Methods for preparing substrates and display panels

Abstract

This application discloses a method for fabricating a substrate and a display panel. A photoresist film with a striped pattern is provided. The photoresist film is attached to the side of a substrate, with one end of the striped pattern connected to a first conductive pad and the other end connected to a second conductive pad. The portion of the photoresist film corresponding to the striped pattern is then removed to form a trench. The trench exposes the substrate, the first conductive pad, and the second conductive pad. A metal layer is formed within the trench, with one end connected to the first conductive pad and the other end connected to the second conductive pad. Finally, the photoresist film is removed to form a wire connecting the first and second conductive pads. This method avoids the technical difficulties of three-sided exposure in traditional processes, enabling better implementation of connections across the sides of the substrate.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a method for preparing a substrate and a display panel. Background Technology

[0002] The prospects for new display applications such as ultra-narrow bezels and seamless splicing are very broad. The former can bring users a cool technological experience, while the latter is an important technical route for the large-size development of sub-millimeter LEDs and micro LEDs, both of which have extremely high commercial development value. To realize such technologies, in the display panel design, non-display areas such as fan-shaped traces and solder leads must be moved from the traditional front of the panel to the back of the panel. The display area lines on the front and the bonding lines on the back are then connected by lines that cross the sides of the substrate.

[0003] In the process of researching and practicing existing technologies, the inventors of this application have discovered that there are many methods for forming interconnects across the sides of a substrate, such as laser engraving and silver paste printing. However, the problems of low yield and low production efficiency encountered in practice cannot be well solved in the short term.

[0004] Currently, most exposure machines on the market are planar products, and their lamp source systems, alignment systems, and platform systems cannot complete the exposure of three sides of the substrate. Some targeted design attempts, such as substrate platform rotation, light source rotation, and three-sided light sources, also encountered insurmountable problems during the experiment: uneven exposure and difficulty in controlling depth of field. Summary of the Invention

[0005] This application provides a substrate that can bypass the technical difficulties of three-sided exposure, enabling better implementation of connections across the sides of the substrate.

[0006] This application provides a method for preparing a substrate, comprising the following steps:

[0007] A photoresist film is provided; the photoresist film is provided with at least one stripe pattern;

[0008] A driving substrate is provided; the driving substrate includes a display area and a border area; the driving substrate includes a substrate, a first conductive pad and a second conductive pad; the substrate includes a first surface and a second surface disposed opposite to the first surface; the first conductive pad is disposed on the first surface and corresponds to the border area; the second conductive pad is disposed on the second surface and corresponds to the border area.

[0009] A driving substrate module is formed by aligning and attaching the photoresist film onto the driving substrate; the strip pattern is attached to the side of the substrate, and one end of the strip pattern is connected to the first conductive pad, and the other end of the strip pattern is connected to the second conductive pad.

[0010] The photoresist film is developed to remove the portion of the photoresist film corresponding to the strip pattern, forming trenches; the trenches expose the substrate, the first conductive pad, and the second conductive pad.

[0011] A metal layer is formed on the photoresist film and in the trench; one end of the metal layer is connected to the first conductive pad, and the other end of the metal layer is connected to the second conductive pad;

[0012] Remove the photoresist film to form a wire connecting the first conductive pad and the second conductive pad.

[0013] Optionally, in some embodiments of this application, the step of providing a photoresist film further includes:

[0014] The strip pattern is formed by exposing the photoresist laminate to the light; the photoresist laminate includes a first protective layer, the photoresist film, and a second protective layer stacked together.

[0015] Remove the first protective layer and the second protective layer.

[0016] Optionally, in some embodiments of this application, the step of providing a driving substrate further includes:

[0017] Clean the drive substrate;

[0018] Dry the drive substrate;

[0019] The driving substrate is subjected to edge grinding to form a first connecting surface between the first surface and the side surface, and a second connecting surface between the second surface and the side surface.

[0020] Activate the substrate.

[0021] Optionally, in some embodiments of this application, the step of providing a driving substrate before activating the substrate further includes:

[0022] At least the sides of the substrate are roughened.

[0023] Optionally, in some embodiments of this application, the step of aligning and attaching the photoresist film on the driving substrate to form a driving substrate module further includes:

[0024] The photoresist film is aligned and attached to the driving substrate to form a driving substrate module;

[0025] Bake the drive substrate module;

[0026] Press the photoresist film to remove air bubbles.

[0027] Optionally, in some embodiments of this application, the step of aligning and attaching the photoresist film on the driving substrate to form a driving substrate module further includes:

[0028] The photoresist film is aligned and attached to the driving substrate to form a driving substrate module;

[0029] The drive substrate module is preheated;

[0030] The photoresist film is rolled at a set temperature; the set temperature is between 104 degrees Celsius and 106 degrees Celsius.

[0031] Optionally, in some embodiments of this application, the step of forming a metal layer within the trenches of the photoresist film includes:

[0032] A vapor deposition apparatus is provided; the vapor deposition apparatus includes a rotating disk and a rotating shaft; the rotating shaft is disposed on the rotating disk;

[0033] A first target is provided at one end of the revolution disk, and a second target is provided at the other end of the revolution disk;

[0034] The drive base plate module is disposed on the rotation axis;

[0035] Rotating the revolution disk and the rotation shaft drives the drive base plate module to rotate;

[0036] The first target and the second target are bombarded, causing the materials of the first target and the second target to be deposited on the driving substrate module to form a metal layer; the metal layer covers the photoresist film and the trench.

