A heat conduction transfer module and its application

Abstract

A heat conduction adapter module and its application of the present invention are used in conjunction with a heating body for heat conduction, and include a heat conduction core, the heat conduction core is provided with a heat conduction channel, a heating surface, and a heat conduction heat exchange surface, the heating surface is matched with the heating surface of the heating body, and the shape of the heat conduction heat exchange surface is different from the heating surface of the heating body to heat the equipment to be heated of different shapes; one end of the heat conduction channel is connected to the heating surface, and the other end is connected to the heat conduction heat exchange surface, and the heat conduction fluid flows and is distributed in the heat conduction channel, and is arranged at the position where the heating surface and the heating surface of the heating body are in contact, wherein the heating surface of the heating body and the heat conduction heat exchange surface have different shapes to cooperate with the heating of the objects to be heated of different shapes. A heat conduction adapter module and its application provided by the present invention improves the compatibility of the heating body and reduces the cost of use.

Description

Technical Field

[0001] The invention belongs to the field of chemical, biological and medical heating technology, and in particular relates to a heat conduction transfer module and application thereof. Background Art

[0002] In the fields of chemistry, biology, medicine, etc., heating is a common application or research process. Most heating equipment is designed for specific heating consumables and materials, such as metal baths, PCR instruments, etc. There are also flat heating tables that can be used to heat beakers, conical flasks and other equipment, such as constant temperature heating tables.

[0003] However, these devices can only be used to heat certain consumables. For example, metal baths and PCR instruments can only be used to heat centrifuge tubes, and constant temperature heating tables can only be used to heat beakers and conical flasks. It is difficult to further expand the scope of application of existing equipment.

[0004] In addition, with the development of biotechnology and medical technology, the application of microfluidic chips is becoming more and more extensive. Microfluidic chips are miniaturized reaction devices that integrate basic operation units such as sample preparation, reaction, separation, and detection in biological, chemical, and medical analysis processes onto a micrometer-scale chip to automatically complete the entire analysis process. Miniaturized reaction devices have various shapes, such as planar structure chips, such as circular, fan-shaped, rectangular, square, etc., and special-shaped chips, such as cylindrical, conical, etc. Based on the needs of biological reactions, they need to be warmed and incubated at a certain temperature, and even require variable temperature reactions with rapid temperature changes. In this case, manufacturers can only develop specific variable temperature instruments to match the corresponding chips.

[0005] Therefore, in order to make the existing heating equipment more compatible on the one hand, and to reduce the development costs of microfluidic chip manufacturers on the other hand, if there is a module that can perform temperature conduction and adaptation on existing equipment, the above problems can be solved.

[0006] Therefore, in order to solve the problem of poor compatibility of heating equipment used in the same detection equipment in the prior art and the need for different microfluidic chips to be used in conjunction with various heating equipment, achieving greater heating compatibility of the heating equipment and compatibility of the corresponding microfluidic chips has become a technical problem that needs to be urgently solved by technical personnel in this field. Summary of the invention

[0007] The first object of the present invention is to provide a heat conduction adapter module to solve the compatibility problem of the heating body in the prior art.

[0008] To this end, the above-mentioned purpose of the present invention is achieved through the following technical solutions:

[0009] A heat conduction adapter module is used in conjunction with a heating body for heat conduction, characterized in that: it includes a heat conduction core, the heat conduction core is provided with a heat conduction flow channel, a heating surface, and a heat conduction heat exchange surface, the heating surface is matched with and abutted against the heating surface of the heating body, and the shape of the heat conduction heat exchange surface is different from the heating surface of the heating body so as to heat equipment to be heated of different shapes; one end of the heat conduction flow channel is connected to the heating surface, and the other end is connected to the heat conduction heat exchange surface, the heat conduction fluid flows and is distributed in the heat conduction flow channel, and is arranged at the position where the heating surface and the heating surface of the heating body are in abutment, wherein the heating surface of the heating body and the heat conduction heat exchange surface have different shapes so as to cooperate with the heating of objects to be heated of different shapes.

[0010] While adopting the above technical solutions, the present invention may also adopt or combine the following technical solutions:

[0011] As a preferred technical solution of the present invention: the heating surface of the heating body is in a tubular groove shape, the heating surface is in a tubular shape that matches the heating surface of the heating body, and the heat conduction and heat exchange surface is a plane, and the heat conduction and heat exchange surface is used to heat the flat body to be heated or to place a flat microfluidic chip.

