Cooling cabinet and computer room cooling system

Abstract

The present application discloses a cooling cabinet and a computer room cooling system. The cooling cabinet includes a housing, a cooling assembly and an airflow drive assembly. The housing has a closed accommodating chamber, and the accommodating chamber includes a cooling zone and a heat exchange zone that are interconnected. The cooling cabinet has a use state. In the use state, the heat exchange zone is used to accommodate the heating element, and the accommodating chamber is used to fill the pressurized gas so that the air pressure in the accommodating chamber is higher than 1atm; the cooling assembly is arranged in the cooling zone, and the cooling assembly is used to cool the pressurized gas; the airflow drive assembly is arranged in the accommodating chamber, and the airflow drive assembly is used to circulate the pressurized gas between the cooling zone and the heat exchange zone, thereby cooling the heating element. In the use state, the pressurized gas with a pressure higher than 1atm can efficiently exchange heat with the heating element to prevent local overheating of the heating element. In addition, the airflow drive assembly consumes less power to drive the pressurized gas to flow, thereby saving energy. The accommodating chamber is in a closed state, which can keep the heating element in a clean environment and effectively protect the heating element.

Description

Technical Field

[0001] The present application relates to the technical field of cooling cabinets, and in particular to a cooling cabinet and a computer room cooling system. Background Art

[0002] Computer rooms, such as data center computer rooms and core computer rooms, are important places for placing computer equipment. A large number of computer equipment are gathered in the computer room, and the heat dissipation problem of the computer room is the focus of the computer room design. At present, with the rapid growth of computing power demand in my country, computer equipment in the data center industry has developed rapidly. For example, the power of a single GPU (Graphics Processing Unit) card involved in AI (Artificial Intelligence) machine learning training has increased from 400W to 500W, and can even reach 700W per card. This computer equipment has higher requirements for heat dissipation. When a large number of concentrated computer equipment are in operation, if the heat cannot be dissipated in time, abnormal conditions such as heat accumulation or local overheating will occur, which will affect the normal operation of the computer equipment. Summary of the Invention

[0003] The embodiments of the present application provide a cooling cabinet and a computer room cooling system, which can solve the problem of low heat dissipation efficiency in a computer room.

[0004] In a first aspect, an embodiment of the present application provides a cooling cabinet, comprising:

[0005] The box body has a closed accommodating cavity, the accommodating cavity includes a cooling area and a heat exchange area that are interconnected, the cooling cabinet has an in-use state, in which the heat exchange area is used to accommodate the heating element, and the accommodating cavity is used to be filled with pressurized gas so that the gas pressure in the accommodating cavity is higher than 1atm;

[0006] a cooling assembly, disposed in the cooling zone, for cooling the pressurized gas; and

[0007] An airflow driving component is disposed in the accommodating cavity, and is used to cause the pressurized gas to circulate between the cooling area and the heat exchange area, thereby cooling the heating element.

[0008] In a second aspect, an embodiment of the present application provides a computer room cooling system, comprising the cooling cabinet as described above.

[0009] Based on the cooling cabinet and computer room cooling system of the embodiment of the present application, when the cooling cabinet is in use, the pressure of the pressurized gas in the accommodating chamber of the box body is greater than 1atm, so that when the pressurized gas after the cooling component is cooled contacts the heating element, the pressurized gas and the heating element can efficiently exchange heat, so as to quickly balance the temperature of each part of the heating element, prevent local overheating of the heating element, and effectively improve the heat dissipation efficiency of the cooling cabinet for the heating element when the cooling cabinet is in use. Moreover, in an environment where the air pressure is greater than 1atm, the power consumption of the airflow drive component to drive the flow of pressurized gas in the accommodating chamber is smaller, thereby saving energy. The accommodating chamber is in a closed state and does not need to exchange substances with the outside world. It can keep the heating element in a clean environment, prevent the heating element from contacting external substances, and effectively protect the heating element. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.

[0011] Figure 1 This is a schematic diagram of the three-dimensional structure of a cooling cabinet according to an embodiment of the present application;

[0012] Figure 2 This is a schematic diagram of the exploded structure of a cooling cabinet according to an embodiment of the present application;

[0013] Figure 3 This is a schematic cross-sectional view of a box according to an embodiment of the present application;

[0014] Figure 4 For this application Figure 1 Schematic cross-sectional view in the AA direction.

