A process and equipment for capping HIC with organic materials

Abstract

The present invention relates to a process device and method for capping HIC with organic materials, belonging to the technical field of radioactive waste or hazardous waste treatment, the method comprising: placing HIC on a rotating platform and accurately positioning it; opening the HIC cover by a cover gripper; loading the waste steel barrel into the HIC container; placing the HIC cover back on the HIC container by a cover gripper; adjusting the position of the glue filling head to align it with one of the glue filling holes of the HIC cover; preparing A and B component organic sealing materials according to the formula; opening the valve, and starting the A and B component metering pumps at the same time, and conveying the A and B component organic sealing materials to the glue filling head according to the set flow rate, and cooperating with the rotating platform to complete the glue filling of the HIC. The process device and method provided by the present invention can not only simplify the structure and operation process of the capping device and reduce the generation of secondary radioactive waste, but also improve the compatibility of the packaging container with the waste, and meet the provisions of GB36900.2‑2018 on the safety requirements of HIC.

Description

Technical Field

[0001] The invention belongs to the technical field of radioactive waste or hazardous waste treatment, and specifically relates to a process method and equipment for capping HIC with organic materials. Background Art

[0002] Radioactive waste is generated from nuclear facilities (including nuclear power plants and spent fuel reprocessing plants, etc.). At present, most of the low- and medium-level radioactive waste generated by my country's nuclear facilities is treated with traditional cement solidification. However, cement solidification has the disadvantages of large waste volume increase, poor long-term storage stability, and high leaching rate. Therefore, some domestic nuclear power plants have begun to use high integrity containers (hereinafter referred to as "HIC") to contain radioactive waste, such as Tianwan Nuclear Power Plant. HIC is used to place solidified nuclear waste, which can be safely stored for 300 years under dry and wet, hot and cold, salt corrosion, impact and other environmental conditions; this technology can simplify multiple barriers, do not need to be buried underground, and save a lot of land resources.

[0003] At present, concrete is used as the base material as the sealing material in the concrete HIC capping process, and the problems are:

[0004] a) It is difficult to meet the corrosion resistance requirements for containing more types of waste;

[0005] b) The supporting equipment is complex, the operation process is cumbersome, the equipment investment is large, the manpower demand is large, the cleaning is troublesome, time-consuming and labor-intensive, and secondary pollution such as cleaning waste liquid and dust is generated;

[0006] c) GB36900.2-2018 safety requirements stipulate that the structure and sealing materials of HIC must be compatible with its contents and its environment. If necessary, corrosion-resistant lining, jacket or coating can be installed inside and outside the concrete container. Summary of the invention

[0007] In order to solve the defects of the prior art, the purpose of the present invention is to provide a process device and method for sealing HIC with organic materials. The device and method can not only simplify the structure and operation process of the sealing equipment and reduce the generation of secondary radioactive waste, but also improve the compatibility between the packaging container and the waste, and meet the safety requirements of GB36900.2-2018 for HIC.

[0008] In order to achieve the above purpose, a technical solution adopted by the present invention is:

[0009] A process device for capping HIC with organic materials, comprising an organic material preparation and delivery unit, and a capping and glue filling unit. The organic material preparation and delivery unit is used for preparing and conveying organic sealing materials of components A and B, and the capping and glue filling unit is used for mixing the organic sealing materials of components A and B and then performing glue filling and capping on HIC.

[0010] The organic material preparation and delivery unit includes two passages, which are respectively used for the preparation and delivery of the organic sealing material of component A and the organic sealing material of component B. Each passage includes a preparation tank, a feeding pump, a feeding tank and a metering pump which are sequentially connected end to end through a delivery pipeline. The other ends of the two metering pumps are connected to the glue pouring head of the sealing cover and glue pouring unit. The two feeding pumps respectively transport the organic sealing materials of components A and B from the corresponding preparation tanks to the corresponding feeding tanks. The two metering pumps respectively transport the organic sealing materials of components A and B from the corresponding feeding tanks to the glue pouring head at a set flow rate.