[0012] As a preferred technical solution of the present invention: the heat conduction channel is arranged through the heat conduction core body in a T-shape, so as to allow the heat conduction fluid to flow and conduct heat.

[0013] As a preferred technical solution of the present invention: the heat conduction channel is arranged on the outer wall of the heat conduction core, and provides heat conduction for the heat conduction fluid from bottom to top in the heat conduction core.

[0014] As a preferred technical solution of the present invention: four heat-conducting channels are arranged and evenly distributed on the outer wall of the heat-conducting core, so that the heat-conducting core is in a cross-like shape.

[0015] As a preferred technical solution of the present invention: the heat-conducting core is made of heat-conducting metal or heat-conducting graphene.

[0016] As a preferred technical solution of the present invention: the heat-conducting fluid is selected from silicone paste, silicone grease, and silicone oil.

[0017] A second objective of the present invention is to provide an application of a heat conduction adapter module.

[0018] To this end, the above-mentioned purpose of the present invention is achieved through the following technical solutions: the heat conduction adapter module is applied to a heat conduction adapter device, the heat conduction adapter module is applied to a heat conduction adapter device, the heat conduction adapter device includes a heat conduction adapter plate and a heat conduction adapter module, the heat conduction adapter plate is made of heat-conducting metal or heat-conducting graphene material, and is provided for the distribution of several heat conduction adapter modules.

[0019] While adopting the above technical solutions, the present invention may also adopt or combine the following technical solutions:

[0020] As a preferred technical solution of the present invention: the heat conduction adapter plate is square, round or special-shaped;

[0021] The outer ring of the heat conduction adapter plate is provided with heat insulation material.

[0022] The present invention provides a heat conduction adapter module and its application. In the heat conduction adapter module, the heating surface is matched with the heating surface of the heating body to realize the changeable shape of the heat conduction and heat exchange surface, so as to adapt to heating consumables of different shapes and some customized microfluidic chips for detection, thereby improving the compatibility of the heating body and enabling some consumables that are difficult to heat to be heated and temperature-controlled by ordinary flat or tubular heating bodies like ordinary consumables. The heat transfer fluid is used for heating conversion applications of different bodies to be heated, and the operation is convenient and fast, which greatly saves the use cost and avoids the cost of customizing equipment for consumables of various specifications. It has significant cost advantages and use advantages, and has the value of machine promotion and application. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a schematic diagram of the structure of the heat conduction adapter module embodiment 1 of the present invention;

[0024] Figure 2 It is a side view of the second embodiment of the heat conduction adapter module of the present invention;

[0025] Figure 3 It is a structural schematic diagram of Example 3 of the application of the heat conduction adapter module of the present invention;

[0026] Figure 4 It is a structural schematic diagram of Example 3 of the application of the heat conduction adapter module of the present invention;

[0027] In the attached drawings: heat conduction adapter module 1; heat conduction core 2; heat conduction channel 3; heating surface 4; heat conduction heat exchange surface 5; heat conduction fluid 6; heating body 7; heat conduction adapter plate 8; microfluidic chip 9. DETAILED DESCRIPTION

[0028] The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.

[0029] A heat conduction adapter module 1 is used in conjunction with a heating body for heat conduction, comprising a heat conduction core 2, wherein the heat conduction core 2 is provided with a heat conduction channel 3, a heating surface 4, and a heat conduction heat exchange surface 5, wherein the heating surface 4 is in conjunction with and abuts against a heating surface of the heating body, and the shape of the heat conduction heat exchange surface 5 is different from the heating surface of the heating body so as to heat equipment to be heated of different shapes; one end of the heat conduction channel 3 is connected to the heating surface 4, and the other end is connected to the heat conduction heat exchange surface 5, a heat conduction fluid 6 flows and is distributed in the heat conduction channel 3, and is arranged at a position where the heating surface 4 and the heating surface of the heating body are in abutment, wherein the heating surface of the heating body and the heat conduction heat exchange surface 5 have different shapes so as to cooperate with heating of objects to be heated of different shapes.

[0030] The heating surface of the heating body 7 is in the shape of a tubular groove, the heating surface 4 is in the shape of a tube that matches the heating surface of the heating body, and the heat conduction and heat exchange surface 5 is a plane. The heat conduction and heat exchange surface 5 is used to heat the flat body to be heated or to place a flat-shaped microfluidic chip 9. This structure realizes the heating or reaction of a flat body to be heated or a circular microfluidic chip 9 on the tubular heating body 7.

