device to a discharge fluid coupling member. Such a flow may also be a circular flow along a closed-loop flow path of the electronic device. Furthermore, the cooling fluid may be permanently kept in the fluid cooling unit without flowing. When located inside the cooling unit (in particular when flowing through an integrated fluid cooling unit), the fluid may be heated by heat energy released primarily by the electronic components and the component carrier, thereby cooling the electronic components and the component carrier. In particular, a cooling member having at least a portion of a fluid cooling unit therein may cover an embodiment in which the fluid cooling unit is incorporated into the cooling member (e.g. Fig. 9 ), and can also cover embodiments in which the fluid cooling unit is formed in the cooling member and is enclosed by the component carrier (e.g. Figure 1 ).

[0013] In the context of the present application, the term "fluid" may particularly denote a liquid (eg water) and / or a gas (eg air), optionally including solid particles.

[0014] In the context of the present application, the term "metallic connection structure" may particularly denote a connection medium comprising a metallic material and which is arranged at the interface of the interconnection of the component carrier and the cooling member. The metallic connection structure may thereby establish a mechanical and thermal coupling between the component carrier and the cooling member, but preferably does not facilitate current conduction through the electronic device. For example, the metallic connection structure may comprise: a solder material (e.g. comprising a tin component), a sintered material (e.g. a silver sintered paste), or an adhesive containing metal particles. A silver sintered medium or a diffusion bonding medium may be preferred. The connection may also be established by thermocompression bonding or by press fit.

[0015] According to an exemplary embodiment of the present invention, an electronic device is provided, which enables efficient fluid-based cooling of embedded electronic components and / or surface-mounted electronic components such as power semiconductor chips. Two independently manufacturable components, namely a preferably flat component carrier (e.g. a printed circuit board, PCB) and a cooling member with an internally integrated or recessed fluid structure, can preferably be connected to each other over their entire connection surface, thereby establishing a suitable mechanical and thermal coupling between the component carrier and the cooling member. Very advantageously, at least a part of the thermal and mechanical coupling can be established in a simple, reliable and thermally efficient manner by a (e.g. metal) connection structure (e.g. solder). At the same time, such a (e.g. metal) connection structure can preferably help to define a fluid chamber or conduit, because such a (e.g. metal) connection structure can be liquid-tight and highly thermally conductive.

[0016] Detailed Description of Exemplary Embodiments

[0017] Hereinafter, exemplary embodiments of the manufacturing method and the electronic device will be further described.

[0018] In one embodiment, the fluid cooling unit includes a hollow space (e.g., a cavity or at least one fluid guiding structure) for accommodating a cooling fluid. In particular, the hollow space can be at least partially filled with a cooling fluid. The fluid cooling can be liquid cooling or gas cooling. By configuring the fluid cooling unit for liquid cooling, the cooling fluid contained in or flowing through the fluid channel or fluid chamber of the electronic device can be in a liquid phase, such as water. Other examples of fluids that can be used for cooling are ethylene glycol; water with additives such as inhibitors (e.g., phosphorus) to further prevent corrosion; or a dielectric cooling fluid. By configuring the fluid cooling unit for gas cooling, the coolant contained in or flowing through the fluid channel or fluid chamber of the electronic device can be in a gas phase, such as air.

[0019] In an embodiment, the hollow space of the cooling member is defined by a wall that is at least partially heat-conductive. At least a portion of the heat-conductive wall may have an inner surface profile configured to increase the heat exchange area between the cooling fluid and the at least partially heat-conductive wall. For example, the inner surface profile may form a portion of a component carrier and / or may form a portion of the cooling member. The inner surface profile may particularly form a portion of one or two relative main surfaces of the wall. For example, the inner surface profile may be an oscillating or wavy structure (e.g., a wave structure) that increases the active heat exchange surface. For example, the inner surface profile may follow a rectangular function, a sawtooth function, a sine function, etc. The wall may be partially or completely defined by a metal material such as copper. Descriptively, the inner surface profile may enhance the thermal coupling between the cooling fluid and the wall, thereby enhancing the thermal coupling between the cooling member and the embedded component. For example, the structure forming the inner surface profile may have a height in the range of 5 μm to 500 μm. For example, the depth of the structure forming the inner surface profile may be in the range of 5 μm to 500 μm. By taking the measures described, the surface in the channel can be thermally improved, because more surface leads to better cooling performance. The profiled surface portion can be adjusted, for example, on one main side, on two main sides, or even completely circumferentially. For example, the topology can be manufactured using a semi-additive process (SAP) or a modified semi-additive process (MSAP) or a 3D printing process. Alternatively, a differential etching process can also be performed for this purpose.

[0020] In one embodiment, the metal connection structure is a solder structure, a sintered structure or an electrically conductive glue. In particular, by welding or sintering, the metal interface of the component carrier and the cooling member can be mechanically and reliably connected by the metal connection structure, while ensuring a high thermal conductivity path from the electronic component to the fluid cooling unit. In addition, this can ensure that the fluid in the hollow space is tightly (especially airtight or liquid-tight) sealed to accommodate the cooling fluid. In view of the latter property, the metal connection structure can also help to define the fluid chamber or fluid channel of the cooling unit. Alternatively, an electrically conductive glue can be used, which can include metal particles in an adhesive matrix.

[0021] In one embodiment, the metal connection structure is an annular structure, i.e. an open or preferably closed ring. Advantageously, the metal connection structure can connect the component carrier and the cooling member along a closed circumferential path (e.g. a line or path of any other shape and / or style). This can ensure low thermal resistance and proper thermal coupling between the component carrier and the cooling member and can simultaneously produce a closed liquid tight surround. Thus, such an annular metal connection structure can circumferentially delimit a fluid chamber or fluid channel of a fluid cooling unit.

[0022] In an embodiment, the cooling member comprises a further component carrier, or the cooling member consists of a further component carrier, the further component carrier comprising a further stack, the further stack comprising at least one further electrically conductive layer structure (114) and / or at least one further electrically insulating layer structure (116). Advantageously, an electronic device in the form of a component carrier and a cooling member can be produced by interconnecting two component carriers, in particular two printed circuit boards (PCBs). This makes it possible to use similar or identical materials (e.g. resin and copper, and optionally reinforcing glass structures and / or ceramic filler particles) for the two component carriers, so that inappropriate material bridges can be avoided and CTE (coefficient of thermal expansion) mismatches at the interface between the component carrier and the cooling member can be suppressed. In addition, by simply connecting the mutually facing connection surfaces of the component carriers, a flat and highly compact electronic device can be obtained.

[0023] In one embodiment, the fluid cooling unit is partially bounded by a cavity in the further stack. In the context of the present application, the term "cavity" may particularly denote a hole, particularly a blind hole, in the further component carrier. The cavity may be at least partially bounded by the bottom of the further component carrier, and the cavity may be at least partially bounded by one or more side walls of the further component carrier, particularly fully circumferentially bounded by one or more side walls of the further component carrier. The cavity may be closed by interconnecting only the component carriers, particularly flat or recessed, with the metal connection structure therebetween to complete the formation of the cooling chamber.

[0024] In an embodiment, at least one of the at least one further electrically conductive layer structures and the metal connection structure partially delimit a cooling fluid receiving chamber of the cooling unit. Advantageously, the above-mentioned chamber can be delimited on the bottom and the side walls by the at least one further electrically conductive layer structure, which can be implemented, for example, as a continuous copper cladding. For example, the continuous copper cladding can be formed by depositing copper on the exposed walls of the chamber using electroless deposition or sputtering. When such a further component carrier (having a metal clad cavity, wherein the cladding can have a thickness of at least 1 μm or more) is interconnected with other component carriers (having electronic components and having a metal layer at its bottom) and the metal connection structure in between, the entire cooling fluid receiving chamber can be completely delimited by the metal material. Therefore, the cooling fluid can be reliably prevented from soaking the dielectric material (especially resin) of the stack of component carriers. Very advantageously, the cooling fluid receiving chamber can be completely delimited by the metal material of the component carrier, the further component carrier and the metal connection structure.

[0025] In an embodiment, at least one of the at least one further electrically conductive layer structure and the metal connection structure (which may be in direct contact with each other) adjoin at least one of the at least one further electrically insulating layer structure via a stepped joint. In particular, a stepped dielectric structure may be formed, wherein the metal connection structure and the further electrically conductive layer structure adjoin the dielectric material of the further stack. Such a stepped geometry may improve the mechanical integrity of the electronic device at the interface between the component carriers.

[0026] In another embodiment, the cooling member comprises a metal body, or the cooling member consists of a metal body, which has at least one integrally formed fluid guiding structure, in particular at least one cooling channel. For example, the fluid cooling unit can be completely composed of metal, such as a machined copper plate. For example, such a metal plate or metal block can be provided with an internal hollow channel structure. However, the fluid guiding structure can also be implemented in a dielectric structure covered by a metal layer. For example, one or more fluid guiding structures can be formed as a tortuous, spiral or serrated structure, or formed to produce a swirl or turbulence to further improve the heat exchange with the component carrier. Such a cooling member can be manufactured in a simple manner and has excellent thermal coupling properties. For example, the thickness of such a metal body can be in the range of 0.5 mm to 3 mm, in particular in the range of 1 mm to 2 mm.