[0011] The capping and glue pouring unit mainly includes a screw lifting mechanism, a gripper mechanical arm, a cover gripper, a support column, a glue pouring head with a mixing function, a glue pouring mechanical arm and a rotating platform;

[0012] The first ends of the gripper mechanical arm and the glue pouring mechanical arm are both movably connected to the support column and can rotate around the support column; the lead screw lifting mechanism is fixed to the second end of the gripper mechanical arm, and the cover plate gripper is fixed to the telescopic end of the lead screw lifting mechanism. The cover plate gripper is accurately positioned through the rotation of the gripper mechanical arm and the telescopic end of the lead screw lifting mechanism, thereby realizing the effective gripping and release of the HIC cover plate by the cover plate gripper;

[0013] The glue pouring head is fixed at the second end of the glue pouring robot arm. In the glue pouring state, the glue pouring head is located directly above the annular space between the HIC container and the HIC cover plate. The rotating platform can rotate horizontally to carry the HIC and drive the HIC to rotate, and cooperate with the glue pouring head to complete the capping of the HIC.

[0014] Furthermore, in the process device for capping HIC with organic materials as described above, the mixing tank and the supply tank are equipped with stirring and heating devices; the type of the metering pump is a ceramic piston pump.

[0015] Furthermore, in the process device for capping HIC with organic materials as described above, a positioning slot is provided on the gripper mechanical arm for realizing accurate positioning of the cover gripper on the gripper mechanical arm.

[0016] Furthermore, in the above-mentioned process device for capping HIC with organic materials, the cover plate gripper is powered by pure mechanical or compressed air.

[0017] Furthermore, in the process device for capping HIC with organic materials as described above, a laser sensor is provided on the glue filling robot arm for monitoring the glue filling height in the annular space between the HIC container and the HIC cover plate; and when the space is full, the metering pump is controlled to automatically stop working.

[0018] Furthermore, in the process device for capping HIC with organic materials as described above, the glue pouring robot arm is equipped with a retractable liquid receiving tray, and the liquid receiving tray can be located below the glue pouring head to prevent glue from dripping elsewhere.

[0019] Furthermore, in the process device for capping HIC with organic materials as described above, a positioning block is provided on the rotating platform, and a guiding slope is arranged on the positioning block to ensure that the positioning accuracy of the HIC is within the range of ±2mm after it is placed.

[0020] Furthermore, in the process device for capping HIC with organic materials as described above, the organic material preparation and delivery unit is arranged in a non-radioactive area on site; and the capping and glue filling unit is arranged in a radioactive area on site.

[0021] A process method for capping HIC using the above process device comprises the following steps:

[0022] S1. Place the HIC on the rotating platform and position it accurately;

[0023] S2. Open the HIC cover plate by using the cover plate gripper;

[0024] S3, put the waste steel drum into the HIC container;

[0025] S4, placing the HIC cover plate back onto the HIC container by using the cover plate gripper;

[0026] S5, adjusting the position of the glue filling head so that it is aligned with one of the glue filling holes of the HIC cover plate;

[0027] S6. Prepare the organic sealing materials of components A and B respectively according to the formula;

[0028] S7, open the valve, start the metering pumps of components A and B at the same time, deliver the organic sealing materials of components A and B to the glue pouring head according to the set flow rate, and cooperate with the rotating platform to complete the glue pouring of the HIC;

[0029] S8. After the glue pouring is completed, the HIC is transported to a temporary storage area for curing and solidification.

[0030] Furthermore, in the process of capping HIC with organic material as described above, in step S5, the distance between the lower end surface of the glue potting head and the upper end surface of the HIC cover plate is within a range of 2 to 20 mm.

[0031] Further, in the above-mentioned process of capping HIC with organic materials, the specific process of glue filling in step S7 is as follows:

[0032] First, glue is poured at a high flow rate: the flow rate is controlled within the range of 30-50g / s. When the laser sensor detects that the organic material fills the glue filling hole, the metering pumps of the A and B components are controlled to automatically stop working;

[0033] Then glue is poured at a small flow rate: the rotating platform is started and the metering pumps of components A and B are restarted. The rotating platform rotates at a uniform speed so that the glue pouring head pours at a small flow rate in the annular space between the HIC container and the HIC cover plate. The flow rate is controlled to be less than 20g / s. When the laser sensor detects that it is full again, the metering pumps of components A and B automatically stop working.

