Control method and device for transporting special-shaped wafer, electronic equipment and storage medium

Abstract

This application provides a control method, apparatus, electronic device, and storage medium for transporting irregularly shaped wafers. The control method includes: acquiring the current wafer picking layer in a wafer picking command; determining whether the scan result corresponding to the current wafer picking layer indicates the presence of an irregularly shaped wafer; if so, determining the wafer picking position of the current wafer picking layer; if not, updating the current wafer picking layer by one and continuing to determine the corresponding scan result; and controlling a robotic arm to remove the irregularly shaped wafer from the cassette and transport it to a worktable for processing based on the wafer picking position. The technical solution provided in this application enables the automatic control of irregularly shaped wafer transport without manual intervention by attaching the irregularly shaped wafer to a glass substrate and placing it together with the glass substrate in a cassette. By scanning each layer of the cassette, the wafer picking position is determined, and the robotic arm is controlled to remove the irregularly shaped wafer from the picking position in the cassette and place it on the worktable, thereby improving the processing efficiency of irregularly shaped wafers.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor processing equipment, in particular to a control method and device for transmission of special-shaped wafers, an electronic device and a storage medium. BACKGROUND

[0002] A wafer is a silicon wafer used for manufacturing silicon semiconductor circuits. With the continuous development of integrated circuit (IC) manufacturing technology, the feature size of chips is becoming smaller and smaller, the number of interconnections is becoming more and more, and the diameter of wafers is also increasing. To realize multi-layer wiring, the wafer surface must have extremely high flatness, smoothness and cleanliness, so the wafer needs to be transmitted to a worktable by a mechanical hand for processing to ensure the processing efficiency of the wafer.

[0003] At present, the transmission process of the wafer is mainly for regular wafers, i.e. circular wafers, but for special-shaped wafers, artificial transmission is still needed, which not only increases the labor cost, but also affects the quality of the wafer and reduces the processing efficiency of the wafer. Therefore, how to control the transmission of the special-shaped wafer to improve the processing efficiency of the special-shaped wafer has become a problem to be solved. SUMMARY

[0004] Therefore, the present application aims to provide a control method and device for transmission of special-shaped wafers, an electronic device and a storage medium, which can realize automatic control of the transmission of the special-shaped wafer without manual intervention by attaching the special-shaped wafer to a glass substrate, placing the glass substrate in a magazine together, determining the wafer taking position of the special-shaped wafer by scanning each layer of the magazine, and controlling the mechanical hand to take out the special-shaped wafer from the wafer taking position of the magazine and place it on the worktable, thereby improving the processing efficiency of the special-shaped wafer.

[0005] The present application mainly includes the following aspects:

[0006] In a first aspect, the present application provides a control method for transmission of special-shaped wafers, applied to a control system for transmission of special-shaped wafers, the control system comprising special-shaped wafers attached to a glass substrate, a magazine, a mechanical hand and a worktable; the magazine has N layers, each layer being used for containing the special-shaped wafers, and the layer spacing between each layer in the magazine is equal; the mechanical hand has a detection sensor; and the control method comprises:

[0007] obtaining a scanning instruction, and controlling the detection sensor to scan each layer in the magazine to determine whether the layer has a special-shaped wafer according to the scanning instruction, thereby obtaining the scanning result of each layer in the magazine;

[0008] obtaining a current wafering layer in a wafering instruction, determining whether a scanning result corresponding to the current wafering layer indicates a wafer with a special shape according to scanning results of each layer in the magazine; if yes, determining a wafering position of the current wafering layer; if not, updating the current wafering layer to a next layer and continuing to determine the scanning result corresponding to the next layer;

[0009] controlling a mechanical arm to take out the wafer with the special shape from the magazine according to the wafering position and transmit the wafer to a workbench for processing.

[0010] Further, the scanning result of each layer in the magazine is obtained by the following steps:

[0011] obtaining a scanning position of a wafer with a special shape that can be scanned in a first layer in the magazine;

[0012] determining scanning positions of wafers with special shapes that can be scanned in each layer in the magazine according to the number of layers of the magazine, an interval between each layer in the magazine and the scanning position of the wafer with the special shape that can be scanned in the first layer in the magazine;

[0013] determining a scanning range of the wafer with the special shape that can be scanned in each layer in the magazine according to the scanning position of the wafer with the special shape that can be scanned in each layer in the magazine and a preset allowance;

[0014] controlling the detection sensor to start to rise and scan from a lowest position of the scanning range of a current layer in the magazine according to the scanning range and taking the first layer in the magazine as the current layer, and obtaining a scanning signal of the detection sensor in the scanning range of the current layer;

[0015] determining a scanning result of the current layer according to the scanning signal in the scanning range of the current layer, and updating a next layer in the magazine to the current layer to continue to scan, until the current scanning position of the detection sensor rises to a highest position of the scanning range of the Nth layer in the magazine to stop scanning, thereby obtaining the scanning result of each layer in the magazine.

[0016] Further, the scanning result of the current layer is determined by the following steps:

[0017] determining whether the current scanning position of the detection sensor exceeds the highest position of the scanning range of the current layer in real time;

[0018] if not, continuing to obtain the scanning signal;

[0019] If yes, it is determined whether there is a high level in the scanning range of the current layer in the scanning signal, if yes, the scanning position of the current layer to the scanning position of the special-shaped wafer is determined as the wafer taking position, and the wafer taking position and the indication information that the current layer has the special-shaped wafer are determined as the scanning result of the current layer; if not, the indication information that the current layer does not have the special-shaped wafer is determined as the scanning result of the current layer.

[0020] Further, the special-shaped wafer is taken out from the magazine by the following steps:

[0021] The thickness of the special-shaped wafer carried and sucked by the manipulator and the thickness of the glass substrate are obtained;

[0022] According to the thickness of the special-shaped wafer carried and sucked by the manipulator, the thickness of the glass substrate and the layer spacing between each layer in the magazine, the wafer taking margin of the manipulator is determined;

[0023] According to the wafer taking position and the wafer taking margin, the wafer taking high position and the wafer taking low position of the manipulator are determined;

[0024] The current position of the manipulator is obtained, and the manipulator is controlled to move to the wafer taking low position to horizontally stretch out;

[0025] After the manipulator horizontally stretches out, the manipulator is controlled to move to the wafer taking high position to open the vacuum to adsorb the special-shaped wafer and then horizontally retract, and the manipulator is controlled to take out the special-shaped wafer from the magazine.

[0026] Further, the control method further comprises:

[0027] After the special-shaped wafer is taken out from the magazine, the manipulator is controlled to rotate to the rotating position and then move to the pre-determined workbench high position, and the manipulator is controlled to stretch out and close the vacuum at the workbench high position and then move to the pre-determined workbench low position;

[0028] After the manipulator moves to the workbench low position, it is determined whether the workbench adsorbs the special-shaped wafer, if yes, the manipulator is controlled to horizontally retract from the workbench low position to place the special-shaped wafer on the workbench for processing.

