Method for producing resin pattern, method for producing circuit wiring, method for producing touch panel, and photosensitive transfer member

Abstract

The present invention provides a method for manufacturing a resin pattern, a method for manufacturing circuit wiring, a method for manufacturing a touch panel, and a photosensitive transfer component. The method for manufacturing a resin pattern uses a photosensitive transfer component having a temporary support and a photosensitive resin layer to form a resin pattern on a substrate, wherein the pattern width of the resin pattern at a portion in contact with the substrate is greater than or equal to 0.2 μm than the pattern width at a position where the resin pattern is 90% of its maximum height. The photosensitive transfer component has a temporary support and a photosensitive resin layer. When a resin pattern A having a pattern width of 6 μm at a position where the resin pattern is 90% of its maximum height is formed on a substrate, in a cross section of the resin pattern A in the width direction, the pattern width of the resin pattern A at a portion in contact with the substrate is greater than or equal to 6.2 μm.

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a resin pattern, a method for manufacturing a circuit wiring, a method for manufacturing a touch panel, and a photosensitive transfer member. Background Art

[0002] In a display device (such as an organic electroluminescent (EL) display device and a liquid crystal display device) having a touch panel, such as an electrostatic capacitive input device, a conductive layer pattern including an electrode pattern of a sensor corresponding to a visual recognition portion, a peripheral wiring portion, and wiring of a lead-out wiring portion is arranged inside the touch panel.

[0003] Generally, when forming a patterned layer, a method of exposing a layer of a photosensitive resin composition provided on an arbitrary substrate using a photosensitive transfer member through a mask having a desired pattern and then developing the layer is widely used because the number of steps required to obtain a desired pattern shape is small.

[0004] Furthermore, as conventional photosensitive resin compositions, those described in Japanese Patent Application Laid-Open No. 2014-209173 or Japanese Patent Application Laid-Open No. 2011-209426 are known.

[0005] Japanese Patent Application Laid-Open No. 2014-209173 describes a photosensitive resin composition comprising (A) an acid-modified photosensitive epoxy resin and (B) a non-photosensitive carboxylic acid resin having a styrene skeleton and a weight average molecular weight of 10,000 to 50,000.

[0006] Japanese Patent Application Laid-Open No. 2011-209426 describes a photosensitive resin composition characterized by containing an alkali-soluble resin, a compound having a quinonediazide structure, and a nitrogen-containing heterocyclic compound having at least one structure selected from the group consisting of a pyrrole structure, an isoxazole structure, a thiazole structure, an isothiazole structure, a pyridine structure, an indole structure, a quinoline structure, and an isoquinoline structure. Summary of the Invention

[0007] Technical issues to be solved by the invention

[0008] An object of one embodiment of the present invention is to provide a method for producing a resin pattern having excellent resolution.

[0009] Furthermore, another embodiment of the present invention aims to provide a method for manufacturing a circuit wiring having excellent resolution and a method for manufacturing a touch panel.

[0010] Furthermore, another embodiment of the present invention aims to provide a photosensitive transfer member having excellent resolution.

[0011] Means for solving technical problems

[0012] Means for solving the above-mentioned problems include the following.

[0013] <1> A method for manufacturing a resin pattern, comprising forming a resin pattern on a substrate using a photosensitive transfer member having a temporary support and a photosensitive resin layer, wherein the pattern width of the resin pattern at a portion in contact with the substrate is greater than the pattern width at a position that is 90% of the maximum height of the resin pattern from the substrate by at least 0.2 μm.

[0014] <2> The method for producing a resin pattern according to <1>, wherein the photosensitive resin layer has a thickness of 8 μm or less.

[0015] <3> The method for producing a resin pattern according to <1> or <2>, wherein the temporary support has a thickness of 25 μm or less.

[0016] <4> The method for manufacturing a resin pattern according to any one of <1> to <3>, wherein the value obtained by subtracting the pattern width at a position where 90% of the maximum height of the resin pattern from the pattern width of the portion of the resin pattern in contact with the substrate is greater than or equal to 0.2 μm and less than or equal to 2.4 μm.

[0017] <5> The method for producing a resin pattern according to any one of <1> to <4>, wherein the photosensitive resin layer contains a polymerizable compound and a binder polymer.

[0018] <6> The method for producing a resin pattern according to <5>, wherein a ratio Mm / Mb of a content Mm of the polymerizable compound to a content Mb of the binder polymer in the photosensitive resin layer is 0.9 or less.

[0019] <7> The method for manufacturing a resin pattern according to <5> or <6>, wherein the polymerizable compound in the photosensitive resin layer includes a (meth)acrylic compound, and the content of the acrylic compound is 60% by mass or less relative to the total mass of the (meth)acrylic compound contained in the photosensitive resin layer.

[0020] <8> The method for manufacturing a resin pattern according to any one of <1> to <7>, wherein the resin pattern to be manufactured includes a resin pattern having a pattern width of 6 μm or less.

[0021] <9> A method for manufacturing circuit wiring, comprising the following steps: in a laminate having the above-mentioned resin pattern on the above-mentioned substrate manufactured by the method for manufacturing a resin pattern described in any one of <1> to <8>, the above-mentioned substrate has a conductive layer on the surface of the side on which the above-mentioned resin pattern is formed, and the above-mentioned conductive layer located in an area where the above-mentioned resin pattern is not arranged is etched to form circuit wiring.

[0022] <10> A method for manufacturing a touch panel, comprising the following steps: in a laminate having the resin pattern on the substrate manufactured by the method for manufacturing a resin pattern described in any one of <1> to <8>, the substrate has a conductive layer on the surface on the side where the resin pattern is formed, and the conductive layer located in an area where the resin pattern is not arranged is etched to form wiring for the touch panel.

[0023] <11> A photosensitive transfer component comprising a temporary support and a photosensitive resin layer, wherein, when a resin pattern A having a pattern width of 6 μm at a position 90% of the maximum height of the substrate is formed on a substrate by the photosensitive transfer component, the pattern width of the resin pattern A at a portion in contact with the substrate in a cross section in the width direction of the resin pattern A is greater than 6.2 μm.

[0024] Effects of the Invention

[0025] According to one embodiment of the present invention, a method for producing a resin pattern having excellent resolution can be provided.

[0026] Furthermore, according to another embodiment of the present invention, a method for manufacturing a circuit wiring having excellent resolution and a method for manufacturing a touch panel can be provided.

[0027] Furthermore, according to another embodiment of the present invention, a photosensitive transfer member having excellent resolution can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a schematic cross-sectional view in the width direction of a resin pattern formed in the method for producing a resin pattern according to the present invention.

[0029] Figure 2 This is a schematic diagram showing an example of the layer structure of the photosensitive transfer member used in the present invention.

[0030] Figure 3 This is a schematic diagram showing pattern A.

[0031] Figure 4 This is a schematic diagram showing pattern B. DETAILED DESCRIPTION

[0032] Hereinafter, the content of the present invention will be described. In addition, the description will be made with reference to the drawings, but reference numerals may be omitted in some cases.

[0033] Furthermore, in this specification, a numerical range expressed using “to” indicates a range including the numerical values described before and after “to” as the lower limit and the upper limit.

[0034] Furthermore, in this specification, “(meth)acrylic acid” means both or either acrylic acid and methacrylic acid, and “(meth)acrylate” means both or either acrylate and methacrylate.

[0035] Furthermore, in this specification, when a plurality of substances corresponding to each component are present in a composition, the amount of each component in the composition represents the total amount of the corresponding plurality of substances present in the composition unless otherwise specified.

[0036] In this specification, the term "process" includes not only independent processes but also processes that cannot be clearly distinguished from other processes as long as the intended purpose of the process can be achieved.

[0037] In the description of groups (atomic groups) in this specification, the description without description of substitution or unsubstituted includes both groups without substitution and groups with substitution. For example, "alkyl" includes not only alkyl groups without substitution (unsubstituted alkyl groups) but also alkyl groups with substitution (substituted alkyl groups).

[0038] In this specification, unless otherwise specified, "exposure" includes not only exposure using light but also drawing using particle beams such as electron beams and ion beams. Examples of light commonly used for exposure include the bright line spectrum of a mercury lamp, far ultraviolet light typified by excimer lasers, extreme ultraviolet light (EUV light), X-rays, and active energy rays such as electron beams.

[0039] Furthermore, the chemical structural formulas in this specification may be described as simplified structural formulas in which hydrogen atoms are omitted.

[0040] In the present invention, "mass %" and "weight %" have the same meaning, and "parts by mass" and "parts by weight" have the same meaning.

[0041] Furthermore, in the present invention, a combination of two or more preferred aspects becomes a more preferred aspect.

[0042] Unless otherwise specified, the weight average molecular weight (Mw) and number average molecular weight (Mn) in the present invention are molecular weights calculated using THF (tetrahydrofuran) as a solvent, a differential refractometer, and polystyrene as a standard substance in a gel permeation chromatography (GPC) analyzer using TSKgel GMHxL, TSKgel G4000HxL, or TSKgel G2000HxL (all trade names, manufactured by TOSOH CORPORATION) columns.

[0043] [Method for producing resin pattern]

[0044] The method for manufacturing a resin pattern involved in the present invention is a method for manufacturing a resin pattern by forming a resin pattern on a substrate using a photosensitive transfer component having a temporary support body and a photosensitive resin layer, wherein, in a cross-section in the width direction of the above-mentioned resin pattern, the pattern width of the above-mentioned resin pattern in the portion in contact with the above-mentioned substrate is greater than the pattern width of the above-mentioned resin pattern at a position that is 90% of the maximum height of the above-mentioned substrate by more than 0.2 μm.

[0045] In order to increase the fineness of the photosensitive resin composition, studies are underway to reduce the film thickness.

[0046] In the case of a thin film resist, if development, etching, and other processes are performed under the same conditions as conventional thick film resists, excessive development and etching may prevent the preferred morphology (undercut, peeling, uneven shape, etc.) from being obtained.

[0047] In particular, excessive etching may cause problems such as etching deep into the lower portion of the resist (so-called side etching) or damaging the resist layer itself, causing wiring to disappear, making it difficult to miniaturize the resin pattern.

[0048] On the other hand, in general, in order to achieve linearity and uniformity of the linear shape during etching, the resist is required to have a rectangular shape, and further, the etching time is prolonged to obtain good linearity.

[0049] However, when the resist is thinned as described above, it is difficult to perform processing with a long etching time.

[0050] The present inventors have discovered that the resolution is insufficient in conventional methods for producing a resin pattern having a cross-sectional shape of the pattern.

[0051] As a result of intensive research conducted by the present inventors, it was found that a method for manufacturing a resin pattern using the above-mentioned structure can have excellent resolution.

[0052] The detailed mechanism of the above-mentioned effect is not yet clear, but it is speculated that: in the cross-section of the above-mentioned resin pattern in the width direction, by making the pattern width of the above-mentioned resin pattern in contact with the above-mentioned substrate larger than the pattern width at a position 90% of the maximum height of the above-mentioned resin pattern from the above-mentioned substrate by more than 0.2 μm, when etching using the above-mentioned resin pattern is performed, since the width of the above-mentioned resin pattern in contact with the above-mentioned substrate is larger, the progress of side etching can be slowed down, and even for an etching pattern with a smaller width, the occurrence of etching defects such as pattern refinement and line breakage can be suppressed, and the resolution of the obtained etching pattern (also referred to as "resolution") is excellent.

[0053] Furthermore, in general, in order to prevent etching defects, the resist is required to have a rectangular shape without residue or curling.

[0054] On the other hand, in the method for producing a resin pattern according to the present invention, the resist shape after development is intentionally designed to have a curled shape to slow down the etching rate and thereby prevent over-etching.

[0055] That is, the method for producing a resin pattern according to the present invention is an invention having a technical concept opposite to the design of a conventional negative resist.

[0056] The method for producing a resin pattern according to the present invention is a method for producing a resin pattern, wherein a resin pattern is formed on a substrate using a photosensitive transfer member having a temporary support and a photosensitive resin layer.

[0057] Preferred embodiments of the photosensitive transfer member used in the present invention will be described later.

[0058] The photosensitive transfer member used in the method for producing a resin pattern according to the present invention is preferably a negative-type photosensitive transfer member.

[0059] Furthermore, the resin pattern produced by the method for producing a resin pattern according to the present invention can be preferably used as a resist.

[0060] In the method for manufacturing a resin pattern according to the present invention, the width of the resin pattern at the portion contacting the substrate in a cross-section of the resin pattern in the width direction is at least 0.2 μm greater than the width of the resin pattern at a position 90% of the maximum height of the resin pattern from the substrate. A width greater than 0.2 μm can slow down the progress of etching at the edge, resulting in excellent resolution.

[0061] Furthermore, in the method for manufacturing a resin pattern involved in the present invention, from the viewpoint of resolution and linearity, in the cross-section in the width direction of the above-mentioned resin pattern, the value obtained by subtracting the pattern width at a position where 90% of the maximum height of the above-mentioned resin pattern from the pattern width of the above-mentioned resin pattern in the portion in contact with the substrate (the value of the pattern width of the above-mentioned resin pattern in contact with the substrate - the pattern width at a position where 90% of the maximum height of the above-mentioned resin pattern) is preferably greater than 0.2 μm and less than 3.0 μm, more preferably greater than 0.2 μm and less than 2.4 μm, further preferably greater than 0.3 μm and less than 2.0 μm, and particularly preferably greater than 0.4 μm and less than 2.0 μm.

[0062] In the present invention, the pattern width of the resin pattern at a position 90% of the maximum height of the substrate in a cross-section along the width direction of the resin pattern and the pattern width of the resin pattern in the portion contacting the substrate are measured by cutting the substrate having the resin pattern along the width direction of the resin pattern, observing the cut resin pattern and the substrate from the cut surface using a scanning electron microscope, and measuring the pattern widths. The pattern width at a position 90% of the maximum height of the resin pattern and the pattern width in the portion contacting the substrate are averaged from 10 measurements.

[0063] In the present invention, the "cross section of the resin pattern in the width direction" refers to a cross section on a plane parallel to the width direction and thickness direction of the substrate, for example, a cross section on a plane perpendicular to the line direction of the resin pattern consisting of lines and spaces.

[0064] Furthermore, in the present invention, "the position of X% of the maximum height of the above-mentioned resin pattern in the cross section in the width direction of the above-mentioned resin pattern" means the position of the height of X% of the maximum height of the above-mentioned resin pattern from the above-mentioned substrate in the cross section in the width direction of the above-mentioned resin pattern.

[0065] Furthermore, in the present invention, it is preferred that the resin pattern have a higher hardness than the uncured photosensitive resin layer.

[0066] Figure 1 It is a schematic cross-sectional view in the width direction of a resin pattern formed in the method for producing a resin pattern according to the present invention.

[0067] Figure 1 The resin pattern 4 on the substrate 2 shown has curling portions 4a on both sides of the resin pattern 4 near the portion in contact with the substrate 2. Figure 1In the figure, the height of the resin pattern 4 at 90% of the maximum height from the substrate 2 is H90, the pattern width at 90% of the maximum height of the resin pattern 4 is L1, and the pattern width of the resin pattern 4 in contact with the substrate 2 is L2.

[0068] Furthermore, in the method for manufacturing a resin pattern involved in the present invention, when a resin pattern A having a pattern width of 6 μm at a position 90% of the maximum height of the above-mentioned substrate is formed on a substrate, from the viewpoints of resolution and linearity, in the cross-section in the width direction of the above-mentioned resin pattern A, the pattern width of the above-mentioned resin pattern A in the portion in contact with the above-mentioned substrate is preferably 6.2 μm or more, more preferably 6.2 μm or more and 9.0 μm or less, further preferably 6.2 μm or more and 8.4 μm or less, particularly preferably 6.3 μm or more and 8.0 μm or less, and most preferably 6.4 μm or more and 8.0 μm or less.

[0069] In the method for manufacturing a resin pattern involved in the present invention, all of the above-mentioned resin patterns may not be resin patterns in which the pattern width of the portion in contact with the above-mentioned substrate in the cross section in the width direction of the above-mentioned resin pattern is greater than the pattern width at a position 90% of the maximum height of the above-mentioned substrate by more than 0.2 μm. The proportion of resin patterns in which the pattern width of the portion in contact with the above-mentioned substrate in the cross section in the width direction of the above-mentioned resin pattern, observed from a direction perpendicular to the surface direction of the above-mentioned substrate, is greater than the pattern width at a position 90% of the maximum height of the above-mentioned resin pattern by more than 0.2 μm is preferably greater than 50 area%, more preferably greater than 80 area%, and particularly preferably greater than 90 area%.

[0070] Furthermore, in the method for manufacturing a resin pattern involved in the present invention, from the viewpoint of resolution and linearity, in the cross-section of the above-mentioned resin pattern in the width direction, the value of the pattern width at a position of 90% of the maximum height of the above-mentioned resin pattern - the pattern width at a position of 50% of the maximum height of the above-mentioned resin pattern is preferably greater than -0.5 μm and less than 1.0 μm, more preferably greater than -0.2 μm and less than 0.5 μm, further preferably greater than -0.2 μm and less than 0.2 μm, and particularly preferably greater than -0.1 μm and less than 0.1 μm.

[0071] From the viewpoints of resolution and linearity, the resin pattern manufactured by the resin pattern manufacturing method involved in the present invention is more preferably a resin pattern in which the pattern width in the cross section in the width direction of the above-mentioned resin pattern gradually increases from a position of 5% to 40% of the maximum height of the above-mentioned resin pattern toward the above-mentioned substrate, more preferably a resin pattern in which the pattern width gradually increases from a position of 10% to 30% of the maximum height of the above-mentioned resin pattern toward the above-mentioned substrate, and particularly preferably a resin pattern in which the pattern width gradually increases from a position of 15% to 25% of the maximum height of the above-mentioned resin pattern toward the above-mentioned substrate.

[0072] Furthermore, in the method for manufacturing a resin pattern involved in the present invention, from the viewpoint of resolution and linearity, in the cross-section of the above-mentioned resin pattern in the width direction, the value of the pattern width of the above-mentioned resin pattern at a position 90% of the maximum height of the above-mentioned substrate - the pattern width of the above-mentioned resin pattern at a position 5% of the maximum height of the above-mentioned substrate is preferably greater than 0.1 μm and less than 2.5 μm, more preferably greater than 0.1 μm and less than 2.0 μm, further preferably greater than 0.15 μm and less than 1.8 μm, and particularly preferably greater than 0.2 μm and less than 1.5 μm.

[0073] From the perspective of further exerting the effects of the present invention, the resin pattern manufactured by the resin pattern manufacturing method involved in the present invention preferably includes a resin pattern with a pattern width of less than 10 μm, more preferably includes a resin pattern with a pattern width of less than 8 μm, further preferably includes a resin pattern with a pattern width of less than 6 μm, and especially preferably includes a resin pattern with a pattern width of more than 1 μm and less than 6 μm.

[0074] Furthermore, from the viewpoint of further exerting the effects of the present invention, the resin pattern produced by the method for producing a resin pattern according to the present invention preferably has a line and space pattern.

