Wafer Carrying and Fixing Mechanism and Deposition Machine

Abstract

The present invention relates to a wafer carrier and fixing mechanism, which mainly includes a carrier plate, a first cover ring and a second cover ring. The carrier plate includes a carrying surface for carrying a wafer, and a first alignment unit is disposed around the carrying surface. The second cover ring is connected to the first cover ring and includes a second alignment unit. The second cover ring is placed inside the first cover ring, wherein the circumference of the first cover ring is greater than that of the second cover ring and is used to carry the second cover ring. When the carrier plate moves towards the first cover ring and the second cover ring, the second alignment unit of the second cover ring will contact the first alignment unit of the carrier plate and align the second cover ring and the carrier plate, so that the second cover ring contacts the fixed position of the wafer on the carrier plate, thereby fixing the wafer on the carrying surface of the carrier plate and performing a thin film deposition process on the wafer.

Description

Technical Field

[0001] The present invention relates to a fixing device for a wafer carrier, and more particularly to a deposition machine using the fixing device for the wafer carrier to fix a wafer on the carrier and perform a thin film deposition process on the wafer. Background Art

[0002] Chemical vapor deposition (CVD), physical vapor deposition (PVD), and atomic layer deposition (ALD) are all commonly used deposition machines and are widely used in processes such as integrated circuits, light emitting diodes, and displays.

[0003] The deposition equipment mainly includes a chamber and a wafer carrier. The wafer carrier is located in the chamber and is used to carry at least one wafer. Taking physical vapor deposition as an example, a target needs to be set in the chamber, and the target faces the wafer on the wafer carrier. During physical vapor deposition, the wafer is fixed on the wafer carrier through a fixing device, and an inert gas and / or a reaction gas are transported into the chamber. Bias voltages are applied to the target and the wafer carrier respectively. The wafer carrier also heats the carried wafer. The inert gas in the chamber will form ionized inert gas due to the action of a high voltage electric field. The ionized inert gas will be attracted by the bias voltage on the target and bombard the target. The target atoms or molecules sputtered from the target will be attracted by the bias voltage on the wafer carrier and deposited on the surface of the heated wafer to form a thin film on the surface of the wafer.

[0004] Generally, the deposition machines manufactured by semiconductor equipment manufacturers are usually only applicable to wafers of a single size. If wafers of different sizes need to be deposited, it is often necessary to substantially change the structure of the deposition machine or purchase deposition machines of different specifications. This not only causes inconvenience in use but also greatly increases the cost of the process. Summary of the Utility Model

[0005] As described in the prior art, conventional deposition machines can usually only deposit wafers of a single size, which causes inconvenience in use and may greatly increase the cost of the process. Therefore, the present invention proposes a novel wafer carrier fixing mechanism and a deposition machine using the wafer carrier fixing mechanism, which can be used to fix wafers of two or more sizes on the carrier and perform deposition, which is beneficial to improving the applicable range of the wafer carrier fixing mechanism and the deposition machine and can reduce the cost of the process.

[0006] An object of the present invention is to provide a wafer carrying and fixing mechanism, which mainly includes a carrier plate, a first cover ring and a second cover ring, wherein the carrier plate is used to carry at least one wafer. The first cover ring is used to carry the second cover ring, wherein the circumference or radius of the second cover ring is smaller than that of the first cover ring, and it is placed inside the first cover ring. When the carrier plate drives the carried wafer to approach the second cover ring, the second cover ring will contact the wafer and fix the wafer on the carrier plate.

[0007] Corresponding alignment units are respectively arranged on the carrier plate and the second cover ring of the present invention. When the carrier plate approaches and connects with the second cover ring, the alignment units will guide and align the second cover ring and the carrier plate, so that the second cover ring is placed in the fixed area of the carrier plate to accurately contact and fix the wafer on the carrier plate.

[0008] In actual application, the second cover ring can be removed from the first cover ring, and the larger-sized wafer can be fixed on the carrier plate with the first cover ring having a larger radius or circumference. In addition, when the second cover ring is placed on the first cover ring, the smaller-sized wafer can be fixed on the carrier plate with the second cover ring having a smaller radius or circumference, so that the wafer carrying and fixing mechanism is applicable to fixing two different-sized wafers and can be used for thin film deposition on two different-sized wafers.