[0015] Reference numerals:

[0016] 100, cooling cabinet; 101, accommodating cavity

[0017] 1011, cooling zone; 1012, heat exchange zone; X, preset direction;

[0018] 101a, supply air flow area; 101b, return air flow area; 101c, heat source placement area;

[0019] 110, housing; 111, outer shell; 1111, first shell; 1112, second shell;

[0020] 112, partition; 113, cabinet door; 112a, air supply opening; 112b, return air opening;

[0021] 120, cooling assembly; 121, cooling pipe; 122, heat exchange fin;

[0022] 102, heat exchange section; 1211, liquid inlet section; 1212, liquid outlet section; 1213, transition section;

[0023] 130. Air flow drive assembly; 131. Air supply fan;

[0024] 140, air supply flow equalizing component; 141, air supply flow equalizing plate; 140a, air supply hole; 141b, windward surface;

[0025] 150, return air flow equalizing component; 151, return air flow equalizing plate; 150a, return air hole; 150b, return air surface;

[0026] 160, ventilation valve;

[0027] 200. Heating element. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical solutions and advantages of this application more clearly understood, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0029] The inventors discovered that as the power density of computer equipment increases, while liquid cooling systems have improved the cooling efficiency of high-power-density computer equipment, they still require a large amount of cooling medium, cooling pipes, and other materials to meet the cooling requirements. In the renovation of various computer rooms, simply converting the original air-cooling system to a liquid cooling system may lead to problems such as insufficient building load-bearing capacity.

[0030] In addition, the inventors have also found that precision refrigeration systems, such as row-to-row air conditioners, have good heat dissipation effects when applied to high-heat-density data centers, various modular data centers, data centers with low PUE (Power Usage Effectiveness) requirements, local hotspot renovations in computer rooms, high-heat-density areas in medium and large computer rooms, and data centers with limited computer room space. However, when using precision refrigeration systems for cooling, there is a major problem of high power consumption. For example, the compressors of air-cooled row-to-row air conditioners mostly use variable-capacity digital scroll compressors for cooling, and the fans use EC fans (EC fans refer to centrifugal fans using digital brushless DC external rotor motors or centrifugal fans using EC motors, i.e., electric exchange motors) for air supply. The fans are connected to pipes, which are arranged around the periphery of the computer equipment. Cold air flows in the pipes, and the compressor and fan adjust the flow state of the cold air in the pipes according to the heat load in the pipes to remove the heat generated by the computer equipment, improve the temperature uniformity of the computer equipment, and prevent local overheating of the computer equipment. However, with this air-cooled cooling method, the power consumption of the compressor and fan is very high.

[0031] To solve the above problems, Figure 1 and Figure 2 As shown, an embodiment of the present application provides a cooling cabinet 100, which includes a housing 110, a cooling assembly 120, and an airflow drive assembly 130. The cooling assembly 120 and the airflow drive assembly 130 are both disposed within the housing 110. The cooling cabinet 100 has an in-use state. In the in-use state, the cooling assembly 120 is used to cool the air surrounding it, and the airflow drive assembly 130 is used to drive the air flow around it.

[0032] like Figure 3 As shown, the housing 110 has a closed accommodating chamber 101. For example, at least in the use state, the accommodating chamber 101 of the housing 110 is in a sealed state to block external substances from entering the accommodating chamber 101 and prevent external substances from contacting the structure installed in the accommodating chamber 101. At this time, the air pressure in the accommodating chamber 101 remains unchanged. In addition, in the use state, in addition to adjusting the air pressure in the accommodating chamber 101 to fill the accommodating chamber 101 with pressurized gas or exhaust gas from the accommodating chamber 101, the accommodating chamber 101 of the cooling cabinet 100 no longer exchanges substances with the outside world, so as to provide a good working environment for the heating element 200 in the use state, thereby improving the working stability of the heating element 200. The heating element 200 includes but is not limited to computer equipment in the computer room.

[0033] The accommodating chamber 101 includes a cooling area 1011 and a heat exchange area 1012 that are interconnected. The cooling area 1011 and the heat exchange area 1012 can be directly connected to achieve communication. For example, when no partition structure is provided in the box body 110, the cooling area 1011 and the heat exchange area 1012 are directly connected to achieve communication, that is, the accommodating chamber 101 is a complete space that is not divided; or Figure 4 As shown, when a partition structure is provided in the box body 110, for example, the partition structure is a partition 112, the partition structure can divide the accommodating cavity 101 into a cooling zone 1011 and a heat exchange zone 1012, and the partition structure defines an area connecting the cooling zone 1011 and the heat exchange zone 1012.

[0034] Among them, in the use state, the accommodating chamber 101 is used to fill the pressurized gas so that the air pressure in the accommodating chamber 101 is higher than 1atm, and the heat exchange area 1012 is used to accommodate the heating element 200, so that the heating element 200 is in a high-pressure environment. At this time, the accommodating chamber 101 of the box body 110 is in a closed state and no longer ventilated with the outside. The cooling component 120 is arranged in the cooling area 1011, and the cooling component 120 is used to cool the pressurized gas in the cooling area 1011. The airflow drive component 130 can be arranged at any position in the accommodating chamber 101. The airflow drive component 130 is used to circulate the pressurized gas between the cooling area 1011 and the heat exchange area 1012, and when the pressurized gas flows to the vicinity of the heating element 200, it absorbs the heat of the heating element 200 to cool the heating element 200. The pressurized gas that absorbs the heat of the heating element 200 flows back to the cooling zone 1011, is reabsorbed by the cooling assembly 120 and cooled, and then continues to circulate to the heat exchange zone 1012, so as to continuously cool the heating element 200.