[0029] Further, the rotating position is determined by the following steps:

[0030] The detection sensor is controlled to start upward scanning from the bottom of the workbench, when the grooves of the workbench can be scanned within a preset time, the detection sensor is controlled to stop rising and rotate to scan the top surface of the workbench according to a preset rotating sequence, and the positions of the grooves on the top surface of the workbench are obtained.

[0031] According to the positions of the recesses on the table top of the worktable scanned for multiple times, the rotating position of the mechanical hand is determined.

[0032] Further, the high position of the worktable is determined according to the positions of the worktable top scanned for multiple times and the thickness of the special-shaped wafer carried and sucked by the mechanical hand; and the low position of the worktable is determined according to the positions of the worktable top scanned for multiple times and the positions of the recess top of the worktable scanned for multiple times.

[0033] In a second aspect, the embodiments of the present application further provide a control device for special-shaped wafer transmission, applied to a control system for special-shaped wafer transmission, the control system comprising special-shaped wafers attached to a glass substrate, a magazine, a mechanical hand and a worktable; the magazine has N layers, each layer being used for containing the special-shaped wafers, and the layer spacing between each layer in the magazine being equal; the mechanical hand has a detection sensor; and the control device comprises:

[0034] a scanning module, configured to acquire a scanning instruction, control the detection sensor to scan whether each layer in the magazine has a special-shaped wafer according to the scanning instruction, and obtain a scanning result of each layer in the magazine;

[0035] a processing module, configured to acquire a current wafer-taking layer in a wafer-taking instruction, determine whether the scanning result corresponding to the current wafer-taking layer indicates that the current wafer-taking layer has a special-shaped wafer according to the scanning result of each layer in the magazine; if yes, determine a wafer-taking position of the current wafer-taking layer; and if no, update the current wafer-taking layer to be one more than the current wafer-taking layer and continue to determine the corresponding scanning result;

[0036] a control module, configured to control the mechanical hand to take out the special-shaped wafer from the magazine to the worktable for processing according to the wafer-taking position.

[0037] In a third aspect, the embodiments of the present application further provide an electronic device, comprising a processor, a memory and a bus, the memory storing machine readable instructions executable by the processor, the processor and the memory communicating through the bus when the electronic device is running, and the machine readable instructions being executed by the processor to perform the steps of the control method for special-shaped wafer transmission as described above.

[0038] In a fourth aspect, the embodiments of the present application further provide a computer readable storage medium, the computer readable storage medium storing a computer program, the computer program being executed by the processor to perform the steps of the control method for special-shaped wafer transmission as described above.

[0039] The embodiment of the application provides a control method and device for transmission of a special wafer, electronic equipment and a storage medium, which are applied to a control system for transmission of a special wafer, and the control system comprises a special wafer attached to a glass substrate, a magazine, a mechanical hand and a workbench; the magazine has N layers, each layer being used for containing the special wafer, and the layer spacing between each layer in the magazine is equal; the mechanical hand is provided with a detection sensor; the control method comprises the following steps: obtaining a scanning instruction, controlling the detection sensor to scan each layer in the magazine according to the scanning instruction to obtain a scanning result of each layer in the magazine; obtaining a current wafer taking layer in a wafer taking instruction, determining whether the scanning result corresponding to the current wafer taking layer indicates that the special wafer exists or not according to the scanning result of each layer in the magazine; if yes, determining a wafer taking position of the current wafer taking layer; if no, updating the current wafer taking layer to a next layer and continuing to determine the scanning result corresponding to the next layer; and controlling the mechanical hand to take out the special wafer from the magazine according to the wafer taking position and transmit the special wafer to the workbench for processing.

[0040] In this way, by adopting the technical scheme provided in the application, the special wafer is attached to the glass substrate, and the glass substrate and the special wafer are placed in the magazine together; the wafer taking position of the special wafer is determined by scanning each layer in the magazine; the mechanical hand is controlled to take out the special wafer from the wafer taking position of the magazine and place the special wafer on the workbench, so that the transmission of the special wafer is automatically controlled without manual intervention, and the processing efficiency of the special wafer is improved.

[0041] In order to make the above objectives, characteristics and advantages of the application more apparent, the following will describe a preferred embodiment in detail, and the accompanying drawings will be referred to, and the detailed description will be as follows. BRIEF DESCRIPTION OF DRAWINGS

[0042] In order to more clearly illustrate the technical scheme of the embodiment of the application, the following will briefly introduce the drawings needed to be used in the embodiment, and it should be understood that the following drawings only show some embodiments of the application, and therefore should not be regarded as a limitation to the scope, and for those skilled in the art, other related drawings can also be obtained without creative labor on the basis of the drawings.

[0043] Figure 1 A flow chart of a control method for transmission of a special wafer provided by the embodiment of the application is shown;

[0044] Figure 2 A flow chart of another control method for transmission of a special wafer provided by the embodiment of the application is shown;

[0045] Figure 3 A structural schematic diagram for controlling transmission of a special wafer provided by the embodiment of the application is shown;

[0046] Figure 4 Fig. 2 shows a structural schematic diagram of the control device for the transmission of the shaped wafer according to an embodiment of the present application;

[0047] Figure 5 Fig. 1 shows a structural diagram of a control device for the transmission of the shaped wafer according to an embodiment of the present application;

[0048] Figure 6 Fig. 2 shows a structural diagram of a control device for the transmission of the shaped wafer according to an embodiment of the present application;

[0049] Figure 7 Fig. 3 shows a structural schematic diagram of an electronic device according to an embodiment of the present application.

[0050] Icon: 1 - servo motor; 2 - module; 3 - sliding frame and connecting piece; 4 - stepping motor; 5 - air cylinder; 6 - mechanical hand; 7 - detection sensor; 510 - control device; 511 - scanning module; 512 - processing module; 513 - control module; 514 - placing module; 515 - determining module; 700 - electronic device; 710 - processor; 720 - memory; 730 - bus. DETAILED DESCRIPTION

[0051] To make the objectives, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. It should be understood that the drawings in the present application only serve the purpose of description and illustration, and are not used to limit the scope of protection of the present application. In addition, it should be understood that the schematic drawings are not drawn according to the actual proportions. The flowcharts show the operations implemented according to some embodiments of the present application. It should be understood that the operations of the flowcharts can not be implemented in sequence, and the steps without logical context relationship can be reversed in sequence or implemented simultaneously. In addition, one or more other operations can be added to the flowcharts or one or more operations can be removed from the flowcharts under the guidance of the content of the present application.

