A radio frequency chip structure, a manufacturing method thereof, and a radio frequency chip structure system

Abstract

The application discloses a radio frequency chip structure, a manufacturing method thereof, and a radio frequency chip structure system. The radio frequency chip structure comprises a substrate, a radio frequency integrated circuit, and a pin portion. The substrate is provided with at least one pin structure mounting position. The radio frequency integrated circuit is packaged on the substrate and connected with an external circuit through the at least one pin portion. The pin portion is mounted on the pin structure mounting position, and a closed hole and an open hole arranged on a portion of the pin portion away from the substrate are arranged on the pin portion. The technical problem that the radio frequency chip structure is not easy to fix in the prior art is solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of radio frequency chip, in particular to a radio frequency chip structure, a manufacturing method thereof and a radio frequency chip structure system. BACKGROUND

[0002] In the prior art, a chip is a commonly used component, in order to facilitate integration, processing and use, different pins with different functions are generally provided for connecting different circuit parts of the outside to realize normal use of the chip.

[0003] In actual use and the industry, chip pins are generally divided into embedded and external types. The external type is generally provided in the form of a long strip and is bent to ensure that the pin has sufficient contact area with a PCB or other shell for fixing the chip, and finally fixed by soldering. The embedded type is generally provided with a circular hole on the pin, and the pin is installed through the circular hole. The connecting pin is inserted through the circular hole, and the connection between the two is fixed by soldering to make the connection more secure.

[0004] However, the circular hole needs to pass through the pin, which requires an initial alignment and investment. The subsequent soldering process also requires additional investment. In addition, when the amount of soldering is large, the soldering is prone to bulging, resulting in loose connection or virtual connection. SUMMARY

[0005] The present application aims to provide a radio frequency chip structure to solve the problem of loose connection when the radio frequency chip structure is used for soldering in the prior art.

[0006] To achieve the above purpose, the present application provides a radio frequency chip structure, which comprises:

[0007] a substrate provided with at least one pin structure mounting position;

[0008] a radio frequency integrated circuit packaged on the substrate and connected to an external circuit through at least one pin portion;

[0009] a pin portion mounted on the pin structure mounting position, and provided with a closed hole on the pin portion and an open hole on a portion of the pin portion away from the substrate.

[0010] Optionally, the substrate comprises a first packaging edge and a second packaging edge extending in a first direction and arranged opposite to each other, and the number of pin portions is plural, at least one pin portion is arranged on the first packaging edge, and at least one pin portion is arranged on the second packaging edge.

[0011] Optionally, the substrate has a central axis extending along the first direction, the pin portion arranged at the first packaging edge and the pin portion arranged at the second packaging edge are symmetrically arranged based on the central axis.

[0012] Optionally, the substrate includes a third packaging edge and a fourth packaging edge extending along a second direction and oppositely arranged, at least one pin portion is arranged at the third packaging edge, and at least one pin portion is arranged at the fourth packaging edge.

[0013] Optionally, the substrate has a central axis extending along the first direction, the pin portion arranged at the first packaging edge and the pin portion arranged at the second packaging edge are symmetrically arranged based on the central axis.

[0014] Optionally, the closed hole is a circular hole.

[0015] Optionally, the open hole is a semicircular hole.

[0016] Optionally, the diameter of the semicircular hole is equal to the diameter of the circular hole.

[0017] The application further provides a manufacturing method of the radio frequency chip structure, which is used for manufacturing the radio frequency chip structure, and the manufacturing method of the radio frequency chip structure includes:

[0018] Obtaining a chip substrate provided with a pin structure mounting position;

[0019] Fixing and mounting a pin portion at the pin structure mounting position;

[0020] Drilling a closed hole at the middle of the pin portion and the extension part away from the chip substrate, respectively;

[0021] Cutting off half of the closed hole of the extension part of the pin portion to form an open hole.

[0022] The application further provides a radio frequency chip structure system, which includes a PCB substrate and the radio frequency chip structure, and the radio frequency chip structure can be fixed on the PCB substrate by a pin or a soldering patch.

[0023] The present application sets an opening hole on the radio frequency chip, so that when the chip is fixed on the PCB, the chip can be placed in the installation position without the lead passing through the closed hole. The solder flows from the opening hole. Since there is no lead and based on the half space set in the present application, the solder can extend along the inner diameter of the opening hole without air entering and forming bubbles due to the retention of solder caused by the closed hole, thereby reducing the loose welding caused by bubbles. When installing the radio frequency chip, the problem of loose connection of the radio frequency chip structure in the prior art is solved. BRIEF DESCRIPTION OF DRAWINGS

[0024] The present application will be further described below in conjunction with the drawings and examples.

[0025] Figure 1 It is a structural schematic diagram of the radio frequency chip structure in one embodiment.

