Card Component Detection Method, System, Computer Product and Readable Storage Medium

Abstract

The present invention relates to a card component detection method, system, computer product and readable storage medium. The card component detection method includes: obtaining a test image of a card component to be tested during operation from an infrared thermal imaging device; comparing and analyzing the test image with a standard image, and determining the identifier of an abnormal component according to the result of the comparison and analysis, wherein the standard image is an image collected by the infrared thermal imaging device when a standard card component operates under standard working conditions; based on the identifier of the abnormal component and according to the identifiers corresponding to multiple components on the card component and their respective positions on the card component stored in advance, searching for the position of the abnormal component. Implementing the technical solution of the present invention, the detection method is simple and fast, and can avoid damage caused by human factors. On the other hand, it can not only detect faulty components, but also detect components in a sub-healthy state. Therefore, potential hidden dangers of the card component can be exposed in advance, reducing the failure risk.

Description

Technical Field

[0001] The present invention relates to the field of infrared temperature measurement, and particularly to a method and system for detecting a card, a computer product, and a readable storage medium. Background Art

[0002] Nuclear power generation is a very efficient energy source, which can not only obtain high economic benefits but also play a high environmental protection benefit. Safety, reliability, and economy are the basis for the survival and development of nuclear power plants. The power supply card is one of the very important devices in a nuclear power plant and is extremely crucial for the safe and stable operation of the nuclear power plant. Once a problem occurs with the power supply card, the impact is huge. Therefore, the daily maintenance and non-destructive inspection of the card are very important.

[0003] The components on the power supply card are very dense, and it is very difficult to detect faults in complex circuits. How to quickly locate the components is an important step in the fault repair of electronic devices. During normal maintenance, for various types of equipment, the staff uses a multimeter to detect the connection parts of each component. For complex parts, relevant instructions need to be consulted in advance to understand the necessary parameters of the circuit. By measuring the connection parts of the components with a multimeter and comparing the measured values with the standard values in the instruction manual, such a method is used to determine which component is in a faulty state. This testing method takes a long time and requires high professional skills from the card inspection personnel. In addition, traditional card detection methods are difficult to detect potential problems and can only detect problems that have already occurred.

[0004] The above problems are not limited to power supply cards. Ordinary cards also have problems such as long detection time, high professional skills required for card inspection personnel, and inability to detect potential abnormalities during daily maintenance and inspection. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide a method and system for detecting a card, a computer product, and a readable storage medium, aiming at the defects of the prior art such as long time consumption, high professional skills required for card inspection personnel, and inability to detect potential abnormalities.

[0006] The technical solution adopted by the present invention to solve its technical problems is to construct a method for detecting a card, including:

[0007] An image acquisition step: obtaining a test image of the card to be tested during operation from an infrared thermal imaging device;

[0008] An image processing step: comparing and analyzing the test image with a standard image, and determining the identifier of the abnormal component according to the comparison and analysis result; wherein, the standard image is an image collected by the infrared thermal imaging device when the standard card operates under standard working conditions;

[0009] Abnormal location step: Based on the identifiers corresponding to multiple components on the card module stored in advance and their respective positions on the card module, the position of the abnormal component is found based on the identifier of the abnormal component.

[0010] Preferably, it further includes:

[0011] Alarm step: Judging whether the temperature of the card module is abnormal according to the detection result of the infrared thermal imaging device, and giving an alarm reminder when the temperature is abnormal.

[0012] Preferably, the image processing step:

[0013] Performing image difference processing on the test image and the standard image to obtain a difference image;

[0014] Determining pixel points with pixel values greater than a first preset value in the difference image, and for each pixel point with a pixel value greater than the first preset value, screening it with a specific graph to obtain a corresponding image block;

[0015] Respectively calculating the number value of pixel points with pixel values greater than the first preset value in each image block, respectively judging whether the number value corresponding to each image block is greater than a threshold value, and taking the image block with a number value greater than the threshold value as an abnormal image block;

[0016] According to the position of the abnormal image block in the difference image, determining an abnormal area in the test image or the standard image;

[0017] Identifying the identifier of the component from the abnormal area, and taking the identified identifier as the identifier of the abnormal component.