[0031] The heat conduction channel is arranged through the heat conduction core body in a T-shape, and allows the heat conduction fluid to flow and conduct heat.

[0032] The heat conduction channel is arranged on the outer wall of the heat conduction core, and provides heat conduction for the heat conduction fluid from bottom to top in the heat conduction core.

[0033] The heat-conducting flow channels are arranged in four and are evenly distributed on the outer wall of the heat-conducting core, so that the heat-conducting core is in a cross-like shape.

[0034] The heat-conducting core is made of heat-conducting metal or heat-conducting graphene.

[0035] The heat transfer fluid is selected from silicone paste, silicone grease, and silicone oil.

[0036] The heat conduction adapter module is applied to a heat conduction adapter device. The heat conduction adapter module is applied to a heat conduction adapter device. The heat conduction adapter device includes a heat conduction adapter plate and a heat conduction adapter module. The heat conduction adapter plate is made of heat-conducting metal or heat-conducting graphene material for distributing a plurality of heat conduction adapter modules.

[0037] The heat transfer adapter plate is square, round or special-shaped;

[0038] The outer ring of the heat conduction adapter plate is provided with heat insulation material to reduce heat loss.

[0039] In the present invention, in the heat conduction adapter module, the heating surface 4 cooperates with the heating surface of the heating body, providing a variety of shapes of the heat transfer surface 5 to adapt to heating consumables of different shapes and some customized microfluidic chips for detection, thereby improving the compatibility of the heating body and enabling some consumables that are difficult to heat to be heated and temperature-controlled by ordinary flat or tubular heating bodies like ordinary consumables. The heat conduction adapter module of the present invention utilizes the heat transfer fluid 6 for heating conversion applications of different bodies to be heated, and directly installs the heating surface 4 on the heating surface of the heating body, and utilizes the heat transfer fluid for heat conduction and heat exchange, which is easy to operate and extremely quick, greatly saving the cost of use and avoiding the cost of customizing equipment for consumables of various specifications.

[0040] The application of the heat conduction adapter module in the present invention utilizes a heat conduction adapter plate to distribute a plurality of heat conduction adapter modules, and one or more heat conduction adapter modules can be installed to meet the heating needs of different bodies to be heated, which is convenient for heating the same reactant in different forms to be heated, thereby expanding the use scenarios of the heat conduction adapter module and improving the application scope of the present invention.

[0041] Example 1

[0042] like Figure 1 As shown, a heat conduction adapter module 1 is used in conjunction with a heating body for heat conduction, comprising a heat-conducting core 2, wherein the heat-conducting core 2 is provided with a heat-conducting flow channel 3, a heating surface 4, and a heat-conducting heat exchange surface 5, wherein the heating surface 4 is in conjunction with and abuts against the heating surface of the heating body, and the shape of the heat-conducting heat exchange surface 5 is different from the heating surface of the heating body so as to heat equipment to be heated of different shapes; one end of the heat-conducting flow channel 3 is connected to the heating surface 4, and the other end is connected to the heat-conducting heat exchange surface 5, a heat-conducting fluid 6 flows and is distributed in the heat-conducting flow channel 3, and is arranged at the position where the heating surface 4 and the heating surface of the heating body are in abutment, wherein the heating surface of the heating body and the heat-conducting heat exchange surface 5 have different shapes so as to cooperate with the heating of objects to be heated of different shapes.

[0043] The heat conduction channel 3 is arranged through the heat conduction core body in a T-shape, and allows the heat conduction fluid to flow and conduct heat.

[0044] The heat conduction channel 3 in the present invention is T-shaped in the cross-sectional direction, and is used for the circulation of heat conduction fluid and gas. The heat conduction fluid 6 can be introduced into one side of the T-shaped transverse channel at the upper end, and the other side is used for gas circulation. The heat conduction fluid 6 flows from top to bottom to the part where the heating surface 4 and the heating surface of the heating body are in contact, thereby improving the thermal conductivity.