[0052] In addition, the described embodiments are only some of the embodiments of the present application, not all the embodiments. The components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0053] In order to enable those skilled in the art to use the content of the present application, the following embodiments are given in combination with a specific application scenario "transportation of special-shaped wafers", and the general principles defined herein can be applied to other embodiments and application scenarios without departing from the spirit and scope of the present application.

[0054] The method, device, electronic equipment or computer readable storage medium of the embodiments of the present application can be applied to any scenario requiring transportation of special-shaped wafers, and the embodiments of the present application do not limit the specific application scenario. Any solution using the control method, device, electronic equipment and storage medium provided by the embodiments of the present application for transportation of special-shaped wafers is within the protection scope of the present application.

[0055] It is worth noting that the wafer is a silicon wafer used for manufacturing silicon semiconductor circuits. With the continuous development of integrated circuit (IC) manufacturing technology, the feature size of the chip is getting smaller and smaller, the number of interconnections is getting more and more, and the diameter of the wafer is also increasing. To realize multi-layer wiring, the wafer surface must have extremely high flatness, smoothness and cleanliness, so the wafer needs to be transported to the workbench by the mechanical hand for processing to ensure the processing efficiency of the wafer.

[0056] At present, the transportation process of the wafer is mainly for regular wafers, i.e. circular wafers, but for non-circular special-shaped wafers, manual transportation is still needed, which not only increases the labor cost, but also affects the quality of the wafer and reduces the processing efficiency of the wafer. Therefore, how to control the transportation of the special-shaped wafer to improve the processing efficiency of the special-shaped wafer has become a problem to be solved.

[0057] Based on this, the present application proposes a control method, device, electronic equipment and storage medium for transportation of special-shaped wafers, which are applied to a control system for transportation of special-shaped wafers, the control system comprising special-shaped wafers attached to a glass substrate, a magazine, a mechanical hand and a workbench; the magazine has N layers, each layer being used to hold the special-shaped wafers, and the layer spacing between each layer in the magazine is equal; the mechanical hand has a detection sensor; the control method comprises: obtaining a scanning instruction, controlling the detection sensor to scan whether each layer in the magazine has a special-shaped wafer according to the scanning instruction, and obtaining the scanning result of each layer in the magazine; obtaining a current wafer taking layer in a wafer taking instruction, determining whether the scanning result corresponding to the current wafer taking layer indicates that there is a special-shaped wafer according to the scanning result of each layer in the magazine; if yes, determining the wafer taking position of the current wafer taking layer; if not, updating the current wafer taking layer by one to continue to determine the corresponding scanning result; and controlling the mechanical hand to take out the special-shaped wafer from the magazine according to the wafer taking position and transport it to the workbench for processing.

[0058] In this way, by adopting the technical scheme provided in the application, the shaped wafer is attached to the glass substrate, and the glass substrate and the shaped wafer are placed in the magazine. The picking position of the shaped wafer is determined by scanning each layer of the magazine. The shaped wafer is picked up from the picking position of the magazine by the mechanical hand and placed on the workbench. The transmission of the shaped wafer is automatically controlled without manual intervention, and the processing efficiency of the shaped wafer is improved.

[0059] In order to facilitate the understanding of the present application, the technical scheme provided by the present application will be described in detail below in combination with specific embodiments.

[0060] Please refer to Figure 1 , Figure 1 The flow chart of the control method for the shaped wafer transmission provided by the embodiment of the present application is shown in Figure 1 The control system for the shaped wafer transmission, which comprises the shaped wafer attached to the glass substrate, the magazine, the mechanical hand and the workbench. The number of layers of the magazine is N layers, each layer is used to hold the shaped wafer, and the layer spacing between each layer in the magazine is equal. The detection sensor is provided in the mechanical hand. The control method comprises the following steps:

[0061] S101, a scanning instruction is obtained, and the detection sensor is controlled to scan each layer of the magazine to determine whether the shaped wafer is present in each layer of the magazine, and the scanning result of each layer of the magazine is obtained.

[0062] It should be noted that the step of obtaining the scanning result of each layer of the magazine is described in detail in Figure 2 , Figure 2 The flow chart of another control method for the shaped wafer transmission provided by the embodiment of the present application is shown in Figure 2 The scanning result of each layer of the magazine is obtained by the following steps:

[0063] S201, the scanning position of the shaped wafer in the first layer of the magazine is obtained.

[0064] In this step, the scanning position of the shaped wafer in the first layer of the magazine is determined according to the experimental data, and is recorded as P1.

[0065] S202, the scanning position of the shaped wafer in each layer of the magazine is determined according to the number of layers of the magazine, the layer spacing between each layer of the magazine and the scanning position of the shaped wafer in the first layer of the magazine.

[0066] In this step, the position P of the shaped wafer in the Nth layer of the magazine is obtained according to the number of layers N of the magazine, the layer spacing M between each layer of the magazine and the scanning position P1 of the shaped wafer in the first layer of the magazine. NWherein, the formula of the position of each layer of the magazine that can scan the irregular wafer is as follows:

[0067] P N = P1+M×(N-1), N=1, 2, …, N;

[0068] Here, according to the above formula, the position of each layer of the magazine that can scan the irregular wafer can be determined.

[0069] S203, according to the scanning position of each layer of the magazine that can scan the irregular wafer and the preset margin, determining the scanning range of each layer of the magazine that can scan the irregular wafer;

[0070] In this step, considering that the glass substrate attached to the irregular wafer has a large thickness, the position of each layer scanning the irregular wafer is a range, assuming that the preset margin is X, X is greater than T / 2 and less than M / 2, wherein T is the thickness of the glass substrate, and the scanning range of the Nth layer is P N -X~P N +X.

[0071] S204, according to the scanning range, taking the first layer of the magazine as the current layer to control the detection sensor to start rising scanning from the lowest of the scanning range of the current layer of the magazine, and acquiring the scanning signal of the detection sensor in the scanning range of the current layer;

[0072] In this step, the detection sensor in the mechanical hand is controlled to start rising scanning from P1-X, N is recorded as 1, the first layer is determined as the current layer, which indicates that the current scanning position of the detection sensor is in the first layer of the magazine, and the scanning signal of the detection sensor is acquired in real time, when the glass substrate is scanned, the scanning signal is high (ON), and when the glass substrate is not scanned, the scanning signal is low (OFF).

[0073] S205, according to the scanning signal in the scanning range of the current layer, determining the scanning result of the current layer, and updating the next layer of the magazine as the current layer to continue scanning, until the current scanning position of the detection sensor rises to the highest of the scanning range of the Nth layer of the magazine to stop scanning, and the scanning result of each layer of the magazine is obtained.