[0009] In addition, when the periphery of the wafer warps, the wafer on the carrier plate may push the second cover ring to displace relative to the first cover ring. For example, the wafer pushes the second cover ring in the direction towards the target. Since the weight of the second cover ring is less than that of the first cover ring or the sum of the first and second cover rings, it can avoid damaging the wafer when the wafer is fixed on the carrier plate or the wafer pushes the second cover ring.

[0010] An object of the present invention is to provide a wafer carrying and fixing mechanism, which mainly includes a carrier plate and a carrying member, wherein a carrying surface of the carrier plate is used to carry at least one wafer, and the carrying member is arranged on the carrier plate and is located below the wafer.

[0011] The carrying member is connected to at least one lifting unit, and the lifting unit drives the carrying member to displace relative to the carrier plate. When the lifting unit drives the carrying member away from the carrier plate, the carrying member will drive the wafer away from the carrying surface of the carrier plate, which is beneficial for taking the wafer on the carrying member by a robotic arm or placing the wafer on the carrying member. Then the lifting unit can drive the carrying member to displace towards the carrier plate and place the wafer on the carrying surface of the carrier plate.

[0012] To achieve the above object, the present invention provides a wafer carrier and fixing mechanism for carrying and fixing at least one wafer, comprising: a carrier plate including at least one first alignment unit and a carrying surface for carrying the wafer, wherein the first alignment unit is disposed around the carrying surface; a first cover ring located above the carrier plate; and a second cover ring connected to the first cover ring and including a second alignment unit corresponding to the first alignment unit, wherein the circumference of the first cover ring is greater than that of the second cover ring and is used for carrying the second cover ring. When the carrier plate moves towards the second cover ring, the second cover ring will contact the wafer on the carrier plate, and the second alignment unit of the second cover ring will contact the first alignment unit of the carrier plate for aligning the second cover ring and the carrier plate.

[0013] The present invention provides a deposition machine, comprising: a chamber including an accommodating space; at least one baffle located in the accommodating space of the chamber, wherein one end of the baffle has an annular flange and an opening is formed inside the annular flange; a wafer carrier and fixing mechanism located in the accommodating space for carrying at least one wafer, comprising: a carrier plate including at least one first alignment unit and a carrying surface for carrying the wafer, wherein the first alignment unit is disposed around the carrying surface; a first cover ring disposed on the annular flange of the baffle; a second cover ring connected to the first cover ring and including a second alignment unit corresponding to the first alignment unit, wherein the circumference of the first cover ring is greater than that of the second cover ring and is used for carrying the second cover ring; and a support member connected to and driving the carrier plate to displace relative to the baffle. When the support member drives the carrier plate towards the baffle, the second cover ring will contact the wafer on the carrier plate, and the second alignment unit of the second cover ring will contact the first alignment unit of the carrier plate for aligning the second cover ring and the carrier plate.

[0014] The wafer carrier and fixing mechanism and the deposition machine as described above further comprise: a carrying member disposed on the carrier plate and below the wafer, wherein the carrying member includes a first carrying portion and a second carrying portion, the first carrying portion includes a notch, and the second carrying portion is located in the notch; and at least one lifting unit connected to the first carrying portion of the carrying member for driving the first carrying portion of the carrying member and the wafer to displace relative to the carrier plate. When the lifting unit drives the first carrying portion of the carrying member away from the carrier plate, the carrying member and the first carrying portion will drive the wafer away from the carrying surface of the carrier plate.

[0015] The wafer carrier and fixing mechanism and the deposition machine as described above, wherein the first cover ring includes at least one third alignment unit, and the second cover ring includes at least one fourth alignment unit. The fourth alignment unit is located outside the lower surface of the second cover ring, and the second alignment unit is located inside the lower surface of the second cover ring. When the second cover ring is connected to the first cover ring, the fourth alignment unit will contact the third alignment unit to align the second cover ring and the first cover ring.

[0016] The described wafer carrying and fixing mechanism and deposition machine include an annular member connected to a carrier plate. The annular member is located around the carrying surface of the carrier plate. Among them, the first cover ring includes at least one fifth alignment unit, and the annular member includes at least one sixth alignment unit. When the first cover ring is connected to the annular member, the fifth alignment unit will contact the sixth alignment unit to align the annular member and the first cover ring.

[0017] The described wafer carrying and fixing mechanism and deposition machine, wherein the first alignment unit of the carrier plate is a groove, and the second alignment unit of the second cover ring is a protrusion. The groove and the protrusion have corresponding inclined surfaces. The protrusion of the second cover ring enters the groove of the carrier plate to align the second cover ring and the carrier plate.

