Laser Direct Structuring LDS Antenna Components

Abstract

A laser direct structuring (LDS) antenna assembly is provided. The LDS antenna assembly includes a carrier having a first portion formed from a first resin and a second portion formed from a second resin different from the first resin. The LDS antenna assembly also includes an LDS antenna disposed on the carrier. The LDS antenna assembly includes a component coupled to the LDS antenna via a connection point located on a surface of the first portion of the carrier, such that the component is in electrical communication with the LDS antenna via the connection point.

Description

[0001] Priority Declaration

[0002] This application claims the benefit of priority to U.S. Provisional Application No. 62 / 950,543, filed December 19, 2019, and entitled “Laser Direct Structuring LDS Antenna Assembly,” which is incorporated herein by reference. Technical Field

[0003] The present disclosure relates generally to an LDS antenna assembly, and more particularly to a method of manufacturing the LDS antenna assembly. Background Art

[0004] Laser direct structure (LDS) antennas can be placed on a carrier. For example, a laser device can be used to etch a channel into the outer surface of the carrier. The shape of the channel can correspond to the shape of the LDS antenna to be placed on the carrier. The carrier can then be electroplated in a metal bath so that the channel is filled with the desired metal to form the LDS antenna. LDS antennas can be used in a variety of applications. For example, LDS antennas can be used in mobile phones (e.g., cell phones). In particular, LDS antennas can be formed on the housing of the mobile phone. Summary of the Invention

[0005] Various aspects and advantages of the embodiments of the present disclosure will be set forth in part in the following description, or may be learned from the description, or may be learned through practice of the embodiments.

[0006] In one aspect, a laser direct structure (LDS) antenna assembly is provided. The LDS antenna assembly includes a carrier having a first portion formed from a first resin and a second portion formed from a second resin different from the first resin. The LDS antenna assembly also includes an LDS antenna disposed on the carrier. The LDS antenna assembly includes a component coupled to the LDS antenna via a connection point located on a surface of the first portion of the carrier, such that the component is in electrical communication with the LDS antenna via the connection point.

[0007] In another aspect, a method for manufacturing an LDS antenna assembly is provided. The method includes forming an LDS antenna on a carrier of the LDS antenna assembly. The carrier includes a first portion formed from a first resin and a second portion formed from a second resin different from the first resin. The method includes coupling a component to a connection point located on a surface of the first portion of the carrier, such that the component is in electrical communication with the LDS antenna via the connection point.

[0008] On the other hand, an LDS antenna assembly is provided. The LDS antenna assembly includes a carrier having a first portion, a second portion, and a third portion. The first portion and the third portion each include a first resin. The second portion includes a second resin different from the first resin. The LDS antenna assembly includes a first LDS antenna and a second LDS antenna. The first LDS antenna and the second LDS antenna are both disposed on the carrier. The LDS antenna assembly includes a first component coupled to the first LDS antenna via a first connection point located on a surface of the first portion of the carrier, such that the first component is electrically connected to the first LDS antenna via the first connection point. The LDS antenna assembly includes a second component coupled to the second LDS antenna via a second connection point located on a surface of the third portion of the carrier, such that the second component is electrically connected to the second LDS antenna via the second connection point located on the surface of the third portion of the carrier.

[0009] These and other features, aspects and advantages of the embodiments will be better understood with reference to the following description and appended claims.The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the present disclosure and, together with the description, serve to explain the relevant principles. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] With reference to the accompanying drawings, embodiments for those skilled in the art are discussed in detail in the specification, in which:

[0011] Figure 1 depicts an LDS antenna assembly according to an example embodiment of the present disclosure;

[0012] Figure 2 Describes an exemplary embodiment of the present disclosure Figure 1 Another view of the LDS antenna assembly;

[0013] Figure 3 depicts components connected to an LDS antenna assembly according to an example embodiment of the present disclosure;

[0014] Figure 4 Describes an exemplary embodiment of the present disclosure Figure 3 an enlarged view of a portion of; and

[0015] Figure 5 A flow chart of a method of manufacturing an LDS antenna assembly according to an example embodiment of the present disclosure is depicted. DETAILED DESCRIPTION

[0016] Reference will now be made in detail to the embodiments, one or more examples of which are illustrated in the accompanying drawings. Each example is provided by way of explanation of the embodiments and not as a limitation of the present disclosure. Indeed, it will be apparent to those skilled in the art that various modifications and variations may be made to the embodiments without departing from the scope or spirit of the present disclosure. For example, features shown or described as part of one embodiment may be used with another embodiment to produce yet another embodiment. Therefore, it is intended that aspects of the present disclosure encompass such modifications and variations.

