Display panel and manufacturing method thereof

Abstract

An embodiment of the present application discloses a display panel and a preparation method thereof, wherein the display panel includes a substrate, including a first surface and a second surface opposite to each other, and also including a side surface connecting the first surface and the second surface; at least one first recess is provided at an edge of the first surface close to the side surface, and at least one second recess is provided at an edge of the second surface close to the side surface, wherein the opening of the first recess is flush with the first surface, and the opening of the second recess is flush with the second surface; a first conductive terminal is provided on the first surface of the substrate, and a side surface of the first conductive terminal is in contact with the inner surface of the first recess; a second conductive terminal is provided on the second surface of the substrate, and a side surface of the second conductive terminal is in contact with the inner surface of the second recess; a conductive trace has one end connected to the first conductive terminal and the other end extending from the side surface and connected to the second conductive terminal.

Description

Technical Field

[0001] The present application relates to the field of display, and in particular to a display panel and a method for preparing the same. Background Art

[0002] Currently, panels are becoming increasingly diverse. MicroLEDs offer resolution and color close to OLEDs, surpassing LCDs. They also consume less power and are thinner and lighter. The ideal method for seamlessly joining MicroLEDs is backbonding. Backbonding involves placing the TFT (thin-film field-effect transistor) and LED chips on the front surface, with the OLB (outer lead bonding) area on the back surface. Conductive silver paste is applied to the sides and edges of the glass to create a conductive connection between the pads on both sides. Finally, the module manufacturing process is carried out.

[0003] Unlike LCD products, MicroLEDs are driven by current. After a period of illumination, the side of the glass experiences a temperature rise (approximately 70-100°C), creating a heating phenomenon. Actual testing revealed excessive contact resistance in the side wires, leading to localized overheating in this area. Summary of the Invention

[0004] The embodiments of the present application provide a display panel and a method for manufacturing the same, which can solve the technical problem of excessively large contact resistance between side wires and conductive terminals in the prior art.

[0005] An embodiment of the present application provides a display panel, comprising a substrate, comprising a first surface and a second surface opposite to each other, and further comprising a side surface connecting the first surface and the second surface; at least one first recess is provided at an edge of the first surface close to the side surface, and at least one second recess is provided at an edge of the second surface close to the side surface, wherein the opening of the first recess is flush with the first surface, and the opening of the second recess is flush with the second surface; a first conductive terminal is provided on the first surface of the substrate, and a side surface of the first conductive terminal is in contact with the inner surface of the first recess; a second conductive terminal is provided on the second surface of the substrate, and a side surface of the second conductive terminal is in contact with the inner surface of the second recess; a conductive trace has one end connected to the first conductive terminal and the other end extending from the side surface and connected to the second conductive terminal.

[0006] Optionally, in some embodiments of the present application, the inner surface of the first recess and the inner surface of the second recess are both arc-shaped surfaces with smooth transitions.

[0007] Optionally, in some embodiments of the present application, the projection of the conductive trace on the first surface completely covers the projection of the first recess on the first surface.

[0008] Optionally, in some embodiments of the present application, the projection of the conductive trace on the second surface completely covers the projection of the second recess on the second surface.

[0009] Optionally, in some embodiments of the present application, the contact area between the side surface of the first conductive terminal away from the first surface and the conductive trace is defined as A, the projection area of the contact area on the first surface is B, and A is greater than B.

[0010] Optionally, in some embodiments of the present application, a display area and a bonding area are further included, the display area is provided with a pixel unit, and the first recess and the conductive trace are located in the bonding area.

[0011] Accordingly, the embodiment of the present application further provides a method for preparing a display panel, the preparation steps being:

[0012] Providing a substrate, the substrate comprising a first surface and a second surface that are opposite to each other, and a side surface connecting the first surface and the second surface;

[0013] preparing at least one first concave portion on the first surface and preparing at least one second concave portion on the second surface;

[0014] Prepare a first conductive terminal on the first surface, wherein the first conductive terminal is attached to the inner surface of the first recess;

[0015] preparing a second conductive terminal on the second surface, wherein the second conductive terminal is attached to the inner surface of the second recess;

[0016] Conductive silver paste is prepared on the first surface, the side surface and the second surface, and is cured to form a conductive trace, wherein one end of the conductive trace is connected to the first conductive terminal, and the other end extends from the side surface and is connected to the second conductive terminal.