[0018] Preferably, in the image processing step, before the step of performing image difference processing on the test image and the standard image, it further includes:

[0019] Respectively identifying multiple feature points in the test image and the standard image;

[0020] Pairing the feature points of the test image with the feature points in the standard image to obtain multiple groups of feature point pairs;

[0021] Determining an image space coordinate transformation matrix according to the multiple groups of feature point pairs;

[0022] Performing image registration processing on the test image according to the image space coordinate transformation matrix;

[0023] Moreover, the performing image difference processing on the test image and the standard image includes:

[0024] Perform image difference processing on the test image after image registration processing and the standard image;

[0025] Determining an abnormal area in the test image or the standard image includes:

[0026] Determine an abnormal area in the test image or the standard image after image registration processing.

[0027] Preferably, using a specific graphic to screen it includes:

[0028] Perform circular screening with it as the center and the second preset value as the diameter.

[0029] The present invention also constructs a computer product, including a processor, and the processor implements the above-mentioned card detection method when executing a computer program.

[0030] The present invention also constructs a readable storage medium, storing a computer program, and the computer program implements the above-mentioned card detection method when executed by a processor.

[0031] The present invention also constructs a card detection system, including a background host, an infrared thermal imaging device and a front-end machine arranged in a cabinet. The infrared thermal imaging device is connected to the background host through the front-end machine, and the background host includes a processor, and the processor implements the above-mentioned card detection method when executing a computer program.

[0032] Preferably, the infrared thermal imaging device includes a short-wave infrared camera and an image generation module that are electrically connected. A card slot for fixing the card and a support for fixing the short-wave infrared camera are also arranged in the cabinet, and the card slot is located within the shooting area of the short-wave infrared camera.

[0033] Preferably, it further includes a test signal source and an acquisition control device arranged in the cabinet, where:

[0034] The background host is further configured to generate a test case for the card to be tested, send the test case to the front-end machine, and analyze the received response signal to obtain the test result of the card;

[0035] The front-end machine is configured to parse the received test case into multiple control commands and send them to the test signal source and the acquisition control device;

[0036] The test signal source is configured to configure the output voltage according to the received corresponding control command to provide an excitation signal for the card to be tested;

[0037] The acquisition control device is used to collect response signals from the card to be tested according to the received corresponding control commands, and send them to the background host through the front-end machine.

[0038] Preferably, the acquisition control device includes a main control board, a digital output board, a digital input board, and an analog input board respectively connected to the main control board. Moreover, the digital output board, the digital input board, and the analog input board are also respectively connected to the corresponding pins of the card to be tested through corresponding ports, where

[0039] The main control board is used to receive corresponding control commands from the front-end machine, and configure the on / off states of the corresponding channels in the digital output board and the digital input board according to the corresponding control commands; it is also used to collect digital response signals from the digital input board, and collect analog response signals from the analog input board, and process the digital response signals and the analog response signals.

[0040] Preferably, the test signal source includes:

[0041] A relay protection tester, which is used to configure corresponding AC voltages or currents according to the received corresponding control commands;

[0042] A DC adjustable power supply, which is used to configure corresponding DC voltages or currents according to the received corresponding control commands.

[0043] Preferably, it further includes an adaptation device arranged in the cabinet, and

[0044] The adaptation device is used to condition the excitation signals input to the card to be tested and / or the response signals output by the card to be tested.

[0045] The technical solution provided by the present invention can use infrared temperature measurement technology to capture the basic heat source information on the surface of the card to be tested without contacting the card to be tested, and generate an infrared image. Then, by comparing and analyzing the infrared image of the card with the standard image, the identification of abnormal components can be obtained. Finally, according to the pre-stored corresponding relationship between the identification and position of the components, the position of the abnormal component on the card can be determined. When using this card detection method to detect the card, on the one hand, it is not necessary to directly contact the card, nor is it necessary to have professional inspectors, and the abnormal components in the card can be quickly and accurately detected. Therefore, the detection method is simple and can avoid damage caused by human factors; on the other hand, not only can the faulty components be detected, but also the sub-healthy components can be detected. Therefore, the potential hidden dangers of the card can be exposed in advance, reducing the failure risk. Description of the Drawings

[0046] To more clearly illustrate the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings. In the drawings:

[0047] Figure 1 is the flowchart of the first embodiment of the card detection method of the present invention;

[0048] Figure 2 is Figure 1 the flowchart of the first embodiment of the image processing step S20 in ;

