Control method for centering silicon rods in cutting equipment and cutting equipment

Abstract

The embodiment of the present application provides a control method and cutting device for centering silicon rods in a cutting device, wherein the method includes: when it is recognized that the centering tool is located on the supporting platform of the cutting device, controlling the centering mechanism to drive the centering tool to move to a position to be tested along a first direction; the first direction is perpendicular to the cutting feed direction of the cutting device; when it is recognized that the position to be tested where the centering tool is located is aligned with the cutting line in the cutting device, generating a test completion instruction. The control method and cutting device for centering silicon rods in a cutting device provided by the embodiment of the present application can test the centering mechanism, so that the silicon rod can be moved to a position corresponding to the cutting line through the centering mechanism later, and the silicon rod can be cut into small silicon rods with smaller cross-sectional areas, so as to facilitate direct slicing of the small silicon rods to obtain small silicon wafers, eliminating the traditional laser scribing step, and improving the quality and yield of silicon wafers.

Description

Technical Field

[0001] The present application relates to a hard and brittle material cutting technology, and in particular to a control method and cutting device for centering silicon rods in a cutting device. Background Art

[0002] With the development of heterojunction solar cells, the demand for small silicon wafers is increasing. Traditionally, cylindrical single-crystal silicon rods are cut into square rods, which are then cut into large silicon wafers. Laser technology is then used to scribing these large wafers into smaller wafers. However, the laser scribing process can cause damage and defects in the cross-section of the small silicon wafers, severely impacting the conversion efficiency of the resulting heterojunction solar cell. Summary of the Invention

[0003] In order to solve one of the above technical defects, an embodiment of the present application provides a control method for centering silicon rods in a cutting device and a cutting device.

[0004] According to a first aspect of an embodiment of the present application, a control method for centering a silicon rod in a cutting device is provided, comprising:

[0005] When it is recognized that the centering tool is located on the carrying platform of the cutting device, the centering mechanism is controlled to drive the centering tool to move along a first direction to a position to be measured; the first direction is perpendicular to the cutting feed direction of the cutting device;

[0006] When it is recognized that the position to be tested of the centering tool is aligned with the cutting line of the cutting device, a test completion instruction is generated.

[0007] According to a second aspect of an embodiment of the present application, a control device for centering silicon rods in a cutting device is provided, comprising:

[0008] Memory;

[0009] processor; and

[0010] computer programs;

[0011] The computer program is stored in the memory and configured to be executed by the processor to implement the method described above.

[0012] According to a third aspect of an embodiment of the present application, a computer-readable storage medium is provided, on which a computer program is stored; the computer program is executed by a processor to implement the method described above.

[0013] According to a fourth aspect of an embodiment of the present application, a cutting device is provided, comprising: the control device for centering the silicon rod as described above.

[0014] The technical solution provided by the embodiment of the present application is that when it is recognized that the centering tool is located on the supporting platform of the cutting equipment, the centering mechanism is controlled to drive the centering tool to move along the first direction to the position to be tested; when it is recognized that the centering tool in the position to be tested is aligned with the cutting line in the cutting equipment, a test completion instruction is generated, so that before cutting the silicon rod, the execution effect of the centering mechanism is tested by the centering tool, so that after the test is completed, the cutting line can cut the silicon rod according to the preset position requirements, improve the accuracy of the cutting position, and meet the silicon rod size requirements. The silicon rod is cut into two small silicon rods with equal cross-sectional areas. Subsequently, the small silicon rods are directly sliced ​​to obtain smaller silicon wafers, and traditional laser scribing is no longer used, so as to avoid damage to the silicon wafers and ensure the quality of the silicon wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0016] Figure 1 A flowchart of the centering control method provided in an embodiment of the present application;

[0017] Figure 2 A schematic structural diagram of a silicon rod centering device provided in an embodiment of the present application;

[0018] Figure 3 A schematic structural diagram of a silicon rod centering device provided in an embodiment of the present application applied to a cutting device;

[0019] Figure 4 A schematic structural diagram of a silicon rod centering mechanism provided in an embodiment of the present application;

[0020] Figure 5 A partial cross-sectional view of a silicon rod centering mechanism provided in an embodiment of the present application;

[0021] Figure 6 This is a schematic diagram of the structure of the cooperation between the centering support and the clamping claw connecting block in the silicon rod centering mechanism provided in an embodiment of the present application;

[0022] Figure 7 A schematic structural diagram of another silicon rod centering mechanism provided in an embodiment of the present application;

[0023] Figure 8 for Figure 7 A partial cross-sectional view of the silicon rod centering mechanism shown;

[0024] Figure 9 A schematic diagram of the structure of the centering tool provided in an embodiment of the present application;

[0025] Figure 10A schematic diagram of the structure of the centering tool provided in an embodiment of the present application applied to a cutting device;

[0026] Figure 11 Schematic diagram of rod length detection in the cutting equipment provided in an embodiment of the present application.

[0027] Reference numerals:

[0028] 21-carrying platform; 211-supporting platform;

[0029] 51-Centering support seat; 52-Centering adjustment plate; 53-Centering mechanism; 531-Centering support; 532-Centering cylinder; 533-Centering drive rod; 534-Centering guide rod; 5341-Limiting sleeve; 535-Centering jaw; 5351-Centering jaw connecting block; 5352-Centering jaw arm; 536-Buffer block; 537-First protective sheet metal; 538-Second protective sheet metal; 539-Accordion cover; 5310-Centering lead screw; 5311-Centering nut; 5312-Centering motor; 5313-Centering base; 5314-Centering guide rail; 5315-Centering slider; 5316-Driving pulley; 5317-Driven pulley; 5318-Timing belt; 5319-Protective cover; 54-Centering adjustment assembly; 56-Rod length detection assembly;

[0030] 55-centering tool; 551-tool base plate; 5511-base plate notch; 5512-reference surface; 5513-base plate through hole; 552-tool test piece; 5521-seam; 5522-protrusion;

[0031] 6- cutting line;

[0032] 7-Silicon rod. DETAILED DESCRIPTION

[0033] In order to make the technical solutions and advantages of the embodiments of the present application more clearly understood, the exemplary embodiments of the present application are further described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present application, and are not an exhaustive list of all the embodiments. It should be noted that the embodiments and features in the embodiments of the present application can be combined with each other unless they conflict.

[0034] In the traditional solution, cylindrical single-crystal silicon rods are first cut into square rods, and then the square rods are cut into large silicon wafers. Finally, laser technology is used to scribing the large silicon wafers to form small silicon wafers. However, the laser scribing process will cause damage and defects in the cross-section of the small silicon wafers, seriously affecting the conversion efficiency of the final processed heterojunction battery.