[0027] In an embodiment, the connection structure includes a thermal interface material that facilitates heat removal from the electronic component to the cooling unit. For example, the thermal interface material is thermally conductive and electronically non-conductive (e.g., thermal prepreg). Advantageously, the connection structure can be an annular structure. In an embodiment, the connection structure can include a metal and can form a metal connection structure.

[0028] In embodiments, the fluid guiding structure may be applied on an inner surface of the cooling member (eg with a cavity) and / or on a surface of eg a PCB type component carrier which may form a part of the cooling member.

[0029] In an embodiment, the metal connection structure is connected to at least one of the at least one electrically conductive layer structures of the component carrier. Thus, an intermetallic connection between the component carrier and the metal connection structure can be formed, which provides a strong mechanical connection and a suitable thermal coupling. Furthermore, this can make the electrically conductive layer structure of the component carrier contribute to the definition of the boundaries of the fluid harbor. Preferably, the bottom surface of the component carrier can be provided with a surface profile of structured copper to expand the surface area, thus providing heat transfer and cooling more effectively.

[0030] In an embodiment, the metal connection structure is electrically decoupled from the electronic component by at least one of the at least one electrically insulating layer structures of the component carrier. Advantageously, the electrical signals originating from and / or propagating to the electronic component can be reliably prevented from undesired interaction with the liquid coolant of the cooling member by a dielectric barrier. Such a dielectric barrier should be as thin as possible and should conduct heat appropriately. For example, the dielectric barrier can be a single-layer or multi-layer structure (e.g., made of any material of the electrically insulating layer structure, as described below). For example, the dielectric barrier can be made of two bonding sheets (e.g., made of aluminum) with a thermally highly conductive layer therebetween. In other words, the current path of the electronic device can be decoupled from the fluid flow path, while thermal coupling between the component carrier and the cooling member can be achieved.

[0031] In an embodiment, the metal connection structure partially defines a cooling fluid receiving cavity of the fluid cooling unit. Advantageously, the metal connection structure simultaneously fulfils several functions, namely establishing a mechanical connection between the component carrier and the cooling member, ensuring thermal coupling between the component carrier and the cooling member, and forming a part of a fluid tight and non-immersed boundary of the coolant fluid chamber.

[0032] In an embodiment, the metal connection structure has an inclined surface portion that partially defines a cooling fluid receiving chamber of the cooling unit. For example, such an inclined surface portion can be generated by a slight flow of solder or sintered material into the fluid receiving chamber or channel when connecting the component carrier and the metal connection structure therebetween. For example, such flow can be promoted by tendencies such as increased wet surfaces, capillary effects, etc. Descriptively, the inclined geometry resulting from such material flow can remove sharp corner areas that would otherwise be thermally poor connections. In addition, the thermally highly conductive material of the metal connection structure accumulates highly thermally conductive material close to the fluid receiving chamber, thereby improving cooling performance and cooling power in view of the increased metal volume defining the fluid receiving chamber.

[0033] In one embodiment, at least one of the at least one electrically insulating layer structures has a thermal conductivity of at least 1.4 W / mK, in particular at least one of the at least one electrically insulating layer structures has a thermal conductivity of at least 2.5 W / mK, and preferably at least one of the at least one electrically insulating layer structures has a thermal conductivity of at least 4.5 W / mK, for example, at least one of the at least one electrically insulating layer structures is a thermal prepreg. Even more preferably, the thermal conductivity may even be at least 9.5 W / mK (for example when using aluminum oxide). In contrast, one or more other electrically insulating layer structures of the component carrier and / or the cooling member may, for example, be made of ordinary prepregs and may have a thermal conductivity of, for example, 0.4 W / mK to 1.2 W / mK. The conductive coupling structure implemented as a thermal prepreg may have the high values ​​of the thermal conductivity mentioned. Therefore, such a thermal prepreg may provide a significant contribution to the heat transfer between the component carrier and the cooling member. Advantageously, thermal prepregs can achieve the following dual functions: on the one hand, thermal prepregs can contribute to strong thermal coupling between component carriers and cooling members; on the other hand, thermal prepregs can electrically decouple component carriers (with embedded or surface mounted electronic components) from cooling members (containing cooling fluid).

[0034] In an embodiment, one (preferably only one) of the electrically insulating layer structures which is located closest to the metallic connection structure has a thermal conductivity value which is higher than the thermal conductivity values ​​of all other electrically insulating layer structures of the component carrier. Thus, the mentioned electrically insulating layer structure which is closest to the metallic connection structure can, for example, be a thermal prepreg and can highly advantageously promote the heat transfer from the component carrier to the cooling member while electrically decoupling the component carrier from the cooling member. For all other electrically insulating layer structures, a particularly high thermal conductivity can be of lower relevance, so that the other electrically insulating layer structures can be made of ordinary prepregs and can therefore be provided at low cost.

[0035] In a preferred embodiment, the fluid guiding structure of the cooling member is completely delimited in the circumferential direction by the electrically conductive material. This may be preferred for the above-mentioned embodiments, wherein the cooling member is a component carrier with a cavity or recess, or the cooling member is a machined metal body with a hollow internal fluid guiding structure. For example, the complete circumferential metallization can be achieved by manufacturing the cooling member from a complete metal body with one or more internal volumes to form one or more fluid guiding structures or cavities. Alternatively, this can be achieved by delimiting the fluid guiding structure or cavity, for example, by a copper clad lining of the component carrier recess together with the metal connection structure and the bottom metal structure of the component carrier, in particular the copper layer.

[0036] In an embodiment, the electronic device includes at least one fluid coupling member, which is configured to be fluidically connected to a fluid conduit in a component carrier and / or in a cooling member to supply cooling fluid to a fluid cooling unit (particularly a fluid containing cavity or a fluid channel) and / or to discharge cooling fluid from the fluid cooling unit. For example, the at least one fluid coupling member is configured to form a screw connection with a counterpart, such as an outer tube for supplying or discharging cooling fluid. Alternatively, the fluid coupling member can be a fitting portion at the end of a supply pipe or the like to be connected to other mating portions. By equipping an electronic device with such a fluid coupling member, a continuous flow of cooling fluid supplied in one fluid coupling member through the cooling member and discharged at another fluid coupling member can be achieved.

[0037] In an embodiment, at least one fluid engagement member is formed at an outer surface of the component carrier and / or at an outer surface of the cooling member. For this purpose, an access hole may be formed at the component carrier or on the outer surface of the cooling member, and the access hole may be in fluid communication with the fluid receiving chamber in the interior of the cooling member.

[0038] In an embodiment, at least one fluid engaging member is formed at a main surface of the electronic device or at a side wall of the electronic device.Thus, preferably any available surface portion of the plate-like component carrier or the cooling member can be used for fluid connection of said fluid engaging member.

[0039] In a preferred embodiment, the plate-shaped component carrier can have a surface topology or contour on its bottom side for increasing the heat exchange area of ​​the cooling unit, which can be closed on its top side by the component carrier. This can be achieved, for example, by etching copper structures on the bottom side of the component carrier. For example, the structures forming the surface contour can have a height of 5 μm to 500 μm. For example, the depth of the structures forming the surface contour can be in the range of 5 μm to 500 μm.

[0040] In an embodiment, the stack is a laminated stack. Lamination refers to the process of connecting the stack layers by mechanical pressure and / or heat. Electronic components can also be embedded in the stack by lamination.

[0041] In an embodiment, the manufacturing method comprises forming the fluid cooling unit as a cavity in a further component carrier (constituting the cooling member), the further component carrier comprising a further stack comprising at least one further electrically conductive layer structure and / or at least one further electrically insulating layer structure. The cavity can be formed by embedding a poorly adhesive structure (e.g. polytetrafluoroethylene (PTFE) or a wax material) as a release layer into the further stack and circumferentially cutting the components of the stack. Thus, the electronic device comprising its cavity can be manufactured purely by component carrier technology, in particular by printed circuit board technology.

[0042] In another embodiment, the manufacturing method includes forming the fluid cooling unit as at least one fluid guiding structure, which is integrally formed in the metal body. Thereafter, the metal material of the metal body can be removed after connection with the component carrier, thereby establishing fluid communication from the outside of the electronic device through the component carrier to the at least one fluid guiding structure. Descriptively speaking, the material removal can expose or open the fluid guiding structure to achieve fluid access (fluidic access) to the fluid guiding structure from the outside. Forming the cooling member by simply forming an access hole in the perforated metal block is simple and provides high thermal performance. The connection of such a pure metal cooling member to the component carrier manufactured with PCB technology is simple and direct, and can be achieved by simply welding or sintering the metal connection structure.

[0043] In an embodiment, a fluid containing volume for forming a cooling member or a cavity for embedding an electronic component in a component carrier can be formed by embedding a poorly viscous sheet into a corresponding component carrier layer stack. Thereafter, the components above the poorly viscous sheet of the stack can be circumferentially separated from the rest of the stack by, for example, laser drilling or laser routing. Due to the poor adhesion between the stack material and the poorly viscous sheet, the separated sheet of the stack can be removed from the stack, thereby realizing one or more cavities.

[0044] In an embodiment, the component carrier comprises a stack having at least one electrically insulating layer structure and at least one electrically conductive layer structure. For example, the component carrier can be a laminate of the mentioned electrically insulating layer structures and the electrically conductive layer structures, in particular a laminate formed by applying mechanical pressure and / or heat. The mentioned stack can provide a plate-like component carrier that can provide a large mounting surface for further components and yet is very thin and compact.