[0034] Furthermore, in the process of sealing HIC with organic materials as described above, the components of the organic sealing materials A and B include liquid epoxy resin, modifier and additives.

[0035] The following beneficial effects are achieved by using the process device and method for capping HIC with organic materials as described in the present invention:

[0036] 1) The device is easy to operate and does not require pipeline cleaning, which greatly reduces the amount of secondary waste generated;

[0037] 2) Using laser sensors to monitor the glue filling status can effectively improve the control of the glue filling system;

[0038] 3) The device has a simple structure, small size and more compact layout;

[0039] 4) This process has high sealing efficiency and can fill 5 HIC barrels every 8 hours. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 It is a schematic diagram of the structure of a process device for capping HIC with an organic material provided in a specific embodiment of the present invention;

[0041] Figure 2 Schematic diagram of the state of the gripper mechanical arm taking the cap in the embodiment of the present invention;

[0042] Figure 3 It is a partial schematic diagram of a cover plate gripper grabbing a HIC cover plate in an embodiment of the present invention;

[0043] Figure 4 Schematic diagram of the HIC cover plate being grabbed and separated in an embodiment of the present invention;

[0044] Figure 5 Schematic diagram of the glue filling head in place and the glue filling state with a large flow rate in the embodiment of the present invention;

[0045] Figure 6 This is a schematic diagram of a small flow glue filling state in an embodiment of the present invention;

[0046] Figure 7 It is a flow chart of a process method for capping HIC with an organic material provided in a specific embodiment of the present invention.

[0047] In the figure: the organic material preparation and delivery unit includes: 1-A component dispensing tank, 2-A component supply tank, 3-B component supply tank, 4-B component dispensing tank, 5-A component supply pump, 6-B component supply pump, 7-A component metering pump, 8-B component metering pump, 9-valve, 10-delivery pipeline;

[0048] The capping and glue pouring unit includes: 11-screw lifting mechanism, 12-gripper mechanical arm, 13-cover gripper, 14-support column, 15-liquid receiving tray, 16-glue pouring head, 17-glue pouring mechanical arm, 18-laser sensor, 19-HIC cover, 20-waste steel barrel, 21-HIC container, 22-rotating platform, 23-installation platform. DETAILED DESCRIPTION

[0049] The present invention is further described below in conjunction with specific embodiments and the accompanying drawings.

[0050] In view of the problems existing in the current use of concrete as a base material for sealing materials, the present invention proposes a process device for sealing HIC with organic materials, the structural schematic diagram of which is shown in FIG. Figure 1 As shown, the device mainly includes: an organic material preparation and delivery unit, a capping and glue filling unit, the organic material preparation and delivery unit is used for preparing and conveying the A and B component organic sealing materials, and the capping and glue filling unit is used for mixing the A and B component organic sealing materials and then filling and sealing the HIC with glue.

[0051] The organic material preparation and delivery unit mainly includes two batching tanks, two feed tanks, two feed pumps, two metering pumps, valves and delivery pipelines. The functions and connection relationships of each component are as follows:

[0052] A component dispensing tank 1 and B component dispensing tank 4: used for the preparation of organic materials of component A and component B respectively, equipped with stirring and heating devices. Add raw materials and additives into the corresponding dispensing tanks according to the set proportion, and then stir evenly to prepare the organic materials of the required components.

[0053] A component supply tank 2 and B component supply tank 3: connected with A component distribution tank 1 and B component distribution tank 4 respectively through conveying pipelines, used for supplying A component and B component organic materials, equipped with stirring and heating devices, which can meet the supply demand of 5 HIC caps every 8 hours.

[0054] A component feed pump 5 and B component feed pump 6: A component feed pump 5 is located on the delivery pipeline connecting A component dispensing tank 1 and A component supply tank 2, and B component feed pump 6 is located on the delivery pipeline connecting B component dispensing tank 4 and B component supply tank 3, and is respectively used to transport A component and B component organic materials from corresponding dispensing tanks to corresponding supply tanks.

