Micro-LED Packaging Products and Electronic Devices

Abstract

The present invention provides a Micro-LED packaging product and an electronic device. The Micro-LED packaging product includes a heat sink, a chip, a glass panel, and a circuit board. Two side surfaces of the chip are respectively adhered to the heat sink and the glass panel. The circuit board is installed on the heat sink, and the circuit board and the chip are connected by a gold wire. The heat sink can be made of a metal with good thermal conductivity, such as copper, aluminum, or copper alloy, etc. The area of the heat sink is larger than the area of the chip. The heat sink includes a first area for the chip to adhere to and a second area for the circuit board to be installed, and the first area and the second area do not overlap. By directly adhering one side of the chip to the heat sink, the Micro-LED packaging product can directly transfer the heat generated by the chip to the heat sink, and then transfer the heat out through the heat sink, playing a role in accelerating heat dissipation. The Micro-LED packaging product has the advantage of good heat dissipation effect.

Description

Technical Field

[0001] The present invention relates to the field of Micro-LED packaging, and in particular to a Micro-LED packaging product and electronic equipment. Background Art

[0002] When Micro-LED is working, only 30% of the chip is converted into light, and the remaining 70% is converted into heat. In the existing technology, the chip is connected to the circuit board, which has poor heat dissipation effect. If the chip temperature is too high, it is easy to cause failure of Micro-LED packaging products. Therefore, solving the heat dissipation problem is the key consideration of Micro-LED packaging.

[0003] In view of this, it is necessary to provide a new Micro-LED packaging product and electronic device to solve or at least alleviate the above-mentioned technical defects. Summary of the invention

[0004] The main purpose of the present invention is to provide a Micro-LED packaging product and an electronic device, aiming to solve the technical problem of poor chip heat dissipation effect of Micro-LED packaging products in the prior art.

[0005] To achieve the above-mentioned purpose, according to one aspect of the present invention, the present invention provides a Micro-LED packaging product, including a heat sink, a chip, a glass panel and a circuit board, the two side surfaces of the chip are respectively adhered to the heat sink and the glass panel, the circuit board is installed on the heat sink, and the circuit board and the chip are connected by gold wire.

[0006] In one embodiment, the circuit board is mounted on a side of the heat sink facing the chip, and the circuit board is mounted on one side of the chip, and a solder pad is provided on a side of the chip close to the circuit board.

[0007] In one embodiment, the circuit board is installed on a side of the heat sink facing the chip, the circuit board is formed with a hollow area, the chip is embedded in the hollow area, a left pad and a right pad are respectively provided on both sides of the chip, and the left pad and the right pad are respectively connected to the circuit board through gold wires.

[0008] In one embodiment, a surface of the heat sink facing the chip and another surface facing away from the chip are respectively connected to the circuit board.

[0009] In one embodiment, the circuit board is mounted on one side of the chip.

[0010] In one embodiment, a hollow area is formed on the side of the circuit board facing the chip, the chip is embedded in the hollow area, a left pad and a right pad are respectively provided on both sides of the chip, and the left pad and the right pad are respectively connected to the circuit board through gold wires.

[0011] In one embodiment, a surface of the chip facing the heat sink is entirely attached to the heat sink.

[0012] In one embodiment, the chip and the heat sink are bonded together via a first adhesive layer, and the glass panel and the chip are bonded together via a second adhesive layer.

[0013] In one embodiment, the first adhesive layer is a U-shaped adhesive layer.

[0014] In one embodiment, the Micro-LED packaging product further includes a gold wire glue layer, and the gold wire glue layer wraps the gold wire.

[0015] In one embodiment, the circuit board is a flexible circuit board.

[0016] According to yet another aspect of the present invention, the present invention further provides an electronic device, comprising the Micro-LED package product described above.