[0037] Optionally, in some embodiments of this application, the step of providing a driving substrate before performing edge grinding on the driving substrate further includes the following steps:

[0038] A first insulating film is attached to the first surface and corresponds to the display area; a second insulating film is attached to the second surface and corresponds to the display area.

[0039] Optionally, in some embodiments of this application, the following steps are included before removing the photoresist film:

[0040] Peel off the first and second barrier membranes; at the same time, use an air knife to blow away the target particles.

[0041] Accordingly, embodiments of this application also provide a method for manufacturing a display panel, comprising:

[0042] Provide a substrate as described above;

[0043] A light-emitting device is disposed on the substrate.

[0044] This application embodiment employs a photoresist film with a striped pattern. The photoresist film is attached to the side of a substrate, with one end of the striped pattern connected to a first conductive pad and the other end connected to a second conductive pad. Subsequently, the portion of the photoresist film corresponding to the striped pattern is removed to form a trench. The trench exposes the substrate, the first conductive pad, and the second conductive pad. A metal layer is formed within the trench, with one end of the metal layer connected to the first conductive pad and the other end connected to the second conductive pad. Finally, the photoresist film is removed to form a wire connecting the first conductive pad and the second conductive pad. This solution avoids the technical difficulties of three-sided exposure in traditional processes, enabling better implementation of connections across the sides of the substrate. Attached Figure Description

[0045] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0046] Figure 1 This is a schematic diagram of the substrate fabrication method provided in Embodiment 1 of this application;

[0047] Figure 2 This is a schematic diagram of step B1 of the substrate fabrication method provided in this application;

[0048] Figure 3 This is a schematic diagram of step B2 of the substrate fabrication method provided in Embodiment 1 of this application; Figure 3a This is a slanted view of the driving substrate in step B24;

[0049] Figure 4 This is a schematic diagram showing the connection relationship between the first type of bar pattern and the first and second conductive pads provided in Embodiment 1 of this application;

[0050] Figure 5 This is a schematic diagram showing the connection relationship between the second type of bar pattern and the first and second conductive pads provided in Embodiment 1 of this application;

[0051] Figure 6 This is a schematic diagram of step B3 of the substrate fabrication method provided in Embodiment 1 of this application;

[0052] Figure 7 This is a schematic diagram of step B4 of the substrate fabrication method provided in Embodiment 1 of this application;

[0053] Figure 8 This is a slanted structural schematic diagram of step B4 of the substrate fabrication method provided in Embodiment 1 of this application;

[0054] Figure 9This is a schematic diagram of step B5 of the substrate fabrication method provided in Embodiment 1 of this application;

[0055] Figure 9a This is a slanted structural schematic diagram of step B5 of the substrate fabrication method provided in Embodiment 1 of this application;

[0056] Figure 10 This is a schematic diagram of the vapor deposition apparatus provided in this application;

[0057] Figure 10a This is a schematic diagram of the sampling test results provided in this application;

[0058] Figure 11 This is a schematic diagram of step B6 of the substrate fabrication method provided in Embodiment 1 of this application;

[0059] Figure 12 This is a slanted view of step B6 of the substrate fabrication method provided in Embodiment 1 of this application;

[0060] Figure 13 This is a schematic diagram of the substrate fabrication method provided in Embodiment 2 of this application;

[0061] Figure 14 This is a schematic diagram of step B2 of the substrate fabrication method provided in Embodiment 2 of this application; Figure 14a This is a slanted view of the driving substrate in step B23;

[0062] Figure 15 This is a schematic diagram showing the connection relationship between the first type of bar pattern and the first and second conductive pads provided in Embodiment 2 of this application;

[0063] Figure 15a This is a schematic diagram showing the connection relationship between the second type of bar pattern and the first and second conductive pads provided in Embodiment 2 of this application;

[0064] Figure 16 This is a schematic diagram of step B3 of the substrate fabrication method provided in Embodiment 2 of this application;

[0065] Figure 17 This is a schematic diagram of step B4 of the substrate fabrication method provided in Embodiment 2 of this application;

[0066] Figure 18 This is a slanted structural schematic diagram of step B4 of the substrate fabrication method provided in Embodiment 2 of this application;

[0067] Figure 19 This is a schematic diagram of step B5 of the substrate fabrication method provided in Embodiment 2 of this application;

[0068] Figure 20 This is a schematic diagram of step B6 of the substrate fabrication method provided in Embodiment 2 of this application;

[0069] Figure 21 This is a schematic diagram of steps B7, B8, and B9 of the substrate fabrication method provided in Embodiment 2 of this application;

[0070] Figure 22 This is a schematic diagram of the display panel manufacturing method provided in Embodiment 3 of this application.