[0026] Figure 2 It is a flowchart of the control method of the radio frequency chip structure in one embodiment. DETAILED DESCRIPTION

[0027] This part will describe the specific embodiments of the present application in detail. The preferred embodiments of the present application are shown in the drawings, which are used to supplement the description of the text part and make people understand each technical feature and the overall technical scheme of the present application intuitively and visually. However, it cannot be understood as a limitation on the protection scope of the present application.

[0028] In order to solve the problem of loose connection of the radio frequency chip structure in the prior art, the present application proposes a radio frequency chip structure.

[0029] In one embodiment, as shown in Figure 1 A radio frequency chip structure, the radio frequency chip structure includes a substrate 10, a radio frequency integrated circuit, and a pin part 1021. The substrate 10 is provided with at least one pin structure mounting position. The radio frequency integrated circuit is packaged on the substrate 10 and connected with the external circuit through at least one pin part 1021. The pin part 1021 is installed on the pin structure mounting position, and the closed hole 10212 is provided on the pin part 1021, and the opening hole 10211 is provided on the part of the pin part 1021 away from the substrate 10.

[0030] Wherein, by further setting the opening hole 10211 on the radio frequency chip, when the chip is fixed on the PCB board, without the lead passing through the closed hole 10212, the chip is directly placed in the installation position, and the solder flows from the opening hole 10211. Due to the absence of the lead and the half-space based on the present application, the solder can extend along the inner diameter of the opening hole 10211 at this time, and air cannot enter to form a bubble to cause virtual welding due to the stagnation of the solder caused by the closed hole 10212. Therefore, when the radio frequency chip is installed, the welding tightness caused by the bubble can be reduced as much as possible. Therefore, the problem of loose connection of the radio frequency chip structure for welding in the prior art is solved. Moreover, by setting the closed hole 10212 and the opening hole 10211, the radio frequency chip can be arbitrarily selected in multiple installation and fixing modes, and multiple installations of the radio frequency chip are realized. In addition, due to the particularity of the radio frequency chip, the opening hole 10211 is provided outside the closed hole 10212, which can also improve the efficiency of signal transmission.

[0031] In an embodiment, the substrate 10 includes a first packaging edge and a second packaging edge extending in a first direction and oppositely arranged, and the pin portion 1021 is in a plurality. At least one pin portion 1021 can be provided on the first packaging edge, and at least one pin portion 1021 is provided on the second packaging edge.

[0032] Wherein, the pin portion 1021 is provided on both edges, which can fix the freedom in the first direction and the height direction when the radio frequency chip is installed. Therefore, the safety is further ensured. It should be noted that the first direction can be any direction of length, width and height.

[0033] Optionally, the substrate 10 has a central axis extending in the first direction, and the pin portion 1021 provided on the first packaging edge 101 and the pin portion 1021 provided on the second packaging edge 102 are symmetrically arranged based on the central axis.

[0034] Optionally, the substrate 10 includes a third packaging edge and a fourth packaging edge extending in a second direction and oppositely arranged, and at least one pin portion 1021 can be provided on the third packaging edge 103, and at least one pin portion 1021 is provided on the fourth packaging edge 104.

[0035] Wherein, the pin portion 1021 is provided on both the third packaging edge 103 and the fourth packaging edge 104, which can fix the freedom in the first direction and the height direction when the radio frequency chip is installed. Therefore, the safety is further ensured. It should be noted that the first direction is perpendicular to the first direction.

[0036] Optionally, the substrate 10 has a central axis extending along the first direction, and the pin portion 1021 arranged at the first packaging edge 101 and the pin portion 1021 arranged at the second packaging edge 102 are symmetrically arranged based on the central axis.

[0037] Wherein, based on the symmetry of the central axis, in the improved radio frequency chip, the mutual offset of the electrically generated magnetic phenomenon can be realized.

[0038] It should be noted that the first direction and the second direction are perpendicular or intersected. The stress balance and stability of the installed radio frequency chip can be further improved.

[0039] Optionally, the closed hole 10212 is a circular hole. When the closed hole 10212 is a circular hole, the degree of adaptation during welding can be improved.

[0040] Optionally, the open hole 10211 is a semicircular hole. When it is arranged as a semicircular hole, the extended edge that needs to be welded is a curved surface in three dimensions. According to the flow of the liquid, the solder is in the form of a ball, so that the generation of pores during soldering can be better avoided, and a more stable connection relationship can be realized.

[0041] Optionally, the diameter of the semicircular hole is equal to the diameter of the circular hole.

[0042] Wherein, when the diameter of the semicircular hole is equal to the diameter of the circular hole, the related parameters can be better determined, so that the existing production process and auxiliary devices can be used for punching, and the problem of needing to additionally set the specifications of the punching equipment can be avoided.

[0043] Optionally, the open hole 10211 is a recessed hole, and the opening is arranged away from the substrate 10, and the recessed portion is arranged on the substrate 10.

[0044] Through the above scheme, it can be ensured that the radio frequency chip will not increase in size due to the addition of the connecting hole, in addition, a certain welding position can be further reserved for welding, so that the size of the radio frequency chip after welding will not exceed that of the radio frequency chip without the open hole 10211.