[0075] Furthermore, from the perspective of further exerting the effects of the present invention, the resin pattern manufactured by the resin pattern manufacturing method involved in the present invention is preferably a resist pattern for wiring formation, more preferably a resist pattern for circuit wiring, and especially preferably a resist pattern for circuit wiring including wiring with a width of less than 6 μm.

[0076] The maximum height of the resin pattern manufactured by the method for manufacturing a resin pattern involved in the present invention is also related to the thickness of the photosensitive resin layer described later. From the viewpoint of further exerting the effect of the present invention, it is preferably 20 μm or less, more preferably 10 μm or less, further preferably 8 μm or less, and particularly preferably 2 μm or more and 8 μm or less.

[0077] Furthermore, the resin pattern manufactured by the method for manufacturing a resin pattern according to the present invention preferably includes a resin pattern in which the value of the pattern width at 90% of the maximum height of the resin pattern from the substrate / the maximum height of the resin pattern falls within the following numerical range.

[0078] From the viewpoint of further exerting the effect of the present invention, the value of the pattern width of the above-mentioned resin pattern at a position 90% of the maximum height of the above-mentioned substrate / the maximum height of the above-mentioned resin pattern is preferably less than 2, more preferably less than 1.5, further preferably less than 1, and especially preferably greater than 0.5 and less than 0.8.

[0079] The method for producing a resin pattern according to the present invention is a method for producing a resin pattern, wherein a resin pattern is formed on a substrate using a photosensitive transfer member having a temporary support and a photosensitive resin layer.

[0080] As a method for manufacturing a resin pattern, it is preferred that the method sequentially includes a process of laminating a photosensitive transfer component and a substrate in a manner such that a substrate (preferably a conductive substrate) is in contact with the second surface (i.e., the surface on the side not opposite to the temporary support body) of the photosensitive resin layer (hereinafter also referred to as a "laminating process"), a process of exposing the photosensitive resin layer to a pattern (hereinafter also referred to as an "exposure process"), and a process of developing the exposed photosensitive resin layer to form a resin pattern (hereinafter also referred to as a "development process").

[0081] <Lamination process>

[0082] The method for producing a resin pattern preferably includes a lamination step.

[0083] During the lamination process, the substrate (or, if a conductive layer is provided on the substrate surface, the conductive layer) is preferably brought into contact with the second surface of the photosensitive resin layer, thereby press-bonding the photosensitive transfer member and the substrate. This configuration improves the adhesion between the second surface of the photosensitive resin layer and the substrate, making it suitable for use as a resist when etching the conductive layer of the photosensitive resin layer having a pattern formed thereon after exposure and development.

[0084] In addition, when the photosensitive transfer member includes a cover film, the cover film may be removed from the surface of the photosensitive resin layer before lamination.

[0085] Furthermore, when the photosensitive transfer component further includes a layer other than the covering film (for example, a high refractive index layer and / or a low refractive index layer) on the surface of the photosensitive resin layer on the side not facing the temporary support body, the bonding process is a method of bonding the surface of the photosensitive resin layer on the side not having the temporary support body and the substrate via the layer.

[0086] There are no particular limitations on the method for pressure-bonding the substrate and the photosensitive transfer member, and a known transfer method and lamination method can be used.

[0087] The photosensitive transfer member is preferably laminated to the substrate by stacking the substrate on the second surface side of the photosensitive resin layer and applying pressure and heat using a mechanism such as a roller. A known laminator such as a laminator, a vacuum laminator, or an automatic cutting laminator that can further improve productivity can be used for lamination.

[0088] The method for producing a resin pattern and a method for producing a circuit wiring including the lamination step are preferably performed by a roll-to-roll method.

[0089] The roll-to-roll method is described below.

[0090] The roll-to-roll method refers to the following method: a substrate that can be wound and unwound is used as a substrate, including a process of unwinding the substrate or a structure including the substrate before any process included in the resin pattern manufacturing method or the circuit wiring manufacturing method (also referred to as an "unwinding process") and a process of winding the substrate or the structure including the substrate after any process (also referred to as a "winding process"), and at least any one process (preferably all processes or all processes other than the heating process) is performed while conveying the substrate or the structure including the substrate.

[0091] The unwinding method in the unwinding step and the winding method in the winding step are not particularly limited, and a known method can be used in a production method to which a roll-to-roll system is applied.

[0092] <Substrate>

[0093] As the substrate used in the method for producing a resin pattern according to the present invention, a known substrate can be used, but a substrate having a conductive layer is preferred, and a substrate having a conductive layer on its surface is more preferred.

[0094] The substrate may have any layer other than the conductive layer as needed.

[0095] Examples of the base material constituting the substrate include glass, silicon, and thin films.

[0096] The base material constituting the substrate is preferably transparent. In this specification, "transparent" means that the transmittance of light with a wavelength of 400 nm to 700 nm is 80% or more.

[0097] Furthermore, the refractive index of the base material constituting the substrate is preferably 1.50 to 1.52.

[0098] Examples of the transparent glass substrate include tempered glass such as Gorilla Glass from Corning Incorporated. Furthermore, materials used in Japanese Patent Application Laid-Open Nos. 2010-86684, 2010-152809, and 2010-257492 can be used as the transparent glass substrate.

[0099] When a film substrate is used as the substrate, it is preferred to use a film substrate with low optical distortion and / or high transparency. Examples of such film substrates include polyethylene terephthalate (PET), polyethylene naphthalate, polycarbonate, triacetyl cellulose, and cycloolefin polymer.

[0100] When manufacturing by a roll-to-roll method, the substrate is preferably a film substrate. Furthermore, when manufacturing the circuit wiring for a touch panel by a roll-to-roll method, the substrate is preferably a sheet-like resin composition.

[0101] Examples of the conductive layer included in the substrate include conductive layers used for general circuit wiring and touch panel wiring.

[0102] From the viewpoint of conductivity and thin line formation, the conductive layer is preferably at least one layer selected from a metal layer, a conductive metal oxide layer, a graphene layer, a carbon nanotube layer, and a conductive polymer layer, more preferably a metal layer, and still more preferably a copper layer or a silver layer.

[0103] The substrate may have a single conductive layer or may have two or more conductive layers. In the case of having two or more conductive layers, the conductive layers are preferably made of different materials.

[0104] Examples of the material for the conductive layer include metals and conductive metal oxides.

[0105] Examples of the metal include Al, Zn, Cu, Fe, Ni, Cr, Mo, Ag, and Au.

[0106] Examples of the conductive metal oxide include ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), and SiO 2 .

[0107] In this specification, “conductive” means a volume resistivity of less than 1×10 6 Ωcm. The volume resistivity of the conductive metal oxide is preferably less than 1×10 4 Ωcm.

[0108] When a resin pattern is produced using a substrate having a plurality of conductive layers, at least one of the plurality of conductive layers preferably contains a conductive metal oxide.

[0109] As the conductive layer, an electrode pattern of a sensor corresponding to a visual recognition portion used in a capacitive touch panel or wiring of a peripheral lead portion is preferable.

[0110] Exposure process

[0111] The method for producing a resin pattern preferably includes, after the laminating step, a step of pattern-exposing the photosensitive resin layer (exposure step).

[0112] The detailed arrangement and specific dimensions of the pattern during pattern exposure are not particularly limited. In order to improve the display quality of a display device (e.g., a touch panel) having an input device including circuit wiring manufactured using the circuit wiring manufacturing method and to reduce the area occupied by lead wiring, at least a portion of the pattern (preferably the electrode pattern and / or lead wiring portion of the touch panel) preferably includes fine lines with a width of 20 μm or less, and more preferably includes fine lines with a width of 10 μm or less.

[0113] The light source used for exposure can be appropriately selected as long as it irradiates light of a wavelength capable of exposing the photosensitive resin layer (for example, 365 nm or 405 nm). Specific examples include ultrahigh-pressure mercury lamps, high-pressure mercury lamps, metal halide lamps, and LEDs (light emitting diodes).

[0114] As exposure dose, 5 mJ / cm 2 ~200mJ / cm 2 , more preferably 10 mJ / cm 2 ~100mJ / cm 2 .

[0115] During the exposure process, pattern exposure can be performed after peeling the temporary support from the photosensitive resin layer, or after peeling the temporary support. To prevent contamination of the photosensitive resin layer due to contact between the photosensitive resin layer and the mask and to avoid the influence of foreign matter attached to the mask on the exposure, pattern exposure is preferably performed through a temporary support. Pattern exposure can be performed through a mask or directly using an exposure method such as a laser.

[0116] <Development Process>

[0117] The method for producing a resin pattern preferably includes, after the exposure step, a step of developing the exposed photosensitive resin layer to form a resin pattern (development step).

[0118] When the photosensitive transfer member comprises a thermoplastic resin and an intermediate layer, the thermoplastic resin layer and intermediate layer in the non-exposed areas are removed along with the photosensitive resin layer in the non-exposed areas during the development step. Furthermore, the thermoplastic resin layer and intermediate layer in the exposed areas can be removed during the development step by being dissolved or dispersed in the developer.

[0119] The development of the exposed photosensitive resin layer in the development step can be performed using a developer.

[0120] The developer is not particularly limited as long as it can remove the non-image area (non-exposed area) of the photosensitive resin layer. For example, a known developer such as the developer described in Japanese Patent Application Laid-Open No. 5-72724 can be used.

[0121] The developer is preferably an alkaline aqueous solution containing a compound with a pKa of 7 to 13 at a concentration of 0.05 to 5 mol / L (liter). The developer may also contain a water-soluble organic solvent and / or a surfactant. The developer described in paragraph 0194 of International Publication No. 2015 / 093271 is also preferred.

[0122] The developing method is not particularly limited and may be any of spin immersion developing, shower developing, shower and spin developing, and immersion developing. Spray developing is a developing process in which a developer is sprayed onto the exposed photosensitive resin layer in a shower to remove unexposed areas.

[0123] After the development step, it is preferable to remove development residues while spraying a cleaning agent with a shower and wiping with a brush.

[0124] The liquid temperature of the developer is not particularly limited, but is preferably 20°C to 40°C.

[0125] <Cover film peeling process>

[0126] When the photosensitive transfer member includes a cover film, the method for producing the resin pattern preferably includes a step of peeling the cover film from the photosensitive transfer member. The method for peeling the cover film is not limited, and a known method can be applied.

[0127] <Other Process>

[0128] The method for producing a resin pattern may include any steps (other steps) other than the above steps. For example, the following steps may be mentioned, but the method is not limited to these steps.

[0129] Hereinafter, the photosensitive transfer member used in the present invention will be described in detail.

[0130] <Photosensitive transfer member>

[0131] The photosensitive transfer member used in the present invention includes at least a temporary support and a photosensitive resin layer.

[0132] The photosensitive transfer member may be formed by directly laminating the temporary support and the photosensitive resin layer without intervening other layers, or by laminating the temporary support and the photosensitive resin layer with intervening other layers. Furthermore, other layers may be laminated on the surface of the photosensitive resin layer opposite to the surface facing the temporary support.

[0133] Examples of other layers other than the temporary support and the photosensitive resin layer include a thermoplastic resin layer, an intermediate layer, and a cover film.

[0134] Temporary support

[0135] The photosensitive transfer member used in the present invention includes a temporary support.

[0136] The temporary support is a peelable support that supports the photosensitive resin layer or the laminated body including the photosensitive resin layer.

[0137] The temporary support preferably has light transmittance in order to enable exposure of the photosensitive resin layer through the temporary support during pattern exposure of the photosensitive resin layer. In this specification, “light transmittance” means that the transmittance of light of the wavelength used for pattern exposure is 50% or more.

[0138] From the viewpoint of improving the exposure sensitivity of the photosensitive resin layer, the transmittance of the temporary support to light of a wavelength (more preferably a wavelength of 365 nm) used for pattern exposure is preferably 60% or more, more preferably 70% or more.

[0139] The transmittance of a layer included in a photosensitive transfer member is the ratio of the intensity of light emitted after passing through the layer to the intensity of the incident light when light is incident in a direction perpendicular to the main surface of the layer (thickness direction), and is measured using an MCPD Series manufactured by Otsuka Electronics Co., Ltd.

[0140] Examples of the material constituting the temporary support include a glass substrate, a resin film, and paper. From the viewpoint of strength, flexibility, and light transmittance, a resin film is preferred.

[0141] Examples of the resin film include polyethylene terephthalate (PET) films, cellulose triacetate films, polystyrene films, and polycarbonate films. Among these, PET films are preferred, and biaxially stretched PET films are more preferred.

[0142] The thickness (layer thickness) of the temporary support is not particularly limited and can be selected according to the material from the viewpoints of strength as a support, flexibility required when laminating to a circuit wiring forming substrate, and light transmittance required in the initial exposure step.

[0143] The thickness of the temporary support is preferably in the range of 5 μm to 100 μm, more preferably in the range of 10 μm to 50 μm, further preferably in the range of 10 μm to 20 μm, and particularly preferably in the range of 10 μm to 16 μm from the viewpoint of ease of handling and versatility.

[0144] Furthermore, from the viewpoint of resolution and linearity during exposure via a temporary support, the thickness of the temporary support is preferably 50 μm or less, and more preferably 25 μm or less.

[0145] Furthermore, the film used as a temporary support preferably has no deformation such as wrinkles, scratches, or defects.

[0146] From the viewpoint of pattern formation during pattern exposure via a temporary support and the transparency of the temporary support, the smaller the number of particles, foreign matter, defects, precipitates, etc. contained in the temporary support, the better. The number of particles, foreign matter, or defects with a diameter of 1 μm or more is preferably 50 / 10 mm. 2 Less than 10 pieces / 10mm, more preferably 10 pieces / 10mm 2 Below, more preferably 3 / 10mm 2 Below, particularly preferably 0 / 10mm 2 .

[0147] Preferred forms of temporary support bodies are described, for example, in paragraphs 0017 to 0018 of Japanese Patent Publication No. 2014-85643, paragraphs 0019 to 0026 of Japanese Patent Publication No. 2016-27363, paragraphs 0041 to 0057 of International Publication No. 2012 / 081680, paragraphs 0029 to 0040 of International Publication No. 2018 / 179370, and paragraphs 0012 to 0032 of Japanese Patent Publication No. 2019-101405, and the contents of these publications are incorporated into this specification.

[0148] [Photosensitive resin layer]

[0149] The photosensitive transfer member used in the present invention includes a photosensitive resin layer.

[0150] The photosensitive resin layer is preferably a negative-type photosensitive resin layer, wherein the solubility of the exposed portion in the developer is reduced by exposure, and the unexposed portion is removed by development. However, the photosensitive resin layer is not limited to a negative-type photosensitive resin layer and may also be a positive-type photosensitive resin layer, wherein the solubility of the exposed portion in the developer is increased by exposure, and the exposed portion is removed by development.

[0151] The photosensitive resin layer preferably contains a polymerizable compound and a binder polymer, more preferably contains a polymerizable compound, a binder polymer, and a photopolymerization initiator, and particularly preferably contains polymer A, a polymerizable compound, and a photopolymerization initiator. Based on the total mass of the photosensitive resin layer, the photosensitive resin layer preferably contains 10% to 90% by mass of the binder polymer, 5% to 70% by mass of the polymerizable compound, and 0.01% to 20% by mass of the photopolymerization initiator.

[0152] Hereinafter, each component will be described in sequence.

[0153] [Binder polymer]

[0154] The photosensitive resin layer preferably contains a binder polymer.

[0155] The binder polymer is not particularly limited, and preferred examples include known binder polymers used in resists.

[0156] Furthermore, examples of the binder polymer include alkali-soluble polymers.

[0157] As the alkali-soluble polymer, an alkali-soluble polymer having an acid group is preferable.

[0158] Among them, the binder polymer is preferably the polymer A described below.

[0159] -Polymer A-

[0160] As the binder polymer, polymer A is preferably contained.

[0161] The polymer A is preferably an alkali-soluble polymer. The alkali-soluble polymer includes a polymer that is easily soluble in an alkaline substance.

[0162] From the viewpoint of achieving better resolution by suppressing swelling of the photosensitive resin layer due to the developer, the acid value of the polymer A is preferably 220 mgKOH / g or less, more preferably less than 200 mgKOH / g, and even more preferably less than 190 mgKOH / g.

[0163] The lower limit of the acid value of polymer A is not particularly limited, but is preferably 60 mgKOH / g or more, more preferably 120 mgKOH / g or more, further preferably 150 mgKOH / g or more, and particularly preferably 170 mgKOH / g or more from the viewpoint of achieving better developability.

[0164] The acid value is the mass [mg] of potassium hydroxide required to neutralize 1 g of a sample, and in this specification, the unit is expressed as mgKOH / g. The acid value can be calculated, for example, based on the average content of acid radicals in the compound.

[0165] The acid value of the polymer A can be adjusted by the type of the structural unit constituting the polymer A and the content of the structural unit containing an acid group.

[0166] The weight average molecular weight of polymer A is preferably 5,000 to 500,000. From the viewpoint of improving resolution and developability, the weight average molecular weight is preferably set to 500,000 or less. It is more preferred to set the weight average molecular weight to 100,000 or less, further preferably to set it to 60,000 or less, and particularly preferably to set it to 50,000 or less. On the other hand, from the viewpoint of controlling the properties of the developed agglomerates and the properties of the unexposed film such as edge fusion and chipping when made into a photosensitive resin laminate, it is preferred to set the weight average molecular weight to 5,000 or more. It is more preferred to set the weight average molecular weight to 10,000 or more, further preferably to set it to 20,000 or more, and particularly preferably to set it to 30,000 or more. Edge fusion refers to the degree to which the photosensitive resin layer easily protrudes from the end face of the roll when the photosensitive transfer component is wound into a roll. Chipping refers to the degree to which chips easily fly when the unexposed film is cut using a cutter. If the shavings adhere to the upper surface of the photosensitive resin laminate, etc., they will be transferred to the mask in the subsequent exposure process, etc., which will cause defective products. The dispersity of polymer A is preferably 1.0 to 6.0, more preferably 1.0 to 5.0, further preferably 1.0 to 4.0, and further preferably 1.0 to 3.0. In the present invention, the molecular weight is a value measured using gel permeation chromatography. In addition, the dispersity is the ratio of the weight average molecular weight to the number average molecular weight (weight average molecular weight / number average molecular weight).

[0167] From the viewpoint of suppressing the line width coarseness or resolution degradation when the focus position is offset during exposure, the photosensitive resin layer preferably contains a polymer having a monomer component of an aromatic hydrocarbon group as polymer A. In addition, as such an aromatic hydrocarbon group, for example, a substituted or unsubstituted phenyl group or a substituted or unsubstituted aralkyl group can be cited. In polymer A, based on the total mass of all monomer components, the proportion of the monomer component having an aromatic hydrocarbon group is preferably 20% by mass or more, more preferably 30% by mass or more, further preferably 40% by mass or more, particularly preferably 45% by mass or more, and most preferably 50% by mass or more. As an upper limit, there is no particular limitation, but it is preferably 95% by mass or less, more preferably 85% by mass or less. In addition, the proportion of the monomer component having an aromatic hydrocarbon group when containing a plurality of polymers A is obtained as a weight average.