[0071] Explanation of reference numerals in the attached drawings: substrate 100, photoresist film 10, strip pattern 10a, driving substrate 20, display area AA, border area NA, substrate 21, first conductive pad 22, second conductive pad 23, first surface 21a, second surface 21b, driving substrate module 201, side surface 21c, trench 10b, metal layer 30, wire 30a, photoresist laminate 101, first protective layer 11, second protective layer 12, first insulating film 24, second insulating film 25, first connecting surface 26, second connecting surface 27, vapor deposition equipment 200, rotating disk 200a, rotation axis 200b, first target 210, second target 220, protective layer 40, display panel 300, light-emitting device 301. Detailed Implementation

[0072] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. In addition, it should be understood that the specific embodiments described herein are only for illustration and explanation of this application and are not intended to limit this application. In this application, unless otherwise stated, directional terms such as "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, specifically the drawing directions in the accompanying drawings; while "inner" and "outer" refer to the outline of the device.

[0073] This application provides a display panel, which will be described in detail below. It should be noted that the order of description of the following embodiments is not intended to limit the preferred order of the embodiments.

[0074] Example 1

[0075] Please see Figure 1-12 This application provides a method for preparing a substrate 100.

[0076] Please see Figure 1 The method for preparing substrate 100 includes the following steps:

[0077] Step B1, a photoresist film 10 is provided. The photoresist film 10 is provided with at least one strip pattern 10a.

[0078] Step B2, a driving substrate 20 is provided. The driving substrate 20 includes a display area AA and a border area NA. The driving substrate 20 includes a substrate 21, a first conductive pad 22, and a second conductive pad 23. The substrate 21 includes a first surface 21a and a second surface 21b disposed opposite to the first surface 21a. The first conductive pad 22 is disposed on the first surface 21a and corresponds to the border area NA. The second conductive pad 23 is disposed on the second surface 21b and corresponds to the border area NA.

[0079] Step B3: A photoresist film 10 is aligned and attached to the driving substrate 20 to form a driving substrate module 201. A strip pattern 10a is attached to the side surface 21c of the substrate 21, and one end of the strip pattern 10a is connected to the first conductive pad 22, and the other end of the strip pattern 10a is connected to the second conductive pad 23.

[0080] Step B4: The photoresist film 10 is developed to remove the portion of the photoresist film 10 corresponding to the strip pattern 10a, forming a trench 10b. The trench 10b exposes the substrate 21, the first conductive pad 22, and the second conductive pad 23.

[0081] Step B5: A metal layer 30 is formed on the photoresist film 10 and within the trench 10b. One end of the metal layer 30 is connected to the first conductive pad 22, and the other end of the metal layer 30 is connected to the second conductive pad 23.

[0082] Step B6: Remove the photoresist film 10 to form a wire 30a connected to the first conductive pad 22 and the second conductive pad 23.

[0083] It is understood that the embodiments of this application employ a photoresist film with a striped pattern. The photoresist film is attached to the side of the substrate, with one end of the striped pattern corresponding to a first conductive pad and the other end corresponding to a second conductive pad. Subsequently, the portion of the photoresist film corresponding to the striped pattern is removed to form a trench. The trench exposes the substrate, the first conductive pad, and the second conductive pad. A metal layer is formed within the trench, with one end of the metal layer connected to the first conductive pad and the other end connected to the second conductive pad. Finally, the photoresist film is removed to form a wire connecting the first conductive pad and the second conductive pad. This solution avoids the technical difficulties of three-sided exposure in traditional processes, enabling better realization of connections across the sides of the substrate.

[0084] The steps of the substrate 100 fabrication method are described in detail below:

[0085] Please see Figure 2 In step B1, the step of providing a photoresist film 10 further includes:

[0086] Step B11 involves exposing the photoresist laminate 101 to form a striped pattern 10a. The photoresist laminate 101 includes a first protective layer 11, a photoresist film 10, and a second protective layer 12 stacked together. It is understood that the photoresist film 10 can be a negative photoresist film. When the photoresist film 10 is negative, the exposed area is deep blue, and the color distinction before and after exposure is obvious, improving the contrast between the exposed and unexposed areas and facilitating subsequent lamination processes. It can also be a positive photoresist film. The first protective layer 11 and the second protective layer 12 protect the photoresist film 10 from contamination during the exposure process. The process then proceeds to step B12.

[0087] Step B12: Remove the first protective layer 11 and the second protective layer 12. Then proceed to step B2.

[0088] Please see Figure 3 In step B2, a driving substrate 20 is provided. The driving substrate 20 includes a display area AA and a border area NA. The driving substrate 20 includes a substrate 21, a first conductive pad 22, and a second conductive pad 23. The substrate 21 includes a first surface 21a and a second surface 21b disposed opposite to the first surface 21a. The first conductive pad 22 is disposed on the first surface 21a and corresponds to the border area NA. The step of disposing the second conductive pad 23 on the second surface 21b and corresponding to the border area NA further includes:

[0089] Step B21: Clean the driver substrate 20. Then proceed to step B22.

[0090] Step B22: Dry the drive substrate 20. Then proceed to step B23.

[0091] In step B23, a first insulating film 24 is attached to the first surface 21a, corresponding to the display area AA. A second insulating film 25 is attached to the second surface 21b, also corresponding to the display area AA. It is understood that attaching the first insulating film 24 to the first surface 21a and the second insulating film 25 to the second surface 21b reduces the impact of subsequent processes on the display area AA of the substrate 100. Then, proceed to step B24.