[0017] A typical LDS assembly includes a carrier on which the LDS antenna is mounted. This carrier is formed using a resin or other thermally resistant material that allows components (e.g., coaxial cables, passive electronic components) to be soldered to it. However, this resin can adversely affect the performance of the LDS antenna. Furthermore, these components are often soldered directly to the LDS antenna, which can also negatively impact the performance of the LDS antenna.

[0018] Example aspects of the present disclosure are directed to an LDS antenna assembly having a carrier including a first portion and a second portion. The first portion of the carrier and the second portion of the carrier are formed using different resins such that the thermal resistance of the first portion is greater than the thermal resistance of the second portion. As will be discussed in more detail below, one or more components (e.g., a coaxial cable, a flexible printed circuit, a spring contact, a spring probe, a passive electronic component, an active electronic component, etc.) can be electrically connected to the LDS antenna via the first portion of the carrier.

[0019] The first portion of the carrier includes one or more connection points. Specifically, the one or more connection points may be disposed on an outer surface of the first portion of the carrier. In some embodiments, the one or more connection points may include solder joints. In these embodiments, the LDS antenna and components of the LDS antenna assembly may be soldered to the solder joints. In this manner, the components may be electrically connected to the LDS antenna without directly contacting the LDS antenna.

[0020] An LDS antenna assembly according to exemplary aspects of the present disclosure may provide numerous technical advantages. For example, the second portion of the carrier is made larger than the first portion of the carrier to reduce or eliminate adverse effects of the high-temperature resin used to form the first portion of the carrier on the LDS antenna disposed on the carrier. In addition, the first portion of the carrier includes one or more connection points. In this manner, the performance of the LDS antenna is improved because the components are not welded directly to the LDS antenna; instead, the components are welded to one or more connection points of the first portion of the carrier. In this manner, the performance (e.g., gain) of the same LDS antenna disposed on a carrier of an antenna assembly according to the present disclosure may be improved (e.g., by approximately 15%) compared to the performance of the LDS antenna when disposed on a conventional carrier.

[0021] It should be understood that LDS antenna assemblies according to example aspects of the present disclosure can be used in a variety of different applications. For example, the LDS antenna assembly can be used in mobile phones (e.g., cell phones), mobile computing devices (e.g., laptops), video game consoles, wireless printers, wireless routers, inventory tracking systems, medical devices, vehicle tracking systems, unmanned aerial vehicles (UAVs), or any other suitable device having one or more LDS antennas.

[0022] As used herein, the term "about" used with a numerical value means within 25% of the numerical value. In addition, the term "resin" means one material, or a combination of a plurality of materials.

[0023] Now referring to the accompanying drawings, Figure 1 and Figure 2 An antenna assembly 100 according to an exemplary embodiment of the present disclosure is depicted. The antenna assembly 100 may include a carrier 110 having a first portion 112 and a second portion 114 that is larger than the first portion 112. More specifically, the surface area of ​​the second portion 114 of the carrier 110 may be greater than the surface area of ​​the first portion 112 of the carrier 110. For example, in some embodiments, the surface area of ​​the second portion 114 of the carrier 110 may be greater than about 60% of the total surface area of ​​the carrier 110, such as about 70% of the total surface area, such as about 80% of the total surface area, or such as about 90% of the total surface area.

[0024] It should be understood that the carrier 110 may include any suitable component configured to accommodate one or more antennas. For example, in some embodiments, the carrier 110 may be a housing (e.g., a cover, a housing, a radome) for one or more antennas. It should also be understood that the first portion 112 of the carrier 110 and the second portion 114 of the carrier 110 are formed using different resins. For example, the first portion 112 of the carrier 110 may be formed using a first resin, while the second portion 114 of the carrier 110 may be formed using a second resin different from the first resin. It should also be understood that the thermal resistance of the first resin used to form the first portion 112 of the carrier 110 is greater than the thermal resistance of the second resin used to form the second portion 114 of the carrier 110. In this way, the first portion 112 of the carrier 110 may be more heat resistant than the second portion 114 of the carrier 110.