[0049] Figure 3 is the logical structure diagram of the first embodiment of the card detection system of the present invention;

[0050] Figure 4 is Figure 3 the schematic diagram of the first embodiment of the thermal imaging device in ;

[0051] Figure 5 is the logical structure diagram of the second embodiment of the card detection system of the present invention. Specific Embodiments

[0052] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0053] First, it should be noted that the heat dissipated by each component in a card (such as a power card) within a fixed range under normal working conditions. When a certain component of the card is abnormal (in a faulty or sub-healthy state), its power consumption will increase compared to the normal state, and the heat radiated will also increase compared to the normal state. In this case, if the card continues to work, it will cause damage to the components and even lead to the failure of the entire system. To avoid this situation, the present application can effectively detect the abnormal components in the card by collecting and analyzing the heat distribution of the card, and then timely interfere with them, thereby reducing the risk of failure. Therefore, understanding the heat distribution of the card is crucial for the safety and lifespan of the card.

[0054] Figure 1 is the flowchart of the first embodiment of the card detection method of the present invention. The card detection method of this embodiment includes:

[0055] Image acquisition step S10: Obtain a test image of the card to be tested during operation from an infrared thermal imaging device;

[0056] In this step, during the normal operation of the card, some components will start to generate temperature on the surface due to current and emit infrared thermal radiation to the outside. There is a certain relationship between infrared thermal imaging and the radiation power and temperature of the components, and the heat energy can be accurately quantified and measured, and the infrared thermal field of the card can be detected. Since the radiation intensities of the components on the card are not equal and the temperature at each position is also different, infrared thermal imaging can display a large amount of information of the card itself in the form of an infrared thermal field, objectively reflecting the state of the components on the circuit board.

[0057] The infrared thermal imaging device includes an electrically connected short-wave infrared camera and an image generation module. The short-wave infrared camera can be, for example, a dual-spectrum temperature measurement camera, and the camera is aligned with the card. The short-wave infrared camera focuses the infrared energy emitted from the card and generates an infrared thermal signal. Then, the image generation module performs processes such as AD conversion, background noise removal, non-uniformity correction, sensor temperature measurement, storage, and pseudo-color coding on the infrared thermal signal, and finally converts the infrared thermal signal into an infrared image.

[0058] Image processing step S20: Compare and analyze the test image with a standard image, and determine the identifier of the abnormal component according to the result of the comparison and analysis; wherein, the standard image is an image collected by the infrared thermal imaging device when a standard card operates under standard working conditions;

[0059] In this step, it should be noted first that the standard card is a card of the same type as the card to be tested and all its components are normal. When it operates under standard working conditions, the infrared image of this standard card collected by the infrared thermal imaging device is used as the standard image. This step discriminates whether there are abnormal components and the identifiers of the abnormal components in the tested card by comparing and analyzing the test image and the standard image.

[0060] Abnormal location step S30: Based on the identifiers corresponding to multiple components on the card stored in advance and their positions on the card, find the position of the abnormal component based on the identifier of the abnormal component.

[0061] In this step, there is a wide variety of components on the card, and the positions of the components are relatively compact. Therefore, it is necessary to correspond the infrared image information of the card with each component to achieve the identification and positioning of the components. For the card with complex components, simple numbering can be carried out according to certain rules. Usually, the rule is: number the different types of components on the card in order from left to right according to the English alphabet, and then add Arabic numerals to number the components of the same type. Then, mark the relative positions on the card, and uniformly record the name, model and other identification information of each component and the position information in the card into the database of this type of card. After determining the identification of the abnormal component through the comparison and analysis of the images, the position of the abnormal component in the card can be determined by querying the database, that is, the position of the corresponding component can be located.

[0062] In the technical solution of this embodiment, the infrared temperature measurement technology can be used to capture the basic heat source information on the surface of the card without contacting the card to be measured, and generate an infrared image. Then, by comparing and analyzing the infrared image of the card with the standard image, the identification of the abnormal component can be obtained. Finally, according to the pre-stored corresponding relationship between the identification and position of the component, the position of the abnormal component on the card can be determined. When using this card detection method to detect the card, on the one hand, it is not necessary to directly contact the card, nor is it necessary to have professional inspectors, so that the abnormal components in the card can be detected in a timely and accurate manner. Therefore, the detection method is simple and can avoid damage caused by human factors. On the other hand, not only can the faulty components be detected, but also the components in the sub-healthy state (with potential problems) can be detected. Therefore, the potential hidden dangers of the card can be exposed in advance and the failure risk can be reduced.