[0035] This embodiment provides a cutting method. After obtaining a square rod, the rod is cut along its length to obtain small silicon rods with smaller cross-sectional areas. The small silicon rods are then sliced ​​to directly obtain smaller silicon wafers, eliminating the laser scribing step and avoiding damage to the surface of the small silicon wafers. One cutting method involves cutting along the centerline of the silicon rod, dividing the square rod into two small silicon rods with equal cross-sectional areas. The resulting small silicon wafers are of the same size after slicing, making them easier to store and transport. This cutting process requires very high alignment accuracy between the wire cutting device and the silicon rod, and the cutting line must pass through the centerline of the square rod.

[0036] Accordingly, a cutting device including a machine base, a silicon rod supporting device and a wire cutting device arranged on the base can be used. The silicon rod supporting device is used to support the silicon rod, and a cutting wire is wound around the wire cutting device. The silicon rod is cut using the above-mentioned cutting method.

[0037] After placing the silicon ingot on the ingot carrier, the ingot's position needs to be adjusted to align the ingot's intended cutting position with the cutting line. For example, the ingot's centerline should be aligned with the cutting line. Adjusting the ingot's position can be accomplished using the ingot's centering mechanism within the cutting equipment. However, due to factors such as dimensional deviations within the centering mechanism or errors in its installation on the cutting equipment, the ingot may not be accurately positioned after the centering operation. Therefore, a centering test is required before cutting.

[0038] This embodiment provides a control method for centering a silicon rod in a cutting device, such as Figure 1 As shown, the centering control method provided in this embodiment includes:

[0039] Step 10: When it is recognized that the centering tool is located on the carrying platform of the cutting device, the centering mechanism is controlled to drive the centering tool to move along the first direction to the position to be measured.

[0040] First, the centering tool is placed on a carrying platform, which can be placed manually or transported by a robot. In this embodiment, the carrying platform is a silicon rod carrying platform.

[0041] An identification device is provided near the carrying platform to identify whether the centering tool is placed on the carrying platform.

[0042] When it is recognized that there is a centering tool on the carrying platform, the centering mechanism is controlled to start and the centering tool is driven to move along the first direction to the position to be measured.

[0043] The first direction is a horizontal direction perpendicular to the centerline of the silicon ingot, that is, perpendicular to the cutting feed direction of the cutting equipment. For example, if the carrier platform and the wire cutting device move relative to each other in the horizontal direction to cut the silicon ingot, the feed direction is the same as the centerline of the silicon ingot, which is the second direction. The first direction is perpendicular to the second direction. Assuming the second direction is the front-to-back direction, the first direction is the left-to-right direction.

[0044] The position to be measured is the target position to which the centering tool can push the silicon rod. For example, the position to be measured is the center position of the centering mechanism, that is, the center line of the centering tool coincides with the center line of the centering mechanism.

[0045] Step 20: When it is recognized that the centering tool at the position to be tested is aligned with the cutting line of the cutting device, a test completion instruction is generated.

[0046] After step 10, the alignment of the cutting line and the centering fixture is determined at the test position. If the alignment is confirmed, a test completion signal is generated, indicating that the centering mechanism can subsequently move the silicon ingot to the target position, aligning it with the cutting line and meeting the cutting requirements.

[0047] Identify whether the cutting line and the centering tool are aligned. For example, laser alignment can be used. Using the principle that lasers travel in straight lines, the cutting line and a marking point on the centering tool are monitored to see if they are in the same straight line. If they are, alignment is indicated. For example, a laser transmitter can be installed on the centering tool to emit laser light from the marking point along the center line of the centering tool. If the laser shines on the cutting line, alignment is indicated.

[0048] The technical solution provided by this embodiment is that when it is recognized that the centering tool is located on the supporting platform of the cutting equipment, the centering mechanism is controlled to drive the centering tool to move along the first direction to the position to be tested; when it is recognized that the centering tool in the position to be tested is aligned with the cutting line in the cutting equipment, a test completion instruction is generated, so that before cutting the silicon rod, the execution effect of the centering mechanism is tested by the centering tool, so that after the test is completed, the cutting line can cut the silicon rod according to the preset position requirements, improve the accuracy of the cutting position, and meet the silicon rod size requirements. The silicon rod is cut into two small silicon rods with equal cross-sectional areas. Subsequently, the small silicon rods are directly sliced ​​to obtain smaller silicon wafers, and traditional laser scribing is no longer used to avoid damage to the silicon wafers and ensure the quality of the silicon wafers.

[0049] On the basis of the above technical solution, after controlling the centering mechanism to drive the centering tool to move along the first direction to the position to be measured in step 10, the method further includes:

[0050] The wire cutting device or the carrying platform in the cutting equipment is controlled to move so that the cutting wire wound on the wire cutting device and the centering tool are brought closer to each other along the second direction.

[0051] Here, it is recognized that the position to be measured of the centering tool is aligned with the cutting line of the cutting device, specifically, it is recognized that the cutting line enters the seam of the centering tool.

[0052] Specifically, a seam is set on the centering tool, and the centering mechanism drives the tool to move, aiming to align the seam with the cutting line. If the seam aligns with the cutting line after the centering mechanism moves the tool, the current centering mechanism's pushing action on the tool meets the requirements, and the test is complete. If the seam and cutting line are not aligned after the centering mechanism moves the tool, the current centering mechanism's pushing action on the tool does not meet the requirements and requires adjustment.

[0053] Specifically, when it is determined that the position to be measured of the centering tool is not aligned with the cutting line of the cutting device, the position of the centering mechanism is adjusted along the first direction, and then the adjusted centering mechanism is controlled to drive the centering tool to move along the first direction to the position to be measured. That is, after the position of the centering mechanism is adjusted, the centering operation is re-performed to drive the centering tool to the position to be measured. The position of the centering mechanism is repeatedly adjusted along the first direction until the centering tool is driven by the centering mechanism to move until the seam is aligned with the cutting line.

[0054] Furthermore, after recognizing that the position to be measured of the centering tool is aligned with the cutting line of the cutting device, the method further includes: controlling the wire cutting device or the supporting platform to move back to the initial position, awaiting subsequent cutting of the silicon ingot. Specifically, when recognizing that the silicon ingot is located on the supporting platform, the centering mechanism is controlled to drive the centering tool to move in a first direction to the position to be cut, so that the cutting line wound on the wire cutting device can cut the silicon ingot.

