A self-marking chip bad point testing device

Abstract

The invention discloses a self-marking chip bad pixel testing device, which belongs to the field of chip detection technology. This solution uses an ultrasonic detection ring to detect bad pixels on the chip, and at the same time lays a color-changing marking layer made of two thermochromic particles with different color-changing temperatures on the chip. When a bad pixel is detected, a light-emitting module is used to generate a high-temperature light beam to irradiate the color-changing marking layer to mark the damaged part. When the damaged position is deep, the position is continuously irradiated to cause the color-changing marking layer to produce a secondary color change, so that staff can quickly understand the specific damaged position and reasonably judge whether it is worth repairing. Ferromagnetic fluid is used in combination with a magnetic film to be attached to the inner wall of a reflective cavity, which improves the concentration of the light beam and enables the thermochromic particles to change color quickly. When the temperature inside the reflective chamber is too high, the ferromagnetic fluid loses its magnetism and cooperates with the light-dissipating heat dissipation chamber to absorb a large amount of light, thereby reducing the temperature of the reflective chamber and extending the service life of the device.

Description

Technical Field

[0001] The present invention relates to the technical field of chip detection, and more particularly to a self-marking chip bad point testing device. Background Art

[0002] A chip, also known as a microcircuit, microchip, or integrated circuit, refers to a silicon wafer containing an integrated circuit. It is very small and is an important component of electronic devices such as computers. In electronics, a wafer / chip is a way to miniaturize circuits (mainly semiconductor devices, but also passive components, etc.) and is often manufactured on the surface of a semiconductor wafer.

[0003] With the increasing popularity of intelligent devices, chips as important core components are receiving increasing attention. Due to the fine structure of chips, complex manufacturing processes and cumbersome procedures, there are often tiny defects in the manufacturing process. However, due to the particularity of chips, tiny defects will cause the chips to malfunction, so the chips need to be tested. The current detection method often uses ultrasound to detect the chip and then marks the position with paint. The position and size of the bad points cannot be intuitively reflected on the chip, which is not conducive to maintenance by staff, and the paint can easily contaminate other chips.

[0004] Therefore, we propose a self-marking chip bad pixel testing device to effectively solve some problems existing in the prior art. Summary of the Invention

[0005] 1. Technical problems to be solved

[0006] In response to the problems existing in the prior art, the purpose of the present invention is to provide a self-marking chip bad pixel testing device, which detects bad pixels on the chip by using an ultrasonic detection ring, and at the same time lays a color-changing marking layer made of two thermochromic particles with different color-changing temperatures on the chip. When a bad pixel is detected, a light-emitting module is used to generate a high-temperature light beam to irradiate the color-changing marking layer to mark the damaged part. When the damaged position is deeper, the position is continuously irradiated to cause the color-changing marking layer to produce a secondary color change, so that the staff can quickly understand the specific damaged position and reasonably judge whether it is worth repairing. Ferromagnetic fluid is used in combination with a magnetic film to be attached to the inner wall of the reflective cavity, which improves the concentration of the light beam and allows the thermochromic particles to change color quickly. When the temperature inside the reflective chamber is too high, the ferromagnetic fluid loses its magnetism and cooperates with the light-dissipating heat dissipation chamber to absorb a large amount of light, thereby reducing the temperature of the reflective chamber and extending the service life of the device.

[0007] 2. Technical solution

[0008] To solve the above problems, the present invention adopts the following technical solutions.

[0009] A self-marking chip comprises a chip. A color-changing marking layer is arranged on the upper end of the chip. The color-changing marking layer is made of a transparent gel material. Color-changing material is evenly distributed inside the color-changing marking layer.

[0010] Furthermore, the color-changing material includes two thermochromic particles mixed with each other, the color-changing temperature difference between the two thermochromic particles is 10-15 degrees Celsius, and the initial colors of the two thermochromic particles are different.

