An appearance inspection system for chip electronic components

Abstract

The present invention discloses an appearance inspection system for patch electronic components, comprising: a machine platform; a bulk material tray; a transmission assembly for receiving workpieces on the bulk material tray; the transmission assembly comprises a motor fixing seat with a built-in motor, an offset seat hinged on the motor, and a transmission tray connected to the top of the offset seat, the offset seat comprises a plurality of telescopic rods connected to the transmission tray, and a driving member corresponding to the number of telescopic rods and driving the telescopic rods to move up and down; a forward detection assembly and a plurality of oblique detection assemblies are sequentially arranged along the rotation direction of the transmission assembly; a material dividing assembly is arranged on one side of the bulk material tray and has an opening facing the transmission assembly, which can first detect the five forward surfaces of the patch assembly through the forward detection assembly, and then tilt the transmission tray by orderly extending and retracting the telescopic rods to change the inclination of the patch electronic components on the transmission tray, and then photograph different diagonals and oblique surfaces of the patch electronic components for backup inspection through the oblique detection assembly.

Description

Technical Field

[0001] The invention relates to a chip electronic component detection structure, in particular to an appearance detection system for chip electronic components. Background Art

[0002] On circuit boards or main boards, you can often see a dense array of various chip electronic components. Chip components are divided into passive components and active components. Common passive components include rectangular chips, cylindrical chips, and triangular chips. Today's chip electronic components include chip resistors, chip resistors, quartz crystals, etc. The most common one is the chip resistor, which has a rectangular appearance and welding ends at both ends. The chip resistor has high precision requirements, accurate to 0.01 mm, and chip resistors of different specifications have different sizes.

[0003] After the chip resistors are manufactured, they need to undergo various tests. The most basic test is the appearance test. By verifying the integrity of the appearance of each surface, it is determined whether the appearance and specifications of the entire chip resistor meet the requirements. The existing testing method only tests the chip electronic components in the forward direction, while ignoring their oblique and diagonal positions. After testing, defects often appear in easily overlooked positions, which in turn causes defective products to be mixed into the finished product, affecting the quality of the entire batch of structures. Summary of the Invention

[0004] The present invention provides an appearance inspection system for chip electronic components, which can effectively solve the above problems.

[0005] The present invention is achieved in that:

[0006] An appearance inspection system for chip electronic components, comprising:

[0007] Machine;

[0008] A bulk material tray is provided on the machine table;

[0009] a transmission assembly for receiving workpieces in bulk trays;

[0010] The transmission assembly includes a motor fixing seat with a built-in motor, an offset seat hinged on the motor, a transmission plate connected to the top of the offset seat, the offset seat includes a plurality of telescopic rods connected to the transmission plate, and a driving member corresponding to the number of the telescopic rods and driving the telescopic rods to move up and down;

[0011] A forward detection component and a plurality of oblique detection components are sequentially arranged along the rotation direction of the transmission component;

[0012] A material distribution component is arranged on one side of the bulk material tray and has an opening facing the transmission component.

[0013] As a further improvement, the top of the telescopic rod is a hinge ball, and the bottom of the transmission disk is provided with a plurality of spherical grooves for accommodating the hinge balls.

[0014] As a further improvement, the forward detection component includes a first mounting bracket arranged on the outside of the transmission component, a first sliding guide rail clamped at the bottom of the first mounting bracket, a first movable structure that drives the first sliding guide rail, a first height adjustment structure fixed at the bottom of the first sliding guide rail, a forward shooting structure installed in the middle section of the first mounting bracket and above the transmission component, and a top shooting structure arranged above the forward shooting structure and connected to the first mounting bracket, wherein the top shooting structure includes a top camera and a fill light.

[0015] As a further improvement, a first guide groove is provided on the inner side of the first mounting frame, and the forward shooting structure includes an annular base, a through hole provided on the inner side of the annular base, a side camera arranged on the inner side of the annular base and facing the through hole, and a first transposition seat slidably connected to the first guide groove.