[0055] In the above steps, controlling the centering mechanism to drive the centering tooling to move along the first direction to the position to be measured specifically includes: controlling the two centering jaws in the centering mechanism to approach each other along the first direction, and the centering jaws push the silicon rod from both sides to move along the first direction until the silicon rod contacts the two centering jaws and reaches the position to be measured.

[0056] Assuming the seam is equidistant from both sides of the centering fixture—that is, the seam lies on the centerline of the fixture—the centering fixture moves at the same speed and travels the same distance. The centering fixture is then moved to the desired location, and the cutting line is aligned with the seam of the centering mechanism. Subsequently, the cutting line can be aligned with the centerline of the silicon ingot to produce two smaller ingots with equal cross-sectional areas.

[0057] On the basis of the above technical solution, the centering tool can be identified by infrared, photoelectric sensors, image acquisition and the like. In this embodiment, a rod length detection component is used for identification. The rod length detection component is located beside the centering mechanism and below the carrying platform; the rod length detection component extends upward to the bottom of the centering tool. Specifically, the detection signal of the rod length detection component provided on the carrying platform is first obtained, and then the centering tool is identified by the detection signal. The rod length detection component can be an infrared sensor, a light sensor and the like. When the centering tool is placed on the carrying device, the rod length detection component performs detection below the centering tool.

[0058] Furthermore, during the movement of the carrying platform, the process also includes: measuring the running straightness of the centering tool. Specifically, a dial indicator is used on the left and right reference surfaces of the centering tool to measure the running straightness of the centering tool. The running straightness must be less than a preset value.

[0059] In addition, during the process of cutting the silicon rod through the cutting line, the duration of the carrier platform's moving feed, the moving speed of the carrier platform, and the distance between the rod length detection component and the cutting line before cutting are also obtained. Then, the length of the silicon rod is determined based on the duration, the moving speed of the carrier platform, and the distance between the rod length detection component and the cutting line before cutting.

[0060] like Figure 2 and Figure 3 As shown, the silicon rod centering device provided in this embodiment includes a centering support 51, a centering mechanism 53, and a centering adjustment assembly 54. The centering support 51 serves as the base structure, and the centering mechanism 53 and the centering adjustment assembly 54 are both mounted on the centering support 51. The centering support 51 can be mounted on the base of a cutting device.

[0061] Centering mechanism 53 is mounted on centering support 51. It includes at least one pair of centering jaws corresponding to the silicon rod. The jaws can move toward or away from each other to move the silicon rod to a position midway between the jaws. The direction in which the jaws move toward or away from each other is defined as a first direction, which is perpendicular to the centerline of the silicon rod.

[0062] The centering adjustment assembly 54 is used to adjust the position of the centering mechanism 53. It drives the centering mechanism 53 in the direction of the silicon ingot's movement to precisely position it. Due to the size of the centering mechanism 53 and production tolerances, the centering mechanism 53 may not be fully installed. The centering adjustment assembly 54 drives the centering mechanism 53 into position, ensuring the precise position of the centering mechanism 53 and the accuracy of the silicon ingot centering.

[0063] A centering mechanism and a centering adjustment component are provided on the centering support seat, wherein the centering adjustment component is used to adjust the position of the centering mechanism. The centering mechanism has at least one pair of centering jaws. The pair of centering jaws can move closer to or farther away from each other to push the silicon rod to move to the middle position of the pair of centering jaws, thereby realizing the centering of the silicon rod and cutting the silicon rod into two small silicon rods with smaller cross-sectional areas. Subsequently, the small silicon rods are directly sliced ​​to obtain smaller silicon wafers. Traditional laser scribing is no longer used, thereby avoiding damage to the silicon wafer and ensuring the quality of the silicon wafer.

[0064] Furthermore, when the moving speed and moving distance of a pair of centering jaws are the same, the cutting line passes through the center line of the silicon rod and cuts, thereby cutting the silicon rod into two small silicon rods with equal cross-sectional areas.

[0065] When the silicon rod is short, a centering mechanism 53 is used, wherein the centering jaws extend to the middle of both sides of the silicon rod to push the silicon rod to move the silicon rod into position.

[0066] When the silicon rod is long, two, three or more centering mechanisms 53 may be used and spaced apart along the length of the silicon rod to apply a pushing force to the silicon rod from the front end, rear end or middle of the silicon rod, so that the center line of the silicon rod does not deviate during movement.

[0067] In this embodiment, two centering mechanisms 53 are arranged at intervals along the length direction of the silicon rod to apply a pushing force to the front and rear of the silicon rod respectively.

[0068] There may be two centering adjustment components 54 , which are respectively disposed beside the centering mechanism 53 and are used to push the corresponding centering mechanism 53 to move along the first direction.

[0069] Furthermore, a centering adjustment plate 52 is disposed on top of the centering support base 51. The centering adjustment plate 52 can move relative to the centering support base 51 in a first direction and lock into place, for example, by being secured to the centering support base 51 via fasteners. A centering adjustment assembly 54 is used to apply a force to the centering adjustment plate 52 to cause it to move in the first direction. A centering mechanism 53 is secured to the centering adjustment plate 52 and moves with it.

[0070] Based on the above scheme, the two centering mechanisms 53 are both arranged on the centering adjustment plate 52. The centering adjustment plate 52 is pushed to move by the centering adjustment component 54 so that the two centering mechanisms 53 move together with the centering adjustment plate 52. There is no need to adjust the positions of the centering mechanisms 53 separately, which reduces the adjustment steps and processes, thereby improving production efficiency.

[0071] The centering adjustment assembly 54 can cooperate with the centering mechanism 53 in a variety of ways. For example, one implementation involves the centering adjustment assembly 54 comprising a centering adjustment block and an adjustment bolt. The centering adjustment block is fixed to the centering support 51 and has a threaded hole extending in a first direction. The adjustment bolt is screwed into the threaded hole, and the length of the adjustment bolt extending relative to the centering adjustment block can be adjusted by rotating the adjustment bolt. The tail end of the adjustment bolt abuts against or is fixedly connected to the centering adjustment plate, and rotating the adjustment bolt causes the centering adjustment plate to move in the first direction.

[0072] Regarding the connection between the centering adjustment plate 52 and the centering support base 51, for example, one implementation involves defining an elongated hole extending in a first direction in the centering support base 51, with the centering adjustment plate 52 secured within the elongated hole via bolts. When the bolts are loosened, the centering adjustment plate 52 can move relative to the centering support base 51 in the first direction. Once in position, the bolts are tightened to secure the centering adjustment plate 52 to the centering support base 51.

[0073] On the basis of the above technical solution, this embodiment provides a specific implementation of a silicon rod supporting device: Figure 3 As shown, the silicon rod supporting device includes a supporting platform 21 , which is provided with two sets of support brackets 211 for supporting the silicon rods 7 . The support brackets 211 are cantilevered and the silicon rods 7 are placed on the support brackets 211 .