[0035] When in use, in addition to adjusting the air pressure in the accommodating chamber 101 to fill the accommodating chamber 101 with pressurized gas or exhaust gas from the accommodating chamber 101, the accommodating chamber 101 of the cooling cabinet 100 no longer exchanges substances with the outside world, thereby providing a good working environment for the heating element 200 and improving the working stability of the heating element 200.

[0036] In use, when the pressure within the housing chamber 101 is greater than 1 atm, the pressurized gas achieves a higher heat exchange efficiency when in contact with the heating element 200, thereby causing the pressurized gas to cool the heating element 200 more quickly. Furthermore, as the pressure increases, the heat exchange efficiency increases. Furthermore, under the same heat exchange requirements, the power consumption of the airflow drive assembly 130 can be reduced. It is understood that when the pressurized gas circulates within the cooling zone 1011 and the heat exchange zone 1012, the pressure in different areas of the housing chamber 101 may vary slightly due to factors such as the heat from the heating element 200. The pressure within the housing chamber 101 described in the embodiments of the present application is the average pressure across all areas within the housing chamber 101.

[0037] Optionally, the pressure range of the pressurized gas is greater than or equal to 2 atm and less than or equal to 5 atm. Within this pressure range, the heat exchange efficiency between the pressurized gas and the heating element 200 can be effectively improved, and the power consumption of the airflow driving component 130 can be effectively reduced.

[0038] Optionally, the pressurized gas is nitrogen or air, nitrogen is an inactive gas, and air is the ambient gas in which the heating element 200 is at normal pressure. Therefore, nitrogen or air is used as the pressurized gas to fill the accommodating cavity 101 and achieve pressurization. The nitrogen or air contacts the heating element 200, which can prevent the pressurized gas from reacting with the components of the heating element 200, thereby protecting the heating element 200.

[0039] The power consumption of the airflow driving assembly 130 is low under high pressure conditions (i.e., pressure greater than 1 atm), as deduced from the following formulas (1) to (15).

[0040] The power N of the airflow drive assembly 130 is expressed as follows (1):

[0041] N=Vp f / (3600*1000*η0*η1) (1)

[0042] In formula (1), V is the volume flow rate of the pressurized gas passing through the airflow drive assembly 130, and p f is the total wind pressure of the airflow drive assembly 130 (i.e., the pressure difference between the air outlet and the air inlet of the airflow drive assembly 130), η0 is the internal efficiency of the airflow drive assembly 130, and η1 is the mechanical efficiency of the airflow drive assembly 130. When the internal efficiency η0, mechanical efficiency η1, and total wind pressure pf of the airflow drive assembly 130 remain unchanged, the power N of the airflow drive assembly 130 is proportional to the volume flow rate V of the pressurized gas.

[0043] According to Darcy's formula, the internal resistance loss Δl in the air duct of the airflow driving component 130 is proportional to the square of the wind speed v and the density ρ of the pressurized gas, that is, Δl is proportional to v 2 ·ρ.

[0044] The total wind pressure p generated by the airflow driving component 130 f It is necessary to overcome the internal resistance loss of the air duct △l to drive the pressurized gas to flow, that is, p f =△l, from this we can know that p f Proportional to v 2 ·ρ.

[0045] In the following formula, the subscript "air" represents the pressurized gas at a pressure of 1 atm, and the subscript "high" represents the pressurized gas at a pressure higher than 1 atm. The following equation is obtained:

[0046] p f,air / p f,high =(v air 2 ·ρ air ) / (v high 2 ·ρ high ) (2)

[0047] Since the volume flow rate of the pressurized gas is V=s·v, where s is the cross-sectional area of ​​the pressurized gas passing through the airflow driving assembly 130, when the cross-sectional area s is the same, the following is obtained:

[0048] V air / V high =v air / v high (3)

[0049] From the above formulas (1), (2) and (3), we can obtain:

[0050] N air / N high =(V air 3 ·ρ air ) / (V high 3 ·ρ high ) (4)

[0051] The pyrolysis power Q of the heating element 200 is expressed as follows (5):

[0052] Q=ρC p V△t (5)

[0053] In formula (5), ρ is the density of the pressurized gas, C p is the constant-pressure specific heat capacity of the pressurized gas, V is the volume flow rate of the pressurized gas, and △t is the supply and return air temperature difference of the pressurized gas (the temperature difference between the pressurized gas near the cooling component 120 and the pressurized gas near the heating element 200 is taken as the supply and return air temperature difference).