[0045] Example 2

[0046] like Figure 2As shown, a heat conduction adapter module 1 is used in conjunction with a heating body for heat conduction, comprising a heat-conducting core 2, wherein the heat-conducting core 2 is provided with a heat-conducting flow channel 3, a heating surface 4, and a heat-conducting heat exchange surface 5, wherein the heating surface 4 is in conjunction with and abuts against the heating surface of the heating body, and the shape of the heat-conducting heat exchange surface 5 is different from the heating surface of the heating body so as to heat equipment to be heated of different shapes; one end of the heat-conducting flow channel 3 is connected to the heating surface 4, and the other end is connected to the heat-conducting heat exchange surface 5, a heat-conducting fluid 6 flows and is distributed in the heat-conducting flow channel 3, and is arranged at the position where the heating surface 4 and the heating surface of the heating body are in abutment, wherein the heating surface of the heating body and the heat-conducting heat exchange surface 5 have different shapes so as to cooperate with the heating of objects to be heated of different shapes.

[0047] The heat conduction channel 6 is arranged on the outer wall of the heat conduction core 2, and four heat conduction channels are arranged and evenly distributed on the outer wall of the heat conduction core, so that the heat conduction core is in a cross shape. The heat conduction fluid is provided for heat conduction in the heat conduction core 2 from bottom to top.

[0048] Example 3

[0049] like Figure 3-4 As shown, an application of a heat conduction adapter module of the present invention, the heating surface of the heating body is a tubular groove, the heating surface 4 is a tubular shape matching the heating surface of the heating body, and the heat conduction and heat exchange surface 5 is a plane, and the heat conduction and heat exchange surface 5 is used to heat the flat body to be heated or to place a flat microfluidic chip 9.

[0050] The content of the heat conduction adapter module in this embodiment is the same as that in Embodiment 1 or Embodiment 2, and will not be repeated here.

[0051] The above-mentioned specific implementation methods are used to explain the present invention and are only preferred embodiments of the present invention, rather than limiting the present invention. Any modifications, equivalent substitutions, improvements, etc. made to the present invention within the spirit of the present invention and the protection scope of the claims shall fall within the protection scope of the present invention.

Claims

1. A heat conduction adapter module, used in conjunction with a heating body for heat conduction, characterized in that: The invention comprises a heat-conducting core, which is provided with a heat-conducting flow channel, a heating surface, and a heat-conducting heat exchange surface. The heating surface is fitted against a heating surface of a heating body, and the shape of the heat-conducting heat exchange surface is different from the heating surface of the heating body so as to heat equipment to be heated of different shapes. One end of the heat-conducting flow channel is connected to the heating surface, and the other end is connected to the heat-conducting heat exchange surface. The heat-conducting fluid flows and is distributed in the heat-conducting flow channel, and is arranged at the position where the heating surface and the heating surface of the heating body are in contact, wherein the heating surface of the heating body and the heat-conducting heat exchange surface have different shapes so as to heat objects to be heated of different shapes.

2. A heat transfer module as claimed in claim 1, characterized in that: The heating surface of the heating body is in a tubular groove shape, the heating surface is in a tubular shape matching the heating surface of the heating body, and the heat conduction and heat exchange surface is a plane, which is used to heat the flat body to be heated or to place a flat microfluidic chip.

3. The heat transfer module according to claim 1, characterized in that: The heat conduction channel is arranged through the heat conduction core body in a T-shape, and allows the heat conduction fluid to flow and conduct heat.

4. The heat transfer module according to claim 1, characterized in that: The heat conduction channel is arranged on the outer wall of the heat conduction core, and provides heat conduction for the heat conduction fluid from bottom to top in the heat conduction core.

5. A heat transfer module as claimed in claim 4, characterized in that: The heat-conducting flow channels are arranged in four and are evenly distributed on the outer wall of the heat-conducting core, so that the heat-conducting core is in a cross-like shape.

6. The heat transfer module according to claim 1, characterized in that: The heat-conducting core is made of heat-conducting metal or heat-conducting graphene.

7. The heat transfer module according to claim 1, characterized in that: The heat transfer fluid is selected from silicone grease and silicone oil.

8. The application of a heat transfer module according to any one of claims 1 to 7, characterized in that: The heat conduction adapter module is applied to a heat conduction adapter device, which includes a heat conduction adapter plate and a heat conduction adapter module. The heat conduction adapter plate is made of heat-conducting metal or heat-conducting graphene material for distributing a plurality of heat conduction adapter modules.

9. The application of the heat transfer module according to claim 8, characterized in that: The heat transfer adapter plate is square, round or special-shaped; The outer ring of the heat conduction adapter plate is provided with heat insulation material.

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