[0016] As a further improvement, the oblique detection component includes a second mounting bracket arranged on the outside of the transmission component, a second sliding guide rail clamped at the bottom of the second mounting bracket, a second movable structure that drives the second sliding guide rail, a second height adjustment structure fixed at the bottom of the second sliding guide rail, a first closed structure installed in the middle section of the second mounting bracket, a second closed structure facing the first closed structure, and a rotating shooting structure facing the opening of the first closed structure.

[0017] As a further improvement, a second guide groove is provided on the inner side of the second mounting frame, the first closed structure is identical to the second closed structure, the second closed structure includes an arched cover, a detection groove provided on the inner side of the arched cover, a lamp bead arranged on the inner side of the detection groove, and a second transposition seat slidably connected to the second guide groove.

[0018] As a further improvement, the rotating shooting structure includes a mounting arm arranged on the second mounting frame, a steering motor fixed at the bottom of the mounting arm, and an oblique camera locked on the steering motor and pointing to the detection slot.

[0019] As a further improvement, the material separation component includes a plurality of waste bins and a plurality of finished product bins, and both the waste bins and the finished product bins are provided with extraction structures, and a partition structure is provided at the feed port of the waste bin and the finished product bin.

[0020] As a further improvement, the partition structure includes a positioning seat, a partition baffle that slides up and down along the positioning seat, and a guide column connected to the partition baffle.

[0021] As a further improvement, the interior of the machine is further provided with an electrostatic supporting structure that is movably fitted with the transmission component, and an electrostatic relief structure is fixedly connected to one side of the separation structure.

[0022] The beneficial effects of the present invention are:

[0023] The present invention is equipped with a transmission component, a forward detection component and several oblique detection components. First, the five forward surfaces of the patch component can be detected by the forward detection component, and then the transmission disk can be tilted by orderly extending and retracting the telescopic rod to change the inclination of the patch electronic components on the transmission disk. Then, the oblique detection component can be used to photograph different diagonals and oblique surfaces of the patch electronic components for backup detection, thereby performing all-round detection on the patch electronic components and improving the comprehensiveness of the detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0025] Figure 1 The figure is a schematic diagram of the external structure of a system for inspecting the appearance of patch electronic components provided by an embodiment of the present invention.

[0026] Figure 2 The figure is a schematic diagram of the internal structure of a system for inspecting the appearance of surface mount electronic components provided by an embodiment of the present invention.

[0027] Figure 3 The present invention provides a schematic structural diagram of an appearance inspection system for chip electronic components with the body removed.

[0028] Figure 4 It is a schematic diagram of the three-dimensional structure of a transmission component provided by an embodiment of the present invention.

[0029] Figure 5 It is a front view structural schematic diagram of a transmission component provided by an embodiment of the present invention.

[0030] Figure 6 It is a structural schematic diagram of a material dividing component from a first perspective provided by an embodiment of the present invention.

[0031] Figure 7 It is a structural schematic diagram of a material dividing component from a second perspective provided by an embodiment of the present invention.

[0032] Figure 8 It is a structural diagram of a forward detection component provided by an embodiment of the present invention.

[0033] Figure 9 It is a structural schematic diagram of an oblique detection component provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0034] All embodiments of the present invention are within the scope of protection of the present invention. Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0035] In the description of the present invention, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as referring to the purpose, technical solutions and advantages of the methods. To be clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work indicate or imply relative importance or implicitly indicate the number of indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0036] Reference Figure 1-9 As shown, a visual inspection system for chip electronic components includes: a machine 1; a bulk material tray 2 arranged on the machine 1; a transmission component 3 for receiving workpieces from the bulk material tray 2; the transmission component 3 includes a motor fixing seat 31 with a built-in motor (not shown in the figure), an offset seat 32 hinged on the motor, and a transmission disk 33 connected to the top of the offset seat 32, the offset seat 32 includes a plurality of telescopic rods 321 connected to the transmission disk 33, and a driving member 322 corresponding to the number of the telescopic rods 321 and driving the telescopic rods 321 to move up and down; a forward detection component 4 and a plurality of oblique detection components 5 are sequentially arranged along the rotation direction of the transmission component 3; a material dividing component 6 is arranged on one side of the bulk material tray 2 and has an opening facing the transmission component 3.