[0168] As the monomer with the above-mentioned aromatic hydrocarbon group, for example, a monomer with an aralkyl group, styrene and a polymerizable styrene derivative (for example, methyl styrene, vinyl toluene, tert-butoxystyrene, acetoxystyrene, 4-vinylbenzoic acid, styrene dimer, styrene trimer, etc.) can be mentioned. Among them, a monomer or styrene with an aralkyl group is preferred. In one embodiment, when the monomer component with an aromatic hydrocarbon group in polymer A is styrene, the content of the styrene monomer component is preferably 20% by mass to 50% by mass, more preferably 25% by mass to 45% by mass, further preferably 30% by mass to 40% by mass, and particularly preferably 30% by mass to 35% by mass, based on the total mass of all monomer components.

[0169] Examples of the aralkyl group include substituted or unsubstituted phenylalkyl (excluding benzyl) and substituted or unsubstituted benzyl. Preferably, it is a substituted or unsubstituted benzyl.

[0170] Examples of the monomer having a phenylalkyl group include phenethyl (meth)acrylate and the like.

[0171] Examples of monomers having a benzyl group include (meth)acrylates having a benzyl group (e.g., benzyl (meth)acrylate, benzyl chloroacrylate), and vinyl monomers having a benzyl group (e.g., vinylbenzyl chloride, vinylbenzyl alcohol, etc.). Among these, benzyl (meth)acrylate is preferred. In one embodiment, when the monomer component having an aromatic hydrocarbon group in polymer A is benzyl (meth)acrylate, the content of the benzyl (meth)acrylate monomer component is preferably 50% to 95% by mass, more preferably 60% to 90% by mass, further preferably 70% to 90% by mass, and particularly preferably 75% to 90% by mass, based on the total mass of all monomer components.

[0172] The polymer A containing a monomer component having an aromatic hydrocarbon group is preferably obtained by polymerizing a monomer having an aromatic hydrocarbon group and at least one of the first monomers described below and / or at least one of the second monomers described below.

[0173] The polymer A containing no monomer component having an aromatic hydrocarbon group is preferably obtained by polymerizing at least one of the first monomers described below, and more preferably by copolymerizing at least one of the first monomers and at least one of the second monomers described below.

[0174] The first monomer is a monomer having a carboxyl group in the molecule. Examples of the first monomer include (meth)acrylic acid, fumaric acid, cinnamic acid, crotonic acid, itaconic acid, 4-vinylbenzoic acid, maleic anhydride, and maleic acid half ester. Among them, (meth)acrylic acid is preferred.

[0175] In the polymer A, the content of the first monomer is preferably 5 to 50% by mass, more preferably 10 to 40% by mass, and even more preferably 15 to 30% by mass, based on the total mass of all monomer components.

[0176] In addition, in this specification, “(meth)acrylic acid” means acrylic acid or methacrylic acid, “(meth)acryloyl” means acryloyl or methacryloyl, and “(meth)acrylate” means “acrylate” or “methacrylate”.

[0177] Based on the total mass of all monomer components, the copolymerization ratio of the first monomer is preferably 10% to 50% by mass. From the viewpoints of showing good developability, controlling edge fusion, etc., it is preferred that the above-mentioned copolymerization ratio be set to 10% by mass or more, more preferably 15% by mass or more, and further preferably 20% by mass or more. From the viewpoints of high resolution and edge shape of the resist pattern, and further from the viewpoint of chemical resistance of the resist pattern, it is preferred that the above-mentioned copolymerization ratio be set to 50% by mass or less, and from these viewpoints, it is more preferred that it be 35% by mass or less, further preferably 30% by mass or less, and particularly preferably 27% by mass or less.

[0178] The second monomer is a non-acidic monomer having at least one polymerizable unsaturated group in the molecule. Examples of the second monomer include (meth)acrylates such as methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, tert-butyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, cyclohexyl (meth)acrylate, and 2-ethylhexyl (meth)acrylate; esters of vinyl alcohol such as vinyl acetate; and (meth)acrylonitrile. Among these, methyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, and n-butyl (meth)acrylate are preferred, and methyl (meth)acrylate is particularly preferred.

[0179] In polymer A, the content of the second monomer is preferably 5 to 60% by mass, more preferably 15 to 50% by mass, and even more preferably 20 to 45% by mass, based on the total mass of all monomer components.

[0180] From the perspective of suppressing line width expansion and resolution degradation caused by focus shift during exposure, it is preferred to contain a monomer having an aralkyl group and / or styrene as a monomer. For example, a copolymer containing methacrylic acid, benzyl methacrylate, and styrene, or a copolymer containing methacrylic acid, methyl methacrylate, benzyl methacrylate, and styrene is preferred.

[0181] In one embodiment, polymer A preferably comprises 25% to 40% by mass of a monomer component having an aromatic hydrocarbon group, 20% to 35% by mass of a first monomer component, and 30% to 45% by mass of a second monomer component. Furthermore, in another embodiment, polymer A preferably comprises 70% to 90% by mass of a monomer component having an aromatic hydrocarbon group and 10% to 25% by mass of the first monomer component.

[0182] Polymer A may have a linear structure, a branched structure, or an alicyclic structure in its side chain. By using a monomer containing a group having a branched structure in its side chain or a monomer containing a group having an alicyclic structure in its side chain, a branched structure or an alicyclic structure can be introduced into the side chain of polymer A. The group having an alicyclic structure may be monocyclic or polycyclic.

[0183] Specific examples of the monomer containing a group having a branched structure in the side chain include isopropyl (meth)acrylate, isobutyl (meth)acrylate, sec-butyl (meth)acrylate, t-butyl (meth)acrylate, isoamyl (meth)acrylate, t-amyl (meth)acrylate, sec-amyl (meth)acrylate, 2-octyl (meth)acrylate, 3-octyl (meth)acrylate, and t-octyl (meth)acrylate. Among them, isopropyl (meth)acrylate, isobutyl (meth)acrylate, and t-butyl methacrylate are preferred, and isopropyl methacrylate or t-butyl methacrylate are more preferred.

[0184] Specific examples of monomers containing a group having an alicyclic structure in a side chain include monomers having a monocyclic aliphatic hydrocarbon group and monomers having a polycyclic aliphatic hydrocarbon group. Furthermore, (meth)acrylates having an alicyclic hydrocarbon group having 5 to 20 carbon atoms can be mentioned. More specific examples include (bicyclo〔2.2.1]heptyl-2-(meth)acrylate, 1-adamantyl (meth)acrylate, 2-adamantyl (meth)acrylate, 3-methyl-1-adamantyl (meth)acrylate, 3,5-dimethyl-1-adamantyl (meth)acrylate, 3-ethyladamantyl (meth)acrylate, 3-methyl-5-ethyl-1-adamantyl (meth)acrylate, 3,5,8-triethyl-1-adamantyl (meth)acrylate, 3,5-dimethyl-8-ethyl-1-adamantyl (meth)acrylate, 2-methyl-2-adamantyl (meth)acrylate, 2-ethyl -2-adamantyl (meth)acrylate, 3-hydroxy-1-adamantyl (meth)acrylate, octahydro-4,7-mentholinden-5-yl (meth)acrylate, octahydro-4,7-mentholinden-1-ylmethyl (meth)acrylate, 1-menthyl (meth)acrylate, tricyclodecyl (meth)acrylate, 3-hydroxy-2,6,6-trimethyl-bicyclo〔3.1.1〕heptyl (meth)acrylate, 3,7,7-trimethyl-4-hydroxy-bicyclo〔4.1.0〕heptyl (meth)acrylate, (nor)bornyl (meth)acrylate, isobornyl (meth)acrylate, fenchyl (meth)acrylate, 2,2,5-trimethylcyclohexyl (meth)acrylate and cyclohexyl (meth)acrylate, etc. Among these (meth)acrylates, cyclohexyl (meth)acrylate, (nor)bornyl (meth)acrylate, isobornyl (meth)acrylate, 1-adamantyl (meth)acrylate, 2-adamantyl (meth)acrylate, fenchyl (meth)acrylate, 1-menthyl (meth)acrylate, or tricyclodecanyl (meth)acrylate is preferred, and cyclohexyl (meth)acrylate, (nor)bornyl (meth)acrylate, isobornyl (meth)acrylate, 2-adamantyl (meth)acrylate, or tricyclodecanyl (meth)acrylate is more preferred.

[0185] Polymer A may be used alone or in combination of two or more. When two or more polymers are mixed, it is preferred to use a mixture of two polymers A containing monomer components having aromatic hydrocarbon groups, or to use a mixture of a polymer A containing monomer components having aromatic hydrocarbon groups and a polymer A not containing monomer components having aromatic hydrocarbon groups. In the latter case, the proportion of the polymer A containing monomer components having aromatic hydrocarbon groups used relative to the total polymer A is preferably 50% by mass or more, more preferably 70% by mass or more, further preferably 80% by mass or more, and particularly preferably 90% by mass or more.

[0186] Polymer A is preferably synthesized by adding an appropriate amount of a free radical polymerization initiator such as benzoyl peroxide or azoisobutyronitrile to a solution obtained by diluting one or more of the monomers described above with a solvent such as acetone, methyl ethyl ketone, or isopropyl alcohol, followed by heating and stirring. Synthesis may also be performed while a portion of the mixture is dropwise added to the reaction solution. After the reaction is completed, further solvent may be added to adjust the desired concentration. Synthesis methods, in addition to solution polymerization, may also include bulk polymerization, suspension polymerization, or emulsion polymerization.

[0187] The glass transition temperature Tg of polymer A is preferably 30°C or higher and 135°C or lower. In the photosensitive resin layer, by using a polymer A having a Tg of 135°C or lower, it is possible to suppress the thickening of the line width or degradation of the resolution when the focus position shifts during exposure. From this viewpoint, the Tg of polymer A is more preferably 130°C or lower, further preferably 120°C or lower, and particularly preferably 110°C or lower. Furthermore, from the viewpoint of improving edge fusion resistance, it is preferred to use a polymer A having a Tg of 30°C or higher. From this viewpoint, the Tg of polymer A is more preferably 40°C or higher, further preferably 50°C or higher, particularly preferably 60°C or higher, and most preferably 70°C or higher.

[0188] The photosensitive resin layer may contain resins other than the polymer A.

[0189] Examples of resins other than polymer A include acrylic resins, styrene-acrylic acid copolymers (wherein the styrene content is 40% by mass or less), polyurethane resins, polyvinyl alcohol, polyvinyl formal, polyamide resins, polyester resins, epoxy resins, polyacetal resins, polyhydroxystyrene resins, polyimide resins, polybenzoxazole resins, polysiloxane resins, polyethyleneimine, polyallylamine, and polyalkylene glycol.

[0190] The binder polymer may be used alone or in combination of two or more.

[0191] The ratio of the binder polymer to the total mass of the photosensitive resin layer is preferably in the range of 10% to 90% by mass, more preferably 30% to 70% by mass, and further preferably 40% to 60% by mass. From the viewpoint of controlling the development time, it is preferred that the ratio of the binder polymer to the photosensitive resin layer be set to 90% by mass or less. On the other hand, from the viewpoint of improving edge fusion resistance, it is preferred that the ratio of the binder polymer to the photosensitive resin layer be set to 10% by mass or more.

[0192] (Polymerizable compound)

[0193] The photosensitive resin layer preferably contains a polymerizable compound.

[0194] In this specification, the "polymerizable compound" refers to a compound other than the above-mentioned binder polymer that is polymerized by the action of a polymerization initiator described later.

[0195] As the polymerizable compound, an ethylenically unsaturated compound is preferred.

[0196] The ethylenically unsaturated compound is a component that contributes to the photosensitivity (ie, photocurability) of the negative photosensitive resin layer and the strength of the cured film.

[0197] Furthermore, the ethylenically unsaturated compound is a compound having one or more ethylenically unsaturated groups.

[0198] As the ethylenically unsaturated compound, the photosensitive resin layer preferably contains a bifunctional or higher-functional ethylenically unsaturated compound.

[0199] Here, the bifunctional or higher-functional ethylenically unsaturated compound refers to a compound having two or more ethylenically unsaturated groups in one molecule.

[0200] As the ethylenically unsaturated group, a (meth)acryloyl group is more preferred.

[0201] As the ethylenically unsaturated compound, a (meth)acrylate compound is preferred.

[0202] The photosensitive resin layer preferably contains a polymerizable compound having a polymerizable group.

[0203] The polymerizable group possessed by the polymerizable compound is not particularly limited as long as it is a group that participates in the polymerization reaction. Examples thereof include groups having ethylenically unsaturated groups such as vinyl, acryloyl, methacryloyl, styryl and maleimide groups; and groups having cationic polymerizable groups such as epoxy and oxetane groups.

[0204] As the polymerizable group, a group having an ethylenically unsaturated group is preferred, and an acryloyl group or a methacryloyl group is more preferred.

[0205] As the polymerizable compound, from the viewpoint of improving the photosensitivity of the photosensitive resin layer, a compound having one or more ethylenically unsaturated groups (ethylenically unsaturated compounds) is preferred, and a compound having two or more ethylenically unsaturated groups in one molecule (polyfunctional ethylenically unsaturated compounds) is more preferred.

[0206] Furthermore, from the viewpoint of achieving better resolution and releasability, the number of ethylenically unsaturated groups contained in one molecule of the ethylenically unsaturated compound is preferably 6 or less, more preferably 3 or less, and even more preferably 2 or less.

[0207] From the viewpoint of achieving a better balance between the photosensitivity, resolution, and releasability of the photosensitive resin layer, the photosensitive resin layer preferably contains a bifunctional or trifunctional ethylenically unsaturated compound having two or three ethylenically unsaturated groups in one molecule, and more preferably contains a bifunctional ethylenically unsaturated compound having two ethylenically unsaturated groups in one molecule.

[0208] From the viewpoint of excellent releasability, the content of the bifunctional ethylenically unsaturated compound in the photosensitive resin layer is preferably 60% by mass or more relative to the content of the polymerizable compound, more preferably exceeding 70% by mass, and even more preferably 90% by mass or more. The upper limit is not particularly limited and may be 100% by mass. That is, the polymerizable compounds contained in the photosensitive resin layer may all be bifunctional ethylenically unsaturated compounds.

[0209] Furthermore, as the ethylenically unsaturated compound, a (meth)acrylate compound having a (meth)acryloyl group as a polymerizable group is preferred.

[0210] -Polymerizable compound B1-

[0211] The photosensitive resin layer preferably contains a polymerizable compound B1 having an aromatic ring and two ethylenically unsaturated groups. The polymerizable compound B1 is a bifunctional ethylenically unsaturated compound having one or more aromatic rings in one molecule among the above-mentioned polymerizable compounds.

[0212] In the photosensitive resin layer, from the perspective of achieving better resolution, the mass ratio of the content of the polymerizable compound B1 relative to the content of the polymerizable compound is preferably 40% by mass or more, more preferably 50% by mass or more, even more preferably 55% by mass or more, and particularly preferably 60% by mass or more. The upper limit is not particularly limited, but from the perspective of releasability, it is preferably 99% by mass or less, more preferably 95% by mass or less, even more preferably 90% by mass or less, and particularly preferably 85% by mass or less.

[0213] Examples of the aromatic ring possessed by the polymerizable compound B1 include aromatic hydrocarbon rings such as a benzene ring, a naphthalene ring, and an anthracene ring, aromatic heterocyclic rings such as a thiophene ring, a furan ring, a pyrrole ring, an imidazole ring, a triazole ring, and a pyridine ring, and condensed rings thereof. Aromatic hydrocarbon rings are preferred, and a benzene ring is more preferred. The aromatic rings may have substituents.

[0214] The polymerizable compound B1 may have only one aromatic ring, or may have two or more aromatic rings.

[0215] From the viewpoint of improving the resolution by suppressing the swelling of the photosensitive resin layer due to the developer, the polymerizable compound B1 preferably has a bisphenol structure.

[0216] Examples of the bisphenol structure include a bisphenol A structure derived from bisphenol A (2,2-bis(4-hydroxyphenyl)propane), a bisphenol F structure derived from bisphenol F (2,2-bis(4-hydroxyphenyl)methane), and a bisphenol B structure derived from bisphenol B (2,2-bis(4-hydroxyphenyl)butane). The bisphenol A structure is preferred.

[0217] Examples of the polymerizable compound B1 having a bisphenol structure include compounds having a bisphenol structure and two polymerizable groups (preferably (meth)acryloyl groups) bonded to both ends of the bisphenol structure.

[0218] The two polymerizable groups at both ends of the bisphenol structure may be bonded directly or through one or more alkyleneoxy groups. The alkyleneoxy groups added to both ends of the bisphenol structure are preferably ethyleneoxy or propyleneoxy, with ethyleneoxy being more preferred. The number of alkyleneoxy groups added to the bisphenol structure is not particularly limited, but is preferably 4 to 16, and more preferably 6 to 14, per molecule.

[0219] The polymerizable compound B1 having a bisphenol structure is described in paragraphs 0072 to 0080 of JP-A-2016-224162, and the contents described in the publication are incorporated into the present specification.

[0220] As the polymerizable compound B1, a bifunctional ethylenically unsaturated compound having a bisphenol A structure is preferred, and 2,2-bis(4-((meth)acryloyloxypolyalkoxy)phenyl)propane is more preferred.

[0221] Examples of 2,2-bis(4-((meth)acryloyloxypolyalkoxy)phenyl)propane include 2,2-bis(4-(methacryloyloxydiethoxy)phenyl)propane (FA-324M, manufactured by Hitachi Chemical Co., Ltd.), 2,2-bis(4-(methacryloyloxyethoxypropoxy)phenyl)propane, 2,2-bis(4-(methacryloyloxypentaethoxy)phenyl)propane (BPE-500, manufactured by Shin-Nakamura Chemical Co., Ltd.), 2,2-bis(4-(methacryloyloxydodeethoxytetrapropoxy)phenyl)propane (FA-3200MY, manufactured by Hitachi Chemical Co., Ltd.), and 2,2-bis(4-(methacryloyloxypentadecethoxy)phenyl)propane (BPE-1300, manufactured by Shin-Nakamura Chemical Co., Ltd.). Co., Ltd.), 2,2-bis(4-(methacryloyloxydiethoxy)phenyl)propane (BPE-200, Shin-Nakamura Chemical Co., Ltd.), and ethoxylated (10) bisphenol A diacrylate (NK ESTETR A-BPE-10, Shin-Nakamura Chemical Co., Ltd.).

[0222] As the polymerizable compound B1, a compound represented by the following general formula (I) can be used.

[0223] [Chemical Formula 1]

[0224]

[0225] {In the formula, R1 and R2 each independently represent a hydrogen atom or a methyl group, A is C2H4, B is C3H6, n1 and n3 each independently represent an integer from 1 to 39, and n1+n3 each represent an integer from 2 to 40, n2 and n4 each independently represent an integer from 0 to 29, and n2+n4 each represent an integer from 0 to 30, and the arrangement of the repeating units of -(AO)- and -(BO)- may be random or block-like. In the case of a block-like structure, either -(AO)- or -(BO)- may be on the biphenyl side.}

[0226] In one embodiment, n1+n2+n3+n4 is preferably 2 to 20, more preferably 2 to 16, and even more preferably 4 to 12. Furthermore, n2+n4 is preferably 0 to 10, more preferably 0 to 4, even more preferably 0 to 2, and particularly preferably 0.