[0074] It should be noted that the scanning result of the current layer is determined by the following steps:

[0075] S2051, acquiring the current scanning position of the detection sensor in real time, and determining whether the current scanning position of the detection sensor exceeds the highest of the scanning range of the current layer;

[0076] S2052, if not, continue to acquire the scanning signal;

[0077] S2053, if yes, it is determined whether there is a high level in the scanning signal in the scanning range of the current layer, if yes, the scanning position of the current layer that can scan to the wafer with irregular shape is determined as the picking position, and the picking position and the indication information that the current layer has the wafer with irregular shape are determined as the scanning result of the current layer; if no, the indication information that the current layer does not have the wafer with irregular shape is determined as the scanning result of the current layer.

[0078] In this step, before scanning the next layer, it is determined whether there is a high level in the scanning signal in the scanning range of the current layer, if yes, the current layer is determined to have the wafer with irregular shape, and the scanning position of the current layer that can scan to the wafer with irregular shape is determined as the picking position; for example, when the scanning signal appears ON in the range of P1-X~P1+X, it is determined that the first layer of the magazine has the wafer with irregular shape, P1 is determined as the picking position, and the indication information that the first layer has the wafer with irregular shape and the picking position P1 are determined as the scanning result of the first layer of the magazine.

[0079] Here, in step S205, when the current scanning position of the detection sensor exceeds P1+X, the next layer is updated as the current layer to continue to acquire the scanning signal, and every time the current scanning position of the detection sensor exceeds the highest position of the scanning range of the current layer, i.e. exceeds P N +X, the next layer is updated as the current layer by N=N+1 until the current scanning position of the detection sensor exceeds the highest position of the scanning range of the highest layer, i.e. the Nth layer, to stop scanning and acquire the scanning result of each layer.

[0080] In this step, after determining the scanning result of the current layer, the control method further comprises:

[0081] 1) determining whether the change of the scanning signal in the scanning range of the current layer is from low level to high level and then from high level to low level;

[0082] 2) if no, generating error information to alarm, and after the alarm is removed, re-scanning the current layer;

[0083] 3) if yes, updating the next layer of the magazine as the current layer to continue scanning.

[0084] In this step, when the lifting position of the mechanical arm is in P N -X to P NIf the detection sensor has a signal output, it is recorded as a wafer, A[N]=1. In this process, the scanning signal of the sensor output changes from OFF (low level) to ON (high level) and from ON to OFF. If one of the two processes is missing, it indicates that the special wafer is placed obliquely or the special wafer is too thick or there are stacked wafers, and the current layer reports an error, which needs to be manually adjusted. After the alarm is cleared, the layer is scanned again until the scanning signal of the sensor output changes from OFF to ON and then from ON to OFF. If the lifting position is greater than P N +X, then N=N+1, and the cycle is repeated to obtain the scanning result.

[0085] S102, obtaining a current wafer taking layer in a wafer taking instruction, determining whether the scanning result corresponding to the current wafer taking layer indicates that there is a special wafer in each layer of the magazine according to the scanning result of each layer of the magazine; if yes, determining a wafer taking position of the current wafer taking layer; if no, updating the current wafer taking layer by one to continue determining the corresponding scanning result;

[0086] In this step, when taking wafers, the current wafer taking layer is determined from the first layer to the Nth layer in the magazine according to the wafer taking instruction, and the corresponding wafer taking position is determined according to the scanning result of the current wafer taking layer. For example, the current wafer taking layer is the third layer in the magazine, and the scanning result A[3]:1, P3 of the third layer is obtained. The 1 in A[3] indicates that there is a special wafer in the third layer, and then P3 in A[3] is obtained. P3 is the wafer taking position of the third layer. If the current wafer taking layer is the fourth layer in the magazine, the scanning result A[4]:0 of the fourth layer is obtained. The fourth layer does not have a special wafer, and the next layer, i.e., the fifth layer, is continuously determined whether it has a special wafer. In this way, when a layer with a special wafer is determined, the special wafer in the layer is taken out and placed on the workbench.

[0087] S103, controlling a robot to take the special wafer from the magazine according to the wafer taking position and transmit the special wafer to the workbench for processing.

[0088] It should be noted that the robot is controlled to take the special wafer from the magazine by the following steps:

[0089] S1031, obtaining the thickness of the special wafer carried and sucked by the robot and the thickness of the glass substrate;

[0090] S1032, determining a wafer taking allowance of the robot according to the thickness of the special wafer carried and sucked by the robot, the thickness of the glass substrate, and the layer spacing between each layer in the magazine;

[0091] In this step, the wafer taking allowance satisfies the following formula:

[0092] d + Y + T < M;

[0093] Wherein, d is the thickness of the robot carrying and sucking the special-shaped wafer; Y is the wafer taking allowance; T is the thickness of the glass substrate; M is the layer spacing between each layer in the magazine.

[0094] S1033, determining a wafer taking high position and a wafer taking low position of the robot according to the wafer taking position and the wafer taking allowance;

[0095] In this step, the formula of the wafer taking high position and the wafer taking low position is as follows:

[0096] L[N] = P N -d-Y;

[0097] H[N] = P N +d+Y;

[0098] Wherein, L[N] is the wafer taking low position; P N is the wafer taking position of the Nth layer; Y is the wafer taking allowance; d is the thickness of the robot carrying and sucking the special-shaped wafer; H[N] is the wafer taking high position.

[0099] S1034, obtaining the current position of the robot, and controlling the robot to move to the wafer taking low position to horizontally stretch out;

[0100] In this step, the robot is controlled to move to the wafer taking low position, that is, to horizontally stretch out at L[N].

[0101] S1035, after the robot horizontally stretches out, controlling the robot to move to the wafer taking high position to open vacuum to suck the special-shaped wafer and then horizontally retract, and controlling the robot to take the special-shaped wafer out of the magazine.

[0102] In this step, after the robot horizontally stretches out at L[N], the robot is moved (upward) to the wafer taking high position, that is, to open vacuum to suck the special-shaped wafer at H[N], and then the robot is controlled to horizontally retract at H[N] to take the special-shaped wafer out of the Nth layer of the magazine, N is 1, 2, 3, …, N; after the special-shaped wafer is taken out of the magazine, the scanning result of this layer is determined as no wafer; for example, according to the scanning result A[3]: 1, P3, after the special-shaped wafer of the third layer is taken out, the scanning result A[3] is updated as A[3]: 0.

[0103] It should be noted that the control method further comprises:

[0104] 1) after the special-shaped wafer is taken out of the magazine, according to a predetermined rotation position, the robot is controlled to rotate to the rotation position, then move to a predetermined worktable high position, at the worktable high position, the robot is controlled to stretch out and close vacuum, and then move to a predetermined worktable low position.