[0063] Regarding the above embodiment, it should also be noted that when detecting the card, the test images at multiple time points after the card starts to work can be obtained respectively. For example, the infrared images obtained by the infrared thermal imaging device are recorded at multiple different time points such as 20 minutes, 40 minutes, and 1 hour after the card starts to run. Similarly, there are multiple standard images, and they respectively correspond to different working durations. When comparing and analyzing the test image with the standard image, the selected standard image should be the standard image with the same working duration as the test image.

[0064] In an optional embodiment, the card detection method of the present invention further includes an alarm step: judging whether the temperature of the card is abnormal according to the detection result of the infrared thermal imaging device, and giving an alarm reminder when the temperature is abnormal. In this embodiment, an alarm threshold for abnormal temperature can be set in advance. When the detected temperature is greater than this threshold, it is determined that the temperature of the card is abnormal, and then an alarm reminder is given to remind the staff to pay attention.

[0065] Further, after the abnormal location step S30, the following operations can also be performed: generating a detection report according to the identifier and location of the abnormal component, and storing the detection report and the test image for subsequent historical query, so as to provide a reliable and comprehensive basis for testing.

[0066] Figure 2 Yes Figure 1 It is a flowchart of the first embodiment of the image processing step S20. In this embodiment, the image processing step S20:

[0067] Step S21, performing image difference processing on the test image and the standard image to obtain a difference image;

[0068] Step S22, determining the pixel points with pixel values greater than the first preset value in the difference image, and for each pixel point with a pixel value greater than the first preset value, using a specific graphic to perform gating on it to obtain the corresponding image block;

[0069] In this step, preferably, when performing gating on the pixel points with pixel values greater than the first preset value, a circular gating is performed with the position of the pixel point as the center and the second preset value (for example, 40) as the diameter, so that the obtained image block is a circular image block. Currently, in other embodiments, shapes such as square and rectangle can also be selected to perform gating on the pixel points with pixel values greater than the first preset value. In this way, the obtained image blocks are square, rectangular and other image blocks.

[0070] Step S23, respectively calculating the quantity value of the pixel points with pixel values greater than the first preset value in each image block, respectively judging whether the quantity value corresponding to each image block is greater than the threshold, and taking the image block with the quantity value greater than the threshold as the abnormal image block;

[0071] In this step, it should be noted that the ratio of the pixel points with pixel values greater than the first preset value in each image block to the entire image block can also be calculated respectively, and then it is respectively judged whether the ratio corresponding to each image block is greater than the threshold, and the image block with the ratio greater than the threshold is taken as the abnormal image block.

[0072] Step S24, determining the abnormal area in the test image or the standard image according to the position of the abnormal image block in the difference image;

[0073] Step S25, identifying the identifier of the component from the abnormal area, and taking the identified identifier as the identifier of the abnormal component.

[0074] In this embodiment, after obtaining the difference image by performing image difference processing on the test image of the card under test and the standard image, the difference image can be processed by MATLAB: First, filter out the pixel points with pixel values greater than the first preset value (for example, 50), that is, filter out the highlighted pixel points, and then perform gating on the highlighted pixel points to obtain multiple image blocks. Then, calculate the number of pixel points with pixel values greater than the first preset value in each image block respectively, and determine whether the corresponding quantity value of each image block is greater than the threshold, and regard the image blocks with values greater than the threshold as abnormal image blocks. Finally, according to the position of the abnormal image block in the difference image, determine the abnormal area in the test image or the standard image, and determine the identification of the abnormal component by performing image recognition on the abnormal area.

[0075] Further, in an alternative embodiment, it is found in practical applications that when collecting the standard image and the test image, there may be deviations in the relative positions of the standard card, the card under test, and the camera in the infrared thermal imaging device. Therefore, it is necessary to perform image registration processing on the test image first to make the positions of the pixel points in the test image consistent with the positions of the corresponding pixel points in the standard image. Specifically, in this embodiment, before the step of performing image difference processing on the test image and the standard image, it further includes:

[0076] Step S201. Identify multiple feature points in the test image and the standard image respectively;

[0077] In this step, it should be noted that feature points can be set at multiple different positions on the card under test and the standard card in advance, or specific devices (such as resistors) arranged on the card under test and the standard card can be used as feature points.