[0011] Furthermore, a self-marking chip bad point testing device includes a base plate, a detection seat is provided at the upper end of the base plate, a detection cavity is provided at the upper end of the detection seat, a pair of mutually symmetrical slide grooves are provided at the upper end of the base plate, a sliding fixing rod is provided inside the slide groove through the sliding of an electric push rod, the upper ends of the sliding fixing rods are connected to each other through a sliding rod, a detection mark assembly is slid on the sliding rod, the detection mark assembly includes a sliding telescopic section, a touch detection section is slidably provided at the lower end of the sliding telescopic section, a light-emitting chamber is provided inside the touch detection section, a light-emitting module is provided inside the light-emitting chamber, an intermediate layer is provided on the side wall of the light-emitting chamber, a plurality of reflective cavities are provided inside the intermediate layer, a magnetic film is provided on the side wall of the reflective cavity close to the light-emitting chamber, the reflective cavity is filled with ferromagnetic fluid, a light leakage and heat dissipation chamber corresponding to the position of the intermediate layer is provided inside the detection mark assembly, the light leakage and heat dissipation chamber is filled with light-absorbing material, a light-emitting head corresponding to the position of the light-emitting chamber is provided at the lower end of the touch detection section, and an ultrasonic detection ring is provided at the lower end of the touch detection section.

[0012] Furthermore, a heat dissipation petal corresponding to the position of the light emitting module is provided at the lower end of the touch detection section, the heat dissipation petal is wrapped around the outside of the light emitter, and the inside of the heat dissipation petal is filled with heat dissipation liquid.

[0013] Furthermore, the inner wall of the light-emitting head is polished to obtain a smooth surface, and a reflective film is provided on the inner wall of the light-emitting head.

[0014] Furthermore, the ferromagnetic fluid is silvery white, and the filling amount of the ferromagnetic fluid is 30%.

[0015] Furthermore, the light absorbing material is also soaked in heat dissipation liquid, and the heat dissipation liquid is made of insulating liquid.

[0016] Furthermore, a discharge trough connected to the inside of the detection cavity is opened at the left end of the detection seat, a reserved groove corresponding to the position of the discharge trough is opened on the bottom wall of the detection cavity, a magnetic repulsion bar is provided inside the reserved groove, and an electromagnet is provided at the bottom of the reserved groove, which is connected to an external controller.

[0017] Furthermore, the discharge trough is arranged to be gradually inclined upward from left to right, the interior of the discharge trough is polished to obtain a smooth surface, a pair of clamping plates are provided on the side walls of the detection cavity, and the right end of the bottom wall of the detection cavity is an upward inclined structure.

[0018] Furthermore, a pair of fixed plates are provided at the upper end of the bottom plate, a conveyor belt is provided between the pair of fixed plates, and an offset correction strip corresponding to the upper end position of the conveyor belt is rotatably provided on the inner side wall of the fixed plate.

[0019] 3. Beneficial effects

[0020] Compared with the prior art, the advantages of the present invention are:

[0021] (1) This solution uses an ultrasonic detection ring to detect bad spots on the chip, and at the same time, a color-changing marking layer made of two types of thermochromic particles with different color-changing temperatures is laid on the chip. When a bad spot is detected, a light-emitting module is used to generate a high-temperature light beam to irradiate the color-changing marking layer to mark the damaged part. When the damaged part is deep, the light is continuously irradiated to cause the color-changing marking layer to change color a second time, so that the staff can quickly understand the specific damaged part and reasonably judge whether it is worth repairing. Ferromagnetic fluid is used in combination with a magnetic film attached to the inner wall of the reflective cavity to improve the concentration of the light beam, so that the thermochromic particles can change color quickly. When the temperature inside the reflective chamber is too high, the ferromagnetic fluid loses its magnetism and cooperates with the light-dissipating heat dissipation chamber to absorb a large amount of light, thereby reducing the temperature of the reflective chamber and extending the service life of the device.

[0022] (2) The color-changing material in this solution includes two thermochromic particles mixed with each other. The color-changing temperature difference between the two thermochromic particles is 10-15 degrees Celsius. The initial colors of the two thermochromic particles are different. The use of two thermochromic particles with different color-changing temperature differences, combined with the illumination time, can effectively mark the depth and location of damage, thereby improving the speed at which staff can determine whether the chip is worth repairing.