[0017] In the above scheme, the Micro-LED packaging product includes a heat sink, a chip, a glass panel and a circuit board. The two sides of the chip are respectively attached to the heat sink and the glass panel. The circuit board is installed on the heat sink, and the circuit board and the chip are connected by gold wire. The heat sink can be made of a metal with good thermal conductivity, such as copper, aluminum or copper alloy. The area of ​​the heat sink is larger than the area of ​​the chip. The heat sink includes a first area for the chip to be attached and a second area for the circuit board to be installed. The first area and the second area do not overlap, and the circuit board partially extends out of the heat sink. The invention can directly transfer the heat generated by the chip to the heat sink by directly attaching one side of the chip to the heat sink, and then transfer the heat through the heat sink, thereby accelerating the heat dissipation. The invention has the advantage of good heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0019] Figure 1 Schematic diagram of the cross-sectional structure of the Micro-LED packaging product according to the first embodiment of the present invention;

[0020] Figure 2 A top view of a Micro-LED package product according to a first embodiment of the present invention;

[0021] Figure 3 Schematic diagram of the cross-sectional structure of a Micro-LED package product according to a second embodiment of the present invention;

[0022] Figure 4 A top view of a Micro-LED package product according to a second embodiment of the present invention;

[0023] Figure 5 Schematic diagram of the cross-sectional structure of a Micro-LED package product according to a third embodiment of the present invention;

[0024] Figure 6 FIG. 1 is a top view of a Micro-LED package product according to a third embodiment of the present invention.

[0025] Description of Figure Numbers:

[0026] 1. Heat sink; 2. Chip; 3. Glass panel; 31. Effective display area; 4. Circuit board; 41. First sub-board; 42. Second sub-board; 43. Third sub-board; 44. Fourth sub-board; 45. Mounting slot; 5. Gold wire; 6. First adhesive layer; 7. Second adhesive layer; 8. Gold wire adhesive layer; 9. Pins, pads; 10. Left pad; 11. Right pad.

[0027] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with the implementation methods and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] It should be noted that all directional indications (such as up, down, etc.) in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0030] In addition, in the present invention, the descriptions such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features.

[0031] Furthermore, the technical solutions between the various embodiments of the present invention may be combined with each other, but this must be based on the fact that they can be implemented by ordinary technicians in the field. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0032] See also Figure 1 to Figure 6 According to one aspect of the present invention, the present invention provides a Micro-LED packaging product, including a heat sink 1, a chip 2, a glass panel 3 and a circuit board 4, the two side surfaces of the chip 2 are respectively adhered to the heat sink 1 and the glass panel 3, the circuit board 4 is installed on the heat sink 1, and the circuit board 4 and the chip 2 are connected by a gold wire 5.

[0033] It should be noted here that due to the large heat generation of the pixel area of ​​the Micro-LED product, the large number of side pads on the chip, and the small size of the Micro-LED and the small heat dissipation area, it is easier to cause the Micro-LED package product to fail due to excessive chip temperature than ordinary LED products and mini LED products. In the above embodiment, the glass panel 3 can be a display panel, and an effective display area 31 is formed in the middle of the display panel. The circuit board 4 and the chip 2 are directly connected by the gold wire 5 to play a role in signal transmission, and the size of the Micro-LED package product can be reduced by connecting the gold wire 5. The heat sink 1 can be made of a metal with good thermal conductivity, such as copper, aluminum or copper alloy. The area of ​​the heat sink 1 is larger than the area of ​​the chip 2. The heat sink 1 includes a first area for the chip 2 to be attached and a second area for the circuit board 4 to be installed. The first area and the second area do not overlap, and the circuit board 4 partially extends out of the heat sink 1. In this embodiment, by directly attaching one side of the chip 2 to the heat sink 1, the heat generated by the chip 2 can be directly transferred to the heat sink 1, and then the heat is transferred out through the heat sink 1, which plays a role in accelerating heat dissipation. This embodiment has the advantage of good heat dissipation effect.

[0034] See also Figure 1 and Figure 2 As a first embodiment of the present invention, the circuit board 4 is mounted on the side of the heat sink 1 facing the chip 2, and the circuit board 4 is mounted on one side of the chip 2, and a pad 9 is provided on the side of the chip 2 close to the circuit board 4. The circuit board 4 is bonded to the side of the heat sink 1 facing the chip 2 by adhesive. Figure 1The circuit board 4 is mounted on the right side of the chip 2. A pad 9 is provided on the right side of the chip 2. The circuit board 4 is connected to the pad 9 only from the right side of the chip 2 through a gold wire 5. Specifically, the gold wire 5 is connected to the pin 9 on the circuit board 4. This manufacturing method only requires the circuit board 4 to be attached to one side of the chip 2, which is simple and convenient to manufacture and has low cost.