[0074] The centering device is located below the support 211 and utilizes two centering mechanisms 53 spaced apart along the length of the silicon rod. The two centering jaws 535 in the centering mechanism 53 extend upward to either side of the silicon rod 7. Prior to cutting, the silicon rod 7 is placed on the support 211. The two centering jaws 535 are then driven toward each other. When one of the centering jaws 535 contacts the side of the silicon rod 7 and applies a force to the silicon rod 7, it propels the silicon rod 7 in a first direction until both sides of the silicon rod 7 contact the centering jaws 535. The silicon rod 7 is then positioned so that the cutting line can pass through the centerline of the silicon rod for cutting.

[0075] Based on the above technical solution, a rod length detection assembly 56 is used. It is installed on the centering adjustment plate 52 and can be located between the two centering mechanisms 53. The rod length detection assembly 56 extends upward to the bottom of the silicon rod 7 and is used to detect the current position of the silicon rod 7 and calculate the length of the silicon rod 7 based on the distance the silicon rod 7 moves during the cutting process.

[0076] Based on the above solution, this embodiment provides an implementation method of the centering mechanism 53:

[0077] like Figures 4 and 5As shown, the silicon rod centering mechanism provided in this embodiment includes: a centering support 531 , a centering drive member, a centering drive rod 533 and a centering clamp 535 .

[0078] The centering support 531 is the basic structure for mounting and supporting various components. A centering drive is mounted on the centering support 531. The centering drive can be an electric cylinder, a hydraulic cylinder, or a pneumatic cylinder. In this embodiment, the centering drive is specifically a centering cylinder 532.

[0079] The number of the centering drive rods 533 is at least one pair, and a pair includes two centering drive rods 533 .

[0080] The number of centering jaws 535 is at least one pair, each pair comprising two centering jaws 535. When a pair of centering jaws 535 is used, the two centering jaws 535 are respectively disposed at the ends of the centering support 531 along the first direction. One centering drive rod 533 is connected to each centering jaw 535, and the two centering jaws 535 can move synchronously toward or away from each other. Alternatively, two centering drive rods 533 can be connected to one centering jaw 535, and two other centering drive rods 533 can be connected to another centering jaw 535, so that the two centering drive rods 533 drive the movement of one centering jaw 535.

[0081] When two pairs of centering jaws 535 are used, the two centering jaws 535 in a pair are respectively disposed at the ends of the centering support 531 along the first direction, and the two pairs of centering jaws 535 are spaced apart and perpendicular to the first direction. The centering jaws 535 at the same end are connected to the same centering drive rod 535, so that the centering drive rod drives the movement of the two pairs of centering jaws 535.

[0082] Alternatively, three or more pairs of centering jaws may be used, and the settings may be made with reference to the above two pairs.

[0083] Specifically, taking a pair of centering jaws 535 as an example, the centering drive rod 533 extends in a first direction, which is the direction of movement of the centering jaws 535 and is perpendicular to the centerline of the silicon rod. The cylinder 532 is located in the center, and the centering jaws 535 are located on either side. One end of the centering drive rod 533 is connected to the cylinder 532, and the other end is connected to the centering jaws 535.

[0084] The centering cylinder 532 can drive the centering drive rod 533 to move along the first direction relative to the centering support 531, and drive the centering clamping jaws 535 to move synchronously. The centering cylinder 532 drives the two centering clamping jaws 535 to move the same distance at the same speed.

[0085] Before the cutting equipment begins cutting the silicon ingot, the centering cylinder 532 drives the centering jaws 535 toward each other, pushing the silicon ingot to its center position. That is, the centerline of the silicon ingot is aligned with the cutting line. For example, assuming the first direction is left-right, if the silicon ingot is initially positioned to the left, the left centering jaw 535 will first contact the silicon ingot, pushing it to the right until it contacts the right centering jaw 535, reaching the center position.

[0086] The centering drive member is arranged on the centering support, and a centering clamp is arranged on both sides of the centering support; one end of the centering drive rod is connected to the centering clamp, and the other end is connected to the centering drive member. The centering drive rod is driven by the centering driver to move relative to the centering support, and the centering clamp is driven to move synchronously, so that the two centering clamps in a pair are pushed to move to the middle position in the process of approaching each other, and aligned with the cutting line, so as to facilitate the subsequent cutting of the silicon rod into two small silicon rods with the same cross-section.

[0087] One implementation method is: a receiving space is provided inside the centering support 531. The centering drive member is provided in the receiving space.

[0088] The centering drive rod 533 is disposed through the centering support 531. One end of the rod extends into the receiving space and connects to the centering cylinder 532. The other end of the rod extends beyond the centering support 531 and connects to the centering clamp 535. The centering drive rod 533 and the centering support 531 generate relative motion, with the centering support 531 guiding the motion.

[0089] In addition to the above technical solution, two centering guide rods 534 are further provided, each connected to a corresponding one of the two centering jaws 535. Specifically, the centering guide rods 534 extend along a first direction and are movably mounted on the centering support 531. One end of the centering guide rods 534 is connected to the centering jaws 535. In one embodiment, the centering guide rods 534 extend through the centering support 531.

[0090] When the centering cylinder 532 drives the centering jaws 535 to move, friction with contacting components, gravity, and other forces can easily cause the movement of the centering jaws 535 to deviate from the primary direction, preventing the two centering jaws 535 from perpendicularly contacting the silicon rod's sides. A centering guide rod 534, connected between the centering jaws 535 and the centering support 531, guides the movement of the centering jaws 535, preventing deviation from the primary direction and ensuring perpendicular contact between the two centering jaws 535 and the silicon rod's sides, improving centering accuracy.

[0091] Based on the above technical solution, this embodiment provides a specific implementation of a silicon rod centering mechanism: the centering jaw 535 specifically includes a jaw connecting block 5351 and a jaw arm 5352. The jaw connecting block 5351 is connected to the centering drive rod 533, and the jaw arm 5352 is disposed on the jaw connecting block 5351. The jaw arm 5352 extends toward the silicon rod, with the end of the jaw arm 5352 located on the side of the silicon rod for aligning the silicon rod.

[0092] One embodiment: The clamping arm 5352 is set on the top of the clamping connecting block 5351, and the clamping arm 5352 extends upward until the top of the clamping arm 5352 is located on the side of the silicon rod, which is used to align the silicon rod above.

[0093] Alternatively, the clamping arm 5352 may also be disposed at the bottom of the clamping connecting block 5351 and extend downward to the side of the silicon rod to align the silicon rod below.