[0045] In an embodiment, the component carrier is formed as a plate. This contributes to a compact design, wherein the component carrier nevertheless provides a large base for the components mounted on the component carrier. Furthermore, in particular a bare die as an example of an embedded electronic component can be easily embedded in a thin plate, such as a printed circuit board, due to the small thickness of the bare die.

[0046] In an embodiment, the component carrier is configured as one of a printed circuit board, a substrate (in particular an IC substrate) and an interposer.

[0047] In the context of the present application, the term "printed circuit board" (PCB) may particularly denote a plate-like component carrier formed by laminating a plurality of electrically conductive layer structures with a plurality of electrically insulating layer structures, for example by applying pressure and / or by supplying thermal energy. As a preferred material for PCB technology, the electrically conductive layer structures are made of copper, while the electrically insulating layer structures may comprise resin and / or glass fibers, so-called prepregs, or FR4 materials. The individual electrically conductive layer structures may be connected to one another in a desired manner by forming holes through the laminate, for example by laser drilling or mechanical drilling, and by filling these through holes with an electrically conductive material, in particular copper, thereby forming vias or any other through-hole connections. The filled holes either connect the entire stack, (through-hole connections extending through a plurality of layers or the entire stack), or the filled holes connect at least two conductive layers, called vias. Similarly, optical interconnects may be formed through the layers of the stack to receive an electro-optical circuit board (EOCB). In addition to one or more components that can be embedded in the printed circuit board, the printed circuit board is generally configured to accommodate one or more components on one surface or two opposite surfaces of the plate-shaped printed circuit board. The one or more components can be connected to the corresponding main surface by welding. The dielectric portion of the PCB can be composed of a resin with reinforcing fibers (e.g., glass fibers).

[0048] In the context of the present application, the term "substrate" may particularly refer to a small component carrier. Relative to a PCB, a substrate may be a relatively small component carrier on which one or more components may be mounted and which may be used as a connection medium between one or more chips and another PCB. For example, a substrate may have substantially the same size as a component (particularly an electronic component) to be mounted on the substrate (for example, in the case of a chip-scale package (CSP)). More specifically, a substrate may be understood as a carrier for electrical connectors or power grids and a component carrier for connectors arranged laterally and / or vertically, which are comparable to a printed circuit board (PCB) but have a relatively high density. The transverse connectors are, for example, conductive channels, while the vertical connectors may be, for example, drilled holes. These transverse connectors and / or vertical connectors are arranged in the substrate and may be used to provide electrical, thermal and / or mechanical connections between accommodated components or unaccommodated components (such as bare wafers), particularly IC chips and printed circuit boards or intermediate printed circuit boards. Therefore, the term "substrate" also includes an "IC substrate". The dielectric portion of the substrate may be composed of a resin with reinforcing particles, such as reinforcing spheres, particularly glass spheres.

[0049] The substrate or interposer may include or be composed of at least one layer of glass, silicon (Si) and / or a photoimageable or dry-etchable organic material, such as an epoxy-based laminate material (e.g., an epoxy-based laminate film) or a polymer compound (the polymer compound may or may not include photosensitive and / or heat-sensitive molecules) such as polyimide or polybenzoxazole.

[0050] In an embodiment, at least one electrically insulating layer structure comprises at least one of the following: a resin or a polymer, such as an epoxy resin, a cyanate resin, a benzocyclobutene resin, a bismaleimide-triazine resin, a polyphenyl derivative (e.g. based on polyphenylene ether, PPE), a polyimide (PI), a polyamide (PA), a liquid crystal polymer (LCP), polytetrafluoroethylene (PTFE) and / or a combination thereof. It is also possible to use reinforcing structures, such as meshes, fibers, spheres or other kinds of filling particles, for example made of glass (multilayer glass) to form a composite. A semi-cured resin combined with a reinforcing agent, such as a fiber impregnated with the above resin, is called Prepregs are prepregs. These prepregs are usually named after their characteristics, such as FR4 or FR5, which describe their flame retardant properties. Although prepregs, especially FR4, are generally preferred for rigid PCBs, other materials, especially epoxy-based laminates (such as laminate films) or photoimageable dielectric materials, may also be used. For high-frequency applications, high-frequency materials, such as polytetrafluoroethylene, liquid crystal polymers and / or cyanate resins may be preferred. In addition to these polymers, low-temperature co-fired ceramics (LTCC) or other low, very low or ultra-low DK materials can be implemented as electrically insulating structures in component carriers.

[0051] In an embodiment, at least one electrically conductive layer structure comprises at least one of the following: copper, aluminum, nickel, silver, gold, palladium, tungsten and magnesium. Although copper is generally preferred, other materials or coated variations thereof, in particular coated with superconducting materials or conductive polymers, such as graphene or poly (3,4-ethylenedioxythiophene) (PEDOT) are also possible.

[0052] At least one component can be embedded in the component carrier and / or can be surface mounted on the component carrier. Such at least one component can be selected from: a non-electrically conductive inlay, an electrically conductive inlay (such as a metal inlay, preferably comprising copper or aluminum), a heat transfer unit (such as a heat pipe), a light guiding element (such as an optical waveguide or optical conductor connection), an electronic component or a combination thereof. The inlay can be, for example, a metal block with or without a coating of insulating material (IMS-inlay), the inlay can be embedded or surface mounted to promote heat dissipation. Suitable materials are defined according to the thermal conductivity of the material, which should be at least 2 W / mK. Such materials are usually based on, but not limited to, metals, metal oxides and / or ceramics, such as copper, aluminum oxide (Al2O3) or aluminum nitride (AlN). In order to increase the heat exchange capacity, other geometries with increased surface area are also often used. In addition, the component can be an active electronic component (at least one pn junction is realized), a passive electronic component (such as a resistor, an inductor or a capacitor), an electronic chip, a storage device (such as a DRAM or other data storage), a filter, an integrated circuit (such as a field programmable gate array (FPGA), a programmable array logic (PAL), a general array logic (GAL) and a complex programmable logic device (CPLD)), a signal processing component, a power management component (such as a field effect transistor (FET), a metal oxide semiconductor field effect transistor (MOSFET), a complementary metal oxide semiconductor (CMOS), a junction field effect transistor (JFE T) or insulated gate field effect transistors (IGFETs), all based on semiconductor materials such as silicon carbide (SiC), gallium arsenide (GaAs), gallium nitride (GaN), gallium oxide (Ga2O3), indium gallium arsenide (InGaAs) and / or any other suitable inorganic compound), optoelectronic interface elements, light emitting diodes, optical couplers, voltage converters (e.g., DC / DC converters or AC / DC converters), cryptographic components, transmitters and / or receivers, electromechanical transducers, sensors, actuators, microelectromechanical systems (MEMS), microprocessors, capacitors, resistors, inductors, batteries, switches, cameras, antennas, logic chips and energy harvesting units. However, other components may also be embedded in the component carrier. For example, a magnetic element may be used as a component. Such a magnetic element may be a permanent magnetic element (e.g., a ferromagnetic element, an antiferromagnetic element, a multiferroic element or a ferrimagnetic element, such as a ferrite core) or may be a paramagnetic element. However, the component may also be an IC substrate, an interposer or other component carrier, such as in a board-in-board configuration. The component can be surface mounted on a component carrier and / or can be embedded in the interior of a corresponding component carrier. In addition, other components can also be used as components, in particular those components that generate and emit electromagnetic radiation and / or are sensitive to electromagnetic radiation propagating from the environment.

[0053] In an embodiment, the component carrier is a laminated component carrier. In such an embodiment, the component carrier is a composite of multiple layers that are stacked and connected together by applying pressure and / or heat.

[0054] After processing the internal layer structure of the component carrier, one or both main surfaces of the processed layer structure can be covered symmetrically or asymmetrically (in particular by lamination) with one or more further electrically insulating layer structures and / or electrically conductive layer structures. In other words, stacking can be continued until the desired number of layers is obtained.

[0055] After the formation of the stack having the electrically insulating layer structure and the electrically conductive layer structure has been completed, the resulting layer structure or component carrier can be subjected to a surface treatment.

[0056] In particular, in terms of surface treatment, an electrically insulating solder resist may be applied to one or both of the main surfaces of the layer stack or component carrier. For example, a solder resist may be formed over the entire main surface and the layer of solder resist may be subsequently patterned to expose one or more electrically conductive surface portions that will be used to electrically couple the component carrier to an electronic peripheral. Surface portions of the component carrier that remain covered with the solder resist, in particular surface portions containing copper, may be effectively protected from oxidation or corrosion.

[0057] In terms of surface treatment, a surface finishing portion can also be selectively applied to the exposed electrically conductive surface portion of the component carrier. Such a surface finishing portion can be an electrically conductive covering material on an exposed electrically conductive layer structure (e.g., pads, conductive traces, etc., particularly including or consisting of copper) on the surface of the component carrier. If such an exposed electrically conductive layer structure is not protected, the exposed electrically conductive component carrier material (particularly copper) will be oxidized, thereby making the reliability of the component carrier low. The surface finishing portion can then be formed as, for example, a joint between a surface mounted component and a component carrier. The surface finishing portion has the function of protecting the exposed electrically conductive layer structure (particularly a copper circuit), and the surface finishing portion can realize a joining process with one or more components, for example, by welding. Examples of suitable materials for the surface finishing portion are organic solderability preservatives (OSP), electroless nickel immersion gold (ENIG), electroless nickel immersion palladium immersion gold (ENIPIG), gold (particularly hard gold), chemical tin, nickel gold, nickel palladium, etc.