[0054] When the return air temperature difference Δt is the same as the pyrolysis power Q of the heating element 200, that is, Q air =Q high , △t air =△t high , according to formula (5):

[0055] ρ air C p,air V air =ρ high C p,high V high (6)

[0056] According to formula (6), we can obtain:

[0057] V air / V high =(ρ high ·C p,high ) / (ρ air ·C p,air ) (7)

[0058] From the above formula (4) and formula (7), we can obtain:

[0059]

[0060] The ideal gas state equation includes the following formulas (9)-(12):

[0061] pV=nRT (9)

[0062] ρV=m=nM (10)

[0063] Rg=R / M (11)

[0064] Cp=(k / k-1)Rg (12)

[0065] In the above equations (9) to (12), P is the pressure of the pressurized gas, M is the molar mass of the pressurized gas, R is the universal constant of the pressurized gas, T is the temperature of the pressurized gas, n is the amount of pressurized gas substance, m is the mass of the pressurized gas, Cp is the constant-pressure specific heat capacity of the pressurized gas, and k is the gas specific heat ratio.

[0066] From the above formulas (9)-(10), we can obtain:

[0067] ρ=pM / RT (13)

[0068] From the above formulas (11)-(12), we can obtain:

[0069] Cp=(k / k-1)·(R / M) (14)

[0070] From the above equations (8), (13) and (14), we can obtain:

[0071]

[0072] During use, the pressure within chamber 101 remains constant, and the pressurized gas is an ideal gas. When the pressure within chamber 101 is greater than 1 atm, the effect of pressure on the specific heat ratio k is negligible. For example, at room temperature (25°C), the specific heat of air at 1 atm is 1.4017 kJ / (kg K), and at 4 atm is 1.4070 kJ / (kg K). The change in specific heat of air at these two pressures is very small, indicating that the effect of pressure on the specific heat ratio k of the pressurized gas is negligible.

[0073] According to the above formula (15), when the molar mass M and the specific heat ratio k are constant, as the air pressure p in the accommodating chamber 101 increases, the power consumption N of the airflow driving component 130 gradually decreases.

[0074] like Figure 4 As shown, in some embodiments, the cooling cabinet 100 may further include an air flow equalizer 140. The air flow equalizer 140 is disposed in the heat exchange area 1012 and forms an air flow equalizer area 101a with the inner wall of the housing 110. The air flow equalizer 140 is provided with a plurality of air supply holes 140a, and the cooling area 1011, the air flow equalizer area 101a, and the air supply holes 140a are sequentially connected. In use, the air supply holes 140a are disposed toward the heating element 200 so that the pressurized gas in the cooling area 1011 can enter the air flow equalizer area 101a from the cooling area 1011, and after being equalized by the air flow equalizer 140, it is delivered to the heating element 200 through the air supply holes 140a. Among them, the pressurized gas after being evenly distributed by the air supply equalizer 140 can be delivered to the heating element 200 more evenly to prevent the pressurized gas from being delivered to the layout location of the heating element 200, and to prevent the pressurized gas from contacting different parts of the heating element 200 in different amounts, thereby avoiding local overheating of the heating element 200.

[0075] The air supply flow balancing area 101a and the area for accommodating the heating element 200 are arranged side by side along a preset direction X, and the cooling area 1011 is arranged on one side of the air supply flow balancing area 101a and the area for accommodating the heating element 200 along a direction perpendicular to the preset direction X. After the pressurized gas in the cooling area 1011 is delivered to the air supply flow balancing area 101a, it can turn within the air supply flow balancing area 101a, and then pass through the air supply holes 140a of the air supply flow balancing member 140 to flow to the space where the heating element 200 is located and contact the heating element 200. Among them, the pressurized gas turns within the air supply flow balancing area 101a, so that the airflow in each part of the air supply flow balancing area 101a can be uniform, and then the pressurized gas in the air supply flow balancing area 101a can pass through the air supply flow balancing member 140 and be delivered to the heating element 200 more evenly.

[0076] Optionally, the air flow equalizing member 140 is an air flow equalizing plate 141, which is disposed within the housing 110. The surface of the air flow equalizing plate 141 is perpendicular to the preset direction X, and the air flow equalizing plate 141 is connected to the housing 110. The air flow equalizing plate 141 has a windward surface 141b, and the windward surface 141b of the air flow equalizing plate 141 and the wall surface of the housing 110 jointly define an air flow equalizing area 101a. The air supply holes 140a extend from the windward surface 141b through the air flow equalizing plate 141 along the preset direction X. In use, the surface of the air flow equalizing plate 141 facing away from the windward surface 141b is directed toward the heating element 200.

[0077] The cooling cabinet 100 further includes a return air flow equalizer 150, which is disposed in the heat exchange area 1012 and forms a return air flow equalizer 101b with the inner wall of the cabinet 110. The return air flow equalizer 150 also forms a heat source placement area 101c with at least the supply air flow equalizer 140. The heat source placement area 101c is an area for accommodating the heating element 200. The return air flow equalizer 150 has a plurality of return air holes 150a. The supply air holes 140a, the heat source placement area 101c, the return air holes 150a, the return air flow equalizer 101b, and the cooling area 1011 are sequentially connected, so that the pressurized gas in the supply air flow equalizer 101a can pass through the supply air holes 140a to reach the heat source placement area 101c, then enter the return air flow equalizer 101b from the return air holes 150a and flow back to the cooling area 1011, thereby allowing the pressurized gas to circulate within the accommodating chamber 101.