[0018] The beneficial effects of the present invention are: to provide a novel wafer carrying and fixing mechanism and a deposition machine applying the wafer carrying and fixing mechanism, which can be used to accurately fix wafers of two or more sizes on the carrier plate and perform deposition, which is beneficial to improving the applicable range of the wafer carrying and fixing device and the deposition machine, and can reduce the cost of the process. Description of the Drawings

[0019] Figure 1 It is a three-dimensional exploded view of an embodiment of the wafer carrying and fixing mechanism of the present invention.

[0020] Figure 2 It is an enlarged exploded view of a part of the structure of an embodiment of the wafer carrying and fixing mechanism of the present invention.

[0021] Figure 3 It is an enlarged view of a part of the structure of another embodiment of the wafer carrying and fixing mechanism of the present invention.

[0022] Figures 4 to 6 It is a schematic diagram of the operation process of an embodiment of the wafer carrying and fixing mechanism of the present invention.

[0023] Figure 7 It is a cross-sectional view of an embodiment of the deposition machine of the present invention.

[0024] Description of reference numerals: 10: wafer carrying and fixing mechanism; 11: carrying plate; 111: carrying surface; 113: first alignment unit; 12: wafer; 13: first cover ring; 130: first opening; 131: upper surface; 132: lower surface; 133: third alignment unit; 137: flange; 139: fifth alignment unit; 15: second cover ring; 150: second opening; 151: lower surface; 153: second alignment unit; 15 5: fourth alignment unit; 17: annular member; 171: sixth alignment unit; 191: lifting unit; 193: bearing member; 1931: first bearing part; 1932: notch; 1933: second bearing part; 1934: gap; 20: deposition machine; 21: chamber; 211: air inlet; 215: wafer inlet and outlet; 22: accommodating space; 23: support member; 26: target material; 27: stopper; 271: annular flange DETAILED DESCRIPTION

[0025] See also Figure 1 and Figure 2 , are respectively a three-dimensional exploded schematic diagram of an embodiment of a wafer carrying and fixing mechanism of the present invention and an enlarged exploded schematic diagram of a part of the structure. As shown in the figure, the wafer carrying and fixing mechanism 10 is used to carry and fix at least one wafer 12, and mainly includes at least one carrier plate 11, a first cover ring 13 and a second cover ring 15, wherein the first cover ring 13 and the second cover ring 15 are located above the carrier plate 11 and the wafer 12.

[0026] The carrier plate 11 includes a carrying surface 111 for carrying the wafer 12. The top view of the first cover ring 13 and the second cover ring 15 is annular, wherein the maximum circumference and / or maximum radius of the first cover ring 13 is greater than the maximum circumference and / or maximum radius of the second cover ring 15. The second cover ring 15 is located above the first cover ring 13, and the first cover ring 13 carries the second cover ring 15. When the carrier plate 11 moves toward the first cover ring 13 and / or the second cover ring 15, the second cover ring 15 contacts the edge of the wafer 12 carried by the carrier plate 11 and fixes the wafer 12 on the carrying surface 111 of the carrier plate 11.

[0027] Specifically, the first cover ring 13 includes a first opening 130, and the second cover ring 15 includes a second opening 150, wherein the radius, circumference and / or area of the first opening 130 are larger than those of the second opening 150, and the maximum radius and / or maximum circumference of the second cover ring 15 are larger than those of the first opening 130. Therefore, the second cover ring 15 can be arranged or placed on the inner side or radially inward of the first cover ring 13, wherein when the second cover ring 15 is placed on the first cover ring 13, part of the inner side of the second cover ring 15 will protrude from the inner side of the first cover ring 13 and cover part of the first opening 130, for example, part of the second cover ring 15 protrudes toward the radial inner side of the first cover ring 13.

[0028] The weight of the second cover ring 15 is less than the sum of the first cover ring 13 and the first cover ring 13 and the second cover ring 15. Among them, the force exerted by the second cover ring 15 on the wafer 12 is smaller, which can prevent the wafer 12 from being under excessive pressure and causing breakage. Therefore, the wafer carrying and fixing mechanism 10 described in the present invention is particularly suitable for fixing a wafer 12 with a relatively thin thickness on the carrier plate 11.