[0058] The aspects defined above and further aspects of the invention are apparent from the examples of embodiment to be described hereinafter and are explained with reference to these examples of embodiment. BRIEF DESCRIPTION OF THE DRAWINGS

[0059] Figure 1 A cross-sectional view of an electronic device according to an exemplary embodiment of the present invention is shown.

[0060] Figure 2 and Figure 3 shows that in executing manufacturing according to Figure 1 A cross-sectional view of the structure obtained during the method of electronic device.

[0061] Figures 4 to 8 A cross-sectional view showing details of a structure obtained during execution of a method of manufacturing an electronic device according to an exemplary embodiment of the present invention.

[0062] Fig. 9 A cross-sectional view of an electronic device according to another exemplary embodiment of the present invention is shown.

[0063] Figures 10 to 14 A cross-sectional view showing details of a structure obtained during performance of a method of manufacturing an electronic device according to an exemplary embodiment of the present invention.

[0064] Fig.15 A cross-sectional view of an electronic device according to a further exemplary embodiment of the present invention is shown.

[0065] Fig.16 A cross-sectional view of an electronic device according to yet another exemplary embodiment of the present invention is shown.

[0066] Fig.17 and Fig.18 A cross-sectional view showing details of a structure obtained by performing a method of manufacturing an electronic device according to an exemplary embodiment of the present invention.

[0067] Fig.19 and Fig. 20 A cross-sectional view showing a structure obtained during the performance of a method of manufacturing an electronic device according to an exemplary embodiment of the present invention.

[0068] Fig.21 A plan view of an electronic device according to still another exemplary embodiment of the present invention is shown.

[0069] Figure 22 to Figure 26 A cross-sectional view showing details of a structure obtained during execution of a method of manufacturing an electronic device according to an exemplary embodiment of the present invention.

[0070] Fig. 27 A cross-sectional view showing details of a structure obtained during execution of a method of manufacturing an electronic device according to an exemplary embodiment of the present invention.

[0071] Fig.28A cross-sectional view of an electronic device according to yet another exemplary embodiment of the present invention is shown, wherein a single-sided inner surface contour portion serves as a thermal enhancement surface.

[0072] Fig.29 A cross-sectional view of an electronic device according to other exemplary embodiments of the present invention is shown, wherein a double-sided inner surface contour portion serves as a thermal enhancement surface. DETAILED DESCRIPTION

[0073] The illustrations in the drawings are schematic. In different drawings, similar or identical elements are provided with the same reference numerals.

[0074] Before describing the exemplary embodiments in more detail with reference to the drawings, some basic considerations based on which the exemplary embodiments of the invention have been developed will be summarized.

[0075] According to an exemplary embodiment of the present invention, an electronic device is provided, which includes two interconnected components, namely, a component carrier (e.g., a PCB) with embedded electronic components (e.g., a transistor chip) and a cooling member (which can be another PCB or a prefabricated metal body) with an integrated fluid (preferably liquid) cooling unit. Advantageously, the metal connection structure can couple the component carrier and the cooling member mechanically and thermally, and can also advantageously contribute to the spatial definition of the cooling chamber or fluid guiding structure (i.e., can form part of the boundary), wherein the fluid guiding structure includes a fluid (particularly liquid) coolant. Therefore, the metal connection structure can simultaneously perform multiple functions. Descriptively speaking, an exemplary embodiment can provide an electronic device having a PCB-based water fluid guiding structure.

[0076] During operation of such an electronic device, embedded components or surface mounted components (e.g. power semiconductor transistor chips) can heat up. Such one or more electronic components on and / or in the component carrier can preferably be thermally coupled to a metal structure (preferably comprising copper) with even better thermal conductivity via an electrically insulating and thermally conductive structure, which is liquid-resistant and defines a fluid-containing volume. The latter metal structure can form part of a cooling member, such as a PCB-integrated water cooling member or a machined metal body. Therefore, although a first component part of the electronic device comprising the at least one electronic component (as the heat source) is a component carrier such as a PCB, a second component part in the form of a cooling member can also be manufactured in PCB technology or a second component part in the form of a cooling member can be manufactured as a perforated metal body.

[0077] When implemented as a further component carrier, a cavity can be formed in the cooling member and the cavity can be filled with a cooling fluid during operation of the electronic device. For example, the cavity can be formed by embedding the poorly viscous structure in a stack of further component carriers, and the stack can be cut circumferentially to a depth corresponding to the poorly viscous structure to remove a piece of the stack above the poorly viscous structure. Such an embodiment has the advantage that the entire electronic device can be manufactured in PCB technology.

[0078] When implemented as a machined metal body including an internal central control space serving as a fluid channel, the cooling member can be formed, for example, based on a copper plate with pre-formed fluid channels. The metal plate thus machined can then be connected to the component carrier by a metal connection structure. Optionally but preferably, an opening can be formed in the electronic device, which extends through the component carrier and extends to the wall of the metal body to at least one fluid channel in the metal body to establish a fluid connection between the exterior of the electronic component and the fluid channel.

[0079] The exemplary embodiments of the present invention are based on a paradigm shift involving the cooling of electronic components. In power electronics, a PCB with an embedded power chip is usually attached to a heat sink. However, this produces an undesirable thermal interface, resulting in high thermal resistance. In order to overcome this traditional disadvantage, the exemplary embodiments of the present invention use the free space within the PCB for cooling purposes. Therefore, the power electronics do not require a longer external heat sink. In contrast, the free space inside the PCB can be used for cooling with very low thermal resistance. In addition, due to the integrated cooling unit, the volume of the electronic device with cooling function can be reduced. The manufacturing architecture of the exemplary embodiment of the present invention is completely flexible and based on a simple process. This manufacturing architecture supports electrically optimized connections. In particular, cooling paths can be applied where needed. The electronic device according to the exemplary embodiment of the present invention can be extremely particularly suitable for high-power applications or high-current applications. In view of the overall arrangement of the cooling unit inside the electronic device, a compact configuration can be achieved. The combination between the described cooling member and one or more embedded components enables the provision of a high-performance PCB. Particularly advantageous is the combination of embedded components and water fluid guiding structures in a pure PCB structure. In addition, the electronic device according to the exemplary embodiment of the present invention can be manufactured with a low workload. The reliability of the electronic device may be significantly improved by creating a sealed channel, which may be partially defined by the metal connection structure. In particular, the combination of embedded components and aqueous fluid guiding structures / elements in a single PCB body may be very advantageous.

[0080] In power electronics, especially transistors, losses may occur during operation due to non-ideal devices. These losses may generate heat, which should be removed in an efficient manner to ensure proper operation of the electronic device.

[0081] Traditionally, it is possible to mount such a transistor on the outside of a printed circuit board or as an embedded component within the printed circuit board and cool the device via an external heat sink. A thermal interface material can then ensure proper heat distribution and also electrical isolation at the same time. In the case of greater losses, water cooling connected to a metal (e.g. aluminum) heat sink can be installed.

[0082] In order to at least partially overcome the above conventional and / or other disadvantages, exemplary embodiments of the present invention provide an electronic device having the function of cooling one or more embedded electronic components (e.g., transistor chips) by implementing a cooling unit (e.g., a water channel) in the PCB itself. This enables a low-height electronic device, thereby achieving a compact configuration and miniaturization in the vertical direction. In addition, this can allow for higher cooling efficiency due to a small distance and therefore a smaller thermal barrier and fewer thermal interfaces for embedded electronic components (e.g., power chips).

[0083] In particular, the concept of forming a cavity in a component carrier using a poorly viscous structure or release layer for defining the bottom of the cavity is very suitable for forming a copper-clad channel. Copper foil or PCB core can be used as a cover for a closed channel. Such a channel can be any desired shape with a limited height (depending on the core material). Water can be injected into the channel through a copper-clad hole. In this hole, a connector for a flexible tube can be welded to ensure proper connection to the liquid. Although a PCB dielectric such as FR4 material may be soaked in water or other liquids, this phenomenon can be avoided by the continuous copper cladding of the channel itself. In other words, the metal (especially copper) cladding of the fluid guiding structure or chamber can ensure that the coolant is retained in the fluid guiding structure or chamber, and the PCB dielectric remains spaced apart from the fluid (especially liquid) coolant. Therefore, the provided electronic device can have high reliability, especially power reliability. Excellent cooling performance can be synergistically combined with the compact design of an electronic device with embedded power components.

[0084] The above-mentioned fluid guiding structure can be formed, for example, by milling or laser cutting. Minimum cross-section of the fluid guiding structure can help balance pressure and throughput. Calculation and simulation may help to ensure optimized operating conditions.

[0085] Figure 1 A cross-sectional view of an electronic device 100 according to an exemplary embodiment of the present invention is shown.

[0086] according to Figure 1 The plate-shaped electronic device 100 includes two main components, namely a component carrier 102 and a cooling member 120 .