[0078] Among them, the return air flow equalizer 150 is used to evenly receive the pressurized gas in the heat source placement area 101c, so that the pressurized gas can flow more evenly after entering the heat source placement area 101c from the air supply hole 140a and before reaching the return air hole 150a, so as to evenly contact various parts of the heating element 200, thereby evenly cooling the heating element 200 and preventing local overheating of the heating element 200.

[0079] Optionally, the return air flow equalizing member 150 is a return air flow equalizing plate 151, which is disposed within the housing 110. The surface of the return air flow equalizing plate 151 is perpendicular to the preset direction X, and the return air flow equalizing plate 151 is connected to the housing 110. The return air flow equalizing plate 151 has a return air surface 150b, and the return air surface 150b of the return air flow equalizing plate 151 and the inner wall surface of the housing 110 define a return air flow equalizing area 101b. Return air holes 150a extend from the surface of the return air flow equalizing plate 151 facing the heat source placement area 101c along the preset direction X to the return air surface 150b, so that pressurized gas from the heat source placement area 101c can pass through the return air holes 150a to reach the return air flow equalizing area 101b.

[0080] Optionally, when the return air flow equalizer 150 is a return air flow equalizer plate 151 and the supply air flow equalizer 140 is a supply air flow equalizer plate 141, the heat source placement area 101c is defined by the surface of the return air flow equalizer plate 151 facing away from the return air surface 150b, the surface of the supply air flow equalizer plate 141 facing away from the windward surface 141b, and a portion of the inner wall surface of the cabinet 110. In other embodiments, the return air flow equalizer 150 and the supply air flow equalizer 140 are not limited to being plate-shaped, and can be selected based on actual needs.

[0081] like Figure 4As shown, the return air flow equalizer 150 and the supply air flow equalizer 140 are arranged relative to each other along the preset direction X, so that the return air flow equalizer area 101b and the supply air flow equalizer area 101a are arranged on opposite sides of the heat source placement area 101c along the preset direction X, so that the pressurized gas passing through the supply air hole 140a directly passes through the heat source placement area 101c along the preset direction X and then enters the return air hole 150a, so that the pressurized gas can flow more evenly in the heat source placement area 101c.

[0082] In some embodiments, the multiple air supply holes 140a of the air supply flow equalizer 140 are evenly arranged in a plane perpendicular to a preset direction. In this case, the air supply fan 131 can be set to deliver the pressurized gas to the air supply flow equalizer area 101a in a direction perpendicular to the preset direction X, so that the pressurized gas contacts the wall of the box 110 and then changes direction, so that the pressurized gas can be more evenly distributed in the air supply flow equalizer area 101a, and thus can more evenly pass through the multiple air supply holes 140. Furthermore, the return air holes 150a of the return air flow equalizer area 150 are evenly arranged in a plane perpendicular to the preset direction X, so that the pressurized gas in each area of ​​the heat source placement area 101c can pass through the corresponding return air holes 150a along the preset direction X or a direction close to the preset direction X, making the flow of pressurized gas in the heat source placement area 101c more stable.

[0083] When in use, the placement position of the cooling cabinet 100 can be adjusted so that the return air flow equalizer 150 and the supply air flow equalizer 140 are arranged relative to each other along the preset direction X. At this time, the preset direction X is the horizontal direction, and the heat exchange zone 1012 is located below the cooling zone 1011 along the gravity direction (i.e., the vertical direction), so that the low-temperature pressurized gas after being cooled in the cooling zone 1011 sinks into the heat exchange zone 1012 along the gravity direction, and the high-temperature pressurized gas in the heat exchange zone 1012 that absorbs the heat of the heating element 200 floats to the cooling zone 1011. In this way, the circulation of the pressurized gas can be promoted and the heat exchange efficiency can be improved.

[0084] When the heat exchange zone 1012 is located below the cooling zone 1011 along the direction of gravity, and the return air equalizing flow zone 101b and the supply air equalizing flow zone 101a are arranged on opposite sides of the heat source placement zone 101c in the horizontal direction, the pressurized gas in the cooling zone 1011 sinks to the supply air equalizing flow zone 101a, and contacts the wall of the box body 110 used to limit the supply air equalizing flow zone 101a, and then changes direction to pass through the supply air hole 140a to enter the heat source placement zone 101c. After the pressurized gas absorbs the heat of the heating element 200, it enters the return air equalizing flow zone 101b from the return air hole 150a, and changes direction to float upward in the return air equalizing flow zone 101b to flow back to the cooling zone 1011. Optionally, along the gravity direction, the cooling zone 1011 and the heat source placement zone 101c at least partially overlap to simplify the flow path of the pressurized gas from the cooling zone 1011 to the supply air flow balancing zone 101a, and to simplify the flow path of the pressurized gas from the return air flow balancing zone 101b back to the cooling zone 1011. Furthermore, along the gravity direction, the cooling zone 1011 covers the heat exchange zone 1012.