[0092] Please see Figure 3 and Figure 3a In step B24, the driving substrate 20 is ground to form a first connecting surface 26 between the first surface 21a and the side surface 21c, and a second connecting surface 27 between the second surface 21b and the side surface 21c. It is understood that the first connecting surface 26 and the second connecting surface 27 are relatively smooth; they can be either curved surfaces or beveled surfaces. Using the first connecting surface 26 and the second connecting surface 27 as transition surfaces can improve the quality of the metal layer 30 formed in the trench 10b in subsequent processes, making the metal layer 30 less prone to breakage. Then, proceed to step B25.

[0093] Step B25, activate substrate 21. It is understood that activating substrate 21 can improve its activity and reduce bubbles generated during subsequent processes when the photoresist film 10 is aligned and attached to the driving substrate 20. Then proceed to step B3.

[0094] Optionally, in some embodiments of this application, before activating the substrate 21 in step B25, the step of providing a driving substrate 20 in step B2 further includes:

[0095] At least the side surface 21c of the substrate 21 is roughened. It is understood that roughening the side surface 21c of the substrate 21 can improve the adsorption of the side surface 21c of the substrate 21, thereby improving the quality of the metal layer 30 formed in the trench 10b in subsequent processes, and the metal layer 30 is less prone to breakage.

[0096] Optionally, in some embodiments of this application, before activating the substrate 21 in step B25, the step of providing a driving substrate 20 in step B2 further includes:

[0097] The region corresponding to the stripe pattern 10a of the substrate 21 is roughened. It can be understood that roughening the region corresponding to the stripe pattern 10a of the substrate 21 can, on the one hand, improve the adsorption of the region corresponding to the stripe pattern 10a of the substrate 21, thereby improving the quality of the metal layer 30 formed in the trench 10b in the subsequent process, making the metal layer 30 less prone to breakage; on the other hand, it can control the bubbles generated during the subsequent process of aligning and attaching the photoresist film 10 on the driving substrate 20.

[0098] Please see Figures 4-6 In step B3, a driving substrate module 201 is formed by aligning and attaching a photoresist film 10 onto the driving substrate 20. The step of attaching a striped pattern 10a to the side surface 21c of the substrate 21, with one end of the striped pattern 10a correspondingly connected to the first conductive pad 22 and the other end of the striped pattern 10a correspondingly connected to the second conductive pad 23, further includes:

[0099] It is understood that one end of the bar pattern 10a is connected to the first conductive pad 22, and the other end of the bar pattern 10a is connected to the second conductive pad 23; for more information, please refer to [link / reference needed]. Figure 4 One end of the strip pattern 10a covers the first conductive pad 22, and the other end of the strip pattern 10a covers the second conductive pad 23. In this connection method, the requirements for equipment process precision can be reduced. Alternatively, please refer to... Figure 5 One end of the strip pattern 10a is connected to the first conductive pad 22 on the side, and the other end of the strip pattern 10a is connected to the second conductive pad 23 on the side. In this connection method, the thickness requirement of the metal layer 30 deposition can be reduced.

[0100] Please see Figure 6 In step B310, a photoresist film 10 is aligned and attached to the driving substrate 20 to form a driving substrate module 201. Then proceed to step B320.

[0101] Step B320: Bake the driver substrate module 201. It should be noted that the driver substrate module 201 is baked at a set temperature for a set duration. The set temperature is between 104 degrees Celsius and 106 degrees Celsius, for example, 104 degrees Celsius, 105 degrees Celsius, or 106 degrees Celsius. The set duration is between 25 minutes and 35 minutes, for example, 25 minutes, 30 minutes, or 35 minutes. During the baking process, the photoresist film 10 softens and exhibits leveling properties. The photoresist film 10 will automatically level towards air bubbles during this process, reducing the amount of air bubbles generated. It should be noted that the baking process is carried out in a vacuum environment. Then proceed to step B330.

[0102] Step B330: Press the photoresist film 10 to remove air bubbles. It is understood that after baking, the number of air bubbles between the driver substrate 20 and the photoresist film 10 in the driver substrate module 201 is greatly reduced. Further removing air bubbles by pressing the photoresist film 10 yields a driver substrate module 201 with high process standards. It should be noted that the air bubble removal by pressing the photoresist film 10 is performed in a vacuum environment. Then proceed to step B4.

[0103] Optionally, in some embodiments of this application, step B3, which involves aligning and attaching the photoresist film 10 onto the driving substrate 20 to form the driving substrate module 201, further includes:

[0104] Step B311: Photoresist film 10 is aligned and attached to the driving substrate 20 to form driving substrate module 201. Then proceed to step B321.

[0105] Step B321 involves preheating the driving substrate module 201. Preheating the substrate 100 softens the photoresist film 10, preventing damage during subsequent rolling. It should be noted that preheating the driving substrate module 201 does not need to be performed in a vacuum environment, reducing the requirements for the process equipment. The process then proceeds to step B331.