[0087] The plate-like laminated component carrier 102 is implemented here as a printed circuit board (PCB). The component carrier 102 comprises a laminated layer stack 106 formed by one or more electrically conductive layer structures 110 and one or more electrically insulating layer structures 112. For example, the electrically conductive layer structure 110 may comprise a patterned or continuous copper foil and vertical through-connections, such as laser vias filled with copper that can be produced by electroplating. The electrically insulating layer structure 112 may comprise a corresponding resin (e.g. a corresponding epoxy resin), which preferably comprises reinforcing particles (e.g. glass fibers or glass balls) therein. For example, the electrically insulating layer structure 112 may be made of prepreg or FR4. The lowermost portion of the electrically insulating layer structure 112 may be a highly thermally conductive electrically insulating layer structure 112' (e.g. a thermal prepreg or a ceramic plate, e.g. made of aluminum nitride), which has a higher thermal conductivity (e.g. at least 1.4 W / mK) than the other electrically insulating layer structures 112 (e.g. having a thermal conductivity of not more than 1.2 W / mK).

[0088] Furthermore, the component carrier 102 has (in the illustrated embodiment, two) electronic components 118 embedded in the stack 106. For example, the electronic components 118 are power semiconductor chips, such as transistor chips. The electronic components 118 can be electrically coupled to the periphery of the electronic device 100 and to each other via the electrically conductive layer structure 110. During operation of the electronic device 100, the electronic components 118 generate a considerable amount of heat, which needs to be removed from the electronic device 100 to obtain high performance.

[0089] In order to effectively promote heat dissipation, the electronic device 100 includes as a second main component a cooling member 120 having an integrated fluid cooling unit 124, which is implemented here as a fully circumferential metal-clad cavity 126. Thus, the fluid cooling unit 124 includes an internal hollow space in the form of the cavity 126. In addition to one or more inlet holes ( Figure 1 Not shown, for example Fig. 9 ), the cavity 126 may be hermetically sealed. Fluid cooling (preferably liquid cooling) may be achieved by a cooling fluid 142 (e.g., water) in the cavity 126. Heat generated by the electronic components 118 during operation of the electronic device 100 may be thermally conducted into the cooling member 120 and may be carried away by the cooling fluid 142, causing the cooling fluid 142 to be heated.

[0090] In the embodiment shown, the cooling component 120 with its fluid cooling unit 124 is a further component carrier 104, in particular a further plate-shaped laminated component carrier, such as a further printed circuit board (PCB). Therefore, the cooling component 120 comprises a further laminate layer stack 108, which comprises one or more further electrically conductive layer structures 114 and one or more further electrically insulating layer structures 116.

[0091] Optionally, at least one component (e.g., the electronic component 118 described above for the component carrier 102) may be embedded in the cooling member 120 (not shown). Since the cooling member 120 may be a PCB having a cavity, there may be at least one component embedded in the cooling member 120 or at least one component surface mounted on the cooling member 120. For example, such a component may be used to route signals.

[0092] For example, the further electrically conductive layer structure 114 may comprise a patterned or continuous copper foil and optionally vertical through-connections, such as copper-filled laser vias that may be produced by electroplating. The further electrically insulating layer structure 116 may comprise a corresponding resin, such as a corresponding epoxy resin, preferably including reinforcing particles therein, such as glass fibers or glass balls. For example, the further electrically insulating layer structure 116 may be made of prepreg or FR4.

[0093] like Figure 1 As shown, the (e.g. separately preformed) component carrier 102 and the cooling member 120 are connected via a highly thermally conductive metal connection structure 122, which can be applied, for example, by dispensing. Due to the high thermal conductivity of the metal connection structure 122, the metal connection structure 122 facilitates heat transfer from the electronic component 118 to the cooling unit 124. Preferably, the highly thermally conductive metal connection structure 122 has a thermal conductivity of at least 50 W / mk, in particular a thermal conductivity of at least 100 W / mk. Advantageously, the metal connection structure 122 can be a solder structure or a sintered structure (e.g. a solidified sintered paste), so that the component carrier 102 and the cooling member 120 can be thermally and mechanically connected, preferably by welding or sintering. Although in Figure 1 Although not shown in the cross-sectional view of FIG. 1 , the metal connection structure 122 may be a circumferentially closed annular structure extending along the entire periphery of the electronic device 100 . The metal connection structure 122 is in direct physical contact with the metal material of the component carrier 102 and the metal material of the cooling member 120 .

[0094] As shown, the fluid containing volume of the fluid cooling unit 124 is defined by a cavity 126 in the further stack 108. The bottom surface and the side walls defining the cavity 126 are made of a metal material, in particular clad with copper. The upper surface of the fluid containing volume closing the cavity 126 on the upper side is formed by the lowermost electrically conductive layer structure 110 of the component carrier 102, which is a thick copper plate. The metal connection structure 122 closes the side walls of the cavity 126 on the upper side and also contributes to the complete circumferential metal cladding defining the fluid containing volume of the cooling unit 124. In other words, the metal connection structure 122, the electrically conductive layer structure 110 of the component carrier 102 and the other electrically conductive layer structures 114 of the component carrier type cooling member 120 completely define the cooling fluid containing cavity 126 of the cooling unit 124. In other words, no dielectric material of the component carrier 102 and the dielectric material of the cooling member 120 are in direct physical contact with the cooling fluid 142, such as water. Thus, soaking of the dielectric resin by the cooling fluid 142 can be reliably prevented, since the cooling fluid 142 is in direct physical contact only with the metal material within the electronic device 100. The metal connection structure 122 is connected to the lowermost electrically conductive layer structure 110 of the component carrier 102 and to the further electrically conductive layer structure 114 of the cooling member 120. This ensures a fluid-tight surround of the cooling fluid 142 only by the metal material. Optionally, the continuous metal wall defining the cavity 126 can be covered by a passivation film (not shown). In addition, a copper topology ( Figure 1 Not shown, see Fig.28 and Fig.29 ).

[0095] Further advantageously, the metal connection structure 122 is electrically decoupled from the electronic component 118 by the lowermost highly thermally conductive electrically insulating layer structure 112' of the component carrier 102, which forms an electrical barrier. Thus, on the one hand, an undesired electrical connection between the electrical path connected to the electronic component 118 and the fluid path of the cooling member 120 is reliably prevented. At the same time, since the lowermost highly thermally conductive electrically insulating layer structure 112' of the component carrier 102 can be made of thermal prepreg, the component carrier 102 and the cooling member 120 are strongly thermally coupled.

[0096] During operation of the electronic device 100, an electrical signal can be applied to the electronic component 118 through the electrically conductive layer structure 110, so that the electronic component 118 can fulfill its electronic function (e.g., power semiconductor function). The heat generated during operation of the electronic component 118 can be conducted in a downward direction through the highly thermally conductive metal structure (see reference numerals 110, 122, 114) and through the highly thermally conductive and electrically insulating layer structure 112'. The heat can be absorbed by the cooling fluid 142, which can flow continuously through the cavity 124 (e.g., can be pumped). Alternatively, the cooling fluid 142 can be permanently retained in the cavity 126. Therefore, heat can be effectively removed from the electronic device 100, thereby improving the performance of the electronic device 100. At the same time, the power reliability of the electronic component 100 is ensured by reliably avoiding the short circuit of the electrical signal generated by the cooling fluid 142 (particularly reference numeral 112'). In view of the planar design of the electronic device 100, which is basically composed of two superimposed PCBs, a highly compact configuration is obtained, which has a very small footprint in the vertical direction. Further advantageously, the described configuration keeps the heat paths inside the electronic device 100 short, which keeps the losses small and ensures a high heat dissipation capacity.

[0097] Figure 2 and Figure 3 shows that in executing manufacturing according to Figure 1 A cross-sectional view of the structure of the electronic device 100 obtained during the method.

[0098] Figure 2 The two main components of the electronic device 100 are shown, namely the component carrier 102 and the cooling member 120 , which are still separated from each other.

[0099] With respect to the component carrier 102, it is shown that two electronic components 118 have been embedded in the laminate layer stack 106. In addition, Figure 2 Illustrated by reference numeral 160a are through holes or fluid conduits 140 that have been formed to extend vertically through the entire stack 106 to form the fluid engaging member 138 (compare Figures 4 to 8 ), the fluid coupling member 138 enables external access to the cooling unit 124 of the cooling member 120. For example, the through hole can be produced by mechanical drilling or laser drilling.

[0100] Reference again Figure 2, the thickest of the electrically conductive layer structures 110 is located at the bottom of the layer stack 106 and may have a thickness d of, for example, at least 50 μm, in particular at least 500 μm (e.g. in order to achieve proper heat dissipation). This allows to establish a proper thermal coupling between the component carrier 102 and the cooling member 120 while also contributing to a hollow fluid containing volume within the electronic device 100 after the connection of the component carrier 102 to the cooling member 120. The thickest and lowest electrically conductive layer structure 110 also defines a part of the hollow fluid containing volume, which, together with the cooling member 120, is completely defined by the electrically conductive material. Thus, liquid soaking in the dielectric stack material can be reliably prevented.

[0101] Arranged directly above the thickest of the electrically conductive layer structures 110 at the bottom of the layer stack 106 is: a continuous layer in the form of an electrically insulating layer structure 112' constructed as a thermal prepreg (this arrangement may also be vice versa). Of all the electrically insulating layer structures 112 of the stack 106, the bottommost electrically insulating layer structure 112' has the highest thermal conductivity. Therefore, the bottommost electrically insulating layer structure 112' achieves two functions: firstly, the bottommost electrically insulating layer structure 112' strongly promotes effective thermal coupling between the component carrier 102 and the cooling member 120; secondly, the bottommost electrically insulating layer structure 112' electrically decouples the circuit including the embedded electronic component 118 above the bottommost electrically insulating layer structure 112' from the fluid system below the bottommost electrically insulating layer structure 112'. This avoids short circuiting of the flowing current and improves the power reliability of the electronic device 100.