[0085] See also Figure 2 as well as Figure 4 The box body 110 includes an outer shell 111 and a partition 112. The outer shell 111 has an accommodating chamber 101. The partition 112 is arranged in the accommodating chamber 101 and fixed to the outer shell 111. The partition 112 divides the accommodating chamber 101 into a cooling zone 1011 and a heat exchange zone 1012. The partition 112 has an air supply opening 112a or the partition 112 and the outer shell 111 form an air supply opening 112a. The pressurized gas in the cooling zone 1011 enters the heat exchange zone 1012 from the air supply opening 112a. The partition 112 also has a return air opening 112b or the partition 112 and the outer shell 111 form a return air opening 112b. The pressurized gas in the heat exchange zone 1012 flows back to the cooling zone 1011 from the return air opening 112b. When the cooling cabinet 100 also includes a supply air flow equalizer 140 and a return air flow equalizer 150, the supply air flow equalizer 140, the return air flow equalizer 150 and the partition 112 separate the accommodating cavity 101 into four orderly spaces, namely, a cooling area 1011, a supply air flow equalizer area 101a, a heat source placement area 101c and a return air flow equalizer area 101b, so that the pressurized gas circulates in the above four areas in sequence, preventing the pressurized gases in the above four areas from cross-interference with each other, thereby improving the heat exchange efficiency.

[0086] The supply air opening 112a and the return air opening 112b can be directly connected to the heat exchange zone 1012, that is, the supply air opening 112a is directly connected to the supply air equalizing flow zone 101a of the heat exchange zone 1012, and the return air opening 112b is directly connected to the return air equalizing flow zone 101b of the heat exchange zone 1012. At this time, the supply air equalizing flow zone 101a is defined by one end of the partition 112 with the supply air opening 112a, the supply air equalizing flow plate 141 and the outer shell 111, and the return air equalizing flow zone 101b is defined by the other end of the partition 112 with the return air opening 112b, the return air equalizing flow plate 151 and the outer shell 111, and the heat source placement area 101c is defined by the middle part of the partition 112, the supply air equalizing flow plate 141, the return air equalizing flow plate 151 and the outer shell 111. In use, the bottom of the outer shell 111 is used to support the heating element 200.

[0087] It should be noted that in order to allow the pressurized gas to smoothly pass through the air supply opening 112a from the cooling zone 1011 into the air supply equalizing flow zone 101a, and at the same time allow the pressurized gas to smoothly pass through the return air equalizing flow zone 101b into the cooling zone 1011 through the return air opening 112b, the airflow drive component 130 can be set to be located in other areas outside the cooling zone 1011, for example, the airflow drive component 130 can be set to be located at at least one of the supply air opening 112a and the return air opening 112b.

[0088] The airflow driving assembly 130 may include at least one of a supply blower 131 and an exhaust blower to drive the pressurized gas to circulate in the accommodating chamber 101 .

[0089] When the airflow drive assembly 130 is located at the air supply opening 112a, the airflow drive assembly 130 is configured to include an air supply blower 131. The air supply blower 131 uses air supply to deliver the pressurized gas in the cooling zone 1011 to the air supply uniform flow zone 101a. The direction of the air outlet of the air supply blower 131 can be set so that the pressurized gas entering the air supply uniform flow zone 101a flows in a direction perpendicular to the preset direction X, and changes direction after contacting the inner wall of the shell 111 and passes through the air supply hole 140a. Optionally, the air supply blower 131 is configured to be located within the air supply opening 112a and fixed to the partition 112. When the air supply opening 112a is formed by the partition 112 and the shell 111, the air supply blower 131 can be located within the air supply opening 112a and fixed to at least one of the plate 112 and the shell 111.

[0090] When the airflow drive assembly 130 is located at the return air opening 112b, the airflow drive assembly 130 is configured to include an exhaust fan. The exhaust fan uses an exhaust method to extract the pressurized gas in the return air flow zone 101b to the cooling zone 1011, thereby driving the circulation of the pressurized gas in various areas within the accommodating chamber 101. Optionally, the exhaust fan is configured to be located within the return air opening 112b and fixed to the partition 112. When the return air opening 112b is formed by the partition 112 and the housing 111, the exhaust fan can be located within the return air opening 112b and fixed to at least one of the partition 112 and the housing 111.

[0091] Of course, in some other embodiments, the airflow drive assembly 130 may also be provided in other areas outside the cooling zone 1011, the air supply opening 112a and the return air opening 112b. This application does not limit this, and the specific selection can be made according to actual needs. For example, the airflow drive assembly 130 includes an exhaust fan, which is provided in the return air equalizing area 101b and fixed to the housing 111. It should be noted that when selecting the installation position of the airflow drive assembly 130, it is preferable to provide the airflow drive assembly 130 on the side of the return air equalizing member 150 away from the heat source placement area 101c, and use an exhaust method to drive the pressurized gas to pass through the air supply equalizing member 140 and the return air equalizing member 150 in sequence, so that the pressurized gas can flow more evenly and stably in the heat source placement area 101c.