[0227] The polymerizable compound B1 may be used alone or in combination of two or more.

[0228] From the perspective of achieving better resolution, the content of polymerizable compound B1 in the photosensitive resin layer is preferably 10% by mass or more, and more preferably 20% by mass or more, relative to the total mass of the photosensitive resin layer. There is no particular upper limit, but from the perspective of transferability and edge blending (the phenomenon of photosensitive resin oozing out from the ends of the transfer member), it is preferably 70% by mass or less, and more preferably 60% by mass or less.

[0229] The photosensitive resin layer may contain a polymerizable compound other than the above-mentioned polymerizable compound B1.

[0230] The polymerizable compounds other than polymerizable compound B1 are not particularly limited and can be appropriately selected from known compounds. Examples include compounds having one ethylenically unsaturated group per molecule (monofunctional ethylenically unsaturated compound), bifunctional ethylenically unsaturated compounds without an aromatic ring, and trifunctional or higher ethylenically unsaturated compounds.

[0231] Examples of the monofunctional ethylenically unsaturated compound include ethyl (meth)acrylate, ethylhexyl (meth)acrylate, 2-(meth)acryloyloxyethyl succinate, polyethylene glycol mono(meth)acrylate, polypropylene glycol mono(meth)acrylate, and phenoxyethyl (meth)acrylate.

[0232] Examples of the bifunctional ethylenically unsaturated compound having no aromatic ring include alkylene glycol di(meth)acrylate, polyalkylene glycol di(meth)acrylate, urethane di(meth)acrylate, and trimethylolpropane diacrylate.

[0233] Examples of the alkylene glycol di(meth)acrylate include tricyclodecane dimethanol diacrylate (A-DCP, manufactured by Shin-Nakamura Chemical Co., Ltd.), tricyclodecane dimethanol dimethacrylate (DCP, manufactured by Shin-Nakamura Chemical Co., Ltd.), 1,9-nonanediol diacrylate (A-NOD-N, manufactured by Shin-Nakamura Chemical Co., Ltd.), 1,6-hexanediol diacrylate (A-HD-N, manufactured by Shin-Nakamura Chemical Co., Ltd.), ethylene glycol dimethacrylate, 1,10-decanediol diacrylate, and neopentyl glycol di(meth)acrylate.

[0234] Examples of the polyalkylene glycol di(meth)acrylate include polyethylene glycol di(meth)acrylate, dipropylene glycol diacrylate, tripropylene glycol diacrylate, and polypropylene glycol di(meth)acrylate.

[0235] Examples of urethane di(meth)acrylates include propylene oxide-modified urethane di(meth)acrylates and ethylene oxide- and propylene oxide-modified urethane di(meth)acrylates. Examples of commercially available products include 8UX-015A (manufactured by TAISEI FINE CHEMICAL CO., LTD.), UA-32P (manufactured by Shin-Nakamura Chemical Co., Ltd.), and UA-1100H (manufactured by Shin-Nakamura Chemical Co., Ltd.).

[0236] Examples of trifunctional or higher-functional ethylenically unsaturated compounds include dipentaerythritol (tri / tetra / penta / hexa) (meth)acrylate, pentaerythritol (tri / tetra) (meth)acrylate, trimethylolpropane tri(meth)acrylate, di-trimethylolpropane tetra(meth)acrylate, trimethylolethane tri(meth)acrylate, isocyanuric acid tri(meth)acrylate, glycerol tri(meth)acrylate, and alkylene oxide-modified products thereof.

[0237] Here, “(tri / tetra / penta / hexa) (meth) acrylate” is a concept including tri(meth) acrylate, tetra(meth) acrylate, penta(meth) acrylate and hexa(meth) acrylate, and “(tri / tetra) (meth) acrylate” is a concept including tri(meth) acrylate and tetra(meth) acrylate. In one embodiment, the photosensitive resin layer preferably contains the above-mentioned polymerizable compound B1 and a trifunctional or higher ethylenically unsaturated compound, and more preferably contains the above-mentioned polymerizable compound B1 and two or more trifunctional or higher ethylenically unsaturated compounds. In this case, the mass ratio of the polymerizable compound B1 to the trifunctional or higher ethylenically unsaturated compound is preferably (total mass of the polymerizable compound B1): (total mass of the trifunctional or higher ethylenically unsaturated compound) = 1: 1 to 5: 1, more preferably 1.2: 1 to 4: 1, and further preferably 1.5: 1 to 3: 1.

[0238] Furthermore, in one embodiment, the photosensitive resin layer preferably contains the polymerizable compound B1 and two or more trifunctional ethylenically unsaturated compounds.

[0239] Examples of the alkylene oxide-modified products of trifunctional or higher ethylenically unsaturated compounds include caprolactone-modified (meth)acrylate compounds (such as KAYARAD (registered trademark) DPCA-20 manufactured by Nippon Kayaku Co., Ltd. and A-9300-1CL manufactured by Shin-Nakamura Chemical Co., Ltd.), alkylene oxide-modified (meth)acrylate compounds (such as KAYARAD RP-1040 manufactured by Nippon Kayaku Co., Ltd. and ATM-35E and A-9300 manufactured by Shin-Nakamura Chemical Co., Ltd. and EBECRYL (registered trademark) 135 manufactured by Daicel-Allnex Ltd.), ethoxylated glyceryl triacrylate (such as A-GLY-9E manufactured by Shin-Nakamura Chemical Co., Ltd.), ARONIX (registered trademark) TO-2349 manufactured by Toagosei Co., Ltd., and ARONIX M-520 (manufactured by TOAGOSEI CO., LTD.) and ARONIX M-510 (manufactured by TOAGOSEI CO., LTD.).

[0240] Furthermore, as polymerizable compounds other than the polymerizable compound B1, polymerizable compounds having an acid group described in paragraphs 0025 to 0030 of JP-A-2004-239942 can be used.

[0241] From the viewpoint of resolution and linearity, the ratio Mm / Mb of the polymerizable compound content Mm to the binder polymer content Mb in the photosensitive resin layer is preferably 1.0 or less, more preferably 0.9 or less, and particularly preferably 0.5 or more and 0.9 or less.

[0242] Furthermore, from the viewpoint of curability and resolution, the polymerizable compound in the photosensitive resin layer preferably contains a (meth)acrylic compound.

[0243] Furthermore, from the perspectives of curability, resolution, and linearity, the polymerizable compound in the photosensitive resin layer more preferably contains a (meth)acrylic compound, and the content of the acrylic compound relative to the total mass of the (meth)acrylic compound contained in the photosensitive resin layer is preferably 60% by mass or less. The lower limit of the content of the acrylic compound is not particularly limited, but is, for example, 0.1% by mass.

[0244] The polymerizable compound may be used alone or in combination of two or more.

[0245] The content of the polymerizable compound in the photosensitive resin layer is preferably 10 to 70% by mass, more preferably 20 to 60% by mass, and even more preferably 20 to 50% by mass, relative to the total mass of the photosensitive resin layer.

[0246] The weight average molecular weight (Mw) of the polymerizable compound including the polymerizable compound B1 is preferably 200 to 3,000, more preferably 280 to 2,200, and even more preferably 300 to 2,200.

[0247] [Other ingredients]

[0248] The photosensitive resin layer may contain components other than the binder polymer and the polymerizable compound.

[0249] -Photopolymerization initiator-

[0250] The photosensitive resin layer preferably contains a photopolymerization initiator.

[0251] The photopolymerization initiator is a compound that initiates polymerization of a polymerizable compound by receiving activating light such as ultraviolet light, visible light, and X-rays. The photopolymerization initiator is not particularly limited, and a known photopolymerization initiator can be used.

[0252] Examples of the photopolymerization initiator include a photoradical polymerization initiator and a photocationic polymerization initiator, and a photoradical polymerization initiator is preferred.

[0253] Examples of the photoradical polymerization initiator include a photopolymerization initiator having an oxime ester structure, a photopolymerization initiator having an α-aminoalkylphenone structure, a photopolymerization initiator having an α-hydroxyalkylphenone structure, a photopolymerization initiator having an acylphosphine oxide structure, and a photopolymerization initiator having an N-phenylglycine structure.

[0254] Furthermore, from the perspectives of photosensitivity, visibility of the exposed and non-exposed areas, and resolution, the photosensitive resin layer preferably contains at least one selected from 2,4,5-triarylimidazole dimers and derivatives thereof as a photoradical polymerization initiator. Furthermore, the two 2,4,5-triarylimidazole structures in the 2,4,5-triarylimidazole dimers and derivatives thereof may be the same or different.

[0255] Examples of the derivatives of 2,4,5-triarylimidazole dimers include 2-(o-chlorophenyl)-4,5-diphenylimidazole dimer, 2-(o-chlorophenyl)-4,5-di(methoxyphenyl)imidazole dimer, 2-(o-fluorophenyl)-4,5-diphenylimidazole dimer, 2-(o-methoxyphenyl)-4,5-diphenylimidazole dimer, and 2-(p-methoxyphenyl)-4,5-diphenylimidazole dimer.

[0256] As the photoradical polymerization initiator, for example, polymerization initiators described in paragraphs 0031 to 0042 of JP-A-2011-95716 and paragraphs 0064 to 0081 of JP-A-2015-14783 can be used.

[0257] Examples of the photoradical polymerization initiator include ethyl dimethylaminobenzoate (DBE, CAS No. 10287-53-3), benzoin methyl ether, anisyl (p,p'-dimethoxybenzyl), TAZ-110 (trade name: manufactured by Midori Kagaku Co., Ltd.), benzophenone, TAZ-111 (trade name: manufactured by Midori Kagaku Co., Ltd.), Irgacure OXE01, OXE02, OXE03, and OXE04 (manufactured by BASF), Omnirad 651 and 369 (trade name: manufactured by IGM Resins B.V.), and 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole (manufactured by Tokyo Chemical Industry Co., Ltd.).

[0258] Examples of commercially available photoradical polymerization initiators include 1-[4-(phenylthio)phenyl]-1,2-octanedione-2-(o-benzoyloxime) (trade name: IRGACURE (registered trademark) OXE-01, manufactured by BASF), 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone-1-(O-acetoxime) (trade name: IRGACURE OXE-02, manufactured by BASF), IRGACURE OXE-03 (manufactured by BASF), 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone (trade name: Omnirad 379EG, manufactured by IGM Resins BV), and 2-methyl-1-(4-methylthiophenyl)-2-morpholinopropan-1-one (trade name: Omnirad 379EG, manufactured by IGM Resins BV). 907, manufactured by IGM Resins BV), 2-hydroxy-1-{4-[4-(2-hydroxy-2-methylpropionyl)benzyl]phenyl}-2-methylpropan-1-one (trade name: Omnirad 127, manufactured by IGM Resins BV), 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)butanone-1-one (trade name: Omnirad 369, manufactured by IGM Resins BV), 2-hydroxy-2-methyl-1-phenylpropan-1-one (trade name: Omnirad 1173, manufactured by IGM Resins BV), 1-hydroxycyclohexyl phenyl ketone (trade name: Omnirad 184, manufactured by IGM Resins BV), 2,2-dimethoxy-1,2-diphenylethan-1-one (trade name: Omnirad 651, manufactured by IGM Resins BV) BV), 2,4,6-trimethylbenzoyl-diphenylphosphine oxide (trade name: Omnirad TPO H, manufactured by IGM Resins BV), bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide (trade name: Omnirad 819, manufactured by IGM Resins BV), oxime ester-based photopolymerization initiator (trade name: Lunar 6, manufactured by DKSH Management Ltd.), 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenylbisimidazole (2-(2-chlorophenyl)-4,5-diphenylimidazole dimer) (trade name: B-CIM, manufactured by Hampford), and 2-(o-chlorophenyl)-4,5-diphenylimidazole dimer (trade name: BCTB, manufactured by Tokyo Chemical Industry Co., Ltd.).

[0259] Furthermore, 2,2′-bis(2-chlorophenyl)-4,4′,5,5′-tetraphenylbisimidazole (2-(2-chlorophenyl)-4,5-diphenylimidazole dimer) (trade name: B-IMD, manufactured by KUROGANE KASEICo., Ltd.) can also be used.

[0260] In this specification, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenylbisimidazole (2-(2-chlorophenyl)-4,5-diphenylimidazole dimer) is described as B-CIM or B-IMD.

[0261] Photocationic polymerization initiators (photoacid generators) are compounds that generate acid in response to activating light. Preferred photocationic polymerization initiators are those that generate acid in response to activating light with a wavelength of 300 nm or longer, preferably 300-450 nm, but their chemical structure is not limited. Furthermore, photocationic polymerization initiators that are not directly sensitive to activating light with a wavelength of 300 nm or longer may also be used in combination with a sensitizer, provided they generate acid in response to activating light with a wavelength of 300 nm or longer.

[0262] As the photocationic polymerization initiator, one that generates an acid with a pKa of 4 or less is preferred, one that generates an acid with a pKa of 3 or less is more preferred, and one that generates an acid with a pKa of 2 or less is particularly preferred. The lower limit of the pKa is not particularly limited, but is preferably -10.0 or greater, for example.

[0263] Examples of the photocationic polymerization initiator include ionic photocationic polymerization initiators and nonionic photocationic polymerization initiators.

[0264] Examples of the ionic photocationic polymerization initiator include onium salt compounds such as diaryliodonium salts and triarylsulfonium salts, and quaternary ammonium salts.

[0265] As the ionic photocationic polymerization initiator, those described in paragraphs 0114 to 0133 of JP-A-2014-85643 can be used.

[0266] Examples of nonionic photocationic polymerization initiators include trichloromethyl-s-triazines, diazomethane compounds, imide sulfonate compounds, and oxime sulfonate compounds. Trichloromethyl-s-triazines, diazomethane compounds, and imide sulfonate compounds may be compounds described in paragraphs 0083 to 0088 of JP-A-2011-221494. Oxime sulfonate compounds may be compounds described in paragraphs 0084 to 0088 of WO-2018 / 179640.

[0267] The photosensitive resin layer preferably contains a photoradical polymerization initiator, and more preferably contains at least one selected from 2,4,5-triarylimidazole dimers and derivatives thereof.

[0268] The photosensitive resin layer may contain one type of photopolymerization initiator alone, or may contain two or more types of photopolymerization initiators.

[0269] The content of the photopolymerization initiator in the photosensitive resin layer is not particularly limited, but is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, and even more preferably 1.0% by mass or more, relative to the total mass of the photosensitive resin layer. The upper limit is not particularly limited, but is preferably 10% by mass or less, more preferably 5% by mass or less, relative to the total mass of the photosensitive resin layer.

[0270] -pigment-

[0271] From the perspective of visibility of the exposed and non-exposed areas, and of pattern visibility and resolution after development, the photosensitive resin layer preferably contains a pigment (also referred to as "pigment N") having a maximum absorption wavelength of 450 nm or greater within the wavelength range of 400 nm to 780 nm during color development, and wherein the maximum absorption wavelength is altered by acid, base, or free radicals. The detailed mechanism is not yet clear, but the inclusion of pigment N improves adhesion to adjacent layers (e.g., a temporary support and an intermediate layer), resulting in better resolution.

[0272] In this specification, the "maximum absorption wavelength of a pigment changes due to acid, alkali or free radicals" can mean any of the following: a pigment in a coloring state is decolorized by acid, alkali or free radicals; a pigment in a decolorized state is colorized by acid, alkali or free radicals; and a pigment in a coloring state is changed to a coloring state of another hue.

[0273] Specifically, the pigment N may be a compound that develops color by changing from a bleached state upon exposure, or may be a compound that changes from a developed state upon exposure to discoloration. In this case, the pigment may be a pigment that generates an acid, base, or free radical in the photosensitive resin layer upon exposure and causes the acid, base, or free radical to act, thereby changing the developed or discolored state. Alternatively, the pigment may be a pigment that changes the state (e.g., pH) within the photosensitive resin layer by acid, base, or free radicals, thereby changing the developed or discolored state. Furthermore, the pigment may be a pigment that changes the developed or discolored state by directly stimulating an acid, base, or free radical without exposure.

[0274] Among them, from the viewpoint of visibility and resolution of the exposed and non-exposed areas, the dye N is preferably a dye whose maximum absorption wavelength changes due to acid or radicals, and more preferably a dye whose maximum absorption wavelength changes due to radicals.

[0275] From the viewpoint of visibility and resolution of the exposed and non-exposed areas, the photosensitive resin layer preferably contains both a dye (as dye N) whose maximum absorption wavelength changes due to radicals and a photoradical polymerization initiator.

[0276] Furthermore, from the viewpoint of visibility of the exposed portion and the non-exposed portion, the dye N is preferably a dye that develops color by acid, alkali, or radicals.

[0277] As an example of the color development mechanism of the dye N in the present invention, the following method can be cited: a method in which a photoradical polymerization initiator, a photocationic polymerization initiator (photoacid generator) or a photobase generator is added to the photosensitive resin layer, and after exposure, a radical-reactive dye, an acid-reactive dye or a base-reactive dye (for example, a colorless dye) is caused to develop color by the free radicals, acid or base generated from the photoradical polymerization initiator, photocationic polymerization initiator or photobase generator.

[0278] From the viewpoint of visibility of the exposed and non-exposed areas, the dye N preferably has a maximum absorption wavelength of 550 nm or longer in the wavelength range of 400 nm to 780 nm during color development, more preferably 550 nm to 700 nm, and even more preferably 550 nm to 650 nm.

[0279] Furthermore, the pigment N may have only one maximum absorption wavelength within the wavelength range of 400 nm to 780 nm when developing color, or may have two or more such maximum absorption wavelengths. When the pigment N has two or more maximum absorption wavelengths within the wavelength range of 400 nm to 780 nm when developing color, the maximum absorption wavelength with the highest absorbance among the two or more maximum absorption wavelengths may be 450 nm or greater.

[0280] The maximum absorption wavelength of the pigment N was obtained by measuring the transmission spectrum of a solution containing pigment N (liquid temperature 25° C.) in the range of 400 nm to 780 nm using a spectrophotometer: UV3100 (manufactured by Shimadzu Corporation) in an atmospheric atmosphere and detecting the wavelength where the light intensity becomes minimum (maximum absorption wavelength).

[0281] Examples of dyes that develop or fade color by exposure include colorless compounds.

[0282] Examples of dyes that are discolored by exposure include colorless compounds, diarylmethane dyes, oxazine dyes, xanthene dyes, iminonaphthoquinone dyes, azomethine dyes, and anthraquinone dyes.

[0283] As the dye N, a colorless compound is preferred from the viewpoint of visibility of the exposed portion and the non-exposed portion.

[0284] Examples of the colorless compound include colorless compounds having a triarylmethane skeleton (triarylmethane-based dyes), colorless compounds having a spiropyran skeleton (spiropyran-based dyes), colorless compounds having a fluoran skeleton (fluoran-based dyes), colorless compounds having a diarylmethane skeleton (diarylmethane-based dyes), colorless compounds having a rhodamine lactam skeleton (rhodamine lactam-based dyes), colorless compounds having an indolylphthalide skeleton (indolylphthalide-based dyes), and colorless compounds having a colorless auramine skeleton (colorless auramine-based dyes).