[0106] Step B331: Roll-roll the photoresist film 10 at a set temperature. The set temperature is between 104°C and 106°C, for example, 104°C, 105°C, or 106°C. The set time is between 25 minutes and 35 minutes, for example, 25 minutes, 30 minutes, or 35 minutes. It is understood that at the set temperature, the photoresist film 10 will further soften, improving its leveling properties. After removing air bubbles through rolling, the driving substrate module 201 that meets the process requirements can be obtained. It should be noted that rolling the photoresist film 10 at the set temperature does not need to be performed in a vacuum environment, reducing the requirements for process equipment. Then proceed to step B4.

[0107] Please see Figure 7 and Figure 8 In step B4, the photoresist film 10 is developed to remove the portion of the photoresist film 10 corresponding to the stripe pattern 10a, forming a trench 10b. The trench 10b exposes the substrate 21, the first conductive pad 22, and the second conductive pad 23. It is understood that the photoresist film 10 is developed using a developing solution to remove the portion of the photoresist film 10 corresponding to the stripe pattern 10a to form the trench 10b. Then, the process proceeds to step B5.

[0108] Please see Figure 9 and Figure 9a In step B5, a metal layer 30 is formed on the photoresist film 10 and within the trench 10b. The step of connecting one end of the metal layer 30 to the first conductive pad 22 and the other end of the metal layer 30 to the second conductive pad 23 includes:

[0109] Please see Figure 9 , Figure 9a , Figure 10 and Figure 10a Step B51: A metal layer 30 is formed within the trench 10b of the photoresist film 10; a vapor deposition apparatus 200 is provided. The vapor deposition apparatus 200 includes a rotating disk 200a and a rotation axis 200b. The rotation axis 200b is disposed on the rotating disk 200a. Then proceed to step B52.

[0110] Step B52: A first target 210 is placed at one end of the rotating disk 200a, and a second target 220 is placed at the other end of the rotating disk 200a. Then proceed to step B53.

[0111] Step B53: Install the drive substrate module 201 on the rotation axis 200b. Then proceed to step B54.

[0112] In step B54, the revolution disk 200a and the rotation shaft 200b are rotated, causing the drive substrate module 201 to rotate. It is understood that the drive substrate 20 rotates and revolves during this process, and the first target 210 is positioned at one end of the revolution disk 200a, while the second target 220 is positioned at the other end, which allows for more uniform deposition of the target material. Then, proceed to step B55.

[0113] In step B55, the first target 210 and the second target 220 are bombarded, causing the materials of the first target 210 and the second target 220 to be deposited on the driving substrate module 201 to form a metal layer 30. The metal layer 30 covers the photoresist film 10 and the trench 10b. After step B5 is completed, the substrate 100 is subjected to area sampling inspection, and the inspection results are as follows. Figure 10a As shown in the figure, it is clear that there is no obvious peeling of the membrane layer, the membrane layer is continuous, the membrane texture is slightly rough, and the structure is qualified for testing. Then proceed to step B6.

[0114] Please refer to the following: Figure 11 and Figure 12 In step B6, the photoresist film 10 is removed to form a wire 30a connected to the first conductive pad 22 and the second conductive pad 23.

[0115] In this embodiment, the following steps are included before removing the photoresist film 10 in step B6:

[0116] The first barrier film 24 and the second barrier film 25 are peeled off. Simultaneously, target particles are blown away using an air knife. It is understood that peeling off the first barrier film 24 and the second barrier film 25 removes the target material deposited on them, and the air knife removes target particles generated during the peeling process, reducing the impact of target particles on the quality of the substrate 100.

[0117] Thus, substrate 100 is prepared.

[0118] Example 2

[0119] Please see Figure 2 , Figure 10 , Figure 10a , Figures 13 to 21 The difference between this embodiment and Embodiment 1 is that this embodiment does not include the first insulating film 24 and the second insulating film 25; and it includes the following additional steps compared to Embodiment 1: Step B7, setting a protective layer 40; the protective layer 40 covers the first conductive pad 22, the second conductive pad 23, and the wire 30a. Step B8, removing the target material on the driving substrate 20. Step B9, removing the protective layer 40. This application embodiment provides a method for preparing a substrate 100.

[0120] Please see Figure 13 The method for preparing substrate 100 includes the following steps:

[0121] Step B1, a photoresist film 10 is provided. The photoresist film 10 is provided with at least one strip pattern 10a.

[0122] Step B2, a driving substrate 20 is provided. The driving substrate 20 includes a display area AA and a border area NA. The driving substrate 20 includes a substrate 21, a first conductive pad 22, and a second conductive pad 23. The substrate 21 includes a first surface 21a and a second surface 21b disposed opposite to the first surface 21a. The first conductive pad 22 is disposed on the first surface 21a and corresponds to the border area NA. The second conductive pad 23 is disposed on the second surface 21b and corresponds to the border area NA.

[0123] Step B3: A photoresist film 10 is aligned and attached to the driving substrate 20 to form a driving substrate module 201. A strip pattern 10a is attached to the side surface 21c of the substrate 21, and one end of the strip pattern 10a is connected to the first conductive pad 22, and the other end of the strip pattern 10a is connected to the second conductive pad 23.

[0124] Step B4: The photoresist film 10 is developed to remove the portion of the photoresist film 10 corresponding to the strip pattern 10a, forming a trench 10b. The trench 10b exposes the substrate 21, the first conductive pad 22, and the second conductive pad 23.