[0092] like Figure 2 and Figure 4 As shown, the cooling assembly 120 includes a cooling pipe 121, and the cooling pipe 121 includes a heat exchange section 102 accommodated in the cooling zone 1011. In use, the flow direction of the cooling medium flowing in the heat exchange section 102 is opposite to the flow direction of the pressurized gas in the cooling zone 1011, so as to facilitate heat exchange and improve heat exchange efficiency.

[0093] Optionally, the cooling pipe 121 is a straight pipe, which extends parallel to the preset direction X. In this case, the portion of the straight pipe accommodated in the cooling zone 1011 forms the heat exchange section 102 .

[0094] Optionally, the cooling pipe 121 includes a liquid inlet section 1211, a liquid outlet section 1212 and a transition section 1213 connected between the liquid inlet section 1211 and the liquid outlet section 1212. The liquid inlet section 1211 and the liquid outlet section 1212 can be arranged side by side in a direction perpendicular to the preset direction X, and the liquid inlet section 1211 and the liquid outlet section 1212 are arranged to pass through the part of the shell 111 away from the air supply opening 112a. At this time, the cooling fluid in the liquid outlet section 1212 is opposite to the flow direction of the pressurized gas, that is, the liquid outlet section 1212 forms a heat exchange section 102; or, the liquid inlet section 1211 and the liquid outlet section 1212 are arranged to pass through the part of the shell 111 adjacent to the air supply opening 112a. At this time, the cooling fluid in the liquid inlet section 1211 is opposite to the flow direction of the pressurized gas, that is, the liquid inlet section 1211 forms the heat exchange section 102.

[0095] The cooling assembly 120 may further include a plurality of heat exchange fins 122, with at least one of the cooling tube 121 and the heat exchange fins 122 being fixed to the housing 110. The plurality of heat exchange fins 122 are all connected to the periphery of the heat exchange section 102, with adjacent heat exchange fins 122 spaced apart. The spaced-apart heat exchange fins 122 increase the contact area between the cooling assembly 120 and the pressurized gas within the cooling zone 1011. Specifically, when the cooling tube 121 includes a liquid inlet section 1211, a liquid outlet section 1212, and a transition section 1213, heat exchange fins 122 are disposed adjacent to the periphery of the liquid inlet section 1211, the liquid outlet section 1212, and the transition section 1213 to further improve heat exchange efficiency.

[0096] The cabinet 110 includes a cabinet door 113, which is movably mounted on the outer shell 111. The cabinet door 113 can be opened or closed. When the cabinet door 113 is closed, the cabinet door 113 and the outer shell 111 jointly define the accommodating chamber 101. The cabinet door 113 is set to correspond to at least the heat exchange area 1012. For example, the cabinet door 113 is set to correspond to the heat source placement area 101c. Furthermore, the cabinet door 113 can be set to correspond to both the heat source placement area 101c and the cooling area 1011. The cabinet door 113 can be opened to place the heating element 200 in the heat source placement area 101c. In the use state, the cabinet door 113 is closed to place the heating element 200 in the sealed accommodating chamber 101.

[0097] When the cabinet door 113 is provided corresponding to the heat source placement area 101c, the housing 111 may include a first shell 1111 and a second shell 1112, the partition 112 being fixed to the first shell 1111, and the cabinet door 113 being movably mounted on the first shell 1111. In this case, the first shell 1111, the cabinet door 113, and the partition 112 collectively define a heat exchange area 1012. The second shell 1112 is provided on a side of the partition 112 away from the heat exchange area 1012 and is mounted on the first shell 1111. In this case, the first shell 1111 and the partition collectively define a cooling area 1011.

[0098] See also Figure 1 as well as Figure 2 The cooling cabinet 100 also includes a ventilation valve 160 provided on the box body 110. The ventilation valve 160 is connected to the accommodating chamber 101. Pressurized gas is injected into the accommodating chamber 101 through the ventilation valve 160 to make the air pressure in the accommodating chamber 101 greater than 1atm. Alternatively, when it is necessary to open the cabinet door 113 to inspect the heating element 200, the pressurized gas in the accommodating chamber 101 is discharged through the ventilation valve 160.