[0105] It is necessary to explain that the rotating position is determined by the following steps:

[0106] (1) Control the detection sensor to start rising from the bottom of the worktable and scan, when the grooves of the worktable can be scanned within the preset time, control the detection sensor to stop rising and rotate the worktable top surface according to the preset rotating sequence to obtain the position of the groove on the worktable top surface;

[0107] In this step, the middle part of the worktable has a groove, which crosses the worktable and is used for the lifting of the mechanical hand to place the special-shaped wafer on the top surface of the worktable. For example, if the worktable is a cylinder, the top surface of the worktable is circular, and the middle part of the circular top surface has a rectangle which crosses the circular top surface, and the rectangle is the top surface of the groove viewed from above.

[0108] Here, the detection sensor rises from the bottom of the worktable, and stops rising when the output signal of the detection sensor changes from ON (high level) to OFF (low level) and remains OFF. At this time, the mechanical hand rotates from left to right, and the moving range covers the entire worktable. According to the change of the output signal of the detection sensor, the rotating position is determined. The actual rotating position S1 is recorded at the moment when the output signal of the detection sensor changes from ON to OFF, and the actual rotating position S2 is recorded at the moment when the output signal of the detection sensor changes from OFF to ON. S1 and S2 are on the boundary of the groove, and the boundary of the groove is determined by S1 and S2.

[0109] (2) According to the positions of the grooves on the top surface of the worktable scanned for multiple times, the rotating position of the mechanical hand is determined.

[0110] In this step, when the output signal of the detection sensor is ON for a period of time, the rotating is stopped, and the above process is repeated n times to obtain the average value S 1A and S 2A of the n results, and the formula of the rotating position is as follows:

[0111]

[0112] Wherein, S is the rotating position.

[0113] It should be noted that the high position of the workbench is determined according to the positions of the top surface of the workbench scanned for multiple times and the thickness of the special-shaped wafer carried and sucked by the mechanical arm; the low position of the workbench is determined according to the positions of the top surface of the workbench scanned for multiple times and the positions of the top surface of the groove of the workbench scanned for multiple times; the determination process of the high position of the workbench and the low position of the workbench is similar to the above-mentioned process of determining the rotating position, and here will not be repeated, only the mechanical arm is rotated first and then lifted, and the actual lifting position is determined according to multiple scans, including the actual lifting position Z1 of the top surface of the workbench (the position of the top surface of the workbench) and the actual lifting position Z2 of the top surface of the groove (the position of the top surface of the groove of the workbench), and the determination formula of the high position of the workbench and the low position of the workbench is as follows:

[0114] Z H = Z1 + d + Q;

[0115]

[0116] Z H is the high position of the workbench; Q is the measurement allowance; d is the thickness of the special-shaped wafer carried and sucked by the mechanical arm; and Z L is the low position of the workbench.

[0117] 2) After the mechanical arm moves to the low position of the workbench, it is determined whether the workbench is vacuum adsorbed with the special-shaped wafer, if yes, the mechanical arm is controlled to horizontally retract from the low position of the workbench to place the special-shaped wafer on the workbench for processing.

[0118] In this step, the special-shaped wafer is placed on the workbench for processing, for example, the total thickness of the special-shaped wafer and the attached glass substrate is measured on the workbench, the thickness of the special-shaped wafer is determined according to the thickness of the glass substrate, and the special-shaped wafer is polished, after the processing of the special-shaped wafer is completed, the mechanical arm takes away the special-shaped wafer from the workbench and puts it into another box, and the transmission process is similar, only the sequence of actions is adjusted, which will not be repeated here, and the automatic feeding and discharging is completed at this time.

[0119] Please refer to Figure 3 , 4, Figure 3 is one of the structure schematic diagrams for controlling the transmission of the special-shaped wafer provided by the embodiment of the application, Figure 4 is the second structure schematic diagram for controlling the transmission of the special-shaped wafer provided by the embodiment of the application, as Figure 3As shown in the figure, the structure for controlling the transmission of the special wafer includes a servo motor 1, a module 2, a sliding frame and a connecting piece 3, a stepping motor 4, a cylinder 5 and a mechanical hand 6. The servo motor 1 with an encoder is connected with the module 2, which is used to drive the sliding frame and the connecting piece 3 on the module 2. The sliding frame and the connecting piece 3 are located at the lower end of the module 2, which is used to control the lifting of the mechanical hand 6. The stepping motor 4 is located at the upper end of the sliding frame and the connecting piece 3 of the module 2, which is used to drive the rotation of the mechanical hand 6. The cylinder 5 is located at the upper end of the stepping motor 4, which is used to control the extension and retraction of the mechanical hand 6. The mechanical hand 6 is installed on the piston rod of the cylinder 5, which is used to adsorb and take the special wafer. As shown in the figure, Figure 4 the structure for controlling the transmission of the special wafer also includes a detection sensor 7, which is located inside the mechanical hand 6 and exposed in the small hole at the front end of the mechanical hand 6, which is used to scan whether each layer of the wafer box has the special wafer.

[0120] For example, the detection sensor 7 detects whether each layer of the special wafer in the wafer box has the special wafer, the servo motor 1 drives the sliding frame and the connecting piece 3 on the module 2 to control the mechanical hand 6 to rise from the initial scanning position (the position below the lowest layer scanning to the special wafer) to the high scanning position (the position above the highest layer scanning to the special wafer) at a certain speed. When the detection sensor 7 is opposite to the special wafer, the detection sensor 7 has an output signal, which is recorded as having a wafer. According to the current scanning position, the number of layers of the special wafer scanned currently is calculated, and in this way, the number of layers of the wafer box having the special wafer can be obtained and recorded. When taking the wafer automatically, the number of layers of the wafer to be taken is determined first, and according to the scanning result of the detection sensor 7, the wafer is taken from the lowest layer having the special wafer, and the low position and the high position of the wafer to be taken can be calculated according to the layer number. The stepping motor 4 is controlled to drive the mechanical hand 6 to rotate to the wafer taking position, the servo motor 1 is controlled to drive the sliding frame and the connecting piece 3 on the module 2 to control the mechanical hand 6 to rise to the low position of the wafer to be taken, the cylinder 5 is controlled to make the mechanical hand 6 extend, the servo motor 1 is controlled to drive the sliding frame and the connecting piece 3 on the module 2 to control the mechanical hand 6 to rise to the high position of the wafer to be taken, the vacuum is opened, the special wafer is adsorbed, the cylinder 5 is controlled to make the mechanical hand 6 retract, the servo motor 1 is controlled to drive the sliding frame and the connecting piece 3 on the module 2 to make the mechanical hand 6 descend to the waiting position, and the automatic wafer taking is completed. After the wafer taking is completed, the data of the layer in the scanning record is cleared, that is, the record of the layer having the special wafer is cleared. After the mechanical hand 6 places the special wafer on the measuring table, the stepping motor 4 is controlled to drive the mechanical hand 6 to rotate to the measuring position, the servo motor 1 is controlled to drive the sliding frame and the connecting piece 3 on the module 2 to make the mechanical hand 6 rise to the high measuring position, the cylinder 5 is controlled to make the mechanical hand 6 extend, the vacuum is closed, the servo motor 1 is controlled to drive the sliding frame and the connecting piece 3 on the module 2 to make the mechanical hand 6 descend to the low measuring position, and finally the cylinder 5 is controlled to make the mechanical hand 6 retract, and the wafer placing is completed.