[0023] (3) In this solution, a heat dissipation flap corresponding to the position of the light-emitting module is provided at the lower end of the touch detection section. The heat dissipation flap is wrapped around the outside of the light-emitting head, and the inside of the heat dissipation flap is filled with heat dissipation liquid. The heat dissipation liquid in the heat dissipation flap can absorb a large amount of heat, effectively preventing the light-emitting head from being damaged due to excessive temperature, thereby improving the practicality of the device.

[0024] (4) The inner wall of the light-emitting head in this solution is polished to obtain a smooth surface, and a reflective film is provided on the inner wall of the light-emitting head. The reflective film can effectively sort out the scattered light and improve the concentration of the light beam.

[0025] (5) The ferromagnetic fluid in this scheme is silvery white, and the filling amount of the ferromagnetic fluid is 30%. The silvery white ferromagnetic fluid can further improve the efficiency of reflection. The 30% filling amount can allow the ferromagnetic fluid to have free space to separate from the magnetic film after being heated, allowing light to leak out, dissipate heat in the light-emitting chamber, and reduce the temperature of the light-emitting chamber.

[0026] (6) The light-absorbing material in this solution is also soaked in heat dissipation liquid, which is made of insulating liquid. The use of insulating heat dissipation liquid reduces the risk of short circuit and effectively absorbs heat, further reducing the temperature of the light-emitting chamber and protecting the light-absorbing material from being damaged by high temperature.

[0027] (7) The left end of the detection seat in this scheme is provided with a discharge trough connected to the inside of the detection chamber, and the bottom wall of the detection chamber is provided with a reserved groove corresponding to the position of the discharge trough. A magnetic repulsion bar is provided inside the reserved groove, and an electromagnet is provided at the bottom of the reserved groove. The electromagnet is connected to an external controller. The discharge trough is arranged to gradually tilt upward from left to right. The inside of the discharge trough is polished to obtain a smooth surface. A pair of clamping plates are provided on the side walls of the detection chamber. The right end of the bottom wall of the detection chamber is in an upward tilted structure. The electromagnet is used to attract and repel the magnetic repulsion bar, so that the chip can be discharged from the detection chamber after completing the detection. The clamping plate is used to fix the chip, which reduces the situation where the chip is offset during the detection process and causes errors in the detection.

[0028] (8) In this solution, a pair of fixed plates are provided at the upper end of the bottom plate, a conveyor belt is provided in the middle of the pair of fixed plates, and an offset correction strip corresponding to the upper end position of the conveyor belt is provided on the inner side wall of the fixed plate. The offset correction strip is used to adjust the position of the chip so that it enters the detection cavity at a relatively correct angle, thereby improving the detection accuracy of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 Schematic diagram of the chip structure of the present invention;

[0030] Figure 2 It is a schematic diagram of the main structure of the present invention;

[0031] Figure 3 It is an exploded view of the main structure of the present invention;

[0032] Figure 4 This is a schematic structural diagram of the detection marking assembly of the present invention;

[0033] Figure 5 is a cross-sectional view of the detection mark assembly of the present invention in a normal state;

[0034] Figure 6 for Figure 5 A in the middle is an enlarged schematic diagram;

[0035] Figure 7 This is a schematic structural diagram of the detection base of the present invention;

[0036] Figure 8 A cross-sectional view of the detection seat of the present invention;

[0037] Figure 9 Schematic diagram of the bottom plate structure of the present invention;

[0038] Figure 10 is a cross-sectional view of the detection mark assembly of the present invention in a heat dissipation state;

[0039] Figure 11 for Figure 10 Enlarged schematic diagram of point B in the middle.