[0055] Component A metering pump 7 and component B metering pump 8: Component A metering pump 7 is located on the delivery pipeline connecting component A supply tank 2 and glue filling head 16, and component B metering pump 8 is located on the delivery pipeline connecting component B supply tank 3 and glue filling head 16, and is used to transport component A and component B organic materials from the corresponding supply tanks to the glue filling head 16, and to meter the transported organic materials.

[0056] Valve 9: located on each delivery pipeline, used to control the on-off of the delivery pipeline 10.

[0057] The capping and glue pouring unit mainly includes a screw lifting mechanism 11, a gripper mechanical arm 12, a cover gripper 13, a support column 14, a liquid receiving tray 15, a glue pouring head with a mixing function 16, a glue pouring mechanical arm 17, a laser sensor 18, a rotating platform 22, a mounting platform 23 and an instrumentation control system. The functions and connection relationships of each component are as follows:

[0058] Support column 14 : fixedly mounted on the mounting platform 23 , used to support the gripper robot arm 12 and the glue pouring robot arm 17 .

[0059] The cover plate gripper 13 is used to grip and release the HIC cover plate 19 .

[0060] One end of the gripper arm 12 is movably connected to the support column 14 and can rotate around the support column 14; the screw lifting mechanism 11 is fixed to the other end of the gripper arm 12, and the movable end of the screw lifting mechanism 11 is fixedly connected to the cover gripper 13. The gripper arm 12 rotates around the support column 14 to drive the screw lifting mechanism 11 and the cover gripper 13 to rotate, and the cover gripper 13 is lifted and lowered by adjusting the screw lifting mechanism 11, thereby realizing the horizontal and axial positioning of the cover gripper 13, and then realizing the effective gripping and releasing of the HIC cover 19 by the cover gripper 13.

[0061] The glue pouring head 16 is fixed on the glue pouring mechanical arm 17 and is connected to the A component metering pump 7 and the B component metering pump 8 through the delivery pipeline. The glue pouring head 16 has a mixing function, and the mixing of the A component and the B component organic materials and the injection of HIC are achieved through the glue pouring head 16.

[0062] The glue pouring robot arm 17 has one end movably connected to the support column 14 and can rotate around the support column 14, and the other end is fixedly connected to the glue pouring head 16;

[0063] The laser sensor 18 is fixed on the glue filling robot arm 17 to monitor the glue filling height in the annular space between the HIC container 21 and the HIC cover plate 19; and when it is full, the laser sensor 18 will feedback a signal to control the glue filling system to automatically stop glue filling.

[0064] The rotating platform 22 is mounted on the mounting platform 23 and can perform horizontal rotational motion, and is used to support the HIC and drive the HIC to perform rotational motion.

[0065] The instrumentation and control system is used to realize automatic control and information feedback of the entire device.

[0066] Preferably, the organic material preparation and delivery unit is arranged in a non-radioactive area on site to facilitate personnel operation; the capping and glue pouring unit is arranged in a radioactive area on site, and the glue pouring operation can be carried out in an automated control manner.

[0067] Preferably, the A component metering pump 7 and the B component metering pump 8 are ceramic piston pumps, which can improve their wear resistance to solid additives.

[0068] Preferably, a positioning slot is provided on the gripper mechanical arm 12 to achieve accurate positioning of the cover gripper 13 on the gripper mechanical arm 12 .

[0069] Preferably, the cover gripper 13 is powered by pure mechanical means or compressed air, and is suitable for use in a radioactive environment.

[0070] Preferably, the gripper robot arm 12 and the glue pouring robot arm 17 are installed on the same support column 14 and are controlled separately, which can save layout space.

[0071] Preferably, the horizontal distance between the center of the support column 14 and the center of the HIC container 21 is in the range of 1 to 2 m.

[0072] Preferably, a positioning block is provided on the rotating platform 22, and a guiding slope is arranged on the positioning block to ensure that the positioning accuracy of the HIC is within the range of ±2mm after it is placed.

[0073] Preferably, in the glue pouring state, the glue pouring head 16 is located directly above the annular space between the HIC container 21 and the HIC cover plate 19, and the distance between the lower end surface of the glue pouring head 16 and the upper end surface of the HIC cover plate 19 is within a range of 2 to 20 mm.