[0029] Specifically, as Figure 3 and Figure 5 shown, when the carrier plate 11 drives the wafer 12 with a warped edge towards the direction of the first cover ring 13 and / or the second cover ring 15, the second cover ring 15 will contact and press on the warped edge of the wafer 12 to fix the wafer 12 on the bearing surface 111 of the carrier plate 11. If the warping amplitude of the edge of the wafer 12 is relatively large, the warped edge of the wafer 12 may push against the second cover ring 15, causing the second cover ring 15 to displace relative to the first cover ring 13. For example, the second cover ring 15 may slightly move away from the first cover ring 13. At this time, the wafer 12 only needs to bear the weight of the second cover ring 15, and does not need to bear the weight of the first cover ring 13, which can avoid the situation where the wafer 12 is damaged due to excessive pressure.

[0030] The carrier plate 11 described in the present invention includes at least one first alignment unit 113, which is arranged around the bearing surface 111, and the second cover ring 15 includes at least one second alignment unit 153, wherein the first alignment unit 113 of the carrier plate 11 corresponds to the second alignment unit 153 of the second cover ring 15.

[0031] Specifically, when the second cover ring 15 approaches or contacts the carrier plate 11, the second alignment unit 153 of the second cover ring 15 will contact or align with the first alignment unit 113 of the carrier plate 11, and guide the second cover ring 15 to the fixed position of the carrier plate 11, so that the carrier plate 11 and the second cover ring 15 are aligned with each other. Through the arrangement of the first alignment unit 113 and the second alignment unit 153, the second cover ring 15 can contact the fixed area of the wafer 12 on the carrier plate 11 to firmly fix the wafer 12 on the carrier plate 11.

[0032] In an embodiment of the present invention, the first alignment unit 113 of the carrier plate 11 may be a groove with an inclined surface, and the second alignment unit 153 of the second cover ring 15 may be a protrusion with an inclined surface. For example, the first alignment unit 113 may be an annular groove with an inclined surface and is arranged around the bearing surface 111 of the carrier plate 11, while the second alignment unit 153 may be an annular protrusion with an inclined surface and is arranged on the lower surface 151 of the second cover ring 15 near the radially outer side. In another embodiment of the present invention, the first alignment unit 113 of the carrier plate 11 may be an inclined surface arranged around the bearing surface 111, and the second alignment unit 153 of the second cover ring 15 is provided with a corresponding inclined surface towards the radially inner side to align the second cover ring 15 and the carrier plate 11.

[0033] In an embodiment of the present invention, the first cover ring 13 includes at least one third alignment unit 133, and the second cover ring 15 includes at least one fourth alignment unit 155. The fourth alignment unit 155 is located on the lower surface 151 of the second cover ring 15 near the radially outer side, while the second alignment unit 153 is located on the lower surface 151 of the second cover ring 15 near the radially inner side. When the second cover ring 15 is placed on the first cover ring 13, the fourth alignment unit 155 will contact and align with the third alignment unit 133 to align the second cover ring 15 and the first cover ring 13.

[0034] As Figure 2 shown, the third alignment unit 133 of the first cover ring 13 may include at least one groove and / or at least one protrusion, and the third alignment unit 133 is arranged on the upper surface 131 of the first cover ring 13. The fourth alignment unit 155 of the second cover ring 15 may include at least one groove and / or at least one protrusion, and the fourth alignment unit 155 is arranged on the lower surface 151 of the second cover ring 15. For example, the grooves of the first cover ring 13 and the second cover ring 15 are annular grooves, and the protrusions of the first cover ring 13 and the second cover ring 15 are annular protrusions.

[0035] The third alignment unit 133 corresponds to the fourth alignment unit 155. When the second cover ring 15 is placed on the first cover ring 13, the third alignment unit 133 and the fourth alignment unit 155 can guide the second cover ring 15 to the fixed position of the first cover ring 13 to complete the connection and alignment of the first cover ring 13 and the second cover ring 15.

[0036] In addition, at least one flange 137 and at least one fifth alignment unit 139 may be provided on the lower surface 132 of the first cover ring 13, wherein the flange 137 and the fifth alignment unit 139 may be annular protrusions. In an embodiment of the present invention, the flange 137 is connected to the outer edge or radially outer side of the first cover plate 13, and the fifth alignment unit 139 is located inside the flange 137 or radially inner side. A sixth alignment unit 171 may be provided on the carrier plate 11, wherein the sixth alignment unit 171 is located on the radially outer side of the carrier plate 11, and the first alignment unit 113 is located on the radially inner side of the carrier plate 11, and the first cover ring 13 and the carrier plate 11 may be aligned through the fifth alignment unit 139 and the sixth alignment unit 171.