[0035] See also Figure 3 and Figure 4 As the second embodiment of the present invention, the circuit board 4 is installed on the side of the heat sink 1 facing the chip 2. The circuit board 4 is formed with a hollow area. The chip 2 is embedded in the hollow area. The left pad 10 and the right pad 11 are respectively provided on both sides (left and right sides) of the chip 2. The left pad 10 and the right pad 11 are respectively connected to the circuit board 4 through the gold wire 5. Specifically, for the convenience of description, the circuit board 4 is divided into a first sub-board 41 located on the left side of the chip and a second sub-board 42 located on the right side of the chip. The first sub-board 41 is connected to the left pad 10 through the gold wire 5, and the second sub-board 42 is connected to the right pad 11 through the gold wire 5. Because the circuit board 4 can have multiple layers, the left pad 10 can be led out to the right side of the circuit board 4 through the upper and lower layers of the circuit board 4, and the external connector is connected to the right side of the circuit board 4. It should be noted that the circuit board 4 is divided into the first sub-board 41 and the second sub-board 42 for description only for the convenience of description. In fact, the circuit board 4 is a whole board with a hollow area formed in the middle for installing the chip 2 and the glass panel 3, that is, the circuit board 4 is arranged around the chip 2. As Figure 3 The chip 2 is installed in the middle of the circuit board 4, and the left pad 10 and the right pad 11 on both sides of the chip 2 are connected to the circuit board 4 respectively, which can increase the number of I / O ports and improve the signal transmission quality and speed.

[0036] See also Figure 5 and Figure 6 As a third embodiment of the present invention, the heat sink 1 is connected to the circuit board 4 on one side facing the chip 2 and the other side facing away from the chip 2. In this embodiment, the circuit board 4 is connected to both sides of the heat sink 1. Figure 5, it can be seen that the circuit board 4 is formed with a mounting groove 45, the heat sink 1 is installed in the mounting groove 45, and there is a through hole on the side wall of the mounting groove 45 for connecting the chip 2 with the heat sink 1. As described above, the external connector is connected to the right side of the circuit board. This embodiment increases the connection port on the right side of the circuit board by setting a foldable circuit board 4, and can realize the connection of different connectors at the back end while increasing the number of I / O. For example, if the circuit board 4 of the second embodiment is used, only one connector can be connected, while this embodiment has an additional connection port on the right side of the folded circuit board 4, so that two different connectors can be connected. Specifically, similar to the first embodiment, the circuit board 4 can be installed only on one side of the chip 2. This method is simple and convenient to manufacture and has low cost. Similar to the second embodiment, the circuit board 4 is formed with a hollow area, the chip 2 is embedded in the hollow area, and the left pad 10 and the right pad 11 are respectively provided on both sides (left and right sides) of the chip 2. The left pad 10 and the right pad 11 are respectively connected to the circuit board 4 through the gold wire 5. This method can further increase the number of I / O ports and improve the signal transmission quality and speed.

[0037] See also Figure 2 , Figure 4 or Figure 6 In one embodiment, the side of the chip 2 facing the heat sink 1 is completely attached to the heat sink 1, and the surface area of ​​the heat sink 1 is larger than the surface area of ​​the chip 2. In this embodiment, the entire surface of the chip 2 is completely attached to the heat sink 1, which can increase the heat dissipation effect of the chip 2.

[0038] See also Figure 2 , Figure 4 or Figure 6 In one embodiment, the chip 2 is bonded to the heat sink 1 through a first adhesive layer 6, and the glass panel 3 and the chip 2 are bonded through a second adhesive layer 7. The first adhesive layer 6 and the second adhesive layer 7 here can be epoxy resin glue or silicone glue, and the adhesive bonding process is simple and low in cost. The first adhesive layer 6 can be the entire gap between the chip 2 and the heat sink 1, so that the bonding effect is better; it can also be set in the form of a U-shaped form, so that the chip 2 can be in direct contact with most of the heat sink 1, which accelerates the heat dissipation effect and reduces the production cost. The circuit board 4 can adopt a flexible circuit board, which is more convenient to install and can be bent to a certain extent, and is particularly suitable for the third embodiment of the present invention.