[0074] Preferably, the glue pouring head 16 is built with a detachable mixing component, which can not only achieve the mixing of component A and component B, but also achieve glue pouring after mixing, and at the same time, on-site replacement is more convenient.

[0075] Preferably, the glue pouring robot arm 17 is provided with a retractable liquid receiving tray 15, which is used to extend the liquid receiving tray 15 and position it under the glue pouring head 16 after the glue is filled, so as to prevent the glue from dripping elsewhere.

[0076] The process device for capping HIC with organic materials of the present invention has good performance, convenient operation, low investment cost and small space occupation, and is suitable for use in nuclear power plants or post-processing plants.

[0077] The embodiment of the present invention also provides a process for capping HIC using the above device, referring to Figure 7 As shown, the method comprises the following steps:

[0078] Step 1: Place the HIC on the rotating platform and position it accurately. This step can be completed using a factory crane.

[0079] Step 2: Open the HIC cover 19 by means of the liftable cover gripper 13 .

[0080] The specific process is: drive the gripper mechanical arm 12 to rotate, so that the cover gripper 13 is positioned just above the HIC container 21, such as Figure 2 Start the screw lifting mechanism 11 down to a suitable position, start the cylinder of the cover gripper 13, so that the cover gripper 13 holds the HIC cover 19 tightly, such as Figure 3 As shown; the screw lifting mechanism 11 is lifted to a reasonable position, and the gripper mechanical arm 12 is rotated to the initial position, such as Figure 4 shown.

[0081] Step 3: Load the waste steel drum 20 into the HIC container 21. This step can be completed using a factory crane.

[0082] Step 4: Place the HIC cover plate 19 back onto the HIC container 21 by the cover plate gripper 13 .

[0083] The specific process is: drive the gripper robot arm 12 to rotate, so that the cover gripper 13 is repositioned directly above the HIC container 21, start the screw lifting mechanism 11 to descend to a suitable position, and after the cover gripper 13 releases the HIC cover 19, the screw lifting mechanism 11 is lifted to a reasonable position, and the rotating gripper robot arm 12 returns to the initial position.

[0084] Step 5: Adjust the position of the glue injection head 16 to align it with any glue injection hole of the HIC cover plate 19.

[0085] like Figure 5 As shown, the glue pouring robot arm 17 is driven to position the glue pouring head 16 directly above the annular space between the HIC container 21 and the HIC cover plate 19, and the distance between the lower end surface of the glue pouring head 16 and the upper end surface of the HIC cover plate 19 is within 2 to 20 mm. The rotating platform 22 is started to align the glue pouring head 16 with any glue pouring hole of the HIC cover plate 19 (there are three glue pouring holes on the HIC cover plate 19), and the laser sensor 18 is adjusted into place.

[0086] Step 6: Prepare the A and B component organic sealing materials according to the formula.

[0087] Compared with concrete mortar sealing materials, organic sealing materials have better corrosion resistance, which can not only simplify the structure and operation process of the sealing equipment and reduce the generation of secondary radioactive waste, but also improve the compatibility between the packaging container and the waste, and meet the safety requirements of HIC in GB36900.2-2018. Therefore, it can be used to contain more types of radioactive waste, such as evaporation residues and incineration ash generated in fast reactors and reprocessing projects containing large amounts of sodium salts, sulfates, halides, etc. Radioactive waste.

[0088] The organic sealing material described in the present invention includes liquid epoxy resin, curing agent (which may be one or a mixture of polyamide, aromatic amine, polyether amine curing agent, etc.), diluent, flame retardant, toughening agent and other modifiers, and additives such as fly ash, kaolin, silicon dioxide, aluminum hydroxide, etc. may also be added.

[0089] The specific process of preparing organic sealing materials is as follows: prepare organic sealing materials - component A and component B in component A and component B feeding tanks according to the formula, start the stirring paddle and heater, and after stirring evenly, start the A and B component feeding pumps to transport them to their respective feeding tanks, and start their stirring paddles and heaters at the same time.