[0094] Furthermore, a buffer block 536 is provided on the side of the clamping arm 5352 facing the silicon rod. The buffer block 536 is used to directly contact the surface of the silicon rod to prevent scratching the surface of the silicon rod and thus protect the silicon rod. The buffer block 536 can be made of a soft material such as nylon, felt, rubber, or silicone.

[0095] One implementation of the aforementioned centering support 531 is as follows: the centering support 531 is a box-shaped structure with an internal cavity, and a centering cylinder 532 is disposed within the internal cavity. The number of centering cylinders 532 can be one or two. When there is one centering cylinder 532, each centering cylinder 532 is connected to a centering drive rod 533 via a connecting rod transmission structure, and the two centering drive rods 533 are driven by one centering cylinder 532 to move toward or away from each other. When there are two centering cylinders 532, each centering cylinder 532 is connected to each centering drive rod 533, and the two centering drive rods 533 have the same stroke, thereby driving the centering jaws 535 to move the same distance for centering.

[0096] The two side walls of the centering support 531, perpendicular to the first direction, are provided with drive rod holes for the centering drive rod 533 and guide rod holes for the centering guide rod 534. The drive rod holes are located above the guide rod holes, with the centerlines of the two centering drive rods 533 and the two centering guide rods 534 aligned side by side.

[0097] Specifically, the two side walls of the centering support 531 are respectively provided with four through-holes, arranged in two rows and two columns. The two upper through-holes are used to pass through the centering drive rod 533, and the two lower through-holes are used to pass through the centering guide rod 534. Viewed from one side of the centering support 531, the centering drive rod 533 corresponding to the centering clamping jaw on that side passes through the upper left through-hole, and the centering guide rod 534 passes through the lower right through-hole. The centering drive rod 533 corresponding to the centering clamping jaw on the other side passes through the upper right through-hole, and the centering guide rod 534 passes through the lower left through-hole. With this arrangement, the centering drive rod and centering guide rod corresponding to one centering clamping jaw are arranged along the diagonal line of the centering support 531, and the distance between them is larger, which can further improve the stability and accuracy of the movement process.

[0098] Furthermore, there are relatively moving parts in the centering mechanism. In order to protect the moving parts, protective sheet metal, accordion shields and other covers are installed on the outside to prevent water, foreign matter and dust from entering the centering support and affecting the normal movement of the centering drive rod and the centering guide rod.

[0099] Specifically, an accordion shield 539 is connected between the centering support 531 and the centering jaw 535, sealing the gap between the centering support 531 and the centering jaw 535. The accordion shield 539 opens and closes along a first direction. When the centering jaw 535 moves outward, the accordion shield 539 expands; when the centering jaw 535 moves inward, the accordion shield 539 contracts. The accordion shield 539 prevents the ingress of water, foreign matter, and dust without affecting the normal movement of the centering jaw 535.

[0100] Furthermore, a limit sleeve 5341 is provided on the end of the centering guide rod 534 close to the centering clamp 535 to limit the stroke of the centering cylinder and prevent the centering cylinder from crushing the accordion cover 539.

[0101] Furthermore, a protective sheet metal (referred to as first protective sheet metal 537) is laid above the centering support 531 and connected between the two accordion shields 539 to provide protection from above. During use, the first protective sheet metal 537 will come into contact with the upper components of the cutting equipment. The first protective sheet metal 537 has a certain strength and wear resistance, which can protect the centering support 531 and reduce wear.

[0102] Furthermore, a second protective sheet metal 538 is used to surround the outside of the clamping jaw connecting block 5351 to protect the clamping jaw connecting block 5352, thereby reducing wear and extending its service life.

[0103] In order to facilitate a clearer understanding of the technical solution of the present application, the centering working process of the silicon rod centering mechanism of the present application is described below:

[0104] After the silicon ingot is placed on the cutting machine's support platform, it lies between the two centering jaws, without contact. The centering drive in the centering mechanism is controlled to operate, driving at least one pair of centering drive rods inward, bringing the two centering jaws closer together. One centering jaw first contacts the silicon ingot and pushes it toward the other jaw until both jaws contact and clamp it.

[0105] The centering drive moves the two centering jaws at the same fixed speed and distance, moving the silicon ingot to the center between the two centering jaws for centering and alignment. During the subsequent cutting process, the cutting line passes through the centerline of the silicon ingot, splitting the ingot into two smaller ingots of equal cross-sectional area.

[0106] Taking a square rod with a rectangular cross section as an example, the cutting line passes through the center line of the square rod, and the square rod can be cut in half to obtain two small silicon rods with equal cross-sectional areas.

[0107] like Figure 7 and Figure 8 As shown, this embodiment provides another implementation method of the centering mechanism: the silicon rod centering mechanism includes: a centering screw 5310, a centering drive member, a centering nut 5311 and a centering clamp.

[0108] The centering screw 5310 extends along the first direction, and there are two centering nuts 5311 , which are threadedly engaged with the centering screw 5310 .

[0109] At least one pair of centering jaws 535 is employed, each comprising two centering jaws 535 , one located at each end of a centering screw 5310 . A centering nut 5311 connects to the centering jaws on the corresponding side, allowing the pair of centering jaws to move synchronously toward or away from each other. The first direction is the direction of movement of the centering jaws.

[0110] When two pairs of centering jaws 535 are used, the two pairs are spaced apart and arranged perpendicular to the first direction. The centering jaws 535 on the same side of the two pairs are connected to the same centering nut 5311. Three or more pairs of centering jaws 535 can also be used, and the arrangement is similar to that of two pairs.

[0111] The centering drive member can be a motor, a hydraulic cylinder, or a pneumatic cylinder. In this embodiment, the centering drive member is specifically a centering motor 5312. The centering motor 5312 is connected to the centering screw 5310 and is used to drive the centering screw 5310 to rotate. When the centering screw 5310 rotates, the pair of centering nuts 5311 move in opposite directions.

[0112] This embodiment uses a pair of centering jaws as an example. Each centering jaw 535 is connected to a corresponding centering nut 5311, and moves synchronously with the centering nut 5311 relative to the centering screw 5310. The centering jaws extend toward the silicon rod and are used to press against the rod from both sides to align it. A centering motor 5312, via the centering screw 5310, drives the two centering jaws to move at the same speed and distance.

[0113] Before the cutting equipment begins cutting the silicon ingot, the centering motor 5312 drives the centering jaws toward each other, pushing the silicon ingot to its center position. That is, the centerline of the silicon ingot is aligned with the cutting line. For example, assuming the first direction is left-right, if the silicon ingot is initially positioned to the left, the left centering jaw will first contact the silicon ingot, pushing it to the right until it contacts the right centering jaw, reaching the center position.