[0037] In some existing appearance inspection structures, multiple cameras set at different angles are used to shoot different sides of the chip electronic components, but they all adopt the orthographic projection shooting method to obtain the front views of different planes. However, in fact, when this shooting method is used, when small bulges or small depressions appear on the chip electronic components, they are difficult to reflect in the orthographic projection view, and they are also in a flat state, making it difficult to distinguish them from the picture.

[0038] In the present invention, a forward detection component 4 is first set along the rotation direction of the transmission component 3, and information is first captured in different forward directions of the patch electronic components. On this basis, the driving member 322 drives the telescopic rod 321 to rise, so that the horizontality of the patch electronic components rotating along the transmission component 3 changes, that is, it gradually changes from the original horizontal state to an inclined state with different inclinations, and obtains perspective pictures of the patch electronic components at different inclinations, so that defects that were originally unable to be obtained from the front can be obtained from the inclined surface. Through verification at different angles, defects on the side edges and corners of the patch electronic components, as well as bulges and small depressions on the front can be correctly reflected, so that possible defect points that could not be accurately judged from the front can be verified in other directions.

[0039] The machine 1 includes a control chip and a storage control structure such as a database. The database stores images of normal SMD electronic components from different perspectives, including forward and oblique images. These images can be compared with the captured images in real time to determine whether the SMD electronic components being tested meet the requirements in the shortest possible time. The detection method of comparing the database with the real-time captured images is a conventional technology and will not be elaborated on here.

[0040] It should be emphasized that the starting frequency of the driving member 322 is finely controlled, so the extension frequency and distance of the telescopic rod 321 are also fixed. The transmission disk 33 connected to the telescopic rod 321 will be circular with the output shaft of the motor. When passing through the detection area of ​​the forward detection component 4, it will be tilted at different angles. Specifically, the area of ​​the bulk material plate 2, the forward detection component 4, and the material distribution component 6 is horizontal, and the area between the forward detection component 4 and the material distribution component 6 is covered by the oblique detection component 5. In this area, the extension distance of the telescopic rod 321 will change periodically and evenly. Figure 3 It can be seen that the setting angles of the oblique detection components 5 are different, and different conditions of the surface-mount electronic components can be obtained from different oblique angles and different directions, and the coverage range is more comprehensive.

[0041] In addition, due to the stable output of the driver 322, the inclination of the chip electronic components also changes steadily. Therefore, before the detection begins, the system can be run once with a normal chip resistor, and the picture of the normal chip resistor can be recorded and used as a database. In the subsequent comparison process, it can correspond one-to-one with the angle, direction, and inclination of the real-time picture, with a very high matching degree, making it easier to find defective points.

[0042] During the operation of this system, a large number of patch electronic components are poured into the bulk tray 2, wherein the bulk tray 2 is a vibrating bulk tray, which can continuously transmit individual patch electronic components to the transmission tray 33. The patch components transmitted to the transmission tray 33 first pass through the forward detection component 4 to obtain information in the forward projection direction, and then the transmission tray 33 is tilted under the manipulation of the driving member 322 and the telescopic rod 321, driving the patch components thereon to tilt, and the tilted patch components pass through several forward detection structures 5 to obtain information in different projection directions, and then enter the material distribution component 6 according to whether they meet the quality requirements.

[0043] In the present case, since the chip electronic components need to undergo tilted photography inspection by the transmission component 3, in order to prevent their position from changing and being unable to correspond to the shooting structure or slipping off the entire transmission component 3, the interior of the machine 1 is also provided with an electrostatic support structure 7 that is movably fitted with the transmission component 3. An electrostatic release structure 8 is fixedly connected to one side of the separation structure 64. When the chip electronic components are input from the bulk tray 2, the electrostatic support structure 7 is used to apply static electricity to the entire transmission component 3, so that the chip electronic components are firmly adsorbed on it. After completing the forward and oblique inspections, it is necessary to enter the material separation component 6, and then the static electricity is released by the electrostatic release structure 8. Through one support and one release, the accurate positioning and inspection of the chip electronic components are achieved.