[0285] Among them, triarylmethane-based dyes or fluoran-based dyes are preferred, and colorless compounds having a triphenylmethane skeleton (triphenylmethane-based dyes) or fluoran-based dyes are more preferred.

[0286] As a colorless compound, from the viewpoint of visual recognition of the exposure portion and the non-exposure portion, it is preferred to have a lactone ring, a sultone ring or a sultone ring. Thus, by reacting the lactone ring, the sultone ring or the sultone ring possessed by the colorless compound with the free radical generated by the photo-radical polymerization initiator or the acid generated by the photo-cationic polymerization initiator, the colorless compound can be changed to a closed-loop state and decolorized or the colorless compound can be changed to an open-loop state and color developed. As a colorless compound, it is preferred to have a lactone ring, a sultone ring or a sultone ring and the lactone ring, the sultone ring or the sultone ring is opened by a free radical or an acid and the compound is more preferably a lactone ring and the lactone ring is opened by a free radical or an acid and the compound is colored.

[0287] Examples of the pigment N include the following dyes and colorless compounds.

[0288] Specific examples of the dye in the pigment N include brilliant green, ethyl violet, methyl green, crystal violet, basic fuchsin, methyl violet 2B, quinaldine red, rose bengal, metamin yellow, thymol sulfonphthalein, xylenol blue, methyl orange, p-methyl red, Congo red, benzo red violet 4B, α-naphthyl red, Nile blue 2B, Nile blue A, methyl violet, malachite green, para fuchsin, Victoria pure blue-alkyl naphthalene sulfonate, Victoria pure blue BOH (manufactured by HODOGAYA CHEMICAL CO., LTD.), Oil Blue #603 (manufactured by ORIENT CHEMICAL INDUSTRIES CO., LTD.), Oil Powder #312 (manufactured by ORIENT CHEMICAL INDUSTRIES CO., LTD.), Oil Red 5B (manufactured by ORIENT CHEMICAL INDUSTRIES CO., LTD.), Oil Red #308 (manufactured by ORIENT CHEMICAL INDUSTRIES CO., LTD.), Oil Red OG (manufactured by ORIENT CHEMICAL Industries Co., Ltd.), Oil Red RR (manufactured by Orient Chemical Industries Co., Ltd.), Oil Green #502 (manufactured by Orient Chemical Industries Co., Ltd.), Spilon Red BEH Special (manufactured by Hodogaya Chemical Co., Ltd.), m-cresol violet, cresol red, rhodamine B, rhodamine 6G, sulforhodamine B, auramine, 4-(p-diethylamino)phenyliminonaphthoquinone, 2-carboxyanilino-4-(p-diethylamino)phenyliminonaphthoquinone, 2-carboxystearylamino-4-pN,N-bis(hydroxyethyl)amino-phenyliminonaphthoquinone, 1-phenyl-3-methyl-4-(p-diethylamino)phenylimino-5-pyrazolone, and 1-β-naphthyl-4-(p-diethylamino)phenylimino-5-pyrazolone.

[0289] Specific examples of the colorless compound in the dye N include p,p',p"-hexamethyltriaminotriphenylmethane (colorless crystal violet), Pergascript Blue SRB (manufactured by Ciba-Geigy), crystal violet lactone, malachite green lactone, benzoylleuco-methylene blue, 2-(N-phenyl-N-methylamino)-6-(N-p-tolyl-N-ethyl)aminofluoran, 2-anilino-3-methyl-6-(N-ethyl-p-toluidinyl)fluoran, 3,6-dimethoxyfluoran, 3-(N,N-diethylamino)-5-methyl-7-(N,N-dibenzylamino)fluoran, 3-(N-cyclohexyl-N-methylamino)-6-(N-methylamino)-2-nitro-3-methyl-6-(N-ethyl-p-toluidinyl)fluoran, -methyl-7-anilinofluoran, 3-(N,N-diethylamino)-6-methyl-7-anilinofluoran, 3-(N,N-diethylamino)-6-methyl-7-dimethylanilinofluoran, 3-(N,N-diethylamino)-6-methyl-7-chlorofluoran, 3-(N,N-diethylamino)-6-methoxy-7-aminofluoran, 3-(N,N-diethylamino)-7-(4-chloroanilino)fluoran, 3-(N,N-diethylamino)-7-chlorofluoran, 3-( N,N-diethylamino)-7-benzylaminofluoran, 3-(N,N-diethylamino)-7,8-benzofluoran, 3-(N,N-dibutylamino)-6-methyl-7-anilinofluoran, 3-(N,N-dibutylamino)-6-methyl-7-dimethylanilinofluoran, 3-hydropyridyl-6-methyl-7-anilinofluoran, 3-pyrrolidinyl-6-methyl-7-anilinofluoran, 3,3-bis(1-ethyl-2-methylindol-3-yl)phthalide, 3,3-bis( 1-n-butyl-2-methylindol-3-yl)phthalide, 3,3-bis(p-dimethylaminophenyl)-6-dimethylaminophthalide, 3-(4-diethylamino-2-ethoxyphenyl)-3-(1-ethyl-2-methylindol-3-yl)-4-azaphthalide, 3-(4-diethylaminophenyl)-3-(1-ethyl-2-methylindol-3-yl)phthalide, and 3',6'-bis(diphenylamino)spiroisobenzofuran-1(3H),9'-[9H]xanthen-3-one.

[0290] From the viewpoint of visibility of the exposed and non-exposed areas, and pattern visibility and resolution after development, the dye N is preferably a dye whose maximum absorption wavelength changes due to radicals, and more preferably a dye that develops color due to radicals.

[0291] As the pigment N, leuco crystal violet, crystal violet lactone, brilliant green or Victoria pure blue-alkylnaphthalenesulfonate is preferred.

[0292] The dye N may be used alone or in combination of two or more.

[0293] From the viewpoint of visibility of the exposed and non-exposed portions, and visibility and resolution of the pattern after development, the content of the pigment N is preferably 0.1% by mass or more, more preferably 0.1% by mass to 10% by mass, further preferably 0.1% by mass to 5% by mass, and particularly preferably 0.1% by mass to 1% by mass, relative to the total mass of the photosensitive resin layer.

[0294] The content of the dye N represents the content of the dye when all the dye N contained in the photosensitive resin layer is in a colored state. Hereinafter, a method for quantifying the content of the dye N will be described using a dye that develops color by radicals as an example.

[0295] Solutions were prepared by dissolving 0.001 g and 0.01 g of the pigment in 100 mL of methyl ethyl ketone. Irgacure OXE01 (trade name, BASF Japan Ltd.), a photoradical polymerization initiator, was added to each solution, and irradiated with 365 nm light to generate radicals, causing all the pigments to develop color.

[0296] Then, the absorbance of each solution at a liquid temperature of 25° C. was measured using a spectrophotometer (UV3100, manufactured by Shimadzu Corporation) under an air atmosphere to create a calibration curve.

[0297] Next, the absorbance of the solution after the pigment is fully developed is measured using the same method as above, except that 3 g of the photosensitive resin layer is dissolved in methyl ethyl ketone instead of the pigment. The pigment content in the photosensitive resin layer is calculated from the absorbance of the resulting solution containing the photosensitive resin layer using a calibration curve.

[0298] -Surfactants-

[0299] From the viewpoint of thickness uniformity, the photosensitive resin layer preferably contains a surfactant.

[0300] Examples of the surfactant include anionic surfactants, cationic surfactants, nonionic surfactants, and amphoteric surfactants, and nonionic surfactants are preferred.

[0301] Examples of the nonionic surfactant include polyoxyethylene higher alkyl ethers, polyoxyethylene higher alkylphenyl ethers, higher fatty acid diesters of polyoxyethylene glycol, silicone nonionic surfactants, and fluorine-based nonionic surfactants.

[0302] From the viewpoint of achieving better resolution, the photosensitive resin layer preferably contains a fluorinated nonionic surfactant. This is believed to be because the inclusion of a fluorinated nonionic surfactant in the photosensitive resin layer inhibits penetration of the etching solution into the photosensitive resin layer, thereby reducing side etching.

[0303] Examples of commercially available fluorine-based nonionic surfactants include MEGAFACE F-551, F-552, and F-554 (all manufactured by DIC Corporation).

[0304] Examples of commercially available fluorochemical surfactants include MEGAFACE F-171, F-172, F-173, F-176, F-177, F-141, F-142, F-143, F-144, F-437, F-475, F-477, F-479, F-482, F-555-A, F-556, F-557, F-558, F-559, F-560, F-561, F-565, and F-563. 、F-568、F-575、F-780、EXP、MFS-330、MFS-578、MFS-579、MFS-586、MFS-587、R-41、R-41-LM、R-01、R-40、R-40-LM、RS-43、TF-1956、RS-90、R-94、RS-72-K、DS-21(the above are DIC CORPORATION), Fluorad FC430, FC431, FC171 (all manufactured by Sumitomo 3M Limited), Surflon S-382, SC-101, SC-103, SC-104, SC-105, SC-1068, SC-381, SC-383, S-393, KH-40 (all manufactured by AGC Inc.), PolyFox PF636, PF656, PF6320, PF6520, PF7002 (all manufactured by OMNOVA SOLUTIONS INC.), Ftergent 710FL, 710FM, 610FM, 601AD, 601ADH2, 602A, 215M, 245F, 251, 212M, 250, 209F, 222F, 208G, 710LA, 710FS, 730LM, 650AC, 681, 683 (all manufactured by NEOS Co., Ltd.), etc.

[0305] Furthermore, as fluorochemical surfactants, acrylic compounds having a molecular structure with a fluorine-containing functional group, in which the fluorine atoms are volatilized by cleavage of the fluorine-containing functional group upon heating, can also be preferably used. Examples of such fluorochemical surfactants include the MEGAFACE DS series manufactured by DIC Corporation (The Chemical Daily (February 22, 2016), Nikkei Business Daily (February 23, 2016)), such as MEGAFACE DS-21.

[0306] Furthermore, as the fluorine-based surfactant, a polymer of a fluorine atom-containing vinyl ether compound having a fluoroalkyl group or a fluoroalkylene ether group and a hydrophilic vinyl ether compound is also preferably used.

[0307] Furthermore, block polymers can also be used as fluorine-based surfactants.

[0308] Furthermore, as a fluorine-based surfactant, a fluorine-containing polymer compound containing a structural unit derived from a (meth)acrylate compound having a fluorine atom and a structural unit derived from a (meth)acrylate compound having two or more (preferably five or more) alkyleneoxy groups (preferably ethyleneoxy and propyleneoxy) can also be preferably used.

[0309] Furthermore, as the fluorine-based surfactant, a fluorine-containing polymer having a group containing an ethylenically unsaturated bond in a side chain may be used, such as MEGAFACE RS-101, RS-102, RS-718K, and RS-72-K (all manufactured by DIC Corporation).

[0310] As the fluorine-based surfactant, from the viewpoint of improving environmental compatibility, surfactants derived from alternative materials to compounds having a linear perfluoroalkyl group having 7 or more carbon atoms, such as perfluorooctanoic acid (PFOA) and perfluorooctanesulfonic acid (PFOS), are preferred.

[0311] Examples of the nonionic surfactant include glycerin, trimethylolpropane, trimethylolethane, and ethoxylates and propoxylates thereof (e.g., glycerol propoxylate, glycerol ethoxylate, etc.), polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene octylphenyl ether, polyoxyethylene nonylphenyl ether, polyethylene glycol dilaurate, polyethylene glycol distearate, sorbitan fatty acid esters, Pluronic L10, L31, L61, L62, 10R5, 17R2, and 25R2 (all manufactured by BASF), Tetronic 304, 701, 704, 901, 904, and 150R1 (all manufactured by BASF), Solsperse 20000 (all manufactured by Lubrizol Japan Limited), NCW-101, NCW-1001, and NCW-1002 (all manufactured by FUJIFILM Wako Pure Chemical Corporation), PIONIN D-6112, D-6112-W, D-6315 (all manufactured by Takemoto Oil & Fat Co., Ltd.), OLFINE E1010, Surfynol 104, 400, 440 (all manufactured by Nissin Chemical Industry Co., Ltd.), etc.

[0312] Examples of the silicone surfactant include linear polymers composed of siloxane bonds and modified siloxane polymers having an organic group introduced into a side chain or a terminal.

[0313] Specific examples of silicone surfactants include DOWSIL 8032 ADDITIVE, TORAY SILICONE DC3PA, TORAY SILICONE SH7PA, TORAY SILICONE DC11PA, TORAY SILICONE SH21PA, TORAY SILICONE SH28PA, TORAY SILICONE SH29PA, TORAY SILICONE SH30PA, and TORAY SILICONE SH8400 (all manufactured by Dow Corning Toray Co., Ltd.) and X-22-4952, X-22-4272, X-22-6266, KF-351A, K354L, KF-355A, KF-945, KF-640, KF-642, KF-643, X-22-6191, X-22-4515, KF-6004, KP-341, KF-6001, KF-6002 (all manufactured by Shin-Etsu Silicone Co., Ltd.), F-4440, TSF-4300, TSF-4445, TSF-4460, TSF-4452 (all manufactured by Momentive performance Materials Inc.), BYK307, BYK323, BYK330 (all manufactured by BYK Japan KK), etc.

[0314] As the surfactant, the surfactants described in paragraphs 0120 to 0125 of International Publication No. 2018 / 179640, the surfactants described in paragraph 0017 of Japanese Patent No. 4502784, and the surfactants described in paragraphs 0060 to 0071 of Japanese Patent Application Laid-Open No. 2009-237362 can also be used.

[0315] The photosensitive resin layer may contain one type of surfactant alone, or may contain two or more types of surfactants.

[0316] The content of the surfactant is preferably 0.001% by mass to 10% by mass, more preferably 0.01% by mass to 3% by mass, relative to the total mass of the photosensitive resin layer.

[0317] -additive-

[0318] In addition to the above components, the photosensitive resin layer may contain known additives as needed.

[0319] Examples of additives include radical polymerization inhibitors, sensitizers, plasticizers, heterocyclic compounds, benzotriazoles, carboxybenzotriazoles, resins other than polymer A, and solvents. The photosensitive resin layer may contain one type of each additive alone or two or more types of each additive.

[0320] The photosensitive resin layer may contain a radical polymerization inhibitor.

[0321] Examples of free radical polymerization inhibitors include the thermal polymerization inhibitors described in paragraph 0018 of Japanese Patent No. 4502784. Among these, phenothiazine, phenoxazine, or 4-methoxyphenol are preferred. Other free radical polymerization inhibitors include naphthylamine, cuprous chloride, nitrosophenylhydroxylamine aluminum salt, and diphenylnitrosamine. Nitrosophenylhydroxylamine aluminum salt is preferably used as the free radical polymerization inhibitor to avoid impairing the sensitivity of the photosensitive resin layer.

[0322] Examples of the benzotriazoles include 1,2,3-benzotriazole, 1-chloro-1,2,3-benzotriazole, bis(N-2-ethylhexyl)aminomethylene-1,2,3-benzotriazole, bis(N-2-ethylhexyl)aminomethylene-1,2,3-tolyltriazole, and bis(N-2-hydroxyethyl)aminomethylene-1,2,3-benzotriazole.

[0323] Examples of the carboxybenzotriazoles include 4-carboxy-1,2,3-benzotriazole, 5-carboxy-1,2,3-benzotriazole, N-(N,N-di-2-ethylhexyl)aminomethylenecarboxybenzotriazole, N-(N,N-di-2-hydroxyethyl)aminomethylenecarboxybenzotriazole, and N-(N,N-di-2-ethylhexyl)aminoethylenecarboxybenzotriazole. Examples of the carboxybenzotriazoles include commercially available products such as CBT-1 (trade name of JOHOKU CHEMICAL CO., LTD.).

[0324] The total content of the radical polymerization inhibitor, benzotriazoles, and carboxybenzotriazoles is preferably 0.01% to 3% by mass, more preferably 0.05% to 1% by mass, based on the total mass of the photosensitive resin layer as 100% by mass. From the perspective of imparting storage stability to the photosensitive resin layer, this content is preferably 0.01% by mass or greater. On the other hand, from the perspective of maintaining sensitivity and suppressing dye discoloration, this content is preferably 3% by mass or less.

[0325] The photosensitive resin layer may contain a sensitizer.

[0326] The sensitizer is not particularly limited, and known sensitizers, dyes, and pigments can be used. Examples of the sensitizer include dialkylaminobenzophenone compounds, pyrazoline compounds, anthracene compounds, coumarin compounds, xanthone compounds, thioxanthone compounds, acridone compounds, oxazole compounds, benzoxazole compounds, thiazole compounds, benzothiazole compounds, triazole compounds (e.g., 1,2,4-triazole), stilbene compounds, triazine compounds, thiophene compounds, naphthalimide compounds, triarylamine compounds, and aminoacridine compounds.

[0327] The photosensitive resin layer may contain one type of sensitizer alone, or may contain two or more types of sensitizers.

[0328] When the photosensitive resin layer contains a sensitizer, the content of the sensitizer can be appropriately selected depending on the purpose, but from the viewpoint of improving sensitivity to light sources and improving the curing rate by balancing the polymerization rate and chain transfer, the content is preferably 0.01% by mass to 5% by mass, and more preferably 0.05% by mass to 1% by mass, relative to the total mass of the photosensitive resin layer.

[0329] The photosensitive resin layer may contain at least one selected from a plasticizer and a heterocyclic compound.

[0330] Examples of the plasticizer and heterocyclic compound include compounds described in paragraphs 0097 to 0103 and 0111 to 0118 of International Publication No. 2018 / 179640.

[0331] The photosensitive resin layer may contain a solvent. When the photosensitive resin layer is formed from a photosensitive resin composition containing a solvent, the solvent may remain in the photosensitive resin layer.

[0332] In addition, the photosensitive resin layer may further contain known additives such as metal oxide particles, antioxidants, dispersants, acid multipliers, development accelerators, conductive fibers, thermal radical polymerization initiators, thermal acid generators, ultraviolet absorbers, thickeners, crosslinking agents, and organic or inorganic suspending agents.

[0333] Additives contained in the photosensitive resin layer are described in paragraphs 0165 to 0184 of Japanese Patent Application Laid-Open No. 2014-85643, the contents of which are incorporated into this specification.

[0334] <Physical properties, etc.>

[0335] The thickness of the photosensitive resin layer is preferably 0.1 μm to 300 μm, more preferably 0.2 μm to 100 μm, further preferably 0.5 μm to 50 μm, even more preferably 0.5 μm to 15 μm, particularly preferably 0.5 μm to 10 μm, and most preferably 0.5 μm to 8 μm. This improves the developability of the photosensitive resin layer and thus the resolution.

[0336] Furthermore, in one embodiment, the thickness is preferably 0.5 μm to 5 μm, more preferably 0.5 μm to 4 μm, and even more preferably 0.5 μm to 3 μm.

[0337] Furthermore, from the viewpoint of linearity, the thickness of the photosensitive resin layer is preferably 10 μm or less, more preferably 8 μm or less, further preferably 6 μm or less, and particularly preferably 1 μm or more and 4 μm or less.