[0114] The technical solution provided in this embodiment adopts two centering nuts to cooperate with the centering screw threads, and the centering nuts are connected to the centering claws on the corresponding sides. The centering screw is driven to rotate by the centering drive member, so that the two centering nuts drive at least one pair of corresponding centering claws to move in opposite directions at the same time. In the process of the centering claws approaching each other, the silicon rod is pushed to move to the middle position and aligned with the cutting line, so as to facilitate the subsequent cutting of the silicon rod into two small silicon rods with the same cross-section.

[0115] The centering screw 5310 may be one in number, with external threads at both ends of the centering screw 5310 respectively arranged in opposite directions, each engaging with a centering nut thread. When the centering screw 5310 rotates, the two centering nuts 5310 move in opposite directions.

[0116] Alternatively, two centering screws 5310 may be used, one centering screw 5310 being threadedly engaged with a centering nut 5311. One motor and a connecting rod mechanism may be used to drive the two centering screws 5310 to rotate, or two motors may be used to drive the two centering screws 5310 to rotate respectively.

[0117] Furthermore, a guide structure can be used to guide the centering nut 5311 during its movement. One embodiment is to use a centering base 5313, on which a centering guide rail 5314 extending along a first direction is provided. Two centering sliders 5315 are slidably connected to the centering guide rail 5314.

[0118] The centering nut 5311 is fixedly connected to the centering slider 5315. The centering slider 5315 restricts the centering nut 5311 to move only in the first direction. In addition, the above function can also be achieved by using a centering slot and a centering slider in combination.

[0119] The centering motor 5312 may be directly connected to the centering screw 5310 or may be connected to the centering screw 5310 via a transmission mechanism.

[0120] One embodiment is that the center line of the centering motor 5312 is parallel to the center line of the centering screw 5310 and is arranged side by side. Figure 2 The viewing angle of the first direction is Figure 2 In the left and right directions, the centering motor 5312 is located beside the threaded section at the left end of the centering screw 5310, and the output shaft extends to the left. The transmission mechanism extends in a direction perpendicular to the first direction and is connected to the left end of the centering screw 5310 and the left end of the centering motor 5312.

[0121] The transmission mechanism is used to transmit driving force between the centering screw 5310 and the centering motor 5312. This embodiment provides a specific method: the transmission mechanism includes a driving pulley 5316, a driven pulley 5317, and a synchronous belt 5318. The driving pulley 5316 is connected to the output shaft of the centering motor 5312, and the output shaft of the centering motor 5312 drives the driving pulley 5316 to rotate synchronously. The driven pulley 5317 is connected to the centering screw 5310 and rotates synchronously with the centering screw 5310. The synchronous belt 5318 is mounted on the driving pulley 5316 and the driven pulley 5317 to transmit the rotational torque of the driving pulley 5316 to the driven pulley 5317, and then drives the centering screw 5310 to rotate via the driven pulley 5317.

[0122] In addition to the above solutions, the transmission mechanism can also adopt a gear transmission mechanism, etc.

[0123] Based on the above technical solution, to protect moving components such as the centering screw 5310, a protective cover 5319 can be installed outside the centering screw, centering driver, and centering nut. Protective cover 5319 can be sheet metal and is used to prevent water, dust, and other impurities from entering the area enclosed by protective cover 5319. Sheet metal has a certain strength and wear resistance, protecting the structures in contact with it and reducing wear.

[0124] One method is to use two sets of protective covers 5319, each covering the outside of the two sets of centering nuts 5311 and the centering slider 5315. Furthermore, an accordion cover 539 is connected between the two sets of protective covers 5319 to seal the space between the two sets of protective covers 5319. The accordion cover 539 is set to open and retract along a first direction. When the centering jaws move outward, the accordion cover 539 stretches and opens; when the centering jaws move inward, the accordion cover 539 retracts. The accordion cover 539 can prevent the ingress of water, foreign matter, dust, etc., without affecting the normal movement of the centering jaws.

[0125] Based on the above technical solution, this embodiment provides a specific implementation of a centering clamp: the centering clamp specifically includes a clamping block 5351 and a clamping arm 5352. The clamping block 5351 is connected to the protective cover 5319, which is fixedly connected to the centering nut 5311. The clamping arm 5352 is connected to the clamping block 5315 and extends toward the silicon rod. The end of the clamping arm 5352 is located on the side of the silicon rod to align the silicon rod.

[0126] One embodiment: the clamping claw connection block 5351 is connected to the top of the protective cover 5319, and the clamping claw arm 5352 extends upward until the top of the clamping claw arm 5352 is located on the side of the silicon rod for aligning the silicon rod above.

[0127] Alternatively, the clamping arm 5352 can extend downward to the side of the silicon rod to align the underlying silicon rod. A buffer block 536 is provided on the side of the clamping arm 5352 facing the silicon rod. The buffer block 536 is designed to directly contact the surface of the silicon rod to prevent scratches and protect the silicon rod. The buffer block 536 can be made of a soft material such as nylon, felt, rubber, or silicone.

[0128] In order to facilitate a clearer understanding of the technical solution of the present application, the centering working process of the silicon rod centering mechanism of the present application is described below:

[0129] After the silicon ingot is placed on the cutting machine's support platform, it lies between a pair of centering jaws, without contact with either jaw. The centering drive in the centering mechanism is controlled to operate, driving the centering screw, which, via the centering nut, moves the two centering jaws in a pair toward each other. One centering jaw first contacts the silicon ingot and pushes it toward the other jaw until both jaws contact and clamp it.

[0130] like Figure 9 and Figure 10 As shown, this embodiment provides a centering tool 55, comprising a tool base 551 and a tool test piece 552. The tool base 551 is a plate-like structure, and the tool test piece 552 is mounted on the tool base 551. One end of the tool test piece 552 is provided with a seam 5521 for accommodating a cutting line. The seam 5521 is spaced a predetermined distance from a reference plane of the tool base 551, which is a side surface of the tool base 551 parallel to the depth direction of the seam 5521. The width of the seam 5521 is greater than or equal to the diameter of the cutting line, which can be a diamond wire.

[0131] The centering tool 55 can be placed on the carrying device of the cutting equipment. The centering mechanism applies thrust to the centering tool 55 from both sides to move the centering tool 55 relative to the carrying device. When it moves to the preset position, if the seam 5521 is aligned with the cutting line in the cutting equipment, the carrying device and the wire cutting device are moved relative to each other, and the cutting line can enter the seam 5521, it indicates that the centering tool 55 can meet the centering requirements. In the actual production process, the silicon rod can be moved to the preset position and cut as required by the cutting line.