[0044] During the cooperation between the telescopic rod 321 and the transmission disk 33, since the transmission disk 33 is a rigid structure, in order to prevent the telescopic rod 321 from directly hitting the transmission disk 33, during the cooperation between the two, the top of the telescopic rod 321 is a hinge ball, and the bottom of the transmission disk 33 is provided with a plurality of spherical grooves for accommodating the hinge balls, so that the telescopic rod 321 can lift the transmission disk 33 while allowing the two to maintain a relatively flexible movement state, thereby avoiding damage to the telescopic rod 321 or the transmission disk 33 during multiple, continuous movements of the telescopic rod 321.

[0045] In the existing structure, if it is necessary to shoot in five directions, for example, five cameras need to be set up to shoot one by one for detection and comparison. However, in this case, the forward detection component 4 includes a first mounting frame 41 arranged on the outside of the transmission component 3, a first sliding guide rail 42 clamped at the bottom of the first mounting frame 41, a first moving structure 43 that drives the first sliding guide rail 42, a first height adjustment structure 44 fixed at the bottom of the first sliding guide rail 42, a forward shooting structure 45 installed in the middle section of the first mounting frame 41 and above the transmission component 3, and a top shooting structure 46 arranged above the forward shooting structure 45 and connected to the first mounting frame 41. The top shooting structure 46 includes a top camera (not shown in the figure) and a fill light (not shown in the figure).

[0046] Since most chip resistors are rectangular chips, they have four side surfaces and two upper and lower surfaces. On the side surfaces of the chip resistor, the height of the first mounting frame 41 is first adjusted by the first height adjustment structure 44, so that the forward shooting structure 45 can completely cover the chip resistor in the vertical direction. In the horizontal direction, the first mounting frame 41 can be driven to slide on the first sliding guide rail 42 by the first moving structure 43, changing the horizontal position so that the forward shooting structure 45 is aligned with the chip resistor. After completing the above-mentioned movement, a first guide groove 411 is provided on the inner side of the first mounting frame 41, and the forward shooting structure 45 includes an annular base 451, which is provided on the The through hole 452 on the inner side of the annular base 451, the lateral camera arranged on the inner side of the annular base 451 and facing the through hole 452, and the first transposition seat 453 slidingly connected to the first guide groove 411. Specifically, the annular base 451 covers the chip resistor, and the four lateral cameras are aimed at the chip resistor in the through hole 452 to obtain its appearance in four directions. At the same time, the first transposition seat 453 slides down along the first guide groove 411, allowing the top shooting structure 46 to descend and block the through hole 452. The top camera and the fill light point to the top of the chip resistor to obtain the appearance of its top. At the same time, the fill light can provide fill light in the process of obtaining the appearance of the entire chip resistor.

[0047] After obtaining the appearance information of the five sides and the top, it is necessary to obtain the information of the chip resistor at different oblique directions. In this embodiment, the number of oblique detection components 5 is four, that is, the situation on the four oblique surfaces of the chip resistor can be obtained for comparison. In other embodiments, other numbers of oblique detection components 5 can also be used. The specific structure and principle of the oblique detection component 5 are as follows:

[0048] The oblique detection assembly 5 includes a second mounting frame 51 arranged on the outside of the transmission assembly 3, a second sliding guide rail 52 clamped at the bottom of the second mounting frame 51, a second movable structure 53 that drives the second sliding guide rail 52, a second height adjustment structure 54 fixed at the bottom of the second sliding guide rail 52, a first closed structure 55 installed in the middle section of the second mounting frame 51, a second closed structure 56 facing the first closed structure 55, and a rotating shooting structure 57 opening toward the first closed structure 55. After the forward detection is completed, the chip resistor moves along the transmission disk 33 to between the first closed structure 55 and the second closed structure 56. Similar to the forward structure, the entire second mounting frame 51 is driven to move in the vertical direction by a similar second height adjustment structure 54, while in the horizontal direction, the second mounting frame 51 is driven to slide on the second sliding guide rail 52 by the second movable structure 53, so that the first closed structure 55 and the second closed structure 56 are symmetrically arranged across the transmission disk 33, confining the chip resistor to a small area to prevent other external light or debris from interfering with the entire appearance detection.