[0025] In some embodiments, the first resin may be a first polycarbonate, and the second resin may be a second polycarbonate different from the first polycarbonate. Alternatively or additionally, the first resin may include an additive such as glass fiber. However, it should be appreciated that the first resin may include any suitable type of additive as long as the thermal resistance of the first resin is greater than the thermal resistance of the second resin. Example resins may include, for example: acrylonitrile butadienestyrene (ABS), polycarbonate-acrylonitrile butadienestyrene (PC-ABS), polyamides (PA), polyphthalamides (PPA), polycarbonate polyethylene terephthalate (PC / PET), polybutylene terephthalate (PBT), liquid crystal polymers (LCP), and polyphenylene ether (PPE).

[0026] In some embodiments, the carrier 110 may include a third portion 116 formed using the first resin used to form the first portion 112 of the carrier 110. As shown, the second portion 114 may be disposed between the first portion 112 and the third portion such that the first portion 112 and the third portion 116 do not contact (e.g., touch) each other. Additionally, the size of the third portion 116 of the carrier 110 may be smaller than the size of the second portion 114 of the carrier 110. In some embodiments, the size of the third portion 116 of the carrier 110 may be the same as the size of the first portion 112 of the carrier 110. In alternative embodiments, the size of the third portion 116 of the carrier 110 may be different from the size of the first portion 112 of the carrier 110. For example, in some embodiments, the third portion 116 of the carrier 110 may be larger than the first portion 112 of the carrier 110. In alternative embodiments, the third portion 116 of the carrier 110 may be smaller than the first portion 112 of the carrier 110.

[0027] Although the carrier 110 of the antenna assembly 100 discussed above is described as having two separate portions (e.g., the first portion 112 and the third portion 116) formed using a first resin, it should be appreciated that the carrier 110 may include more or fewer portions formed using the first resin. However, in embodiments where the carrier 110 includes multiple portions formed using the first resin, it should be understood that the surface area of ​​the second portion 114 of the carrier 110 is greater than the total surface area of ​​the portions (e.g., the first portion 112, the third portion 116) formed using the first resin.

[0028] The antenna assembly 100 may include one or more laser direct structure (LDS) antennas disposed on a carrier 110. For example, Figure 1 and Figure 2 As shown, the carrier 110 may be configured to accommodate the first LDS antenna 120 of the antenna assembly 100 and the second LDS antenna 122 of the antenna assembly 100. However, it should be appreciated that the carrier 110 may be configured to accommodate more or fewer LDS antennas.

[0029] In some embodiments, the first LDS antenna 120 may be disposed entirely on the second portion 114 of the carrier 110. In alternative embodiments, the first LDS antenna 120 may be disposed on both the first portion 112 of the carrier 110 and the second portion 114 of the carrier 110. In these embodiments, the portion of the first LDS antenna 120 disposed on the second portion 114 of the carrier 110 is larger than the portion disposed on the first portion 112 of the carrier 110. In this manner, performance degradation of the first LDS antenna 120 caused at least in part by the first resin used to form the first portion 112 of the carrier 110 can be reduced.

[0030] In some embodiments, the second LDS antenna 122 may be disposed entirely on the second portion 114 of the carrier 110. In alternative embodiments, the second LDS antenna 122 may be disposed on both the second portion 114 of the carrier 110 and the third portion 116 of the carrier 110. In this manner, performance degradation of the second LDS antenna 122 caused at least in part by the first resin used to form the third portion 116 of the carrier 110 may be reduced.

[0031] It should be appreciated that the one or more LDS antennas of the antenna assembly 100 can be configured to communicate on any suitable frequency band. For example, in some embodiments, the first LDS antenna 120 can be configured to communicate with one or more devices in a Bluetooth network. Alternatively or additionally, the second LDS antenna 122 can be configured to communicate with one or more devices in a Wi-Fi network. In some embodiments, the one or more LDS antennas of the antenna assembly 100 can be configured to communicate with one or more devices in a cellular network.