[0132] The preset distance between the seam 5521 and the reference plane of the tooling substrate 551 can be determined according to the position where the cutting line cuts the silicon rod. The reference plane is the side surface of the tooling substrate 551 parallel to the depth direction of the seam 5521.

[0133] For example, if the distance between the cutting surface of the silicon ingot and one side of the silicon ingot is 100mm, then the preset distance between seam 5521 and one side of the tooling base plate 551 is also set to 100mm. During testing, if the cutting line can enter seam 5521 when the centering tooling is pushed into place by the centering mechanism, the relative position between the cutting line and the centering test piece meets the requirements, and the cutting surface will be able to cut the silicon ingot at the preset 100mm position in the future.

[0134] The technical solution provided in this embodiment uses a centering tool to simulate a silicon rod to test the centering mechanism. The centering tool includes a tool substrate and a tool test piece. The tool test piece is arranged on the tool substrate, and one end of the tool test piece is provided with a seam for accommodating the cutting line. The seam has a preset distance from the reference plane of the tool substrate. The reference plane is the side of the tool substrate parallel to the depth direction of the seam.

[0135] On the basis of the above technical solution, the end of the tooling test piece 552 can extend out of the tooling base plate 551 so that the cutting line can enter the seam, and the tooling base plate 551 will not interfere with the cutting line.

[0136] Alternatively, another solution is to provide a substrate notch 5511 on one end of the tooling substrate 551 for the cutting line to pass through. The substrate notch 5511 extends from the end of the tooling substrate 551 to the seam 5521 of the tooling test piece 552. The tooling test piece 552 is then positioned in the middle of the tooling substrate 551, and the cutting line first enters the substrate notch 5511 and then the seam 5521.

[0137] In one embodiment, the direction of the seam 5521 is parallel to the cutting line and perpendicular to the surface of the tooling substrate 551. This allows the cutting line to enter the seam 5521 perpendicular to the tooling substrate 551. Alternatively, the direction of the seam 5521 can be set based on the angle or direction of the silicon rod cut by the cutting line. For example, if the cutting line is set at an angle and the angle between it and the tooling substrate 551 is acute, the seam 5521 is also set at an angle.

[0138] For the method in which the cutting line passes through the center line of the silicon rod, the two side surfaces of the tooling substrate 551 adjacent to the end surface with the substrate notch are used as reference surfaces 5512, and the distance between the seam 5521 and the two reference surfaces 5512 is equal, that is, the seam 5521 is located in the middle of the two reference surfaces 5512.

[0139] In one specific embodiment, the tooling substrate 551 is a rectangular plate, with a substrate notch 5511 provided on an end surface of the tooling substrate 551 extending in the width direction. The substrate notch 5511 extends along the length of the tooling substrate 551. The two side surfaces of the tooling substrate 551 extending in the length direction serve as reference surfaces 5512. The upper and lower surfaces of the tooling substrate 551 are both flat, and the tooling substrate 551 is placed horizontally on the support device.

[0140] The tooling test piece 552 extends in a direction perpendicular to the tooling base plate 551. The top and bottom ends of the tooling test piece 552 are respectively provided with protrusions 5522 protruding in the direction of the cutting line, and the seam 5521 is provided on the protrusion 5522. Specifically, the upper protrusion 5522 and the lower protrusion 5522 are both provided with seams 5521, and the cutting line can enter the seams 5521 of the two protrusions 5522 simultaneously. This arrangement, on the one hand, can prevent the seams 5521 from being too long. The cutting line will inevitably be affected by vibration during movement. If one end cannot smoothly enter the seam 5521, it will affect the test accuracy. On the other hand, seams 5521 are provided at the top and bottom. As long as the cutting line can enter the upper and lower seams, it means that the relative position of the cutting line and the seam meets the requirements, and then it is known that the centering mechanism test is qualified.

[0141] The test fixture 552 and the base plate 551 can be integrally formed. Alternatively, the test fixture 552 can be secured to the base plate 551 by welding, pressing, or clamping. For example, the base plate 551 may be provided with a test fixture mounting slot or a test fixture mounting hole, into which the test fixture is inserted and secured.

[0142] Furthermore, the tooling substrate 551 is provided with at least two through-holes 5513 extending through its thickness, with each through-hole 5513 spaced apart along the length of the tooling substrate 551. The through-holes 5513 not only reduce weight but also form a hollow structure, exposing the detection components at the bottom of the carrier for easy observation and testing.

[0143] Based on the above-mentioned centering tooling and centering device, this embodiment provides a specific implementation of a centering control method:

[0144] Step 1: Place the centering tool 55 on the support 211;

[0145] Step 2: Control the centering mechanism 53 to start, so that the centering jaws 535 approach each other until the centering tool 55 is moved to the position to be measured, and then release the centering jaws 535;

[0146] Step 3: Control the carrying device to move toward the wire cutting device 3 to identify whether the cutting line can enter the seam of the centering tool 55;

[0147] If it enters the seam of the centering tool 55, go to step 5;

[0148] If it is not possible to enter the seam of the centering tool 55, proceed to step 4.

[0149] Step 4: adjusting the position of the centering mechanism 55 along the first direction according to the position deviation between the seam and the cutting line;

[0150] Then repeat steps 2 and 3.

[0151] Each time the position of the centering mechanism 55 is adjusted, the centering mechanism 55 is fixed to prevent the centering mechanism 55 from moving during the detection process.

[0152] Step 5: Control the carrying device to move to the initial position;

[0153] Step 6: Remove the centering tool 55;

[0154] The following steps are performed to cut the silicon rods:

[0155] Step 7: Place the silicon rod on the carrier 211;

[0156] Step 8: Control the centering mechanism 5 to start, move the centering jaws 535 closer to each other, until the silicon rod is moved to the position to be cut, and then release the centering jaws 535;

[0157] Step 9: Control the carrying device to move toward the wire cutting device 3 to cut the silicon rod using the cutting wire.

[0158] Furthermore, during the execution of step 3 above, a dial indicator is used to mark the left or right reference surface of the centering fixture 55 to measure the running straightness of the centering fixture 55. Specifically, a dial indicator is fixed to the machine base 1, and the dial indicator head is placed on the left or right reference surface of the fixture. As the supporting platform drives the centering fixture 55 to move, the changes in the dial indicator are identified to determine the running straightness of the centering fixture 55. When the straightness is less than a preset value, it is considered qualified. If the straightness is greater than the preset value, the deflection angle of the centering mechanism 2 relative to the second direction is adjusted. After the adjustment, steps 2 and 3 are repeated until the straightness meets the requirements.