[0125] Step B5: A metal layer 30 is formed on the photoresist film 10 and within the trench 10b. One end of the metal layer 30 is connected to the first conductive pad 22, and the other end of the metal layer 30 is connected to the second conductive pad 23.

[0126] Step B6: Remove the photoresist film 10 to form a wire 30a connected to the first conductive pad 22 and the second conductive pad 23.

[0127] This application embodiment employs a photoresist film with a striped pattern. The photoresist film is attached to the side of a substrate, with one end of the striped pattern connected to a first conductive pad and the other end connected to a second conductive pad. Subsequently, the portion of the photoresist film corresponding to the striped pattern is removed to form a trench. The trench exposes the substrate, the first conductive pad, and the second conductive pad. A metal layer is formed within the trench, with one end of the metal layer connected to the first conductive pad and the other end connected to the second conductive pad. Finally, the photoresist film is removed to form a wire connecting the first conductive pad and the second conductive pad. This solution avoids the technical difficulties of three-sided exposure in traditional processes, enabling better implementation of connections across the sides of the substrate.

[0128] The steps of the substrate 100 fabrication method are described in detail below:

[0129] Please see Figure 2 In step B1, the step of providing a photoresist film 10 further includes:

[0130] Step B11 involves exposing the photoresist laminate 101 to form a striped pattern 10a. The photoresist laminate 101 includes a first protective layer 11, a photoresist film 10, and a second protective layer 12 stacked together. It is understood that the photoresist film 10 can be a negative photoresist film. When the photoresist film 10 is negative, the exposed area is deep blue, and the color distinction before and after exposure is obvious, improving the contrast between the exposed and unexposed areas and facilitating subsequent lamination processes. It can also be a positive photoresist film. The first protective layer 11 and the second protective layer 12 protect the photoresist film 10 from contamination during the exposure process. The process then proceeds to step B12.

[0131] Step B12: Remove the first protective layer 11 and the second protective layer 12. Then proceed to step B2.

[0132] Please see Figure 14 In step B2, a driving substrate 20 is provided. The driving substrate 20 includes a display area AA and a border area NA. The driving substrate 20 includes a substrate 21, a first conductive pad 22, and a second conductive pad 23. The substrate 21 includes a first surface 21a and a second surface 21b disposed opposite to the first surface 21a. The first conductive pad 22 is disposed on the first surface 21a and corresponds to the border area NA. The step of disposing the second conductive pad 23 on the second surface 21b and corresponding to the border area NA further includes:

[0133] Step B21: Clean the driver substrate 20. Then proceed to step B22.

[0134] Step B22: Dry the drive substrate 20. Then proceed to step B23.

[0135] The difference here from Embodiment 1 is that the process of attaching the first barrier film 24 and the second barrier film 25 is not included.

[0136] Please see Figure 14a Step B23 involves grinding the edges of the driving substrate 20 to form a first connecting surface 26 between the first surface 21a and the side surface 21c, and a second connecting surface 27 between the second surface 21b and the side surface 21c. It is understood that the first connecting surface 26 and the second connecting surface 27 are relatively smooth. The first connecting surface 26 and the second connecting surface 27 can be either curved or beveled. Using the first connecting surface 26 and the second connecting surface 27 as transition surfaces can improve the quality of the metal layer 30 formed in the trench 10b in subsequent processes, making the metal layer 30 less prone to breakage. Then, proceed to step B24.

[0137] Step B24, activate substrate 21. It is understood that activating substrate 21 can improve its activity and reduce bubbles generated during subsequent processes when the photoresist film 10 is aligned and attached to the driving substrate 20. Then proceed to step B3.

[0138] Optionally, in some embodiments of this application, before activating the substrate 21 in step B24, the step of providing a driving substrate 20 in step B2 further includes:

[0139] At least the side surface 21c of the substrate 21 is roughened. It is understood that roughening the side surface 21c of the substrate 21 can improve the adsorption of the side surface 21c of the substrate 21, thereby improving the quality of the metal layer 30 formed in the trench 10b in subsequent processes, and making the metal layer 30 less prone to breakage.

[0140] Optionally, in some embodiments of this application, before activating the substrate 21 in step B24, the step of providing a driving substrate 20 in step B2 further includes:

[0141] The region corresponding to the stripe pattern 10a of the substrate 21 is roughened. It can be understood that roughening the region corresponding to the stripe pattern 10a of the substrate 21 can, on the one hand, improve the adsorption of the region corresponding to the stripe pattern 10a of the substrate 21, thereby improving the quality of the metal layer 30 formed in the trench 10b in the subsequent process, making the metal layer 30 less prone to breakage; on the other hand, it can control the bubbles generated during the subsequent process of aligning and attaching the photoresist film 10 on the driving substrate 20.