[0039] See also Figure 2 , Figure 4 or Figure 6In one embodiment, the Micro-LED packaging product further includes a gold wire glue layer 8, which wraps the gold wire 5. Specifically, the gold wire glue layer 8 may also be epoxy resin glue or silicone glue. The gold wire 5 is wrapped and fixed by the gold wire glue layer 8 to prevent the gold wire 5 from loosening or breaking due to shaking during use.

[0040] According to another aspect of the present invention, the present invention also provides an electronic device, which includes the above-mentioned Micro-LED package product. The above-mentioned electronic device can be smart glasses, augmented reality devices or virtual reality devices. Augmented reality (English name: Augmented Reality, abbreviated as AR) is a technology that cleverly integrates virtual information with the real world. It widely uses a variety of technical means such as multimedia, three-dimensional modeling, real-time tracking and registration, intelligent interaction, and sensing. After simulating computer-generated text, images, three-dimensional models, music, videos and other virtual information, it is applied to the real world. The two types of information complement each other, thereby achieving "enhancement" of the real world. Virtual reality (English name: Virtual Reality, abbreviated as VR) is a brand-new practical technology developed in the 20th century. Virtual reality technology encompasses computers, electronic information, and simulation technology. Its basic implementation method is that computers simulate virtual environments to give people a sense of environmental immersion. Since the electronic device includes all the technical solutions of all the embodiments of all the above-mentioned Micro-LED package products, it has at least all the beneficial effects brought by all the above-mentioned technical solutions, which will not be repeated here.

[0041] The above are only optional embodiments of the present invention, and are not intended to limit the patent scope of the present invention. All equivalent structural changes made using the contents of the present invention's specification and drawings under the technical concept of the present invention, or directly / indirectly applied in other related technical fields, are included in the patent protection scope of the present invention.

Claims

1. A Micro-LED packaging product, It is characterized in that The invention comprises a heat sink, a chip, a glass panel and a circuit board, wherein the two sides of the chip are respectively attached to the heat sink and the glass panel, the circuit board is mounted on the heat sink, and the circuit board and the chip are connected by gold wires; the heat sink comprises a first area for attaching the chip and a second area for mounting the circuit board, and the first area and the second area do not overlap; The circuit board is a folding structure, and a mounting groove is formed on the circuit board. The heat sink is installed in the mounting groove. The side surface of the heat sink facing the chip and the other side away from the chip are respectively connected to the circuit board; a through hole is provided on the side wall of the mounting groove for connecting the chip with the heat sink.

2. The Micro-LED package product according to claim 1, It is characterized in that The circuit board is mounted on one side of the chip.

3. The Micro-LED package product according to claim 1, It is characterized in that A left pad and a right pad are respectively arranged on both sides of the chip, and the left pad and the right pad are respectively connected to the circuit board through gold wires.

4. The Micro-LED package product according to any one of claims 1 to 3, It is characterized in that The chip is completely attached to the heat sink on one side facing the heat sink.

5. The Micro-LED package product according to any one of claims 1 to 3, It is characterized in that The chip and the heat sink are bonded together via a first bonding layer, and the glass panel and the chip are bonded together via a second bonding layer.

6. The Micro-LED package product according to claim 5, It is characterized in that The first adhesive layer is a U-shaped adhesive layer.

7. The Micro-LED package product according to any one of claims 1 to 3, It is characterized in that The Micro-LED packaging product also includes a gold wire glue layer, and the gold wire glue layer wraps the gold wire.

8. The Micro-LED package product according to any one of claims 1 to 3, It is characterized in that The circuit board is a flexible circuit board.

9. An electronic device, It is characterized in that The electronic device comprises the Micro-LED package product according to any one of claims 1 to 8.

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