[0049] During the oblique detection process, the chip resistor is not facing the rotating shooting structure 57, but one of its edges is facing the rotating shooting structure 57. The rotating shooting structure 57 can simultaneously obtain information on both sides of the chip resistor, and further confirm the small defects that may appear on its edges and in the positive direction. Specifically, a second guide groove 511 is provided on the inner side of the second mounting frame 51. The first closing structure 55 and the second closing structure 56 have the same structure. The second closing structure 56 includes an arched cover 561. The detection groove 56 is provided on the inner side of the arched cover 561. 2. The lamp bead 563 is arranged on the inner side of the detection groove 562, and the second transposition seat 564 is slidably connected to the second guide groove 511. The position change of the second transposition seat 564 in the second guide groove 511 allows the rotating shooting structure 57 to approach the detection groove 562. Among them, the setting of the arch cover 561 prevents the fill light of the lamp bead 563 from leaking out, making the photo clearer. Since the first closed structure 55 and the second closed structure 56 have the same structure, the structure of the first closed structure 55 cooperating with the chip electronic components and the transmission disk 33 is the same as the first closed structure 55.

[0050] In order to simultaneously obtain images at different positions on two side surfaces, the rotating shooting structure 57 includes a mounting arm 571 arranged on the second mounting frame 51, a steering motor 572 fixed to the bottom of the mounting arm 571, and an oblique camera 573 locked on the steering motor 572 and pointing to the detection slot 562. The position of the oblique camera 573 can be changed by the steering motor 572, and image information at different points on two surfaces can be obtained at the same time for multi-directional comparison.

[0051] In this embodiment, refer to the attached Figure 3 It can be seen that the installation positions of different oblique detection components 5 are different, that is, in the process of the patch electronic components moving along the transmission component 3, different oblique detection components 5 can obtain the appearance of the two surfaces in different directions, and through comparison in multiple directions, more accurate detection can be achieved.

[0052] Furthermore, the material separation component 6 includes a plurality of waste bins 61 and a plurality of finished product bins 62 , and an extraction structure 63 is provided in each of the waste bins 61 and the finished product bins 62 , and a partition structure 64 is provided at the feed port of the waste bins 61 and the finished product bins 62 .

[0053] In the process of inspection, it is inevitable that defective products will appear. In order to classify defective products from finished products, the material separation component 6 includes a number of waste bins 61 and a number of finished product bins 62. The waste bins 61 and the finished product bins 62 are both provided with extraction structures 63, and a separation structure 64 is provided at the feed port of the waste bins 61 and the finished product bins 62. Obviously, the number of finished products is definitely much greater than that of defective products, so a separation structure needs to be provided between the finished products and the defective products. The specific separation structure 64 is as follows: the separation structure 64 includes a positioning seat 641, a separation baffle 642 that slides up and down along the positioning seat 641, and is connected to the separation baffle 642. The guide column 643 in the baffle 642, where the number of finished products is large, in most cases, the partition structure 64 does not need to be moved, and the finished products will fall into the finished product bin 62 along the partition structure 64 that acts as a barrier. When defective products appear, that is, an abnormality occurs in one of the forward detection components 4 and the oblique detection components 5, the machine 1 will control the partition baffle 642 to rise along the positioning seat 641, climb up in the direction guided by the guide column 643, and form a channel, so that the defective products can turn through the finished product bin 62 and then be blocked by the second partition baffle 642 and fall into the waste bin 61.

[0054] However, at a specific time, the positions of several waste bins 61 and several finished product bins 62 can also be swapped, and it is only necessary to modify the corresponding startup program.

[0055] It should be added that a bottom detection structure 9 is fixed in the machine 1 and placed at the bottom of the transmission component 3. The bottom of the chip electronic components is photographed through the transparent transmission component 3, thereby forming a complete detection system with six-sided appearance and multiple two-sided bevel appearance, covering the entire area.

[0056] The foregoing description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that various modifications and variations are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention are intended to be within the scope of protection of the present invention.