[0037] In actual application, the second cover ring 15 may be placed on the first cover ring 13, and the smaller-sized wafer 12 may be fixed on the carrier plate 11 through the second cover ring 15. In addition, the second cover ring 15 may also be removed from the first cover ring 13, and the larger-sized wafer 12 may be fixed on the carrier plate 11 through the first cover ring 13. When fixing the larger-sized wafer 12 on the carrier plate 11 with the first cover ring 13, it may be necessary to replace the carrier plate 11 or configure additional components on the carrier plate 11.

[0038] In an embodiment of the present invention, the wafer carrier fixing mechanism 10 may include an annular member 17, wherein the annular member 17 is connected to the carrier plate 11 and is located around the carrying surface 111 of the carrier plate 11 and / or the wafer 12. For example, the annular member 17 may be sleeved on a part of the carrier plate 11, as Figure 2 shown.

[0039] The annular member 17 and the first cover ring 13 include at least one corresponding alignment unit to align the annular member 17 and the first cover ring 13. For example, the upper surface of the annular member 17 may include at least one sixth alignment unit 171, wherein the sixth alignment unit 171 corresponds to the fifth alignment unit 139 of the first cover ring 13. When the first cover ring 13 is connected to the annular member 17, the fifth alignment unit 139 will contact the sixth alignment unit 171 to align the annular member 17 and the first cover ring 13.

[0040] In an embodiment of the present invention, the second cover ring 15 and the carrier plate 11 are mainly aligned by providing a first alignment unit 113 on the carrier plate 11 and a second alignment unit 153 on the second cover ring 15. If corresponding alignment units such as the first alignment unit 113 and the second alignment unit 153 are not provided between the carrier plate 11 and the second cover ring 15, when the carrier plate 11 approaches the first cover ring 13 and the second cover ring 15, the first cover ring 13 will align with the sixth alignment unit 171 of the carrier plate 11 through the fifth alignment unit 139, so that the first cover ring 13 is aligned with the carrier plate 11, and the second cover ring 15 is aligned with the carrier plate 11 via the first cover ring 13.

[0041] Since the second cover ring 15 and the carrier plate 11 are aligned indirectly, there may be an alignment error between the second cover ring 15 and the carrier plate 11, resulting in the second cover ring 15 being unable to accurately contact the wafer 12 on the carrier plate 11, and thus unable to fix the wafer 12 on the bearing surface 111 of the carrier plate 11.

[0042] In order to improve the alignment error between the second cover ring 15 and the carrier plate 11, the present invention proposes to provide a first alignment unit 113 on the carrier plate 11 and a second alignment unit 153 on the second cover ring 15, which can greatly improve the alignment accuracy between the second cover ring 15 and the carrier plate 11, so that the second cover ring 15 can contact and fix a specific area or edge of the wafer 12.

[0043] In an embodiment of the present invention, the wafer carrier fixing mechanism 10 may include at least one lifting unit 191 and a carrier member 193. The carrier member 193 is disposed on the carrier plate 11 and is located below the wafer 12 carried by the carrier plate 11. For example, the appearance of the carrier member 193 may be annular and is located inside the annular member 17. The lifting unit 191 is connected to the carrier member 193 and the carrier plate 11 and is used to drive the carrier member 193 to displace relative to the carrier plate 11. For example, the lifting unit 191 can extend relative to the bearing surface 111 of the carrier plate 11 and drive the carrier member 193 away from the carrier plate 11, so as to drive the wafer 12 away from the bearing surface 111 of the carrier plate 11 through the carrier member 193.

[0044] In another embodiment of the present invention, the lifting unit 191 is connected to the carrier plate 11 and is located below the wafer 12 carried by the carrier plate 11. The lifting unit 191 can extend relative to the bearing surface 111 of the carrier plate 11 and drive the wafer 12 away from the bearing surface 111 of the carrier plate 11, so that there is no need to provide the carrier member 193.

[0045] In actual application, as Figure 2 and Figure 4 shown, the first cover ring 13 can be placed on a stopper 27, and one end of the stopper 27 can form an annular flange 271. The annular flange 271 of the stopper 27 is located between the flange 137 of the first cover ring 13 and the fifth alignment unit 139 and is used to carry the first cover ring 13.