[0159] The two sets of centering mechanisms 55 are adjusted in the same manner.

[0160] In the above content, the length of the silicon rod is determined according to the duration, the moving speed of the carrying platform and the distance between the rod length detection component and the cutting line before cutting, as shown in the following example: Figure 11 As shown,

[0161] Rod length detection assembly 56 is a travel switch. Before cutting, the distance S between rod length detection assembly 56 and the cutting line is fixed, and the distance L between rod length detection assembly 56 and the front end of the silicon rod can be measured. When the silicon rod is placed on the support platform, rod length detection assembly 56 is triggered, emitting a switch signal. During the cutting process, the silicon rod moves toward the right end in the figure. After a certain period of time, the silicon rod leaves rod length detection assembly 56, and the trigger signal of rod length detection assembly 56 disappears. The length of the silicon rod can be calculated based on the support platform feed speed v, the cutting time t, and the aforementioned distances S and L. Rod length x = v*t + SL.

[0162] Those skilled in the art will appreciate that the embodiments of the present application can be provided as methods, systems, or computer program products. Therefore, the application can adopt the form of a complete hardware embodiment, a complete software embodiment, or an embodiment in combination with software and hardware. Moreover, the application can adopt the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) that contain computer-usable program code. The scheme in the embodiment of the present application can be implemented in various computer languages, for example, C language, VHDL language, Verilog language, object-oriented programming language Java, and directly interpreted scripting language JavaScript, etc.

[0163] The present application is described with reference to the flowcharts and / or block diagrams of the methods, devices (systems), and computer program products according to the embodiments of the present application. It should be understood that each process and / or box in the flowchart and / or block diagram, as well as the combination of the processes and / or boxes in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the steps in the process. Figure 1 a process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0164] These computer program instructions may also be stored in a computer readable memory that can direct a computer or other programmable data processing device to work in a specific manner, so that the instructions stored in the computer readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 a process or multiple processes and / or boxes Figure 1 The function specified in one or more boxes.

[0165] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operational steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing the instructions executed on the computer or other programmable device for implementing the process. Figure 1 a process or multiple processes and / or boxes Figure 1 A step that specifies a function in one or more boxes.

[0166] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0167] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of the features. Throughout the description of this application, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0168] In this application, unless otherwise expressly specified or limited, terms such as "mounted," "connected," "connect," and "fixed" should be understood broadly. For example, they may refer to fixed connections, detachable connections, or integration; mechanical connections, electrical connections, or communication; direct connections or indirect connections through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of these terms in this application based on specific circumstances.

[0169] Although the preferred embodiments of the present application have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present application.

[0170] Obviously, those skilled in the art may make various changes and modifications to this application without departing from the spirit and scope of this application. Thus, if these modifications and variations of this application fall within the scope of the claims of this application and their equivalents, this application is intended to include these modifications and variations.

Claims

1. A control method for centering a silicon rod in a cutting device, characterized in that: include: When it is recognized that the centering tool is located on the carrying platform of the cutting device, the centering mechanism is controlled to drive the centering tool to move along the first direction to the position to be measured; The first direction is perpendicular to the cutting feed direction of the cutting device; Controlling the movement of the wire cutting device or the carrying platform in the cutting equipment so that the cutting wire wound on the wire cutting device and the centering tool approach each other along a second direction; the second direction is perpendicular to the first direction; When it is recognized that the centering tool at the position to be tested is aligned with the cutting line of the cutting device, specifically when it is recognized that the cutting line enters the seam of the centering tool, a test completion instruction is generated; The centering tooling includes a tooling base plate and a tooling test piece. The tooling test piece is arranged on the tooling base plate, and a seam is provided at one end of the tooling test piece.

2. The control method according to claim 1, characterized in that: When it is recognized that the position to be measured of the centering tool is aligned with the cutting line of the cutting equipment, the following steps are also included: Control the wire cutting device or the carrying platform to move back to the initial position.

3. The control method according to claim 1, wherein: Controlling the centering mechanism to drive the centering tool to move along the first direction to a position to be measured includes: At least one pair of centering jaws in the centering mechanism is controlled to approach each other along a first direction. The centering jaws push the silicon rod from both sides to move along the first direction until the silicon rod contacts two centering jaws in a pair and reaches a position to be tested.

4. The control method according to claim 3, characterized in that: Also includes: obtaining a detection signal from a rod length detection component disposed on the carrying platform; The centering tool is identified through the detection signal.

5. The control method according to claim 4, characterized in that: The rod length detection component is located beside the centering mechanism and below the carrying platform; the rod length detection component extends upward to below the centering tooling.

6. The control method according to claim 1, characterized in that: Also includes: When it is recognized that the position to be measured of the centering fixture is not aligned with the cutting line of the cutting equipment, adjusting the position of the centering mechanism along the first direction; The centering mechanism after controlling the adjusted position drives the centering tool to move along the first direction to the position to be measured.

7. The control method according to claim 1, characterized in that: After generating the test completion instruction, it also includes: When it is identified that the silicon rod is located on the carrying platform, the centering mechanism is controlled to drive the silicon rod to move along the first direction to the position to be cut, so that the cutting wire wound on the wire cutting device cuts the silicon rod.

8. The control method according to claim 3, characterized in that: The centering mechanism includes: a centering drive member, a centering drive rod and a centering clamping claw; the centering drive rod extends along a first direction and is connected between the centering drive member and the centering clamping claw; Controlling two centering jaws of at least one pair of centering jaws in the centering mechanism to approach each other along the first direction is specifically as follows: The centering drive member is controlled to work, the centering drive rod is driven to move along a first direction and the centering clamping jaw is driven to move along the first direction, and two centering clamping jaws in a pair move in opposite directions.

9. The control method according to claim 3, characterized in that: The two centering jaws in a pair of centering jaws move synchronously and have the same movement stroke so that the cutting line is aligned with the seam of the centering mechanism at the position to be measured, and the distance between the seam and the two sides of the centering tool is equal.

10. The control method according to claim 1, characterized in that: The process of moving the carrying platform also includes: Measure the running straightness of the centering fixture.

11. A control device for centering silicon rods in a cutting device, characterized in that: include: Memory; processor; as well as computer programs; The computer program is stored in the memory and configured to be executed by the processor to implement the method according to any one of claims 1 to 10.

12. A computer-readable storage medium, characterized in that A computer program is stored thereon; the computer program is executed by a processor to implement the method according to any one of claims 1 to 10.

13. A cutting device, characterized in that: include: The control device for centering silicon rods according to claim 11.

Images