Claims

1. An appearance inspection system for chip electronic components, characterized in that: include: Machine (1); A bulk material tray (2) is arranged on the machine platform (1); A transmission assembly (3) for receiving workpieces from a bulk tray (2); The transmission assembly (3) includes a motor fixing seat (31) with a built-in motor, an offset seat (32) hinged on the motor, and a transmission plate (33) connected to the top of the offset seat (32); the offset seat (32) includes a plurality of telescopic rods (321) connected to the transmission plate (33), and a driving member (322) corresponding to the number of the telescopic rods (321) and driving the telescopic rods (321) to move up and down; A forward detection component (4) and a plurality of oblique detection components (5) are sequentially arranged along the rotation direction of the transmission component (3); A material distribution component (6) disposed on one side of the bulk material tray (2) and having an opening facing the transmission component (3); The top of the telescopic rod (321) is a hinged ball, and the bottom of the transmission disc (33) is provided with a plurality of spherical grooves for accommodating the hinged balls; The driving member (322) drives the telescopic rod (321) to rise, so that the horizontality of the patch electronic component rotating along the transmission component (3) changes, that is, the horizontal state gradually changes to an inclined state with different inclinations, so as to obtain perspective images of the patch electronic component at different inclinations; The material dividing component (6) includes a plurality of waste bins (61) and a plurality of finished product bins (62), wherein the waste bins (61) and the finished product bins (62) are both provided with extraction structures (63), and a partition structure (64) is provided at the feed port of the waste bins (61) and the finished product bins (62), wherein the partition structure (64) includes a positioning seat (641), a partition baffle (642) sliding up and down along the positioning seat (641), and a guide column (643) connected to the partition baffle (642). The interior of the machine (1) is also provided with an electrostatic supporting structure (7) movably fitted with the transmission component (3), and an electrostatic relief structure (8) is fixedly connected to one side of the partition structure (64).

2. The appearance inspection system for chip electronic components according to claim 1, characterized in that: The forward detection component (4) includes a first mounting frame (41) arranged on the outside of the transmission component (3), a first sliding guide rail (42) clamped at the bottom of the first mounting frame (41), a first moving structure (43) driving the first sliding guide rail (42), a first height adjustment structure (44) fixed at the bottom of the first sliding guide rail (42), a forward shooting structure (45) installed in the middle section of the first mounting frame (41) and arranged above the transmission component (3), and a top shooting structure (46) arranged above the forward shooting structure (45) and connected to the first mounting frame (41), wherein the top shooting structure (46) includes a top camera and a fill light.

3. The appearance inspection system for chip electronic components according to claim 2, characterized in that: A first guide groove (411) is provided on the inner side of the first mounting frame (41), and the forward shooting structure (45) includes an annular base (451), a through hole (452) provided on the inner side of the annular base (451), a side camera arranged on the inner side of the annular base (451) and facing the through hole (452), and a first transposition seat (453) slidably connected to the first guide groove (411).

4. The appearance inspection system for chip electronic components according to claim 1, characterized in that: The oblique detection assembly (5) includes a second mounting frame (51) arranged on the outside of the transmission assembly (3), a second sliding guide rail (52) clamped on the bottom of the second mounting frame (51), a second moving structure (53) driving the second sliding guide rail (52), a second height adjustment structure (54) fixed on the bottom of the second sliding guide rail (52), a first closing structure (55) installed in the middle section of the second mounting frame (51), a second closing structure (56) facing the first closing structure (55), and a rotating shooting structure (57) facing the opening of the first closing structure (55).

5. The appearance inspection system for chip electronic components according to claim 4, characterized in that: A second guide groove (511) is provided on the inner side of the second mounting frame (51). The first closed structure (55) and the second closed structure (56) have the same structure. The second closed structure (56) includes an arched cover (561), a detection groove (562) provided on the inner side of the arched cover (561), a lamp bead (563) provided on the inner side of the detection groove (562), and a second transposition seat (564) slidably connected to the second guide groove (511).

6. The appearance inspection system for chip electronic components according to claim 5, characterized in that: The rotating shooting structure (57) comprises a mounting arm (571) arranged on the second mounting frame (51), a steering motor (572) fixed to the bottom of the mounting arm (571), and an oblique camera (573) locked on the steering motor (572) and pointing toward the detection slot (562).

Images