[0121] This application provides a control method for transporting irregularly shaped wafers, applied to a control system for transporting irregularly shaped wafers. The control system includes an irregularly shaped wafer attached to a glass substrate, a cassette, a robotic arm, and a worktable. The cassette has N layers, each layer holding the irregularly shaped wafer, and the interlayer spacing between each layer in the cassette is equal. The robotic arm has a detection sensor. The control method includes: acquiring a scanning command; controlling the detection sensor to scan each layer in the cassette to check for irregularly shaped wafers according to the scanning command, obtaining the scanning result of each layer in the cassette; acquiring the current wafer-retrieving layer in a wafer-retrieving command; determining whether the scanning result corresponding to the current wafer-retrieving layer indicates the presence of an irregularly shaped wafer according to the scanning result of each layer in the cassette; if yes, determining the wafer-retrieving position of the current wafer-retrieving layer; if not, incrementing the current wafer-retrieving layer by one to update it and continuing to determine the corresponding scanning result; controlling the robotic arm to remove the irregularly shaped wafer from the cassette according to the wafer-retrieving position and transporting it to the worktable for processing.

[0122] Thus, by adopting the technical solution provided in this application, irregularly shaped wafers can be attached to a glass substrate and placed together with the glass substrate in a material box. By scanning each layer of the material box, the wafer pick-up position can be determined, and the robot arm can be controlled to pick up the irregularly shaped wafer from the pick-up position in the material box and place it on the worktable. This achieves automatic control of the transfer of irregularly shaped wafers without human intervention, thereby improving the processing efficiency of irregularly shaped wafers.

[0123] Based on the same application concept, this application also provides a control device for irregular wafer transmission, which corresponds to the control method for irregular wafer transmission provided in the above embodiment. Since the principle of the device in this application is similar to the control method for irregular wafer transmission in the above embodiment, the implementation of the device can refer to the implementation of the method, and the repeated parts will not be described again.

[0124] Please see Figure 5 , Figure 6 , Figure 5 This is one of the structural diagrams of a control device for transporting irregularly shaped wafers provided in an embodiment of this application. Figure 6 This is a second structural diagram of a control device for transporting irregularly shaped wafers, provided in an embodiment of this application. Figure 5 As shown, a control system for transporting irregularly shaped wafers includes an irregularly shaped wafer attached to a glass substrate, a hopper, a robotic arm, and a worktable; the hopper has N layers, each layer holding the irregularly shaped wafer, and the spacing between each layer in the hopper is equal; the robotic arm has a detection sensor; the control device 510 includes:

[0125] The scanning module 511 is configured to acquire a scanning instruction, control the detection sensor to scan whether each layer in the magazine has a special-shaped wafer according to the scanning instruction, and obtain a scanning result of each layer in the magazine.

[0126] The processing module 512 is configured to acquire a current wafer-taking layer in a wafer-taking instruction, determine whether a scanning result corresponding to the current wafer-taking layer indicates that the current wafer-taking layer has a special-shaped wafer according to the scanning result of each layer in the magazine, determine a wafer-taking position of the current wafer-taking layer if the scanning result indicates that the current wafer-taking layer has a special-shaped wafer, and update the current wafer-taking layer to be a next layer in the magazine and continue to determine a corresponding scanning result if the scanning result does not indicate that the current wafer-taking layer has a special-shaped wafer.

[0127] The control module 513 is configured to control a mechanical arm to take the special-shaped wafer from the magazine to a workbench for processing according to the wafer-taking position.

[0128] Optionally, when the scanning module 511 is used to obtain the scanning result of each layer in the magazine, the scanning module 511 is specifically configured to:

[0129] acquire a scanning position at which the first layer in the magazine can scan to the special-shaped wafer;

[0130] determine scanning positions at which each layer in the magazine can scan to the special-shaped wafer according to the number of layers of the magazine, an interlayer spacing between each layer in the magazine, and the scanning position at which the first layer in the magazine can scan to the special-shaped wafer;

[0131] determine a scanning range at which each layer in the magazine can scan to the special-shaped wafer according to the scanning position at which each layer in the magazine can scan to the special-shaped wafer and a preset allowance;

[0132] control the detection sensor to start to ascend and scan from a lowest position of the scanning range of the current layer of the magazine according to the scanning range and acquire a scanning signal of the detection sensor in the scanning range of the current layer of the magazine;

[0133] determine a scanning result of the current layer according to the scanning signal in the scanning range of the current layer, and update a next layer of the magazine to be the current layer to continue to scan, until the current scanning position of the detection sensor ascends to a highest position of the scanning range of the Nth layer of the magazine to stop scanning, so as to obtain the scanning result of each layer in the magazine.

[0134] Optionally, when the scanning module 511 is used to determine the scanning result of the current layer, the scanning module 511 is specifically configured to:

[0135] acquire the current scanning position of the detection sensor in real time, and determine whether the current scanning position of the detection sensor exceeds the highest position of the scanning range of the current layer;

[0136] If no, continue to acquire the scanning signal;

[0137] If yes, determine whether the scanning signal has a high level within the scanning range of the current layer, if yes, determine the scanning position of the current layer to the scanning position of the irregular wafer as the picking position, and determine the picking position and the indication information that the current layer has the irregular wafer as the scanning result of the current layer; if no, determine the indication information that the current layer does not have the irregular wafer as the scanning result of the current layer.

[0138] Optionally, the scanning module 511 is further used for:

[0139] determining whether the change of the scanning signal within the scanning range of the current layer is from a low level to a high level and then from the high level to the low level;

[0140] if no, generating error information for alarm, and after the alarm is removed, re-performing the scanning of the current layer;

[0141] if yes, updating the next layer of the magazine as the current layer to continue the scanning.

[0142] Optionally, when the control module 513 is used for controlling the robot to take out the irregular wafer from the magazine, the control module 513 is specifically used for:

[0143] acquiring the thickness of the irregular wafer carried and sucked by the robot and the thickness of the glass substrate;

[0144] determining a picking allowance of the robot for picking according to the thickness of the irregular wafer carried and sucked by the robot, the thickness of the glass substrate and the layer spacing between each layer in the magazine;

[0145] determining a picking high position and a picking low position of the robot for picking according to the picking position and the picking allowance;

[0146] acquiring the current position of the robot, and controlling the robot to move to the picking low position to horizontally stretch out;

[0147] after the robot horizontally stretches out, controlling the robot to move to the picking high position to open the vacuum to suck the irregular wafer and then horizontally retract, and controlling the robot to take out the irregular wafer from the magazine.