[0142] In step B3, a driving substrate module 201 is formed by aligning and attaching a photoresist film 10 onto the driving substrate 20. The step of attaching a striped pattern 10a to the side surface 21c of the substrate 21, with one end of the striped pattern 10a correspondingly connected to the first conductive pad 22 and the other end of the striped pattern 10a correspondingly connected to the second conductive pad 23, further includes:

[0143] Please see Figure 15 and Figure 15a It is understood that one end of the bar pattern 10a is connected to the first conductive pad 22, and the other end of the bar pattern 10a is connected to the second conductive pad 23; for more information, please refer to [link / reference needed]. Figure 15 One end of the bar pattern 10a covers the first conductive pad 22, and the other end of the bar pattern 10a covers the second conductive pad 23. This connection method reduces the requirements for equipment process precision. Please refer to [link / reference]. Figure 16 Alternatively, a first conductive pad 22 can be connected to one side of the strip pattern 10a, and a second conductive pad 23 can be connected to the other side of the strip pattern 10a. In this connection method, the thickness requirement of the metal layer 30 deposition can be reduced.

[0144] Please see Figure 16 In step B310, a photoresist film 10 is aligned and attached to the driving substrate 20 to form a driving substrate module 201. Then proceed to step B320.

[0145] Step B320: Bake the driver substrate module 201. It should be noted that the driver substrate module 201 is baked at a set temperature for a set duration. The set temperature is between 104 degrees Celsius and 106 degrees Celsius, for example, 104 degrees Celsius, 105 degrees Celsius, or 106 degrees Celsius. The set duration is between 25 minutes and 35 minutes, for example, 25 minutes, 30 minutes, or 35 minutes. During the baking process, the photoresist film 10 softens and exhibits leveling properties. The photoresist film 10 will automatically level towards air bubbles during this process, reducing the amount of air bubbles generated. It should be noted that the baking process is carried out in a vacuum environment. Then proceed to step B330.

[0146] Step B330: Press the photoresist film 10 to remove air bubbles. It is understood that after baking, the number of air bubbles between the driver substrate 20 and the photoresist film 10 in the driver substrate module 201 is greatly reduced. Further removing air bubbles by pressing the photoresist film 10 yields a driver substrate module 201 with high process standards. It should be noted that the air bubble removal by pressing the photoresist film 10 is performed in a vacuum environment. Then proceed to step B4.

[0147] Optionally, in some embodiments of this application, step B3, which involves aligning and attaching the photoresist film 10 onto the driving substrate 20 to form the driving substrate module 201, further includes:

[0148] Step B311: Photoresist film 10 is aligned and attached to the driving substrate 20 to form driving substrate module 201. Then proceed to step B321.

[0149] Step B321 involves preheating the driving substrate module 201. Preheating the substrate 100 softens the photoresist film 10, preventing damage during subsequent rolling. It should be noted that preheating the driving substrate module 201 does not need to be performed in a vacuum environment, reducing the requirements for the process equipment. The process then proceeds to step B331.

[0150] Step B331: Roll-roll the photoresist film 10 at a set temperature. The set temperature is between 104°C and 106°C, for example, 104°C, 105°C, or 106°C. The set time is between 25 minutes and 35 minutes, for example, 25 minutes, 30 minutes, or 35 minutes. It is understood that at the set temperature, the photoresist film 10 will further soften, improving its leveling properties. After removing air bubbles through rolling, the driving substrate module 201 that meets the process requirements can be obtained. It should be noted that rolling the photoresist film 10 at the set temperature does not need to be performed in a vacuum environment, reducing the requirements for process equipment. Then proceed to step B4.

[0151] Please see Figure 17 and Figure 18In step B4, the photoresist film 10 is developed to remove the portion of the photoresist film 10 corresponding to the stripe pattern 10a, forming a trench 10b. The trench 10b exposes the substrate 21, the first conductive pad 22, and the second conductive pad 23. It is understood that the photoresist film 10 is developed using a developing solution to remove the portion of the photoresist film 10 corresponding to the stripe pattern to form the trench 10b. Then, the process proceeds to step B5.

[0152] Please see Figure 10 , Figure 10a and Figure 19 In step B5, a metal layer 30 is formed on the photoresist film 10 and within the trench 10b. The step of connecting one end of the metal layer 30 to the first conductive pad 22 and the other end of the metal layer 30 to the second conductive pad 23 includes:

[0153] Please see Figure 10 In step B51, a metal layer 30 is formed within the trench 10b of the photoresist film 10, providing a vapor deposition apparatus 200. The vapor deposition apparatus 200 includes a rotating disk 200a and a rotation axis 200b. The rotation axis 200b is disposed on the rotating disk 200a. Then proceed to step B52.

[0154] Step B52: A first target 210 is placed at one end of the rotating disk 200a, and a second target 220 is placed at the other end of the rotating disk 200a. Then proceed to step B53.

[0155] Step B53: Install the drive substrate module 201 on the rotation axis 200b. Then proceed to step B54.

[0156] In step B54, the revolution disk 200a and the rotation shaft 200b are rotated, causing the drive substrate module 201 to rotate. It is understood that the drive substrate 20 rotates and revolves during this process, and the first target 210 is positioned at one end of the revolution disk 200a, while the second target 220 is positioned at the other end, which allows for more uniform deposition of the target material. Then, proceed to step B55.

[0157] In step B55, the first target 210 and the second target 220 are bombarded, causing the materials of the first target 210 and the second target 220 to be deposited on the driving substrate module 201 to form a metal layer 30. The metal layer 30 covers the photoresist film 10 and the trench 10b. After step B5 is completed, the substrate 100 is subjected to area sampling inspection, and the inspection results are as follows. Figure 10a As shown in the figure, it is clear that there is no obvious peeling of the membrane layer, the membrane layer is continuous, the membrane texture is slightly rough, and the structure is qualified for testing. Then proceed to step B6.