[0040] Description of the numbers in the figure:

[0041] 1 chip, 11 color-changing marking layer, 2 bottom plate, 21 fixed plate, 22 offset correction strip, 23 slide, 3 conveyor belt, 4 detection seat, 401 detection cavity, 41 discharge chute, 42 clamping plate, 43 magnetic repulsion strip, 44 electromagnet, 5 sliding fixed rod, 6 detection mark assembly, 61 sliding telescopic section, 62 touch detection section, 621 light-emitting chamber, 622 light-emitting module, 623 intermediary layer, 624 reflective cavity, 625 light-dissipating heat dissipation chamber, 626 light-emitting head, 63 ultrasonic detection ring, 64 heat dissipation package. DETAILED DESCRIPTION

[0042] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention; it is obvious that the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0043] In the description of the present invention, it should be noted that the terms "upper," "lower," "inner," "outer," "top / bottom," and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate and simplify the description of the present invention. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limitations on the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0044] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "provided with," "mounted / connected," and "connected" should be understood in a broad sense. For example, "connected" can mean a fixed connection, a detachable connection, or an integral connection; a mechanical connection or an electrical connection; a direct connection or an indirect connection through an intermediate medium, or internal communication between compatible components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0045] Example 1:

[0046] See also Figure 1A self-marking chip includes a chip 1. A color-changing marking layer 11 is provided on the upper end of the chip 1. The color-changing marking layer 11 is made of a transparent gel material. Color-changing material is evenly distributed inside the color-changing marking layer 11.

[0047] The color-changing material includes two thermochromic particles mixed with each other. The color-changing temperature difference between the two thermochromic particles is 10-15 degrees Celsius. The initial colors of the two thermochromic particles are different. The use of two thermochromic particles with different color-changing temperature differences, combined with the illumination time, can effectively mark the depth and location of damage, thereby improving the speed at which staff can determine whether the chip 1 is worth repairing.

[0048] See also Figure 1-7 A self-marking chip bad point test device includes a base plate 2, a detection seat 4 is provided on the upper end of the base plate 2, a detection cavity 401 is provided on the upper end of the detection seat 4, a pair of mutually symmetrical slide grooves 23 are provided on the upper end of the base plate 2, a sliding fixed rod 5 is provided inside the slide groove 23 through the sliding of an electric push rod, the upper ends of the sliding fixed rods 5 are connected to each other through a sliding rod, a detection mark assembly 6 is slidably provided on the sliding rod, the detection mark assembly 6 includes a sliding telescopic section 61, a touch detection section 62 is slidably provided at the lower end of the sliding telescopic section 61, a light emitting chamber 621 is provided inside the touch detection section 62, and a light emitting chamber 62 is provided inside the light emitting chamber 62. 1 is provided with a light-emitting module 622 inside, an intermediary layer 623 is provided on the side wall of the light-emitting chamber 621, a plurality of reflective cavities 624 are provided inside the intermediary layer 623, a magnetic film is provided on the side wall of the reflective cavity 624 close to the light-emitting chamber 621, and the reflective cavity 624 is filled with ferromagnetic fluid. A light-dissipating heat-dissipating chamber 625 is provided inside the detection mark assembly 6 corresponding to the position of the intermediary layer 623, and the light-dissipating heat-dissipating chamber 625 is filled with light-absorbing material. A light-emitting head 626 is provided at the lower end of the detection section 62 corresponding to the position of the light-emitting chamber 621, and an ultrasonic detection ring 63 is provided at the lower end of the detection section 62.

[0049] See also Figure 4-5 A heat dissipation package 64 corresponding to the position of the light-emitting module 622 is provided at the lower end of the detection section 62. The heat dissipation package 64 is wrapped around the outside of the light-emitting head 626. The heat dissipation package 64 is filled with heat dissipation liquid. The heat dissipation liquid in the heat dissipation package 64 can absorb a large amount of heat, effectively preventing the light-emitting head 626 from being damaged by excessive temperature, thereby improving the practicality of the device.

[0050] The inner wall of the light-emitting head 626 is polished to obtain a smooth surface. The inner wall of the light-emitting head 626 is provided with a reflective film, which can effectively sort out scattered light and improve the concentration of the light beam.

[0051] The ferromagnetic fluid is silvery white, and the filling amount of the ferromagnetic fluid is 30%. The silvery white ferromagnetic fluid can further improve the reflection efficiency. The 30% filling amount can allow the ferromagnetic fluid to have free space to separate from the magnetic film after being heated, allowing light to leak out, dissipate heat to the light-emitting chamber 621, and reduce the temperature of the light-emitting chamber 621.