[0090] Step 7: Open the valve and start the metering pumps of components A and B at the same time, and deliver the organic sealing materials of components A and B to the glue pouring head 16 according to the set flow rate, and cooperate with the rotating platform 22 to complete the glue pouring of HIC.

[0091] The specific method of perfusion is:

[0092] First, glue is poured at a high flow rate. The organic materials of component A and component B are mixed evenly in the glue pouring head 16 and discharged, and flow into the HIC container through any glue pouring hole on the HIC cover plate, and the flow rate is controlled to be about 30-50g / s; at the same time, the laser sensor 18 monitors the liquid level of the organic material. When the laser sensor 18 detects that the organic material fills the glue pouring hole, it feeds back a signal to control the metering pumps of components A and B to stop working;

[0093] Then, glue is poured at a small flow rate. Start the rotating platform 22 and restart the metering pumps of components A and B. The rotating platform rotates at a constant speed, so that the glue pouring head 16 pours at a small flow rate in the annular space between the HIC container 21 and the HIC cover plate 19. The flow rate is controlled to be less than 20g / s. Figure 6 Until the gap between the waste steel drum 20 and the HIC container 21 and the annular space between the HIC container 21 and the HIC cover plate 19 are filled with organic materials, and the laser sensor 18 detects that they are full again, the metering pumps of the A and B components stop working.

[0094] After the filling is completed, the liquid receiving tray 15 is opened to be located under the glue filling head 16, and then the glue filling robot arm 17 is rotated to the initial position to prevent the glue from dripping elsewhere.

[0095] Step 8: After the glue pouring is completed, the HIC is transported to the temporary storage area for curing and solidification.

[0096] Then, repeat steps 1-8 above to fill the next HIC; or reset the device and clean it. When the filling head is blocked, replace it with a new one and dispose of the replaced filling head as waste. Clean the dripping organic material in the liquid receiving tray as needed.

[0097] The present invention provides a process device and method for capping HIC with organic materials. The operation is simple, no pipeline cleaning is required, and the amount of secondary waste generated is greatly reduced. The use of laser sensors to monitor the glue filling state can effectively improve the control of the glue filling system. The equipment is simple, small in size, and more compact in layout. The sealing efficiency is improved, and 5 HIC barrels can be filled with glue every 8 hours. The method fully considers the characteristics of the organic material formula, the feasibility of engineering application, the convenience of operation, and the minimization of the amount of secondary waste generated. The organic material is poured into the annular space between the HIC container and the cover plate or the gap between the waste steel barrel and the HIC container. The combination of inorganic and organic materials further improves the waste containment performance and durability of the concrete container, which can effectively reduce the risk of leakage of radioactive nuclides and other harmful components to the environment during long-term storage, and improve the disposal safety of radioactive waste.

[0098] The above embodiments are merely illustrative of the present invention, and the present invention may also be implemented in other specific ways or other specific forms without departing from the gist or essential features of the present invention. Therefore, the described embodiments should be considered illustrative rather than restrictive in any respect. The scope of the present invention should be described by the appended claims, and any changes equivalent to the intent and scope of the claims should also be included within the scope of the present invention.