[0338] The thickness of each layer of the photosensitive transfer member is measured by observing a cross section perpendicular to the main surface of the photosensitive transfer member using a scanning electron microscope (SEM), measuring the thickness of each layer at 10 or more points on the observed image, and calculating the average value.

[0339] Furthermore, from the viewpoint of achieving better adhesion, the transmittance of the photosensitive resin layer for light at a wavelength of 365 nm is preferably 10% or more, more preferably 30% or more, and even more preferably 50% or more. The upper limit is not particularly limited, but is preferably 99.9% or less.

[0340] <Formation method>

[0341] The method for forming the photosensitive resin layer is not particularly limited as long as it is a method that can form a layer containing the above-mentioned components.

[0342] Examples of a method for forming the photosensitive resin layer include a method of preparing a photosensitive resin composition containing a binder polymer, a polymerizable compound, a solvent, etc., applying the photosensitive resin composition on a surface of a temporary support, etc., and drying the coating of the photosensitive resin composition.

[0343] Examples of the photosensitive resin composition for forming the photosensitive resin layer include a composition containing a binder polymer, a polymerizable compound, the above-mentioned optional components, and a solvent.

[0344] The photosensitive resin composition preferably contains a solvent in order to adjust the viscosity of the photosensitive resin composition and to facilitate formation of the photosensitive resin layer.

[0345] (Solvent)

[0346] The solvent contained in the photosensitive resin composition is not particularly limited as long as it can dissolve or disperse the binder polymer, the polymerizable compound, and the above-mentioned optional components, and a known solvent can be used.

[0347] Examples of the solvent include alkylene glycol ether solvents, alkylene glycol ether acetate solvents, alcohol solvents (methanol, ethanol, etc.), ketone solvents (acetone, methyl ethyl ketone, etc.), aromatic hydrocarbon solvents (toluene, etc.), aprotic polar solvents (N,N-dimethylformamide, etc.), cyclic ether solvents (tetrahydrofuran, etc.), ester solvents, amide solvents, lactone solvents, and mixed solvents containing two or more of these solvents.

[0348] When producing a photosensitive transfer member comprising a temporary support, a thermoplastic resin layer, an intermediate layer, and a photosensitive resin layer, the photosensitive resin composition preferably contains at least one solvent selected from an alkylene glycol ether solvent and an alkylene glycol ether acetate solvent. Among these, a mixed solvent containing at least one solvent selected from an alkylene glycol ether solvent and an alkylene glycol ether acetate solvent and at least one solvent selected from a ketone solvent and a cyclic ether solvent is more preferred. A mixed solvent containing at least one solvent selected from an alkylene glycol ether solvent and an alkylene glycol ether acetate solvent, a ketone solvent, and a cyclic ether solvent is even more preferred.

[0349] Examples of the alkylene glycol ether solvent include ethylene glycol monoalkyl ether, ethylene glycol dialkyl ether, propylene glycol monoalkyl ether, propylene glycol dialkyl ether, diethylene glycol dialkyl ether, dipropylene glycol monoalkyl ether, and dipropylene glycol dialkyl ether.

[0350] Examples of the alkylene glycol ether acetate solvent include ethylene glycol monoalkyl ether acetate, propylene glycol monoalkyl ether acetate, diethylene glycol monoalkyl ether acetate, and dipropylene glycol monoalkyl ether acetate.

[0351] As the solvent, the solvents described in paragraphs 0092 to 0094 of International Publication No. 2018 / 179640 and the solvents described in paragraph 0014 of Japanese Patent Application Laid-Open No. 2018-177889 can be used, and the contents thereof are incorporated into this specification.

[0352] The photosensitive resin composition may contain one type of solvent alone, or may contain two or more types of solvents.

[0353] The content of the solvent when applying the photosensitive resin composition is preferably 50 to 1,900 parts by mass, more preferably 100 to 900 parts by mass, based on 100 parts by mass of the total solid content in the photosensitive resin composition.

[0354] The method for preparing the photosensitive resin composition is not particularly limited. For example, a method for preparing the photosensitive resin composition may include preparing a solution in advance by dissolving the components in the above-mentioned solvent and mixing the solution in a predetermined ratio.

[0355] The photosensitive resin composition is preferably filtered using a filter having a pore size of 0.2 μm to 30 μm before forming the photosensitive resin layer.

[0356] The method for applying the photosensitive resin composition is not particularly limited, and the composition can be applied by a known method. Examples of the coating method include slit coating, spin coating, curtain coating, and spray coating.

[0357] Furthermore, the photosensitive resin layer can also be formed by applying a photosensitive resin composition onto a cover film to be described later and then drying the composition.

[0358] [Thermoplastic resin layer]

[0359] The photosensitive transfer member may include a thermoplastic resin layer.

[0360] The photosensitive transfer member preferably includes a thermoplastic resin layer between the temporary support and the photosensitive resin layer. This is because the presence of the thermoplastic resin layer between the temporary support and the photosensitive resin layer improves the photosensitive transfer member's ability to follow the substrate during the lamination process, inhibits the intrusion of bubbles between the substrate and the photosensitive transfer member, and improves adhesion to adjacent layers (e.g., the temporary support).

[0361] <Ingredients>

[0362] (Alkali-soluble resin)

[0363] The thermoplastic resin layer contains an alkali-soluble resin as the thermoplastic resin.

[0364] In this specification, the term "alkali-soluble" means that the solubility in 100 g of a 1% by mass aqueous solution of sodium carbonate at 22°C is 0.1 g or more.

[0365] Examples of the alkali-soluble resin include acrylic resins, polystyrene resins, styrene-acrylic acid copolymers, polyurethane resins, polyvinyl alcohol, polyvinyl formal, polyamide resins, polyester resins, polyamide resins, epoxy resins, polyacetal resins, polyhydroxystyrene resins, polyimide resins, polybenzoxazole resins, polysiloxane resins, polyethyleneimine, polyallylamine, and polyalkylene glycol.

[0366] As the alkali-soluble resin, acrylic resin is preferred from the viewpoint of developability and adhesion with adjacent layers.

[0367] Here, the acrylic resin refers to a resin having at least one structural unit selected from the group consisting of a structural unit derived from (meth)acrylic acid, a structural unit derived from (meth)acrylate, and a structural unit derived from (meth)acrylamide.

[0368] As for the acrylic resin, the total content of the structural unit derived from (meth)acrylic acid, the structural unit derived from (meth)acrylate, and the structural unit derived from (meth)acrylamide is preferably 50% by mass or more based on the total mass of the acrylic resin.

[0369] The total content of the structural units derived from (meth)acrylic acid and the structural units derived from (meth)acrylate is preferably 30 to 100% by mass, more preferably 50 to 100% by mass, based on the total mass of the acrylic resin.

[0370] Furthermore, the alkali-soluble resin is preferably a polymer having an acid group.

[0371] Examples of the acid group include a carboxyl group, a sulfo group, a phosphate group, and a phosphonate group, and a carboxyl group is preferred.

[0372] From the viewpoint of developability, the alkali-soluble resin is more preferably an alkali-soluble resin having an acid value of 60 mgKOH / g or more, and even more preferably a carboxyl group-containing acrylic resin having an acid value of 60 mgKOH / g or more.

[0373] The upper limit of the acid value of the alkali-soluble resin is not particularly limited, but is preferably 200 mgKOH / g or less, and more preferably 150 mgKOH / g or less.

[0374] The carboxyl group-containing acrylic resin having an acid value of 60 mgKOH / g or more is not particularly limited, and can be appropriately selected from known resins for use.

[0375] For example, the alkali-soluble resin as a carboxyl group-containing acrylic resin having an acid value of 60 mgKOH / g or more among the polymers described in paragraph 0025 of JP-A-2011-95716, the carboxyl group-containing acrylic resin having an acid value of 60 mgKOH / g or more among the polymers described in paragraphs 0033 to 0052 of JP-A-2010-237589, and the carboxyl group-containing acrylic resin having an acid value of 60 mgKOH / g or more among the binder polymers described in paragraphs 0053 to 0068 of JP-A-2016-224162 can be mentioned.

[0376] The copolymerization ratio of the structural unit having a carboxyl group in the carboxyl group-containing acrylic resin is preferably 5 to 50% by mass, more preferably 10 to 40% by mass, and even more preferably 12 to 30% by mass, relative to the total mass of the acrylic resin.

[0377] As the alkali-soluble resin, an acrylic resin having a structural unit derived from (meth)acrylic acid is particularly preferred from the viewpoint of developability and adhesion with adjacent layers.

[0378] The alkali-soluble resin may have a reactive group. The reactive group may be any group capable of undergoing addition polymerization, and examples thereof include ethylenically unsaturated groups; condensation-polymerizable groups such as hydroxyl and carboxyl groups; and addition-polymerizable groups such as epoxy groups and (blocked) isocyanate groups.

[0379] The weight average molecular weight (Mw) of the alkali-soluble resin is preferably 1,000 or more, more preferably 10,000 to 100,000, and even more preferably 20,000 to 50,000.

[0380] The thermoplastic resin layer may contain one kind of alkali-soluble resin alone, or may contain two or more kinds of alkali-soluble resins.

[0381] From the viewpoint of developability and adhesion with adjacent layers, the content of the alkali-soluble resin is preferably 10% by mass to 99% by mass, more preferably 20% by mass to 90% by mass, further preferably 40% by mass to 80% by mass, and particularly preferably 50% by mass to 70% by mass, relative to the total mass of the thermoplastic resin layer.

[0382] (pigment)

[0383] The thermoplastic resin layer preferably contains a pigment (also referred to as "pigment B") having a maximum absorption wavelength of 450 nm or longer in the wavelength range of 400 nm to 780 nm during color development and whose maximum absorption wavelength changes due to acid, base, or radicals.

[0384] Preferred aspects of the dye B are the same as preferred aspects of the dye N except for the points described below.

[0385] From the viewpoint of visibility and resolution of the exposed and non-exposed areas, the dye B is preferably a dye whose maximum absorption wavelength changes due to acid or radicals, and more preferably a dye whose maximum absorption wavelength changes due to acid.

[0386] From the viewpoint of visibility and resolution of the exposed and non-exposed areas, the thermoplastic resin layer preferably contains, as the dye B, both a dye whose maximum absorption wavelength is changed by acid and a compound that generates acid by light, as described later.

[0387] The pigment B may be used alone or in combination of two or more.

[0388] From the viewpoint of visibility of the exposed and non-exposed areas, the content of the dye B is preferably 0.2% by mass or more, more preferably 0.2% by mass to 6% by mass, further preferably 0.2% by mass to 5% by mass, and particularly preferably 0.25% by mass to 3.0% by mass, relative to the total mass of the thermoplastic resin layer.

[0389] Here, the content of the pigment B refers to the content of the pigment when all the pigment B contained in the thermoplastic resin layer is in a colored state. The quantitative method of the content of the pigment B is described below using a pigment that develops color by radicals as an example.

[0390] Solutions were prepared by dissolving 0.001 g and 0.01 g of the pigment in 100 mL of methyl ethyl ketone. Irgacure OXE01 (trade name, BASF Japan Ltd.), a photoradical polymerization initiator, was added to each resulting solution, and free radicals were generated by irradiation with 365 nm light, thereby rendering all the pigments color-developed. The absorbance of each solution at a liquid temperature of 25° C. was then measured using a spectrophotometer (UV3100, manufactured by SHIMADZU CORPORATION) under atmospheric pressure to create a calibration curve.

[0391] Next, 0.1 g of the thermoplastic resin layer was dissolved in methyl ethyl ketone in place of the pigment. The absorbance of the solution after the pigment had fully developed was measured using the same method as above. The amount of pigment contained in the thermoplastic resin layer was calculated from the absorbance of the resulting solution containing the thermoplastic resin layer using a calibration curve.

[0392] (a compound that generates acids, bases, or free radicals using light)

[0393] The thermoplastic resin layer may contain a compound that generates an acid, a base, or a radical by light (also referred to simply as "compound C").

[0394] As the compound C, a compound that generates an acid, a base, or a radical upon receiving activating light such as ultraviolet light and visible light is preferred.

[0395] Known photoacid generators, photobase generators, and photoradical polymerization initiators (photoradical generators) can be used as compound C. Among them, photoacid generators are preferred.

[0396] -Photoacid generator-

[0397] From the viewpoint of resolution, the thermoplastic resin layer preferably contains a photoacid generator.

[0398] Examples of the photoacid generator include the photocationic polymerization initiator that may be contained in the above-mentioned photosensitive resin layer, and preferred embodiments thereof are the same except for the points described below.

[0399] The photoacid generator preferably contains at least one compound selected from an onium salt compound and an oxime sulfonate compound from the viewpoints of sensitivity and resolution, and more preferably contains an oxime sulfonate compound from the viewpoints of sensitivity, resolution, and adhesion.

[0400] Furthermore, as the photoacid generator, a photoacid generator having the following structure is also preferred.

[0401] [Chemical Formula 2]

[0402]

[0403] -Photoradical polymerization initiator-

[0404] The thermoplastic resin layer may contain a photoradical polymerization initiator (photoradical generator).

[0405] Examples of the photoradical polymerization initiator include the photoradical polymerization initiators that may be contained in the above-mentioned photosensitive resin layer, and preferred embodiments are also the same.

[0406] -Photobase Generator-

[0407] The thermoplastic resin layer may contain a photobase generator.

[0408] The photobase generator is not particularly limited as long as it is a known photobase generator, and examples thereof include 2-nitrobenzylcyclohexylcarbamate, triphenylmethanol, o-carbamoylhydroxyamide, o-carbamoyloxime, [[(2,6-dinitrobenzyl)oxy]carbonyl]cyclohexylamine, bis[[(2-nitrobenzyl)oxy]carbonyl]hexane-1,6-diamine, 4-(methylthiobenzoyl)-1-methyl-1-morpholinoethane, (4-morpholinobenzoyl)- 1-Benzyl-1-dimethylaminopropane, N-(2-nitrobenzyloxycarbonyl)pyrrolidine, hexaamminecobalt(III) tris(triphenylmethyl borate), 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)butanone, 2,6-dimethyl-3,5-diacetyl-4-(2-nitrophenyl)-1,4-dihydropyridine, and 2,6-dimethyl-3,5-diacetyl-4-(2,4-dinitrophenyl)-1,4-dihydropyridine.

[0409] The thermoplastic resin layer may contain one type of compound C alone, or may contain two or more types of compounds C.

[0410] From the viewpoint of visibility and resolution of the exposed and non-exposed areas, the content of the compound C is preferably 0.1 to 10% by mass, more preferably 0.5 to 5% by mass, based on the total mass of the thermoplastic resin layer.

[0411] (Plasticizer)

[0412] From the viewpoints of resolution, adhesion with adjacent layers, and developability, the thermoplastic resin layer preferably contains a plasticizer.

[0413] The plasticizer preferably has a molecular weight smaller than that of the alkali-soluble resin (in the case of an oligomer or a polymer, the weight average molecular weight (Mw)). The molecular weight (weight average molecular weight (Mw)) of the plasticizer is preferably 200 to 2,000.

[0414] The plasticizer is not particularly limited as long as it is a compound that is compatible with the alkali-soluble resin and exhibits plasticity. However, from the perspective of imparting plasticity, the plasticizer preferably has an alkyleneoxy group in the molecule, and is more preferably a polyalkylene glycol compound. The alkyleneoxy group contained in the plasticizer more preferably has a polyethyleneoxy structure or a polypropyleneoxy structure.

[0415] Furthermore, from the viewpoints of resolution and storage stability, the plasticizer preferably contains a (meth)acrylate compound. From the viewpoints of compatibility, resolution, and adhesion with adjacent layers, it is more preferable that the alkali-soluble resin is an acrylic resin and the plasticizer contains a (meth)acrylate compound.

[0416] Examples of the (meth)acrylate compound used as the plasticizer include the (meth)acrylate compounds described as the polymerizable compounds contained in the above-mentioned photosensitive resin layer.

[0417] In a photosensitive transfer member, when a thermoplastic resin layer and a photosensitive resin layer are laminated in direct contact, it is preferred that both the thermoplastic resin layer and the photosensitive resin layer contain the same (meth)acrylate compound. This is because when the thermoplastic resin layer and the photosensitive resin layer contain the same (meth)acrylate compound, diffusion of components between the layers is suppressed, thereby improving storage stability.

[0418] When the thermoplastic resin layer contains a (meth)acrylate compound as a plasticizer, it is preferred that the (meth)acrylate compound does not polymerize in the exposed portion after exposure from the viewpoint of adhesion with the adjacent layer.

[0419] Furthermore, the (meth)acrylate compound used as the plasticizer is preferably a polyfunctional (meth)acrylate compound having two or more (meth)acryloyl groups in one molecule from the viewpoints of resolution, adhesion to adjacent layers, and developability.

[0420] Furthermore, as the (meth)acrylate compound used as the plasticizer, a (meth)acrylate compound or a urethane (meth)acrylate compound having an acid group is also preferred.

[0421] The thermoplastic resin layer may contain one type of plasticizer alone, or may contain two or more types of plasticizers.

[0422] From the viewpoints of resolution, adhesion to adjacent layers, and developability, the content of the plasticizer is preferably 1 to 70% by mass, more preferably 10 to 60% by mass, and particularly preferably 20 to 50% by mass, relative to the total mass of the thermoplastic resin layer.

[0423] (Surfactant)

[0424] From the viewpoint of thickness uniformity, the thermoplastic resin layer preferably contains a surfactant.

[0425] Examples of the surfactant include the surfactants that may be contained in the above-mentioned photosensitive resin layer, and preferred embodiments are also the same.

[0426] The thermoplastic resin layer may contain one type of surfactant alone, or may contain two or more types of surfactants.

[0427] The content of the surfactant is preferably 0.001% by mass to 10% by mass, more preferably 0.01% by mass to 3% by mass, relative to the total mass of the thermoplastic resin layer.

[0428] (Sensitizer)

[0429] The thermoplastic resin layer may contain a sensitizer.

[0430] The sensitizer is not particularly limited, and examples thereof include the sensitizers that can be contained in the above-mentioned photosensitive resin layer.

[0431] The thermoplastic resin layer may contain one type of sensitizer alone, or may contain two or more types of sensitizers.

[0432] The content of the sensitizer can be appropriately selected depending on the purpose, but from the viewpoint of improving sensitivity to the light source and visibility of the exposed and non-exposed areas, it is preferably in the range of 0.01% by mass to 5% by mass, more preferably in the range of 0.05% by mass to 1% by mass, relative to the total mass of the thermoplastic resin layer.

[0433] (Additives, etc.)

[0434] In addition to the above-mentioned components, the thermoplastic resin layer may contain known additives as needed.

[0435] The thermoplastic resin layer is described in paragraphs 0189 to 0193 of Japanese Patent Application Laid-Open No. 2014-85643, and the contents described in this publication are incorporated into this specification.

[0436] <Physical properties, etc.>

[0437] The thickness of the thermoplastic resin layer is not particularly limited, but from the perspective of adhesion with adjacent layers, it is preferably 1 μm or more, more preferably 2 μm or more. The upper limit is not particularly limited, but from the perspective of developability and resolution, it is preferably 20 μm or less, more preferably 10 μm or less, and even more preferably 5 μm or less.