[0046] The carrier plate 11 is connected to a support member 23, and the support member 23 is used to drive the carrier plate 11 to displace relative to the stopper 27 and the first cover ring 13 and the second cover ring 15 carried thereon, as Figure 5As shown, the second cover ring 15 contacts the wafer 12 carried by the carrier plate 11 and fixes the wafer 12 on the carrier plate 11. Before the second cover ring 15 contacts the wafer 12, the second alignment unit 153 of the second cover ring 15 will first contact the first alignment unit 113 of the carrier plate 11 to align the second cover ring 15 and the carrier plate 11, so that the second cover ring 15 can contact the fixed position of the wafer 12.

[0047] In an embodiment of the present invention, as Figure 6 shown, after the support member 23 drives the carrier plate 11 away from the stopper 27, the first cover ring 13 and the second cover ring 15, the lifting unit 191 can further drive the carrier member 193 away from the carrier plate 11, so that the carrier member 193 lifts the wafer 12 originally located on the bearing surface 111 of the carrier plate 11, and a gap 1934 is formed between the wafer 12 and the bearing surface 111 of the carrier plate 11. A robotic arm (not shown) can extend into the gap 1934 and be located below the wafer 12 to take out the wafer 12 on the carrier member 193 or place the wafer 12 on the carrier member 193.

[0048] After the robotic arm places the wafer 12 on the carrier member 193, the lifting unit 191 will drive the carrier member 193 and the wafer 12 carried thereon to displace toward the bearing surface 111 of the carrier plate 11 to place the wafer 12 on the bearing surface 111 of the carrier plate 11, as Figure 4 shown.

[0049] In another embodiment of the present invention, as Figure 6 shown, the carrier member 193 includes a first bearing portion 1931 and a second bearing portion 1933, wherein the first bearing portion 1931 includes a notch 1932, and the second bearing portion 1933 is located within the notch 1932. Specifically, the appearance of the carrier member 193 can be annular, and the first bearing portion 1931 and the second bearing portion 1933 are partial annular structures. When the second bearing portion 1933 is located within the notch 1932 of the first bearing portion 1931, the two will form an annular carrier member 193.

[0050] In addition, the lifting unit 191 is only connected to the first bearing portion 1931, and the lifting unit 191 is used to drive the first bearing portion 1931 and the wafer 12 away from the bearing surface 111 of the carrier plate 11 to facilitate the robotic arm to pick up the wafer 12 through the notch 1932 of the first bearing portion 1931 or place the wafer 12 on the first bearing portion 1931 through the notch 1932.

[0051] Please refer to Figure 7, is a schematic cross-sectional view of an embodiment of the deposition machine of the present invention. As shown in the figure, the deposition machine 20 includes at least one wafer carrier fixing mechanism 10 and a chamber 21, wherein the chamber 21 includes a receiving space 22, and the wafer carrier fixing mechanism 10 is located in the receiving space 22 and is used to carry at least one wafer 12.

[0052] As Figure 1 shown, the wafer carrier fixing mechanism 10 mainly includes at least one carrier plate 11, a first cover ring 13 and a second cover ring 15, wherein the first cover ring 13 and the second cover ring 15 are located above the carrier plate 11 and the wafer 12. The top view shapes of the first cover ring 13 and the second cover ring 15 are annular, wherein the maximum circumference and / or maximum radius of the first cover ring 13 are greater than the maximum circumference and / or maximum radius of the second cover ring 15.

[0053] At least one baffle 27 is provided in the receiving space 22 of the chamber 21, wherein one end of the baffle 27 is connected to the chamber 21, and the other end forms an opening. In an embodiment of the present invention, the end of the baffle 27 not connected to the chamber 21 may form an annular flange 271, and an opening is formed inside the annular flange 271. The annular flange 271 of the baffle 27 is used to carry the first cover ring 13, and the first cover ring 13 is used to carry the second cover ring 15.

[0054] In an embodiment of the present invention, the deposition machine 20 may be a physical vapor deposition device, and a target 26 is provided in the chamber 21, wherein the target 26 faces the carrier plate 11 and / or the wafer 12. The chamber 21 is provided with at least one gas inlet 211, wherein the gas inlet 211 is fluidly connected to the receiving space 22 of the chamber 21 and is used to transport a process gas into the receiving space 22 to perform a deposition process. For example, the process gas may be an inert gas or a reactive gas. In addition, an exhaust port may be provided on the chamber 21, and the gas in the chamber 21 is pumped out through the exhaust port by a pump.