[0102] Contents related to cooling member 112, Figure 2 Reference numeral 162 schematically illustrates the formation of the cavity 126 of the fluid cooling unit 124 in the cooling member 120. As shown, the poor adhesion structure 150 can be embedded in the stack 108 of the cooling member 120. The poor adhesion structure 150 can be made of a material (such as polytetrafluoroethylene (PTFE) or a wax material) that does not properly adhere to the surrounding material of the stack 108. The poor adhesion structure 150 can also be represented as a release layer because the poor adhesion structure 150 defines an area within the stack 108, so that different parts of the stack 108 can be separated or released at this area. Still referring to Figure 2, a laser beam 165 generated by a laser source 164 (or a mechanical drill, not shown) can be used to perform a circumferential cut extending from the outside of the stack 108 to the poor adhesion structure 150. The above-mentioned circumferential cut can isolate a piece 152 from the rest of the stack 108. The piece 152 is laterally defined by a circumferential cut line and is defined on the bottom side by the poor adhesion structure 150. Therefore, the piece 152 can be removed from the rest of the stack 108. Therefore, the cavity 126 is formed by the following operations: embedding the poor adhesion structure 150 in the stack 108; and circumferentially cutting out the piece 152 of the stack 108, which is defined on the bottom side by the poor adhesion structure 150.

[0103] As shown, the cooling member 120 is configured as an additional component carrier 104 that includes a laminate layer stack 108 having a cavity 126 formed therein, as described above. Figure 2 As shown, the entire cavity 126 is defined by an electrically conductive material in the form of an electrically conductive layer structure 114. After cavity 126 is formed, an electrically conductive material may be deposited in cavity 126 as shown by reference numeral 162 to continuously coat or clad cavity 120 completely with an electrically conductive material, such as copper.

[0104] Reference now Figure 3 ,according to Figure 2 The processed component carrier 102 and cooling member 120 can be interconnected by an annular metal connection structure 122, which can be implemented as solder. As shown, the material of the metal connection structure 122 helps to define a fluid holding volume of the electronic device 100, in which a cooling fluid 142 as a coolant is held. The metal connection structure 122 is connected to the metal material of the component carrier 102 and the metal material of the cooling member 120, thereby promoting efficient heat removal from the electronic component 118 to the cooling unit 124 due to the high thermal conductivity of the metal connection structure 122.

[0105] Figures 4 to 8 1 is a cross-sectional view showing details of a structure obtained during the execution of a method of manufacturing an electronic device 100 according to an exemplary embodiment of the present invention. More specifically, Figures 4 to 8 It is shown how a fluid connection between the exterior of the electronic device 100 and the fluid receiving cavity 126 in the cooling member 120 may be formed.

[0106] Reference Figure 4 A through hole is drilled through the stack 106 as a fluid conduit 140 to obtain external access to the cavity 126. The formation of the through hole can be performed, for example, by mechanical drilling or laser drilling.

[0107] Also like Figure 4 As shown, the metal connection structure 122 can be formed with an inclined surface portion 134, which partially defines the cooling fluid receiving cavity 126 of the cooling unit 124. During soldering (optionally accompanied by pressing the component carrier 102 and cooling and cooling the member 120), the solder, sintering or bonding material of the metal connection structure 122 can flow into the cavity 126, so that the inclined surface portion 134 can be formed. The advantageous shape of the inclined surface portion 134 shown can be obtained by adjusting the characteristics of the solder or sintering connection used to produce the metal connection structure 122. In particular, adjusting the viscosity of the paste used to form the metal connection structure 122 (the paste can be applied, for example, by dispensing), the mechanical pressure applied, the processing temperature, etc., can allow the shape of the inclined surface portion 134 to be adjusted. The viscosity of the paste used to produce the metal connection structure 122 can also be adjusted to fill the vias in the component carrier 102 and / or the cooling member 120, for further improving the mechanical integrity of the electronic device 100. Thus, the highly thermally conductive solder material may define a substantial surface area of ​​the cavity 126 and provide additional volume of high thermal conductivity to further enhance heat transfer and cooling effects.

[0108] Reference Figure 5 , the sidewalls of the fluid conduit 140 may then be coated with an electrically conductive material 168, such as copper. This may be achieved, for example, by electroless plating. Thus, the entire fluid conduit 140 is defined by the electrically conductive material 168, rather than by the dielectric material of the electrically insulating layer structures 112, 112'. This may advantageously inhibit undesirable soaking of dielectric wall portions by the cooling fluid 142 supplied to the cavity 126 via the fluid conduit 140. Such soaking may occur when the cooling fluid 142 is in direct physical contact with the resin material of the electrically insulating layer structures 112, 112'.

[0109] To obtain Figure 6 In the structure shown, auxiliary material 171 can be inserted into the fluid conduit 140, such as by stencil printing. The auxiliary material 171 can be a via plugging paste (such as a material similar to FR4) to keep the channel dry during the production process so that no chemical residue can remain in the water channel after manufacturing.

[0110] Reference Figure 7 , a drill bit or pin 172 is guided through the auxiliary material 171 in the fluid conduit 140 to create an opening extending vertically through the auxiliary material 171 into the cavity 126 .

[0111] Reference Figure 8, the fluid joining member 138 is connected to the component carrier 102 by welding using a solder material 170, and the fluid joining member 138 can be a fitting or a fitting part. For example, the fluid joining member 138 can be configured as a fitting, which is constructed to establish a screw connection at the end of a tube or a capillary (not shown) using a counter screw. Therefore, the electronic device 100 is provided with a fluid joining member 138, which is connected to a fluid conduit 140, which is used to supply a cooling fluid 142 to the cavity 126 or discharge the cooling fluid 142 from the cavity 126. As shown, the fluid joining member 138 is connected to the outer main surface of the component carrier 102. The fluid joining member 138 is fluidically coupled to the cavity 126 of the cooling member 120 through the component carrier 102. Although not shown, the fluid joining member 138 can also be formed at the outer surface of the cooling member 120. Although according to Figure 8 The fluid engaging member 138 is formed at the upper main surface of the component carrier 102 , but, alternatively, the fluid engaging member 138 may be formed at the side wall of the component carrier 102 or at the side wall of the cooling member 120 .

[0112] As a reference Figures 4 to 8 As a result of the described process, a cooling pipe connection is established. The heat dissipation chamber in the form of cavity 126 may be filled with a cooling fluid 142, such as water, and may function as a heat pipe.

[0113] Fig. 9 A cross-sectional view of an electronic device 100 according to another exemplary embodiment of the present invention is shown.

[0114] Fig. 9 The implementation method and Figure 1 The difference between the implementation methods is that: Fig. 9 In the embodiment of the present invention, the cooling member 120 is implemented as a machined metal plate rather than being configured as a PCB. More specifically, according to Fig. 9The cooling member 120 is implemented as a metal body 130 having an integrally formed internal fluid guiding structure 132. Therefore, the fluid cooling unit 124 includes a hollow space in the form of a fluid guiding structure 132 (e.g., separate or interconnected). Each of the fluid guiding structures 132 of the cooling member 120 is completely bounded by the electrically conductive material of the metal body 130 in the circumferential direction. In particular, the metal body 130 with the integral fluid guiding structure 132 can be a copper block having a thickness D in the range of 0.5 mm to 10 mm, for example, 1 mm. For example, cooling traces can be formed inside the metal body 130 as hollow fluid guiding structures 132. For example, the fluid guiding structure 132 can be arranged in a zigzag, spiral or sawtooth configuration. There can also be areas with a high-density channel configuration and areas with a low density. This design can facilitate appropriate heat transfer from the metal body 130 to the cooling fluid 142 flowing through the fluid guiding structure 132.

[0115] The connection between the component carrier 102 and the cooling member 120 can also be established by a metal connection structure 122, for example by welding, sintering, by an electrically conductive adhesive, or by thermocompression bonding. This can also be integrated into the manufacturing cycle of the PCB (particularly lamination).

[0116] also, Fig. 9 Two fluid engaging members 138 are shown at the upper major surface of the component carrier 102 and are in fluid communication with the fluid guiding structure 132. As indicated by arrows 174, one fluid engaging member 138 is configured for supplying a cooling fluid 142 (e.g., water) to the fluid guiding structure 132. As indicated by arrows 176, the other fluid engaging member 138 is configured for draining the cooling fluid 142 from the fluid guiding structure 132 to a drain (not shown).

[0117] Figures 10 to 14 The following is a diagram showing the process of performing manufacturing according to an exemplary embodiment of the present invention. Fig. 9 A cross-sectional view of a detail of the structure obtained during the method of manufacturing an electronic device 100 of the type shown. More specifically, Figures 10 to 14 Shown according to Fig. 9 How the fluid cooling unit 124 can be fluidically connected from the outside of the electronic device 100 .

[0118] refer to Fig.10 , a metal body 130 with an integrally formed fluid guiding structure 132 has been connected to the component carrier 102. Furthermore, through holes (as fluid conduits 140) are drilled through the stack 106 to obtain external access to the metal body 130. The formation of the through holes can be performed, for example, by mechanical drilling or laser drilling.