[0148] Optionally, as shown in Figure 6 the control device 510 further includes a placing module 514, and the placing module 514 is used for:

[0149] After the special-shaped wafer is taken out from the magazine, the robot is controlled to rotate to a predetermined rotation position according to the predetermined rotation position, to move to a predetermined worktable high position after the robot is controlled to extend and the vacuum is closed, and to move to a predetermined worktable low position;

[0150] After the robot moves to the worktable low position, it is determined whether the worktable is vacuum adsorbed with the special-shaped wafer. If yes, the robot is controlled to horizontally retract from the worktable low position, so as to place the special-shaped wafer on the worktable for processing.

[0151] Optionally, as shown in Figure 6 The control device 510 further includes a determination module 515, which is configured to:

[0152] The detection sensor is controlled to start rising scanning from the bottom of the worktable. When the grooves of the worktable can be scanned within a predetermined time, the detection sensor is controlled to stop rising and rotate scanning the top surface of the worktable according to a predetermined rotation sequence, so as to obtain the positions of the grooves on the top surface of the worktable.

[0153] According to the positions of the grooves on the top surface of the worktable scanned for multiple times, the rotation position of the robot is determined.

[0154] The control device for special-shaped wafer transmission provided by the embodiment of the present application is applied to a control system for special-shaped wafer transmission. The control system includes special-shaped wafers attached to glass substrates, a magazine, a robot and a worktable. The magazine has N layers, each of which is used for containing the special-shaped wafers. The layer spacing between each layer in the magazine is equal. The robot has a detection sensor. The control device includes a scanning module, a processing module and a control module. The scanning module is used for obtaining a scanning instruction, controlling the detection sensor to scan each layer in the magazine to obtain a scanning result of each layer in the magazine. The processing module is used for obtaining a current wafer taking layer in a wafer taking instruction, determining whether the scanning result corresponding to the current wafer taking layer indicates that the special-shaped wafer exists. If yes, a wafer taking position of the current wafer taking layer is determined. If not, the current wafer taking layer is updated to a new current wafer taking layer to continue determining the corresponding scanning result. The control module is used for controlling the robot to take out the special-shaped wafer from the magazine according to the wafer taking position and transmit the special-shaped wafer to the worktable for processing.

[0155] Thus, by adopting the technical solution provided in this application, irregularly shaped wafers can be attached to a glass substrate and placed together with the glass substrate in a material box. By scanning each layer of the material box, the wafer pick-up position can be determined, and the robot arm can be controlled to pick up the irregularly shaped wafer from the pick-up position in the material box and place it on the worktable. This achieves automatic control of the transfer of irregularly shaped wafers without human intervention, thereby improving the processing efficiency of irregularly shaped wafers.

[0156] Please see Figure 7 , Figure 7 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Figure 7 As shown, the electronic device 700 includes a processor 710, a memory 720, and a bus 730.

[0157] The memory 720 stores machine-readable instructions executable by the processor 710. When the electronic device 700 is running, the processor 710 communicates with the memory 720 via the bus 730. When the machine-readable instructions are executed by the processor 710, they can perform the operations described above. Figure 1 as well as Figure 2 The steps of the control method for transporting irregularly shaped wafers in the method embodiment shown are described in detail in the method embodiment, and will not be repeated here.

[0158] This application also provides a computer-readable storage medium storing a computer program, which, when executed by a processor, can perform the above-described actions. Figure 1 as well as Figure 2 The steps of the control method for transporting irregularly shaped wafers in the method embodiment shown are described in detail in the method embodiment, and will not be repeated here.

[0159] Those skilled in the art will understand that, for the sake of convenience and brevity, the specific working processes of the systems, devices, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0160] In the several embodiments provided in this application, it should be understood that the disclosed systems, apparatuses, and methods can be implemented in other ways. The apparatus embodiments described above are merely illustrative. For example, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. Furthermore, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Additionally, the shown or discussed mutual couplings, direct couplings, or communication connections may be through some communication interfaces; indirect couplings or communication connections between devices or units may be electrical, mechanical, or other forms.

[0161] The units described as separate components may or may not be physically separate, and the components displayed as units may or may not be physical units, i.e. may be located in one place, or may be distributed on multiple network units. Part or all of the units can be selected according to actual needs to achieve the purpose of the embodiment scheme.

[0162] In addition, the functional units in each embodiment of the present application can be integrated in one processing unit, or each unit can be physically present separately, or two or more units can be integrated in one unit.

[0163] If the functions are realized in the form of software functional units and sold or used as independent products, they can be stored in a non-volatile computer readable storage medium executable by a processor. Based on this understanding, the technical solutions of the present application or the part of the present application that essentially contributes to the prior art or the part of the technical solutions can be embodied in the form of a software product, which is stored in a storage medium and includes a plurality of instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the method described in each embodiment of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (Read-Only Memory, ROM), random access memory (Random Access Memory, RAM), magnetic disk or optical disk, and various program code storage media.

[0164] Finally, it should be noted that: the above-described embodiments are only specific embodiments of the present application, used to illustrate the technical solutions of the present application, and not to limit them, the protection scope of the present application is not limited thereto, although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand: any skilled person in the art within the technical scope disclosed by the present application, they can still modify or easily think of changes to the technical solutions recorded in the foregoing embodiments, or make equivalent replacement to part of the technical features; and these modifications, changes or replacements do not make the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and all should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A control method of anisotropic wafer transport, characterized by, The application discloses a control system applied to the transmission of special-shaped wafers, and belongs to the technical field of special-shaped wafer transmission. The control system comprises special-shaped wafers attached to a glass substrate, a magazine, a mechanical arm and a workbench. The magazine has N layers, and each layer is used for containing the special-shaped wafers. The mechanical arm is provided with a detection sensor. The control method comprises the following steps: acquiring a scanning instruction, and controlling the detection sensor to scan each layer of the magazine according to the scanning instruction to obtain the scanning result of each layer of the magazine; acquiring a current wafer-taking layer in a wafer-taking instruction, and determining whether the scanning result corresponding to the current wafer-taking layer indicates that the current wafer-taking layer has the special-shaped wafers according to the scanning result of each layer of the magazine; if yes, determining the wafer-taking position of the current wafer-taking layer; if not, updating the current wafer-taking layer to a next wafer-taking layer to continue to determine the corresponding scanning result; controlling the mechanical arm to take out the special-shaped wafers from the magazine according to the wafer-taking position and transmit the special-shaped wafers to the workbench for processing; the scanning result of each layer of the magazine is obtained through the following steps: acquiring the scanning position of the first layer of the magazine at which the special-shaped wafers can be scanned; determining the scanning position of each layer of the magazine at which the special-shaped wafers can be scanned according to the number of layers of the magazine, the layer spacing between each layer of the magazine and the scanning position of the first layer of the magazine at which the special-shaped wafers can be scanned; 2. The control method according to claim 1, characterized by, determining the scanning range of each layer of the magazine at which the special-shaped wafers can be scanned according to the scanning position of each layer of the magazine at which the special-shaped wafers can be scanned and a preset allowance; controlling the detection sensor to start to ascend and scan from the lowest position of the scanning range of the current layer of the magazine according to the scanning range and the first layer of the magazine as the current layer, and acquiring the scanning signal of the detection sensor in the scanning range of the current layer; determining the scanning result of the current layer according to the scanning signal in the scanning range of the current layer, and updating the next layer of the magazine to the current layer to continue to scan until the current scanning position of the detection sensor ascends to the highest position of the scanning range of the Nth layer of the magazine to stop scanning, thereby obtaining the scanning result of each layer of the magazine. The scanning result of the current layer is determined through the following steps:

3. The control method according to claim 1, characterized by, real-time acquiring the current scanning position of the detection sensor, and determining whether the current scanning position of the detection sensor exceeds the highest position of the scanning range of the current layer; if not, continuing to acquire the scanning signal; if yes, determining whether the scanning signal in the scanning range of the current layer has a high level; if yes, determining the scanning position of the current layer at which the special-shaped wafers can be scanned as the wafer-taking position, and determining the wafer-taking position and the indication information that the current layer has the special-shaped wafers as the scanning result of the current layer; if not, determining the indication information that the current layer does not have the special-shaped wafers as the scanning result of the current layer. The mechanical arm is controlled to take out the special-shaped wafers from the magazine through the following steps: acquiring the thickness of the special-shaped wafers carried and sucked by the mechanical arm and the thickness of the glass substrate; According to the thickness of the mechanical arm carrying and sucking the special-shaped wafer, the thickness of the glass substrate, and the layer spacing between each layer in the magazine, the wafer taking margin of the mechanical arm is determined; According to the wafer taking position and the wafer taking margin, the wafer taking high position and the wafer taking low position of the mechanical arm are determined; The current position of the mechanical arm is obtained, and the mechanical arm is controlled to move to the wafer taking low position and horizontally extend; After the mechanical arm horizontally extends, the mechanical arm is controlled to move to the wafer taking high position, open the vacuum to suck the special-shaped wafer, and then horizontally retract, and the mechanical arm is controlled to take the special-shaped wafer from the magazine.

4. The control method according to claim 1, characterized by, The control method further comprises: After the special-shaped wafer is taken out from the magazine, the mechanical arm is controlled to rotate to a predetermined rotation position, move to a predetermined worktable high position, extend and close the vacuum, and then move to a predetermined worktable low position; After the mechanical arm moves to the worktable low position, it is determined whether the worktable is vacuum-sucked with the special-shaped wafer, and if so, the mechanical arm is controlled to horizontally retract from the worktable low position to place the special-shaped wafer on the worktable for processing.

5. The control method according to claim 4, characterized by The rotation position is determined by the following steps: The detection sensor is controlled to start scanning from the bottom of the worktable, and when the groove of the worktable can be scanned within a predetermined time, the detection sensor is controlled to stop rising and rotate to scan the top surface of the worktable according to a predetermined rotation sequence to obtain the position of the groove on the top surface of the worktable; According to the positions of the grooves on the top surface of the worktable scanned multiple times, the rotation position of the mechanical arm is determined.

6. The control method according to claim 4, characterized by The worktable high position is determined according to the positions of the top surface of the worktable scanned multiple times and the thickness of the mechanical arm carrying and sucking the special-shaped wafer; and the worktable low position is determined according to the positions of the top surface of the worktable scanned multiple times and the positions of the top surfaces of the grooves of the worktable scanned multiple times.

7. A control device for the transport of shaped wafers, characterized in that A control system applied to special-shaped wafer transmission, the control system comprises special-shaped wafers attached to a glass substrate, a magazine, a mechanical arm, and a worktable; the number of layers of the magazine is N layers, each layer is used to hold the special-shaped wafers, and the layer spacing between each layer in the magazine is equal; The mechanical arm has a detection sensor; the control device comprises: A scanning module is used to obtain a scanning instruction, control the detection sensor to scan whether each layer in the magazine has a special-shaped wafer according to the scanning instruction, and obtain the scanning result of each layer in the magazine; A processing module is used to obtain a current wafer taking layer in a wafer taking instruction, determine whether the scanning result corresponding to the current wafer taking layer indicates that there is a special-shaped wafer according to the scanning result of each layer in the magazine; if so, the wafer taking position of the current wafer taking layer is determined; if not, the current wafer taking layer is updated to be one more than the current wafer taking layer to continue to determine the corresponding scanning result; A control module is used to control the mechanical arm to take the special-shaped wafer from the magazine according to the wafer taking position and transmit it to the worktable for processing; The scanning module is specifically used for: obtaining the scanning result of each layer in the material box. acquiring the scanning position of the irregular wafer in the first layer of the material box; determining the scanning position of the irregular wafer in each layer of the material box according to the number of layers of the material box, the layer spacing between each layer in the material box, and the scanning position of the irregular wafer in the first layer of the material box; determining the scanning range of the irregular wafer in each layer of the material box according to the scanning position of the irregular wafer in each layer of the material box and a preset allowance; controlling the detection sensor to start upward scanning from the lowest part of the scanning range of the current layer of the material box according to the scanning range and the first layer of the material box as the current layer, and acquiring the scanning signal of the detection sensor in the scanning range of the current layer; 8. An electronic device, comprising: determining the scanning result of the current layer according to the scanning signal in the scanning range of the current layer, and updating the next layer of the material box as the current layer for continuous scanning until the current scanning position of the detection sensor is raised to the highest part of the scanning range of the Nth layer of the material box to stop scanning, thereby obtaining the scanning result of each layer in the material box. comprising:

9. A computer readable storage medium characterized by, a processor, a memory and a bus, the memory storing machine readable instructions executable by the processor, when the electronic device is running, the processor and the memory communicate through the bus, the machine readable instructions are executed by the processor to perform the steps of the control method of the irregular wafer transmission as claimed in any one of claims 1 to 6. The computer readable storage medium stores a computer program, and the computer program is executed by the processor to perform the steps of the control method of the irregular wafer transmission as claimed in any one of claims 1 to 6.

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