[0045] In order to solve the above problems, the present application further provides a manufacturing method of a radio frequency chip structure for manufacturing the radio frequency chip structure as described above, as shown in Figure 2 The manufacturing method of the radio frequency chip structure comprises:

[0046] S1, obtaining a chip substrate 10 provided with a pin structure mounting position;

[0047] The chip substrate 10 has been printed and tested with a radio frequency integrated circuit and the like. The pin structure mounting position is reserved during the manufacturing process of the chip substrate 10.

[0048] S2, fixing and mounting the pin part 1021 to the pin structure mounting position;

[0049] At this time, the pin part 1021 can be fixed and mounted to the pin structure mounting position by metal welding or pressing. Thus, the radio frequency integrated circuit and the pin part 1021 have an electrical connection relationship, and can communicate with external circuits through the pin part 1021.

[0050] S3, punching a closed hole 10212 in the middle of the pin part 1021 and the extension part away from the chip substrate 10;

[0051] The specific shape of the closed hole 10212 is set according to user needs.

[0052] It should be noted that the sizes of the two closed holes 10212 can be equal or not equal. When they are equal, this step can be set to punch holes in sequence. After punching one hole, the chip substrate 10 or the punching device can be shifted to punch the other hole. In this way, the existing radio frequency chip production equipment can be improved as small as possible, and the industrialization cost of this scheme is reduced.

[0053] S4, cutting off half of the closed hole 10212 of the extension part of the pin part 1021 to form an open hole 10211.

[0054] By setting the open hole 10211 on the radio frequency chip, when the chip is fixed to the PCB, the solder can flow from the open hole 10211 without the need for a pin to pass through the closed hole 10212. Since there is no pin and the half space set according to the present application, the solder will not be virtual soldered due to the control of the residence. Thus, when installing the radio frequency chip, the tightness of the soldering caused by the bubbles can be reduced as much as possible. Thus, the problem of loose connection of the radio frequency chip structure for soldering in the prior art is solved.

[0055] Further, the closed hole 10212 is a circular hole, and the open hole 10211 is a semicircular hole. The diameter of the semicircular hole is equal to the diameter of the circular hole.

[0056] When the diameter of the semicircular hole is equal to the diameter of the circular hole, the related parameters can be determined better, so that the punching can be performed on the basis of the existing production process and auxiliary devices, avoiding the need to set the specifications of the punching device.

[0057] In order to solve the above problems, the application further provides a radio frequency chip structure system, which comprises a PCB substrate 10 and the radio frequency chip structure as described above; the radio frequency chip structure can be fixed on the PCB substrate 10 through a lead or a soldering patch.

[0058] It should be noted that, since the radio frequency chip structure system of the application adopts the scheme of the radio frequency chip structure, the radio frequency chip structure system of the application has all the embodiments and beneficial effects of the radio frequency chip structure, which will not be described herein.

[0059] The technical features of the above embodiments can be combined in any manner. In order to make the description concise, all possible combinations of the technical features in the above embodiments are not described, however, as long as the combinations of the technical features do not exist contradictions, they should be considered as the scope of the present application.

Claims

1. A radio frequency chip structure, characterized in that, The radio frequency chip structure includes: The substrate has at least one pin structure mounting position; A radio frequency integrated circuit is packaged on the substrate and connected to an external circuit through at least one pin. The pin portion is mounted on the pin structure mounting position, and the pin portion is provided with a closed hole and an opening hole provided on the pin portion away from the substrate; The closed hole is a circular hole, and the open hole is a semi-circular hole, the diameter of the semi-circular hole being equal to the diameter of the circular hole; The substrate includes a first encapsulation edge and a second encapsulation edge extending in a first direction and disposed opposite to each other. The number of pin portions is multiple, at least one of the pin portions may be disposed on the first encapsulation edge, and at least one of the pin portions may be disposed on the second encapsulation edge. The substrate has a central axis extending along the first direction, and the pin portion provided on the first package side and the pin portion provided on the second package side are symmetrically arranged based on the central axis.

2. The radio frequency chip structure as described in claim 1, characterized in that, The substrate includes a third packaging edge and a fourth packaging edge extending in a second direction and disposed opposite to each other, at least one of the pin portions may be disposed on the third packaging edge, and at least one of the pin portions may be disposed on the fourth packaging edge.

3. A method for fabricating a radio frequency chip structure, characterized in that, A method for fabricating the radio frequency chip structure as described in any one of claims 1-2, comprising: Obtain a chip substrate with pin structure mounting positions; The pin portion is fixedly mounted to the pin structure mounting position; A closed hole is punched in the middle of the pin portion and in the extension portion away from the chip substrate; The closed hole of the extension of the pin portion is cut off in half to form an open hole.

4. A radio frequency chip structure system, characterized in that, The radio frequency chip structure system includes a PCB substrate and a radio frequency chip structure as described in any one of claims 1-2; the radio frequency chip structure is fixed to the PCB substrate by pins or solder pads.

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