[0052] The light-absorbing material is also soaked in heat dissipation liquid, which is made of insulating liquid. The use of insulating heat dissipation liquid reduces the risk of short circuit and effectively absorbs heat, further reducing the temperature of the light-emitting chamber 621, while protecting the light-absorbing material and preventing it from being damaged by high temperature.

[0053] See also Figure 7-8 The left end of the detection seat 4 is provided with a discharge trough 41 connected to the inside of the detection chamber 401, and the bottom wall of the detection chamber 401 is provided with a reserved groove corresponding to the position of the discharge trough 41, and a magnetic repulsion bar 43 is provided inside the reserved groove. An electromagnet 44 is provided at the bottom of the reserved groove, and the electromagnet 44 is connected to the external controller. The discharge trough 41 is arranged to gradually tilt upward from left to right, and the inside of the discharge trough 41 is polished to obtain a smooth surface. A pair of clamping plates 42 are provided on the side walls of the detection chamber 401, and the right end of the bottom wall of the detection chamber 401 is an upward inclined structure. The electromagnet 44 uses the attraction and repulsion effect of the magnetic repulsion bar 43 to realize the action of chip 1 completing the detection and discharging from the detection chamber 401, and the clamping plate 42 is used to fix the chip 1, thereby reducing the situation where the chip 1 is offset during the detection process and causes errors in the detection.

[0054] See also Figure 9 A pair of fixed plates 21 are provided at the upper end of the bottom plate 2, and a conveyor belt 3 is provided in the middle of the pair of fixed plates 21. An offset correction strip 22 corresponding to the upper end position of the conveyor belt 3 is rotatably provided on the inner side wall of the fixed plate 21. The offset correction strip 22 is used to adjust the position of the chip 1 so that it enters the detection cavity 401 at a relatively correct angle, thereby improving the detection accuracy of the chip 1.

[0055] When using the device to test a chip 1, the operator first needs to apply a color-changing marking layer 11 to the surface of the chip 1. After the color-changing marking layer 11 is dried, the chip 1 is placed on the conveyor belt 3. After the position of the chip 1 is adjusted by the offset correction strip 22, the chip 1 is placed into the detection chamber 401 and fixed with the clamping plate 42.

[0056] See also Figure 10-11, control the touch detection section 62 in the detection mark component 6 to contact the surface of the chip 1, and use the ultrasonic detection ring 63 to perform ultrasonic detection on it. When a bad point is detected, the light emitting module 622 is used to generate a high-temperature light beam to irradiate the color-changing mark layer 11 to mark the damaged part. When the damaged position is deep, the position is continuously irradiated to cause the color-changing mark layer 11 to produce a secondary color change, so that the staff can quickly understand the specific damaged position and reasonably judge whether it is worth repairing. Ferromagnetic fluid is used in combination with a magnetic film to be attached to the inner wall of the reflective cavity 624, which improves the concentration of the light beam and allows the temperature-sensitive color-changing particles to change color quickly. When the temperature inside the reflective chamber 621 is too high, the ferromagnetic fluid loses its magnetism and cooperates with the light-dissipating heat dissipation chamber 625 to absorb a large amount of light, thereby reducing the temperature of the reflective chamber 621 and extending the service life of the device.

[0057] It should be added here that the two thermochromic particles have different colors in the initial state. After the first color change, one thermochromic particle becomes colorless, and the color-changing marking layer 11 shows the color of the other thermochromic particle. After the second color change, the color-changing marking layer 11 appears colorless.

[0058] The above description is merely a preferred embodiment of the present invention; however, the scope of protection of the present invention is not limited thereto. Any person skilled in the art who, within the technical scope disclosed by the present invention, makes equivalent substitutions or modifications based on the technical solutions and improved concepts of the present invention shall be covered by the scope of protection of the present invention.