[0017] Optionally, in some embodiments of the present application, the first recess is prepared on the first surface by laser etching or acid etching.

[0018] Optionally, in some embodiments of the present application, the specific steps of forming the conductive traces after curing are as follows:

[0019] The conductive silver paste is placed at a temperature of 150° C. to 170° C. and allowed to stand for 20 to 30 minutes to form the conductive traces.

[0020] Optionally, in some embodiments of the present application, a gray tone half mask is used to prepare the first conductive terminal, and a concave surface is formed on the surface of the first conductive terminal;

[0021] The second conductive terminal is prepared by using a gray tone half mask plate, and a concave surface is formed on the surface of the second conductive terminal.

[0022] The beneficial effect of this embodiment is that the display panel and its preparation method of this embodiment provide concave recesses on both side surfaces of the substrate, place the conductive terminals in the recesses, and form arc-shaped surfaces on the conductive terminals through a mask plate, thereby increasing the contact area between the conductive terminals and the wire traces without changing the resistance value of the conductive terminals or increasing the width of the bonding area, reducing the contact resistance between the conductive traces and the conductive terminals, improving the heat generation problem in the bonding area, and increasing the service life of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0024] Figure 1 is a schematic structural diagram of a display panel provided in an embodiment of the present application;

[0025] Figure 2 This is a schematic structural diagram of the first conductive terminal and the second conductive terminal provided in an embodiment of the present application after preparation;

[0026] Figure 3 This is a schematic diagram of the structure after the arc corner provided in the embodiment of the present application is polished;

[0027] Figure 4 This is a schematic diagram of the structure of the pixel unit provided in the embodiment of the present application after preparation.

[0028] Description of reference numerals:

[0029] Substrate 100; pixel unit 200;

[0030] First conductive terminal 300; second conductive terminal 400;

[0031] Conductive trace 500; display area 101;

[0032] bonding area 102; first surface 110;

[0033] Second surface 120; side surface 130;

[0034] The first recessed portion 111; the second recessed portion 121. DETAILED DESCRIPTION

[0035] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present application. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present application, and are not used to limit the present application. In the present application, unless otherwise specified, the directional words used, such as "upper" and "lower", generally refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the accompanying drawings; and "inside" and "outside" refer to the outline of the device.

[0036] The present invention provides a display panel and a method for manufacturing the same, which are described in detail below.

[0037] Example

[0038] In this embodiment, Figure 1 As shown, the display panel of the present invention structurally comprises a substrate 100, a pixel unit 200, a first conductive terminal 300, a second conductive terminal 400, and a conductive trace 500. Functionally, the display panel further comprises a display area 101 and a bonding area 102. The main improvement of this embodiment is that, without increasing the width of the bonding area 102, the contact area between the first conductive terminal 300 and the conductive trace 500, and the contact area between the second conductive terminal 400 and the conductive trace 500 are increased, thereby reducing the contact resistance between the conductive trace 500 and the conductive terminals (the first conductive terminal 300 and the second conductive terminal 400).

[0039] Specifically, such as Figure 2 As shown, substrate 100 is a glass substrate and includes a first surface 110 and a second surface 120, which are opposite to each other, and a side surface 130 connecting first surface 110 and second surface 120. First surface 110 is a display surface, and pixel units 200 are disposed on first surface 110 and correspondingly disposed in display area 101. Light emitted from pixel units 200 enables image display in display area 101. First and second recesses 111, 121 are respectively defined on first and second surfaces 110, 120. The first and second recesses 111, 121 are correspondingly disposed in bonding area 102. The first recess 111 is recessed from the first surface 110 toward the second surface 120, forming an inwardly concave arcuate surface. The second recess 121 is recessed from the second surface 120 toward the first surface 110, also forming an inwardly concave arcuate surface.

[0040] The first conductive terminal 300 is provided on the first surface 110 and is connected to the pixel unit 200 via a metal trace (not shown). Specifically, the first conductive terminal 300 covers the first recess 111 and is completely in contact with the inner surface of the first recess 111. On the premise that the thickness of the first conductive terminal 300 remains unchanged, that is, on the premise that the resistance of the first conductive terminal 300 itself remains unchanged, the upper surface of the first conductive terminal 300 corresponding to the first recess 111 (the side of the first conductive terminal 300 away from the substrate 100) and the inner surface of the first recess 111 are both concave arc-shaped surfaces. For example, the contact area between the side of the first conductive terminal 300 away from the first surface 110 and the conductive trace 500 is defined as A, and the projected area of the contact area A on the first surface 110 is defined as B, where A is greater than B. Therefore, without increasing the width of the bonding area 102 (i.e., without increasing the projection width of the first conductive terminal 300 on the substrate 100), the contact area between the conductive trace 500 and the first conductive terminal 300 is increased, thereby reducing the contact resistance between the conductive trace 500 and the first conductive terminal 300, thereby avoiding the technical problem of excessive heat generation due to excessive contact resistance.