[0119] Reference Fig.11 , the sidewalls of the fluid conduit 140 can be coated with an electrically conductive material 168, such as copper. For example, this can be achieved by electroless plating. Therefore, the entire fluid conduit 140 is defined by the electrically conductive material, rather than by the dielectric material of the electrically insulating layer structure 112, 112'. This can advantageously suppress undesired soaking of the cooling fluid 142 supplied to the fluid guiding structure 132 via the fluid conduit 140.

[0120] To obtain Fig.12 , a drill bit or pin 172 is inserted into the copper-lined fluid conduit 140 until the drill bit or pin 172 protrudes through the upper portion of the metal body 130 to the fluid channel 132 below to establish fluid communication between the fluid conduit 140 and the fluid channel 132. This process is advantageous in that the channel is kept dry during manufacturing, and an opening can be formed at the end of manufacturing. In other words, a fluid connection can be established by removing the metal material on the top side of the metal body 130 after connection with the component carrier 102, thereby establishing fluid communication between the outside of the electronic device 100 through the component carrier 102 and the fluid cooling unit 124 leading to the cooling member 120. The result is as shown in FIG. Fig.13 shown.

[0121] Reference Fig.14 , and then the fluid joining member 138 is connected to the outer main surface of the component carrier 102 by welding using solder 170. For example, the fluid joining member 138 can be configured as a fitting or a fitting portion, which is configured to establish a screw connection at the end of a supply tube or a capillary (not shown) using a corresponding screw (e.g., a nut). Therefore, the electronic device 100 is provided with a fluid joining member 138, which is connected to a fluid conduit 140, which is used to supply a cooling fluid 142 to the fluid channel 132 or discharge the cooling fluid 142 from the fluid channel 132. As shown, the fluid joining member 138 is formed on the outer surface of the component carrier 102, and the fluid joining member 138 enables fluid communication through the component carrier 102 to the cooling member 120. Although not shown, the fluid joining member 138 can also be formed at the outer surface of the cooling member 120. Although according to Fig.14 The fluid engaging member 138 is formed at the upper main surface of the component carrier 102 , but, alternatively, the fluid engaging member 138 may be formed at the side wall of the component carrier 102 or at the side wall of the cooling member 120 .

[0122] Fig.15A cross-sectional view of an electronic device 100 according to a further exemplary embodiment of the present invention is shown.

[0123] Fig.15 The implementation method and Figure 1 The implementation methods are different, in particular: according to Fig.15 , the further stack 108 comprises an additional further electrically conductive layer structure 114 and a further electrically insulating layer structure 116 below the cavity 126. Thus, further configurations may be present on the bottom side of the electronic device 100.

[0124] Another difference is that: Fig.15 The metal connection structure 122 has an inclined surface portion 134 that defines the cavity 126. This enhances thermal coupling, thereby improving the thermal performance of the electronic device 100.

[0125] also, Figure 1 The thickest lowermost electrically conductive layer structure 110 is Fig.15 In the embodiment of the present invention, the array of copper pillars 178 extending through the electrically insulating layer structure 112 is replaced to establish appropriate thermal contact in the vertical direction of the electronic device 100. The array of copper pillars 178 extending through the electrically insulating layer structure 112 can be implemented as a core. Alternatively, it can be implemented as a thick copper sheet, such as Figure 1 The cooling structure of the electronic device 100 is Fig.15 Indicated by reference numeral 180.

[0126] Fig.16 A cross-sectional view of an electronic device 100 according to yet another exemplary embodiment of the present invention is shown.

[0127] Fig.16 The implementation method and Fig.15 The implementation methods are different, in particular: according to Fig.16 , the electronic component 118 is surface mounted on the laminate layer stack 106, rather than embedded in the laminate layer stack 106. In addition, the thermally conductive connection between the surface mounted electronic component 118 and the cooling structure 180 in the interface area between the component carrier 102 and the cooling member 120 is formed by a copper pillar 178, which thermally couples the electronic component 118 with a thermally conductive electrically insulating layer structure 112', for example, which is embodied as a thermal prepreg. On its bottom side, the thermally conductive electrically insulating layer structure 112' is thermally coupled to a further copper pillar 178 below, such as Fig.15 shown.

[0128] according to Figure 6 The upper part of the component carrier 102 can be embodied as a core having a metallization cavity 126 .

[0129] Fig.17 A cross-sectional view showing details of a structure obtained during the execution of a method for manufacturing an electronic device 100 according to an exemplary embodiment of the present invention. As described above, the fluid coupling member 138 may be a welded connector to a flexible cooling tube. The thermally conductive and electrically insulating layer structure 112' may have a higher thermal conductivity than the further electrically insulating layer structure 112, the thermally conductive and electrically insulating layer structure 112' may be a thermally enhanced prepreg, and the thermally conductive and electrically insulating layer structure 112' may be able to connect one or more electronic components 118 ( Fig.17 At the same time, the thermally conductive and electrically insulating layer structure 112 ′ enhances the thermal coupling between the component carrier 102 and the cooling member 120 .

[0130] The metal connection structure 122 having an inclined surface portion 134 defining the cavity 126 can be formed by appropriately adjusting process parameters to establish a solder connection or a sintered copper connection to enhance thermal coupling between the cooling fluid 142 and the electronic component 118. Together with the copper cladding defining the fluid guiding structure associated with the cavity 126, the inclined surface portion 134 of the metal connection structure 122 contributes to the thermal performance of the electronic device 100.

[0131] Low flow prepregs may also be used to enhance the connection between the component carrier 102 and the cooling member 120 .

[0132] Fig.18 A cross-sectional view showing details of a structure obtained during the execution of a method of manufacturing the electronic device 100 according to the exemplary embodiment of the present invention.

[0133] As shown at 182, the lateral end of the metal connection structure 122 facing away from its inclined surface portion 134 and the further electrically conductive layer structure 114 located directly below the metal connection structure 122 laterally abuts one or more further electrically insulating layer structures 116. This abutment produces a stepped metal-resin joint 128, and furthermore, at Fig.18 The stepped metal-resin joint 128 is indicated by a dashed line in FIG. The stepped joint 128 increases the mechanical connection strength in the region between the component carrier 102 and the cooling member 120 .

[0134] Fig.18 A vertical interconnection (also indicated as Z-interconnection) is shown between the component carrier 102 and the cooling member 120. In an embodiment, said Z-interconnection may be applied only to the edges of the fluid guiding structure and all other areas may be filled with pre-cut prepreg.

[0135] Fig.19 and Fig. 20 A cross-sectional view of a structure obtained during the performance of a method of manufacturing the electronic device 100 according to an exemplary embodiment of the present invention is shown.

[0136] Fig.19 An embodiment is shown in which the fluid receiving volume for receiving the cooling fluid 142 is defined exclusively by the cavity 126 of the cooling member 120 , while the flat bottom surface of the component carrier 102 closes the cavity 126 exclusively from the upper side.

[0137] Fig. 20 Another embodiment is shown in which the fluid accommodation volume for accommodating the cooling fluid 142 is defined by the cavity 126 of the cooling member 120 and a recess 184 formed in the bottom surface of the component carrier 102, which closes the cavity 126 from the upper side and increases the fluid accommodation volume. Therefore, by forming the recess 184 in the bottom surface of the component carrier 102 aligned with the cavity 126 of the cooling member 120, the cooling performance of the electronic device 100 can be further improved.

[0138] Fig.21 A (partially transparent) plan view of an electronic device 100 according to yet another exemplary embodiment of the present invention is shown.

[0139] Fig.21 A meandric fluid guiding structure of the fluid cooling unit 124 extending between two fluid coupling members 138 is shown to generate a continuous flow of the cooling fluid 142. The fluid guiding structure can be bounded by the further electrically conductive layer structure 114 and can contain the cooling fluid. For example, a vertically extending electrically conductive connecting element 186 can be embedded in the further electrically insulating layer structure 116, so that it can be reliably electrically and fluidically decoupled from the flow path of the cooling fluid 142.

[0140] Figure 22 to Figure 26 1 shows a cross-sectional view of details of a structure obtained during the execution of a method of manufacturing an electronic device 100 according to an exemplary embodiment of the present invention. For the following description, please refer to Figures 10 to 14 of the above description, and only the differences are mentioned.

[0141] refer to Fig. 22 , the starting point is based on Fig.10 structure.

[0142] Reference Fig.23 , the sidewalls of the fluid conduit 140 may be coated with an electrically conductive material 168 , and a preform of the fluid engaging member 138 may be welded and connected to the top of the component carrier 102 .

[0143] Reference Fig.24, an access hole may be formed (e.g., by drilling) in the preform of the fluid engaging member 138 to establish a fluid connection with the fluid conduit 140. During the formation of the access hole, material from the top of the metal body 130 may be removed to fluidically connect the fluid conduit 140 with the fluid guiding structure 132.

[0144] exist Fig.25 In an alternative embodiment, a drill or pin 172 may be used to remove metal material on top of the metal body 130 prior to connection of the fluid engaging member 138 to fluidly connect the fluid conduit 140 to the fluid guiding structure 132 (compare Fig.12 ).

[0145] like Fig.26 As shown, the fluid engaging member 138 can be welded according to Fig.25 The top of the obtained structure (control Fig.14 ).