Claims

1. A process device for capping HIC with organic materials, characterized in that: It includes an organic material preparation and delivery unit and a capping and glue pouring unit. The organic material preparation and delivery unit is arranged in a non-radioactive area on site, and the capping and glue pouring unit is arranged in a radioactive area on site. The organic material preparation and delivery unit is used to prepare and deliver the organic sealing materials of components A and B. The capping and glue pouring unit is used to mix the organic sealing materials of components A and B and then perform glue pouring and capping on the HIC. The organic material preparation and delivery unit includes two passages, which are respectively used for the preparation and delivery of the organic material of component A and the organic material of component B. Each passage includes a batching tank, a feeding pump, a feeding tank and a metering pump which are sequentially connected end to end through a delivery pipeline. The other ends of the two metering pumps are connected to the glue filling head (16) of the capping and glue filling unit. The two feeding pumps respectively transport the organic sealing materials of components A and B from the corresponding batching tanks to the corresponding feeding tanks. The two metering pumps respectively transport the organic sealing materials of components A and B from the corresponding feeding tanks to the glue filling head (16) at a set flow rate. The batching tank and the feeding tank are both equipped with stirring and heating devices, which can meet the feeding demand of 5 HIC caps every 8 hours. The capping and glue pouring unit mainly comprises a screw lifting mechanism (11), a gripper mechanical arm (12), a cover gripper (13), a support column (14), the glue pouring head (16) with a mixing function, a glue pouring mechanical arm (17) and a rotating platform (22); The first ends of the gripper mechanical arm (12) and the glue filling mechanical arm (17) are both movably connected to the support column (14) and can rotate around the support column (14); the screw lifting mechanism (11) is fixed to the second end of the gripper mechanical arm (12), and the cover plate gripper (13) is fixed to the telescopic end of the screw lifting mechanism (11). The cover plate gripper (13) is accurately positioned by the rotation of the gripper mechanical arm (12) and the telescopic movement of the screw lifting mechanism (11), thereby achieving effective gripping and release of the HIC cover plate by the cover plate gripper (13); The glue filling head (16) is fixed to the second end of the glue filling mechanical arm (17). In the glue filling state, the glue filling head (16) is located directly above the annular space between the HIC container (21) and the HIC cover plate (19); the rotating platform (22) can rotate horizontally, and is used to carry the HIC and drive the HIC to rotate, and cooperate with the glue filling head (16) to complete the capping of the HIC; The glue pouring mechanical arm (17) is equipped with a retractable liquid receiving tray (15), and the liquid receiving tray (15) can be located below the glue pouring head (16) to prevent glue from dripping elsewhere.

2. The process device for capping HIC with organic materials according to claim 1, characterized in that: The gripper mechanical arm (12) is provided with a positioning slot for achieving accurate positioning of the cover gripper (13) on the gripper mechanical arm (12).

3. The process device for capping HIC with organic material according to claim 2, characterized in that: The cover plate gripper (13) is powered by pure mechanical means or compressed air.

4. The process device for capping HIC with organic material according to claim 1, characterized in that: The glue filling mechanical arm (17) is provided with a laser sensor (18) for monitoring the glue filling height in the annular space between the HIC container (21) and the HIC cover plate (19); and when the glue filling is full, controlling the metering pump to automatically stop working.

5. The process device for capping HIC with organic material according to claim 1, characterized in that: The rotating platform (22) is provided with a positioning block, and a guiding slope is arranged on the positioning block to ensure that the positioning accuracy of the HIC is within the range of ±2mm after it is placed.

6. A process for capping HIC using the device according to any one of claims 1 to 5, comprising the following steps: S1. Place the HIC on the rotating platform and position it accurately; S2. Open the HIC cover using the cover gripper; S3. Place the waste drum into the HIC container; S4, placing the HIC cover plate back onto the HIC container using the cover plate gripper; S5. Adjust the position of the glue filling head so that it is aligned with one of the glue filling holes of the HIC cover plate; S6. Prepare the organic sealing materials of components A and B respectively according to the formula; S7, open the valve, start the metering pumps of components A and B at the same time, and deliver the organic sealing materials of components A and B to the glue pouring head according to the set flow rate, and cooperate with the rotating platform to complete the glue pouring of the HIC; S8. After the glue pouring is completed, the HIC is transported to a temporary storage area for curing and solidification.

7. The process for capping HIC according to claim 6, characterized in that: In step S5, the distance between the lower end surface of the glue filling head and the upper end surface of the HIC cover plate is within a range of 2 to 20 mm.

8. The HIC capping process according to claim 7, characterized in that: The specific process of glue filling in step S7 is as follows: First, glue is poured at a high flow rate: the flow rate is controlled within the range of 30-50g / s. When the laser sensor detects that the organic material fills the glue filling hole, the metering pumps of components A and B are controlled to automatically stop working; Then, glue is poured at a small flow rate: the rotating platform is started and the metering pumps of components A and B are restarted. The rotating platform rotates at a constant speed, so that the glue pouring head pours glue at a small flow rate in the annular space between the HIC container and the HIC cover plate. The flow rate is controlled to be less than 20g / s. When the laser sensor detects that the glue is full again, the metering pumps of components A and B automatically stop working.

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