[0099] An embodiment of the present application also provides a computer room cooling system, including the cooling cabinet 100 as described above, wherein the number of cooling cabinets 100 is multiple and arranged side by side. The computer room cooling system also includes a liquid supply device (not shown in the figure) and a control module (not shown in the figure), and the liquid supply device is used to transport a cooling medium into the cooling pipe 121. For example, the cooling medium includes cooling water, etc. The control module is electrically connected to the liquid supply device and the airflow drive assembly 130, respectively. In use, by adjusting the flow state of the cooling medium through the liquid supply device and adjusting the flow state of the pressurized gas in the accommodating chamber 101 through the airflow drive assembly 130, a variety of heat exchange requirements can be met. Moreover, the computer room cooling system of the present application has the advantages of light weight and low power consumption by being provided with the cooling cabinet 100 as described above, and can be applied to a variety of application scenarios. For example, when modifying the air cooling system, the computer room cooling system of the present application is adopted, and the pressurized gas is filled in the closed accommodating cavity 101 of the cooling cabinet 100, which can effectively improve the heat dissipation efficiency and reduce the power consumption of the airflow drive component 130, and at least save the amount of cooling medium and cooling pipes, and prevent the modification from being affected by the weight limit of the building.

[0100] The same or similar numbers in the drawings of this embodiment correspond to the same or similar parts; in the description of this application, it should be understood that if the terms "upper", "lower", "left", "right", etc. indicate an orientation or position relationship, they are based on the orientation or position relationship shown in the drawings. This is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, the terms describing the position relationship in the drawings are only used for illustrative purposes and cannot be understood as a limitation on this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0101] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. A cooling cabinet, characterized in that: include: A box body, the box body comprising an outer shell and a partition, the outer shell having a closed accommodating cavity, the partition dividing the accommodating cavity into a cooling area and a heat exchange area that are interconnected, the cooling cabinet having an in-use state, in which the heat exchange area is used to accommodate a heating element, and the accommodating cavity is used to be filled with pressurized gas so that the gas pressure in the accommodating cavity is higher than 1 atm; Along the gravity direction, the cooling zone covers the heat exchange zone, the partition has an air supply opening or the partition and the shell form an air supply opening, the pressurized gas in the cooling zone enters the heat exchange zone from the air supply opening, the partition has a return air opening or the partition and the shell form a return air opening, the pressurized gas in the heat exchange zone flows back to the cooling zone from the return air opening; a cooling assembly, disposed in the cooling zone, for cooling the pressurized gas; and an airflow driving assembly, disposed at any position within the accommodating chamber, for circulating the pressurized gas between the cooling zone and the heat exchange zone, thereby cooling the heating element; Among them, when the air pressure in the accommodating chamber is higher than 1atm, the heat exchange efficiency of the pressurized gas when in contact with the heating element is higher, and under the same heat exchange requirements, the power consumption of the airflow driving component is smaller, wherein the air pressure in the accommodating chamber is the average air pressure in each area in the accommodating chamber.

2. The cooling cabinet according to claim 1, characterized in that: The cooling cabinet further comprises: An air flow equalizing component is arranged in the heat exchange zone and forms an air flow equalizing area with the inner wall of the box. The air flow equalizing component has a plurality of air supply holes. The cooling zone, the air flow equalizing area and the air supply holes are connected in sequence.

3. The cooling cabinet according to claim 2, characterized in that: The cooling cabinet further comprises: The return air flow equalizing component is arranged in the heat exchange area, and forms a return air flow equalizing area with the inner wall of the box body, and forms a heat source placement area with at least the supply air flow equalizing component. The return air flow equalizing component has multiple return air holes, and the supply air holes, the heat source placement area, the return air holes, the return air flow equalizing area and the cooling area are connected in sequence.

4. The cooling cabinet according to claim 3, characterized in that: The return air uniform flow area and the supply air uniform flow area are arranged on opposite sides of the heat source placement area along a preset direction; In the use state, the preset direction is a horizontal direction, and the heat exchange zone is located below the cooling zone along the direction of gravity.

5. The cooling cabinet according to claim 1, wherein: The airflow drive assembly includes an air supply fan, provided at the air supply opening; and / or, The exhaust fan is arranged at the return air opening.

6. The cooling cabinet according to claim 1, wherein: The cooling assembly comprises: a cooling pipe comprising a heat exchange section accommodated in the cooling zone, wherein, in the use state, a flow direction of the cooling medium flowing in the heat exchange section is opposite to a flow direction of the pressurized gas in the cooling zone; A plurality of heat exchange fins, wherein the plurality of heat exchange fins are connected to the periphery of the heat exchange section, and two adjacent heat exchange fins are arranged at intervals; Wherein, at least one of the cooling pipe and the heat exchange plate is fixed to the box body.

7. The cooling cabinet according to claim 1, characterized in that: The box body includes a cabinet door, and the cabinet door is arranged at least corresponding to the heat exchange area; and / or The cooling cabinet further includes a ventilation valve provided on the box body, and the ventilation valve is communicated with the accommodating cavity.

8. The cooling cabinet according to any one of claims 1 to 7, characterized in that: The pressurized gas is nitrogen or air; and / or, The pressure range of the pressurized gas is greater than or equal to 2 atm and less than or equal to 5 atm.

9. A cooling system for a machine room, characterized in that: The cooling cabinet comprises the cooling cabinet according to any one of claims 1 to 8.

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