[0438] <Formation method>

[0439] The method for forming the thermoplastic resin layer is not particularly limited as long as it is a method that can form a layer containing the above-mentioned components.

[0440] Examples of a method for forming the thermoplastic resin layer include a method of preparing a thermoplastic resin composition containing the above-mentioned components and a solvent, applying the thermoplastic resin composition on a surface of a temporary support, and drying the coating of the thermoplastic resin composition.

[0441] The thermoplastic resin composition preferably contains a solvent in order to adjust the viscosity of the thermoplastic resin composition and facilitate formation of the thermoplastic resin layer.

[0442] (Solvent)

[0443] The solvent contained in the thermoplastic resin composition is not particularly limited as long as it can dissolve or disperse the above-mentioned components contained in the thermoplastic resin layer.

[0444] Examples of the solvent contained in the thermoplastic resin composition include the solvents that may be contained in the above-mentioned photosensitive resin composition, and preferred embodiments are also the same.

[0445] The solvent contained in the thermoplastic resin composition may be a single type or two or more types.

[0446] The content of the solvent when applying the thermoplastic resin composition is preferably 50 to 1,900 parts by mass, more preferably 100 to 900 parts by mass, based on 100 parts by mass of the total solid content in the thermoplastic resin composition.

[0447] The preparation of the thermoplastic resin composition and the formation of the thermoplastic resin layer can be carried out according to the above-mentioned method for preparing the photosensitive resin composition and the method for forming the photosensitive resin layer.

[0448] For example, a solution of each component contained in the thermoplastic resin layer dissolved in the above-mentioned solvent is prepared in advance, and the obtained solution is mixed in a predetermined ratio to prepare a thermoplastic resin composition. The obtained thermoplastic resin composition is then applied to the surface of a temporary support, and the coating film of the thermoplastic resin composition is dried to form the thermoplastic resin layer.

[0449] Furthermore, after forming a photosensitive resin layer and an intermediate layer on a cover film described later, a thermoplastic resin layer may be formed on the surface of the intermediate layer.

[0450] Middle layer

[0451] The photosensitive transfer member preferably includes an intermediate layer between the thermoplastic resin layer and the photosensitive resin layer. The intermediate layer can suppress mixing of components during coating of multiple layers and during storage after coating.

[0452] From the viewpoint of developability and suppression of mixing of components during coating of multiple layers and during storage after coating, the intermediate layer is preferably a water-soluble layer.

[0453] In this specification, "water-soluble" means that the solubility in 100 g of water with a pH of 7.0 and a liquid temperature of 22°C is 0.1 g or more.

[0454] The intermediate layer may be an oxygen barrier layer having an oxygen barrier function, which is described as a "separation layer" in Japanese Patent Application Laid-Open No. 5-72724. An oxygen barrier layer is preferred because it improves sensitivity during exposure, reduces the time load on the exposure machine, and improves productivity.

[0455] The oxygen barrier layer used as the intermediate layer can be appropriately selected from known layers described in the aforementioned publications, etc. Among them, an oxygen barrier layer exhibiting relatively low oxygen permeability and dispersible or soluble in water or an alkaline aqueous solution (a 1 mass % aqueous solution of sodium carbonate at 22° C.) is preferred.

[0456] The intermediate layer preferably contains a resin.

[0457] Examples of the resin contained in the intermediate layer include polyvinyl alcohol resins, polyvinyl pyrrolidone resins, cellulose resins, acrylamide resins, polyethylene oxide resins, gelatin, vinyl ether resins, polyamide resins, and copolymers thereof.

[0458] As the resin contained in the intermediate layer, a water-soluble resin is preferable.

[0459] Furthermore, from the viewpoint of suppressing mixing of components between multiple layers, the resin contained in the intermediate layer is preferably different from both the polymer A contained in the photosensitive resin layer and the thermoplastic resin (alkali-soluble resin) contained in the thermoplastic resin layer.

[0460] From the viewpoint of oxygen barrier properties and suppression of mixing of components during coating of multiple layers and storage after coating, the intermediate layer preferably contains polyvinyl alcohol, and more preferably contains both polyvinyl alcohol and polyvinyl pyrrolidone.

[0461] The intermediate layer may contain one kind of the above resins alone, or may contain two or more kinds of the above resins.

[0462] The content of the resin in the intermediate layer is not particularly limited, but from the viewpoint of oxygen barrier properties and suppression of mixing of components during coating of multiple layers and storage after coating, it is preferably 50% by mass to 100% by mass relative to the total mass of the intermediate layer, more preferably 70% by mass to 100% by mass, further preferably 80% by mass to 100% by mass, and particularly preferably 90% by mass to 100% by mass.

[0463] Furthermore, the intermediate layer may contain additives such as a surfactant as needed.

[0464] The thickness of the intermediate layer is not particularly limited, but is preferably 0.1 μm to 5 μm, more preferably 0.5 μm to 3 μm.

[0465] This is because if the thickness of the intermediate layer is within the above range, mixing of components during multi-layer coating and storage after coating can be suppressed without reducing oxygen barrier properties, and an increase in the time required to remove the intermediate layer during development can be suppressed.

[0466] The method for forming the intermediate layer is not particularly limited. For example, the intermediate layer may be formed by preparing an intermediate layer composition containing the above-mentioned resin and any additives, applying the intermediate layer composition on the surface of the thermoplastic resin layer or the photosensitive resin layer, and drying the coating film of the intermediate layer composition.

[0467] In order to adjust the viscosity of the intermediate layer composition to facilitate the formation of the intermediate layer, the intermediate layer composition preferably contains a solvent.

[0468] The solvent contained in the intermediate layer composition is not particularly limited as long as it can dissolve or disperse the above-mentioned resin. It is preferably at least one selected from water and a water-miscible organic solvent, and more preferably water or a mixed solvent of water and a water-miscible organic solvent.

[0469] Examples of the water-miscible organic solvent include alcohols having 1 to 3 carbon atoms, acetone, ethylene glycol, and glycerin. Alcohols having 1 to 3 carbon atoms are preferred, and methanol or ethanol is more preferred.

[0470] [Covering film]

[0471] The photosensitive transfer member preferably includes a cover film in contact with the surface of the photosensitive resin layer that does not face the temporary support.

[0472] Hereinafter, in this specification, the surface of the photosensitive resin layer facing the temporary support is also referred to as the "first surface", and the surface opposite to the first surface is also referred to as the "second surface".

[0473] Examples of the material constituting the cover film include resin films and paper. From the viewpoint of strength and flexibility, resin films are preferred.

[0474] Examples of the resin film include polyethylene films, polypropylene films, polyethylene terephthalate films, cellulose triacetate films, polystyrene films, and polycarbonate films. Among these, polyethylene films, polypropylene films, and polyethylene terephthalate films are preferred.

[0475] The thickness (layer thickness) of the cover film is not particularly limited, but is preferably 5 μm to 100 μm, more preferably 10 to 50 μm.

[0476] Furthermore, from the perspective of achieving even better resolution, the arithmetic mean roughness Ra value of the surface of the cover film that contacts the photosensitive resin layer (hereinafter referred to as the "surface of the cover film") is preferably 0.3 μm or less, more preferably 0.1 μm or less, and even more preferably 0.05 μm or less. This is believed to be because a Ra value of the cover film surface within the above range improves the uniformity of the thickness of the photosensitive resin layer and the resulting resin pattern.

[0477] The lower limit of the Ra value of the surface of the cover film is not particularly limited, but is preferably 0.001 μm or more.

[0478] The Ra value of the surface of the coating film is measured by the following method.

[0479] The surface profile of the cover film was obtained by measuring the surface of the cover film using a three-dimensional optical profiler (New View 7300, manufactured by Zygo Corporation) under the following conditions.

[0480] The measurement / analysis software used was the Microscope Application of MetroPro ver8.3.2. Next, the Surface Map screen was displayed using the analysis software, and histogram data was obtained from the Surface Map screen. The arithmetic mean roughness was calculated from the obtained histogram data to obtain the Ra value of the coating surface.

[0481] When the cover film is attached to the photosensitive transfer member, the cover film may be peeled off from the photosensitive transfer member, and the Ra value of the surface on the peeled side may be measured.

[0482] The photosensitive transfer member may include layers other than the above-mentioned layers (hereinafter also referred to as "other layers"). Examples of the other layers include contrast enhancement layers.

[0483] The contrast enhancement layer is described in paragraph 0134 of International Publication No. 2018 / 179640. Furthermore, other layers are described in paragraphs 0194 to 0196 of Japanese Patent Application Laid-Open No. 2014-85643. The contents of these publications are incorporated into this specification.

[0484] From the viewpoint of further exerting the effects of the present invention, the total thickness of each layer of the photosensitive transfer member excluding the temporary support and the cover film is preferably 20 μm or less, more preferably 10 μm or less, further preferably 8 μm or less, and particularly preferably 2 μm or more and 8 μm or less.

[0485] Furthermore, from the viewpoint of further exerting the effects of the present invention, the total thickness of the photosensitive resin layer, the intermediate layer, and the thermoplastic resin layer in the photosensitive transfer member is preferably 20 μm or less, more preferably 10 μm or less, further preferably 8 μm or less, and particularly preferably 2 μm or more and 8 μm or less.

[0486] [Method for manufacturing photosensitive transfer member]

[0487] The method for producing the photosensitive transfer member used in the present invention is not particularly limited, and a known production method, for example, a known method for forming each layer, can be used.

[0488] Below, reference Figure 2 The method for producing the photosensitive transfer member used in the present invention will be described. However, the photosensitive transfer member used in the present invention is not limited to the one having Figure 2 The photosensitive transfer member has the structure shown.

[0489] Figure 2 This is a schematic diagram showing an example of the structure of the photosensitive transfer member used in the present invention. Figure 2 The photosensitive transfer member 100 shown has a structure in which a temporary support 10 , a thermoplastic resin layer 12 , an intermediate layer 14 , a photosensitive resin layer 16 , and a cover film 18 are stacked in this order.

[0490] As a method for manufacturing the above-mentioned photosensitive transfer member 100, for example, there can be mentioned a method including the following steps: a step of coating a thermoplastic resin composition on the surface of a temporary support 10 and then drying the coating film of the thermoplastic resin composition to thereby form a thermoplastic resin layer 12; a step of coating an intermediate layer composition on the surface of the thermoplastic resin layer 12 and then drying the coating film of the intermediate layer composition to thereby form an intermediate layer 14; and a step of coating a photosensitive resin composition containing a binder polymer and a polymerizable compound on the surface of the intermediate layer 14 and then drying the coating film of the photosensitive resin composition to thereby form a photosensitive resin layer 16.

[0491] In the above-described production method, it is preferred to use a thermoplastic resin composition containing at least one selected from an alkylene glycol ether solvent and an alkylene glycol ether acetate solvent, an interlayer composition containing at least one selected from water and a water-miscible organic solvent, and a photosensitive resin composition containing a binder polymer, a polymerizable compound, and at least one selected from an alkylene glycol ether solvent and an alkylene glycol ether acetate solvent. This prevents mixing of components contained in thermoplastic resin layer 12 with components contained in interlayer 14 during application of the interlayer composition to the surface of thermoplastic resin layer 12 and / or during storage of a laminate having a coating film of the interlayer composition. Furthermore, mixing of components contained in interlayer 14 with components contained in photosensitive resin layer 16 during application of the photosensitive resin composition to the surface of interlayer 14 and / or during storage of a laminate having a coating film of the photosensitive resin composition can be prevented.

[0492] The photosensitive transfer member 100 is manufactured by press-bonding the cover film 18 onto the photosensitive resin layer 16 of the laminated body manufactured by the above-described manufacturing method.

[0493] As a method for manufacturing the photosensitive transfer member used in the present invention, it is preferred to manufacture the photosensitive transfer member 100 including the temporary support 10, the thermoplastic resin layer 12, the intermediate layer 14, the photosensitive resin layer 16 and the cover film 18 through a step including providing the cover film 18 so as to be in contact with the second surface of the photosensitive resin layer 16.

[0494] After the photosensitive transfer member 100 is manufactured by the above-described manufacturing method, a roll-shaped photosensitive transfer member can be produced and stored by winding the photosensitive transfer member 100. The roll-shaped photosensitive transfer member can be directly provided to the step of laminating the roll-to-roll member to the substrate described later.

[0495] [Method for manufacturing circuit wiring]

[0496] The method for producing a circuit wiring according to the present invention is not particularly limited as long as it includes the method for producing a resin pattern according to the present invention.

[0497] As a method for manufacturing circuit wiring, a method is preferably provided that includes the following steps, namely, a step of etching the conductive layer in an area where the resin pattern is not arranged in a laminate having a conductive layer on a surface of the substrate on the side where the resin pattern is formed and resin patterns manufactured by the method for manufacturing the resin pattern involved in the present invention are stacked in this order (hereinafter also referred to as the "etching step"). It is more preferred to use a resin pattern manufactured by a manufacturing method including the above-mentioned bonding step, the above-mentioned exposure step and the above-mentioned development step.

[0498] Hereinafter, each step included in the method for producing a circuit wiring will be described. However, unless otherwise specified, the contents described for each step included in the method for producing a resin pattern also apply to each step included in the method for producing a circuit wiring.

[0499] Etching process

[0500] The method for manufacturing a circuit wiring preferably includes a step (etching step) of etching the conductive layer in an area where the resin pattern is not disposed in a laminated body in which a substrate, a conductive layer, and a resin pattern (more preferably, a resin pattern produced by the production method including the lamination step, the exposure step, and the development step) are sequentially laminated. Specifically, "etching the conductive layer in an area where the resin pattern is not disposed" means etching the conductive layer to remove a portion of the conductive layer where the resin pattern is not disposed.

[0501] In the etching step, the conductive layer is etched using the resin pattern formed by the photosensitive resin layer as a resist.

[0502] As the etching method, a known method can be applied, for example, the method described in paragraphs 0209 to 0210 of Japanese Patent Application Publication No. 2017-120435, the method described in paragraphs 0048 to 0054 of Japanese Patent Application Publication No. 2010-152155, wet etching by immersion in an etching solution, and dry etching methods such as plasma etching.

[0503] The etching solution used for wet etching can be appropriately selected from acidic or alkaline etching solutions depending on the object to be etched.

[0504] Examples of acidic etching solutions include aqueous solutions of a single acidic component selected from hydrochloric acid, sulfuric acid, nitric acid, acetic acid, hydrofluoric acid, oxalic acid, and phosphoric acid, and mixed aqueous solutions of an acidic component and a salt selected from ferric chloride, ammonium fluoride, and potassium permanganate. The acidic component may also be a combination of multiple acidic components.

[0505] Examples of alkaline etching solutions include aqueous solutions of a single alkali component selected from sodium hydroxide, potassium hydroxide, ammonia, organic amines, and salts of organic amines (e.g., tetramethylammonium hydroxide), and mixed aqueous solutions of an alkali component and a salt (e.g., potassium permanganate). The alkali component may also be a combination of multiple alkali components.

[0506] 〔Removal process〕

[0507] In the method for producing a circuit wiring, it is preferable to perform a step of removing the remaining resin pattern (removal step).

[0508] The removal step is not particularly limited and may be performed as needed, but is preferably performed after the etching step.

[0509] The method for removing the remaining resin pattern is not particularly limited, and a method of removing by chemical treatment is exemplified, and a method of removing using a removing liquid is preferred.

[0510] The photosensitive resin layer can be removed by immersing the substrate having the remaining resin pattern in a stirring removal liquid having a liquid temperature of preferably 30° C. to 80° C., more preferably 50° C. to 80° C., for 1 to 30 minutes.

[0511] Examples of the removal liquid include those obtained by dissolving an inorganic or organic base component in water, dimethyl sulfoxide, N-methylpyrrolidone, or a mixture thereof. Examples of the inorganic base component include sodium hydroxide and potassium hydroxide. Examples of the organic base component include primary amine compounds, secondary amine compounds, tertiary amine compounds, and quaternary ammonium salt compounds.

[0512] Alternatively, removal may be performed using a removal liquid by a known method such as a spraying method, a shower method, or a spin immersion method.

[0513] 〔Other processes〕

[0514] The method for producing a circuit wiring may include any steps (other steps) other than the above steps. For example, the following steps may be mentioned, but the method is not limited to these steps.

[0515] Furthermore, examples of exposure steps, development steps, and other steps applicable to the method for producing circuit wiring include steps described in paragraphs 0035 to 0051 of Japanese Patent Application Laid-Open No. 2006-23696.

[0516] <Process for reducing visible light reflectivity>

[0517] The method for producing a circuit wiring may include a step of performing a treatment to reduce the visible light reflectivity of a part or all of the plurality of conductive layers included in the substrate.

[0518] As a treatment for reducing the visible light reflectance, an oxidation treatment can be mentioned. When the substrate has a conductive layer containing copper, the visible light reflectance of the conductive layer can be reduced by oxidizing the copper to form copper oxide and blackening the conductive layer.

[0519] The treatment for reducing the visible light reflectance is described in paragraphs 0017 to 0025 of Japanese Patent Application Laid-Open No. 2014-150118 and paragraphs 0041, 0042, 0048, and 0058 of Japanese Patent Application Laid-Open No. 2013-206315, the contents of which are incorporated herein by reference.

[0520] <Step of forming an insulating film, step of forming a new conductive layer on the surface of the insulating film>

[0521] The method for producing a circuit wiring preferably further includes the steps of forming an insulating film on the surface of the circuit wiring and forming a new conductive layer on the surface of the insulating film.

[0522] Through the above steps, the second electrode pattern insulated from the first electrode pattern can be formed.

[0523] The step of forming the insulating film is not particularly limited, and a known method of forming a permanent film may be used. Alternatively, an insulating film having a desired pattern may be formed by photolithography using a photosensitive material having insulating properties.

[0524] The step of forming a new conductive layer on the insulating film is not particularly limited. For example, a new conductive layer having a desired pattern can be formed by photolithography using a photosensitive material having conductivity.

[0525] The circuit wiring manufacturing method also preferably uses a substrate having multiple conductive layers on both sides of the substrate, and sequentially or simultaneously forms circuits on the conductive layers formed on both sides of the substrate. This structure enables the formation of touch panel circuit wiring having a first conductive pattern formed on one surface of the substrate and a second conductive pattern formed on the other surface. Furthermore, it is also preferred to form touch panel circuit wiring with this structure on both surfaces of the substrate using a roll-to-roll process.

[0526] [Purpose of circuit wiring]

[0527] The circuit wiring produced by the circuit wiring production method can be applied to various devices. Devices equipped with the circuit wiring produced by the above-mentioned production method include, for example, input devices, preferably touch panels, and more preferably electrostatic capacitive touch panels. Furthermore, the above-mentioned input device can be applied to display devices such as organic EL display devices and liquid crystal display devices.

[0528] [Method for Manufacturing Touch Panel]

[0529] The method for manufacturing a touch panel according to the present invention is not particularly limited as long as it is a method for manufacturing circuit wiring including the method for manufacturing a resin pattern according to the present invention.