[0032] The first portion 112 of the carrier 110 may include one or more connection points 130. More specifically, the one or more connection points 130 may be disposed on the surface 113 of the first portion 112 of the carrier 110. In some embodiments, the one or more connection points 130 may be disposed on the surface 113 of the first portion 112 of the carrier 110 such that the one or more connection points 130 abut the second portion 114 of the carrier 110. The first LDS antenna 120 may be coupled to the first portion 112 of the carrier 110 via the one or more connection points 130. For example, in some embodiments, the one or more connection points 130 may include solder points. In these embodiments, the first LDS antenna 120 may be soldered to the one or more connection points 130 located on the surface 113 of the first portion 112 of the carrier 110.

[0033] Furthermore, the third portion 116 of the carrier 110 may include one or more connection points 140. More specifically, the one or more connection points 140 may be disposed on a surface 117 of the third portion 116 of the carrier 110. In some embodiments, the one or more connection points 140 may be disposed on the surface 117 of the third portion 116 of the carrier 110 such that the one or more connection points 140 abut the second portion 114 of the carrier 110. The second LDS antenna 122 may be coupled to the third portion 116 of the carrier 110 via the one or more connection points 140. For example, in some embodiments, the one or more connection points 140 may include one or more solder points. In these embodiments, the second LDS antenna 122 may be soldered to the one or more connection points 140 located on the surface 117 of the third portion 116 of the carrier 110.

[0034] Reference Figure 3 and Figure 4 , the antenna assembly 100 may include one or more components 150 coupled to the first LDS antenna 120 via one or more connection points 130 of the first portion 112 of the carrier 110. For example, in some embodiments, the one or more components 150 may be soldered to the one or more connection points 130. It should be understood that when the one or more components 150 are directly connected to the first LDS antenna 120, the performance of the first LDS antenna 120 may be degraded. In this regard, the performance of the first LDS antenna 120 of the antenna assembly 100 according to the present disclosure may be improved because the one or more components are not directly connected to the first LDS antenna 120; instead, the one or more components 150 are coupled to the first LDS antenna 120 via one or more connection points 130 located on the surface 113 of the first portion 112 of the carrier 110.

[0035] In some embodiments, the antenna assembly 100 can include one or more components 150 that are coupled to the second LDS antenna 122 via one or more connection points 140 of the third portion 116 of the carrier 110. For example, in some embodiments, the one or more components 150 can be soldered to the one or more connection points 140. It should be understood that when the one or more components 150 are directly connected to the second LDS antenna 122, the performance of the second LDS antenna 122 may be degraded. In this regard, the performance of the second LDS antenna 122 of the antenna assembly 100 according to the present disclosure can be improved because the one or more components 150 are not directly connected to the second LDS antenna 122; instead, the one or more components 150 are coupled to the second LDS antenna 122 via one or more connection points 140 defined by the third portion 116 of the carrier 110.

[0036] As shown, one or more components 150 may include a coaxial cable. However, it should be appreciated that the one or more components may include any suitable type of electronic component. For example, in some embodiments, the one or more components 150 may include passive electronic components. Examples of passive electronic components may include, but are not limited to, resistors, capacitors, and inductors. In alternative embodiments, the one or more components 150 may include active electronic components. Examples of active electronic components may include, but are not limited to, transistors (e.g., metal-oxide semiconductor field effect transistors (MOSFETs), bipolar junction transistors (BJTs), etc.).

[0037] Reference Figure 5, a flowchart of a method 200 of manufacturing an LDS antenna assembly according to an example embodiment of the present disclosure is provided. Figure 5 The steps are depicted as being performed in a particular order for purposes of illustration and discussion. One of ordinary skill in the art, using the disclosure provided herein, will appreciate that the various steps of any of the methods described herein may be rewritten, omitted, rearranged, include steps that are not listed, performed simultaneously, and / or modified in various ways without departing from the scope of this disclosure.

[0038] At (202), the method 200 may include: forming an LDS antenna on a carrier, the carrier including a first portion formed of a first resin and a second portion formed of a second resin different from the first resin. In some embodiments, forming the LDS antenna may include: etching a channel on a surface of the carrier using a laser device at (204). For example, in some embodiments, the surface may include an outer surface of the carrier. It should be understood that the shape of the channel etched using the laser device may correspond to the shape of the LDS antenna to be formed on the surface of the carrier. After etching the channel on the surface of the carrier, forming the LDS antenna may also include: electroplating the carrier in a metal bath at (206) so that the channel is filled with metal to form the LDS antenna.