Claims

1. A self-marking chip bad point testing device, comprising a base plate (2), characterized in that: The upper end of the base plate (2) is provided with a detection seat (4), the upper end of the detection seat (4) is provided with a detection cavity (401), the upper end of the base plate (2) is provided with a pair of mutually symmetrical slide grooves (23), the interior of the slide groove (23) is provided with a sliding fixed rod (5) through the sliding of an electric push rod, the upper ends of the sliding fixed rods (5) are connected to each other through a slide rod, and a detection mark assembly (6) is slidably provided on the slide rod, the detection mark assembly (6) includes a sliding telescopic section (61), the lower end of the sliding telescopic section (61) is slidably provided with a touch detection section (62), the touch detection section (62) is provided with a light-emitting chamber (621), and the light-emitting chamber (621) is provided with a light-emitting module. (622), the side wall of the light-emitting chamber (621) is provided with an intermediate layer (623), a plurality of reflective cavities (624) are provided inside the intermediate layer (623), a magnetic film is provided on a side wall of the reflective cavity (624) close to the light-emitting chamber (621), the reflective cavity (624) is filled with ferromagnetic fluid, the detection mark assembly (6) is provided with a light-dissipating heat dissipation chamber (625) corresponding to the position of the intermediate layer (623), the light-dissipating heat dissipation chamber (625) is filled with light-absorbing material, the lower end of the touch detection section (62) is provided with a light-emitting head (626) corresponding to the position of the light-emitting chamber (621), and the lower end of the touch detection section (62) is provided with an ultrasonic detection ring (63); It also includes a chip (1), wherein a color-changing marking layer (11) is provided on the upper end of the chip (1), the color-changing marking layer (11) is made of a transparent gel material, and a color-changing material is evenly distributed inside the color-changing marking layer (11); The color-changing material includes two thermochromic particles mixed with each other, the color-changing temperature difference between the two thermochromic particles is 10-15 degrees Celsius, and the initial colors of the two thermochromic particles are different.

2. The self-marking chip bad pixel testing device according to claim 1, characterized in that: The lower end of the touch detection section (62) is provided with a heat dissipation package (64) corresponding to the position of the light emitting module (622), the heat dissipation package (64) is wrapped around the outside of the light emitting head (626), and the inside of the heat dissipation package (64) is filled with heat dissipation liquid.

3. The self-marking chip bad pixel testing device according to claim 1, characterized in that: The inner wall of the light-emitting head (626) is polished to obtain a smooth surface, and the inner wall of the light-emitting head (626) is provided with a reflective film.

4. The self-marking chip bad pixel testing device according to claim 1, characterized in that: The ferromagnetic fluid is silvery white, and the filling amount of the ferromagnetic fluid is 30%.

5. The self-marking chip bad pixel testing device according to claim 1, characterized in that: The light absorbing material is also soaked in heat dissipation liquid, and the heat dissipation liquid is made of insulating liquid.

6. The self-marking chip bad pixel testing device according to claim 1, characterized in that: The left end of the detection seat (4) is provided with a discharge trough (41) connected to the inside of the detection cavity (401), the bottom wall of the detection cavity (401) is provided with a reserved groove corresponding to the position of the discharge trough (41), a magnetic repulsion bar (43) is provided inside the reserved groove, and an electromagnet (44) is provided at the bottom of the reserved groove, and the electromagnet (44) is connected to an external controller.

7. The self-marking chip bad pixel testing device according to claim 6, characterized in that: The discharge trough (41) is arranged to be gradually inclined upward from left to right, and the interior of the discharge trough (41) is polished to obtain a smooth surface. A pair of clamping plates (42) are provided on the side walls of the detection cavity (401), and the right end of the bottom wall of the detection cavity (401) is in an upward inclined structure.

8. The self-marking chip bad pixel testing device according to claim 1, characterized in that: A pair of fixed plates (21) are provided at the upper end of the bottom plate (2), a conveyor belt (3) is provided between the pair of fixed plates (21), and an offset correction strip (22) corresponding to the upper end position of the conveyor belt (3) is rotatably provided on the inner side wall of the fixed plate (21).

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