[0078] Step S202. Pair the feature points in the test image with the feature points in the standard image to obtain multiple groups of feature point pairs;

[0079] Step S203. Determine the image space coordinate transformation matrix according to the multiple groups of feature point pairs;

[0080] Step S204. Perform image registration processing on the test image according to the image space coordinate transformation matrix;

[0081] Moreover, step S21 includes:

[0082] Perform image difference processing on the test image after image registration processing and the standard image.

[0083] In step S24, determining the abnormal area in the test image or the standard image includes:

[0084] An abnormal area is determined in the test image or the standard image after image registration processing.

[0085] The present invention also constructs a computer product, including a processor, which implements the above-mentioned card detection method when executing a computer program.

[0086] The present invention also constructs a readable storage medium, storing a computer program, which implements the above-mentioned card detection method when executed by a processor.

[0087] Figure 3 It is a logical structure diagram of the first embodiment of the card detection system of the present invention. The card detection system of this embodiment includes a background host 107, an infrared thermal imaging device 108 and a front-end machine 102 arranged in a cabinet 101. The infrared thermal imaging device 108 is connected to the background host 107 through the front-end machine 102, and the background host 107 includes a processor, which implements the above-mentioned card detection method when executing a computer program.

[0088] Figure 4 is Figure 3 It is a schematic diagram of the first embodiment of the thermal imaging device. The infrared thermal imaging device of this embodiment includes a short-wave infrared camera 1081 and an image generation module 1082 that are electrically connected. A card slot (not shown) for fixing a card 106 and a support member for fixing the short-wave infrared camera 1081 are also arranged in the cabinet 101, and the card slot is located within the shooting area of the short-wave infrared camera 1081. Moreover, the support member includes a vertical rod 1101 and a cross bar 1082 fixed at the top of the vertical rod 1101, and the vertical rod and / or the cross bar are telescopic rods. A pan-tilt is installed on the cross bar 1102, and the short-wave infrared camera 1081 is fixed on the pan-tilt. For example, the pan-tilt supports a horizontal rotation angle of 0° to 350° and a vertical rotation angle of -10° to 110°. For a card slot with a width of 6 cm and a height of 12 cm, the short-wave infrared camera 1081 can fully cover it. In addition, in this embodiment, the cabinet width is 80 cm, the maximum height of the left automatic telescopic rod is 20.20 cm, the maximum wide angle of the suspended short-wave infrared camera is 120°, and a height of 4U (17.78 cm) is configured in the cabinet. According to the size of the card to be tested, the position and posture of the short-wave infrared camera 1081 are automatically adjusted through the telescopic rods 1101 and 1102 and the pan-tilt.

[0089] Figure 5It is the logical structure diagram of the second embodiment of the card detection system of the present invention. The card detection system of this embodiment includes a background host 107, a cabinet 101, and a front-end computer 102, a test signal source 103, a switching power supply (such as a 24V switching power supply) 109, a acquisition control device 104, an adaptation device 105, and an infrared thermal imaging device 108 arranged in the cabinet 101. Moreover, the front-end computer 102 is connected to the background host 107 and the acquisition control device 104 through Ethernet ports. The test signal source 103 is respectively connected to the front-end computer 102 and the acquisition control device 104. The output of the acquisition control device 104 is electrically port-connected to the adaptation device 105. The adaptation device 105 is electrically port-connected to the card 106 to be tested. The infrared thermal imaging device 108 is connected to the front-end computer 102.

[0090] In this embodiment, in addition to having the functions of the foregoing embodiment, the background host 107 is further configured to generate test cases for the card 106 to be tested, and send the test cases to the front-end computer 102. Moreover, the background host 107 analyzes the received response signals to obtain the test results of the card 106. The front-end computer 102 is configured to parse the received test cases into multiple control commands and send them to the test signal source 103 and the acquisition control device 104. The test signal source 103 is configured to configure the output voltage according to the received corresponding control commands to provide an excitation signal for the card to be tested. The acquisition control device 104 is configured to collect response signals from the card to be tested according to the received corresponding control commands and send them to the background host 107 through the front-end computer 102. The switching power supply 109 is configured to provide a power signal for the card 106 to be tested. The adaptation device 105 is configured to condition the excitation signal input to the card 106 to be tested and / or the response signal output by the card to be tested.