[0039] At (208), method 200 may include coupling a component to a connection point on the first portion of the carrier such that the component is in electrical communication with the LDS antenna via the connection point. In some embodiments, coupling the component to the connection point may include soldering the component to the connection point. It should be appreciated that the component may include any suitable type of electronic component. For example, in some embodiments, the electronic component may include a passive electronic component (e.g., a capacitor, a resistor, an inductor). In alternative embodiments, the electronic component may include an active electronic component (e.g., a transistor).

[0040] Although the subject matter has been described in detail with respect to specific exemplary embodiments thereof, it will be appreciated that those skilled in the art, upon gaining an understanding of the foregoing, may readily make changes, modifications, and equivalents to these embodiments. Accordingly, the scope of the present disclosure is by way of example and not limitation, and the present disclosure does not exclude such modifications, variations, and / or additions to the subject matter as would be apparent to one of ordinary skill in the art.

Claims

1. A laser direct structuring (LDS) antenna assembly, comprising: a carrier including a first portion and a second portion, the first portion being formed of a first resin and the second portion being formed of a second resin different from the first resin; a laser directly structured LDS antenna, wherein the LDS antenna is arranged on the carrier, and the entire LDS antenna is arranged on the second portion of the carrier; as well as A component is coupled to the LDS antenna via a connection point located on a surface of the first portion of the carrier such that the component is in electrical communication with the LDS antenna via the connection point.

2. The LDS antenna assembly according to claim 1, wherein: The surface area of ​​the second portion of the carrier is greater than the surface area of ​​the first portion of the carrier.

3. The LDS antenna assembly according to claim 1, wherein: The first resin includes a first polycarbonate; and The second resin includes a second polycarbonate different from the first polycarbonate.

4. The LDS antenna assembly according to claim 3, wherein: The first resin further includes glass fibers.

5. The LDS antenna assembly according to claim 1, wherein: The connection point is located on the first portion of the carrier such that the connection point abuts the second portion of the carrier.

6. The LDS antenna assembly according to claim 1, wherein: The second portion of the carrier defines a channel configured to receive the LDS antenna.

7. The LDS antenna assembly according to claim 1, wherein: The components include a coaxial cable.

8. The LDS antenna assembly according to claim 1, wherein: The components include passive electronic components.

9. The LDS antenna assembly according to claim 1, wherein: The components include active electronic components.

10. The LDS antenna assembly according to claim 9, wherein: The active electronic components include transistors.

11. A method for manufacturing a laser direct structuring (LDS) antenna assembly, the method comprising: forming an LDS antenna on a carrier of the LDS antenna assembly, the carrier including a first portion formed using a first resin and a second portion formed using a second resin different from the first resin, the LDS antenna being entirely disposed on the second portion of the carrier; as well as A component is coupled to a connection point on the surface of the first portion of the carrier such that the component is in electrical communication with the LDS antenna via the connection point.

12. The method according to claim 11, wherein Coupling a component to a connection point formed on the first portion of the carrier includes soldering the component to the connection point so that the component is in electrical communication with the LDS antenna via the connection point.

13. The method according to claim 11, wherein The forming of the LDS antenna comprises: etching channels on the surface of the carrier by means of a laser device; and After etching the channels, the carrier is electroplated in a metal bath so that the channels are filled with metal to form the LDS antenna.

14. The method according to claim 11, wherein The components include active electronic components or passive electronic components.

15. A laser direct structuring (LDS) antenna assembly, comprising: a carrier comprising a first portion, a second portion, and a third portion, wherein the first portion and the third portion each comprise a first resin, and the second portion comprises a second resin different from the first resin; a first LDS antenna, wherein the first LDS antenna is entirely disposed on the second portion of the carrier; a second LDS antenna, wherein the second LDS antenna is entirely disposed on the second portion of the carrier; a first component coupled to the first LDS antenna via a first connection point located on a surface of the first portion of the carrier such that the first component is in electrical communication with the first LDS antenna via the first connection point; as well as A second component is coupled to the second LDS antenna via a second connection point on the surface of the third portion of the carrier, such that the second component is in electrical communication with the second LDS antenna via the second connection point on the surface of the third portion of the carrier.

16. The LDS antenna assembly according to claim 15, wherein: The first portion of the carrier and the third portion of the carrier are separated from each other by the second portion of the carrier.

Images