[0055] The chamber 21 may include a wafer inlet / outlet 215, and the wafer 12 may be transported into the chamber 21 through the wafer inlet / outlet 215 by a robotic arm, or the wafer 12 in the chamber 21 may be taken out through the wafer inlet / outlet 215.

[0056] In an embodiment of the present invention, the carrier plate 11 is connected to a support member 23, wherein the support member 23 is used to drive the carrier plate 11 to displace relative to the baffle 27, the first cover ring 13 and the second cover ring 15. As Figure 5 shown, the support member 23 drives the carrier plate 11 to displace towards the baffle 27, so that the second cover ring 15 contacts the wafer 12 carried by the carrier plate 11 to fix the wafer 12 on the carrier plate 11.

[0057] As Figure 6 and Figure 7As shown, after the support member 23 drives the carrier plate 11 away from the stopper 27, the first cover ring 13 and the second cover ring 15, the lifting unit 191 can further drive the carrier member 193 or the first carrier portion 1931 away from the carrier plate 11, so that the carrier member 193 or the first carrier portion 1931 lifts the wafer 12 originally located on the bearing surface 111 of the carrier plate 11, and a gap 1934 is formed between the wafer 12 and the bearing surface 111 of the carrier plate 11, which is beneficial to taking out the wafer 12 carried by the carrier member 193 or the first carrier portion 1931 from the cavity 21 through a robotic arm (not shown) via the wafer inlet / outlet 215, or placing the wafer 12 onto the carrier member 193 or the first carrier portion 1931 via the wafer inlet / outlet 215.

[0058] After the robotic arm places the wafer 12 on the carrier member 193 or the first carrier portion 1931, the lifting unit 191 will drive the carrier member 193 and the wafer 12 carried thereon to displace towards the bearing surface 111 of the carrier plate 11, so as to place the wafer 12 on the bearing surface 111 of the carrier plate 11, as Figure 4 shown.

[0059] Then the support member 23 can drive the carrier plate 11 and the wafer 12 to displace towards the first cover ring 13 and / or the second cover ring 15 and contact the first cover ring 13 and / or the second cover ring 15, as Figure 5 shown. During the process of the second cover ring 15 contacting the carrier plate 11, the first alignment unit 113 and the second alignment unit 153 will guide the second cover ring 15 to complete the alignment between the second cover ring 15 and the carrier plate 11, and make the second cover ring 15 located in the fixed area of the carrier plate 11.

[0060] Advantages of the present invention:

[0061] A novel wafer carrier fixing mechanism and a deposition machine using the wafer carrier fixing mechanism are provided, which can be used to accurately fix wafers of two or more sizes on a carrier plate and perform deposition, which is beneficial to improving the applicable range of the wafer carrier fixing device and the deposition machine, and can reduce the cost of the process.

[0062] The above is only a preferred embodiment of the present invention, and is not used to limit the scope of implementation of the present invention. That is, all equivalent changes and modifications made according to the shape, structure, features and spirit described in the scope of the patent application of the present invention should be included in the scope of the patent application of the present invention.

Claims

1. A wafer carrier and fixing mechanism, characterized in that, Comprising: A carrier plate, including at least one first alignment unit and a carrying surface, wherein the carrying surface is used to carry large-size or small-size wafers, and the first alignment unit is disposed around the carrying surface; A first cover ring, located above the carrier plate; A second cover ring, connected to the first cover ring, and including a second alignment unit corresponding to the first alignment unit, wherein the circumference of the first cover ring is greater than that of the second cover ring and is used to carry the second cover ring. When the carrier plate carries the small-size wafer and displaces towards the second cover ring, the second cover ring will contact the small-size wafer on the carrier plate, and the second alignment unit of the second cover ring will contact the first alignment unit of the carrier plate and is used to align the second cover ring and the carrier plate; or when the second cover ring is removed from the first cover ring, the first cover ring will fix the large-size wafer on the carrier plate; And An annular member, connected to the carrier plate, the annular member being located around the carrying surface of the carrier plate, wherein the first cover ring includes at least one fifth alignment unit, and the annular member includes at least one sixth alignment unit. When the first cover ring is connected to the annular member, the fifth alignment unit will contact the sixth alignment unit to align the annular member and the first cover ring.