[0091] Further, the acquisition control device 104 in this embodiment includes a main control board 1041, a digital output board 1042, an analog input board 1043, and a digital input board 1044 respectively connected to the main control board. Moreover, the digital output board 1042, the analog input board 1043, and the digital input board 1044 are also respectively connected to the corresponding pins of the adaptation device through corresponding ports. The adaptation device is then connected to the corresponding pins of the card 106 to be tested through its corresponding pins. Among them, the main control board 1041 is configured to receive corresponding control commands from the front-end computer 102 and configure the on / off of the corresponding channels in the digital output board 1042 and the digital input board 1044 according to the corresponding control commands. The main control board 1041 is also configured to collect digital response signals from the digital input board 1044 and analog response signals from the analog input board 1043, and process the digital response signals and the analog response signals.

[0092] In a specific embodiment, the main control board 1041 realizes functions such as data acquisition control, calculation processing, communication, wave recording, and recording; the digital output board 1042 is connected to the test signal source 103 and is used to control the excitation signal input to the card under test 106; the digital output board 1042 and the analog input board 1044 are connected to the adapter device 105 and are used to collect the digital and analog response signals of the card 106. The models of each board include but are not limited to the following: the model of the main control board 1041 is RP7001, the model of the digital input board 1044 is RP7301, the model of the digital output board 1042 is RP7321, and the model of the analog input board 1043 is RP7105.

[0093] Further, the test signal source 103 in this embodiment includes a relay protection tester 1031 and a DC adjustable power supply 1032. Among them, the relay protection tester 1031 is used to configure corresponding AC voltage or current according to the received corresponding control commands. For example, AC and DC voltages or currents that change in set steps; the DC adjustable power supply 1032 is used to configure corresponding DC voltage or current according to the received corresponding control commands.

[0094] The following combines Figure 5 to illustrate the working process of the card detection system in this embodiment:

[0095] 1. The background host 107 generates test cases by configuring the test process and is also used to store various data. When the background host issues the test cases to the front-end machine 102, the test cases include the configuration of parameters such as the types, start times, stop times, etc. of the output signals of phases A, B, and C of the relay protection tester 1031, the start times, stop times, etc. of the switching power supply 109, the start times, stop times, interval acquisition times, diagnostic features, etc. of the infrared thermal imaging device 108, and the types, acquisition channels, etc. of the signals collected from the pins of the card 106.

[0096] 2. The front-end machine 102 parses the test cases into control commands and issues them to the main control board 1041 of the test signal source 103 and the acquisition control device 104 respectively.

[0097] 3. The relay protection tester 1031 in the test signal source 103 configures the output voltages of phases A, B, and C according to the control commands, and the main control board 1041 of the acquisition control device 104 configures the on / off of the corresponding channels in the digital output board 1042 and the digital input board 1044 according to the control commands.

[0098] 4. The acquisition control device 104 outputs the two-phase voltage output by the relay protection tester 1031 and the 24V DC voltage output by the switching power supply to the signal input terminal block on the adapter device 105 of the card.

[0099] 5. The intermediate circuit on the adaptation device 105 transmits the conditioned input signal to the card 106 via the output terminal block.

[0100] 6. After the card 106 obtains voltage signals on some pins, the status change information of some corresponding pins is sent to the digital input board 1044 of the acquisition control device 104 through the corresponding terminals on the adaptation device 105.

[0101] 7. The digital input board 1044 of the acquisition control device 104 sends the acquired response signal to the main control board 1041 for processing.

[0102] 8. The main control board 1041 of the acquisition control device 104 sends the processed response signal to the front-end computer 102, and the front-end computer 102 stores the data.

[0103] 9. The background host 107 can further process the response signal, process it into a graph, and display it on the human-computer interaction interface.

[0104] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the scope of the claims of the present invention.