[0041] In particular, this embodiment only discusses increasing the contact area between the conductive trace 500 and the first conductive terminal 300 without increasing the width of the bonding area 102. In another preferred embodiment of the present invention, the width of the bonding area 102 can also be reduced without reducing the contact area between the conductive trace 500 and the first conductive terminal 300, which also falls within the scope of protection of the present invention.

[0042] Similar to the first conductive terminal 300, in this embodiment, the second conductive terminal 400 is provided on the second surface 120 for connecting to the driving element. Specifically, the second conductive terminal 400 covers the second recess 121 and is completely in contact with the inner surface of the second recess 121. On the premise that the thickness of the second conductive terminal 400 remains unchanged, that is, on the premise that the resistance of the second conductive terminal 400 itself remains unchanged, the upper surface of the second conductive terminal 400 corresponding to the second recess 121 (the side surface of the second conductive terminal 400 away from the substrate 100) is the same as the inner surface of the second recess 121, both of which are concave arc surfaces, thereby increasing the contact area between the conductive trace 500 and the first conductive terminal 300, reducing the contact resistance between the conductive trace 500 and the first conductive terminal 300, and avoiding the technical problem of excessive heat generation due to excessive contact resistance.

[0043] Conductive trace 500 is located in bonding region 102. One end of conductive trace 500 covers a portion of the surface of first conductive terminal 300 facing away from substrate 100. The other end of conductive trace 500 extends from side surface 130 to second surface 120 and covers a portion of the surface of second conductive terminal 400 facing away from substrate 100. Conductive trace 500 connects first conductive terminal 300 and second conductive terminal 400, thereby achieving backside bonding of the display panel.

[0044] In particular, the projection of the conductive trace 500 on the substrate 100 completely covers the first recess 111 and the second recess 121 , so as to maximize the contact area between the conductive trace 500 and the first conductive terminal 300 and the conductive trace 500 and the second conductive terminal 400 .

[0045] In order to better explain the present invention, this embodiment also provides a method for preparing the above-mentioned display panel, and the specific preparation steps are as follows:

[0046] S1) A substrate 100 is provided. The substrate 100 includes a first surface 110 and a second surface 120 that are opposite to each other, and a side surface 130 connecting the first surface 110 and the second surface 120 .

[0047] S2) preparing at least one first concave portion 111 on the first surface 110 and at least one second concave portion 121 on the second surface 120, wherein the first concave portion 111 and the second concave portion 121 are formed by laser etching or acid solution corrosion.

[0048] S3) A first conductive terminal 300 is prepared on the first surface 110 using a half-tone mask, wherein the first conductive terminal 300 is attached to the inner surface of the first recess 111, and a side surface of the first conductive terminal 300 away from the first recess 111 is an arc-shaped surface, and its shape is similar to the inner surface of the first recess 111, thereby ensuring that the thickness and resistance value of the entire first conductive terminal 300 remain unchanged.

[0049] S4) Preparing a second conductive terminal 400 on the second surface 120, wherein the second conductive terminal 400 is attached to the inner surface of the second recess 121, and the side surface of the second conductive terminal 400 away from the second recess 121 is an arc-shaped surface, and its shape is similar to the inner surface of the second recess 121, thereby ensuring that the thickness and resistance value of the entire second conductive terminal 400 remain unchanged.

[0050] S5) Figure 3 and Figure 4As shown, by grinding the connecting edge between the side surface 130 and the first surface 110 and the connecting edge between the side surface 130 and the second surface 120, the corners of the bonding area 102 are made into arc-shaped corners, thereby preventing the subsequent conductive traces 500 from breaking at the corners. The pixel unit 200 is packaged on the first surface 110, and the pixel unit 200 is connected to the first conductive terminal 300 through a metal trace.