[0158] Please see Figure 20In step B6, the photoresist film 10 is removed to form a wire 30a connected to the first conductive pad 22 and the second conductive pad 23.

[0159] Optionally, the steps of the method for preparing substrate 100 may further include:

[0160] Please see Figure 21 Step B7: Set a protective layer 40; the protective layer 40 covers the first conductive pad 22, the second conductive pad 23 and the wire 30a.

[0161] Step B8: Remove the target material on the driving substrate 20.

[0162] Step B9, remove the protective layer 40.

[0163] Thus, substrate 100 is prepared.

[0164] Example 3

[0165] This application embodiment also provides a method for manufacturing a display panel 300, including:

[0166] Provide at least one substrate 100 as described in Embodiment 1 or Embodiment 2;

[0167] Please see Figure 22 A light-emitting device 301 is disposed on the substrate 100.

[0168] It is understandable that the light-emitting device 301 can be a sub-millimeter light-emitting diode or a miniature light-emitting diode.

[0169] The display panel 300 is now complete.

[0170] The preparation methods of the substrate and display panel provided in the embodiments of this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the methods and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A method of producing a substrate, characterized by, The method comprises the following steps: providing a photoresist film; the photoresist film is provided with at least one strip-shaped pattern, and the strip-shaped pattern is obtained by exposure treatment; providing a driving substrate; the driving substrate comprises a display area and a frame area; the driving substrate comprises a substrate, a first conductive pad and a second conductive pad; the substrate comprises a first surface and a second surface arranged opposite to the first surface; the first conductive pad is arranged on the first surface and corresponds to the frame area; the second conductive pad is arranged on the second surface and corresponds to the frame area; attaching the photoresist film on the driving substrate in alignment to form a driving substrate module; the strip-shaped pattern is attached to the side surface of the substrate, and one end of the strip-shaped pattern corresponds to the first conductive pad, and the other end of the strip-shaped pattern corresponds to the second conductive pad; developing the photoresist film to remove the part of the photoresist film corresponding to the strip-shaped pattern to form a groove; the groove exposes the substrate, the first conductive pad and the second conductive pad; forming a metal layer on the photoresist film and in the groove; one end of the metal layer is connected to the first conductive pad, and the other end of the metal layer is connected to the second conductive pad; removing the photoresist film to form a conductive wire connected to the first conductive pad and the second conductive pad.

2. The method of claim 1, wherein The step of providing a photoresist film further comprises: exposing the photoresist film to form the strip-shaped pattern; the photoresist film comprises a first protective layer, the photoresist film and a second protective layer arranged in layers; removing the first protective layer and the second protective layer.

3. The method of claim 1, wherein the substrate is a glass substrate. The step of providing a driving substrate further comprises: cleaning the driving substrate; drying the driving substrate; edge grinding the driving substrate to form a first connecting surface between the first surface and the side surface, and a second connecting surface between the second surface and the side surface; activating the substrate.

4. The method of claim 3, wherein the substrate is a glass substrate. Before activating the substrate, the step of providing a driving substrate further comprises: roughening at least the side surface of the substrate.

5. The method of claim 1, wherein the substrate is a glass substrate. The step of attaching the photoresist film on the driving substrate in alignment to form a driving substrate module further comprises: attaching the photoresist film on the driving substrate in alignment to form a driving substrate module; baking the driving substrate module; pressing the photoresist film to remove bubbles.

6. The method of claim 1, wherein the substrate is a glass substrate. The step of attaching the photoresist film on the driving substrate in alignment to form a driving substrate module further comprises: attaching the photoresist film on the driving substrate in alignment to form a driving substrate module; preheating the driving substrate module; rolling the photoresist film at a set temperature; the set temperature is between 104 degrees Celsius and 106 degrees Celsius.

7. The method of claim 1, wherein the substrate is a glass substrate. The step of forming a metal layer in the groove of the photoresist film comprises: providing a vapor deposition device; the vapor deposition device comprises a revolution disc and a rotation shaft; the rotation shaft is arranged on the revolution disc; arranging a first target material at one end of the revolution disc and a second target material at the other end of the revolution disc; arranging the driving substrate module on the rotation shaft; rotating the revolution disc and the rotation shaft to drive the driving substrate module to rotate; Bombarding the first target and the second target, so that materials of the first target and the second target are deposited on the driving substrate module to form a metal layer; the metal layer covers the photoresist film and the groove.

8. The method of claim 3, wherein the substrate is prepared by a method comprising: Before the edge grinding process is performed on the driving substrate, the step of providing a driving substrate further comprises the following steps: A first isolation film is attached to the first surface and corresponds to the display area; and a second isolation film is attached to the second surface and corresponds to the display area.

9. The method of claim 8, wherein the substrate is a glass substrate. Before the photoresist film is removed, the following step is further included: The first isolation film and the second isolation film are peeled off; and at the same time, the target particles are blown away by an air knife.

10. A method for manufacturing a display panel, characterized by, The application further provides a display device comprising: A substrate as claimed in any of claims 1 to 9 is provided; A light emitting device is arranged on the substrate.

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