Claims

1. A card component detection method, characterized in that, Including: Image acquisition step: Obtain a test image of the card to be tested during operation from an infrared thermal imaging device; Image processing step: Compare and analyze the test image with a standard image, and determine the identifier of the abnormal component according to the comparison and analysis result; wherein, the standard image is an image collected by the infrared thermal imaging device when the standard card operates under standard working conditions; The image processing step includes: performing image difference processing on the test image and the standard image to obtain a difference image; Determine the pixel points with pixel values greater than a first preset value in the difference image, and for each pixel point with a pixel value greater than the first preset value, use a specific graphic to screen it to obtain a corresponding image block; Calculate the quantity value of the pixel points with pixel values greater than the first preset value in each image block respectively, and determine whether the quantity value corresponding to each image block is greater than a threshold value respectively, and use the image block with a quantity value greater than the threshold value as an abnormal image block; Determine an abnormal area in the test image or the standard image according to the position of the abnormal image block in the difference image; Identify the identifier of the component from the abnormal area, and use the identified identifier as the identifier of the abnormal component; Abnormal positioning step: Based on the identifiers corresponding to multiple components on the card stored in advance and their positions on the card, search for the position of the abnormal component based on the identifier of the abnormal component.

2. The card component detection method according to claim 1, wherein It further includes: Alarm step: Judge whether the temperature of the card is abnormal according to the detection result of the infrared thermal imaging device, and give an alarm reminder when the temperature is abnormal.

3. The card component detection method according to claim 1, wherein In the image processing step, before the step of performing image difference processing on the test image and the standard image, it further includes: Identify multiple feature points in the test image and the standard image respectively; Pair the feature points of the test image with the feature points in the standard image to obtain multiple groups of feature point pairs; Determine an image space coordinate transformation matrix according to the multiple groups of feature point pairs; Perform image registration processing on the test image according to the image space coordinate transformation matrix; Moreover, the performing image difference processing on the test image and the standard image includes: Performing image difference processing on the test image after image registration processing and the standard image; The determining an abnormal area in the test image or the standard image includes: Determining an abnormal area in the test image or the standard image after image registration processing.

4. The card component detection method according to claim 1, wherein The using a specific graphic to screen it includes: Performing circular screening with it as the center and the second preset value as the diameter.

5. A computer product, comprising a processor, characterized in that, The processor implements the card detection method according to any one of claims 1-4 when executing a computer program.

6. A readable storage medium storing a computer program, characterized in that, The computer program implements the card detection method according to any one of claims 1-4 when executed by a processor.

7. A card component detection system, characterized in that, It includes a background host, an infrared thermal imaging device and a front-end machine arranged in a cabinet. The infrared thermal imaging device is connected to the background host through the front-end machine, and the background host includes a processor which implements the card detection method according to any one of claims 1-4 when executing a computer program.

8. The card component detection system according to claim 7, wherein The infrared thermal imaging device includes a short-wave infrared camera and an image generation module which are electrically connected. A card slot for fixing a card and a support for fixing the short-wave infrared camera are also arranged in the cabinet, and the card slot is located within the shooting area of the short-wave infrared camera.

9. The card component detection system according to claim 7, wherein It further includes a test signal source and an acquisition control device arranged in the cabinet, where: The background host is further configured to generate test cases for the cards to be tested, send the test cases to the front-end machine, and analyze the received response signals to obtain the test results of the cards. The front-end machine is configured to parse the received test cases into multiple control commands and send them to the test signal source and the acquisition control device. The test signal source is configured to configure the output voltage according to the received corresponding control command to provide an excitation signal for the card to be tested. The acquisition control device is configured to collect response signals from the card to be tested according to the received corresponding control command and send them to the background host through the front-end machine.

10. The card component detection system according to claim 9, characterized in that, The acquisition control device includes a main control board, a digital output board, a digital input board, and an analog input board which are respectively connected to the main control board. Moreover, the digital output board, the digital input board, and the analog input board are respectively connected to corresponding pins of the card to be tested through corresponding ports, where The main control board is configured to receive corresponding control commands from the front-end machine and configure the on / off states of corresponding channels in the digital output board and the digital input board according to the corresponding control commands; it is also configured to collect digital response signals from the digital input board and analog response signals from the analog input board, and process the digital response signals and the analog response signals.

11. The card component detection system according to claim 9, wherein The test signal source includes: A relay protection tester configured to configure corresponding AC voltage or current according to the received corresponding control command. A DC adjustable power supply configured to configure corresponding DC voltage or current according to the received corresponding control command.

12. The card component detection system according to claim 7, wherein It further includes an adaptation device arranged in the cabinet, and The adaptation device is configured to condition the excitation signal input to the card to be tested and / or the response signal output by the card to be tested.

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