[0051] S6) Conductive silver paste is transferred onto the first surface 110, the side surface 130, and the second surface 120. The conductive trace 500 is formed after being placed at a temperature of 150°C to 170°C and allowed to stand for 20 to 30 minutes. The conductive trace 500 serves to connect the first conductive terminal 300 and the second conductive terminal 400. Because the surfaces of the first conductive terminal 300 and the second conductive terminal 400 are both curved, the contact area with the conductive trace 500 is increased while the projected area remains unchanged (the width of the bonding area 102 remains unchanged). This reduces the contact resistance between the conductive trace 500 and the first conductive terminal 300 and the second conductive terminal 400, thereby improving the heating problem of the bonding area 102.

[0052] The beneficial effect of this embodiment is that the display panel and its preparation method of this embodiment provide concave recesses on both side surfaces of the substrate, place the conductive terminals in the recesses, and form arc-shaped surfaces on the conductive terminals through a mask plate, thereby increasing the contact area between the conductive terminals and the wire traces without changing the resistance value of the conductive terminals or increasing the width of the bonding area, reducing the contact resistance between the conductive traces and the conductive terminals, improving the heat generation problem in the bonding area, and increasing the service life of the display panel.

[0053] The above is a detailed introduction to a display panel and a preparation method thereof provided in an embodiment of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for technical personnel in this field, based on the ideas of the present application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A display panel, characterized in that: include A substrate comprising a first surface and a second surface facing away from each other, and further comprising a side surface connecting the first surface and the second surface; At least one first recess is provided at an edge of the first surface close to the side surface, and at least one second recess is provided at an edge of the second surface close to the side surface, wherein an opening of the first recess is flush with the first surface, and an opening of the second recess is flush with the second surface; a first conductive terminal disposed on the first surface of the substrate, wherein a side surface of the first conductive terminal is in contact with an inner surface of the first recess; a second conductive terminal disposed on the second surface of the substrate, wherein a side surface of the second conductive terminal is in contact with an inner surface of the second recess; a conductive trace, one end of which is connected to the first conductive terminal, and the other end of which extends from the side surface and is connected to the second conductive terminal; The display panel is a Micro LED display panel.

2. The display panel according to claim 1, wherein: The inner surface of the first concave portion and the inner surface of the second concave portion are both arc-shaped surfaces with smooth transition.

3. The display panel according to claim 1, wherein: The projection of the conductive trace on the first surface completely covers the projection of the first recess on the first surface.

4. The display panel according to claim 1, wherein: The projection of the conductive trace on the second surface completely covers the projection of the second recess on the second surface.

5. The display panel according to claim 1, wherein: A contact area between a surface of the first conductive terminal away from the first surface and the conductive trace is defined as A, a projection area of the contact area on the first surface is defined as B, and A is greater than B.

6. The display panel according to claim 1, wherein: It also includes a display area and a bonding area, the display area is provided with a pixel unit, and the first concave portion and the conductive trace are located in the bonding area.

7. A method for preparing a display panel, characterized in that: The method comprises the following preparation steps: providing a substrate, wherein the substrate comprises a first surface and a second surface which are opposite to each other, and a side surface connecting the first surface and the second surface; preparing at least one first concave portion on the first surface and preparing at least one second concave portion on the second surface; Prepare a first conductive terminal on the first surface, wherein the first conductive terminal is attached to the inner surface of the first recess; preparing a second conductive terminal on the second surface, wherein the second conductive terminal is attached to the inner surface of the second recess; Conductive silver paste is prepared on the first surface, the side surface, and the second surface, and is cured to form a conductive trace, wherein one end of the conductive trace is connected to the first conductive terminal, and the other end extends from the side surface and is connected to the second conductive terminal; The display panel is a Micro LED display panel.

8. The method for manufacturing a display panel according to claim 7, wherein: The first concave portion is prepared on the first surface by laser etching or acid etching.

9. The method for manufacturing a display panel according to claim 7, wherein: The specific steps of forming the conductive traces after curing are as follows: The conductive silver paste is placed at a temperature of 150° C. to 170° C. and allowed to stand for 20 to 30 minutes to form the conductive traces.

10. The method for manufacturing a display panel according to claim 7, wherein: The first conductive terminal is prepared by using a gray tone half mask plate, and a concave surface is formed on the surface of the first conductive terminal; The second conductive terminal is prepared by using a gray tone half mask plate, and a concave surface is formed on the surface of the second conductive terminal.

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