[0146] Fig. 27 A cross-sectional view showing structural details obtained during execution of a method of manufacturing the electronic device 100 according to an exemplary embodiment of the present invention.

[0147] In addition to Fig.17 In addition to the arrangement adopted, the solder resist 188 may be selectively applied to the surface portion of the electronic device 100 onto which no solder 170 should flow.

[0148] Fig.28 A cross-sectional view of an electronic device 100 according to yet another exemplary embodiment of the present invention is shown, wherein an inner surface profile 196 serves as a heat enhancement surface. As shown, the hollow space 126 is bounded by a heat conductive wall, wherein the upper major surface of the wall includes an inner surface profile 196 having a periodic rectangular pattern. The inner surface profile 196 is configured to increase the heat exchange area between the cooling fluid 142 and the heat conductive wall. Thus, heat removal from the embedded electronic component 118 can be further enhanced.

[0149] Fig.29 A cross-sectional view of an electronic device 100 is shown according to other exemplary embodiments of the present invention, wherein the inner surface contour 196 serves as a thermally enhanced surface. Fig.29 The implementation method and Fig.28 The implementation methods are different in that: Fig.29 , both the upper and lower main surfaces of the wall comprise an inner surface profile 196 having a periodic rectangular pattern. Thus, a stronger enhanced thermal coupling between the component carrier 102 and the cooling member 120 can be obtained.

[0150] It should be noted that the term "comprising" does not exclude other elements or steps and the singular form does not exclude a plurality. Likewise, elements described in connection with different embodiments may be combined.

[0151] It should also be noted that reference signs in the claims should not be construed as limiting the scope of the claims.

[0152] The embodiments of the invention are not limited to the preferred embodiments shown in the drawings and described above. On the contrary, several variations are possible using the solutions shown and according to the principle of the invention, even in the case of fundamentally different embodiments.

Claims

1. An electronic device (100), comprising: A component carrier (102), the component carrier (102) comprising a stack (106), the stack (106) having at least one electrically conductive layer structure (110) and / or at least one electrically insulating layer structure (112), and the component carrier (102) comprising electronic components (118) on and / or in the stack (106); and A cooling member (120) having a fluid cooling unit (124) at least partially located in the cooling member (120); wherein the component carrier (102) and the cooling member (120) are connected via a connecting structure (122); Therein, the fluid cooling unit (124) is formed in the cooling component (120) and is closed by the component carrier (102).

2. The electronic device (100) according to claim 1, wherein: The fluid cooling unit (124) includes a hollow space (126, 132) for containing a cooling fluid (142).

3. The electronic device (100) according to claim 2, wherein: The hollow space (126, 132) is at least partially filled with a cooling fluid (142).

4. The electronic device (100) according to claim 2, wherein: The hollow space (126, 132) is bounded by an at least partially heat-conductive wall, at least a portion of which has an inner surface contour (196) configured to increase a heat exchange area between a cooling fluid (142) and the at least partially heat-conductive wall.

5. The electronic device (100) according to claim 1, wherein: The connection structure (122) includes at least one of a solder structure, a sintered structure, and an electrically conductive glue.

6. The electronic device (100) according to claim 1, wherein: The cooling component (120) comprises a further component carrier (104), or the cooling component (120) consists of a further component carrier (104), wherein the further component carrier (104) comprises a further stack (108), wherein the further stack (108) comprises at least one further electrically conductive layer structure (114) and / or at least one further electrically insulating layer structure (116).

7. The electronic device (100) according to claim 6, wherein: The fluid cooling unit (124) is at least partially defined by a cavity (126) in the further stack (108).

8. The electronic device (100) according to claim 6, wherein: At least one of the at least one further electrically conductive layer structure (114) and the connecting structure (122) partially delimit a cooling fluid receiving cavity (126) of the cooling unit (124).

9. The electronic device (100) according to claim 6, wherein: At least one of the at least one further electrically conductive layer structures (114) and the connecting structure (122) adjoin at least one of the at least one further electrically insulating layer structures (116) via a stepped joint (128).

10. The electronic device (100) according to claim 1, wherein: The cooling component (120) comprises a metal body (130), or the cooling component (120) is composed of a metal body (130), wherein the metal body (130) has at least one integrally formed fluid guiding structure (132).

11. The electronic device (100) according to claim 10, wherein: The metal body (130) is a metal plate.

12. The electronic device (100) according to claim 1, comprising at least one of the following features: in, The connection structure (122) is connected to at least one of the at least one electrically conductive layer structure (110) of the component carrier (102); wherein the connection structure (122) is electrically decoupled from the electronic component (118) by at least one of the at least one electrically insulating layer structure (112) of the component carrier (102); wherein the connection structure (122) partially defines a cooling fluid receiving chamber (126) of the fluid cooling unit (124); wherein at least one of the at least one electrically insulating layer structure (112) has a thermal conductivity of at least 1.4 W / mK; The fluid guiding structure (132) of the cooling component (120) is completely defined in the circumferential direction by an electrically conductive material.

13. The electronic device (100) according to claim 12, wherein: The connecting structure (122) has an inclined surface portion (134) that partially defines the cooling fluid receiving cavity (126).

14. The electronic device (100) according to claim 1, wherein: At least one of the at least one electrically insulating layer structure (112) has a thermal conductivity of at least 2.5 W / mK.

15. The electronic device (100) according to claim 1, wherein: At least one of the at least one electrically insulating layer structure (112) has a thermal conductivity of at least 4.5 W / mK.

16. The electronic device (100) according to claim 1, wherein: At least one of the at least one electrically insulating layer structure (112) is a thermal prepreg and / or comprises a ceramic material.

17. The electronic device (100) according to claim 16, wherein: The ceramic material is alumina.

18. The electronic device (100) according to claim 1, wherein: The fluid guiding structure (132) of the cooling member (120) is completely defined in the circumferential direction by the electrically conductive material of the machined metal body (130).

19. The electronic device (100) according to claim 1 comprises at least one fluid coupling member (138), which is configured to be connected to a fluid conduit (140) in the component carrier (102) and / or in the cooling member (120) to supply cooling fluid (142) to the fluid cooling unit (124) and / or to discharge cooling fluid (142) from the fluid cooling unit (124).

20. The electronic device (100) according to claim 19, comprising at least one of the following features: in, The at least one fluid engaging member (138) is configured to establish a threaded connection with an external tube; Wherein, the at least one fluid coupling member (138) is formed on the outer surface of the component carrier (102) and / or on the outer surface of the cooling member (120); wherein the at least one fluid coupling member (138) is formed on the main surface of the electronic device (100) and / or on the side wall of the electronic device (100).

21. The electronic device (100) according to claim 1, comprising at least one of the following features: in, One of the at least one electrically insulating layer structures (112) which is located closest to the connecting structure (122) has a thermal conductivity value that is higher than the thermal conductivity values ​​of all other electrically insulating layer structures of the at least one electrically insulating layer structure (112), wherein the fluid cooling unit (124) is integrated into the cooling component (120); The cooling member (120) comprises at least one fluid guiding structure (132), wherein the at least one fluid guiding structure (132) is configured as an at least partially heat-conducting wall that generates a swirling flow.

22. The electronic device (100) according to claim 1, wherein: The connection structure (122) includes a thermal interface material that facilitates heat removal from the electronic component (118) to the cooling unit (124).

23. The electronic device (100) according to claim 1, wherein: The connecting structure (122) is a ring-shaped structure.

24. The electronic device (100) according to claim 22, wherein: The thermal interface material is thermally conductive and electronically non-conductive.

25. The electronic device (100) according to claim 1, wherein: The connection structure (122) includes metal and forms a metal connection structure.

26. A method of manufacturing an electronic device (100), wherein: The method comprises: mounting an electronic component (118) on and / or in a stack (106) of component carriers (102), the stack (106) comprising at least one electrically conductive layer structure (110) and / or at least one electrically insulating layer structure (112); forming at least a portion of a fluid cooling unit (124) in the cooling member (120); and Connecting the component carrier (102) to the cooling member (120) via a connecting structure (122); Therein, the fluid cooling unit (124) is formed in the cooling component (120) and is closed by the component carrier (102).

27. The method according to claim 26, wherein: The method comprises connecting the component carrier (102) to the cooling member (120) via a metal connection structure (122).

28. The method according to claim 26, wherein: The method includes connecting the component carrier (102) to the cooling member (120) via a connection structure (122), the connection structure (122) facilitating heat removal from the electronic component (118) to the fluid cooling unit (124).

29. The method according to claim 26, wherein: The method comprises: forming the fluid cooling unit (124) as a cavity (126) in a further component carrier (104), the further component carrier (104) comprising a further stack (108), the further stack (108) comprising at least one further electrically conductive layer structure (114) and / or at least one further electrically insulating layer structure (116); and The fluid cooling unit (124) is formed by embedding a low-viscosity structure (150) in the further stack (108) and circumferentially cutting out a block (152) of the stack (108), the block (152) being delimited at the bottom side by the low-viscosity structure (150).

30. The method of claim 26, wherein: The method comprises: forming the fluid cooling unit (124) as at least one fluid guiding structure (132), wherein the at least one fluid guiding structure (132) is integrally formed in the metal body (130); and The fluid cooling unit (124) is formed by removing metal material of the metal body (130) after connection with the component carrier (102), thereby establishing fluid communication from the outside of the electronic device (100) through the component carrier (102) to the at least one fluid guiding structure (132).

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