2. The wafer carrier fixing mechanism according to claim 1, characterized in that, Comprising: A carrying member, disposed on the carrier plate and located below the wafer, wherein the carrying member includes a first carrying portion and a second carrying portion, the first carrying portion includes a notch, and the second carrying portion is located within the notch; and At least one lifting unit, connected to the first carrying portion of the carrying member and used to drive the first carrying portion of the carrying member and the wafer to displace relative to the carrier plate. When the lifting unit drives the first carrying portion of the carrying member away from the carrier plate, the first carrying portion will drive the wafer away from the carrying surface of the carrier plate.

3. The wafer carrying and fixing mechanism according to claim 1, characterized in that, Wherein the first cover ring includes at least one third alignment unit, and the second cover ring includes at least one fourth alignment unit. The fourth alignment unit is located outside the lower surface of the second cover ring, and the second alignment unit is located inside the lower surface of the second cover ring. When the second cover ring is connected to the first cover ring, the fourth alignment unit will contact the third alignment unit to align the second cover ring and the first cover ring.

4. The wafer carrier fixing mechanism according to claim 1, characterized in that Wherein the first alignment unit of the carrier plate is a groove, and the second alignment unit of the second cover ring is a protrusion. The groove and the protrusion have corresponding inclined surfaces. The protrusion of the second cover ring enters the groove of the carrier plate to align the second cover ring and the carrier plate.

5. A deposition device, characterized in that, Comprising: A cavity, including an accommodating space; At least one stopper, located within the accommodating space of the cavity, wherein one end of the stopper has an annular flange, and an opening is formed inside the annular flange; A wafer carrying and fixing mechanism, located within the accommodating space, including: A carrier plate, including at least one first alignment unit and a carrying surface, wherein the carrying surface is used to carry large-size or small-size wafers, and the first alignment unit is disposed around the carrying surface; A first cover ring, disposed on the annular flange of the stopper; A second cover ring, connecting to the first cover ring and including a second alignment unit corresponding to the first alignment unit, wherein the perimeter of the first cover ring is greater than that of the second cover ring and is used to carry the second cover ring; A support member, connecting and driving the carrier plate to displace relative to the stopper. When the support member drives the carrier plate to displace towards the stopper, the second cover ring will contact the wafer with a small size on the carrier plate, and the second alignment unit of the second cover ring will contact the first alignment unit of the carrier plate and is used to align the second cover ring and the carrier plate; or remove the second cover ring from the first cover ring, and the first cover ring fixes the wafer with a large size on the carrier plate; And An annular member, connecting to the carrier plate, and the annular member is located around the bearing surface of the carrier plate. Wherein the first cover ring includes at least one fifth alignment unit, and the annular member includes at least one sixth alignment unit. When the first cover ring connects to the annular member, the fifth alignment unit will contact the sixth alignment unit to align the annular member and the first cover ring.

6. The deposition apparatus according to claim 5, wherein Comprising: A bearing member, arranged on the carrier plate and located below the wafer. Wherein the bearing member includes a first bearing portion and a second bearing portion, and the cavity includes a wafer inlet and outlet. The first bearing portion includes a notch facing the wafer inlet and outlet, and the second bearing portion is located within the notch; And At least one lifting unit, connecting to the first bearing portion of the bearing member and used to drive the first bearing portion of the bearing member and the wafer to displace relative to the carrier plate. When the lifting unit drives the first bearing portion of the bearing member away from the carrier plate, the first bearing portion will drive the wafer away from the bearing surface of the carrier plate.

7. The deposition apparatus according to claim 5, wherein Wherein the first cover ring includes at least one third alignment unit, and the second cover ring includes at least one fourth alignment unit. The fourth alignment unit is located outside the lower surface of the second cover ring, and the second alignment unit is located inside the lower surface of the second cover ring. When the second cover ring connects to the first cover ring, the fourth alignment unit will contact the third alignment unit to align the second cover ring and the first cover ring.

8. The deposition apparatus according to claim 5, characterized in that, Wherein the first alignment unit of the carrier plate is a groove, and the second alignment unit of the second cover ring is a protrusion. The groove and the protrusion have corresponding inclined surfaces, and the protrusion of the second cover ring enters the groove of the carrier plate to align the second cover ring and the carrier plate.

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