[0530] As a method for manufacturing a touch panel, a method preferably includes the following steps, namely, in a laminate in which the substrate has a conductive layer on the surface on the side where the resin pattern is formed, and a resin pattern manufactured using the photosensitive transfer member is laminated in this order, and the conductive layer is etched in an area where the resin pattern is not arranged to form wiring for the touch panel. It is more preferred to use a resin pattern manufactured by a manufacturing method including the above-mentioned lamination step, the above-mentioned exposure step, and the above-mentioned development step.

[0531] The specific aspects of each step in the touch panel manufacturing method and the order of performing each step are as described in the above “Manufacturing method of resin pattern” and “Manufacturing method of circuit wiring”, and the preferred aspects are the same.

[0532] Method for Manufacturing a Touch Panel The touch panel wiring is formed by the above-described method. Other methods can be referred to for manufacturing a touch panel.

[0533] Furthermore, the method for manufacturing a touch panel may include any steps (other steps) other than those described above.

[0534] An example of a pattern of a mask used for manufacturing a touch panel is shown in Figure 3 and Figure 4 .

[0535] exist Figure 3 The pattern A and Figure 4 In the pattern B shown, SL and G are non-image portions (light shielding portions), and DL is a portion showing a virtual alignment frame. In the method for manufacturing a touch panel, for example, the touch panel can be formed by a process having Figure 3 The photosensitive resin layer is exposed to light using a mask having a pattern A shown in FIG. 1 to produce a touch panel having circuit wiring having a pattern A corresponding to SL and G. Specifically, the touch panel can be formed by the method of International Publication No. 2016 / 190405. Figure 1 In one example of the manufactured touch panel, G is a portion where transparent electrodes (touch panel electrodes) are formed, and SL is a portion where wiring of the peripheral lead portion is formed.

[0536] The touch panel manufacturing method can manufacture a touch panel having at least touch panel wiring. The touch panel preferably has a transparent substrate, electrodes, and an insulating layer or a protective layer.

[0537] Examples of detection methods for touch panels include known methods such as a resistive film method, an electrostatic capacitance method, an ultrasonic method, an electromagnetic induction method, and an optical method. Among them, the electrostatic capacitance method is preferred.

[0538] Examples of the types of touch panels include so-called in-cell types (e.g., the types described in FIG. 5 , FIG. 6 , FIG. 7 , and FIG. 8 of Japanese Unexamined Patent Publication No. 2012-517051 ), so-called out-cell types (e.g., the types described in FIG. 19 of Japanese Unexamined Patent Publication No. 2013-168125 , and FIG. 2012-89102 ). Figure 1 5 ), OGS (OneGlass Solution) type, TOL (Touch-on-Lens) type (e.g., Japanese Patent Application Laid-Open No. 2013-54727) Figure 2 ), various plug-in types (so-called GG, G1·G2, GFF, GF2, GF1 and G1F, etc.) and other structures (for example, the type described in Figure 6 of Japanese Patent Gazette No. 2013-164871).

[0539] As an example of a touch panel, the touch panel described in paragraph 0229 of Japanese Patent Application Laid-Open No. 2017-120345 can be cited.

[0540] [Photosensitive transfer unit]

[0541] The photosensitive transfer component involved in the present invention is a photosensitive transfer component having a temporary support body and a photosensitive resin layer, wherein, when a resin pattern A with a pattern width of 6 μm at a position 90% of the maximum height of the above-mentioned substrate is formed on a substrate by the above-mentioned photosensitive transfer component, in a cross-section of the above-mentioned resin pattern A in the width direction, the pattern width of the above-mentioned resin pattern A in the portion in contact with the above-mentioned substrate is greater than 6.2 μm.

[0542] Except for the following, preferred embodiments of the photosensitive transfer member according to the present invention are the same as preferred embodiments of the photosensitive transfer member used in the method for producing a resin pattern according to the present invention.

[0543] In the case where the photosensitive transfer component involved in the present invention has a resin pattern A with a pattern width of 6 μm formed on a substrate at a position 90% of the maximum height of the above-mentioned substrate, from the viewpoint of resolution and linearity, in the cross-section in the width direction of the above-mentioned resin pattern A, the pattern width of the above-mentioned resin pattern A in the portion in contact with the above-mentioned substrate is preferably greater than 6.2 μm and less than 9.0 μm, more preferably greater than 6.2 μm and less than 8.4 μm, further preferably greater than 6.3 μm and less than 8.0 μm, and particularly preferably greater than 6.4 μm and less than 8.0 μm.

[0544] Example

[0545] Below, the embodiment of the present invention is described in more detail by enumerating examples. As long as it does not depart from the gist of the embodiment of the present invention, the materials, usage amounts, ratios, processing contents and processing sequences shown in the following examples can be appropriately changed. Therefore, the scope of the embodiment of the present invention is not limited to the specific examples shown below. In addition, unless otherwise specified, "parts" and "%" are weight references.

[0546] (Examples 1 to 9 and Comparative Examples 1 to 3)

[0547] <Production of Photosensitive Transfer Components>

[0548] -Formation of Thermoplastic Resin Layer-

[0549] A PET film having a thickness of 25 μm was prepared as a temporary support, and the following thermoplastic resin composition was applied onto the surface of the temporary support using a slit nozzle so that the coating width became 1.0 m and the layer thickness after drying became 4.0 μm.

[0550] The formed coating film of the thermoplastic resin composition was dried at 80° C. for 40 seconds to form a thermoplastic resin layer.

[0551] <<Thermoplastic resin composition>>

[0552] The following ingredients were mixed to prepare a thermoplastic resin composition.

[0553] Benzyl methacrylate, methacrylic acid, and acrylic acid copolymer (solid content concentration 30.0%, Mw 30,000, acid value 153 mgKOH / g): 42.85 parts

[0554] NK ESTETR A-DCP (tricyclodecane dimethanol diacrylate, manufactured by Shin-Nakamura Chemical Co., Ltd.): 4.63 parts

[0555] 8UX-015A (polyfunctional urethane acrylate compound, manufactured by TAISEI FINE CHEMICAL CO., LTD.): 2.31 parts

[0556] ARONIX TO-2349 (a multifunctional acrylate compound having a carboxyl group, manufactured by TOAGOSEI CO., LTD.): 0.77 parts

[0557] Compound having the structure shown below (photoacid generator, compound synthesized according to the method described in paragraph 0227 of JP-A-2013-47765): 0.32 parts

[0558] [Chemical Formula 3]

[0559]

[0560] · Compound of the structure shown below (acid-induced coloring): 0.08 parts

[0561] [Chemical Formula 4]

[0562]

[0563] E-1 (MEGAFACE F552 (manufactured by DIC Corporation)): 0.03 parts

[0564] MEK (methyl ethyl ketone, manufactured by SANKYO CHEMICAL Co., Ltd.): 39.50 parts

[0565] PGMEA (propylene glycol monomethyl ether acetate, manufactured by SHOWA DENKO KK): 9.51 parts

[0566] -Formation of the middle layer-

[0567] The intermediate layer composition was applied onto the surface of the formed thermoplastic resin layer using a slit nozzle to a coating width of 1.0 m and a layer thickness of 1.2 μm after drying. The intermediate layer composition coating was dried at 80° C. for 40 seconds to form an intermediate layer.

[0568] <<Intermediate layer composition>>

[0569] The following ingredients were mixed to prepare the intermediate layer composition.

[0570] Deionized water: 38.12 parts

[0571] Methanol (manufactured by MITSUBISHI GAS CHEMICAL COMPANY, INC.): 57.17 parts

[0572] KURARAY POVAL PVA-205 (polyvinyl alcohol, manufactured by KURARAY CO., LTD.): 3.22 parts

[0573] Polyvinylpyrrolidone K-30 (manufactured by Nippon Shokubai Co., Ltd.): 1.49 parts

[0574] MEGAFACE F-444 (fluorinated nonionic surfactant, manufactured by DIC Corporation): 0.0015 parts

[0575] -Formation of Photosensitive Resin Layer-

[0576] Using a slit nozzle, one of the photosensitive resin compositions A-1 to A-7 or AH-1 to AH-3 listed in Table 1 was applied onto the surface of the formed intermediate layer so that the coating width was 1.0 m and the thickness after drying was the thickness listed in Table 1. The coated film of one of the photosensitive resin compositions A-1 to A-7 or AH-1 to AH-3 was dried at 80°C for 40 seconds to form a photosensitive resin layer.

[0577] [Table 1]

[0578]

[0579] In addition, the compositions of the photosensitive resin compositions A-1 to A-7 and AH-1 to AH-3 used are shown in Table 2 below.

[0580] [Table 2]

[0581]

[0582] In Table 2, “Mm / Mb” represents the value of the ratio Mm / Mb of the content Mm of the polymerizable compound to the content Mb of the binder polymer in the photosensitive resin layer, and “Content of acrylic compound” represents the content of the acrylic compound relative to the total mass of the (meth)acrylic compound contained in the photosensitive resin layer, and the unit is % by mass.

[0583] In addition, the details of the abbreviations in Table 2 are shown below.

[0584] BPE-500: Ethoxylated (10 molar equivalent) bisphenol A dimethacrylate (manufactured by Shin-Nakamura Chemical Co., Ltd.)

[0585] BPE-200: Ethoxylated (4 molar equivalent) bisphenol A dimethacrylate (manufactured by Shin-Nakamura Chemical Co., Ltd.)

[0586] M-270: Polypropylene glycol diacrylate (n=about 12) (manufactured by TOAGOSEI CO., LTD.)

[0587] A-TMPT: trimethylolpropane triacrylate (manufactured by Shin-Nakamura Chemical Co., Ltd.)

[0588] SR-454: Ethoxylated trimethylolpropane triacrylate (made by Arkema SA)

[0589] SR-502: Ethoxylated (9 molar equivalents) trimethylolpropane triacrylate (manufactured by Arkema SA)

[0590] A-9300-CL1: ε-caprolactone-modified tris-(2-acryloyloxyethyl) isocyanurate (manufactured by Shin-Nakamura Chemical Co., Ltd.)

[0591] B-CIM: 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-bisimidazole (polymerization initiator, manufactured by Kurogane Kasei Co., Ltd.)

[0592] SB-PI 701: 4,4'-bis(diethylamino)benzophenone (sensitizer, manufactured by SANYO TRADING CO., LTD.)

[0593] CBT-1: Carboxybenzotriazole (rust inhibitor, manufactured by JOHOKU CHEMICAL CO., LTD.)

[0594] TDP-G: Phenothiazine (polymerization inhibitor, manufactured by Kawaguchi Chemical Industry Co., Ltd.)

[0595] Irganox 245: Ethylene bis(oxyethylene) bis(3-(5-tert-butyl-4-hydroxy-m-tolyl) propionate) (polymerization inhibitor, manufactured by BASF)

[0596] F-552: Fluorine-based surfactant (manufactured by DIC Corporation)

[0597] -Paste the covering film-

[0598] A PET film (Lumirror 16QS62, arithmetic mean roughness (Ra value) 0.02 μm, manufactured by TORAY INDUSTRIES, INC.) was pressure-bonded as a cover film to produce a photosensitive transfer member of each example.

[0599] The obtained photosensitive transfer member is wound to produce a roll-shaped photosensitive transfer member.

[0600] <Production of Laminated Body>

[0601] The covering films of the photosensitive transfer members F-1 to F-9, FH-1, and FH-2 prepared above were peeled off, and the peeled surface of the photosensitive transfer member was brought into contact with a copper substrate. The laminate was then laminated on a copper substrate having a copper layer 200 μm thick formed by sputtering copper onto a PET film under the following lamination conditions to obtain a laminate.

[0602] -Lamination conditions-

[0603] Copper substrate temperature: 40°C

[0604] Rubber roller temperature: 110°C

[0605] Linear pressure: 3N / cm

[0606] Transmission speed: 2m / min

[0607] <Exposure>

[0608] Next, an exposure mask having an exposure pattern of line & space = 6 μm / 6 μm was brought into close contact with a temporary support on the side of the laminate on which the photosensitive transfer member was laminated, and exposure was performed through the exposure mask using a proximity exposure machine (manufactured by Hitachi High-Tech Electronics Engineering Co., Ltd.) equipped with an ultra-high pressure mercury lamp at an exposure dose such that the width at a height of 90% of the maximum height of the resist pattern became 6 μm.

[0609] <Development>

[0610] Then, the temporary support was peeled off from the exposed laminate, and a development treatment was performed under the development condition of using a 1.0% sodium carbonate aqueous solution at 26° C. for 30 seconds.

[0611] Next, a washing process was performed using pure water at 26° C. for 30 seconds.

[0612] Next, air is blown onto the surface to remove moisture, thereby producing a substrate having a resin pattern.

[0613] A spray-type developer was used for the development and cleaning processes, and the spray pressure was 0.08 MPa.

[0614] <Etching and peeling>

[0615] The copper layer of the substrate having the resin pattern was shower-etched for 60 seconds using a 25° C. copper etching solution (Cu-02 manufactured by KANTO CHEMICAL CO., INC.).

[0616] Then, the resin pattern was removed by performing shower stripping for 2 minutes using a stripping liquid (KP-301 manufactured by KANTO CHEMICAL CO., INC.) at 60° C., thereby producing a circuit wiring A.

[0617] <Measurement of Resist Line Width in Exposure Area>

[0618] The produced substrate having the resin pattern was cut along a plane perpendicular to the line direction of the line pattern.

[0619] The cross section of the line pattern was observed from the cross-section side using a scanning electron microscope (SEM), and the width of the resist was measured.

[0620] Furthermore, in the same sample as above, the thickness of the layer in the non-exposed portion was measured.

[0621] <Evaluation>

[0622] -Resolution Evaluation-

[0623] Using a circuit wiring pattern mask with lines and spaces of various widths, a wiring sample was prepared in the same manner as above, after stripping the resist. The wiring portion of the resulting wiring sample was observed using an optical microscope, and the resolution was evaluated based on the width of the thinnest line identified using the following evaluation criteria.

[0624] A: The width of the thinnest line that can be resolved is less than 6 μm

[0625] B: The width of the thinnest line that can be resolved is greater than 6 μm and less than 10 μm

[0626] C: The width of the thinnest line that can be distinguished is greater than 10 μm

[0627] -Linearity Evaluation-

[0628] The line widths of the wiring samples were measured at 20 randomly selected locations. The standard deviation σ was calculated from the obtained line width data, and the value obtained by multiplying the standard deviation σ by 3 was defined as LWR (Line Width Roughness), which was used as an indicator of pattern linearity.

[0629] By definition, the smaller the LWR, the smaller the line width variation, which is preferred.

[0630] A: LWR value is less than 200nm

[0631] B: LWR value is greater than 200nm and less than 300nm

[0632] C: LWR value is greater than 300nm

[0633] (Example 10)

[0634] During the exposure, a substrate and circuit wiring A having a resin pattern were produced in the same manner as in Example 5, except that the exposure pattern of line & space = 6 μm / 6 μm was changed to the exposure pattern of line & space = 8 μm / 8 μm.

[0635] Furthermore, evaluation was performed in the same manner as in Example 5.

[0636] (Example 11)

[0637] During the exposure, a substrate and circuit wiring A having a resin pattern were produced in the same manner as in Example 5, except that the exposure pattern of line & space = 6 μm / 6 μm was changed to the exposure pattern of line & space = 4 μm / 4 μm.

[0638] Furthermore, evaluation was performed in the same manner as in Example 5.

[0639] (Example 12)

[0640] During the above-mentioned development, the development conditions of using a 1.0% sodium carbonate aqueous solution at 26°C for 30 seconds were changed to using a 1.2% potassium carbonate aqueous solution at 30°C for 30 seconds. Otherwise, a substrate and circuit wiring A having a resin pattern were produced in the same manner as in Example 5.

[0641] Furthermore, evaluation was performed in the same manner as in Example 5.

[0642] [Table 3]

[0643]

[0644] As shown in Table 3, the wiring and other etched patterns obtained by the resin pattern manufacturing methods and photosensitive transfer members of Examples 1 to 12 were superior in resolution compared to the resin pattern manufacturing methods and photosensitive transfer members of Comparative Examples 1 to 3.

[0645] Furthermore, as shown in Table 3, the methods for producing the resin patterns and the photosensitive transfer members of Examples 1 to 12 also exhibited excellent linearity in the obtained etching patterns.

[0646] In addition, the entire contents of Japanese Patent Application No. 2020-017720 filed on February 5, 2020 are incorporated herein by reference. Furthermore, all documents, patent applications, and technical standards described in this specification are incorporated herein by reference to the same extent as if each document, patent application, or technical standard were specifically and individually indicated to be incorporated by reference.

Claims

1. A method for producing a resin pattern, comprising forming a resin pattern on a substrate using a photosensitive transfer member having a temporary support and a photosensitive resin layer. In a cross section of the resin pattern in the width direction, a value obtained by subtracting a pattern width at a position where 90% of the maximum height of the resin pattern from a pattern width of the portion of the resin pattern in contact with the substrate is 0.2 μm or more and 2.4 μm or less, The photosensitive resin layer contains a polymerizable compound, and the polymerizable compound contains a (meth)acrylic compound. The content of the acrylic compound is 0.1% by mass or more and 60% by mass or less relative to the total mass of the (meth)acrylic compound contained in the photosensitive resin layer.

2. The method for producing a resin pattern according to claim 1, wherein: The photosensitive resin layer has a thickness of 1 μm or more and 8 μm or less.

3. The method for producing a resin pattern according to claim 1 or 2, wherein: The temporary support has a thickness of 5 μm or more and 25 μm or less.

4. The method for producing a resin pattern according to claim 1 or 2, wherein: The photosensitive resin layer contains a polymerizable compound and a binder polymer.

5. The method for producing a resin pattern according to claim 4, wherein: The value of the ratio Mm / Mb of the content Mm of the polymerizable compound to the content Mb of the binder polymer in the photosensitive resin layer is 0.5 or more and 0.9 or less.

6. The method for producing a resin pattern according to claim 1 or 2, wherein: The resin patterns to be produced include resin patterns having a pattern width of 1 μm or more and 6 μm or less.

7. A method for manufacturing a circuit wiring, comprising the following steps: In a laminate having a resin pattern on a substrate manufactured by the method for manufacturing a resin pattern according to any one of claims 1 to 6, the substrate has a conductive layer on the surface on the side where the resin pattern is formed, and the conductive layer in an area where the resin pattern is not arranged is etched to form circuit wiring.

8. A method for manufacturing a touch panel, comprising the following steps: In a laminate having a resin pattern on a substrate manufactured by the method for manufacturing a resin pattern according to any one of claims 1 to 6, the substrate has a conductive layer on a surface on the side where the resin pattern is formed, and the conductive layer located in an area where the resin pattern is not arranged is etched to form wiring for a touch panel.

9. A photosensitive transfer member comprising a temporary support and a photosensitive resin layer. When a resin pattern A having a pattern width of 6 μm at a position 90% of the maximum height of the substrate is formed on a substrate by the photosensitive transfer member, the pattern width of the resin pattern A at a portion in contact with the substrate in a cross section in the width direction is 6.2 μm or more and 8.4 μm or less. The photosensitive resin layer contains a polymerizable compound, and the polymerizable compound contains a (meth)acrylic compound. The content of the acrylic compound is 0.1% by mass or more and 60% by mass or less relative to the total mass of the (meth)acrylic compound contained in the photosensitive resin layer.

Images